WO2016199361A1 - Appareil électronique - Google Patents

Appareil électronique Download PDF

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Publication number
WO2016199361A1
WO2016199361A1 PCT/JP2016/002513 JP2016002513W WO2016199361A1 WO 2016199361 A1 WO2016199361 A1 WO 2016199361A1 JP 2016002513 W JP2016002513 W JP 2016002513W WO 2016199361 A1 WO2016199361 A1 WO 2016199361A1
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WO
WIPO (PCT)
Prior art keywords
electronic
guide
electronic substrate
cover
substrate
Prior art date
Application number
PCT/JP2016/002513
Other languages
English (en)
Japanese (ja)
Inventor
政義 栢野
Original Assignee
株式会社デンソー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社デンソー filed Critical 株式会社デンソー
Priority to US15/571,970 priority Critical patent/US10292293B2/en
Publication of WO2016199361A1 publication Critical patent/WO2016199361A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards

Definitions

  • the present disclosure relates to an electronic device formed by holding an electronic substrate on a cover.
  • a pair of tapered nails are formed on a fixed body for fixing the printed circuit board.
  • claw is provided so that it may mutually oppose in the normal line direction of a to-be-fixed body, and a printed circuit board is slid and inserted in the groove
  • the present disclosure has been made in view of the above problems, and an object thereof is to provide an electronic apparatus in which an electronic substrate can be inserted from various directions.
  • an electronic apparatus including an electronic substrate on which an electronic component is mounted and a cover that holds the electronic substrate inserted along the plate surface direction.
  • the cover includes a flat plate portion, a first guide portion that protrudes from the flat plate portion and extends in a posture inclined with respect to the planar direction of the flat plate portion, and is flatter than the first guide portion.
  • An insertion port through which the electronic board can be inserted is extended in a direction inclined away from the part and extending in a direction inclined to the planar direction opposite to the direction in which the first guide part extends in the planar direction.
  • a second guide portion formed between the first guide portion and the first guide portion, the first guide portion and the second guide portion being displaced from each other in the planar direction, wherein the second guide portion is located more than the first guide portion; Located in the insertion direction of the electronic board And wherein the door.
  • the first guide portion and the second guide portion are formed to be inclined with respect to the planar direction of the flat plate portion, and when viewed in the direction in which the electronic substrate is inserted,
  • the guide part and the second guide part are arranged in this order. Therefore, for example, when the electronic board inserted along the plate surface direction is held by the cover, the first guide part and the second guide part serve as a guide. As a result, the step of inserting the electronic substrate between the first guide portion and the second guide portion can be performed smoothly.
  • the first guide portion and the second guide portion that form the insertion port into which the electronic substrate can be inserted are arranged so as to be shifted from each other in the planar direction.
  • the frontage of an insertion slot becomes wide.
  • the insertion direction for inserting the electronic board into the insertion slot is not limited to the planar direction. Therefore, according to this aspect, it is possible to provide an electronic device in which an electronic substrate can be inserted from various directions.
  • the drawing It is a perspective view of the cover in an embodiment. It is an enlarged view of the part of the 1st guide part in an embodiment, and the 2nd guide part. It is a perspective view of the electronic substrate in an embodiment. It is a top view in the state where the electronic substrate in an embodiment was attached to a cover. It is a perspective view of the case in an embodiment. It is the side view seen from the horizontal direction of the cover in an embodiment. It is an enlarged view of the control part in an embodiment. It is explanatory drawing of the board
  • the electronic device 10 in this embodiment includes a metal cover 100, an electronic substrate 200, a metal case 300, and the like.
  • the cover 100 includes a flat plate portion 11, a pair of first guide portions 12, a pair of first standing wall portions 13, a pair of third guide portions 14, two antenna base portions 15, a restriction portion 16, A locking wall 17 is provided.
  • the lateral width of the cover 100 is set to be slightly larger than the lateral width of the electronic substrate 200.
  • the depth direction and the horizontal direction in FIG. The height direction is the normal direction of the cover 100.
  • the flat plate portion 11 has a substantially flat plate shape and has a predetermined thickness in the height direction.
  • the flat plate portion 11 has a substantially square shape when viewed from the height direction.
  • the flat plate part 11 is made of metal.
  • the flat plate portion 11 includes a bottom surface portion 111 and a bottom raised edge portion 112.
  • the bottom surface portion 111 is arranged inside the cover 100 with respect to the bottom raised edge portion 112.
  • the bottom surface portion 111 is recessed from the bottom-up edge portion 112 by a predetermined length in the direction opposite to the height direction.
  • the predetermined length is such a length that the back surface electronic component 201a mounted on the back surface 201 of the electronic substrate 200 facing the bottom surface portion 111 does not contact the bottom surface portion 111 in a state where the electronic substrate 200 is assembled to the cover 100. Is set.
  • Cover fastening holes 113 are formed at the four corners of the bottom-up edge 112. A fastening member that penetrates the cover fastening hole 113 holds the cover 100, the electronic substrate 200, and the case 300.
  • the inner diameter of the cover fastening hole 113 is substantially the same as the inner diameter of the board fastening hole 202 formed in the electronic board 200 (see FIG. 4).
  • the bottom-up edge portion 112 is formed continuously with the bottom surface portion 111 so as to surround the periphery of the bottom surface portion 111, and is raised in the height direction from the bottom surface portion 111.
  • the pair of first guide portions 12 are formed one at each of the lateral ends of the bottom-up edge portion 112.
  • the first guide portion 12 protrudes from the bottom-up edge portion 112 in the height direction.
  • the first guide portion 12 is formed to project in a mountain shape in the height direction.
  • the rising portion from the bottom-up edge portion 112 is smooth.
  • the pair of first guide portions 12 extends in a posture inclined with respect to the flat plate portion 11.
  • the pair of first guide portions 12 are formed at the same position in the depth direction.
  • the pair of first standing wall portions 13 are disposed in the depth direction with respect to the pair of first guide portions 12 and are formed at both lateral ends of the bottom-up edge portion 112.
  • the pair of first standing wall portions 13 are arranged at the same position when viewed from the lateral direction.
  • the pair of first standing wall portions 13 are formed so as to stand in the height direction from the bottom raised edge portion 112 and are continuous with the bottom raised edge portion 112.
  • the height of each first standing wall portion 13 is larger than the height of the first guide portion 12 in the height direction (see FIG. 6).
  • a pair of 1st standing wall part 13 is arrange
  • a bent portion 131 and a second guide portion 132 are formed so as to be continuous with the first standing wall portion 13.
  • the bent portion 131 and the second guide portion 132 are formed by bending a plate-like portion extending from the first standing wall portion 13.
  • the bent portion 131 is continuously formed in the anti-depth direction from the end portion positioned in the height direction in the first standing wall portion 13.
  • the bent portion 131 has a predetermined length in the anti-depth direction.
  • the second guide part 132 is further formed continuously from the bent part 131.
  • the second guide part 132 extends in a posture inclined from the end in the anti-depth direction of the bent part 131 in the height direction.
  • the second guide part 132 extends in a direction opposite to the extending direction of the first guide part 12 in the depth direction.
  • the connecting portion between the second guide portion 132 and the bent portion 131 is smooth.
  • the second guide part 132 is disposed closer to the depth direction than the first guide part 12. Specifically, the distal end portion of the second guide portion 132 extending in the anti-depth direction and the end portion on the back side of the first guide portion 12 are aligned with each other in the depth direction.
  • the second guide part 132 is located farther from the flat plate part 11 than the first guide part 12.
  • the second guide part 132 and the first guide part 12 are arranged so as to be shifted from each other in the depth direction.
  • the second guide part 132 is located in the depth direction relative to the first guide part 12.
  • an insertion port 18 that is a gap into which the electronic substrate 200 can be inserted is formed.
  • the pair of third guide portions 14 is arranged in the opposite depth direction than the pair of first guide portions 12, and is formed one at each lateral end of the bottom-up edge portion 112.
  • the pair of third guide portions 14 includes a standing portion 141 and an inclined portion 142, respectively.
  • the standing portion 141 is a wall that is formed continuously with the bottom-up edge portion 112 and extends in the height direction.
  • the height of the standing portion 141 in the height direction is larger than the height of the first standing wall portion 13 in the height direction (see FIG. 6).
  • the interval between the standing portions 141 of the pair of third guide portions 14 is set to be slightly larger than the lateral width of the electronic substrate 200. With this setting, the standing portion 141 can restrict the lateral movement of the electronic substrate 200.
  • the inclined portions 142 included in each of the pair of third guide portions 14 are formed continuously with the standing portions 141.
  • the mutual distance between the pair of inclined portions 142 is set so as to increase in the height direction. That is, the inclined portion 142 is formed so as to protrude to the outside of the cover 100 as it goes in the height direction. In the lateral direction, the outer edge of each inclined portion 142 protrudes outside the cover from the outer edge of the bottom-up edge portion 112.
  • a first antenna pedestal portion 15 a and a second antenna pedestal portion 15 b are provided on the cover 100.
  • the first antenna base portion 15a and the second antenna base portion 15b are continuous with the bottom-up edge portion 112.
  • the first antenna pedestal portion 15a and the second antenna pedestal portion 15b are arranged in the depth direction with respect to the second guide portions 132.
  • the first antenna pedestal portion 15a and the second antenna pedestal portion 15b include a second standing wall portion 151 and an antenna arrangement portion 152, respectively.
  • the first antenna pedestal portion 15a is continuous with the raised edge portion 112 located in the lateral direction of the bottom surface portion 111, and is disposed in the depth direction with respect to the first standing wall portion 13.
  • the 2nd standing wall part 151a of the 1st antenna base part 15a is a wall which protrudes in the height direction from the bottom raising edge part 112. As shown in FIG.
  • the height in the height direction of the second standing wall portion 151 is larger than the height in the height direction of the standing portion 141 (see FIG. 6).
  • the antenna placement portion 152a of the first antenna base portion 15a is formed continuously with the end portion of the second standing wall portion 151 in the height direction.
  • the antenna placement portion 152a is a portion extending from the second standing wall portion 151a to the inside of the cover, and has a predetermined length in the lateral direction.
  • An antenna for communication between the electronic device 10 and other components is arranged on the upper surface of the antenna arrangement unit 152a located in the height direction.
  • the second antenna pedestal portion 15b is continuous with the raised edge portion 112 located in the depth direction of the bottom surface portion 111.
  • the antenna placement portion 152b of the second antenna base portion 15b is a portion extending from the second standing wall portion 151b to the inside of the cover, and has a predetermined length in the depth direction.
  • An antenna is arranged on the upper surface of the antenna arrangement unit 152b located in the height direction, similarly to the antenna arrangement unit 152a.
  • the locking wall 17 is disposed on the bottom raised edge 112 on the opposite side to the side on which the first antenna pedestal 15a is formed, out of the bottom raised edges 112 located on both sides of the bottom 111 in the lateral direction. Has been.
  • the locking wall 17 locks the electronic substrate 200.
  • the distance between the locking wall 17 and the first antenna pedestal 15 a in the horizontal direction is set to be slightly larger than the width in the horizontal direction of the electronic substrate 200.
  • the movement of the electronic substrate 200 in the lateral direction is restricted by the locking wall 17 and the second standing wall portion 151a of the first antenna base portion 15a.
  • the back side where the first antenna pedestal portion 15a is formed is the second of the locking wall 17 and the first antenna pedestal portion 15a. Movement in the lateral direction is restricted by the standing wall 151a. On the other hand, lateral movement is restricted by the pair of standing portions 141 on the front side.
  • the regulating unit 16 has a function of regulating movement of the electronic substrate 200 in the height direction.
  • the restricting portion 16 is formed continuously with the end portion 11 a in the depth direction of the flat plate portion 11, specifically, the bottom-up edge portion 112 positioned in the depth direction of the bottom surface portion 111.
  • the restricting portion 16 is adjacent to the second antenna base portion 15b in the lateral direction.
  • the restricting portion 16 is formed in a more anti-depth direction than the second standing wall portion 151b of the second antenna base portion 15b.
  • the restricting portion 16 has a restricting wall portion 161 and a latching portion 162.
  • the restriction wall portion 161 extends in the height direction from the end portion 11a.
  • the latching portion 162 is formed continuously with the restriction wall portion 161 and is bent in the lateral direction with respect to the restriction wall portion 161. When the electronic substrate 200 is about to move in the height direction in a state where the electronic substrate 200 is assembled to the cover 100, the latching portion 162 contacts the electronic substrate 200 and restricts further movement.
  • the third guide portion 14, the first guide portion 12, the second guide portion 132, the first antenna pedestal portion 15 a, and the restricting portion 16 as it goes in the depth direction. are arranged in this order.
  • the electronic substrate 200 is a substrate having a thickness in the height direction and has a substantially square shape.
  • the outer shape of the electronic substrate 200 is slightly smaller than the outer shape of the cover 100.
  • One of the both surfaces of the electronic substrate 200 facing the flat plate portion 11 in the state of being held by the cover 100 is the back surface 201 of the electronic substrate 200, and the other facing the height direction is the front surface 203.
  • Electronic components 204 are mounted on both the front surface 203 and the back surface 201 of the electronic substrate 200.
  • substrate fastening holes 202 are formed through which fastening members that integrally hold the cover 100, the electronic substrate 200, and the case 300 pass.
  • the board fastening hole 202 penetrates the electronic board 200 in the height direction.
  • the substrate fastening hole 202 and the cover fastening hole 113 are formed so as to be coaxially positioned (see FIG. 4).
  • a small electronic component 204 a and a large electronic component 204 b are mounted on the electronic substrate 200 as the electronic component 204.
  • the small electronic component 204a has a relatively small height from the mounting surface along the height direction.
  • the height of the large electronic component 204b is larger than the height of the small electronic component 204a.
  • the large electronic components 204b are arranged more concentrated in the anti-depth direction than the small electronic components 204a.
  • the largest electronic component 204c having the largest physique among the large electronic components 204b is disposed in the opposite depth direction than the first guide portion 12.
  • concentration refers to a situation in which more large electronic components 204b are disposed on the front side of the electronic substrate 200 than on the rear side.
  • electronic component 204 that is smaller than the height in the height direction of the second standing wall portion 151 is defined as the small electronic component 204a.
  • the height in the height direction of the first guide portion 12 is higher than the height t1 of the back surface electronic component 201a having the largest height in the height direction among the back surface electronic components 201a mounted on the back surface 201.
  • the length t2 is set to be large (see FIG. 9).
  • penetrating portions 205 notched inside the electronic substrate 200 are formed at both ends in the lateral direction of the electronic substrate 200.
  • the penetrating portion 205 is formed so as to penetrate the electronic substrate 200 in the height direction, and is open to the lateral side surface.
  • Each penetration part 205 is formed in the mutually same position in the depth direction.
  • the first guide portion 12 in a state where the electronic substrate 200 is assembled to the cover 100, the first guide portion 12 is disposed in each through portion 205.
  • the lateral width of the notched portion of the penetrating portion 205 is slightly larger than the lateral width of the first guide portion 12.
  • a notch groove 206 is formed at the end of the electronic substrate 200 in the depth direction.
  • the notch groove 206 is formed so as to penetrate the electronic substrate 200 in the height direction, and is notched inside the electronic substrate 200.
  • the second standing wall portion 151b and the restricting portion 16 of the second antenna base portion 15b are disposed in the notch groove 206 (see FIGS. 4 and 7).
  • the end portion 206a of the electronic substrate 200 that faces the notch groove 206 in the lateral direction is more anti-lateral than the distal end portion of the latching portion 162 that extends in the lateral direction. That is, the latching portion 162 has a tip portion positioned in the height direction of the end portion of the electronic substrate 200 (see FIG. 7).
  • the case 300 is a substantially rectangular parallelepiped housing and includes a case bottom plate 301 and four case side walls 302.
  • the case 300 is surrounded by four case side walls 302 to form an opening that is open in the height direction (see FIG. 5).
  • through holes 304 are formed through which fixing members for fixing the case 300 to other parts are inserted.
  • Four case fastening holes 303 are formed in a portion closer to the inside of the case 300 than the insertion hole 304.
  • the inside of the case fastening hole 303 is processed into a shape that fits with the fastening member, and serves as a nut.
  • the case bottom plate 301 is formed with ribs protruding in the height direction in a substantially lattice shape.
  • a notch portion that opens in the height direction is formed in the case side wall 302 in the anti-depth direction.
  • a part of the electronic component 204 disposed at the end of the electronic substrate 200 on the side opposite to the depth direction is disposed in the notch.
  • the electronic substrate 200 has a first guide portion 12 and a second guide portion toward the depth direction in a state where the plate surface direction is inclined at a predetermined angle ⁇ 1 with respect to the cover 100. It is inserted between 132 (substrate insertion step S1).
  • the depth direction is substantially the same as the insertion direction in which the electronic substrate 200 is inserted.
  • the predetermined angle is set as an insertion angle at which the electronic substrate 200 does not contact the first guide portion 12 or the second guide portion 132.
  • the electronic substrate 200 is inserted while the end on the opposite side in the depth direction is held by a machine or the like. Note that the insertion method is not limited to gripping by a machine or the like, and the electronic substrate 200 may be pressed in the depth direction, for example.
  • the electronic substrate 200 In the substrate insertion step S1, when the electronic substrate 200 is inclined such that the angle between the electronic substrate 200 and the cover 100 becomes a predetermined value or more, the electronic substrate 200 approaches the flat plate portion 11 from the upper side in the height direction. It will be. At this time, the electronic substrate 200 is disposed between the third guide portions 14 provided on both sides of the virtual axis along the insertion direction of the electronic substrate 200 while being guided by the two inclined portions 142. Then, accurate positioning of the electronic substrate 200 between the standing portions 141 becomes unnecessary at the start of the substrate insertion step S1. Therefore, the electronic substrate 200 can be easily inserted even from the upper side in the height direction. And after board
  • the angle of the electronic board 200 with respect to the cover 100 is adjusted to an angle ⁇ 2 smaller than ⁇ 1 (angle adjustment step S2).
  • the electronic substrate 200 is supported by the end of the first guide portion 12 in the height direction.
  • the end portion in the height direction of the first guide portion 12 becomes a fulcrum and rotation becomes easy, the angle adjustment becomes easy.
  • the series of insertion steps is completed with the electronic substrate 200 being completely inserted until the notch groove 206 of the electronic substrate 200 contacts the restricting portion 16.
  • the end of the electronic substrate 200 on the near side and the cover 100 are gripped again, and the electronic substrate 200 and the cover 100 are inverted together as shown in FIG. Step S3).
  • the rear side of the electronic substrate 200 is restricted from moving in the height direction by the restriction portion 16.
  • the front side of the electronic substrate 200 is restricted from moving in the height direction by being held by a machine or the like.
  • the inverted electronic substrate 200 and cover 100 are accommodated in the case 300 (case accommodating step S4).
  • a fastening member is inserted into each fastening hole in a state where the positions of the board fastening hole 202, the cover fastening hole 113, and the case fastening hole 303 are coaxially arranged, and the electronic board 200, the cover 100 and the case 300 are integrated to complete the manufacture of the electronic device 10. (See FIG. 11).
  • the 1st guide part 12 and the 2nd guide part 132 are inclined with respect to the flat plate part 11, and when it sees in the depth direction, the order of the 1st guide part 12 and the 2nd guide part 132 is shown. Is arranged in. Therefore, for example, when the electronic substrate 200 is held on the cover 100 at an angle parallel to the depth direction, the first guide portion 12 and the second guide portion 132 serve as a guide. As a result, the electronic substrate 200 is smoothly inserted into the insertion opening 18 between the first guide portion 12 and the second guide portion 132.
  • the first guide portion 12 and the second guide portion 132 that form the insertion port 18 into which the electronic substrate 200 can be inserted are arranged so as to be shifted from each other in the depth direction.
  • the opening of the insertion port 18 becomes wide.
  • the insertion direction in which the electronic substrate 200 is inserted into the insertion port 18 is not limited to an angle parallel to the depth direction. Therefore, according to the present embodiment, it is possible to provide the electronic device 10 in which the electronic substrate 200 can be inserted from various directions.
  • the through portion 205 is formed in the electronic substrate 200. Therefore, the electronic substrate 200 is unlikely to become unstable. Specifically, since the first guide portion 12 can be disposed in the penetrating portion 205 in a state where the electronic substrate 200 is held by the cover 100, the electronic substrate 200 is supported by the tip of the first guide portion 12 and is flat. It does not become a state of floating from the part 11. Therefore, the electronic substrate 200 can be stably held on the cover 100.
  • the height of the first guide portion 12 in the height direction is higher than the height of the back surface electronic component 201a having the largest height in the height direction among the back surface electronic components 201a mounted on the back surface 201.
  • the height is set to be large. Therefore, there is no possibility that the back surface electronic component 201 a contacts the flat plate portion 11 of the cover 100 when the electronic substrate 200 is slid and inserted in the manufacturing process of the electronic device 10.
  • the bottom surface portion 111 is recessed by a predetermined length from the bottom-up edge portion 112 so that the back surface electronic component 201 a mounted on the back surface 201 does not contact the bottom surface portion 111. Therefore, there is no possibility that the back surface electronic component 201a contacts the cover 100 in a state where the electronic substrate 200 is assembled to the cover 100 (state shown in FIG. 4).
  • the electronic substrate 200 When the electronic substrate 200 is inclined such that the angle between the electronic substrate 200 and the cover 100 becomes a predetermined value or more, the electronic substrate 200 approaches the flat plate portion 11 from above.
  • the inclination part 142 from which a mutual distance expands as it distances from the flat plate part 11 can guide the electronic substrate 200 which approaches the flat plate part 11 from the upper side. Therefore, the assembly property can be improved.
  • the restricting portion 16 is formed continuously with the end portion 11 a in the depth direction of the cover 100, specifically, the bottom-up edge portion 112. Therefore, the movement of the electronic substrate 200 in the height direction is restricted by the restriction unit 16, and the movement of the electronic substrate 200 in the height direction is restricted by being gripped by a machine or the like. .
  • the largest electronic component 204c having the largest physique among the large-sized electronic components 204b is arranged in the direction opposite to the depth than the first guide portion 12. That is, the 1st guide part 12 and the largest electronic component 204c are arrange
  • the insertion direction in which the electronic substrate 200 is inserted is substantially the same as the depth direction.
  • the maximum electronic component 204c that easily interferes with the cover as compared with the small electronic component 204a is disposed in a direction opposite to the insertion direction with respect to the first guide portion 12 and the second guide portion 132. ing.
  • the maximum electronic component 204 c does not go to the first antenna pedestal portion 15 a side than the first guide portion 12 and the second guide portion 132. Therefore, the interference between the maximum electronic component 204c and the first antenna base portion 15a is reliably suppressed. Therefore, it is not necessary to pay attention to interference between the maximum electronic component 204c and the cover 100 when the electronic substrate 200 is inserted into the insertion port 18, and thus the manufacturing efficiency is improved.
  • a bent portion 131 having a predetermined length in the depth direction is formed between the first standing wall portion 13 and the second guide portion 132. Therefore, the first standing wall portion 13 is moved away from the second guide portion 132 in the depth direction. Therefore, when the tip of the electronic substrate 200 is inserted into the insertion port 18, the collision of the electronic substrate 200 with the first standing wall portion 13 is suppressed.
  • the cover 100 may not have the third guide part 14 and the restriction part 16 may not be formed. Further, the antenna base 15 may not be formed. Furthermore, the penetration part 205 does not need to be formed.
  • the electronic substrate 200 is inserted at an angle that allows the electronic substrate 200 to be inserted between the first guide portion 12 and the second guide portion 132.
  • the electronic substrate 200 may be inserted at an angle and position corresponding to the second guide portion 132. In this case, after the front end of the electronic substrate 200 collides with the second guide portion 132, it is guided to the insertion port 18 between the first guide portion 12 and the second guide portion 132 due to the inclination of the second guide portion 132. The Therefore, the electronic substrate 200 can be inserted smoothly.
  • the electronic substrate 200 may be inserted at an angle and a position so as to hit the first guide portion 12. In this case as well, the electronic substrate 200 is guided to the upper side in the height direction due to the inclination of the first guide portion 12 and inserted into the insertion port 18.
  • the inclination angles ⁇ 3 and ⁇ 4 of the second guide portion 132 and the first guide portion 12 with respect to the flat plate portion 11 may be the same angle, or may be set so that one of the inclination angles is larger than the other. .
  • the inclination angle ⁇ ⁇ b> 4 of the second guide part 132 is made larger than the inclination angle ⁇ ⁇ b> 3 of the first guide part 12.
  • the second guide part 132 may be broken by the pressing force applied in the depth direction when the electronic board 200 collides with the second guide part 132.
  • a beam portion 133 that connects the first standing wall portion 13 and the tip of the second guide portion 132 in the height direction may be formed. In this way, the collision force in the depth direction applied to the second guide part 132 can be dispersed, and the second guide part 132 can be prevented from being broken.
  • the first guide portion 12 and the second guide portion 132 do not overlap in the height direction, but as shown in FIG. 15, the end of the inclined surface on the back side in the first guide portion 12 is the second. You may make it overlap with the guide part 132 in a height direction. In this way, even when the electronic substrate 200 is inserted into the insertion port 18 at an angle that does not contact both the first guide portion 12 and the second guide portion 132 in the substrate insertion step S1, the first guide portion The electronic substrate 200 can be smoothly inserted by the inclined surface on the back side of the twelve.
  • the standing portion 141 is a wall that is formed continuously with the bottom-up edge portion 112 and extends in the height direction. However, it may be formed in a shape such that the distance between each other increases in the anti-depth direction. In this way, even when the electronic substrate 200 is inserted without being inclined with respect to the flat plate portion 11, the insertion can be guided by the standing portion 141.
  • the second standing wall portion 151 and the locking wall 17 may be formed such that the distance between them increases in the anti-depth direction. In this case, the insertion of the electronic substrate 200 in the depth direction can be guided by the second standing wall portion 151 and the locking wall 17.
  • a first bellows portion 121 may be formed in the first guide portion 12.
  • the 1st bellows part 121 has the trough part 121a and the peak part 121b.
  • a second bellows portion 163 having a mountain and a valley may be formed in the restriction portion 16. If it does in this way, the movement of a height direction can be controlled by inserting the electronic substrate 200 in the trough part of each bellows part. Specifically, the electronic substrate 200 is pressed into the cover 100 side in a state where the electronic substrate 200 is fully inserted until the end portion in the depth direction of the electronic substrate 200 abuts against the restricting portion 16, and is fitted into the valley portions of the bellows portions. Furthermore, by forming each bellows part with an elastic member such as a spring, it is possible to easily fit the valley part by pressing.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

Appareil électronique pourvu : d'un substrat électronique (200) sur lequel est monté un composant électronique (204) ; et d'un couvercle (100) qui maintient le substrat électronique (200) qui est introduit dans la direction de surface de substrat. Le couvercle (100) est pourvu : d'une section panneau plat (11) ; d'une première section de guidage (12), qui fait saillie à partir de la section panneau plat (11) et qui s'étend de la manière inclinée par rapport à la direction plane de la section panneau plat (11) ; et d'une seconde section de guidage (132), qui est positionnée plus loin de la section panneau plat (11) que la première section de guidage (12), s'étend, de la manière inclinée par rapport à la direction plane, dans la direction opposée à la direction dans laquelle la première section de guidage (12) s'étend dans la direction plane, et forme un trou d'introduction (18) dans lequel le substrat électronique (200) peut être introduit, ledit trou d'introduction étant formé entre la première section de guidage (12) et la seconde section de guidage. La première section de guidage (12) et la seconde section de guidage (132) sont disposées en étant déplacées l'une par rapport à l'autre dans la direction plane, et la seconde section de guidage (132) est positionnée plus dans la direction d'introduction que la première section de guidage (12), ladite direction d'introduction étant la direction dans laquelle le substrat électronique (200) est introduit.
PCT/JP2016/002513 2015-06-08 2016-05-24 Appareil électronique WO2016199361A1 (fr)

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JP6631581B2 (ja) * 2017-04-17 2020-01-15 株式会社デンソー 電子装置
JP7181071B2 (ja) * 2018-12-10 2022-11-30 ファナック株式会社 電子装置

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JPS625691U (fr) * 1985-06-26 1987-01-14
JPS6270486U (fr) * 1985-10-22 1987-05-02
JP2005045625A (ja) * 2003-07-23 2005-02-17 Denso Corp キーレスエントリー受信機及びその製造方法
JP2007336044A (ja) * 2006-06-13 2007-12-27 Sony Corp 電子機器
WO2011089655A1 (fr) * 2010-01-25 2011-07-28 三菱電機株式会社 Structure de fixation de substrat
JP2012151380A (ja) * 2011-01-21 2012-08-09 Sony Corp 表示装置および電子機器

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JPH04363098A (ja) 1991-04-26 1992-12-15 Matsushita Electric Works Ltd プリント基板固定構造
DE19734110C1 (de) * 1997-08-07 1998-11-19 Bosch Gmbh Robert Elektrisches Gerät mit einer Leiterplatte und Verfahren zum Fügen des Geräts
JP4270865B2 (ja) 2000-08-18 2009-06-03 三菱電機株式会社 実装基板及び実装基板を用いたバルブソケット
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JPS59103492U (ja) * 1982-12-28 1984-07-12 アルプス電気株式会社 プリント基板の保持構造
JPS625691U (fr) * 1985-06-26 1987-01-14
JPS6270486U (fr) * 1985-10-22 1987-05-02
JP2005045625A (ja) * 2003-07-23 2005-02-17 Denso Corp キーレスエントリー受信機及びその製造方法
JP2007336044A (ja) * 2006-06-13 2007-12-27 Sony Corp 電子機器
WO2011089655A1 (fr) * 2010-01-25 2011-07-28 三菱電機株式会社 Structure de fixation de substrat
JP2012151380A (ja) * 2011-01-21 2012-08-09 Sony Corp 表示装置および電子機器

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US20180146567A1 (en) 2018-05-24

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