WO2016194474A1 - タッチセンサの製造方法 - Google Patents
タッチセンサの製造方法 Download PDFInfo
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- WO2016194474A1 WO2016194474A1 PCT/JP2016/061527 JP2016061527W WO2016194474A1 WO 2016194474 A1 WO2016194474 A1 WO 2016194474A1 JP 2016061527 W JP2016061527 W JP 2016061527W WO 2016194474 A1 WO2016194474 A1 WO 2016194474A1
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- photosensitive resin
- resin layer
- light
- layer
- film
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0416—Control or interface arrangements specially adapted for digitisers
- G06F3/04164—Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0307—Providing micro- or nanometer scale roughness on a metal surface, e.g. by plating of nodules or dendrites
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Definitions
- This invention relates to the manufacturing method of a touch sensor provided with a base film, an electrode, and routing wiring.
- Capacitive touch on the display screen of multi-function mobile phones (smartphones), multi-function mobile terminals (tablets), car navigation, portable game machines, small electronic devices such as electronic dictionaries, and display devices such as OA / FA devices
- a sensor equipped with a sensor that can be input on a screen is widely used.
- a transparent conductive film is used for electrodes that are required to be transparent.
- ITO Indium-Tin-Oxide
- indium oxide Indium oxide
- tin oxide Indium oxide
- the like which exhibit high transmittance with respect to visible light
- the electrodes of the touch sensor a pattern obtained by patterning a transparent conductive film made of the above-mentioned material has become the mainstream.
- a method for patterning a transparent conductive film As a method for patterning a transparent conductive film, a method is generally used in which after forming a transparent conductive film, a resist pattern is formed by photolithography, and a predetermined portion of the conductive film is removed by wet etching to form a conductive pattern.
- a mixed liquid composed of two liquids of hydrochloric acid and ferric chloride is generally used as an etching liquid.
- the ITO film and the tin oxide film are generally formed by a sputtering method.
- the properties of the transparent conductive film are easily changed depending on the difference in sputtering method, sputtering power, gas pressure, substrate film temperature, type of atmospheric gas, and the like. Differences in the film quality of the transparent conductive film due to variations in sputtering conditions cause variations in the etching rate when the transparent conductive film is wet-etched, and are liable to reduce product yield due to patterning defects.
- the conductive pattern forming method described above has undergone a sputtering process, a resist forming process, and an etching process, the process is long and a great burden is imposed on the cost.
- Patent Document 1 After forming a conductive layer containing conductive fibers such as silver fibers on a base film, a photosensitive resin layer is formed on the conductive layer, and a pattern mask is formed thereon. A method of forming a conductive pattern that is exposed to light and developed is disclosed.
- Patent Document 2 uses a transfer type photosensitive conductive film in which a conductive layer containing a conductive fiber such as silver fiber and a light-sensitive resin layer are laminated on a support film.
- a method of forming a conductive pattern is also disclosed in which the photosensitive resin layer is laminated on a film so that the photosensitive resin layer is in close contact, exposed through a pattern mask, and developed after the support film is peeled off.
- the present inventors have considered that conductive layers containing conductive fibers such as silver fibers are provided on both sides of the base film, and patterning the conductive layers in different patterns on both sides at the same time, the active area It was a problem how to form a circuit around the outer periphery of the base film on both sides. That is, although the method of printing by ink jet printing or silk screen printing using conductive ink containing conductive fibers such as silver fibers can be considered, these methods cannot be processed simultaneously on both sides of the base film, Also, the alignment accuracy of the front and back surfaces is not good.
- the first aspect of the present invention includes a light-shielding metal layer on both surfaces of a base film having UV-cut performance, and a first photosensitive resin layer on each of the light-shielding metal layers.
- the second aspect of the present invention provides the touch sensor forming method according to the first aspect, wherein the thickness of the second photosensitive resin layer is 1 ⁇ m to 2 ⁇ m.
- the third aspect of the present invention is a step of forming a light-shielding metal layer on both surfaces of a base film having UV cut performance, and forming a first photosensitive resin layer on each of the light-shielding metal layers, An exposure step of irradiating the first photosensitive resin layer on the light-shielding metal layer with UV light through different pattern masks on both sides; Forming a resist pattern by developing the exposed first photosensitive resin layer; An etching step of forming a routing circuit pattern by removing the light-shielding metal layer in a portion not covered with the resist pattern; Removing the first photosensitive resin layer covering the routing circuit pattern at least at a connection portion; and A photosensitive conductive film comprising: a support film; a second photosensitive resin layer provided on the support film; and a conductive layer containing conductive fibers provided on the second photosensitive resin layer.
- the fourth aspect of the present invention provides the touch sensor forming method according to any one of the first to third aspects, wherein the total thickness of the second photosensitive resin layer and the conductive layer is 1 to 3 ⁇ m.
- the step of peeling and removing the first photosensitive resin layer removes the first photosensitive resin layer. Furthermore, before the step of laminating the photosensitive conductive film, the method further comprises a step of covering the light-shielding metal layer of the routing circuit pattern with a PAS layer excluding the connection portion. A method for forming a touch sensor is provided.
- the overlapping portion with the electrode pattern is roughened.
- the seventh aspect of the present invention is the touch sensor according to the sixth aspect, wherein the rough surface in the roughening step has an arithmetic average roughness (Ra) measured in accordance with JIS B 0601: 2001 of 1 nm to 50 nm.
- Ra arithmetic average roughness
- the manufacturing method of the touch sensor of the present invention is configured as described above, it is possible to process the drawing circuit pattern on both surfaces of the base film at the same time, and it is excellent in the alignment accuracy of the front and back surfaces.
- Schematic diagram of a touch sensor according to the present invention Partial enlarged plan view of a touch sensor according to the present invention
- the schematic diagram which shows the process of forming a light-shielding metal layer and a 1st photosensitive resin layer The schematic diagram which shows the exposure process of a 1st photosensitive resin layer Schematic diagram showing the development process of the first photosensitive resin layer Schematic diagram showing the etching process of the light-shielding metal layer
- the schematic diagram which shows the process of peeling and removing the 1st photosensitive resin layer Schematic diagram showing the process of forming the PAS layer in the routing circuit pattern
- Schematic diagram showing the process of laminating a photosensitive conductive film The schematic diagram which shows the exposure process of a 2nd photosensitive resin layer Schematic diagram showing the development process of the second photosensitive resin layer Schematic diagram showing another process of laminating a photosensitive conductive film
- the schematic diagram which shows another exposure process of a 2nd photosensitive resin layer The schematic diagram which shows another image development process of a 2nd photo
- the touch sensor 30 is of the electrostatic capacity type that is bonded to the back surface of the cover glass of the electronic device display window. Specifically, as shown in FIG. 1, a transparent base film 1, a transparent conductive film formed on both surfaces of the base film 1 so as to have an electrode pattern 25 in the center portion 1 a, and an outer frame A light-shielding conductive film formed so as to have a routing circuit pattern 5 of the portion 1b.
- the electrode pattern 25 formed on the central window 1a of the touch sensor 30 will be supplementarily described.
- the electrode pattern 25 has different patterns on the front and back sides.
- a rhombus electrode 251 a having a rhombus shape in plan view, and a connection wiring 251 b penetrating the plurality of rhombus electrodes 251 a in the vertical direction (Y direction) in the drawing. are provided in the central portion 1a.
- the plurality of rhombus electrodes 251a and the connection wiring 251b are electrically connected to each other.
- connection wiring 251b and a plurality of rhombus electrodes 251a penetrating therethrough are taken as a set, and the set is repeatedly arranged in the horizontal direction (X direction) in the figure.
- a plurality of rhombus electrodes 252a and connection wirings 252b penetrating them are provided in the central portion 1a on the surface of the base film 1.
- the extending direction of the connection wiring 252b is different from that of the connection wiring 251b and is the horizontal direction (X direction) in the drawing.
- the direction in which a set of the connection wiring 252b and the plurality of rhombus electrodes 252a penetrating the connection wiring 252b is repeatedly arranged is the vertical direction (Y direction) in the figure.
- the rhombus electrode 251a is disposed so as to fill the gaps between the plurality of connection wirings 252b, while the rhombus electrode 252a is disposed so as to fill the gaps between the plurality of connection wirings 251b. Is done.
- the positional relationship between the rhombus electrode 251a and the rhombus electrode 252a is complementary. That is, the plurality of rhombus electrodes 252a are arranged so as to fill the gaps in the rhombus shape that occur when the rhombus electrodes 251a are arranged in a matrix.
- the X direction electrode and the Y direction electrode are arranged so as to form a lattice in plan view, so if a user's finger or the like touches any position on the lattice through the cover glass, A capacitor is formed between the finger or the like and the X-direction electrode touched by the finger or the like, and a capacitor is formed between the finger or the like and the Y-direction electrode touched by the finger or the like. By forming this capacitor, the capacitance of the X direction electrode and the Y direction electrode increases.
- the position detector of the external circuit detects the amount of change in capacitance that occurs in such a case, or even the X-direction electrode and Y-direction electrode having the maximum capacitance, and gives a specific value where it touched. It can be acquired as a set of X coordinate values and Y coordinate values.
- the light-shielding metal layer 2 is formed on both surfaces of the base film 1 having UV cut performance, and the first photosensitive resin layer 3 is formed on the light-shielding metal layer 2 respectively.
- a step of forming the resist pattern 4 by developing the exposed first photosensitive resin layer 3 see FIG. 5
- a portion of the light-shielding metal layer not covered with the resist pattern 4 An etching process (see FIG.
- the base film 1 is preferably configured using a material excellent in transparency, flexibility, insulation, and the like.
- materials that satisfy such requirements include general-purpose resins such as polyethylene terephthalate and acrylic resins, general-purpose engineering resins such as polyacetal resins and polycarbonate resins, and super engineering resins such as polysulfone resins and polyphenylene sulfide resins.
- the resin film which consists of is illustrated.
- the thickness of the base film 1 can be set to 25 ⁇ m to 100 ⁇ m, for example.
- the base film 1 may be comprised using film glass etc.
- the second photosensitive resin layer is formed by photolithography in the method of forming the electrode pattern 25 described later.
- the UV light 15 that is not absorbed by the second photosensitive resin layer 23 among the UV light 15 irradiated from one surface side of the base film 1 is the base film. 1 reaches the second photosensitive resin layer 23 on the other surface side, and therefore, it is problematic that electrodes having different patterns cannot be simultaneously formed on both surfaces of the base film 1.
- a layer having a UV cut function is used as the base film 1.
- a layer having a UV cut function as the base film 1
- the light absorbing material used for cutting the UV light 15 include a UV absorber and a resin having a UV absorbing function, and a UV absorber is added to the base film 1 or the base film 1 is configured.
- a resin having a UV absorption function can be copolymerized.
- UV absorber contained in the base film 1 examples include benzophenone series, benzotriazole series, benzoate series, salicylate series, triazine series, and cyanoacrylate series.
- benzotriazole-based UV absorbers include 2- (2H-benzotriazol-2-yl) -p-cresol, 2- (2H-benzotriazol-2-yl) -4-6-bis (1-methyl-1-phenylethyl) phenol, 2- [5-chloro (2H) -benzotriazol-2-yl] -4-methyl-6- (tert-butyl) phenol, 2- (2H-benzotriazole -Yl) -4,6-di-tert-pentylphenol, 2- (2H-benzotriazol-2-yl) -4- (1,1,3,3-tetramethylbutyl) phenol and mixtures thereof, Examples include modified products, polymers, and derivatives.
- UV absorbers 2- (4,6-diphenyl-1,3,5-triazin-2-yl) -5-[(hexyl) oxy] -phenol, 2- [4- [ (2-Hydroxy-3-dodecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4-dimethylphenyl) -1,3,5-triazine, 2- [4-[(2 -Hydroxy-3-tridecyloxypropyl) oxy] -2-hydroxyphenyl] -4,6-bis (2,4dimethylphenyl) -1,3,5-triazine, 2,4-bis (2,4- Examples thereof include dimethylphenyl) -6- (2-hydroxy-4-iso-octyloxyphenyl) -s-triazine, and mixtures, modified products, polymers, and derivatives thereof. These may be used alone or in combination.
- the resin having a UV absorption function includes a non-reactive UV absorber such as benzophenone, benzotriazole, benzoate, salicylate, triazine, cyanoacrylate, and the like, vinyl group, acryloyl group, A functional group having a polymerizable double bond such as a methacryloyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, an epoxy group, or an isocyanate group is introduced.
- a non-reactive UV absorber such as benzophenone, benzotriazole, benzoate, salicylate, triazine, cyanoacrylate, and the like
- vinyl group acryloyl group
- a functional group having a polymerizable double bond such as a methacryloyl group, an alcoholic hydroxyl group, an amino group, a carboxyl group, an epoxy group, or an isocyanate group is introduced.
- the content of the light-absorbing material is not particularly limited as long as light that has not been absorbed by the second photosensitive resin layer 23 on one surface of the base film 1 can be prevented from reaching the second photosensitive resin layer 23 on the other surface. It is not limited.
- Examples of the light-shielding metal layer 2 include a single metal film having high conductivity and good light-shielding property, and a layer made of an alloy or a compound thereof, such as a vacuum deposition method, a sputtering method, an ion plating method, and a plating method. It is good to form with.
- Examples of the preferable metal include aluminum, nickel, copper, silver, and tin.
- a metal film made of copper foil and having a thickness of 20 to 1000 nm is very preferable because of its excellent conductivity and light shielding properties. More preferably, the thickness is 30 nm or more. More preferably, the thickness is 100 to 500 nm.
- a highly conductive light-shielding metal layer 2 can be obtained by setting the thickness to 100 nm or more, and a light-shielding metal layer 2 that is easy to handle and excellent in workability can be obtained by setting the thickness to 500 nm or less.
- the first photosensitive resin layer 3 is an acrylic resin having a thickness of 10 to 20 ⁇ m that can be exposed to a carbon arc lamp, a mercury vapor arc lamp, an ultra-high pressure mercury lamp, a high-pressure mercury lamp, a xenon lamp, etc. and developed with an alkaline aqueous solution described later. It consists of a photoresist material.
- the first photosensitive resin layer 3 was formed on the entire surface by a general printing method such as gravure, screen, and offset, as well as various coater methods, coating and dipping methods, and a dry film resist method. The patterning may be performed after exposure and development, but the dry film resist method is more preferable.
- a dry film resist (DFR) used in the dry film resist method is a film in which the photosensitive layer to be the first photosensitive resin layer 3 is sandwiched between a base film and a cover film.
- the above printing method, coating method, painting method, etc. have problems such as only one side coating and poor efficiency, whereas the dry film resist method bonds the photosensitive layer with a heating roll after peeling the cover film.
- This method is mainstream because it is highly productive and can meet various requirements. Note that exposure is usually performed by placing a pattern mask on the base film (not shown), and development is performed after the base film is peeled off.
- the base film of the dry film resist a film made of polyethylene terephthalate or the like can be used. Moreover, what consists of polyethylene etc. can be used as a cover film of a dry film resist.
- Examples of the exposure method in the exposure step include a method of irradiating the UV light 15 in an image form through a pattern mask (mask exposure method).
- a known light source such as a carbon arc lamp, a mercury vapor arc lamp, an ultrahigh pressure mercury lamp, a high pressure mercury lamp, or a xenon lamp is used.
- what emits ultraviolet rays effectively, such as Ar ion laser and semiconductor laser is also used.
- a method of irradiating the UV light 15 in an image shape by a direct drawing method using a laser exposure method or the like may be employed.
- the base film 1 made of a resin film has a problem of elongation. Therefore, the patterning of the first photosensitive resin layer 3 of the laminate is suitably performed by double-sided simultaneous exposure as in the present invention. This is because, when the patterning of the first photosensitive resin layer 3 is performed by exposing one side at a time, the patterning on one side is completed, and the base film 1 is stretched when the front and back of the laminate are replaced in the exposure apparatus and attached again. This is because the cured pattern 3a on the front surface and the cured pattern 3a on the back surface are displaced. In the case of the example shown in FIG.
- the accuracy of the electrode pattern 25 is important, and the cured pattern 3a on the surface (finally the inversion pattern of the routing circuit) And the cured pattern 3a on the back surface (finally the reversed pattern of the routing circuit) are misaligned, the connection with these electrode patterns 25 becomes uncertain.
- the light-shielding conductive film blocks the UV light 15 on the opposite side, so that even if it is exposed with a different mask pattern at the same time, it affects the patterning of the first photosensitive resin layer 3 on the opposite side.
- both surfaces can be exposed simultaneously, it is easy to align the cured pattern 3a on the front surface and the cured pattern 3a on the back surface, and the double-sided pattern can be formed in a single process, resulting in excellent productivity.
- a well-known mask alignment method of a double-sided exposure apparatus can be used for alignment of the front and back masks.
- a mask alignment mark is formed on each of the front mask and the back mask, and an optical reading sensor such as a camera reads the overlapping state of the pair of mask alignment marks, thereby relative to the front mask and the back mask. Get location information. Then, based on the obtained position information, the mask position adjusting mechanism relatively moves the front mask and the back mask so that the pair of mask alignment marks overlap with each other. For example, a method of aligning the back mask.
- the wet development is performed by a known method such as spraying, rocking immersion, brushing, or scraping, using a developer corresponding to a photosensitive resin such as an alkaline aqueous solution, an aqueous developer, or an organic solvent developer. .
- a safe and stable aqueous solution such as an alkaline aqueous solution
- the base of the alkaline aqueous solution include alkali hydroxides such as lithium, sodium, or potassium hydroxide, alkali carbonates such as lithium, sodium, potassium, or ammonium carbonate or bicarbonate, potassium phosphate, and phosphoric acid.
- Alkali metal phosphates such as sodium and alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate are used.
- a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating development, and the like may be mixed.
- an aqueous developer composed of water or an aqueous alkaline solution and one or more organic solvents
- the base contained in the alkaline aqueous solution in addition to the above-mentioned bases, for example, borax, sodium metasilicate, tetramethylammonium hydroxide, ethanolamine, ethylenediamine, diethylenetriamine, 2-amino-2-hydroxymethyl-1 , 3-propanediol, 1,3-diaminopropanol-2, morpholine.
- organic solvent examples include 3 acetone alcohol, acetone, ethyl acetate, alkoxy ethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether. Is mentioned. These are used individually by 1 type or in combination of 2 or more types. In addition, a small amount of a surfactant, an antifoaming agent, or the like can be added to the aqueous developer.
- Examples of the developing method include a dip method, a battle method, a spray method, brushing, and slapping. Among these, it is preferable to use a high-pressure spray system from the viewpoint of improving resolution.
- the etching process In the etching process, the light-shielding metal layer 2 is simultaneously etched with an etchant such as ferric chloride, and the light-shielding metal layer 2 in a portion where the resist pattern 4 is not formed is removed.
- an etchant such as ferric chloride
- the first photosensitive resin layer 3 remaining on the patterned light-shielding metal layer 2 is completely stripped with a resist stripping solution, and the entire surface of the light-shielding metal layer 2 is once temporarily removed. Expose (see FIG. 7).
- an acidic stripping solution or an alkaline stripping solution is used as the resist stripping solution.
- a typical acidic stripping solution a stripping solution in which a phenol compound, a chlorinated solvent, an aromatic hydrocarbon, or the like is blended with alkylbenzene sulfonic acid is commercially available.
- alkaline stripping solution a stripping solution comprising a water-soluble organic amine and an organic solvent such as dimethyl sulfoxide is commercially available.
- the PAS (passivation) layer covers the portion other than the connection portion 5a of the routing circuit pattern 5 and functions as an insulating rust prevention layer that protects the routing circuit pattern 5 (see FIG. 8).
- the PAS layer 6 can use the same material and method as the resist pattern 4.
- the formation method of the electrode pattern 25 of the invention according to the present embodiment is performed through the following steps after each forming step of the routing circuit pattern 5 described above. That is, the photosensitive conductive film 20 provided with the support film 21, the conductive layer 22 provided on the support film 21 and containing conductive fibers, and the second photosensitive resin layer 23 provided on the conductive layer 22. Are laminated so that the second photosensitive resin layer 23 is in close contact with both surfaces of the base film 1 on which the routing circuit pattern 5 is formed (see FIG. 9), and on both surfaces of the base film 1 An exposure step (step in FIG.
- the laminating step shown in FIG. 9 is performed, for example, by a method of laminating the photosensitive conductive film 20 by pressing the photosensitive resin layer side to the base film 1 while heating. In addition, it is preferable to laminate
- the support film 21 examples include polymer films having heat resistance and solvent resistance such as polyethylene terephthalate film, polyethylene film, polypropylene film, and polycarbonate film.
- polymer films having heat resistance and solvent resistance such as polyethylene terephthalate film, polyethylene film, polypropylene film, and polycarbonate film.
- these polymer films must be removable from the photosensitive resin layer later, they must not be subjected to a surface treatment or material that makes removal impossible.
- the thickness of the support film 21 is preferably 5 to 300 ⁇ m, more preferably 10 to 200 ⁇ m, and particularly preferably 15 to 100 ⁇ m.
- the support film 21 tends to be easily torn in the step of coating or the step of peeling the support film 21 before developing the exposed photosensitive resin layer 3.
- the thickness of the support film 21 exceeds 300 ⁇ m, the pattern resolution tends to decrease when the UV light 15 is irradiated onto the second photosensitive resin layer 23 through the support film 21, and the price increases. There is a tendency.
- the haze value of the support film 21 is preferably 0.01 to 5.0%, more preferably 0.01 to 3.0%, from the viewpoint of improving sensitivity and resolution. It is particularly preferably from 2.0 to 2.0%, and extremely preferably from 0.01 to 1.0%.
- the haze value can be measured according to JIS K-7105. For example, it can be measured with a commercially available turbidimeter such as NDH-1001DP (trade name, manufactured by Nippon Denshoku Industries Co., Ltd.). .
- Examples of the conductive fibers contained in the conductive layer 22 include metal fibers such as gold, silver, and platinum, and carbon fibers such as carbon nanotubes. These can be used alone or in combination of two or more. From the viewpoint of conductivity, it is preferable to use gold fiber or silver fiber. Gold fiber and silver fiber can be used individually by 1 type or in combination of 2 or more types. Furthermore, silver fiber is more preferable from the viewpoint of easily adjusting the conductivity of the formed conductive film.
- the metal fiber can be prepared by, for example, a method of reducing metal ions with a reducing agent such as NaBH4 or a polyol method.
- the fiber diameter of the conductive fibers is preferably 1 nm to 50 nm, more preferably 2 nm to 20 nm, and particularly preferably 3 nm to 10 nm.
- the fiber length of the conductive fiber is preferably 1 ⁇ m to 100 ⁇ m, more preferably 2 ⁇ m to 50 ⁇ m, and particularly preferably 3 ⁇ m to 10 ⁇ m.
- the conductive layer 22 preferably has a network structure in which conductive fibers are in contact with each other.
- the conductive layer 22 having such a network structure is formed on the surface of the second photosensitive resin layer 23 on the support film 21 side, and is conductive in the surface direction on the surface exposed when the support film 21 is peeled off. It is sufficient if the sex is obtained. Therefore, in the definition of “the second photosensitive resin layer 23 provided on the conductive layer 22” in this specification, the conductive layer 22 having a network structure is the support film 21 side of the second photosensitive resin layer 23. The case where it is formed in the form included in the surface layer is also included.
- the thickness of the conductive layer 22 varies depending on the use of the conductive film or conductive pattern formed using the photosensitive conductive film 20 and the required conductivity, but is preferably 1 ⁇ m or less, preferably 1 nm to 0.5 ⁇ m. More preferably, it is 5 nm to 0.1 ⁇ m.
- the thickness of the conductive layer 22 is 1 ⁇ m or less, the light transmittance in the wavelength region of 450 to 650 nm is high, the pattern forming property is excellent, and it is particularly suitable for the production of a transparent electrode.
- the conductive layer 22 containing conductive fibers is, for example, conductive obtained by adding the above-described conductive fibers to the support film 21 with water and / or an organic solvent and, if necessary, a dispersion stabilizer such as a surfactant. It can be formed by coating and then drying the fiber dispersion. After drying, the conductive layer 22 formed on the support film 21 may be laminated as necessary.
- the coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method. The drying can be performed at 30 to 150 ° C. for about 1 to 30 minutes with a hot air convection dryer or the like.
- the conductive fibers may coexist with a surfactant or a dispersion stabilizer.
- the second photosensitive resin layer 23 is formed from a photosensitive resin composition containing (a) a binder polymer, (b) a photopolymerizable compound having an ethylenically unsaturated bond, and (c) a photopolymerization initiator. Things.
- (A) As a binder polymer for example, obtained by reaction of acrylic resin, styrene resin, epoxy resin, amide resin, amide epoxy resin, alkyd resin, phenol resin, ester resin, urethane resin, epoxy resin and (meth) acrylic acid
- acrylic resin styrene resin
- epoxy resin amide resin
- amide epoxy resin alkyd resin
- phenol resin ester resin
- urethane resin epoxy resin
- epoxy resin and (meth) acrylic acid examples thereof include epoxy acrylate resins, acid-modified epoxy acrylate resins obtained by reaction of epoxy acrylate resins and acid anhydrides, and the like. These resins can be used singly or in combination of two or more.
- the photopolymerizable compound having an ethylenically unsaturated bond is preferably a photopolymerizable compound having an ethylenically unsaturated bond.
- Examples of the photopolymerizable compound having an ethylenically unsaturated bond include a compound obtained by reacting a polyhydric alcohol with an ⁇ , ⁇ -unsaturated carboxylic acid, 2,2-bis (4-((meth) acryloxy).
- Examples of the photopolymerization initiator include benzophenone, N, N′-tetramethyl-4,4′-diaminobenzophenone (Michler ketone), N, N′-tetraethyl-4,4′-diaminobenzophenone, 4- Methoxy-4′-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1,2-methyl-1- [4- (methylthio) phenyl] -2-morpholino- Aromatic ketones such as propanone-1, 2-ethylanthraquinone, phenanthrenequinone, 2-tert-butylanthraquinone, octamethylanthraquinone, 1,2-benzanthraquinone, 2,3-benzanthraquinone, 2-phenylanthraquinone, 2,3 -Diphenylanthra
- the second photosensitive resin layer 23 is formed by applying and drying a solution of a photosensitive resin composition having a solid content of about 10 to 60% by mass, dissolved in a solvent, on the support film 21 on which the conductive layer 22 is formed. It can. However, in this case, the amount of the remaining organic solvent in the photosensitive resin layer after drying is preferably 2% by mass or less in order to prevent the organic solvent from diffusing in the subsequent step.
- Coating can be performed by a known method such as a roll coating method, a comma coating method, a gravure coating method, an air knife coating method, a die coating method, a bar coating method, or a spray coating method. After coating, drying to remove the organic solvent and the like can be performed at 70 to 150 ° C. for about 5 to 30 minutes with a hot air convection dryer or the like.
- the thickness of the second photosensitive resin layer 23 is generally preferably 1 ⁇ m to 15 ⁇ m, and more preferably 1 to 10 ⁇ m, after drying. If the thickness is less than 1 ⁇ m, coating tends to be difficult, and if it exceeds 15 ⁇ m, the sensitivity due to a decrease in light transmission is insufficient, and the photocurability of the photosensitive resin layer to be transferred tends to be reduced.
- the second photosensitive resin layer 23 when the photosensitive conductive film 20 is in the order of the conductive layer 22 containing conductive fibers and the second photosensitive resin layer 23 from the support film 21 side, the second photosensitive resin layer 23.
- the thickness of is particularly preferably 2 ⁇ m or less. When the thickness exceeds 2 ⁇ m, the conductivity with the routing circuit tends to be lowered.
- the laminate of the conductive layer 22 and the second photosensitive resin layer 23 has a wavelength range of 450 to 650 nm when the total thickness of both layers is 1 to 10 ⁇ m.
- the minimum light transmittance is preferably 80% or more, and more preferably 85% or more.
- the total thickness of the conductive layer 22 and the second photosensitive resin layer 23 is more preferably 3 ⁇ m or less. If the thickness exceeds 3 ⁇ m, the step between the portion where the electrode pattern 25 is formed and the portion where the electrode pattern 25 is not formed becomes large, so that the pattern appears.
- the photosensitive conductive film 20 may further have a layer such as an adhesive layer.
- the base film 1 of this embodiment is provided with a UV cut function as described above, and when performing double-sided simultaneous exposure, a layer having a UV cut function is used as the base film 1.
- a layer having a UV cut function as the base film 1, among the UV light 15 irradiated from one surface side of the base film 1, light that has not been absorbed by the second photosensitive resin layer 23 is Reaching the second photosensitive resin layer 23 on the other surface side of the base film 1 can be prevented.
- the second photosensitive resin layer 23 By passing through the above-mentioned steps, those provided with the second photosensitive resin layer 23 having the cured pattern 24 on both surfaces of the base film 1 where the drawing circuit pattern 5 is formed are obtained (see FIG. 10).
- the second photosensitive resin layer 23 is heated at about 60 to 250 ° C. or exposed at about 0.2 to 10 J / cm 2 as necessary. May be further cured.
- portions other than the cured portion of the second photosensitive resin layer 23 are removed. Specifically, when the transparent support film 21 exists on the conductive layer 22, the support film 21 is first removed, and then a portion other than the cured portion of the second photosensitive resin layer 23 by wet development. Remove. Thereby, the conductive layer 22 containing conductive fibers remains on the cured resin layer having a predetermined pattern, and the electrode pattern 25 is formed (see FIG. 11).
- the conductive pattern is further cured by heating at about 60 to 250 ° C. or exposure at about 0.2 to 10 J / cm 2 as necessary after development. May be.
- the drawing circuit pattern can be processed on both surfaces of the base film at the same time, and a touch panel with excellent front and back alignment accuracy can be obtained.
- the method for forming the electrode pattern 25 of the invention according to this embodiment includes the support film 21, the second photosensitive resin layer 23 provided on the support film 21, and the second photosensitive resin layer 23. Laminating the photosensitive conductive film 20 including the conductive layer 22 containing the conductive fibers so that the conductive layer 22 is in close contact with both surfaces of the base film 1 on which the routing circuit pattern 5 is formed. (See FIG.
- a touch sensor including a conductive film (electrode pattern 25) patterned on the film is obtained.
- the first embodiment is a photosensitive conductive film 20 (so-called face-up type) in which the conductive layer 22 and the second photosensitive resin layer 23 are laminated in this order from the support film 21 side, whereas this embodiment is a support
- the two are different in that it is a photosensitive conductive film 20 (so-called face-down type) in which the second photosensitive resin layer 23 and the conductive layer 22 are laminated in this order from the film 21 side.
- the conductive layer 22 containing conductive fibers provided on the second photosensitive resin layer 23” in this specification the conductive layer 22 having a network structure is the second photosensitive resin layer.
- the case where it forms with the form contained in the surface layer on the opposite side to 23 support films 21 is also contained.
- the light-shielding metal layer 2 having the routing circuit pattern 5 and the conductive layer 22 having the electrode pattern 25 can come into direct contact with each other. Therefore, even if the thickness of the second photosensitive resin layer 23 is not reduced, conduction between the routing circuit and the electrode can be ensured.
- the following configuration may be further added. That is, before the step of laminating the photosensitive conductive film 20, a roughening step of roughening an overlapping portion with the electrode pattern 25 on the exposed surface of the light shielding metal layer 2 of the routing circuit pattern 5 is provided. May be.
- the rough surface in the roughening step is preferably 1 nm to 50 nm in arithmetic average roughness (Ra) measured according to JIS B 0601: 2001.
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Abstract
Description
前記遮光性金属層上の前記第1感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第1感光性樹脂層を現像することによりレジストパターンを形成する工程と、
前記レジストパターンで被覆されていない部分の前記遮光性金属層を除去することにより引き回し回路パターンを形成するエッチング工程と、
前記引き回し回路パターンを覆う前記第1感光性樹脂層を少なくとも接続部で剥離除去する工程と、
前記基材フィルムの両面にラミネートされた前記感光性導電フィルムの前記第2感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第2感光性樹脂層を現像することにより、前記第2感光性樹脂層の除去される部分に積層された前記導電層も一緒に除去し、前記引き回し回路パターンと電気的に接続された電極パターンを形成する現像工程と、を備える、タッチセンサの形成方法を提供する。
前記遮光性金属層上の前記第1感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第1感光性樹脂層を現像することによりレジストパターンを形成する工程と、
前記レジストパターンで被覆されていない部分の前記遮光性金属層を除去することにより引き回し回路パターンを形成するエッチング工程と、
前記引き回し回路パターンを覆う前記第1感光性樹脂層を少なくとも接続部で剥離除去する工程と、
支持フィルムと、該支持フィルム上に設けられ第2感光性樹脂層と、該第2感光性樹脂層上に設けられた導電性繊維を含有する導電層とを備える感光性導電フィルムを、前記基材フィルムの前記引き回し回路パターンが形成された両面に前記導電層が密着するようにラミネートする工程と、
前記基材フィルムの両面にラミネートされた前記感光性導電フィルムの前記第2感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第2感光性樹脂層を現像することにより、前記第2感光性樹脂層の除去される部分に積層された前記導電層も一緒に除去し、前記引き回し回路パターンと電気的に接続された電極パターンを形成する現像工程と、を備える、タッチセンサの形成方法を提供する。
さらに、前記感光性導電フィルムをラミネートする工程の前に、前記引き回し回路パターンの前記遮光性金属層をPAS層を前記接続部を除いて被覆する工程を備える、第1~4態様のいずれかのタッチセンサの形成方法を提供する。
<タッチセンサ>
タッチセンサ30は、電子機器表示窓のカバーガラスの裏面に貼り合わせられた、静電容量方式のものである。具体的には、図1に示すように、透明な基材フィルム1と、基材フィルム1の両面に各々、中央部1aの電極パターン25を有するように形成された透明導電膜と、外枠部1bの引き回し回路パターン5を有するように形成された遮光性導電膜とを備えている。
第一実施形態に係る発明の引き回し回路の形成方法は、UVカット性能を有する基材フィルム1の両面に遮光性金属層2、該遮光性金属層2上に各々第1感光性樹脂層3を形成する工程(図3参照)と、前記遮光性金属層2上の前記第1感光性樹脂層3に、両面で異なるパターンマスク10,11を介して、UV光15を照射する露光工程(図4参照)と、露光した前記第1感光性樹脂層3を現像することによりレジストパターン4を形成する工程(図5参照)と、前記レジストパターン4で被覆されていない部分の前記遮光性金属層2を除去することにより引き回し回路パターン5を形成するエッチング工程(図6参照)と、前記引き回し回路パターン5を覆う前記第1感光性樹脂層3を全て剥離除去する工程(図7参照)と、前記引き回し回路パターン5の前記遮光性金属層2をPAS層6を前記接続部5aを除いて被覆する工程(図8参照)とを備える。
基材フィルム1としては、透明性、柔軟性、及び絶縁性等に優れた材料を用いて構成されていることが好ましい。このような要求を満足する材料としては、例えばポリエチレンテレフタレートやアクリル系樹脂等の汎用樹脂、ポリアセタール系樹脂やポリカーボネート系樹脂等の汎用エンジニアリング樹脂、ポリスルホン系樹脂やポリフェニレンサルファイド系樹脂等のスーパーエンジニアリング樹脂等からなる樹脂フィルムが例示される。基材フィルム1の厚みは、例えば、25μm~100μmとすることができる。なお、基材フィルム1は、フィルムガラス等を用いて構成されても良い。
露光工程での露光方法としては、パターンマスクを通してUV光15を画像状に照射する方法(マスク露光法)が挙げられる。UV光15の光源としては、公知の光源、例えば、カーボンアーク灯、水銀蒸気アーク灯、超高圧水銀灯、高圧水銀灯、キセノンランプ等の紫外線を有効に放射するものが用いられる。また、Arイオンレーザ、半導体レーザ等の紫外線を有効に放射するものも用いられる。また、レーザ露光法などを用いた直接描画法によりUV光15を画像状に照射する方法を採用してもよい。
現像工程では、ウェット現像により第1感光性樹脂層3の硬化部以外の部分が完全に除去される。これにより、所定のパターンを有するレジストパターン4が形成される。
エッチング工程では、塩化第二鉄などのエッチング液で遮光性金属層2を同時にエッチングし、レジストパターン4が形成されていない部分の遮光性金属層2を除去する。
本実施形態のレジスト剥離工程では、パターン化された遮光性金属層2上に残存する第1感光性樹脂層3をレジスト剥離液でもって全て剥離し、遮光性金属層2の表面全体を一旦、露出させる(図7参照)。
PAS(パッシベーション)層は、前記引き回し回路パターン5の接続部5a以外を被覆し、前記引き回し回路パターン5を保護する絶縁性の防錆層として機能している(図8参照)。PAS層6は、前記レジストパターン4と同様の材料、方法を用いることができる。
本実施形態に係る発明の電極パターン25の形成方法は、前記した引き回し回路パターン5の各形成工程の後、以下の工程を経て行われる。
すなわち、支持フィルム21と、該支持フィルム21上に設けられ導電性繊維を含有する導電層22と、該導電層22上に設けられた第2感光性樹脂層23とを備える感光性導電フィルム20を、前記基材フィルム1の前記引き回し回路パターン5が形成された両面に前記第2感光性樹脂層23が密着するようにラミネートする工程(図9参照)と、前記基材フィルム1の両面にラミネートされた前記感光性導電フィルム20の前記第2感光性樹脂層23に、両面で異なるパターンマスク12,13を介して、UV光15を照射する露光工程(図10工程)と、露光した前記第2感光性樹脂層23を現像することにより、前記第2感光性樹脂層23の除去される部分に積層された前記導電層22も一緒に除去し、前記引き回し回路パターン5と電気的に接続された電極パターン25を形成する現像工程(図11参照)と、を備える。これらの工程を経ることにより、基材フィルム1上にパターニングされた導電膜(電極パターン25)を備えるタッチセンサが得られる。
図9に示すラミネート工程は、例えば、感光性導電フィルム20を、加熱しながら感光性樹脂層側を基材フィルム1に圧着することにより積層する方法により行なわれる。なお、この作業は、密着性及び追従性の見地から減圧下で積層することが好ましい。
また、上記導電層22及び上記第2感光性樹脂層23の合計厚みは、3μm以下であることがより好ましい。厚みが3μmを超えると、電極パターン25の形成された箇所と形成されていない箇所との段差が大きくなるため、パターン見えが生ずる。
本実施形態の露光工程では、導電層22上の支持フィルム21がUV光15に対して透明である場合には、支持フィルム21を通してUV光15を照射することができ、支持フィルム21が遮光性である場合には、支持フィルム21を除去した後に第2感光性樹脂層23にUV光15を照射する。
本実施形態の現像工程では、第2感光性樹脂層23の硬化部以外の部分が除去される。具体的には、導電層22上に透明な支持フィルム21が存在している場合には、まず支持フィルム21を除去し、その後、ウェット現像により第2感光性樹脂層23の硬化部以外の部分を除去する。これにより、所定のパターンを有する樹脂硬化層上に導電性繊維を含有する導電層22が残り、電極パターン25が形成される(図11参照)。
<別の電極パターンの形成方法>
本実施形態は、第一実施形態に係るタッチセンサの製造方法と、電極パターン25の形成方法が一部異なる。
すなわち、本実施形態に係る発明の電極パターン25の形成方法は、支持フィルム21と、該支持フィルム21上に設けられ第2感光性樹脂層23と、該第2感光性樹脂層23上に設けられた導電性繊維を含有する導電層22とを備える感光性導電フィルム20を、前記基材フィルム1の前記引き回し回路パターン5が形成された両面に前記導電層22が密着するようにラミネートする工程(図12参照)と、前記基材フィルム1の両面にラミネートされた前記感光性導電フィルム20の前記第2感光性樹脂層23に、両面で異なるパターンマスク12,13を介して、UV光15を照射する露光工程(図13参照)と、 露光した前記第2感光性樹脂層23を現像することにより、前記第2感光性樹脂層23の除去される部分に積層された前記導電層22も一緒に除去し、前記引き回し回路パターン5と電気的に接続された電極パターン25を形成する現像工程(図14参照)と、を備える、これらの工程を経ることにより、基材フィルム上にパターニングされた導電膜(電極パターン25)を備えるタッチセンサが得られる。
第一実施形態及び第二実施形態において、さらに下記構成を追加してもよい。
すなわち、前記感光性導電フィルム20をラミネートする工程の前に、前記引き回し回路パターン5の前記遮光性金属層2の露出表面のうち、電極パターン25との重複部分を粗す粗化工程を備えていてもよい。
また、上記各実施形態の引き回し回路の形成方法においては、遮光性金属層2上に残存する第1感光性樹脂層3をレジスト剥離液でもって全て剥離し、その後に当該引き回し回路パターン5の接続部5a以外をPAS層6で被覆しているが、これに限定されない。例えば、遮光性金属層2上に残存する第1感光性樹脂層3を接続部5aのみ剥離してもよい。この場合、残存する第1感光性樹脂層3がPAS層6として機能する。
1a 中央部
1b 外枠部
2 遮光性金属層
3 第1感光性樹脂層
3a 硬化パターン
4 レジストパターン
5 引き回し回路パターン
5a 接続部
6 PAS層
10,11,12,13 パターンマスク
15 UV光
20 感光性導電フィルム
21 支持フィルム
22 導電性繊維を含有する導電層
23 第2感光性樹脂層
24 硬化パターン
25 電極パターン
30 タッチセンサ
Claims (7)
- UVカット性能を有する基材フィルムの両面に遮光性金属層、該遮光性金属層上に各々第1感光性樹脂層を形成する工程と、
前記遮光性金属層上の前記第1感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第1感光性樹脂層を現像することによりレジストパターンを形成する工程と、
前記レジストパターンで被覆されていない部分の前記遮光性金属層を除去することにより引き回し回路パターンを形成するエッチング工程と、
前記引き回し回路パターンを覆う前記第1感光性樹脂層を少なくとも接続部で剥離除去する工程と、
支持フィルムと、該支持フィルム上に設けられ導電性繊維を含有する導電層と、該導電層上に設けられた第2感光性樹脂層とを備える感光性導電フィルムを、前記基材フィルムの前記引き回し回路パターンが形成された両面に前記第2感光性樹脂層が密着するようにラミネートする工程と、
前記基材フィルムの両面にラミネートされた前記感光性導電フィルムの前記第2感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第2感光性樹脂層を現像することにより、前記第2感光性樹脂層の除去される部分に積層された前記導電層も一緒に除去し、前記引き回し回路パターンと電気的に接続された電極パターンを形成する現像工程と、
を備える、タッチセンサの形成方法。 - 前記第2感光性樹脂層の厚みが1μm~2μmである、請求項1記載のタッチセンサの形成方法。
- UVカット性能を有する基材フィルムの両面に遮光性金属層、該遮光性金属層上に各々第1感光性樹脂層を形成する工程と、
前記遮光性金属層上の前記第1感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第1感光性樹脂層を現像することによりレジストパターンを形成する工程と、
前記レジストパターンで被覆されていない部分の前記遮光性金属層を除去することにより引き回し回路パターンを形成するエッチング工程と、
前記引き回し回路パターンを覆う前記第1感光性樹脂層を少なくとも接続部で剥離除去する工程と、
支持フィルムと、該支持フィルム上に設けられ第2感光性樹脂層と、該第2感光性樹脂層上に設けられた導電性繊維を含有する導電層とを備える感光性導電フィルムを、前記基材フィルムの前記引き回し回路パターンが形成された両面に前記導電層が密着するようにラミネートする工程と、
前記基材フィルムの両面にラミネートされた前記感光性導電フィルムの前記第2感光性樹脂層に、両面で異なるパターンマスクを介して、UV光を照射する露光工程と、
露光した前記第2感光性樹脂層を現像することにより、前記第2感光性樹脂層の除去される部分に積層された前記導電層も一緒に除去し、前記引き回し回路パターンと電気的に接続された電極パターンを形成する現像工程と、
を備える、タッチセンサの形成方法。 - 前記第2感光性樹脂層及び前記導電層の合計厚みが1~3μmである、請求項1~3のいずれかに記載のタッチセンサの形成方法。
- 前記第1感光性樹脂層を剥離除去する工程が前記第1感光性樹脂層を全て除去するものであり、
さらに、前記感光性導電フィルムをラミネートする工程の前に、前記引き回し回路パターンの前記遮光性金属層をPAS層を前記接続部を除いて被覆する工程を備える、請求項1~4のいずれかに記載のタッチセンサの形成方法。 - さらに、前記感光性導電フィルムをラミネートする工程の前に、前記引き回し回路パターンの前記遮光性金属層の露出表面のうち、電極パターンとの重複部分を粗す粗化工程を備える、請求項1~5のいずれかに記載のタッチセンサの形成方法。
- 前記粗化工程における粗面がJIS B 0601:2001に準拠して測定する算術平均粗さ(Ra)で1nm~50nmである、請求項6記載のタッチセンサの形成方法。
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