WO2016189945A1 - ガラス基板の研削方法 - Google Patents

ガラス基板の研削方法 Download PDF

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Publication number
WO2016189945A1
WO2016189945A1 PCT/JP2016/059231 JP2016059231W WO2016189945A1 WO 2016189945 A1 WO2016189945 A1 WO 2016189945A1 JP 2016059231 W JP2016059231 W JP 2016059231W WO 2016189945 A1 WO2016189945 A1 WO 2016189945A1
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WO
WIPO (PCT)
Prior art keywords
glass substrate
grinding
outer peripheral
shaped glass
grinding tool
Prior art date
Application number
PCT/JP2016/059231
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English (en)
French (fr)
Japanese (ja)
Inventor
裕貴 片山
Original Assignee
日本電気硝子株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気硝子株式会社 filed Critical 日本電気硝子株式会社
Priority to CN201680011055.XA priority Critical patent/CN107249818B/zh
Publication of WO2016189945A1 publication Critical patent/WO2016189945A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C19/00—Surface treatment of glass, not in the form of fibres or filaments, by mechanical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to a method for grinding an outer peripheral end of a disk-shaped glass substrate by rotating a grinding tool.
  • a disk-shaped glass substrate is sometimes used as a support for supporting a semiconductor wafer in a back grinding process of the semiconductor wafer.
  • an orientation flat or a notch is formed at the outer peripheral end.
  • chamfering such as R chamfering and C chamfering on the formed orientation flat and notch.
  • a method of forming a notch at the outer peripheral edge of the semiconductor wafer with a grinding tool, and grinding the formed notch An example of a method for chamfering the notch is disclosed in Patent Document 1.
  • the notch is ground by rotating a grinding tool around an axis extending parallel to the main surface (front and back surfaces) of the semiconductor wafer.
  • An object of the present invention made in view of the above circumstances is to prevent the disk-shaped glass substrate from being damaged when the outer peripheral end of the disk-shaped glass substrate is ground by rotating a grinding tool.
  • the method according to the present invention which was devised to solve the above-mentioned problems, is a glass substrate grinding method for grinding an outer peripheral end of a disk-shaped glass substrate by rotating a grinding tool, wherein the grinding tool is It is characterized by rotating around an axis extending in the thickness direction of the glass substrate.
  • the outer peripheral edge of the disk-shaped glass substrate is rotated by the grinding tool. It is ground along a direction parallel to the surface (front and back surfaces). Therefore, it can prevent as much as possible that the force which acts on an outer peripheral edge part from a grinding tool acts on the thickness direction of a disk shaped glass substrate. Thereby, during the grinding of the outer peripheral end by the grinding tool, the occurrence of a situation in which the outer peripheral end swings along the thickness direction is avoided. As a result, it becomes possible to prevent the disk-shaped glass substrate from being damaged, such as cracking or chipping.
  • the disk-shaped glass substrate is rotated about the axis extending in the thickness direction at the center thereof, and the grinding tool is rotated around the disk-shaped glass substrate against the rotation direction of the disk-shaped glass substrate. It is preferable.
  • the grinding tool turns around the disk-shaped glass substrate against the direction of rotation of the disk-shaped glass substrate in the rotated state.
  • the direction and the traveling direction of the outer peripheral end are opposite to each other. Thereby, the time required for the grinding tool to grind the outer peripheral end can be shortened.
  • the grinding tool or the second grinding tool that rotates about the axis extending in the thickness direction of the disk-shaped glass substrate and is different from the grinding tool is used. Then, a positioning portion obtained by removing a part of the outer peripheral end portion for positioning the disc-shaped glass substrate may be formed at the outer peripheral end portion.
  • the positioning part is formed by removing a part of the outer peripheral edge of the disk-shaped glass substrate, the disk-shaped glass substrate is damaged when the positioning part is formed on the outer peripheral edge compared to when grinding the outer peripheral edge. It becomes easy.
  • the grinding tool or the second grinding tool is used for forming the positioning portion at the outer peripheral end, both of them rotate about the axis extending in the thickness direction of the disk-shaped glass substrate. Even when the positioning portion is formed, occurrence of a situation in which the outer peripheral end portion swings along the thickness direction is avoided. As a result, it is possible to form the positioning portion at the outer peripheral end without damaging the disk-shaped glass substrate.
  • the positioning portion is formed at the outer peripheral end after grinding the outer peripheral end, the positioning portion is formed after the rough shape of the disk-shaped glass substrate is determined by grinding the outer peripheral end. become. For this reason, when mass-producing the disk-shaped glass substrate which has a positioning part in an outer peripheral edge part, generation
  • the outer peripheral end portion of the disk-shaped glass substrate can be ground at high speed by using the grinding tool having a relatively large diameter.
  • the second grinding tool with a relatively small diameter is used to prevent the disk-shaped glass substrate from being damaged as much as possible. can do. Further, it is possible to form the positioning portion with high accuracy by using the second grinding tool having a relatively small diameter.
  • the positioning portion is a notch whose formation width gradually increases from the center side to the outer periphery side of the disk-shaped glass substrate, when the notch is formed, It is preferable to use a second grinding tool having a smaller diameter than a large one.
  • the notch is formed using the second grinding tool having a diameter smaller than the maximum width of the notch planned to be formed, the disc-shaped glass substrate is damaged as much as possible when the notch is formed. This can be prevented and the notch can be formed with high accuracy.
  • the smaller the diameter the higher the effect of preventing the disc-shaped glass substrate from being damaged during the formation of the positioning part and the effect of forming the positioning part with high accuracy.
  • a tool having a diameter of 2 mm or less is used as the second grinding tool, both of the above effects can be suitably expressed.
  • the outer peripheral end portion is chamfered along with the grinding of the outer peripheral end portion, and the chamfering process is performed on the positioning portion when forming the positioning portion. Therefore, it is preferable to use a tool in which the shape and size of the grinding groove formed on the outer peripheral portion of the second grinding tool are the same as the shape and size of the grinding groove formed on the outer peripheral portion of the grinding tool.
  • the chamfered portion between the portion excluding the positioning portion ground by the grinding tool and chamfered and the positioning portion ground by the second grinding tool and chamfered is processed.
  • the cross-sectional shape (the cross-sectional shape when the disk-shaped glass substrate is virtually cut in the thickness direction) is substantially the same. That is, it is possible to avoid a sudden change in the cross-sectional shape between the positioning portion and a portion connected to the positioning portion.
  • stress concentration tends to occur when some external force is applied to the disk-shaped glass substrate, and the risk of damage to the disk-shaped glass substrate increases.
  • the cross-sectional shape can be made substantially the same between the positioning portion and the portion connected to the positioning portion, it is possible to accurately eliminate the fear as described above.
  • the outer peripheral end of the disk-shaped glass substrate is ground along a direction parallel to the main surface of the disk-shaped glass substrate with a grinding tool, the front surface side and the back surface side of the disk-shaped glass substrate are It is possible to chamfer both at the same time. Thereby, the time which a chamfering process requires can be reduced significantly.
  • the grinding tool and the second grinding tool share the rotation axis.
  • the positioning part since the positioning part is formed in a state where the disk-shaped glass substrate is stationary, the positioning part can be formed with higher accuracy.
  • the strength of the outer peripheral end is reduced as compared with the case where the positioning portion is not formed.
  • the outer peripheral end is subjected to an etching process after the positioning portion is formed, defects such as microcracks included in the outer peripheral end can be removed. As a result, the strength of the outer peripheral end portion of the disk-shaped glass substrate can be improved.
  • a scribe line is formed on the outer peripheral end portion by rolling of the scribe wheel or laser irradiation, and the orientation flat is cut along the scribe line. May be formed.
  • the orientation flat is formed at the outer peripheral end, so that after the outline shape of the disk-shaped glass substrate is determined by grinding of the outer peripheral end, the orientation flat is Will be formed. For this reason, when mass-producing a disk-shaped glass substrate having an orientation flat at the outer peripheral end, it is possible to prevent the occurrence of a situation in which the shape of the disk-shaped glass substrates varies between each other. be able to.
  • the disk-shaped glass substrate when the outer peripheral end of the disk-shaped glass substrate is ground by rotating a grinding tool, the disk-shaped glass substrate can be prevented from being damaged.
  • a chamfering process for grinding the outer peripheral end 2a of the disk-shaped glass substrate 2 and chamfering it is performed using the grinding tool 1. (FIGS. 1 to 3).
  • a second grinding tool 3 different from the grinding tool 1 a notch forming step for forming the chamfered notch 4 on the outer peripheral end 2 a of the disk-shaped glass substrate 2 is performed ( FIG. 5).
  • an etching process is performed on the outer peripheral end 2a of the disk-shaped glass substrate 2 to execute a processing step for improving the strength of the outer peripheral end 2a.
  • the grinding tool 1 and the second grinding tool 3 are rotated about axes 5 and 6 extending in the thickness direction of the disk-shaped glass substrate 2 (hereinafter simply referred to as the thickness direction), respectively.
  • the disk-shaped glass substrate 2 to be ground in the present embodiment is a glass substrate that serves as a support for supporting the semiconductor wafer in the back grinding process of the semiconductor wafer.
  • the disc-shaped glass substrate 2 is placed in a flat position on a table 8 that can be rotated (spinned) in the A direction about an axis 7 extending along the thickness direction. It is placed.
  • the disc-shaped glass substrate 2 is placed on the table 8 so that the position of the center 2b of the disc-shaped glass substrate 2 coincides with the position of the axis 7 in plan view.
  • the table 8 has a support portion 8a for supporting the disk-shaped glass substrate 2 from below, and the support portion 8a is formed in a circle having a smaller diameter than the disk-shaped glass substrate 2 in plan view. Thereby, the outer peripheral end 2a of the disc-shaped glass substrate 2 placed on the table 8 is in a state of protruding from the outer peripheral end of the support portion 8a.
  • the support portion 8a is formed with a large number of holes 8aa, and each of the large number of holes 8aa is connected to negative pressure generating means (for example, a vacuum pump or the like) (not shown). Thereby, the support part 8a can adsorb
  • the grinding tool 1 rotates (spins) in the B direction around the axis 5 as the center of rotation, and turns around the disk-shaped glass substrate 2 in the C direction against the rotation direction (A direction) of the disk-shaped glass substrate 2. Is possible.
  • the grinding tool 1 rotates (spins) in a direction to grind the outer peripheral end 2a of the disk-shaped glass substrate 2 by a down cut method.
  • the grinding tool 1 may be rotated (rotated) in the direction of grinding the outer peripheral end 2a of the disk-shaped glass substrate 2 by an up-cut method.
  • the outer peripheral portion 1a of the grinding tool 1 has a large number of abrasives fixed by an adhesive (for example, a metal bond). It is composed of grains.
  • grinding grooves 9 for grinding the outer peripheral end portion 2a of the disc-shaped glass substrate 2 are formed in a plurality of upper and lower stages.
  • Each grinding groove 9 includes a bottom portion 9a for grinding the outer peripheral end surface 2aa of the disc-shaped glass substrate, and a pair of side walls for grinding the upper surface 2c and the lower surface 2d of the disc-shaped glass substrate 2 respectively. Part 9b.
  • Each grinding groove 9 is formed such that the groove width gradually increases as the grinding tool 9 moves to the outer peripheral side of the grinding tool 1.
  • Both the bottom 9a and the side wall 9b are smoothly connected by a curved surface curved with a constant curvature.
  • both the side wall portion 9b and the outer peripheral end surface 1aa of the grinding tool 1 are smoothly connected by a curved surface curved with a constant curvature.
  • the outer peripheral end 2a is formed in a cross-sectional shape corresponding to 9, and the chamfering process is completed.
  • an outer periphery is carried out from the center 2b side of the disk shaped glass substrate 2.
  • a notch 4 whose formation width gradually increases toward the side is formed in the outer peripheral end 2a. The notch 4 is formed by removing a part of the outer peripheral end 2a of the disc-shaped glass substrate 2 and, when the disc-shaped glass substrate 2 is viewed in plan, a positioning portion for determining the orientation and positioning the disc-shaped glass substrate 2 It is.
  • a tool having a diameter D2 smaller than the maximum width W of the notch 4 scheduled to be formed is used as the second grinding tool 3.
  • the diameter D2 of the second grinding tool 3 is smaller than the diameter D1 of the grinding tool 1 used in the chamfering process, and a tool having a diameter D2 of 2 mm or less is used.
  • a tool having a diameter D2 of 1.5 mm or less is used as the second grinding tool 3.
  • the outer peripheral portion 3a of the second grinding tool 3 is composed of a large number of abrasive grains fixed by an adhesive (for example, metal bond) in the same manner as the grinding tool 1 used in the chamfering process. Furthermore, the outer peripheral part 3a is formed with a plurality of upper and lower grinding grooves for forming a notch 4 in which the outer peripheral end part 2a of the disk-shaped glass substrate 2 is ground and chamfered. The shape and dimensions of the grinding grooves are the same as the grinding grooves 9 formed on the outer peripheral portion 1 a of the grinding tool 1.
  • the notch 4 having a shape following the track S is formed by grinding the outer peripheral end 2a of the disc-shaped glass substrate 2 while the second grinding tool 3 moves along the track S.
  • the notch 4 is chamfered to complete the notch formation process.
  • the entire periphery of the outer peripheral end 2a of the disc-shaped glass substrate 2 is etched. This etching process is performed, for example, by spraying hydrogen fluoride (HF) onto the outer peripheral end 2a.
  • HF hydrogen fluoride
  • the disc-shaped glass substrate 2 is rotated.
  • the outer peripheral edge 2a is ground along a direction parallel to the main surface (upper surface 2c, lower surface 2d) of the disk-shaped glass substrate 2 by the grinding tool 1 or the second grinding tool 3. Therefore, it is possible to prevent as much as possible that the force acting from the grinding tool 1 or the second grinding tool 3 to the outer peripheral end 2 a acts in the thickness direction of the disk-shaped glass substrate 2.
  • the grinding method of the glass substrate according to the present invention is not limited to the aspect described in the above embodiment.
  • the grinding tool is used for the chamfering process and the second grinding tool different from the grinding tool is used for the notch forming process.
  • the chamfering process and the notch forming process are performed.
  • the same grinding tool may be used for execution.
  • the outer peripheral edge of the disk shaped glass substrate 2 as a positioning part it is good also as an aspect which forms the orientation flat 10 in the part 2a.
  • the notch forming process is performed after the chamfering process for chamfering by grinding the outer peripheral edge of the disk-shaped glass substrate, but this is not restrictive.
  • a scribe line is formed on the outer peripheral edge of the disk-shaped glass substrate by rolling of the scribe wheel or laser irradiation, and the orientation flat is formed by cleaving along the scribe line. May be formed.
  • the said grinding tool and the 2nd grinding tool may be used, and grinding tools other than these may be used.
  • the grinding tool and the second grinding tool may share the rotation axis. That is, both grinding tools may be attached to the same rotating shaft, for example, in a state of being separated from each other in the axial direction.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Surface Treatment Of Glass (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
PCT/JP2016/059231 2015-05-22 2016-03-23 ガラス基板の研削方法 WO2016189945A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201680011055.XA CN107249818B (zh) 2015-05-22 2016-03-23 玻璃基板的磨削方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015-104640 2015-05-22
JP2015104640A JP6583663B2 (ja) 2015-05-22 2015-05-22 ガラス基板の研削方法

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CN (1) CN107249818B (zh)
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WO (1) WO2016189945A1 (zh)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017154933A (ja) * 2016-03-02 2017-09-07 日本電気硝子株式会社 板ガラスおよびその製造方法
WO2017149876A1 (ja) * 2016-03-04 2017-09-08 日本電気硝子株式会社 板ガラス及びその製造方法並びにエッチング処理装置
JP2019204940A (ja) * 2018-05-25 2019-11-28 力成科技股▲分▼有限公司 フルエッジトリミングを用いたウェハ処理方法

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CN110281101B (zh) * 2019-07-23 2021-10-29 西安奕斯伟材料科技有限公司 一种边缘研磨装置及方法
TW202134490A (zh) * 2020-03-13 2021-09-16 鴻創應用科技有限公司 氮化鋁晶圓片之製造方法及其氮化鋁晶圓片
CN111941197B (zh) * 2020-08-25 2022-01-28 广西益顺盈智能科技集团有限公司 一种手机液晶屏垂直磨边面吸附装置及其使用方法

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Publication number Priority date Publication date Assignee Title
JP2017154933A (ja) * 2016-03-02 2017-09-07 日本電気硝子株式会社 板ガラスおよびその製造方法
WO2017149877A1 (ja) * 2016-03-02 2017-09-08 日本電気硝子株式会社 板ガラスおよびその製造方法
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WO2017149876A1 (ja) * 2016-03-04 2017-09-08 日本電気硝子株式会社 板ガラス及びその製造方法並びにエッチング処理装置
JP2019204940A (ja) * 2018-05-25 2019-11-28 力成科技股▲分▼有限公司 フルエッジトリミングを用いたウェハ処理方法

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CN107249818A (zh) 2017-10-13
TW201703926A (zh) 2017-02-01
JP6583663B2 (ja) 2019-10-02
JP2016215339A (ja) 2016-12-22
CN107249818B (zh) 2020-06-16

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