WO2016175056A1 - 物品の製造装置及び製造方法 - Google Patents

物品の製造装置及び製造方法 Download PDF

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Publication number
WO2016175056A1
WO2016175056A1 PCT/JP2016/062134 JP2016062134W WO2016175056A1 WO 2016175056 A1 WO2016175056 A1 WO 2016175056A1 JP 2016062134 W JP2016062134 W JP 2016062134W WO 2016175056 A1 WO2016175056 A1 WO 2016175056A1
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WO
WIPO (PCT)
Prior art keywords
information
article
replaceable
mold
replaceable member
Prior art date
Application number
PCT/JP2016/062134
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
真 松尾
高橋　和宏
史明 田頭
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to CN201680023962.6A priority Critical patent/CN107530913B/zh
Priority to KR1020177026357A priority patent/KR20170141194A/ko
Publication of WO2016175056A1 publication Critical patent/WO2016175056A1/ja

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B29C33/306—Exchangeable mould parts, e.g. cassette moulds, mould inserts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D37/00—Tools as parts of machines covered by this subclass
    • B21D37/04—Movable or exchangeable mountings for tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/30—Mounting, exchanging or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/36—Moulds having means for locating or centering cores
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B30—PRESSES
    • B30B—PRESSES IN GENERAL
    • B30B15/00—Details of, or accessories for, presses; Auxiliary measures in connection with pressing
    • B30B15/02—Dies; Inserts therefor; Mounting thereof; Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds

Definitions

  • the present invention prevents the misplacement or the like of a replaceable member that is exchanged in a manufacturing apparatus according to the article to be manufactured, thereby maintaining the quality of the article and preventing the manufacturing apparatus from being adversely affected.
  • the present invention relates to an article manufacturing apparatus and a manufacturing method.
  • a barcode tag corresponding to an identification number assigned to a die attached to the press machine main body is attached to a barcode management panel provided in the machine setup unit.
  • the barcode tag corresponding to the identification number of the mounting mold is read by the barcode reader.
  • the unique mold information read by the barcode reader and the set mold information when the mold set is used for processing are stored, and the necessary mold set is based on the set mold information during processing.
  • a mold management method for calling and exchanging molds has been proposed (see paragraphs [0006], [0009], [0027] and FIG. 5 of Patent Document 1).
  • a resin sealing device for electronic parts which is a kind of resin molding device, covers a chip-like element such as a semiconductor chip mounted on a substrate (lead frame, printed circuit board, etc.) with a sealing resin.
  • a sealed substrate that is a molded product is completed.
  • the mold for resin sealing in the resin sealing apparatus is replaced when the model (type) of the sealed substrate is changed, when the mold is worn, or the like. Therefore, a shaping
  • molding die is a replaceable member exchanged according to the kind of articles
  • the quality is guaranteed and the characteristics match. If a product different from the correct mold (compatible product) is mounted, the quality of the molded product may be impaired. In addition, there is a possibility that problems such as adversely affecting the main body of the resin sealing device may occur.
  • the problem to be solved by the present invention is that there is a possibility that a case where a replaceable member used for manufacturing an article in an article manufacturing apparatus is not compatible with a replaceable member to be originally used may occur. .
  • an article manufacturing apparatus includes at least one exchangeable member that is exchanged according to the type of article that is included in the article manufacturing apparatus and is manufactured from the material.
  • a sign provided on the member, a pattern formed on the sign, a reading unit that optically reads the pattern, and a decoding unit that obtains first information including information that identifies the replaceable member based on the read pattern
  • a control unit that controls the operation of the manufacturing apparatus based on the second information stored in advance including at least information specifying the replaceable member, and comparing the first information and the second information
  • Is commutative based on the result of discrimination Material is if incompatible with respect to the second information, characterized in that the interchangeable part member with respect to the second information to control the manufacturing apparatus as shown is a manufacturing apparatus that does not fit.
  • the second information may be used for at least one of determination regarding whether or not the replaceable member is a compatible product and determination regarding whether or not the replaceable member is a maintenance-required product.
  • control unit may control the manufacturing apparatus so that the manufacturing apparatus does not operate when the replaceable member does not match the second information based on the determination result.
  • control unit may control the manufacturing apparatus so that the manufacturing apparatus operates in accordance with the received signal after controlling the manufacturing apparatus so that the manufacturing apparatus does not operate.
  • the replaceable member includes a single replaceable member or a plurality of replaceable members, a marker is provided at a predetermined position in each of the single replaceable member or the plurality of replaceable members, and the reading unit is A light receiving unit, a light guide unit, and an image acquisition unit may be provided, and at least the light receiving unit may be provided corresponding to each predetermined position.
  • the replaceable member includes a single replaceable member or a plurality of replaceable members, a marker is provided at a predetermined position in each of the single replaceable member or the plurality of replaceable members, and the reading unit is A light receiving unit, a light guiding unit, and an image acquisition unit, and at least the light receiving unit is moved so that the light receiving unit is commonly used for each of the single replaceable member or the plurality of replaceable members. Good.
  • At least the light receiving unit is provided in a transport mechanism having at least one of a function of supplying a material to the replaceable member or a function of unloading an article from the replaceable member. You may move to a predetermined position with a conveyance mechanism.
  • the image acquisition unit may be provided at a position away from the single replaceable member or the plurality of replaceable members, and the light receiving unit and the image acquisition unit may be optically connected by the light guide unit.
  • the replaceable member may include a single mold or a plurality of molds.
  • the replaceable member has at least a first mold and a second mold opposite to the first mold, and relatively moves at least the first mold and the second mold. And a drive mechanism.
  • the manufacturing apparatus described above includes a replaceable member module provided with at least a replaceable member and a receiving module for receiving material, and the replaceable member module can be attached to and detached from the receiving module. May be attachable to and detachable from other replaceable member modules.
  • the pattern formed on the sign may include a pattern formed by electroforming.
  • the manufacturing apparatus described above may include a marker made of another member on which a pattern is formed, and the other member may be fixed to the replaceable member.
  • an article manufacturing method for manufacturing an article from a material by using a manufacturing apparatus, the article being included in the manufacturing apparatus and manufactured.
  • the step of comparing the first information and the second information and performing the determination Made to work If the interchangeable member does not conform to the second information based on the step of controlling the apparatus and the determination result, the manufacturing apparatus indicates that the interchangeable member does not conform to the second information. And a step of controlling the manufacturing apparatus.
  • the second information is included in at least one of determination regarding whether or not the replaceable member is a conformable product, or determination regarding whether or not the replaceable member is a maintenance-required product. Can be used.
  • a step of controlling the manufacturing apparatus so that the manufacturing apparatus does not operate may be provided.
  • the manufacturing apparatus may be controlled so that the manufacturing apparatus operates according to the received signal after the manufacturing apparatus is controlled so that the manufacturing apparatus does not operate.
  • the reading unit includes a step of preparing a light receiving unit, a light guide unit, and an image acquisition unit
  • the replaceable member includes a single replaceable member or a plurality of replaceable members, and the single replaceable member
  • a marker is provided at a predetermined position on each of the plurality of replaceable members, and in the step of optically reading the pattern, a light receiving portion provided on each of the replaceable member or the plurality of replaceable members is used. Then, the first information may be read.
  • the reading unit includes a step of preparing a light receiving unit, a light guide unit, and an image acquisition unit
  • the replaceable member is a single replaceable member or a plurality of replaceable members, and the single replaceable member
  • a mark is provided at a predetermined position in each of the plurality of replaceable members, and in the step of optically reading the pattern, a light receiving portion provided in common to the single replaceable member or the plurality of replaceable members is provided. It may be used to read the first information.
  • the step of preparing the light receiving unit, the light guide unit, and the image acquisition unit is the same as the step of preparing the image acquisition unit at a position away from the single replaceable member or the plurality of replaceable members.
  • a transport mechanism having at least one of a function of supplying a material to a member or a function of unloading an article from a replaceable member
  • a step of preparing a light receiving unit, and a light receiving unit and an image acquiring unit are optically
  • a step of preparing a light guide unit connected to the optical sensor, and in the step of optically reading the pattern, the light receiving unit may be moved to a predetermined position by moving the transport mechanism.
  • the step of preparing the light receiving unit, the light guide unit, and the image acquiring unit includes the step of preparing the image acquiring unit at a position apart from the single replaceable member or the plurality of replaceable members, and the light receiving unit. And a step of preparing a light guide unit that optically connects the image acquisition unit.
  • a step of preparing a single mold or a plurality of molds included in the replaceable member may be provided.
  • the method comprises a step of preparing at least a replaceable member module provided with a replaceable member and a receiving module for receiving material, and the replaceable member module can be attached to and detached from the receiving module.
  • the replaceable member module may be attachable to and detachable from other replaceable member modules.
  • a marker including a pattern formed by electroforming may be prepared.
  • a sign made of another member fixed to the replaceable member may be prepared.
  • a sign is provided on a replaceable member to be mounted on an article manufacturing apparatus.
  • a pattern representing first information including information specifying the replaceable member is formed on the sign.
  • the reading unit reads the pattern, and the decoding unit obtains the first information based on the read pattern.
  • the determination unit compares the first information with the second information stored in advance including information specifying the replaceable member, and performs determination.
  • the control unit controls the manufacturing apparatus so that the manufacturing apparatus operates when the replaceable member matches the second information based on the determination result.
  • the control unit causes the manufacture apparatus to indicate that the replaceable member does not conform to the second information. To control. Therefore, generation
  • FIG. 1A is a schematic side view of the molding module shown in FIG. 1A.
  • FIG. 1A is a side view which expands and shows the principal part of a shaping
  • FIG. 1A is a side view which expands and shows the principal part of a shaping
  • FIG. 1A is a side view which expands and shows the principal part of a shaping
  • Example 1 A first embodiment of the article manufacturing apparatus and method according to the present invention will be described with reference to FIGS. 1A, 1B, 2A, and 2B.
  • a resin sealing device for electronic parts will be described as an example of an article manufacturing apparatus. 2. Description of the Related Art
  • a resin sealing device for electronic components performs a process of covering a chip-like element such as a semiconductor chip mounted on a substrate (such as a lead frame or a printed board) with a sealing resin.
  • a sealing resin corresponding to a molded product is completed by molding a sealing resin on a substrate (mounted substrate) on which chip-shaped elements are mounted using a mold.
  • the sealed substrate itself may correspond to an article (finished product).
  • Each piece obtained by dividing (cutting) the sealed substrate may correspond to an article (finished product).
  • the sealed substrate is a semi-finished product.
  • the word “product” includes semi-finished products.
  • the resin sealing device 1 for electronic components includes one or a plurality of molding modules M.
  • a plurality of molding modules M When a plurality of molding modules M are provided, they can be arranged along the X direction and connected to each other. As will be described later, the plurality of molding modules M can be attached to each other and can be separated afterwards.
  • the molding module M includes a fixed platen 2 fixed to the main body, and a movable platen 3 provided so as to be opposed to the fixed platen 2 so as to be opposed to the fixed platen 2.
  • the resin sealing device 1 includes a fixed mold (upper mold) 4 that is detachably mounted on the fixed platen 2 (so that it can be replaced), and a movable mold (lower mold) that is detachably mounted on the movable platen 3. Mold) 5 at least.
  • the fixed mold 4 and the movable mold 5 together constitute a mold (resin-sealed mold) 6.
  • the mold 6 is a member that is replaced according to the product to be manufactured (hereinafter, referred to as “replaceable member” as appropriate).
  • the resin sealing device 1 is a control unit for controlling the operation of the drive mechanism 7 including a reciprocating drive mechanism (mold opening / closing mechanism) 7a and a resin pressurizing mechanism 7b of the movable platen 3 in the resin sealing device 1, for example. 8 is provided.
  • a sign 9 is attached to a predetermined position in the mold 6.
  • a fine pattern indicating first information including at least information for specifying the mold 6 is formed by unevenness or the like.
  • the fine pattern is constituted by, for example, a barcode, a two-dimensional code, or the like.
  • the information for specifying the mold 6 includes information on the manufacturer, supplier, and service provider of the mold 6, the model number and serial number of the mold 6, and a molded product molded by the mold 6 (sealing Included product information indicating that the model (type) of the finished substrate) and the mold 6 are compliant.
  • the term “compatible product” means that the mold 6 is to be originally used, and specifically has at least the following two meanings.
  • the term “conforming product” secondly means that the mold 6 is a mold provided by a legitimate manufacturer or supplier.
  • the information forming surface 9 a of the marker 9 attached to the molding die 6 is formed at a position corresponding to a predetermined position in the molding die 6.
  • An information reading means (information reading unit) 10 for reading a fine pattern is provided.
  • the control unit 8 includes a decoding unit DE that obtains first information based on a fine pattern formed on the information forming surface 9a read by the information reading unit 10, and a molding die 6.
  • a storage unit ME in which information to be specified (second information) is stored in advance is provided.
  • the control unit 8 compares the obtained first information with previously stored second information to determine whether or not the mold 6 is compatible with the second information. Is provided.
  • the control unit 8 controls the operation of the resin sealing device 1 including the operation of the drive mechanism 7 based on the determination result.
  • the movable mold 5 constituting the mold 6 includes a pot 5 a to which a resin material is supplied, a cavity 5 b on the movable mold 5 side (hereinafter referred to as “movable side”), and a movable mold 5.
  • a movable resin passage 5c connected to the side cavity 5b and an air vent 5v are provided.
  • the fixed mold 4 is provided with a resin passage 4a on the fixed mold 4 side (hereinafter referred to as “fixed side”) and a fixed-side cavity 4b.
  • the movable mold 5 and the fixed mold 4 are clamped by a mold opening / closing mechanism 7a.
  • the mold surface (upper surface in FIG. 1A) of the movable mold 5 and the mold surface of the fixed mold 4 (lower surface in FIG. 1A) that are opposed to each other are in close contact.
  • the pot 5a of the movable mold 5 communicates with the fixed resin passage (cull portion) 4a
  • the fixed resin passage 4a communicates with the movable resin passage 5c.
  • the pot 5a of the movable mold 5 communicates with the movable side cavity 4b and the fixed side cavity 5b through the resin passage 4a and the resin passage 5c sequentially.
  • fluid resin such as molten resin is filled in the cavity 4b on the movable side and the cavity 5b on the fixed side.
  • the gas remaining inside the cavity 4b and the cavity 5b is discharged out of the mold 6 through the air vent 5v as the fluid resin is filled.
  • the information reading means 10 is respectively arranged on the main body 1 of the resin sealing device corresponding to the position where the marker 9 is mounted on each of the fixed mold 4 and the movable mold 5. Therefore, each information reading means 10 can read a fine pattern from the information forming surface 9a of each marker 9 attached to the fixed mold 4 and the movable mold 5 mounted on the fixed plate 2 and the movable plate 3, respectively. .
  • the light representing the image of the information forming surface 9a enters the image sensor Ld via the light guide (light guide) La, the convex lens (collection lens) Lb, and the light guide Lc. .
  • the image sensor Ld is, for example, a CCD sensor or a CMOS sensor.
  • the image sensor Ld converts light corresponding to the image on the information forming surface 9a into an electrical signal.
  • Image data including an electrical signal representing an image of the information forming surface 9a is sent to the control unit 8 (see FIGS. 1A and 1B) via the cable Le.
  • a digital camera having an image sensor may be disposed as the information reading means 10. This digital camera preferably has heat resistance.
  • the molding die 6 composed of the fixed die 4 and the movable die 5 constitutes a set of die units. Therefore, you may fix the label
  • the information reading means 10 is arranged on one side of the fixed mold 4 or the movable mold 5 in the resin sealing device 1 so as to correspond to the side of the mold 6 to which the marker 9 is attached. Just keep it. In the following description, the case where the marker 9 is affixed to the stationary mold 4 is targeted.
  • the thickness of the marker 9 that is adhered to and integrated with the surface of the molding die 6 (at least one of the fixed die 4 and the movable die 5).
  • a recess 4d for labeling is provided so as to be deeper. Therefore, as will be described later, by sticking the sign 9 to the inner bottom surface of the recess 4d and integrating it, the information forming surface 9a of the sign 9 comes into contact with other components and the like, so that the information forming surface 9a Problems such as deformation or damage can be prevented.
  • the control unit 8 controlling the resin sealing device 1 when the first information is the conforming product information.
  • the control unit 8 obtains information on whether or not the molding die 6 to be identified is a conforming product, Displayed in the resin sealing device 1. Specifically, if the mold 6 is a conforming product, that effect is displayed on the display panel. In addition, it is preferable to shift to a state in which the molding module M including the molding die 6 becomes operable.
  • the molding module M may be shifted to a state where the molding module M becomes inoperable (for example, a state where the power is ON but an operation start signal is not received, a state where the power is turned off, etc.).
  • each of the fixed mold 4 and the movable mold 5 is a so-called divided mold (not shown) configured by dividing into a plurality of bodies, for example, the most important part of the cavity block that can be replaced is marked. 9 is pasted. In this case, it is possible to prevent erroneous mounting on the cavity block which is the most important component in resin molding and which is a replaceable member, mounting of a nonconforming product, and the like.
  • FIG. 3 illustrates a laser-type so-called non-contact type code reading sensor as the information reading means 10.
  • the information reading means 10 reflects the laser beam 10b emitted from the laser diode 10a by reciprocating a repetitive vibration mirror (scanning mirror) 10c.
  • the information forming surface 9a formed on the marker 9 is scanned with the laser beam 10b reflected by the repetitive vibration mirror 10c.
  • the reflected light 10d reflected by the information forming surface 9a from the laser light 10b is received by the photodiode 10e.
  • the fine pattern formed on the information forming surface 9a is optically read.
  • a high-precision fine pattern is formed on the information forming surface 9a side (front surface side) of the sign 9 by electroforming (electrocasting).
  • a release paper 9c is attached to the back side of the sign 9 via an adhesive 9b.
  • the back surface side of the label 9 is adhered to the inner bottom surface of the label application recess 4d (5d) on the label application surface of the mold 6 through the adhesive 9b. (See FIG. 3).
  • the mark 9 is formed into a thin sheet by electroforming.
  • the label 9 has the following two purposes. The first purpose is to avoid discriminating (incorrect recognition) that a nonconforming product is a conforming product.
  • the second purpose is to remove the marker 9 from the marker attaching surface (the inner bottom surface of the marker attaching recesses 4d and 5d) in the molding die 6 (fixed die 4 and movable die 5). Attaching to non-conforming products, etc., so that they cannot be reused. Therefore, the thickness of the marker 9 is set to a thickness that satisfies both of the following two conditions (in other words, a necessary and sufficient thickness).
  • the thickness is such that at least the information forming surface 9a is damaged when the label 9 attached to the label attaching surface 4d (5d) is peeled off.
  • the thickness of the label 9 (electroformed product) having the above two conditions for example, when electroforming is surface transfer, a thickness of 0.05 to 0.1 ⁇ m is possible. With this thickness, a fine pattern representing information can be manufactured with high accuracy. Even when the sign 9 having the information forming surface 9a including a three-dimensional shape (three-dimensional shape) is manufactured, it is possible to manufacture an electroformed product having a thickness satisfying the above two conditions by a normal electroforming process. It is.
  • FIGS. 4A to 4D a description will be given of the case where the sign 9 is manufactured.
  • 4A and 4B show an electroforming process
  • FIGS. 4C and 4D simply show a process of integrating release paper on the back surface of the label 9 with an adhesive.
  • a constant voltage is applied from the outside between the metal (nickel anode) 22 and the matrix (cathode) 23 in the electrolytic bath 21 in the electroforming tank 20. .
  • metal ionization occurs at the anode and electrodeposition due to metal reduction occurs in the matrix 23.
  • the electrodeposition shown in FIGS. 4A-4D is done with nickel.
  • An electroformed product 24 made of electrodeposited nickel is used as the main body of the marker 9.
  • the mother die 23 is preferably manufactured by precision machining such as elliptical vibration cutting.
  • the electroformed product 24 electrodeposited on the mother die 23 is peeled off from the mother die 23.
  • a fine pattern is formed on the electroformed product 24 by reversing the high-precision shape or the like formed on the mother die 23.
  • the fine pattern having a highly accurate shape formed in the electroformed product 24 is used as a fine pattern representing information for specifying the mold 6 on the information forming surface 9 a of the marker 9.
  • the adhesive 9b with the release paper 9c attached is attached to the back surface of the electroformed product 24 (on the surface opposite to the information forming surface 9a). In this way, the label 9 with the adhesive 9b is manufactured.
  • the release paper 9c is peeled off from the sign 9.
  • the back surface of the label 9 is attached to the inner bottom surface of the label attaching recess 4d (5d) on the label attaching surface of the mold 6 through the adhesive 9b.
  • the inner bottom surface of the recess 4d (5d) of the mold 6 and the marker 9 can be integrated.
  • the pressure-sensitive adhesive 9b and the release paper 9c are formed in a state where the label 9 is attached to the label-attaching recess 4d (5d) on the label-attachment surface of the molding die 6 with the release paper 9c removed. Used to attach to the bottom and integrate.
  • a double-sided adhesive tape is used in advance. You may affix on the inner bottom face of the recess 4d (5d).
  • the sign 9 on which the fine pattern representing the conforming product information is formed is, first of all, to indicate that the mold 6 is a mold that conforms to the product to be manufactured and has a guaranteed quality. ,means.
  • the label 9 on which the fine pattern representing the conforming product information is formed is such that the molding die 6 is, for example, an authorized producer of the resin sealing device, an authorized mold manufacturer, or an authorized resin sealing device. It means that it is a mold provided by a service provider (hereinafter referred to as a “conforming product provider”) related to regular molds.
  • the information forming surface 9a on which the fine pattern representing the information specifying the type is formed can be distinguished from a non-conforming product that is not attached with a sign or a sign by a person other than the conforming product provider. Thus, it is formed with high accuracy.
  • a barcode or a two-dimensional code is formed on the information forming surface 9a.
  • the information forming surface 9a is difficult to imitate characters, character strings, symbols, shapes, three-dimensional shapes, combinations thereof, or imitations arbitrarily determined by the conforming product provider.
  • a fine pattern made of a special image, hologram, or other highly accurate mark may be formed. Based on the fine pattern formed on the information forming surface 9a, information specifying the mold 6 is read.
  • the fine pattern formed on the information forming surface 9a is preferably a pattern that is difficult to imitate.
  • the fine pattern formed on the information forming surface 9a is a fine pattern for displaying a conforming product provider, and a mark such as a symbol having a function of displaying the origin of goods or services, a trademark (including a registered trademark), a logo May include type (logologtype).
  • step S ⁇ b> 1 in FIG. 5 in a state where the power of the resin sealing device 1 is turned on, the fixed mold 4 is mounted on the fixed platen 2, and the movable mold 5 is mounted on the movable platen 3. Installing. Mounting of the fixed mold 4 and the movable mold 5 in this step may be temporary placement (temporary fixing) as long as the fine pattern formed on the information forming surface 9a of the marker 9 can be read.
  • step S2 the information reading means 10 is used to form a fine pattern formed on the information forming surface 9a of the sign 9 attached to each of the fixed mold 4 and the movable mold 5 that are mounted. Read.
  • control unit 8 obtains first information from the fine pattern formed on the information forming surface 9a.
  • the fine pattern is a two-dimensional code
  • the two-dimensional code is decoded.
  • step S4 the control unit 8 reads out second information (information stored in advance) including information for specifying the mold 6.
  • the second information is stored in advance in the storage unit ME included in the control unit 8 of the resin sealing device 1.
  • the determination unit J in the control unit 8 includes the first information obtained from the fine pattern formed on the information forming surface 9a of the sign 9 and the second information stored in advance. The information specifying the mold 6 included in the information is compared. Based on the comparison result, the discriminating unit J determines whether “the fixed mold 4 is a“ conforming product ”or not and“ the movable mold 5 is a “conforming product”. Determine.
  • step S5 the determination unit J determines that the fixed signal indicating that the fixed die 4 is “compatible” and “the movable die 5 is“ compatible ”. Is generated.
  • the control unit 8 displays the “fixed mold 4 on the display unit (touch panel or the like; not shown) of the control unit 8 of the resin sealing device 1 based on the received matching signal. “It is a“ conforming product ”” and “the movable mold 5 is“ a conforming product ”” are displayed.
  • the control unit 8 may turn on the warning lamp in a mode (for example, a mode in which green light is continuously turned on) indicating that the resin sealing device 1 is operable.
  • the control unit 8 may indicate that the resin sealing device 1 is in an operable state by a sound such as “operable”.
  • step S8 the control unit 8 shifts the resin sealing device 1 to a state where it can operate (operation state) based on the received conformance signal.
  • the control unit 8 continues to maintain the resin sealing device 1 in an operable state.
  • Steps S7 and S8 may be switched in order or may be executed simultaneously.
  • step S5 the determination unit J generates a non-conformance signal indicating that the movable mold 5 is not a “conforming product”.
  • step S ⁇ b> 10 based on the received nonconformity signal, the control unit 8 displays “the movable mold 5 is“ conforming product ”on the display unit (not shown) of the control unit 8 of the resin sealing device 1. "Not” is displayed.
  • the control unit 8 may turn on the warning lamp in a mode (for example, a mode in which yellow or red light is intermittently turned on) indicating that the resin sealing device 1 cannot operate. .
  • the control unit 8 may indicate that the resin sealing device 1 is in an inoperable state by a sound such as a warning sound or “inoperable”.
  • step S11 the control unit 8 shifts the resin sealing device 1 to a state where it cannot operate (non-operating state) based on the received nonconforming signal.
  • Step S10 and step S11 may be switched in order or may be executed simultaneously. Even when the fixed mold 4 is not a “compatible product” and when both the fixed mold 4 and the movable mold 5 are not “compatible products”, the same process as in the second case described above is performed.
  • nonconforming type When at least one of the fixed mold 4 and the movable mold 5 is a type that is not a “conforming product” (hereinafter referred to as “nonconforming type”), the operator will be referred to as a “conforming product” (hereinafter referred to as “conforming type”). .) Is searched from the mold inventory. The operator replaces the nonconforming type with the found compatible type. The operator operates the control unit 8 of the resin sealing device 1 according to the flowchart shown in FIG. 5 in a state where the adaptive mold is temporarily placed on the resin sealing device 1. In this case, since the compatible mold is temporarily placed in the resin sealing device 1, the resin sealing device 1 shifts to the operating state by performing the processing of steps S1 to S5 to S8.
  • the information for specifying the mold 6 is included in at least the first information.
  • the information for specifying the mold 6 includes information on the manufacturer, supplier, and service provider of the mold 6, the model number and serial number of the mold 6, and the mold 6.
  • compatible product information indicating that the mold 6 is a compatible product is included.
  • information specifying the mold 6 includes the date of manufacture, the date of start of use, the date of use, the lot number of the manufactured article (sealed substrate), and the number of times of use. History information indicating a history such as (the number of shots) may be included.
  • the history information may include information indicating the history and the history of the cleaning, inspection, maintenance (maintenance) and replacement (hereinafter referred to as “inspection, maintenance, etc.”) of the mold 6.
  • the history information may include information indicating a history of defects and improvements in the past with respect to the mold 6. Accordingly, the user (user) or the conforming product provider of the resin sealing device 1 or the mold 6 creates a database of such information (information indicating a history of defects, improvements, etc.). Such information is used to improve the operating rate of the resin sealing device 1 or the mold 6.
  • the discriminating unit J determines that it is time to inspect and maintain the movable mold 5 based on the history information.
  • the determination unit J generates a maintenance required signal indicating that “the movable mold 5 is a“ required maintenance product ”that requires inspection, maintenance, and the like”.
  • the control unit 8 displays that “the movable mold 5 is a maintenance-required product” and shifts the resin sealing device 1 to an inoperable state (non-operating state). Therefore, the user (user), the operator, and the like of the resin sealing device 1 can know that it is time to perform inspection, maintenance, etc. for the movable mold 5.
  • the molding die 6 including the movable die 5 continues to be used after a time when inspection, maintenance, etc. are necessary due to carelessness.
  • the term “maintenance required” described above means that the mold is not a mold that should be used originally from the viewpoint of whether inspection, maintenance, or the like is necessary.
  • the information for specifying the mold 6 includes at least conforming product information, and may include history information as necessary.
  • the information for specifying the mold 6 may include any one of conforming product information and history information as necessary.
  • the mold 6 Even if the mold 6 is not a conforming product, there may be no problem in using the mold 6.
  • the information indicating the conforming product includes the mold 6 manufactured in a specific factory owned by the mold manufacturer.
  • the mold 6 can be used.
  • a signal input by the operator from the outside of the resin sealing device 1 is used.
  • the determination in the control unit 8 may be changed. Specifically, according to the signal input by the operator, it is only necessary to shift from the determination of “not a conforming product” to the determination of “a conforming product”.
  • a laser type code reading sensor is exemplified as the information reading means 10.
  • the information reading means 10 is not limited to such means.
  • image data obtained by photographing the information forming surface 9a of the marker 9 may be sent to the control unit 8 by using an image sensor such as a CCD element (Charge Coupled Device) which is an image reading sensor.
  • the sent image data may be compared with specific image data (reference data) stored in advance to determine whether or not it is a conforming product.
  • a CMOS sensor can also be used as the image reading sensor.
  • the information reading means 10 only needs to be capable of reading the fine pattern formed on the information forming surface 9a of the sign 9 with high accuracy and accuracy.
  • the first information read from the mark 9 fixed to the molding die 6 and the first information stored in advance are used to determine whether or not the molding die 6 that is a replaceable member is a compatible product.
  • Two pieces of information are used.
  • the first information includes information for specifying the mold 6, and the second information includes at least information for specifying the mold 6.
  • the information specifying the mold 6 includes at least one of conforming product information and history information, and preferably includes both of them. By these things, it can be discriminate
  • the sign 9 is manufactured by electroforming, a fine pattern can be formed on the information forming surface 9a of the sign 9 with high accuracy.
  • the label 9 has heat resistance.
  • the quality of the molded product is deteriorated, and the resin sealing device 1 is adversely affected, deteriorated in durability, and has other adverse effects. You can prevent problems.
  • the marker 9 is formed into a thin sheet, the marker 9 is broken when the marker 9 is peeled off from the mold. Due to this, the label 9 cannot be peeled off and reattached to another mold in the original state. Therefore, for example, it is possible to prevent unauthorized use of the sign 9 by a person other than the conforming product provider, supply of a molding die that is incompatible product, and the like.
  • the second information is stored in advance in a storage device provided outside the resin sealing device 1. Examples of the storage device provided outside are the following two.
  • the first storage device is a storage device included in a server or the like for a user (user) of the resin sealing device 1 to manage the semiconductor manufacturing process.
  • the second storage device is a storage device included in a server or the like for a conforming product provider related to the resin sealing device 1 or the mold 6 to manage its own products, services, and the like.
  • first, second information is read from a storage device included in a server or the like for a user of the resin sealing device 1 or the mold 6 to manage the entire semiconductor manufacturing process. . Accordingly, the user and the operator of the resin sealing device 1 or the mold 6 can know whether or not the mold 6 is a compatible product. In addition, the user and the operator of the resin sealing device 1 or the mold 6 can know whether it is time to perform inspection, maintenance, etc. for the mold 6. “Inspection, maintenance, etc.” includes cleaning of the mold 6 (including physical or chemical cleaning using a brush, laser light, plasma, etc. in addition to cleaning).
  • the second information is read out from a storage device included in a server or the like for a conforming product provider related to the resin sealing device 1 or the mold 6 to manage its products, services, and the like.
  • the conformity product provider regarding the resin sealing device 1 or the mold 6 can know whether or not the time for inspection, maintenance, etc. for the mold 6 has come.
  • the conforming product provider alerts the user of the resin sealing device 1 or the mold 6 that the time for inspection, maintenance, etc. has come.
  • the compatible product provider may inform the user that he / she is ready to dispatch a service engineer of the compatible product provider or to supply a replacement member for replacement as necessary.
  • the server of the conformity product provider confirms that the time for inspection, maintenance, etc.
  • Example 3 Based on FIG. 6, Example 3 of the manufacturing apparatus and manufacturing method of the articles
  • a resin sealing device 1 which is a manufacturing apparatus, a resin sealing device 1 employing a compression molding method in which one cavity CAV is provided in the lower mold 5 will be described as an example.
  • the present embodiment shows a preferable example of the information reading means 10 when a replaceable member used at a high temperature is targeted.
  • the resin sealing device 1 is provided with a ball screw 30 and a ball nut 31.
  • a main transport mechanism 32 is attached to the ball nut 31.
  • An X-direction guide rail 33 extending along the X direction is provided so that the main transport mechanism 32 can move along the X direction.
  • the main transport mechanism 32 is provided with a Y-direction guide rail 34 extending along the ⁇ Y direction.
  • a sub-transport mechanism 35 is provided so that it can move along the Y-direction guide rail 34.
  • the sub transport mechanism 35 holds a mounted substrate (not shown) having a semiconductor chip mounted on the substrate on the upper side and supplies it to the lower surface of the fixed mold 4.
  • the mounted substrate On the lower surface of the fixed mold 4, the mounted substrate is temporarily fixed by a method such as suction or clamping.
  • the sub-conveying mechanism 35 holds a resin material (not shown) such as a solid resin such as a sheet or powder and a liquid resin having fluidity at room temperature in a container or the like provided on the lower side.
  • the sub transport mechanism 35 supplies the held resin material into the cavity CAV provided in the movable mold 5.
  • a light receiving unit 36 included in the information reading unit 10 is provided on the lower surface or the side surface.
  • the light receiving unit 36 is provided with a convex lens 37 and a reflecting mirror 38 each made of heat-resistant glass.
  • an annular illumination 39 is provided on the side where the convex lens 37 is provided (light incident side).
  • An image acquisition unit 41 having an image sensor 40 such as a CCD sensor or a CMOS sensor is attached to the main transport mechanism 32 located away from the mold 6.
  • Image data composed of electrical signals obtained by the image sensor 40 is sent to a camera controller 43 included in the control unit 8 via a cable 42, for example.
  • an electronic camera having the image sensor 40 may be attached to the main transport mechanism 32.
  • the resin sealing device 1 has a plurality of molding modules M arranged along the X direction, one main transport mechanism 32 including one sub transport mechanism 35 is common to the plurality of molding modules M. Used.
  • a cavity block 44 in which a cavity CAV is formed is attached to the movable mold (lower mold) 5.
  • the cavity block 44 is a replaceable member that is exchanged according to a product to be manufactured (in this embodiment, a sealed substrate).
  • a marker 9 having an information forming surface 9a is fixed to the cavity block 44 by, for example, sticking, screwing or the like.
  • the light representing the image of the fine pattern formed on the information forming surface 9a enters the convex lens 37 through the light guide 45 consisting of space and is condensed.
  • the collected light is reflected by the reflecting mirror 38.
  • the light reflected by the reflecting mirror 38 enters the image sensor 40 via the light guide unit 46 made up of space, and is converted into image data made up of electrical signals.
  • the converted image data is sent to the camera controller 43 included in the control unit 8 (see FIGS. 1A and 1B) via the cable.
  • at least the light receiving unit 36 having the convex lens 37 and the reflecting mirror 38, the light guiding unit 46, and the image acquiring unit 41 having the image sensor 40 are the information shown in FIGS. 2A and 2B. It has a function corresponding to the reading means 10.
  • At least the light receiving unit 36, the light guide unit 46, and the image acquisition unit 41 are included in the information reading unit 10.
  • the following effects can be obtained.
  • This effect is obtained by automatically reading information identifying the mold 6 from the information forming surface 9a of the mark 9 fixed to the mold 6 and automatically determining whether the mold 6 is a conforming product. It is obtained by the configuration of discriminating automatically.
  • This effect is based on a configuration in which it is automatically determined from the information forming surface 9a of the mark 9 fixed to the mold 6 whether or not it is time to perform maintenance and inspection for the mold 6. can get.
  • the convex lens 37 and the reflecting mirror 38 which are optical elements involved in the acquisition of image data, are made of heat resistant glass.
  • the image sensor 40 is disposed at a position away from the mold 6 that becomes high temperature, and the light guide portions 45 and 46 from the information forming surface 9a to the image sensor 40 through the convex lens 37 and the reflecting mirror 38 in order are space. Consists of. With these configurations, deterioration of the information reading unit 10 including the light receiving unit 36 including the convex lens 37 and the reflecting mirror 38, the light guide unit 46 including a space, and the image acquisition unit 41 including the image sensor 40 is prevented. .
  • an increase in the manufacturing cost of the resin sealing device 1 can be suppressed.
  • This effect is obtained by the following configuration.
  • the information reading means 10 a configuration is adopted in which a convex lens 37 and a reflecting mirror 38 each made of heat-resistant glass are provided in the sub-transport mechanism 35.
  • the image acquisition unit 41 including the image sensor 40 is attached to the main transport mechanism 32 is employed. Therefore, since it is not necessary to newly provide a means for moving the information reading means 10, an increase in the manufacturing cost of the resin sealing device 1 can be suppressed.
  • a set of information reading means 10 can be shared. By this, the increase in the manufacturing cost of the resin sealing apparatus 1 can be suppressed more effectively.
  • FIG. 6 shows an example in which the light guide unit 46 from the light receiving unit 36 to the image acquisition unit 41 is configured by a space.
  • a configuration including an optical fiber that guides the light that enters the convex lens 37 and is condensed by the convex lens 37 may be adopted as the light guide unit 46. It is preferable to dispose an optical fiber inside a protective tube having heat resistance. In this case, the optical fiber corresponds to the light guide unit. According to this configuration, the place where the image acquisition unit 41 is arranged can be freely selected by appropriately routing the optical fiber.
  • FIG. 6 illustrates an example in which the image acquisition unit 41 including the image sensor 40 is attached to the main transport mechanism 32.
  • the image acquisition unit 41 is not limited thereto, and a configuration in which a digital camera including an image sensor is attached to the main transport mechanism 32 may be employed.
  • the digital camera may be attached to the main transport mechanism 32 or may be attached to the sub transport mechanism 35.
  • the digital camera is preferably provided with a cooling mechanism.
  • Example 4 Based on FIG. 6 and FIG. 7, Example 4 of the manufacturing apparatus and manufacturing method of the articles
  • the resin sealing device 1 includes one material receiving module A, four molding modules M (see FIGS. 1A and 1B), and one dispensing module B.
  • the resin sealing device 1 includes a power supply 50 that supplies electric power and a control unit 8 (see FIGS. 1A and 1B) that controls each component for the entire resin sealing device 1.
  • the material receiving module A and the leftmost molding module M in FIG. 7 can be attached to each other and separated from each other.
  • Adjacent molding modules M can be attached to each other and separated from each other.
  • the rightmost molding module M and dispensing module B in FIG. 7 can be attached to each other and separated from each other.
  • Positioning when mounting the above-described components is performed by known means such as positioning holes and positioning pins.
  • the mounting is performed by well-known means including screwing using a bolt and a nut.
  • the material receiving module A includes a substrate material receiving unit 51, a resin material receiving unit 52, and a material transfer mechanism 53.
  • the substrate material receiving unit 51 receives the mounted substrate 54 from the outside of the resin sealing device 1.
  • the resin material receiving unit 52 receives a resin material R made of a powdered solid resin from the outside of the resin sealing device 1.
  • the resin sealing device 1 is provided with an X-direction guide rail 33 along the X direction from the material receiving module A through the four molding modules M to the dispensing module B.
  • the X-direction guide rail 33 is provided so that the main transport mechanism 32 can move along the X direction.
  • the main transport mechanism 32 is provided with a Y-direction guide rail 34 along the Y direction.
  • the Y-direction guide rail 34 is provided with a sub-transport mechanism 35 included in the main transport mechanism 32 so as to be movable along the Y direction.
  • the sub transport mechanism 35 accommodates the mounted substrate 54 in the upper part and accommodates the resin material R in the lower part.
  • the sub transport mechanism 35 reciprocates between a standby position in contact with the X-direction guide rail 33 in one molding module M and the upper portion of the cavity CAV in the lower mold 5.
  • the sub transport mechanism 35 supplies the mounted substrate 54 to the lower surface of the upper mold 4 and supplies the resin material R to the cavity CAV of the lower mold 5.
  • the transport mechanism including the main transport mechanism 32 and the sub transport mechanism 35 is formed by resin-sealing a mounted substrate 54 and a semiconductor chip (not shown) mounted on the mounted substrate 54. Both the sealed substrate 55, which is a molded product, is transported. According to this configuration, since the transport mechanism including the main transport mechanism 32 and the sub transport mechanism 35 serves as both the carry-in mechanism and the carry-out mechanism, the configuration of the resin sealing device 1 is simplified.
  • the dispensing module B includes a molded product transfer mechanism 56 that transports the sealed substrate 55 and a magazine 57 that houses the sealed substrate 55.
  • the dispensing module B has a vacuum pump 58.
  • the vacuum pump 58 is a decompression source for decompressing the space including the cavity CAV.
  • the vacuum pump 58 may be used as a reduced pressure source for adsorbing the mounted substrate 54, the sealed substrate 55, and the like for the entire resin sealing device 1.
  • the vacuum pump 58 may be provided in the material receiving module A or in each molding module M.
  • adjacent molding modules M among the four molding modules M can be attached to each other and separated from each other.
  • the number of molding modules M can be increased as demand increases, and the number of molding modules M can be decreased as demand decreases.
  • the resin sealing device 1 of the factory Fb located in an area where the demand is not increasing is used for production of the specific product.
  • the molding module M to be used is separated (the molding module M is removed).
  • the separated molding module M is transported to the factory Fa, and the transported molding module M is added to the resin sealing device 1 of the factory Fa. This makes it possible to meet the increased demand in the area where the factory Fa is located. Therefore, according to the present embodiment, the resin sealing device 1 that can flexibly cope with an increase or decrease in demand is realized.
  • the material receiving module A and the dispensing module B are integrated, and one integrated receiving / dispensing module is connected to one end of the resin sealing device 1 (the left end or the right end in FIG. 7). ).
  • one molding module M is exposed at the other end (the right end or the left end in FIG. 7) of the resin sealing device 1, it is easy to mount and separate the molding modules M.
  • the material receiving module A and one molding module M are integrated, and one integrated receiving / molding module is connected to one end of the resin sealing device 1 (in FIG. 7). (Left end or right end) In this case, one molding module M is mounted on the receiving / molding module, or a plurality of molding modules M are sequentially mounted.
  • the resin sealing device 1 is configured by mounting the dispensing module B on the molding module M located at the other end (right end or left end in FIG. 7).
  • the main transport mechanism 32 and the sub transport mechanism 35 are combined into a transport mechanism, and a transport mechanism is provided separately from the transport mechanism.
  • the carry-in mechanism and the carry-out mechanism operate independently, the efficiency of the molding operation in the resin sealing device 1 is improved.
  • the resin sealing device 1 may be configured so that adjacent molding modules M can be attached to each other and separated from each other.
  • the present invention can be applied to the resin sealing device 1 configured as described above.
  • a metal material such as tool steel is used as the mold material.
  • the present invention is not limited to this, and an optimum material corresponding to the application of the mold, the material of the molded product, etc., such as a ceramic material and a glass material, is used.
  • a composite material in which a ceramic material is formed on the surface of a metal material, a ceramic material, a glass material, or the like can be used as a mold material.
  • the types of molds include not only molds for resin sealing but also molds for plastic (resin molds) used when molding general plastic products.
  • the resin molding method includes a method of using at least two molds facing each other. These methods are, for example, injection molding, compression molding, transfer molding, blow molding, and the like.
  • the resin molding method includes a method using a single mold. These methods are, for example, vacuum forming (molding in which a softened thermoplastic plate, a thermoplastic sheet or the like is adsorbed on the surface of one mold).
  • the types of mold include a press mold, a cast mold, a die cast mold, a forging mold, an extrusion mold, and the like.
  • the mold other than the resin mold includes a pair of opposed molds such as a press mold, in other words, a mold composed of a set of molds.
  • the mold other than the resin mold includes, for example, a single mold such as an extrusion mold used for extrusion processing of aluminum or the like. In this case, one mold corresponds to one set of molds.
  • jigs and tools used in the manufacturing apparatus are included in the replaceable member.
  • a cutting table (stage) provided in a cutting device (dicer) used in a semiconductor manufacturing process is a fixing jig to which an object to be cut is fixed. Is mentioned.
  • stage which is a fixing jig to which a workpiece (including a workpiece to be cut; the same shall apply hereinafter) provided in various processing apparatuses is fixed.
  • a fixing jig (clamper, fixture, etc.) provided on a machine tool used in machining, to which a workpiece is fixed.
  • a high-pressure gas such as compressed air
  • the degree to which the information forming surface 9a is affected by cutting oil, chips and the like is reduced.
  • information (first information) specifying the fixing jig is stably read.
  • the tool includes a cutting blade, a rotary blade, a polishing sheet, and the like.
  • the barcode tag itself may be deteriorated due to adhesion of cutting water, cutting fluid, generated chips and the like that are sprayed when the workpiece is processed. is there. There is a possibility that the reliability of the RFID tag may be lowered due to the influence of cutting water or the like.
  • high-pressure gas such as compressed air
  • the extent to which the information forming surface 9a is affected by cutting water, chips and the like is reduced. Can do. As a result, information (first information) specifying the replaceable member is stably read.
  • Articles manufactured by the article manufacturing apparatus include finished products manufactured by resin molding, pressing, machining, and the like.
  • the manufactured articles include semi-finished products such as the sealed substrates in the above-described embodiments.
  • the first processing is machining.
  • the machining includes blasting, water jet machining, and the like in addition to cutting (including vibration cutting).
  • the second processing is laser processing.
  • the type of laser is not particularly limited. An optimum laser corresponding to the material to be processed (material constituting the mark 9) is used.
  • the third process is an etching process.
  • the etching process includes both wet etching and dry etching.
  • the fourth process is a process of attaching a film to the surface of the marker.
  • the process for attaching the film includes screen printing, inkjet printing, painting, and the like.
  • a material having characteristics such as high hardness, chemical resistance and heat resistance as the material constituting the film.
  • the film is hardly removed from the surface of the label. Therefore, information can be stably obtained from the sign 9 of the replaceable member over a long period of time.
  • the fifth processing is processing using a so-called 3D printer such as a layered modeling method represented by an optical modeling method or a cutting modeling method.
  • a so-called 3D printer such as a layered modeling method represented by an optical modeling method or a cutting modeling method.
  • a sheet-like, thin-plate-like marker 9 formed using the above-described processing is stuck on the surface of the mold.
  • the marker 9 may be fixed to the surface of the mold by mechanical means such as screwing. You may form a fine pattern directly on the surface of a replaceable member using the process mentioned above.
  • the replaceable member itself having the mark 9 may be manufactured using the processing described above.
  • the various processes described above may be used to manufacture a component included in the replaceable member and having the label 9 (for example, a cavity block or a gate piece in a resin mold).
  • the fine pattern existing codes such as barcodes and matrix type two-dimensional codes can be used. You may use the fine pattern which the manufacturer of the manufacturing apparatus, the user, etc. determined suitably. For example, 1 byte (8 bits) of information is represented by 8 consecutive unevennesses by associating the unevenness of the fine pattern with “0” and “1” (or “1” and “0”), respectively. Can do. Information can be expressed by the Morse code by making the irregularities of the fine pattern correspond to the long point and short point (or the short point and long point) of the Morse code, respectively. The Morse code itself may be formed on the replaceable member.
  • the number of points (dots) constituting one bar in the barcode or the number of points (dots) constituting one component in the two-dimensional code is set to an appropriate number of concave or convex. And the number of the concaves or convexes may be meaningful.
  • a pattern itself processed by micromachining in addition to the irregularities processed by micromachining, a pattern itself processed by micromachining, an image itself, or the like may be used.
  • various information can be given meanings corresponding to a plurality of types of patterns and images, and the corresponding information can be read by recognizing those patterns and images.
  • the pattern itself, the image itself, and the like processed by microfabrication are used to specify the manufacturer, seller, provider of services related to the replaceable member, etc. (hereinafter referred to as “source for replaceable member”).
  • source for replaceable member a pattern having a function of displaying the origin of the replaceable member.
  • patterns, images, characters, etc. which are fine patterns, signs having a function of displaying the origin of the replaceable member, for example, trade names such as company names and trademarks (including registered trademarks) may be used.
  • the fine pattern may include a sign having a function of displaying the origin of the replaceable member.
  • information for specifying the replaceable member is obtained as the first information from the sign of the replaceable member.
  • History of commodities manufactured based on history information (second information) of exchangeable members obtained from the first information in other words, history information of exchangeable members obtained based on the first information.
  • second information history information of exchangeable members obtained from the first information
  • information can be tracked.
  • Information (article history information; third information) relating to the history of an article manufactured using the replaceable member is, for example, obtained by the user of the resin sealing device 1 or the molding die 6 as a whole semiconductor manufacturing process.
  • a storage unit ME included in the control unit 8 of the resin sealing device 1, and the like.
  • a user of a manufacturing apparatus or a replaceable member history information obtained from a sign included in the replaceable member (exchangeable member history information; second information)
  • article history information third information indicating the traceability of an article manufactured using a replaceable member.
  • 1 resin sealing device (manufacturing device), 2 fixed plate, 3 movable plate, 4 fixed type (exchangeable member), 4a, 5c resin passage, 4b, 5b cavity, 4d, 5d recess, 5 movable type (possible Replacement member), 5a pot, 5v air vent, 6 molding die (exchangeable member), 7 drive mechanism, 7a reciprocating drive mechanism (mold opening / closing mechanism), 7b resin pressurizing mechanism, 8 control unit, 9 mark (separate member), 9a Information forming surface, 9b adhesive, 9c release paper, 10 information reading means (information reading unit), 10a laser diode, 10b laser light, 10c repetitive vibration mirror, 10d reflected light, 10e photodiode, 20 electroforming processing tank, 21 Electrolytic bath, 22 metals, 23 master mold, 24 electroformed product (marker, separate member), 30 ball screw, 31 ball nut, 32 main transport mechanism (transport mechanism) 33, X-direction guide rail, 34 Y-direction guide rail, 35 Sub-transport mechanism (transport

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PCT/JP2016/062134 2015-04-29 2016-04-15 物品の製造装置及び製造方法 WO2016175056A1 (ja)

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CN114055728A (zh) * 2021-11-09 2022-02-18 东莞市巨成模具有限公司 一种塑胶模具抽芯装置

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