WO2016163166A1 - 基板収納容器 - Google Patents
基板収納容器 Download PDFInfo
- Publication number
- WO2016163166A1 WO2016163166A1 PCT/JP2016/054974 JP2016054974W WO2016163166A1 WO 2016163166 A1 WO2016163166 A1 WO 2016163166A1 JP 2016054974 W JP2016054974 W JP 2016054974W WO 2016163166 A1 WO2016163166 A1 WO 2016163166A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- resin
- holding
- mass
- polybutylene terephthalate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/14—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H10P72/145—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterised by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
- H10P72/1912—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like characterised by shock absorbing elements, e.g. retainers or cushions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/18—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] characterised by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1906—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing masks, reticles or pellicles
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1914—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by locking systems
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1918—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
- H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
- H10P72/1921—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by substrate supports
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
Definitions
- the present invention relates to a substrate storage container for storing substrates such as semiconductor wafers, photomask glass, and aluminum disks.
- the substrate storage container is mainly composed of a front open type container main body for aligning and storing a plurality of substrates, and a lid body that can be opened and closed to open and close the front of the container main body. Substrates stored in the substrate storage container are supported one by one by a holding portion formed in the container.
- the container body and the lid body are made of a polycarbonate resin or a polypropylene resin that is excellent in both rigidity and visibility from the outside to the inside of the container and has a high degree of cleaning.
- the substrate may rotate in the container due to vibration or impact applied to the substrate storage container.
- wear powder may be generated due to friction between the substrate and the groove of the holding portion, and the contamination risk of the substrate increases.
- the holding part provided in the known substrate storage container is made of a material having a smaller frictional resistance than that of the container main body and the lid and having a good sliding property.
- a highly wear-resistant polycarbonate resin or a polybutylene terephthalate resin to which a sliding material is added is used (for example, see Patent Document 1).
- it has also been proposed to coat a polybutylene terephthalate resin on the surface of a holding portion made of polycarbonate resin see, for example, Patent Document 2.
- the substrate inside the container body slides up the groove of the holding part.
- the lid is removed from the opening of the container body, the substrate slides down the groove of the holding portion. That is, the substrate moves up and down in the groove of the holding portion by opening and closing the lid.
- the holding part itself or the surface of the holding part is made of polybutylene terephthalate resin, the substrate can move up and down more smoothly in the groove of the holding part.
- the present invention has been made in view of the above-described problems, and maintains a smooth vertical movement of the substrate in the groove of the holding portion in the substrate storage container, and reduces the rubbing trace with the holding portion in the vicinity of the substrate end surface. It aims to be realized.
- a substrate storage container includes a container main body that opens at least one of the substrates, and a lid that can be freely opened and closed in the opening of the container main body.
- the container body has a first holding portion with a first holding groove for holding the rear portion of the substrate, and the front portion of the substrate is held inside the lid.
- the second holding portion with the second holding groove is provided, and at least the first holding groove in the first holding portion is made of an alloy resin mainly composed of polycarbonate resin and polybutylene terephthalate resin.
- the substrate storage container according to another embodiment of the present invention may further include a polybutylene terephthalate resin in an alloy resin that is greater than 20% by mass and less than 80% by mass with respect to the mass of the resin component.
- the substrate storage container according to another embodiment of the present invention may further include a polybutylene terephthalate resin in an alloy resin that is 25% by mass or more and 40% by mass or less based on the mass of the resin component.
- At least the second holding groove in the second holding portion may be further made of alloy resin.
- the container body includes support portions having shelves for supporting the substrates at regular intervals on the inner surfaces of the left and right sides of the substrate as viewed from the opening. Equipped with a first holding part on the back side as viewed from the opening in the support part, and on the inner side of the first holding part, provided with an inclined surface that can be supported by lifting the end on the back side of the substrate from the top surface of the shelf, Even when the lid is attached to the opening of the container body, the substrate in the container body is sandwiched between the first holding groove and the second holding groove and lifted from the shelf and held. good.
- the support portion may be a separate body from the container body, and may be detachably attached from the container body.
- the present invention it is possible to reduce the rubbing trace with the holding portion in the vicinity of the substrate end surface while maintaining smooth vertical movement of the substrate in the groove of the holding portion in the substrate storage container.
- FIG. 1 shows an exploded perspective view of a substrate storage container according to an embodiment of the present invention.
- FIG. 2 is a main perspective view showing a state in which the substrate storage container of FIG. 1 is assembled.
- FIG. 3 is a cross-sectional view of the substrate storage container of FIG. 2 cut in the vertical direction (cross section taken along line AA).
- FIG. 4 is a cross-sectional view of the substrate storage container of FIG. 2 cut in the horizontal direction (cross section taken along line BB).
- FIG. 5 shows a rear perspective view of the lid of FIG.
- FIG. 6 is a plan view (6A) of the state in which the substrate is held by the teeth and the retainer when the substrate is stored in the substrate storage container of FIG.
- FIG. 7 shows a cross-sectional view of the substrate storage container according to the second embodiment of the present invention, the same view as FIG. 8 shows a cross-sectional view of the substrate storage container of FIG.
- FIG. 1 shows an exploded perspective view of a substrate storage container according to the first embodiment of the present invention.
- FIG. 2 is a main perspective view showing a state in which the substrate storage container of FIG. 1 is assembled.
- FIG. 3 is a cross-sectional view of the substrate storage container of FIG. 2 cut in the vertical direction (cross section taken along line AA).
- FIG. 4 is a cross-sectional view of the substrate storage container of FIG. 2 cut in the horizontal direction (cross section taken along line BB).
- FIG. 5 shows a rear perspective view of the lid of FIG.
- a substrate storage container 1 includes a container main body 2 having at least one opening for storing a substrate W, a lid 3 that can be freely opened and closed in an opening 5 of the container main body 2, and Is provided.
- the container body 2 and the lid 3 are made of polycarbonate resin.
- the container body 2 and the lid 3 may be made of a resin other than the polycarbonate resin, for example, a polypropylene resin.
- the opening 5 is formed to protrude from the left side wall, the right side wall, the upper surface wall, and the lower surface wall, and has a form in which the lid 3 can be accommodated on the inner peripheral edge thereof.
- the opening 5 is provided with a pair of locking recesses 6 for locking the lid 3 on the upper and lower edges facing each other at the inner peripheral edge thereof.
- the container body 2 includes conveying parts such as a robotic flange 7, a manual handle 8, and a side rail 9 for conveying the substrate storage container 1 on its outer wall.
- the container body 2 includes a bottom plate 10 on the bottom surface. The bottom plate 10 is used for positioning and sensing of the substrate storage container 1.
- the container body 2 includes support portions 11 each having a plurality of shelves for supporting the substrates W at regular intervals on the inner surfaces of the left and right sides of the substrate W as viewed from the opening 5.
- Each support portion 11 formed in a shelf shape has a step 11 a on the opening 5 side for restricting movement of the substrate W in the opening direction.
- the support part 11 formed in the inside of the container main body 2 has teeth 12 as a first holding part for restricting the movement of the substrate W to the back side on the back side opposite to the opening 5.
- the teeth 12 have a first holding groove 12a that holds a rear portion of the substrate W.
- the first holding groove 12a is preferably formed from two inclined surfaces in a substantially V-shaped or U-shaped longitudinal section. The position of the substrate W supported on the support portion 11 is regulated by the lower inclined surface of the first holding groove 12a.
- the lid 3 includes a retainer 4 that holds the substrate W on the surface (back surface) facing the container body 2.
- the retainer 4 is a component that can contact the periphery of the substrate W located on the opening 5 side.
- the lid 3 includes a gasket 13 for forming a seal on the side wall or the back surface thereof.
- the lid body 3 includes a pair of locking mechanisms 14 therein.
- the locking mechanism 14 is pivotally fixed to the lid 3 and can be rotated from the outside, a latch bar 14b that performs a linear motion in the vertical direction in conjunction therewith, and a locking claw 14c at the tip of the latch bar 14b.
- the lid 3 can be fixed to the container body 2 by the latching claw 14 c protruding from the through hole 15 in the side wall of the lid 3 and being latched by the latch recess 6 of the container body 2.
- the retainer 4 includes a substantially rectangular frame body 23 and a plurality of pairs of elastic pieces 24 protruding inward from the frame body 23.
- Each elastic piece 24 has a distal end portion 25 as a second holding portion for holding the substrate W at an end portion or an intermediate portion thereof.
- the tip portion 25 is formed so as to protrude from the elastic piece 24 in a direction opposite to the substrate W.
- the second holding groove 25 a is formed on the inner side surface of the container body 2 of the tip end portion 25.
- the second holding groove 25a is preferably formed from two inclined surfaces in a substantially V-shaped or U-shaped longitudinal section.
- the container body 2 includes a rear support portion 20 on the back surface portion that is the farthest from the opening 5. Although the rear support unit 20 has a plurality of upper and lower shelves, the rear support unit 20 can be normally in a non-contact state with the substrate W. In this case, each shelf of the rear support portion 20 is formed at a different height from each shelf of the support portion 11.
- the rear support portion 20 regulates the position of the substrate W when a large impact is applied during transportation of the substrate storage container 1.
- the substrate W is placed inside the container body 2
- the substrate W is supported on the support portion 11 and the lower inclined surface of the first holding groove 12 a.
- the opening-side tip of the substrate W comes into contact with the lower inclined surface of the second holding groove 25a and is gradually pushed to the back side.
- the contact portion between the substrate W and the first holding groove 12a moves upward on the lower inclined surface in the first holding groove 12a.
- substrate W is hold
- the upper inclined surface of the first holding groove 12a restricts the movement of the substrate W from the deepest portion to the upper side.
- the substrate storage container 1 includes the teeth 12 with the first holding grooves 12 a that hold the rear portion of the substrate W inside the container body 2, and the inside of the lid 3. Includes a tip portion 25 with a second holding groove 25a for holding a front portion of the substrate W.
- the support unit 11 has shelves that support the substrates W at regular intervals on the inner surfaces of the left and right sides of the substrate W as viewed from the opening 5 of the container body 2.
- the teeth 12 are provided on the back side when viewed from the opening 5 in the support portion 11, and are provided with an inclined surface on the inside that can lift and support the end on the back side of the substrate W from the top surface of the shelf.
- the substrate W in the container main body 2 is sandwiched between the first holding groove 12 a and the second holding groove 25 a, and from the shelf of the support portion 11. Lifted and held.
- the support portion 11 may be integrated with the container main body 2 or may be a separate body from the container main body 2 and detachably attached to the container main body 2.
- At least the first holding groove 12a in the tooth 12 is made of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin.
- alloy resin mainly composed of polycarbonate resin and polybutylene terephthalate resin means an alloy resin composed only of polycarbonate resin and polybutylene terephthalate resin, polycarbonate resin, polybutylene terephthalate resin and other resins. It is interpreted broadly so as to include alloy resins containing components. However, the mass of resin components other than these is small with respect to each mass of polycarbonate resin or polybutylene terephthalate resin. Examples of suitable resin components other than those include polyethylene terephthalate resin.
- the entire tooth 12 can be constituted only by the alloy resin, or the first in the tooth 12 can be formed.
- Only the portion of the holding groove 12a may be the alloy resin, and the other portion may be a resin other than the alloy resin such as a polycarbonate resin or a polybutylene terephthalate resin.
- the teeth 12 made of polycarbonate resin may be prepared, and the surface of the first holding groove 12a may be coated with an alloy resin mainly composed of polycarbonate resin and polybutylene terephthalate resin.
- a substantially U-shaped or substantially V-shaped thin curved member made of the above-mentioned alloy resin may be bonded to a portion of the first holding groove 12a of the teeth 12 made of polycarbonate resin.
- the distal end portion 25 does not necessarily need to be made of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin.
- the tip portion 25 is made of a resin other than the alloy resin, such as a polycarbonate resin or a polybutylene terephthalate resin. can do.
- the alloy resin that constitutes at least the first holding groove 12a of the tooth 12 and the alloy resin that constitutes at least the second holding groove 25a of the distal end portion 25 are made of the same component or different components. It can also be an alloy resin.
- the entire teeth 12 and the entire retainer 4 are both composed of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin, regardless of whether or not they are the same component.
- the alloy resin contains a polybutylene terephthalate resin that is greater than 20% by mass and less than 80% by mass relative to its mass.
- a polybutylene terephthalate resin that is greater than 20% by mass and less than 80% by mass relative to its mass.
- An alloy resin of 100% by mass with both types of resins such as 70% by mass of polybutylene terephthalate resin or 25% by mass of polycarbonate resin + 75% by mass of polybutylene terephthalate resin can be suitably used.
- the said alloy resin contains 25 mass% or more and 40 mass% or less of polybutylene terephthalate resin with respect to the mass.
- polybutylene terephthalate resin both types of resins such as polycarbonate resin 75% by mass + polybutylene terephthalate resin 25% by mass, polycarbonate resin 70% by mass + polybutylene terephthalate resin 30% by mass, or polycarbonate resin 60% by mass + polybutylene terephthalate resin 40% by mass.
- 100 mass% alloy resin can be used more suitably.
- 100% by mass of an alloy resin can be used with both types of resins such as polycarbonate resin 20% by mass + polybutylene terephthalate resin 80% by mass, or polycarbonate resin 80% by mass + polybutylene terephthalate resin 20% by mass.
- the rear support portion 20 may be integrated with the inner back surface portion of the container body 2 or may be provided detachably from the inner back surface portion. Since the rear support part 20 is also a part in contact with the substrate W, like at least the first holding groove 12a of the tooth 12, the rear support part 20 may be made of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin. A preferable mass ratio between the polycarbonate resin and the polybutylene terephthalate resin is the same as that in the case where the tooth 12 or the tip portion 25 is made of the alloy resin.
- FIG. 6 is a plan view (6A) of the state in which the substrate is held by the teeth and the retainer when the substrate is stored in the substrate storage container of FIG.
- a front view (6B) and a front view (6C) of the tip of the elastic piece extending from the retainer as seen from the direction of arrow D are shown.
- the substrate W is formed by the first holding grooves 12a of the two teeth 12 and the second holding grooves 25a of the tip portions 25 provided in the retainer 4 inside the substrate storage container 1 with the lid 3 closed. It is in a clamped state.
- the first holding groove 12a and the second holding groove 25a are each indicated by an arrow C (direction toward the front of each first holding groove 12a).
- the deepest part is formed substantially horizontal seeing from arrow D (direction which goes to the front of each 2nd holding groove 25a).
- the deepest part may not be substantially horizontal, but may be inclined from the horizontal.
- FIG. 7 shows a cross-sectional view of the substrate storage container according to the second embodiment of the present invention
- the same view as FIG. 8 shows a cross-sectional view of the substrate storage container of FIG.
- the substrate storage container 30 according to the second embodiment is different from the substrate storage container 1 according to the first embodiment in the position for holding the rear portion of the substrate W.
- a different part from 1st embodiment in the substrate storage container 30 is mainly demonstrated.
- the container body 31 includes rear support portions 34 that support the substrates W at regular intervals on the inner surface in the back direction of the substrate W when viewed from the opening 5.
- the rear support part 34 is formed in a shelf shape.
- a first holding portion (teeth) 33 is formed between the shelves adjacent to each other in the vertical direction.
- the container body 31 is provided with a support portion 32 in a shelf shape on the inner surface of the both side walls, in a substantially intermediate region between the opening 5 and the teeth 33, on which the substrate W can be placed. For this reason, the teeth 33 are further formed in the back direction from the support portion 32 of the substrate W.
- the teeth 33 hold the substrate W by the retainer 4 and the teeth 33 formed on the inner surface of the lid 3 when the opening 5 of the container body 31 is closed by the lid 3, and the substrate W is held by the support portion 32. It is preferable to be formed at a height away from the plate. For this reason, the retainer 4 and the teeth 33 are formed in a substantially horizontal position and preferably higher than the support portion 32.
- the teeth 33 have a first holding groove 33a for holding a rear portion of the substrate W.
- the first holding groove 33a is preferably formed from two inclined surfaces in a substantially V-shaped or U-shaped longitudinal section.
- the position of the substrate W supported on the support portion 32 is regulated by the lower inclined surface of the first holding groove 33a.
- At least the first holding groove 33a in the teeth 33 is made of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin. Since at least the first holding groove 33a in the teeth 33 is made of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin, the entire teeth 33 can be constituted only by the alloy resin, or the first in the teeth 33 can be formed. Only the portion of the holding groove 33a may be the alloy resin, and the other portion may be a resin other than the alloy resin such as a polycarbonate resin or a polybutylene terephthalate resin.
- teeth 33 made of polycarbonate resin may be prepared, and the surface of the first holding groove 33a may be coated with an alloy resin mainly composed of polycarbonate resin and polybutylene terephthalate resin. Further, a substantially U-shaped or substantially V-shaped thin curved member made of the above alloy resin may be bonded to the portion of the first holding groove 33a of the teeth 33 made of polycarbonate resin.
- the entire teeth 33 and the entire retainer 4 are both composed of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin, regardless of whether or not they are the same component.
- the alloy resin contains a polybutylene terephthalate resin that is greater than 20% by mass and less than 80% by mass relative to its mass.
- a polybutylene terephthalate resin that is greater than 20% by mass and less than 80% by mass relative to its mass.
- An alloy resin of 100% by mass with both types of resins such as 70% by mass of polybutylene terephthalate resin or 25% by mass of polycarbonate resin + 75% by mass of polybutylene terephthalate resin can be suitably used.
- the said alloy resin contains 25 mass% or more and 40 mass% or less of polybutylene terephthalate resin with respect to the mass.
- polybutylene terephthalate resin both types of resins such as polycarbonate resin 75% by mass + polybutylene terephthalate resin 25% by mass, polycarbonate resin 70% by mass + polybutylene terephthalate resin 30% by mass, or polycarbonate resin 60% by mass + polybutylene terephthalate resin 40% by mass.
- 100 mass% alloy resin can be used more suitably.
- 100% by mass of an alloy resin can be used with both types of resins such as polycarbonate resin 20% by mass + polybutylene terephthalate resin 80% by mass, or polycarbonate resin 80% by mass + polybutylene terephthalate resin 20% by mass.
- the rear support portion 34 may be integrated with the inner back surface portion of the container main body 31, or may be provided detachably from the inner back surface portion. Since the rear support part 34 is also a part in contact with the substrate W, similarly to at least the first holding groove 33a of the teeth 33, the rear support part 34 may be made of an alloy resin mainly composed of a polycarbonate resin and a polybutylene terephthalate resin. A preferable mass ratio between the polycarbonate resin and the polybutylene terephthalate resin is the same as that when the teeth 33 or the tip portion 25 is made of the alloy resin.
- the container bodies 2 and 31 have a form in which one side is opened, but may have a form in which two directions are opened.
- the teeth 12, 33 as the first holding part and the tip part 25 as the second holding part preferably include a polycarbonate resin containing a polybutylene terephthalate resin of greater than 20% by weight and less than 80% by weight with respect to its weight. It consists of an alloy resin mainly composed of polybutylene terephthalate resin. However, at least one of the teeth 12, 33 and the tip 25 is mainly composed of a polycarbonate resin and a polybutylene terephthalate resin containing 20% by mass or less or 80% by mass or more of a polybutylene terephthalate resin with respect to its mass. You may comprise from the alloy resin to do.
- the teeth 12, 33 and the tip 25 are preferably an alloy mainly composed of a polycarbonate resin and a polybutylene terephthalate resin containing 25% by mass or more and 40% by mass or less of a polybutylene terephthalate resin with respect to its mass.
- the teeth 12, 33 and the tip portion 25 is mainly composed of a polycarbonate resin and a polybutylene terephthalate resin containing a polybutylene terephthalate resin less than 25% by mass or more than 40% by mass with respect to the mass. You may comprise from the alloy resin to do.
- the support portions 11 and 32 and the rear support portions 20 and 34 are made of polycarbonate resin in each of the above embodiments.
- the support portions 11 and 32 and the rear support portions 20 and 34 are made of alloy resin mainly composed of polycarbonate resin and polybutylene terephthalate resin. It may be configured. Therefore, if the first holding grooves 12a and 33a of the teeth 12 and 33 are made of an alloy resin mainly composed of at least a polycarbonate resin and a polybutylene terephthalate resin, the whole teeth 12 and 33, the first holding grooves 12a and 33a and the retainer are used.
- a constituent part (whether partial or whole) that can come into contact with the substrate W can be made of the alloy resin.
- the substrate W is sandwiched between the first holding grooves 12 a and 33 a and the second holding groove 25 a inside the container main bodies 2 and 31 with the lid 3 closed, and is lifted from the shelves of the support portions 11 and 32. However, it does not necessarily have to be lifted from the shelves of the support portions 11 and 32 and held. Furthermore, the substrate W in the same situation does not necessarily have to be lifted from the rear support portions 20 and 34 and held. For example, the substrate W may be in contact with at least one of the shelves of the support parts 11 and 32 and the shelves of the rear support parts 20 and 34.
- the structure of the exemplary retainer 4 is shown.
- the elastic piece 24 extending from the frame body portion 23 is not limited to the cantilever structure, and is connected at the central portion of the elastic piece 24, It may have a double-supported beam structure in which elastic pieces 24 extending from the frame body portion 23 are respectively connected to a center frame body provided at the center portion.
- the number of the second holding grooves 25a is not limited to the case where two pieces are formed on the elastic pieces 24 of each step, and only one or a total of three or more pieces may be formed on the elastic pieces 24 of each step.
- the present invention is not limited to the case where the left and right teeth 12 are each provided with one first holding groove 12a.
- the first holding groove is provided in each of the support portion 11 and the rear support portion 20. 12a may be provided.
- each of the support portion 32 and the rear support portion 34 may include a first holding groove 33a.
- the constituent parts of the above embodiments may be combined with each other within a range where they can be combined with each other.
- the whole teeth 12 and 33 may be made of the above alloy resin
- the entire retainer 4 may be made of a polybutylene terephthalate resin.
- Example 1 The container main body and the lid were formed from a polycarbonate resin, and the support portion and the first holding portion (tooth) were formed from an alloy resin of polycarbonate resin and polybutylene terephthalate resin.
- the alloy resin was blended with 75% by mass of a polycarbonate resin and 25% by mass of a polybutylene terephthalate resin.
- the retainer including the tip portion as the second holding portion was composed only of polybutylene terephthalate resin.
- This substrate storage container was loaded with 25 semiconductor wafers, and before the vibration test, it was examined whether or not the semiconductor wafers were smoothly slid down from the teeth when the lid was removed from the opening of the container body. Then, the opening part of the container main body was closed with the cover body, and the predetermined packing was given. After packing, a vibration test was performed to confirm the presence and extent of resin contact traces on the semiconductor wafer. In addition, before and after the vibration test, the presence or absence and degree of contact traces were confirmed at the end portions of the semiconductor wafer on the opening side and the back side.
- the contact mark was confirmed by the following method.
- the edge inspection apparatus for semiconductor wafers the end surfaces on the opening side and the back side of the semiconductor wafer before and after the vibration test were observed from the horizontal direction, the diagonally upward direction, and the diagonally downward direction, respectively.
- the best evaluation “ ⁇ ” was given when no contact mark was observed in any direction.
- a good evaluation “ ⁇ ” is given after “ ⁇ ”.
- a failure evaluation “x” was given when a clear contact mark was observed by observation from at least one of the directions.
- the semiconductor wafer stored in the container body slides smoothly from the first holding groove of the first holding part before the vibration test, it is evaluated as ⁇ ⁇ '', and if it does not slide smoothly Evaluated as “x”.
- Example 2 The same material and structure as in Example 1 were used except that the alloy resin used in the teeth of Example 1 was changed to a blend of 70% by mass of polycarbonate resin and 30% by mass of polybutylene terephthalate resin. Was evaluated.
- Example 3 The same material and structure as in Example 1 were adopted except that the alloy resin used in the teeth of Example 1 was changed to a blend of 60% by mass of polycarbonate resin and 40% by mass of polybutylene terephthalate resin. Was evaluated.
- Example 4 The same material and structure as in Example 1 were used, except that the alloy resin used in the teeth of Example 1 was changed to a blend of 30% by mass of polycarbonate resin and 70% by mass of polybutylene terephthalate resin. Was evaluated.
- Example 5 The alloy resin used in the teeth of Example 1 was changed to a blend of 25% by mass of polycarbonate resin and 75% by mass of polybutylene terephthalate resin. % And an alloy resin blended with 75% by mass of a polybutylene terephthalate resin), the same material and structure as in Example 1 were adopted, and the same evaluation as in Example 1 was performed.
- Example 6 The alloy resin used in the teeth of Example 1 was changed to a blend of 30% by mass of a polycarbonate resin and 70% by mass of a polybutylene terephthalate resin, and the material used for the retainer was the same as that of the above teeth (polycarbonate resin 30% by mass). % And an alloy resin blended with 70% by mass of polybutylene terephthalate resin), the same evaluation as in Example 1 was performed using the same material and structure as in Example 1.
- Example 7 In order to manufacture the substrate storage container shown in FIGS. 7 and 8, the container main body and the lid provided with a support portion are formed of polycarbonate resin, and the rear support portion and the first holding portion (tooth) are separated from the support portion. In position, it was formed from an alloy resin of polycarbonate resin and polybutylene terephthalate resin.
- the alloy resin was a resin in which 75% by mass of a polycarbonate resin and 25% by mass of a polybutylene terephthalate resin were blended. Further, the first holding part was provided so that its position was higher than the position of the support part.
- the stored semiconductor wafer is sandwiched between the first holding part and the tip part as the second holding part from the state supported by the supporting part, and thereby from the supporting part. It was lifted and held. Further, when the lid was removed, the semiconductor wafer W was slid down the first holding groove 33a and supported again on the support portion 32.
- the retainer including the tip was formed from an alloy resin in which 25% by mass of polycarbonate resin and 75% by mass of polybutylene terephthalate resin were blended.
- the substrate storage container (corresponding to the substrate storage container 30 according to the second embodiment) having such a configuration, and the lid is removed from the opening of the container body before the vibration test, the semiconductor It was examined whether or not the wafer slides smoothly from the teeth. Then, the opening part of the container main body was closed with the cover body, and the predetermined packing was given. After packing, a vibration test was performed to confirm the presence and extent of resin contact traces on the semiconductor wafer. In addition, before and after the vibration test, the presence or absence and degree of contact traces were confirmed at the end portions of the semiconductor wafer on the opening side and the back side.
- Example 1 The same evaluation as in Example 1 was performed using the same material and structure as in Example 1 except that the alloy resin used in the teeth of Example 1 was changed to only polybutylene terephthalate resin.
- Table 1 shows a comparison of the conditions and evaluation results of the examples and comparative examples.
- the indication in the column of the first holding part and the second holding part means the type and mass% of each resin component.
- PC75 / PBT25 means an alloy resin containing 75% by mass of polycarbonate and 25% by mass of polybutylene terephthalate
- PBT100 means 100% by mass of polybutylene terephthalate resin.
- Other indications of the first holding part and second holding part fields are interpreted in the same manner.
- Example 7 and Comparative Example 1 in which the retainer was formed only from polybutylene terephthalate resin, some contact marks were formed on the end surface on the opening side of the semiconductor wafer, and the retainer was formed from alloy resin.
- the evaluation was lower than that of Examples 5 and 6.
- the retainer is not formed of an alloy resin, it has been found that there is no major problem as compared with the case where the teeth are not made of an alloy resin, and the evaluation is at a pass level.
- the present invention can be used for a substrate storage container for storing a substrate such as a semiconductor wafer, a photomask glass, or an aluminum disk.
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
2,31 容器本体
3 蓋体
4 リテーナ
5 開口部
11,32 支持部
12,33 ティース(第一保持部)
12a,33a 第一保持溝
20,34 後方支持部
25 先端部(第二保持部)
25a 第二保持溝
W 基板
図1は、本発明の第一実施形態に係る基板収納容器の展開斜視図を示す。図2は、図1の基板収納容器を組み立てた状態の主要斜視図を示す。図3は、図2の基板収納容器を垂直方向(A-A線断面)にて切断した断面図を示す。図4は、図2の基板収納容器を水平方向(B-B線断面)にて切断した断面図を示す。図5は、図1の蓋体の裏面斜視図を示す。
次に、本発明の第二実施形態に係る基板収納容器について説明する。第二実施形態において、第一実施形態と共通する部材の一部若しくは全部については、同じ符号を付し、かつその説明を省略する。
以上、本発明の好適な実施形態について説明したが、本発明は、上述の各実施形態に限定されず、以下のように種々変形して実施することができる。
(実施例1)
容器本体と蓋体とをポリカーボネート樹脂から形成し、支持部および第一保持部(ティース)を、ポリカーボネート樹脂とポリブチレンテレフタレート樹脂のアロイ樹脂から形成した。当該アロイ樹脂は、ポリカーボネート樹脂75質量%とポリブチレンテレフタレート樹脂25質量%とを配合した。第二保持部としての先端部を含むリテーナは、ポリブチレンテレフタレート樹脂のみから構成した。こうして、上記構成要素を持ち、図1~図6に示す形状の基板収納容器を用意した。この基板収納容器に25枚の半導体ウェーハを装填し、振動試験前に、蓋体を容器本体の開口部から外したときに、半導体ウェーハがティースからスムーズに滑り下がるか否かを調べた。その後、容器本体の開口部を蓋体にて閉じ、所定の梱包を施した。梱包後、振動試験を行い、半導体ウェーハへの樹脂接触痕の有無とその程度の確認を実施した。なお、接触痕は、振動試験前後に、開口側と奥側の半導体ウェーハの端部にてその有無と程度とを確認した。
・振動周波数:5Hz~50Hz~5Hz~50Hz(1往復半)
・加速度:±0.75G
・加振時間:片道7min×3回
・固定方法:バンド止め
半導体ウェーハのエッジ検査装置において、振動試験前後の半導体ウェーハの開口側と奥側のそれぞれの端面を、水平方向、斜め上方向、斜め下方向からそれぞれ観察した。その結果、いずれの方向から観察しても、接触痕が見られない場合には、最も良い評価「◎」を付けた。また、多少の接触痕が存在するが、ほとんど問題が無いレベルの場合には、「◎」の次に良い評価「○」を付けた。さらに、少なくともいずれか1つの方向からの観察によって、明確な接触痕が観察された場合には、不合格の評価「×」を付けた。
実施例1のティースに用いたアロイ樹脂を、ポリカーボネート樹脂70質量%とポリブチレンテレフタレート樹脂30質量%の配合に変えた以外、実施例1と同一の材料、構造を採用し、実施例1と同一の評価を行った。
実施例1のティースに用いたアロイ樹脂を、ポリカーボネート樹脂60質量%とポリブチレンテレフタレート樹脂40質量%の配合に変えた以外、実施例1と同一の材料、構造を採用し、実施例1と同一の評価を行った。
実施例1のティースに用いたアロイ樹脂を、ポリカーボネート樹脂30質量%とポリブチレンテレフタレート樹脂70質量%の配合に変えた以外、実施例1と同一の材料、構造を採用し、実施例1と同一の評価を行った。
実施例1のティースに用いたアロイ樹脂を、ポリカーボネート樹脂25質量%とポリブチレンテレフタレート樹脂75質量%の配合に変え、さらに、リテーナに用いた材料を上記ティースと同様のアロイ樹脂(ポリカーボネート樹脂25質量%とポリブチレンテレフタレート樹脂75質量%を配合したアロイ樹脂)に変えた以外、実施例1と同一の材料、構造を採用し、実施例1と同一の評価を行った。
実施例1のティースに用いたアロイ樹脂を、ポリカーボネート樹脂30質量%とポリブチレンテレフタレート樹脂70質量%の配合に変え、さらに、リテーナに用いた材料を上記ティースと同様のアロイ樹脂(ポリカーボネート樹脂30質量%とポリブチレンテレフタレート樹脂70質量%を配合したアロイ樹脂)に変えた以外、実施例1と同一の材料、構造を採用し、実施例1と同一の評価を行った。
図7および図8の基板収納容器を製造するため、支持部を備えた容器本体と蓋体とをポリカーボネート樹脂から形成し、後方支持部および第一保持部(ティース)を、支持部から離れた位置に、ポリカーボネート樹脂とポリブチレンテレフタレート樹脂のアロイ樹脂から形成した。当該アロイ樹脂は、ポリカーボネート樹脂75質量%とポリブチレンテレフタレート樹脂25質量%とを配合した樹脂とした。また、第一保持部を、その位置が支持部の位置よりも高くなるように設けた。蓋体を容器本体に取り付けたときに、収納された半導体ウェーハは、支持部で支持された状態から、第一保持部と第二保持部としての先端部とに挟持され、これによって支持部から持ち上がって保持されるようにした。また、蓋体を取り外すと、半導体ウェーハWは、第一保持溝33aを滑り落ちて、支持部32上で再び支持されるようにした。先端部を含むリテーナは、ポリカーボネート樹脂25質量%とポリブチレンテレフタレート樹脂75質量%とを配合したアロイ樹脂から形成した。かかる構成の基板収納容器(第二実施形態に係る基板収納容器30に相当)に25枚の半導体ウェーハを装填し、振動試験前に、蓋体を容器本体の開口部から外したときに、半導体ウェーハがティースからスムーズに滑り下がるか否かを調べた。その後、容器本体の開口部を蓋体にて閉じ、所定の梱包を施した。梱包後、振動試験を行い、半導体ウェーハへの樹脂接触痕の有無とその程度の確認を実施した。なお、接触痕は、振動試験前後に、開口側と奥側の半導体ウェーハの端部にてその有無と程度とを確認した。
実施例1のティースに用いたアロイ樹脂を、ポリブチレンテレフタレート樹脂のみに変えた以外、実施例1と同一の材料、構造を採用し、実施例1と同一の評価を行った。
表1に、各実施例および比較例の条件および評価結果を比較して示す。表中、第一保持部および第二保持部の欄内の表示は、各樹脂成分の種類と質量%を意味する。例えば、PC75/PBT25は、ポリカーボネート75質量%とポリブチレンテレフタレート25質量%とを含むアロイ樹脂を、PBT100はポリブチレンテレフタレート樹脂100質量%を、それぞれ意味する。第一保持部および第二保持部の欄の他の表示も同様に解釈される。
Claims (6)
- 基板を収納する少なくとも一方を開口した容器本体と、その容器本体の開口部を開閉自在に着脱可能な蓋体と、を備える基板収納容器であって、
前記容器本体の内部には、前記基板の後方部位を保持する第一保持溝付きの第一保持部を備え、
前記蓋体の内側には、前記基板の前方部位を保持する第二保持溝付きの第二保持部を備え、
前記第一保持部における少なくとも前記第一保持溝を、ポリカーボネート樹脂とポリブチレンテレフタレート樹脂とを主とするアロイ樹脂から構成する基板収納容器。 - 前記アロイ樹脂は、その樹脂成分の質量に対して20質量%より大きく80質量%未満のポリブチレンテレフタレート樹脂を含む、請求項1に記載の基板収納容器。
- 前記アロイ樹脂は、その樹脂成分の質量に対して25質量%以上40質量%以下のポリブチレンテレフタレート樹脂を含む、請求項2に記載の基板収納容器。
- 前記第二保持部における少なくとも前記第二保持溝を、さらに、前記アロイ樹脂から構成する請求項1から請求項3のいずれか1項に記載の基板収納容器。
- 前記容器本体は、その開口部からみて前記基板の左右両側の内面に、それぞれ、前記基板を一定間隔で支持する棚を有する支持部を備え、
前記第一保持部は、前記支持部における前記開口部からみて奥側に備えられ、
前記第一保持部は、その内側に、前記基板の前記奥側の端部を前記棚の上面から持ち上げて支持可能な傾斜面を備え、
前記容器本体の前記開口部に前記蓋体を取り付けた際に、前記容器本体内の前記基板は、前記第一保持溝と前記第二保持溝との間で挟持され、前記棚から持ち上がって保持される、請求項1から請求項4のいずれか1項に記載の基板収納容器。 - 前記支持部は、前記容器本体と別体であり、前記容器本体から着脱自在に取り付けられている、請求項5に記載の基板収納容器。
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| DE112016001674.3T DE112016001674T5 (de) | 2015-04-10 | 2016-02-22 | Substrataufbewahrungsbehälter |
| CN201680018405.5A CN107431036B (zh) | 2015-04-10 | 2016-02-22 | 基板收纳容器 |
| KR1020177024292A KR102374961B1 (ko) | 2015-04-10 | 2016-02-22 | 기판 수납 용기 |
| US15/557,720 US10559484B2 (en) | 2015-04-10 | 2016-02-22 | Substrate storage container |
| SG11201707411QA SG11201707411QA (en) | 2015-04-10 | 2016-02-22 | Substrate storage container |
| JP2017511488A JP6372871B2 (ja) | 2015-04-10 | 2016-02-22 | 基板収納容器 |
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| WO2013151022A1 (ja) * | 2012-04-04 | 2013-10-10 | 信越ポリマー株式会社 | 基板収納容器 |
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- 2016-02-22 SG SG11201707411QA patent/SG11201707411QA/en unknown
- 2016-02-22 JP JP2017511488A patent/JP6372871B2/ja active Active
- 2016-02-22 CN CN201680018405.5A patent/CN107431036B/zh active Active
- 2016-02-22 US US15/557,720 patent/US10559484B2/en active Active
- 2016-02-22 DE DE112016001674.3T patent/DE112016001674T5/de active Pending
- 2016-02-22 KR KR1020177024292A patent/KR102374961B1/ko active Active
- 2016-02-22 WO PCT/JP2016/054974 patent/WO2016163166A1/ja not_active Ceased
- 2016-03-10 TW TW105107366A patent/TWI697523B/zh active
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| JP2002305239A (ja) * | 2001-04-06 | 2002-10-18 | Shin Etsu Polymer Co Ltd | 基板収納容器及びその製造方法 |
| WO2009107254A1 (ja) * | 2008-02-27 | 2009-09-03 | ミライアル株式会社 | 裏面支持構造付きウエハ収納容器 |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111213228A (zh) * | 2017-11-16 | 2020-05-29 | 信越聚合物株式会社 | 基板收纳容器 |
| KR20200085328A (ko) * | 2017-11-16 | 2020-07-14 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
| KR102635149B1 (ko) * | 2017-11-16 | 2024-02-13 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
| JP2021034601A (ja) * | 2019-08-27 | 2021-03-01 | 信越ポリマー株式会社 | 基板収納容器 |
| WO2021039153A1 (ja) * | 2019-08-27 | 2021-03-04 | 信越ポリマー株式会社 | 基板収納容器 |
| JP7313975B2 (ja) | 2019-08-27 | 2023-07-25 | 信越ポリマー株式会社 | 基板収納容器 |
| TWI848170B (zh) * | 2019-08-27 | 2024-07-11 | 日商信越聚合物股份有限公司 | 基板收納容器 |
| JPWO2021234809A1 (ja) * | 2020-05-19 | 2021-11-25 | ||
| JP7562657B2 (ja) | 2020-05-19 | 2024-10-07 | ミライアル株式会社 | 基板収納容器 |
| US12431377B2 (en) | 2020-05-19 | 2025-09-30 | Miraial Co., Ltd. | Substrate storage container |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI697523B (zh) | 2020-07-01 |
| JPWO2016163166A1 (ja) | 2018-02-01 |
| US10559484B2 (en) | 2020-02-11 |
| JP6372871B2 (ja) | 2018-08-15 |
| US20180068882A1 (en) | 2018-03-08 |
| DE112016001674T5 (de) | 2017-12-28 |
| SG11201707411QA (en) | 2017-10-30 |
| TW201641585A (zh) | 2016-12-01 |
| CN107431036B (zh) | 2021-09-28 |
| CN107431036A (zh) | 2017-12-01 |
| KR102374961B1 (ko) | 2022-03-15 |
| KR20170136500A (ko) | 2017-12-11 |
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