WO2016157478A1 - 配線基板および電子装置 - Google Patents

配線基板および電子装置 Download PDF

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Publication number
WO2016157478A1
WO2016157478A1 PCT/JP2015/060388 JP2015060388W WO2016157478A1 WO 2016157478 A1 WO2016157478 A1 WO 2016157478A1 JP 2015060388 W JP2015060388 W JP 2015060388W WO 2016157478 A1 WO2016157478 A1 WO 2016157478A1
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WO
WIPO (PCT)
Prior art keywords
region
conductor layer
component mounting
wiring board
main surface
Prior art date
Application number
PCT/JP2015/060388
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English (en)
French (fr)
Japanese (ja)
Inventor
厚志 小森
甲斐　昭裕
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP2017509093A priority Critical patent/JPWO2016157478A1/ja
Priority to PCT/JP2015/060388 priority patent/WO2016157478A1/ja
Priority to CN201590000233.XU priority patent/CN206059386U/zh
Publication of WO2016157478A1 publication Critical patent/WO2016157478A1/ja

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details

Definitions

  • the present invention relates to a wiring board and an electronic device, and more particularly to a heat dissipation structure.
  • Patent Document 1 when mounting a surface mounting component on a wiring board, in order to prevent thermal destruction due to heat generation of the component, a number of thermal via holes are formed immediately below the heat generating component on the component mounting surface.
  • a technique for connecting the copper foil on the mounting surface and the copper foil on the back surface is disclosed. According to the said structure, it becomes possible to improve the heat dissipation of components.
  • the heat dissipation structure in the surface mount component of Patent Document 1 is such that the copper foil on the component mounting surface directly below the heat generating component and the copper foil on the back surface are connected by a number of thermal via holes. It is necessary to increase the size of the copper foil provided immediately below the heat generating component. For this reason, there is a problem that it is difficult to keep the restrictions on the outer size of the substrate. Moreover, there existed a problem that copper foil size could not be ensured enough to expand by arrangement
  • the present invention has been made in view of the above, and while reducing the size of the heat radiating part such as a copper foil for heat radiating component heat radiation, it improves heat radiation and secures the performance of the heat radiating component.
  • An object of the present invention is to obtain a wiring board capable of improving the reliability of the heat generating component.
  • a wiring board includes a first main surface and a second main surface facing the first main surface, and the surface is formed on the first main surface.
  • An insulating substrate having a surface mounting component mounting region for mounting a mounting component; a first conductor layer formed on the first main surface; a second conductor layer formed on the second main surface and forming a heat dissipation region; A surface mount component mounting region and a peripheral region of the surface mount component mounting region are provided, and a via hole filled with a solder layer is provided therein.
  • the first conductor layer on the first main surface side is thermally connected to the heat dissipation area of the second conductor layer through a via hole.
  • FIG. 3 is a cross-sectional view of an electronic device in which an electronic component is mounted on the wiring board according to the first embodiment, and is a cross-sectional view taken along line AA in FIGS. 1 and 2.
  • FIG. 3 is a cross-sectional view of an electronic device in which an electronic component is mounted on the wiring board according to the first embodiment, and is a cross-sectional view taken along line BB in FIGS.
  • FIG. 9 is a cross-sectional view of an electronic device in which an electronic component is mounted on a wiring board according to Embodiment 3, and is a cross-sectional view taken along DD in FIG.
  • FIG. 10 is a cross-sectional view of an electronic device in which an electronic component is mounted on a wiring board according to a fourth embodiment, and is an EE cross-sectional view in FIGS. 10 and 11
  • FIG. 1 is a plan view of an electronic device in which an electronic component is mounted on the wiring board according to the first embodiment, as viewed from the substrate surface.
  • FIG. 2 is an electronic device in which the electronic component is mounted on the wiring substrate according to the first embodiment.
  • FIG. 3 is a cross-sectional view taken along the line AA in FIGS. 1 and 2
  • FIG. 4 is a cross-sectional view taken along the line BB.
  • FIG. 5 is a schematic plan view seen from the component mounting surface of the wiring board of the first embodiment.
  • the first conductor layer 12 on the first main surface side which is the component mounting surface 10A is covered with the resist layer 16 except for the first region serving as an electrical connection region
  • the second conductor layer 13 on the second main surface side, which is the back surface 10B is covered with a resist layer 16 except for the second region serving as an electrical connection region.
  • the first conductor layer 12 on the first main surface side penetrates the insulating substrate 11 constituting the wiring substrate 10 immediately below the surface mount component mounting region Ra on which the power element 20 as the surface mount component is mounted and its peripheral region Rb.
  • the first and second conductor layers 12 and 13 connected by the solder layer 15 filled in the via hole 14 are exposed from the resist layer 16 and are connected to the second conductor layer 13 through the via hole 14.
  • the heat radiation region R covered with 15 is formed.
  • a wiring board called a regular printed circuit board may leave the solder resist pattern used for patterning of the wiring pattern as it is, but it may also be used for surface protection and insulation, including when resist processing is newly performed. Resist processing is performed on the surface of the conductor layer except for the electrical connection portion including the surface.
  • the first conductor layer 12 made of copper foil on the component mounting surface 10 ⁇ / b> A of the wiring substrate 10 is subjected to resist processing as a component mounting surface.
  • the pad 12P directly under the lead terminal 23 is not subjected to resist processing on the component mounting surface, and the resist layer 16 does not exist.
  • a first conductor layer made of a copper foil on the component mounting surface 10A is provided with a via hole 14B in the peripheral area Rb of the surface mounting component mounting area Ra, which is an area immediately below the power element 20. 12 and the second conductor layer 13 made of copper foil on the back surface 10B are connected.
  • the first conductor layer 12 is not formed in the peripheral region Rb, a heat dissipation path is formed in the second conductor layer 13 on the back surface 10B through the solder in the via hole 14.
  • the second conductive layer 13 made of the copper foil on the back surface 10B is exposed without forming the resist layer 16 on the back surface 10B on the copper foil on the back surface 10B.
  • a solder layer 15 is formed in the via hole 14 and on the surface of the first conductor layer 12 and the second conductor layer 13 exposed from the resist layer 16. That is, by filling the via hole 14 with solder, the via hole 14 is used as a heat dissipation path with good thermal conductivity. By securing a heat dissipation area not only in the plane direction of the wiring board but also in the thickness direction, The heat dissipation is improved while suppressing the increase in size.
  • the first conductor layer 12 made of copper foil is formed on the component mounting surface 10A of the insulating substrate 11 such as an epoxy substrate, and the second conductor layer 13 and the component mounting surface 10A are formed on the back surface 10B.
  • a solder layer 15 that is a solder plating layer deposited from the first conductor layer 12 to the second conductor layer 13 through the via hole 14.
  • the regions inside the via hole 14 and on the first conductor layer 12 and the second conductor layer 13 other than the region covered with the solder plating layer 15 are covered with the resist layer 16. That is, the first conductor layer 12 and the second conductor layer 13 are selectively covered with the resist layer 16, and the region exposed from the resist layer 16 is covered with the solder layer 15.
  • solder layer for component mounting is formed on the conductor layers on the component mounting surface 10 ⁇ / b> A and the back surface 10 ⁇ / b> B by electroless plating.
  • a region where solder connection is not required is left as a resist layer, covered with a resist layer 16 so as to expose a region where the solder layer 15 is to be formed, and immersed in a solder bath to select a necessary region.
  • a method of forming the solder layer 15 is employed. It is known that the solder layer is formed by leaving the pattern of the resist layer 16 in the wiring region and performing pattern formation.
  • the pattern of the resist layer 16 is changed, and the region where the solder layer is formed is used as a heat dissipation region.
  • a solder layer is formed not only in the surface mount component mounting region Ra but also in the peripheral region Rb of the surface mount component mounting region Ra to constitute a heat radiating portion.
  • solder layers 15 are formed in the surface mount component mounting region Ra, that is, in the via hole 14A immediately below the component and in the via hole 14B in the peripheral region Rb around the component.
  • 1 and 2 show the main part of the wiring substrate 10, a region exposed from the resist layer 16 is a heat radiation region R.
  • the power element 20 as a surface-mount component is a usual one, and a mold resin is used so that a semiconductor chip 22 is mounted on a die pad 21 that constitutes a heat radiating fin at one end, and a short lead terminal 23 having a straight piece shape is led out.
  • the power element 20 In mounting on the wiring board 10, the power element 20 is placed on the surface mount component mounting area Ra on the wiring board 10, and the lead terminals 23 are aligned on the pads 12 ⁇ / b> P on the wiring board 10, The lead terminal 23 is electrically connected to the pad 12P through the solder layer 15 by heating. At this time, the surface of the pad 12P is also exposed from the resist layer 16, and the solder layer 15 is formed.
  • FIG. 5 is a schematic diagram showing the surface mounting component mounting area Ra as a center. Many other components 18 different from the power element 20 are mounted on the wiring board 10, but only the overview is shown here. Shall be shown. As shown in FIG. 5, the via holes 14 are more densely distributed in the surface mount component mounting region Ra and the peripheral region Rb than the edge portion of the substrate, so that heat dissipation can be realized more efficiently.
  • a large number of via holes 14 that connect the first conductor layer 12 made of copper foil on the component mounting surface 10A and the second conductor layer 13 on the back surface 10B are provided to be mounted on the copper foil on the component mounting surface 10A.
  • the heat generated by the power element 20 can be efficiently transmitted to the copper foil on the back surface 10B. Therefore, only by changing the resist pattern so that the second conductor layer 13 made of the copper foil on the back surface 10B is exposed from the resist layer 16, the second conductor layer 13 on the back surface 10B and the through hole 14 penetrating through the second conductor layer 13 are formed.
  • the solder layer 15 is formed, the heat radiation path from the component mounting surface 10A to the back surface 10B is increased, and the surface area exposed to the air is increased, whereby the heat dissipation of the copper foil on the back surface 10B can be improved.
  • the performance of the heat generating component is ensured, the reliability of the heat generating component is improved, and the heat generating component Thermal destruction can be prevented.
  • a large number of via holes 14B are provided around the power element 20 as the heat generating component, and the first conductor layer 12 on the component mounting surface 10A is provided. Is connected to the second conductor layer 13 on the back surface 10B to efficiently transfer the heat of the power element 20 mounted on the copper foil on the component mounting surface 10A to the second conductor layer 13 on the back surface 10B. And the area
  • the first conductor layer 12 and the second conductor layer 13 are covered with the resist layer 16 except for the region covered with the solder layer 15, and the heat dissipation is improved, and the resist layer 16 is not limited during the manufacture. Since the solder layer 15 is formed by solder plating in the via hole 14B in the peripheral region Rb and on the surface of the second conductor layer 13 simply by changing the region where the metal is removed, the wiring board has high heat dissipation without increasing the number of manufacturing steps. Can be formed. Further, the wiring pattern of the component mounting surface 10A is not separately increased, and the heat radiation path is increased only in the via hole 14, so that the circuit configuration is hardly affected.
  • the heat dissipating structure in the power element 20 of the present embodiment can improve the heat dissipating performance by changing the distribution or shape of the via holes 14 or not performing the resist processing of the copper foil or changing the resist shape.
  • the solder layer 15 increases the surface area and further improves the heat dissipation.
  • a conductor layer is also formed on the inner wall of the via hole 14, but by solder plating, the via hole 14 is filled with solder, and the solder heats from the component mounting surface 10A to the back surface 10B. A transport path is formed.
  • a heat dissipation path is formed from the component mounting surface 10A to the back surface 10B via the solder in the via hole not only in the surface mount component mounting region Ra but also in the peripheral region Rb. Therefore, the heat dissipation performance is improved, and the effect of reducing the size of the copper foil of the second conductor layer 13 for heat dissipation can be achieved. Further, by improving the heat dissipation performance, the performance of the heat generating component can be ensured, and the reliability of the heat generating component can be improved.
  • Embodiment 2 FIG.
  • the resist coating on the back surface 10B of the wiring substrate 10 is not performed, that is, the second conductor layer 13 on the back surface 10B of the wiring substrate 10 is not coated with the resist layer 16.
  • the copper foil on the component mounting surface 10 ⁇ / b> A is also used as a heat dissipation region without performing resist coating on the component mounting surface.
  • FIG. 6 is a plan view of a principal part of an electronic device in which the power element 20 as an electronic component is mounted on the wiring board according to the second embodiment, as viewed from the substrate surface
  • FIG. 7 is a cross-sectional view taken along the line CC in FIG. is there.
  • the first conductor layer 12 made of the copper foil of the component mounting surface 10A is exposed without forming the resist layer 16 of the component mounting surface 10A on the copper foil of the component mounting surface 10A of the wiring board 10.
  • a via hole 14B is also provided in the peripheral area Rb, which is the periphery of the surface mounting component mounting area Ra, and the first conductor layer 12 and the back surface of the component mounting surface 10A
  • the second conductor layer 13 of 10B is connected.
  • the back surface 10B is not exposed to the copper foil of the back surface 10B, and the copper foil of the back surface 10B is exposed to form the solder layer 15.
  • Other parts are the same as those of the wiring substrate 10 of the first embodiment, and the description thereof will be omitted.
  • the first conductor layer 12 that is a copper foil of the component mounting surface 10A that is not covered with the resist layer 16 of the component mounting surface 10A, and the back surface
  • the solder layer 15 adheres to the second conductor layer 13 not covered with the resist layer 16 of 10B, the inside of the via hole 14A immediately below the component, and the inside of the via hole 14B around the component.
  • the wiring board formed as described above more efficiently conveys the heat generated by the power element 20 mounted on the first conductor layer 12 of the component mounting surface 10A, and the back surface 10B.
  • the surface area of the solder layer 15 increases, and the surface area exposed to air increases, thereby improving the heat dissipation from both the component mounting surface 10A and the back surface 10B. Can do.
  • the copper foil size of the first conductor layer 12 on the component mounting surface 10A and the second conductor layer 13 on the back surface 10B is reduced, the performance of the heat generating component is ensured, the reliability of the heat generating component is improved, and the heat of the heat generating component is increased. Destruction can be prevented.
  • the solder layer 15 is formed by solder plating in the via hole 14B in the peripheral region Rb and on the surface of the first conductor layer 12 in the peripheral region Rb simply by changing the region from which the resist layer 16 is removed during manufacturing. Therefore, a wiring board with high heat dissipation can be formed without increasing the number of manufacturing steps.
  • FIG. 8 is a plan view of a principal part of an electronic device in which an electronic component is mounted on the wiring board according to the second embodiment when viewed from the back surface 10B
  • FIG. 9 is a cross-sectional view taken along the line DD in FIG.
  • the component mounting surface 10A is the same as that of the second embodiment shown in FIG.
  • the component mounting surface 10A of the component mounting surface 10A of the wiring board 10 to the first conductor layer 12 is the same as shown in FIG. Is formed around the surface-mounted component mounting region Ra.
  • the peripheral region Rb covered with the solder layer 15 is divided into a plurality of portions with the resist slits 16S therebetween, so that the solder in a lattice-shaped region can be obtained.
  • the surface area of the layer 15 is increased to facilitate the formation of a heat flow, and the heat dissipation is improved.
  • the via hole 14B is also provided in the peripheral region Rb around the power element 20 to provide the first conductor layer 12 on the component mounting surface 10A.
  • the via hole 14B is also provided in the peripheral region Rb around the power element 20 to provide the first conductor layer 12 on the component mounting surface 10A.
  • the second conductor layer 13 on the back surface 10B Resist processing of the back surface 10B to the copper foil of the back surface 10B is performed so as to form a lattice, and the solder layer 15 is formed without performing resist processing in the lattice-shaped region across the resist slit 16S of the back surface 10B. It is. That is, the region where the solder layer 15 is formed on the second conductor layer 13 on the back surface 10B is divided into a plurality of parts.
  • the first conductor made of the copper foil of the component mounting surface 10A that is not subjected to the resist processing of the component mounting surface 10A.
  • the layer 12 and the second conductor layer 13 made of copper foil on the back surface 10B at a plurality of locations where the resist processing of the back surface 10B is not performed include the inside of the via hole 14A immediately below the surface mount component mounting region Ra and the peripheral region Rb around the component. Since the solder layer 15 adheres inside the via hole 14B, the wiring board 10 with high heat dissipation can be easily obtained.
  • the solder layer 15 deposited inside the via hole 14 is formed so as to fill the via hole 14 without any gap.
  • the wiring board is formed at each location compared to when the resist processing of the back surface 10B is not performed uniformly. After 10 passes through the solder bath, more solder layer 15 adheres to the area of the copper foil, and the surface area exposed to air increases, thereby further improving the heat dissipation of the copper foil on the component mounting surface 10A and the back surface 10B. Can be improved.
  • the copper foil size of the copper foil on the component mounting surface 10A and the copper foil on the back surface 10B can be reduced, the performance of the heat generating component can be ensured, the reliability of the heat component can be improved, and the heat destruction of the heat generating component can be prevented.
  • Embodiment 4 FIG.
  • the processing shape of the resist layer 16 on the back surface 10B covering the second conductor layer 13 on the back surface 10B is changed, but in the fourth embodiment, the copper foil and the back surface 10B on the component mounting surface 10A
  • the shape of the via hole 14B in the peripheral region Rb to which the copper foil is connected was changed.
  • 10 is a plan view as viewed from the component mounting surface according to the fourth embodiment of the present invention
  • FIG. 11 is a plan view as viewed from the rear surface 10B according to the fourth embodiment of the present invention
  • FIG. 12 is a cross section taken along line E-E in FIG. FIG.
  • the cross-sectional shape of the via hole 14 is different in each region.
  • the via holes 14A are provided with a constant cross section and at a constant interval, whereas in the peripheral region Rb, an elongated via hole 14S is formed, and the area of the via hole 14S is increased. Yes.
  • the resist layer 16 is not formed in the surface mounting component mounting region Ra and the peripheral region Rb of the component mounting surface 10A of the wiring board 10.
  • the resist layer 16 is not formed in an area that requires solder connection, such as the pad 12P formation area, but the other area is covered with the resist layer 16.
  • solder bath adheres to the inside of the via hole 14A in the surface mounting component mounting region Ra and the inside of the elongated hole shaped hole 14S in the peripheral region Rb located around the component.
  • connection area between the copper foil on the component mounting surface 10A and the copper foil on the back surface 10B can be increased by providing a large number of elongated via holes 14S that connect the copper foil on the component mounting surface 10A and the copper foil on the back surface 10B.
  • the heat generated by the power element 20 mounted on the copper foil on the component mounting surface 10A can be efficiently transferred to the copper foil on the back surface 10B.
  • the surface area of the component mounting surface 10A where the solder layer 15 attached to the elongated hole-shaped via hole 14S is exposed to air increases, and the back surface 10B copper foil is not subjected to resist processing on the back surface 10B. More solder adheres and the surface area exposed to air increases, so that the heat dissipation of the copper foil on the component mounting surface 10A and the copper foil on the back surface 10B can be improved.
  • the via holes 14S are distributed at a higher density in the peripheral region Rb directly below the mounting component, that is, in the surface mounting component mounting region Ra, and heat from the surface mounting component is more efficiently transferred from the peripheral portion to the back surface 10B side.
  • the heat can be dissipated, and the heat can be dissipated more efficiently.
  • the via holes 14A and 14S are distributed in the surface mounting component mounting region Ra and the peripheral region Rb around the surface mounting component Ra at a higher density than the edge portion of the substrate, so that the back surface 10B is closer to the surface mounting component mounting region Ra. Heat dissipation to the side.
  • the copper foil size of the copper foil on the component mounting surface 10A and the copper foil on the back surface 10B can be reduced, the performance of the heat generating component can be ensured, the reliability of the heat component can be improved, and the heat destruction of the heat generating component can be prevented.
  • the surface-mounted component has been described, but components other than the surface-mounted component are also applicable. Needless to say, this is more effective for mounting surface mount components, in particular, where heat dissipation of heat directly under the components is important. Further, the via holes are more densely distributed in the surface mount component mounting region and the peripheral region than the edge portion of the substrate, so that heat can be more efficiently realized.
  • the epoxy substrate is used as the wiring substrate.
  • the present invention is not limited to the epoxy substrate, and can be applied to other resin substrates, ceramic substrates, glass substrates, and the like.
  • the example using copper foil was demonstrated about the wiring layer, it is not limited to copper foil, Various conductor wiring is applicable.
  • the wiring layer can be applied not only to the front and back surfaces but also to a multilayer wiring board having an intermediate layer.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
PCT/JP2015/060388 2015-04-01 2015-04-01 配線基板および電子装置 WO2016157478A1 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017509093A JPWO2016157478A1 (ja) 2015-04-01 2015-04-01 配線基板および電子装置
PCT/JP2015/060388 WO2016157478A1 (ja) 2015-04-01 2015-04-01 配線基板および電子装置
CN201590000233.XU CN206059386U (zh) 2015-04-01 2015-04-01 布线基板以及电子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2015/060388 WO2016157478A1 (ja) 2015-04-01 2015-04-01 配線基板および電子装置

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WO2019193930A1 (ja) * 2018-04-03 2019-10-10 ソニーセミコンダクタソリューションズ株式会社 電子モジュールおよびその製造方法
CN110622627A (zh) * 2017-05-26 2019-12-27 三菱电机株式会社 半导体装置

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US11145587B2 (en) * 2017-05-26 2021-10-12 Kyocera Corporation Electronic component mounting substrate, electronic device, and electronic module
JP2022107932A (ja) * 2021-01-12 2022-07-25 モレックス エルエルシー 放熱器及び電子部品モジュール

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JP2008078271A (ja) * 2006-09-20 2008-04-03 Sumitomo Wiring Syst Ltd 放熱構造を備えたプリント基板の製造方法および放熱構造を備えたプリント基板
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CN110622627A (zh) * 2017-05-26 2019-12-27 三菱电机株式会社 半导体装置
JPWO2018216646A1 (ja) * 2017-05-26 2020-01-23 三菱電機株式会社 半導体装置
CN110622627B (zh) * 2017-05-26 2022-08-16 三菱电机株式会社 半导体装置
WO2019193930A1 (ja) * 2018-04-03 2019-10-10 ソニーセミコンダクタソリューションズ株式会社 電子モジュールおよびその製造方法
JPWO2019193930A1 (ja) * 2018-04-03 2021-04-01 ソニーセミコンダクタソリューションズ株式会社 電子モジュールおよびその製造方法

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