WO2016136021A1 - Composant électronique, son procédé de fabrication, et dispositif pour sa fabrication - Google Patents

Composant électronique, son procédé de fabrication, et dispositif pour sa fabrication Download PDF

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Publication number
WO2016136021A1
WO2016136021A1 PCT/JP2015/079941 JP2015079941W WO2016136021A1 WO 2016136021 A1 WO2016136021 A1 WO 2016136021A1 JP 2015079941 W JP2015079941 W JP 2015079941W WO 2016136021 A1 WO2016136021 A1 WO 2016136021A1
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WO
WIPO (PCT)
Prior art keywords
mold
plate
resin
electronic component
mounted substrate
Prior art date
Application number
PCT/JP2015/079941
Other languages
English (en)
Japanese (ja)
Inventor
岩田　康弘
智行 後藤
竹内　慎
Original Assignee
Ｔｏｗａ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ｔｏｗａ株式会社 filed Critical Ｔｏｗａ株式会社
Priority to KR1020177018910A priority Critical patent/KR20170121157A/ko
Priority to CN201580075550.2A priority patent/CN107210271A/zh
Publication of WO2016136021A1 publication Critical patent/WO2016136021A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Definitions

  • the present invention relates to an electronic component, a manufacturing apparatus and a manufacturing method thereof, and more specifically, an electronic component having a plate-like member functioning as an electromagnetic shield plate or a heat sink, a wiring board, and a sealing resin, a manufacturing apparatus and a manufacturing method thereof Regarding the method.
  • This electronic component manufacturing method has the following three steps. First, an electronic element such as a semiconductor element such as an IC (Integrated Circuit) is placed on the upper surface of a wiring board having a surface wiring pattern such as a signal wiring pattern or a ground wiring pattern. Next, it is a step of electrically connecting the connection electrode provided on the upper surface of the electronic element and the surface wiring pattern via a fine metal wire. Next, the electronic element is covered with an insulating sealing resin.
  • a semiconductor element such as an IC (Integrated Circuit) is placed on the upper surface of a wiring board having a surface wiring pattern such as a signal wiring pattern or a ground wiring pattern.
  • the metal wire made of a material softer than the mold used for resin sealing on the upper surface of the metal post.
  • the chip component and the metal post are resin-sealed with a sealing resin.
  • the resin-encapsulated structure obtained in the previous step is a step of cutting into individual devices by dicer or the like and dividing into individual devices.
  • a metal shield case is attached to the separated structure. By this step, the metal wire exposed from the sealing resin and the metal shield case are electrically connected.
  • the process of resin sealing, the step of exposing the ground electrode member, and the step of mounting the metal member are required separately, so that the assembly work of the electronic component is complicated. become.
  • the cost of the processing machine and the labor cost of the operator who operates the processing machine are required to perform each process, the manufacturing cost of the electronic component increases.
  • the present invention has been devised in view of the above-described problems, and provides an electronic component having good heat dissipation, a manufacturing apparatus and a manufacturing method thereof, which can reduce steps when manufacturing an electronic component, shield electromagnetic waves well, and have good heat dissipation.
  • the purpose is to do.
  • An electronic component according to the present invention is obtained by curing an electronic element, a mounted substrate electrically connected to a connection electrode of the electronic element, a ground wiring pattern on a main surface, and a fluid resin.
  • An electronic component comprising a sealing resin that is formed and covers at least the electronic element and the ground wiring pattern, and is fixed to a surface opposite to the mounted substrate in the sealing resin, and has a conductive plate-like member, It is electrically connected in advance to the ground wiring pattern of the mounted substrate, electrically connected to the plate-like member, and has a conductive functional member, and the functional member is covered with a sealing resin. It is characterized by being.
  • An electronic component according to the present invention includes an electronic device, a mounted substrate having a bonding pad electrically connected to a connection electrode of the electronic device on a main surface, and an electronic device formed by curing a fluid resin.
  • An electronic component comprising at least an encapsulating resin, which is fixed to a surface opposite to the mounted substrate in the encapsulating resin, and has a plate-like member having thermal conductivity, and a main surface of the mounted substrate And a functional member that is thermally connected in advance and thermally connected to the plate-like member and has thermal conductivity, and the functional member is covered with a sealing resin.
  • the flowable resin in the electronic component described above, is cured in a state where the mounted substrate presses the conductive member toward the plate-like member, so that the conductive member is electrically connected to the plate-like member. It is characterized by being connected.
  • the flowable resin in the electronic component described above, is cured in a state where the conductive member and the plate-like member are pressed against each other by the compressive stress when the flowable resin is cured.
  • the characteristic member is electrically connected to the plate-like member.
  • An electronic component manufacturing method includes an electronic device, a bonding pad electrically connected to a connection electrode of the electronic device, a ground wiring pattern, and a conductive material electrically connected in advance to the ground wiring pattern.
  • a step of preparing a mounted substrate having a functional member having a main surface on the main surface, a step of preparing a plate member having conductivity, and temporarily mounting the mounted substrate at a predetermined position of the first mold A step, a step of disposing a plate-like member on the inner bottom surface of the cavity provided in the second die opposite to the first die, a step of filling the cavity with a flowable resin, In the process of bringing the plate-shaped member and the functional member into contact with each other by clamping the mold and the second mold, and in a state where the first mold and the second mold are clamped, at least the functional member and the electronic Elements and grau
  • An electronic component manufacturing method includes an electronic element mounted on a main surface, a bonding pad electrically connected to a connection electrode of the electronic element, and a thermal connection that is thermally connected to the main surface in advance.
  • a step of preparing a mounted substrate having a functional member having a property, a step of preparing a plate member having thermal conductivity, and a step of temporarily fixing the mounted substrate at a predetermined position of the first mold And a step of disposing a plate-like member on the inner bottom surface of the cavity provided in the second die opposite to the first die, a step of filling the cavity with the fluid resin, At least the functional member and the electronic element in the step of bringing the plate-shaped member and the functional member into contact with each other by clamping the mold and the second mold, and the first mold and the second mold being clamped And the ground wiring pattern and the main surface of the mounted board
  • the method for manufacturing an electronic component according to the present invention is the above-described method for manufacturing an electronic component, wherein in the step of forming the sealing resin, the flowable resin in a state where the mounted substrate presses the conductive member toward the plate-shaped member. Is cured.
  • the conductive member and the plate-shaped member are brought into contact with each other by compressive stress when the fluid resin is cured.
  • the fluid resin is cured in the pressed state.
  • An apparatus for manufacturing an electronic component according to the present invention includes a mounted substrate having a main surface of an electronic element, a bonding pad electrically connected to a connection electrode of the electronic element, and a ground wiring pattern, and a fluid resin is cured.
  • a sealing resin that covers at least the electronic element and the ground wiring pattern, a plate member that is fixed to the sealing resin and has conductivity, and a ground wiring pattern that the mounted substrate has.
  • An electronic component manufacturing apparatus that manufactures an electronic component including a conductive functional member that is connected and electrically connected to a plate-shaped member, wherein the mounted substrate is temporarily fixed.
  • a second die having a cavity opposite to the first die a plate-like member is disposed on the inner bottom surface of the cavity, and the first die and the second die are clamped
  • the functional member and the plate-like member come into contact with each other, and the first die
  • the fluid resin filled in the cavity is cured to form a sealing resin.
  • An apparatus for manufacturing an electronic component according to the present invention includes a mounted substrate having a main surface of an electronic element, a bonding pad electrically connected to a connection electrode of the electronic element, and a ground wiring pattern, and a fluid resin is cured.
  • a sealing resin that at least covers the electronic element and the ground wiring pattern, a plate member that is fixed to the sealing resin and has thermal conductivity, and a plate that is thermally connected to the mounted substrate in advance.
  • An electronic component manufacturing apparatus for manufacturing an electronic component comprising a functional member thermally connected to a member and having thermal conductivity, wherein a first mold on which a mounted substrate is temporarily fixed; And a second mold having a cavity opposite to the first mold, a plate-like member is disposed on the inner bottom surface of the cavity, and the first mold and the second mold are clamped together.
  • the functional member and the plate-shaped member are in contact with each other, and the first mold and the second mold
  • the fluid resin filled in the cavity is cured to form a sealing resin.
  • An electronic component manufacturing apparatus includes the first alignment unit provided in the plate-like member and the second alignment unit provided in the cavity in the electronic component manufacturing apparatus described above.
  • the plate member and the cavity are aligned by the first alignment portion and the second alignment portion.
  • the electronic component manufacturing apparatus is the above-described electronic component manufacturing apparatus, in which the first mold and the second mold are clamped to conduct electricity by compressive stress when the fluid resin is cured.
  • the fluid resin is cured in a state where the adhesive member and the plate-like member are pressed against each other.
  • an electronic component that has high productivity when manufacturing an electronic component, shields electromagnetic waves well, has good heat dissipation, and can manufacture the electronic component by reducing the conventional manufacturing process. It becomes possible to provide a method and a manufacturing apparatus.
  • FIG. 7 is a schematic cross-sectional view showing a part of the process following FIG. 6, where (a) shows a process of separating a sealed substrate into pieces, and (b) shows an electronic component manufactured in the process of Example 4.
  • FIG. 1 shows the structure of an electronic component 1 according to this embodiment.
  • An electronic component 1 shown in FIG. 1 includes at least a wiring board 2, an electronic element 3, a sealing resin 4, a plate-like member 5 functioning as at least one of an electromagnetic shield plate or a heat sink, a wiring board 2, It has the electroconductive member 6 which connects the plate-shaped member 5 electrically.
  • the wiring board 2 is a laminated body having a rectangular planar shape formed by laminating a plurality of insulating layers and wiring layers. Circuit wiring is formed between both surfaces of the wiring board 2 and the insulating layer, and these circuit wirings are electrically connected to each other via via-hole conductors.
  • Examples of the wiring board 2 include a printed board having a glass epoxy board as a base board and wiring each made of copper, an interlayer wiring, and a via-hole conductor.
  • the main surface of the wiring board 2 has a power supply system pattern and signal and power supply system bonding pads 7.
  • the power supply system pattern includes a + power supply pattern (not shown) and a ground wiring pattern 8.
  • the power supply pattern, the ground wiring pattern 8 and the bonding pad 7 are electrically connected to an external connection conductor (not shown) formed on the lower surface or side surface of the wiring board 2 via a via-hole conductor or the like inside the wiring board 2. Connected to.
  • An electronic element 3 made of a semiconductor element such as an IC (Integrated Circuit) is mounted on the main surface 9 of the wiring substrate 2 using, for example, a die bond material or a conductive resin.
  • a plurality of connection electrodes 10 are formed on the upper surface of the electronic element 3.
  • the connection electrode 10 is electrically connected to the bonding pad 7 by a thin metal wire (wire) 11 having a loop shape.
  • the fine metal wire 11 is made of, for example, Au, Al, Cu or the like, and its diameter is usually 18 ⁇ m to 35 ⁇ m.
  • a conductive member 6 is formed on one surface (main surface; a surface on which a semiconductor element is mounted) of the wiring board 2.
  • the conductive member 6 is used to electrically connect the ground wiring pattern 8 of the wiring board 2 and the plate-like member 5.
  • FIG. 1 shows an example in which the conductive member 6 is connected to the wiring board 2 in the vertical direction by bonding the conductive member 6 to the ground wiring pattern 8 on the main surface of the wiring board 2 using the cream solder 12. Show.
  • the conductive member 6 has a columnar shape, a spiral shape, an arch shape, a loop shape, a ribbon shape, a spherical shape, a strip shape, a foil shape, a wall shape, or the like protruding from one surface of the wiring board 2.
  • the cream solder 12 that electrically connects the conductive member 6 and the ground wiring pattern 8 it is preferable to employ a material having a melting point higher than a molding temperature (curing temperature) by a molding die 14 described later.
  • the cream solder includes, for example, Sn, Ag, Cu, and the like, and is formed on the connection surface of the conductive member 6 and the ground wiring pattern 8 or around the connection surface.
  • the plate-like member 5 that functions as at least one of an electromagnetic shield plate or a heat radiating plate is made of a conductive material such as brass, copper, aluminum, solder, or conductive resin, and has a rectangular or square planar shape.
  • the plate-like member 5 is disposed so as to face the main surface 9 of the wiring board 2.
  • brass, copper, aluminum, solder, conductive resin or the like is formed in a film shape on at least one surface of the plate-like insulating material by a method such as electroless plating, vapor deposition, or screen printing. Other members may be used.
  • As the conductive member 6, a metal plate having a wall shape can be used.
  • the metal plate for example, a thin plate made of Cu, Al, galvanized steel plate, brass or the like can be used.
  • the shape of the plate-like member 5 may be a box shape in which a wall is provided on the plate. In this case, in FIG. 1, it is preferable that the wall portion extends downward from the left and right ends or the middle portion of the plate-like member 5 and the lower end of the wall portion and the ground wiring pattern 8 are electrically connected.
  • the sealing resin 4 seals the electronic element 3, the connection electrode 10, the fine metal wire 11, the + power supply pattern (not shown), the ground wiring pattern 8, the bonding pad 7, the main surface 9 of the wiring substrate 2, and the conductive member 6.
  • a resin for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin is used.
  • the electronic component 1 is manufactured by resin-sealing a mounted substrate 13 on which at least the electronic element 3 and the conductive member 6 shown in FIG.
  • a molding die 14 for resin sealing shown in FIG. 2B has an upper die 15 and a lower die 16.
  • the upper mold 15 has at least one of a fixture (not shown) or a suction mechanism (not shown) that fixes the mounted substrate 13.
  • the lower mold 16 has a cavity 17. Protrusions 18 for aligning the plate-like member 5 with respect to the cavity 17 are provided at the corners of the bottom surface in the cavity 17.
  • the first member is a mounted substrate 13. At least the electronic element 3 and the conductive member 6 are mounted on the mounted substrate 13.
  • the connection electrode 10 of the electronic element 3 and the power supply system pattern and the bonding pad 7 of the wiring board 2 are electrically connected by the thin metal wire 11.
  • the conductive member 6 is electrically connected to at least a part of the ground wiring pattern 8 of the wiring board 2 by cream solder 12.
  • the second member is a plate-like member 5.
  • a notch 19 for alignment is formed in advance at the corner of the plate-like member 5.
  • Cream solder 20 is applied in advance to the surface (joint surface) to which the conductive member 6 is joined in the plate-like member 5.
  • the cream solder 20 it is preferable to employ a material having a melting point lower than the curing temperature (for example, about 180 ° C.) in resin molding, in other words, the low melting point cream solder 20.
  • the cream solder 20 is melted at the curing temperature. Therefore, the plate-like member 5 to which the cream solder 20 is applied is in a state where the conductive member 6 can be joined by being placed in the molding die 14 heated to about 180 ° C. in advance.
  • the mounted substrate 13 is temporarily fixed to a predetermined position in the upper mold 15 by a fixing tool or a suction mechanism.
  • the predetermined position is a position where the cavity 17 is included in the main surface 9 of the mounted substrate 13 (main surface 9 of the wiring board 2) in plan view.
  • the protrusion 18 of the cavity 17 and the plate-like member 5 are cut.
  • the cavity 17 and the plate member 5 are aligned by the notch 19 (see FIG. 2A), and the plate member 5 is arranged.
  • an insulating liquid resin 21 that is liquid at room temperature so as to cover the plate-like member 5 disposed on the inner bottom surface of the cavity 17 (see FIG. 3C).
  • Inject flowable resin
  • the liquid resin 21 for example, a thermosetting resin is used.
  • the upper die 15 and the lower die 16 are clamped from the state shown in FIG. 3A as shown in FIG. 3B.
  • the conductive member 6 mounted on the main surface 9 of the mounted substrate 13 is immersed (immersed) in the liquid resin 21 injected into the cavity 17.
  • the electronic element 3 on the main surface 20 of the mounted substrate 13, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the fine metal wires 11, and the main surface of the mounted substrate 13 are made of liquid resin. Immerse in 21 (soak).
  • the conductive member 6 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds).
  • the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while pressurizing the liquid resin 21.
  • a heater not shown
  • the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.
  • the upper mold 15 and the lower mold 16 are opened.
  • the lower mold 16 and the sealed substrate 22 having the molded sealing resin 4 are separated.
  • the melted cream solder 20 is cured.
  • the electronic component 1 composed of the sealed substrate 22 is completed through the steps so far.
  • the cream solder 20 is applied to the joining surface of the plate-like member 5 to which the conductive member 6 is joined.
  • the cream solder 20 is heated to melt the cream solder 20. This ensures that the conductive member 6 is brought into contact with the plate-like member 5 in a state where the melted cream solder 20 exists on the end surface (lower surface in the drawing) of the conductive member 6 and the side surface around the end surface.
  • the liquid resin 21 is cured.
  • the melted cream solder 20 is cured.
  • the plate-like member 5 and the ground wiring pattern 8 can be reliably electrically connected by the conductive member 6 and the solder cream 12 that has already been cured and the solder that the cream solder 20 has cured.
  • the cream solder melted in the process in which the conductive member 6 bent (deformed) pressed by the compressive stress when the liquid resin 21 is cured contacts the plate-like member 5 and the electronic component 1 is cooled. 20 is cured. Therefore, the plate-like member 5 and the ground wiring pattern 8 can be more reliably electrically connected.
  • Cream solder 12 has a melting point higher than the curing temperature. Since the cream solder 12 maintains the cured state in the steps after the step of heating and curing the liquid resin 21, the state where the conductive member 6 is fixed is maintained. Therefore, since the conductive member 6 is prevented from being displaced, the plate-like member 5 and the ground wiring pattern 8 can be electrically connected more reliably.
  • the electrical connection between the plate member 5 and the ground wiring pattern 8 and the fixing of the plate member 5 are performed in parallel. Therefore, productivity when manufacturing the electronic component 1 is improved.
  • the shape of the plate-like member 5 is a box shape, the electronic component 1 having a property of shielding electromagnetic waves well and a good heat dissipation property can be obtained.
  • the conductive member 6 and the plate-like member 5 each have conductivity.
  • the plate-like member 5 is a functional member having an electromagnetic shielding function.
  • Embodiment 2 of the present invention will be described in detail with reference to FIG.
  • the manufacturing method of the electronic component 1 in the present embodiment is a method of manufacturing the electronic component 1 using the conductive member 23 different from the first embodiment.
  • the conductive member 23 is constituted by a plurality of loop-shaped metal thin wires formed in the vertical direction formed by well-known wire bonding on the ground wiring pattern of the wiring board 2.
  • the These fine metal wires are made of, for example, a metal material such as Au or Al, and preferably have a thickness equal to or greater than the diameter of the fine metal wires 11 that connect the connection electrodes 10 and the bonding pads 7.
  • the thickness of the conductive member 23 is set to 100 ⁇ m to 500 ⁇ m, for example.
  • the conductive member 23 is formed so as to surround the electronic element 3. Cream solder 20 is applied to the plate-like member 5 in advance at a location where the conductive member 23 is joined. In the present embodiment, these two members (intermediates) will be described as examples.
  • the first member is a mounted substrate 24 in which a conductive member 23 is formed on the wiring substrate 2.
  • the mounted substrate 24 is disposed at a predetermined position in the upper mold 15.
  • the predetermined position is a position where the cavity 17 (see FIG. 4C) is included in the main surface of the mounted substrate 24 in plan view.
  • the second member is a plate-like member 5.
  • the plate member 5 is disposed on the inner bottom surface of the cavity 17 of the lower mold 16.
  • a liquid resin 21 is injected into the cavity 17 of the lower mold 16 so as to cover the plate-like member 5.
  • the upper mold 15 and the lower mold 16 are clamped.
  • the conductive member 23 mounted on the main surface of the mounted substrate 24 is immersed (immersed) in the liquid resin 21 injected into the cavity 17.
  • the electronic device 3, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the metal thin wire 11, and the main surface 25 of the mounted substrate 24 on the main surface 25 of the mounted substrate 24 are liquid resin. Immerse in 21 (soak).
  • the conductive member 23 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds).
  • the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while the liquid resin 21 is pressurized. As a result, as shown in FIGS. 4A and 4B, the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.
  • the upper mold 15 and the lower mold 16 are opened.
  • the lower mold 16 and the sealed substrate 26 having the molded sealing resin 4 are separated.
  • the melted cream solder 20 is cured.
  • the electronic component 1 composed of the sealed substrate 26 is completed through the steps so far.
  • the same effect as in the first embodiment can be obtained.
  • an existing wire bonding apparatus used for connecting the connection electrode 10 and the bonding pad 7 shown in FIG. 1 can be used. Therefore, the electronic component 1 which has the characteristic which shields electromagnetic waves favorably, and favorable heat dissipation can be manufactured by utilizing the existing manufacturing apparatus.
  • Embodiment 3 of the present invention will be described in detail based on FIG.
  • the manufacturing method of the electronic component 1 in the present embodiment is a method of manufacturing the electronic component 1 using the conductive member 27 different from the first embodiment and the second embodiment.
  • the conductive member 27 is arranged on the ground wiring pattern of the wiring board 2 so as to completely surround the electronic element 3 and is fixed by the cream solder 12. It is a member.
  • the conductive member 27 completely surrounds a part (one or a plurality, shown on the right side in the drawing) of the plurality of electronic elements 3 on the mounted substrate 28.
  • the first member is a mounted substrate 28 in which a conductive member 27 is formed on the wiring substrate 2.
  • the conductive member 27 shown in FIG. 5A has a square bracket ([) -like cross-sectional shape having portions bent at both ends.
  • a plurality of electronic elements 3 are mounted on the mounted substrate 28.
  • the mounted substrate 28 is disposed at a predetermined position in the upper mold 15. The predetermined position is a position where the cavity 17 (see FIG. 5C) is included in the main surface 29 of the mounted substrate 28 in plan view.
  • the second member is a plate-like member 5.
  • a notch 19 for alignment (see FIG. 2A) is formed in advance at opposite corners of the plate-like member 5.
  • the inner bottom surface of the cavity 17 has a protrusion 18 at a position corresponding to the notch 19 for alignment of the plate-like member 5.
  • the plate-like member 5 is arranged on the inner bottom surface of the cavity 17 of the lower mold 16.
  • the liquid resin 21 is injected into the cavity 17 of the lower mold 16 so as to cover the plate-like member 5.
  • the upper mold 15 and the lower mold 16 are clamped.
  • the conductive member 27 mounted on the main surface 29 of the mounted substrate 28 is immersed (immersed) in the liquid resin 21 injected into the cavity 17.
  • the electronic device 3, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the metal thin wire 11, and the main surface 29 of the mounted substrate 28 on the main surface 29 of the mounted substrate 28 are liquid resin. Immerse in 21 (soak).
  • the conductive member 27 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds).
  • the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while pressurizing the liquid resin 21.
  • a heater not shown
  • the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.
  • the upper mold 15 and the lower mold 16 are opened. Thereby, the lower mold 16 and the sealed substrate 22 having the molded sealing resin 4 are separated. In the process in which the sealed substrate 22 is cooled, the melted cream solder 20 is cured. The electronic component 1 composed of the sealed substrate 22 is completed through the steps so far.
  • the conductive member 6 is mounted so as to partially surround the electronic element 3.
  • This electronic component 1 is a manufacturing method employed when manufacturing a mounted substrate 13 having a plurality of electronic elements 3.
  • specific electronic elements 3 one or more having characteristics such as being susceptible to electromagnetic influence, being easily affected by electromagnetic influence, and generating a large amount of heat are targeted. Can be shielded or dissipated.
  • Examples of the electronic element 3 that is easily affected by electromagnetic waves and the electronic element 3 that generates a large amount of heat include a power control element that switches a large current.
  • an element used in a circuit that handles a high-frequency signal can be cited.
  • a conductive module 6 may partially surround a circuit module including a plurality of electronic elements 3.
  • Embodiment 4 of the present invention will be described in detail with reference to FIGS.
  • the manufacturing method of the electronic component 1 in the present embodiment is a method of manufacturing the electronic component 1 using the conductive member 30 different from the first, second, and third embodiments. According to the present embodiment, it is possible to manufacture a plurality of electronic components 1 by mounting at least two or more electronic elements 3 on the wiring board 2 and separating the sealed substrate 22 sealed with resin. it can.
  • the conductive member 30 is disposed on the ground wiring pattern 8 of the wiring board 2 so as to completely surround the electronic element 3 and is fixed to the cream solder 12. It is a member.
  • the plurality of conductive members 30 surround each of the plurality of electronic elements 3 on the mounted substrate 31.
  • the first member is a mounted substrate 31 in which the conductive member 30 is formed on the wiring substrate 2.
  • a plurality of electronic elements 3 are mounted on the mounted substrate 31.
  • the second member is a plate-like member 5.
  • the mounted substrate 31 is arranged at a predetermined position in the upper mold 15.
  • the predetermined position is a position where the cavity 17 (see FIG. 6C) is included in the main surface of the mounted substrate 31 in plan view.
  • the plate-like member 5 is disposed on the inner bottom surface of the cavity 17 of the lower mold 16. A liquid resin 21 is injected into the cavity 17 of the lower mold 16 so as to cover the plate-like member 5.
  • the upper mold 15 and the lower mold 16 are clamped.
  • the conductive member 30 mounted on the main surface of the mounted substrate 31 is immersed (immersed) in the liquid resin 21 injected into the cavity 17.
  • the electronic device 3, the bonding pad 7, the + power supply pattern (not shown), the ground wiring pattern 8, the metal thin wire 11, and the main surface of the mounted substrate 31 on the main surface of the mounted substrate 31 are made into the liquid resin 21. Immerse (soak).
  • the conductive member 6 is brought into contact with the plate member 5. Hold the clamped state for a certain time (at least 20 seconds).
  • the liquid resin 21 is heated at a predetermined curing temperature using a heater (not shown) provided in the lower mold 16 while the liquid resin 21 is pressurized. As a result, as shown in FIGS. 6A and 6B, the liquid resin 21 is cured to form the sealing resin 4 made of the cured resin.
  • the upper mold 15 and the lower mold 16 are opened.
  • the lower mold 16 and the sealed substrate 22 having the molded sealing resin 4 are separated.
  • the melted cream solder 20 is cured.
  • the sealed substrate 22 is temporarily fixed to a stage (not shown). Using the rotary blade 32, the sealed substrate 22 is cut along the Y direction and the X direction in a lattice-shaped dicing line 33 virtually provided on the sealed substrate 22. As a result, the sealed substrate 22 is separated into individual pieces. As shown in FIG. 7B, the sealed substrate 22 is separated into pieces, and the electronic component 1 is completed.
  • the same effect as in the first embodiment can be obtained.
  • a plurality of electronic components 1 are manufactured from one sealed substrate 22. Therefore, the productivity when manufacturing the electronic component 1 is further improved.
  • compression molding is given as an example when sealing with resin.
  • Transfer molding or injection molding may be used as the molding method.
  • a cavity 17 may be provided in one or both of the upper mold 15 and the lower mold 16 of the mold 14.
  • the shape of the inner bottom surface of the cavity 17 is made the same as the planar shape of the plate-like member 5 and slightly larger than the planar shape.
  • a concave portion or a hole is formed in advance in the plate-like member 5 by press working or the like, and a pin or a protrusion 18 having a shape corresponding to the concave portion or the hole is provided in advance on the inner bottom surface of the cavity 17.
  • a protrusion is formed in advance on the plate-like member 5 by press working or the like, and a recess having a shape corresponding to the protrusion is provided on the inner bottom surface of the cavity 17 in advance.
  • the cross-sectional shape of the conductive member 6 may be a line segment.
  • the cross-sectional shape of the conductive member 6 is preferably an “L” shape having a portion bent at one end.
  • the cross-sectional shape of the conductive member 6 is more preferably a shape such as square brackets ([) having portions bent at both ends (see FIG. 5).
  • the surface of the bent portion (hereinafter referred to as “bent portion”) is the ground wiring pattern 8. In surface contact.
  • the conductive member 6 with the bent portion is reliably electrically connected to the ground wiring pattern 8.
  • a portion in contact with the ground wiring pattern 8 and the plate-like member 5 is preferably surface-treated.
  • the surface treatment of the conductive member 6 solder plating, coating with a conductive resin, or the like can be used depending on the material.
  • the end face connected to the plate-like member 5 in the conductive member 6 may be a surface having a fine uneven shape or a fine acute angle shape. These shapes bite into the surface of the plate-like member 5 when the conductive member is pressed against the plate-like member while being bent by the compressive stress when the liquid resin 21 is cured in a state where the mold is clamped. Resin sealing is performed in a state in which these shapes bite into the surface of the plate-like member 5. Thereby, the plate-like member 5 and the conductive member 6 can be electrically connected without interposing the cream solder 20 between the plate-like member 5 and the conductive member 6.
  • liquid resin 21 is taken as an example.
  • solid resin materials such as granules, powders, and tablets may be used. In this case, the resin material is heated and melted to produce a fluid resin made of a molten resin.
  • the planar shape of the sealing resin 4 may be other than a rectangle.
  • the shape of the plate-like member 5 may be other than a rectangle.
  • Examples of the shape other than the rectangle include a circle, a shape provided with a portion protruding toward the outside of the circle, a shape provided with a portion cut out toward the inside of the circle, and the like.
  • the electronic element 3 a memory, a power transistor, a power diode, a CMOS sensor, or the like may be used.
  • the electronic element 3 includes a connector, a battery, a sensor, and the like.
  • the electronic element 3 includes passive elements such as resistors, capacitors, and inductors, crystal oscillators, filters, and the like. In addition, the electronic element 3 and the passive element may be combined.
  • wire bonding is taken as an example.
  • Flip chip bonding or the like may be used in the connection method.
  • a foil or a thin plate made of Cu, Al or the like and having an appropriate base portion and a rising portion may be attached to the plate member.
  • a conductive fluid material such as a conductive resin may be discharged onto the wiring board 2 using a nozzle.
  • the wiring substrate 2 may be a ceramic substrate, a metal base substrate, a lead frame, or the like.
  • a metal base substrate may be used.
  • the metal that is the base material of the metal base substrate is usually used at a ground potential.
  • a projecting member may be disposed in a portion other than the ground wiring pattern 8 and in an electrically neutral portion instead of the conductive member 6. It is preferable that the projecting member and the plate-like member 5 have high thermal conductivity. In this case, the plate-like member 5 is a functional member having a heat dissipation function.
  • the conductive member 6 bonded to the ground wiring pattern 8 part of the mounted substrate 13 by applying the cream solder 12 is taken as an example.
  • cream solder 12 solder plating may be used.
  • a frame-shaped member surrounding the electronic component 1 may be used as the conductive member 6.
  • a metal plate having a plate shape (wall shape) partially surrounding the electronic element 3 may be used.
  • the step of arranging 5 on the inner bottom surface of the cavity 17 of the lower mold 16 may be interchanged.
  • the step of mounting the conductive member 6 (including wire bonding in the second embodiment) and the electronic element 3 (chip) are mounted.
  • the step of wire bonding may be interchanged.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Selon la présente invention, un substrat à composant monté (13), sur une surface principale (9) duquel sont fixés un élément électronique (3) et un élément conducteur saillant (6), est disposé sur un moule supérieur (15). Un élément du type plaque (5), portant une crème à braser (20) appliquée à l'avance sur une partie qui entrera en contact avec l'élément conducteur (6), est disposé sur la surface inférieure interne d'une cavité (17) d'un moule inférieur (16). Une résine liquide (21) est versée dans la cavité (17), et le moule supérieur (15) et le moule inférieur (16) sont serrés l'un contre l'autre de manière que l'élément conducteur (6), un fil métallique fin (11), l'élément électronique (3), une plage de connexion (7) et la surface principale (9) du substrat à composant monté (13) soient immergés dans la résine liquide (21), et de manière que l'élément conducteur (6) entre en contact avec l'élément du type plaque (5) avec la crème à braser (2) intercalée entre eux. La résine liquide (21) est durcie pour former une résine d'étanchéité (4), moyennant quoi un substrat étanche (22) est achevé. L'élément conducteur (6) et l'élément du type plaque (5) sont électriquement connectés l'un à l'autre de façon fiable par la crème à braser (20) dans un état où l'élément conducteur (6) est poussé contre l'élément du type plaque (5) en raison d'une contrainte de compression causée par le durcissement de la résine liquide (21).
PCT/JP2015/079941 2015-02-27 2015-10-23 Composant électronique, son procédé de fabrication, et dispositif pour sa fabrication WO2016136021A1 (fr)

Priority Applications (2)

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KR1020177018910A KR20170121157A (ko) 2015-02-27 2015-10-23 전자 부품, 그 제조 방법 및 제조 장치
CN201580075550.2A CN107210271A (zh) 2015-02-27 2015-10-23 电子部件及其制造方法和制造装置

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JP2015038968A JP6400509B2 (ja) 2015-02-27 2015-02-27 電子部品の製造方法

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107808854A (zh) * 2016-09-09 2018-03-16 东和株式会社 电子电路装置及电子电路装置的制造方法
WO2018061722A1 (fr) * 2016-09-30 2018-04-05 株式会社村田製作所 Module à antenne intégrée et dispositif de communication
KR20180119194A (ko) * 2017-04-24 2018-11-02 이엘케이 주식회사 지문인식센서 모듈의 제조방법 및 이로부터 제조된 지문인식센서 모듈
US20190252343A1 (en) * 2018-02-13 2019-08-15 Samsung Electronics Co., Ltd. Stack tool for reflow and stack apparatus having the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6654994B2 (ja) * 2016-10-31 2020-02-26 Ｔｏｗａ株式会社 回路部品の製造方法
JP2018113399A (ja) * 2017-01-13 2018-07-19 Ｔｏｗａ株式会社 回路部品の製造方法および回路部品
JP6798472B2 (ja) * 2017-11-15 2020-12-09 オムロン株式会社 電子装置およびその製造方法
JP2020004840A (ja) * 2018-06-28 2020-01-09 アルパイン株式会社 電子ユニットおよびその製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4519398B2 (ja) * 2002-11-26 2010-08-04 Ｔｏｗａ株式会社 樹脂封止方法及び半導体装置の製造方法
WO2013035714A1 (fr) * 2011-09-07 2013-03-14 株式会社村田製作所 Procédé de production de module et bornier

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003249607A (ja) * 2002-02-26 2003-09-05 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107808854A (zh) * 2016-09-09 2018-03-16 东和株式会社 电子电路装置及电子电路装置的制造方法
WO2018061722A1 (fr) * 2016-09-30 2018-04-05 株式会社村田製作所 Module à antenne intégrée et dispositif de communication
KR20180119194A (ko) * 2017-04-24 2018-11-02 이엘케이 주식회사 지문인식센서 모듈의 제조방법 및 이로부터 제조된 지문인식센서 모듈
KR101958925B1 (ko) * 2017-04-24 2019-03-19 이엘케이 주식회사 지문인식센서 모듈의 제조방법 및 이로부터 제조된 지문인식센서 모듈
US20190252343A1 (en) * 2018-02-13 2019-08-15 Samsung Electronics Co., Ltd. Stack tool for reflow and stack apparatus having the same
US10833046B2 (en) * 2018-02-13 2020-11-10 Samsung Electronics Co., Ltd. Stack tool for reflow and stack apparatus having the same

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CN107210271A (zh) 2017-09-26
TW201637149A (zh) 2016-10-16
JP2016162840A (ja) 2016-09-05
JP6400509B2 (ja) 2018-10-03

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