WO2018061722A1 - Module à antenne intégrée et dispositif de communication - Google Patents

Module à antenne intégrée et dispositif de communication Download PDF

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Publication number
WO2018061722A1
WO2018061722A1 PCT/JP2017/032614 JP2017032614W WO2018061722A1 WO 2018061722 A1 WO2018061722 A1 WO 2018061722A1 JP 2017032614 W JP2017032614 W JP 2017032614W WO 2018061722 A1 WO2018061722 A1 WO 2018061722A1
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WO
WIPO (PCT)
Prior art keywords
antenna
conductor
built
module
conductive film
Prior art date
Application number
PCT/JP2017/032614
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English (en)
Japanese (ja)
Inventor
伊東　祐一
貴洋 渡辺
伸充 天知
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018061722A1 publication Critical patent/WO2018061722A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present invention relates to a module with a built-in antenna and a communication device, and particularly relates to a module with a built-in antenna including an antenna conductor and an electronic component, and a communication device including the module with a built-in antenna.
  • Patent Document 1 discloses an antenna built-in module including an antenna conductor and an RF (Radio Frequency) circuit (electronic component).
  • the antenna conductor and the RF circuit are arranged on the wiring board so as not to overlap.
  • the antenna conductor and the RF circuit are sealed with a sealing resin.
  • a conductive paste is applied to the region of the upper surface of the sealing resin that covers the electronic component and the side surface of the sealing resin.
  • An RF circuit shield is formed by a conductive paste applied to the sealing resin (see Patent Document 1).
  • the present invention has been made to solve such a problem, and an object of the present invention is to form a shield for an electronic component and a radiation characteristic of the antenna in a module with a built-in antenna including an antenna conductor and an electronic component. It is to suppress the decrease of.
  • the antenna built-in module includes a wiring board, an antenna conductor, an electronic component, a sealing resin, a first conductive film, and at least one first columnar conductor.
  • the wiring board includes a ground layer.
  • the antenna conductor is provided on the wiring board.
  • the electronic component is provided on the wiring board in a region that does not overlap with the antenna conductor.
  • the sealing resin is formed so as to seal the antenna conductor and the electronic component.
  • the first conductive film is formed in a region covering the electronic component on the upper surface of the sealing resin.
  • the first columnar conductor electrically connects the first conductive film and the ground layer.
  • the first columnar conductor is provided between the antenna conductor region and the electronic component region.
  • the first columnar conductor forms a shield for the electronic component together with the first conductive film and the ground layer.
  • the module with a built-in antenna further includes a second conductive film.
  • the second conductive film is formed on the side surface of the sealing resin positioned rearward when the direction of the antenna conductor is the front as viewed from the electronic component.
  • the conductive film is not formed on the side surface of the sealing resin other than the side surface on which the second conductive film is formed.
  • the first columnar conductor forms a shield for the electronic component together with the first and second conductive films and the ground layer.
  • the module with a built-in antenna includes at least two first columnar conductors.
  • the module with a built-in antenna includes at least three first columnar conductors.
  • the first columnar conductor is disposed on the wiring board and is provided so as to surround the electronic component in plan view.
  • the module with a built-in antenna further includes a third conductive film and a second columnar conductor.
  • the third conductive film is formed in a band shape in a region of the upper surface of the sealing resin that covers the antenna conductor.
  • the second columnar conductor electrically connects the third conductive film and the antenna conductor.
  • An antenna is formed by the third conductive film, the second columnar conductor, and the antenna conductor.
  • the thickness of the sealing resin in the region where the third conductive film is not formed in the region covering the antenna conductor in the upper surface of the sealing resin is that of the region where the third conductive film is formed. It is thinner than the thickness of the sealing resin.
  • the module with a built-in antenna further includes a connection terminal.
  • the connection terminal is directly or indirectly connected to the set substrate outside the antenna built-in module.
  • the antenna conductor and the electronic component input and output signals through the connection terminals.
  • a communication device includes an antenna built-in module including the connection terminal, a set substrate, and a matching element outside the antenna built-in module.
  • the matching element is an element that matches the impedance on the antenna built-in module side with the impedance on the set substrate side.
  • the antenna built-in module and the matching element are mounted on a set substrate.
  • the antenna built-in module including the antenna conductor and the electronic component, it is possible to form a shield for the electronic component and to suppress a decrease in the radiation characteristics of the antenna.
  • FIG. 5 is a VV cross-sectional view of FIG. 2. It is a figure for demonstrating the example of mounting to the communication apparatus of the module with a built-in antenna.
  • FIG. 4 is a view showing a manufacturing process of the antenna built-in module from the direction of the VII-VII cross section of FIG. 3.
  • FIG. 4 is a diagram showing a manufacturing process of the antenna built-in module from the direction of the section VIII-VIII in FIG. 3. It is a figure for demonstrating the other advantage by the electroconductive film
  • FIG. 14 is a sectional view taken along line XIV-XIV in FIG. 11.
  • FIG. 1 is a perspective view showing a module with a built-in antenna according to the first embodiment from the front.
  • FIG. 2 is a perspective view showing the module with a built-in antenna according to the first embodiment from the rear.
  • FIG. 3 is a diagram showing components mounted on the wiring board of the antenna built-in module according to the first embodiment from above.
  • an arrow D indicates a vertically downward direction
  • an arrow U indicates a vertically upward direction
  • Arrow F indicates the front direction of the module with a built-in antenna
  • arrow B indicates the rear direction of the module with a built-in antenna
  • Arrows L and R respectively indicate the left direction and the right direction of the antenna built-in module.
  • the antenna built-in module 1 is a wireless communication module mounted on a set substrate of a communication device (not shown) such as a smartphone.
  • the antenna built-in module 1 includes, for example, a communication system that performs communication compliant with LTE (Long Term Evolution) standards, wireless LAN standards, and Bluetooth (registered trademark).
  • the antenna built-in module 1 includes a wiring board 10 and a sealing resin 20 formed on the wiring board 10.
  • An antenna conductor 12, an electronic component 14, and a columnar conductor 16 are mounted on the wiring board 10 (FIG. 3).
  • the antenna conductor 12 has a shape corresponding to a frequency band used for wireless communication, and is made of metal.
  • the antenna conductor 12 is an antenna pattern provided on the wiring board 10, for example.
  • the electronic component 14 is, for example, an RF (Radio Frequency) circuit.
  • the RF circuit can include, for example, an RFIC (Radio Frequency Integrated Circuit), a switch IC, a filter element, a resistor, an inductor, a capacitor, and the like.
  • the columnar conductor 16 is, for example, a pole (column) or a pin made of metal.
  • the sealing resin 20 is formed so as to seal the antenna conductor 12, the electronic component 14, and the columnar conductor 16.
  • the sealing resin 20 is formed, for example, by filling the wiring substrate 10 with a thermosetting resin such as an epoxy resin or a cyanate resin.
  • the upper surface 26 of the antenna built-in module 1 includes an antenna region 22 and an electronic circuit region 24.
  • An antenna conductor 12 is provided below the antenna region 22 (in the direction of arrow D), and an electronic component 14 and a columnar conductor 16 are provided below the electronic circuit region 24.
  • the conductive film 23 is formed, while in the antenna region 22, the conductive film is not formed.
  • the conductive film 23 is formed, for example, by sputtering a metal such as stainless steel or by photolithography.
  • the conductive film 23 is formed for the purpose of shielding noise radiated from the electronic component 14. Since the conductive film is not formed above the antenna conductor 12 (in the direction of the arrow U), the deterioration of the radiation characteristics of the antenna conductor 12 due to the conductive film is suppressed.
  • the conductive film 28 is formed on the rear side surface 40 of the antenna built-in module 1.
  • the wiring board 10 includes a via conductor 17 (described later) and a ground layer 19 (ground layer) formed of metal.
  • the conductive film 28 is formed in the rear side surface 40 in a region from the upper end to at least the ground layer 19. Similarly to the conductive film 23, the conductive film 28 is also formed for the purpose of shielding noise emitted from the electronic component 14.
  • the side surface (the surface on which the conductive film 28 is formed) of the sealing resin 20 included in the rear side surface 40 is located rearward when the direction of the antenna conductor 12 is the front as viewed from the electronic component 14. It can also be said to be a side surface of the sealing resin 20.
  • the conductive film is not formed on the other side surfaces (front side surface 30, left side surface 32, right side surface 42) of the antenna built-in module 1.
  • a columnar conductor 16 is provided on a portion of the wiring board 10 where via conductors 17 (described later) are arranged. Each columnar conductor 16 is connected to the ground layer 19 via a via conductor 17. The upper end of each columnar conductor 16 is connected to the conductive film 23.
  • the electronic component 14 is disposed in a region A1 surrounded by the two columnar conductors 16 and the conductive film 28.
  • the electronic component 14 is sandwiched between the conductive film 23 and the wiring substrate 10 (ground layer 19) in the vertical direction. That is, the electronic component 14 is surrounded by the ground layer 19, the two columnar conductors 16, the via conductors 17 that connect the columnar conductors to the ground layer 19, and the conductive films 23 and 28.
  • the shield of the electronic component 14 is formed by these.
  • the widest gap (a finite-length opening) in this shield is a region between the two columnar conductors 16. Therefore, the finite-length opening functions as a shield with respect to noise whose quarter wavelength is longer than the distance between the two columnar conductors 16.
  • each columnar conductor 16 is provided in a region between the antenna conductor 12 and the electronic component 14 in the arrangement direction of the antenna conductor 12 and the electronic component 14. Therefore, the columnar conductor 16 can shield noise radiated from the electronic component 14 toward the antenna conductor 12.
  • FIG. 4 is a bottom view of the module with a built-in antenna according to the first embodiment. Referring to FIG. 4, a plurality of connection terminals 18 are exposed on the lower surface side of wiring board 10.
  • connection terminal 18 can be directly or indirectly connected to an external set substrate of the antenna built-in module 1.
  • the antenna conductor 12 and the electronic component 14 input and output signals through the connection terminals 18.
  • the input / output terminals of the antenna conductor 12 included in the connection terminal 18 and the input / output terminals of the electronic component 14 included in the connection terminal 18 are connected to each other via, for example, a matching element outside the antenna built-in module 1.
  • the user of the module with a built-in antenna 1 can measure the input / output characteristics of the electronic component 14 only by looking at the input / output signals of the input / output terminals of the electronic component 14 included in the connection terminal 18.
  • FIG. 5 is a VV cross-sectional view of FIG. With reference to FIG. 5, as described above, the electronic component 14 is surrounded by the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28. Therefore, as described above, the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 form a shield for the electronic component 14.
  • FIG. 6 is a diagram for explaining an example of mounting the module with a built-in antenna according to the first embodiment on a communication device.
  • antenna built-in module 1 is mounted on set substrate 150.
  • Other electronic components 160 are mounted on the set substrate 150.
  • a matching element for matching the impedance on the antenna built-in module 1 side and the impedance on the set substrate 150 side can be used.
  • the antenna built-in module 1 does not include a matching element, and the communication device 100 uses a matching element outside the antenna built-in module 1. Therefore, when connecting the module with a built-in antenna 1 to the set substrate 150, the user selects a matching element according to the mounting state of the module with a built-in antenna 1 on the set substrate 150 (such as a noise state of surrounding electronic components). Can do.
  • the electronic component 14 is formed by forming a conductive film on the entire left side surface 32 and right side surface 42 without providing the columnar conductor 16. It is also conceivable to form a shield.
  • the electronic component 14 is surrounded by the conductive film 23, the conductive films formed on the left side surface 32 and the right side surface 42, and the ground layer 19. Since the conductive film 23, the conductive films formed on the left side surface 32 and the right side surface 42, and the ground layer 19 are all conductive materials, they form a shield for the electronic component 14.
  • a conductive film is also formed on the side surface of the sealing resin 20 that seals the antenna conductor 12 (the front side portion of the left side surface 32 and the right side surface 42).
  • the radiation characteristics of the antenna conductor 12 deteriorate.
  • the In this module 1 with a built-in antenna for example, the side surface (front side surface 30, left side surface 32, right side surface 42) other than the side surface on which the conductive film 28 is formed among the side surfaces of the sealing resin 20 is conductive.
  • the characteristic film is not formed. Therefore, for example, the radiation characteristics of the antenna conductor 12 are not adversely affected by the conductive films on the left side surface 32 and the right side surface 42. Therefore, according to the module 1 with a built-in antenna, it is possible to form a shield for the electronic component 14 and to suppress a decrease in radiation characteristics of the antenna conductor 12.
  • FIG. 7 is a diagram showing the manufacturing process of the antenna built-in module according to the first embodiment from the direction of the VII-VII cross section of FIG.
  • FIG. 8 is a diagram showing the manufacturing process of the antenna built-in module according to the first embodiment from the direction of the VIII-VIII cross section of FIG.
  • the antenna conductor 12, the electronic component 14, and the columnar conductor 16 are mounted on the wiring board 10.
  • the columnar conductor 16 is connected to the ground layer 19 through a via conductor 17 provided in the wiring board 10 (FIGS. 7A and 8A).
  • the sealing resin 20 is filled on the wiring substrate 10 on which the antenna conductor 12 and the like are mounted (FIGS. 7B and 8B).
  • the sealing resin 20 and the columnar conductor 16 are cut out so that the thickness of the sealing resin 20 becomes a predetermined thickness.
  • the predetermined thickness is a thickness at which at least the columnar conductor 16 is exposed to the outside (FIGS. 7C and 8C).
  • the sealing resin 20 and the back of the wiring substrate 10 are half-cut to form the grooves 29.
  • the depth of the groove 29 is a depth that reaches at least the ground layer 19 (FIGS. 7D and 8D).
  • a conductive film 23 is formed and the conductive material is filled in the grooves 29 (FIGS. 7E and 8E). .
  • the conductive film formed in the antenna region 22 is deleted (FIG. 7 (f), FIG. 8 (f)).
  • the back of the wiring board 10 is fully cut, and the front, left, and right sides of the wiring board 10 and the sealing resin 20 are fully cut, whereby the antenna built-in module 1 is completed (FIG. 7). (G), FIG. 8 (g)).
  • the electronic component 14 is surrounded by the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28. That is, a finite length opening or a conductive surface of a conductor is formed in each of the electronic component 14 in the vertical and horizontal directions. Therefore, the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 form a shield for the electronic component 14.
  • the antenna built-in module 1 no conductive film is formed on the left side surface 32 and the right side surface 42. Therefore, the deterioration of the radiation characteristics of the antenna conductor 12 is suppressed in the left and right side surfaces.
  • FIG. 9 shows other advantages (advantages other than suppression of deterioration of the radiation characteristics of the antenna conductor 12) due to the fact that the conductive film is not formed on the left side surface and the right side surface of the antenna built-in module according to the first embodiment. It is a figure for demonstrating.
  • a conductive film is formed on the left side surface and the right side surface of the antenna built-in module 1, first, the left and right sides of the sealing resin 20 and the wiring substrate 10 are half-cut. Then, grooves 91 and 92 are formed (FIG. 9A).
  • the conductive film 23 is formed by applying a conductive material on the upper surface of the sealing resin 20, and the grooves 91 and 92 are filled with the conductive material (FIG. 9B). Then, the wiring substrate 10 is fully cut at the position X along the grooves 91 and 92, thereby forming the conductive films 93 and 94 (FIG. 9C).
  • antenna built-in module 1 in order to form the conductive films 93 and 94, it is necessary to perform a half cut. Therefore, in antenna built-in module 1 according to the first embodiment, the number of half cuts can be reduced by not forming conductive films 93 and 94. As a result, the manufacturing process of the antenna built-in module 1 can be shortened.
  • the miniaturization of the antenna built-in module 1 is realized by not forming the conductive films 93 and 94.
  • the electronic component 14 includes the columnar conductor 16, the conductive film 23, the ground layer 19, the via conductor 17, and the conductive film 28, for example.
  • a shield is formed. Therefore, according to the module 1 with a built-in antenna, it is possible to form a shield for the electronic component 14 and to suppress a decrease in radiation characteristics of the antenna conductor 12.
  • antenna built-in module 1 In antenna built-in module 1 according to the first embodiment, no conductive film is formed in antenna region 22 of upper surface 26 of sealing resin 20. In the antenna built-in module according to the second embodiment, a conductive film is formed in a part of the antenna region.
  • the conductive film 28 is formed on the rear side surface 40 of the antenna built-in module 1.
  • the conductive film is not formed on the rear side surface of the antenna built-in module. Instead, columnar conductors are also provided in the region on the rear side surface of the antenna built-in module on the wiring board.
  • FIG. 10 is a perspective view showing the antenna built-in module according to the second embodiment from the front.
  • FIG. 11 is a perspective view showing the antenna built-in module according to the second embodiment from the rear.
  • FIG. 12 is a diagram showing components mounted on the wiring board of the antenna built-in module according to the second embodiment from above.
  • FIG. 13 is a bottom view of the antenna built-in module according to the second embodiment.
  • the antenna built-in module 2 includes a wiring board 50 and a sealing resin 60 formed on the wiring board 50.
  • the antenna conductor 59, the electronic component 14, and the columnar conductors 16, 54, 55, 56, and 57 are mounted on the wiring board 50.
  • the columnar conductors 54, 55, 56, and 57 are, for example, poles or pins formed of metal, like the columnar conductor 16.
  • the upper surface 66 of the antenna built-in module 2 includes an antenna region 62 and an electronic circuit region 64.
  • An antenna conductor 59 and columnar conductors 54, 55, 57 are provided below the antenna area 62 (in the direction of arrow D), and an electronic component 14 and columnar conductors 16, 56 are provided below the electronic circuit area 64. Yes.
  • a conductive film 61 is formed in the electronic circuit region 64. As in the first embodiment, the conductive film 61 forms a shield above the electronic component 14.
  • the antenna region 62 includes a resin region 63 and a conductive film region 65.
  • a resin region 63 In the conductive film region 65, two strip-shaped conductive films 67 and 68 are formed. These two conductive films 67 and 68 are formed so as to be parallel to each other. Although details will be described later, the conductive films 67 and 68 form part of the antenna in the antenna built-in module 2.
  • the conductive film is not formed on the rear side surface 80 of the antenna built-in module 2. Similarly to the first embodiment, the conductive film is not formed on the front side surface 70, the left side surface 72, and the right side surface 82 of the module 2 with a built-in antenna.
  • the two columnar conductors 16 and the two columnar conductors 56 are disposed on the portion of the wiring board 50 where the via conductors 17 are formed.
  • the two columnar conductors 16 are mounted in a region between the antenna conductor 59 and the electronic component 14, and the two columnar conductors 56 are mounted in a region behind the electronic component 14.
  • Each of the columnar conductors 16 and 56 is connected to a ground layer 79 (described later) included in the wiring substrate 50 and the conductive film 61 via the via conductor 17.
  • the electronic component 14 is disposed in a region A ⁇ b> 2 surrounded by the two columnar conductors 16 and the two columnar conductors 56.
  • the electronic component 14 is sandwiched between the conductive film 61 and the wiring substrate 50 (ground layer 79) in the vertical direction. That is, the electronic component 14 is surrounded by the ground layer 79, the two columnar conductors 16, the two columnar conductors 56, the via conductors 17, and the conductive film 61.
  • the ground layer 79, the columnar conductors 16 and 56, the via conductor 17 and the conductive film 61 are all formed of a conductive material.
  • a finite-length opening or a solid surface of the conductor exists in each of the upper, lower, left, and right front-back directions of the electronic component 14. That is, the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61 form a shield for the electronic component 14.
  • the shield of the electronic component 14 is formed by providing the columnar conductor 56 without forming the conductive film on the rear side surface side of the module with a built-in antenna 2.
  • count of the half cut of a back side can be further reduced in the manufacture process of the module 2 with a built-in antenna, and the module 2 with a built-in antenna can be further reduced in size.
  • columnar conductors 54, 55, and 57 are mounted on the wiring board 50.
  • An antenna conductor 69 and a plurality of connection terminals 58 are provided on the lower surface of the wiring board 50.
  • the columnar conductor 54 is connected to the antenna conductor 59 and the conductive film 67.
  • the columnar conductor 57 is connected to the conductive film 67 and the antenna conductor 69.
  • the columnar conductor 55 is connected to the antenna conductor 69 and the conductive film 68.
  • the antenna conductor 59, the columnar conductor 54, the conductive film 67, the columnar conductor 57, the antenna conductor 69, the columnar conductor 55, and the conductive film 68 are electrically connected.
  • the electrical length as the whole antenna can be lengthened.
  • the size of the module can be reduced.
  • FIG. 14 is a cross-sectional view taken along the line XIV-XIV in FIG. Referring to FIG. 14, as described above, the electronic component 14 is surrounded by the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61. Therefore, as described above, the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61 form a shield for the electronic component 14.
  • the thickness of the sealing resin 60 below the resin region 63 is thinner than the thickness of the sealing resin 20 below the conductive film region 65.
  • the dielectric constant of the sealing resin 60 is higher than the dielectric constant of air.
  • the antenna built-in module 2 according to the second embodiment can be mounted on a set substrate included in a communication device (not shown) as in the first embodiment.
  • the antenna built-in module 2 can be mounted on the set substrate together with a matching element outside the antenna built-in module 2. Therefore, as in the first embodiment, when connecting the module with a built-in antenna 2 to the set substrate, the user can select a matching element according to the characteristics of the module with a built-in antenna 2 and the set substrate.
  • the manufacturing method of the antenna built-in module 2 according to the second embodiment is different from the first embodiment mainly in the following points. That is, in the second embodiment, since the conductive film is not formed on the rear side surface of the antenna built-in module 2, the half cut is not performed on the rear side surface. Further, in order to form the resin region 63 and the conductive film region 65 in the antenna region 62, the conductive film and the sealing resin in the resin region 63 are formed after the conductive film is formed in the electronic circuit region 64 and the antenna region 62. 60 is cut by Dicer.
  • the electrical length of the antenna is not required as compared with the first embodiment, and no additional cost is required. Can be lengthened.
  • the conductive film 67, 68, the columnar conductors 54, 55, 57, and the antenna conductors 59, 69 form an antenna. Therefore, according to the module 2 with a built-in antenna, for example, the electrical length of the antenna can be made longer than when the antenna is formed only by the antenna conductor 59 or the antenna conductor 69 on the wiring board 50. As a result, for example, when the electrical length of the antenna is set to a certain length, the size of the module can be reduced.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28, and the antenna conductor 12 is used as the antenna.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the two columnar conductors 56, and an antenna having a long electrical length formed from the antenna conductors 59, 69, etc. was used.
  • the combination of the method of surrounding the electronic component 14 (shield formation method) and the antenna is not limited to this.
  • an antenna having a long electrical length formed of the antenna conductors 59 and 69 and the like may be employed while the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28, or the two columnar conductors 16 may be employed.
  • the electronic component 14 may be surrounded by the two columnar conductors 56 and the antenna conductor 12 may be employed.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28.
  • the method of surrounding the electronic component 14 by the columnar conductor 16 and the conductive film 28 is as follows. It is not limited to this.
  • the electronic component 14 may be surrounded by one columnar conductor 16 and the conductive film 28.
  • a region surrounded by one columnar conductor 16 and the conductive film 28 is narrower than a region surrounded by the two columnar conductors 16 and the conductive film 28, so that a shield is formed. The area where it can be narrowed.
  • the electronic component 14 may be surrounded by three or more columnar conductors 16 and the conductive film 28.
  • the distance between the columnar conductors 16 and the distance between the columnar conductors 16 and the conductive film 28 are shorter than those in the first embodiment. That is, the length of one side and the diagonal line of the finite length opening is shortened. As a result, the wavelength of noise that can be shielded by the columnar conductor 16 and the conductive film 28 is shortened. Therefore, the columnar conductor 16 and the conductive film 28 function as a shield for higher frequency noise.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the two columnar conductors 56.
  • the electronic component 14 is surrounded by five or more columnar conductors. It is good.
  • the distance between the columnar conductors is shorter than that in the second embodiment.
  • the five or more columnar conductors function as a shield for higher frequency noise.
  • the antenna conductor 12 is provided on the surface (upper surface) of the wiring board 10 on which the electronic component 14 and the columnar conductor 16 are mounted.
  • the position of the antenna conductor 12 is not limited to this.
  • the antenna conductor 12 may be provided on the inner layer of the wiring board 10 or the lower surface of the wiring board 10.
  • the antenna conductors 59 and 69 are provided on the upper surface and the lower surface of the wiring board 10, respectively.
  • the positions of the antenna conductors 59 and 69 are not limited to this.
  • the antenna conductors 59 and 69 may be provided on the lower surface and the upper surface of the wiring board 10, respectively.
  • each of the antenna conductors 59 and 69 may be mounted on the inner layer of the wiring board 10.
  • the columnar conductor such as the columnar conductor 16 is a pole formed of metal, but the columnar conductor such as the columnar conductor 16 is not necessarily limited to this.
  • the columnar conductor 16 may be formed by forming a via and embedding a conductive resin in the formed via, or may be formed by potting a conductive resin.
  • the conductive films 67 and 68 are formed in parallel to each other.
  • the two films are not necessarily parallel to each other.
  • the two band-like conductive films 67 and 68 are formed in the antenna region 62, it is not always necessary that the two band-like conductive films are formed in the antenna region 62.
  • the number of strip-shaped conductive films formed in the antenna region 62 may be one, or three or more.
  • the antenna conductor (antenna conductor 12 or antenna conductor 59 or the like) is provided in a region adjacent to the electronic component 14 on the wiring boards 10 and 50.
  • the technique disclosed in this specification can be effective.
  • FIG. 15 is a diagram showing the wiring board of the module from which the antenna conductor is removed from the antenna built-in module 1 according to the first embodiment from above.
  • FIG. 16 is a diagram showing the wiring board of the module in which the antenna conductor is removed from the antenna built-in module 2 according to the second embodiment from above. 15 and 16, also in these modules, the shield of the electronic component 14 in the directions of arrows F, B, L, and R by the columnar conductor 16 and the conductive film 28 or the columnar conductor 16 and the columnar conductor 56. Is formed. Therefore, the influence which the noise radiated

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention concerne un module à antenne intégrée, comprenant un conducteur d'antenne et un composant électronique, et un blindage pour le composant électronique étant formé, tout en supprimant la diminution des caractéristiques de rayonnement de l'antenne. Un module (1) à antenne intégrée selon la présente invention est pourvu d'un substrat de câblage (10), d'un conducteur d'antenne, d'un composant électronique, d'une résine d'étanchéité (20), d'un film conducteur (23) et d'un premier conducteur en colonne. Le substrat de câblage (10) comprend une couche de mise à la terre. La résine d'étanchéité (20) est formée de façon à sceller le conducteur d'antenne et le composant électronique. Le film conducteur (23) est formé dans une région de la surface supérieure de la résine d'étanchéité (20), ladite région recouvrant le composant électronique. Le premier conducteur en colonne connecte électriquement le film conducteur (23) et la couche de mise à la terre l'un à l'autre. Le premier conducteur en colonne est disposé entre la région du conducteur d'antenne et la région du composant électronique.
PCT/JP2017/032614 2016-09-30 2017-09-11 Module à antenne intégrée et dispositif de communication WO2018061722A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016-193873 2016-09-30
JP2016193873 2016-09-30

Publications (1)

Publication Number Publication Date
WO2018061722A1 true WO2018061722A1 (fr) 2018-04-05

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050009244A1 (en) * 2003-07-09 2005-01-13 Toshio Shiobara Method for sealing semiconductor component
WO2011102095A1 (fr) * 2010-02-19 2011-08-25 パナソニック株式会社 Procédé de fabrication de module
US20130234304A1 (en) * 2012-03-08 2013-09-12 Renesas Electronics Corporation Semiconductor device
WO2016051700A1 (fr) * 2014-09-30 2016-04-07 タツタ電線株式会社 Matériau de revêtement conducteur et procédé de production d'un emballage de protection l'utilisant
WO2016136021A1 (fr) * 2015-02-27 2016-09-01 Ｔｏｗａ株式会社 Composant électronique, son procédé de fabrication, et dispositif pour sa fabrication

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050009244A1 (en) * 2003-07-09 2005-01-13 Toshio Shiobara Method for sealing semiconductor component
WO2011102095A1 (fr) * 2010-02-19 2011-08-25 パナソニック株式会社 Procédé de fabrication de module
US20130234304A1 (en) * 2012-03-08 2013-09-12 Renesas Electronics Corporation Semiconductor device
WO2016051700A1 (fr) * 2014-09-30 2016-04-07 タツタ電線株式会社 Matériau de revêtement conducteur et procédé de production d'un emballage de protection l'utilisant
WO2016136021A1 (fr) * 2015-02-27 2016-09-01 Ｔｏｗａ株式会社 Composant électronique, son procédé de fabrication, et dispositif pour sa fabrication

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