WO2018061722A1 - Module with built-in antenna and communication device - Google Patents

Module with built-in antenna and communication device Download PDF

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Publication number
WO2018061722A1
WO2018061722A1 PCT/JP2017/032614 JP2017032614W WO2018061722A1 WO 2018061722 A1 WO2018061722 A1 WO 2018061722A1 JP 2017032614 W JP2017032614 W JP 2017032614W WO 2018061722 A1 WO2018061722 A1 WO 2018061722A1
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WO
WIPO (PCT)
Prior art keywords
antenna
conductor
built
module
conductive film
Prior art date
Application number
PCT/JP2017/032614
Other languages
French (fr)
Japanese (ja)
Inventor
伊東　祐一
貴洋 渡辺
伸充 天知
Original Assignee
株式会社村田製作所
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Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2018061722A1 publication Critical patent/WO2018061722A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate

Definitions

  • the present invention relates to a module with a built-in antenna and a communication device, and particularly relates to a module with a built-in antenna including an antenna conductor and an electronic component, and a communication device including the module with a built-in antenna.
  • Patent Document 1 discloses an antenna built-in module including an antenna conductor and an RF (Radio Frequency) circuit (electronic component).
  • the antenna conductor and the RF circuit are arranged on the wiring board so as not to overlap.
  • the antenna conductor and the RF circuit are sealed with a sealing resin.
  • a conductive paste is applied to the region of the upper surface of the sealing resin that covers the electronic component and the side surface of the sealing resin.
  • An RF circuit shield is formed by a conductive paste applied to the sealing resin (see Patent Document 1).
  • the present invention has been made to solve such a problem, and an object of the present invention is to form a shield for an electronic component and a radiation characteristic of the antenna in a module with a built-in antenna including an antenna conductor and an electronic component. It is to suppress the decrease of.
  • the antenna built-in module includes a wiring board, an antenna conductor, an electronic component, a sealing resin, a first conductive film, and at least one first columnar conductor.
  • the wiring board includes a ground layer.
  • the antenna conductor is provided on the wiring board.
  • the electronic component is provided on the wiring board in a region that does not overlap with the antenna conductor.
  • the sealing resin is formed so as to seal the antenna conductor and the electronic component.
  • the first conductive film is formed in a region covering the electronic component on the upper surface of the sealing resin.
  • the first columnar conductor electrically connects the first conductive film and the ground layer.
  • the first columnar conductor is provided between the antenna conductor region and the electronic component region.
  • the first columnar conductor forms a shield for the electronic component together with the first conductive film and the ground layer.
  • the module with a built-in antenna further includes a second conductive film.
  • the second conductive film is formed on the side surface of the sealing resin positioned rearward when the direction of the antenna conductor is the front as viewed from the electronic component.
  • the conductive film is not formed on the side surface of the sealing resin other than the side surface on which the second conductive film is formed.
  • the first columnar conductor forms a shield for the electronic component together with the first and second conductive films and the ground layer.
  • the module with a built-in antenna includes at least two first columnar conductors.
  • the module with a built-in antenna includes at least three first columnar conductors.
  • the first columnar conductor is disposed on the wiring board and is provided so as to surround the electronic component in plan view.
  • the module with a built-in antenna further includes a third conductive film and a second columnar conductor.
  • the third conductive film is formed in a band shape in a region of the upper surface of the sealing resin that covers the antenna conductor.
  • the second columnar conductor electrically connects the third conductive film and the antenna conductor.
  • An antenna is formed by the third conductive film, the second columnar conductor, and the antenna conductor.
  • the thickness of the sealing resin in the region where the third conductive film is not formed in the region covering the antenna conductor in the upper surface of the sealing resin is that of the region where the third conductive film is formed. It is thinner than the thickness of the sealing resin.
  • the module with a built-in antenna further includes a connection terminal.
  • the connection terminal is directly or indirectly connected to the set substrate outside the antenna built-in module.
  • the antenna conductor and the electronic component input and output signals through the connection terminals.
  • a communication device includes an antenna built-in module including the connection terminal, a set substrate, and a matching element outside the antenna built-in module.
  • the matching element is an element that matches the impedance on the antenna built-in module side with the impedance on the set substrate side.
  • the antenna built-in module and the matching element are mounted on a set substrate.
  • the antenna built-in module including the antenna conductor and the electronic component, it is possible to form a shield for the electronic component and to suppress a decrease in the radiation characteristics of the antenna.
  • FIG. 5 is a VV cross-sectional view of FIG. 2. It is a figure for demonstrating the example of mounting to the communication apparatus of the module with a built-in antenna.
  • FIG. 4 is a view showing a manufacturing process of the antenna built-in module from the direction of the VII-VII cross section of FIG. 3.
  • FIG. 4 is a diagram showing a manufacturing process of the antenna built-in module from the direction of the section VIII-VIII in FIG. 3. It is a figure for demonstrating the other advantage by the electroconductive film
  • FIG. 14 is a sectional view taken along line XIV-XIV in FIG. 11.
  • FIG. 1 is a perspective view showing a module with a built-in antenna according to the first embodiment from the front.
  • FIG. 2 is a perspective view showing the module with a built-in antenna according to the first embodiment from the rear.
  • FIG. 3 is a diagram showing components mounted on the wiring board of the antenna built-in module according to the first embodiment from above.
  • an arrow D indicates a vertically downward direction
  • an arrow U indicates a vertically upward direction
  • Arrow F indicates the front direction of the module with a built-in antenna
  • arrow B indicates the rear direction of the module with a built-in antenna
  • Arrows L and R respectively indicate the left direction and the right direction of the antenna built-in module.
  • the antenna built-in module 1 is a wireless communication module mounted on a set substrate of a communication device (not shown) such as a smartphone.
  • the antenna built-in module 1 includes, for example, a communication system that performs communication compliant with LTE (Long Term Evolution) standards, wireless LAN standards, and Bluetooth (registered trademark).
  • the antenna built-in module 1 includes a wiring board 10 and a sealing resin 20 formed on the wiring board 10.
  • An antenna conductor 12, an electronic component 14, and a columnar conductor 16 are mounted on the wiring board 10 (FIG. 3).
  • the antenna conductor 12 has a shape corresponding to a frequency band used for wireless communication, and is made of metal.
  • the antenna conductor 12 is an antenna pattern provided on the wiring board 10, for example.
  • the electronic component 14 is, for example, an RF (Radio Frequency) circuit.
  • the RF circuit can include, for example, an RFIC (Radio Frequency Integrated Circuit), a switch IC, a filter element, a resistor, an inductor, a capacitor, and the like.
  • the columnar conductor 16 is, for example, a pole (column) or a pin made of metal.
  • the sealing resin 20 is formed so as to seal the antenna conductor 12, the electronic component 14, and the columnar conductor 16.
  • the sealing resin 20 is formed, for example, by filling the wiring substrate 10 with a thermosetting resin such as an epoxy resin or a cyanate resin.
  • the upper surface 26 of the antenna built-in module 1 includes an antenna region 22 and an electronic circuit region 24.
  • An antenna conductor 12 is provided below the antenna region 22 (in the direction of arrow D), and an electronic component 14 and a columnar conductor 16 are provided below the electronic circuit region 24.
  • the conductive film 23 is formed, while in the antenna region 22, the conductive film is not formed.
  • the conductive film 23 is formed, for example, by sputtering a metal such as stainless steel or by photolithography.
  • the conductive film 23 is formed for the purpose of shielding noise radiated from the electronic component 14. Since the conductive film is not formed above the antenna conductor 12 (in the direction of the arrow U), the deterioration of the radiation characteristics of the antenna conductor 12 due to the conductive film is suppressed.
  • the conductive film 28 is formed on the rear side surface 40 of the antenna built-in module 1.
  • the wiring board 10 includes a via conductor 17 (described later) and a ground layer 19 (ground layer) formed of metal.
  • the conductive film 28 is formed in the rear side surface 40 in a region from the upper end to at least the ground layer 19. Similarly to the conductive film 23, the conductive film 28 is also formed for the purpose of shielding noise emitted from the electronic component 14.
  • the side surface (the surface on which the conductive film 28 is formed) of the sealing resin 20 included in the rear side surface 40 is located rearward when the direction of the antenna conductor 12 is the front as viewed from the electronic component 14. It can also be said to be a side surface of the sealing resin 20.
  • the conductive film is not formed on the other side surfaces (front side surface 30, left side surface 32, right side surface 42) of the antenna built-in module 1.
  • a columnar conductor 16 is provided on a portion of the wiring board 10 where via conductors 17 (described later) are arranged. Each columnar conductor 16 is connected to the ground layer 19 via a via conductor 17. The upper end of each columnar conductor 16 is connected to the conductive film 23.
  • the electronic component 14 is disposed in a region A1 surrounded by the two columnar conductors 16 and the conductive film 28.
  • the electronic component 14 is sandwiched between the conductive film 23 and the wiring substrate 10 (ground layer 19) in the vertical direction. That is, the electronic component 14 is surrounded by the ground layer 19, the two columnar conductors 16, the via conductors 17 that connect the columnar conductors to the ground layer 19, and the conductive films 23 and 28.
  • the shield of the electronic component 14 is formed by these.
  • the widest gap (a finite-length opening) in this shield is a region between the two columnar conductors 16. Therefore, the finite-length opening functions as a shield with respect to noise whose quarter wavelength is longer than the distance between the two columnar conductors 16.
  • each columnar conductor 16 is provided in a region between the antenna conductor 12 and the electronic component 14 in the arrangement direction of the antenna conductor 12 and the electronic component 14. Therefore, the columnar conductor 16 can shield noise radiated from the electronic component 14 toward the antenna conductor 12.
  • FIG. 4 is a bottom view of the module with a built-in antenna according to the first embodiment. Referring to FIG. 4, a plurality of connection terminals 18 are exposed on the lower surface side of wiring board 10.
  • connection terminal 18 can be directly or indirectly connected to an external set substrate of the antenna built-in module 1.
  • the antenna conductor 12 and the electronic component 14 input and output signals through the connection terminals 18.
  • the input / output terminals of the antenna conductor 12 included in the connection terminal 18 and the input / output terminals of the electronic component 14 included in the connection terminal 18 are connected to each other via, for example, a matching element outside the antenna built-in module 1.
  • the user of the module with a built-in antenna 1 can measure the input / output characteristics of the electronic component 14 only by looking at the input / output signals of the input / output terminals of the electronic component 14 included in the connection terminal 18.
  • FIG. 5 is a VV cross-sectional view of FIG. With reference to FIG. 5, as described above, the electronic component 14 is surrounded by the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28. Therefore, as described above, the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 form a shield for the electronic component 14.
  • FIG. 6 is a diagram for explaining an example of mounting the module with a built-in antenna according to the first embodiment on a communication device.
  • antenna built-in module 1 is mounted on set substrate 150.
  • Other electronic components 160 are mounted on the set substrate 150.
  • a matching element for matching the impedance on the antenna built-in module 1 side and the impedance on the set substrate 150 side can be used.
  • the antenna built-in module 1 does not include a matching element, and the communication device 100 uses a matching element outside the antenna built-in module 1. Therefore, when connecting the module with a built-in antenna 1 to the set substrate 150, the user selects a matching element according to the mounting state of the module with a built-in antenna 1 on the set substrate 150 (such as a noise state of surrounding electronic components). Can do.
  • the electronic component 14 is formed by forming a conductive film on the entire left side surface 32 and right side surface 42 without providing the columnar conductor 16. It is also conceivable to form a shield.
  • the electronic component 14 is surrounded by the conductive film 23, the conductive films formed on the left side surface 32 and the right side surface 42, and the ground layer 19. Since the conductive film 23, the conductive films formed on the left side surface 32 and the right side surface 42, and the ground layer 19 are all conductive materials, they form a shield for the electronic component 14.
  • a conductive film is also formed on the side surface of the sealing resin 20 that seals the antenna conductor 12 (the front side portion of the left side surface 32 and the right side surface 42).
  • the radiation characteristics of the antenna conductor 12 deteriorate.
  • the In this module 1 with a built-in antenna for example, the side surface (front side surface 30, left side surface 32, right side surface 42) other than the side surface on which the conductive film 28 is formed among the side surfaces of the sealing resin 20 is conductive.
  • the characteristic film is not formed. Therefore, for example, the radiation characteristics of the antenna conductor 12 are not adversely affected by the conductive films on the left side surface 32 and the right side surface 42. Therefore, according to the module 1 with a built-in antenna, it is possible to form a shield for the electronic component 14 and to suppress a decrease in radiation characteristics of the antenna conductor 12.
  • FIG. 7 is a diagram showing the manufacturing process of the antenna built-in module according to the first embodiment from the direction of the VII-VII cross section of FIG.
  • FIG. 8 is a diagram showing the manufacturing process of the antenna built-in module according to the first embodiment from the direction of the VIII-VIII cross section of FIG.
  • the antenna conductor 12, the electronic component 14, and the columnar conductor 16 are mounted on the wiring board 10.
  • the columnar conductor 16 is connected to the ground layer 19 through a via conductor 17 provided in the wiring board 10 (FIGS. 7A and 8A).
  • the sealing resin 20 is filled on the wiring substrate 10 on which the antenna conductor 12 and the like are mounted (FIGS. 7B and 8B).
  • the sealing resin 20 and the columnar conductor 16 are cut out so that the thickness of the sealing resin 20 becomes a predetermined thickness.
  • the predetermined thickness is a thickness at which at least the columnar conductor 16 is exposed to the outside (FIGS. 7C and 8C).
  • the sealing resin 20 and the back of the wiring substrate 10 are half-cut to form the grooves 29.
  • the depth of the groove 29 is a depth that reaches at least the ground layer 19 (FIGS. 7D and 8D).
  • a conductive film 23 is formed and the conductive material is filled in the grooves 29 (FIGS. 7E and 8E). .
  • the conductive film formed in the antenna region 22 is deleted (FIG. 7 (f), FIG. 8 (f)).
  • the back of the wiring board 10 is fully cut, and the front, left, and right sides of the wiring board 10 and the sealing resin 20 are fully cut, whereby the antenna built-in module 1 is completed (FIG. 7). (G), FIG. 8 (g)).
  • the electronic component 14 is surrounded by the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28. That is, a finite length opening or a conductive surface of a conductor is formed in each of the electronic component 14 in the vertical and horizontal directions. Therefore, the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 form a shield for the electronic component 14.
  • the antenna built-in module 1 no conductive film is formed on the left side surface 32 and the right side surface 42. Therefore, the deterioration of the radiation characteristics of the antenna conductor 12 is suppressed in the left and right side surfaces.
  • FIG. 9 shows other advantages (advantages other than suppression of deterioration of the radiation characteristics of the antenna conductor 12) due to the fact that the conductive film is not formed on the left side surface and the right side surface of the antenna built-in module according to the first embodiment. It is a figure for demonstrating.
  • a conductive film is formed on the left side surface and the right side surface of the antenna built-in module 1, first, the left and right sides of the sealing resin 20 and the wiring substrate 10 are half-cut. Then, grooves 91 and 92 are formed (FIG. 9A).
  • the conductive film 23 is formed by applying a conductive material on the upper surface of the sealing resin 20, and the grooves 91 and 92 are filled with the conductive material (FIG. 9B). Then, the wiring substrate 10 is fully cut at the position X along the grooves 91 and 92, thereby forming the conductive films 93 and 94 (FIG. 9C).
  • antenna built-in module 1 in order to form the conductive films 93 and 94, it is necessary to perform a half cut. Therefore, in antenna built-in module 1 according to the first embodiment, the number of half cuts can be reduced by not forming conductive films 93 and 94. As a result, the manufacturing process of the antenna built-in module 1 can be shortened.
  • the miniaturization of the antenna built-in module 1 is realized by not forming the conductive films 93 and 94.
  • the electronic component 14 includes the columnar conductor 16, the conductive film 23, the ground layer 19, the via conductor 17, and the conductive film 28, for example.
  • a shield is formed. Therefore, according to the module 1 with a built-in antenna, it is possible to form a shield for the electronic component 14 and to suppress a decrease in radiation characteristics of the antenna conductor 12.
  • antenna built-in module 1 In antenna built-in module 1 according to the first embodiment, no conductive film is formed in antenna region 22 of upper surface 26 of sealing resin 20. In the antenna built-in module according to the second embodiment, a conductive film is formed in a part of the antenna region.
  • the conductive film 28 is formed on the rear side surface 40 of the antenna built-in module 1.
  • the conductive film is not formed on the rear side surface of the antenna built-in module. Instead, columnar conductors are also provided in the region on the rear side surface of the antenna built-in module on the wiring board.
  • FIG. 10 is a perspective view showing the antenna built-in module according to the second embodiment from the front.
  • FIG. 11 is a perspective view showing the antenna built-in module according to the second embodiment from the rear.
  • FIG. 12 is a diagram showing components mounted on the wiring board of the antenna built-in module according to the second embodiment from above.
  • FIG. 13 is a bottom view of the antenna built-in module according to the second embodiment.
  • the antenna built-in module 2 includes a wiring board 50 and a sealing resin 60 formed on the wiring board 50.
  • the antenna conductor 59, the electronic component 14, and the columnar conductors 16, 54, 55, 56, and 57 are mounted on the wiring board 50.
  • the columnar conductors 54, 55, 56, and 57 are, for example, poles or pins formed of metal, like the columnar conductor 16.
  • the upper surface 66 of the antenna built-in module 2 includes an antenna region 62 and an electronic circuit region 64.
  • An antenna conductor 59 and columnar conductors 54, 55, 57 are provided below the antenna area 62 (in the direction of arrow D), and an electronic component 14 and columnar conductors 16, 56 are provided below the electronic circuit area 64. Yes.
  • a conductive film 61 is formed in the electronic circuit region 64. As in the first embodiment, the conductive film 61 forms a shield above the electronic component 14.
  • the antenna region 62 includes a resin region 63 and a conductive film region 65.
  • a resin region 63 In the conductive film region 65, two strip-shaped conductive films 67 and 68 are formed. These two conductive films 67 and 68 are formed so as to be parallel to each other. Although details will be described later, the conductive films 67 and 68 form part of the antenna in the antenna built-in module 2.
  • the conductive film is not formed on the rear side surface 80 of the antenna built-in module 2. Similarly to the first embodiment, the conductive film is not formed on the front side surface 70, the left side surface 72, and the right side surface 82 of the module 2 with a built-in antenna.
  • the two columnar conductors 16 and the two columnar conductors 56 are disposed on the portion of the wiring board 50 where the via conductors 17 are formed.
  • the two columnar conductors 16 are mounted in a region between the antenna conductor 59 and the electronic component 14, and the two columnar conductors 56 are mounted in a region behind the electronic component 14.
  • Each of the columnar conductors 16 and 56 is connected to a ground layer 79 (described later) included in the wiring substrate 50 and the conductive film 61 via the via conductor 17.
  • the electronic component 14 is disposed in a region A ⁇ b> 2 surrounded by the two columnar conductors 16 and the two columnar conductors 56.
  • the electronic component 14 is sandwiched between the conductive film 61 and the wiring substrate 50 (ground layer 79) in the vertical direction. That is, the electronic component 14 is surrounded by the ground layer 79, the two columnar conductors 16, the two columnar conductors 56, the via conductors 17, and the conductive film 61.
  • the ground layer 79, the columnar conductors 16 and 56, the via conductor 17 and the conductive film 61 are all formed of a conductive material.
  • a finite-length opening or a solid surface of the conductor exists in each of the upper, lower, left, and right front-back directions of the electronic component 14. That is, the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61 form a shield for the electronic component 14.
  • the shield of the electronic component 14 is formed by providing the columnar conductor 56 without forming the conductive film on the rear side surface side of the module with a built-in antenna 2.
  • count of the half cut of a back side can be further reduced in the manufacture process of the module 2 with a built-in antenna, and the module 2 with a built-in antenna can be further reduced in size.
  • columnar conductors 54, 55, and 57 are mounted on the wiring board 50.
  • An antenna conductor 69 and a plurality of connection terminals 58 are provided on the lower surface of the wiring board 50.
  • the columnar conductor 54 is connected to the antenna conductor 59 and the conductive film 67.
  • the columnar conductor 57 is connected to the conductive film 67 and the antenna conductor 69.
  • the columnar conductor 55 is connected to the antenna conductor 69 and the conductive film 68.
  • the antenna conductor 59, the columnar conductor 54, the conductive film 67, the columnar conductor 57, the antenna conductor 69, the columnar conductor 55, and the conductive film 68 are electrically connected.
  • the electrical length as the whole antenna can be lengthened.
  • the size of the module can be reduced.
  • FIG. 14 is a cross-sectional view taken along the line XIV-XIV in FIG. Referring to FIG. 14, as described above, the electronic component 14 is surrounded by the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61. Therefore, as described above, the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61 form a shield for the electronic component 14.
  • the thickness of the sealing resin 60 below the resin region 63 is thinner than the thickness of the sealing resin 20 below the conductive film region 65.
  • the dielectric constant of the sealing resin 60 is higher than the dielectric constant of air.
  • the antenna built-in module 2 according to the second embodiment can be mounted on a set substrate included in a communication device (not shown) as in the first embodiment.
  • the antenna built-in module 2 can be mounted on the set substrate together with a matching element outside the antenna built-in module 2. Therefore, as in the first embodiment, when connecting the module with a built-in antenna 2 to the set substrate, the user can select a matching element according to the characteristics of the module with a built-in antenna 2 and the set substrate.
  • the manufacturing method of the antenna built-in module 2 according to the second embodiment is different from the first embodiment mainly in the following points. That is, in the second embodiment, since the conductive film is not formed on the rear side surface of the antenna built-in module 2, the half cut is not performed on the rear side surface. Further, in order to form the resin region 63 and the conductive film region 65 in the antenna region 62, the conductive film and the sealing resin in the resin region 63 are formed after the conductive film is formed in the electronic circuit region 64 and the antenna region 62. 60 is cut by Dicer.
  • the electrical length of the antenna is not required as compared with the first embodiment, and no additional cost is required. Can be lengthened.
  • the conductive film 67, 68, the columnar conductors 54, 55, 57, and the antenna conductors 59, 69 form an antenna. Therefore, according to the module 2 with a built-in antenna, for example, the electrical length of the antenna can be made longer than when the antenna is formed only by the antenna conductor 59 or the antenna conductor 69 on the wiring board 50. As a result, for example, when the electrical length of the antenna is set to a certain length, the size of the module can be reduced.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28, and the antenna conductor 12 is used as the antenna.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the two columnar conductors 56, and an antenna having a long electrical length formed from the antenna conductors 59, 69, etc. was used.
  • the combination of the method of surrounding the electronic component 14 (shield formation method) and the antenna is not limited to this.
  • an antenna having a long electrical length formed of the antenna conductors 59 and 69 and the like may be employed while the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28, or the two columnar conductors 16 may be employed.
  • the electronic component 14 may be surrounded by the two columnar conductors 56 and the antenna conductor 12 may be employed.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28.
  • the method of surrounding the electronic component 14 by the columnar conductor 16 and the conductive film 28 is as follows. It is not limited to this.
  • the electronic component 14 may be surrounded by one columnar conductor 16 and the conductive film 28.
  • a region surrounded by one columnar conductor 16 and the conductive film 28 is narrower than a region surrounded by the two columnar conductors 16 and the conductive film 28, so that a shield is formed. The area where it can be narrowed.
  • the electronic component 14 may be surrounded by three or more columnar conductors 16 and the conductive film 28.
  • the distance between the columnar conductors 16 and the distance between the columnar conductors 16 and the conductive film 28 are shorter than those in the first embodiment. That is, the length of one side and the diagonal line of the finite length opening is shortened. As a result, the wavelength of noise that can be shielded by the columnar conductor 16 and the conductive film 28 is shortened. Therefore, the columnar conductor 16 and the conductive film 28 function as a shield for higher frequency noise.
  • the electronic component 14 is surrounded by the two columnar conductors 16 and the two columnar conductors 56.
  • the electronic component 14 is surrounded by five or more columnar conductors. It is good.
  • the distance between the columnar conductors is shorter than that in the second embodiment.
  • the five or more columnar conductors function as a shield for higher frequency noise.
  • the antenna conductor 12 is provided on the surface (upper surface) of the wiring board 10 on which the electronic component 14 and the columnar conductor 16 are mounted.
  • the position of the antenna conductor 12 is not limited to this.
  • the antenna conductor 12 may be provided on the inner layer of the wiring board 10 or the lower surface of the wiring board 10.
  • the antenna conductors 59 and 69 are provided on the upper surface and the lower surface of the wiring board 10, respectively.
  • the positions of the antenna conductors 59 and 69 are not limited to this.
  • the antenna conductors 59 and 69 may be provided on the lower surface and the upper surface of the wiring board 10, respectively.
  • each of the antenna conductors 59 and 69 may be mounted on the inner layer of the wiring board 10.
  • the columnar conductor such as the columnar conductor 16 is a pole formed of metal, but the columnar conductor such as the columnar conductor 16 is not necessarily limited to this.
  • the columnar conductor 16 may be formed by forming a via and embedding a conductive resin in the formed via, or may be formed by potting a conductive resin.
  • the conductive films 67 and 68 are formed in parallel to each other.
  • the two films are not necessarily parallel to each other.
  • the two band-like conductive films 67 and 68 are formed in the antenna region 62, it is not always necessary that the two band-like conductive films are formed in the antenna region 62.
  • the number of strip-shaped conductive films formed in the antenna region 62 may be one, or three or more.
  • the antenna conductor (antenna conductor 12 or antenna conductor 59 or the like) is provided in a region adjacent to the electronic component 14 on the wiring boards 10 and 50.
  • the technique disclosed in this specification can be effective.
  • FIG. 15 is a diagram showing the wiring board of the module from which the antenna conductor is removed from the antenna built-in module 1 according to the first embodiment from above.
  • FIG. 16 is a diagram showing the wiring board of the module in which the antenna conductor is removed from the antenna built-in module 2 according to the second embodiment from above. 15 and 16, also in these modules, the shield of the electronic component 14 in the directions of arrows F, B, L, and R by the columnar conductor 16 and the conductive film 28 or the columnar conductor 16 and the columnar conductor 56. Is formed. Therefore, the influence which the noise radiated

Abstract

A module with a built-in antenna, which comprises an antenna conductor and an electronic component, and wherein a shield for the electronic component is formed, while suppressing decrease in the radiation characteristics of the antenna. A module (1) with a built-in antenna according to the present invention is provided with a wiring substrate (10), an antenna conductor, an electronic component, a sealing resin (20), a conductive film (23) and a first columnar conductor. The wiring substrate (10) comprises a grounding layer. The sealing resin (20) is formed so as to seal the antenna conductor and the electronic component. The conductive film (23) is formed in a region of the upper surface of the sealing resin (20), said region covering the electronic component. The first columnar conductor electrically connects the conductive film (23) and the grounding layer to each other. The first columnar conductor is provided between the region of the antenna conductor and the region of the electronic component.

Description

アンテナ内蔵モジュール及び通信装置Antenna built-in module and communication device
　本発明は、アンテナ内蔵モジュール及び通信装置に関し、特に、アンテナ導体と電子部品とを備えるアンテナ内蔵モジュール、及び、そのアンテナ内蔵モジュールを備える通信装置に関する。 The present invention relates to a module with a built-in antenna and a communication device, and particularly relates to a module with a built-in antenna including an antenna conductor and an electronic component, and a communication device including the module with a built-in antenna.
　国際公開第２０１５／０１５８６３号（特許文献１）は、アンテナ導体と、ＲＦ（Radio　Frequency）回路（電子部品）とを備えるアンテナ内蔵モジュールを開示する。このアンテナ内蔵モジュールにおいては、配線基板上に、アンテナ導体とＲＦ回路とが重ならないように配置されている。アンテナ導体及びＲＦ回路は、封止樹脂によって封止されている。封止樹脂の上面のうち電子部品を覆う領域、及び、封止樹脂の側面には導電性ペーストが塗布されている。封止樹脂に塗布された導電性ペーストによって、ＲＦ回路のシールドが形成されている（特許文献１参照）。 International Publication No. 2015/015863 (Patent Document 1) discloses an antenna built-in module including an antenna conductor and an RF (Radio Frequency) circuit (electronic component). In this antenna built-in module, the antenna conductor and the RF circuit are arranged on the wiring board so as not to overlap. The antenna conductor and the RF circuit are sealed with a sealing resin. A conductive paste is applied to the region of the upper surface of the sealing resin that covers the electronic component and the side surface of the sealing resin. An RF circuit shield is formed by a conductive paste applied to the sealing resin (see Patent Document 1).
国際公開第２０１５／０１５８６３号International Publication No. 2015/015863
　上記特許文献１に開示されるアンテナ内蔵モジュールにおいては、アンテナ導体から放射される電磁波が、封止樹脂の側面に塗布された導電性ペーストによって遮断されることにより、アンテナの放射特性が低下する。 In the antenna built-in module disclosed in Patent Document 1, electromagnetic radiation radiated from the antenna conductor is blocked by the conductive paste applied to the side surface of the sealing resin, so that the radiation characteristics of the antenna are deteriorated.
　この発明は、このような問題を解決するためになされたものであって、その目的は、アンテナ導体と電子部品とを備えるアンテナ内蔵モジュールにおいて、電子部品のシールドを形成するとともに、アンテナの放射特性の低下を抑制することである。 The present invention has been made to solve such a problem, and an object of the present invention is to form a shield for an electronic component and a radiation characteristic of the antenna in a module with a built-in antenna including an antenna conductor and an electronic component. It is to suppress the decrease of.
　本発明のある局面に従うアンテナ内蔵モジュールは、配線基板と、アンテナ導体と、電子部品と、封止樹脂と、第１の導電性膜と、少なくとも１つの第１の柱状導体とを備える。配線基板は、接地層を含む。アンテナ導体は、配線基板に設けられている。電子部品は、配線基板において、アンテナ導体と重ならない領域に設けられている。封止樹脂は、アンテナ導体及び電子部品を封止するように形成されている。第１の導電性膜は、封止樹脂の上面のうち電子部品を覆う領域に形成されている。第１の柱状導体は、第１の導電性膜と接地層とを電気的に接続する。第１の柱状導体は、アンテナ導体の領域と電子部品の領域との間に設けられている。 The antenna built-in module according to an aspect of the present invention includes a wiring board, an antenna conductor, an electronic component, a sealing resin, a first conductive film, and at least one first columnar conductor. The wiring board includes a ground layer. The antenna conductor is provided on the wiring board. The electronic component is provided on the wiring board in a region that does not overlap with the antenna conductor. The sealing resin is formed so as to seal the antenna conductor and the electronic component. The first conductive film is formed in a region covering the electronic component on the upper surface of the sealing resin. The first columnar conductor electrically connects the first conductive film and the ground layer. The first columnar conductor is provided between the antenna conductor region and the electronic component region.
　好ましくは、第１の柱状導体は、第１の導電性膜及び接地層とともに電子部品のシールドを形成する。 Preferably, the first columnar conductor forms a shield for the electronic component together with the first conductive film and the ground layer.
　さらに好ましくは、アンテナ内蔵モジュールは、第２の導電性膜をさらに備える。第２の導電性膜は、電子部品から見て、アンテナ導体の方向を前方とした場合に、後方に位置する封止樹脂の側面に形成されている。封止樹脂の側面のうち、第２の導電性膜が形成された側面以外の側面には導電性膜が形成されていない。第１の柱状導体は、第１及び第２の導電性膜並びに接地層とともに電子部品のシールドを形成する。 More preferably, the module with a built-in antenna further includes a second conductive film. The second conductive film is formed on the side surface of the sealing resin positioned rearward when the direction of the antenna conductor is the front as viewed from the electronic component. The conductive film is not formed on the side surface of the sealing resin other than the side surface on which the second conductive film is formed. The first columnar conductor forms a shield for the electronic component together with the first and second conductive films and the ground layer.
　さらに好ましくは、アンテナ内蔵モジュールは、少なくとも２つの第１の柱状導体を備える。 More preferably, the module with a built-in antenna includes at least two first columnar conductors.
　好ましくは、アンテナ内蔵モジュールは、少なくとも３つの第１の柱状導体を備える。第１の柱状導体は、配線基板の上に配置され、平面視して、電子部品を取り囲むように設けられている。 Preferably, the module with a built-in antenna includes at least three first columnar conductors. The first columnar conductor is disposed on the wiring board and is provided so as to surround the electronic component in plan view.
　好ましくは、アンテナ内蔵モジュールは、第３の導電性膜と、第２の柱状導体とをさらに備える。第３の導電性膜は、封止樹脂の上面のうちアンテナ導体を覆う領域に帯状に形成されている。第２の柱状導体は、第３の導電性膜とアンテナ導体とを電気的に接続する。第３の導電性膜と、第２の柱状導体と、アンテナ導体とによってアンテナが形成されている。 Preferably, the module with a built-in antenna further includes a third conductive film and a second columnar conductor. The third conductive film is formed in a band shape in a region of the upper surface of the sealing resin that covers the antenna conductor. The second columnar conductor electrically connects the third conductive film and the antenna conductor. An antenna is formed by the third conductive film, the second columnar conductor, and the antenna conductor.
　さらに好ましくは、封止樹脂の上面のうちアンテナ導体を覆う領域において第３の導電性膜が形成されていない領域の封止樹脂の厚みは、第３の導電性膜が形成されている領域の封止樹脂の厚みよりも薄い。 More preferably, the thickness of the sealing resin in the region where the third conductive film is not formed in the region covering the antenna conductor in the upper surface of the sealing resin is that of the region where the third conductive film is formed. It is thinner than the thickness of the sealing resin.
　好ましくは、アンテナ内蔵モジュールは、接続端子をさらに備える。接続端子は、アンテナ内蔵モジュール外部のセット基板に直接的又は間接的に接続される。アンテナ導体及び電子部品は、接続端子を介して信号の入出力を行なう。 Preferably, the module with a built-in antenna further includes a connection terminal. The connection terminal is directly or indirectly connected to the set substrate outside the antenna built-in module. The antenna conductor and the electronic component input and output signals through the connection terminals.
　本発明の別の局面に従う通信装置は、上記接続端子を備えるアンテナ内蔵モジュールと、セット基板と、アンテナ内蔵モジュール外部の整合素子とを備える。整合素子は、アンテナ内蔵モジュール側のインピーダンスと、セット基板側のインピーダンスとを整合させる素子である。アンテナ内蔵モジュールと整合素子とは、セット基板に実装されている。 A communication device according to another aspect of the present invention includes an antenna built-in module including the connection terminal, a set substrate, and a matching element outside the antenna built-in module. The matching element is an element that matches the impedance on the antenna built-in module side with the impedance on the set substrate side. The antenna built-in module and the matching element are mounted on a set substrate.
　この発明によれば、アンテナ導体と電子部品とを備えるアンテナ内蔵モジュールにおいて、電子部品のシールドを形成するとともに、アンテナの放射特性の低下を抑制することができる。 According to the present invention, in the antenna built-in module including the antenna conductor and the electronic component, it is possible to form a shield for the electronic component and to suppress a decrease in the radiation characteristics of the antenna.
実施の形態１に従うアンテナ内蔵モジュールを前方から示した斜視図である。It is the perspective view which showed the antenna built-in module according to Embodiment 1 from the front. アンテナ内蔵モジュールを後方から示した斜視図である。It is the perspective view which showed the module with a built-in antenna from the back. アンテナ内蔵モジュールの配線基板に実装されている部品を上方から示した図である。It is the figure which showed the components mounted in the wiring board of the module with a built-in antenna from the upper part. アンテナ内蔵モジュールの下面図である。It is a bottom view of a module with a built-in antenna. 図２のＶ－Ｖ断面図である。FIG. 5 is a VV cross-sectional view of FIG. 2. アンテナ内蔵モジュールの通信装置への実装例を説明するための図である。It is a figure for demonstrating the example of mounting to the communication apparatus of the module with a built-in antenna. アンテナ内蔵モジュールの製造工程を、図３のＶＩＩ－ＶＩＩ断面の方向から示した図である。FIG. 4 is a view showing a manufacturing process of the antenna built-in module from the direction of the VII-VII cross section of FIG. 3. アンテナ内蔵モジュールの製造工程を、図３のＶＩＩＩ－ＶＩＩＩ断面の方向から示した図である。FIG. 4 is a diagram showing a manufacturing process of the antenna built-in module from the direction of the section VIII-VIII in FIG. 3. アンテナ内蔵モジュールの左方側面及び右方側面に導電性膜が形成されていないことによる他の利点を説明するための図である。It is a figure for demonstrating the other advantage by the electroconductive film | membrane being not formed in the left side surface and right side surface of a module with a built-in antenna. 実施の形態２に従うアンテナ内蔵モジュールを前方から示した斜視図である。It is the perspective view which showed the antenna built-in module according to Embodiment 2 from the front. アンテナ内蔵モジュールを後方から示した斜視図である。It is the perspective view which showed the module with a built-in antenna from the back. アンテナ内蔵モジュールの配線基板に実装されている部品を上方から示した図である。It is the figure which showed the components mounted in the wiring board of the module with a built-in antenna from the upper part. アンテナ内蔵モジュールの下面図である。It is a bottom view of a module with a built-in antenna. 図１１のＸＩＶ－ＸＩＶ断面図である。FIG. 14 is a sectional view taken along line XIV-XIV in FIG. 11. 実施の形態１に従うアンテナ内蔵モジュールからアンテナ導体が取り除かれたモジュールの配線基板を上方から示した図である。It is the figure which showed the wiring board of the module from which the antenna conductor was removed from the module with a built-in antenna according to Embodiment 1 from upper direction. 実施の形態２に従うアンテナ内蔵モジュールからアンテナ導体が取り除かれたモジュールの配線基板を上方から示した図である。It is the figure which showed the wiring board of the module by which the antenna conductor was removed from the module with a built-in antenna according to Embodiment 2 from upper direction.
　以下、この発明の実施の形態について、図面を参照しながら詳細に説明する。以下では、複数の実施の形態について説明するが、各実施の形態で説明された構成を適宜組み合わせることは出願当初から予定されている。なお、図中同一又は相当部分には同一符号を付してその説明は繰り返さない。 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Hereinafter, a plurality of embodiments will be described. However, it is planned from the beginning of the application to appropriately combine the configurations described in the embodiments. In the drawings, the same or corresponding portions are denoted by the same reference numerals and description thereof will not be repeated.
　［実施の形態１］
　（アンテナ内蔵モジュールの構成）
　図１は、本実施の形態１に従うアンテナ内蔵モジュールを前方から示した斜視図である。図２は、本実施の形態１に従うアンテナ内蔵モジュールを後方から示した斜視図である。図３は、本実施の形態１に従うアンテナ内蔵モジュールの配線基板に実装されている部品を上方から示した図である。 [Embodiment 1]
(Configuration of module with built-in antenna)
FIG. 1 is a perspective view showing a module with a built-in antenna according to the first embodiment from the front. FIG. 2 is a perspective view showing the module with a built-in antenna according to the first embodiment from the rear. FIG. 3 is a diagram showing components mounted on the wiring board of the antenna built-in module according to the first embodiment from above.
　なお、図１～図３中、矢印Ｄは鉛直方向下方を示し、矢印Ｕは鉛直方向上方を示す。矢印Ｆはアンテナ内蔵モジュールの前方向を示し、矢印Ｂはアンテナ内蔵モジュールの後ろ方向を示す。矢印Ｌ，Ｒは、アンテナ内蔵モジュールの左方向及び右方向をそれぞれ示す。これらは図４～図１６においても共通である。 In FIGS. 1 to 3, an arrow D indicates a vertically downward direction, and an arrow U indicates a vertically upward direction. Arrow F indicates the front direction of the module with a built-in antenna, and arrow B indicates the rear direction of the module with a built-in antenna. Arrows L and R respectively indicate the left direction and the right direction of the antenna built-in module. These are common to FIGS. 4 to 16.
　図１～図３を参照して、アンテナ内蔵モジュール１は、スマートフォン等の通信装置（不図示）のセット基板に実装される無線通信モジュールである。アンテナ内蔵モジュール１は、たとえば、ＬＴＥ（Long　Term　Evolution）規格、無線ＬＡＮ規格、Ｂｌｕｅｔｏｏｔｈ（登録商標）に準拠した通信を行なう通信システムを備える。 1 to 3, the antenna built-in module 1 is a wireless communication module mounted on a set substrate of a communication device (not shown) such as a smartphone. The antenna built-in module 1 includes, for example, a communication system that performs communication compliant with LTE (Long Term Evolution) standards, wireless LAN standards, and Bluetooth (registered trademark).
　アンテナ内蔵モジュール１は、配線基板１０と、配線基板１０上に形成された封止樹脂２０とを含む。配線基板１０には、アンテナ導体１２と、電子部品１４と、柱状導体１６とが実装されている（図３）。 The antenna built-in module 1 includes a wiring board 10 and a sealing resin 20 formed on the wiring board 10. An antenna conductor 12, an electronic component 14, and a columnar conductor 16 are mounted on the wiring board 10 (FIG. 3).
　アンテナ導体１２は、無線通信に使用される周波数帯域に応じた形状を有し、金属により形成されている。アンテナ導体１２は、たとえば、配線基板１０上に設けられたアンテナパターンである。電子部品１４は、たとえば、ＲＦ（Radio　Frequency）回路である。ＲＦ回路は、たとえば、ＲＦＩＣ（Radio　Frequency　Integrated　Circuit）、スイッチＩＣ、フィルタ素子、抵抗、インダクタ、キャパシタ等を含み得る。柱状導体１６は、たとえば、金属によって形成されたポール（柱）又はピンである。 The antenna conductor 12 has a shape corresponding to a frequency band used for wireless communication, and is made of metal. The antenna conductor 12 is an antenna pattern provided on the wiring board 10, for example. The electronic component 14 is, for example, an RF (Radio Frequency) circuit. The RF circuit can include, for example, an RFIC (Radio Frequency Integrated Circuit), a switch IC, a filter element, a resistor, an inductor, a capacitor, and the like. The columnar conductor 16 is, for example, a pole (column) or a pin made of metal.
　封止樹脂２０は、アンテナ導体１２、電子部品１４、及び、柱状導体１６を封止するように形成されている。封止樹脂２０は、たとえば、エポキシ樹脂やシアネート樹脂等の熱硬化性樹脂が配線基板１０上に充填されることによって形成されている。 The sealing resin 20 is formed so as to seal the antenna conductor 12, the electronic component 14, and the columnar conductor 16. The sealing resin 20 is formed, for example, by filling the wiring substrate 10 with a thermosetting resin such as an epoxy resin or a cyanate resin.
　アンテナ内蔵モジュール１の上面２６は、アンテナ領域２２と電子回路領域２４とを含む。アンテナ領域２２の下方（矢印Ｄ方向）にはアンテナ導体１２が設けられており、電子回路領域２４の下方には電子部品１４及び柱状導体１６が設けられている。 The upper surface 26 of the antenna built-in module 1 includes an antenna region 22 and an electronic circuit region 24. An antenna conductor 12 is provided below the antenna region 22 (in the direction of arrow D), and an electronic component 14 and a columnar conductor 16 are provided below the electronic circuit region 24.
　電子回路領域２４には導電性膜２３が形成されている一方、アンテナ領域２２には導電性膜が形成されていない。導電性膜２３は、たとえば、ステンレス等の金属をスパッタリングすることによって形成されたり、フォトリソグラフィによって形成される。導電性膜２３は、電子部品１４から放射されるノイズをシールドする目的で形成されている。アンテナ導体１２の上方（矢印Ｕ方向）には導電性膜が形成されていないため、導電性膜によるアンテナ導体１２の放射特性の低下は抑制されている。 In the electronic circuit region 24, the conductive film 23 is formed, while in the antenna region 22, the conductive film is not formed. The conductive film 23 is formed, for example, by sputtering a metal such as stainless steel or by photolithography. The conductive film 23 is formed for the purpose of shielding noise radiated from the electronic component 14. Since the conductive film is not formed above the antenna conductor 12 (in the direction of the arrow U), the deterioration of the radiation characteristics of the antenna conductor 12 due to the conductive film is suppressed.
　アンテナ内蔵モジュール１の後方側面４０には導電性膜２８が形成されている。配線基板１０は、金属で形成されたビア導体１７（後述）、グラウンド層１９（接地層）を含む。導電性膜２８は、後方側面４０のうち、上端から少なくともグラウンド層１９までの領域において形成されている。導電性膜２８も、導電性膜２３と同様、電子部品１４から放射されるノイズをシールドする目的で形成されている。 The conductive film 28 is formed on the rear side surface 40 of the antenna built-in module 1. The wiring board 10 includes a via conductor 17 (described later) and a ground layer 19 (ground layer) formed of metal. The conductive film 28 is formed in the rear side surface 40 in a region from the upper end to at least the ground layer 19. Similarly to the conductive film 23, the conductive film 28 is also formed for the purpose of shielding noise emitted from the electronic component 14.
　なお、後方側面４０に含まれる封止樹脂２０の側面（導電性膜２８が形成された面）は、電子部品１４から見て、アンテナ導体１２の方向を前方とした場合に、後方に位置する封止樹脂２０の側面ともいえる。なお、アンテナ内蔵モジュール１の他の側面（前方側面３０、左方側面３２、右方側面４２）には導電性膜が形成されていない。 Note that the side surface (the surface on which the conductive film 28 is formed) of the sealing resin 20 included in the rear side surface 40 is located rearward when the direction of the antenna conductor 12 is the front as viewed from the electronic component 14. It can also be said to be a side surface of the sealing resin 20. In addition, the conductive film is not formed on the other side surfaces (front side surface 30, left side surface 32, right side surface 42) of the antenna built-in module 1.
　配線基板１０においてビア導体１７（後述）が配置する部分の上には、柱状導体１６が設けられている。各柱状導体１６は、ビア導体１７を介して、グラウンド層１９に接続されている。また、各柱状導体１６の上端は、導電性膜２３に接続されている。 A columnar conductor 16 is provided on a portion of the wiring board 10 where via conductors 17 (described later) are arranged. Each columnar conductor 16 is connected to the ground layer 19 via a via conductor 17. The upper end of each columnar conductor 16 is connected to the conductive film 23.
　電子部品１４は、２本の柱状導体１６と導電性膜２８とによって取り囲まれる領域Ａ１内に配置されている。電子部品１４は、上下方向に関しては、導電性膜２３と配線基板１０（グラウンド層１９）とによって挟まれている。すなわち、電子部品１４は、グラウンド層１９、２本の柱状導体１６、柱状導体をグラウンド層１９と接続するビア導体１７及び、導電性膜２３，２８によって周囲を取り囲まれている。 The electronic component 14 is disposed in a region A1 surrounded by the two columnar conductors 16 and the conductive film 28. The electronic component 14 is sandwiched between the conductive film 23 and the wiring substrate 10 (ground layer 19) in the vertical direction. That is, the electronic component 14 is surrounded by the ground layer 19, the two columnar conductors 16, the via conductors 17 that connect the columnar conductors to the ground layer 19, and the conductive films 23 and 28.
　グラウンド層１９、ビア導体１７、柱状導体１６、及び、導電性膜２３，２８はすべて導電性材料で形成されているため、これらによって電子部品１４のシールドが形成される。なお、このシールドにおける最も広い隙間（有限長の開口）は、２本の柱状導体１６間の領域である。したがって、有限長の開口は、１／４波長が２本の柱状導体１６間の距離よりも長いノイズに関して、シールドとして機能する。 Since the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 are all made of a conductive material, the shield of the electronic component 14 is formed by these. The widest gap (a finite-length opening) in this shield is a region between the two columnar conductors 16. Therefore, the finite-length opening functions as a shield with respect to noise whose quarter wavelength is longer than the distance between the two columnar conductors 16.
　また、各柱状導体１６は、アンテナ導体１２と電子部品１４との並び方向において、アンテナ導体１２と電子部品１４との間の領域に設けられている。したがって、柱状導体１６は、電子部品１４からアンテナ導体１２に向かって放射されるノイズをシールドし得る。 Further, each columnar conductor 16 is provided in a region between the antenna conductor 12 and the electronic component 14 in the arrangement direction of the antenna conductor 12 and the electronic component 14. Therefore, the columnar conductor 16 can shield noise radiated from the electronic component 14 toward the antenna conductor 12.
　図４は、本実施の形態１に従うアンテナ内蔵モジュールの下面図である。図４を参照して、配線基板１０の下面側には複数の接続端子１８が露出している。 FIG. 4 is a bottom view of the module with a built-in antenna according to the first embodiment. Referring to FIG. 4, a plurality of connection terminals 18 are exposed on the lower surface side of wiring board 10.
　接続端子１８は、アンテナ内蔵モジュール１の外部のセット基板に直接的又は間接的に接続され得る。アンテナ導体１２及び電子部品１４は、接続端子１８を介して信号の入出力を行なう。接続端子１８に含まれるアンテナ導体１２の入出力端子と、接続端子１８に含まれる電子部品１４の入出力端子とは、たとえば、アンテナ内蔵モジュール１外部の整合素子を介して互いに接続される。アンテナ内蔵モジュール１のユーザは、たとえば、接続端子１８に含まれる電子部品１４の入出力端子の入出力信号を見るだけで、電子部品１４の入出力特性を測定することができる。 The connection terminal 18 can be directly or indirectly connected to an external set substrate of the antenna built-in module 1. The antenna conductor 12 and the electronic component 14 input and output signals through the connection terminals 18. The input / output terminals of the antenna conductor 12 included in the connection terminal 18 and the input / output terminals of the electronic component 14 included in the connection terminal 18 are connected to each other via, for example, a matching element outside the antenna built-in module 1. For example, the user of the module with a built-in antenna 1 can measure the input / output characteristics of the electronic component 14 only by looking at the input / output signals of the input / output terminals of the electronic component 14 included in the connection terminal 18.
　図５は、図２のＶ－Ｖ断面図である。図５を参照して、上述の通り、電子部品１４は、グラウンド層１９、ビア導体１７、柱状導体１６、及び、導電性膜２３，２８によって周囲を取り囲まれている。したがって、上述の通り、グラウンド層１９、ビア導体１７、柱状導体１６、及び、導電性膜２３，２８は、電子部品１４のシールドを形成する。 FIG. 5 is a VV cross-sectional view of FIG. With reference to FIG. 5, as described above, the electronic component 14 is surrounded by the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28. Therefore, as described above, the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 form a shield for the electronic component 14.
　図６は、本実施の形態１に従うアンテナ内蔵モジュールの通信装置への実装例を説明するための図である。図６を参照して、アンテナ内蔵モジュール１は、セット基板１５０に実装される。 FIG. 6 is a diagram for explaining an example of mounting the module with a built-in antenna according to the first embodiment on a communication device. Referring to FIG. 6, antenna built-in module 1 is mounted on set substrate 150.
　セット基板１５０には、他にも電子部品１６０が実装されている。電子部品１６０には、たとえば、アンテナ内蔵モジュール１側のインピーダンスとセット基板１５０側のインピーダンスとを整合させるための整合素子を用いることができる。この場合、アンテナ内蔵モジュール１には整合素子が含まれず、通信装置１００においては、アンテナ内蔵モジュール１の外部の整合素子が用いられる。したがって、ユーザは、アンテナ内蔵モジュール１をセット基板１５０に接続する場合に、アンテナ内蔵モジュール１のセット基板１５０への実装状態（周囲の電子部品のノイズ状態等）に応じた整合素子を選択することができる。 Other electronic components 160 are mounted on the set substrate 150. For the electronic component 160, for example, a matching element for matching the impedance on the antenna built-in module 1 side and the impedance on the set substrate 150 side can be used. In this case, the antenna built-in module 1 does not include a matching element, and the communication device 100 uses a matching element outside the antenna built-in module 1. Therefore, when connecting the module with a built-in antenna 1 to the set substrate 150, the user selects a matching element according to the mounting state of the module with a built-in antenna 1 on the set substrate 150 (such as a noise state of surrounding electronic components). Can do.
　（アンテナの放射特性の低下抑制）
　再び図１及び図２を参照して、たとえば、アンテナ内蔵モジュール１において、柱状導体１６を設けることなく、左方側面３２及び右方側面４２の全面に導電性膜を形成することによって電子部品１４のシールドを形成することも考えられる。 (Suppression of deterioration of antenna radiation characteristics)
Referring to FIGS. 1 and 2 again, for example, in the antenna built-in module 1, the electronic component 14 is formed by forming a conductive film on the entire left side surface 32 and right side surface 42 without providing the columnar conductor 16. It is also conceivable to form a shield.
　この場合には、電子部品１４は、導電性膜２３、左方側面３２及び右方側面４２に形成された導電性膜、並びに、グラウンド層１９によって周囲を取り囲まれることになる。導電性膜２３、左方側面３２及び右方側面４２に形成された導電性膜、並びに、グラウンド層１９はすべて導電性材料であるため、これらは電子部品１４のシールドを形成する。 In this case, the electronic component 14 is surrounded by the conductive film 23, the conductive films formed on the left side surface 32 and the right side surface 42, and the ground layer 19. Since the conductive film 23, the conductive films formed on the left side surface 32 and the right side surface 42, and the ground layer 19 are all conductive materials, they form a shield for the electronic component 14.
　しかしながら、この場合には、封止樹脂２０のうちアンテナ導体１２を封止している部分の側面（左方側面３２及び右方側面４２の前方寄りの部分）にも導電性膜が形成されることになり、アンテナ導体１２の放射特性が低下する。また、左方側面３２及び右方側面４２のうち、アンテナ導体１２を封止していない部分（左方側面３２及び右方側面４２の後方寄りの部分）にだけ導電性膜を形成することはアンテナ内蔵モジュール１の製造上困難である。 However, in this case, a conductive film is also formed on the side surface of the sealing resin 20 that seals the antenna conductor 12 (the front side portion of the left side surface 32 and the right side surface 42). As a result, the radiation characteristics of the antenna conductor 12 deteriorate. In addition, it is possible to form a conductive film only on portions of the left side surface 32 and the right side surface 42 where the antenna conductor 12 is not sealed (portions closer to the rear of the left side surface 32 and the right side surface 42). It is difficult to manufacture the antenna built-in module 1.
　本実施の形態１に従うアンテナ内蔵モジュール１においては、柱状導体１６と、導電性膜２３と、グラウンド層１９と、ビア導体１７と、たとえば、導電性膜２８とによって電子部品１４のシールドが形成される。このアンテナ内蔵モジュール１においては、たとえば、封止樹脂２０の側面のうち、導電性膜２８が形成されている側面以外の側面（前方側面３０、左方側面３２、右方側面４２）には導電性膜が形成されていない。したがって、たとえば、左方側面３２及び右方側面４２の導電性膜によってアンテナ導体１２の放射特性が悪影響を受けることもない。よって、アンテナ内蔵モジュール１によれば、電子部品１４のシールドを形成するとともに、アンテナ導体１２の放射特性の低下を抑制することができる。 In the antenna built-in module 1 according to the first embodiment, the columnar conductor 16, the conductive film 23, the ground layer 19, the via conductor 17, and the conductive film 28, for example, form a shield for the electronic component 14. The In this module 1 with a built-in antenna, for example, the side surface (front side surface 30, left side surface 32, right side surface 42) other than the side surface on which the conductive film 28 is formed among the side surfaces of the sealing resin 20 is conductive. The characteristic film is not formed. Therefore, for example, the radiation characteristics of the antenna conductor 12 are not adversely affected by the conductive films on the left side surface 32 and the right side surface 42. Therefore, according to the module 1 with a built-in antenna, it is possible to form a shield for the electronic component 14 and to suppress a decrease in radiation characteristics of the antenna conductor 12.
　（製造方法）
　図７は、本実施の形態１に従うアンテナ内蔵モジュールの製造工程を、図３のＶＩＩ－ＶＩＩ断面の方向から示した図である。図８は、本実施の形態１に従うアンテナ内蔵モジュールの製造工程を、図３のＶＩＩＩ－ＶＩＩＩ断面の方向から示した図である。 (Production method)
FIG. 7 is a diagram showing the manufacturing process of the antenna built-in module according to the first embodiment from the direction of the VII-VII cross section of FIG. FIG. 8 is a diagram showing the manufacturing process of the antenna built-in module according to the first embodiment from the direction of the VIII-VIII cross section of FIG.
　図７及び図８を参照して、まず、配線基板１０上に、アンテナ導体１２、電子部品１４、及び、柱状導体１６が実装される。柱状導体１６は、配線基板１０に設けられたビア導体１７を通して、グラウンド層１９に接続される（図７（ａ）、図８（ａ））。アンテナ導体１２等が実装された配線基板１０上に封止樹脂２０が充填される（図７（ｂ）、図８（ｂ））。 7 and 8, first, the antenna conductor 12, the electronic component 14, and the columnar conductor 16 are mounted on the wiring board 10. The columnar conductor 16 is connected to the ground layer 19 through a via conductor 17 provided in the wiring board 10 (FIGS. 7A and 8A). The sealing resin 20 is filled on the wiring substrate 10 on which the antenna conductor 12 and the like are mounted (FIGS. 7B and 8B).
　封止樹脂２０の厚さが所定の厚さとなるように、封止樹脂２０及び柱状導体１６が削り出される。なお、所定の厚さは、少なくとも柱状導体１６が外部に露出する厚さである（図７（ｃ）、図８（ｃ））。その後、封止樹脂２０及び配線基板１０の後方がハーフカットされ、溝２９が形成される。溝２９の深さは、少なくともグラウンド層１９に到達する深さである（図７（ｄ）、図８（ｄ））。 The sealing resin 20 and the columnar conductor 16 are cut out so that the thickness of the sealing resin 20 becomes a predetermined thickness. The predetermined thickness is a thickness at which at least the columnar conductor 16 is exposed to the outside (FIGS. 7C and 8C). Thereafter, the sealing resin 20 and the back of the wiring substrate 10 are half-cut to form the grooves 29. The depth of the groove 29 is a depth that reaches at least the ground layer 19 (FIGS. 7D and 8D).
　封止樹脂２０の上面に導電性材料が塗布されることによって、導電性膜２３が形成されるとともに、溝２９に導電性材料が充填される（図７（ｅ）、図８（ｅ））。導電性膜２３のうち、アンテナ領域２２に形成されていた導電性膜が削除される（図７（ｆ）、図８（ｆ））。そして、配線基板１０の後方がフルカットされるとともに、配線基板１０及び封止樹脂２０の前方、左方、及び、右方がフルカットされることによって、アンテナ内蔵モジュール１が完成する（図７（ｇ）、図８（ｇ））。 By applying a conductive material on the upper surface of the sealing resin 20, a conductive film 23 is formed and the conductive material is filled in the grooves 29 (FIGS. 7E and 8E). . Of the conductive film 23, the conductive film formed in the antenna region 22 is deleted (FIG. 7 (f), FIG. 8 (f)). Then, the back of the wiring board 10 is fully cut, and the front, left, and right sides of the wiring board 10 and the sealing resin 20 are fully cut, whereby the antenna built-in module 1 is completed (FIG. 7). (G), FIG. 8 (g)).
　このようにして完成したアンテナ内蔵モジュール１において、電子部品１４は、グラウンド層１９、ビア導体１７、柱状導体１６、及び、導電性膜２３、２８によって周囲を取り囲まれている。すなわち、電子部品１４の上下左右前後方向の各々には、導電体の有限長開口又は導電面が形成される。したがって、グラウンド層１９、ビア導体１７、柱状導体１６、及び、導電性膜２３、２８は、電子部品１４のシールドを形成する。 In the antenna built-in module 1 thus completed, the electronic component 14 is surrounded by the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28. That is, a finite length opening or a conductive surface of a conductor is formed in each of the electronic component 14 in the vertical and horizontal directions. Therefore, the ground layer 19, the via conductor 17, the columnar conductor 16, and the conductive films 23 and 28 form a shield for the electronic component 14.
　また、アンテナ内蔵モジュール１において、左方側面３２、及び、右方側面４２には、導電性膜が形成されていない。したがって、左右の側面方向において、アンテナ導体１２の放射特性の低下は抑制されている。 In the antenna built-in module 1, no conductive film is formed on the left side surface 32 and the right side surface 42. Therefore, the deterioration of the radiation characteristics of the antenna conductor 12 is suppressed in the left and right side surfaces.
　図９は、本実施の形態１に従うアンテナ内蔵モジュールの左方側面及び右方側面に導電性膜が形成されていないことによる他の利点（アンテナ導体１２の放射特性の低下抑制以外の利点）を説明するための図である。 FIG. 9 shows other advantages (advantages other than suppression of deterioration of the radiation characteristics of the antenna conductor 12) due to the fact that the conductive film is not formed on the left side surface and the right side surface of the antenna built-in module according to the first embodiment. It is a figure for demonstrating.
　図９を参照して、仮にアンテナ内蔵モジュール１の左方側面及び右方側面に導電性膜を形成するとした場合、まず、封止樹脂２０及び配線基板１０の左方及び右方がハーフカットされ、溝９１，９２が形成される（図９（ａ））。 Referring to FIG. 9, if a conductive film is formed on the left side surface and the right side surface of the antenna built-in module 1, first, the left and right sides of the sealing resin 20 and the wiring substrate 10 are half-cut. Then, grooves 91 and 92 are formed (FIG. 9A).
　その後、封止樹脂２０の上面に導電性材料が塗布されることによって導電性膜２３が形成されるとともに、溝９１，９２に導電性材料が充填される（図９（ｂ））。そして、溝９１，９２に沿って、Ｘの位置で配線基板１０のフルカットが行なわれることによって、導電性膜９３，９４が形成される（図９（ｃ））。 Thereafter, the conductive film 23 is formed by applying a conductive material on the upper surface of the sealing resin 20, and the grooves 91 and 92 are filled with the conductive material (FIG. 9B). Then, the wiring substrate 10 is fully cut at the position X along the grooves 91 and 92, thereby forming the conductive films 93 and 94 (FIG. 9C).
　このように、導電性膜９３，９４を形成するためには、ハーフカットを行なう必要がある。したがって、本実施の形態１に従うアンテナ内蔵モジュール１においては、導電性膜９３，９４を形成しないことによって、ハーフカットの回数を低減することができる。その結果、アンテナ内蔵モジュール１の製造工程の短縮が実現されている。 Thus, in order to form the conductive films 93 and 94, it is necessary to perform a half cut. Therefore, in antenna built-in module 1 according to the first embodiment, the number of half cuts can be reduced by not forming conductive films 93 and 94. As a result, the manufacturing process of the antenna built-in module 1 can be shortened.
　また、導電性膜９３，９４を形成しない場合には、たとえば、図９（ｃ）のＹの位置でフルカットを行なうことができる。すなわち、導電性膜９３，９４を形成することによって、スペース２００が余分に必要になってしまう。したがって、本実施の形態１に従うアンテナ内蔵モジュール１においては、導電性膜９３，９４を形成しないことによって、アンテナ内蔵モジュール１の小型化を実現している。 Further, when the conductive films 93 and 94 are not formed, for example, a full cut can be performed at a position Y in FIG. 9C. That is, by forming the conductive films 93 and 94, an extra space 200 is required. Therefore, in the antenna built-in module 1 according to the first embodiment, the miniaturization of the antenna built-in module 1 is realized by not forming the conductive films 93 and 94.
　以上のように、本実施の形態１に従うアンテナ内蔵モジュール１においては、柱状導体１６と、導電性膜２３と、グラウンド層１９と、ビア導体１７と、たとえば、導電性膜２８とによって電子部品１４のシールドが形成される。したがって、アンテナ内蔵モジュール１によれば、電子部品１４のシールドを形成するとともに、アンテナ導体１２の放射特性の低下を抑制することができる。 As described above, in the antenna built-in module 1 according to the first embodiment, the electronic component 14 includes the columnar conductor 16, the conductive film 23, the ground layer 19, the via conductor 17, and the conductive film 28, for example. A shield is formed. Therefore, according to the module 1 with a built-in antenna, it is possible to form a shield for the electronic component 14 and to suppress a decrease in radiation characteristics of the antenna conductor 12.
　［実施の形態２］
　上記実施の形態１に従うアンテナ内蔵モジュール１においては、封止樹脂２０の上面２６のうち、アンテナ領域２２には導電性膜が形成されていない。本実施の形態２に従うアンテナ内蔵モジュールにおいては、アンテナ領域の一部に導電性膜が形成される。 [Embodiment 2]
In antenna built-in module 1 according to the first embodiment, no conductive film is formed in antenna region 22 of upper surface 26 of sealing resin 20. In the antenna built-in module according to the second embodiment, a conductive film is formed in a part of the antenna region.
　また、上記実施の形態１に従うアンテナ内蔵モジュール１においては、アンテナ内蔵モジュール１の後方側面４０に導電性膜２８が形成されている。本実施の形態２に従うアンテナ内蔵モジュールにおいては、アンテナ内蔵モジュールの後方側面に導電性膜が形成されない。その代わりに、配線基板上においてアンテナ内蔵モジュールの後方側面側の領域にも柱状導体が設けられる。 In the antenna built-in module 1 according to the first embodiment, the conductive film 28 is formed on the rear side surface 40 of the antenna built-in module 1. In the antenna built-in module according to the second embodiment, the conductive film is not formed on the rear side surface of the antenna built-in module. Instead, columnar conductors are also provided in the region on the rear side surface of the antenna built-in module on the wiring board.
　図１０は、本実施の形態２に従うアンテナ内蔵モジュールを前方から示した斜視図である。図１１は、本実施の形態２に従うアンテナ内蔵モジュールを後方から示した斜視図である。図１２は、本実施の形態２に従うアンテナ内蔵モジュールの配線基板に実装されている部品を上方から示した図である。図１３は、本実施の形態２に従うアンテナ内蔵モジュールの下面図である。なお、ここでは、実施の形態１と異なる部分を中心に説明し、実施の形態１と同様な部分については説明を繰り返さない。 FIG. 10 is a perspective view showing the antenna built-in module according to the second embodiment from the front. FIG. 11 is a perspective view showing the antenna built-in module according to the second embodiment from the rear. FIG. 12 is a diagram showing components mounted on the wiring board of the antenna built-in module according to the second embodiment from above. FIG. 13 is a bottom view of the antenna built-in module according to the second embodiment. Here, the description will focus on the parts different from the first embodiment, and the description of the same parts as in the first embodiment will not be repeated.
　図１０～図１３を参照して、アンテナ内蔵モジュール２は、配線基板５０と、配線基板５０上に形成された封止樹脂６０とを含む。配線基板５０には、アンテナ導体５９と、電子部品１４と、柱状導体１６，５４，５５，５６，５７とが実装されている。柱状導体５４，５５，５６，５７は、柱状導体１６と同様、たとえば、金属によって形成されたポール又はピンである。 10 to 13, the antenna built-in module 2 includes a wiring board 50 and a sealing resin 60 formed on the wiring board 50. On the wiring board 50, the antenna conductor 59, the electronic component 14, and the columnar conductors 16, 54, 55, 56, and 57 are mounted. The columnar conductors 54, 55, 56, and 57 are, for example, poles or pins formed of metal, like the columnar conductor 16.
　アンテナ内蔵モジュール２の上面６６は、アンテナ領域６２と電子回路領域６４とを含む。アンテナ領域６２の下方（矢印Ｄ方向）にはアンテナ導体５９及び柱状導体５４，５５，５７が設けられており、電子回路領域６４の下方には電子部品１４及び柱状導体１６，５６が設けられている。 The upper surface 66 of the antenna built-in module 2 includes an antenna region 62 and an electronic circuit region 64. An antenna conductor 59 and columnar conductors 54, 55, 57 are provided below the antenna area 62 (in the direction of arrow D), and an electronic component 14 and columnar conductors 16, 56 are provided below the electronic circuit area 64. Yes.
　電子回路領域６４には導電性膜６１が形成されている。導電性膜６１は、実施の形態１と同様、電子部品１４の上方においてシールドを形成する。 In the electronic circuit region 64, a conductive film 61 is formed. As in the first embodiment, the conductive film 61 forms a shield above the electronic component 14.
　アンテナ領域６２は、樹脂領域６３と、導電性膜領域６５とを含む。導電性膜領域６５には、２本の帯状の導電性膜６７，６８が形成されている。これらの２本の導電性膜６７，６８は、互いに平行となるように形成されている。詳細については後述するが、導電性膜６７，６８は、アンテナ内蔵モジュール２におけるアンテナの一部を形成する。 The antenna region 62 includes a resin region 63 and a conductive film region 65. In the conductive film region 65, two strip-shaped conductive films 67 and 68 are formed. These two conductive films 67 and 68 are formed so as to be parallel to each other. Although details will be described later, the conductive films 67 and 68 form part of the antenna in the antenna built-in module 2.
　一方、樹脂領域６３には導電性膜が形成されていない。樹脂領域６３においては、封止樹脂２０の一部が削られている。したがって、樹脂領域６３下方の封止樹脂２０の厚みは、導電性膜領域６５下方の封止樹脂２０の厚みよりも薄い。 On the other hand, no conductive film is formed in the resin region 63. In the resin region 63, a part of the sealing resin 20 is shaved. Therefore, the thickness of the sealing resin 20 below the resin region 63 is thinner than the thickness of the sealing resin 20 below the conductive film region 65.
　なお、本実施の形態２においては、実施の形態１と異なり、アンテナ内蔵モジュール２の後方側面８０には導電性膜が形成されていない。また、実施の形態１と同様、アンテナ内蔵モジュール２の前方側面７０、左方側面７２、及び、右方側面８２にも導電性膜が形成されていない。 In the second embodiment, unlike the first embodiment, the conductive film is not formed on the rear side surface 80 of the antenna built-in module 2. Similarly to the first embodiment, the conductive film is not formed on the front side surface 70, the left side surface 72, and the right side surface 82 of the module 2 with a built-in antenna.
　配線基板５０のうちビア導体１７が形成された部分の上には、２本の柱状導体１６と、２本の柱状導体５６とが配置されている。２本の柱状導体１６は、アンテナ導体５９と電子部品１４との間の領域に実装されており、２本の柱状導体５６が、電子部品１４よりも後方の領域に実装されている。柱状導体１６，５６の各々は、ビア導体１７を介して、配線基板５０内に含まれるグラウンド層７９（後述）と、導電性膜６１とに接続されている。 The two columnar conductors 16 and the two columnar conductors 56 are disposed on the portion of the wiring board 50 where the via conductors 17 are formed. The two columnar conductors 16 are mounted in a region between the antenna conductor 59 and the electronic component 14, and the two columnar conductors 56 are mounted in a region behind the electronic component 14. Each of the columnar conductors 16 and 56 is connected to a ground layer 79 (described later) included in the wiring substrate 50 and the conductive film 61 via the via conductor 17.
　電子部品１４は、２本の柱状導体１６と、２本の柱状導体５６とによって取り囲まれる領域Ａ２内に配置されている。電子部品１４は、上下方向に関しては、導電性膜６１と配線基板５０（グラウンド層７９）とによって挟まれている。すなわち、電子部品１４は、グラウンド層７９、２本の柱状導体１６、２本の柱状導体５６、ビア導体１７、及び、導電性膜６１によって周囲を取り囲まれている。グラウンド層７９、柱状導体１６，５６、ビア導体１７、及び、導電性膜６１はすべて導電性材料で形成されている。したがって、電子部品１４の上下左右前後方向の各々には、導電体の有限長開口又はベタ面が存在することになる。すなわち、グラウンド層７９、柱状導体１６，５６、ビア導体１７、及び、導電性膜６１によって、電子部品１４のシールドが形成される。 The electronic component 14 is disposed in a region A <b> 2 surrounded by the two columnar conductors 16 and the two columnar conductors 56. The electronic component 14 is sandwiched between the conductive film 61 and the wiring substrate 50 (ground layer 79) in the vertical direction. That is, the electronic component 14 is surrounded by the ground layer 79, the two columnar conductors 16, the two columnar conductors 56, the via conductors 17, and the conductive film 61. The ground layer 79, the columnar conductors 16 and 56, the via conductor 17 and the conductive film 61 are all formed of a conductive material. Therefore, a finite-length opening or a solid surface of the conductor exists in each of the upper, lower, left, and right front-back directions of the electronic component 14. That is, the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61 form a shield for the electronic component 14.
　このように、本実施の形態２においては、アンテナ内蔵モジュール２の後方側面側に導電性膜を形成することなく、柱状導体５６を設けることによって電子部品１４のシールドが形成される。これにより、実施の形態１と比較して、アンテナ内蔵モジュール２の製造過程において背面側のハーフカットの回数をさらに減らすことができ、アンテナ内蔵モジュール２をさらに小型化することができる。 Thus, in the second embodiment, the shield of the electronic component 14 is formed by providing the columnar conductor 56 without forming the conductive film on the rear side surface side of the module with a built-in antenna 2. Thereby, compared with Embodiment 1, the frequency | count of the half cut of a back side can be further reduced in the manufacture process of the module 2 with a built-in antenna, and the module 2 with a built-in antenna can be further reduced in size.
　また、配線基板５０上には、柱状導体５４，５５，５７が実装されている。また、配線基板５０の下面には、アンテナ導体６９及び複数の接続端子５８が設けられている。 Further, columnar conductors 54, 55, and 57 are mounted on the wiring board 50. An antenna conductor 69 and a plurality of connection terminals 58 are provided on the lower surface of the wiring board 50.
　柱状導体５４は、アンテナ導体５９と導電性膜６７とに接続されている。柱状導体５７は、導電性膜６７とアンテナ導体６９とに接続されている。柱状導体５５は、アンテナ導体６９と導電性膜６８とに接続されている。 The columnar conductor 54 is connected to the antenna conductor 59 and the conductive film 67. The columnar conductor 57 is connected to the conductive film 67 and the antenna conductor 69. The columnar conductor 55 is connected to the antenna conductor 69 and the conductive film 68.
　このように、本実施の形態２においては、アンテナ導体５９と、柱状導体５４と、導電性膜６７と、柱状導体５７と、アンテナ導体６９と、柱状導体５５と、導電性膜６８とが電気的に接続されることによって、１本の立体的なアンテナが形成されている。これにより、実施の形態１と比較して、アンテナ全体としての電気長を長くすることができる。その結果、たとえば、アンテナの電気長をある一定の長さにする場合に、モジュールの大きさを小型化することができる。 Thus, in the second embodiment, the antenna conductor 59, the columnar conductor 54, the conductive film 67, the columnar conductor 57, the antenna conductor 69, the columnar conductor 55, and the conductive film 68 are electrically connected. Are connected to form a three-dimensional antenna. Thereby, compared with Embodiment 1, the electrical length as the whole antenna can be lengthened. As a result, for example, when the electrical length of the antenna is set to a certain length, the size of the module can be reduced.
　図１４は、図１１のＸＩＶ－ＸＩＶ断面図である。図１４を参照して、上述の通り、電子部品１４は、グラウンド層７９、柱状導体１６，５６、ビア導体１７、及び、導電性膜６１によって周囲を取り囲まれている。したがって、上述の通り、グラウンド層７９、柱状導体１６，５６、ビア導体１７、及び、導電性膜６１は、電子部品１４のシールドを形成する。 FIG. 14 is a cross-sectional view taken along the line XIV-XIV in FIG. Referring to FIG. 14, as described above, the electronic component 14 is surrounded by the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61. Therefore, as described above, the ground layer 79, the columnar conductors 16 and 56, the via conductor 17, and the conductive film 61 form a shield for the electronic component 14.
　また、上述の通り、樹脂領域６３の下方の封止樹脂６０の厚さは、導電性膜領域６５の下方の封止樹脂２０の厚さよりも薄い。一般的に、封止樹脂６０の誘電率は空気の誘電率よりも高い。樹脂領域６３において封止樹脂６０が深く削られ、削られた領域が誘電率が低い空気で満たされることによって、導電性膜６７，６８と配線基板５０との間の容量性結合が低下する。また、導電性膜６７と導電性膜６８との間の容量性結合も低下する。その結果、アンテナの放射特性を向上することができる。 Also, as described above, the thickness of the sealing resin 60 below the resin region 63 is thinner than the thickness of the sealing resin 20 below the conductive film region 65. Generally, the dielectric constant of the sealing resin 60 is higher than the dielectric constant of air. When the sealing resin 60 is deeply cut in the resin region 63 and the cut region is filled with air having a low dielectric constant, the capacitive coupling between the conductive films 67 and 68 and the wiring substrate 50 is lowered. In addition, capacitive coupling between the conductive film 67 and the conductive film 68 is also reduced. As a result, the radiation characteristics of the antenna can be improved.
　なお、本実施の形態２に従うアンテナ内蔵モジュール２も実施の形態１と同様、通信装置（不図示）に含まれるセット基板に実装され得る。この場合には、アンテナ内蔵モジュール２は、アンテナ内蔵モジュール２の外部の整合素子とともにセット基板に実装することができる。したがって、実施の形態１と同様、ユーザは、アンテナ内蔵モジュール２をセット基板に接続する場合に、アンテナ内蔵モジュール２及びセット基板の特性に応じた整合素子を選択することができる。 Note that the antenna built-in module 2 according to the second embodiment can be mounted on a set substrate included in a communication device (not shown) as in the first embodiment. In this case, the antenna built-in module 2 can be mounted on the set substrate together with a matching element outside the antenna built-in module 2. Therefore, as in the first embodiment, when connecting the module with a built-in antenna 2 to the set substrate, the user can select a matching element according to the characteristics of the module with a built-in antenna 2 and the set substrate.
　また、本実施の形態２に従うアンテナ内蔵モジュール２の製造方法は、主に以下の点で実施の形態１と異なる。すなわち、本実施の形態２においては、アンテナ内蔵モジュール２の後方側面において導電性膜が形成されないため、後方側面においてハーフカットが行なわれない。また、アンテナ領域６２に樹脂領域６３と導電性膜領域６５とを形成するために、電子回路領域６４及びアンテナ領域６２に導電性膜が形成された後に樹脂領域６３の導電性膜と封止樹脂６０とがダイサーによって削り込まれる。この方法によれば、導電性膜６１（シールド）と導電性膜６７，６８（アンテナ）とが一括形成されるので、実施の形態１と比較して追加コストを要することなく、アンテナの電気長を長くすることができる。 The manufacturing method of the antenna built-in module 2 according to the second embodiment is different from the first embodiment mainly in the following points. That is, in the second embodiment, since the conductive film is not formed on the rear side surface of the antenna built-in module 2, the half cut is not performed on the rear side surface. Further, in order to form the resin region 63 and the conductive film region 65 in the antenna region 62, the conductive film and the sealing resin in the resin region 63 are formed after the conductive film is formed in the electronic circuit region 64 and the antenna region 62. 60 is cut by Dicer. According to this method, since the conductive film 61 (shield) and the conductive films 67 and 68 (antenna) are formed at a time, the electrical length of the antenna is not required as compared with the first embodiment, and no additional cost is required. Can be lengthened.
　以上のように、本実施の形態２に従うアンテナ内蔵モジュール２においては、導電性膜６７，６８と、柱状導体５４，５５，５７と、アンテナ導体５９，６９とによってアンテナが形成されている。したがって、このアンテナ内蔵モジュール２によれば、たとえば、配線基板５０上のアンテナ導体５９又はアンテナ導体６９のみによってアンテナを形成する場合よりもアンテナの電気長を長くすることができる。その結果、たとえば、アンテナの電気長をある一定の長さにする場合に、モジュールの大きさを小型化することができる。 As described above, in the antenna built-in module 2 according to the second embodiment, the conductive film 67, 68, the columnar conductors 54, 55, 57, and the antenna conductors 59, 69 form an antenna. Therefore, according to the module 2 with a built-in antenna, for example, the electrical length of the antenna can be made longer than when the antenna is formed only by the antenna conductor 59 or the antenna conductor 69 on the wiring board 50. As a result, for example, when the electrical length of the antenna is set to a certain length, the size of the module can be reduced.
　［他の実施の形態］
　以上のように、この発明の実施の形態として実施の形態１～２を説明した。しかしながら、この発明は必ずしもこの実施の形態１～２に限定されない。ここでは、他の実施の形態の一例について説明する。 [Other embodiments]
As described above, the first and second embodiments have been described as the embodiments of the present invention. However, the present invention is not necessarily limited to the first and second embodiments. Here, an example of another embodiment will be described.
　上記実施の形態１においては、２本の柱状導体１６及び導電性膜２８によって電子部品１４が取り囲まれるとともに、アンテナとしてはアンテナ導体１２が用いられた。また、上記実施の形態２においては、２本の柱状導体１６及び２本の柱状導体５６によって電子部品１４が取り囲まれるとともに、アンテナとしてはアンテナ導体５９，６９等から形成される電気長の長いアンテナが用いられた。しかしながら、電子部品１４を取り囲む方法（シールドの形成方法）と、アンテナとの組み合わせはこれに限定されない。たとえば、２本の柱状導体１６及び導電性膜２８によって電子部品１４を取り囲むとともに、アンテナ導体５９，６９等から形成される電気長の長いアンテナを採用してもよいし、２本の柱状導体１６及び２本の柱状導体５６によって電子部品１４を取り囲むとともに、アンテナ導体１２を採用してもよい。 In the first embodiment, the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28, and the antenna conductor 12 is used as the antenna. In the second embodiment, the electronic component 14 is surrounded by the two columnar conductors 16 and the two columnar conductors 56, and an antenna having a long electrical length formed from the antenna conductors 59, 69, etc. Was used. However, the combination of the method of surrounding the electronic component 14 (shield formation method) and the antenna is not limited to this. For example, an antenna having a long electrical length formed of the antenna conductors 59 and 69 and the like may be employed while the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28, or the two columnar conductors 16 may be employed. In addition, the electronic component 14 may be surrounded by the two columnar conductors 56 and the antenna conductor 12 may be employed.
　また、上記実施の形態１においては、２本の柱状導体１６及び導電性膜２８によって電子部品１４が取り囲まれることとしたが、柱状導体１６と導電性膜２８とによって電子部品１４を取り囲む方法はこれに限定されない。たとえば、１本の柱状導体１６と導電性膜２８とによって電子部品１４を取り囲むこととしてもよい。ただし、この場合には、１本の柱状導体１６と導電性膜２８とによって取り囲まれる領域が、２本の柱状導体１６と導電性膜２８とによって取り囲まれる領域よりも狭くなるため、シールドを形成できる領域が狭くなる。 In the first embodiment, the electronic component 14 is surrounded by the two columnar conductors 16 and the conductive film 28. However, the method of surrounding the electronic component 14 by the columnar conductor 16 and the conductive film 28 is as follows. It is not limited to this. For example, the electronic component 14 may be surrounded by one columnar conductor 16 and the conductive film 28. However, in this case, a region surrounded by one columnar conductor 16 and the conductive film 28 is narrower than a region surrounded by the two columnar conductors 16 and the conductive film 28, so that a shield is formed. The area where it can be narrowed.
　また、たとえば、３本以上の柱状導体１６と導電性膜２８とによって電子部品１４を取り囲むこととしてもよい。３本以上の柱状導体１６をバランスよく設けることによって、柱状導体１６間の距離、及び、柱状導体１６と導電性膜２８との距離が上記実施の形態１よりも短くなる。すなわち、有限長開口の一辺及び対角線の長さが短くなる。その結果、柱状導体１６と導電性膜２８とによってシールドできるノイズの波長が短くなる。よって、柱状導体１６と導電性膜２８とは、より高周波のノイズのシールドとして機能する。 Further, for example, the electronic component 14 may be surrounded by three or more columnar conductors 16 and the conductive film 28. By providing three or more columnar conductors 16 in a well-balanced manner, the distance between the columnar conductors 16 and the distance between the columnar conductors 16 and the conductive film 28 are shorter than those in the first embodiment. That is, the length of one side and the diagonal line of the finite length opening is shortened. As a result, the wavelength of noise that can be shielded by the columnar conductor 16 and the conductive film 28 is shortened. Therefore, the columnar conductor 16 and the conductive film 28 function as a shield for higher frequency noise.
　また、上記実施の形態２においては、２本の柱状導体１６及び２本の柱状導体５６によって電子部品１４が取り囲まれることとしたが、たとえば、電子部品１４を５本以上の柱状導体によって取り囲むこととしてもよい。５本以上の柱状導体をバランスよく設けることによって（たとえば、均等間隔）、柱状導体間の距離が上記実施の形態２よりも短くなる。その結果、５本以上の柱状導体は、より高周波のノイズのシールドとして機能する。 In the second embodiment, the electronic component 14 is surrounded by the two columnar conductors 16 and the two columnar conductors 56. For example, the electronic component 14 is surrounded by five or more columnar conductors. It is good. By providing five or more columnar conductors in a balanced manner (for example, at equal intervals), the distance between the columnar conductors is shorter than that in the second embodiment. As a result, the five or more columnar conductors function as a shield for higher frequency noise.
　また、上記実施の形態１において、アンテナ導体１２は、配線基板１０のうち電子部品１４及び柱状導体１６等が実装される面（上面）に設けられることとした。しかしながら、アンテナ導体１２の位置はこれに限定されない。たとえば、アンテナ導体１２は、配線基板１０の内層や、配線基板１０の下面に設けられることとしてもよい。 In the first embodiment, the antenna conductor 12 is provided on the surface (upper surface) of the wiring board 10 on which the electronic component 14 and the columnar conductor 16 are mounted. However, the position of the antenna conductor 12 is not limited to this. For example, the antenna conductor 12 may be provided on the inner layer of the wiring board 10 or the lower surface of the wiring board 10.
　また、上記実施の形態２においては、アンテナ導体５９，６９は、配線基板１０の上面及び下面にそれぞれ設けられることとした。しかしながら、アンテナ導体５９，６９の位置はこれに限定されない。たとえば、アンテナ導体５９、６９は、配線基板１０の下面及び上面にそれぞれ設けられることとしてもよい。また、たとえば、アンテナ導体５９，６９の各々は、配線基板１０の内層に実装されてもよい。 In the second embodiment, the antenna conductors 59 and 69 are provided on the upper surface and the lower surface of the wiring board 10, respectively. However, the positions of the antenna conductors 59 and 69 are not limited to this. For example, the antenna conductors 59 and 69 may be provided on the lower surface and the upper surface of the wiring board 10, respectively. Further, for example, each of the antenna conductors 59 and 69 may be mounted on the inner layer of the wiring board 10.
　また、上記実施の形態１，２においては、柱状導体１６等の柱状導体は金属によって形成されたポールであるとしたが、柱状導体１６等の柱状導体は必ずしもこれに限定されない。たとえば、柱状導体１６は、ビアを形成し、形成されたビアに導電性樹脂を埋め込むことによって形成されてもよいし、導電性樹脂をポッティングすることによって形成されてもよい。 In the first and second embodiments, the columnar conductor such as the columnar conductor 16 is a pole formed of metal, but the columnar conductor such as the columnar conductor 16 is not necessarily limited to this. For example, the columnar conductor 16 may be formed by forming a via and embedding a conductive resin in the formed via, or may be formed by potting a conductive resin.
　また、上記実施の形態２においては、導電性膜６７，６８は互いに平行に形成されることとしたが、必ずしもこれらの２本は平行である必要はない。また、アンテナ領域６２には２本の帯状の導電性膜６７，６８が形成されることとしたが、必ずしもアンテナ領域６２に形成される帯状の導電性膜は２本である必要はない。たとえば、アンテナ領域６２に形成される帯状の導電性膜は１本であってもよいし、３本以上であってもよい。 In the second embodiment, the conductive films 67 and 68 are formed in parallel to each other. However, the two films are not necessarily parallel to each other. In addition, although the two band-like conductive films 67 and 68 are formed in the antenna region 62, it is not always necessary that the two band-like conductive films are formed in the antenna region 62. For example, the number of strip-shaped conductive films formed in the antenna region 62 may be one, or three or more.
　また、上記実施の形態１，２においては、配線基板１０，５０上の電子部品１４に隣接する領域にアンテナ導体（アンテナ導体１２又はアンテナ導体５９等）が設けられた。しかしながら、配線基板１０，５０において、電子部品１４に隣接する領域にアンテナ導体が設けられなかったとしても、本明細書に開示される技術は効果を奏し得る。 In the first and second embodiments, the antenna conductor (antenna conductor 12 or antenna conductor 59 or the like) is provided in a region adjacent to the electronic component 14 on the wiring boards 10 and 50. However, even if the antenna conductor is not provided in the area adjacent to the electronic component 14 in the wiring boards 10 and 50, the technique disclosed in this specification can be effective.
　図１５は、実施の形態１に従うアンテナ内蔵モジュール１からアンテナ導体が取り除かれたモジュールの配線基板を上方から示した図である。図１６は、実施の形態２に従うアンテナ内蔵モジュール２からアンテナ導体が取り除かれたモジュールの配線基板を上方から示した図である。図１５，１６を参照して、これらのモジュールにおいても、柱状導体１６及び導電性膜２８、又は、柱状導体１６及び柱状導体５６によって、矢印Ｆ，Ｂ，Ｌ，Ｒ方向における電子部品１４のシールドが形成される。したがって、電子部品１４から放射されるノイズが、セット基板において電子部品１４の近くに配置される他の電子部品に与える影響を低減することができる。また、他の電子部品から放射されるノイズが電子部品１４に与える影響を低減することができる。 FIG. 15 is a diagram showing the wiring board of the module from which the antenna conductor is removed from the antenna built-in module 1 according to the first embodiment from above. FIG. 16 is a diagram showing the wiring board of the module in which the antenna conductor is removed from the antenna built-in module 2 according to the second embodiment from above. 15 and 16, also in these modules, the shield of the electronic component 14 in the directions of arrows F, B, L, and R by the columnar conductor 16 and the conductive film 28 or the columnar conductor 16 and the columnar conductor 56. Is formed. Therefore, the influence which the noise radiated | emitted from the electronic component 14 has on other electronic components arrange | positioned near the electronic component 14 in a set board | substrate can be reduced. Moreover, the influence which the noise radiated | emitted from another electronic component has on the electronic component 14 can be reduced.
　今回開示された実施の形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなく、請求の範囲によって示され、請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.
　１，２　アンテナ内蔵モジュール、１０，５０　配線基板、１２，５９，６９　アンテナ導体、１４，１６０　電子部品、１６，５４，５５，５６，５７　柱状導体、１７　ビア導体、１８，５８　接続端子、１９，７９　グラウンド層、２０，６０　封止樹脂、２２，６２　アンテナ領域、２３，２８，６１，６７，６８　導電性膜、２４，６４，９３，９４　電子回路領域、２６，６６　上面、２９，９１，９２　溝、３０，７０　前方側面、３２，７２　左方側面、４０，８０　後方側面、４２，８２　右方側面、６３　樹脂領域、６５　導電性膜領域、１００　通信装置、１５０　セット基板、２００　スペース。 1, 2, antenna built-in module, 10, 50 wiring board, 12, 59, 69 antenna conductor, 14, 160 electronic parts, 16, 54, 55, 56, 57 columnar conductor, 17 via conductor, 18, 58 connection terminal, 19 79 ground layer, 20, 60 sealing resin, 22, 62 antenna area, 23, 28, 61, 67, 68 conductive film, 24, 64, 93, 94 electronic circuit area, 26, 66 top surface, 29, 91 , 92 groove, 30, 70 front side surface, 32, 72 left side surface, 40, 80 rear side surface, 42, 82 right side surface, 63 resin region, 65 conductive film region, 100 communication device, 150 set substrate, 200 space .

Claims (9)

  1. 　接地層を含む配線基板と、
    　前記配線基板に設けられたアンテナ導体と、
    　前記配線基板において、前記アンテナ導体と重ならない領域に設けられた電子部品と、
    　前記アンテナ導体及び前記電子部品を封止するように形成された封止樹脂と、
    　前記封止樹脂の上面のうち前記電子部品を覆う領域に形成された第１の導電性膜と、
    　前記第１の導電性膜と前記接地層とを電気的に接続する少なくとも１つの第１の柱状導体とを備え、
    　前記第１の柱状導体は、前記アンテナ導体の領域と前記電子部品の領域との間に設けられている、アンテナ内蔵モジュール。     A wiring board including a ground layer;
    An antenna conductor provided on the wiring board;
    In the wiring board, an electronic component provided in a region that does not overlap the antenna conductor,
    Sealing resin formed to seal the antenna conductor and the electronic component;
    A first conductive film formed in a region of the upper surface of the sealing resin that covers the electronic component;
    Comprising at least one first columnar conductor for electrically connecting the first conductive film and the ground layer;
    The module with a built-in antenna, wherein the first columnar conductor is provided between a region of the antenna conductor and a region of the electronic component.
  2. 　前記第１の柱状導体は、前記第１の導電性膜及び前記接地層とともに前記電子部品のシールドを形成する、請求項１に記載のアンテナ内蔵モジュール。 The antenna built-in module according to claim 1, wherein the first columnar conductor forms a shield of the electronic component together with the first conductive film and the ground layer.
  3. 　前記電子部品から見て、前記アンテナ導体の方向を前方とした場合に、後方に位置する前記封止樹脂の側面、に形成された第２の導電性膜をさらに備え、
    　前記封止樹脂の側面のうち、前記第２の導電性膜が形成された側面以外の側面には導電性膜が形成されておらず、
    　前記第１の柱状導体は、前記第１及び第２の導電性膜並びに前記接地層とともに前記電子部品のシールドを形成する、請求項１又は２に記載のアンテナ内蔵モジュール。     When viewed from the electronic component, when the direction of the antenna conductor is the front, further comprising a second conductive film formed on the side surface of the sealing resin located behind,
    Of the side surfaces of the sealing resin, no conductive film is formed on side surfaces other than the side surface on which the second conductive film is formed,
    The antenna built-in module according to claim 1, wherein the first columnar conductor forms a shield of the electronic component together with the first and second conductive films and the ground layer.
  4. 　少なくとも２つの前記第１の柱状導体を備える、請求項３に記載のアンテナ内蔵モジュール。 The antenna built-in module according to claim 3, comprising at least two first columnar conductors.
  5. 　少なくとも３つの前記第１の柱状導体を備え、
    　前記第１の柱状導体は、前記配線基板の上に配置され、平面視して、前記電子部品を取り囲むように設けられている、請求項１に記載のアンテナ内蔵モジュール。     Comprising at least three first columnar conductors;
    The module with a built-in antenna according to claim 1, wherein the first columnar conductor is disposed on the wiring board and is provided so as to surround the electronic component in a plan view.
  6. 　前記封止樹脂の上面のうち前記アンテナ導体を覆う領域に帯状に形成された第３の導電性膜と、
    　前記第３の導電性膜と前記アンテナ導体とを電気的に接続する第２の柱状導体とをさらに備え、
    　前記第３の導電性膜と、前記第２の柱状導体と、前記アンテナ導体とによってアンテナが形成されている、請求項１～５のいずれか１項に記載のアンテナ内蔵モジュール。     A third conductive film formed in a band shape in a region covering the antenna conductor in the upper surface of the sealing resin;
    A second columnar conductor that electrically connects the third conductive film and the antenna conductor;
    6. The antenna built-in module according to claim 1, wherein an antenna is formed by the third conductive film, the second columnar conductor, and the antenna conductor.
  7. 　前記封止樹脂の上面のうち前記アンテナ導体を覆う領域において前記第３の導電性膜が形成されていない領域の封止樹脂の厚みは、前記第３の導電性膜が形成されている領域の封止樹脂の厚みよりも薄い、請求項６に記載のアンテナ内蔵モジュール。 The thickness of the sealing resin in the region where the third conductive film is not formed in the region covering the antenna conductor in the upper surface of the sealing resin is that of the region where the third conductive film is formed. The antenna built-in module according to claim 6, which is thinner than a thickness of the sealing resin.
  8. 　アンテナ内蔵モジュール外部のセット基板に直接的又は間接的に接続される接続端子をさらに備え、
    　前記アンテナ導体及び前記電子部品は、前記接続端子を介して信号の入出力を行なう、請求項１～７のいずれか１項に記載のアンテナ内蔵モジュール。     It further comprises a connection terminal connected directly or indirectly to the set substrate outside the module with a built-in antenna,
    The antenna built-in module according to any one of claims 1 to 7, wherein the antenna conductor and the electronic component perform signal input / output via the connection terminal.
  9. 　請求項８に記載のアンテナ内蔵モジュールと、
    　前記セット基板と、
    　前記アンテナ内蔵モジュール外部の整合素子とを備え、
    　前記整合素子は、前記アンテナ内蔵モジュール側のインピーダンスと、前記セット基板側のインピーダンスとを整合させるための素子であり、
    　前記アンテナ内蔵モジュールと前記整合素子とは、前記セット基板に実装されている、通信装置。     The module with a built-in antenna according to claim 8,
    The set substrate;
    A matching element outside the antenna built-in module;
    The matching element is an element for matching the impedance on the antenna built-in module side and the impedance on the set substrate side,
    The communication device, wherein the antenna built-in module and the matching element are mounted on the set substrate.
PCT/JP2017/032614 2016-09-30 2017-09-11 Module with built-in antenna and communication device WO2018061722A1 (en)

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WO2011102095A1 (en) * 2010-02-19 2011-08-25 パナソニック株式会社 Module manufacturing method
US20130234304A1 (en) * 2012-03-08 2013-09-12 Renesas Electronics Corporation Semiconductor device
WO2016051700A1 (en) * 2014-09-30 2016-04-07 タツタ電線株式会社 Conductive coating material and method for producing shield package using same
WO2016136021A1 (en) * 2015-02-27 2016-09-01 Ｔｏｗａ株式会社 Electronic component, method for manufacturing same, and device for manufacturing same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050009244A1 (en) * 2003-07-09 2005-01-13 Toshio Shiobara Method for sealing semiconductor component
WO2011102095A1 (en) * 2010-02-19 2011-08-25 パナソニック株式会社 Module manufacturing method
US20130234304A1 (en) * 2012-03-08 2013-09-12 Renesas Electronics Corporation Semiconductor device
WO2016051700A1 (en) * 2014-09-30 2016-04-07 タツタ電線株式会社 Conductive coating material and method for producing shield package using same
WO2016136021A1 (en) * 2015-02-27 2016-09-01 Ｔｏｗａ株式会社 Electronic component, method for manufacturing same, and device for manufacturing same

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