JP6793061B2 - High frequency module - Google Patents

Description

The present invention relates to a high frequency module, and more particularly to a high frequency module having an ESD protection structure.

In recent years, a circuit board on which electronic components are mounted, a sealing resin layer for sealing made of an insulating resin material provided on the side of the mounting surface so as to cover the electronic components, and a sealing resin layer. High-frequency modules have been developed that include a conductive layer made of a conductive paste material that covers the surface, terminal electrodes for connecting antennas, and via holes that connect the terminal electrodes and electronic components.

In such a high-frequency module, static electricity easily enters the electronic component from the antenna via the terminal electrode and via hole, and the electronic component is easily destroyed by the electrostatic discharge (ESD: Electro Static Discharge) of the invading static electricity. There was a possibility. Therefore, protective measures against ESD are required. Especially in the model with strict ESD standard, the necessity is high.

As a method of implementing ESD protection measures on a high-frequency module, a first method of mounting an ESD protection element having a pair of ground electrodes facing each other on a circuit board, such as the surge absorbing element 800 in Patent Document 1, or a patent. As in the electronic module 900 in Document 2, a second method for forming an ESD protection structure including a ground electrode inside a circuit board is disclosed.

In the surge absorbing element 800 according to the first method (Patent Document 1), as shown in FIG. 8, the insulating ceramic sheet 802 has an internal electrode 806 and a discharge space 805 that are conductive to the external electrode, and the discharge space 805 has an internal electrode 806. The discharge gas was trapped. With such a configuration, it is possible to provide a highly productive surge absorbing element having a small capacitance and not requiring a complicated manufacturing process.

Further, in the electronic module 900 according to the second method (Patent Document 2), as shown in FIG. 9, the ESD is further inside the electronic component built-in substrate 901 incorporating at least one electronic component element (capacitor element 903, etc.). A protection element 902 is provided, and the ESD protection element 902 is composed of at least a cavity formed inside the electronic component built-in substrate 901 and a pair of discharge electrodes formed so as to face each other in the cavity. , The ESD protection element 902 is formed integrally with the electronic component element. With such a configuration, it is possible to solve the problem that the initial characteristics of the electronic module 900 are deviated and the ESD protection effect is diminished.

Japanese Unexamined Patent Publication No. 2001-043954 Japanese Unexamined Patent Publication No. 2011-100649

However, since the surge absorbing element 800 according to the first method described above newly uses an ESD protection element, there is a problem that the structure is complicated and the mounting area is increased due to the increase in the number of parts. .. Further, in the electronic module 900 according to the second method, a discharge electrode having a relatively large size and a complicated shape is directly connected to the via hole. Therefore, if such a via hole is a via hole for an antenna signal line, , There was a possibility that the impedance of the via hole was changed to affect the electrical performance of the antenna such as transmission power and sensitivity.

Further, in the electronic module 900, since the ground electrode is formed near the center of the circuit board together with the other wiring electrodes, noise at the time of discharge may affect the electrical performance of the electronic circuit.

The present invention has been made in view of the actual conditions of the prior art, and an object of the present invention is to provide a high frequency module having an ESD protection structure having a simple structure and little influence on electrical performance.

High frequency module of the invention in order to solve the above problems, a circuit board having a real Somen and bottom, and an electronic component mounted on the mounting surface, and a conductive layer provided so as to cover the mounting surface, a high-frequency module wherein the circuit board has a terminal electrode for antenna connection provided on the bottom surface, and a via hole for connecting the terminal electrode and the electronic component, the front Kishirubedenso The lower end portion of the terminal electrode is arranged at a predetermined distance from the terminal electrode so that the static electricity applied to the terminal electrode is discharged to the conductive layer .

In the high-frequency module configured in this way, the lower end of the conductive layer is opposed to the terminal electrode at a predetermined distance, so that the conductive layer and the terminal electrode are used without using a new ESD protection element. The ESD protection structure can be easily formed. Further, since it is not necessary to change the structure of the via hole for connecting the antenna when forming this ESD protection structure, the impedance characteristic of the via hole does not change, and the influence on the electrical performance of the antenna can be suppressed. Further, by discharging from the terminal electrode to the conductive layer on the side end side of the circuit board, it is possible to suppress the influence of noise at the time of discharging on the electrical performance of the electronic circuit. As a result, it is possible to realize an ESD protection structure having a simple structure and having little influence on the electrical performance.

Further, in the above configuration, a part of the lower end portion has a feature that the shape is sharp toward the terminal electrode.

In the high frequency module configured in this way, by forming a part of the lower end portion of the conductive layer into a sharp shape, the electric charge on the terminal electrode side can be concentrated and discharged to a part of the lower end portion of the conductive layer. Therefore, the discharge from the terminal electrode to the conductive layer can be performed more reliably.

The high frequency module of the present invention in order to solve the above problems, real Somen, a circuit board having a bottom surface and an inner layer, an electronic component mounted on the mounting surface, provided so as to cover the mounting surface A high-frequency module including a conductive layer, wherein the circuit board is provided in a terminal electrode for connecting an antenna provided on the bottom surface, a via hole for connecting the electronic component and the terminal electrode, and an inner layer. was a ground electrode, one end of the ground electrode is connected to the conductive layer, the other end of the ground electrode, static electricity applied to the terminal electrode via the via hole and the ground electrode It is characterized in that it is arranged at a predetermined distance from the outer peripheral portion of the via hole so as to discharge to the conductive layer .

In the high-frequency module configured in this way, the other end of the ground electrode is opposed to the outer peripheral portion of the via hole at a predetermined distance, so that the ground electrode connected to the conductive layer without using a new ESD protection element. And via holes can be used to easily form an ESD protection structure. Further, since the ground electrode is not directly connected to the via hole for connecting the antenna when the ESD protection structure is formed, the change in the impedance characteristic of the via hole can be reduced and the deterioration of the electrical performance can be suppressed. Further, by discharging the ground electrode connected to the conductive layer on the side end side of the circuit board through the via hole, it is possible to suppress the influence of noise at the time of discharging on the electrical performance of the electronic circuit. As a result, it is possible to realize an ESD protection structure having a simple structure and having little influence on the electrical performance.

Further, in the above configuration, the circuit board is provided with a plurality of the inner layers, and the ground electrode is formed in at least two inner layers of the plurality of inner layers.

In the high frequency module configured in this way, by providing a plurality of ground electrodes and increasing the number of discharge points, it is possible to more reliably discharge from the via hole to the conductive layer.

Further, in the above configuration, the portion of the other end of the ground electrode facing the via hole is characterized in that it has a sharp shape toward the via hole.

In the high frequency module configured in this way, by forming the other end of the ground electrode into a sharp shape, the electric charge on the terminal electrode side can be concentrated and discharged to the other end of the ground electrode through the through hole. Therefore, the discharge from the terminal electrode to the conductive layer can be performed more reliably.
Further, the high-frequency module further includes a sealing resin layer provided on the mounting surface side so as to cover the electronic component, and the conductive layer is provided so as to cover the surface of the sealing resin layer. Is preferable.

The high-frequency module of the present invention can easily form an ESD protection structure without using a new ESD protection element. In addition, the change in the impedance characteristic of the via hole can be reduced to suppress the influence on the electrical performance of the antenna. Further, by discharging to the side end side of the circuit board, it is possible to suppress the influence of noise at the time of discharging on the electrical performance of the electronic circuit. As a result, it is possible to realize an ESD protection structure having a simple structure and having little influence on the electrical performance.

It is a perspective view which shows the appearance of the high frequency module in embodiment of this invention. It is a top view of the high frequency module. It is sectional drawing of the high frequency module in 1st Embodiment. It is a side view of the high frequency module in 1st Embodiment. It is a side view of the 1st modification of the high frequency module in 1st Embodiment. It is sectional drawing of the 2nd modification of the high frequency module in 1st Embodiment. It is an enlarged sectional view of the high frequency module in 2nd Embodiment. It is an exploded perspective view of the surge absorption element which concerns on a conventional example. It is sectional drawing of the electronic module which concerns on a conventional example.

Hereinafter, the high frequency module of the present invention will be described with reference to the drawings. The high-frequency module of the present invention is a small high-frequency module having a high-frequency circuit used for, for example, a wireless LAN (Local Area Network) or Bluetooth (registered trademark), and is mounted on an electronic device such as a smartphone. The application of the high frequency module of the present invention is not limited to the embodiments described below, and can be appropriately changed. In this specification, for convenience, right side, left side, rear side, front side, upper side, and lower side may be described in the description for each drawing, but these are described as + X side in each drawing, respectively. It indicates the −X side, the + Y side, the −Y side, the + Z side, and the −Z side, and does not limit the installation direction and the usage direction of the product to these.

[First Embodiment]
First, the structure of the high frequency module 100 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 4. FIG. 1 is a perspective view showing the appearance of the high frequency module 100, FIG. 2 is a plan view of the high frequency module 100, and FIG. 3 is a cross-sectional view of the high frequency module 100 seen from line AA in FIG. is there. Further, FIG. 4 is a side view of the high frequency module 100.

As shown in FIGS. 1 to 4, the high-frequency module 100 covers the circuit board 30 having the mounting surfaces 30a and the bottom surface 30b facing each other, the electronic component 41 mounted on the mounting surface 30a, and the electronic component 41. It includes a sealing resin layer 10 provided on the mounting surface 30a side, and a conductive layer 20 provided so as to cover the surface of the sealing resin layer 10. The high frequency module 100 is provided with a plurality of electronic components 41.

As shown in FIG. 3, the circuit board 30 in the high-frequency module 100 has a plurality of inner layers 30d, and a wiring pattern 37 is formed on the inner layer 30d and the mounting surface 30a of the circuit board 30. The electronic circuit 40 is formed by the wiring pattern 37 and the plurality of electronic components 41. Further, in the inner layer 30d of the circuit board 30, a plurality of via holes 38 are formed between the electronic component 41 and the wiring pattern 37 and the like. The high frequency module 100 is provided with the inner layer 30d, but in the present invention, the inner layer 30d is not necessarily provided.

The plurality of electronic components 41 are resin-sealed by a sealing resin layer 10 for sealing made of an insulating resin material 11 provided on the side of the mounting surface 30a so as to cover the electronic components 41 on the circuit board 30. There is. The insulating resin material 11 is a thermosetting molding material in which an epoxy resin is added as a main component and a silica filler or the like is added, and the purpose is to protect the electronic component 41 on the circuit board 30 from the environment such as heat and humidity. Used.

As shown in FIG. 3, the plurality of electronic components 41 are mounted on the component pads 35 provided on the mounting surface 30a of the circuit board 30. The component pad 35 is connected to the wiring pattern 37 and the via hole 38 described above.

As shown in FIG. 3, a plurality of land electrodes 36 necessary for normal operation are provided on the bottom surface 30b, which is the lowermost layer of the circuit board 30. The plurality of land electrodes 36 are used, for example, as a power supply terminal for supplying power to the electronic circuit 40 described above, an input terminal or an output terminal of the electronic circuit 40, and a ground terminal. In the high frequency module 100, among these land electrodes 36, the power supply terminal, the input terminal, and the output terminal are provided along the periphery of the bottom surface 30b, and the ground terminal is provided in the center of the bottom surface 30b. The plurality of land electrodes 36 are connected to the wiring pattern 37 via the via hole 38 described above.

The plurality of land electrodes 36 provided on the bottom surface 30b of the circuit board 30 are attached to an electronic device such as a smartphone on which the high frequency module 100 is mounted by soldering or the like, and the electronic circuit 40 is electrically attached to the circuit in the electronic device. Be connected.

On the bottom surface 30b of the circuit board 30, a terminal electrode 31 for connecting an antenna, which is also one of a plurality of land electrodes 36, is formed. The terminal electrode 31 is connected to the component pad 35 by a via hole 38 provided inside the circuit board 30, and is directly connected to the electronic component 41. The terminal electrode 31 is provided in the vicinity of the side end portion 30c of the circuit board 30. Actually, the terminal electrode 31 is formed up to the end portion on the −X side of the bottom surface 30b of the circuit board 30.

As described above, the high frequency module 100 includes a conductive layer 20 made of a conductive paste material 21 that covers the surface of the sealing resin layer 10 described above.

The conductive layer 20 is formed for the purpose of shielding the electronic circuit 40, which is a high-frequency circuit, from the outside. The conductive layer 20 is formed so as to cover the surface of the sealing resin layer 10 and at least a part of the side end portion 30c of the circuit board 30. The conductive paste material 21 constituting the conductive layer 20 is made of a conductive material such as silver or copper, and has strong adhesion to the sealing resin layer 10 and the circuit board 30.

The conductive layer 20 covers at least a part of the side end portion 30c of the circuit board 30 in the vicinity of the terminal electrode 31 described above, and the lower end portion 20a of the conductive layer 20 is a terminal electrode as shown in FIGS. 3 and 4. It faces 31 with a predetermined interval D1.

In the high frequency module 100, as shown in FIG. 4, the conductive layer 20 on the side (−X side) where the terminal electrode 31 is provided is located at a distance D1 from the bottom surface 30b at the side end portion 30c of the circuit board 30. It is formed over all but the parts up to. It should be noted that the distance from the bottom surface 30b may be D1 or more, except for the portion facing the terminal electrode 31 at the position of the lower end portion 20a of the conductive layer 20.

Since the terminal electrode 31 is a terminal for connecting an antenna as described above, an antenna (not shown) for signals input and / or output from the electronic circuit 40 is connected to the electronic circuit 40. Normally, since the antenna is arranged so as to be exposed to the outside, static electricity is applied to the terminal electrode 31 via the antenna, and static electricity may invade the electronic component 41.

The high-frequency module 100 according to the first embodiment of the present invention is configured so that the static electricity applied to the terminal electrode 31 is released to the conductive layer 20 via the predetermined interval D1 described above. Therefore, it is possible to prevent static electricity applied to the terminal electrode 31 from entering the electronic component 41.

The predetermined interval D1 is connected to the terminal electrode 31 and is also an electronic component so that the static electricity applied by the voltage and capacitance specified in the ESD standard can be easily discharged from the terminal electrode 31 to the conductive layer 20. The distance is set so that the impedance of the component pad 35 on which the 41 is mounted does not change extremely.

With this configuration, the high-frequency module 100 can easily form an ESD protection structure by using the conductive layer 20 and the terminal electrode 31 without newly using an ESD protection element. Further, since it is not necessary to change the structure of the via hole 38 for connecting the antenna when forming this ESD protection structure, the impedance characteristic of the via hole 38 does not change, and the influence on the electrical performance of the antenna can be suppressed. .. Further, by discharging from the terminal electrode 31 to the conductive layer 20 on the side end portion 30c side of the circuit board 30, it is possible to suppress the influence of noise at the time of discharging on the electronic circuit 40.

[Embodiment of the first modification of the first embodiment]
Next, the structure of the high frequency module 110, which is a first modification of the high frequency module according to the first embodiment of the present invention, will be described with reference to FIGS. 3 and 5. FIG. 5 is a side view of the high frequency module 110. Since the cross-sectional view of the high-frequency module 110 is the same as the cross-sectional view of the high-frequency module 100, FIG. 3 is used as the cross-sectional view of the high-frequency module 110. Further, the difference between the high frequency module 110 and the high frequency module 100 is that the shape of the lower end portion 23a of the conductive layer 23 in the high frequency module 110 is different from the shape of the lower end portion 20a of the conductive layer 20 in the high frequency module 100. Therefore, the description thereof will be omitted except that it is related to the shape of the lower end portion 23a of the conductive layer 23.

As shown in FIGS. 3 and 5, a part of the lower end portion 23a of the conductive layer 23 of the high frequency module 110 faces the terminal electrode 31 with a predetermined distance D1.

In the high frequency module 110, as shown in FIG. 5, a part of the lower end portion 23a of the conductive layer 23 on the side (−X side) where the terminal electrode 31 is provided has a shape sharpened toward the terminal electrode 31. It has become. Of the lower end portion 23a of the conductive layer 23, a distance of D1 or more from the bottom surface 30b is provided except for the pointed tip portion facing the terminal electrode 31.

By forming a part of the lower end portion 23a of the conductive layer 23 into a pointed shape toward the terminal electrode 31 in this way, the electric charge on the terminal electrode 31 side is concentrated on a part of the lower end portion 23a of the conductive layer 23. Since it can be discharged, it is possible to more reliably discharge the terminal electrode 31 to the conductive layer 23.

[Embodiment of the second modification of the first embodiment]
Next, with reference to FIG. 6, the structure of the high frequency module 120, which is a second modification of the high frequency module according to the first embodiment of the present invention, will be described. FIG. 6 is a cross-sectional view of the high frequency module 120. Further, the difference between the high frequency module 120 and the high frequency module 100 is that the shape of the terminal electrode 32 and the shape of the conductive layer 25 in the high frequency module 120 are different from those in the case of the high frequency module 100. Therefore, the description of the high frequency module 120 will be omitted except that it is related to the shapes of the terminal electrode 32 and the conductive layer 25.

As shown in FIG. 6, the high-frequency module 120 is mounted on a mother substrate 90 in an electronic device (not shown) such as a smartphone in which the high-frequency module 120 is housed. The fact that the high-frequency module is mounted on the mother substrate 90 is the same for the high-frequency module 100 and the high-frequency module 110 described above.

A plurality of mother substrate side electrodes 91 for mounting the high frequency module 120 are formed on the mother substrate 90, and a plurality of land electrodes 36 including a terminal electrode 32 of the high frequency module 120 are formed on the mother substrate side electrode 91. , Electrically and mechanically connected by solder or the like.

The terminal electrode 32 is provided in the vicinity of the side end portion 30c of the circuit board 30, but the terminal electrode 32 is not formed up to the end portion on the −X side of the bottom surface 30b of the circuit board 30 and is not formed on the bottom surface. It is formed inward by a predetermined distance from the end on the −X side of 30b.

As shown in FIG. 6, the lower end portion 25a of the conductive layer 25 is formed so as to face the mother substrate side electrode 91 on the mother substrate 90 to which the terminal electrode 32 is attached at a predetermined distance D1. There is.

As described above, in the high frequency module 120, the static electricity applied to the terminal electrode 32 is applied to the conductive layer 25 via the mother substrate side electrode 91 facing the terminal electrode 32 on the mother substrate 90 and the predetermined interval D1. It was configured to escape. Therefore, it is possible to prevent static electricity applied to the terminal electrode 32 from entering the electronic component 41.

[Second Embodiment]
Next, the structure of the high frequency module 200 according to the second embodiment of the present invention will be described with reference to FIGS. 1, 2, and 7. FIG. 7 is an enlarged cross-sectional view of the high frequency module 200. Since the perspective view and the plan view of the high frequency module 200 are the same as those of the high frequency module 100, FIGS. 1 and 2 are used as the perspective view and the plan view of the high frequency module 200. Further, the difference between the high frequency module 200 and the high frequency module 100 is that the structure of the inner layer 30d in the high frequency module 200 is different from the structure of the inner layer 30d in the high frequency module 100. Therefore, the description thereof will be omitted except that it is related to the structure of the inner layer 30d.

As shown in FIGS. 1, 2, and 7, the high-frequency module 200 includes a circuit board 30 having a mounting surface 30a, a bottom surface 30b, and an inner layer 30d facing each other, and an electronic component 41 mounted on the mounting surface 30a. A sealing resin layer 10 provided on the mounting surface 30a side so as to cover the electronic component 41, a conductive layer 20 provided so as to cover the surface of the sealing resin layer 10, and an antenna connection provided on the bottom surface 30b. The terminal electrode 32 and the via hole 38 provided inside the circuit board 30 so as to connect the electronic component 41 and the terminal electrode 32 are provided.

As shown in FIG. 7, the via hole 38 is provided in the vicinity of the side end portion 30c of the circuit board 30, and the conductive layer 20 covers at least a part of the side end portion 30c in the vicinity of the via hole 38.

The circuit board 30 in the high frequency module 200 is provided with a plurality of inner layers 30d. Each of the plurality of inner layers 30d is provided with a ground electrode 33 extending from the side end portion 30c of the circuit board 30 toward the via hole 38, and one end of the ground electrode 33 is connected to the conductive layer 20 and the ground electrode 33 is connected. The other end of the via hole 38 faces the outer peripheral portion of the via hole 38 with a predetermined distance D1. The lower end portion 20a of the conductive layer 20 described above may at least reach the position of the inner layer 30d in which the lowermost ground electrode 33 is provided in the circuit board 30.

The predetermined interval D1 described above is a component pad on which the electronic component 41 is mounted so that the static electricity applied by the voltage and capacitance specified in the ESD standard can be easily discharged from the via hole 38 to the ground electrode 33. The distance is set so that the impedance at 35 does not change extremely.

The ground electrode 33 is formed on at least two inner layers 30d of the plurality of inner layers 30d. Since the discharge location may differ depending on the strength of the ESD, by providing a plurality of ground electrodes 33 in this way and increasing the discharge locations, the discharge from the via hole 38 to the conductive layer 20 can be performed more reliably. Can be able to

In the high frequency module 200, it is desirable that the portion of the ground electrode 33 facing the via hole 38 at the other end has a sharp shape toward the via hole 38. By making the portion of the other end of the ground electrode 33 facing the via hole 38 sharp toward the via hole 38, the electric charge on the terminal electrode 32 side is concentrated on the other end of the ground electrode 33 via the through hole 38. Therefore, it is possible to more reliably discharge the terminal electrode 32 to the conductive layer 20.

Hereinafter, the effect of the present embodiment will be described.

In the high frequency module 100, the lower end portion 20a of the conductive layer 20 is opposed to the terminal electrode 31 at a predetermined distance D1, so that the conductive layer 20 and the terminal electrode 31 are used without using a new ESD protection element. The ESD protection structure can be easily formed. Further, since it is not necessary to change the structure of the via hole 38 for connecting the antenna when forming this ESD protection structure, the impedance characteristic of the via hole 38 does not change, and the influence on the electrical performance of the antenna can be suppressed. .. Further, by discharging from the terminal electrode 31 to the conductive layer 20 on the side end portion 30c side of the circuit board 30, it is possible to suppress the influence of noise at the time of discharging on the electronic circuit 40. As a result, it is possible to realize an ESD protection structure having a simple structure and having little influence on the electrical performance.

Further, the high frequency module 110 concentrates the electric charge on the terminal electrode 31 side on a part of the lower end portion 23a of the conductive layer 23 and discharges it by forming a part of the lower end portion 23a of the conductive layer 23 into a sharp shape. Therefore, the discharge from the terminal electrode 31 to the conductive layer 23 can be performed more reliably.

Further, in the high frequency module 200, since the other end of the ground electrode 33 is opposed to the outer peripheral portion of the via hole 38 with a predetermined distance D1, the ground is connected to the conductive layer 20 without using a new ESD protection element. The ESD protection structure can be easily formed by using the electrode 33 and the via hole 38. Further, since the ground electrode 33 is not directly connected to the via hole 38 for connecting the antenna when the ESD protection structure is formed, the change in the impedance characteristic of the via hole 38 can be reduced and the deterioration of the electrical performance can be suppressed. Further, by discharging the ground electrode 33 connected to the conductive layer 20 on the side end portion 30c side of the circuit board 30 through the via hole 38, it is possible to suppress the influence of noise at the time of discharging on the electronic circuit 40. it can. As a result, it is possible to realize an ESD protection structure having a simple structure and having little influence on the electrical performance.

Further, by providing a plurality of ground electrodes 33 to increase the number of discharge points, it is possible to more reliably discharge the via hole 38 to the conductive layer 20.

Further, by forming the other end of the ground electrode 33 into a sharp shape, the electric charge on the terminal electrode 32 side can be concentrated and discharged to the other end of the ground electrode 33 through the through hole 38, so that the terminal electrode can be discharged. The discharge from the 32 to the conductive layer 20 can be performed more reliably.

As described above, the high-frequency module of the present invention can easily form an ESD protection structure without using a new ESD protection element. In addition, the change in the impedance characteristic of the via hole can be reduced to suppress the influence on the electrical performance of the antenna. Further, by discharging to the side end side of the circuit board, it is possible to suppress the influence of noise at the time of discharging on the electrical performance of the electronic circuit. As a result, it is possible to realize an ESD protection structure having a simple structure and having little influence on the electrical performance.

The present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist.

10 Encapsulating resin layer 11 Insulating resin material 20 Conductive layer 20a Lower end 21 Conductive paste material 23 Conductive layer 23a Lower end 25 Conductive layer 25a Lower end 30 Circuit board 30a Mounting surface 30b Bottom surface 30c Side end 30d Inner layer 31 Terminal electrode 32 Terminal electrode 33 Ground electrode 35 Parts pad 36 Land electrode 37 Wiring pattern 38 Via hole 40 Electronic circuit 41 Electronic component 90 Mother board 91 Mother board side electrode 100 High frequency module 110 High frequency module 120 High frequency module 200 High frequency module D1 Interval

Claims (6)

A circuit board having a real Somen and bottom,
An electronic component mounted before Symbol mounting surface,
A high-frequency module including a conductive layer provided so as to cover the mounting surface .
The circuit board
The terminal electrode for connecting the antenna provided on the bottom surface and
It has a via hole for connecting the electronic component and the terminal electrode.
The lower end of the front Kishirube conductive layer, static electricity applied to the terminal electrode so that discharge to the conductive layer, are arranged at the terminal electrode by a predetermined interval,
A high frequency module characterized by that. A part of the lower end portion has a sharp shape toward the terminal electrode.
The high frequency module according to claim 1. A circuit board having a real Somen, bottom and inner layer,
An electronic component mounted before Symbol mounting surface,
A high-frequency module including a conductive layer provided so as to cover the mounting surface .
The circuit board
The terminal electrode for connecting the antenna provided on the bottom surface and
A via hole connecting the electronic component and the terminal electrode,
It has a ground electrode provided on the inner layer and
One end of the ground electrode is connected to the conductive layer ,
The other end of the ground electrode is arranged at a predetermined distance from the outer peripheral portion of the via hole so that the static electricity applied to the terminal electrode is discharged to the conductive layer via the via hole and the ground electrode. Yes,
A high frequency module characterized by that. The circuit board is provided with a plurality of the inner layers.
The ground electrode is formed in at least two inner layers of the plurality of inner layers.
The high frequency module according to claim 3. The portion of the other end of the ground electrode facing the via hole has a sharp shape toward the via hole.
The high frequency module according to claim 3 or 4 . A sealing resin layer provided on the mounting surface side so as to cover the electronic component is further provided.
The conductive layer is provided so as to cover the surface of the sealing resin layer.
The high frequency module according to any one of claims 1 to 5.

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