WO2016111243A1 - Carte de câblage imprimé souple et son procédé de montage - Google Patents

Carte de câblage imprimé souple et son procédé de montage Download PDF

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Publication number
WO2016111243A1
WO2016111243A1 PCT/JP2016/000027 JP2016000027W WO2016111243A1 WO 2016111243 A1 WO2016111243 A1 WO 2016111243A1 JP 2016000027 W JP2016000027 W JP 2016000027W WO 2016111243 A1 WO2016111243 A1 WO 2016111243A1
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WIPO (PCT)
Prior art keywords
electrodes
solder
hole
flexible printed
printed wiring
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PCT/JP2016/000027
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English (en)
Japanese (ja)
Inventor
吉田　和正
哲夫 加藤
慎也 清水
佐藤　照明
美野　真司
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Ｎｔｔエレクトロニクス株式会社
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Publication of WO2016111243A1 publication Critical patent/WO2016111243A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Definitions

  • the present invention relates to a connection structure and a connection method for electrically connecting substrates on which electronic circuits, optical circuits, and the like are mounted. More specifically, the present invention relates to a flexible printed wiring board configured by connecting various circuit boards and made of a flexible material.
  • optical transmission modules having basic functions such as electrical-optical conversion, optical-electrical conversion, amplification, and reproduction modulation / demodulation are widely used.
  • optical transmission modules With the background of higher speed and larger capacity of wired networks and wireless networks, optical transmission modules are required to speed up signal processing, but at the same time, low cost and high reliability are also strongly demanded.
  • the optical transmission module includes an optical semiconductor element (semiconductor laser, light receiving element, modulation element, etc.), a substrate on which the optical semiconductor element is mounted, and a substrate on which a signal generation circuit (drive circuit, amplifier circuit, etc.) is mounted.
  • High-speed signal transmission is realized by electrical connection using a flexible printed wiring board.
  • a flexible printed circuit board (FPC: Flexible Printed Circuit) is made of a material that is thinner and more flexible than an ordinary printed circuit board.
  • a flexible printed circuit board (FPC) is formed by forming a conductive foil based on a film-like insulator. The connection between the flexible printed wiring board and the circuit board is realized by fixing the electrodes at the front end of the signal line pattern formed on each board to each other by soldering.
  • the flexible printed wiring board is simply referred to as “flexible board”.
  • Patent Document 1 and Patent Document 2 provide stable connection quality and high reliability for electronic parts having standard sizes and shapes that can be surface-mounted.
  • quality, yield, and reliability when trying to automatically or semi-automatically fix parts that exceed complex shapes, normal sizes and weights. In some cases, bonding was necessary. This problem also applies when a plurality of circuit boards are included in the optical transmission module and a flexible board is used to connect these boards.
  • the flexible substrate is soldered semi-automatically using an instantaneous heating device such as a hot bar.
  • an instantaneous heating device such as a hot bar.
  • screen printing the print area cannot be made larger than the electrode area. This is because when the screen printing is performed over a wider area than the electrode area and the reflow process is executed, the solder flows out of the electrode area and there is a risk of short-circuiting between the electrodes.
  • FIG. 1A to FIG. 1C are diagrams showing an electrode pattern at a tip portion of a conventional flexible substrate used for soldering and a connection method thereof.
  • FIG. 1A is a top view showing an end portion of a flexible substrate.
  • the flexible substrate 10 has at least one or more electrodes 11 at the end of the base material 12 for electrical connection with the outside.
  • FIG. 1B is a diagram for explaining a connection process between a flexible substrate and a circuit board by an instantaneous heating apparatus using a hot bar, from a cross section perpendicular to the connection electrode surface.
  • an electrode 14 is formed on the board surface, and the solder 15 after the reflow process is covered on the electrode 14.
  • the flexible substrate has a connection electrode 11 formed on a base material 12. When connecting the circuit board 13 and the flexible board, the respective electrodes are brought into close contact with each other and heated by pressing the hot bar 16 from above the flexible board.
  • FIG. 1C is a view for explaining another connection process between the flexible substrate and the circuit board by the instantaneous heating device using a hot bar from a cross section perpendicular to the connection electrode surface.
  • the solder 17 is different from the example of FIG. 1B in that the solder 17 is formed not on the electrode 14 on the circuit board 13 but on the electrode 11 of the flexible board.
  • the electrodes are brought into close contact with each other and heated by pressing the hot bar 16 from above the flexible board.
  • the bonding surfaces of the two opposing electrodes are sufficiently adhered via heating. Therefore, it is necessary to finish the soldering process in a short time.
  • FIG. 2A to 2C are diagrams showing an electrode pattern and a cross-sectional structure of a tip portion of another conventional flexible substrate.
  • FIG. 2A is a top view showing an end portion of the flexible substrate 20.
  • the flexible substrate 20 has wiring inside or on the surface of the film-like substrate material, and at least 1 is provided at the end of the base material 22 for electrical connection with the outside.
  • One or more electrodes 21 are provided.
  • a through hole 23 is formed in each of the electrodes 21.
  • a half through hole (half via) 24 is formed at the end of the flexible substrate.
  • the through-hole 23 and the half-through-hole 24 are also formed with conductor electrodes on the inner surface side of the through-hole, and conducts the electrodes formed on both surfaces of the base material 22 and screen-prints on the electrode on one surface.
  • the applied solder works to flow on the electrode on the other surface.
  • FIGS. 2B and 2C are diagrams for explaining the state of solder on the surface opposite to the surface on which the solder paste is screen-printed and joined to the circuit board in the flexible substrate after the preliminary soldering process is completed. is there.
  • the surface opposite to the surface (joint surface) to which the solder paste is screen-printed and joined to the circuit board is referred to as the A surface.
  • the left side of FIG. 2B shows the A surface immediately after screen printing, and is a state where the conductor of the electrode can be seen.
  • the right side of FIG. 2B shows a state in which the solder is appearing on the A surface through the through hole after the preliminary soldering process.
  • FIG. 2B is merely an example of the solder shape that can be obtained as a result, and it is not possible to control solder that does not spread uniformly over the entire A surface, and the shape of the shape varies. For example, there are ridges on the surface of the mountain, sharp ones, concave ones. Further, the shape of the solder 25a in FIG.
  • FIG. 2C is a view of a cross section (IIC-IIC ′) perpendicular to the electrode surface of the flexible substrate of FIG. 2B. Since the solders 25a and 25b coming out to the A surface side through the through holes are localized on the A surface, the surface of the A surface is uneven and the height is not constant. Such unevenness becomes an obstacle to bringing the hot bar 16 and the flexible substrate into close contact when the hot bar 16 is pressed and heated.
  • the instantaneous heating method is inherently characterized in that only the solder joint surface is locally heated so that peripheral components that are weak against heat on the printed circuit board or in the package are hardly heated. Even when a plurality of circuit boards are included in the optical transmission module and a flexible board is used for the connection, there is a problem that the features of the instantaneous heating method cannot be effectively used.
  • solder is applied to the flexible substrate by dipping.
  • it since it is difficult to control the amount of solder, it realizes high-speed signal processing and high-density mounting expected in the future for optical transmission modules. It is difficult to use for electrical connection.
  • the electrode pattern configuration may be optimized from a different viewpoint than when fixed by hand soldering. is necessary.
  • the specific configuration of the electrode pattern, the necessary conditions for the solder state on the surface opposite to the solder joint surface (A surface), and the design rules have not been sufficiently studied.
  • the present invention has been made in view of such problems, and the object of the present invention is to satisfactorily solder between a flexible board and a circuit board, etc. even when an instantaneous heating device such as a hot bar is used. It is an object of the present invention to provide a flexible substrate that can be fixed easily and a mounting method thereof.
  • a flexible printed wiring board including a connection electrode that is solder-bonded to an electrode of a circuit board, along one side of an end portion of the flexible printed wiring board.
  • a plurality of electrodes having a half through hole having a hole, and one or more through holes having a circular through hole located on the same straight line passing through the half through hole in the longitudinal direction of the electrode;
  • two electrodes positioned at both ends of the one side are longer in a longitudinal direction of the conductor region than the plurality of electrodes near the center of the one side excluding the two electrodes. , Having a longer conductor area and having a different through-hole diameter and distance between the centers of the through-holes than the plurality of electrodes excluding the two electrodes.
  • the diameter of the half through hole and the diameter of the one or more through holes may be the same.
  • the solder layer preheats a solder paste screen-printed on the conductor region on one side of the flexible printed wiring board, and passes through the half-through hole and the one or more through-holes. Then, it can be formed by spreading solder on the conductor region on the surface opposite to the one surface.
  • the flexible printed wiring board is bonded to the plurality of electrodes on one surface of the first flexible printed wiring board. Aligning the plurality of electrodes on the first surface on the circuit board to be pressed, pressing the heating body on the plurality of electrodes on the other surface of the first flexible printed wiring board, Heating, holding the heating body, the plurality of electrodes on the one surface of the first flexible printed wiring board, and the plurality of electrodes on the first surface on the circuit board And a solder bonding step.
  • the method may further comprise a step of bringing the plurality of electrodes on the surface into close contact with the plurality of electrodes on the second surface on the circuit board and soldering.
  • the solder bonding of the second flexible printed wiring board is performed at a temperature lower than the temperature at which the solder bonding of the first flexible printed wiring board is performed.
  • Still another aspect of the present invention is a flexible printed circuit board including a connection electrode that is solder-bonded to an electrode of a circuit board, wherein the plurality of electrodes are arranged along one side of an end of the flexible printed circuit board.
  • Each electrode has a corresponding substantially identical conductor region on both sides, a semi-through hole centered on one side and having a semi-circular through hole, and the semi-through in the longitudinal direction of the electrode.
  • a plurality of electrodes having one or more through-holes having circular through-holes located on the same straight line passing through the holes, and solder is applied to each of the conductor regions on both sides with a substantially uniform thickness, and A solder layer filled with solder inside each of the through holes, and the diameter of the half through hole is ⁇ 1, the most from the half through hole of the one or more through holes When the diameter of a through hole at a large position is ⁇ 2, the distance W between the centers of two adjacent through holes of the half through hole or the one or more through holes is W ⁇ 3 ⁇ ( ⁇ 1 + ⁇ 2).
  • a flexible printed wiring board characterized by satisfying the relationship.
  • the flexible substrate of the present invention introduces design rules for the diameter and spacing of the through holes in the electrode region, and even with an instantaneous heating device such as a hot bar, the flexible substrate and the circuit substrate It becomes easy to fix the gap between the two well.
  • FIG. 1A is a diagram showing an electrode pattern at the tip of a conventional flexible substrate used for soldering.
  • FIG. 1B is a diagram showing a connection method of the tip portion of a conventional flexible substrate used for soldering.
  • FIG. 1C is a diagram illustrating another connection method of the tip portion of the flexible substrate of the prior art used for soldering.
  • FIG. 2A is a diagram showing an electrode pattern at the tip of another flexible substrate according to the prior art.
  • FIG. 2B is a diagram illustrating a state of soldering at a tip portion of another conventional flexible substrate.
  • FIG. 2C is a diagram illustrating a solder state and a cross-sectional structure of a tip portion of another conventional flexible substrate.
  • FIG. 3A is a view showing the upper surface of the flexible substrate of the present invention.
  • FIG. 3B is a diagram showing a cross section of the flexible substrate of the present invention.
  • FIG. 4 is a diagram showing a procedure for producing the tip of the flexible substrate of the present invention.
  • FIG. 5A is a diagram illustrating a first step in a procedure for mounting the flexible board of the present invention on a circuit board in a module.
  • FIG. 5B is a diagram illustrating a second step in the procedure for mounting the flexible substrate of the present invention on the circuit board in the module.
  • FIG. 5C is a diagram illustrating a third step in the procedure of mounting the flexible substrate of the present invention on the circuit board in the module.
  • FIG. 6 is a diagram showing the relationship between the interval between the through holes and the yield rate (%) of the flexible substrate in the flexible substrate of the present invention.
  • FIG. 7A is a top view of the flexible substrate according to the second embodiment of the present invention.
  • FIG. 7B is a cross-sectional view of the flexible substrate according to the second embodiment of the present invention.
  • FIG. 8A is a diagram showing the definition of the interval W between the through holes.
  • FIG. 8B is a diagram showing the definition of the interval W between half-through holes.
  • FIG. 9 is a diagram illustrating the configuration of the distal end portion of the flexible substrate according to the third embodiment of the present invention.
  • FIG. 10 is a diagram for explaining a method of mounting the flexible substrate of the present invention on the electrode on the substrate protruding in a terrace shape.
  • FIG. 11 is a diagram for explaining a method of mounting the flexible substrate of the present invention on the upper and lower electrodes of the substrate protruding in a terrace shape.
  • FIG. 12 is a diagram illustrating a configuration of a flexible substrate including a side pad electrode according to the prior art.
  • a certain design rule is applied to the diameter and pitch interval of the through hole of the electrode found by the inventors.
  • a good solder joint can be obtained by applying solder on the electrodes in advance by screen printing or the like and spreading the preliminary solder evenly on both surfaces of the connection electrode including the through hole of the flexible substrate in the region.
  • the solder was localized only on the periphery of the through hole on the electrode opposite to the solder joint surface of the flexible substrate, and one electrode conductor (for example, gold) was used. The part was exposed.
  • the inventors carried out a process of using an instantaneous heating device using a hot bar or the like on a flexible substrate in which the shape of the preliminary solder is uniform on the surface opposite to the solder joint surface of the connection electrode of the flexible substrate. I found it more desirable. Furthermore, it has been found that in the connection electrode of the flexible substrate, it is desirable that the number of through holes in the electrode region is large and the through hole interval is sufficiently close.
  • the electrode pattern of the flexible substrate needs to be optimized from a viewpoint different from the case where it is assumed to be fixed by a manual soldering operation, and the present invention embodies the requirements for the layout configuration.
  • various embodiments of the present invention will be described with reference to the drawings.
  • the flexible board means “flexible printed wiring board”.
  • solder joint means to physically join and fix the metal electrodes facing each other using a solder material, and the solder connection including the meaning of electrical connection of electrical signals is also used in the same meaning. Is done.
  • the through hole is a hole formed through the substrate and means an electrode for electrically connecting the electrodes on both sides of the substrate.
  • a via hole with a metal plating on the inner surface of the hole is used in the same meaning as a through hole.
  • the half-through hole is formed at the end of the substrate, and the shape of the hole is a semicircle, and the inner surface of the hole can be seen from the outside at the end surface of the substrate.
  • FIG. 3A to 3B are diagrams showing the configuration of the flexible substrate of the present invention.
  • FIG. 3A is a top view of an end portion where a connection electrode of a flexible substrate is formed.
  • FIG. 3B is a diagram showing a cross section (IIIB-IIIB ′) including the through hole of the electrode and perpendicular to the electrode surface. Since a flexible substrate is used for wiring to a movable part or three-dimensional wiring between separated substrates, there are various types of overall shapes. Therefore, the overall shape of the flexible substrate ranges from a simple rectangular shape to an irregular shape, but the vicinity of the end where the connection electrode is located is a part of the rectangle. In the following description, it should be noted that only the end portion of the flexible substrate having the connection electrode for solder bonding is shown.
  • FIG. 3A shows a state in which the solder covering the electrode surface is removed to show the electrode shape of the flexible substrate 30.
  • the flexible substrate 30 includes one or more electrodes 31 along one side of the end portion of the base material 32 of the substrate.
  • the flexible substrate 30 includes a plurality of electrodes 31, and in the example of FIG. 3A, includes five electrodes.
  • the surface of the plurality of electrodes 31 is, for example, Au plated for good soldering.
  • a half through hole (half via) 34 is formed at the tip of each of the plurality of electrodes 31, and a through hole 33 penetrating the front and back of the substrate 32 is formed in the region of each electrode 31. Therefore, two through holes including half through holes are formed inside each electrode region.
  • the same or substantially the same pattern is formed on both surfaces of the substrate 32.
  • the conductors of the electrodes on both sides of the flexible substrate 30 are electrically connected by the two through holes 33 and 34.
  • the electrode shape is generally rectangular. However, if the solder joint is rectangular, wiring or the like may be continuous with the rectangular portion.
  • the shapes of the plurality of electrodes may be slightly different. Depending on the thickness of the substrate, the shape, area, and layout of the electrodes, the size of the through holes and the arrangement in the longitudinal direction of the electrodes differ, but details will be described later.
  • the through holes are circular and are aligned on a straight line in the electrode arrangement direction.
  • the shape, size, and arrangement of the through hole of the flexible substrate are set so that the solder can be held on both surfaces of the electrode portion.
  • the solder spreads through the through holes 33 and 34 on the electrodes formed on both sides.
  • Preliminary solder 35 is uniformly applied integrally to the peripheral region of the through hole including the region between at least two through holes on the electrode conductor portions 31 on both surfaces of the flexible substrate end.
  • the flexible substrate of the present invention has a tip portion including a connection electrode in a state where the preliminary solder 35 is uniformly applied in this way, so that it can be satisfactorily soldered in the process of using the instantaneous heating device. It can be performed. It should be noted that in the cross-sectional view of FIG. 3B, the dimensional relationship among the substrate thickness, electrode thickness, solder thickness, and through-hole diameter is not necessarily drawn accurately.
  • the flexible substrate of the present invention is a flexible printed wiring board 30 provided with connection electrodes that are solder-bonded to the electrodes of the circuit board, and a plurality of electrodes arranged along one side of the end portion of the flexible printed wiring board.
  • Each electrode 31 has a corresponding substantially identical conductor region on both sides, a semi-through hole 34 centered on one side and having a substantially semi-circular through hole, A plurality of electrodes having one or more through holes 33 having circular through holes located on the same straight line passing through the half through holes in the longitudinal direction, and a substantially uniform thickness on each of the conductor regions on both sides
  • a solder layer 35 filled with solder inside each of the through holes, and the diameter of the half-through hole is set as described later. 1.
  • the two adjacent ones of the half through hole or the one or more through holes are
  • the distance W between the centers of the through holes can be implemented as a flexible printed wiring board characterized by satisfying a relationship of W ⁇ 3 ⁇ ( ⁇ 1 + ⁇ 2).
  • FIG. 4 is a diagram showing a procedure for producing the tip of the flexible substrate of the present invention.
  • Each step shown in FIGS. 4A to 4E corresponds to a preliminary soldering step for the tip electrode of the flexible substrate.
  • the region where the connection electrode is formed and the region of the substrate base material without the connection electrode are drawn separately in a simplified manner, Note that they are different. Therefore, for example, the electrode region 47 in FIG. 4A actually includes the substrate base material, and the base material region 40 also includes metal wiring (not shown) connected to the electrode region 47. It is.
  • a top view of the electrode surface viewed from the solder joint surface side is shown on the upper side, and a cross-sectional view of the lower side passing through the center of the through hole and viewed in the direction perpendicular to the electrode surface is shown.
  • the surface opposite to the solder joint surface is referred to as A surface for simplicity.
  • FIG. 4 shows the state of the flexible substrate before attaching preliminary solder.
  • the electrode region 47 there is a half-through hole 41 at the end of the substrate, and a through-hole 42 in the approximate center of the electrode region.
  • the inside of the through hole is a cavity.
  • the solder paste 43 is screen-printed on the electrode pattern on the solder joint surface (upper side in the figure). At this time, the solder paste does not spread on the surface opposite to the solder joint surface (the lower side in the figure).
  • FIG. 4C in the reflow process, the temperature is gradually raised to a state below the melting point of the solder.
  • the flux 44 in the solder paste 43 gradually begins to spread to the A surface while entraining the solder particles in the solder paste, but is limited to the periphery of the through hole because of low fluidity.
  • FIG. 4D the temperature further rises and the middle stage of reflow above the melting point of the solder is reached.
  • the liquefied solder becomes spherical in the through hole, but the solders in the through hole are not yet connected to each other, and the solder shapes on both sides of the electrode remain non-uniform.
  • FIG. 4E in the latter stage of reflow, the solders of the through holes are connected and integrated, and the solders on both sides of the substrate are in a uniform state.
  • the cross section of the integrated solder is drawn in an elliptical shape, but the actual cross sectional shape is almost as shown in FIG.
  • the flexible substrate of the present invention is not only on the electrode on the solder joint surface but also on the electrode on the A surface opposite to the solder joint surface across the substrate. Solder is spreading through halls. As a result, in the process of soldering to the circuit board using an instantaneous heating type hot bar (or heater chip) later, the heat of the hot bar is transferred to the solder on the solder joint surface side through the solder on the A-side electrode. Can be transmitted uniformly and efficiently, and good solder joints with excellent solder wettability can be achieved.
  • the solder is evenly distributed without unevenness on the electrode on the A side where the hot bar (or heater chip) contacts, so that the contact state between the hot bar and the auxiliary solder on the A side is good.
  • the heat of the hot bar is efficiently and uniformly transmitted to the solder on the joint surface, a better solder joint can be obtained at a lower temperature than when a conventional flexible substrate is mounted.
  • the lower temperature bonding process can suppress flux inactivation and solder oxide film formation. As a result, there is an effect of minimizing thermal damage to peripheral components that are vulnerable to heat and the circuit board itself.
  • FIG. 5A to FIG. 5C are diagrams for explaining the procedure for mounting the flexible substrate of the present invention on the circuit substrate in the module.
  • FIGS. 5A to 5C for the purpose of conceptually explaining each process, it should be noted that the relationship between each substrate, electrode thickness, through hole diameter, and the like is not accurately drawn.
  • the relative positions of the electrode 54 on the circuit board 52 side, the electrode 55 on the flexible board 50 side, and the hot bar 53 to be soldered are determined.
  • the flexible substrate of the present invention and a circuit board such as an optical transmission module are stacked one above the other so that each electrode surface to which both substrates are bonded and the pressing / heating position of the hot bar are positioned vertically.
  • This positioning may be performed by visual observation with a stereomicroscope, or may be performed by a mechanical operation such that the tip of the flexible substrate abuts against some reference surface.
  • the hot bar is held at a position above the substrate so that it is pressed against a predetermined position where the preliminary solder on the A surface of the flexible substrate has spread.
  • the hot bar is pressed against the flexible substrate to raise the temperature.
  • the hot bar held above is lowered and pressed against the electrode on which the preliminary solder on the A surface side of the flexible substrate is applied, and at the same time, the temperature is rapidly raised.
  • the electrodes 55 on both surfaces of the flexible substrate, the solder 51 applied on each electrode, and the electrodes 54 on the circuit board are simultaneously heated. In this heating step, it is more effective to use preheating in which the flux is activated in advance.
  • the flexible board of the present invention can be bonded to the electrode on the terrace of the module package protruding from the end face of the module described later.
  • the hot bar is moved upward to cool.
  • the solder since the solder is also applied to the electrode surface opposite to the solder joint surface, the heat from the hot bar can be efficiently and uniformly transmitted to the solder joint portion. Therefore, solder bonding can be performed at a lower temperature than the conventional flexible substrate.
  • the temperature required for melting the solder with the hot bar should be 40 ° C. or higher compared to the case of the present invention. Was confirmed experimentally.
  • the necessary conditions to be satisfied between the electrode pattern and the shape of the through hole in the flexible substrate having the configuration shown in FIGS. 3A and 3B will be described.
  • various parameters relating to the configuration of the electrode pattern and the through hole can be considered.
  • the thickness including the conductor thickness on both sides of the electrode part forming the through hole is: It is approximately in the range of 0.1 to 0.5 mm. Therefore, the standard through-hole length was set to 0.16 mm, and the optimum conditions were examined by paying particular attention to the diameter of the through-holes and the interval between them.
  • FIG. 3A when two through holes including half through holes (half vias) are formed and the through hole diameter ⁇ is 0.14 mm, the distance between the centers of the two through holes is changed. An experiment was conducted on the relationship between the solder shape and quality.
  • FIG. 6 is a diagram showing the relationship between the interval between the through holes and the non-defective product rate (%) of the non-defective flexible substrate in the flexible substrate of the present invention.
  • FIG. 6A explains the definition of the interval between the through holes. The distance between the centers of adjacent through holes and half through holes is defined as a through hole interval W.
  • FIG. 6B is a graph showing the relationship between the through-hole interval and the non-defective product rate (%) of the solder shape.
  • the non-defective product rate is a non-defective product rate of the flexible substrate, and a non-defective product or a defective product is determined for each flexible substrate including 10 electrodes.
  • each electrode if the solder visually flows through the through hole and the solder spreads on the electrodes on both sides, it is determined as a good electrode.
  • the non-defective product was determined as a non-defective product, and the non-defective product rate (%) of the flexible substrate was determined.
  • Table 1 below shows data corresponding to the graph of FIG.
  • SnAgCu lead-free solder was used as the solder, and the reflow conditions were a set temperature of 280 ° C. at which the temperature of the solder fixing portion can be kept low, and the reflow time of 5 seconds.
  • Table 1 Through-hole spacing and flexible substrate non-defective rate Table 1 shows that the lower through-hole spacing W was 0.4 mm, the lower the through-hole spacing W, the higher the yield rate of flexible substrates. I understand that. That is, as the through-hole interval W is narrower, the solder is more likely to spread on both surfaces of the connection electrode.
  • the through-hole interval W is approximately three times or less the sum of the diameters ⁇ of the two through-holes 33 and 34 at both ends, and good solder fixing can be realized.
  • the strength of the electrode decreases if the through hole is too close, the strength is sufficient if there is an interval of one through hole or more.
  • the through-hole interval W satisfies the relationship of the following equation when the diameters are ⁇ 1 and ⁇ 2. .
  • the through-hole interval W and the through-hole diameter ⁇ may be set so as to satisfy the relationship of the formula (1) or the formula (2).
  • the present invention provides a flexible printed wiring board having a connection electrode that is solder-bonded to an electrode of a circuit board, a plurality of electrodes arranged along one side of the end of the flexible printed wiring board, each electrode
  • a connection electrode that is solder-bonded to an electrode of a circuit board
  • a plurality of electrodes arranged along one side of the end of the flexible printed wiring board, each electrode
  • there are corresponding semi-through holes having substantially the same shape of the conductor region, the center on the one side and having a substantially semi-circular through hole, and the longitudinal direction of the electrode.
  • a plurality of electrodes having one or more through-holes having circular through-holes located on the same straight line passing through the half-through hole, and solder are applied to each of the conductor regions on both sides with a substantially uniform thickness.
  • the diameter of the half through hole is ⁇ 1
  • the diameter of the through hole located farthest from the half through hole among the one or more through holes is ⁇ 2
  • the layers are aligned on the same straight line.
  • solder is applied to the electrode surface on the opposite side of the solder joint surface of the flexible substrate. Heat can be efficiently and uniformly transmitted to the solder joint. Compared to conventional flexible substrates, good solder joints can be obtained at lower temperatures, so flux inactivation and solder oxide film formation can be suppressed, and good solder fixation with excellent solder wetting during heating is possible. Become. Furthermore, thermal damage to the substrate and the peripheral portion can be minimized.
  • connection electrode width is preferably 0.20 mm or more from the viewpoint of maintaining the connection strength.
  • the signal line width is preferably about 0.15 mm, for example, in order to match the characteristic impedance to 50 ⁇ .
  • the through-hole diameter ⁇ is preferably 0.20 mm or less, for example, so as not to disturb the shape of the electrode of the connection portion of the flexible substrate.
  • solder wetting tends to be poor, and 0.14 mm or more is preferable.
  • FIGS. 7A and 7B are diagrams showing the configuration of the flexible substrate according to the second embodiment of the present invention.
  • two through holes are included in the electrode region including the half through hole.
  • three or more through holes including the half through hole are included in the electrode region. including.
  • FIG. 7A is a top view of the end portion where the connection electrode of the flexible substrate is formed.
  • FIG. 7B is a diagram showing a cross section (VIIB-VIIB ′) as seen in a direction perpendicular to the electrode surface, including the through hole of the electrode.
  • FIG. 7A shows a state in which the solder covering the electrode surface is removed in order to show the electrode shape of the flexible substrate 70.
  • the flexible substrate 70 includes, for example, one or more electrodes 71 at one end of a rectangular substrate (base material) 74. Since a plurality of electrical signals and power sources are usually connected between the substrates in the optical transmission module, a plurality of electrodes 71 are provided. In this embodiment, an example including five electrodes is shown.
  • the surfaces of the plurality of electrodes 71 are, for example, Au plated for good soldering.
  • a half through hole (half via) 73 is formed at the tip of each of the plurality of electrodes 71, and through holes 72 a and 72 b that penetrate the front and back of the substrate 74 are formed in each electrode region 71. Therefore, three through holes including half through holes are formed inside the electrode region.
  • three or more through holes including a half through hole (half via) at the tip are arranged in the electrode longitudinal direction in the electrode region at the tip of the flexible substrate, and the interval W between the through holes is located at both ends. It should be less than 3 times the sum of the diameters of the through holes. That is, similarly to the first embodiment, the through-hole interval W and the through-hole diameter ⁇ may be set so as to satisfy the relationship of Expression (1) or Expression (2). It is desirable that the center positions of the half through-hole 73 at the end of the substrate and the other two or more through-holes 72a and 72b are linearly arranged at uniform intervals in the electrode longitudinal direction.
  • solder is evenly distributed on the electrodes on both sides through the through-holes in the preliminary soldering process.
  • Solder is also applied to the electrode surface opposite to the solder joint surface of the flexible substrate, and heat from the hot bar can be efficiently and uniformly transmitted to the solder joint portion.
  • good solder joints can be obtained at lower temperatures, so flux inactivation and solder oxide film formation can be suppressed, enabling good solder fixation with excellent solder wetting during heating. Become. Furthermore, thermal damage to the substrate and the peripheral portion can be minimized.
  • the interval W between the through holes conforms to the definition in FIGS. 8A and 8B. That is, when there are three or more through holes, the distance between the centers of the through holes is as shown in FIG. 8A. Unless there is a special reason, adjacent through holes are arranged at equal intervals.
  • the through holes are preferably circular and arranged on the same straight line in the longitudinal direction of the electrode. The shape, size, number, and arrangement of the through holes including the various conditions of the solder paste are set so that the solder can be held on both sides of the connection electrode in each through hole of the flexible substrate.
  • the flexible substrate electrode and through-hole layout configuration of the present invention can be applied to the side pad, and the solder fixing including the side pad is good while maintaining the effect of preventing the bending and increasing the peeling strength. Can be realized.
  • the electrode pattern and through hole configuration and design rules of the present invention are applied to a side pad will be described.
  • FIG. 12 is a diagram showing a configuration of a flexible substrate including a side pad electrode according to the prior art.
  • the flexible substrate 130 includes side pad electrodes 132a and 132b on both sides of the substrate in addition to the normal three electrodes 131 near the center.
  • the side pad electrodes 132a and 132b have a longer and thicker electrode region than the normal connection electrode 131 at the center, so that the folding line AA ′ is placed in the side pad electrode region and is not easily broken. .
  • half through holes (half vias) 133a and 133b are used on the side of the side pads.
  • the structure is strong not only against peeling of the flexible substrate from the short side of the electrode, but also against right and left (from the long side of the electrode) peeling stress from the side of the flexible substrate.
  • both the amount of solder and the solder wetting and spreading are insufficient in the side pads 132a and 132b as compared with the normal electrode 131, and a hot bar or the like is used. Even in the process using the instantaneous heating apparatus, the initial heat resistance was large and good solder melting conditions could not be obtained.
  • the thickness of the paste is controlled to an amount suitable for mounting including normal electrodes 131 other than the side pads, and should be thickened with the necessity of only the side pad electrodes. Is difficult.
  • the solder paste is removed along with the shape of the half-through holes after screen printing, and the amount of solder tends to decrease.
  • the half through hole has a structure in which the inner wall surface and the periphery of the through hole are not easily wetted by the solder during pre-solder reflow or solder fixing. Since the half-through hole has a cut circumference, it has been found that the solder is difficult to spread from the screen printing surface to the opposite surface, particularly at a position far from the front end of the half-through hole.
  • FIG. 9 is a diagram showing the configuration of the tip portion of the flexible substrate according to the third embodiment of the present invention.
  • the half through hole 86 at the end of one electrode 82 and the two through holes 85a and 85b in the electrode region are arranged in the longitudinal direction of the electrode.
  • the side pad electrode 81 has a half through hole 84 only at the end in the electrode longitudinal direction (on the short side of the electrode), and the side pad electrode region 81 has only through holes 83a and 83b.
  • the side pad electrode of the prior art has arranged a half through hole on the long side of the electrode, whereas the flexible substrate of the present invention does not have a half through hole on the long side of the electrode region. It is different. Even in the flexible substrate of the present invention, a folding line is generated along the short side of the normal electrode closer to the center on the inside of the substrate, but since it is in the region of the side pad electrode 81, it has a certain bending strength. . In addition, it is possible to make the shape of the preliminary solder more uniform by using a structure in which a through hole is arranged inside the electrode region of the side pad electrode.
  • the requirements for the electrode pattern such as the relationship between the through-hole spacing and the diameter, are the same as those in the first and second embodiments. *
  • the flexible substrate is made difficult to break by making the electrode region of the side pad electrode longer and thicker than the electrode region of the other electrode near the center excluding the side pad electrode.
  • the structure using a half through hole on the side surface of the side pad of the prior art shown in FIG. 12 has an advantage of a structure that is strong against peeling stress from the left and right sides of the electrode on the long side of the substrate.
  • the side pad electrode of this example does not use a half through hole on the side surface of the substrate, but has a through hole inside the electrode region. For this reason, it is difficult to remove screen-printed solder, and the decrease in the amount of solder is suppressed, and the solder tends to spread from the screen printed surface to the opposite surface through the through holes 83a and 83b.
  • the through-hole interval W and the through-hole diameter ⁇ are set so as to satisfy the relationship of the formula (1) or the formula (2) for the side pad electrode, as in the first and second embodiments.
  • the solder spreads to the opposite side (A surface) of the solder bonding surface of the side pad electrode and realizes a state where the solder spreads uniformly on both electrodes of the flexible substrate. can do.
  • the heat of the hot bar passes through the solder on the A-side electrode to the solder on the solder joint surface side. Efficient and uniform transmission, excellent solder wettability and good solder joints are possible.
  • the diameter of the half through hole 84 at the end of the side pad electrode and the adjacent through hole 83 b is different from that of the inner through hole 83 a, but the smaller through hole diameter is ⁇ 1.
  • the side pad electrode 81 also has the through-hole interval W and the through-hole diameter shown in the first embodiment as in the case of the three normal electrodes 82 near the center.
  • the relational expression (2) the electrode layout is different from that of Example 1, the uniformity of solder bonding of individual electrodes showed the same behavior as that of Example 1.
  • the necessary conditions (formulas (1) and ( 2)) is valid.
  • FIG. 10 is a diagram for explaining a method of mounting the flexible substrate of the present invention on the electrode on the terrace-shaped substrate.
  • a cross section of a structure in which an electrode 103 is formed on a substrate 102 protruding in a terrace shape on the side surface of the module base 101 is shown.
  • the hot bar 105 is preheated after the electrode portions of the flexible substrate 100 of Example 1 are aligned.
  • solder joints are formed while the hot bar 105 is pressurized and heated.
  • the flexible substrate mounting method of this embodiment is suitable for high-density multi-array electrode connection.
  • any of the first to third embodiments can be applied to the flexible substrate connected to the electrode on the terrace-shaped substrate.
  • FIG. 11 is a diagram for explaining a method of mounting the flexible substrate of the present invention on the upper and lower electrodes of the substrate protruding in a terrace shape.
  • the mounting method shown in FIG. 10 may be sequentially executed on each side.
  • FIG. 11A shows a state where the flexible substrate 110 has already been soldered on the electrode 113 on one surface of the terrace-like substrate 112. After this state, as shown in FIG. 11B, the terrace-shaped substrate 112 is inverted, and another flexible substrate 120 is soldered on the electrode 114 on the other surface.
  • the present invention can also be implemented as a mounting method in which the flexible printed wiring board according to any of the first to third embodiments described above is solder-connected to the circuit board.
  • the method includes aligning the plurality of electrodes on one surface of the first flexible printed wiring board with the plurality of electrodes on the first surface on the circuit board to be joined; A step of pressing and heating a heating body on the plurality of electrodes on the other surface of the one flexible printed wiring board; and holding the heating body, the one surface of the first flexible printed wiring board The plurality of electrodes and the plurality of electrodes on the first surface on the circuit board are brought into close contact with each other and soldered. *
  • the flexible board can be soldered one surface at a time using two types of solder having different melting temperatures.
  • solder For example, it is possible to use Sn-AgCu solder of lead-free solder as the solder, and after mounting one flexible substrate at a set temperature of 300 ° C. on the hot bar side, the other flexible substrate can be mounted at 280 ° C.
  • the solder tends to become high temperature during the solder fixing process, and the solder that is connected in the first process is completed. May remelt.
  • solder fixing can be performed at a lower temperature, so that a temperature difference of 20 ° C. between the two set temperatures provides a sufficient margin. Even during the second solder fixing process, the solder on the first fixed surface was not remelted.
  • the optical transmission module having a high-density multi-array electrode connection can be realized by the method of mounting the flexible board on the circuit board according to this embodiment. It can be used for electrical connection for realizing high-speed signal processing and high-density mounting expected for an optical transmission module.
  • the flexible substrate of the present invention and the mounting method thereof introduce design rules for the diameter and pitch interval of the through holes in the electrode region, and even using an instantaneous heating device such as a hot bar.
  • an instantaneous heating device such as a hot bar.
  • the present invention can be used in an optical communication system.
  • it can be used for an optical transmission module of an optical communication system.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

Un procédé de chauffage instantané a pour caractéristique de rendre les composants périphériques sensibles à la chaleur sur une carte de circuit imprimé ou à l'intérieur d'un emballage difficiles à chauffer par chauffage local uniquement de surfaces de connexion soudée ; cependant, l'optimisation d'une configuration de motif d'électrode est requise d'un point de vue différent des cas de fixation par brasage tendre à la main, et les conditions requises ainsi que les règles de conception n'ont pas été suffisamment étudiées pour des configurations spécifiques de motifs d'électrode et pour des états de brasage sur des surfaces à l'opposé de la surface de connexion soudée avec la technologie classique. Grâce à la présente invention, une brasure est appliquée à l'avance par sérigraphie ou similaire sur les électrodes de manière à ce que le brasage préliminaire se fasse uniformément sur les deux surfaces des électrodes de connexion, y compris la carte de câblage imprimé souple à travers les trous à l'intérieur de la région, ce qui permet d'obtenir d'excellentes connexions soudées. En outre, les connexions soudées sont faites sur la surface opposée à la surface de connexion pour les électrodes de connexion sur la carte de câblage imprimé souple en appliquant une pression et des procédés d'augmentation de température à l'aide d'une barre chaude ou similaire sur la carte de câblage imprimé souple dans un état où le brasage préliminaire a été rendu uniforme.
PCT/JP2016/000027 2015-01-07 2016-01-05 Carte de câblage imprimé souple et son procédé de montage WO2016111243A1 (fr)

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WO2018074078A1 (fr) * 2016-10-21 2018-04-26 株式会社村田製作所 Carte de circuit imprimé à connecteur
JP7449816B2 (ja) 2020-08-21 2024-03-14 ＣＩＧ Ｐｈｏｔｏｎｉｃｓ Ｊａｐａｎ株式会社 光モジュール
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