WO2016107146A1 - Adhésif à liaison temporaire pour le traitement de plaquette mince et procédé de préparation associé - Google Patents

Adhésif à liaison temporaire pour le traitement de plaquette mince et procédé de préparation associé Download PDF

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Publication number
WO2016107146A1
WO2016107146A1 PCT/CN2015/084687 CN2015084687W WO2016107146A1 WO 2016107146 A1 WO2016107146 A1 WO 2016107146A1 CN 2015084687 W CN2015084687 W CN 2015084687W WO 2016107146 A1 WO2016107146 A1 WO 2016107146A1
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WO
WIPO (PCT)
Prior art keywords
temporary bonding
bonding adhesive
parts
temporary
solvent
Prior art date
Application number
PCT/CN2015/084687
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English (en)
Chinese (zh)
Inventor
孙蓉
帅行天
邓立波
张国平
郭慧子
Original Assignee
深圳先进技术研究院
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Application filed by 深圳先进技术研究院 filed Critical 深圳先进技术研究院
Priority to DE212015000125.3U priority Critical patent/DE212015000125U1/de
Priority to JP2016565384A priority patent/JP6148414B1/ja
Publication of WO2016107146A1 publication Critical patent/WO2016107146A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
    • C09J167/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/16—Homopolymers or copolymers of alkyl-substituted styrenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C09J133/12—Homopolymers or copolymers of methyl methacrylate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J125/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Adhesives based on derivatives of such polymers
    • C09J125/02—Homopolymers or copolymers of hydrocarbons
    • C09J125/16—Homopolymers or copolymers of alkyl-substituted styrenes

Definitions

  • the invention relates to the technical field of adhesives, in particular to a temporary bonding adhesive for thin wafer processing and a preparation method thereof.
  • Cipheral Patent No. CN104130727A discloses a pressure-sensitive temporary bonding adhesive comprising 30-70 parts of a solvent, 30-50 parts of a base resin, and 5-30 parts of microcapsule particles, wherein the base resin is a cyclic olefin polymer particle, a solvent.
  • microcapsule particle structure being composed of an inner core of a polymer compound and an outer layer of a continuous or outer phase of a natural or synthetic polymer compound, and further comprising a tackifier and a low molecular weight ring.
  • Cisokida olefin copolymer One or a mixture of an olefin copolymer, a plasticizer, and an antioxidant.
  • Chinese patent CN102203917A discloses a composition for temporary wafer bonding, which composition is composed of a free tackifier, a low molecular weight cyclic olefin copolymer, a plasticizer, an antioxidant, wherein the tackifier is selected from the group consisting of Polymyrene resin, R-poly mushroom resin, styrene modified mushroom resin, polymerized rosin resin, rosin resin, alicyclic hydrocarbon resin, C 5 aliphatic hydrocarbon resin, hydrogenated hydrocarbon resin, low molecular weight cyclic olefin copolymer It has a weight average molecular weight of less than about 50,000 Daltons.
  • the temporary bonding adhesive still has a technical defect of low thermal stability and poor corrosion resistance.
  • an aspect of the present invention provides a temporary bonding adhesive having high thermal stability and high corrosion resistance.
  • a temporary bonding adhesive for thin wafer processing characterized in that the total mass of the temporary bonding adhesive is 100 parts, including 55 to 70 parts of a solvent, and 30 to 45 parts dissolved or dispersed in a solvent.
  • a base resin which is a high polymer or a blended polymer having a thermal decomposition temperature of 320 ° C or higher.
  • the thermal decomposition temperature of the base resin is above 320 ° C to ensure that the bonding layer formed by the temporary bonding adhesive has good thermal stability.
  • the base resin has a weight average molecular weight of from 5 ⁇ 10 3 to 5 ⁇ 10 5 and a melt index of 24 or more.
  • high polymer examples include polyalkyl acrylates, polyphenylenes, and polyesters.
  • the high polymer is a polyalkyl acrylate which contains repeating units in the molecular structure. a homopolymer or interpolymer, wherein R 1 is a C 1-2 aliphatic hydrocarbon or an aromatic hydrocarbon, and R 2 is a C 1-3 aliphatic hydrocarbon or an aromatic hydrocarbon.
  • R 1 is a C 1-2 aliphatic hydrocarbon or an aromatic hydrocarbon
  • R 2 is a C 1-3 aliphatic hydrocarbon or an aromatic hydrocarbon.
  • polymethyl methacrylate polymethyl methacrylate.
  • the T g is 65 ° C; the number of carbon atoms in R 1 is 4, and the number of carbon atoms in R 2 is 1 (ie PBMA), the T g is 20 ° C, and its thermal decomposition temperature in air is higher. Low (220 ° C only).
  • the number of carbon atoms of R 2 is preferably from 1 to 3, and may be an aromatic hydrocarbon. It is worth noting that the number of carbon atoms in R 2 may not be less than 1, and the methyl acrylate obtained when the number of carbon atoms of R 2 is zero Tg is too low (only 6 ° C).
  • Polyphenylene which contains repeating units in the molecular structure a homopolymer or interpolymer, wherein R 1 and R 2 are preferably C 1-3 aliphatic hydrocarbons or aromatic hydrocarbons. If both R 1 and R 2 are aliphatic hydrocarbon groups, the olefin polymer formed on the one hand has a low T g due to the absence of a side chain group in its molecular structure, and on the other hand it is easily crystallized (for example, PE, PP, PMP have High crystallinity), which may affect the performance of the base resin as an adhesive material; if the aliphatic hydrocarbon chain is too long, it will increase the flexibility of the polymer and lower its T g , which will affect the use temperature of the bonding adhesive. .
  • Polyester which contains repeating units in the molecular structure a homopolymer or interpolymer, wherein R is cyclohexane, phenyl or hexyloxy,
  • polyester a physical blend of three polyesters of A, B and C can be used.
  • the mass content ranges of A, B, and C are 10 to 60%, 10 to 80%, and 0 to 50%, respectively, and the molecular weight ranges of A, B, and C are 8,000 to 30,000, 5,000 to 50,000, and 5,000 to 100,000, respectively.
  • the blended polymer may be one or more polyalkyl acrylates, and may be one or more polyphenylenes or one or more polyesters. Also can be one A mixture of a polyalkyl acrylate and a polyphenylene, or a mixture of a polyalkyl acrylate and a polyester, and the like.
  • a polyacrylate having a molecular weight of 5,000 to 30,000,000 and a poly- ⁇ -methylstyrene having a molecular weight of 3,000 to 20,000 may be used, and the mass ratio of the two is 2:1 to 20:1.
  • the boiling point of the solvent is preferably above 80 ° C and the polarity is similar to the corresponding polymer.
  • the solvent may be, for example, one or at least two of propylene glycol monomethyl ether acetate, dimethylacetamide, propylene glycol monomethyl ether, ethyl lactate, decene, mesitylene, cyclododecene, and cyclopentanone. .
  • the total mass of the temporary bonding adhesive is 100 parts, and further includes 0.05 to 0.07 parts of a leveling agent and 0 to 0.15 parts of an antioxidant.
  • the leveling agent is preferably an acrylate-based leveling agent modified with fluorine.
  • the antioxidant is preferably composed of a multi-hindered phenolic antioxidant as a main antioxidant and a phosphite antioxidant as an auxiliary antioxidant, and the combination of the two helps to improve the heat of the bonding adhesive. stability.
  • a preferred formulation comprises 20-30 parts of PMMA, 10-15 parts of poly- ⁇ -methylstyrene, 55-70 parts of solvent and 0.05-0.07 parts of FC-4430 leveling. More preferably, the raw material comprises 24 parts of PMMA, 12 parts of poly- ⁇ -methylstyrene, 64.95 parts of DMAc and 0.05 parts of a type IV-4430 leveling agent.
  • a method for preparing a temporary bonding adhesive is provided, and a temporary bonding adhesive having high thermal stability and high corrosion resistance can be obtained by the preparation method.
  • a preparation method of the above temporary bonding glue wherein 30 to 45 parts of the base resin, 55 to 70 parts of the solvent and 0.05 to 0.07 parts of the leveling agent are stirred and mixed under heating conditions, and then cooled and degassed. , get temporary bonding glue.
  • the heating method is a water bath at 60 to 70 ° C; the stirring method is mechanical stirring at a speed of 100 to 1000 rpm; and the degassing treatment is vacuum degassing by a vacuum deaerator.
  • a method for bonding a thin wafer by using the above temporary bonding glue specifically: after the temporary bonding glue is spin-coated on the surface of the carrier wafer, and the solvent is dried, the device wafer is covered on the surface Then, the temporary bonding glue is heated to melt and cool to form a bonding layer.
  • the manner of heating the temporary bonding glue may be a baking method.
  • the other surface of the wafer that is not coated with the bonding adhesive can be directly transferred by baking.
  • the solvent in the bonding adhesive first volatilizes, and then with the continuation of the heating, the base resin slowly melts at about 200 ° C, and is cooled and solidified to form a bonding layer, thus carrying the wafer and the device wafer.
  • the surface is keyed.
  • the DMAc is used to clean the remaining adhesive layer on the periphery of the device wafer, and similarly, DMAc can be used as a cleaning agent to dissolve the bonding layer during the debonding of the device wafer.
  • the temporary bonding adhesive of the present invention comprises 55 to 70 parts of a solvent and 30 to 45 parts of a base resin dissolved or dispersed in a solvent, the base resin is a thermal decomposition temperature, based on 100 parts by mass of the total mass of the temporary bonding glue.
  • the layer is easy to clean and the preparation cost is economical.
  • FIG. 1 is a graph showing a thermogravimetric change of a dry film of a coating of a temporary bonding adhesive according to Embodiment 1 of the present invention
  • Example 2 is a graph showing the thermogravimetric change of the dry film of the coating of the temporary bonding adhesive of Example 2 of the present invention
  • Figure 3 is a graph showing the viscosity and temperature of a solvent-free temporary bonding adhesive of Example 2 of the present invention.
  • Figure 4 is a graph showing the thickness distribution of the temporary bonding adhesive coating dry film of Example 2 of the present invention.
  • Figure 5 is an ultrasonic scanning micrograph of a temporary bonding glue bonded wafer of Example 2 of the present invention.
  • the raw materials specifically include: 4 g of homemade polyester, 5 mg of 4430 leveling agent, and 5.995 g of solvent PGMEA; and stirred at room temperature for 1 hour.
  • the raw material specifically comprises: 2.0 g of polymethyl methacrylate, 1.0 g of poly- ⁇ -methylstyrene, 5 mg of FC-4430 type leveling agent, and 5.5 g of DMAc; example 1.
  • the raw material specifically includes: 3.0 g of polymethyl methacrylate, poly 1.5 g of ⁇ -methyl styrene, 7 mg of FC-4430 type leveling agent, and 7.0 g of DMAc; otherwise, the same applies to the examples. 1.
  • Example 1 The test results of the corrosion resistance of Example 1 and Example 2 are as follows in Table 1 and Table 2 below (in view of the specific test methods are well known to those skilled in the art, the method will not be described in detail herein):
  • thermogravimetric change curves of Examples 1 and 2, respectively can be seen from the figure, the phenomenon of decomposed weight loss occurs in the dry film from 300 ° C, and the weight loss rate at 450 ° C is 80%. That is, most of the decomposition occurs, and thus it can be seen that the temporary bonding adhesive of the present invention has good thermal stability.
  • FIG. 3 it is a viscosity graph of the temporary bonding adhesive of Example 1. As can be seen from the figure, the overall change in viscosity with temperature is mild, thus indicating that the temporary bonding adhesive of the present invention has better viscosity stability.
  • FIG. 4 it is a thickness distribution diagram of the dry film of the temporary bonding adhesive coating of Example 2 of the present invention. It can be seen from the figure that the thickness of the temporary bonding adhesive coating is relatively uniform, thereby indicating that the average thickness of the bonding layer is 22.7 ⁇ m and the standard deviation is 0.5, indicating that the thickness of the bonding layer is appropriate and the bonding layer is flat. The better coating effect, the process requirements of the coating are not critical.
  • an ultrasonic scanning micrograph after bonding a wafer using the temporary bonding glue of Example 2 of the present invention As can be seen from the figure, it can be seen that the bonding layer between the two bonded silicon wafers has no voids (no white spots) and is evenly distributed.
  • the present invention illustrates the detailed process equipment and process flow of the present invention by the above embodiments, but the present invention is not limited to the above detailed process equipment and process flow, that is, does not mean that the present invention must rely on the above detailed process equipment and The process can only be implemented. It should be apparent to those skilled in the art that any modifications of the present invention, equivalent substitution of the various materials of the products of the present invention, addition of auxiliary components, selection of specific means, and the like, are all within the scope of the present invention.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

La présente invention concerne un adhésif à liaison temporaire pour le traitement d'une plaquette mince et un procédé de préparation associé. Pour 100 parties totales en poids de l'adhésif à liaison temporaire, l'adhésif à liaison temporaire comprend 55 à 70 parties en poids d'un solvant et 30 à 45 parties en poids d'une résine de base dissoute ou dispersée dans le solvant. La résine de base est un haut polymère ou un mélange de haut polymère ayant une température de décomposition thermique supérieure à 320 °C et un indice de fusion supérieur à 24. L'adhésif à liaison temporaire présente avantageusement une stabilité thermique élevée et une résistance élevée à la corrosion; en outre, la liaison/décollement de l'adhésif à liaison temporaire est efficace, permettant ainsi un nettoyage facile de la couche d'adhésif résiduel, et la préparation de l'adhésif à liaison temporaire est économique.
PCT/CN2015/084687 2014-12-31 2015-07-21 Adhésif à liaison temporaire pour le traitement de plaquette mince et procédé de préparation associé WO2016107146A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
DE212015000125.3U DE212015000125U1 (de) 2014-12-31 2015-07-21 Temporäres Klebehaftmittel zum Prozessieren eines dünnen Wafers
JP2016565384A JP6148414B1 (ja) 2014-12-31 2015-07-21 薄ウェハー加工用の仮着接着剤及びその製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410855541.2 2014-12-31
CN201410855541.2A CN104559852B (zh) 2014-12-31 2014-12-31 一种用于薄晶圆加工的临时键合胶及其制备方法

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WO2016107146A1 true WO2016107146A1 (fr) 2016-07-07

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JP (1) JP6148414B1 (fr)
CN (1) CN104559852B (fr)
DE (1) DE212015000125U1 (fr)
WO (1) WO2016107146A1 (fr)

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Publication number Priority date Publication date Assignee Title
CN104559852B (zh) * 2014-12-31 2018-02-27 深圳市化讯半导体材料有限公司 一种用于薄晶圆加工的临时键合胶及其制备方法
CN112980364A (zh) * 2021-02-05 2021-06-18 华南理工大学 一种具有高热稳定性和低模量的临时粘接胶及其制备方法与应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149819A (ja) * 2007-12-21 2009-07-09 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム
WO2009126544A1 (fr) * 2008-04-08 2009-10-15 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Assemblages et procédés permettant de réduire le gauchissement et la courbure d'un substrat flexible durant le traitement de semi-conducteurs
WO2014050455A1 (fr) * 2012-09-28 2014-04-03 富士フイルム株式会社 Adhésif provisoire pour la production de dispositifs semi-conducteurs, substrat adhésif associé, et procédé de production de dispositifs semi-conducteurs
CN104559852A (zh) * 2014-12-31 2015-04-29 深圳先进技术研究院 一种用于薄晶圆加工的临时键合胶及其制备方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8092628B2 (en) 2008-10-31 2012-01-10 Brewer Science Inc. Cyclic olefin compositions for temporary wafer bonding
KR20100134492A (ko) * 2009-06-15 2010-12-23 스미토모 베이클리트 컴퍼니 리미티드 반도체 웨이퍼의 가고정제 및 그것을 이용한 반도체 장치의 제조 방법
JP2012129323A (ja) * 2010-12-14 2012-07-05 Sumitomo Bakelite Co Ltd 基材の加工方法
KR20120104450A (ko) * 2011-03-08 2012-09-21 (주)엘지하우시스 웨이퍼 가공 필름용 점착제 조성물
JP5762279B2 (ja) * 2011-12-28 2015-08-12 三井住友建設株式会社 移動パネル装置
CN103184022B (zh) * 2011-12-30 2017-09-19 汉高股份有限及两合公司 用于硅片制备中的暂时性粘合用粘合剂组合物
CN102585748B (zh) * 2012-02-09 2014-05-07 北京联合大学生物化学工程学院 用于晶体加工过程中晶片粘接的水溶性热熔胶及其制备方法
JP6068438B2 (ja) * 2012-03-12 2017-01-25 リンテック株式会社 バックグラインドシート用基材および粘着シート、当該基材およびシートの製造方法、ならびにワークの製造方法
CN103571367B (zh) * 2013-11-08 2014-10-22 烟台德邦科技有限公司 一种晶圆减薄压敏胶及其制备方法
CN104130727B (zh) * 2014-08-06 2016-06-01 华进半导体封装先导技术研发中心有限公司 一种压敏临时键合胶的制备方法及其应用

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009149819A (ja) * 2007-12-21 2009-07-09 Tokyo Ohka Kogyo Co Ltd 接着剤組成物および接着フィルム
WO2009126544A1 (fr) * 2008-04-08 2009-10-15 Arizona Board Of Regents, A Body Corporate Of The State Of Arizona Acting For And On Behalf Of Arizona State University Assemblages et procédés permettant de réduire le gauchissement et la courbure d'un substrat flexible durant le traitement de semi-conducteurs
WO2014050455A1 (fr) * 2012-09-28 2014-04-03 富士フイルム株式会社 Adhésif provisoire pour la production de dispositifs semi-conducteurs, substrat adhésif associé, et procédé de production de dispositifs semi-conducteurs
CN104559852A (zh) * 2014-12-31 2015-04-29 深圳先进技术研究院 一种用于薄晶圆加工的临时键合胶及其制备方法

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CN104559852B (zh) 2018-02-27
DE212015000125U1 (de) 2017-02-20
JP2017519852A (ja) 2017-07-20
JP6148414B1 (ja) 2017-06-14
CN104559852A (zh) 2015-04-29

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