WO2016101874A1 - 通讯设备金属外壳及其制备方法 - Google Patents

通讯设备金属外壳及其制备方法 Download PDF

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Publication number
WO2016101874A1
WO2016101874A1 PCT/CN2015/098295 CN2015098295W WO2016101874A1 WO 2016101874 A1 WO2016101874 A1 WO 2016101874A1 CN 2015098295 W CN2015098295 W CN 2015098295W WO 2016101874 A1 WO2016101874 A1 WO 2016101874A1
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Prior art keywords
slit
metal
metal casing
laser
casing according
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PCT/CN2015/098295
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English (en)
French (fr)
Inventor
赵桂网
李孔林
郭丽芬
董明杰
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比亚迪股份有限公司
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Publication of WO2016101874A1 publication Critical patent/WO2016101874A1/zh

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/04—Metal casings
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/361—Removing material for deburring or mechanical trimming

Definitions

  • the present invention relates to the field of materials, and in particular, to a method of preparing a metal casing for a communication device and a metal casing.
  • metal casings Due to the more beautiful and more textured metal casing and the superior performance of wear resistance and scratch resistance, with the development of metal processing technology, mobile communication devices such as mobile phones and tablet computers are increasingly inclined to use metal casings, especially It is a large-area metal casing, but electromagnetic waves cannot penetrate the metal. In order to achieve good electrical signal effects, when using a metal casing, it is necessary to process a single or a plurality of slits on the casing, and design the antenna at the slit.
  • the first one is the traditional method of machining slits, such as grinding wheel cutting, CNC machine tools (CNC), etc.
  • This processing method has low precision and cannot reach the communication equipment.
  • the required slit width, and in this cutting mode, the blade/bit or the like contacts the machined workpiece (ie, the metal casing) in a high-speed operation manner, which causes mechanical stress on the workpiece, easily causes deformation of the product, and reduces overall mechanical strength.
  • the second method is the use of laser cutting. Due to the coaxial blowing in the laser process, the metal slag is generated on the lower surface of the metal substrate, which necessitates the selection of the cutting process after the cutting, otherwise the slag will be associated with the lower layer.
  • the combination of plastics causes the slit area to be re-conducted, which affects the passage of electromagnetic waves. If the process of first cutting and then injection molding is adopted, the metal substrate after cutting has low strength and is easily deformed after injection molding.
  • the present invention aims to solve at least one of the technical problems existing in the prior art. Accordingly, it is an object of the present invention to provide a method of fabricating a metal casing for a communication device which is capable of processing a smooth, burr-free slit on a metal casing having a plastic support layer with high precision, in slit processing, The metal casing and the slit are not deformed during the surface decoration process, thereby ensuring the uniformity of the appearance of the metal casing.
  • the present invention provides a method of fabricating a metal casing for a communication device, wherein the method comprises the steps of: 1) providing a metal casing comprising a metal substrate and a plastic support layer, the plastic support shown a layer formed on the inner surface of the metal substrate; 2) a slit formed on the metal substrate by laser etching, the slit penetrating the metal substrate and not penetrating the plastic support layer; 3) Metal substrate The outer surface forms a decorative layer. Thereby, a metal casing which is not electrically connected to the bottom of the slit can be obtained, and the communication signal can be realized while maintaining the metal characteristics of the casing.
  • a metal casing comprising a metal substrate and a plastic support layer attached to the inner surface of the metal substrate;
  • the method adopts a laser etching method to process a single or a plurality of smooth and burr-free slits on a metal casing having a plastic support layer, and the obtained slit
  • the width is extremely narrow, only micron level, and the obtained slit is not conductive, and subsequently covered by the flat decorative layer, the nakedness of the outer casing slit is invisible, so that the appearance of the outer casing presents an all-metal texture.
  • the slit is made of non-metal material, the antenna of the electronic communication device is designed at the slit to allow electromagnetic waves to pass through without shielding the antenna radiation.
  • the invention also provides a metal casing for a communication device prepared by the above method.
  • the metal casing has all of the features and advantages of the metal casing prepared by the method described above and will not be further described herein.
  • FIG. 1 is a schematic structural view of a metal casing of a communication device according to an embodiment of the present invention
  • FIG. 2 is a block diagram showing the structure of a metal casing of a communication device according to another embodiment of the present invention.
  • FIG. 3 is a block diagram showing the structure of a metal casing of a communication device in accordance with still another embodiment of the present invention.
  • the communication device can be, for example, a mobile phone, a tablet computer, a notebook computer, or a Bluetooth headset.
  • the inner surface of the metal casing is defined as the surface of the metal casing facing the interior of the communication device when it is used in a communication device.
  • the outer surface of the metal housing is defined as the surface of the metal housing that faces the outside when it is used in a communication device.
  • the inner and outer surfaces of the metal substrate for preparing the metal outer casing and the inner and outer surfaces of the slit are also applicable to the above definition.
  • laser etching means that the processed material is volatilized or chemically physically changed by light energy from above.
  • the material of the metal substrate may be various metals commonly used in communication equipment in the art, and may be, for example, an aluminum alloy, a stainless steel, a magnesium alloy, or a titanium alloy.
  • the method for preparing a metal casing of a communication device comprises the following steps:
  • a metal housing in this step, includes a metal substrate and a plastic support layer attached to the inner surface of the metal substrate.
  • the metal housing is provided to include a metal group and a plastic support layer attached to the inner surface of the metal substrate.
  • the thickness of the metal base and the thickness of the plastic support layer are not particularly limited, and those skilled in the art can appropriately select according to a specific communication device.
  • the thickness of the metal substrate may be from 0.1 to 0.6 mm, in some embodiments of the invention, the thickness of the metal substrate is from 0.2 to 0.5 mm; the thickness of the plastic support layer may be from 0.1 to 2 mm, in some embodiments of the invention The thickness of the plastic support layer is 0.4-1.2 mm.
  • the metal casing as the present invention can be obtained by purchase or by self-processing.
  • a metal substrate to which a plastic support layer is attached that is, a metal case according to an embodiment of the present invention, can be obtained by injection molding a resin on a surface of a metal substrate.
  • the method of molding the resin can adopt a conventional injection molding method and conditions.
  • the conditions of the injection molding may include: an injection pressure of 1600-2400 bar, a pressure of 800-1400 bar, and an upper and lower mold temperature of 80-150 when using an oil temperature machine. Celsius, the injection time is 0.5-2s.
  • the material used in the above injection molding may be a resin conventionally used in the art, and may be, for example, selected from the group consisting of polyethylene, polypropylene, polyacetal, polystyrene, modified polyphenylene ether, polyethylene terephthalate, and poly Butylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyimide, polyamideimide, polyetherimide, polysulfone, polyethersulfone, polyetherketone One or more of polyetherether magnesium, polycarbonate, polyamide, and acrylonitrile-butadiene-styrene copolymer.
  • the material used in the injection molding is a mixture of resin and glass fiber.
  • the resin is selected from the group consisting of polyphenylene sulfide, polycarbonate, and polyamide; and the glass fiber is contained in an amount of 1 to 50% by weight based on the weight of the mixture.
  • a slit penetrating the metal substrate but not penetrating the plastic support layer is formed on the metal substrate by laser etching. Therefore, the above-mentioned slit can be used to effectively ensure the transmission of the antenna and the external signal, and the line of sight communication.
  • the slit width may be 5-100 ⁇ m, in some embodiments of the invention, the slit width is 25-5 ⁇ m; the slit length may be 0.1-500 mm, in some embodiments of the present invention The slit length is 10-150 mm.
  • more than one slit may be formed on the metal base of the metal casing, in other words, in this step, a plurality of slits are provided.
  • the number and shape of the slits are not particularly limited as long as communication can be realized.
  • the number of slits may be 1-200.
  • the number of slits is 5-50;
  • the shape of the slit may be linear, curved, square wave linear or sawtooth. Linear, in some embodiments of the invention, the shape of the slit is linear.
  • the spacing between two adjacent slits may be from 0.1 to 10 mm, and in some embodiments of the invention, the spacing between adjacent two of the slits is between 0.3 and 1.6 mm.
  • more than one slit is formed on the metal substrate by laser etching, and the slit penetrates the metal substrate and does not penetrate the plastic support layer.
  • the metal substrate is completely opened by laser etching, and the plastic support layer is not transparent, so that the slit on the surface of the metal casing can be made non-permeable and communication can be ensured. Further, by performing slit processing on the metal substrate under the support of the plastic support layer, it is possible to prevent the slit from being deformed during the processing.
  • the purpose is to form a through slit on the metal substrate without forming a slit on the plastic support layer, but in actual operation There may be a case where a groove is formed on a part of the plastic support layer, but the effect of the present invention can be achieved by ensuring that the plastic support layer is impervious.
  • the cross-sectional shape of the groove formed on a portion of the plastic support layer may be one or more of an inverted cone shape, an arc shape, a rectangular shape, and an inverted trapezoid shape.
  • the laser light can be an infrared laser, a visible laser or an ultraviolet laser.
  • the laser is an infrared laser, a green external laser, or an ultraviolet laser.
  • the wavelength of the laser is 1064 nm, 532 nm or 355 nm.
  • the conditions of the laser etching can be ensured as long as the slit of the above size can be obtained.
  • the laser etching conditions are: processing power is 2-150 W, processing speed is 20-3000 mm/s, The frequency is 1-80 kHz; in some embodiments of the invention, the laser etching conditions are: processing power of 5-50 W, processing speed of 50-500 mm/s, frequency of 20-60 kHz; some implementations of the invention In the example, the laser etching conditions are: processing power of 5-18 W, processing speed of 50-60 mm/s, and frequency of 20-60 kHz.
  • the method may further include:
  • the decorative layer in this step, it is necessary to form a decorative layer on the outer surface of the metal substrate.
  • the decorative layer can be carried out by conventional methods and conditions in the art, for example, the decorative layer can be formed by one or more of electrophoresis, micro-arc oxidation, anodization, hard anode, and spray coating.
  • the thickness of the above decorative layer may vary over a wide range, and in some embodiments of the invention, the decorative layer has a thickness of 5 to 60 ⁇ m.
  • the decorative layer may be an existing decorative layer of various electronic product casings, for example, one of an aluminum oxide layer, an epoxy resin coating, and an acrylic resin coating.
  • the decorative layer may be formed by an anodizing method
  • the anodizing condition may be a condition known in the art, for example, sulfuric acid having a concentration of 150-210 g/L as a bath, a voltage of 10-15 V, and a current density. It is 1-2A/dm 2 , the temperature is 10-22 degrees Celsius, the anodizing time is 20-60min, the sealing liquid (component such as NiSO 4 aqueous solution) has a concentration of 1-10g/L, and the sealing temperature is 50-95. Celsius, sealing time is 10-50min.
  • the thickness of the decorative layer formed by the above anodizing method is usually 10 to 30 ⁇ m.
  • the decorative layer may be formed by a micro-arc oxidation method, and the micro-arc oxidation conditions may be under conditions known in the art, for example, a pH of 6-12, a voltage of 0-800 V, and a current density of 1-10 A/dm 2 .
  • the temperature is 15-60 degrees Celsius
  • the time is 10-60 minutes
  • the sealing liquid is water
  • the sealing temperature is 70-90 degrees Celsius
  • the sealing time is 1-10 minutes.
  • the thickness of the decorative layer formed by the above micro-arc oxidation method is usually from 10 to 50 ⁇ m.
  • the decorative layer is formed by electrophoresis
  • the electrophoresis conditions may be conditions well known in the art, for example, cathodic electrophoresis: voltage is 20-60 V, pH is 4-6, temperature is 15-30 degrees Celsius, and time is 20-60 s; Anodic electrophoresis: voltage is 40-100V, pH is 6-8, temperature is 15-30 degrees Celsius, time is 40-90s; baking temperature is 120-200 degrees Celsius, baking time is 30-60min.
  • the thickness of the decorative layer formed by the above electrophoresis method is usually 5 to 35 ⁇ m.
  • the decorative layer may be formed by spraying, and the spraying conditions may be conditions well known in the art, for example, electrostatic high pressure: 60-90 kV; electrostatic current: 10-20 ⁇ A; flow rate pressure: 0.3-0.55 Mpa; atomization pressure: 0.33- 0.45Mpa; conveying speed: 4.5-5.5m/min; curing temperature: 150-220 degrees Celsius; curing time: 20-120min.
  • electrostatic high pressure 60-90 kV
  • electrostatic current 10-20 ⁇ A
  • flow rate pressure 0.3-0.55 Mpa
  • atomization pressure 0.33- 0.45Mpa
  • conveying speed 4.5-5.5m/min
  • curing temperature 150-220 degrees Celsius
  • curing time 20-120min.
  • a single or a plurality of smooth and burr-free slits can be processed on a metal casing having a plastic support layer by laser etching.
  • the slit width is extremely narrow, only on the order of micrometers, and the obtained slit is not conductive, and subsequently covered by the flat decorative layer, the nakedness of the outer casing slit is invisible, so that the appearance of the outer casing is full metal texture.
  • the antenna of the electronic communication device is designed at the slit to allow electromagnetic waves to pass through without shielding the antenna radiation.
  • a metal casing comprising a metal substrate and a plastic support layer attached to the inner surface of the metal substrate;
  • the invention also provides a metal casing for a communication device prepared by the above method.
  • Aluminum alloy (purchased from Dongguan Gangxiang Metal Materials Co., Ltd., grade 6063, thickness 0.4mm) was cut into a metal matrix of 15 mm x 80 mm.
  • the above metal substrate was subjected to degreasing and water washing to remove surface stains and oil stains, and then dried at 80 ° C for 20 min to obtain a metal base A11 after washing and drying.
  • the above metal substrate A11 was placed in a mold, and injection molding was performed using a polyphenylene sulfide resin.
  • the injection molding conditions are: injection pressure of 1800 bar, pressure of 1000 bar, upper and lower mold temperature of 100 ° C when using oil temperature machine, injection time of 1.5 s, forming a plastic support layer (thickness of 1.0 mm), thereby obtaining a metal with a plastic support layer Housing A12.
  • the slit is processed on the metal casing A12 by using an infrared laser (model LSF20 laser produced by Huagong Laser, wavelength 1064 nm).
  • the slit width was 50 ⁇ m
  • the number of processed strips was 6,
  • the length of the slit was 10 mm
  • the slit pitch was 0.6 mm.
  • the laser processing power is 18W
  • the speed is 50mm/s
  • the frequency is 20kHz.
  • a metal casing A13 is obtained.
  • the resulting slit surface was smooth and burr-free, and the slit conductivity was measured by a Fluke 175 True RMS multimeter, and as a result, all six were non-conductive.
  • the metal casing A13 is subjected to alkali etching, water washing, pickling, and water washing, and then immersed in an electrolytic bath containing a H 2 SO 4 aqueous solution having a concentration of 180 g/L, using a metal substrate A13 as an anode and a stainless steel plate as a cathode.
  • the anode was oxidized for 40 min under the condition of a voltage of 15 V, a current density of 1 A/dm 2 and a temperature of 19 ° C. After the anodization was completed, it was taken out and ultrasonically cleaned to avoid the influence of the acid in the slit on the subsequent coloration. At this point, the slit is completely covered by the decorative layer and is invisible to the naked eye.
  • the anodized metal shell A13 was immersed in an acid dye solution (purchased from Okuno Industry Co., Ltd., dye type TAC BLACK-SLH) for 10 min, and the acid dye solution concentration was 5 g/L, and the pH was 5.5.
  • the temperature of the dye solution is 50 degrees Celsius, and after removal, it is taken out and cleaned.
  • the metal casing A22 was obtained in the same manner as in the step 1) of Example 1.
  • a slit is processed on the metal casing A22 by using a green external laser (model LSG7EI laser produced by Huagong Laser, wavelength 532 nm).
  • the slit width was 30 ⁇ m
  • the number of processed strips was 6,
  • the length of the slit was 10 mm
  • the slit pitch was 0.6 mm.
  • the laser processing power is 7W
  • the speed is 60mm/s
  • the frequency is 60kHz.
  • a metal casing A23 is obtained.
  • the resulting slit surface was smooth and burr-free, and the slit conductivity was measured by a Fluke 175 True RMS multimeter, and as a result, all six were non-conductive.
  • the metal shell A23 is degreased, and then immersed in a micro-arc oxidation electrolyte (component and composition: sodium hexametaphosphate 40 g / L, sodium silicate 8 g / L, ammonium metavanadate 12 g / L), the metal
  • the casing A23 serves as an anode
  • the stainless steel plate serves as a cathode, and is subjected to micro-arc oxidation for 40 minutes under the conditions of a voltage of 0-600 V, a current density of 5 A/dm 2 and a temperature of 25 ° C. After completion, it is taken out and cleaned with pure water.
  • a metal shell A23 after micro-arc oxidation is obtained. At this time, the slit is completely covered by the micro-arc oxide film, and the surface slit has no hand feeling.
  • micro-arc oxidized metal casing A23 was immersed in hot pure water having a temperature of 85 ° C for 5 minutes, and then taken out and blown dry.
  • the metal casing A32 was obtained in the same manner as in the step 1) of Example 1.
  • the slit was machined on the metal casing A32 using an ultraviolet laser (Model LSU3EI laser produced by Huagong Laser, wavelength 355 nm).
  • the slit width is 25 ⁇ m
  • the number of processed strips is six
  • the length of the slit is 10 mm.
  • the spacing is 0.6mm.
  • the laser processing power is 5W
  • the speed is 50mm/s
  • the frequency is 20kHz.
  • a metal casing A33 is obtained.
  • the resulting slit surface was smooth and burr-free, and the slit conductivity was measured by a Fluke 175 True RMS multimeter, and as a result, all six were non-conductive.
  • the metal case A33 is subjected to alkali etching, water washing, pickling, and water washing treatment, and then an electrophoretic paint (available as an acrylic resin (purchased from Shimizu Corporation) in a colloidal form in water is used as a cathode, and the content of the acrylic resin is 10 In the weight %), under the conditions of a cathodic electrophoretic paint pH of 4.5, a temperature of 23 ° C, and a voltage of 35 V, electrophoresis was carried out for 120 s, and an electrophoretic coating was formed on the surface. Thereafter, the substrate was immersed in clean water for 120 s to remove the residual liquid on the surface of the coating. A metal casing after electrophoretic coating is obtained.
  • an electrophoretic paint available as an acrylic resin (purchased from Shimizu Corporation) in a colloidal form in water is used as a cathode, and the content of the acrylic resin is 10 In the weight %), under the conditions of a cathodic electrophoretic paint pH of
  • the above substrate was placed in an oven at a temperature of 175 ° C, baked for 50 min, and baked and cured to obtain a metal shell A34 of a communication device having a surface smoothing electrophoretic coating having a thickness of 30 ⁇ m.
  • the method according to the first embodiment is carried out, except that the step 2) is: processing the slit in the metal casing A12 by using a fiber laser cutting machine (Model LCF200CI laser produced by Huagong Laser, wavelength 1080 nm).
  • the slit width was 30 ⁇ m
  • the number of processed strips was 6, the length of the slit was 10 mm
  • the slit pitch was 0.6 mm.
  • the laser processing power is 60 W, the speed is 10 mm/s, and the frequency is 1.5 kHz.
  • a metal casing D13 is obtained.
  • the resulting slit surface was smooth and burr-free, and the slit conductivity was measured by a Fluke 175 True RMS multimeter, and as a result, all six were turned on.
  • the finally obtained communication device metal casing D14 has a surface flat decorative layer.
  • the method according to the first embodiment is carried out, except that the step 2) is: processing the slit in the metal shell A12 by using a CNC device (the CNC device of the type TC-510 of Lijin Machinery), and processing speed is 2000 r/min, and processing is performed.
  • the speed is 500mm/min and the number of processing is 40 times.
  • the slit width was 0.4 mm, the number of processed strips was 6, the length of the slit was 10 mm, and the slit pitch was 0.6 mm.
  • a metal casing D23 is obtained.
  • the surface of the obtained slit had a slight metal residue curling, and subsequent grinding was performed to remove the curl.
  • the slit conductivity was measured by a Fluke 175 True RMS multimeter, and the result was that all six were not conductive.
  • the metal casing D24 of the communication device is finally obtained. Although the metal casing D24 of the communication device has been surface-decorated, the slit is clearly visible.
  • the slit can be directly processed on the metal casing having the plastic support layer by laser etching, and the processed slits are all non-conductive, and the obtained metal is obtained.
  • the decorative layer of the outer casing is flat and has no unevenness.
  • Comparative Example 1 the sample processed by laser cutting, although the slit width can reach 30 ⁇ m, but after testing the conductivity, it was found that all were conductive, and the metal residue should be Blowing to the bottom of the slit cannot be discharged.
  • the sample processed by CNC can be processed many times to be successful, and the tool life is very short due to the too thin tip, the processing size is 0.4 mm, and the precision is very low.
  • the sample etched by the ultraviolet laser has a slit having a smaller slit width due to a smaller spot.
  • the metal casing prepared by the method described above may have the following structure: a metal substrate 100, a slit 200 penetrating the upper surface and the lower surface of the metal substrate 100, and an inner surface of the covering metal substrate 100.
  • Plastic support layer wherein, the slit 200 may not protrude into the plastic support layer 300, and the number of the slits 200 may be more than one (not shown).
  • the plastic support layer 300 is disposed on the inner surface of the metal substrate 100, but the specific position, thickness, shape and the like are not particularly limited.
  • the plastic support layer 300 may be disposed to cover only the slit 200, or may be disposed to cover the metal substrate.
  • the entire inner surface of 100 (not shown).
  • the metal casing has a decorative layer 400, and the decorative layer 400 is located on an outer surface of the metal substrate 100.
  • a portion of the outer surface of the plastic support layer 300 may be introduced into the slit 200, but the slit 200 may not be filled; or a portion of the decorative layer 400 may be embedded in the slit 200. But the slit 200 is not filled.

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Abstract

一种通讯设备金属外壳的制备方法，该方法包括以下步骤：1）提供金属壳体，所述金属壳体包括金属基体（100）和塑料支撑层（300），所述塑料支撑层形成在所述金属基体内表面上；2）通过激光刻蚀，在所述金属基体上形成狭缝（200），所述狭缝贯穿所述金属基体且不管穿所述塑料支撑层；以及3）在所述金属基体外表面形成装饰层。

Description

通讯设备金属外壳及其制备方法
优先权信息
本申请请求2014年12月26日向中国国家知识产权局提交的、专利申请号为201410834677.5的专利申请的优先权和权益，并且通过参照将其全文并入此处。
技术领域
本发明涉及材料领域，具体地，本发明涉及一种通讯设备金属外壳的制备方法以及金属外壳。
背景技术
金属外壳由于具有更加美观，更具质感，同时耐磨耐划伤等性能更加优越的特点，随着金属加工技术的发展，手机、平板电脑等移动通信设备，越来越倾向选用金属外壳，尤其是大面积的金属外壳，但是电磁波不能穿透金属，为了达到良好的电信号效果，采用金属外壳时需要在外壳上加工单条或多条狭缝，并将天线设计在狭缝处。
现有的加工狭缝的方法主要有两种，第一种是传统的机械加工狭缝的方式，如砂轮切割、数控机床(CNC)等，这种加工方式精度低，达不到通讯设备所要求的缝宽，且在这种切割方式下，刀片/钻头等以高速运转的方式接触加工工件(即金属壳体)，会对工件产生机械应力，容易造成产品变形，降低整体的机械强度。第二种是采用激光切割的方法，由于激光过程中同轴吹气的作用，导致金属熔渣在金属基材的下表面生成，导致必须选择先切割后注塑工艺顺序，否则熔渣会与下层塑胶结合，造成狭缝区域重新导通，影响电磁波的通过。若采用先切割后注塑的工艺，切割后的金属基材强度较低，注塑后易变形。
发明内容
本发明旨在至少解决现有技术中存在的技术问题之一。为此，本发明的一个目的在于提出一种通讯设备金属外壳的制备方法，该方法能够在具有塑料支撑层的金属壳体上高精度地加工表面平滑无毛刺的狭缝，在狭缝加工、表面装饰过程中金属壳体和狭缝不发生变形，从而能够保证金属外壳外观上的平整一致性。
为了实现上述目的，本发明提供一种通讯设备金属外壳的制备方法，其中，该方法包括以下步骤：1)提供金属壳体，所述金属壳体包括金属基体和塑料支撑层，所示塑料支撑层形成在所述金属基体内表面上；2)通过激光刻蚀，在所示金属基体上形成狭缝，所述狭缝贯穿所述金属基体且不贯穿所述塑料支撑层；3)在所述金属基体 外表面形成装饰层。由此，可以获得狭缝底部不导通的金属外壳，进而可以在保持外壳具有金属特性的同时，实现通讯信号的传输。
换句话说，上述方法可以通过下列步骤实现：
1)提供金属壳体，所述金属壳体包括金属基体和附着在所述金属基体内表面上的塑料支撑层；
2)通过激光刻蚀在金属基体上形成一条以上的狭缝，所述狭缝贯穿所述金属基体且不贯穿所述塑料支撑层；
3)在金属基体外表面形成装饰层。
根据本发明的通讯设备金属外壳的制备方法，该方法采用激光刻蚀的方式，可在具有塑料支撑层的金属壳体上加工单条或者多条表面光滑无毛刺的狭缝，所得到的狭缝宽度极窄，只有微米级别，且得到的狭缝不导通，后续可通过表面平整的装饰层的覆盖，实现外壳狭缝处肉眼不可见，从而使该外壳外观呈现为全金属质感。同时又因为狭缝处为非金属材质，将电子通讯设备天线设计在狭缝处，可使电磁波通过，不会屏蔽天线辐射。
本发明还提供通过上述方法制备得到的通讯设备金属外壳。该金属外壳具有前面描述的方法制备的金属外壳所述具有的全部特征以及优点，在此不再赘述。
本发明的其它特征和优点将在随后的具体实施方式部分予以详细说明。
附图说明
图1显示了根据本发明一个实施例的通讯设备金属外壳的结构示意图；
图2显示了根据本发明另一个实施例的通讯设备金属外壳的结构示意图；以及
图3显示了根据本发明又一个实施例的通讯设备金属外壳的结构示意图。
附图标记说明：
100：金属基体
200：狭缝
300：塑料支撑层
400：装饰层
具体实施方式
以下对本发明的具体实施方式进行详细说明。应当理解的是，此处所描述的具体实施方式仅用于说明和解释本发明，并不用于限制本发明。
在本发明中，通讯设备例如可以为：手机、平板电脑、笔记本电脑或蓝牙耳机等。
本发明中，金属壳体的内表面定义为将其用于通讯设备中时，金属壳体朝向通讯设备内部的表面。可以理解的是，金属壳体的外表面定义为将其用于通讯设备中时，金属壳体朝向外界的表面。另外，用于制备金属外壳的金属基体的内外表面以及狭缝的内外表面也适用于上述定义。
在本发明中，激光刻蚀是指：通过光能将所加工的物质挥发或化学物理变化从上方一层一层剥离。
在本发明中，金属基体的材质可以为本领域通常用于通讯设备的各种金属，例如可以为铝合金、不锈钢、镁合金或钛合金等。
本发明提供的通讯设备金属外壳的制备方法包括以下步骤：
1)提供金属壳体
根据本发明的实施例，在该步骤中，提供金属壳体。具体地，金属壳体包括金属基体和附着在金属基体内表面上的塑料支撑层。换句话说，在该步骤中，提供的金属壳体包括金属集团和附着在金属基体内表面上的塑料支撑层。根据本发明，金属基体的厚度以及塑料支撑层的厚度没有特别的限定，本领域技术人员可以根据具体的通讯设备适当地进行选择。例如金属基体的厚度可以为0.1-0.6mm，在本发明的一些实施例中，金属基体的厚度为0.2-0.5mm；塑料支撑层的厚度可以为0.1-2mm，在本发明的一些实施例中，塑料支撑层的厚度为0.4-1.2mm。
作为本发明的金属壳体可以通过购买或自行加工得到。自行加工得到时，可以通过在金属基体内表面上注塑树脂而得到附着有塑料支撑层的金属基体，即根据本发明实施例的金属壳体。
根据本发明，注塑树脂的方法可采用常规的注塑成型方法和条件，例如，注塑的条件可以包括：射压1600-2400bar，保压800-1400bar，使用油温机时上下模温为80-150摄氏度，射出时间为0.5-2s。
上述注塑时采用的材料可以为本领域常规使用的树脂，例如可选自聚乙烯、聚丙烯、聚缩醛、聚苯乙烯、改性聚苯醚、聚对苯二甲酸乙二醇酯、聚对苯二甲酸丁二醇酯、聚萘二甲酸乙二醇之、聚苯硫醚、聚酰亚胺、聚酰胺酰亚胺、聚醚酰亚胺、聚砜、聚醚砜、聚醚酮、聚醚醚镁、聚碳酸酯、聚酰胺和丙烯腈-丁二烯-苯乙烯共聚物中的一种或多种。
为了进一步提高得到的金属壳体的力学强度，在本发明的一些实施例中，注塑时采用的材料为树脂与玻璃纤维的混合物。在本发明的一些实施例中，上述混合物中，树脂选自聚苯硫醚、聚碳酸酯、聚酰胺中的一种；以混合物的重量为基准，玻璃纤维的含量为1-50重量％。
2)形成狭缝
根据本发明的实施例，在该步骤中，通过激光刻蚀，在金属基体上形成贯穿金属基体，但不贯穿塑料支撑层的狭缝。由此，可以利用上述狭缝有效的保证天线与外界信号传输，视线通讯。
具体地，对于上述狭缝，狭缝宽度可以为5-100μm，在本发明的一些实施例中，狭缝宽度为25-5μm；狭缝长度可以为0.1-500mm，在本发明的一些实施例中，狭缝长度为10-150mm。
此外，对于上述狭缝的具体宽度、间距、长度、条数和形状，本领域技术人员可通过实际需要实现的通讯信号类别及频率等条件，在上述范围内进行调整，具体调整方法是本领域公知的，在本发明中不再赘述。
例如，根据本发明的实施例，在该步骤中，可以在金属壳体的金属基体上形成一条以上的狭缝，换句话说，即在该步骤中，设置多条狭缝。另外，狭缝的条数和形状没有特别的限定，只要能够实现通讯即可。例如狭缝的条数可以为1-200条，在本发明的一些实施例中，狭缝的条数为5-50条；狭缝的形状可以为直线形、曲线形、方波线形或锯齿线形，在本发明的一些实施例中，狭缝的形状为直线形。相邻两条所述狭缝之间的间距可以为0.1-10mm，在本发明的一些实施例中，相邻两条所述狭缝之间的间距为0.3-1.6mm。
综上所述，通过激光刻蚀在金属基体上形成一条以上的狭缝，狭缝贯穿金属基体且不贯穿塑料支撑层。通过激光刻蚀将金属基体完全打通，塑料支撑层不通透，可使金属外壳表面的狭缝具有非通透性，并且能够保证通讯。此外，通过在塑料支撑层的支撑下对金属基体进行狭缝加工，能够防止加工过程中狭缝发生变形。
此外，本领域技术人员能够理解的是：在本发明的步骤2)中，其目的是在金属基体上形成贯穿的狭缝，而并不需要在塑料支撑层上形成狭缝，但在实际操作中，会存在在塑料支撑层的一部分上形成沟槽的情况，但只要保证塑料支撑层为非通透即可实现本发明的效果。
在本发明中，在塑料支撑层的一部分上形成的沟槽的截面形状可以为倒锥形、弧形、矩形和倒梯形中的一种或多种。
根据本发明，激光可以为红外激光、可见光激光或紫外激光。在本发明的一些实施例中，激光为红外激光、绿外激光或紫外激光。在本发明的一些实施例中，激光的波长为1064nm、532nm或355nm。
根据本发明，激光刻蚀的条件只要能够保证得到上述尺寸的狭缝即可。在本发明的一些实施例中，激光刻蚀的条件为：加工功率为2-150W，加工速度为20-3000mm/s， 频率为1-80kHz；在本发明的一些实施例中，激光刻蚀的条件为：加工功率为5-50W，加工速度为50-500mm/s，频率为20-60kHz；在本发明的一些实施例中，激光刻蚀的条件为：加工功率为5-18W，加工速度为50-60mm/s，频率为20-60kHz。根据本发明，为了提高金属外壳的美观程度，该方法还可以进一步包括：
3)形成装饰层
根据本发明的实施例，在该步骤中，需要在金属基体外表面形成装饰层。装饰层可以采用本领域的常规方法和条件进行，例如可以通过电泳、微弧氧化、阳极氧化、硬质阳极和喷涂中的一种或多种形成装饰层。对于上述装饰层的厚度可在较大范围内变动，在本发明的一些实施例中，装饰层的厚度为5-60μm。装饰层可以为现有的各种电子产品外壳装饰层，例如可以为氧化铝层、环氧树脂涂层、丙烯酸树脂涂层中的一种。
本发明中，可采用阳极氧化方法形成装饰层，阳极氧化条件可以本领域所公知的条件，例如可以为：以浓度为150-210g/L的硫酸作为槽液，电压为10-15V，电流密度为1-2A/dm2，温度为10-22摄氏度，阳极氧化时间为20-60min，封孔槽液(成分例如为NiSO4水溶液)浓度为1-10g/L，封孔温度为50-95摄氏度，封孔时间为10-50min。通过上述阳极氧化方法形成的装饰层厚度通常为10-30μm。
或者，也可通过微弧氧化方法形成装饰层，微弧氧化条件可以本领域所公知的条件，例如可以为：pH为6-12，电压为0-800V，电流密度为1-10A/dm2，温度为15-60摄氏度，时间为10-60min，封孔槽液为水，封孔温度为70-90摄氏度，封孔时间为1-10min。通过上述微弧氧化方法形成的装饰层厚度通常为10-50μm。
或者，通过电泳形成装饰层，电泳条件可以本领域所公知的条件，例如可以为：阴极电泳：电压为20-60V，pH为4-6，温度为15-30摄氏度，时间为20-60s；阳极电泳：电压为40-100V，pH为6-8，温度为15-30摄氏度，时间为40-90s；烘烤温度为120-200摄氏度，烘烤时间为30-60min。通过上述电泳方法形成的装饰层厚度通常为5-35μm。
或者，通过喷涂形成装饰层，喷涂条件可以本领域所公知的条件，例如可以为：静电高压：60-90kV；静电电流：10-20μA；流速压力：0.3-0.55Mpa；雾化压力：0.33-0.45Mpa；输送速度：4.5-5.5m/min；固化温度：150-220摄氏度；固化时间：20-120min。
综上所述，根据本发明的通讯设备金属外壳的制备方法，采用激光刻蚀的方式，可在具有塑料支撑层的金属壳体上加工单条或者多条表面光滑无毛刺的狭缝，所得到的狭缝宽度极窄，只有微米级别，且得到的狭缝不导通，后续可通过表面平整的装饰层的覆盖，实现外壳狭缝处肉眼不可见，从而使该外壳外观呈现为全金属质感。同时又因为狭缝处为非金属材质，将电子通讯设备天线设计在狭缝处，可使电磁波通过，不会屏蔽天线辐射。换句话说，上述方法可以通过以下步骤实现：
1)提供金属壳体，金属壳体包括金属基体和附着在金属基体内表面上的塑料支撑层；
2)通过激光刻蚀在金属基体上形成一条以上的狭缝，狭缝贯穿金属基体且不贯穿塑料支撑层；
3)在金属基体外表面形成装饰层。
在本发明的另一方面，本发明还提供通过上述方法制备得到的通讯设备金属外壳。
由于该金属外壳是利用上述方法制备的，因此具有前面描述的方法制备的金属外壳的全部特征以及优点，在此不再赘述。
以下将通过实施例对本发明进行详细描述。需要说明的是，下面的具体实施例仅仅是用于说明的目的，而不以任何方式限制本发明的范围，另外，如无特殊说明，未具体记载条件或者步骤的方法均为常规方法，所采用的试剂和材料均可从商业途径获得。
实施例1
1)注塑
将铝合金(购于东莞市港祥金属材料有限公司，牌号为6063，厚度为0.4mm)切割为15mm x 80mm的尺寸作为金属基体。对上述金属基体进行除油、水洗处理除去表面污迹和油渍，之后在80摄氏度烘干20min，得到清洗烘干后的金属基体A11。
将上述金属基体A11放入模具中，采用聚苯硫醚树脂进行注塑。注塑条件为：射压1800bar，保压1000bar，使用油温机时上下模温为100摄氏度，射出时间为1.5s，形成塑料支撑层(厚度为1.0mm)，从而得到带有塑料支撑层的金属壳体A12。
2)通过激光刻蚀形成狭缝
采用红外激光器(华工激光生产的型号为LSF20激光器，波长1064nm)在金属壳体A12上加工狭缝。狭缝宽度为50μm，加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。激光加工的功率为18W，速度为50mm/s，频率为20kHz。得到金属壳体A13。得到的狭缝表面光滑无毛刺，通过Fluke 175True RMS万用表测定狭缝导电性能，其结果为6条全不导通。
3)采用阳极氧化方法形成表面装饰层
将上述金属壳体A13进行碱蚀、水洗、酸洗、水洗处理，之后浸入盛有浓度为180g/L的H2SO4水溶液的电解槽中，以金属基体A13作为阳极，不锈钢板作为阴极，在电压为15V，电流密度为1A/dm2、温度为19摄氏度的条件下阳极氧化40min，完成阳极氧化后取出并超声波清洗干净，避免狭缝内藏酸影响后续着色。此时，狭缝完全被装饰层 填充覆盖，肉眼不可见。
将上述经过阳极氧化的金属壳体A13浸入酸性染液(购自奥野制业工业株式会社，染料型号为TAC BLACK-SLH)中染色10min，该酸性染液浓度为5g/L，PH值为5.5，染液的温度为50摄氏度，完成后取出并清洗干净。
然后在封孔剂(NiSO4水溶液，浓度为10g/L)中浸渍20min，温度为95摄氏度，完成封孔后用90摄氏度的纯水清洗干净，并在60摄氏度条件下烘烤15min。得到厚度为20μm的装饰层。最终得到具有表面平整装饰层的通讯设备金属外壳A14。
实施例2
1)注塑
按照实施例1步骤1)的方法得到金属壳体A22。
2)通过激光刻蚀形成狭缝
采用绿外激光器(华工激光生产的型号为LSG7EI激光器，波长532nm)在金属壳体A22上加工狭缝。狭缝宽度为30μm，加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。激光加工的功率为7W，速度为60mm/s，频率为60kHz。得到金属壳体A23。得到的狭缝表面光滑无毛刺，通过Fluke 175True RMS万用表测定狭缝导电性能，其结果为6条全不导通。
3)采用微弧氧化方法形成表面装饰涂层。
将金属壳体A23进行脱脂处理，之后浸入微弧氧化电解液(成分与组成为：六偏磷酸钠40g/L，硅酸钠8g/L，偏钒酸铵12g/L)中，以该金属壳体A23作为阳极，不锈钢板作为阴极，在电压为0-600V，电流密度为5A/dm2，温度为25摄氏度的条件下微弧氧化40min，完成后取出用纯水清洗干净。得到微弧氧化后的金属壳体A23。此时，狭缝完全被微弧氧化膜填充覆盖，表面狭缝无手感。
将上述微弧氧化后的金属壳体A23浸入温度为85摄氏度的热纯水中封闭5min，然后取出吹干。得到具有35μm厚度的表面平整装饰层的通讯设备金属外壳A24。
实施例3
1)注塑
按照实施例1步骤1)的方法得到金属壳体A32。
2)通过激光刻蚀形成狭缝
采用紫外激光器(华工激光生产的型号为LSU3EI激光器，波长355nm)在金属壳体A32上加工狭缝。狭缝宽度为25μm，加工条数为6条，狭缝的长度为10mm，狭缝 间距为0.6mm。激光加工的功率为5W，速度为50mm/s，频率为20kHz。得到金属壳体A33。得到的狭缝表面光滑无毛刺，通过Fluke 175True RMS万用表测定狭缝导电性能，其结果为6条全不导通。
3)采用电泳方法形成表面装饰层
将金属壳体A33进行碱蚀、水洗、酸洗和水洗处理，之后作为阴极放入电泳漆(将丙烯酸树脂(购于清水株式会社)以胶体形式溶解在水中而得到，丙烯酸树脂的含量为10重量％)中，在阴极电泳漆pH为4.5，温度为23摄氏度，电压为35V的条件下，电泳120s，表面形成电泳涂层。之后，将上述基材放入清水中浸洗120s，去除涂层表面残液。得到电泳涂装后的金属外壳。此时，狭缝完全被电泳涂层覆盖，表面狭缝肉眼不可见。最后，将上述基材放入温度为175摄氏度的烘箱中，烘烤50min，经过烘烤固化后，得到具有30μm厚度的表面平整的电泳涂层的通讯设备金属外壳A34。
对比例1
按照实施例1的方法进行，不同的是，步骤2)为：采用光纤激光切割机(华工激光生产的型号为LCF200CI激光器，波长1080nm)在金属壳体A12加工狭缝。狭缝宽度为30μm，加工条数为6条，缝的长度为10mm，狭缝间距为0.6mm。激光加工的功率为60W，速度为10mm/s，频率为1.5kHz。得到金属壳体D13。得到的狭缝表面光滑无毛刺，通过Fluke 175True RMS万用表测定狭缝导电性能，其结果为6条全都导通。此外，最终得到的通讯设备金属外壳D14具有表面平整装饰层。
对比例2
按照实施例1的方法进行，不同的是，步骤2)为：采用CNC设备(力劲机械的型号为TC-510的CNC设备)在金属壳体A12加工狭缝，加工转速2000r/min，加工走速500mm/min，加工次数40次。狭缝宽度为0.4mm，加工条数为6条，狭缝的长度为10mm，狭缝间距为0.6mm。得到金属壳体D23。得到的狭缝表面有轻微的金属残渣卷边，后续需要稍做打磨，去除卷边，通过Fluke 175True RMS万用表测定狭缝导电性能，其结果为6条全不导通。此外，最终得到通讯设备金属外壳D24，该通讯设备金属外壳D24虽然经过了表面装饰，但狭缝还是明显可见。
通过上述实施例和对比例可知，通过本发明的方法，采用激光刻蚀能够直接在具有塑料支撑层的金属壳体上加工狭缝，且加工得到的狭缝全部不导通，并且得到的金属外壳的装饰层平整，没有凹凸不平。相对于此，在对比例1中，通过激光切割加工的样品，虽然缝宽也可以达到30μm，但是测试导通性后发现全都是导通的，应该是金属残渣被 吹到狭缝底部无法排出。在对比例2中，通过CNC加工的样品，需加工多次方可成功，而且由于刀头太细造成刀具使用寿命很短，加工尺寸达到0.4mm，精度很低。
另外，在实施例3中，通过紫外激光器刻蚀的样品，由于有更小的光斑，能够加工的狭缝宽度更小的狭缝。
以上详细描述了本发明的一些实施方式，但是，本发明并不限于上述实施方式中的具体细节，在本发明的技术构思范围内，可以对本发明的技术方案进行多种简单变型，这些简单变型均属于本发明的保护范围。
另外需要说明的是，在上述具体实施方式中所描述的各个具体技术特征，在不矛盾的情况下，可以通过任何合适的方式进行组合。
此外，本发明的各种不同的实施方式之间也可以进行任意组合，只要其不违背本发明的思想，其同样应当视为本发明所公开的内容。并且，在不付出创造性劳动的前提下，对前面描述的方法以及金属壳体所做出的改进，也属于本发明所公开的内容。例如，为了节省成本，参考图1，利用前面描述的方法制备的金属壳体可以具有以下结构：金属基体100，贯穿金属基体100的上表面以及下表面的狭缝200以及覆盖金属基体100内表面的塑料支撑层。其中，狭缝200可以不伸入到塑料支撑层300中，并且狭缝200的条数可以不止一条(图中未示出)。塑料支撑层300设置于金属基体100的内表面，但其具体位置、厚度、形状等参数不受特别限定，例如，塑料支撑层300可以设置为只覆盖狭缝200，也可以设置为覆盖金属基体100的整个内表面(图中未示出)。此外，参考图2，该金属壳体具有装饰层400，装饰层400位于金属基体100的外表面。参考图3，在该金属壳体中，可以使塑料支撑层300外表面的一部分进入狭缝200中，但不填满狭缝200；或者，可以使装饰层400的一部分嵌入到狭缝200中，但不将狭缝200填满。
本发明的描述中，需要理解的是，术语“上”、“下”、“前”、“后”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。

Claims (15)

  1. 一种通讯设备金属外壳的制备方法，其特征在于，包括：
    1)提供金属壳体，所述金属壳体包括金属基体和塑料支撑层，所示塑料支撑层形成在所述金属基体内表面上；
    2)通过激光刻蚀，在所示金属基体上形成狭缝，所述狭缝贯穿所述金属基体且不贯穿所述塑料支撑层；
    3)在所述金属基体外表面形成装饰层。
  2. 根据权利要求1所述的金属外壳的制备方法，其特征在于，步骤1)包括：在所述金属基体内表面上注塑树脂，形成所述塑料支撑层。
  3. 根据权利要求1或2中任一项所述的金属外壳的制备方法，其特征在于，所述狭缝宽度为5-100μm。
  4. 根据权利要求3所述的金属外壳的制备方法，其中，所述狭缝宽度为25-50μm。
  5. 根据权利要求1所述的金属外壳的制备方法，其特征在于，所述狭缝长度为0.1-500mm。
  6. 根据权利要求5所述的金属外壳的制备方法，其特征在于，所述狭缝长度为10-500mm。
  7. 根据权利要求1-6任一项所示的金属外壳的制备方法，其特征在于，在步骤2)中，形成多条所述狭缝。
  8. 根据权利要求7所述的金属外壳的制备方法，其特征在于，相邻两条所述狭缝之间的间距为0.1-10mm。
  9. 根据权利要求8所述的金属外壳的制备方法，其特征在于，相邻两条所述狭缝之间的间距为0.3-1.6mm。
  10. 根据权利要求1-9任一项所述的金属外壳的制备方法，其特征在于，步骤2)中，所述激光刻蚀的条件为：加工功率为2-150W，加工速度为20-3000mm/s，频率为1-80kHz。
  11. 根据权利要求10所述的金属外壳的制备方法，其特征在于，步骤2)中，所述激光刻蚀的条件为：加工功率为5-50W，加工速度为50-500mm/s，频率为20-60kHz。
  12. 根据权利要求1-11任一项所述的金属外壳的制备方法，其特征在于，所述激光为红外激光、可见光激光或紫外激光。
  13. 根据权利要求12所述的金属外壳的制备方法，其特征在于，所述激光的波长为1064nm、532nm或355nm。
  14. 根据权利要求1-13任一所述的金属外壳的制备方法，其特征在于，所述装饰层是通过电泳、微弧氧化、阳极氧化、硬质阳极和喷涂中的一种或多种形成的。
  15. 一种通讯设备金属外壳，其特征在于，所述通讯设备金属外壳是通过权利要求1-14中任意一项所述的方法制备的。
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