WO2018001130A1 - 壳体及其制备方法和应用 - Google Patents
壳体及其制备方法和应用 Download PDFInfo
- Publication number
- WO2018001130A1 WO2018001130A1 PCT/CN2017/088946 CN2017088946W WO2018001130A1 WO 2018001130 A1 WO2018001130 A1 WO 2018001130A1 CN 2017088946 W CN2017088946 W CN 2017088946W WO 2018001130 A1 WO2018001130 A1 WO 2018001130A1
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- WO
- WIPO (PCT)
- Prior art keywords
- aqueous solution
- anodic oxide
- resin film
- film layer
- metal hard
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 127
- 239000002184 metal Substances 0.000 claims abstract description 127
- 239000010407 anodic oxide Substances 0.000 claims abstract description 86
- 239000011347 resin Substances 0.000 claims abstract description 61
- 229920005989 resin Polymers 0.000 claims abstract description 61
- 238000005530 etching Methods 0.000 claims abstract description 55
- 238000001746 injection moulding Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 63
- 239000007864 aqueous solution Substances 0.000 claims description 56
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 45
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 42
- 229910000838 Al alloy Inorganic materials 0.000 claims description 39
- 239000011148 porous material Substances 0.000 claims description 34
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 30
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 24
- 239000000945 filler Substances 0.000 claims description 23
- 239000002131 composite material Substances 0.000 claims description 21
- 239000011342 resin composition Substances 0.000 claims description 20
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 18
- 238000007743 anodising Methods 0.000 claims description 16
- 235000006408 oxalic acid Nutrition 0.000 claims description 15
- 239000003792 electrolyte Substances 0.000 claims description 14
- 229920005992 thermoplastic resin Polymers 0.000 claims description 14
- 239000000243 solution Substances 0.000 claims description 13
- 229910021578 Iron(III) chloride Inorganic materials 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000002253 acid Substances 0.000 claims description 12
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 claims description 12
- 239000003795 chemical substances by application Substances 0.000 claims description 11
- 238000004043 dyeing Methods 0.000 claims description 10
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 9
- 239000012765 fibrous filler Substances 0.000 claims description 9
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 8
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical group [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims description 8
- 230000002378 acidificating effect Effects 0.000 claims description 8
- 229920002647 polyamide Polymers 0.000 claims description 8
- 239000003365 glass fiber Substances 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- AJPJDKMHJJGVTQ-UHFFFAOYSA-M sodium dihydrogen phosphate Chemical compound [Na+].OP(O)([O-])=O AJPJDKMHJJGVTQ-UHFFFAOYSA-M 0.000 claims description 6
- LVXHNCUCBXIIPE-UHFFFAOYSA-L disodium;hydrogen phosphate;hydrate Chemical compound O.[Na+].[Na+].OP([O-])([O-])=O LVXHNCUCBXIIPE-UHFFFAOYSA-L 0.000 claims description 5
- 239000011521 glass Substances 0.000 claims description 5
- 229910000402 monopotassium phosphate Inorganic materials 0.000 claims description 5
- 235000019796 monopotassium phosphate Nutrition 0.000 claims description 5
- 229910000403 monosodium phosphate Inorganic materials 0.000 claims description 5
- 235000019799 monosodium phosphate Nutrition 0.000 claims description 5
- PJNZPQUBCPKICU-UHFFFAOYSA-N phosphoric acid;potassium Chemical compound [K].OP(O)(O)=O PJNZPQUBCPKICU-UHFFFAOYSA-N 0.000 claims description 5
- 229920001955 polyphenylene ether Polymers 0.000 claims description 5
- 239000000454 talc Substances 0.000 claims description 5
- 229910052623 talc Inorganic materials 0.000 claims description 5
- 239000005995 Aluminium silicate Substances 0.000 claims description 4
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 4
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 claims description 4
- UIIMBOGNXHQVGW-UHFFFAOYSA-M Sodium bicarbonate Chemical compound [Na+].OC([O-])=O UIIMBOGNXHQVGW-UHFFFAOYSA-M 0.000 claims description 4
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 4
- 235000012211 aluminium silicate Nutrition 0.000 claims description 4
- 238000002048 anodisation reaction Methods 0.000 claims description 4
- FLNKWZNWHZDGRT-UHFFFAOYSA-N azane;dihydrochloride Chemical compound [NH4+].[NH4+].[Cl-].[Cl-] FLNKWZNWHZDGRT-UHFFFAOYSA-N 0.000 claims description 4
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 4
- 239000004917 carbon fiber Substances 0.000 claims description 4
- ZPWVASYFFYYZEW-UHFFFAOYSA-L dipotassium hydrogen phosphate Chemical compound [K+].[K+].OP([O-])([O-])=O ZPWVASYFFYYZEW-UHFFFAOYSA-L 0.000 claims description 4
- 229910000396 dipotassium phosphate Inorganic materials 0.000 claims description 4
- 235000019797 dipotassium phosphate Nutrition 0.000 claims description 4
- 239000000835 fiber Substances 0.000 claims description 4
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims description 4
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 claims description 4
- 239000001095 magnesium carbonate Substances 0.000 claims description 4
- 229910000021 magnesium carbonate Inorganic materials 0.000 claims description 4
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 claims description 4
- 239000000347 magnesium hydroxide Substances 0.000 claims description 4
- 229910001862 magnesium hydroxide Inorganic materials 0.000 claims description 4
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 claims description 4
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims description 4
- 229910000029 sodium carbonate Inorganic materials 0.000 claims description 4
- KFGJICJPSZZEEP-UHFFFAOYSA-L dipotassium;hydrogen phosphate;hydrate Chemical compound O.[K+].[K+].OP([O-])([O-])=O KFGJICJPSZZEEP-UHFFFAOYSA-L 0.000 claims description 3
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 3
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 claims description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 2
- -1 amine compound Chemical class 0.000 claims description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 2
- 235000015165 citric acid Nutrition 0.000 claims description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 claims description 2
- LMPDLIQFRXLCMO-UHFFFAOYSA-L dipotassium;hydrogen phosphate;phosphoric acid Chemical compound [K+].[K+].OP(O)(O)=O.OP([O-])([O-])=O LMPDLIQFRXLCMO-UHFFFAOYSA-L 0.000 claims description 2
- BNIILDVGGAEEIG-UHFFFAOYSA-L disodium hydrogen phosphate Chemical compound [Na+].[Na+].OP([O-])([O-])=O BNIILDVGGAEEIG-UHFFFAOYSA-L 0.000 claims description 2
- 229910000397 disodium phosphate Inorganic materials 0.000 claims description 2
- 235000019800 disodium phosphate Nutrition 0.000 claims description 2
- CSVGEMRSDNSWRF-UHFFFAOYSA-L disodium;dihydrogen phosphate Chemical compound [Na+].[Na+].OP(O)([O-])=O.OP(O)([O-])=O CSVGEMRSDNSWRF-UHFFFAOYSA-L 0.000 claims description 2
- 235000019253 formic acid Nutrition 0.000 claims description 2
- 229910000027 potassium carbonate Inorganic materials 0.000 claims description 2
- 229910000030 sodium bicarbonate Inorganic materials 0.000 claims description 2
- 235000017557 sodium bicarbonate Nutrition 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 1
- 150000002429 hydrazines Chemical class 0.000 claims 1
- 229910052739 hydrogen Inorganic materials 0.000 claims 1
- 239000001257 hydrogen Substances 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims 1
- AHKZTVQIVOEVFO-UHFFFAOYSA-N oxide(2-) Chemical compound [O-2] AHKZTVQIVOEVFO-UHFFFAOYSA-N 0.000 claims 1
- 229910000028 potassium bicarbonate Inorganic materials 0.000 claims 1
- 235000015497 potassium bicarbonate Nutrition 0.000 claims 1
- 239000011736 potassium bicarbonate Substances 0.000 claims 1
- 235000011181 potassium carbonates Nutrition 0.000 claims 1
- TYJJADVDDVDEDZ-UHFFFAOYSA-M potassium hydrogencarbonate Chemical compound [K+].OC([O-])=O TYJJADVDDVDEDZ-UHFFFAOYSA-M 0.000 claims 1
- 229940086066 potassium hydrogencarbonate Drugs 0.000 claims 1
- 238000004891 communication Methods 0.000 abstract description 7
- 239000000463 material Substances 0.000 abstract description 3
- 230000003647 oxidation Effects 0.000 abstract description 2
- 238000007254 oxidation reaction Methods 0.000 abstract description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 19
- 239000008367 deionised water Substances 0.000 description 16
- 229910021641 deionized water Inorganic materials 0.000 description 16
- 239000000805 composite resin Substances 0.000 description 12
- 239000000203 mixture Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 239000003513 alkali Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- RZVHIXYEVGDQDX-UHFFFAOYSA-N 9,10-anthraquinone Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3C(=O)C2=C1 RZVHIXYEVGDQDX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229940024548 aluminum oxide Drugs 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XONPDZSGENTBNJ-UHFFFAOYSA-N molecular hydrogen;sodium Chemical compound [Na].[H][H] XONPDZSGENTBNJ-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Images
Classifications
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- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/00—Layered products comprising a layer of synthetic resin
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- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form
- B32B3/26—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer
- B32B3/266—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar shape; Layered products comprising a layer having particular features of form characterised by a particular shape of the outline of the cross-section of a continuous layer; characterised by a layer with cavities or internal voids ; characterised by an apertured layer characterised by an apertured layer, the apertures going through the whole thickness of the layer, e.g. expanded metal, perforated layer, slit layer regular cells B32B3/12
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- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
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- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/20—Acidic compositions for etching aluminium or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/024—Anodisation under pulsed or modulated current or potential
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- C—CHEMISTRY; METALLURGY
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- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/16—Pretreatment, e.g. desmutting
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/246—Chemical after-treatment for sealing layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C2045/1486—Details, accessories and auxiliary operations
- B29C2045/14868—Pretreatment of the insert, e.g. etching, cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0001—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor characterised by the choice of material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2081/00—Use of polymers having sulfur, with or without nitrogen, oxygen or carbon only, in the main chain, as moulding material
- B29K2081/04—Polysulfides, e.g. PPS, i.e. polyphenylene sulfide or derivatives thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/02—Aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
- B29L2031/3481—Housings or casings incorporating or embedding electric or electronic elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
- B32B2264/10—Inorganic particles
- B32B2264/102—Oxide or hydroxide
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/08—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing inorganic acids
Definitions
- the present disclosure relates to the field of electronic communications, and in particular, to a housing, a method of manufacturing the housing, and a housing and housing prepared by the method as an outer casing of an electronic product.
- the purpose of the present disclosure is to overcome the defects of inconsistent and discontinuous visual effects of the overall electronic product casing in the prior art, and to provide a casing and a preparation method and application thereof.
- the present disclosure provides a case, wherein the case includes a metal hard anodic oxide layer and a resin film layer attached to a first surface of the metal hard anodic oxide layer, The metal hard anodic oxide layer is integrated with the resin film layer.
- the present disclosure also provides a method of preparing a housing, the method comprising:
- the metal substrate is subjected to a hard anodizing treatment to obtain a substrate having a metal hard anodic oxide on the surface;
- the second composite is subjected to acid etching to remove the metal substrate in the matrix.
- the present disclosure also provides a housing prepared by the method of the present disclosure.
- the present disclosure also provides the use of the housing of the present disclosure as an outer casing for an electronic product.
- the appearance of the housing provided by the present disclosure is neat, smooth, and uniform; and the metal hard anodic oxide layer can exhibit a metallic visual effect, thereby satisfying the consumer's demand for appearance effects.
- both the metal hard anodic oxide layer and the resin film layer are non-metallic materials, and are all capable of being penetrated by radio frequency, and thus the housing of the present disclosure is used as an outer casing of an electronic product, particularly a communication device (such as a mobile phone). The case does not interfere with the communication function when the case is).
- the housing of the present disclosure can mold the metal hard anodic oxide layer together with the resin film layer by injection molding, which makes it easier to realize the structural design of the electronic product outer casing and solve the problem of inconsistent appearance effect.
- Figure 1 is a schematic cross-sectional view of a pretreated metal substrate
- Figure 2 is a schematic cross-sectional view of a substrate subjected to hard anodization
- Figure 3 is a schematic cross-sectional view of the first composite body completed by injection molding
- FIG. 4 is a schematic cross-sectional view showing a second composite body of a metal hard anodic oxide on a surface of a substrate on which a resin film layer is not formed;
- Figure 5 is a schematic cross-sectional view of a housing for removing a metal substrate
- Figure 6 is a schematic cross-sectional view of the dyed casing.
- the present disclosure provides a housing as shown in FIG. 5, wherein the housing includes a metal hard anodic oxide layer 5 and a resin film layer attached to the first surface of the metal hard anodic oxide layer 5. 3.
- the metal hard anodic oxide layer 5 and the resin film layer 3 have an integral structure.
- the term "integral structure” means that the metal hard anodic oxide layer 5 and the resin film layer 3 are bonded tightly and without gaps, and do not exhibit inconsistencies in appearance.
- the metal hard anodic oxide layer 5 is formed by hard anodization of aluminum or an aluminum alloy.
- the aluminum alloy refers to an alloy formed by adding other elements to aluminum as a base element, and may be various common aluminum alloys.
- the metal hard anodic oxide layer 5 has a double-layered pore structure including an inner layer having a macroporous structure and an outer layer having a small pore structure, wherein The resin film layer 3 is bonded to the inner layer having a macroporous structure.
- the macropores and the small holes may be used to accommodate a resin composition to anchor the resin film layer 3 to the surface of the metal hard anodic oxide layer 5 so that the two can be bonded tightly and without gaps. together.
- "macroporous" and "small pore” are relative concepts, mainly for explaining that pore structures of different sizes are distributed in different portions of the metal hard anodic oxide layer 5.
- the size of the large pores and small pores in the metal hard anodic oxide layer 5 is not particularly limited and may be a conventional choice in the art.
- the macropores have a pore diameter of from 200 to 2000 nm, particularly from 500 to 1800 nm, for example from 1000 to 1500 nm; and the pores have a pore diameter of from 10 to 100 nm, particularly from 20 to 70 nm, for example from 30 to 60 nm.
- the thickness of the metal hard anodic oxide layer 5 is not particularly limited and may be a conventional choice in the art. However, in order to optimize the space of the pore structure, the resin film layer 3 and the metal hard anodic oxide layer 5 have a higher bonding force, and optionally, the metal hard anodic oxide layer 5
- the thickness is from 5 to 90 ⁇ m, in particular from 10 to 70 ⁇ m, for example from 12 to 45 ⁇ m.
- the hardness of the metal hard anodic oxide layer 5 is not particularly limited and may be a conventional choice in the art. However, in order to enhance the performance of the housing, optionally, the hardness of the metal hard anodic oxide layer 5 It is 350-800HV, especially 450-600HV.
- the composition of the resin film layer 3 is not particularly limited as long as the resin film layer 3 can be made resistant to acid and alkali, and the resin film layer 3 and the metal hard anodic oxide layer are provided. 5 has a high bonding force.
- the resin film layer 3 is formed of a resin composition containing a thermoplastic resin and, optionally, a filler.
- the content of the thermoplastic resin and the content of the filler in the resin composition are not particularly limited and may be a conventional choice in the art.
- the resin composition contains 50 to 99% by weight of a thermoplastic resin and 1 to 50% by weight of a filler, in particular, the resin composition contains 60 to 75% by weight of a thermoplastic resin and 25 to 40% by weight. Filler.
- the selection of the thermoplastic resin is not particularly limited and may be a conventional choice in the art.
- the thermoplastic resin is at least one of polyphenylene sulfide, polyphenylene ether and polyamide, in particular polyphenylene sulfide.
- the selection of the filler is not particularly limited and may be a conventional choice in the art.
- the filler is a fibrous filler and/or a powder filler.
- the selection of the fibrous filler is not particularly limited and may be a conventional choice in the art.
- the fibrous filler is at least one of glass fibers, carbon fibers and polyamide fibers, in particular glass fibers.
- the selection of the powder filler is not particularly limited and may be a conventional choice in the art.
- the powder filler is at least one of silica, talc, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, glass and kaolin, especially silica, talc, and hydroxide. At least one of aluminum and magnesium hydroxide.
- the thickness of the resin film layer 3 is not particularly limited and may be selected according to specific use requirements.
- the thickness of the resin film layer 3 is 0.1-10 mm, particularly 0.2-8 mm.
- it is 0.4-5mm.
- the thickness of the resin film layer 3 means a vertical distance between the upper surface of the metal hard anodic oxide layer 5 to the upper surface of the resin film layer 3.
- the casing may further include a dyeing layer 4 formed on the second surface of the metal hard anodic oxide layer 5.
- the upper side faces the resin film layer 3.
- the color of the dye layer 4 is not particularly limited, and may be selected according to needs and appearance effects, and may be, for example, silver, white, or gold.
- the present disclosure also provides a method of preparing a housing, the method comprising:
- the second composite is subjected to acid etching to remove the metal substrate 1 in the substrate.
- the embodiment of the hard anodizing treatment is not particularly limited, and the metal substrate 1 may be subjected to hard anodizing treatment in a manner conventional in the art to obtain a surface having a metal hard anodic oxide. 2 matrix.
- the metal substrate 1 may be placed in an electrolyte under the conditions of a hard anodizing treatment, the metal substrate 1 is used as an anode, and a conductive material that does not react with the electrolyte is used as a cathode to make the cathode and
- the anodes are electrically connected to the positive and negative electrodes of the power source, respectively, and after being energized, a hard anodization treatment is performed to form a metal hard anodic oxide 2 on the surface of the metal substrate 1, as shown in FIG.
- the conditions of the hard anodizing treatment are not particularly limited, and may be selected in accordance with the thickness of the intended metal hard anodic oxide 2.
- the hard anodized condition comprises: a current density of 0.1-10A / dm 2, in particular 1.5-5A / dm 2; a temperature of 0-20 deg.] C, particularly 2-10 °C; time 1-300 min, especially 30-120 min; the concentration of the electrolyte is 10-260 g/L, especially 30-180 g/L.
- the selection of the electrolyte in the electrolytic solution is not particularly limited and may be a conventional choice in the art, and may be, for example, at least one of sulfuric acid, oxalic acid, formic acid, and citric acid, particularly sulfuric acid and/or Oxalic acid, such as sulfuric acid and oxalic acid.
- the concentration of sulfuric acid and oxalic acid in the electrolytic solution of the present disclosure is not particularly limited.
- the concentration of sulfuric acid in the electrolyte is 25-225 g/L, especially 100-200 g/L, for example 150-180 g/L; concentration of oxalic acid It is 5-35 g/L, especially 10-25 g/L, for example 15-20 g/L.
- the surface of the hard anodized substrate is reamed.
- the condition of the reaming is such that the surface of the metal hard anodic oxide 2 forms a large pore having a pore diameter of 200 to 2000 nm, particularly 500 to 1800 nm, for example, 1000 to 1500 nm.
- the process of reaming is performed in a pore-expanding agent
- concentration of the pore-expanding agent is not particularly limited in the present disclosure, and may be a conventional choice in the art, and optionally, the pore-expanding agent
- the concentration is from 0.1 to 40 g/L, especially from 10 to 20 g/L.
- the selection of the pore-expanding agent in the present disclosure is not particularly limited as long as the purpose of the present invention is achieved.
- the pore-expanding agent is an aqueous solution of sodium carbonate, an aqueous solution of sodium hydrogencarbonate, an aqueous solution of sodium hydroxide, an aqueous solution of potassium carbonate, and carbon.
- Potassium hydrogen phosphate aqueous solution potassium hydroxide aqueous solution, sodium hydrogen phosphate aqueous solution, potassium hydrogen phosphate aqueous solution, sodium dihydrogen phosphate aqueous solution, potassium dihydrogen phosphate aqueous solution, sodium hydroxide-sodium hydrogen phosphate aqueous solution, potassium hydroxide-potassium hydrogen phosphate aqueous solution, At least one of an aqueous ammonia solution, an aqueous solution of hydrazine, an aqueous solution of an anthraquinone derivative, an aqueous solution of a water-soluble amine compound, an aqueous solution of ammonium-ammonium chloride, an aqueous solution of sodium phosphate-sodium hydrogen phosphate, and an aqueous solution of potassium phosphate-potassium hydrogen phosphate; At least one of an aqueous solution of sodium hydrogenhydride, an aqueous solution of potassium dihydrogen phosphate
- the method for providing the metal substrate 1 may be: grinding the metal into a polishing machine, then washing with anhydrous ethanol, and then immersing the metal in a 40-60 g/L aqueous sodium hydroxide solution. After 1-5 min, the metal was taken out and rinsed with deionized water to obtain a metal substrate 1 having a clean and flat surface as shown in FIG.
- the metal may be aluminum or an aluminum alloy.
- the manner of forming the resin film layer 3 includes injection molding using a resin composition.
- the resin composition is filled into the large pores and small pores of the metal hard anodic oxide 2, and a layer is formed on the surface of the metal hard anodic oxide 2 to be firmly bonded to the metal hard anodic oxide 2
- the resin film layer 3 is as shown in FIG.
- the composition of the resin composition is not particularly limited as long as the resin film layer 3 can be made resistant to acid and alkali, and between the resin film layer 3 and the metal hard anodic oxide 2 It has a high binding force.
- the resin composition contains 50 to 99% by weight of a thermoplastic resin and 1 to 50% by weight of a filler, in particular, the resin composition contains 60 to 75% by weight of a thermoplastic resin and 25 to 40% by weight filler.
- thermoplastic resin is not particularly limited and may be a conventional choice in the art, and may be, for example, at least one of polyphenylene sulfide, polyphenylene ether, and polyamide.
- the selection of the filler is not particularly limited and may be a conventional choice in the art, and may be, for example, a fibrous filler and/or a powder filler.
- the selection of the fibrous filler is not particularly limited and may be a conventional choice in the art, and may be, for example, at least one of glass fiber, carbon fiber, and polyamide fiber.
- the selection of the powder filler is not particularly limited and may be a conventional choice in the art, and may be, for example, silica, talc, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, glass, and At least one of kaolin.
- the alkaline etching is performed to remove the metal hard anodic oxide 2 on the surface of the substrate where the resin film layer 3 is not formed.
- the first composite is placed in the etching solution A for alkaline etching, and after the alkaline etching is completed, it is taken out to obtain a second composite including the metal substrate 1, the metal hard anodic oxide layer 5, and the resin film layer 3.
- the body was rinsed with deionized water to obtain a second composite as shown in FIG.
- the concentration of the etching solution A used for the alkaline etching is not particularly limited as long as the metal hard anodic oxide 2 on which the resin film layer 3 is not formed on the surface of the substrate can be removed, optionally,
- the concentration of the etching solution A used for the alkaline etching is 5 to 60 g/L, particularly 30 to 50 g/L.
- the selection of the etching liquid A used for the alkaline etching is not particularly limited and may be a conventional choice in the art.
- the etching solution A contains at least one of sodium hydroxide, potassium hydroxide, sodium carbonate, particularly sodium hydroxide and/or potassium hydroxide, such as sodium hydroxide.
- the conditions of the alkaline etching are not particularly limited as long as the metal hard anodic oxide 2 on which the resin film layer 3 is not formed on the surface of the substrate can be effectively removed.
- the conditions of the alkaline etching include: a temperature of 20-80 ° C, especially 40-60 ° C; a time of 0.1-10 min, especially 0.5-3 min.
- the acidic etching is performed to remove the metal substrate 1 in the substrate.
- the second composite is placed in the etching solution B for acid etching, and after the acid etching is completed, it is taken out and rinsed with deionized water, and the obtained casing is as shown in FIG. 5.
- the concentration of the etching liquid B used for the acidic etching is not particularly limited as long as the metal substrate 1 in the substrate can be removed.
- the etching solution B used for the acidic etching has a concentration of 1-900 g/L, particularly 300-800 g/L.
- the selection of the etching liquid B used for the acidic etching is not particularly limited, and optionally, the etching liquid B contains at least one of ferric chloride, hydrochloric acid, and copper chloride, particularly Ferric chloride and hydrochloric acid.
- the etching liquid B is a mixture of ferric chloride and hydrochloric acid, the weight ratio of ferric chloride to hydrochloric acid is from 1:10 to 10:1.
- the conditions of the acidic etching are not particularly limited and may be a conventional choice in the art.
- the conditions of the acidic etching include: a temperature of 5 to 40 ° C, particularly 20 to 30 ° C; a time of 1 to 60 min, particularly 15 to 30 min.
- the method may further include: low on the metal hard anodic oxide layer 5 in which the resin film layer 3 is not formed
- the surface is dyed and sealed.
- the dyeing process may be performed in a dye tank.
- the color of the dye is not particularly limited in the present disclosure, and may be selected according to needs and appearance effects, for example, may be silver, white or gold, and the dyeing is completed.
- the deionized water is rinsed, and the dyed casing is as shown in Fig. 6; the sealing process can be carried out in the sealing groove.
- the present disclosure also provides a housing prepared by the method of the present disclosure.
- the casing includes a metal hard anodic oxide layer 5 and a resin film layer 3, and the metal hard anodic oxide layer 5 and the resin film layer 3 have an integral structure.
- the metal hard anodic oxide layer 5 has a double-layered pore structure including an inner layer having a macroporous structure and an outer layer having a small pore structure, wherein the resin film layer 3 has the same
- the inner layers of the macroporous structure are joined together.
- the casing is neat and tidy, Smooth and consistent.
- the present disclosure also provides the use of the housing of the present disclosure as an outer casing for an electronic product.
- the electronic product casing may be any electronic product (such as a communication device) housing that requires a metal as a casing, and may be, for example, a casing or a frame of the mobile terminal, a casing or a frame of the wearable electronic device.
- the mobile terminal refers to a device that can be in a mobile state and has a wireless transmission function, such as a mobile phone, a portable computer (including a laptop and a tablet).
- the wearable electronic device refers to an intelligent wearable device, such as a smart watch or a smart bracelet.
- the electronic product may specifically be, but not limited to, at least one of a mobile phone, a portable computer (such as a notebook computer and a tablet), a smart watch, and a smart bracelet.
- the electronic product housing is a mobile phone housing.
- the phone case has an all-metal appearance, and the case is neat, smooth, consistent, continuous, and capable of being penetrated by radio frequency.
- the thickness of the metal hard anodic oxide was measured using a metallographic microscope of the model Axio Imager Alm available from ZEISS;
- the hardness of the metal hard anodic oxide was measured by a model HX-1000TM/LCD microhardness tester purchased from Shanghai Optical Instrument Factory No. 1;
- the pore diameter of the pore was measured by a scanning electron microscope of JSM-7600F available from Nippon Denshi Co., Ltd. (five different positions of the same sample were observed, and the pore diameters of all the pores appearing in the visual field range were measured);
- the aluminum alloy sheets in the following examples and comparative examples were purchased from South-South Aluminum Corporation.
- This embodiment is for explaining a method of preparing a casing.
- the aluminum alloy sheet was placed as an anode in a hard anodizing bath containing 150 g/L of sulfuric acid and 15 g/L of oxalic acid, and hardened at 6 ° C and a current density of 1.5 A/dm 2 .
- the thickness of the metal hard anodic oxide was measured by a metallographic microscope, and the hardness of the metal hard anodic oxide was measured by a microhardness tester. The results are shown in Table 1;
- the first aluminum alloy resin composite injected into the mold is placed in a 40 g/L sodium hydroxide aqueous solution, immersed at 40 ° C for 1 min, and then taken out and rinsed with deionized water, and the metal in the uninjected area is removed by alkaline etching.
- a hard anodic oxide resulting in a second aluminum alloy resin composite comprising an aluminum alloy layer, a metal hard anodic oxide layer and a resin film layer, as shown in FIG. 4;
- the alkaline etching of the second aluminum alloy resin composite is carried out by immersing in a mixture of 300 g/L of ferric chloride and hydrochloric acid (weight ratio of ferric chloride to hydrochloric acid is 1:1) for immersion in acidity Etching, the temperature is 30 ° C, the time is 18 minutes to etch away the aluminum alloy layer, after the acid etching is completed, rinse with deionized water to obtain a casing as shown in FIG. 5;
- the acid-etched casing is placed in a dye tank of a suitable color for dyeing for 10 minutes, and after the dyeing is completed, it is washed with deionized water to obtain a casing as shown in FIG. 6;
- This embodiment is for explaining a method of preparing a casing.
- the first aluminum alloy resin composite injected into the sample is placed in a 30 g/L sodium hydroxide aqueous solution, immersed at 50 ° C for 0.5 min, then taken out and rinsed with deionized water, and subjected to alkaline etching to remove the uninjected area.
- a metal hard anodic oxide resulting in a second aluminum alloy resin composite comprising an aluminum alloy layer, a metal hard anodic oxide layer and a resin film layer, as shown in FIG. 4;
- the acid-etched casing is placed in a dye tank of a suitable color for dyeing for 10 minutes, and after the dyeing is completed, it is washed with deionized water to obtain a casing as shown in FIG. 6;
- This embodiment is for explaining a method of preparing a casing.
- the first aluminum alloy resin composite injected into the mold is placed in a 50 g/L sodium hydroxide aqueous solution, immersed at 60 ° C for 3 min, and then taken out and rinsed with deionized water to obtain an unetched area after alkaline etching.
- a metal hard anodic oxide resulting in a second aluminum alloy resin composite comprising an aluminum alloy layer, a metal hard anodic oxide layer and a resin film layer, as shown in FIG. 4;
- the acid-etched casing is placed in a dye tank of a suitable color for dyeing for 10 minutes, and after the dyeing is completed, it is washed with deionized water to obtain a casing as shown in FIG. 6;
- This example is intended to illustrate a housing prepared when the pore-expanding agent is an aqueous ammonium-ammonium chloride solution.
- the shell was prepared in the same manner as in Example 1, except that the pore-expanding agent in the step (3) was an ammonium-ammonium chloride aqueous solution.
- the measurement results are shown in Table 1.
- This example is intended to illustrate a housing that is prepared when the concentration of the pore expander is not within the optimum range but is within the broader scope of the present disclosure.
- the shell was prepared in the same manner as in Example 1 except that the concentration of the pore-expanding agent in the step (3) was 5 g/L.
- the measurement results are shown in Table 1.
- This embodiment is for explaining a housing prepared without the step of reaming.
- the shell was prepared in the same manner as in Example 1, except that the hole expanding process of the step (3) was not performed, that is, the substrate having the metal hard anodic oxide obtained on the surface obtained in the step (2) was directly subjected to the injection molding process of the step (4). .
- the measurement results are shown in Table 1.
- the hardness of the casing prepared by the method of the present disclosure reaches the requirement (hardness greater than 180 HV) which can be used as an outer casing of an electronic product.
- the casing has a clean, smooth, uniform and continuous all-metal appearance effect, and the casing prepared by the method of the present disclosure passes the metal hard anode through the large hole and the small hole filling resin.
- the oxide layer is tightly bonded to the resin film layer to improve the performance of the casing.
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Abstract
Description
Claims (19)
- 一种壳体,包括金属硬质阳极氧化物层(5)和附着于该金属硬质阳极氧化物层(5)的第一表面上的树脂膜层(3),所述金属硬质阳极氧化物层(5)与所述树脂膜层(3)为一体结构。
- 根据权利要求1所述的壳体,其中,所述金属硬质阳极氧化物层(5)的厚度为5-90μm,优选为10-70μm,进一步优选为12-45μm;优选地,所述金属硬质阳极氧化物层(5)的硬度为350-800HV,进一步优选为450-600HV。
- 根据权利要求1或2所述的壳体,其中,所述金属硬质阳极氧化物层(5)具有双层孔洞结构,该双层孔洞结构包括具有大孔结构的内层和具有小孔结构的外层,其中,所述树脂膜层(3)与所述具有大孔结构的内层结合在一起。
- 根据权利要求3所述的壳体,其中,大孔的孔径为200-2000nm,小孔的孔径为10-100nm。
- 根据权利要求1或2所述的壳体,其中,所述金属硬质阳极氧化物层(5)由铝或铝合金经过硬质阳极氧化形成。
- 根据权利要求1所述的壳体,其中,所述树脂膜层(3)的厚度为0.1-10mm,优选为0.2-8mm,进一步优选为0.4-5mm。
- 根据权利要求1或6所述的壳体,其中,所述树脂膜层(3)由含有热塑性树脂以及任选的填料的树脂组合物形成;优选地,所述树脂组合物含有50-99重量%的热塑性树脂和1-50重量%的填料;优选地,所述热塑性树脂为聚苯硫醚、聚苯醚和聚酰胺中的至少一种;优选地,所述填料为纤维填料和/或粉末填料,进一步优选地,所述纤维填料为玻璃纤维、碳纤维和聚酰胺纤维中的至少一种,所述粉末填料为二氧化硅、滑石粉、氢氧化铝、氢 氧化镁、碳酸钙、碳酸镁、玻璃和高岭土中的至少一种。
- 根据权利要求1、2或6所述的壳体,其中,所述壳体还包括染色层(4),所述染色层(4)形成于所述金属硬质阳极氧化物层(5)的第二表面上,与所述树脂膜层(3)相对。
- 一种壳体的制备方法,包括:提供金属基材(1),将所述金属基材(1)进行硬质阳极氧化处理,得到具有金属硬质阳极氧化物的基体;在所述基体的第一表面上形成树脂膜层(3),得到第一复合体;将所述第一复合体进行碱性蚀刻,以去除未形成树脂膜层(3)的基体表面上的金属硬质阳极氧化物(2),得到第二复合体,所述第二复合体包括金属基材(1)、金属硬质阳极氧化物层(5)和树脂膜层(3);将所述第二复合体进行酸性蚀刻,以去除所述基体中的金属基材(1)。
- 根据权利要求9所述的方法,其中,在所述硬质阳极氧化处理之后并且在所述基体的第一表面上形成树脂膜层(3)之前对所述基体的表面进行扩孔。
- 根据权利要求10所述的方法,其中,所述扩孔的过程在扩孔剂中进行,所述扩孔剂的浓度为0.1-40g/L;优选地,所述扩孔剂为碳酸钠水溶液、碳酸氢钠水溶液、氢氧化钠水溶液、碳酸钾水溶液、碳酸氢钾水溶液、氢氧化钾水溶液、磷酸氢钠水溶液、磷酸氢钾水溶液、磷酸二氢钠水溶液、磷酸二氢钾水溶液、氢氧化钠-磷酸氢钠水溶液、氢氧化钾-磷酸氢钾水溶液、氨水溶液、肼水溶液、肼衍生物水溶液、水溶性胺系化合物水溶液、铵-氯化铵水溶液、磷酸钠-磷酸氢钠水溶液和磷酸钾-磷酸氢钾水溶液中的至少一种;进一步优选为磷酸二氢钠水溶液、磷酸二氢钾水溶液、氢氧化钠-磷酸氢钠水溶液和氢氧化钾-磷酸氢钾水溶液中的至少一种;更优选为磷酸二氢钠水溶液。
- 根据权利要求9或10所述的方法,其中,所述硬质阳极氧化处理的条件包括:电流密度为0.1-10A/dm2,优选为1.5-5A/dm2;温度为0-20℃,优选为2-10℃;时间为1-300min, 优选为30-120min;电解液的浓度为10-260g/L,优选为30-180g/L;优选地,所述电解液中的电解质为硫酸、草酸、甲酸和柠檬酸中的至少一种,进一步优选为硫酸和/或草酸,更优选为硫酸和草酸;进一步优选地,当电解液中的电解质为硫酸和草酸时,所述电解液中的硫酸的浓度为18-200g/L,草酸的浓度为5-35g/L。
- 根据权利要求9或10所述的方法,其中,形成所述树脂膜层(3)的方式包括:采用树脂组合物进行注塑;优选地,所述树脂组合物含有50-99重量%的热塑性树脂和1-50重量%的填料;优选地,所述热塑性树脂为聚苯硫醚、聚苯醚和聚酰胺中的至少一种;优选地,所述填料为纤维填料和/或粉末填料,进一步优选地,所述纤维填料为玻璃纤维、碳纤维和聚酰胺纤维中的至少一种,所述粉末填料为二氧化硅、滑石粉、氢氧化铝、氢氧化镁、碳酸钙、碳酸镁、玻璃和高岭土中的至少一种。
- 根据权利要求9或10所述的方法,其中,所述碱性蚀刻所用的蚀刻液A的浓度为5-60g/L;优选地,所述蚀刻液A含有氢氧化钠、氢氧化钾和碳酸钠中的至少一种,进一步优选为氢氧化钠;优选地,所述碱性蚀刻的条件包括:温度为20-80℃,优选为40-60℃;时间为0.1-10min,优选为0.5-3min。
- 根据权利要求9或10所述的方法,其中,所述酸性蚀刻所用的蚀刻液B的浓度为1-200g/L;优选地,所述蚀刻液B含有三氯化铁、盐酸和氯化铜中的至少一种,进一步优选含有三氯化铁和盐酸;优选地,所述酸性蚀刻的条件包括:温度为5-40℃,优选为20-30℃;时间为1-60min,优选为15-30min。
- 根据权利要求9-15中任意一项所述的方法,还包括:对未形成所述树脂膜层(3)的所述金属硬质阳极氧化层(5)的第二表面进行染色和封孔。
- 由权利要求9-16中任意一项所述的方法制备的壳体。
- 权利要求1-8和17中任意一项所述的壳体作为电子产品外壳的应用。
- 根据权利要求18所述的应用,所述电子产品外壳为手机壳体。
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US16/314,362 US20190159352A1 (en) | 2016-06-30 | 2017-06-19 | Housing and method for fabrication thereof and application thereof |
JP2018568231A JP2019522727A (ja) | 2016-06-30 | 2017-06-19 | ハウジング、ならびにその組立て方法およびその適用 |
KR1020197002648A KR20190022794A (ko) | 2016-06-30 | 2017-06-19 | 하우징, 이의 제조 방법 및 이의 용도 |
EP17819127.6A EP3481164A4 (en) | 2016-06-30 | 2017-06-19 | HOUSING AND ITS MANUFACTURING METHOD AND APPLICATION |
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US10830264B2 (en) | 2016-11-17 | 2020-11-10 | Sb Ingenierie Sas | Arrangement for fastening a panel in a slot using two opposite wedges |
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CN110129854B (zh) * | 2018-02-08 | 2021-07-09 | 华为技术有限公司 | 一种氧化膜的制备方法和终端设备 |
CN108866553A (zh) * | 2018-05-30 | 2018-11-23 | 株洲航发橡塑制品有限公司 | 铝合金工件阳极化表面的超声波清洗工艺 |
CN110545343B (zh) * | 2019-09-06 | 2021-12-31 | 广州三星通信技术研究有限公司 | 包括金属壳体的电子设备及其制造方法 |
EP4082746A4 (en) * | 2019-12-27 | 2023-12-06 | DIC Corporation | COMPOSITE STRUCTURE AND ITS MANUFACTURING METHOD |
US20230366118A1 (en) | 2020-09-25 | 2023-11-16 | Beijing Huayu Chuangxin Technologies Co., Ltd. | Method for Manufacturing Colored Product and Mobile Phone shell |
CN114889040B (zh) * | 2022-01-18 | 2024-04-30 | 深圳市栢迪科技有限公司 | 复合齿轮的制造方法 |
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US20190159352A1 (en) | 2019-05-23 |
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JP2019522727A (ja) | 2019-08-15 |
KR20190022794A (ko) | 2019-03-06 |
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