WO2016093148A1 - 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法 - Google Patents

液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法 Download PDF

Info

Publication number
WO2016093148A1
WO2016093148A1 PCT/JP2015/084025 JP2015084025W WO2016093148A1 WO 2016093148 A1 WO2016093148 A1 WO 2016093148A1 JP 2015084025 W JP2015084025 W JP 2015084025W WO 2016093148 A1 WO2016093148 A1 WO 2016093148A1
Authority
WO
WIPO (PCT)
Prior art keywords
epoxy resin
component
resin composition
liquid
liquid epoxy
Prior art date
Application number
PCT/JP2015/084025
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
鈴木　真
東之 吉井
小原　和之
Original Assignee
ナミックス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ナミックス株式会社 filed Critical ナミックス株式会社
Priority to CN201580047046.1A priority Critical patent/CN106687496A/zh
Priority to KR1020177005859A priority patent/KR102352908B1/ko
Publication of WO2016093148A1 publication Critical patent/WO2016093148A1/ja

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5033—Amines aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C08J3/226—Compounding polymers with additives, e.g. colouring using masterbatch techniques using a polymer as a carrier
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Definitions

  • the present invention relates to a liquid epoxy resin composition, and in particular, to a liquid epoxy resin composition suitable for a liquid semiconductor encapsulant, especially a liquid semiconductor encapsulant for flip chip type semiconductor devices.
  • Flip chip bonding is used as a semiconductor element mounting method that can cope with higher density and higher output of wiring and the like of a semiconductor device.
  • a semiconductor element and a substrate are joined by bumps, and a gap between the semiconductor element and the substrate is sealed with a liquid semiconductor sealing agent called an underfill material.
  • An object of the present invention is to provide a liquid semiconductor encapsulant that is excellent in injectability into a flip chip type semiconductor device having a fine pitch wiring pattern and suppresses fillet cracks after curing.
  • the present invention relates to a liquid epoxy resin composition, a semiconductor encapsulant, a semiconductor device, and a method for producing a liquid epoxy resin composition that have solved the above problems by having the following configuration.
  • a liquid epoxy resin containing (A) an aminophenol type epoxy resin, (B) an amine curing agent, (C) a silica filler, and (D) a silane coupling agent, (A) The aminophenol type epoxy resin is included in an amount of 10.0 to 70 parts by mass with respect to 100 parts by mass of the component, (B) component is a ratio of 0.7 to 1.2 equivalents with respect to (A) component: 1 equivalent,
  • the aminophenol type epoxy resin contained in the component (A) is represented by the formula (1):
  • the component (B) is represented by chemical formulas (2) to (4):
  • the average particle size of the component (C) is 0.1 to 3.0 ⁇ m, and the component (C) is 55 to 75 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition.
  • the component (D) is dispersed in at least a part of the component (A) excluding the aminophenol type epoxy resin to form a master batch, and then the master batch contains the aminophenol type epoxy resin.
  • a liquid semiconductor encapsulant comprising the liquid epoxy resin composition according to the above [1].
  • a flip chip type semiconductor device comprising a copper pillar according to [10].
  • the component (D) is dispersed in the component (A) excluding the aminophenol type epoxy resin to form a master batch, and then the amino batch type epoxy resin and the component (B) are mixed into the master batch.
  • liquid epoxy resin composition which is excellent in injectability into a flip chip type semiconductor device having a fine pitch wiring pattern and suppresses fillet cracks after curing.
  • a highly reliable semiconductor device in which a liquid semiconductor encapsulant is satisfactorily injected into a fine-pitch wiring pattern and fillet cracks of the cured liquid semiconductor encapsulant are suppressed is easy. Can be provided.
  • liquid epoxy resin composition The liquid epoxy resin composition of the present invention (hereinafter referred to as liquid epoxy resin composition) (A) a liquid epoxy resin containing an aminophenol type epoxy resin, (B) an amine curing agent, (C) a silica filler and (D) a silane coupling agent, (A) The aminophenol type epoxy resin is included in an amount of 10.0 to 70 parts by mass with respect to 100 parts by mass of the component, (B) component is a ratio of 0.7 to 1.2 equivalents with respect to (A) component: 1 equivalent, The glass transition temperature (Tg) after curing is 110 to 200 ° C.
  • Tg glass transition temperature after curing
  • the aminophenol type epoxy resin contained in the component (A) is an epoxy resin having a low molecular weight, which makes the liquid epoxy resin composition low in viscosity and good injectability. Moreover, generation
  • the aminophenol type epoxy resin is preferably represented by the formula (5):
  • liquid epoxy resin composition In view of the injection property of the liquid epoxy resin composition, curability, heat resistance, adhesiveness, durability such as fillet crack suppression of the liquid epoxy resin composition after curing, particularly from the viewpoint of migration resistance preferable.
  • Commercially available products include aminophenol type epoxy resins (grade: JER630, JER630LSD) manufactured by Mitsubishi Chemical.
  • the aminophenol type epoxy resin may be used alone or in combination of two or more.
  • component (A) other than aminophenol type epoxy resin liquid bisphenol A type epoxy resin, liquid bisphenol F type epoxy resin, liquid naphthalene type epoxy resin, liquid hydrogenated bisphenol type epoxy resin, liquid alicyclic epoxy resin, liquid type Examples include alcohol ether type epoxy resins, liquid cycloaliphatic type epoxy resins, liquid fluorene type epoxy resins, liquid siloxane type epoxy resins, etc., liquid bisphenol A type epoxy resins, liquid bisphenol F type epoxy resins, and liquid siloxane type epoxy resins. From the viewpoint of curability, heat resistance, adhesion, and durability.
  • the epoxy equivalent is preferably 80 to 250 g / eq from the viewpoint of viscosity adjustment.
  • Nippon Steel Chemical's bisphenol A type epoxy resin product name: YDF8170
  • Nippon Steel Chemical's bisphenol F type epoxy resin product name: YDF870GS
  • DIC naphthalene type epoxy resin product name: HP4032D
  • Shin-Etsu examples include chemical siloxane-based epoxy resins (product name: TSL9906).
  • Components (A) other than the aminophenol-type epoxy resin may be used alone or in combination of two or more.
  • the aminophenol type epoxy resin is contained in an amount of 10.0 to 70 parts by weight with respect to 100 parts by weight of the component (A) from the viewpoint of injectability and suppression of fillet cracks.
  • the aminophenol type epoxy resin is less than 10.0 parts by mass, the injectability is deteriorated and fillet cracks are easily generated.
  • the aminophenol type epoxy resin exceeds 70 parts by mass, the glass transition of the cured liquid epoxy resin composition The point becomes too high, fillet cracks are likely to occur, and the reliability is lowered.
  • the aminophenol type epoxy resin is 10.0 to 70 parts by weight, the crosslink density of the liquid epoxy resin composition after curing is increased, the rigidity of the bond of the component (A) is maintained, and the fillet crack is extended.
  • the aminophenol type epoxy resin is added excessively, the rigidity of the bond of the component (A) is weakened, and the fillet crack of the liquid epoxy resin composition after curing is likely to extend. It is done.
  • Component (B) imparts good reactivity (curing speed) and moderate viscosity to the liquid epoxy resin composition.
  • any component having at least one active hydrogen capable of addition reaction with an epoxy group in the molecule may be used.
  • aliphatic amine compounds such as diethylenetriamine, triethylenetetramine, n-propylamine, 2-hydroxyethylaminopropylamine, cyclohexylamine, 4,4′-diamino-dicyclohexylmethane; 4,4′- Aromatic amine compounds such as diaminodiphenylmethane and 2-methylaniline; imidazole compounds such as imidazole, 2-methylimidazole, 2-ethylimidazole and 2-isopropylimidazole; imidazoline compounds such as imidazoline, 2-methylimidazoline and 2-ethylimidazoline An aromatic amine compound is preferable from the viewpoint of liquidity and storage stability.
  • (B) component is represented by chemical formulas (2) to (4):
  • the amine-based curing agent represented by at least one of the above is included from the viewpoint of being liquid and storage stability.
  • (B) component ALBEMARLE Co., Ltd. , Ltd., Ltd. Diethyltoluenediamine (compound of chemical formula (2), product name: Etacure 100), Nippon Kayaku amine curing agent (compound of chemical formula (3), product name: HDAA), ADEKA amine curing agent (chemical formula (4 ), Product name: EH105L).
  • a component may be individual or may use 2 or more types together.
  • the linear expansion coefficient of the liquid epoxy resin composition can be controlled by the component (C).
  • the component (C) include colloidal silica, hydrophobic silica, fine silica, and nano silica.
  • the average particle diameter of component (C) (or the average maximum diameter if not granular) is not particularly limited, but when it is 0.1 to 3 ⁇ m, component (C) is uniformly distributed in the liquid epoxy resin composition. It is preferable to disperse in the range of 0.3 to 2.0 ⁇ m. Moreover, it is preferable for reasons such as excellent injectability of the liquid epoxy resin composition. If it is less than 0.1 ⁇ m, the viscosity of the liquid epoxy resin composition increases and the injectability may be deteriorated.
  • the component (C) preferably contains nanosilica having an average particle diameter of 10 to 100 nm from the viewpoint of bleeding.
  • the average particle diameter of the filler is measured by a dynamic light scattering nanotrack particle size analyzer.
  • a component may be individual or may use 2 or more types together.
  • component (D) component provides adhesiveness to a liquid epoxy resin composition.
  • component (D) 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, vinyltrimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, p-styryltrimethoxysilane, 3-methacryloxypropylmethyltrimethoxysilane, 3-acryloxypropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, 3-mercaptopropyltrimethoxysilane, bis (triethoxysilylpropyl) tetra And sulfide, 3-isocyanatopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-triethoxysilyl-N- (1,
  • a component may be individual or may use 2 or more types together.
  • the component (B) is in a ratio of 0.7 to 1.2 equivalents and preferably in a ratio of 0.7 to 1.0 equivalents to 1 equivalent of the component (A).
  • the equivalent of (A) component is an epoxy equivalent
  • the equivalent of (B) component is an amine equivalent.
  • it is 0.7 or more, the reactivity, moisture resistance reliability of the liquid epoxy resin composition after curing, and migration resistance are good.
  • it is 1.2 or less, the viscosity increase ratio does not become too high. , The generation of voids is suppressed.
  • the component (C) is preferably 55 to 75 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition from the viewpoint of the linear expansion coefficient of the liquid epoxy resin composition after curing.
  • the component (D) is preferably 0.05 to 5.0 parts by mass, more preferably 0.1 to 3.0 parts by mass with respect to 100 parts by mass of the component (A).
  • it is 0.05 parts by mass or more, the adhesion of the liquid epoxy resin composition is improved, the moisture resistance reliability of the liquid epoxy resin composition after curing becomes better, and when it is 5.0 parts by mass or less, Foaming of the liquid epoxy resin composition is suppressed.
  • the liquid epoxy resin composition further contains (E) polyalkylsiloxane (alkyl groups bonded to Si include methyl, dimethyl, ethyl, etc.), the flow characteristics of the liquid epoxy resin composition are improved. This is preferable because the fillet shape can be changed.
  • the component (E) is more preferably polyalkyldimethylsiloxane.
  • Toray Dow Corning polyalkyl dimethylsiloxane product name: SF8421
  • a component may be individual or may use 2 or more types together.
  • the liquid epoxy resin composition contains (F) a block copolymer, since the flow characteristics of the liquid epoxy resin composition can be improved and the fillet shape can be changed.
  • the component (F) include block copolymers such as acrylic copolymers, and a block copolymer of methyl methacrylate and butyl acrylate is more preferable.
  • Commercially available products of the component (F) include Arkema block copolymer acrylic copolymer, product name: M52N, and molecular weight: 80,000 to 100,000.
  • a component may be individual or may use 2 or more types together.
  • the component (E) is preferably 2 to 8 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition from the viewpoint of the fillet shape.
  • the component (F) is preferably 4 to 10 parts by mass with respect to 100 parts by mass of the liquid epoxy resin composition from the viewpoint of the fillet shape.
  • liquid epoxy resin composition of the present invention a curing accelerator, a clathrate compound, a leveling agent, an ion trapping agent, an antifoaming agent, a decoloring agent, an oxidation agent are further added as necessary without departing from the object of the present invention.
  • Additives such as inhibitors, pigments and dyes can be blended.
  • the liquid epoxy resin composition has a glass transition temperature (Tg) after curing of 110 to 200 ° C, preferably 120 to 200 ° C. If the Tg is less than 110 ° C, the strength at high temperature decreases, so the reliability in the environmental test with the maximum temperature of 110 to 120 ° C is inferior. If the Tg exceeds 200 ° C, it becomes too hard and the fret Cracks are likely to occur, and shrinkage at the time of curing increases, so that the semiconductor device is likely to warp and the water absorption rate is likely to increase.
  • Tg glass transition temperature
  • the liquid epoxy resin composition preferably has a viscosity of 5 to 20 Pa ⁇ s at a temperature of 25 ° C. from the viewpoint of injectability.
  • the viscosity is measured with a Brookfield HBT viscometer (model number: DV-I).
  • the epoxy resin composition of the present invention is suitable for a liquid semiconductor encapsulant using flip chip bonding having a fine pitch wiring pattern in which the gap between the chip and the substrate is 5 to 25 ⁇ m.
  • the component (D) is dispersed in the component (A) excluding the aminophenol type epoxy resin to form a master batch, and then the amino batch type epoxy resin is added to the master batch.
  • the component (B) is mixed.
  • (D) Component is dispersed in (A) component excluding aminophenol-type epoxy resin, and a master batch is used to separate (D) component in liquid epoxy resin composition, (D) component and aminophenol As compared with the case where all raw materials are mixed at the same time, the liquid epoxy resin composition can be easily produced.
  • the component (A) excluding the aminophenol type epoxy resin mixed with the component (D) is 10 to 1000 parts by mass with respect to 100 parts by mass of the component (C).
  • the amount is 50 to 500 parts by mass.
  • a master batch When producing a master batch, it can be obtained by stirring, melting, mixing, and dispersing while applying heat treatment if necessary.
  • the mixing, stirring, dispersing and the like devices are not particularly limited, and a raikai machine equipped with a stirring and heating device, a three-roll mill, a ball mill, a planetary mixer, a bead mill and the like can be used. . Moreover, you may use combining these apparatuses suitably.
  • the mixing order is not particularly limited.
  • the mixing method may be the same as that for producing a master batch.
  • the liquid epoxy resin composition of the present invention is formed and applied at a desired position on the substrate by a dispenser, printing or the like.
  • the liquid epoxy resin composition is formed between a substrate such as a flexible wiring substrate and a semiconductor element so that at least a part thereof is in contact with the wiring of the substrate.
  • the liquid resin composition of the present invention is preferably cured at 90 to 170 ° C. for 60 to 180 minutes. Particularly, curing within 120 minutes is preferable from the viewpoint of productivity improvement as a sealant used in a semiconductor device.
  • liquid semiconductor sealant The liquid semiconductor encapsulant of the present invention is suitable as a liquid semiconductor encapsulant for flip chip type semiconductor devices containing the above-described liquid epoxy resin composition and having a gap between the chip and the substrate of 5 to 25 ⁇ m.
  • the semiconductor device of the present invention is sealed using the above-mentioned liquid semiconductor sealing agent. Any desired semiconductor element and substrate can be used, but a flip-chip semiconductor device having a gap between the chip and the substrate of 5 to 25 ⁇ m is suitable for exhibiting the effects of the present invention. In addition, the effect of the present invention can be exhibited also for a flip chip type semiconductor device including a copper pillar.
  • Example 1 to 14 Comparative Examples 1 to 6
  • resin composition a liquid epoxy resin composition (hereinafter referred to as “resin composition”) was prepared by dispersing using a three-roll mill at room temperature.
  • component (D) was mixed with the component (A) and the component (C) excluding the aminophenol type epoxy resin at room temperature, and then dispersed with a three-roll mill to obtain a master batch.
  • the aminophenol type epoxy resin and the component (B) were mixed in a master batch at room temperature and then dispersed by a three-roll mill.
  • FIG. 1 the schematic diagram explaining the injection
  • a test piece was prepared in which a gap 40 of 50 ⁇ m or 25 ⁇ m was provided on a substrate 20 and a glass plate 30 was fixed instead of a semiconductor element.
  • a glass substrate was used instead of the flexible substrate.
  • this test piece is placed on a hot plate set at 110 ° C., and as shown in FIG. 1 (B), the prepared resin composition 10 is applied to one end side of the glass plate 30, and FIG. ), The time until the gap 40 was filled with the resin composition 11 was measured.
  • Tables 1 to 3 show the results.
  • Tg glass transition point
  • FIG. 2 is a photograph of a portion where no fillet crack is generated.
  • FIG. 3 is a photograph of a location where the amount of fillet cracks generated is suppressed using the present invention. In FIG. 3, the locations (three locations) where the fillet crack has occurred are indicated by arrows.
  • FIG. 4 is a photograph of a location where a large amount of fillet cracks occurred. In FIG. 4, the location (seven locations) where the fillet crack has occurred is indicated by an arrow.
  • the component (D) is a master batch with the component (A) excluding the aminophenol type epoxy resin, and then the aminophenol type epoxy resin is added to the master batch and the component (B).
  • Example 14 which was mixed at room temperature, the storage characteristics of the liquid epoxy resin composition were better than those in the other examples.
  • Comparative Example 1 containing no aminophenol epoxy resin the rate of occurrence of fillet cracks was high.
  • Comparative Examples 2 to 4 in which the content of the aminophenol epoxy resin was too low, the injectability at a gap of 20 ⁇ m was poor and the rate of occurrence of fillet cracks was also high.
  • Comparative Example 5 in which the content of aminophenol epoxy resin was too high, the glass transition point was too high, the reliability could not be ensured, and the rate of occurrence of fillet cracks was also high.
  • Comparative Example 6 in which the equivalent ratio of the component (B) is low and the glass transition point is too low, the glass transition point is too low and reliability cannot be ensured.
  • the liquid epoxy resin composition of the present invention is excellent in injectability into a flip-chip type semiconductor device having a fine pitch wiring pattern and can suppress fillet cracks after curing. Suitable for stopping agent.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Wire Bonding (AREA)
PCT/JP2015/084025 2014-12-12 2015-12-03 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法 WO2016093148A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580047046.1A CN106687496A (zh) 2014-12-12 2015-12-03 液态环氧树脂组合物、半导体封装剂、半导体装置和液态环氧树脂组合物制造方法
KR1020177005859A KR102352908B1 (ko) 2014-12-12 2015-12-03 액상 에폭시 수지 조성물, 반도체 밀봉제, 반도체 장치, 및 액상 에폭시 수지 조성물의 제조 방법

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-252471 2014-12-12
JP2014252471A JP6969729B2 (ja) 2014-12-12 2014-12-12 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法

Publications (1)

Publication Number Publication Date
WO2016093148A1 true WO2016093148A1 (ja) 2016-06-16

Family

ID=56107336

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/084025 WO2016093148A1 (ja) 2014-12-12 2015-12-03 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法

Country Status (5)

Country Link
JP (1) JP6969729B2 (zh)
KR (1) KR102352908B1 (zh)
CN (1) CN106687496A (zh)
TW (1) TW201629117A (zh)
WO (1) WO2016093148A1 (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181603A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 液状エポキシ樹脂組成物、半導体装置及び半導体装置の製造方法
KR20200023312A (ko) 2017-06-29 2020-03-04 히타치가세이가부시끼가이샤 밀봉용 수지 조성물, 반도체 패키지 및 반도체 패키지의 제조 방법

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018119032A (ja) * 2017-01-23 2018-08-02 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6929069B2 (ja) * 2017-01-23 2021-09-01 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
WO2018135557A1 (ja) * 2017-01-23 2018-07-26 株式会社ダイセル 硬化性エポキシ樹脂組成物
KR20190104063A (ko) * 2017-01-23 2019-09-05 주식회사 다이셀 광반사용 경화성 수지 조성물 및 그의 경화물, 그리고 광반도체 장치
JP6920723B2 (ja) * 2017-07-14 2021-08-18 ナミックス株式会社 加圧実装用ｎｃｆ
CN110527046A (zh) * 2019-08-19 2019-12-03 湖北三选科技有限公司 改质双胺型苯并恶嗪树脂及制备方法、及其在液态晶圆级封装材料中作为应力释放剂的应用
JP7099490B2 (ja) * 2020-05-07 2022-07-12 昭和電工マテリアルズ株式会社 封止用液状樹脂組成物及び電子部品装置
CN112457808A (zh) * 2020-11-20 2021-03-09 湖北三选科技有限公司 氮化镓功率器件用低翘曲高接着力液态模封胶及制备方法
KR102625325B1 (ko) * 2021-08-11 2024-01-16 한국생산기술연구원 자가치유 가능한 에폭시접착제
WO2023140154A1 (ja) * 2022-01-18 2023-07-27 パナソニックＩｐマネジメント株式会社 液状封止用樹脂組成物及び半導体装置
WO2024075342A1 (ja) * 2022-10-07 2024-04-11 ナミックス株式会社 エポキシ樹脂組成物、半導体装置、及び半導体装置の製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006016429A (ja) * 2004-06-30 2006-01-19 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JP2012162585A (ja) * 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
JP2013001811A (ja) * 2011-06-16 2013-01-07 Hitachi Chemical Co Ltd 電子部品用樹脂組成物及び電子部品装置
JP2014227465A (ja) * 2013-05-22 2014-12-08 京セラケミカル株式会社 射出成形用液状樹脂組成物および半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100655056B1 (ko) * 2003-12-30 2006-12-06 제일모직주식회사 반도체 소자 밀봉용 액상 에폭시 수지 조성물
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
US20110253943A1 (en) * 2010-04-19 2011-10-20 Trillion Science, Inc. One part epoxy resin including a low profile additive
JP5593259B2 (ja) 2011-03-16 2014-09-17 ナミックス株式会社 液状エポキシ樹脂組成物
JP5862176B2 (ja) * 2011-10-06 2016-02-16 日立化成株式会社 液状エポキシ樹脂組成物の選択方法及び製造方法、並びに電子部品装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006016429A (ja) * 2004-06-30 2006-01-19 Shin Etsu Chem Co Ltd 半導体封止用エポキシ樹脂組成物
JP2012162585A (ja) * 2011-02-03 2012-08-30 Namics Corp 半導体樹脂封止材
JP2013001811A (ja) * 2011-06-16 2013-01-07 Hitachi Chemical Co Ltd 電子部品用樹脂組成物及び電子部品装置
JP2014227465A (ja) * 2013-05-22 2014-12-08 京セラケミカル株式会社 射出成形用液状樹脂組成物および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018181603A1 (ja) * 2017-03-31 2018-10-04 日立化成株式会社 液状エポキシ樹脂組成物、半導体装置及び半導体装置の製造方法
KR20200023312A (ko) 2017-06-29 2020-03-04 히타치가세이가부시끼가이샤 밀봉용 수지 조성물, 반도체 패키지 및 반도체 패키지의 제조 방법

Also Published As

Publication number Publication date
JP6969729B2 (ja) 2021-11-24
CN106687496A (zh) 2017-05-17
KR102352908B1 (ko) 2022-01-19
TW201629117A (zh) 2016-08-16
KR20170094115A (ko) 2017-08-17
JP2016113525A (ja) 2016-06-23

Similar Documents

Publication Publication Date Title
WO2016093148A1 (ja) 液状エポキシ樹脂組成物、半導体封止剤、半導体装置、および液状エポキシ樹脂組成物の製造方法
JP2011006618A (ja) 封止用液状樹脂組成物、フリップチップ実装体およびその製造方法
JPWO2011129272A1 (ja) 半導体装置
JP5265430B2 (ja) エポキシ樹脂組成物、及び半導体装置
JP6125262B2 (ja) 液状モールド剤、および液状モールド剤の製造方法
JP5593259B2 (ja) 液状エポキシ樹脂組成物
JP6013906B2 (ja) 液状エポキシ樹脂組成物
JPWO2013080732A1 (ja) 一液型エポキシ樹脂組成物
JP2014055245A (ja) 先設置型半導体封止用フィルム
JP6046894B2 (ja) 液状封止材
JP2012056979A (ja) エポキシ樹脂組成物
JP2021119239A (ja) アンダーフィル材、半導体パッケージ及び半導体パッケージの製造方法
JP2010209266A (ja) 半導体封止用液状エポキシ樹脂組成物、及びそれをアンダーフィル材として用いて封止したフリップチップ型半導体装置
JP6837237B2 (ja) ダイボンディング剤
JP5723557B2 (ja) エポキシ樹脂組成物
JP2009269934A (ja) スクリーン印刷用接着剤組成物
TWI664230B (zh) 液狀環氧樹脂組成物
TW201837074A (zh) 液狀環氧樹脂組成物、半導體裝置及半導體裝置的製造方法
JP2013118276A (ja) 半導体装置
JP2013253195A (ja) エポキシ樹脂組成物
WO2014013970A1 (ja) 半導体封止用エポキシ樹脂組成物及び半導体装置の製造方法
WO2021117582A1 (ja) 封止用樹脂組成物、及び半導体装置
JP6758051B2 (ja) 液状エポキシ樹脂組成物、半導体封止剤、および半導体装置
JP2009051970A (ja) 封止用液状エポキシ樹脂組成物および半導体装置
JP5186459B2 (ja) エポキシ樹脂組成物

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15866631

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 20177005859

Country of ref document: KR

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15866631

Country of ref document: EP

Kind code of ref document: A1