WO2016084977A1 - Procédé de fabrication de carte de câblage, dispositif de correction de données, système de formation de motif de câblage, et procédé de correction de données - Google Patents

Procédé de fabrication de carte de câblage, dispositif de correction de données, système de formation de motif de câblage, et procédé de correction de données Download PDF

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Publication number
WO2016084977A1
WO2016084977A1 PCT/JP2015/083604 JP2015083604W WO2016084977A1 WO 2016084977 A1 WO2016084977 A1 WO 2016084977A1 JP 2015083604 W JP2015083604 W JP 2015083604W WO 2016084977 A1 WO2016084977 A1 WO 2016084977A1
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WIPO (PCT)
Prior art keywords
data
pattern
correction
correction function
actual pattern
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PCT/JP2015/083604
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English (en)
Japanese (ja)
Inventor
哲平 山本
中山　肇
荻野　晴夫
聡 磯田
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日立化成株式会社
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Publication of WO2016084977A1 publication Critical patent/WO2016084977A1/fr

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

Definitions

  • the present invention relates to a method for manufacturing a wiring board, a data correction apparatus, a wiring pattern forming system, and a data correction method, and more particularly to manufacturing a wiring board used for manufacturing a wiring board having a fine circuit used in an electronic device or the like.
  • the present invention relates to a method, a data correction apparatus, a wiring pattern forming system, and a data correction method.
  • a direct drawing type exposure apparatus directly irradiating a photosensitive resist with laser light, UV-LED light, etc.
  • DI Direct Imaging
  • AOI Automatic Optical Inspection
  • a method of feeding back inspection data of an inspection apparatus (AOI) of an actual pattern substrate produced in advance for each production lot is conceivable, but the inspection data of the inspection apparatus (AOI) is enormous. Therefore, there is a problem that it takes a long time to process the data to be fed back.
  • the state of the manufacturing process at the time of manufacturing the actual pattern substrate cannot be correctly reflected, and the accuracy is lowered.
  • the present invention has been made in view of the above problems, and in addition to fluctuations in the line width of the wiring pattern depending on the wiring pattern specifications such as pattern gap, pattern size, pattern thickness, pattern position, etc., photosensitive resist, development
  • the line width accuracy at the time of microcircuit formation can be increased by correcting the exposure data with higher accuracy to cope with fluctuations in the line width of the wiring pattern due to changes in the state of the manufacturing process such as solution and etching solution.
  • the purpose is to improve.
  • the difference between the data and the original data or exposure data (C-1), and the relationship between the difference data and the factor causing the difference, the factor causing the difference and the difference are suppressed.
  • the creating step (C-2) a method of manufacturing a wiring board, wherein a plurality of correction functions are created for each region in the surface of the actual pattern board.
  • step (C-2) of creating the plurality of correction functions a primary correction function created using an actual pattern substrate and a secondary correction function created using another actual pattern substrate are
  • step (C-3) of creating the combined correction function created for each area a tertiary correction function obtained by synthesizing the primary correction function and the secondary correction function is created for each area of the actual pattern substrate, and the original correction function is created.
  • Item 4 The wiring board according to Item 1, wherein in the step of correcting data or exposure data (C-4), the original data or exposure data of the wiring pattern of the actual pattern board is corrected for each region using the cubic correction function. Manufacturing method.
  • step (C-2) of creating the plurality of correction functions separately from the secondary correction function, another secondary correction function created using another actual pattern substrate is created, Item 3.
  • the step (C-3) of creating the synthesized correction function creates the other third-order correction function by synthesizing the third-order correction function and the other created second-order correction function.
  • a method for manufacturing a wiring board (4)
  • the step (C-2) of creating the plurality of correction functions the actual pattern substrate used to create the primary correction function and other actual functions used to create other secondary correction functions are used.
  • Item 4. The method for manufacturing a wiring board according to Item 2 or 3, wherein the pattern board or another actual pattern board has the same wiring pattern.
  • step (C-2) of creating the plurality of correction functions another secondary correction function created after the secondary correction function is generated for each production lot of the actual pattern substrate or for each actual pattern substrate.
  • Item 5 The method for manufacturing a wiring board according to any one of Items 2 to 4, which is created.
  • Factors that cause a difference between the actual pattern data and the original data or exposure data include the pattern gap, pattern size, pattern thickness, and pattern position of the original data or exposure data of the wiring pattern of the actual pattern substrate.
  • Item 6. The method for manufacturing a wiring board according to any one of Items 1 to 5, which is any one or a combination of any two or more.
  • the pattern gap, pattern size, pattern thickness, pattern position of the original data or exposure data of the wiring pattern of the actual pattern substrate Item 7 As a factor causing a difference between the actual pattern data and the original data or exposure data, the pattern gap, pattern size, pattern thickness, pattern position of the original data or exposure data of the wiring pattern of the actual pattern substrate Item 7.
  • a correction function obtained by combining the plurality of correction functions is created (C-3), and the original data of the wiring pattern corrected using the correction function created by combining the plurality of correction functions Alternatively, exposure data correction data is generated (C-4), and when the plurality of correction functions are generated (C-2), a plurality of correction functions are generated for each region in the surface of the actual pattern.
  • Correction device When creating a plurality of correction functions (C-2), a primary correction function created using an actual pattern substrate and a secondary correction function created using another actual pattern substrate are When creating the combined correction function created for each region (C-3), a tertiary correction function combining the primary correction function and the secondary correction function is created for each region of the actual pattern substrate, The data according to item 8, wherein the original data or the exposure data is corrected (C-4) by correcting the original data or the exposure data of the wiring pattern of the real pattern substrate for each region using the cubic correction function. Correction device. (10) When creating the plurality of correction functions (C-2), in addition to the secondary correction function, another secondary correction function created using another actual pattern substrate is added for each region.
  • the third correction function and the other generated second correction function are combined to generate another third correction function for each region.
  • Item 10 The data correction device according to Item 9, which is created.
  • the actual pattern substrate used to create the primary correction function and other secondary correction functions used to create other secondary correction functions Item 11.
  • the data correction device according to Item 9 or 10 wherein the actual pattern substrate or another actual pattern substrate has the same wiring pattern.
  • another secondary correction function created after the secondary correction function is set for each production lot of real pattern substrates or for each real pattern substrate. Item 12.
  • Factors causing a difference between the actual pattern data and the original data or exposure data are the pattern gap, pattern size, pattern thickness, and pattern position of the original data or exposure data of the wiring pattern of the actual pattern substrate.
  • Item 13 The method for manufacturing a wiring board according to any one of Items 8 to 12, which is any one or a combination of any two or more.
  • the pattern gap, pattern size, pattern thickness, pattern position of the original data or exposure data of the wiring pattern of the actual pattern substrate Item 14.
  • a pattern exposure device that exposes an exposure pattern to a photosensitive resist disposed on a substrate, a development pattern forming device that develops the photosensitive resist exposed to the exposure pattern to form a development pattern, and the development pattern
  • a wiring pattern forming system comprising: an actual pattern forming apparatus that forms a real pattern by performing circuit processing on the substrate on which the circuit pattern is formed; and an actual pattern data generating apparatus that generates actual pattern data from the actual pattern.
  • a data correction method for wiring pattern original data or exposure data using the data correction device using the data correction device according to any one of items 8 to 14, wherein the original wiring pattern original data or the original data
  • a step (C-1) of creating difference data from the difference between the exposure data created based on the actual pattern data created from the actual pattern substrate formed using the exposure data, and the difference data and the difference A step of creating a plurality of correction functions defining a relationship between a factor causing the difference and a correction amount of the original data or a correction amount of the exposure data for suppressing the difference from a relationship with the factor to be generated ( C-2), a step (C-3) of creating a correction function by combining the plurality of correction functions, and a correction function using the correction function generated by combining the plurality of correction functions.
  • the present invention in addition to fluctuations in the line width of the wiring pattern due to the wiring pattern specifications such as the pattern gap, pattern size, pattern thickness, pattern position, etc., the state of the manufacturing process of the photosensitive resist, developer, etching solution, etc. It is possible to improve the line width accuracy when forming a fine circuit by correcting the exposure data with higher accuracy to cope with the fluctuation of the line width of the wiring pattern due to the change.
  • the manufacturing method of the wiring board of one Embodiment of this invention is shown.
  • the wiring pattern (test pattern) used by one Embodiment of this invention is shown.
  • substrate A used by one Embodiment of this invention is shown.
  • substrate B used by one Embodiment of this invention is shown.
  • substrate C used by one Embodiment of this invention is shown.
  • the linear correction function produced in one Embodiment of this invention is shown.
  • the secondary correction function created in one embodiment of the present invention is shown. 3 shows a cubic correction function created in an embodiment of the present invention.
  • the other secondary correction function and other tertiary correction function which were produced in one embodiment of the present invention are shown.
  • the block diagram of the data correction apparatus of one Embodiment of this invention is shown.
  • the schematic of the wiring pattern formation system of one Embodiment of this invention is represented.
  • the primary correction function of Example 1 is shown.
  • the secondary correction function of Example 1 is shown.
  • the tertiary correction function of Example 1 is shown.
  • 1 is a schematic view of an actual pattern substrate of Example 1.
  • substrate of Example 2 is shown.
  • the method for manufacturing a wiring board according to the present embodiment first includes a step (A) of creating exposure data based on original data of a target wiring pattern.
  • the target wiring pattern is a wiring pattern to be formed as an actual pattern after circuit processing, and includes a product pattern for functioning as a wiring board and a test pattern for creating a correction function described later.
  • the actual pattern is a wiring pattern of an actual pattern substrate that is actually formed by performing circuit processing.
  • the target wiring pattern is not particularly limited, and any wiring pattern can be used.
  • the original data of the wiring pattern is the design data of the target wiring pattern, and the target wiring pattern to be formed is quantified and expressed by, for example, numerical values of coordinates and pattern widths and coordinates and pattern gaps. is there. You may have the data to which the information required for exposure was added.
  • the original data is created using a device (CAD: Computer Aided Design) that creates design data.
  • Exposure data refers to data for forming an exposure pattern corresponding to a wiring pattern by exposing a photosensitive resist to pattern exposure means such as a linear drawing apparatus using laser light or UV light.
  • the exposure data is created using a device (CAM: Computer Aided Manufacturing) that creates exposure data based on the original data.
  • CAM Computer Aided Manufacturing
  • the method for manufacturing a wiring board according to the present embodiment includes a step (B) of creating actual pattern data from the actual pattern board formed using the exposure data.
  • the process (B) for creating actual pattern data includes a pattern exposure process (B-1), a development pattern formation process (B-2), an actual pattern formation process (B-3), and a pattern inspection process (B-4). Have.
  • the exposure pattern corresponding to the wiring pattern is exposed to a photosensitive resist by a pattern exposure apparatus such as a linear drawing apparatus using laser light or UV light.
  • a pattern exposure apparatus such as a linear drawing apparatus using laser light or UV light.
  • the pattern exposure apparatus refers to an exposure apparatus that exposes an exposure pattern to a photosensitive resist disposed on a substrate based on exposure data.
  • Examples of the pattern exposure apparatus include a direct drawing apparatus (DI: Direct Imaging) that directly exposes an exposure pattern to a photosensitive resist using laser light or UV-LED light.
  • DI Direct Imaging
  • the photosensitive resist refers to an etching resist or a plating resist used for forming a wiring pattern by etching a metal foil such as a copper foil or plating a metal such as copper by a photolithography method.
  • An exposure pattern refers to a pattern exposed to a photosensitive resist based on exposure data, and corresponds to a development pattern formed by subsequent development.
  • the photosensitive resist is removed while leaving an exposure pattern formed by pattern exposure and necessary for actual pattern formation.
  • the development pattern refers to a pattern that appears by developing the photosensitive resist after exposure.
  • the developing pattern forming apparatus may be a developing apparatus that develops a photosensitive resist having an exposed exposure pattern to form a developing pattern.
  • circuit processing is performed to manufacture an actual pattern substrate having an actual pattern.
  • the circuit processing refers to forming an actual pattern, and includes, for example, forming a conductor pattern by etching a metal foil by a subtract method.
  • the actual pattern refers to a conductor pattern that is actually formed by performing circuit processing, and can be formed by an actual pattern forming apparatus.
  • the actual pattern forming apparatus refers to an apparatus that forms a real pattern by performing circuit processing on a substrate on which a development pattern is formed, and includes an etching apparatus.
  • the actual pattern substrate means a substrate having a conductor pattern (actual pattern) actually formed by performing circuit processing, for example, a substrate having a conductor pattern obtained by etching a metal foil by a subtract method.
  • the actual pattern data refers to finished data obtained from an actual pattern using an optical appearance inspection apparatus (AOI: Automatic Optical Inspection), a measurement microscope, or the like.
  • the optical appearance inspection apparatus generally detects light reflected from the upper surface (top) of an actual pattern, digitizes the pattern, and sets the data as numerical values such as coordinates, pattern width, and pattern gap.
  • the measurement microscope in this embodiment can be used to measure and convert the line width of both the upper surface (top) of the actual pattern and the bottom surface (bottom) of the actual pattern. .
  • the wiring pattern forming method of the present embodiment includes a step (C) of creating correction data of the original data or exposure data based on the difference between the original data or exposure data and the actual pattern data.
  • the correction data of the original data or exposure data refers to original data or exposure data after correction, that is, corrected original data or exposure data. Further, as shown in FIG.
  • a step (C-1) for creating difference data from the difference between the actual pattern data and the original data or exposure data, and this difference A step of creating a plurality of correction functions defining a relationship between a factor causing a difference and a correction amount of original data or a correction amount of exposure data for suppressing the difference from a relationship between the data and a factor causing the difference ( C-2), a step of creating a correction function by combining the plurality of correction functions (C-3), and a step of correcting the original data or exposure data of the wiring pattern using the combined correction function (C-4) )have.
  • the relationship between the transfer direction of the actual pattern substrate and the direction in which the etching solution hits changes depending on the position of the wiring pattern, even within one of the front and back surfaces of the actual pattern substrate. Therefore, the etching process tends to have uneven directionality and etching amount.
  • the in-plane of the actual pattern substrate is divided into a plurality of regions, and a plurality of correction functions are created for each of these regions.
  • unevenness in the thickness of the copper foil due to variations in the plating thickness is also added.
  • ⁇ Process (C-1)> In the step (C-1) of creating difference data from the difference between the actual pattern data and the original data or exposure data, the actual pattern data obtained in the pattern inspection step (B-4) is compared with the original data or exposure data. From this, differential data is created.
  • the difference between the actual pattern data and the original data or exposure data of the actual pattern is specifically the pattern gap, pattern width, etc. between the actual pattern data and the actual pattern original data or exposure data at the same coordinates.
  • the same coordinates are the same coordinates in the original data (design data), and the pattern gaps and the like are the same design values at the same coordinates.
  • a difference in pattern gaps or the like at the same coordinates indicates a difference obtained by comparing portions having the same design value in the wiring pattern.
  • the difference data refers to data representing this difference by coordinates, pattern gaps, pattern widths, and the like.
  • the difference data can be created using a computer from the difference between the actual pattern data and the original data of the actual pattern or the exposure data.
  • the correction amount of the original data for suppressing the difference or the exposure data A plurality of correction functions that define the relationship with the correction amount are created.
  • the factor causing the difference between the actual pattern data and the original data or the exposure data is that the actual pattern data and the original data or the exposure are changed by the fluctuation in the wiring pattern specification of the original data or the exposure data.
  • a factor that causes a change in the difference from data As such factors, for example, the original data of the actual pattern or the pattern gap of the exposure data, the pattern width, the pattern size, the pattern thickness, the pattern position, or any combination of two or more thereof can be cited.
  • the correction amount of the original data or the exposure data for suppressing the difference for example, the difference itself between the actual pattern data and the original data or exposure data of the actual pattern can be used. This is because if the correction is made such that the difference between the actual pattern data and the original data or exposure data of the actual pattern is added to or subtracted from the current original data or exposure data, the actual pattern data approaches the value of the original data or exposure data. It is because.
  • a plurality of correction functions are created for each region in the surface of the actual pattern substrate.
  • the method for setting the region is not particularly limited, and examples thereof include a method of dividing the region in the vertical direction and the horizontal direction.
  • the number of regions is not particularly limited and can be arbitrarily divided.
  • the number of regions, which are units for creating a plurality of correction functions is more distributed to the peripheral portion of the edge than to the central portion in the plane of the actual pattern substrate. Is desirable. In addition, it is desirable that the size of the region, which is a unit for generating a plurality of correction functions, be smaller in the peripheral portion of the end portion than in the central portion of the actual pattern substrate. Furthermore, it is desirable that the region, which is a unit for generating a plurality of correction functions, be set based on the conductor thickness of the actual pattern substrate.
  • the thickness of the copper foil due to the variation of the plating thickness is also added, so the line width of the actual pattern etc. compared to the center part of the actual pattern board
  • the correction function defines the relationship between the factor causing the difference and the correction amount of the original data or exposure data for suppressing the difference from the relationship between the factor causing the difference and the difference data.
  • the correction function is a computer having a calculation function for obtaining a relationship between a factor causing a difference and a correction amount of the original data or exposure data for suppressing the difference from a relationship between the factor causing the difference and the difference data.
  • FIG. 6 shows an example in which the correction function is created using the pattern gap of the wiring pattern of the actual pattern substrate as a factor that causes the difference between the actual pattern data and the original data or the exposure data. That is, in the correction function of FIG. 6, the horizontal axis represents the pattern gap of the wiring pattern of the actual pattern substrate, and the vertical axis represents the correction amount.
  • any of the pattern gap, pattern size, pattern thickness, and pattern position of the original data or exposure data of the wiring pattern of the actual pattern substrate Alternatively, it is desirable to use actual pattern data corresponding to any combination of two or more.
  • the horizontal axis is the pattern gap of the wiring pattern of the actual pattern substrate.
  • data used as the numerical value of the pattern gap include the original data of the wiring pattern of the actual pattern substrate, the exposure data, Real pattern data can be considered.
  • the correction function indicates the relationship between the original data or exposure data of the pattern gap and the correction amount for the original data or exposure data, and the correction amount is the actual pattern data and the original data.
  • it is based on the difference data with the exposure data, even in this case, it is possible to obtain a correction amount that is somewhat accurate with respect to the original data or exposure data of the pattern gap.
  • the correction amount with respect to the original data or the exposure data is based on the difference data when the actual pattern data (finished value) is different from the original data (design value), and is actually obtained. Since the actual pattern data (finished value) is finished as the original data (design value), that is, the correction amount for matching the original data (design value) and the actual pattern data (finished value) It is conceivable that there is a deviation from the correction amount based on the difference data when the actual pattern data (finished value) is different from the original data (design value).
  • the correction function is the actual pattern data (actual measurement value) of the pattern gap.
  • the correction amount with respect to the original data or exposure data can be regarded as the target original data (design value) or exposure data.
  • Value) is a correction amount for obtaining target original data (design value) or exposure data.
  • the correction function is a factor that causes a change in the difference between the actual pattern data and the original data or the exposure data, which is a wiring pattern in which the pattern gap, pattern width, pattern size, pattern thickness, pattern position, etc. are changed. It can create using the some real pattern board
  • a wiring pattern used to create a correction function a wiring pattern used as a product of a wiring board can be used.
  • factors that cause a difference in FIG. 2, a pattern gap, a pattern It is desirable to use a test pattern in which the width, pattern shape, and pattern size) are changed, because necessary data can be easily obtained and a correction function with higher accuracy can be created.
  • an actual pattern substrate (hereinafter referred to as a test pattern substrate) is used in which a large number of relatively small area test patterns having the same wiring pattern are arranged in the actual pattern substrate.
  • a test pattern substrate it is desirable in that data relating to the same wiring pattern specification can be acquired over the entire actual pattern substrate, and data relating to variations in the actual pattern substrate can also be acquired.
  • a primary correction function created for each region using a real pattern substrate and another real pattern substrate And a quadratic correction function created for each region is created.
  • the other actual pattern substrate means an actual pattern substrate different from the actual pattern substrate when the primary correction function is created, and the wiring pattern itself may be the same or different. Absent. In this way, by creating the primary correction function and the secondary correction function separately, for example, using the actual pattern substrate on which the test pattern is arranged, the reference primary correction function is created and actually created.
  • a secondary correction function that reflects the state of the production line at that time is created again using another actual pattern board, and then these primary corrections are made.
  • a function and a quadratic correction function can be synthesized. That is, based on the primary correction function serving as a reference, correction to a more appropriate correction function according to the production line situation can be performed using the secondary correction function.
  • the actual pattern substrate used to create the primary correction function and the other actual pattern substrate used to create another secondary correction function have the same wiring pattern.
  • a plurality of correction functions may be created using a plurality of actual pattern substrates having the same wiring pattern or a plurality of actual pattern substrates having different wiring patterns, but the former is corrected. It is desirable in that the accuracy of the function can be increased. For example, as shown in FIGS. 3, 4, and 5, the actual pattern substrate A (FIG. 3), the actual pattern substrate B (FIG. 4), and the actual pattern substrate C (FIG. 5) have the same test pattern. Thus, even if the wiring pattern of other portions changes, it is possible to always create a correction function using the same test pattern portion.
  • the secondary correction function is created for each production lot of the actual pattern substrate or for each actual pattern substrate. This makes it possible to create a correction function that reflects the state of the manufacturing process when manufacturing an actual pattern substrate.
  • ⁇ Process (C-3)> In the step (C-3) of creating a correction function by combining a plurality of correction functions, a plurality of correction functions created for each region in the step (C-2) of generating a plurality of correction functions are combined to make one correction. Create a function for each region.
  • a tertiary correction function obtained by synthesizing the primary correction function and the secondary correction function is created for each area of the actual pattern substrate.
  • a primary correction function serving as a reference is created for each region using an actual pattern substrate, and then, as shown in FIG.
  • a secondary correction function is created for each region using the pattern substrate, and a primary correction function and a secondary correction function are synthesized for each region as shown in FIG.
  • the primary correction function as a reference is always fixed, a stable tertiary correction function can be obtained, so that the secondary correction function created for each lot of actual pattern substrates or for each actual pattern substrate is measured. Even if errors or irregular measured values are included, the influence can be reduced.
  • a weighted average obtained by increasing the combination ratio of correction functions created using a larger amount of data is used. Desirable for accuracy improvement. For example, a primary correction function using a large amount of difference data is created as a reference correction function, and then compared as a secondary correction function that reflects the state of the manufacturing process when an actual pattern substrate is manufactured. When creating a secondary correction function using a small amount of difference data and combining these primary correction function and secondary correction function, increase the combination ratio of the primary correction function as a reference to increase the measurement error. And the effects of irregular data can be suppressed.
  • the composition ratio at the time of the weighted average may be arbitrarily set according to the number of difference data when creating the correction function, the state of the manufacturing process, etc.
  • the composite ratio of the primary correction function used as a reference and the secondary correction function created when manufacturing the actual pattern substrate is set in the range of 0.3 to 0.7. It is desirable to do.
  • the composition ratio refers to the ratio of the secondary correction function when the total of the primary correction function and the secondary correction function is set to 1.
  • ⁇ Process (C-4)> In the step (C-4) of correcting the original data or exposure data of the wiring pattern using the combined correction function, a difference is generated in the difference between the actual pattern data and the original data or exposure data using the combined correction function. By calculating the correction amount corresponding to the pattern gap, pattern width, etc., which are factors to be added, and adding or subtracting the obtained correction amount to the original data or exposure data, wiring is performed for each area of the actual pattern substrate The pattern original data or exposure data is corrected.
  • the original data or the exposure data of the wiring pattern of the actual pattern substrate is corrected using a tertiary correction function.
  • a plurality of correction functions are synthesized in this way to create a basic primary correction function and cope with variations in the manufacturing process. Even when creating a secondary correction function with less data than one correction function at the same time as the pattern substrate is manufactured, the effects of measurement errors and irregular measurement values can be reduced. An appropriate correction function reflecting the situation can be obtained. For this reason, it is suitable when the state of the production process hardly changes due to an increase in the number of production and the like and is relatively stable. In addition, a plurality of correction functions are created for each region in the surface of the actual pattern substrate.
  • the wiring pattern due to changes in the state of the manufacturing process such as photosensitive resist, developer, etching solution, etc.
  • the line width accuracy at the time of forming a fine circuit can be improved by correcting the exposure data with higher accuracy to cope with the fluctuation of the line width.
  • Steps (A), (B), (C-1)> As in the first embodiment, first, steps (A), (B), and (C-1) are performed, and difference data is created from the difference between the actual pattern data and the original data. To do.
  • step (C-2) for creating a plurality of correction functions a primary correction function created using an actual pattern substrate and a secondary correction function created using another actual pattern substrate are created for each region. To do. Thereafter, in addition to this secondary correction function, another secondary correction function created using another actual pattern substrate is created for each region.
  • a tertiary correction function by combining the primary correction function and the secondary correction function is generated for each region.
  • this tertiary correction function and another secondary correction function further created in the step (C-2) are combined to create another tertiary correction function for each region.
  • a primary correction function is created for each region using an actual pattern substrate, and then, as shown in FIG. 7, different from this primary correction function.
  • a secondary correction function is created for each region, and as shown in FIG. 8, a primary correction function and a secondary correction function are combined to create a tertiary correction function for each region.
  • a secondary correction function is further created and combined with the tertiary correction function to create another tertiary correction function for each region.
  • the third-order correction function is obtained by repeatedly accumulating the second-order correction function and the composition, the second-order correction function produced for each actual pattern substrate production lot or each actual pattern substrate has measurement errors and irregularities. Even if the measurement value is included, the influence can be reduced.
  • the data correction apparatus of the present embodiment uses a computer, and the computer includes a processing unit (processor), a display unit, an input unit, a storage unit, a communication unit, and each of these components. It has a bus for connecting parts.
  • the display unit displays an image output by a program executed on the computer.
  • the input unit accepts input, and is, for example, a keyboard or a mouse.
  • the storage unit can store information such as a nonvolatile memory, a volatile memory, and a hard disk.
  • the storage unit stores data such as original data, exposure data, actual pattern data, difference data, correction function, correction data, and the process up to correcting the original data or exposure data (correction data creation process (C) in FIG. 1). ) Is stored.
  • the communication unit performs wireless communication or wired communication using a USB cable or the like. Original data, exposure data, actual pattern data, difference data, and the like may be acquired via the communication unit.
  • the processing unit executes a process for correcting original data or exposure data (correction data creation process (C) in FIG. 1).
  • the data correction apparatus does not need to be a general-purpose computer, and may be realized by hardware for executing all or a part of each process and software operating in cooperation therewith.
  • the data correction apparatus of the present embodiment is the original data of the target wiring pattern or the exposure data created based on this original data. And difference data is created from the difference between the actual pattern data created from the actual pattern substrate formed using the exposure data.
  • FIG. 6 shows an example in which the correction function is created using the pattern gap of the wiring pattern as a factor that causes a difference between the actual pattern data and the original data or the exposure data. That is, in the correction function of FIG. 6, the horizontal axis represents the pattern gap of the wiring pattern, and the vertical axis represents the correction amount.
  • a primary correction function created using an actual pattern substrate and another actual pattern substrate are used as the plurality of correction functions.
  • the secondary correction function created in the above is created for each region.
  • the reference primary correction function is created and actually created.
  • a secondary correction function that reflects the current production line status is created again using another actual pattern board, and then these primary corrections are made.
  • a function and a quadratic correction function can be synthesized. That is, based on the primary correction function serving as a reference, correction to a more appropriate correction function according to the production line situation can be performed using the secondary correction function.
  • a tertiary correction function obtained by synthesizing the primary correction function and the secondary correction function is created for each region.
  • a primary correction function serving as a reference is created for each region using an actual pattern substrate, and then, as shown in FIG.
  • a secondary correction function is created for each region using the pattern substrate, and a primary correction function and a secondary correction function are synthesized for each region as shown in FIG.
  • the primary correction function serving as a reference is always fixed, a stable tertiary correction function can be obtained, so the secondary correction function produced for each production lot of the actual pattern substrate or for each actual pattern substrate is Even if measurement errors and irregular measurement values are included, the influence can be reduced.
  • the original data or exposure data is corrected (C-4)
  • the original data or exposure data of the wiring pattern of the actual pattern substrate is corrected for each region using a tertiary correction function.
  • a plurality of correction functions may be created using a plurality of actual pattern substrates having the same wiring pattern or a plurality of actual pattern substrates having different wiring patterns, but the former is corrected. It is desirable in that the accuracy of the function can be increased. For example, as shown in FIGS. 3, 4, and 5, the actual pattern substrate A (FIG. 3), the actual pattern substrate B (FIG. 4), and the actual pattern substrate C (FIG. 5) have the same test pattern. Thus, even if the wiring pattern of other portions changes, it is possible to always create a correction function using the same test pattern portion.
  • C-2 When creating a plurality of correction functions (C-2), another secondary correction function created after the secondary correction function is created for each production lot of the actual pattern substrate or for each actual pattern substrate. Is desirable. This makes it possible to create a correction function that reflects the state of the manufacturing process when manufacturing an actual pattern substrate.
  • the photosensitivity Lines at the time of microcircuit formation can be dealt with by correcting exposure data with higher accuracy even for fluctuations in the line width of wiring patterns due to changes in the state of manufacturing processes such as resist, developer, and etchant.
  • the width accuracy can be improved.
  • the data correction apparatus according to the present embodiment has the configuration shown in FIG. 10 as with the data correction apparatus according to the third embodiment described above.
  • a primary correction function is created for each region using an actual pattern substrate, and then, as shown in FIG. 7, different from this primary correction function.
  • a secondary correction function is created for each region, and as shown in FIG. 8, a primary correction function and a secondary correction function are combined to create a tertiary correction function for each region.
  • a secondary correction function is further created and combined with the tertiary correction function to create another tertiary correction function for each region.
  • the third-order correction function is obtained by repeatedly accumulating the second-order correction function and the composition, the second-order correction function produced for each actual pattern substrate production lot or each actual pattern substrate has measurement errors and irregularities. Even if the measurement value is included, the influence can be reduced.
  • the same operation and effect as those of the third embodiment can be obtained, and the tertiary correction function used for correcting the original data or the exposure data is obtained by repeatedly accumulating the secondary correction function. Therefore, more stable correction can be performed when the state of the manufacturing process tends to fluctuate in a specific direction due to the accumulation of the number of productions.
  • the wiring pattern forming system of the present embodiment first has a data correction device.
  • a computer is used as the data correction apparatus.
  • the computer includes a processing unit (processor), a display unit, an input unit, a storage unit, a communication unit, and each of these components. It has a bus to be connected.
  • the substrate means a substrate having a metal foil such as copper foil or copper plating on an insulating layer such as glass epoxy, and examples thereof include a copper clad laminate.
  • a pattern exposure apparatus refers to an exposure apparatus that exposes an exposure pattern to a photosensitive resist disposed on a substrate based on exposure data. Examples thereof include a direct drawing apparatus (DI: Direct Imaging) that directly exposes an exposure pattern on a photosensitive resist using laser light or UV-LED light.
  • DI Direct Imaging
  • the development pattern forming apparatus for developing a photosensitive resist having an exposed exposure pattern to form a development pattern.
  • An example of the development pattern forming apparatus is a development apparatus used in photolithography.
  • an actual pattern forming apparatus that forms a real pattern by performing circuit processing on the substrate on which the development pattern is formed.
  • Examples of the actual pattern forming apparatus include an etching apparatus and a plating apparatus used in circuit processing of a wiring board.
  • an actual pattern data creation device for creating actual pattern data from the actual pattern.
  • the actual pattern data creation device include an optical appearance inspection device (AOI: Automatic Optical Inspection), a measurement microscope, and the like.
  • the optical appearance inspection apparatus detects light reflected from the upper surface (top) of an actual pattern, digitizes the pattern, and sets the data as numerical values such as coordinates, pattern width, and pattern gap.
  • the measurement microscope can be used to measure the line width and convert it into data for either the upper surface (top) or the lower surface (bottom) of the actual pattern.
  • the data correction device receives the actual pattern data from the actual pattern data creation device, and as shown in FIG. 1, from the difference between the actual pattern data and the original data or exposure data.
  • Difference data is created (C-1), and the relationship between the factor causing the difference and the correction amount of the original data or the correction amount of the exposure data for suppressing the difference from the relationship between the difference and the factor causing the difference Are created for each region (C-2), a correction function obtained by synthesizing the plurality of correction functions is created for each region (C-3), and a wiring pattern is created using the synthesized correction function.
  • the original data or exposure data is corrected for each area (C-4).
  • the wiring pattern forming system of the present embodiment in the same manner as in the first embodiment, in addition to fluctuations in the line width of the wiring pattern due to the wiring pattern specifications such as pattern gap, pattern size, pattern thickness, pattern position, etc.
  • the exposure data can be corrected with higher accuracy to cope with fluctuations in the line width of the wiring pattern due to changes in the state of the manufacturing process such as the resist, developer, and etchant. Line width accuracy can be improved.
  • the data correction method of the present embodiment uses the data correction neglect shown in FIG. 10, and as shown in the correction data creation step of FIG. 1, the original data of the target wiring pattern or the original data A step (C-1) of creating difference data from the difference between the exposure data created based on the actual pattern data created from the exposure pattern and the actual pattern substrate formed using the exposure data, and the difference data and the difference A plurality of correction functions that define the relationship between the factor that causes the difference and the correction amount of the original data or the correction amount of the exposure data for suppressing the difference for each region.
  • the wiring pattern forming system of the present embodiment in the same manner as in the first embodiment, in addition to fluctuations in the line width of the wiring pattern due to the wiring pattern specifications such as pattern gap, pattern size, pattern thickness, pattern position, etc.
  • the exposure data can be corrected with higher accuracy to cope with fluctuations in the line width of the wiring pattern due to changes in the state of the manufacturing process such as the resist, developer, and etchant. Line width accuracy can be improved.
  • Example 1 ⁇ Create primary correction function> First, in order to create a primary correction function, a thickness of 0.22 mm having a copper foil of 5 ⁇ m on the front and back of an insulating layer as a substrate for producing an actual pattern substrate C4c on which the test pattern 1 and the product pattern 7 are arranged. On the copper foil of the copper clad laminate of MCL-E-700G (trade name, manufactured by Hitachi Chemical Co., Ltd., “MCL” is a registered trademark) having a length of 440 mm and a width of 510 mm, an electroplating of about 9 ⁇ m is applied. What prepared the total copper thickness of each surface of front and back about 14 micrometers was prepared.
  • the original data (design value) of the test pattern shown in FIG. 2 is a linear wiring in which the pattern width (width of pattern 3) is fixed at 100 ⁇ m and the pattern gap 2 is changed in 24 steps within the range of 14 to 150 ⁇ m.
  • the patterns are arranged in the vertical and horizontal directions for each of the front and back surfaces, and the initial exposure data created based on this original data is the same as the original data (design value).
  • FIG 5 shows an outline of the actual pattern substrate C4c.
  • the product pattern 7 there are 11 test patterns 1 in the vertical direction, 11 in the horizontal direction, and 121 in total. Were evenly arranged in the front and back surfaces of the actual pattern substrate C4c.
  • Actual pattern data (finished value) was obtained for the actual pattern substrate C4c using an optical automatic visual inspection apparatus.
  • the number of measurement points at this time is one for each of the vertical and horizontal linear wiring patterns for each test pattern.
  • 121 points each for the linear wiring patterns in the vertical direction and the horizontal direction 121 points each for the linear wiring patterns in the vertical direction and the horizontal direction
  • a total of 9 points is 1089 points for each surface for the linear wiring patterns in the vertical direction and the horizontal direction.
  • the difference data was created.
  • the actual pattern data (finished value) is obtained as 1089 points (121 points per sheet) of actual pattern data (finished value) for each surface for each of the 24 pattern gaps. (For every 121 points).
  • the relationship with the transport direction of the actual pattern substrate, the direction of contact with the etching solution, etc. changes depending on the position of the wiring pattern.
  • the directionality and the etching amount tend to be uneven.
  • the unevenness of the thickness of the copper foil (conductor) due to the variation of the plating thickness is also added, so this tendency is further strong.
  • the in-plane of the actual pattern substrate is divided into a plurality of regions based on the distribution of the thickness of the copper foil (conductor), and the copper foil (conductor) is compared with the central portion of the actual pattern substrate.
  • the regions are divided more finely and a primary correction function is created for each of these regions.
  • the design value (unit: ⁇ m) of the pattern gap shown in the table of FIG. 12 is a numerical value of the pattern gap (factor causing the difference) of the original data of the test pattern.
  • the finished value (unit: ⁇ m) of the pattern gap is an actual measurement value of the pattern gap acquired from actual pattern data using an optical automatic visual inspection apparatus.
  • the one-side correction amount (unit: ⁇ m) is the exposure data correction amount for suppressing the difference between the finished value of the pattern gap and the original data, and was obtained by the following equation (1).
  • the one-side correction amount is used to correct the same amount on both sides of the pattern gap when correcting the exposure data.
  • One-side correction amount ( ⁇ m) (finish value of pattern gap ( ⁇ m) ⁇ design value ( ⁇ m)) / 2 (1)
  • the correction processing to the exposure data of the product pattern 7 using the primary correction function is performed, for example, in the exposure data of the product pattern 7 where the finished value of the pattern gap in the table of FIG. From the data of 28.5 ⁇ m (one-side correction amount is 4.3 ⁇ m) and the finished value is 33.2 ⁇ m (one-side correction amount is 5.6 ⁇ m), the value of the one-side correction amount when the finished value is 30 ⁇ m is It was obtained by calculation on the assumption that it was on a straight line connecting the data.
  • the one-side correction amount is 4.7 ⁇ m, and is for exposure data (here, it means initial exposure data and is the same as the original data). Correction processing for narrowing the pattern gap by 4.7 ⁇ m on one side was performed.
  • the exposure data after the pattern gap correction processing is set to 20.6 ⁇ m at the portion where the design data (design value) of the pattern gap of the product pattern 7 is 30 ⁇ m.
  • a primary correction function used for correcting the original data or exposure data of a product pattern (not shown) arranged on the actual pattern substrate C4c is created using the test pattern 1 having the closest positional relationship to each product pattern. The first order correction function was used.
  • the exposure data of the product pattern 7 (here, the initial exposure data means the same as the original data) is subjected to a correction process using the primary correction function created above, and the exposure data of the test pattern 1 The correction process was not applied to.
  • test pattern 1 an actual pattern is always created using the same exposure data as when the primary correction function was created, and actual pattern data for creating the secondary correction function is collected.
  • FIG. 5 shows an outline of the actual pattern substrate C4c.
  • a total of 42 test patterns 1 are actually arranged in the actual pattern substrate C4c.
  • the positions of 42 test patterns 1 arranged in the actual pattern substrate C4c in the actual pattern substrate C4c are 42 points in the actual pattern substrate C4c used to create the primary correction function shown in FIG. This corresponds to the position of the test pattern 1.
  • actual pattern data (finished value) was obtained for the actual pattern substrate C4c using an optical automatic visual inspection apparatus.
  • the number of measurement points at this time is 42 points.
  • Actual pattern data was acquired only for six stages of 60, 80, and 130 ⁇ m.
  • the actual pattern data is averaged for every 42 points, and this averaged actual pattern data is used to create a primary correction function, as shown in FIG. A quadratic correction function as shown in FIG.
  • the pattern gap 2 at other stages was obtained by calculation assuming that the pattern gap 2 was on a straight line connecting the actual pattern data of the pattern gap 2 at the stage where the actual pattern data was obtained. That is, although not shown in the table of FIG. 13, actual pattern data was actually acquired only for six stages, and based on this, the actual pattern data for all 24 stages were estimated. As a result, the actual pattern data to be acquired is reduced and the data processing load is reduced.
  • FIG. 14 shows a case where the composition ratio (ratio) of correction amounts by the primary correction function is 0.5. Specifically, when the composition ratio (ratio) of the correction amounts by the primary correction function is 0.5, the composition ratio (ratio) of the correction amounts by the secondary correction function is 0.5.
  • the one-side correction amount was synthesized by the following equation (2).
  • One-sided correction amount ( ⁇ m) of tertiary correction function one-sided correction amount ( ⁇ m) of primary correction function ⁇ 0.5 + Secondary correction function one-side correction amount ( ⁇ m) ⁇ 0.5 (2)
  • the one-side correction amount data at the time of creating the secondary correction function is obtained only for the pattern gaps in six steps, which is smaller than the 24 steps at the time of creating the primary correction function. It was estimated by calculation so as to obtain data for the same 24 stages as when the primary correction function was created.
  • the correction process to the exposure data of the product pattern 7 using the tertiary correction function includes, for example, a combination ratio (ratio) of the correction amount by the primary correction function to the correction amount by the primary correction function and the correction amount by the secondary correction function.
  • ratio a combination ratio
  • the finished value of the pattern gap in the table of FIG. 14 is 26.8 ⁇ m (one-side correction amount is 3.4 ⁇ m).
  • the one-side correction amount value when the finishing value is 30 ⁇ m is on a straight line connecting these data. Obtained by calculation.
  • the one-side correction amount is 4.2 ⁇ m
  • exposure data in this case, it means initial exposure data, not corrected exposure data, (Same as the data.) Correction processing for narrowing the pattern gap by 4.2 ⁇ m on one side was performed.
  • the exposure data after the pattern gap correction processing is set to 21.6 ⁇ m at the portion where the design data (design value) of the pattern gap of the product pattern 7 is 30 ⁇ m.
  • a tertiary correction function used for correcting the original data or exposure data of a product pattern (not shown) arranged on the actual pattern substrate C4c is created using the test pattern 1 having the closest positional relationship to each product pattern.
  • a cubic correction function was used.
  • the third-order correction function created above is used for the exposure data of the product pattern 7 (here, the initial exposure data means the same as the original data) as in the case of creating the second-order correction function.
  • the correction process is performed, and the exposure data of the test pattern 1 is not subjected to the correction process.
  • an actual pattern is always created using the same exposure data as when the primary correction function was created, and the actual pattern data for creating the secondary correction function thereafter is collected.
  • the combination ratio (ratio) of the correction amount of the primary correction function in the correction amount by the primary correction function and the correction amount by the secondary correction function is 0.5, 0,.
  • the tertiary correction function was created as 7 and 0.3, sufficient process capability was obtained, and the best results were obtained when the composite ratio of the primary correction function was 0.5.
  • the process capability tends to be lower than in the Examples.
  • Example 2 In the same manner as in Example 1, ⁇ creation of primary correction function> and ⁇ correction of exposure data using primary correction function> were performed.
  • the in-plane of the actual pattern substrate is divided into a plurality of regions regardless of the distribution of the thickness of the copper foil (conductor), and the center and end portions of the actual pattern substrate are divided. Without distinguishing the peripheral part, the whole was divided into areas of approximately the same size, and a primary correction function was created for each of these areas.
  • the positions of the 61 test patterns 1 arranged in the actual pattern substrate C4c in the actual pattern substrate C4c are the same as those in the actual pattern substrate A4a used to create the primary correction function shown in FIG. This corresponds to the position of the 61-point test pattern.
  • the tertiary correction function used for correcting the original data or exposure data of the product pattern (not shown) arranged in the actual pattern substrate C4c is the test pattern 1 having the closest positional relationship with each product pattern.
  • the third-order correction function created using this was used.
  • the synthesis ratio of the primary correction function and the secondary correction function is 0.5.
  • the actual pattern substrate is not divided into regions, and the primary correction function, the secondary correction function, the tertiary are used by using the average value of the actual pattern data obtained from 121 points of the entire actual pattern substrate.
  • a correction function was created, and exposure data was corrected using this correction function. That is, the exposure data was corrected using only the same third-order correction function within the surface of the actual pattern substrate, and three actual pattern substrates for evaluation were produced. The rest is the same as in the first and second embodiments.
  • Test pattern 2 Pattern gap 3: Pattern 4: Real pattern substrate 4a: Real pattern substrate A (test substrate) 4b: Actual pattern substrate B (test substrate) 4c: Actual pattern substrate C (product substrate) 5: Substrate 6: Product pattern area 7: Product pattern 8: Data correction device 9: Bus 10: Wiring pattern forming system

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)

Abstract

Selon la présente invention, une étape (C) qui consiste à générer, sur la base de la différence entre des données d'origine et des données de motif réel, des données de correction destinées aux données d'origine ou à des données d'exposition, comprend : une étape (C-1) au cours de laquelle des données de différence sont générées à partir de la différence entre les données de motif réel et les données d'origine ; une étape (C-2) au cours de laquelle une pluralité de fonctions de correction définissant la relation entre la cause de la différence et la quantité de correction de données d'origine ou la quantité de correction de données d'exposition pour la suppression de la différence sont générées à partir de la relation entre les données de différence et la cause de la différence ; ainsi qu'une étape (C-3) au cours de laquelle une fonction de correction obtenue par synthèse de la pluralité de fonctions de correction est générée. À l'étape (C-2), au cours de laquelle la pluralité de fonctions de correction sont générées, ces fonctions de correction sont générées pour chaque zone dans le plan de la carte de motif réel.
PCT/JP2015/083604 2014-11-28 2015-11-30 Procédé de fabrication de carte de câblage, dispositif de correction de données, système de formation de motif de câblage, et procédé de correction de données WO2016084977A1 (fr)

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