WO2016084658A1 - Rficモジュールおよびそれを備えるrfidタグ - Google Patents
Rficモジュールおよびそれを備えるrfidタグ Download PDFInfo
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- WO2016084658A1 WO2016084658A1 PCT/JP2015/082287 JP2015082287W WO2016084658A1 WO 2016084658 A1 WO2016084658 A1 WO 2016084658A1 JP 2015082287 W JP2015082287 W JP 2015082287W WO 2016084658 A1 WO2016084658 A1 WO 2016084658A1
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- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
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- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
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- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
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Definitions
- the present invention relates to an RFIC (Radio Frequency Integrated Circuit) module and an RFID (Radio Frequency IDentifier) tag including the RFIC chip, and more particularly, an RFIC chip having two input / output terminals and two connected to the two input / output terminals, respectively.
- the present invention relates to an RFIC module and an RFID tag including a coil conductor having a coil end.
- the RFID tag includes an RFIC chip that stores predetermined information and processes a predetermined radio signal, and an antenna element (radiator) that transmits and receives a high-frequency signal, and includes various articles (or packaging thereof) to be managed. Used by sticking to material).
- an HF band RFID system using a 13.56 MHz band or a UHF band RFID system using a 900 MHz band is generally used.
- the UHF band RFID system is promising as an article management system because it has a relatively long communication distance and can read a plurality of tags at once.
- a UHF band RFID tag a tag having a structure disclosed in Patent Document 1 is known.
- a main object of the present invention is to provide an RFIC module and an RFID tag including the RFIC module, which can alleviate the concern that the passband width becomes narrow.
- the RFIC module includes an RFIC chip mounted on a substrate having a first input / output terminal and a second input / output terminal, and a first input connected to the first input / output terminal and the second input / output terminal, respectively.
- a power supply circuit built in the substrate including a coil conductor having a coil end and a second coil end; a first terminal electrode provided on a main surface of the substrate and connected to a first position of the coil conductor; And a second terminal electrode connected to a second position of the coil conductor, wherein the coil conductor exists in a section from the first coil end to the first position, A first coil portion having a first winding axis in a direction intersecting with the main surface, and a second winding axis in a direction extending from the second coil end to the second position and intersecting with the main surface of the substrate.
- a second coil portion having a first The yl portion and the first winding shaft and the second coil portion and the second turn of the rolling axis, are arranged at positions sandwiching the RFIC chip in plan view a substrate.
- the RFIC chip functions as a ground or a shield for the first coil portion and the second coil portion, and the first coil portion and the second coil portion are difficult to be coupled to each other both magnetically and capacitively. This can alleviate the concern that the communication signal pass band will be narrowed.
- the RFIC chip is built in the substrate, and the power feeding circuit is arranged at a position overlapping the RFIC chip when viewed from a direction orthogonal to a predetermined side surface of the substrate. This increases the shielding effect of the RFIC chip.
- the substrate is a flexible substrate having a rectangular main surface, and the first coil portion and the second coil portion are respectively disposed on one end side and the other end side of the long side that draws the rectangle.
- a flexible, thin RFIC chip module having a large area can be formed.
- each of the first coil portion and the second coil portion is disposed at a position spaced apart from the RFIC chip in plan view of the substrate. This increases the shielding effect of the RFIC chip.
- the first coil portion and the second coil portion are connected and wound so that the magnetic fields generated in the respective coil portions are in phase. Thereby, it becomes difficult to couple
- the first terminal electrode is disposed so as not to overlap with the center of the coil opening of the first coil portion
- the second terminal electrode is disposed at the center of the coil opening of the second coil portion.
- the magnetic field generation by the first coil portion and the second coil portion is not easily prevented by the first terminal electrode and the second terminal electrode.
- the coil conductor is connected in series between the first position and the second position, and the third coil part and the fourth coil overlap with the first coil part and the second coil part, respectively, in plan view of the substrate. It further includes a part.
- the additional resonance based on the parasitic capacitance between the first coil part and the second coil part is coupled with the original resonance by the third coil part and the fourth coil part. Thereby, a broadband resonance frequency characteristic is obtained.
- the power supply circuit includes a first connection conductor that extends in a thickness direction of the substrate at a position overlapping the first terminal electrode in plan view, and connects the first coil portion and the third coil portion in series. And a second connection conductor extending in the thickness direction of the substrate at a position overlapping the second terminal electrode in plan view and connecting the second coil portion and the fourth coil portion in series.
- the first connection conductor and the second connection conductor are arranged in the rigid region in plan view. This avoids a decrease in flexibility of the RFIC module.
- the first coil unit, the second coil unit, the third coil unit, and the fourth coil unit are configured such that the magnetic field generated in the coil conductor is the first coil unit, the second coil unit, the third coil unit, and the fourth coil. They are wound and connected so that they are in phase with each other. This increases the strength of the magnetic field.
- the third coil portion and the fourth coil portion are provided in a layer adjacent to the layer on which the first and second terminal electrodes are formed, and the first coil portion and the second coil portion are the third coil portion and It is a layer adjacent to the layer in which the fourth coil portion is provided, and is provided in a layer opposite to the layer in which the first and second terminal electrodes are formed.
- the first coil portion and the second coil portion are provided at positions farther from the first terminal electrode and the second terminal electrode than the third coil portion and the fourth coil portion. Accordingly, even if the inductance values of the first coil portion and the second coil portion are increased, the magnetic field generation by the first coil portion and the second coil portion is not easily prevented by the first terminal electrode and the second terminal electrode.
- the inductance values of the first coil portion and the second coil portion are larger than the inductance values of the third coil portion and the fourth coil portion, respectively. In such a case, the significance of arranging the first coil portion and the second coil portion at a position away from the first terminal electrode and the second terminal electrode is increased.
- An RFID tag is an RFID tag having an RFIC module and an antenna element connected to the RFIC module, wherein the RFIC module has a first input / output terminal and a second input / output terminal.
- An RFIC chip mounted on the substrate, a power supply circuit built in the substrate including a coil conductor having a first coil end and a second coil end connected to the first input / output terminal and the second input / output terminal, respectively, and a substrate
- a first terminal electrode provided on the main surface of the coil conductor and connected to the first position of the coil conductor; and a second terminal electrode provided on the main surface of the substrate and connected to the second position of the coil conductor;
- the coil conductor exists in a section from the first coil end to the first position, and has a first coil portion having a first winding axis in a direction intersecting with the main surface of the substrate, and a second coil end to the second position.
- a second coil part having a second winding axis in a direction intersecting with the main surface of the substrate, the first coil part, the first winding axis, the second coil part, and the second winding.
- the axis is arranged at a position where the RFIC chip is sandwiched when the substrate is viewed in plan.
- the RFIC chip functions as a ground or a shield for the first coil portion and the second coil portion, and the first coil portion and the second coil portion are difficult to be coupled to each other both magnetically and capacitively. This can alleviate the concern that the communication signal pass band will be narrowed.
- the antenna element is a dipole antenna element having a first antenna portion having one end connected to the first terminal electrode and a second antenna portion having one end connected to the second terminal electrode.
- the RFID tag can be easily manufactured.
- the antenna element is a loop antenna element having one end connected to the first terminal electrode and the other end connected to the second terminal electrode.
- the antenna characteristics are less likely to vary depending on the dielectric constant of the article to which the RFID tag is attached.
- the RFIC module includes an RFIC chip mounted on a substrate having a first input / output terminal and a second input / output terminal, and a first input connected to the first input / output terminal and the second input / output terminal, respectively.
- An RFIC module including a coil conductor having a coil end and a second coil end and built in the substrate, wherein the coil conductor is disposed at a position sandwiching the RFIC chip in plan view of the substrate, The first and second coil portions are connected in series, and the first and second coil portions extend in a direction intersecting the main surface with the RFIC chip sandwiched in plan view of the substrate.
- Each has a first winding axis and a second winding axis.
- the RFIC chip functions as a ground or a shield for the first coil portion and the second coil portion, and the first coil portion and the second coil portion are difficult to be coupled to each other both magnetically and capacitively. This can alleviate the concern that the communication signal pass band will be narrowed. Further, the first coil portion and the second coil portion function as antenna elements, thereby realizing a small RFID tag.
- the coil conductor is connected in series between the first coil portion and the second coil portion, and the third coil portion and the second coil portion respectively overlapping the first coil portion and the second coil portion in plan view of the substrate.
- a four-coil part is further included.
- the additional resonance based on the parasitic capacitance between the first coil part and the second coil part is coupled with the original resonance by the third coil part and the fourth coil part. Thereby, a broadband resonance frequency characteristic is obtained.
- the RFIC chip by causing the RFIC chip to function as a ground or a shield, it is possible to reduce the concern that the communication signal pass band is narrowed.
- FIG. 1 It is a perspective view which shows the state which looked at the RFIC module of this Example from diagonally upward. It is a circuit diagram which shows the equivalent circuit of a RFIC module.
- A is the top view which shows the state which looked at RFIC module from right above
- B is the side view which showed the state which looked at RFIC module from right side
- C looked at RFIC module from right below
- A is a top view showing a state in which the upper insulating layer of the multilayer substrate constituting the RFIC module is viewed from directly above
- (B) is a view of the middle insulating layer of the multilayer substrate forming the RFIC module from directly above.
- FIG. 6C is a top view showing a state in which the lower insulating layer of the multilayer substrate constituting the RFIC module is viewed from directly above.
- (A) is a sectional view showing an AA section of the insulating layer shown in FIG. 4 (A)
- (B) is a sectional view showing a BB section of the insulating layer shown in FIG. 4 (B)
- FIG. 5C is a cross-sectional view taken along the line CC of the insulating layer shown in FIG. It is an illustration figure which shows an example of the generation state of the magnetic field on an equivalent circuit.
- (A) is a perspective view showing a state in which the RFID device of this embodiment is viewed from diagonally above
- (B) is a perspective view showing a state in which the RFID device of this embodiment is disassembled and viewed from diagonally above.
- FIG. 16 is a perspective view showing a state where the RFID device shown in FIG. 15 is attached to a cylindrical article.
- (A) is a top view which shows the state which looked at the upper insulating layer of the multilayer substrate which comprises the RFIC module of another Example from right above
- (B) is the multilayer substrate which comprises the RFIC module of another Example. It is a top view which shows the state which looked at the middle insulating layer from right above
- (C) is a top view which shows the state which looked at the lower insulating layer of the multilayer substrate which comprises the RFIC module of another Example from right above. It is.
- (A) is a top view which shows the state which looked at the upper insulating layer of the multilayer substrate which comprises the RFIC module of another Example from right above
- (B) is the multilayer substrate which comprises the RFIC module of another Example.
- (C) is a top view which shows the state which looked at the lower insulating layer of the multilayer board
- (A) is the top view which shows the state which looked at the upper insulating layer of the multilayer board
- (B) is the multilayer which comprises the RFIC module of another Example. It is a top view which shows the state which looked at the middle insulating layer of the board
- FIG. (A) is a top view which shows the state which looked at the upper insulating layer of the multilayer substrate which comprises the RFIC module of another Example from right above
- (B) is the multilayer substrate which comprises the RFIC module of another Example. It is a top view which shows the state which looked at the middle insulating layer from right above
- (C) is a top view which shows the state which looked at the lower insulating layer of the multilayer substrate which comprises the RFIC module of another Example from right above. It is. It is a perspective view which shows the state which looked at the RFIC module of the other Example from diagonally upward.
- FIG. 22 is a circuit diagram showing an equivalent circuit of the RFIC module shown in FIG. 21.
- (A) is a top view which shows the state which looked at the upper insulating layer of the multilayer substrate which comprises the RFIC module of another Example from right above
- (B) is the multilayer substrate which comprises the RFIC module of another Example. It is a top view which shows the state which looked at the middle insulating layer from right above
- (C) is a top view which shows the state which looked at the lower insulating layer of the multilayer board
- an RFIC module 10 of this embodiment is typically an RFIC module corresponding to a communication frequency in the 900 MHz band, that is, the UHF band, and has a multilayer substrate 12 whose main surface is rectangular.
- the multilayer substrate 12 is made of a laminate in which flexible resin insulation layers such as polyimide and liquid crystal polymer are laminated, and the multilayer substrate 12 itself exhibits flexibility.
- the dielectric constant of each insulating layer made of these materials is smaller than the dielectric constant of a ceramic base layer represented by LTCC.
- the X axis is assigned to the length direction of the multilayer substrate 12
- the Y axis is assigned to the width direction of the multilayer substrate 12
- the Z axis is assigned to the thickness direction of the multilayer substrate 12.
- the multilayer substrate 12 includes the RFIC chip 16 and A power feeding circuit 18 is built in, and a first terminal electrode 14 a and a second terminal electrode 14 b are formed on one main surface of the multilayer substrate 12.
- the RFIC chip 16 is an ultrathin package, and has a structure in which various elements are incorporated in a hard semiconductor substrate made of a semiconductor such as silicon, and has one main surface and the other main surface. The face draws a square. A first input / output terminal 16a and a second input / output terminal 16b are formed on the other main surface of the RFIC chip 16 (details will be described later).
- the RFIC chip 16 has a posture in which each side of the square extends along the X-axis or the Y-axis, and one main surface and the other main surface face the positive side and the negative side in the Z-axis direction, respectively. , Located in the center in each of the X-axis direction, the Y-axis direction, and the Z-axis direction.
- the feeding circuit 18 is formed by a coil conductor 20 and interlayer connection conductors 24a and 24b (details will be described later).
- the coil conductor 20 is formed by coil patterns 20a to 20c.
- the first coil part CIL1 forms part of the coil pattern 20a
- the second coil part CIL2 forms part of the coil pattern 20b
- the third coil part CIL3 and the fourth coil part CIL4 form part of the coil pattern 20c. .
- the first coil portion CIL1, the third coil portion CIL3, and the interlayer connection conductor 24a are arranged in the Z-axis direction at the negative side position in the X-axis direction
- the second coil portion CIL2, the fourth coil portion CIL4, and the interlayer connection conductor 24b are arranged in the Z-axis direction at the positive position in the X-axis direction.
- the RFIC chip 16 is located between the first coil portion CIL1 and the second coil portion CIL2, and the third coil portion CIL3. It arrange
- the first terminal electrode 14a is disposed at the negative position in the X-axis direction
- the second terminal electrode 14b is disposed at the positive position in the X-axis direction.
- Each of the first terminal electrode 14a and the second terminal electrode 14b is formed in a strip shape using a flexible copper foil as a raw material, and the sizes of the respective main surfaces coincide with each other.
- the short side of the strip extends along the X axis
- the long side of the strip extends along the Y axis.
- the RFIC chip 16 is sandwiched between a part of the power feeding circuit 18 and the other part of the power feeding circuit 18 when the multilayer substrate 12 is viewed in plan from the stacking direction of each insulating layer. Further, when the multilayer substrate 12 is viewed from the X-axis direction, the RFIC chip 16 overlaps the power feeding circuit 18. Furthermore, when the multilayer substrate 12 is viewed in plan, the power feeding circuit 18 partially overlaps each of the first terminal electrode 14a and the second terminal electrode 14b.
- each insulating layer which comprises a laminated body is as thin as 10 micrometers or more and 100 micrometers or less, the RFIC chip 16 and the electric power feeding circuit 18 which were incorporated in the multilayer substrate 12 can be seen through from the outside. For this reason, the connection state (the presence or absence of disconnection) of the RFIC chip 16 and the power feeding circuit 18 can be easily confirmed.
- multilayer substrate 12 is formed by three stacked sheet-like insulating layers 12a to 12c.
- the insulating layer 12a is an upper layer
- the insulating layer 12b is a middle layer
- the insulating layer 12c is a lower layer.
- the first terminal electrode 14a and the second terminal electrode 14b are formed on one main surface of the insulating layer 12a. As described above, the first terminal electrode 14a is disposed on the negative side in the X-axis direction, and the second terminal electrode 14b is disposed on the positive side in the X-axis direction.
- a rectangular through hole HL1 reaching the other main surface is formed at the center position of the one main surface of the insulating layer 12b.
- the size of the through hole HL1 is matched to the size of the RFIC chip 16.
- a coil pattern 20c extending in a strip shape using a flexible copper foil as a material is formed around the through hole HL1 on one main surface of the insulating layer 12b.
- the one end of the coil pattern 20c is arranged at a position overlapping the first terminal electrode 14a in plan view, and is connected to the first terminal electrode 14a by an interlayer connection conductor 22a extending in the Z-axis direction.
- the other end of the coil pattern 20c is disposed at a position overlapping the second terminal electrode 14b in plan view, and is connected to the second terminal electrode 14b by an interlayer connection conductor 22b extending in the Z-axis direction.
- the interlayer connection conductors 22a and 22b and later-described interlayer connection conductors 24a and 24b are hard metal bulks mainly composed of Sn.
- the coil pattern 20c rotates twice around the one end in the counterclockwise direction and extends to the vicinity of the negative end in the Y-axis direction, and then the X-axis. Extends to the positive side of the direction. Subsequently, the coil pattern 20c bends the vicinity of the positive end in the X-axis direction to the positive side in the Y-axis direction, and makes two rotations counterclockwise around the other end before reaching the other end.
- coil patterns 20a and 20b extending in a strip shape from a flexible copper foil are formed.
- the end T1) is arranged at a position that overlaps the negative corner in the X-axis direction and the positive corner in the Y-axis direction among the four corners of the rectangle drawn by the through hole HL1.
- the four corners of the rectangle to be drawn they are arranged at positions that overlap the positive side corner in the X-axis direction and the positive side corner in the Y-axis direction. Note that both the first coil end T1 and the second coil end T2 are rectangular when the insulating layer 12c is viewed in plan.
- the coil pattern 20a When starting from one end of the coil pattern 20a, the coil pattern 20a rotates around the one end in the clockwise direction by 2.5 and then bends to the negative side in the Y-axis direction to reach the other end. Similarly, when starting from one end of the coil pattern 20b, the coil pattern 20b is rotated 2.5 times counterclockwise around the one end and then bent to the negative side in the Y-axis direction to the other end. To reach. Further, one end of the coil pattern 20a is connected to one end of the coil pattern 20c by an interlayer connection conductor 24a extending in the Z-axis direction, and one end of the coil pattern 20b is connected to the coil pattern by an interlayer connection conductor 24b extending in the Z-axis direction. It is connected to the other end of 20c.
- a part of the coil pattern 20a overlaps a part of the coil pattern 20c, and a part of the coil pattern 20b is also a part of another part of the coil pattern 20c. And overlap.
- the power feeding circuit 18 is formed by the coil patterns 20a to 20c thus arranged and the interlayer connection conductors 24a and 24b.
- the section on the coil pattern 20a side is defined as “first coil part CIL1”, and the section on the coil pattern 20c side is defined as “third coil part CIL3”. To do.
- the section on the coil pattern 20b side is defined as “second coil portion CIL2”, and the section on the coil pattern 20c side is defined as “fourth coil section CIL4”.
- the position of one end of the coil pattern 20a or one end of the coil pattern 20c is defined as "first position P1"
- the position of one end of the coil pattern 20b or the other end of the coil pattern 20c is defined as "second position P2". It is defined as
- Rectangular dummy conductors 26a and 26b made of flexible copper foil are also formed on one main surface of the insulating layer 12c.
- the dummy conductors 26a and 26b are arranged so as to overlap two corners arranged in the X-axis direction on the negative side in the Y-axis direction among the four corners of the rectangle drawn by the through hole HL1.
- the RFIC chip 16 is mounted on the insulating layer 12c so that the four corners of the other principal surface face the first coil end T1, the second coil end T2, and the dummy conductors 26a and 26b, respectively.
- the first input / output terminal 16a is disposed on the other main surface of the RFIC chip 16 so as to overlap the first coil end T1 in plan view.
- the second input / output terminal 16b is disposed on the other main surface of the RFIC chip 16 so as to overlap the second coil end T2 in plan view.
- the RFIC chip 16 is connected to the first coil end T1 by the first input / output terminal 16a, and is connected to the second coil end T2 by the second input / output terminal 16b.
- FIG. 2 shows an equivalent circuit of the RFIC module 10 thus configured.
- the inductor L1 corresponds to the first coil part CIL1
- the inductor L2 corresponds to the second coil part CIL2.
- the inductor L3 corresponds to the third coil part CIL3, and the inductor L4 corresponds to the fourth coil part CIL4.
- the characteristic of impedance matching by the feeder circuit 18 is defined by the values of the inductors L1 to L4.
- the one end of the inductor L1 and the one end of the inductor L2 are connected to the first input / output terminal 16a and the second input / output terminal 16b provided on the RFIC chip 16, respectively.
- the other end of the inductor L1 is connected to one end of the inductor L3, and the other end of the inductor L2 is connected to one end of the inductor L4.
- the other end of the inductor L3 is connected to the other end of the inductor L4.
- the first terminal electrode 14a is connected to a connection point between the inductors L1 and L3, and the second terminal electrode 14b is connected to a connection point between the inductors L2 and L4.
- the first coil part CIL1, the second coil part CIL2, the third coil part CIL3, and the fourth coil part CIL4 are wound so that the magnetic fields are in phase and are connected in series with each other. Therefore, the magnetic field is generated so as to be directed in a direction indicated by an arrow in FIG. 6 at a certain time point and to be directed in a direction opposite to the arrow at another time point.
- the first coil portion CIL1 and the third coil portion CIL3 have substantially the same loop shape and the same first winding axis
- the coil part CIL2 and the fourth coil part CIL4 also have substantially the same loop shape and the same second winding axis.
- the first winding shaft and the second winding shaft are disposed at positions sandwiching the RFIC chip 16.
- first coil part CIL1 and the third coil part CIL3 are magnetically and capacitively coupled
- second coil part CIL2 and the fourth coil part CIL4 are also magnetically and capacitively coupled.
- the RFIC chip 16 has a first input / output terminal 16 a and a second input / output terminal 16 b and is built in the multilayer substrate 12.
- the power feeding circuit 18 is built in the multilayer substrate 12 including the coil patterns 20a to 20c.
- the first coil portion CIL1 exists in a section from the first coil end T1 to the first position P1, and has a first winding axis in a direction intersecting with one main surface of the multilayer substrate 12.
- the second coil portion CIL2 exists in a section from the second coil end T2 to the second position P2, and has a second winding axis in a direction intersecting with one main surface of the multilayer substrate 12.
- the third coil part CIL3 is arranged to overlap the first coil part CIL1 in plan view
- the fourth coil part CIL4 is arranged to overlap the second coil part CIL2 in plan view.
- the first coil part CIL1, the third coil part CIL3, the second coil part CIL2, and the fourth coil part CIL4 are arranged at positions sandwiching the RFIC chip 16 when the multilayer substrate 12 is viewed in plan.
- the power feeding circuit 18 for impedance matching is built in the multilayer substrate 12, and the RFIC chip 16 is also built in the multilayer substrate 12, and the first coil unit CIL 1, the third coil unit CIL 3, the second coil unit CIL 2, and the fourth coil unit 4.
- the coil part CIL4 is arranged at a position where the RFIC chip 16 is sandwiched when the multilayer substrate 12 is viewed in plan.
- the RFIC chip 16 Since the RFIC chip 16 is formed of a semiconductor substrate, the RFIC chip 16 functions as a ground or a shield for the first coil unit CIL1, the second coil unit CIL2, the third coil unit CIL3, and the fourth coil unit CIL4.
- the coil part CIL1 and the second coil part CIL2 are difficult to be coupled to each other both magnetically and capacitively, and the third coil part CIL3 and the fourth coil part CIL4 are also difficult to couple to each other both magnetically and capacitively. . This can alleviate the concern that the communication signal pass band will be narrowed. [Example 2]
- FIG. 7A and FIG. 7B show an example of an RFID tag on which the RFIC module 10 of this embodiment is mounted.
- the RFID tag is a dipole type RFID tag
- the antenna element 30a includes an antenna base 32a and antenna conductors 34a and 34b arranged on the antenna base 32a.
- the antenna substrate 32a is a strip-shaped substrate made of PET as a material and exhibiting flexibility.
- each of the antenna conductors 34a and 34b is a strip-shaped conductor exhibiting flexibility using an aluminum foil or a copper foil as a material.
- the antenna conductors 34a and 34b have a common width and length. However, the width of each of the antenna conductors 34a and 34b is smaller than the width of the antenna base material 32a, and the length of each of the antenna conductors 34a and 34b is less than half the length of the antenna base material 32a.
- the distance between the first terminal electrode 14a and the second terminal electrode 14b is adjusted.
- the RFIC module 10 is mounted at a central position on the surface of the antenna substrate 32a with one main surface facing the surface of the antenna substrate 32a. As a result, the first terminal electrode 14a is connected to one end of the antenna conductor 34a, and the second terminal electrode 14b is connected to one end of the antenna conductor 34b.
- the first terminal electrode 14a is fixed to the antenna conductor 34a by the conductive bonding material 36a
- the second terminal electrode 14b is fixed to the antenna conductor 34b by the conductive bonding material 36b (see FIG. 9).
- an insulating bonding material may be adopted and connected via a capacitor. That is, the first terminal electrode 14a and the second terminal electrode 14b may be electrically connected to the antenna conductors 34a and 34b.
- the multilayer substrate 12 is made of flexible polyimide or liquid crystal polymer, and the coil patterns 20a to 20c, the first terminal electrodes 14a, and the second terminal electrodes 14b are made of flexible copper foil.
- the interlayer connection conductors 22a, 22b, 24a, and 24b are hard conductors made of Sn
- the substrate of the RFIC chip 16 is also a hard substrate made of silicon.
- the flexibility of copper foil becomes small, and also by providing plating films, such as Ni / Au and Ni / Sn, the flexibility Is lost.
- the region where each of the first terminal electrode 14a, the second terminal electrode 14b, and the RFIC chip 16 is disposed is a rigid region, and the other region is a flexible region.
- each of the first terminal electrode 14a and the second terminal electrode 14b is provided at a position separated from the RFIC chip 16 in plan view, each of the first terminal electrode 14a and the second terminal electrode 14b and the RFIC chip 16 is provided.
- a flexible region is formed between them.
- the interlayer connection conductors 22a, 22b, 24a, 24b are arranged in the rigid region.
- the RFIC module 10 bends as shown in FIG. 9, for example.
- the first resonance is a resonance that occurs in the current path constituted by the antenna conductors 34a to 34b, the inductor L3, and the inductor L4.
- the second resonance is a current path that is constituted by the inductors L1 to L4 and the parasitic capacitance Cp ( Resonance in the current loop.
- the two resonances are coupled by the inductors L3 to L4 shared by the current paths, and the two currents I1 and I2 corresponding to the two resonances flow as shown in FIG.
- Both the first resonance frequency and the second resonance frequency are affected by the inductors L3 to L4.
- a difference of several tens of MHz (specifically, about 5 to 50 MHz) is generated between the first resonance frequency and the second resonance frequency.
- These resonance frequency characteristics are represented by curves A and B in FIG.
- a broadband resonance frequency characteristic as shown by a curve C in FIG. 11 is obtained.
- FIG. 4 Another example of the RFID tag on which the RFIC module 10 of this embodiment is mounted is shown in FIG.
- FIG. 13A and FIG. 13B show another example of the RFID tag on which the RFIC module 10 of this embodiment is mounted.
- the antenna element 30c includes an antenna base 32b and an antenna conductor 34c disposed thereon.
- the antenna base material 32b is a strip-shaped base material that exhibits flexibility using PET as a material
- the antenna conductor 34c is a strip-shaped conductor that exhibits flexibility using an aluminum foil or a copper foil as a material.
- a rectangular through hole HL2 having a long side extending along the band is provided at the center in the length direction of the band forming the antenna conductor 34c, and a notch CT1 reaching the through hole HL2 from the outer edge of the band is further provided.
- the length of the through hole HL2 exceeds the length of the RFIC module 10, while the length of the notch CT1 is less than the length of the RFIC module 10.
- the RFIC module 10 is mounted at a position that covers the notch CT1 with one main surface facing the surface of the antenna base 32b.
- the first terminal electrode 14a is connected to one end of the loop conductor 34lp
- the second terminal electrode 14b is connected to the other end of the loop conductor 34lp.
- FIG. 14 shows still another example of the RFID tag on which the RFIC module 10 of this embodiment is mounted.
- the antenna element 30d includes a square antenna substrate 32c and an antenna conductor 34d disposed thereon.
- the antenna conductor 34d is formed by coupling the antenna conductor 34c shown in FIGS. 13A to 13B in a loop shape. As a result, the antenna conductor 34d functions as a loop antenna. [Example 6]
- FIG. 15 shows another example of the RFID tag on which the RFIC module 10 of this embodiment is mounted.
- the antenna element 30e includes a square antenna base 32c and an antenna conductor 34e disposed thereon.
- the antenna conductor 34e is formed by coupling the antenna conductors 34a and 34b shown in FIGS. 7A to 7B in a loop shape. As a result, the antenna conductor 34e also functions as a loop antenna.
- the RFID tag shown in FIG. 14 or 15 is attached to the cylindrical article 40 in the manner shown in FIG.
- the article 40 is, for example, a PET bottle or a flexible pack for infusion
- FIG. 16 shows a state where the RFID tag shown in FIG. 15 is attached.
- a loop antenna there is no open end unlike a dipole antenna. For this reason, the antenna characteristics are hardly affected by the dielectric constant of the article 40 to be attached.
- FIGS. 17 (A) to 17 (C) Another example of the multilayer substrate 12 forming the RFIC module 10 is shown in FIGS. 17 (A) to 17 (C).
- the main differences from the multilayer substrate 12 shown in FIGS. 4A to 4C are the winding directions of the first coil portion CIL11 and the second coil portion CIL21, and the third coil portions CIL31 and CIL41.
- Each winding number and winding direction, the positional relationship between the center of the opening of the first coil portion CIL11 and the first terminal electrode 141a, and the center of the opening of the second coil portion CIL21 and the second terminal electrode 141b Is a positional relationship in plan view.
- the multilayer substrate 12 is formed of three stacked sheet-like insulating layers 121a to 121c.
- the insulating layer 121a is an upper layer
- the insulating layer 121b is a middle layer
- the insulating layer 121c is a lower layer.
- the first terminal electrode 141a and the second terminal electrode 141b are formed on one main surface of the insulating layer 121a.
- the first terminal electrode 141a is disposed on the negative side in the X-axis direction
- the second terminal electrode 141b is disposed on the positive side in the X-axis direction.
- a rectangular through hole HL11 reaching the other main surface is formed at the center position of one main surface of the insulating layer 121b.
- the size of the through hole HL11 is matched to the size of the RFIC chip 161.
- a coil pattern 201c extending in a strip shape using a flexible copper foil as a material is formed around the through hole HL11 in one main surface of the insulating layer 121b.
- One end of the coil pattern 201c is arranged at a position overlapping the first terminal electrode 141a in plan view, and is connected to the first terminal electrode 141a by an interlayer connection conductor 221a extending in the Z-axis direction.
- the other end of the coil pattern 201c is arranged at a position overlapping the second terminal electrode 141b in plan view, and is connected to the second terminal electrode 141b by an interlayer connection conductor 221b extending in the Z-axis direction.
- the interlayer connection conductors 221a and 221b and later-described interlayer connection conductors 241a and 241b are hard metal bulks mainly composed of Sn.
- the coil pattern 201c rotates around the one end in the clockwise direction and extends to the vicinity of the positive end in the Y-axis direction, and then the X-axis direction. Extends to the positive side of the. Subsequently, the coil pattern 201c bends the vicinity of the positive end in the X-axis direction to the negative side in the Y-axis direction, and makes one turn clockwise around the other end before reaching the other end.
- coil patterns 201a and 201b extending in a strip shape from a flexible copper foil are formed on one main surface of the insulating layer 121c.
- the end T11) is disposed at a position on the negative side in the X-axis direction within the rectangle drawn by the through hole HL11.
- the coil pattern 201a rotates around the one end in the counterclockwise direction by 2.5 and then bends to the positive side in the Y-axis direction to reach the other end.
- the coil pattern 201b rotates around the one end in the clockwise direction by 2.5, and then bends to the positive side in the Y-axis direction to the other end.
- one end of the coil pattern 201a is connected to one end of the coil pattern 201c by an interlayer connection conductor 241a extending in the Z-axis direction
- one end of the coil pattern 201b is connected to the coil pattern by an interlayer connection conductor 241b extending in the Z-axis direction. It is connected to the other end of 201c.
- the power feeding circuit 18 is formed by the coil patterns 201a to 201c and the interlayer connection conductors 241a and 241b thus arranged.
- the conductor portion excluding the first coil end T11 in the coil pattern 201a is defined as “first coil portion CIL11”, and the conductor portion excluding the second coil end T21 in the coil pattern 201b is defined as “second coil portion CIL21”.
- the negative conductor portion in the X-axis direction from the through hole HL11 in the coil pattern 201c is defined as “third coil portion CIL31”, and the positive conductor portion in the X-axis direction from the through hole HL11 in the coil pattern 201c.
- the conductor portion is defined as “fourth coil portion CIL41”.
- the position of one end of the coil pattern 201a or one end of the coil pattern 201c corresponds to the “first position P1”, and the position of one end of the coil pattern 201b or the other end of the coil pattern 201c is “second position P2”.
- a first input / output terminal 161 a and a second input / output terminal 161 b are provided on the other main surface of the RFIC chip 161.
- the first input / output terminal 161a is disposed on the negative side in the X-axis direction
- the second input / output terminal 161b is disposed on the positive side in the X-axis direction.
- the RFIC chip 161 is mounted on one main surface of the insulating layer 121c so that the first input / output terminal 161a and the second input / output terminal 161b thus arranged are connected to the first coil end T11 and the second coil end T21.
- the distance from the first terminal electrode 141a to the first coil part CIL11 is longer than the distance from the first terminal electrode 141a to the third coil part CIL31, and the distance from the second terminal electrode 141b to the second coil part CIL21 is It is longer than the distance from the 2nd terminal electrode 141b to the 4th coil part CIL41.
- the number of turns of the first coil part CIL11 is larger than the number of turns of the third coil part CIL31, and the number of turns of the second coil part CIL21 is larger than the number of turns of the fourth coil part CIL41.
- the inductance value of the first coil part CIL11 is larger than the inductance value of the third coil part CIL31
- the inductance value of the second coil part CIL21 is larger than the inductance value of the fourth coil part CIL41.
- the first terminal electrode 141a does not overlap with the opening center of each of the first coil portion CIL11 and the third coil portion CIL31
- the second terminal electrode 141b includes the second coil portion CIL21 and the second coil portion CIL21. It does not overlap with the opening center of each of the fourth coil portions CIL41.
- FIGS. 17A to 17C Another example of the multilayer substrate 12 constituting the RFIC module 10 is shown in FIGS.
- the main difference from the multilayer substrate 12 shown in FIGS. 17A to 17C is that the number of turns and the opening area of each of the first coil portion CIL12 and the second coil portion CIL22, the third coil portion CIL32, and The opening area of each of the fourth coil portions CIL42 and the arrangement of the interlayer connection conductors 221a to 221b and 241a to 241b.
- the multilayer substrate 12 is formed of three stacked sheet-like insulating layers 122a to 122c.
- the insulating layer 122a is an upper layer
- the insulating layer 122b is a middle layer
- the insulating layer 122c is a lower layer.
- the first terminal electrode 142a and the second terminal electrode 142b are formed on one main surface of the insulating layer 122a.
- the first terminal electrode 142a is disposed on the negative side in the X-axis direction
- the second terminal electrode 142b is disposed on the positive side in the X-axis direction.
- a rectangular through hole HL12 reaching the other main surface is formed at the center position of one main surface of the insulating layer 122b.
- the size of the through hole HL12 is matched to the size of the RFIC chip 162.
- a coil pattern 202c extending in a strip shape using a flexible copper foil as a material is formed around the through hole HL12 in one main surface of the insulating layer 122b.
- One end of the coil pattern 202c is arranged at a position overlapping the first terminal electrode 142a in plan view, and is connected to the first terminal electrode 142a by an interlayer connection conductor 222a extending in the Z-axis direction.
- the other end of the coil pattern 202c is arranged at a position overlapping the second terminal electrode 142b in plan view, and is connected to the second terminal electrode 142b by an interlayer connection conductor 222b extending in the Z-axis direction.
- the interlayer connection conductors 222a and 222b and later-described interlayer connection conductors 242a and 242b are hard metal bulks mainly composed of Sn.
- the coil pattern 202c rotates around the one end clockwise and extends to the vicinity of the positive end in the Y-axis direction, and then the X-axis direction. Extends to the positive side of the. The coil pattern 202c then bends the vicinity of the positive end in the X-axis direction to the negative side in the Y-axis direction, and makes one turn clockwise around the other end before reaching the other end.
- coil patterns 202a and 202b extending in a strip shape from a flexible copper foil are formed on one main surface of the insulating layer 122c.
- the coil pattern 201a rotates around the one end in the counterclockwise direction by 1.5 and then bends to the positive side in the Y-axis direction to reach the other end.
- the coil pattern 202b rotates 1.5 times clockwise around the one end, and then bends to the positive side in the Y-axis direction to the other end.
- one end of the coil pattern 202a is connected to one end of the coil pattern 202c by an interlayer connection conductor 242a extending in the Z-axis direction
- one end of the coil pattern 202b is connected to the coil pattern by an interlayer connection conductor 242b extending in the Z-axis direction. Connected to the other end of 202c.
- the power feeding circuit 18 is formed by the coil patterns 202a to 202c and the interlayer connection conductors 242a and 242b thus arranged.
- the conductor portion excluding the first coil end T12 in the coil pattern 202a is defined as “first coil portion CIL12”
- the conductor portion excluding the second coil end T22 in the coil pattern 202b is defined as “second coil portion CIL22”.
- the negative conductor portion in the X-axis direction from the through hole HL12 in the coil pattern 202c is defined as “third coil portion CIL32”
- the conductor portion is defined as “fourth coil portion CIL42”.
- the position of one end of the coil pattern 202a or one end of the coil pattern 202c corresponds to the “first position P1”, and the position of one end of the coil pattern 202b or the other end of the coil pattern 202c is “second position P2”.
- a first input / output terminal 162a and a second input / output terminal 162b are provided on the other main surface of the RFIC chip 162.
- the first input / output terminal 162a is arranged on the negative side in the X-axis direction
- the second input / output terminal 162b is arranged on the positive side in the X-axis direction.
- the RFIC chip 162 is mounted on one main surface of the insulating layer 122c so that the first input / output terminal 162a and the second input / output terminal 162b thus arranged are connected to the first coil end T12 and the second coil end T22.
- the opening area and the opening center of the third coil portion CIL32 substantially coincide with the opening area and the opening center of the first coil portion CIL12.
- the opening area and the opening center of the fourth coil part CIL42 substantially coincide with the opening area and the opening center of the second coil part CIL22.
- the opening center of the first coil portion CIL12 and the opening center of the third coil portion CIL32 do not overlap with the first terminal electrode 142a, and similarly, the opening center of the second coil portion CIL22.
- the opening center of the fourth coil portion CIL42 also does not overlap with the second terminal electrode 142b.
- FIGS. 19 (A) to 19 (C) Another example of the multilayer substrate 12 constituting the RFIC module 10 is shown in FIGS. 19 (A) to 19 (C).
- the main difference from the multilayer substrate 12 shown in FIGS. 17A to 17C is the opening area of each of the third coil portion CIL32 and the fourth coil portion CIL42.
- the multilayer substrate 12 is formed by three stacked sheet-like insulating layers 123a to 123c.
- the insulating layer 123a is an upper layer
- the insulating layer 123b is a middle layer
- the insulating layer 123c is a lower layer.
- the first terminal electrode 143a and the second terminal electrode 143b are formed on one main surface of the insulating layer 123a.
- the first terminal electrode 143a is disposed on the negative side in the X-axis direction
- the second terminal electrode 143b is disposed on the positive side in the X-axis direction.
- a rectangular through hole HL13 reaching the other main surface is formed at the center position of one main surface of the insulating layer 123b.
- the size of the through hole HL13 is matched to the size of the RFIC chip 163.
- a coil pattern 203c extending in a strip shape using a flexible copper foil as a material is formed around the through hole HL13 in one main surface of the insulating layer 123b.
- One end of the coil pattern 203c is arranged at a position overlapping the first terminal electrode 143a in plan view, and is connected to the first terminal electrode 143a by an interlayer connection conductor 223a extending in the Z-axis direction.
- the other end of the coil pattern 203c is arranged at a position overlapping the second terminal electrode 143b in plan view, and is connected to the second terminal electrode 143b by an interlayer connection conductor 223b extending in the Z-axis direction.
- the interlayer connection conductors 223a and 223b and later-described interlayer connection conductors 243a and 243b are hard metal bulks mainly composed of Sn.
- the coil pattern 203c When one end of the coil pattern 203c is set as a start end, the coil pattern 203c extends around the one end in the clockwise direction and extends to the vicinity of the positive end in the Y-axis direction, and then in the X-axis direction. Extends to the positive side of the. Subsequently, the coil pattern 203c bends the vicinity of the positive end in the X-axis direction to the negative side in the Y-axis direction, and makes one turn clockwise around the other end before reaching the other end.
- coil patterns 203a and 203b extending in a strip shape from a flexible copper foil are formed on one main surface of the insulating layer 123c.
- the end T13) is disposed at a position on the negative side in the X-axis direction within the rectangle drawn by the through hole HL13.
- the coil pattern 203a rotates around the one end in the counterclockwise direction by 2.5 and then bends to the positive side in the Y-axis direction to reach the other end.
- the coil pattern 203b rotates around the one end in the clockwise direction by 2.5 and then bends to the positive side in the Y-axis direction to the other end.
- one end of the coil pattern 203a is connected to one end of the coil pattern 203c by an interlayer connection conductor 243a extending in the Z-axis direction
- one end of the coil pattern 203b is connected to the coil pattern by an interlayer connection conductor 243b extending in the Z-axis direction. It is connected to the other end of 203c.
- the power feeding circuit 18 is formed by the coil patterns 203a to 203c and the interlayer connection conductors 243a and 243b thus arranged.
- the conductor portion excluding the first coil end T13 in the coil pattern 203a is defined as “first coil portion CIL13”
- the conductor portion excluding the second coil end T23 in the coil pattern 203b is defined as “second coil portion CIL23”.
- the negative conductor portion in the X-axis direction from the through hole HL13 in the coil pattern 203c is defined as “third coil portion CIL33”
- the conductor portion is defined as “fourth coil portion CIL43”.
- the position of one end of the coil pattern 203a or one end of the coil pattern 203c corresponds to the “first position P1”, and the position of one end of the coil pattern 203b or the other end of the coil pattern 203c is “second position P2”.
- a first input / output terminal 163a and a second input / output terminal 163b are provided on the other main surface of the RFIC chip 163.
- the first input / output terminal 163a is disposed on the negative side in the X-axis direction
- the second input / output terminal 163b is disposed on the positive side in the X-axis direction.
- the RFIC chip 163 is mounted on one main surface of the insulating layer 123c so that the first input / output terminal 163a and the second input / output terminal 163b thus arranged are connected to the first coil end T13 and the second coil end T23.
- the inductance value of the first coil portion CIL13 is larger than the inductance value of the third coil portion CIL33.
- the inductance value of the coil part CIL23 is larger than the inductance value of the fourth coil part CIL43.
- the opening center of the first coil portion CIL13 and the opening center of the third coil portion CIL33 do not overlap the first terminal electrode 143a, and similarly, the opening center of the second coil portion CIL23.
- the opening center of the fourth coil portion CIL43 also does not overlap with the second terminal electrode 143b.
- the opening area of the third coil part CIL33 is larger than the opening area of the third coil part CIL31 shown in FIG. 17B
- the opening area of the fourth coil part CIL43 is the fourth coil part shown in FIG. It is larger than the opening area of CIL41.
- FIGS. 17 (A) to 17 (C) the magnetic field formed by the first coil part CIL11 and the third coil part CIL31 and the magnetic field formed by the second coil part CIL21 and the fourth coil part CIL41 are shown in FIGS. 17 (A) to 17 (C). It becomes larger than the multilayer substrate 12 shown.
- FIGS. 20 (A) to 20 (C) Another example of the multilayer substrate 12 constituting the RFIC module 10 is shown in FIGS. 20 (A) to 20 (C).
- the main differences from the multilayer substrate 12 shown in FIGS. 14A to 14C are the opening areas of the first coil portion CIL14 and the second coil portion CIL24, the third coil portion CIL32, and the fourth coil.
- the multilayer substrate 12 is formed of three stacked sheet-like insulating layers 124a to 124c.
- the insulating layer 124a is an upper layer
- the insulating layer 124b is a middle layer
- the insulating layer 124c is a lower layer.
- the first terminal electrode 144a and the second terminal electrode 144b are formed on one main surface of the insulating layer 124a.
- the first terminal electrode 144a is disposed on the negative side in the X-axis direction
- the second terminal electrode 144b is disposed on the positive side in the X-axis direction.
- a rectangular through hole HL14 reaching the other main surface is formed at the center position of one main surface of the insulating layer 124b.
- the size of the through hole HL14 is matched to the size of the RFIC chip 164.
- a coil pattern 204c extending in a strip shape using a flexible copper foil as a material is formed around the through hole HL14 on one main surface of the insulating layer 124b.
- One end of the coil pattern 204c is arranged at a position overlapping the first terminal electrode 144a in plan view, and is connected to the first terminal electrode 144a by an interlayer connection conductor 224a extending in the Z-axis direction.
- the other end of the coil pattern 204c is arranged at a position overlapping the second terminal electrode 144b in plan view, and is connected to the second terminal electrode 144b by an interlayer connection conductor 224b extending in the Z-axis direction.
- the interlayer connection conductors 224a and 224b and later-described interlayer connection conductors 244a and 244b are hard metal bulks mainly composed of Sn.
- the coil pattern 204c When one end of the coil pattern 204c is set as a start end, the coil pattern 204c extends twice around the one end in the clockwise direction and extends to the vicinity of the positive end in the Y-axis direction, and then in the X-axis direction. Extends to the positive side of the. Subsequently, the coil pattern 204c bends the vicinity of the positive end in the X-axis direction to the negative side in the Y-axis direction, makes two clockwise turns around the other end, and then reaches the other end.
- coil patterns 204a and 204b extending in a strip shape from a flexible copper foil are formed on one main surface of the insulating layer 124c.
- the coil pattern 201a rotates around the one end in the counterclockwise direction by 2.5 and then bends to the positive side in the Y-axis direction to reach the other end.
- the coil pattern 204b rotates around the one end in the clockwise direction by 2.5 and then bends to the positive side in the Y-axis direction to the other end.
- one end of the coil pattern 204a is connected to one end of the coil pattern 204c by an interlayer connection conductor 244a extending in the Z-axis direction
- one end of the coil pattern 204b is connected to the coil pattern by an interlayer connection conductor 244b extending in the Z-axis direction. It is connected to the other end of 204c.
- the power feeding circuit 18 is formed by the coil patterns 204a to 204c and the interlayer connection conductors 244a and 244b thus arranged.
- the conductor portion excluding the first coil end T12 in the coil pattern 204a is defined as “first coil portion CIL14”
- the conductor portion excluding the second coil end T24 in the coil pattern 204b is defined as “second coil portion CIL24”.
- the negative conductor portion in the X-axis direction from the through hole HL14 in the coil pattern 204c is defined as “third coil portion CIL34”
- the conductor portion is defined as “fourth coil portion CIL44”.
- the position of one end of the coil pattern 204a or one end of the coil pattern 204c corresponds to the “first position P1”, and the position of one end of the coil pattern 204b or the other end of the coil pattern 204c is “second position P2”.
- a first input / output terminal 164a and a second input / output terminal 164b are provided on the other main surface of the RFIC chip 164.
- the first input / output terminal 164a is disposed on the negative side in the X-axis direction
- the second input / output terminal 164b is disposed on the positive side in the X-axis direction.
- the RFIC chip 164 is mounted on one main surface of the insulating layer 124c so that the first input / output terminal 164a and the second input / output terminal 164b thus arranged are connected to the first coil end T14 and the second coil end T24.
- the number of turns of the third coil part CIL34 is larger than the number of turns of the third coil part CIL31, and the fourth coil part CIL44. Is greater than the number of turns of the fourth coil portion CIL41.
- the opening area of the first coil part CIL14 is smaller than the opening area of the first coil part CIL11, and the opening area of the second coil part CIL24 is smaller than the opening area of the second coil part CIL21.
- the opening center of the first coil portion CIL14 and the opening center of the third coil portion CIL34 do not overlap the first terminal electrode 142a, and the second coil portion CIL24 and the fourth coil portion CIL44.
- the opening center of the opening center does not overlap with the second terminal electrode 142b.
- the RFIC module 10 ′ of this embodiment omits the first terminal electrode 14a and the second terminal electrode 14b and the interlayer connection conductors 22a and 22b shown in FIG. Since it is the same as that of the RFIC module 10 shown in FIG. 1 except for a point, the overlapping description regarding the same structure is abbreviate
- the inductors L1 and L2 affect the resonance frequency, and the first coil part CIL1 and the second coil part CIL2 corresponding to the inductors L1 and L2, respectively, function as antenna elements.
- the two terminal electrodes for connection to the antenna conductors 34a and 34b shown in FIGS. 7A to 7B are omitted, and the first coil portion CIL1 and the third coil are further removed.
- the interlayer connection conductor to be extended from the connection point of the part CIL3 and the interlayer connection conductor to be extended from the connection point of the second coil part CIL2 and the fourth coil part CIL4 are also omitted. Thereby, a small RFID tag is obtained.
- the RFIC module 10 ′ is configured by omitting the first terminal electrode 141a, the second terminal electrode 141b, and the interlayer connection conductors 221a, 221b from the multilayer substrate 12 shown in FIGS. 17 (A) to 17 (C).
- the multi-layer substrate 12 shown in FIGS. 18A to 18C may be configured by omitting the first terminal electrode 142a, the second terminal electrode 142b, and the interlayer connection conductors 222a and 222b.
- the first terminal electrode 143a and the second terminal electrode 143b and the interlayer connection conductors 223a and 223b may be omitted from the multilayer substrate 12 shown in FIGS. 19A to 19C. May be configured by omitting the first terminal electrode 144a, the second terminal electrode 144b, and the interlayer connection conductors 224a, 2214 from the multilayer substrate 12 shown in FIGS. 20 (A) to 20 (C).
- FIG. 23A shows the multilayer substrate 12 shown in FIGS. 17A to 17C in which the first terminal electrode 141a, the second terminal electrode 141b, and the interlayer connection conductors 221a and 221b are omitted. This is shown in FIG.
- RFIC module 12 Multilayer substrate (substrate) 14a, 141a to 144a ... first terminal electrode 14b, 141b to 144b ... second terminal electrode 16a, 161a to 164a ... first input / output terminal 16b, 161a to 164a ... second input / output terminal 18 ... feeding circuit 20 ... coil conductor 20a to 20c, 201a to 201c, 202a to 202c, 203a to 203c, 204a to 204c ... Coil patterns CIL1, CIL11 to CIL14 ... 1st coil part CIL2, CIL21 to CIL24 ... 2nd coil part CIL3, CIL31 to CIL34 ... 3rd Coil part CIL4, CIL41 to CIL44 ... Fourth coil part 30a to 30e ... Antenna element
Abstract
Description
図1を参照して、この実施例のRFICモジュール10は、代表的には900MHz帯、つまりUHF帯の通信周波数に対応するRFICモジュールであり、主面が長方形をなす多層基板12を有する。多層基板12は、ポリイミドや液晶ポリマ等の可撓性の樹脂絶縁層を積層した積層体を素体としていて、多層基板12自体も可撓性を示す。これらの材料からなる各絶縁層の誘電率は、LTCCに代表されるセラミック基材層の誘電率よりも小さい。
[実施例2]
[実施例3]
[実施例4]
[実施例5]
[実施例6]
[実施例7]
[実施例8]
[実施例9]
[実施例10]
[実施例11]
12 …多層基板(基板)
14a,141a~144a …第1端子電極
14b,141b~144b …第2端子電極
16a,161a~164a …第1入出力端子
16b,161a~164a …第2入出力端子
18 …給電回路
20 …コイル導体
20a~20c,201a~201c,202a~202c,203a~203c,204a~204c …コイルパターン
CIL1,CIL11~CIL14 …第1コイル部
CIL2,CIL21~CIL24 …第2コイル部
CIL3,CIL31~CIL34 …第3コイル部
CIL4,CIL41~CIL44 …第4コイル部
30a~30e …アンテナ素子
Claims (16)
- 第1入出力端子および第2入出力端子を有して基板に搭載されたRFICチップと、
前記第1入出力端子および前記第2入出力端子にそれぞれ接続された第1コイル端および第2コイル端を有するコイル導体を含んで前記基板に内蔵された給電回路と、
前記基板の主面に設けられかつ前記コイル導体の第1位置に接続された第1端子電極と、
前記基板の主面に設けられかつ前記コイル導体の第2位置に接続された第2端子電極と、
を備えるRFICモジュールであって、
前記コイル導体は、前記第1コイル端から前記第1位置までの区間に存在し、前記基板の前記主面と交差する方向に第1巻回軸を有する第1コイル部、および前記第2コイル端から前記第2位置までの区間に存在し、前記基板の前記主面と交差する方向に第2巻回軸を有する第2コイル部を有し、
前記第1コイル部および前記第1巻回軸と前記第2コイル部および前記第2巻回軸とは、前記基板を平面視して前記RFICチップを挟む位置に配される、RFICモジュール。 - 前記RFICチップは前記基板に内蔵されており、前記給電回路は前記基板の所定側面に直交する方向から眺めて前記RFICチップと重なる位置に配される、請求項1記載のRFICモジュール。
- 前記基板は前記主面が長方形をなす可撓性の基板であり、
前記第1コイル部および前記第2コイル部は前記長方形を描く長辺の一方端側および他方端側にそれぞれ配される、請求項1または2記載のRFICモジュール。 - 前記第1コイル部および前記第2コイル部の各々は前記基板を平面視して前記RFICチップから離間した位置に配される、請求項1ないし3のいずれかに記載のRFICモジュール。
- 前記第1コイル部および前記第2コイル部は、各コイル部に生じる磁界が同相となるように、接続・巻回されている、請求項1ないし4のいずれかに記載のRFICモジュール。
- 前記基板を平面視して、前記第1端子電極は前記第1コイル部のコイル開口の中心とは重ならないように配置されており、前記第2端子電極は前記第2コイル部のコイル開口の中心とは重ならないように配置されている、請求項1ないし5のいずれかに記載のRFICモジュール。
- 前記コイル導体は、前記第1位置および前記第2位置の間に直列的に接続され、かつ前記基板を平面視して前記第1コイル部および前記第2コイル部とそれぞれ重なる第3コイル部および第4コイル部をさらに含む、請求項1ないし6のいずれかに記載のRFICモジュール。
- 前記給電回路は、前記基板を平面視して前記第1端子電極と重なる位置で前記基板の厚み方向に延在して前記第1コイル部および前記第3コイル部を直列接続する第1接続導体、および前記基板を平面視して前記第2端子電極と重なる位置で前記基板の厚み方向に延在して前記第2コイル部および前記第4コイル部を直列接続する第2接続導体をさらに含む、請求項7記載のRFICモジュール。
- 前記第1コイル部、前記第2コイル部、前記第3コイル部および前記第4コイル部は、前記コイル導体に生じる磁界が前記第1コイル部、前記第2コイル部、前記第3コイル部および前記第4コイル部の間で同相となるように、巻回かつ接続されている、請求項7または8記載のRFICモジュール。
- 前記第3コイル部および前記第4コイル部は前記第1および第2端子電極が形成された層に隣接した層に設けられており、前記第1コイル部および前記第2コイル部は前記第3コイル部および前記第4コイル部が設けられた前記層に隣接した層であって、前記第1および第2端子電極が形成された層とは反対側の層に設けられている、請求項5ないし9のいずれかに記載のRFICモジュール。
- 前記第1コイル部および前記第2コイル部のインダクタンス値は、前記第3コイル部および前記第4コイル部のインダクタンス値よりもそれぞれ大きい、請求項5ないし10のいずれかに記載のRFICモジュール。
- RFICモジュールと、前記RFICモジュールに接続されたアンテナ素子と、を有するRFIDタグであって、
前記RFICモジュールは、
第1入出力端子および第2入出力端子を有して基板に搭載されたRFICチップと、
前記第1入出力端子および前記第2入出力端子にそれぞれ接続された第1コイル端および第2コイル端を有するコイル導体を含んで前記基板に内蔵された給電回路と、
前記基板の主面に設けられかつ前記コイル導体の第1位置に接続された第1端子電極と、
前記基板の主面に設けられかつ前記コイル導体の第2位置に接続された第2端子電極と、
を備え、
前記コイル導体は、前記第1コイル端から前記第1位置までの区間に存在し、前記基板の前記主面と交差する方向に第1巻回軸を有する第1コイル部、および前記第2コイル端から前記第2位置までの区間に存在し、前記基板の前記主面と交差する方向に第2巻回軸を有する第2コイル部を有し、
前記第1コイル部および前記第1巻回軸と前記第2コイル部および前記第2巻回軸とは前記基板を平面視して前記RFICチップを挟む位置に配される、RFIDタグ。 - 前記アンテナ素子は、一端が前記第1端子電極に接続された第1アンテナ部、一端が前記第2端子電極に接続された第2アンテナ部を有したダイポール型アンテナ素子である、請求項12に記載のRFIDタグ。
- 前記アンテナ素子は、一端が前記第1端子電極、他端が前記第2端子電極にそれぞれ接続されたループ型アンテナ素子である、請求項12に記載のRFIDタグ。
- 第1入出力端子および第2入出力端子を有して基板に搭載されたRFICチップと、
前記第1入出力端子および前記第2入出力端子にそれぞれ接続された第1コイル端および第2コイル端を有するコイル導体を含んで前記基板に内蔵された給電回路と、
を備えるRFICモジュールであって、
前記コイル導体は、前記基板を平面視して前記RFICチップを挟む位置に配され、かつ直列的に接続された第1コイル部および第2コイル部を有し、
前記第1コイル部および前記第2コイル部は、前記基板を平面視して前記RFICチップを挟んで前記主面と交差する方向に延びる第1巻回軸および第2巻回軸をそれぞれ有する、RFICモジュール。 - 前記コイル導体は、前記第1コイル部および前記第2コイル部の間に直列的に接続され、かつ前記基板を平面視して前記第1コイル部および前記第2コイル部とそれぞれ重なる第3コイル部および第4コイル部をさらに含む、請求項15記載のRFICモジュール。
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WO2021049399A1 (ja) * | 2019-09-09 | 2021-03-18 | 株式会社村田製作所 | 電子部品モジュール |
US11164064B2 (en) | 2019-11-08 | 2021-11-02 | Murata Manufacturing Co., Ltd. | RFIC module and RFID tag |
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US11621493B2 (en) | 2019-11-25 | 2023-04-04 | Murata Manufacturing Co., Ltd. | RFIC module, RFID tag, method for manufacturing RFIC module, and method for manufacturing RFID tag |
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DE212020000738U1 (de) | 2019-12-17 | 2022-05-31 | Murata Manufacturing Co., Ltd. | RFIC-Modul und RFID-Etikett |
DE212020000494U1 (de) | 2019-12-23 | 2021-08-12 | Murata Manufacturing Co., Ltd. | RFIC-Module und RFID-Etikett |
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JP6977910B1 (ja) * | 2020-02-19 | 2021-12-08 | 株式会社村田製作所 | Rfidタグ用rficモジュールセット及びrfidタグセット |
US11837774B2 (en) | 2020-02-19 | 2023-12-05 | Murata Manufacturing Co., Ltd. | RFID tag RFIC module set and RFID tag set |
WO2021166315A1 (ja) * | 2020-02-19 | 2021-08-26 | 株式会社村田製作所 | Rfidタグ用rficモジュールセット及びrfidタグセット |
JP6947339B1 (ja) * | 2020-02-25 | 2021-10-13 | 株式会社村田製作所 | Rfidタグ用rficモジュール及びrfidタグ |
WO2021171672A1 (ja) * | 2020-02-25 | 2021-09-02 | 株式会社村田製作所 | Rfidタグ用rficモジュール及びrfidタグ |
DE212020000493U1 (de) | 2020-02-25 | 2021-08-10 | Murata Manufacturing Co., Ltd. | RFID-Etikett-RFIC-Modul und RFID-Etikett |
DE212020000721U1 (de) | 2020-02-27 | 2022-11-08 | Murata Manufacturing Co., Ltd. | IC-Modul |
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JP7294562B2 (ja) | 2021-04-01 | 2023-06-20 | 株式会社村田製作所 | Rfidモジュールを備えた容器 |
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WO2024009688A1 (ja) * | 2022-07-08 | 2024-01-11 | 大王製紙株式会社 | Rfidタグ |
Also Published As
Publication number | Publication date |
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EP3176734A1 (en) | 2017-06-07 |
JP6090549B2 (ja) | 2017-03-08 |
US9881248B2 (en) | 2018-01-30 |
CN110350296B (zh) | 2021-01-05 |
JPWO2016084658A1 (ja) | 2017-04-27 |
JP2017112634A (ja) | 2017-06-22 |
EP3176734A4 (en) | 2018-04-18 |
US20170083804A1 (en) | 2017-03-23 |
EP3176734B1 (en) | 2020-07-15 |
CN106462792A (zh) | 2017-02-22 |
CN110350296A (zh) | 2019-10-18 |
JP6288328B2 (ja) | 2018-03-07 |
US20180114104A1 (en) | 2018-04-26 |
CN106462792B (zh) | 2019-07-05 |
US10108896B2 (en) | 2018-10-23 |
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