WO2016076331A1 - 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体 - Google Patents
電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体 Download PDFInfo
- Publication number
- WO2016076331A1 WO2016076331A1 PCT/JP2015/081653 JP2015081653W WO2016076331A1 WO 2016076331 A1 WO2016076331 A1 WO 2016076331A1 JP 2015081653 W JP2015081653 W JP 2015081653W WO 2016076331 A1 WO2016076331 A1 WO 2016076331A1
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- WIPO (PCT)
- Prior art keywords
- electronic component
- cover tape
- sealant layer
- packaging
- heat sealant
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
- B32B27/365—Layered products comprising a layer of synthetic resin comprising polyesters comprising polycarbonates
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2405/00—Adhesive articles, e.g. adhesive tapes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2553/00—Packaging equipment or accessories not otherwise provided for
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
Definitions
- the present invention relates to an electronic component packaging cover tape, an electronic component packaging material, and an electronic component packaging.
- an electronic component storing carrier tape (hereinafter referred to as a tape for storing electronic components) having a recess capable of storing electronic components , which is simply referred to as “carrier tape”) is sealed with a top cover tape (hereinafter also simply referred to as “cover tape”). ing.
- a carrier tape As a carrier tape, a punch carrier tape in which a part of a belt-shaped sheet is penetrated by punching and a bottom tape is attached to the lower surface of the sheet to form a concave component storage part (pocket) (for example, patent document) 1), a press carrier tape (for example, see Patent Document 2) in which a part of the belt-like sheet is formed by compression processing, and a part of the belt-like sheet is molded (pressure forming, vacuum drum molding, press molding, etc.) ), And an embossed carrier tape (see, for example, Patent Document 3) in which a pocket is formed.
- a concave component storage part for example, patent document 1
- a press carrier tape for example, see Patent Document 2
- an embossed carrier tape see, for example, Patent Document 3 in which a pocket is formed.
- the recess 512 in which the electronic component 40 is accommodated is sealed with a cover tape 200, and usually the packaging material 1000 for packaging electronic components.
- the electronic component 40 is taken out from the carrier tape (base material) 500 by peeling the cover tape (sealing material) 200 to expose the concave portion 512, and thereby the electronic component 40 accommodated in the concave portion 512. Is performed by picking up using an electronic component suction nozzle or the like.
- Patent Document 4 discloses a base material layer (A), an intermediate layer (B), a release layer (C) mainly composed of a thermoplastic resin, and a heat mainly composed of a thermoplastic resin that can be heat sealed to a carrier tape.
- the tensile storage elastic modulus (c) at 23 ° C. of the thermoplastic resin comprising at least the sealing layer (D) and forming the release layer (C) is 1 ⁇ 10 6 Pa or more and 1 ⁇ 10 8 Pa or less, The tensile storage modulus (d) at 23 ° C.
- thermoplastic resin forming the heat seal layer (D) is 1 ⁇ 10 8 or more and 1 ⁇ 10 10 Pa or less, and the ratio of (c) and (d) is A cover tape is described wherein 1 ⁇ 10 4 ⁇ (d) / (c) ⁇ 1 ⁇ 10.
- the surface on the carrier tape 500 side needs to have adhesiveness to the carrier tape 500 in order to seal the recess 512 in which the electronic component 40 is accommodated.
- the electronic component 40 may adhere to the surface of the adhesive cover tape 200 on the carrier tape 500 side, and the cover tape 200 may be peeled off from the carrier tape 500.
- the component 40 is attached not to the recess 512 but to the cover tape 200.
- the electronic component 40 cannot be accurately picked up from the recess 512 by the electronic component suction nozzle.
- the sealing material when the electronic component 40 uses a sealing material composed of a resin mainly composed of polyorganosiloxane, such as a light emitting diode, the sealing material has high tackiness, and as a result. The above problems are remarkably recognized.
- An object of the present invention is to provide a cover tape that can be used as a packaging material for packaging an electronic component that can take out an electronic component from a recess provided in the carrier tape with excellent accuracy, and a packaging material for packaging an electronic component that includes the cover tape.
- Another object of the present invention is to provide an electronic component packaging body in which electronic components are stored in the packaging material for packaging electronic components.
- the present invention provides a cover tape for packaging electronic parts that has both heat sealability to a carrier tape and low adhesion to electronic parts.
- the present inventor has intensively studied in order to achieve the above problems. As a result, it has been found that adhesion of electronic components can be effectively prevented by increasing the softening point of the adhesive resin in the heat sealant layer of the cover tape. However, while the adhesion of electronic components can be effectively prevented, the heat sealability to the carrier tape has deteriorated. That is, the present inventor has a trade-off relationship between the heat sealability to the carrier tape and the low adhesion to the electronic component, and the trade-off relationship is the softening of the adhesive resin in the heat sealant layer. It was clarified that it cannot be improved only by adjusting the points. Therefore, the present inventors conducted further intensive studies.
- the present invention has been completed by finding that a cover tape having both heat sealability to a carrier tape and low adhesion to electronic components can be obtained.
- a carrier tape having a concave portion capable of accommodating an electronic component on one surface, an electronic component accommodated in the concave portion, and a cover that covers the concave portion in which the electronic component is accommodated by sealing the carrier tape.
- An electronic component packaging cover tape used for an electronic component packaging body comprising a tape, A base material layer, and a heat sealant layer laminated on one surface of the base material layer and sealed by the carrier tape;
- the heat sealant layer has a surface roughness Rz (specified in JIS B 0601) of 1.0 ⁇ m or more, and an adhesive strength with a resin layer containing polyorganosiloxane as a main component is 0.3 g / mm 2 or less.
- a cover tape for packaging electronic parts characterized by being.
- the electronic component packaging cover tape according to (1) wherein the total light transmittance (as defined in JIS K 7361-1) is 80% or more.
- the said heat sealant layer is a cover tape for electronic component packaging as described in (1) or (2) which contains an ethylene-type copolymer as a main material.
- An electronic component packaging cover tape used for an electronic component packaging body comprising: A base material layer, and a heat sealant layer that is laminated on one surface of the base material layer and contains an adhesive resin; The static friction coefficient of the surface of the heat sealant layer at a load N 1 (50 g) measured according to JIS K7125 is ⁇ 50, and the static friction coefficient of the surface of the heat sealant layer at a load N 2 (200 g) is ⁇ 200 .
- the cover tape for electronic component packaging whose Vicat softening point measured based on JISK7206 of the said adhesive resin in the said heat sealant layer is 30 degreeC or more and less than 70 degreeC.
- a packaging material for electronic component packaging comprising: a concave portion capable of accommodating an electronic component on one surface; and a carrier tape having the concave portion covered with the electronic component packaging cover tape.
- a carrier tape having a concave portion on one side in which an electronic component can be stored An electronic component housed in the recess, Electronic component packaging comprising the electronic component packaging cover tape according to any one of (1) to (18), wherein the concave portion in which the electronic component is accommodated is sealed by sealing the carrier tape on the one surface side. body.
- the packaging material for electronic component packaging to which the cover tape of the present invention is applied (the packaging material for electronic component packaging of the present invention)
- the electronic component stored in the recess is removed. Adhering to the cover tape side can be accurately suppressed or prevented, and the electronic component can be accurately stored in the recess. Therefore, the electronic component can be picked up more accurately using the electronic component suction nozzle or the like.
- the packaging material for electronic component packaging to which the cover tape of the present invention is applied (the packaging material for electronic component packaging of the present invention)
- the trade-off relationship can be improved, and the heat sealability to the carrier tape, Both low adhesion to electronic components.
- FIG. 2 is a cross-sectional view taken along line BB of the electronic component packaging material shown in FIG.
- FIG. 2 is a cross-sectional view taken along line CC of the electronic component packaging material shown in FIG.
- FIG. 2 is a fragmentary perspective view which shows the conventional packaging material for electronic component packaging.
- a packaging material for packaging electronic parts (a packaging material for packaging electronic parts of the present invention) provided with the cover tape of the present invention will be described.
- FIG. 1 is a partial perspective view showing an embodiment of a packaging material for electronic component packaging according to the present invention
- FIG. 2 is a diagram of the packaging material for packaging electronic component shown in FIG. 1 as viewed from the direction of arrow A
- FIG. FIG. 4 is a cross-sectional view taken along line BB of the electronic component packaging material shown in FIG. 1
- FIG. 4 is a cross-sectional view taken along line CC of the electronic component packaging material shown in FIG.
- the upper side in FIGS. 1, 3 and 4 is referred to as “upper”
- the lower side is referred to as “lower”
- the front side in FIG. 2 is referred to as “upper”
- the packaging material 10 for packaging an electronic component is used for packaging (accommodating) an electronic component, has a band shape, and has a recess (electronic component accommodating recess; pocket) 12 that can accommodate an electronic component (not shown).
- a carrier tape (hereinafter also referred to simply as “carrier tape”) 1 provided on one surface (upper surface) 15 and the first surface 15 side are joined to the carrier tape 1 to be recessed 12 of the carrier tape 1.
- a top cover tape hereinafter also simply referred to as “cover tape” 20 for sealing (covering) the opening. That is, the packaging material 10 for packaging an electronic component has, for example, a cover tape 20 for packaging an electronic component and a recess 12 that can store the electronic component on one surface (first surface 15). And the carrier tape 1 with the recess 12 covered.
- the carrier tape (base material) 1 shown in FIGS. 1 to 4 is made of a resin made of a belt-like sheet, and is arranged on the first surface 15 on the upper side of the carrier tape 1 in a line along its longitudinal direction. And a plurality of feed holes 11 arranged in a row so as to be parallel to the plurality of recesses 12.
- the 2nd surface 13 on the opposite side (lower side) of the 1st surface 15 in the carrier tape 1 is substantially flat.
- the carrier tape 1 has a bottomed recess 12 that opens to the first surface 15, and a feed hole 11 that penetrates the first surface 15 and the second surface 13.
- the surface 13 is configured by a surface having substantially no step near the bottom of the recess 12 and the outer periphery thereof.
- the plurality of recesses 12 are provided at equal intervals so as to be arranged in a line on the first surface 15 along the longitudinal direction of the belt-like sheet.
- Each of these recesses 12 can store an electronic component.
- the electronic component generally has a rectangular parallelepiped shape, and in this embodiment, as shown in FIGS. 1 and 2, the shape of the recess 12 for accommodating the electronic component is also corresponding to this. It has a rectangular parallelepiped shape. Therefore, in the present embodiment, the shape of the recess 12 in plan view is rectangular, but in accordance with the shape of the electronic component to be stored, a polygonal shape such as a triangle, pentagon, or hexagon, or a circular shape Etc. may be made.
- a ridge or a groove may be formed along the thickness direction of the carrier tape 1 in consideration of the pickup property of the electronic component suction nozzle.
- a step may be provided on the bottom surface of the recess 12.
- the plurality of feed holes 11 are provided in a row and at equal intervals so as to be parallel to the plurality of recesses 12. These feed holes 11 are used when feeding the electronic component stored in the recess 12 to an electronic component package manufacturing machine, a surface mounter, or the like. That is, it is used when applied to a method for manufacturing an electronic component package and a method for taking out an electronic component.
- the average inner diameter ⁇ is preferably set to about 1.5 to 1.6 mm, more preferably 1. It is set to about 5 to 1.55 mm.
- the average inner diameter ⁇ is preferably set to about 0.76 to 0.84 mm, more preferably about 0.78 to 0.82 mm.
- the plurality of recesses 12 and the plurality of feed holes 11 are provided so as to be arranged in a line along the longitudinal direction of the belt-like sheet.
- the interval at which each is disposed is not particularly limited.
- two or more recesses 12 may be disposed between the two feed holes 11 in the longitudinal direction, or two feeds may be provided.
- One recess 12 may be disposed between the holes 11.
- the carrier tape 1 provided in the electronic component packaging material 10 is made of resin.
- resin By being made of resin, when feeding, fine powder such as paper powder is not generated from the carrier tape 1 itself, and it is possible to prevent the occurrence of poor solder joints of electronic parts and clogging of electronic part suction nozzles. it can. Moreover, the dimensional change of the recessed part 12 by the standing in the recessed part 12 and moisture absorption can be prevented. Thereby, it is possible to sufficiently cope with the cleanliness, improve the stability of taping and surface mounting, and improve the productivity.
- the strength of the carrier tape 1 increases due to being made of resin.
- the feed holes 11 of the carrier tape 1 are Deformation and breakage of the carrier tape 1 can be prevented.
- poor feeding can be sufficiently suppressed, storage stability during taping and pick-up performance during mounting can be improved, and stability of taping and surface mounting can be improved and productivity can be improved.
- the resin constituting the carrier tape 1 is not particularly limited, but various resins such as polycarbonate, polystyrene, polyethylene, polypropylene, polyester (polyethylene terephthalate, etc.), polyvinyl chloride, polyamide, polyacetal (various thermoplastics). Resin), and one or more of them can be used in combination. Among these, at least one selected from polycarbonate and polystyrene is preferably used. In recent years, with the downsizing of electronic components, the carrier tape 1 having a narrow width of about 8 mm is preferably used.
- the carrier tape 1 is strongly developed to be narrow and long, and as a result, the carrier tape 1 is composed of a resin whose main material is polycarbonate and / or polystyrene, which is a rigid resin. Has come to be used. And as resin which comprises the carrier tape 1, what uses polycarbonate and / or styrene as a main material is used, and also the heat sealant layer 22 with which the cover tape 20 is provided is surface roughness Rz (JIS) as will be described later.
- JIS surface roughness
- the heat sealant layer 22 and the carrier tape may be combined with a resin layer containing a polyorganosiloxane and having an adhesive strength of 0.3 g / mm 2 or less.
- the sealing property (adhesiveness) with 1 can be ensured.
- conductive fillers such as carbon black, graphite, and carbon fiber are mixed with these resins.
- conductivity can be imparted to the carrier tape 1 and charging of the carrier tape 1 can be effectively suppressed, destruction of electronic components due to static electricity can be suppressed.
- you may add various additives, such as a foaming agent and a lubricant, as needed.
- a release agent made of a silicone resin, a fluorine resin, or a conductive film may be formed on the surface of the carrier tape 1.
- the layer structure of the carrier tape 1 may be a single layer or a multilayer that satisfies these requirements.
- the recessed part 12 is formed in the 1st surface 15 of the carrier tape 1, and the 2nd surface 13 on the opposite side of the 1st surface 15 in the carrier tape 1 is substantially flat. That is, the 2nd surface 13 is comprised by the surface which does not have a level
- the carrier tape 1 can be used similarly to a punch carrier tape or a press carrier tape by using a taping machine or a mounting machine for a punch carrier tape or a press carrier tape.
- the second surface 13 is substantially flat, so that it is possible to prevent collapse or loosening. Thereby, the deformation
- the size of the recess 12 is determined by the size of the electronic component to be packaged.
- the size of the recess 12 is D (mm), E (mm), D ⁇ E, and the size of the electronic component is X (mm), Y (Mm), where X ⁇ Y, 0 ⁇ DX ⁇ 0.3 and 0 ⁇ EY ⁇ 0.3 are preferably satisfied, 0.05 ⁇ DX ⁇ 0.15, 0. 05 ⁇ EY ⁇ 0.15 is more preferable.
- the cover tape 20 has a band shape and is bonded (sealed) to the first surface 15 of the carrier tape 1 so as to seal (cover) the opening of the recess 12 of the carrier tape 1. is doing.
- the cover tape 20 is joined to the carrier tape 1 on the first surface 15 side of the carrier tape 1 in a state where the electronic component is housed in the recess 12, and after being stored and transported in this state, the carrier tape 1 After that, the electronic component is used to pick up (take out) the electronic component housed in the recess 12 using an electronic component suction nozzle or the like.
- such a cover tape 20 (cover tape of the present invention) has a base material layer 21 and a heat sealant layer 22 laminated on the base material layer 21 as shown in FIGS. Then, the heat sealant layer 22 is sealed to the first surface 15 of the carrier tape 1 with the carrier tape 1 side.
- the heat sealant layer 22 provided in the cover tape 20 has a surface roughness Rz (specified in JIS B 0601) of 1.0 ⁇ m or more, and an adhesive strength with a resin layer containing polyorganosiloxane as a main component is 0. .3 g / mm 2 or less.
- the heat sealant layer 22 has a surface roughness of 1.0 ⁇ m or more at a 10-point average roughness Rz, which is a surface roughness measured in accordance with JIS B 0601.
- the adhesive strength between the layer 22 and the resin layer containing polyorganosiloxane as a main component can be set to 0.3 g / mm 2 or less while maintaining the adhesiveness (bondability) to the carrier tape 1.
- the electronic component housed in the recess 12 is made of a resin whose main component is polyorganosiloxane, such as a light-emitting diode, and the sealing material has high tackiness.
- the adhesive strength with the resin layer containing polyorganosiloxane as a main component is set to a low adhesive strength such that it is 0.3 g / mm 2 or less, the cover tape 20 is peeled off from the carrier tape 1. At this time, it is possible to accurately suppress or prevent the electronic component from adhering to the cover tape 20 side. Therefore, since the electronic component can be accurately stored in the recess 12, the electronic component can be picked up more accurately using the electronic component suction nozzle or the like.
- the surface roughness Rz of the heat sealant layer 22 may be 1.0 ⁇ m or more, but is preferably 1.0 ⁇ m or more and 6.0 ⁇ m or less, and is 1.0 ⁇ m or more and 3.0 ⁇ m or less. It is more preferable.
- the size of the surface roughness Rz within such a range, it is possible to more accurately prevent the electronic component from adhering to the heat sealant layer 22 while reliably maintaining the sealing property (bondability) to the carrier tape 1. It can be suppressed or prevented. That is, the adhesive strength with the resin layer containing polyorganosiloxane can be more reliably set to 0.3 g / mm 2 or less while reliably maintaining the sealing property (bondability) to the carrier tape 1.
- the adhesive strength between the heat sealant layer 22 and the resin layer containing polyorganosiloxane may be 0.3 g / mm 2 or less, preferably 0.1 g / mm 2 or less, and 0.05 g / mm 2. More preferably, it is 2 mm or less.
- the adhesive strength with the resin layer containing the polyorganosiloxane of the heat sealant layer 22 can be measured as follows, for example. That is, first, the resin layer containing polyorganosiloxane and the heat sealant layer 22 are bonded together by placing a 1 kg weight on the cover tape 20 in a state where the heat sealant layer 22 is placed on the upper side. Next, the heat sealant layer 22 (cover tape 20) is peeled from the resin layer containing polyorganosiloxane by applying a force to separate the silicone resin layer and the heat sealant layer 22, and the initial value measured at this time is measured. It is calculated as tack force (adhesiveness) obtained based on the difference between the load increase amount (Max value) and the subsequent steady load (weight load).
- the heat sealant layer (heat seal layer) 22 stores the heat sealant layer 22 in which electronic parts (50, manufactured by Sharp Corporation, “GM4ZR83232AE”) are in close contact with each other at 65 ° C. for 24 hours.
- the residual rate of the electronic component is preferably less than 40%, and more preferably the residual rate of the electronic component is less than 30%. It can be said that the electronic component remaining rate is less than the upper limit value so that the electronic component is accurately suppressed from adhering to the cover tape 20 side.
- the resin layer preferably has a hardness measured with a JIS Type A hardness tester of 20 or more and a hardness measured with a Shore D model hardness test of 70 or less, and was measured with a JIS Type A hardness tester.
- the hardness is preferably set to 35 or more and the hardness measured with a Shore-D type hardness tester is 55 or less.
- the heat sealant layer 22 provided in such a cover tape 20 has an adhesive strength with the resin layer containing the polyorganosiloxane of 0.3 g / mm 2 or less when the surface roughness Rz is 1.0 ⁇ m or more.
- Any resin can be used as long as it is obtained.
- the resin constituting the heat sealant layer 22 include a polypropylene resin, a polycarbonate resin, a (meth) acrylic resin, a polyethylene resin, a polystyrene resin, a polyester resin, and the like.
- a combination of more than one species can be used. Among these, it is preferable to use a polyethylene resin as a main material.
- the carrier tape 1 is composed of, for example, polycarbonate as a main material, the sealing property (adhesiveness) between the heat sealant layer 22 and the carrier tape 1 can be reliably ensured,
- the surface roughness Rz (specified in JIS B 0601) of the heat sealant layer 22 is 1.0 ⁇ or more, the adhesive strength with the resin layer containing polyorganosiloxane is more reliably 0.3 g / mm 2 or less.
- the sealing property is the cover when the cover tape 20 is heat-sealed to the carrier tape 1 at 220 ° C. for 0.015 seconds and then peeled off from the carrier tape 1 in accordance with JIS C-0806-3. It means that the peel strength of the tape 20 is 20 gf or more, and it may be 20 gf or more, but it is preferably 30 gf or more and 50 gf or less. Thereby, it is possible to accurately prevent the cover tape 20 from being peeled off from the carrier tape 1 during storage and transportation of the electronic component package, and at the time of picking up the electronic component housed from the recess 12, the cover tape 20 can be easily peeled off from the carrier tape 1.
- the peel strength is determined by, for example, bonding JIS C-0806- after the carrier tape 1 having a width of 8 mm and the cover tape 20 having a length of 500 mm and a width of 5 mm are bonded to each other on the surface on the heat sealant layer 22 side. 3, the measurement speed is 300 mm / min, and the average peel strength when the cover tape 20 is peeled off can be calculated.
- polyethylene resins include ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-butyl acrylate copolymer (EBA), and ethylene-methyl methacrylate copolymer.
- EMA ethylene-methyl acrylate copolymer
- EAA ethylene-ethyl acrylate copolymer
- EBA ethylene-butyl acrylate copolymer
- ethylene-methyl methacrylate copolymer examples include ethylene-methyl acrylate copolymer (EMA), ethylene-ethyl acrylate copolymer (EEA), ethylene-butyl acrylate copolymer (EBA), and ethylene-methyl methacrylate copolymer.
- EMMA ethylene- (meth) acrylate copolymer, ethylene-vinyl acetate copolymer (EVA), styrene- (meth) acrylate copolymer (MS), graft copolymer of polyethylene glycol and polypropylene
- EMMA ethylene- (meth) acrylate copolymer
- EVA ethylene-vinyl acetate copolymer
- MS styrene- (meth) acrylate copolymer
- SEBS polymer obtained by hydrogenating a double bond of a block copolymer of styrene and butadiene.
- the weight average molecular weight of the resin constituting the heat sealant layer 22 is not particularly limited, but is preferably about 6,000 to 700,000, and more preferably about 10,000 to 500,000.
- the film formability of the heat sealant layer 22 can be improved, and between the heat sealant layer 22 and the carrier tape 1.
- the sealing property (adhesiveness) can be reliably ensured.
- the weight average molecular weight of resin which comprises the heat sealant layer 22 can be measured by GPC (gel permeation chromatography), for example.
- the heat sealant layer 22 is added with a cohesion adjusting resin, an adhesive adjusting resin, etc. within a range that does not adversely affect the adhesive strength with the silicone resin layer containing polyorganosiloxane and the adhesive resin with the carrier tape 1. can do.
- the adhesiveness adjusting resin is not particularly limited as long as it can adjust the adhesiveness, but is preferably an olefin resin, more preferably a polyethylene resin, for example, low density polyethylene, medium density polyethylene, high density polyethylene, linear And low density polyethylene.
- the density is less than 900 g / m 3 or more 920 g / m 3, melting point 100 ° C. or higher 120 than ° C., preferably less than MFR1.0g / 10min or 5 g / 10min.
- the cohesive force adjusting resin makes it easy to separate the carrier tape 1 and the cover tape 20 by adjusting the cohesive failure of the heat sealant layer (heat seal layer) 22 when peeling the cover tape 20 from the carrier tape 1. Used for.
- the cohesive force adjusting resin is not particularly limited as long as it can adjust cohesive failure, but is preferably a styrene resin, such as polystyrene, styrene / butadiene / styrene block copolymer (SBS), styrene / ethylene / Butadiene / styrene block copolymer (SEBS), styrene / isoprene / styrene block copolymer (SIS), styrene / ethylene / propylene / styrene block copolymer (SEPS), styrene-methyl acrylate copolymer, styrene- Examples include methyl methacrylate copolymer and hydrogenated styrene block copolymer.
- SBS polystyrene, styrene / butadiene / styrene block copolymer
- the cohesive strength adjusting resin is preferably 5% by weight or more and 60% by weight or less, preferably 10% by weight or more and 50% by weight or less with respect to the resin composition constituting the heat sealant layer (heat seal layer) 22. Is more preferable.
- the effect of facilitating cohesive failure can be obtained by being at least the lower limit value, and the effect of not inhibiting the adhesiveness can be obtained by being at most the upper limit value.
- the heat sealant layer 22 can further contain an antistatic resin.
- the antistatic resin is not particularly limited.
- Polystyrene sulfonate soda and the like Among these, a polyether / polyolefin copolymer is preferable.
- the polyether / polyolefin copolymer has high antistatic performance, excellent transparency after baking, and good mixing with an adhesive resin. By including an antistatic resin, it becomes possible to impart conductivity.
- the antistatic resin is preferably 10% by mass or more and 40% by mass or less with respect to the resin composition constituting the heat sealant layer (heat seal layer) 22.
- the thickness of the heat sealant layer 22 is preferably 1 ⁇ m or more and 15 ⁇ m or less, and more preferably 5 ⁇ m or more and 13 ⁇ m or less.
- the surface roughness Rz of the heat sealant layer 22 can be set to 1.0 ⁇ m or more, and the heat sealant layer 22 having the surface roughness Rz has a sealing property (adhesiveness) to the carrier tape 1.
- the adhesive strength with the silicone resin layer containing polyorganosiloxane can be set to 0.3 g / mm 2 or less.
- base material layer 21 is processed with various materials as appropriate depending on the application if it has mechanical strength that can withstand external force applied during tape processing or heat sealing to a carrier tape, and heat resistance that can withstand heat sealing. Film can be used.
- polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, polyvinyl chloride, polyacrylate, polymethacrylate, polyimide, polyetherimide, polyarylate, polysulfone, Polyethersulfone, polyphenylene ether, polycarbonate, ABS resin and the like are examples of the material for the base layer film.
- polyethylene terephthalate, nylon 6, nylon 66 and the like are preferable.
- a laminate of two or more layers selected from the exemplified resins may be used as the base material layer 21 .
- the weight average molecular weight of the resin constituting the substrate layer 21 is not particularly limited, but is preferably about 8,000 to 1,000,000, and more preferably about 8,500 to 950,000. By setting the weight average molecular weight of the resin constituting the base material layer 21 within the above range, the base material layer 21 can be provided with excellent flexibility.
- the weight average molecular weight of resin which comprises the base material layer 21 can be measured by GPC (gel permeation chromatography), for example.
- an unstretched film may be used for the base material layer 21, it is preferable to use a film stretched uniaxially or biaxially in order to increase the mechanical strength of the entire cover tape.
- a film stretched uniaxially or biaxially in order to increase the mechanical strength of the entire cover tape.
- the thickness of the base material layer 21 is preferably 7 ⁇ m or more and 30 ⁇ m or less, and more preferably 10 ⁇ m or more and 25 ⁇ m or less. Thereby, the base material layer 21 can be provided with excellent flexibility. If the thickness of the base material layer 21 is not more than the above upper limit value, the rigidity of the cover tape does not become too high, and even when a twist stress is applied to the carrier tape 1 after heat sealing, the cover tape 20 Is less likely to follow the deformation of the carrier tape 1 and cause peeling.
- the thickness of the base material layer 21 is equal to or greater than the above lower limit value, the mechanical strength of the cover tape 20 will be suitable, and the cover will be covered during high-speed peeling when taking out the electronic component housed in the recess 12. The problem that the tape 20 is broken can be suppressed.
- the base material layer may have an antistatic agent, a slip agent, and an antiblocking agent as long as the characteristics are not impaired.
- such a cover tape 20 preferably has light transmittance (transparency). Thereby, even before the cover tape 20 is peeled from the carrier tape 1, the state in the recess 12, for example, whether or not the electronic component is stored, the stored state of the electronic component, and the like can be confirmed through the cover tape 20. .
- the degree of light transmittance is preferably 80% or more, more preferably 85% or more, as defined in JIS K 7361-1.
- the haze (specified in JIS K 7136) of the cover tape 20 is preferably 70% or less, and more preferably 30% or less.
- the state in the recess 12 can be confirmed (visually) more reliably via the cover tape 20.
- the electronic component is packaged by bonding the cover tape 20 to the carrier tape 1 so that the electronic component is accommodated in the recess 12 of the packaging material 10 for packaging electronic components according to the present embodiment, and then the recess 12 is covered.
- An electronic component package (electronic component package of the present embodiment) in which electronic components are stored in the packaging material 10 is obtained. That is, the electronic component package according to the present embodiment includes, for example, the carrier tape 1 having the concave portion 12 that can store the electronic component on one surface (first surface 15), the electronic component stored in the concave portion 12, An electronic component wrapping cover tape 20 is provided to cover the recess 12 in which the electronic component is housed by sealing the carrier tape 1 on the surface (first surface 15) side.
- joining of the carrier tape 1 and the cover tape 20 is normally performed by heat sealing.
- the heat sealing is performed along each edge of the long side of the cover tape 20 using a sealing machine.
- the electronic component is of a size that can be accommodated in the concave portion 12 of the carrier tape 1.
- a resistor, a capacitor, a light emitting diode, a semiconductor element (semiconductor chip), a semiconductor package including the semiconductor element, and the like can be used.
- the packaging material 10 for electronic component packaging is used especially preferable for accommodation of a light emitting diode as an electronic component.
- the sealing material is usually composed of a resin (silicone sealing material) containing polyorganosiloxane having high tackiness.
- the cover tape 20 of this embodiment has a low adhesive strength with respect to the silicone sealing material. Therefore, even if the light emitting diode is housed in the recess 12, when the cover tape 20 is peeled from the carrier tape 1, it is possible to accurately suppress or prevent the electronic component from adhering to the cover tape 20 side.
- the electronic component packaging material 10 and the electronic component package are wound and stored and transported by winding the second surface 13 on the reel (core material) side. Thereby, space saving at the time of storage and transportation of the packaging material 10 for electronic component packaging and the electronic component package is achieved.
- the electronic component packaging cover tape, the electronic component packaging packaging material, and the electronic component packaging body of the second embodiment are the electronic component packaging cover tape, the electronic component packaging packaging material, and the electronic component of the first embodiment.
- the package and the electronic component packaging cover tape are different.
- the electronic component packaging cover tape 20 includes a base material layer 21 and a heat sealant layer 22 provided on one surface of the base material layer 21 and containing an adhesive resin.
- the cover tape 20 has a change amount of the static friction coefficient represented by ( ⁇ 50 ⁇ 200 ) / (N 2 ⁇ N 1 ) ⁇ 1000 of 3.0 or less.
- ⁇ 50 is a static friction coefficient of the surface of the heat sealant layer 22 at a load N 1 (50 g)
- ⁇ 200 is a static friction coefficient of the surface of the heat sealant layer 22 at a load N 2 (200 g).
- the Vicat softening point of the adhesive resin in the heat sealant layer 22 is 30 ° C. or higher and lower than 70 ° C.
- the heat sealability to the carrier tape 1 can be improved. It is possible to realize the cover tape 20 that is excellent in the adhesion preventing property of electronic components while being good.
- the heat sealant layer 22 is a layer provided on one surface of the base material layer 21. The surface of the heat sealant layer 22 is located on the side in contact with the carrier tape 1.
- the cover tape 20 has, for example, a band shape, and is attached to the first surface 15 of the carrier tape 1 so as to seal (cover) the opening of the recess 12 of the carrier tape 1. Used together (sealed).
- the cover tape 20 is joined to the carrier tape 1 on the first surface 15 side of the carrier tape 1 in a state where the electronic component is housed in the recess 12, and after being stored and transported in this state, the cover tape 20 is removed from the carrier tape 1. After being peeled off, the electronic component is used for picking up (removing) the electronic component housed in the recess 12 using an electronic component suction nozzle or the like.
- a cover tape 20 has a base material layer 21 and a heat sealant layer 22 laminated on the base material layer 21, as shown in FIGS. Is sealed to the first surface 15 of the carrier tape 1 on the carrier tape 1 side.
- the present inventor has intensively studied in order to achieve the above problems. As a result, it has been found that adhesion of electronic components can be effectively prevented by increasing the softening point of the adhesive resin in the heat sealant layer of the cover tape. However, while the adhesion of electronic components can be effectively prevented, the heat sealability to the carrier tape has deteriorated. That is, the present inventor has a trade-off relationship between the heat sealability to the carrier tape and the low adhesion to the electronic component, and the trade-off relationship is the softening of the adhesive resin in the heat sealant layer. It was clarified that it cannot be improved only by adjusting the points.
- the present inventor's confirmation in the conventional cover tape, the amount of change in the static friction coefficient on the surface of the heat sealant layer exceeded the upper limit. That is, the state of the surface of the heat sealant layer is easily changed by contact with the electronic component. Therefore, the present inventor considered that adhesion of electronic components is likely to occur. Therefore, the present inventor has further studied earnestly. As a result, by adjusting the change amount of the static friction coefficient of the heat sealant layer surface constituting the cover tape and the Vicat softening point of the adhesive resin in the heat sealant layer to a specific range, the above trade-off relationship can be improved, The present invention has been completed by finding that a cover tape having both heat sealability to a carrier tape and low adhesion to electronic components can be obtained.
- the amount of change in the static friction coefficient on the surface of the heat sealant layer 22 and the Vicat softening point of the adhesive resin in the heat sealant layer 22 satisfy specific conditions. .
- the amount of change in the static friction coefficient on the surface of the heat sealant layer 22 equal to or less than the above upper limit value, it is possible to improve the adhesion preventing property of the electronic component.
- the heat seal property to a carrier tape can be made favorable by making the Vicat softening point of the adhesive resin in the heat sealant layer 22 within the above range.
- the amount of change in the static friction coefficient on the surface of the heat sealant layer 22 is 3.0 or less, preferably ⁇ 2.0 or more and 2.5 or less, more preferably ⁇ 1.5 or more and 2.0 or less.
- the static friction coefficient can be measured in accordance with JIS K7125 using, for example, a Tensilon universal material tester (product name: RTF-1250) manufactured by A & D.
- the Vicat softening point of the adhesive resin in the heat sealant layer 22 is 30 degreeC or more and less than 70 degreeC, Preferably it is 35 degreeC or more and 65 degrees C or less, More preferably, it is 40 degreeC. It is 60 degrees C or less.
- the Vicat softening point of the adhesive resin in the heat sealant layer 22 is set to or higher than the above lower limit value, it is possible to further improve the adhesion preventing property of the electronic component.
- the heat sealability to the carrier tape can be further improved.
- the Vicat softening point of the adhesive resin in the heat sealant layer 22 can be measured according to JIS K7206.
- the cover tape 20 according to the present embodiment can be heat-sealed at a low temperature even in the carrier tape 1 containing polycarbonate or polystyrene, which is a highly rigid resin. Even if the baking process is performed with the cover tape 20 heat-sealed to the carrier tape 1, the electronic components do not adhere to the cover tape 20, and the electronic components can be sufficiently identified and inspected by the sensor or the like by the baking process. Maintain as much transparency as possible.
- the amount of change in the static friction coefficient of the heat sealant layer 22 in the cover tape 20 can be adjusted by appropriately adjusting the types and blending ratios of the components constituting the heat sealant layer 22 and the method for producing the cover tape 20. It is possible to control.
- the type of the adhesive resin, the cohesive force adjusting resin, the adhesive adjusting resin, and the antistatic resin that constitute the heat sealant layer 22 is selected appropriately, and the surface roughness of the heat sealant layer 22 is determined. Adjustment and the like can be cited as a factor for controlling the amount of change in the static friction coefficient.
- the surface roughness of the heat sealant layer 22 can be adjusted, for example, by roughening the surface of the heat sealant layer 22 using a roll having protrusions when the heat sealant layer 22 is formed.
- the coefficient of static friction ⁇ 50 on the surface of the heat sealant layer 22 at a load N 1 (50 g) is preferably 0.5 or more and 3.0 or less, more preferably 1.0 or more. 5 or less.
- the electronic component housed in the recess 12 is, for example, a sealing material that constitutes the electronic component, such as a light emitting diode, is configured with a silicone sealing material, and this sealing material has high tackiness.
- a sealing material that constitutes the electronic component such as a light emitting diode
- this sealing material has high tackiness.
- the cover tape 20 of the present embodiment has a low adhesive strength with respect to the silicone sealing material, when the cover tape 20 is peeled off from the carrier tape 1, it is possible to accurately attach the electronic component to the cover tape 20 side. Can be suppressed or prevented. Therefore, since the electronic component can be accurately stored in the recess 12, the electronic component can be picked up more accurately using the electronic component suction nozzle or the like.
- the arithmetic average height (Sa) of the surface of the heat sealant layer 22 is preferably 0.4 ⁇ m or more and 0.7 ⁇ m or less. Thereby, when peeling the cover tape 20 from the carrier tape 1, it can suppress or prevent more precisely that an electronic component adheres to the cover tape 20 side.
- the arithmetic average height (Sa) of the surface of the heat sealant layer 22 is, for example, in accordance with ISO-25178 using a white interferometer (product name: VertScan (registered trademark)) manufactured by Ryoka System. Can be measured.
- the width of the cover tape 20 according to this embodiment is preferably 1 mm or more and 100 mm or less, more preferably 2 mm or more and 80 mm or less, and most preferably 2 mm or more and 50 mm or less.
- the cover tape 20 according to the present embodiment preferably has light transmittance (transparency). Thereby, even before the cover tape 20 is peeled from the carrier tape 1, the state in the recess 12, for example, whether or not the electronic component is stored, the stored state of the electronic component, and the like can be confirmed through the cover tape 20. .
- the degree of light transmittance is specifically, preferably 80% or more, more preferably 85% or more of the total light transmittance measured in accordance with JIS K 7361-1. .
- the haze (specified in JIS K 7136) of the cover tape 20 is preferably 70% or less.
- the state in the recess 12 can be more reliably confirmed (visually confirmed) via the cover tape 20.
- the thickness of the cover tape 20 is not particularly limited, but is preferably 20 ⁇ m or more and 100 ⁇ m or less, and more preferably 36 ⁇ m or more and 60 ⁇ m or less. By being within the preferable range, workability can be improved.
- the heat sealant layer 22 is preferably composed of a resin composition containing an adhesive resin.
- the adhesive resin is used for bonding the carrier tape 1 and the cover tape 20 by heat sealing.
- the adhesive resin containing a (meth) acryl group is included. It is preferable.
- adhesive resin containing a (meth) acryl group The resin which has a (meth) acryl group containing thermoplastic elastomer as a main component is preferable, and a (meth) acryl group containing thermoplastic elastomer is an ethylene-based copolymer.
- the ethylene copolymer examples include an ethylene-acrylic acid copolymer, an ethylene-methacrylic acid copolymer, an ethylene-methyl acrylate copolymer, an ethylene-methyl methacrylate copolymer, and an ethylene-ethyl acrylate copolymer.
- examples thereof include a copolymer, an ethylene-ethyl methacrylate copolymer, an ethylene-butyl acrylate copolymer, and an ethylene-butyl methacrylate copolymer.
- an ethylene-methyl acrylate copolymer is particularly preferable.
- the content of the (meth) acrylic group in the adhesive resin containing the (meth) acrylic group is preferably 10% by mass or more and 40% by mass or less, and more preferably 12% by mass or more and 30% by mass or less. .
- the content of the (meth) acrylic group is equal to or higher than the lower limit, the softening temperature of the heat sealant layer 22 is lowered, and the adhesion between the carrier tape 1 and the cover tape 20 is improved.
- the content of the (meth) acrylic group is less than or equal to the above upper limit value, the softening temperature of the heat sealant layer 22 is increased and the electronic component housed in the carrier tape and the cover tape 20 are not adhered. It can suppress more effectively.
- the content rate of a (meth) acryl group can be measured according to the DuPont method or the Japan polyethylene method, for example.
- the ratio of the adhesive resin is preferably 30% by mass or more and 80% by mass or less, and more preferably 40% by mass or more and 70% by mass or less with respect to the entire resin composition constituting the heat sealant layer 22.
- the adhesive improvement effect to the carrier tape 1 can be acquired more effectively.
- the effect of preventing the cover tape 20 from being cut when the cover tape 20 is peeled from the carrier tape 1 at a high speed can be obtained more effectively.
- the weight average molecular weight of the resin constituting the heat sealant layer 22 is preferably in the same range as the weight average molecular weight in the first embodiment.
- the resin composition constituting the heat sealant layer 22 further includes a cohesion adjusting resin, an adhesion adjusting resin, etc. within a range that does not adversely affect the adhesion to the electronic component and the heat sealability to the carrier tape 1. Can be contained.
- the same resin as that used in the first embodiment can be used as the adhesiveness adjusting resin and the cohesive force adjusting resin.
- the ratio of the cohesive strength adjusting resin is preferably 5% by mass or more and 50% by mass or less, and more preferably 10% by mass or more and 40% by mass or less with respect to the entire resin composition constituting the heat sealant layer 22. preferable.
- the effect of making it easy to cause cohesive failure can be acquired, and the effect of not inhibiting adhesiveness can be acquired by being the said upper limit or less.
- the heat sealant layer 22 can further contain an antistatic resin.
- the antistatic resin the same resin as that used in the first embodiment can be used.
- the ratio of the antistatic resin is preferably 5% by mass or more and 40% by mass or less with respect to the entire resin composition constituting the heat sealant layer 22. More preferably, it is 10 mass% or more and 30 mass% or less.
- the thickness of the heat sealant layer 22 is preferably 1 ⁇ m or more and 15 ⁇ m or less, and more preferably 5 ⁇ m or more and 13 ⁇ m or less.
- the heat sealant layer 22 has a static friction coefficient change amount in a specific range.
- the types of the adhesive resin, cohesion adjusting resin, adhesive adjusting resin, and antistatic resin of the heat sealant layer 22 described above are appropriately selected, and the surface roughness of the heat sealant layer 22 is appropriately set. This can be realized.
- the base material layer 21 can use the same base material layer as the base material layer in the first embodiment.
- the thickness of the base material layer 21 in the present embodiment is preferably 7 ⁇ m or more and 50 ⁇ m or less, and more preferably 10 ⁇ m or more and 30 ⁇ m or less. Thereby, the flexibility of the base material layer 21 can be improved. If the thickness of the base material layer 21 is equal to or less than the above upper limit value, the cover tape 20 does not have too high rigidity, and even when a twisting stress is applied to the carrier tape 1 after heat sealing. There is little possibility that 20 follows the deformation of the carrier tape 1 and peeling occurs.
- the thickness of the base material layer 21 is not less than the above lower limit value, the mechanical strength of the cover tape 20 becomes better, and at the time of high-speed peeling when taking out the electronic component stored in the recess 12 Breaking of the cover tape 20 can be suppressed.
- the cover tape 20 according to the present embodiment may have an intermediate layer (not shown) between the base material layer 21 and the heat sealant layer 22.
- This intermediate layer can improve the cushioning property of the entire cover tape 20 and can improve the adhesion between the cover tape 20 and the carrier tape 1 during sealing.
- the resin constituting the intermediate layer examples include olefin resins, styrene resins, and cyclic olefin resins. Of these, olefin resins are preferred. By using the olefin-based resin, the effect of improving the adhesion can be ensured.
- the thickness of the intermediate layer is preferably 10 to 50 ⁇ m and more preferably 15 to 30 ⁇ m in order to ensure the effect of improving the adhesion.
- the cover tape 20 may be provided with an adhesive layer (not shown) between the layers. By providing this adhesive layer, the adhesion between the layers can be improved.
- the resin constituting the adhesive layer examples include urethane-based dry laminate adhesive resins or anchor coat adhesive resins, and generally a combination of a polyester composition such as polyester polyol or polyether polyol and an isocyanate compound. Is mentioned.
- each configuration can be replaced with any one that can exhibit the same function, or any configuration Can be added.
- the carrier tape with which the packaging material for electronic component packaging has a several recessed part was demonstrated in the said embodiment, it is not limited to this case,
- the recessed part which a carrier tape has may be one.
- Example 1 As an adhesive resin, Elvalloy AC1820 (ethylene-methyl acrylate copolymer, 20% (meth) acrylate group, manufactured by Mitsui DuPont Polychemical Co., Ltd.), 60 parts as cohesive force adjusting resin, Estyrene MS-600 (styrene- (meta ) 20 parts of methyl acrylate copolymer, manufactured by Nippon Steel Chemical Co., Ltd.) and 20 parts of Pelestat 212 (PP-PEG block copolymer, manufactured by Sanyo Chemical Industries, Ltd.) as an antistatic resin in a twin screw extruder And kneaded to obtain a resin composition constituting the heat sealant layer.
- Elvalloy AC1820 ethylene-methyl acrylate copolymer, 20% (meth) acrylate group, manufactured by Mitsui DuPont Polychemical Co., Ltd.
- Estyrene MS-600 styrene- (meta ) 20 parts of methyl acrylate copolymer,
- the intermediate layer On the PET film (Toyobo Co., Ltd., E5102) with a film thickness of 16 ⁇ m as the base material layer, low density polyethylene (Sumitomo Chemical Co., Ltd., Sumikasen L705) is used as the intermediate layer at an extrusion temperature of 300 ° C. by extrusion lamination. The film was formed to 20 ⁇ m. Next, a resin composition constituting the heat sealant layer as a heat sealant layer was further formed on the formed intermediate layer to a thickness of 5 ⁇ m at an extrusion temperature of 300 ° C. by an extrusion laminating method, and the cover tape of Example 1 was formed. Obtained. When forming the heat sealant layer, the surface of the flat layer was roughened using a cooling roll having protrusions with a surface roughness of 3.5 ⁇ m.
- Example 2 In the same manner as in Example 1, except that the surface of the flat layer was roughened using a cooling roll having protrusions with a surface roughness of 4.5 ⁇ m when the heat sealant layer was formed. A cover tape was obtained.
- Example 3 In the same manner as in Example 1, except that the surface of the flat layer was roughened using a cooling roll having protrusions with a surface roughness of 5.5 ⁇ m when forming the heat sealant layer. A cover tape was obtained.
- Comparative Example 2 The cover tape prepared in Comparative Example 1 was the same as Comparative Example 1 except that the surface of the heat sealant layer was coated with an acrylic adhesive containing 15 wt% of silica having an average particle diameter of 2 ⁇ m to a thickness of 1 ⁇ m. Thus, a cover tape of Comparative Example 2 was obtained.
- the cover tapes of each example and each comparative example were evaluated by the following methods.
- ⁇ Measurement of surface roughness of heat sealant layer> The surface roughness Rz and Sm of the heat sealant layers included in the cover tapes of the examples and the comparative examples were measured in accordance with JIS B 0601 using an ultradeep shape measurement microscope (manufactured by Keyence Corporation, “VK9700”). .
- a silicone resin layer is formed on a table having a size of 60 mm ⁇ 60 mm, and then this silicone resin layer is overlaid with a heat sealant layer provided in the cover tapes (26 mm ⁇ 76 mm) of the examples and comparative examples. After the cover tape was placed on the table so as to be combined, a 1 kg weight was placed on the cover tape to join the silicone resin layer and the heat sealant layer.
- the heat sealant layer (cover tape) is peeled from the silicone resin layer, and the initial load increase (Max value) obtained at this time And the subsequent steady load (weight load) was measured.
- the tack force which is the difference between the obtained load increase amount (Max value) and the steady load (weight load), was calculated as the adhesive strength (adhesion strength).
- the silicone resin layer formed on the table contained polyorganosiloxane, and had a hardness of 60 measured with the Shore D type hardness tester.
- ⁇ Electronic component stickability> The electronic components (50 pieces) adhered to the heat sealant layer (heat seal layer) are stored at 65 ° C. for 24 hours and evaluated for sticking of the electronic components when the electronic components are rotated 180 ° so that the electronic components face down. did.
- GM4ZR83232AE manufactured by SHARP was used as the electronic component.
- the sticking property of the electronic component passed ( ⁇ ), and when the electronic component remaining rate was 40% or more, the sticking property of the electronic component failed (x).
- Table 1 below shows the evaluation results of the cover tapes of Examples and Comparative Examples obtained as described above.
- the surface roughness Rz of the heat sealant layer is 1.0 ⁇ m or more, and the adhesive strength between the heat sealant layer and the silicone resin layer is 0.3 g / mm 2.
- a conductive polymer (Arakawa Chemical Industries, Aracoat AS-) is formed on one surface of a biaxially stretched polyester film (E5102, manufactured by Toyobo Co., Ltd., hereinafter referred to as “PET film”) having a film thickness of 25 ⁇ m as a base material layer. 625) was applied and dried.
- PET film biaxially stretched polyester film
- low-density polyethylene (Sumitomo Chemical Co., Sumikasen L705) was formed as an intermediate layer to a thickness of 25 ⁇ m at an extrusion temperature of 300 ° C. by extrusion lamination.
- Example 4 15 mass% of styrene-methyl methacrylate copolymer (Estyrene MS-600 manufactured by Nippon Steel Chemical Co., Ltd.), ethylene-methyl acrylate copolymer (Mitsui 65% by mass of Elvalloy AC 1820 manufactured by DuPont Polychemical Co., Ltd., acrylic group content: 20% by mass), polyether / polyolefin copolymer (manufactured by Sanyo Chemical Industries, Ltd., Pelestat 212, hereinafter also referred to as “PEG-PO”)
- a cover tape of Example 4 was obtained by forming a 20% by mass mixture into a film having a thickness of 10 ⁇ m at an extrusion temperature of 280 ° C.
- the heat sealant layer was formed, the heat sealant layer was roughened by pressing a silicon rubber mat roll against a cooling roll having protrusions with a surface roughness of 5.5 ⁇ m at a pressure of 0.2 MPa.
- Example 5 When the heat sealant layer was formed, a cooling roll having protrusions with a surface roughness of 6.5 ⁇ m was used, and the pressure of the silicon rubber mat roll was set to 0.2 MPa to roughen the surface of the heat sealant layer. In the same manner as in Example 4, the cover tape of Example 5 was obtained.
- Example 6 When the heat sealant layer is formed, a cooling roll having protrusions with a surface roughness of 4.5 ⁇ m is used, and the pressure of the silicon rubber mat roll is 0.2 MPa, and the surface of the heat sealant layer is roughened. In the same manner as in Example 4, the cover tape of Example 6 was obtained.
- Example 7 When the heat sealant layer was formed, a cooling roll having a surface roughness of 5.5 ⁇ m was used, and the pressure of the silicon rubber mat roll was set to 0.15 MPa to roughen the surface of the heat sealant layer. In the same manner as in Example 4, the cover tape of Example 7 was obtained.
- Example 8 When the heat sealant layer is formed, a cooling roll having a protrusion with a surface roughness of 4.5 ⁇ m is used, and the pressure of the silicon rubber mat roll is set to 0.15 MPa to roughen the surface of the heat sealant layer. In the same manner as in Example 4, a cover tape of Example 8 was obtained.
- the cover tape in each example was excellent in the performance balance between the heat sealability to the carrier tape and the low adhesion to the electronic component.
- the cover tape in each comparative example was inferior in the performance balance between the heat sealability to the carrier tape and the low adhesion to the electronic component.
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Abstract
Description
特許文献4には、基材層(A)、中間層(B)、熱可塑性樹脂を主成分とする剥離層(C)、およびキャリアテープにヒートシール可能な熱可塑性樹脂を主成分とするヒートシール層(D)を少なくとも含んでなり、剥離層(C)を形成する熱可塑性樹脂の23℃における引張貯蔵弾性率(c)が1×106Pa以上で1×108Pa以下であり、ヒートシール層(D)を形成する熱可塑性樹脂の23℃における引張貯蔵弾性率(d)が1×108以上で1×1010Pa以下であり、(c)と(d)の比が、1×104≧(d)/(c)≧1×10である、カバーテープが記載されている。
つまり、本発明者はキャリアテープへのヒートシール性と、電子部品への低付着性との間にトレードオフの関係が存在し、そのトレードオフの関係はヒートシーラント層中の接着性樹脂の軟化点を調整するだけでは改善できないことを明らかにした。
そこで、本発明者らは、さらに鋭意検討を重ねた。その結果、カバーテープを構成するヒートシーラント層表面の静摩擦係数の変化量およびヒートシーラント層中の接着性樹脂のビカット軟化点を特定の範囲に調整することにより、上記トレードオフの関係を改善でき、キャリアテープへのヒートシール性と、電子部品への低付着性とを両立したカバーテープが得られることを見出して本発明を完成するに至った。
(1) 電子部品を収納し得る凹部を一方の面に有するキャリアテープと、前記凹部に収納された電子部品と、前記キャリアテープをシールすることにより前記電子部品が収納された前記凹部を覆うカバーテープとを備える電子部品包装体に用いられる電子部品包装用カバーテープであって、
基材層と、該基材層の一方の面に積層され、前記キャリアテープにシールされるヒートシーラント層とを有し、
前記ヒートシーラント層は、その表面粗さRz(JIS B 0601に規定)が1.0μ以上であり、かつポリオルガノシロキサンを主成分とする樹脂層との粘着強度が0.3g/mm2以下であることを特徴する電子部品包装用カバーテープ。
(3) 前記ヒートシーラント層は、エチレン系共重合体を主材料として含有する(1)または(2)に記載の電子部品包装用カバーテープ。
(4) 前記ヒートシーラント層は、その厚さが1μm以上、かつ15μm以下である(1)から(3)のいずれかに記載の電子部品包装用カバーテープ。
(5) 前記基材層は、その厚さが7μm以上、かつ30μm以下である(1)から(4)のいずれかに記載の電子部品包装用カバーテープ。
基材層と、該記基材層の一方の面に積層され、接着性樹脂を含むヒートシーラント層とを備え、
JIS K7125に準拠して測定される、荷重N1(50g)における前記ヒートシーラント層表面の静摩擦係数をμ50とし、荷重N2(200g)における前記ヒートシーラント層表面の静摩擦係数をμ200としたとき、
(μ50-μ200)/(N2-N1)×1000で表される静摩擦係数の変化量が3.0以下であり、
前記ヒートシーラント層中の前記接着性樹脂のJIS K7206に準拠して測定されるビカット軟化点が30℃以上70℃未満である電子部品包装用カバーテープ。
(9) 前記ヒートシーラント層は(メタ)アクリル基を含有する接着性樹脂を含む(7)または(8)に記載の電子部品包装用カバーテープ。
(10) 前記(メタ)アクリル基を含有する接着性樹脂の(メタ)アクリル基の含有率が10質量%以上40質量%以下である(9)に記載の電子部品包装用カバーテープ。
(11) 前記(メタ)アクリル基を含有する接着性樹脂がエチレン系共重合体である(9)または(10)に記載の電子部品包装用カバーテープ。
(12) 前記ヒートシーラント層は凝集力調整樹脂をさらに含有する(9)から(11)のいずれかに記載の電子部品包装用カバーテープ。
(14) 前記ヒートシーラント層の厚さが1μm以上15μm以下である(7)から(13)のいずれかに記載の電子部品包装用カバーテープ。
(15) 前記基材層の厚さが7μm以上50μm以下である(7)から(14)のいずれかに記載の電子部品包装用カバーテープ。
(16) 前記キャリアテープは、ポリカーボネートおよびポリスチレンから選択される一種または二種以上を含む材料により構成されたものである(7)から(15)のいずれかに記載の電子部品包装用カバーテープ。
(17) 前記電子部品を構成する封止材がシリコーン封止材である(7)から(16)のいずれか一項に記載の電子部品包装用カバーテープ。
(18) 前記電子部品が発光ダイオードである(1)から(17)のいずれかに記載の電子部品包装用カバーテープ。
電子部品を収納できる凹部を一方の面に有し、前記電子部品包装用カバーテープにより前記凹部が覆われたキャリアテープとを備える電子部品包装用包材。
前記凹部に収納された電子部品と、
前記一方の面側で前記キャリアテープをシールすることにより前記電子部品が収納された前記凹部を覆う(1)から(18)のいずれかに記載の電子部品包装用カバーテープとを備える電子部品包装体。
<電子部品包装用包材>
図1は、本発明の電子部品包装用包材の実施形態を示す部分斜視図、図2は、図1に示す電子部品包装用包材を矢印A方向から見た図、図3は、図1に示す電子部品包装用包材の線B-Bに沿った断面図、図4は、図1に示す電子部品包装用包材の線C-Cに沿った断面図である。なお、以下の説明では、図1、3、4中の上側を「上」、下側を「下」、図2中の紙面手前側を「上」、紙面奥側を「下」と言う。
すなわち、電子部品包装用包材10は、例えば、電子部品包装用カバーテープ20と、電子部品を収納できる凹部12を一方の面(第1面15)に有し、電子部品包装用カバーテープ20により凹部12が覆われたキャリアテープ1とを備える。
これは、近年、電子部品の小型化にともない、キャリアテープ1の幅が8mm程度のように狭いものが好ましく用いられ、さらに、電子部品を凹部12に収納し、カバーテープ20でヒートシール際に電子部品包装体製造機等でフィードし得るように、長尺なものが好ましく用いられるためである。つまり、キャリアテープ1としては、幅が狭く、かつ、長尺なもの開発が強く求められ、その結果として、剛性の強い樹脂であるポリカーボネートおよび/またはポリスチレンを主材料とする樹脂で構成されるものが用いられるようになってきている。そして、キャリアテープ1を構成する樹脂として、ポリカーボネートおよび/またはスチレンを主材料とするものを用い、さらに、後述するように、カバーテープ20が備えるヒートシーラント層22を、その表面粗さRz(JIS B 0601に規定)が1.0μ以上であり、かつ、ポリオルガノシロキサンを含む樹脂層との粘着強度が0.3g/mm2以下であるものとの組み合わせとしても、ヒートシーラント層22とキャリアテープ1との間での、シール性(密着性)を確保することができる。
カバーテープ20は、図1、2に示すように、帯状をなし、キャリアテープ1の凹部12の開口を封止(カバー)するように、キャリアテープ1の第1面15に貼り合わせて(シールして)いる。
このカバーテープ20が備えるヒートシーラント層22は、その表面粗さRz(JIS B 0601に規定)が1.0μ以上であり、かつ、ポリオルガノシロキサンを主成分とする樹脂層との粘着強度が0.3g/mm2以下のものである。
また、基材層21は、テープ加工時やキャリアテープへのヒートシール時等に加わる外力に耐えうる機械的強度、ヒートシール時に耐えうる耐熱性があれば用途に応じて適宜種々の材料を加工したフィルムを用いることができる。
本実施形態に係る電子部品包装用包材10の凹部12に、電子部品が収納され、その後、凹部12がカバーされるように、キャリアテープ1にカバーテープ20を接合することで、電子部品包装用包材10に電子部品が収納された電子部品包装体(本実施形態の電子部品包装体)が得られる。
すなわち、本実施形態の電子部品包装体は、例えば、電子部品を収納できる凹部12を一方の面(第1面15)に有するキャリアテープ1と、凹部12に収納された電子部品と、一方の面(第1面15)側でキャリアテープ1をシールすることにより電子部品が収納された凹部12を覆う電子部品包装用カバーテープ20とを備える。
発光ダイオードにおいて、通常、封止材が高いタック性を有するポリオルガノシロキサンを含む樹脂(シリコーン封止材)により構成されている。
本実施形態のカバーテープ20はシリコーン封止材に対し粘着強度が低い。そのため、凹部12に発光ダイオードを収納したとしても、カバーテープ20をキャリアテープ1から剥離させる際に、電子部品がカバーテープ20側に付着するのを的確に抑制または防止することができる。
以下、第二実施形態の電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体を説明する。
本第二実施形態の電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体は、上記第一実施形態の電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体と、電子部品包装用カバーテープが異なる。
本実施形態に係る電子部品包装用カバーテープ20は、基材層21と、基材層21の一方の面に設けられ、接着性樹脂を含むヒートシーラント層22とを備える。
そして、カバーテープ20は、(μ50-μ200)/(N2-N1)×1000で表される静摩擦係数の変化量が3.0以下となるものである。
ここで、μ50は荷重N1(50g)におけるヒートシーラント層22表面の静摩擦係数であり、μ200は荷重N2(200g)におけるヒートシーラント層22表面の静摩擦係数である。
また、カバーテープ20において、ヒートシーラント層22中の接着性樹脂のビカット軟化点が30℃以上70℃未満である。
なお、本実施形態に係るカバーテープ20において、ヒートシーラント層22は、基材層21の一方の面に設けられる層である。かかるヒートシーラント層22の表面は、キャリアテープ1と接触する側に位置する。
また、カバーテープ20は、図1、2に示すように、例えば、帯状であり、キャリアテープ1の凹部12の開口を封止(カバー)するように、キャリアテープ1の第1面15に貼り合わ(シール)されて使用される。
このようなカバーテープ20は、本実施形態では、図3、4に示すように、基材層21と、この基材層21に積層されたヒートシーラント層22とを有し、ヒートシーラント層22をキャリアテープ1側としてキャリアテープ1の第1面15にシールするものである。
特に、発光ダイオード等のように封止材がシリコーン封止材である電子部品を用いた場合には、封止材が高いタック性を備えており、その結果、上記問題点が顕著に認められることが明らかになった。
つまり、本発明者はキャリアテープへのヒートシール性と、電子部品への低付着性との間にトレードオフの関係が存在し、そのトレードオフの関係はヒートシーラント層中の接着性樹脂の軟化点を調整するだけでは改善できないことを明らかにした。
本発明者の確認によれば、従来のカバーテープにおいて、ヒートシーラント層表面の静摩擦係数の変化量は上記上限値を超えるものであった。すなわち、電子部品との接触によってヒートシーラント層表面の状態が変化しやすいものであった。したがって、電子部品の付着が起きやすいと本発明者は考えた。
そこで、本発明者は、さらに鋭意検討を重ねた。その結果、カバーテープを構成するヒートシーラント層表面の静摩擦係数の変化量およびヒートシーラント層中の接着性樹脂のビカット軟化点を特定の範囲に調整することにより、上記トレードオフの関係を改善でき、キャリアテープへのヒートシール性と、電子部品への低付着性とを両立したカバーテープが得られることを見出して本発明を完成するに至った。
なお、静摩擦係数は、例えば、エイアンドデイ社製のテンシロン万能材料試験機(製品名:RTF-1250)を使用して、JIS K7125に準拠して測定することができる。
なお、ヒートシーラント層22中の接着性樹脂のビカット軟化点はJIS K7206に準拠して測定することができる。
本実施形態においては、とくにヒートシーラント層22を構成する接着性樹脂や凝集力調整樹脂、接着性調整樹脂、帯電防止樹脂の種類を適切に選択することや、ヒートシーラント層22の表面粗さを調整すること等が、上記静摩擦係数の変化量を制御するための因子として挙げられる。ヒートシーラント層22の表面粗さは、例えば、ヒートシーラント層22を製膜する際に、突起を備えるロールを用いてヒートシーラント層22の表面を粗面化することにより調整できる。
ヒートシーラント層22表面の静摩擦係数μ50を上記範囲内とすることにより、電子部品の付着防止性をより一層良好なものとすることができる。
なお、ヒートシーラント層22表面の算術平均高さ(Sa)は、例えば、菱化システム社製の白色干渉計(製品名:VertScan(登録商標))を使用して、ISO-25178に準拠して測定することができる。
ヒートシーラント層22は、接着性樹脂を含有する樹脂組成物により構成されていることが好ましい。
接着性樹脂は、キャリアテープ1とカバーテープ20をヒートシールすることによって接着させるために用いられる。接着性樹脂としては、キャリアテープ1に対して接着性を示す樹脂であれば特に限定されないが、密着性をより良好なものとする観点から、(メタ)アクリル基を含有する接着性樹脂を含むことが好ましい。
(メタ)アクリル基を含有する接着性樹脂としては特に限定されないが、(メタ)アクリル基含有熱可塑性エラストマーを主成分とする樹脂が好ましく、(メタ)アクリル基含有熱可塑性エラストマーがエチレン系共重合体であることがより好ましい。これにより、カバーテープ20の柔軟性がより良好なものとなる。上記エチレン系共重合体としては、エチレン-アクリル酸共重合体、エチレン-メタクリル酸共重合体、エチレン-アクリル酸メチル共重合体、エチレン-メタクリル酸メチル共重合体、エチレン-アクリル酸エチル共重合体、エチレン-メタクリル酸エチル共重合体、エチレン-アクリル酸ブチル共重合体、エチレン-メタクリル酸ブチル共重合体、等を挙げることができる。このなかでも、エチレン-アクリル酸メチル共重合体が特に好ましい。
ここで、(メタ)アクリル基の含有率は、例えば、デュポン法や日本ポリエチレン法に準じて測定することができる。
基材層21は、上記第一実施形態における基材層と同様の基材層を使用できる。
本実施形態における基材層21の厚さは、7μm以上50μm以下であることが好ましく、10μm以上30μm以下であることがより好ましい。これにより、基材層21の可撓性をより良好なものとすることができる。基材層21の厚さが上記上限値以下のものであればカバーテープ20の剛性が高くなりすぎず、ヒートシール後のキャリアテープ1に対して捻り応力がかかった場合であってもカバーテープ20がキャリアテープ1の変形に追従し剥離が生じるおそれが少ない。また、基材層21の厚さが、上記下限値以上のものであれば、カバーテープ20の機械的強度がより良好なものとなり、凹部12に収納された電子部品を取り出す際の高速剥離時にカバーテープ20が破断することを抑制することができる。
本実施形態に係るカバーテープ20は、基材層21とヒートシーラント層22の間に中間層(図示せず)を設けていてもよい。この中間層は、カバーテープ20全体のクッション性を向上させ、シール時のカバーテープ20とキャリアテープ1との密着性を向上させることができる。
中間層の厚さは、密着性の向上の効果を確実なものとするため、10~50μmが好ましく、15~30μmがより好ましい。
カバーテープ20は、各層の間に接着層(図示せず)を設けていてもよい。この接着層を設けることにより各層の間の接着性を向上させることができる。
[実施例1]
接着性樹脂としてエルバロイAC1820(エチレン-アクリル酸メチル共重合体、(メタ)アクリレート基20%、三井・デュポンポリケミカル株式会社製)60部、凝集力調整樹脂としてエスチレンMS-600(スチレン-(メタ)アクリル酸メチル共重合体、新日鐵化学株式会社製)20部、および帯電防止樹脂としてペレスタット212(PP-PEGブロック共重合体、三洋化成工業株式会社製)20部を二軸押出機にて混練し、ヒートシーラント層を構成する樹脂組成物を得た。
基材層として膜厚16μmのPETフィルム(東洋紡績株式会社製、E5102)の上に、中間層として低密度ポリエチレン(住友化学株式会社製、スミカセンL705)を押出ラミネート法により押出温度300℃で厚み20μmに製膜した。
次いで、製膜した中間層の上にさらにヒートシーラント層として上記のヒートシーラント層を構成する樹脂組成物を押出ラミネート法により押出温度300℃で厚み5μmに成膜し、実施例1のカバーテープを得た。
なお、ヒートシーラント層を成膜する際に表面粗さ3.5μmの突起を備える冷却ロールを用いて平坦層の表面を粗面化をおこなった。
ヒートシーラント層を成膜する際に、表面粗さ4.5μmの突起を備える冷却ロールを用いて平坦層の表面を粗面化したこと以外は、実施例1と同様にして、実施例2のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ5.5μmの突起を備える冷却ロールを用いて平坦層の表面を粗面化したこと以外は、実施例1と同様にして、実施例3のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ2.4μmの突起を備える冷却ロールを用いて平坦層の表面を粗面化したこと以外は、実施例1と同様にして、比較例1のカバーテープを得た。
比較例1で作成したカバーテープに対し、平均粒子径2μmのシリカを15wt%含むアクリル系接着剤を1μmの厚みになるようにヒートシーラント層の表面にコートした以外は、比較例1と同様にして、比較例2のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ8.0μmの突起を備える冷却ロールを用いて平坦層の表面を粗面化したこと以外は、実施例1と同様にして、比較例3のカバーテープを得た。
<ヒートシーラント層の表面粗さの測定>
超深度形状測定顕微鏡(キーエンス社製、「VK9700」)を用い、JIS B 0601に準拠して、各実施例および各比較例のカバーテープが備えるヒートシーラント層の表面粗さRzおよびSmを測定した。
分光光度計(JASCO社製、「N-670」)を用い、JIS K 7361-1に準拠して、各実施例および各比較例のカバーテープの全光線透過率を測定した。
分光光度計(JASCO社製、「N-670」)を用い、JIS K 7136に準拠して、各実施例および各比較例のカバーテープの曇度を測定した。
まず、60mm×60mmの大きさの台上にシリコーン樹脂層を形成し、その後、このシリコーン樹脂層と、各実施例および各比較例のカバーテープ(26mm×76mm)が備えるヒートシーラント層とが重ね合わさるように、台上にカバーテープを配置した後、カバーテープ上に1kgの重りを載置することで、シリコーン樹脂層とヒートシーラント層とを接合した。
JIS C0806-3に準じて、220℃にてヒートシールしたポリカーボネート樹脂製キャリアテープと各実施例および各比較例のカバーテープの剥離強度を測定し、この剥離強度によってPC(ポリカーボネート)に対する低温シール性を評価した。
すなわち、剥離強度が20g以上の場合は、PCに対するヒートシール性は合格(○)、剥離強度が20g未満の場合は、PCに対するヒートシール性は不合格(×)とした。
ここで、剥離強度は以下の方法で測定した。
8mm幅の導電PC(ポリカーボネート)と、5mm幅で、長手方向が500mmのカバーテープをヒートシーラント層の面で張り合わせ、2列の0.5mm幅、54mm長さのシールコテを用いて、下記のヒートシール条件によりヒートシールする。
<ヒートシール条件>
ヒートシール温度: 各ヒートシール温度
ヒートシールコテ押し当て時間: 0.020 秒/ 1 回
ヒートシールコテ押し当て回数: 13 回
ヒートシールコテ押し当て荷重: 4.0kgf
ヒートシール幅 : 0.5 mm × 2列
上記ヒートシールにより得られたサンプルの剥離強度を、JIS C-0806-3に準じた方法で測定する。尚、測定速度は300mm/minとし、平均強度を算出する。
ヒートシーラント層(ヒートシール層)に密着させた電子部品(50個)を、65℃24時間保管し、電子部品が下になるように180°回転させたときの電子部品の貼り付き性を評価した。ここで、電子部品としては、SHARP社製GM4ZR83232AEを用いた。
電子部品残存率が40%未満である場合は電子部品の貼り付き性は合格(○)、電子部品残存率が40%以上の場合は電子部品の貼り付き性は不合格(×)とした。
はじめに、基材層である膜厚25μmの二軸延伸ポリエステルフィルム(東洋紡績社製E5102、以下、「PETフィルム」とも言う。)の一方の面に導電ポリマー(荒川化学工業社製、アラコートAS-625)を塗布、乾燥した。
次いで、PETフィルムの他方の面上に、押出ラミネート法により、中間層として低密度ポリエチレン(住友化学社製、スミカセンL705)を押出温度300℃で厚み25μmに製膜した。
次いで、製膜した中間層の上に、ヒートシーラント層としてスチレン-メタクリル酸メチル共重合体(新日鐵化学社製エスチレンMS-600)15質量%、エチレン-アクリル酸メチル共重合体(三井・デュポンポリケミカル社製エルバロイAC 1820、アクリル基の含有率:20質量%)65質量%、ポリエーテル/ポリオレフィン共重合体(三洋化成工業社製、ペレスタット212、以下「PEG-PO」とも言う。)20質量%の混合物を押出温度280℃で厚さ10μmに製膜し実施例4のカバーテープを得た。
なお、ヒートシーラント層を成膜する際に表面粗さ5.5μmの突起を備える冷却ロールにシリコンゴム製マットロールを圧力0.2MPaで押当てることでヒートシーラント層の粗面化をおこなった。
ヒートシーラント層を成膜する際に、表面粗さ6.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.2MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、実施例5のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ4.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.2MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、実施例6のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ5.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.15MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、実施例7のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ4.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.15MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、実施例8のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ2.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.2MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、比較例4のカバーテープを得た。
ヒートシーラント層を成膜する際に、表面粗さ3.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.2MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、比較例5のカバーテープを得た。
エチレン-アクリル酸メチル共重合体(三井・デュポンポリケミカル社製エルバロイAC 1820、アクリル基の含有率:20質量%)の代わりに、エチレン-アクリル酸メチル共重合体(三井・デュポンポリケミカル社製エルバロイAC 1609、アクリル基の含有率:9質量%)を用い、ヒートシーラント層を成膜する際に、表面粗さ2.5μmの突起を備える冷却ロールを用い、シリコンゴム製マットロールの圧力を0.2MPaにしてヒートシーラント層の表面を粗面化したこと以外は、実施例4と同様にして、比較例6のカバーテープを得た。
JIS K7206に準拠して、下記の条件により測定した。
菱化システム社製の白色干渉計(製品名:VertScan(登録商標))を使用して、ISO-25178に準拠して、下記の条件により測定した。
(測定条件)
測定は5回おこない、その平均値を採用した。測定は23±2℃、湿度50±6%RHの環境下で実施した。
エイアンドデイ社製のテンシロン万能材料試験機(製品名:RTF-1250)を使用して、JIS K7125に準拠して、下記の条件により測定した。一試料につき、5回測定して、その平均値を静摩擦係数とした。
(測定条件)
環境温度23±2℃、環境湿度50±6%RH、剥離速度100mm/min
ここで、荷重N1(50g)におけるヒートシーラント層表面の静摩擦係数をμ50とし、荷重N2(200g)におけるヒートシーラント層表面の静摩擦係数をμ200とし、(μ50-μ200)/(N2-N1)×1000で表される静摩擦係数の変化量を算出した。
<カバーテープの曇度>
<キャリアテープに対するヒートシール性>
<電子部品(発光ダイオード)貼り付き性>
上記実施例1~3および比較例1~3における測定法と同様の測定法を採用した。
得られたカバーテープを5.5mm幅にスリット後、8mm幅のポリカーボネート性キャリアテープ(ニッポー社製)に、電子部品(SHARP製GM4ZR83232AE)を挿入し、ヒートシール温度180℃で、カバーテープをヒートシールしてサンプルを調整した。
得られたサンプルをカバーテープ面に部品が接するように静置させ70℃で24時間熱処理を加えしたのちに、カバーテープを300mm/minの速度で剥離し、電子部品100個中、カバーテープにはりついた電子部品の個数をカウントした。
カバーテープにはりついたチップが2個未満の場合は、ベーキング後の電子部品の張り付き性は○、2個以上の場合は×とした。
得られたカバーテープを5.5mm幅にスリット後、8mm幅のポリカーボネート性キャリアテープ(ニッポー社製)に、電子部品(QFP64T40-3.9)を挿入し、ヒートシール温度180℃で、カバーテープをヒートシールしてサンプルを調整した。電子部品表面から垂直方向に1cm引き上げたところで、電子部品に印刷されている文字を目視により確認し、文字の輪郭がぼやけず読みとれるものを◎、ぼやけるが読みとれるものを○、そうでないものを×とした。
10 電子部品包装用包材
11 送り穴
12 凹部
13 第2面
15 第1面
20 カバーテープ
21 基材層
22 ヒートシーラント層
40 電子部品
200 カバーテープ
500 キャリアテープ
512 凹部
1000 電子部品包装用包材
Claims (20)
- 電子部品を収納し得る凹部を一方の面に有するキャリアテープと、前記凹部に収納された電子部品と、前記キャリアテープをシールすることにより前記電子部品が収納された前記凹部を覆うカバーテープとを備える電子部品包装体に用いられる電子部品包装用カバーテープであって、
基材層と、該基材層の一方の面に積層され、前記キャリアテープにシールされるヒートシーラント層とを有し、
前記ヒートシーラント層は、その表面粗さRz(JIS B 0601に規定)が1.0μ以上であり、かつポリオルガノシロキサンを主成分とする樹脂層との粘着強度が0.3g/mm2以下であることを特徴する電子部品包装用カバーテープ。 - 全光線透過率(JIS K 7361-1に規定)が80%以上である請求項1に記載の電子部品包装用カバーテープ。
- 前記ヒートシーラント層は、エチレン系共重合体を主材料として含有する請求項1または2に記載の電子部品包装用カバーテープ。
- 前記ヒートシーラント層は、その厚さが1μm以上、かつ15μm以下である請求項1から3のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記基材層は、その厚さが7μm以上、かつ30μm以下である請求項1から4のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記ヒートシーラント層は、ポリカーボネートを主材料として含有するキャリアテープに対してシール性を備えている請求項1から5のいずれか一項に記載の電子部品包装用カバーテープ。
- 電子部品を収納できる凹部を一方の面に有するキャリアテープと、前記凹部に収納された電子部品と、前記キャリアテープをシールすることにより前記電子部品が収納された前記凹部を覆うカバーテープとを備える電子部品包装体に用いられる電子部品包装用カバーテープであって、
基材層と、該記基材層の一方の面に積層され、接着性樹脂を含むヒートシーラント層とを備え、
JIS K7125に準拠して測定される、荷重N1(50g)における前記ヒートシーラント層表面の静摩擦係数をμ50とし、荷重N2(200g)における前記ヒートシーラント層表面の静摩擦係数をμ200としたとき、
(μ50-μ200)/(N2-N1)×1000で表される静摩擦係数の変化量が3.0以下であり、
前記ヒートシーラント層中の前記接着性樹脂のJIS K7206に準拠して測定されるビカット軟化点が30℃以上70℃未満である電子部品包装用カバーテープ。 - ISO-25178に準拠して測定される、前記ヒートシーラント層表面の算術平均高さ(Sa)が0.4μm以上0.7μm以下である請求項7に記載の電子部品包装用カバーテープ。
- 前記ヒートシーラント層は(メタ)アクリル基を含有する接着性樹脂を含む請求項7または8に記載の電子部品包装用カバーテープ。
- 前記(メタ)アクリル基を含有する接着性樹脂の(メタ)アクリル基の含有率が10質量%以上40質量%以下である請求項9に記載の電子部品包装用カバーテープ。
- 前記(メタ)アクリル基を含有する接着性樹脂がエチレン系共重合体である請求項9または10に記載の電子部品包装用カバーテープ。
- 前記ヒートシーラント層は凝集力調整樹脂をさらに含有する請求項9から11のいずれか一項に記載の電子部品包装用カバーテープ。
- JIS K7361-1に準拠して測定される全光線透過率が80%以上である請求項7から12のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記ヒートシーラント層の厚さが1μm以上15μm以下である請求項7から13のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記基材層の厚さが7μm以上50μm以下である請求項7から14のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記キャリアテープは、ポリカーボネートおよびポリスチレンから選択される一種または二種以上を含む材料により構成されたものである請求項7から15のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記電子部品を構成する封止材がシリコーン封止材である請求項7から16のいずれか一項に記載の電子部品包装用カバーテープ。
- 前記電子部品が発光ダイオードである請求項1から17のいずれか一項に記載の電子部品包装用カバーテープ。
- 請求項1から18のいずれか一項に記載の電子部品包装用カバーテープと、
電子部品を収納できる凹部を一方の面に有し、前記電子部品包装用カバーテープにより前記凹部が覆われたキャリアテープとを備える電子部品包装用包材。 - 電子部品を収納できる凹部を一方の面に有するキャリアテープと、
前記凹部に収納された電子部品と、
前記一方の面側で前記キャリアテープをシールすることにより前記電子部品が収納された前記凹部を覆う請求項1から18のいずれか一項に記載の電子部品包装用カバーテープとを備える電子部品包装体。
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JP2019127286A (ja) * | 2018-01-24 | 2019-08-01 | 信越ポリマー株式会社 | カバーテープ及び包装体 |
JP7003099B2 (ja) | 2019-12-10 | 2022-01-20 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
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JP2019204933A (ja) * | 2018-05-25 | 2019-11-28 | デクセリアルズ株式会社 | 電子部品供給体、電子部品供給リール |
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CN110654714B (zh) * | 2018-06-28 | 2021-09-17 | 台湾积体电路制造股份有限公司 | 半导体元件的载带系统与从载带的口袋搬移半导体元件的方法 |
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JPWO2020196031A1 (ja) * | 2019-03-27 | 2020-10-01 | ||
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JPH08324676A (ja) * | 1995-05-30 | 1996-12-10 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
JP2002283512A (ja) * | 2001-03-23 | 2002-10-03 | Dainippon Printing Co Ltd | ヒートシール積層体およびキャリアテープ包装体 |
JP2006219137A (ja) * | 2005-02-08 | 2006-08-24 | Sumitomo Bakelite Co Ltd | 電子部品包装用カバーテープ |
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JP2018073922A (ja) * | 2016-10-27 | 2018-05-10 | 日亜化学工業株式会社 | テープフィーダ及びledの取出し方法 |
JP2019010845A (ja) * | 2017-07-03 | 2019-01-24 | デンカ株式会社 | 積層シート |
JP2019116025A (ja) * | 2017-12-27 | 2019-07-18 | 凸版印刷株式会社 | 包装材用シーラントフィルム、包装材、及び包装体 |
JP7040007B2 (ja) | 2017-12-27 | 2022-03-23 | 凸版印刷株式会社 | 包装材用シーラントフィルム、包装材、及び包装体 |
JP2019127286A (ja) * | 2018-01-24 | 2019-08-01 | 信越ポリマー株式会社 | カバーテープ及び包装体 |
JP7003099B2 (ja) | 2019-12-10 | 2022-01-20 | 住友ベークライト株式会社 | カバーテープおよび電子部品包装体 |
Also Published As
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CN106604878A (zh) | 2017-04-26 |
JPWO2016076331A1 (ja) | 2017-04-27 |
TW201629172A (zh) | 2016-08-16 |
KR101756623B1 (ko) | 2017-07-10 |
TWI647297B (zh) | 2019-01-11 |
KR20170024126A (ko) | 2017-03-06 |
JP5983902B1 (ja) | 2016-09-06 |
CN106604878B (zh) | 2018-03-20 |
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