WO2016027671A1 - 研磨フィルム - Google Patents
研磨フィルム Download PDFInfo
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- WO2016027671A1 WO2016027671A1 PCT/JP2015/072198 JP2015072198W WO2016027671A1 WO 2016027671 A1 WO2016027671 A1 WO 2016027671A1 JP 2015072198 W JP2015072198 W JP 2015072198W WO 2016027671 A1 WO2016027671 A1 WO 2016027671A1
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- WIPO (PCT)
- Prior art keywords
- polishing
- mass
- film
- abrasive particles
- abrasive
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
- B24D11/001—Manufacture of flexible abrasive materials
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3847—Details of mounting fibres in ferrules; Assembly methods; Manufacture with means preventing fibre end damage, e.g. recessed fibre surfaces
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
- G02B6/3807—Dismountable connectors, i.e. comprising plugs
- G02B6/3833—Details of mounting fibres in ferrules; Assembly methods; Manufacture
- G02B6/3863—Details of mounting fibres in ferrules; Assembly methods; Manufacture fabricated by using polishing techniques
Definitions
- the present invention relates to an abrasive film.
- optical connectors that are easy to remove are widely used for connecting optical fibers. This connection is made by directly matching ferrules that align the optical fibers. For this reason, in order to reduce the optical loss (communication loss) of the optical fiber after connection, the connection end face of the optical fiber connector to be connected is sufficiently smooth and no gap is formed between the optical fibers at the connection end face (ferrule). The optical fiber is not pulled in).
- Polishing of the connection end face of such an optical fiber connector is performed by four processes of an adhesive removing process, a rough spherical polishing process, an intermediate finishing process, and a final polishing process. Among them, the polishing accuracy of the final polishing process has a great influence on optical loss. To do.
- This final polishing step is performed by pressing a loaded optical fiber connector while supplying water to the surface of the polishing film attached to the surface of the elastic pad.
- the light loss in the finish polishing step is mainly caused by defective end surfaces such as scratches and chippings due to insufficient grinding force of the polishing film, and deteriorates the productivity and production cost of the optical fiber connector. For this reason, a high grinding force is required for the polishing film used in the finish polishing step.
- an abrasive film having an abrasive layer having abrasive particles and a binder and a devised material for the binder has been proposed (see, for example, JP-A-2007-190613).
- the abrasive of the polishing layer is firmly fixed and the grinding force is increased by using epoxy urethane which is hard to be worn as a binder material.
- this conventional polishing film has a sufficiently high grinding force.
- this conventional polishing film is prone to defects due to variations in load conditions during polishing because the grinding force is insufficient and the incidence of defective end faces increases greatly when the load is low.
- the present invention has been made in view of these circumstances, and an object of the present invention is to provide a polishing film that has a high grinding force and is unlikely to cause an end face defect of an optical fiber connector due to variation in load conditions during polishing. .
- the present inventors have found that the grinding force can be significantly improved by accelerating the abrasion of the polishing layer instead of the conventional method of suppressing the abrasion of the polishing layer.
- the present inventors have found that the grinding force can be significantly improved by accelerating the abrasion of the polishing layer instead of the conventional method of suppressing the abrasion of the polishing layer.
- the invention made to solve the above problems is a polishing film having a base film and a polishing layer laminated on the surface side of the base film, wherein the polishing layer includes abrasive particles and the polishing film. And a wear amount according to a Taber abrasion test of the polishing layer is 10 mg or more and 25 mg or less.
- the abrasion amount of the polishing layer is not less than the above lower limit, the abrasive particles supplied by the abrasion of the polishing layer in the water supplied at the time of polishing the optical fiber connector are used as free abrasive grains as the fixed abrasive of the polishing layer. Polish the fiber optic connector with the grains. For this reason, the said abrasive film has a high grinding force. In addition, even when the load applied to the optical fiber connector is low, the loose abrasive grains necessary for polishing are supplied due to abrasion of the polishing layer, so that the end face failure of the optical fiber connector is unlikely to occur, and the failure due to fluctuations in load conditions is unlikely to occur. .
- the abrasive film can suppress the abrasion amount of the polishing layer per polishing, and can be polished many times while maintaining a high grinding force.
- the content of the abrasive particles in the polishing layer is preferably 85% by mass or more.
- grinding power further improves by making content of the above-mentioned abrasive particles in the above-mentioned polishing layer into the above-mentioned minimum or more.
- the abrasive particles preferably include first abrasive particles having a primary particle diameter of 10 nm or more and less than 50 nm, and second abrasive particles having a primary particle diameter of 50 nm or more and less than 250 nm, and the content of the first abrasive particles with respect to the entire abrasive particles Is preferably 55% by mass or more and 80% by mass or less, and the content of the second abrasive particles is preferably 15% by mass or more and 45% by mass or less.
- the abrasive particles have the two types of abrasive particles, and the wear amount of the polishing layer is easily controlled within the above range by setting the content of the two types of abrasive particles within the above range. Can do.
- the content of abrasive particles having a primary particle diameter of 100 nm or more and less than 250 nm with respect to the entire abrasive particles is preferably 5% by mass or more and 25% by mass or less.
- the average thickness of the polishing layer is preferably 4 ⁇ m or more and 15 ⁇ m or less. By setting the average thickness of the polishing layer within the above range, the durability can be enhanced while suppressing the manufacturing cost.
- the abrasive particles are preferably silica particles. Since silica particles are abrasive particles suitable for the final finishing step in which a small surface roughness is required on the connection end face of the optical fiber connector, by using silica particles, higher grinding force can be imparted while maintaining polishing accuracy.
- “wear amount” is prepared by preparing three samples of test pieces (average diameter 100 mm, average thickness 0.08 mm or more and 0.09 mm or less) using a Taber abrasion tester, load 4.9 N, rotation speed 72 rpm, and Each test piece was rotated 50 times under the condition of the wear wheel CS-10, and the mass difference between the test pieces before and after 50 rotations was measured and averaged.
- “primary particles” refer to particles that are considered to be unit particles as judged from the apparent geometric form
- “primary particle diameter” refers to a scanning electron microscope (SEM) or a transmission electron microscope (TEM). ) Means the diameter of a single particle measured using the image of the particle observed using “”
- “particle diameter” refers to the diameter of the smallest circle circumscribing the image of this particle.
- the polishing film of the present invention has a high grinding force and is unlikely to cause an end face defect of the optical fiber connector due to a change in load conditions during polishing. Therefore, the said polishing film can be used suitably for the final polishing process of an optical fiber connector.
- the polishing film shown in FIG. 1 has a base film 10 and a polishing layer 20 laminated on the surface side of the base film 10.
- the material of the base film 10 is not particularly limited, but is preferably a material that has an appropriate rigidity and ensures good adhesion and adhesion to the polishing layer 20.
- a known thermoplastic resin can be used, and examples thereof include acrylic, polycarbonate, polyethylene terephthalate (PET), polypropylene (PP), and polyethylene (PE).
- PET polyethylene terephthalate
- PP polypropylene
- PE polyethylene
- a biaxially stretched film such as PET, PP, or PE may be used.
- the process which improves adhesiveness such as a chemical process, a corona process, and a primer process, may be performed on the surface of the base film 10.
- the size and planar shape of the base film 10 are not particularly limited, but may be, for example, a 127 mm ⁇ 127 mm square shape or a 127 mm diameter circular shape. Moreover, the structure by which the several base film 10 juxtaposed on the plane is supported by a single support body may be sufficient.
- the average thickness of the base film 10 is not particularly limited, but can be, for example, 30 ⁇ m or more and 150 ⁇ m or less. When the average thickness of the base film 10 is less than the lower limit, the strength and flatness of the polishing film may be insufficient. On the other hand, when the average thickness of the base film 10 exceeds the upper limit, the polishing film is unnecessarily thick and may be difficult to handle.
- the polishing layer 20 has abrasive particles 21 and a binder 22 thereof.
- the lower limit of the average thickness of the polishing layer 20 is preferably 4 ⁇ m and more preferably 5 ⁇ m. Further, the upper limit of the average thickness of the polishing layer 20 is preferably 15 ⁇ m, more preferably 10 ⁇ m, and even more preferably 8 ⁇ m. When the average thickness of the polishing layer 20 is less than the lower limit, the durability of the polishing film may be insufficient. On the other hand, when the average thickness of the polishing layer 20 exceeds the upper limit, the polishing film becomes unnecessarily thick, the amount of raw materials used increases, and the manufacturing cost may increase.
- the lower limit of the amount of abrasion by the Taber abrasion test of the polishing layer 20 is 10 mg, more preferably 12 mg, and even more preferably 13 mg.
- polishing layer 20 it is 25 mg, 20 mg is more preferable, and 18 mg is further more preferable.
- the abrasion amount of the polishing layer 20 by the Taber abrasion test is less than the above lower limit, the grinding force becomes insufficient due to the decrease in the amount of free abrasive grains supplied from the polishing film at a low load, and the optical fiber due to the variation of the load condition during polishing. There is a risk of connector end face failure.
- the abrasion amount of the polishing layer 20 by the Taber abrasion test exceeds the above upper limit, the polishing layer 20 is worn away by polishing for a relatively short time, and a good product may not be obtained.
- the abrasive film supplies abrasive particles from the worn abrasive layer into the water supplied during polishing of the optical fiber connector by promoting the abrasion of the abrasive layer. It is considered that the polishing force is greatly improved by polishing the optical fiber connector together with the fixed abrasive grains of the polishing layer as the abrasive grains as free abrasive grains.
- the present inventors conducted the following tests in order to obtain the lower limit of the amount of wear necessary for the grinding force of the polishing film to be greatly improved by the above-mentioned free abrasive grains.
- eight types of polishing sheets having different polishing layer compositions were prepared as polishing films, and the amount of wear was measured.
- three specimens (average diameter: 100 mm, average thickness: 0.08 mm to 0.09 mm) were prepared, and using a Taber abrasion tester, the load was 4.9 N, the rotation speed was 72 rpm, and the wear wheel CS-10. Each test piece was rotated 50 times under the above conditions, and the mass difference between the test pieces before and after 50 rotations was measured and averaged.
- polishing test of an optical fiber connector 24 terminal in which an optical fiber was bonded to a ferrule (“SC ferrule” of Seiko Giken Co., Ltd.) was performed using this polishing sheet.
- the polishing film is punched into a circular shape with a diameter of 127 mm, and fixed to an elastic pad (hardness 55 °) of a polishing machine (“OFL-15” of Seiko Giken Co., Ltd.) to polish the ion exchange water.
- the final finish polishing was performed for 60 seconds at a load of 1500 g and a rotation speed of 180 rpm on the connection end face of the optical fiber connector after intermediate finish polishing.
- Non-defective product rate (number of non-defective products) / 24 x 100 (%)
- the relationship between the abrasion amount of the polishing layer and the yield rate was determined.
- the result is shown in FIG. It can be seen from FIG. 2 that there is a correlation between the abrasion amount of the polishing layer and the yield rate.
- the polishing film having an abrasion amount of 10 mg or more with a high yield rate has a sufficient grinding force. From the above, 10 mg was derived as the lower limit of the amount of wear necessary for the grinding force of the polishing film to be greatly improved by the above-mentioned free abrasive grains.
- the durability of the polishing film is determined by the amount of abrasion of the polishing layer per polishing, and the amount of abrasion of the polishing layer per polishing is determined by the product of the amount of abrasion of the polishing layer per unit time and the polishing time. Therefore, even if the abrasion amount of the polishing layer per unit time increases, if the polishing time is greatly reduced by the high grinding force and the product of the abrasion amount of the polishing layer per unit time and the polishing time decreases, the polishing 1 The abrasion amount of the polishing layer per turn is reduced, and the durability of the polishing film is improved.
- the present inventors pay attention to this relationship, and the grinding force of the polishing film is greatly improved by promoting abrasion of the polishing layer and supplying a large amount of abrasive particles as free abrasive grains in the water supplied during polishing. As a result, the inventors have found that the polishing time is shortened and the durability of the polishing film is improved.
- the upper limit of the amount of abrasion of the polishing layer is considered to be determined by saturation of the effect of improving the grinding force of the abrasive film by the free abrasive grains. That is, when a particularly high load is applied, the amount of wear of the abrasive film increases, so that more free abrasive grains are supplied and the grinding force is further improved. However, if the amount of wear is too large, the grinding force does not improve with respect to the increase in the supply amount of free abrasive grains, the wear is promoted, and the amount of wear of the polishing layer per polishing increases conversely. it is conceivable that. In FIG. 2, the non-defective product rate is saturated at around 25 mg, and it is considered that the effect of improving the grinding force of the polishing film is saturated. Therefore, 25 mg was derived as the upper limit of the wear amount.
- abrasive particles 21 examples include particles of diamond, alumina, silica, ceria, silicon carbide, and the like. Among them, silica particles that can obtain a high grinding force and can obtain a finished end face without scratches are preferable.
- silica particles include known silica particles such as colloidal silica, dry silica, wet silica, and fused silica.
- colloidal silica includes an organosilica sol in which colloidal silica is dispersed in an organic solvent.
- the lower limit of the content of the abrasive particles 21 with respect to the polishing layer 20 is preferably 85% by mass, and more preferably 88% by mass. Moreover, as an upper limit of content of the abrasive particle 21 with respect to the said grinding
- the abrasive particles 21 may include first abrasive particles 21a having a primary particle diameter of 10 nm or more and less than 50 nm, and second abrasive particles 21b having a primary particle diameter of 50 nm or more and less than 250 nm.
- first abrasive particles 21a having a primary particle diameter of 10 nm or more and less than 50 nm
- second abrasive particles 21b having a primary particle diameter of 50 nm or more and less than 250 nm.
- the lower limit of the content of the first abrasive particles 21a with respect to the entire abrasive particles 21 is preferably 55% by mass, and more preferably 60% by mass. Moreover, as an upper limit of content of the 1st abrasive particle 21a with respect to the said whole abrasive particle 21, 80 mass% is preferable and 75 mass% is more preferable. When the content of the first abrasive particles 21a with respect to the entire abrasive particles 21 is less than the lower limit, the polishing accuracy of the abrasive film may be insufficient.
- the abrasive layer 20 becomes dense, and the abrasion amount of the abrasive layer 20 may be insufficient.
- the lower limit of the content of the second abrasive particles 21b with respect to the entire abrasive particles 21 is preferably 15% by mass, and more preferably 25% by mass. Moreover, as an upper limit of content of the 2nd abrasive particle 21b with respect to the said whole abrasive particle 21, 45 mass% is preferable and 35 mass% is more preferable. When the content of the second abrasive particles 21b with respect to the entire abrasive particles 21 is less than the lower limit, the abrasive layer 20 becomes dense due to the first abrasive particles 21a, and the abrasion amount of the abrasive layer 20 may be insufficient.
- the polishing accuracy of the abrasive film may be insufficient due to the roughness of the primary particle diameter.
- the lower limit of the content of the abrasive particles having a primary particle diameter of 100 nm or more and less than 250 nm (hereinafter also referred to as “large-diameter second abrasive particles”) of the second abrasive particles 21b to the entire abrasive particles is preferably 5% by mass. 8 mass% is more preferable.
- polishing particle with respect to the said whole abrasive particle 21 25 mass% is preferable and 20 mass% is more preferable.
- the content of the large-diameter second abrasive particles relative to the entire abrasive particles 21 is less than the lower limit, the number of starting points of wear of the polishing layer 20 is small, and the wear amount of the polishing layer 20 may be insufficient.
- the content of the large-diameter second abrasive particles with respect to the entire abrasive particles 21 exceeds the above upper limit, the polishing accuracy of the abrasive film may be insufficient due to the roughness of the primary particle diameter.
- the binder 22 holds the abrasive particles 21 in a dispersed state, and fixes the abrasive layer 20 to the base film 10.
- a resin or an elastomer can be used as the main component of the binder 22 .
- the resin for example, acrylic resin, urethane resin, epoxy resin, cellulose resin, vinyl resin, phenoxy resin, phenol resin, polyester, and the like can be used.
- the elastomer include natural rubber, polyisobutylene rubber, isoprene rubber, nitrile rubber, acrylonitrile-butadiene rubber, ethylene propylene rubber, styrene-butadiene rubber, butadiene rubber, chloroprene rubber, silicon rubber, fluorine rubber, acrylic rubber, Examples thereof include urethane rubber.
- the resin is the main component
- an acrylic resin, an epoxy resin, a cellulose resin, and a polyester that can easily ensure good dispersibility of the abrasive particles 21 and good adhesion to the base film 10 are preferable, and an elastomer is the main component.
- acrylonitrile-butadiene rubber, urethane rubber, and acrylic rubber are preferable from the viewpoint of adhesion to the base film 10 and handleability.
- the resin may be at least partially crosslinked and may contain a curing agent such as polyisocyanate or acrylate.
- the “main component” means a component having the highest content, for example, a component having a content of 50% by mass or more.
- the resin binder 22 includes various auxiliary agents such as resins other than the main components, cross-linking agents, dispersants, coupling agents, surfactants, lubricants, antifoaming agents, colorants, and the like depending on purposes. You may make it contain suitably.
- the manufacturing method of the said polishing film can employ
- a solution in which the abrasive particles 21 and the binder 22 are dispersed in a solvent is prepared as a coating liquid.
- the solvent is not particularly limited as long as the binder 22 is soluble.
- methyl ethyl ketone (MEK) isophorone, terpineol, N methylpyrrolidone, cyclohexanone, propylene carbonate, methanol, ethanol, 2 propanol, glycol and the like can be used.
- Various auxiliary agents, diluents and additives may be mixed.
- the coating liquid prepared in the coating liquid preparation process is applied to the surface of the base film 10.
- the coating method is not particularly limited, and for example, known coating methods such as bar coating, comma coating, spray coating, reverse roll coating, knife coating, screen printing, gravure coating, and die coating can be used.
- the applied coating liquid is dried and reaction-cured to form the polishing layer 20.
- the solvent of the coating liquid is evaporated and the solute is cured, thereby forming the polishing layer 20.
- the abrasion amount of the polishing layer 20 is 10 mg or more in the polishing film, the abrasive particles 21 supplied by the abrasion of the polishing layer 20 in the water supplied at the time of polishing the optical fiber connector are used as free abrasive grains.
- the optical fiber connector is polished together with the fixed abrasive. For this reason, the said abrasive film has a high grinding force. Further, even when the load applied to the optical fiber connector is low, loose abrasive grains necessary for polishing are supplied due to the abrasion of the polishing layer 20, so that the end face failure of the optical fiber connector is unlikely to occur, and the failure due to fluctuations in load conditions occurs. hard.
- the abrasion amount of the polishing layer 20 is 25 mg or less, the abrasive film can suppress the abrasion amount of the polishing layer 20 per polishing, and can be polished while maintaining a high grinding force. .
- the present invention is not limited to the above-described embodiment, and can be implemented in a mode in which various changes and improvements are made in addition to the above-described mode.
- a primer treatment layer may be provided between the base film and the polishing layer.
- the main component of the primer-treated layer is not particularly limited as long as the adhesion between the base film and the polishing layer can be ensured.
- water-soluble or water-dispersible polyester or acrylic resin A resin obtained by grafting an unsaturated bond-containing compound on a water-dispersible hydrophilic group-containing polyester can be used.
- the primer-treated layer can be formed, for example, by spray-coating a primer agent containing the main component on the surface of the base film and then drying. Moreover, you may use the base material by which the primer process layer was previously provided on the surface of the base film.
- the polishing layer may have a groove.
- a lattice shape at equal intervals or a stripe shape in which a plurality of linear grooves are arranged substantially in parallel can be used. Since the polishing layer has a groove, polishing debris and the like generated during polishing can be efficiently removed.
- Example 1 100 parts by mass of organosilica sol (“MEK-ST”, Nissan Chemical Industries, Ltd., primary particle diameter 10-20 nm, solid content 30% by mass) as the first abrasive particles, organosilica sol (Fuso Chemical) as the second abrasive particles “PL-7L-IPA” of Industrial Co., Ltd., organosilica sol (“MEK-ST” of NISSAN CHEMICAL INDUSTRIES CO., LTD.)
- organosilica sol As 50 parts by mass of average primary particle diameter of 75 nm, solid content of 20% by mass, and large second abrasive particles -2040 ", average primary particle size 200 nm, solid content 40 mass%) 13 parts by mass, N, N-dimethylformamide containing 5% by mass of acrylonitrile-butadiene rubber (" N230S "from JSR Corporation) as a binder 27 parts by mass of the solution, 5% by mass of cellulose resin (“Etocel 100” from Nihon Kasei Co., Ltd.)
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 6 ⁇ m.
- Example 2 100 parts by mass of organosilica sol (“MEK-ST”, Nissan Chemical Industries, Ltd., primary particle diameter 10-20 nm, solid content 30% by mass) as the first abrasive particles, organosilica sol (Fuso Chemical) as the second abrasive particles “PL-7L-IPA” from Kogyo Co., Ltd., 39 parts by mass of average primary particle size of 75 nm, solid content of 20% by mass, organosilica sol as the second abrasive particles of large diameter (“MEK-ST of Nissan Chemical Industries, Ltd.”) -2040 ", average primary particle size 200 nm, solid content 40% by mass) 19 parts by mass, N, N-dimethylformamide containing 5% by mass of acrylonitrile-butadiene rubber (" N230S "from JSR Corporation) as a binder 30 parts by mass of the solution, 5% by mass of cellulose resin as a binder (“Etocel 100” from Nihon Kasei Co., Ltd.) Methyl
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 5 ⁇ m.
- Example 3 100 parts by mass of organosilica sol (“MEK-ST”, Nissan Chemical Industries, Ltd., primary particle diameter 10-20 nm, solid content 30% by mass) as the first abrasive particles, organosilica sol (Fuso Chemical) as the second abrasive particles "PL-7L-IPA” from Kogyo Co., Ltd., 74 parts by mass of average primary particle diameter of 75 nm, solid content of 20% by mass, organosilica sol as the second large abrasive particles ("MEK-ST from Nissan Chemical Industries, Ltd.”) N, N-dimethylformamide containing 12 parts by weight of “-2040”, average primary particle size 200 nm, solid content 40% by mass, and 5% by mass of acrylonitrile-butadiene rubber (“N230S” from JSR Corporation) as a binder 35 parts by mass of the dissolution liquid, 5% by mass of cellulose resin as a binder (“Etocel 100” from Nihon Kasei Co., Ltd.) Methy
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 5 ⁇ m.
- Example 4 100 parts by mass of organosilica sol (“MEK-ST”, Nissan Chemical Industries, Ltd., primary particle diameter 10-20 nm, solid content 30% by mass) as the first abrasive particles, organosilica sol (Fuso Chemical) as the second abrasive particles “PL-7L-IPA” of Industrial Co., Ltd., 54 parts by mass of average primary particle diameter of 75 nm, solid content of 20% by mass, organosilica sol as second abrasive particles (“IPA-ST-ZL of Nissan Chemical Industries, Ltd.) N, N-dimethylformamide solution containing 7 parts by mass of primary particle size 70-100 nm, solid content 30% by mass and 5% by mass of acrylonitrile-butadiene rubber (“N230S” from JSR Corporation) as a binder 42 parts by mass of liquid and polyisocyanate as a binder (“Death Module L” from Sumika Bayer Urethane Co., Ltd.) 5C ", the solid content 75 mass%) 3 parts by mass of organ
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 8 ⁇ m.
- Example 5 150 parts by mass of organosilica sol (“MEK-ST”, Nissan Chemical Industries, Ltd., primary particle size 10-20 nm, solid content 30% by mass) as the first abrasive particles, organosilica sol (Fuso Chemical) as the second abrasive particles "PL-7L-IPA” from Kogyo Co., Ltd., 75 parts by mass of average primary particle size of 75 nm, solid content of 20% by mass, and organosilica sol as the second large abrasive particles ("MEK-ST from Nissan Chemical Industries, Ltd.") N, N-dimethylformamide containing 20 parts by mass of -2040 ", an average primary particle size of 200 nm and a solid content of 40% by mass” and 5% by mass of acrylonitrile-butadiene rubber (“N230S” from JSR Corporation) as a binder 27 parts by mass of the solution, 5% by mass of cellulose resin (“Etocel 100” from Nihon Kasei Co., Ltd.) as a bin
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 7 ⁇ m.
- organosilica sol (“MEK-ST”, Nissan Chemical Industries, Ltd., primary particle diameter 10-20 nm, solid content 30% by mass)
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 7 ⁇ m.
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 5 ⁇ m.
- Etocel 100 as a binder Methyl ethyl ketone solution 15 parts by weight containing, and ( "Desmodur L75C" of Sumika Bayer Urethane Co., Ltd., solid content 75 wt%) polyisocyanate as a binder were mixed 1 part by mass, to obtain a coating solution.
- the above coating solution is applied to one surface of a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- a polyester film (“HLE-75” manufactured by Teijin DuPont Films Ltd., average thickness: 75 ⁇ m) as a base material using a bar coating method and dried at 100 ° C. in an oven.
- an abrasive film having the content of abrasive particles shown in Table 1 was obtained.
- the average thickness of this polishing layer was 8 ⁇ m.
- polishing film is punched into a 127 mm diameter circular shape, and fixed by attaching to an elastic pad (hardness 55 °) of a polishing machine (Seiko Giken Co., Ltd. “OFL-15”), and ion-exchanged water is used as the polishing liquid.
- the final finish polishing was performed on the connection end face of the optical fiber connector after the intermediate finish polishing for 60 seconds at a load of 1500 g and a rotation speed of 180 rpm.
- the optical fiber connector was a set of 12 terminals, and the 12 terminals were polished at once. Polishing was performed on two sets of optical fiber connectors, and a total of 24 optical fiber connectors were polished.
- the intermediate finish polishing is performed by using a polishing film (“TOPXD150” manufactured by Bando Chemical Co., Ltd.) having diamond abrasive grains having an average primary particle diameter of 1 ⁇ m, and an elasticity of a polishing machine (“OFL-15” manufactured by Seiko Giken Co., Ltd.). Affixed to a pad (hardness 65 °) and fixed, and ion exchanged water was used as a polishing liquid, and the load was 1500 g and the rotation speed was 180 rpm, and was performed for 120 seconds.
- a polishing film (“TOPXD150” manufactured by Bando Chemical Co., Ltd.) having diamond abrasive grains having an average primary particle diameter of 1 ⁇ m
- OFL-15 elasticity of a polishing machine
- Non-defective product rate (number of non-defective products) / 24 x 100 (%)
- the polishing films of Examples 1 to 5 have a higher yield rate than the polishing films of Comparative Examples 1 to 4.
- the abrasive films of Comparative Examples 1 to 3 having a low amount of wear have a low yield rate even when the content of abrasive particles relative to the abrasive layer and the distribution of the primary particle size of the abrasive particles are changed.
- the polishing film of Comparative Example 4 having a large amount of wear causes abrasion of the polishing layer after polishing for a certain time, and a non-defective product cannot be obtained.
- the polishing films of Examples 1 to 5 have a high grinding force and hardly cause the end face defect of the optical fiber connector. is made of.
- Example 1 has a high yield rate even though the content of abrasive particles in the polishing layer is smaller than that in Example 4. That is, the amount of abrasion of the polishing layer is suitably controlled by setting the content of the large-diameter second abrasive particles having a primary particle size of 100 nm or more and less than 250 nm to the entire abrasive particles to 5 mass% or more and 25 mass% or less. I understand.
- the polishing film of the present invention has a high grinding force and a low abrasion amount of the polishing layer per polishing, and an end face defect of the optical fiber connector due to a change in load conditions during polishing hardly occurs. Therefore, the said polishing film can be used suitably for the final polishing process of an optical fiber connector.
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Abstract
Description
図1に示す研磨フィルムは、基材フィルム10と、この基材フィルム10の表面側に積層される研磨層20とを有する。
上記基材フィルム10の材質としては、特に限定されないが、適度な剛性を有し、研磨層20との良好な接着性や密着性が確保される材質が好ましい。このような材質としては、公知の熱可塑性樹脂を用いることができ、例えばアクリル、ポリカーボネート、ポリエチレンテレフタレート(PET)、ポリプロピレン(PP)、ポリエチレン(PE)等が挙げられる。基材フィルム10として、PET、PP、PE等の二軸延伸フィルムを用いてもよい。また、基材フィルム10の表面に化学処理、コロナ処理、プライマー処理等の接着性を高める処理が行われてもよい。
研磨層20は研磨粒子21とそのバインダー22とを有する。
良品率=(良品数)/24×100 (%)
上記研磨粒子21としては、ダイヤモンド、アルミナ、シリカ、セリア、炭化ケイ素等の粒子が挙げられる。中でも高い研削力が得られ、かつ傷のない仕上がり端面が得られるシリカ粒子が好ましい。このシリカ粒子としては、例えばコロイダルシリカ、乾式シリカ、湿式シリカ、溶融シリカ等の公知のシリカ粒子を用いることができる。ここで、「コロイダルシリカ」は、コロイダルシリカを有機溶媒に分散させたオルガノシリカゾルを含むものとする。
バインダー22は、研磨粒子21を分散させた状態で保持し、研磨層20を基材フィルム10に固定する。
当該研磨フィルムの製造方法は、基材フィルム10と研磨層20との接着性及び密着性を十分に確保できる公知の薄膜製造技術を採用することができ、例えば塗工液を準備する工程、上記塗工液を基材フィルム10表面に塗布する工程及び塗布した塗工液を乾燥する工程を備える。
当該研磨フィルムは、研磨層20の摩耗量が10mg以上であるので、光ファイバーコネクタの研磨時に供給される水の中に研磨層20の摩耗により供給された研磨粒子21が遊離砥粒として研磨層20の固定砥粒と共に光ファイバーコネクタを研磨する。このため、当該研磨フィルムは高い研削力を有する。また、光ファイバーコネクタに加えられる荷重が低い場合でも研磨層20の摩耗により研磨に必要な遊離砥粒が供給されるため、光ファイバーコネクタの端面不良が発生し難く、荷重条件の変動による不良が発生し難い。同時に、当該研磨フィルムは、研磨層20の摩耗量が25mg以下であるので、研磨1回当たりの研磨層20の摩耗量を低く抑えることができ、高い研削力を維持しつつ研磨できる回数が多い。
本発明は上記実施形態に限定されるものではなく、上記態様の他、種々の変更、改良を施した態様で実施することができる。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を50質量部、大径第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST-2040」、平均一次粒子径200nm、固形分40質量%)を13質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を27質量部、バインダーとしてのセルロース樹脂(日進化成株式会社の「エトセル100」)を5質量%含有するメチルエチルケトン溶解液27質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を3質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を39質量部、大径第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST-2040」、平均一次粒子径200nm、固形分40質量%)を19質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を30質量部、バインダーとしてのセルロース樹脂(日進化成株式会社の「エトセル100」)を5質量%含有するメチルエチルケトン溶解液30質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を4質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を74質量部、大径第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST-2040」、平均一次粒子径200nm、固形分40質量%)を12質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を35質量部、バインダーとしてのセルロース樹脂(日進化成株式会社の「エトセル100」)を5質量%含有するメチルエチルケトン溶解液35質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を5質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を54質量部、第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「IPA-ST-ZL」、一次粒子径70~100nm、固形分30質量%)を7質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を42質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を3質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を150質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を75質量部、大径第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST-2040」、平均一次粒子径200nm、固形分40質量%)を20質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を27質量部、バインダーとしてのセルロース樹脂(日進化成株式会社の「エトセル100」)を5質量%含有するメチルエチルケトン溶解液27質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を3質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を41質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を22質量部、第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「IPA-ST-ZL」、一次粒子径70~100nm、固形分30質量%)を3質量部とし、バインダーを実施例4と同様とした塗布液を用いた以外は、実施例4と同様にして表1に示す研磨粒子の含有量を持つ研磨フィルムを得た。この研磨層の平均厚さは8μmであった。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を37質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を45質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を4質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を30質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を2質量部混合し、塗布液を得た。
第1研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST」、一次粒子径10~20nm、固形分30質量%)を100質量部、第2研磨粒子としてのオルガノシリカゾル(扶桑化学工業株式会社の「PL-7L-IPA」、平均一次粒子径75nm、固形分20質量%)を50質量部、大径第2研磨粒子としてのオルガノシリカゾル(日産化学工業株式会社の「MEK-ST-2040」、平均一次粒子径200nm、固形分40質量%)を13質量部、バインダーとしてのアクリルニトリル-ブタジエンゴム(JSR株式会社の「N230S」)を5質量%含有するN,N-ジメチルホルムアミド溶解液を15質量部、バインダーとしてのセルロース系樹脂(日進化成株式会社の「エトセル100」)を5質量%含有するメチルエチルケトン溶解液15質量部、及びバインダーとしてのポリイソシアネート(住化バイエルウレタン株式会社の「デスモジュールL75C」、固形分75質量%)を1質量部混合し、塗布液を得た。
上記実施例1~5及び比較例1~4で得られた研磨フィルムに対して、摩耗量の測定と研磨試験とを行った。結果を表1に示す。
上記実施例1~5及び比較例1~4で得られた研磨フィルムごとに、試験片(平均直径100mm、平均厚さ0.08mm以上0.09mm以下)を3サンプル用意した。この試験片をテーバー摩耗試験機を用いて荷重4.9N、回転速度72rpm及び摩耗輪CS-10の条件で50回転し摩耗させた。そして、50回転前後の試験片の質量差を測定し、平均値を算出した。
上記実施例1~5及び比較例1~4で得られた研磨フィルムを用いて、フェルール(株式会社精工技研の「SCフェルール」)に光ファイバーが接着された光ファイバーコネクタの研磨試験を行った。
まず、研磨フィルムを直径127mmの円型に打ち抜き、研磨機(株式会社精工技研の「OFL-15」)の弾性パッド(硬度55°)に貼り付けて固定し、イオン交換水を研磨液として用い、中間仕上げ研磨後の光ファイバーコネクタの接続端面に対し最終仕上げ研磨を荷重1500g、回転数180rpmで60秒間行った。光ファイバーコネクタは12端子を1組とし、12端子を一度に研磨した。また、研磨は2組の光ファイバーコネクタに対して実施し、合計24端子の光ファイバーコネクタの研磨を行った。
研磨した光ファイバーコネクタについて、以下の手順で良品率の算出を行った。
良品率=(良品数)/24×100 (%)
20 研磨層
21 研磨粒子
21a 第1研磨粒子
21b 第2研磨粒子
22 バインダー
Claims (6)
- 基材フィルムと、この基材フィルムの表面側に積層される研磨層とを有する研磨フィルムであって、
上記研磨層が、研磨粒子とそのバインダーとを有し、
上記研磨層のテーバー摩耗試験による摩耗量が10mg以上25mg以下であることを特徴とする研磨フィルム。 - 上記研磨層における上記研磨粒子の含有量が85質量%以上である請求項1に記載の研磨フィルム。
- 上記研磨粒子が、一次粒子径10nm以上50nm未満の第1研磨粒子と、一次粒子径50nm以上250nm未満の第2研磨粒子とを有し、
上記研磨粒子全体に対する第1研磨粒子の含有量が55質量%以上80質量%以下、第2研磨粒子の含有量が15質量%以上45質量%以下である請求項1に記載の研磨フィルム。 - 上記第2研磨粒子のうち一次粒子径100nm以上250nm未満の研磨粒子の上記研磨粒子全体に対する含有量が5質量%以上25質量%以下である請求項3に記載の研磨フィルム。
- 上記研磨層の平均厚さが、4μm以上15μm以下である請求項1に記載の研磨フィルム。
- 上記研磨粒子が、シリカ粒子である請求項1に記載の研磨フィルム。
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JPWO2017098579A1 (ja) * | 2015-12-08 | 2018-11-01 | Mipox株式会社 | ナノシリカ研磨粒子を備えた研磨シート及び該研磨シートを用いた光ファイバコネクタの研磨方法及び製造方法 |
WO2020100848A1 (ja) * | 2018-11-13 | 2020-05-22 | 株式会社アドマテックス | 多心フェルール用研磨材 |
WO2021044870A1 (ja) * | 2019-09-03 | 2021-03-11 | エヌ・ティ・ティ・アドバンステクノロジ株式会社 | 光コネクタ研磨用パッド |
Families Citing this family (2)
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---|---|---|---|---|
CN111015537A (zh) * | 2019-12-20 | 2020-04-17 | 贲庆飞 | 一种砂布转接砂带双面无痕接口生产工艺 |
WO2024145518A1 (en) * | 2022-12-28 | 2024-07-04 | Saint-Gobain Abrasives, Inc. | Abrasive article with eco-friendly solvent |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06262532A (ja) * | 1993-03-05 | 1994-09-20 | Fuji Photo Film Co Ltd | 研磨体 |
JP2000506558A (ja) * | 1996-02-08 | 2000-05-30 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 硬化性水性塗料組成物およびその硬化した製品 |
JP2002103238A (ja) * | 2000-10-03 | 2002-04-09 | Nihon Micro Coating Co Ltd | 研磨フィルム及びその製造方法 |
JP2002239921A (ja) * | 2001-02-07 | 2002-08-28 | Dainippon Printing Co Ltd | 研磨フィルムおよびその製造方法 |
WO2002092286A1 (fr) * | 2001-05-14 | 2002-11-21 | Nihon Micro Coating Co., Ltd. | Pellicule abrasive et procede de fabrication |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3305557B2 (ja) * | 1995-04-10 | 2002-07-22 | 大日本印刷株式会社 | 研磨テープ、その製造方法および研磨テープ用塗工剤 |
JP2001277101A (ja) * | 2000-03-28 | 2001-10-09 | Rodel Nitta Co | 研磨布 |
CN101148031B (zh) * | 2001-11-13 | 2010-06-02 | 东洋橡胶工业株式会社 | 研磨垫及其制造方法 |
JP2004119657A (ja) * | 2002-09-26 | 2004-04-15 | Toray Ind Inc | 研磨パッド、研磨装置、およびそれを用いた研磨方法 |
JP2004249370A (ja) * | 2003-02-18 | 2004-09-09 | Hitachi Maxell Ltd | 研磨体及び研磨体の製造方法 |
JP2007190613A (ja) | 2004-02-09 | 2007-08-02 | Bando Chem Ind Ltd | 研磨フィルム及びその製造方法 |
US20100107509A1 (en) * | 2008-11-04 | 2010-05-06 | Guiselin Olivier L | Coated abrasive article for polishing or lapping applications and system and method for producing the same. |
JP2010274348A (ja) | 2009-05-27 | 2010-12-09 | Nihon Micro Coating Co Ltd | 研磨フィルム及びこれを用いた研磨方法 |
-
2015
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- 2015-08-05 WO PCT/JP2015/072198 patent/WO2016027671A1/ja active Application Filing
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- 2015-08-05 US US15/505,248 patent/US10220488B2/en active Active
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06262532A (ja) * | 1993-03-05 | 1994-09-20 | Fuji Photo Film Co Ltd | 研磨体 |
JP2000506558A (ja) * | 1996-02-08 | 2000-05-30 | ミネソタ マイニング アンド マニュファクチャリング カンパニー | 硬化性水性塗料組成物およびその硬化した製品 |
JP2002103238A (ja) * | 2000-10-03 | 2002-04-09 | Nihon Micro Coating Co Ltd | 研磨フィルム及びその製造方法 |
JP2002239921A (ja) * | 2001-02-07 | 2002-08-28 | Dainippon Printing Co Ltd | 研磨フィルムおよびその製造方法 |
WO2002092286A1 (fr) * | 2001-05-14 | 2002-11-21 | Nihon Micro Coating Co., Ltd. | Pellicule abrasive et procede de fabrication |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPWO2017098579A1 (ja) * | 2015-12-08 | 2018-11-01 | Mipox株式会社 | ナノシリカ研磨粒子を備えた研磨シート及び該研磨シートを用いた光ファイバコネクタの研磨方法及び製造方法 |
WO2020100848A1 (ja) * | 2018-11-13 | 2020-05-22 | 株式会社アドマテックス | 多心フェルール用研磨材 |
JPWO2020100848A1 (ja) * | 2018-11-13 | 2021-09-27 | 株式会社アドマテックス | 多心フェルール用研磨材 |
JP7197603B2 (ja) | 2018-11-13 | 2022-12-27 | 株式会社アドマテックス | 多心フェルール用研磨材 |
WO2021044870A1 (ja) * | 2019-09-03 | 2021-03-11 | エヌ・ティ・ティ・アドバンステクノロジ株式会社 | 光コネクタ研磨用パッド |
JP2021037580A (ja) * | 2019-09-03 | 2021-03-11 | エヌ・ティ・ティ・アドバンステクノロジ株式会社 | 光コネクタ研磨用パッド |
JP7264775B2 (ja) | 2019-09-03 | 2023-04-25 | エヌ・ティ・ティ・アドバンステクノロジ株式会社 | 光コネクタ研磨用パッド |
Also Published As
Publication number | Publication date |
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PL3184244T3 (pl) | 2021-11-29 |
CN106573362B (zh) | 2019-06-11 |
JPWO2016027671A1 (ja) | 2017-04-27 |
US20170266781A1 (en) | 2017-09-21 |
KR101904159B1 (ko) | 2018-10-04 |
CN106573362A (zh) | 2017-04-19 |
US10220488B2 (en) | 2019-03-05 |
EP3184244A4 (en) | 2018-07-04 |
EP3184244A1 (en) | 2017-06-28 |
KR20170039750A (ko) | 2017-04-11 |
JP5898821B1 (ja) | 2016-04-06 |
EP3184244B1 (en) | 2021-03-31 |
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