WO2016009873A1 - 導電性塗膜の製造方法及び導電性塗膜 - Google Patents
導電性塗膜の製造方法及び導電性塗膜 Download PDFInfo
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- WO2016009873A1 WO2016009873A1 PCT/JP2015/069413 JP2015069413W WO2016009873A1 WO 2016009873 A1 WO2016009873 A1 WO 2016009873A1 JP 2015069413 W JP2015069413 W JP 2015069413W WO 2016009873 A1 WO2016009873 A1 WO 2016009873A1
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- coating film
- conductive coating
- copper
- copper powder
- insulating substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D201/00—Coating compositions based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Definitions
- the present invention relates to a method for producing a conductive coating film excellent in adhesiveness and conductivity with an insulating substrate, and a conductive coating film produced by this production method.
- silver As the metal used as the conductive particles, silver is generally used because of its conductivity and stability over time. However, silver is not only expensive, but also has a problem of small amount of resources and ion migration that occurs between circuits under high temperature and high humidity.
- An example of a metal used for conductive particles in place of silver is copper.
- copper powder has a drawback that an oxide layer is easily formed on the particle surface and the conductivity is poor because of the oxide layer. Also, the adverse effect of the oxide layer becomes more pronounced as the particles become smaller. Therefore, in order to reduce the oxide layer of the copper powder, a reduction treatment at a temperature exceeding 300 ° C. in a reducing atmosphere such as hydrogen or a sintering treatment at a higher temperature is required. Due to the sintering process, the conductivity becomes close to that of bulk copper, but usable insulating substrates are limited to materials having high heat resistance such as ceramics and glass.
- a conductive paste using a polymer compound as a binder resin is known as a polymer-type conductive paste.
- the polymer type conductive paste can secure the adhesion of the conductive particles and the adhesiveness to the base material by the binder resin, but the binder resin impedes the contact between the conductive particles, so that the conductivity is deteriorated.
- the binder resin ratio of the conductive paste is decreased, usually the adhesiveness with the base material is lowered, the cohesive strength of the copper powder-containing layer is lowered, and the like.
- copper paste using copper powder as a conductive particle not only deteriorates conductivity due to the progress of oxidation on the surface of the copper particle, but even if the oxide layer is reduced, the treatment at a high temperature exceeding 100 ° C. Adhesion is likely to decrease due to decomposition of the binder resin near the oxide layer on the surface of the copper particles, generation of stress due to volume change caused by oxidation, and the like. That is, in copper paste, the problem caused by the progress of oxidation may be a decrease in adhesion in addition to the deterioration of conductivity.
- Patent Document 1 discloses that by using metal fine particles having a particle size of 100 nm or less, sintering can be performed at a temperature much lower than the melting point of the bulk metal, and a metal thin film having excellent conductivity can be obtained.
- Patent Document 2 discloses superheated steam treatment of a coating film formed using a metal powder paste.
- Patent Document 3 discloses a metal fine particle dispersion using a sulfonate group-containing polymer as a binder.
- Patent Document 4 discloses that a metal thin film can be obtained by plating after superheated steam treatment.
- the metal fine particle dispersion using a sulfonate group-containing polymer as a binder provides good dispersion, but the adsorption force of the sulfonate group to the metal fine particles is strong, and if it is contained in a large amount, the sintering of the metal fine particles tends to decrease. There is.
- Patent Document 5 discloses an improvement in adhesion to a substrate resin by treating a copper foil with an organic compound containing nitrogen in a heterocyclic ring.
- Patent Document 6 discloses an improvement in adhesion to a resin film by treating a copper foil with a heterocyclic compound having a thiol group.
- Patent Document 7 discloses that the adhesion durability of a copper foil treated with an aromatic diacyl hydrazide is improved.
- Patent Document 8 discloses that after the plasma treatment is performed on the polyimide resin layer, the plasma-treated surface is treated with an amino compound to improve the adhesion to the metal.
- the treatment of the copper surface with a heterocyclic compound or a hydrazide compound has a problem that the sintering effect by heating becomes poor and the expression of conductivity is deteriorated, or the characteristics are changed by washing the treatment layer.
- a conductive layer cannot be processed beforehand like a copper foil.
- An object of the present invention is to provide a method for producing a conductive coating film having good conductivity on an insulating substrate using a paste containing copper powder and having excellent adhesion durability.
- the present invention is as follows. (1) After providing a resin layer containing a heterocyclic compound and / or a hydrazide compound containing nitrogen in a heterocyclic ring on an insulating substrate, and forming a copper powder-containing coating film using a copper paste on the resin layer A method for producing a conductive coating film, wherein the heat treatment is performed in a non-oxidizing atmosphere. (2) Production of the conductive coating film according to (1), wherein the copper paste contains copper powder, a binder resin, and a solvent, and the ratio of the copper powder in the total nonvolatile content of the copper paste is 94% by weight or more. Method.
- the method for producing a conductive coating film of the present invention comprises copper powder and a binder resin as main components on an insulating substrate through a resin layer containing a heterocyclic compound and / or a hydrazide compound containing nitrogen in the heterocyclic ring.
- the process which heat-processes in a non-oxidizing atmosphere is included.
- heat treatment in a non-oxidizing atmosphere not only the oxide on the surface of the copper powder is reduced and sintering of the copper powder occurs, but also the adsorption of the specific compound to the copper powder-containing coating proceeds and the copper powder Adhesion between the coating film and the insulating substrate is improved.
- the adhesion force caused by the stress generated at the interface of the conductive coating film due to oxidation of the metal particles or change in the crystalline state, etc. Decline can be prevented.
- the conductivity of the coating film can be further improved by increasing the content ratio of the copper powder in the copper paste.
- the copper paste used in the present invention is obtained by dispersing copper powder and a binder resin as main components in a solvent.
- the copper powder may be metal particles containing copper as a main component or a copper alloy having a copper ratio of 80% by weight or more, and the surface of the copper powder may be coated with silver.
- the copper powder may be completely coated with silver or may be a film in which a part of copper is exposed. Further, the copper powder may have an oxide film on the particle surface to such an extent that the conductivity is not impaired.
- the shape of the copper powder can be any of a substantially spherical shape, a dendritic shape, a flake shape, and the like.
- wet copper powder, electrolytic copper powder, atomized copper powder, vapor phase reduced copper powder, or the like can be used.
- the copper powder used in the present invention preferably has an average particle size of 0.01 to 20 ⁇ m.
- the average particle size of the copper powder is more preferably in the range of 0.02 ⁇ m to 15 ⁇ m, still more preferably 0.04 to 4 ⁇ m, still more preferably 0.05 to 2 ⁇ m.
- the average particle diameter is measured by measuring the particle diameter of 100 particles using any one of a transmission electron microscope, a field emission transmission electron microscope, and a field emission scanning electron microscope to obtain an average value.
- the copper powder used in the present invention may be used by mixing two or more kinds of copper powders having different particle diameters as long as the average particle diameter is 0.01 to 20 ⁇ m. Particularly for screen printing copper pastes, it is desirable to mix 0.05-0.5 ⁇ m fine powder and 1-10 ⁇ m micron-sized powder in order to impart flow characteristics peculiar to this application.
- the solvent used in the copper paste used in the present invention is selected from those that dissolve the binder resin. It may be an organic compound or water.
- the solvent has a role of adjusting the viscosity of the dispersion in addition to the role of dispersing the copper powder in the copper paste.
- examples of the organic solvent include alcohol, ether, ketone, ester, aromatic hydrocarbon, amide and the like.
- binder resin used for the copper paste used in the present invention examples include resins such as polyester, polyurethane, polycarbonate, polyether, polyamide, polyamideimide, polyimide, and acrylic.
- a resin having an ester bond, a urethane bond, an amide bond, an ether bond, an imide bond or the like in the main chain is preferable from the viewpoint of the stability of the copper powder.
- the ratio of each component of the copper paste used in the present invention is preferably in the range of 5 to 400 parts by weight of solvent and 0.5 to 20 parts by weight of binder resin with respect to 100 parts by weight of copper powder.
- the binder resin is more preferably 1 to 6 parts by weight, still more preferably 2 to 5 parts by weight.
- the ratio of copper powder in the total nonvolatile content is preferably 94% by weight or more, and more preferably 96% by weight or more.
- the non-volatile component is a component other than the volatile solvent in the copper paste, and includes a copper powder, a binder resin, a filler, a curing agent, a dispersant, and the like.
- the binder resin When the proportion of the copper powder in the total nonvolatile content is increased, a small amount of the binder resin allows the binder resin to perform the necessary functions.
- the desirable molecular weight varies depending on the type of the binder resin, the number average molecular weight of polyester, polyurethane or polycarbonate is 10,000 or more, preferably 20,000 or more.
- the upper limit of the molecular weight of the binder resin is about 500,000 due to the viscosity of the dispersion.
- the binder resin may contain a polymer containing a functional group capable of adsorbing to a metal such as a sulfonate group or a carboxylate group. desirable.
- Containing the sulfonate group is represented by the sulfur content in the binder resin, and the sulfur content in the binder resin is preferably 0.05 to 3% by weight, more preferably 0.1 to 1% by weight. is there.
- the carboxylic acid group is preferably contained in an amount of 30 to 500 mol, more preferably 50 to 200 mol, per metric ton of binder resin as the original carboxylic acid group.
- the copper paste used in the present invention may contain a curing agent as necessary.
- the curing agent that can be used in the present invention include phenol resins, amino resins, isocyanate compounds, epoxy resins, oxetane compounds, maleimide compounds, and the like.
- the amount of the curing agent used is preferably in the range of 1 to 50% by weight of the binder resin, and more preferably in the range of 1 to 20% by weight.
- the copper paste used in the present invention may contain a dispersant.
- the dispersant include higher fatty acids such as stearic acid, oleic acid, and myristic acid, fatty acid amides, fatty acid metal salts, phosphoric acid esters, and sulfonic acid esters.
- the amount of the dispersant used is preferably in the range of 0.1 to 10% by weight of the binder resin.
- a general method for dispersing powder in a liquid can be used. For example, after mixing a mixture of copper powder and a binder resin solution and, if necessary, an additional solvent, dispersion may be performed by an ultrasonic method, a mixer method, a three-roll method, a ball mill method, or the like. Of these dispersing means, a plurality of dispersing means can be combined for dispersion. These dispersion treatments may be performed at room temperature, or may be performed by heating in order to reduce the viscosity of the dispersion.
- a substrate that can withstand the temperature of the heat treatment is used.
- a polyimide resin sheet or film, ceramics, glass, or a glass epoxy laminated board can be used, and a polyimide resin sheet or film is desirable.
- the polyimide resin examples include a polyimide precursor resin, a solvent-soluble polyimide resin, and a polyamideimide resin.
- the polyimide resin can be polymerized by a usual method. For example, a method of obtaining a polyimide precursor solution by reacting tetracarboxylic dianhydride and diamine in a solution at a low temperature, a method of obtaining a solvent-soluble polyimide solution by reacting tetracarboxylic dianhydride and diamine in a solution, raw materials There are a method using an isocyanate as a method and a method using an acid chloride as a raw material.
- a polyimide film or sheet as an insulating substrate can be obtained by a general method of performing an imidization reaction at a higher temperature after wet-forming a precursor resin solution. Since solvent-soluble polyimide resins and polyamideimide resins are already imidized in solution, they can be formed into sheets or films by wet film formation.
- the insulating substrate may be subjected to surface treatment such as corona discharge treatment, plasma treatment, alkali treatment.
- a resin layer containing a heterocyclic compound containing nitrogen and / or a hydrazide compound in a heterocyclic ring is provided on an insulating substrate, and a copper powder-containing coating film is formed on the resin layer using a copper paste.
- the resin used for the resin layer is selected from those having excellent adhesion to the insulating substrate, and examples thereof include polyester, polyurethane, polycarbonate, polyether, polyamide, polyamideimide, polyimide, and acrylic.
- a resin having an ester bond, an imide bond, an amide bond or the like in the main chain is desirable from the viewpoint of the heat resistance of the resin layer and the adhesion to the insulating substrate.
- the resin layer it is also desirable for the resin layer to contain a curing agent in view of the heat resistance of the resin layer and the adhesion to the insulating substrate.
- a curing agent examples include phenol resin, amino resin, isocyanate compound, epoxy resin, oxetane compound, maleimide compound and the like.
- the amount of the curing agent used is preferably in the range of 1 to 50% by weight of the resin weight.
- the resin layer provided on the insulating substrate contains a heterocyclic compound and / or a hydrazide compound containing nitrogen in the heterocyclic ring.
- Heterocyclic compounds and hydrazide compounds containing nitrogen in the heterocyclic ring may be used as a rust preventive agent for copper foil or copper powder, but in the present invention, these compounds are subjected to heat treatment to form a coating film containing copper powder. And strong adhesion.
- Heterocyclic compounds and hydrazide compounds containing nitrogen have a high affinity for copper and strongly adsorb on the copper surface. Energy is required to adsorb a nitrogen-containing heterocyclic compound or hydrazide compound present in a resin layer having excellent adhesion to an insulating substrate to the copper surface, and heat treatment is most commonly used.
- heterocyclic compound containing nitrogen in the heterocyclic ring examples include pyridine, oxazole, isoquinoline, indole, thiazole, imidazole, benzimidazole, bipyridyl, pyrazole, benzothiazole, pyrimidine, purine, triazole, benzotriazole, benzoguanamine, and the like.
- These structural isomers are also included. These may have a substituent such as an alkyl group, a phenyl group, a phenol group, a carboxyl group, an amino group, a hydroxyl group, a thiol group, and an aromatic ring. These may be condensed with an aromatic ring or a heterocyclic ring. Of these, imidazole compounds and benzotriazole compounds are desirable.
- the hydrazide compound is a compound having a structure in which hydrazine or a derivative thereof and carboxylic acid are condensed.
- examples thereof include salicylic acid hydrazide, isophthalic acid dihydrazide, and a condensate of salicylic acid hydrazide and dodecanedicarboxylic acid.
- the resin layer provided on the insulating substrate preferably contains 1 to 30 parts by weight of the heterocyclic compound and / or hydrazide compound containing nitrogen in the heterocyclic ring with respect to 100 parts by weight of the resin.
- the amount of the heterocyclic compound and / or hydrazide compound containing nitrogen in the heterocyclic ring is less than 1 part by weight relative to 100 parts by weight of the resin, the adhesion with the copper powder-containing layer is not improved.
- the heterocyclic compound and / or hydrazide compound containing nitrogen in the heterocyclic ring exceeds 30 parts by weight, the physical properties of the resin layer may be deteriorated.
- a general method used when applying or printing a resin on a film or sheet can be used. Examples thereof include screen printing, dip coating, spray coating, spin coating, roll coating, die coating, ink jet, letterpress printing, and intaglio printing.
- the resin layer can be formed by evaporating the solvent from the coating film formed by printing or coating by heating or reducing pressure.
- the resin layer may be provided on the entire surface of the insulating substrate, or may be provided partially, as long as it is provided at least on the portion where the conductive coating film is formed.
- the resin layer containing a heterocyclic compound and / or a hydrazide compound containing nitrogen in the heterocyclic ring formed in the present invention preferably has a thickness of 5 ⁇ m or less, particularly 2 ⁇ m or less. Moreover, the minimum of the thickness of this resin layer is 0.01 micrometer. If the thickness of the resin layer exceeds 5 ⁇ m, the adhesion may decrease due to sintering distortion of the copper powder that occurs in the heat treatment, and if the thickness is less than 0.01 ⁇ m, the adhesion may be caused by decomposition of the binder resin by the heat treatment. The decrease in
- the conductive coating film may be provided on the entire surface of the insulating substrate or may be a pattern object such as a conductive circuit. Further, the conductive coating film may be provided on one side or both sides of the insulating substrate.
- a coating film containing copper powder on an insulating substrate via a resin layer using a liquid copper paste use a general method used when applying or printing the copper paste on a film or sheet. Can do. Examples thereof include screen printing, dip coating, spray coating, spin coating, roll coating, die coating, ink jet, letterpress printing, and intaglio printing.
- a copper powder-containing coating film can be formed by evaporating the solvent from the coating film formed by printing or coating by heating or decompression.
- the copper powder-containing coating at this stage has a specific resistance of 1 ⁇ ⁇ cm or more, and the conductivity necessary for a conductive circuit is not obtained.
- the thickness of the copper powder-containing coating film is mainly determined from the required conductivity, but it is preferable that the thickness after drying after evaporation of the solvent contained in the copper paste is 0.05 ⁇ m to 100 ⁇ m. If the thickness of the copper powder-containing coating film is less than 0.05 ⁇ m, sufficient conductivity may not be obtained even if heat treatment is performed in a non-oxidizing atmosphere. The solvent may remain, and the remaining solvent may bump during the superheated steam treatment, in which case the coating film surface may be defective.
- the thickness of the copper powder-containing coating film is more preferably 0.1 ⁇ m to 50 ⁇ m.
- drying may be completed after a resin layer is formed on a temporarily dried product of a polyimide precursor solution or a primary dried product of a polyimide solution or a polyamideimide solution.
- the drying may be completed after the copper paste is applied before the drying is completed.
- the solvent for the polyimide precursor solution and the polyimide solution an amide solvent is generally used.
- amide solvents have poor drying properties, it is necessary to raise the drying temperature to 150 ° C. or higher. At that time, since oxidation occurs in the copper powder, heating in an oxygen-free state such as an inert gas such as nitrogen or superheated steam is desirable.
- the adhesion between the insulating substrate and the conductive layer is improved through the resin layer by adsorbing the nitrogen-containing heterocyclic compound or hydrazide compound present on the copper particle surface by the heat treatment.
- the compound When the compound is contained in the copper paste, it inhibits the sintering of the copper particles by heat treatment, causing a decrease in conductivity and a decrease in the coating film strength of the conductive layer.
- a conductive layer having high conductivity can be adhered to the insulating substrate.
- heat treatment which is an essential requirement in the production method of the present invention means that the oxide on the surface of the copper powder is reduced to cause sintering of the copper powder, and the adhesion between the coating film containing copper powder and the insulating substrate is improved. Is to be done. Therefore, a simple heat treatment (for example, a drying treatment) in which such an effect cannot be obtained is not included.
- the heat treatment must be performed in a non-oxidizing atmosphere such as a reducing atmosphere state or an oxygen-free state because copper is easily oxidized at a high temperature.
- Examples of the heat treatment used in the present invention include heat treatment in a reducing atmosphere containing hydrogen and formic acid and superheated steam treatment.
- the superheated steam treatment is desirable from the viewpoints of heating efficiency, safety, economy, and conductivity obtained.
- Superheated steam treatment uses superheated steam having a heat capacity and specific heat larger than that of air as a heat source for heat treatment.
- Superheated steam is steam that has been heated further by heating saturated steam.
- the optimum range of heat treatment conditions varies depending on the conductive target, copper powder characteristics, and binder resin. Moreover, the temperature at which adhesiveness is manifested by the heat treatment varies depending on the kind and amount of the heterocyclic compound or hydrazide compound containing nitrogen in the heterocyclic ring in the resin layer.
- the temperature of the heat treatment is 200 ° C. or higher, preferably 250 ° C. or higher, more preferably 300 ° C. or higher.
- it is preferable that the temperature of heat processing is more than the glass transition point of resin used for a resin layer, or melting
- the upper limit temperature of the heat treatment varies depending on the material used.
- the heat treatment time is 10 seconds to 10 minutes, preferably 20 seconds to 5 minutes.
- the superheated steam treatment is particularly preferable because it has good heating efficiency, can shorten the treatment time required for reduction of the oxide on the surface of the copper powder, and can suppress a decrease in adhesion due to treatment at a high temperature.
- the conductive coating film of the present invention may be plated after the heat treatment to improve conductivity, and further to improve corrosion resistance, wear resistance, solderability, hardness, etc. good.
- the plating may be performed by a known method, and examples include electroplating, electroless plating, and displacement plating. Examples of the plating metal include copper, nickel, gold, silver, palladium, tin, and alloys mainly composed of these metals. It is done. Although the plating may be performed under alkaline or acidic conditions or at a high temperature, the conductive coating film of the present invention is excellent in adhesiveness with the insulating substrate, so that the damage due to the plating is little or not recognized.
- the electrical resistance value was measured using a low resistivity meter Lorester GP manufactured by Mitsubishi Chemical Corporation and an ASP probe.
- the measured electrical resistance value was surface resistance, and the volume resistivity was the product of the surface resistance and the thickness of the conductive layer (copper powder-containing layer) of the measurement sample.
- Adhesion test 1 (Initial evaluation) 10 ⁇ m copper sulfate electro-copper plating was applied to the conductive coating film, and one day later, the 180 ° peel strength of the plating layer was measured under the conditions of a measurement temperature of 20 ° C. and a pulling speed of 100 mm / min. The plating pretreatment was performed using “DP-320 Clean” manufactured by Okuno Pharmaceutical Co., Ltd. (Evaluation of heat resistance) The adhesion after the heat resistance test in which the electroconductive coating film plated was allowed to stand at 150 ° C. for 1 week was measured as in the case of evaluating the adhesion in the initial evaluation.
- Adhesion test 2 A cellophane tape was bonded to the conductive coating film and peeled off rapidly. A: No peeling occurs in the conductive coating film. B: Although peeling is recognized, peeling is less than 20% of the cellophane tape pasting part. C: Peeling was observed, and peeling was 20% or more of the cellophane tape-laminated portion.
- Copper powder used Copper powder 1: In water, an aqueous copper (II) sulfate solution was adjusted to pH 12.5 with sodium hydroxide, reduced to cuprous oxide with anhydrous glucose, and further reduced to copper powder with hydrated hydrazine. Observation with a transmission electron microscope reveals spherical particles having an average particle diameter of 0.15 ⁇ m. Copper powder 2: Cuprous oxide was suspended in water containing tartaric acid and reduced to copper powder with hydrated hydrazine. Observation with a transmission electron microscope reveals spherical particles having an average particle diameter of 1.8 ⁇ m. -Copper powder 3: It is a particle
- TT-LYK Adeka hydrazide compound “CDA-6”, and isophthalic acid dihydrazide were added at the blending ratios shown in Table 1.
- This composition was applied to a polyimide film “Apical NPI thickness 25 ⁇ m” manufactured by Kaneka Co., Ltd. so as to have a thickness after drying of 0.5 ⁇ m, followed by drying and heat treatment at 200 ° C. for 5 minutes.
- This composition was applied to a polyimide film “Apical NPI thickness 25 ⁇ m” manufactured by Kaneka Co., Ltd. so that the thickness after drying was 0.5 ⁇ m. Then, it was dried and heat-treated at 200 ° C. for 5 minutes.
- AC-14 Similar to AC-1, except that a polyimide film with a resin layer was obtained without adding additives.
- AC-15 Similar to AC-9, but without adding additives, a polyimide film with a resin layer was obtained.
- Binder resin Byron 270: Copolyester manufactured by Toyobo Co., Ltd.
- Byron 290 Copolyester manufactured by Toyobo Co., Ltd.
- Polyester 1-1-2-2 140 parts of dimethyl terephthalate in a reaction vessel equipped with a thermometer, stirrer, and Liebig condenser , 8.9 parts of dimethyl 5-sodium sulfoisophthalate, 122 parts of 1,3-propylene glycol, 82 parts of hydroxypivalyl hydroxypivalate and 0.1 part of tetrabutoxy titanate were heated at 150 to 230 ° C. for 180 minutes.
- polyester resin After transesterification, 50.5 parts of sebacic acid was added, and the esterification reaction was performed at 200 to 220 ° C. for 60 minutes. The temperature of the reaction system was raised to 270 degrees in 30 minutes, and the system was gradually decompressed to 0.3 mmHg after 10 minutes. The reaction was performed for 80 minutes under these conditions to obtain a polyester resin. The analysis results of the obtained resin are shown in Table 2. Similarly, the polyester described in Table 2 was obtained. Polyesters 1-2 and 1-3 have the same composition as polyester 1-1 and different molecular weights. Polyesters 2-1 and 2-2 have a composition similar to that of polyester 1-1 and do not contain a sulfonate group.
- Example 1 A composition having the following blending ratio was placed in a sand mill and dispersed at 800 rpm for 1 hour. As media, zirconia beads having a radius of 0.2 mm were used. The obtained copper paste was applied onto the resin layer of the polyimide film with a resin layer (AC-1) with an applicator so that the thickness after drying was 2 ⁇ m, and dried with hot air at 100 ° C. for 5 minutes to contain copper powder. A coating film was obtained.
- AC-1 resin layer
- the superheated steam treatment of the obtained copper powder-containing coating film was performed at 330 ° C. for 2 minutes.
- a steam heating apparatus (“DHF Super-Hi10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a superheated steam generator, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace.
- Table 3 shows the evaluation results of the obtained conductive coating film.
- Examples 2-8 A conductive coating film was obtained in the same manner as in Example 1 except that the polyimide film with a resin layer described in Table 3 was used as the insulating substrate. Table 3 shows the evaluation results of the obtained conductive coating film.
- Examples 9-14 A composition having the following blending ratio was placed in a sand mill and dispersed at 800 rpm for 1 hour. As media, zirconia beads having a radius of 0.2 mm were used. The obtained copper paste was applied onto the resin layer of the polyimide film with a resin layer (AC-9) with an applicator so that the thickness after drying was 2 ⁇ m, and dried with hot air at 100 ° C. for 5 minutes to contain copper powder. A coating film was obtained.
- the superheated steam treatment of the obtained copper powder-containing coating film was performed at 300 ° C. for 2 minutes.
- a steam heating apparatus (“DHF Super-Hi10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a superheated steam generator, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace.
- Table 3 shows the evaluation results of the obtained conductive coating film.
- a polyimide film with a resin layer described in Table 3 was used as an insulating substrate, and the superheated steam treatment conditions were changed as shown in Table 3.
- Comparative Example 1 A conductive coating film was obtained in the same manner as in Example 1 except that a polyimide film “Apical NPI thickness 25 ⁇ m” manufactured by Kaneka Co., Ltd., which was not resin-coated, was used as the insulating substrate. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 2 A conductive coating film was obtained in the same manner as in Example 1 except that AC-14 was used as the insulating substrate. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 3 A conductive coating film was obtained in the same manner as in Example 9 except that AC-15 was used as the insulating substrate. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 4 A polyimide film “Apical NPI thickness 25 ⁇ m” manufactured by Kaneka Corporation was immersed in 100 ml of a 5% tetrahydrofuran solution of 2-phenylimidazole for 5 minutes at room temperature, and then the immersed part was submerged in 1 L of tetrahydrofuran for 5 minutes, followed by drying at room temperature. It was. A conductive coating film was obtained in the same manner as in Example 1 except that this polyimide film was used as an insulating substrate. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Examples 5 and 6 As in Comparative Example 2, except that the copper paste used was 2-phenylimidazole in Comparative Example 5, benzotriazole derivative “JF-832” manufactured by Johoku Chemical Co., Ltd. in Comparative Example 6, and 1% by weight of the non-volatile content of the copper paste. A conductive coating film was obtained in the same manner except that it was added. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Examples 7 and 8 Similar to Comparative Example 3, except that the hydrazide compound “CDA-6” manufactured by Adeka Co. was used as the copper paste used in Comparative Example 7, 1% by weight of the non-volatile content of the copper paste, and in Comparative Example 8, 3% of the non-volatile content of the copper paste.
- a conductive coating film was obtained in the same manner except that wt% was added. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Examples 9 and 10 As in Comparative Example 3, except that 1% by weight of the non-volatile content of the copper paste was added to the used copper paste as a benzotriazole derivative “BT-3700” manufactured by Johoku Chemical Co., Ltd. A conductive coating film was obtained in the same manner except that the treatment conditions were changed. Table 4 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 11 An electroless copper plating solution “OPC Copper T” manufactured by Okuno Pharmaceutical Co., Ltd. was applied to the polyimide film with a copper powder-containing coating film before the superheated steam treatment having a surface resistance of 10 6 ⁇ / ⁇ or more obtained during the process of Example 1. ”Was performed at 60 ° C. for 10 minutes to impart conductivity. The surface resistance at this time was 0.2 ⁇ / ⁇ . Furthermore, electrolytic copper plating was performed to evaluate adhesion and heat resistance. The evaluation results are shown in Table 4.
- Examples 15-18 The conditions shown in Table 5 for the polyimide film with a copper powder-containing coating film before the superheated steam treatment obtained in the middle of the process of Example 1 in a firing furnace in a mixed gas atmosphere of hydrogen 0.1 L / min and nitrogen 1 L / min was heated to form a conductive coating film.
- Table 5 shows the evaluation results of the obtained conductive coating film.
- Examples 19 and 20 The conditions shown in Table 5 for the polyimide film with a copper powder-containing coating film before the superheated steam treatment obtained in the middle of the process of Example 11 in a firing furnace in a mixed gas atmosphere of hydrogen 0.1 L / min and nitrogen 1 L / min Was heated to form a conductive coating film.
- Table 5 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 12 The conditions shown in Table 5 for the polyimide film with a copper powder-containing coating film before the superheated steam treatment obtained in the middle of the process of Comparative Example 2 in a firing furnace in a mixed gas atmosphere of hydrogen 0.1 L / min and nitrogen 1 L / min Was heated to form a conductive coating film. Table 5 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 13 The conditions shown in Table 5 in the firing furnace of the mixed gas atmosphere of the hydrogen powder 0.1L / min and the nitrogen 1L / min of the polyimide film with the copper powder-containing coating film before the superheated steam treatment obtained during the process of Comparative Example 3 was heated to form a conductive coating film. Table 5 shows the evaluation results of the obtained conductive coating film.
- Example 21 The conductive polyimide film obtained in Example 1 was plated with an electroless copper plating solution “ATS Adcopper IW” manufactured by Okuno Pharmaceutical Co., Ltd. for 5 minutes at 40 ° C. to improve conductivity.
- the surface resistance decreased from 0.055 ⁇ / ⁇ to 0.0028 ⁇ / ⁇ by plating for 5 minutes, and the conductivity was improved.
- a tape peeling test was performed in which cellophane tape was bonded to the plated surface and peeled off rapidly, no peeling occurred.
- Comparative Example 14 On the polyimide film with copper powder-containing coating film before superheated steam treatment obtained in the process of Example 1, plating is performed at 40 ° C. for 5 minutes with an electroless copper plating solution “ATS Ad Copper IW” manufactured by Okuno Pharmaceutical Industries, Ltd. Conductivity was developed. Surface resistance decreased from 10 6 ⁇ / ⁇ or more to 0.81 ⁇ / ⁇ after 5 minutes of plating, and the conductivity was improved. However, a tape peeling test was performed in which cellophane tape was applied to the plated surface and peeled off rapidly. , Peeling occurred on the entire surface.
- Example 22 An epoxy glass cloth prepreg “EGL-7” having a thickness of 200 ⁇ m manufactured by Nitto Shinko Co., Ltd. was used as an insulating substrate, and an epoxy glass cloth which was heated and cured at 200 ° C. for 1 hour with a fluororesin film as a release film.
- a solution used for the polyimide film “AC-1” with a resin layer was applied to an insulating substrate with a wire bar so that the thickness after drying was 0.5 ⁇ m, and was dried and cured at 200 ° C. for 5 minutes.
- the copper paste similar to Example 1 was apply
- Example 2 Further, a superheated steam treatment was performed in the same manner as in Example 1 to obtain a conductive coating film. In the same manner as in Example 1, the conductive coating film was evaluated. The surface resistance was 0.068 ⁇ / ⁇ , the initial value of the adhesion test 1 was 11.1 N / cm, and after the heat resistance test was 10.1 N / cm.
- Examples 23-25 A composition having the following blending ratio was placed in a sand mill and dispersed at 800 rpm for 1 hour. As media, zirconia beads having a radius of 0.2 mm were used. The obtained copper paste was applied on the resin layer of the polyimide film with a resin layer (AC-16) by an applicator so that the thickness after drying was as shown in Table 6, and applied at 100 ° C. The coating film containing copper powder was obtained by drying with hot air for 10 minutes.
- the superheated steam treatment of the obtained copper powder-containing coating film was performed at 330 ° C. for 2 minutes.
- a steam heating apparatus (“DHF Super-Hi10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a superheated steam generator, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace.
- Table 6 shows the evaluation results of the obtained conductive coating film.
- Examples 26-28 A composition having the following blending ratio was placed in a sand mill and dispersed at 800 rpm for 1 hour. As media, zirconia beads having a radius of 0.2 mm were used. The obtained copper paste was applied onto the resin layer of the polyimide film with a resin layer (AC-16, 3) with an applicator so that the thickness after drying was as shown in Table 6, respectively. Drying with hot air at 10 ° C. for 10 minutes gave a coating film containing copper powder.
- a resin layer AC-16, 3
- the superheated steam treatment of the obtained copper powder-containing coating film was performed at 330 ° C. for 2 minutes.
- a steam heating apparatus (“DHF Super-Hi10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a superheated steam generator, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace.
- Table 6 shows the evaluation results of the obtained conductive coating film.
- Examples 29, 30 The conditions shown in Table 6 for the polyimide film with a copper powder-containing coating film before superheated steam treatment obtained in the middle of the process of Example 27 in a firing furnace in a mixed gas atmosphere of hydrogen 0.1 L / min and nitrogen 1 L / min was heated to form a conductive coating film. Table 6 shows the evaluation results of the obtained conductive coating film.
- Example 31 A composition having the following blending ratio was kneaded with a mixer and then dispersed using a three-roll “M-50” manufactured by Exact Technologies. The obtained copper paste was applied on the resin layer of the polyimide film with a resin layer (AC-16) by an applicator so that the thickness after drying was 20 ⁇ m, and dried with hot air at 100 ° C. for 15 minutes. A coating film containing copper powder was obtained.
- Polyester 1-1 solution 8.8 parts (35% by weight ethyl carbitol acetate solution) Copper powder 1 (average particle size 0.15 ⁇ m) 37 parts Copper powder 2 (average particle size 1.8 ⁇ m) 30 parts Copper powder 3 (average particle size 5 ⁇ m) 30 parts Ethyl carbitol acetate 2.7 parts
- the superheated steam treatment of the obtained copper powder-containing coating film was performed at 340 ° C. for 2 minutes.
- a steam heating apparatus (“DHF Super-Hi10” manufactured by Daiichi High Frequency Industrial Co., Ltd.) was used as a superheated steam generator, and 10 kg / hour of superheated steam was supplied to the heat treatment furnace.
- Table 7 shows the evaluation results of the obtained conductive coating film.
- Examples 32-42 As in Example 31, except that in Examples 32 to 35 and 39 to 42, the polyesters listed in Table 7 were used as the binder resin, and Examples 38 and 41 were the copper powder in the total nonvolatile content in the copper paste.
- a conductive coating film was obtained in the same manner except that the composition was changed to the composition described in Table 7 so that the ratio was 99% by weight. Table 7 shows the evaluation results of the obtained conductive coating film.
- Comparative Example 15 A conductive coating film was obtained in the same manner as in Example 31 except that a polyimide film “Apical NPI thickness 25 ⁇ m” manufactured by Kaneka Co., Ltd., which was not resin-coated, was used as the insulating substrate. Table 8 shows the evaluation results of the obtained conductive coating film.
- Comparative Examples 16 and 17 A conductive coating film was obtained in the same manner as in Example 31 except that AC-14 was used as the insulating substrate, and polyester 1-3 was used as the binder resin in Comparative Example 17. Table 8 shows the evaluation results of the obtained conductive coating film.
- Comparative Examples 18 and 19 A conductive coating film was obtained in the same manner as in Example 31 except that AC-15 was used as the insulating substrate and that polyester 2-1 was used as the binder resin in comparative example 19. Table 8 shows the evaluation results of the obtained conductive coating film.
- Example 43 An epoxy glass cloth prepreg “EGL-7” having a thickness of 200 ⁇ m manufactured by Nitto Shinko Co., Ltd. was used as an insulating substrate, and an epoxy glass cloth which was heated and cured at 200 ° C. for 1 hour with a fluororesin film as a release film.
- a solution used for the polyimide film “AC-16” with a resin layer was applied to an insulating substrate with a wire bar so that the thickness after drying was 0.5 ⁇ m, and was dried and cured at 200 ° C. for 5 minutes.
- the copper paste similar to Example 31 was apply
- Example 31 Further, a superheated steam treatment was performed in the same manner as in Example 31 to obtain a conductive coating film.
- the volume resistivity of the obtained conductive coating film was 6.8 ⁇ ⁇ cm, and the result of the adhesion test 2 was “A” both before and after the superheated steam treatment.
- Comparative Example 20 A conductive coating film was obtained in the same manner as in Example 43, except that an epoxy glass cloth prepreg “EGL-7” manufactured by Nitto Shinko Co., Ltd. having a thickness of 200 ⁇ m and not coated with a resin was used as the insulating substrate.
- the volume resistivity of the obtained conductive coating film was 6.8 ⁇ ⁇ cm, and the result of the adhesion test 2 was “C” both before and after the superheated steam treatment.
- the conductive coating film obtained by the present invention has a structure laminated on an insulating substrate through a resin layer containing a heterocyclic compound and / or a hydrazide compound containing nitrogen in the heterocyclic ring, and in a non-oxidizing atmosphere.
- a resin layer containing a heterocyclic compound and / or a hydrazide compound containing nitrogen in the heterocyclic ring By performing the heat treatment at, not only the conductivity is excellent, but also the adhesion with the insulating substrate is improved.
- These conductive coating films are used for metal / resin laminates, metal thin film forming materials such as electromagnetic shielding metal thin films, metal wiring materials, conductive materials and the like.
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Abstract
Description
(1)絶縁基板上に、複素環中に窒素を含む複素環化合物および/またはヒドラジド化合物を含有する樹脂層を設け、該樹脂層上に銅ペーストを用いて銅粉末含有塗膜を形成した後、非酸化性雰囲気中で加熱処理を施すことを特徴とする導電性塗膜の製造方法。
(2)前記銅ペーストが銅粉末とバインダー樹脂と溶剤とを含み、該銅ペーストの全不揮発分中の銅粉末の割合が94重量%以上である(1)に記載の導電性塗膜の製造方法。
(3)前記銅ペーストに含まれるバインダー樹脂がスルフォン酸塩基又はカルボン酸塩基を含むポリマーを含有する(1)または(2)に記載の導電性塗膜の製造方法。
(4)前記加熱処理が200℃以上で行われる(1)~(3)のいずれかに記載の導電性塗膜の製造方法。
(5)前記加熱処理が過熱水蒸気によるものである(1)~(4)のいずれかに記載の導電性塗膜の製造方法。
(6)加熱処理を施した後、さらにめっきを行う(1)~(5)のいずれかに記載の導電性塗膜の製造方法。
(7)(1)~(6)のいずれかに記載の製造方法によって製造される導電性塗膜。
なお、本発明の製造方法において必須要件である「加熱処理」とは、銅粉末表面の酸化物が還元され銅粉末の焼結を起こし、銅粉末含有塗膜と絶縁基板との密着性が向上するために行われるものである。従って、このような効果が得られない、単なる加熱処理(例えば乾燥処理など)は含まれない。
(初期評価)導電性塗膜に10μmの硫酸銅電気銅めっきを施し、一日後、めっき層の180度剥離強度を測定温度20℃、引っ張り速度100mm/分の条件で測定した。なお、めっきの前処理は、奥野製薬工業社製「DP-320クリーン」を用いて行った。
(耐熱性評価)上記初期評価で密着性を評価する場合と同様にめっきをした導電性塗膜を150℃に1週間放置する耐熱試験後の密着性を測定した。
A:導電性塗膜で剥離が起こらない。
B:剥離が認められるが、剥離はセロハンテープ張り合わせ部の20%未満。
C:剥離が認められ、剥離はセロハンテープ張り合わせ部の20%以上。
・銅粉末1:水中にて、硫酸銅(II)水溶液を水酸化ナトリウムによりpH12.5に調整し無水ブドウ糖で亜酸化銅に還元後、さらに水和ヒドラジンにより銅粉末まで還元した。透過型電子顕微鏡により観察したところ、平均粒径0.15μmの球状の粒子である。
・銅粉末2:亜酸化銅を酒石酸を含有する水に懸濁させ、水和ヒドラジンにより銅粉末まで還元した。透過型電子顕微鏡により観察したところ、平均粒径1.8μmの球状の粒子である。
・銅粉末3:アトマイズ銅粉に銀めっきを銀量で10重量%の割合で施した平均粒径5μmの粒子である。
・AC-1~8、16:ポリアミドイミド(東洋紡社製HR-11NN)溶液に硬化剤として三菱化学社製フェノールノボラック型エポキシ樹脂「152」、硬化触媒としてトリフェニルフォスフィン(TPP)、希釈溶剤としてポリアミドイミド溶液の2倍量のテトラヒドロフラン、さらに添加剤として2-フェニルイミダゾール、1,2,3-ベンゾトリアゾール、城北化学社製ベンゾトリアゾール誘導体「JF-832」、城北化学社製ベンゾトリアゾール誘導体「TT-LYK」、アデカ社製ヒドラジド系化合物「CDA-6」、イソフタル酸ジヒドラジドを表1に記載の配合比で加えた。この組成物をカネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」に乾燥後の厚みで0.5μmになるように塗布し、200℃で5分間乾燥・熱処理をした。
・AC-9~13、17、18:共重合ポリエステル樹脂(東洋紡社製RV-290)のメチルエチルケトン/トルエン(1/1重量比)溶液と熱硬化性フェノール樹脂(群栄化学社製レヂトップPL-2407、反応触媒としてp-トルエンスルフォン酸(p-TS)からなる組成物に添加剤として、2-フェニルイミダゾール、城北化学社製ベンゾトリアゾール誘導体「BT-3700」および「TT-LYK」、アデカ社製ヒドラジド系化合物「CDA-10」を表1に記載の配合比で加えた。この組成物をカネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」に乾燥後の厚みで0.5μmになるように塗布し、200℃で5分間乾燥・熱処理をした。
・AC-14:AC-1と同様にただし、添加剤を添加することなく樹脂層付きポリイミドフィルムを得た。
・AC-15:AC-9と同様にただし、添加剤を添加することなく樹脂層付きポリイミドフィルムを得た。
・バイロン270:東洋紡社製共重合ポリエステル
・バイロン290:東洋紡社製共重合ポリエステル
・ポリエステル1-1~2-2:温度計、撹拌機、リービッヒ冷却管を具備した反応容器にテレフタル酸ジメチル140部、5-ナトリウムスルホイソフタル酸ジメチル8.9部、1,3-プロピレングリコール122部、ヒドロキシピバリルヒドロキシピバレート82部及びテトラブトキシチタネート0.1部を仕込み、150~230℃で180分間加熱し、エステル交換を行った後、セバシン酸50.5部を追加しエステル化反応を200~220℃で60分間行った。反応系を30分で270度まで昇温し、系を徐々に減圧し、10分後に0.3mmHgとした。この条件で80分間反応し、ポリエステル樹脂を得た。得られた樹脂の分析結果を表2に示す。同様にして表2に記載したポリエステルを得た。ポリエステル1-2と1-3はポリエステル1-1と同じ組成で分子量が異なる。ポリエステル2-1と2-2はポリエステル1-1と類似組成でスルフォン酸塩基を含まない。
下記の配合割合の組成物をサンドミルにいれ、800rpmで、1時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストをアプリケーターにより、樹脂層付きポリイミドフィルム(AC-1)の樹脂層上に、乾燥後の厚みが2μmになるように塗布し、100℃で5分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 1.25部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.15μm) 9.5部
γ-ブチロラクトン(希釈溶剤) 2.5部
メチルエチルケトン(希釈溶剤) 5部
(共重合ポリエステル:東洋紡社製「バイロン270」)
絶縁基板として表3に記載した樹脂層付きポリイミドフィルムを用いたこと以外は実施例1と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表3に示す。
下記の配合割合の組成物をサンドミルにいれ、800rpmで1時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストをアプリケーターにより、樹脂層付きポリイミドフィルム(AC-9)の樹脂層上に、乾燥後の厚みが2μmになるように塗布し、100℃で5分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 1.75部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末2(平均粒径1.8μm) 9.3部
γ-ブチロラクトン(希釈溶剤) 2.5部
メチルエチルケトン(希釈溶剤) 5部
(共重合ポリエステル:東洋紡社製「バイロン290」)
絶縁基板として樹脂コートしていないカネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」を用いたこと以外は実施例1と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板としてAC-14を用いたこと以外は実施例1と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
絶縁基板としてAC-15を用いたこと以外は実施例9と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
カネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」を2-フェニルイミダゾールの5%テトラヒドロフラン溶液100mlに室温で5分間浸漬したのち、1Lのテトラヒドロフラン中に上記浸漬部を5分間沈めた後、室温で乾燥させた。このポリイミドフィルムを絶縁基板として用いたこと以外は実施例1と同様に導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
比較例2と同様に、ただし用いた銅ペーストに比較例5では2-フェニルイミダゾールを、比較例6では城北化学社製ベンゾトリアゾール誘導体「JF-832」を、銅ペーストの不揮発分の1重量%添加したこと以外は同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
比較例3と同様に、ただし用いた銅ペーストにアデカ社製ヒドラジド系化合物「CDA-6」を比較例7では銅ペーストの不揮発分の1重量%、比較例8では銅ペーストの不揮発分の3重量%添加したこと以外は同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
比較例3と同様に、ただし用いた銅ペーストに城北化学社製ベンゾトリアゾール誘導体「BT-3700」を銅ペーストの不揮発分の1重量%添加し、比較例10では表4に示すように過熱水蒸気処理条件を変更したこと以外は同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表4に示す。
実施例1の工程の途中で得た、表面抵抗が106Ω/□以上の過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムに、奥野製薬工業社製無電解銅めっき液「OPCカッパーT」により60℃で10分間めっきを行い、導電性を付与した。このときの表面抵抗は0.2Ω/□であった。さらに密着性と耐熱性を評価するため電気銅めっきを行った。評価結果を表4に示す。
実施例1の工程の途中で得た、過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムを水素0.1L/分および窒素1L/分の混合ガス雰囲気の焼成炉で表5に示した条件で加熱し導電性塗膜を形成した。得られた導電性塗膜の評価結果を表5に示す。
実施例11の工程の途中で得た、過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムを水素0.1L/分および窒素1L/分の混合ガス雰囲気の焼成炉で表5に示した条件で加熱し導電性塗膜を形成した。得られた導電性塗膜の評価結果を表5に示す。
比較例2の工程の途中で得た、過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムを水素0.1L/分および窒素1L/分の混合ガス雰囲気の焼成炉で表5に示した条件で加熱し導電性塗膜を形成した。得られた導電性塗膜の評価結果を表5に示す。
比較例3の工程の途中で得た、過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムを水素0.1L/分および窒素1L/分の混合ガス雰囲気の焼成炉で表5に示した条件で加熱し導電性塗膜を形成した。得られた導電性塗膜の評価結果を表5に示す。
実施例1で得た導電化したポリイミドフィルムに、奥野製薬工業社製無電解銅めっき液「ATSアドカッパーIW」により40℃で5分間めっきを行い、導電性を向上させた。
5分間のめっきにより表面抵抗は0.055Ω/□から0.0028Ω/□に低下し、導電性は向上した。めっき面にセロハンテープを貼り合わせ、急速に剥がすテープ剥離試験を行ったところ、剥離は全く起こらなかった。
実施例1の工程の途中で得た、過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムに、奥野製薬工業社製無電解銅めっき液「ATSアドカッパーIW」により40℃で5分間めっきを行い、導電性を発現させた。5分間のめっきにより表面抵抗は106Ω/□以上から0.81Ω/□に低下し、導電性は向上したが、めっき面にセロハンテープを貼り合わせ、急速に剥がすテープ剥離試験を行ったところ、全面に剥離が起こった。
絶縁基板として、厚み200μmの日東シンコー社製エポキシガラスクロスプリプレグ「EGL-7」を、離型フィルムとしてフッ素樹脂フィルムと重ね合わせ200℃1時間加熱キュアーしたエポキシガラスクロスを使用した。絶縁基板にワイアーバーにより樹脂層付きポリイミドフィルム「AC-1」で使用した溶液を乾燥後の厚みが0.5μmになるように塗布し、200℃5分間、乾燥硬化させた。実施例1と同様の銅ペーストを乾燥後の厚みが2μmになるように塗布し、100℃で5分熱風乾燥して銅粉末含有塗膜を得た。さらに実施例1と同様に過熱水蒸気処理を行い導電性塗膜を得た。実施例1と同様に、導電性塗膜を評価した。表面抵抗は0.068Ω/□、密着性試験1の初期値は11.1N/cm、耐熱試験後は10.1N/cmであった。
下記の配合割合の組成物をサンドミルにいれ、800rpmで、1時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストを、アプリケーターにより樹脂層付きポリイミドフィルム(AC-16)の樹脂層上に、乾燥後の厚みがそれぞれ表6に記載のとおりになるように調整して塗布し、100℃で10分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 12.5部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.15μm) 95部
γ-ブチロラクトン(希釈溶剤) 25部
メチルエチルケトン(希釈溶剤) 50部
(共重合ポリエステル:東洋紡社製「バイロン290」)
下記の配合割合の組成物をサンドミルにいれ、800rpmで、1時間分散した。メディアは半径0.2mmのジルコニアビーズを用いた。得られた銅ペーストを、アプリケーターにより樹脂層付きポリイミドフィルム(AC-16、3)の樹脂層上に、乾燥後の厚みがそれぞれ表6に記載のとおりになるように調整して塗布し、100℃で10分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
共重合ポリエステルの溶液 7.5部
(トルエン/シクロヘキサノン=1/1(重量比)の40重量%溶液)
銅粉末1(平均粒径0.15μm) 97部
γ-ブチロラクトン(希釈溶剤) 25部
メチルエチルケトン(希釈溶剤) 50部
(共重合ポリエステル:東洋紡社製「バイロン290」)
実施例27の工程の途中で得た、過熱水蒸気処理前の銅粉末含有塗膜付きポリイミドフィルムを水素0.1L/分および窒素1L/分の混合ガス雰囲気の焼成炉で表6に示した条件で加熱し導電性塗膜を形成した。得られた導電性塗膜の評価結果を表6に示す。
下記の配合割合の組成物をミキサーで混練後、エグザクト・テクノロジーズ社製3本ロール「M-50」を用いて分散した。得られた銅ペーストを、アプリケーターにより樹脂層付きポリイミドフィルム(AC-16)の樹脂層上に、乾燥後の厚みが20μmになるように調整して塗布し、100℃で15分熱風乾燥して銅粉末含有塗膜を得た。
分散液組成
ポリエステル1-1の溶液 8.8部
(エチルカルビトールアセテートの35重量%溶液)
銅粉末1(平均粒径 0.15μm) 37部
銅粉末2(平均粒径 1.8μm) 30部
銅粉末3(平均粒径 5μm) 30部
エチルカルビトールアセテート 2.7部
実施例31と同様に、ただし、実施例32~35および39~42ではバインダー樹脂に表7に記載したポリエステルを用い、実施例38と実施例41は銅ペースト中の全不揮発分中の銅粉末の割合が99重量%となるよう表7に記載した組成に変更したこと以外は同様にして導電性塗膜を得た。得られた導電性塗膜の評価結果を表7に示す。
絶縁基板として樹脂コートしていないカネカ社製ポリイミドフィルム「アピカルNPI厚み25μm」を用いたこと以外は実施例31と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表8に示す。
絶縁基板としてAC-14を用い、比較例17ではバインダー樹脂としてポリエステル1-3を用いたこと以外は実施例31と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表8に示す。
絶縁基板としてAC-15を用い、比較例19ではバインダー樹脂としてポリエステル2-1を用いたこと以外は実施例31と同様にして、導電性塗膜を得た。得られた導電性塗膜の評価結果を表8に示す。
絶縁基板として、厚み200μmの日東シンコー社製エポキシガラスクロスプリプレグ「EGL-7」を、離型フィルムとしてフッ素樹脂フィルムと重ね合わせ200℃1時間加熱キュアーしたエポキシガラスクロスを使用した。絶縁基板にワイアーバーにより樹脂層付きポリイミドフィルム「AC-16」で使用した溶液を乾燥後の厚みが0.5μmになるように塗布し、200℃5分間、乾燥硬化させた。実施例31と同様の銅ペーストを乾燥後の厚みが20μmになるように塗布し、100℃で15分熱風乾燥して銅粉末含有塗膜を得た。さらに実施例31と同様に過熱水蒸気処理を行い導電性塗膜を得た。得られた導電性塗膜の体積固有抵抗は6.8μΩ・cm、密着性試験2の結果は過熱水蒸気処理前後ともに「A」であった。
絶縁基板として、樹脂コートしていない厚み200μmの日東シンコー社製エポキシガラスクロスプリプレグ「EGL-7」を用いたこと以外は実施例43と同様にして、導電性塗膜を得た。得られた導電性塗膜の体積固有抵抗は6.8μΩ・cm、密着性試験2の結果は過熱水蒸気処理前後ともに「C」であった。
Claims (7)
- 絶縁基板上に、複素環中に窒素を含む複素環化合物および/またはヒドラジド化合物を含有する樹脂層を設け、該樹脂層上に銅ペーストを用いて銅粉末含有塗膜を形成した後、非酸化性雰囲気中で加熱処理を施すことを特徴とする導電性塗膜の製造方法。
- 前記銅ペーストが銅粉末とバインダー樹脂と溶剤とを含み、該銅ペーストの全不揮発分中の銅粉末の割合が94重量%以上である請求項1に記載の導電性塗膜の製造方法。
- 前記銅ペーストに含まれるバインダー樹脂がスルフォン酸塩基又はカルボン酸塩基を含むポリマーを含有する請求項1または2に記載の導電性塗膜の製造方法。
- 前記加熱処理が200℃以上で行われる請求項1~3のいずれか一項に記載の導電性塗膜の製造方法。
- 前記加熱処理が過熱水蒸気によるものである請求項1~4のいずれか一項に記載の導電性塗膜の製造方法。
- 加熱処理を施した後、さらにめっきを行う請求項1~5のいずれか一項に記載の導電性塗膜の製造方法。
- 請求項1~6のいずれか一項に記載の製造方法によって製造される導電性塗膜。
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