WO2016008360A1 - 制造导线框架体的方法和导线框架体 - Google Patents

制造导线框架体的方法和导线框架体 Download PDF

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Publication number
WO2016008360A1
WO2016008360A1 PCT/CN2015/082696 CN2015082696W WO2016008360A1 WO 2016008360 A1 WO2016008360 A1 WO 2016008360A1 CN 2015082696 W CN2015082696 W CN 2015082696W WO 2016008360 A1 WO2016008360 A1 WO 2016008360A1
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Prior art keywords
frame
wire
wires
frame body
manufacturing
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PCT/CN2015/082696
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English (en)
French (fr)
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申宇慈
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申宇慈
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H01L21/4825—Connection or disconnection of other leads to or from flat leads, e.g. wires, bumps, other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49517—Additional leads
    • H01L23/4952—Additional leads the additional leads being a bump or a wire
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates generally to integrated circuit semiconductor package technology, and more particularly to a method of fabricating a substrate comprising conductive vias.
  • the substrate including the conductive via holes can be further fabricated into a circuit substrate for an integrated circuit semiconductor package by fabricating a circuit and a pad on the upper and lower surfaces of the substrate including the conductive via.
  • TSV Through Silicon Via
  • TGV Through Substrate Via
  • TGV Through Glass Via
  • Silicon, glass, ceramic or organic material substrates have been widely used in integrated circuit semiconductor packaging technology, and are 3D and 2.5D integrated.
  • Circuit boards based on substrates containing vias are commonly used in 3D and 2.5D integrated circuit semiconductor packaging technologies and are components that integrate electronic product functions.
  • the substrate including the via holes includes a silicon substrate including a via hole, a glass substrate, a ceramic substrate, and an organic material substrate.
  • the manufacturing methods of the through-hole-containing substrates can be divided into two types: one is a substrate-based method, and the other is a via-based method.
  • the substrate-based method basically comprises: 1) first opening some of the desired holes on the substrate, 2) then filling the holes with a conductive material to form a substrate containing the conductive vias.
  • the method based on the through hole basically comprises: 1) first making some small metal pillars on a carrier, 2) then covering the small metal pillars with a substrate material, removing the carrier and grinding the upper and lower sides. The surface is exposed to a small metal pillar in a dot shape to form a substrate containing conductive via holes.
  • the use of a substrate including a via hole is to further form a substrate including a via hole into a circuit substrate including a via hole by a circuit and a pad formed on a surface of the substrate, thereby arranging an electron on the upper surface of the substrate in the integrated circuit semiconductor package.
  • the component is connected to other electronic components or printed circuit boards under the substrate, and the circuit on the upper surface of the substrate can also directly communicate the electronic components located thereon and then connect with other electronic components or boards under the substrate. .
  • the basic features of the prior art substrate containing vias include: 1) the upper and lower surfaces of the substrate are flat to further fabricate circuits and pads thereon; 2) the vias are conductive metal posts embedded in A regular arrangement is formed in the substrate and at a desired pitch, and 3) the substrate material of the substrate serves as a carrier for holding the via holes and further fabricating the pads and pads thereon. It should be noted that these prior art substrates containing conductive vias have a number of limitations in their manufacture and use.
  • some limitations include: 1) its manufacture is very time consuming and expensive, 2) the metal posts or vias described therein do not contain an insulating outer layer, 3) due to etching, mechanical drill bits or Laser opening, the side of the through hole is not very flat 4)
  • the diameter of the through hole can not be very small, the prior art manufacturing through hole is less than 10 microns, and the substrate exceeding a certain thickness (such as 100 microns or more) is very expensive, 5
  • the pitch of the via holes cannot be very small. For example, it is difficult and expensive to fabricate via holes having a pitch of less than 50 micrometers on a substrate having a thickness of 100 micrometers or more. 6)
  • the thickness of the substrate including the via holes is affected by the via size and pitch. The limitation is that the smaller the via pitch is, the thinner the substrate is.
  • the Chinese Patent Application No. CN201310651705.5 filed on Dec. 5, 2013, the entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire entire The method comprises the following key steps: fabricating a metal line pattern array; forming a solid dielectric matrix between the spaces between and around the metal lines to form a metal line integrated body comprising a metal line pattern array; The film is divided into a plurality of sheets to form a plurality of substrates including through holes of the pattern array.
  • the key to the method is to accurately fabricate an array of metal line patterns and to ensure that the metal lines therein do not bend and shift during subsequent fabrication of the metal line assembly.
  • the present invention further discloses a method of fabricating a leadframe body that accurately fabricates an array of conductor patterns and ensures that the metal lines therein are less susceptible to bending and displacement during subsequent fabrication of the conductor assembly.
  • the wire frame body comprises: a bottom wire frame, a top fixing frame, a partition plate and a wire; wherein the bottom wire frame and the top fixing frame are an I-shaped structure, which comprises an end plate a strip and a central support column; the partitioning plate is laid on the end slats in a laminated manner for clamping and fixing the wires and setting the spacing of the wires in the lamination direction, the wires being stacked
  • the layers are laid unidirectionally on the dividing plate at a set pitch, and each layer of the wires is clamped and fixed by the adjacent dividing plates.
  • the method of manufacturing a wire frame body of the present invention comprises the following key steps: a) preparing a bottom wire frame, a top fixing frame, a partition plate and a wire; b) laying a partition plate at both ends of the bottom wire frame; c) Laying a layer of unidirectional wire at a set spacing on the divider; d) repeating steps b) and c) to create a plurality of layers of unidirectional wires; e) mounting a top fixing frame that fixes the unidirectionally arranged wire pattern arrays made by the step of laminating and the wire lining in the two frames via the dividing plates, thereby A lead frame body comprising a directional array of wire patterns is formed.
  • the method for manufacturing a wire frame body according to the present invention is characterized in that the bottom wire frame and the top fixing frame are an I-shaped structure, which is composed of an end slat and a middle support column; wherein the middle support column is composed of one , composed of two or more columns.
  • the manufacturing method is characterized in that the partitioning plate is laid on the end slats in a laminated manner, and the wires are separated into a layered structure, wherein the spacing of the wires in the laminating direction is determined by the partitioning plate. Thickness setting.
  • the manufacturing method is characterized in that both ends of the end slats of the bottom wire arranging frame comprise vertical guiding columns, and the ends of the vertical guiding columns contain threads; the two ends of the dividing plate contain blind holes And sleeved on the vertical guiding column to avoid movement of the dividing plate on the end slat; the end slats of the top fixing frame have blind holes at both ends thereof, which are sleeved in the Vertically guide the column and clamp and secure the dividing plate and wire layer laid between the bottom wire frame and the top fixing frame by the thread and nut structure of the vertical guiding column end.
  • the manufacturing method is characterized in that each of the wires is welded to the partition plate in the step c), and the two ends are welded to the partition plate by the wire cutter and arranged in one direction at a set interval. Wire.
  • the manufacturing method is characterized in that, in the step c), the wires are laid on each of the partition plates of the frame device by winding a wire via a polygonal wheel including a frame device.
  • each of the polygon runners includes a frame device to form a lead frame body on each of the faces of the runner.
  • step f) curing the lead frame body containing the unidirectionally arranged wire pattern array in a base material, Thereby, a wire substrate assembly is formed, and the wire substrate assembly is further divided into pieces to form a plurality of substrates containing conductive via holes.
  • the frame device used in the method for manufacturing a wire frame body of the present invention comprises: a bottom wire frame, a top fixing frame and a partition plate; wherein the bottom wire frame and the top fixing frame are I-shaped structures It comprises an end slat and a central support column; the dividing plates are laid on the end slats in a laminated manner for clamping the wires and setting the spacing of the wires in the lamination direction.
  • the frame device is characterized in that both ends of the end slats of the bottom wire frame have vertical guiding columns, and the ends thereof contain Threaded; both ends of the dividing plate contain blind holes which are sleeved on the vertical guiding column to avoid movement of the dividing plate on the end slats; the end plate of the top fixing frame The two ends of the strip contain blind holes which are sleeved on the vertical guiding column and are clamped and fixed by the thread and nut structure of the vertical guiding column end to be separated between the bottom wire frame and the top fixing frame. Board and wire layers.
  • a rotary wheel device used in the method of manufacturing a lead frame body of the present invention comprises: a polygonal runner member and a frame member, wherein a frame member is disposed on each face of the polygonal runner member, said frame
  • the component comprises a bottom cable frame, a top fixing frame and a partitioning plate; wherein the bottom wire frame and the top fixing frame are an I-shaped structure, which comprises an end slat and a middle support column; Layers are laid on the end slats to clamp the wires and set the spacing of the wires in the stacking direction.
  • the runner frame device is characterized in that: the frame member comprises a bottom wire frame at both ends of the end slat comprising vertical guide columns, the ends of which comprise threads; the frame members comprise points The two ends of the partition plate have blind holes which are sleeved on the vertical guide post to avoid movement of the partition plate on the frame end strip of the bottom wire frame; the frame member comprises The end slats of the top fixing frame have blind holes at both ends thereof, which are sleeved on the vertical guiding columns, and are clamped and fixed on the bottom wire frame and the top by the thread and nut structure of the vertical guiding column ends. Separator and wire layers between the fixed frames.
  • the wire frame body of the present invention comprises: a bottom wire frame, a top fixing frame, a partition plate and a wire; wherein the bottom wire frame and the top fixing frame are I-shaped structures including end plates a strip and a central support column; the partitioning plate is laid on the end slats in a laminated manner for clamping and fixing the wires and setting the spacing of the wires in the lamination direction, the wires being stacked
  • the layers are laid unidirectionally on the dividing plate at a set pitch, and each layer of the wires is clamped and fixed by the adjacent dividing plates.
  • the lead frame body is characterized in that both ends of the end slats of the bottom wire arranging frame comprise vertical guiding columns, the ends of which contain threads; the two ends of the dividing plate contain blind holes, Mounting on the vertical guiding column to avoid movement of the partitioning plate on the end slats of the bottom wire frame; the ends of the top fixing frame are blind at both ends A hole is sleeved over the vertical guide post and clamps and secures the divider and wire layers laid between the bottom wire frame and the top frame by threading the nut end and the nut structure.
  • a key inventive concept is to fabricate and fix unidirectionally aligned wires by a frame device, including soldering unidirectionally aligned wires directly on a partition plate in a frame device, or mounting the frame device On a polygonal wheel, a turning device is formed, and a unidirectional wire is made in each frame by the rotation of the wheel.
  • Advantages of the present invention include: 1) accurate and quick manufacturing of the pitch at a set interval The unidirectional wire of the column; 2) The frame device tightens and fixes the wire so that it is less susceptible to bending and displacement in the subsequent process of fabricating the wire assembly.
  • FIG. 1 is a schematic view showing a bottom cable arranging frame and a partitioning plate laid thereon according to an embodiment of the present invention
  • 1A is a schematic view showing a step of laying a plate and a step of arranging a wire according to an embodiment of the present invention
  • 1B is a schematic view of a lead frame body made in an embodiment of the present invention, including a front view and a side view;
  • 1C is a plan view of the lead frame body and a cross-sectional view of the unidirectionally aligned wires fixed therein;
  • FIG. 2 is a schematic view of a bottom cable frame having vertical guide posts at both ends according to an embodiment of the present invention, including a front view and a side view;
  • FIG. 2A is a schematic view of a lead frame body clamped and fixed via a vertical guide post in accordance with an embodiment of the present invention
  • FIG. 3 is a schematic view showing a unidirectional wire arranged at a set pitch by welding a wire on a partition plate according to an embodiment of the present invention
  • FIG. 4 is a schematic view showing a wire laid on the partition plate by winding a polygon wheel according to an embodiment of the present invention
  • FIG. 4A is a schematic view of a lead frame body made through a polygonal wheel in one embodiment of the present invention
  • Figure 4B is a front elevational view of the lead frame body on each face of the polygon wheel
  • FIG. 5 is a schematic view showing a wire substrate assembly formed by curing a prepared lead frame body in a base material according to an embodiment of the present invention
  • Fig. 6 is a schematic view showing a substrate having a conductive via hole formed by dividing a wire substrate assembly formed by a wire frame body into a sheet in one embodiment of the present invention.
  • unidirectional wires which represent a bundle of wires arranged in one direction
  • a wire pattern array which represents the arrangement of the wires in a cross section of a unidirectionally arranged wire, which can Is a square, rectangular, triangular or other distribution pattern
  • the wire substrate An integrated body comprising a columnar substrate comprising unidirectional wires, wherein the unidirectional wires are arranged at a set spacing
  • a substrate representing a sheet of material, such as a piece of ceramic, a piece of glass, a piece of wafer, or a piece of polymerization Material
  • 6) conductive vias which represent conductive channels embedded in the substrate and penetrating the thickness direction of the substrate, such as columnar metal
  • FIG. 1A, FIG. 1B and FIG. 1C are schematic views showing a method of manufacturing a lead frame body according to an embodiment of the present invention.
  • 1100 in Fig. 1 illustrates a bottom cable frame which is an I-shaped structure consisting of end slats represented by numeral symbols 101 and 102 and central support columns represented by numeral symbols 103 and 104, wherein the central support column It may be one or more cylinders;
  • 1200 in Figure 1 illustrates a plating step: it means laying the dividing plates 121 and 122 on the end slats of the bottom wire frame;
  • 1300 in Figure 1A is schematic a wire arranging step: it is to lay a layer of unidirectional wire 131 at a set spacing on the dividing plate; 1400 in Fig.
  • FIG. 1A shows a next step of tiling: it represents the slat at the end Separating the slabs 141 and 142 above the newly laid unidirectional wires; repeating the arranging step and the tiling step until a set number of unidirectional wires is formed; finally, as shown in FIG. 1B, A top fixing frame is mounted on top of the laminate form and the wire layer in the form of a laminate, which is composed of end slats represented by numeral symbols 151 and 152 and central support columns represented by numeral symbols 153 and 154.
  • the top fixing frame together with the bottom wire arranging frame, fixes the unidirectionally arranged wire pattern array made by the tiling step and the arranging step to the two frames via the dividing plate, thereby making And a lead frame body comprising a directional array of wire patterns, as shown in FIG. 1B, wherein 1500 and 1510 respectively show a front view and a side view of the lead frame body; FIG. 1C is schematically illustrated by 1520.
  • the cross section indicated by 1501 in FIG. 1C includes the cross-sections 103, 104, 153 and 154 of the central support column in addition to the square wire pattern array 171; the central support column
  • the function of the wire pattern array is to be tensioned in the wire frame body, so that it is not easy to bend and shift in the subsequent process of fabricating the wire assembly.
  • the square arrangement of the wires presented by 1501 in FIG. 1C is only a schematic example of the wire pattern array that can be fabricated in the present invention, since each of the two lines can be set as needed in the cable routing step.
  • the spacing between the wires can be set layer by layer in the layering step, and the wire layer and the wire layer need not be aligned up and down, and can be staggered, so the invention can be arranged in various arrangements.
  • Wire pattern arrays such as squares, rectangles, triangles, etc.
  • FIG. 2 and 2A illustrate a method of manufacturing a lead frame body of the present invention and a feature of the frame apparatus employed therefor, wherein 2000 in Fig. 2 is a front view and a side view of a bottom cable frame and a partition plate.
  • 2000 in Fig. 2 is a front view and a side view of a bottom cable frame and a partition plate.
  • FIG. 2 which is illustrated at the ends of the end slats 101 and 102 of the bottom cable frame, including vertical guide columns 201, 202, 203 and 204, the ends of the vertical guide posts containing threads; the divider plate 206
  • Both ends contain blind holes 207 that can be placed over the vertical guide posts to avoid movement of the divider plates on the end slats, and numerals 10 and 104 indicate the central support of the bottom wire frame Column 2; 2100 in Fig.
  • FIG. 2A is a front view of a top fixing frame and a side view of a lead frame body, numerals 153 and 154 indicating the middle support column of the top fixing frame, the top fixing frame
  • Both ends of the end slats 151 and 152 contain blind holes 211, 212, 213 and 214 which can be placed over the vertical guide posts and pass through the threaded and nut structures 221/223 and 222 which vertically guide the end of the column. /224 clamped and fixedly laid on the bottom cable
  • FIG. 3 is a view showing a feature of the method of manufacturing a lead frame body of the present invention, wherein the numeral symbol 3000 indicates that the method of laying the wires in the step of arranging in the method of manufacturing a lead frame body of the present invention is to treat each of the wires 300 is soldered to the divider, 301 and 302 represent the solder joints of the conductors 300 on the divider, and numeral 3100 illustrates a layer of conductors 310 that are unidirectionally aligned at a set pitch on the divider.
  • the wire feeder is an existing tool in the semiconductor wire bonding technology, which can quickly solder the wire between the two pads set up. Therefore, it can be soldered to the ends by the existing wire cutter or its improved type. A wire that is unidirectionally arranged on the partition and at a set pitch.
  • FIG. 4 is a view showing another feature of the method of manufacturing a lead frame body of the present invention, wherein the numeral symbol 4000 indicates that the method of laying a wire in the wire arranging step described in the method of manufacturing a lead frame body of the present invention is via an inclusion
  • the polygonal wheel of the frame device is laid on the partition plate of the frame device by winding the wire, wherein the numeral symbol 400 and the arrow represent a quadrilateral wheel, the number Symbol 450 represents a conductive coil that provides a wire wound on the wheel, numeral 451 and arrow indicate the point of contact of the wire on the conductive coil 450 with the wheel, referred to herein as the wire leading end, and numeral 401 represents the mounting of the wire.
  • a bottom wire frame on each side of the quadrilateral wheel 402 represents a dividing plate laid on the end slat of each bottom wire frame, and 403 represents a winding around the dividing plate 402 by the rotation of the wheel.
  • the upper layer of wire 404 represents the placement of the dividing plate 404 at the position of the end slats and the wire layer 402, and then the next layer of wire is wound by the rotation of the wheel until the set number of wires is made. Layer, then install the top fixing frame to make a wire frame body on each side of the wheel.
  • the schematic example in FIG. 4 is a quadrilateral wheel, which may also be a hexagonal or other polygonal wheel.
  • the front end of the wire indicated by the numeral symbol 451 and the runner have a set mutual movement, so that the next circle
  • the wire has a set spacing from the previous wire, and the spacing is not necessarily the same, such as some spacing is 200 microns and others are 100 microns.
  • winding one turn and one turn until the completion of laying a layer of wire then, after laying the partition plate, similarly complete the laying of the next layer of wire until the laying of the set number of wires is completed; finally A top fixing frame is attached to the end of the wire layer to form a wire frame body on each side of the wheel.
  • 4A and 4B illustrate a lead frame body made through the step of the wire winding shown in Fig. 4, wherein 4100 represents a lead frame body 411, 412, 413 and thus formed on each side of the wheel. 414, 4110 represent top views of a leadframe body 411 detached from the runner, each of the leadframe bodies being further cured in a matrix material to form a conductor substrate assembly.
  • 5 is a view showing a manufacturing process of the method for manufacturing a lead frame body according to the present invention, wherein the numeral symbol 5000 represents curing a lead frame body 411 in a base material 500, thereby forming a wire substrate assembly, a numerical symbol. 5100 represents dividing a wire substrate assembly into pieces along a section from C to C to form a plurality of substrates containing conductive vias.
  • FIG. 6 is a cross-sectional view showing a wire substrate assembly or a substrate including conductive vias, wherein the base material 500 including a wire frame body 411 may be a square cylinder, a rectangular cylinder 601 or a circular cylinder.
  • numeral 603 represents a cross section of a central support column of a frame structure included in a wire substrate assembly or a substrate containing conductive vias
  • numeral 605 represents an example of a wire pattern array representing a wire substrate
  • the integrated body includes a plurality of unidirectional wire units, and the further divided substrate including the conductive through holes correspondingly includes a plurality of conductive through hole units, and after the circuit and the pads are formed thereon, the substrate can be further divided along the unit a plurality of circuit substrate units including conductive vias, each The circuit substrate unit including the conductive vias will be applied to an integrated circuit semiconductor package.
  • the first example is that the wire is a thin copper wire having a diameter of less than 100 microns, preferably less than 30 microns, and the material used to make the frame device is the same copper material, the spacing of the wires being set to less than about 500 microns, preferably less than about 200.
  • the matrix material in which the leadframe body is cured is an organic material, such as a polymeric material
  • the resulting wire substrate assembly is 100 mm in diameter, 200 mm or 300 mm in length, and greater than about 0.5 m in length, preferably greater than
  • a cylinder of about 1 meter, or a fabricated wire substrate assembly is a square cylinder or a rectangular cylinder having a width greater than about 0.5 meters and a length greater than about 0.5 meters, preferably greater than about 1 meter, said wire substrate
  • the integrated body can be further divided into an organic material substrate containing conductive vias.
  • a second example is the use of a thin copper wire having a diameter of less than 100 microns, preferably less than 30 microns, and having a ceramic outer layer of about 5 to 20 microns thick.
  • the material used to make the frame device is the same copper, wire.
  • the pitch of the wire substrate is set to be less than about 500 micrometers, preferably less than about 200 micrometers, and the matrix material in which the wire frame body is cured is an aluminum or aluminum alloy having a melting point smaller than the fine copper wire, and the resulting wire substrate assembly is A cylinder having a diameter of 100 mm, 200 mm or 300 mm, a length greater than about 0.5 m, preferably greater than about 1 m, or a finished wire substrate assembly having a width greater than about 0.5 m and a length greater than about 0.5 m, preferably The square substrate or the rectangular cylinder is larger than about 1 meter, and the wire substrate assembly can be further divided into an aluminum substrate containing conductive through holes.
  • a third example is the use of a tungsten wire having a diameter of less than 100 microns, preferably less than 30 microns, the material of the frame assembly being the same tungsten material, the spacing of the wires being set to less than about 200 microns, preferably less than about 100 microns.
  • the base material in which the wire frame body is cured is a glass, ceramic or silicon material, and the wire substrate assembly is made to have a diameter of 100 mm, 200 mm or 300 mm, and a length of more than about 0.5 m, preferably more than about 1.
  • the cylinder of rice, or the resulting wire substrate assembly is a square cylinder or rectangular cylinder having a width greater than about 0.5 meters and a length greater than about 0.5 meters, preferably greater than about 1 meter.
  • the wire substrate assembly may be further divided into a glass substrate containing a conductive via, a ceramic substrate or a silicon substrate.

Abstract

一种导线框架体及其制造方法。该方法包括如下关键步骤：准备底部排线框架（1100），顶部固定框架，分隔板（121,122）和导线（131）；进行铺板步骤（1200）：在底部排线框架（1100）的两端铺设分隔板（121,122）；进行排线步骤（1300）：在分隔板（121,122）上按设定的间距排列一层单向导线（131）；重复该铺板步骤和排线步骤，从而制成设定层数的单向导线；安装顶部固定框架，从而把通过铺板步骤和排线步骤已制成的单向排列的导线图形列阵固定在两个框架之中，从而制成一个导线框架体。该导线框架体可用于进一步制造导线基材集成体和含有导电通孔的基板。

Description

制造导线框架体的方法和导线框架体
相关申请的交叉引用
本申请要求享有于2014年7月14日提交的名称为“制造导线框架体的方法和导线框架体”的中国专利申请CN201410332290.X的优先权，该申请的全部内容通过引用并入本文中。
技术领域
本发明一般地涉及集成电路半导体封装技术，特别地涉及制造包含导电通孔的基板的方法。通过在包含导电通孔的基板的上下表面制作电路和焊盘，可以把所述包含导电通孔的基板进一步制作成用于集成电路半导体封装的电路基板。
背景技术
有通孔的(TSV:Through Silicon Via,TSV:Through Substrate Via andTGV:Through Glass Via)硅，玻璃，陶瓷或有机材料基板在集成电路半导体封装技术中已有广泛的应用，是3D和2.5D集成电路半导体封装中的关键元件。基于含有通孔的基板制成的电路基板通常用于3D和2.5D集成电路半导体封装技术中，是整合电子产品功能的元件。含有通孔的基板包括含有通孔的硅基板，玻璃基板，陶瓷基板和有机材料基板。目前，使用的含有通孔的基板的制造方法可以分为两类：一类是基于基板的方法，另一类是基于通孔的方法。基于基板的方法基本上包括：1)在基板上先开一些所需的孔，2)然后用导电材料填充这些孔，从而形成一个含有导电通孔的基板。基于通孔的方法基本上包括：1)先在一个载体上制作一些点状的小金属柱，2)然后用一个基板材料覆盖这些点状的小金属柱，再去掉所述的载体并打磨上下表面以露出点状的小金属柱，从而形成一个含有导电通孔的基板。目前，含有通孔的基板的使用是通过制作于基板表面的电路和焊盘把含有通孔的基板进一步制作成含有通孔的电路基板，从而在集成电路半导体封装中把位于基板上表面的电子元件与基板下方的其它电子元件或印刷电路板相连接，位于基板上表面的电路也可以使位于其上的电子元件先直接地进行通讯，然后再与基板下方的其它电子元件或电路板相连接。
在现有技术中的含有通孔的基板的基本特征包括：1)基板的上下表面是平整的以便在其上进一步制作电路和焊盘；2)通孔是一种导电的金属小柱，嵌入在基板中并按照所需的间距形成规则的排列，3)基板的基体材料用作保持通孔和在其上进一步制作电路和焊盘的一种载体。需要注意的是，这些现有技术中的含有导电通孔的基板在制造和使用上具有许多局限性。由于其制造工艺，一些局限性包括：1)其制造是非常费时和昂贵的，2)其中所述的金属小柱或通孔不包含绝缘外层，3)由于是通过刻蚀，机械钻头或激光开孔，通孔的侧边不是很平整4)通孔的直径不能非常小，现有技术制造通孔小于10微米，并且超过一定厚度(如100微米以上)的基板是非常昂贵的，5)通孔的间距不能非常小，如现有技术在100微米以上厚度的基板上制造小于50微米间距的通孔是困难和昂贵的，6)含有通孔的基板的厚度受到通孔尺寸和间距的限制，通孔间距越小，基板就得越薄。
发明内容
本申请人于2013年12月5日提交的中国发明专利申请CN201310651705.5公开了一种基于金属线图形阵列制造金属线集成体，并进一步制造含有图形阵列通孔的基板的方法。该方法包括如下关键步骤：制作一个金属线图形阵列；在金属线之间和周围的空间制作固态介电基体，从而形成一个包含金属线图形阵列的金属线集成体；把所述金属线集成体分割成片，从而形成多个含有图形阵列通孔的基板。所述方法的关键是精确地制作一个金属线图形阵列并确保其中的金属线在后续的制作金属线集成体的工艺中不发生弯曲和移位。本发明进一步公开一种制造导线框架体的方法，其可精确地制作导线图形阵列并确保其中的金属线在后续的制作导线集成体的工艺中不易发生弯曲和移位。所述的导线框架体，包括：底部排线框架，顶部固定框架，分隔板和导线；其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧并固定导线并设定导线在叠层方向的间距，所述的导线以叠层的方式按设定的间距单向地铺设在分隔板上，每层导线由相邻的分隔板夹紧并固定。
本发明的制造导线框架体的方法，包括如下关键步骤：a)准备底部排线框架，顶部固定框架，分隔板和导线；b)在底部排线框架的两端铺设分隔板；c)在分隔板上按设定的间距铺设一层单向导线；d)重复所述步骤b)和c)，从而制成设 定层数的单向导线；e)安装顶部固定框架，其把通过铺板步骤和排线步骤制成的单向排列的导线图形列阵经由分隔板固定在所述的两个框架中，从而制成一个包含单向排列的导线图形列阵的导线框架体。
本发明的制造导线框架体的方法，其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其由端部板条和中部支撑柱组成；其中的中部支撑柱由一个、两个或多个柱状体组成。所述制造方法，其特征在于，所述的分隔板以叠层的方式铺设在端部板条上，并把导线分隔成层状结构，其中导线在叠层方向的间距由分隔板的厚度设定。所述制造方法，其特征在于，所述的底部排线框架的端部板条的两端含有垂直引导柱，垂直引导柱的端部含有螺纹；所述的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在端部板条上的移动；所述的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。所述制造方法，其特征在于，在所述的步骤c)中的把每根导线焊接在分隔板上，如通过焊丝器制作两端焊接在分隔板上并按设定间距单向排列的导线。所述制造方法，其特征在于，在所述步骤c)中，经由一个包含框架装置的多边形转轮通过缠绕导线的方式把导线铺设在所述框架装置的每一层分隔板上。所述的经由一个多边形的转轮通过缠绕的方式铺设导线的方法，其特征在于，在转轮上一圈一圈地缠绕导线并制成一层导线的过程中，一圈导线与下一圈导线之间的间距通过导线前端与转轮的相互移动来设定；所述的一圈导线与下一圈导线之间的间距不必是相同的。所述制造导线框架体的方法，所述的多边形转轮的每一个面上包含一个框架装置，从而在所述转轮的每一个面上制成一个导线框架体。所述导线框架体的制造方法，其特征在于，在步骤e)后，其进一步包含：步骤f)把所述的含有单向排列的导线图形列阵的导线框架体固化在一个基体材料中，从而制成一个导线基材集成体，并进一步把所述的导线基材集成体分割成片，从而制成多片含有导电通孔的基板。
本发明的制造导线框架体的方法中采用的框架装置，包括：底部排线框架、顶部固定框架和分隔板；其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧导线并设定导线在叠层方向的间距。所述的框架装置，其特征在于，所述的底部排线框架的端部板条的两端含有垂直引导柱，其端部含有 螺纹；所述的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在端部板条上的移动；所述的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
本发明的制造导线框架体的方法中采用的转轮装置，包括：多边形转轮构件和框架构件，其特征在于，在多边形转轮构件的每个面上设置一套框架构件，所述的框架构件包含底部排线框架，顶部固定框架和分隔板；其中的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧导线并设定导线在叠层方向的间距。所述的转轮框架装置，其特征在于，所述的框架构件包含的底部排线框架的端部板条的两端含有垂直引导柱，其端部含有螺纹；所述的框架构件包含的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在所述的底部排线框的架端部板条上的移动；所述的框架构件包含的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
本发明的导线框架体，包括：底部排线框架、顶部固定框架，分隔板和导线；其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧并固定导线并设定导线在叠层方向的间距，所述的导线以叠层的方式按设定的间距单向地铺设在分隔板上，每层导线由相邻的分隔板夹紧并固定。所述的导线框架体，其特征在于，所述的底部排线框架的端部板条的两端含有垂直引导柱，其端部含有螺纹；所述的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在所述的底部排线框的架端部板条上的移动；所述的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
在本发明中，关键的发明构思是通过一个框架装置制作并固定单向排列的导线，其包括直接在框架装置中的分隔板上焊接单向排列的导线，或把所述的框架装置安装在一个多边形转轮上，形成一个转轮装置，通过转轮的旋转把单向导线制作在每一个框架中。本发明的优点包括：1)可精确和快捷地制造按设定间距排 列的单向导线；2)所述的框架装置把导线拉紧并固定，使其在后续的制作导线集成体的工艺中不易发生弯曲和移位。本发明中一些其它的优点，特征和相关的发明性概念会参照下面的附图说明在本发明的具体实施方式中加以详述。
附图说明
在下文中将基于实施例并参考附图来对本发明进行更详细的描述。
图1为本发明一个实施例中的底部排线框架及在其上铺设分隔板的示意图；
图1A为本发明一个实施例中铺板步骤和排线步骤的示意图；
图1B为本发明一个实施例中制成的导线框架体的示意图，包括正视图和侧视图；
图1C为所述导线框架体的俯视图和固定在其中的单向排列导线的横截面图；
图2为本发明一个实施例中两端含有垂直引导柱的底部排线框架的示意图，包括正视图和侧视图；
图2A为本发明一个实施例中经由垂直引导柱夹紧和固定的导线框架体的示意图；
图3为本发明一个实施例中通过把导线焊接在分隔板上制成一层按设定间距排列的单向导线的示意图；
图4为本发明一个实施例中经由一个多边形的转轮通过缠绕的方式把导线铺设在所述的分隔板上的示意图；
图4A为本发明一个实施例中经由一个多边形的转轮制成的导线框架体的示意图；
图4B示意位于多边形转轮的每一个面上的导线框架体的正视图；
图5为本发明一个实施例中把制成的导线框架体固化在一个基体材料中，从而制成一个导线基材集成体的示意图；
图6为本发明一个实施例中把通过导线框架体制成的导线基材集成体分割成片，从而制成含有导电通孔的基板的示意图。
在附图中，相同的部件使用相同的附图标记。附图并未按照实际的比例。
具体实施方式
为清楚地通过参照附图说明本发明的具体实施方式，首先对一些使用的术语 解释如下：1)单向导线，其代表沿着一个方向排列的一束导线；2)导线图形列阵，其代表一束单向排列的导线的横截面呈现出的导线的排列分布，其可以是方形，长方形，三角形或其它的分布图形；3)导线框架体，其代表包含单向排列的导线图形列阵的一个框架，其中导线被固定在所述的框架之中；4)导线基材集成体，其代表包含单向导线的一个柱状基材，其中的单向导线按设定间距排列；5)基板，其代表一个片状材料，如一片陶瓷，一片玻璃，一片晶片，或一片聚合物材料；6)导电通孔，其代表嵌在基板中并贯通基板厚度方向的导电通道，如柱状金属；7)含有导电通孔的基板，其代表含有按设定间距排列或按设定图案分布的导电通孔的基板；8)含有导电通孔的电路基板，其代表在上下表面进一步制作有电路和焊盘的含有导电通孔的基板。需要注意的是，以上的术语解释仅是为了说明的目的，而不限制本发明的范围和精神。
图1，图1A，图1B和图1C为本发明一个实施例中制造导线框架体的方法的示意图。图1中的1100示意一个底部排线框架，其是一个工字型结构，由数字符号101和102代表的端部板条和数字符号103和104代表的中部支撑柱组成，其中的中部支撑柱可以是一根或多根柱体；图1中的1200示意一个铺板步骤：其表示在所述的底部排线框架的端部板条上铺设分隔板121和122；图1A中的1300示意一个排线步骤：其表示在所述的分隔板上按设定的间距铺设一层单向导线131；图1A中的1400示意下一个铺板步骤：其表示再在所述的端部板条的位置和刚铺设的单向导线的上方铺设分隔板141和142；重复所述的排线步骤和铺板步骤，直到制成设定层数的单向导线；最后，如图1B所示，在叠层形式的分隔板和导线层的顶部安装顶部固定框架，其由数字符号151和152代表的端部板条和数字符号153和154代表的中部支撑柱组成。所述的顶部固定框架连同所述的底部排线框架把通过铺板步骤和排线步骤制成的单向排列的导线图形列阵经由分隔板固定在所述的两个框架之中，从而制成一个包含单向排列的导线图形列阵的导线框架体，如图1B所示，其中1500和1510分别示意所述的导线框架体的正视图和侧视图；图1C中的1520示意所述的导线框架体的俯视图，图1C中的1501示意图1B中的导线框架体1500中的从A到A的横截面，其显示一个方形的导线图形列阵171。
需要说明的是，图1C中的1501示意的横截面除所述的方形的导线图形列阵171外，也包含了中部支撑柱的横截面103，104，153和154；中部支撑柱 的作用是在导线框架体中拉紧单向排列的导线图形列阵，使其在后续的制作导线集成体的工艺中不易发生弯曲和移位。另外，需要说明的是，图1C中的1501呈现的导线的方形排列仅是本发明可制作的导线图形列阵的一个示意性的例子，由于在排线步骤中可按需要设定每两条导线之间的间距，在铺板步骤中可按需要逐层设定分隔板的厚度，导线层与导线层之间可以不必上下对齐，而可以形成交错，所以本发明可制作各种排列分布的导线图形列阵，如方形，长方形，三角形等。
图2和图2A示意本发明的制造导线框架体的方法及其采用的框架装置的一个特征，其中图2中的2000示意的是一个底部排线框架和一个分隔板的正视图和侧视图，其示意在所述的底部排线框架的端部板条101和102的两端含有垂直引导柱201，202，203和204，垂直引导柱的端部含有螺纹；所述的分隔板206的两端含有盲孔207，其可套在所述的垂直引导柱上，从而避免分隔板在端部板条上的移动，数字符号103和104示意所述的底部排线框架的中部支撑柱；图2A中的2100示意的是一个顶部固定框架的正视图和一个导线框架体的侧视图，数字符号153和154示意所述的顶部固定框架的中部支撑柱，所述的顶部固定框架的端部板条151和152的两端含有盲孔211，212，213和214，其可套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构221/223和222/224夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板270和导线层271。
图3示意本发明的制造导线框架体的方法的一个特征，其中的数字符号3000示意在本发明的制造导线框架体的方法中所述的排线步骤中的铺设导线的方法是把每根导线300焊接在分隔板上，301和302代表导线300在分隔板上的焊接点，数字符号3100示意焊接在分隔板上的按设定间距单向排列的一层导线310。焊丝器是半导体焊线封装技术中的已有工具，其可在设定的两个焊盘之间快速地焊接导线，因此，可以通过已有的焊丝器或其改进型制作两端焊接在分隔板上并按设定间距单向排列的导线。
图4示意本发明的制造导线框架体的方法的另一个特征，其中的数字符号4000示意在本发明的制造导线框架体的方法中所述的排线步骤中的铺设导线的方法是经由一个包含框架装置的多边形转轮通过缠绕导线的方式把导线铺设在框架装置的分隔板上，其中的数字符号400和箭头代表一个四边形的转轮，数字 符号450代表一个导线圈，其提供缠绕在转轮上的导线，数字符号451和箭头指示的是导线圈450上的导线与转轮的接触点，这里称作导线前端，数字符号401代表安装在所述四边形转轮的每个面上的底部排线框架，402代表在每个底部排线框架的端部板条上铺设的分隔板，403代表通过转轮的旋转缠绕在分隔板402上的一层导线，404代表在端部板条的位置和导线层402的上面再铺设分隔板404，然后再通过转轮的旋转缠绕下一层导线，直到制成设定层数的导线层，然后安装顶部固定框架，从而在转轮的每个面上制成一个导线框架体。需要说明的是，图4中的示意例是一个四边形的转轮，其也可以是一个六边形或其它的多边形转轮。另外，需要说明的是，在转轮上绕完一圈导线后，准备缠绕下一圈导线时，数字符号451示意的导线前端与转轮之间有一个设定的相互移动，从而下一圈导线与上一圈导线有一个设定的间距，而且，这个设定的间距不必是相同的，如一些间距是200微米，另一些间距是100微米。这样，一圈一圈地缠绕下去，直到完成一层导线的铺设；然后，在铺设完分隔板后，再类似地完成下一层导线的铺设，直到完成设定层数导线的铺设；最后在导线层的端部安装顶部固定框架，从而在转轮的每一个面上制成一个导线框架体。图4A和图4B示意经由图4所示的转轮排线步骤制成的导线框架体，其中4100代表在转轮的每个面上包含一个如此制成的导线框架体411，412，413和414，4110代表从所述转轮上拆下的一个导线框架体411的俯视图，每一个导线框架体可被进一步固化在一个基体材料中，从而制成一个导线基材集成体。
图5示意本发明的制造导线框架体的方法进一步包含的制作步骤，其中的数字符号5000代表把一个导线框架体411固化在一个基体材料500中，从而制成一个导线基材集成体，数字符号5100代表把一个导线基材集成体沿着从C到C的截面分割成片，从而制成多片含有导电通孔的基板。
图6示意一个导线基材集成体或一片含有导电通孔的基板的横截面图，其示意包含一个导线框架体411的基体材料500可以是一个方形柱体，长方形柱体601或圆形柱体602，数字符号603代表包含在导线基材集成体或含有导电通孔的基板中的框架结构的中部支撑柱的横截面，数字符号605代表一个导线图形列阵的例子，其表示一个导线基材集成体中包含多个单向导线单元，其进一步分割成的含有导电通孔的基板对应地包含多个导电通孔单元，在其上制作电路和焊盘后，其可沿着单元间进一步分割成多个含有导电通孔的电路基板单元，每一个所 述含有导电通孔的电路基板单元将应用于一个集成电路半导体封装中。
下面公开的是按照所述实施例的一些具体的应用的例子。
第一个例子是：导线采用直径小于100微米，优选地小于30微米的细铜线，制作框架装置的材料采用相同的铜材，导线的间距设定为小于约500微米，优选地小于约200微米，把导线框架体固化在其中的基体材料是有机材料，如聚合物材料，制成的导线基材集成体是直径为100毫米，200毫米或300毫米，长度大于约0.5米，优选地大于约1米的圆柱体，或者制成的导线基材集成体是宽度大于约0.5米，长度大于约0.5米，优选地大于约1米的方形柱体或长方形柱体，所述的导线基材集成体可进一步分割成含有导电通孔的有机材料基板。
第二个例子是：导线采用直径小于100微米，优选地小于30微米的，并且带有约5到20微米厚的陶瓷外层的细铜线，制作框架装置的材料采用相同的铜材，导线的间距设定为小于约500微米，优选地小于约200微米，把导线框架体固化在其中的基体材料是熔点小于所述细铜线的铝或铝合金，制成的导线基材集成体是直径为100毫米，200毫米或300毫米，长度大于约0.5米，优选地大于约1米的圆柱体，或者制成的导线基材集成体是宽度大于约0.5米，长度大于约0.5米，优选地大于约1米的方形柱体或长方形柱体，所述的导线基材集成体可进一步分割成含有导电通孔的铝基板。
第三个例子是：导线采用直径小于100微米，优选地小于30微米的钨线，制作框架装置的材料采用相同的钨材，导线的间距设定为小于约200微米，优选地小于约100微米，把导线框架体固化在其中的基体材料是玻璃，陶瓷或硅材料，制成的导线基材集成体是直径为100毫米，200毫米或300毫米，长度大于约0.5米，优选地大于约1米的圆柱体，或者制成的导线基材集成体是宽度大于约0.5米，长度大于约0.5米，优选地大于约1米的方形柱体或长方形柱体。所述的导线基材集成体可进一步分割成含有导电通孔的玻璃基板，陶瓷基板或硅基板。
需要说明的是，以上参照实施例和附图说明对本发明的描述仅为举例说明，而不是限定本发明的精神和范围，熟悉此技术者当可据此进行修改而得到等效实施例。

Claims (15)

  1. 一种制造导线框架体的方法，该方法包括：
    步骤a)准备底部排线框架、顶部固定框架、分隔板和导线；
    步骤b)在底部排线框架的两端铺设分隔板；
    步骤c)在分隔板上按设定的间距铺设一层单向导线；
    步骤d)重复所述步骤b)和c)，从而制成设定层数的单向导线；
    步骤e)安装顶部固定框架，其把通过步骤b)、c)和d)制成的单向排列的导线图形列阵经由分隔板固定在所述底部排线框架和顶部固定框架之中，从而制成一个包含单向排列的导线图形列阵的导线框架体。
  2. 如权利要求1所述的制造导线框架体的方法，其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其由端部板条和中部支撑柱组成；其中的中部支撑柱由一个、两个或多个柱状体组成。
  3. 如权利要求1所述的制造导线框架体的方法，其特征在于，所述的分隔板以叠层的方式铺设在端部板条上，并把导线分隔成层状结构，其中导线在叠层方向的间距由分隔板的厚度设定。
  4. 如权利要求1所述的制造导线框架体的方法，其特征在于，所述的底部排线框架的端部板条的两端含有垂直引导柱，垂直引导柱的端部含有螺纹；所述的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在端部板条上的移动；所述的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
  5. 如权利要求1所述的制造导线框架体的方法，其特征在于，在所述的步骤c)中把每根导线焊接在分隔板上，如通过焊丝器制作两端焊接在分隔板上并按设定间距单向排列的导线。
  6. 如权利要求1所述的制造导线框架体的方法，其特征在于，在所述步骤c)中，经由一个包含框架装置的多边形转轮通过缠绕导线的方式把导线铺设在所述框架装置的每一层分隔板上。
  7. 如权利要求6所述的制造导线框架体的方法，其特征在于，在转轮上一圈一圈地缠绕导线并制成一层导线的过程中，一圈导线与下一圈导线之间的间距 通过导线前端与转轮的相互移动来设定；所述的一圈导线与下一圈导线之间的间距不必是相同的。
  8. 如权利要求6所述的制造导线框架体的方法，其特征在于，所述的多边形转轮的每一个面上包含一个框架装置，从而在所述转轮的每一个面上制成一个导线框架体。
  9. 如权利要求1所述的制造导线框架体的方法，其特征在于，在步骤e)后，其进一步包含：步骤f)把所述的含有单向排列的导线图形列阵的导线框架体固化在一个基体材料中，从而制成一个导线基材集成体，并进一步把所述的导线基材集成体分割成片，从而制成多片含有导电通孔的基板。
  10. 一种在如权利要求1所述的制造导线框架体的方法中采用的框架装置，包括：底部排线框架、顶部固定框架和分隔板；其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧导线并设定导线在叠层方向的间距。
  11. 如权利要求10所述的框架装置，其特征在于，所述的底部排线框架的端部板条的两端含有垂直引导柱，其端部含有螺纹；所述的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在端部板条上的移动；所述的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
  12. 一种在如权利要求1所述的制造导线框架体的方法中采用的转轮装置，包括：多边形转轮构件和框架构件，其特征在于，在多边形转轮构件的每个面上设置一套框架构件，所述的框架构件包含底部排线框架，顶部固定框架和分隔板；其中的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧导线并设定导线在叠层方向的间距。
  13. 如权利要求12所述的转轮装置，其特征在于，所述的框架构件包含的底部排线框架的端部板条的两端含有垂直引导柱，其端部含有螺纹；所述的框架构件包含的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在所述的底部排线框的架端部板条上的移动；所述的框架构件包含的顶部固定 框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
  14. 一种导线框架体，包括：底部排线框架、顶部固定框架、分隔板和导线；其特征在于，所述的底部排线框架和顶部固定框架是工字型结构，其包括端部板条和中部支撑柱；所述的分隔板以叠层的方式铺设在端部板条上，其用来夹紧并固定导线并设定导线在叠层方向的间距，所述的导线以叠层的方式按设定的间距单向地铺设在分隔板上，每层导线由相邻的分隔板夹紧并固定。
  15. 如权利要求14所述的导线框架体，其特征在于，所述的底部排线框架的端部板条的两端含有垂直引导柱，其端部含有螺纹；所述的分隔板的两端含有盲孔，其套在所述的垂直引导柱上，从而避免分隔板在所述的底部排线框的架端部板条上的移动；所述的顶部固定框架的端部板条的两端含有盲孔，其套在所述的垂直引导柱上，并通过垂直引导柱端部的螺纹和螺母结构夹紧并固定铺设在底部排线框架和顶部固定框架之间的分隔板和导线层。
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