WO2015194348A1 - Stratifié adsorbant l'humidité comportant un film adsorbant l'humidité - Google Patents

Stratifié adsorbant l'humidité comportant un film adsorbant l'humidité Download PDF

Info

Publication number
WO2015194348A1
WO2015194348A1 PCT/JP2015/065655 JP2015065655W WO2015194348A1 WO 2015194348 A1 WO2015194348 A1 WO 2015194348A1 JP 2015065655 W JP2015065655 W JP 2015065655W WO 2015194348 A1 WO2015194348 A1 WO 2015194348A1
Authority
WO
WIPO (PCT)
Prior art keywords
moisture
hygroscopic
film
sulfate
adsorbing
Prior art date
Application number
PCT/JP2015/065655
Other languages
English (en)
Japanese (ja)
Inventor
有輝 成田
昌 谷口
小川　達也
暁 寺田
Original Assignee
共同印刷株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 共同印刷株式会社 filed Critical 共同印刷株式会社
Priority to CN201580033444.8A priority Critical patent/CN106660343B/zh
Priority to JP2016529212A priority patent/JP6611711B2/ja
Publication of WO2015194348A1 publication Critical patent/WO2015194348A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source

Definitions

  • the present invention relates to a hygroscopic laminate provided with a hygroscopic film and a substrate.
  • the present invention relates to a hygroscopic laminate including a hygroscopic film and a base material that can be easily peeled after adhesion to the base material and hardly peels off from the base material even if the hygroscopic film absorbs moisture. .
  • an organic EL device which is a typical example of an electronic device
  • a so-called dark spot non-light-emitting portion
  • the power generation cell part and the conductor part of the solar cell element are deteriorated by moisture, there is a problem that the power generation efficiency is lowered with time. Therefore, in these apparatuses, a hygroscopic material that absorbs moisture is used.
  • an organic EL device generally, a moisture absorbent or desiccant that adsorbs moisture is dispersed in a thermoplastic resin, and a molded product (called a getter material) formed into a sheet or the like is placed inside the device in a low moisture concentration atmosphere. By sealing to, deterioration due to moisture is prevented.
  • a method of incorporating a hygroscopic material in the apparatus a method of inserting a hygroscopic material by processing a seal plate or the like, a method of bonding a sheet in which a hygroscopic agent is hardened with a binder (for example, Patent Document 1), a hygroscopic material Examples thereof include a method of laminating materials by coating (for example, Patent Document 2).
  • JP 2011-124216 A Japanese Patent No. 4240893
  • the processing cost increases and the device design is also limited.
  • thermosetting resin has been used as a binder. This is because a chemical adsorbent that is less likely to release moisture absorbed by heat treatment or the like and has high moisture absorption performance is used as the moisture absorbent.
  • the moisture-absorbing chemical adsorbent expands its volume when it absorbs moisture, so that when used in combination with a thermoplastic resin binder, the moisture-absorbing film itself also expands.
  • the hygroscopic film expands, the film is easily peeled off from the bonded base material, and therefore a thermosetting resin binder that hardly expands is used.
  • thermosetting resin is inferior in toughness as compared with the thermoplastic resin.
  • an epoxy resin which is a typical thermosetting resin and a low density polyethylene (LDPE) which is a typical thermoplastic resin
  • LDPE low density polyethylene
  • ASTM D638 Izod impact test
  • epoxy resin is broken at 16 to 533 J / m.
  • the elongation at break is about 100 to 650% for LDPE and 3 to 6% for epoxy resin.
  • the moisture-absorbing film described in Patent Document 1 and Patent Document 2 conventionally used in electronic devices has a problem that the substrate is easily damaged by bending or dropping. Moreover, after adhering these hygroscopic films using a thermosetting resin to the base material, the hygroscopic film cannot be peeled off, so that there is another problem that the position of the hygroscopic film cannot be readjusted or exchanged.
  • the present inventors found the following present invention corresponding to said subject.
  • the moisture-absorbing film has a moisture-absorbing layer containing a thermoplastic resin binder and a chemical adsorbent, Hygroscopicity satisfying the following relationship, the peel adhesion strength Y (N / 25 mm) between the base material and the hygroscopic film before the start of moisture absorption uses the volume expansion coefficient X (%) of the hygroscopic film after moisture absorption.
  • Laminate Y ⁇ 0.0011X 2 + 0.058X ⁇ 0.26 (where 0 ⁇ Y ⁇ 5.00) ⁇ 2>
  • the chemical adsorbent is selected from the group consisting of calcium oxide, barium oxide, magnesium oxide, lithium sulfate, sodium sulfate, calcium sulfate, magnesium sulfate, cobalt sulfate, gallium sulfate, titanium sulfate, and nickel sulfate.
  • ⁇ 3> The hygroscopic laminate according to the above ⁇ 1> or ⁇ 2>, wherein the thermoplastic resin binder is a polyolefin resin.
  • ⁇ 4> The hygroscopic laminate according to any one of the above ⁇ 1> to ⁇ 3>, wherein the hygroscopic film has a skin layer containing a polyolefin resin on one side or both sides of the hygroscopic layer.
  • An electronic device comprising the hygroscopic laminate according to any one of ⁇ 1> to ⁇ 4>.
  • the hygroscopic laminate provided with the hygroscopic film of the present invention has an appropriate peel adhesion strength according to the volume expansion coefficient of the hygroscopic film due to moisture absorption, so that peeling due to volume expansion does not occur, and the hygroscopic film is recycled. Peeling (rework) can be performed.
  • a hygroscopic film used in combination with a thermoplastic resin binder and a chemical adsorbent is used.
  • the moisture-absorbing film when adhered to the substrate so as to have reworkability, the moisture-absorbing film expands after moisture absorption and usually peels off from the substrate.
  • the present invention even if the hygroscopic film itself expands due to moisture absorption by giving an appropriate peel adhesion strength according to the volume expansion coefficient of the hygroscopic film between the substrate and the hygroscopic film. Since peeling does not occur and the thermoplastic resin is tough, even if the hygroscopic film is bent at the time of exfoliation, etc., a hygroscopic laminate having a hygroscopic film that is resistant to cracking and breakage and can be reworked is provided. be able to.
  • FIG. 1 is a schematic view of a hygroscopic laminate (10) of the present invention, in which a hygroscopic film (2) comprising two skin layers (21, 23) and a hygroscopic layer (22) comprises a substrate (1) and It adheres via the adhesive layer (3).
  • the moisture-absorbing film and the substrate are bonded with an adhesive layer, but the moisture-absorbing film expands by absorbing moisture, and the moisture-absorbing film has a force to peel from the substrate. Therefore, the hygroscopic film is bonded to the base material with an appropriate adhesive strength so as not to peel from the base material even after the hygroscopic film expands and to maintain the reworkability of the hygroscopic film.
  • This relational expression is derived by creating an approximate curve by polynomial approximation (degree 2) using the approximate line addition function of Excel 2003 based on the results obtained in the following examples.
  • Fig. 2 shows a graph of X and Y of this relational expression.
  • 3.00 is added, which is 0.50, 1.00, 1.50, 2.00, 2.50, 3.50, 4.00, or 4.50. There may be.
  • a moisture absorption film has a moisture absorption layer containing a thermoplastic resin binder and a chemical adsorbent.
  • the moisture-absorbing film can be provided with a skin layer for the purpose of adjusting the moisture absorption rate and / or for improving the handleability during production or use of the hygroscopic laminate.
  • the volume expansion coefficient after moisture absorption of the moisture absorbent film is too large, it becomes necessary to adhere very strongly, and thereby reworkability is lost. Therefore, it is preferably 48% or less, 40% or less, or 30% or less. .
  • the volume expansion coefficient is too low, meaning that the amount of the chemical adsorbent is very small, and the function as a hygroscopic film is low, the volume expansion coefficient is 2% or more, 3% or more, It is preferably 5% or more, 10% or more, or 15%.
  • the thickness of the moisture absorbing film is, for example, 10 ⁇ m or more, 20 ⁇ m or more, or 30 ⁇ m or more, and is 300 ⁇ m or less, 200 ⁇ m or less, 150 ⁇ m or less, 100 ⁇ m or less, or 80 ⁇ m or less.
  • the hygroscopic laminate of the present invention can be used in electronic devices, for example, in organic EL, inorganic EL, and solar cells.
  • an EL element has a TFT, a transparent electrode, an EL layer (light emitting layer), a metal electrode, and a hygroscopic laminate in this order on a transparent substrate.
  • the solar cell is on the side opposite to the transparent base material on the incident light side, the power generation cell, the power generation cell and the connecting wire for connection with the outside, the sealing resin for sealing the power generation cell and the conductive wire, and the transparent base material Including a moisture-proof backsheet, the hygroscopic laminate of the present invention can be at least part of the backsheet.
  • thermoplastic resin binder for the moisture-absorbing layer of the moisture-absorbing film
  • resins include polyolefin resins, particularly low-density polyethylene (LDPE), linear low-density polyethylene (LLDPE), and medium-density polyethylene (MDPE).
  • LDPE low-density polyethylene
  • LLDPE linear low-density polyethylene
  • MDPE medium-density polyethylene
  • High density polyethylene polyethylene polymerized using metallocene catalyst, propylene homopolymer, propylene-ethylene block copolymer, propylene-ethylene random copolymer, polypropylene polymerized using metallocene catalyst, chlorinated polypropylene, Polymethylpentene, ethylene-acrylic acid copolymer (EEA), ethylene-methacrylic acid copolymer (EMAA), ethylene-ethyl acrylate copolymer (EEA), ethylene-methyl acrylate copolymer (EMA), Tylene-ethyl acrylate copolymer, ethylene-vinyl acetate copolymer (EVA), ionomer, carboxylic acid modified polyethylene, carboxylic acid modified polypropylene, carboxylic acid modified ethylene-vinyl acetate copolymer, saturated polyester, poly Also included are vinyl chloride, polystyrene, polycarbonate, polyamide, and mixtures thereof.
  • low density polyethylene LDPE
  • linear low density polyethylene LLDPE
  • medium density polyethylene MDPE
  • high density polyethylene HDPE
  • propylene homopolymer propylene-ethylene block copolymer
  • propylene- Ethylene random copolymer ethylene-acrylic acid copolymer
  • EAA ethylene-methacrylic acid copolymer
  • EAA ethylene-ethyl acrylate copolymer
  • EMA ethylene-methyl acrylate copolymer
  • EVA vinyl acetate copolymer
  • EVA vinyl acetate copolymer
  • the melt mass flow rate of the resin that can be used as the thermoplastic resin binder is, for example, 0.1 g / 10 min or more when measured in accordance with JIS K7210 under the conditions of a temperature of 190 ° C. and a load of 21.18 N.
  • the chemical adsorbent used in the present invention includes a chemical adsorption type hygroscopic agent that adsorbs moisture by chemical bonding, and expands by absorbing moisture. As a result, the hygroscopic film also expands, and a force for peeling the hygroscopic film from the substrate is generated.
  • Examples of the chemical adsorbent include a chemical adsorption type moisture absorbent.
  • Examples of the moisture absorbent include inorganic compounds such as calcium oxide, barium oxide, magnesium oxide, lithium sulfate, sodium sulfate, calcium sulfate, magnesium sulfate, cobalt sulfate, gallium sulfate, titanium sulfate, and nickel sulfate. Can be mentioned.
  • the chemical adsorbent is, for example, 1% by volume, 5% by volume or more, 10% by volume or more, or 20.0% by volume or more, 48.0% by volume or less, 40% by volume or less, 35. It can be made into the range of 1 volume% or less, or 30.0 volume% or less. Further, the chemical adsorbent is, for example, 1% by weight, 5% by weight or more, 10% by weight or more, 30.0% by weight or more, or 50.0% by weight or more, and 66.6% by weight or less in the moisture absorption film. Or it can be set as the range of 60.0 weight% or less.
  • ⁇ Hygroscopic film-skin layer> On one or both sides of the hygroscopic layer, there is an object of suppressing the expansion of the hygroscopic film, an object of adjusting the hygroscopic rate, an object of improving the handleability during the production or use of the hygroscopic laminate, and / or a chemical adsorbent.
  • a skin layer can be provided for the purpose of preventing direct contact with the outside.
  • the skin layer can be obtained from a resin that can be used as the thermoplastic resin binder.
  • the melt mass flow rate of the resin of the skin layer is, for example, 0.1 g / 10 min or more, 0.5 g / 10 min or more when measured according to JIS K7210 under the conditions of a temperature of 190 ° C. and a load of 21.18 N. It is 1.0 g or more, 3.0 g / 10 min or more, or 10.0 g / 10 min or more, and is 100 g / 10 min or less, 50 g / 10 min or less, or 20 g / 10 min or less.
  • the thickness of the skin layer is, for example, 5 ⁇ m or more, or 8 ⁇ m or more, and is 30 ⁇ m or less, 20 ⁇ m or less, or 15 ⁇ m or less.
  • the moisture-absorbing film may contain various additives such as a physical adsorbent, an anti-blocking agent, a lubricant, an antioxidant, and an antistatic agent as long as they do not depart from the gist of the present invention and can be formed into a film.
  • the moisture-absorbing film can be produced by kneading the thermoplastic resin binder and chemical adsorbent described above to obtain a resin composition and forming it into a film.
  • a batch kneader such as a kneader, a Banbury mixer, a mixing roll conical mixer, or a continuous kneader such as a biaxial kneader is used.
  • kneading can be performed at a temperature of 100 ° C. or higher, 120 ° C. or higher, or 140 ° C. or higher, and 220 ° C. or lower, 200 ° C. or lower, or 180 ° C. or lower, depending on the material to be used.
  • the above-mentioned kneaded resin composition can be formed into a film to obtain a moisture-absorbing film.
  • the kneaded resin composition can be formed into a film by press molding, inflation method, T-die method, extrusion molding such as coextrusion or injection molding.
  • a hygroscopic film having a skin layer may be obtained by molding the resin of the skin layer together with the above resin composition by a multilayer inflation method.
  • the moisture absorbing film may be obtained by coextruding the resin of the skin layer on both surfaces or one surface of the film of the resin composition, or laminating the film to be the skin layer by thermocompression bonding or the like.
  • the substrate is not particularly limited, and substrates of any material can be used.
  • it may be an inorganic material or an organic material.
  • inorganic materials include inorganic oxide materials and metal materials.
  • examples of the inorganic oxide include glass and ceramic.
  • iron, aluminum, copper, and those alloys can be mentioned as a metal material.
  • examples of the organic material include polymer materials such as ABS resin, vinyl chloride resin, epoxy resin, polyamide, polypropylene, polycarbonate, acrylic resin, polyester (polyethylene terephthalate (PET), and the like).
  • These substrates may be surface-treated in order to adjust the peel adhesion strength, and for example, a PET film having a release layer made of a silicone resin, a fluorine resin, or the like may be used.
  • ⁇ Adhesive layer> The hygroscopic film is bonded to the substrate by the adhesive layer.
  • Such an adhesive layer can be constituted by an applied adhesive, an adhesive tape having an adhesive, or the like.
  • the adhesive layer preferably gives an appropriate peel adhesion strength between the substrate and the moisture-absorbing film so that reworkability can be obtained, and the peel adhesion strength may be 5.00 N / 25 mm or less. preferable.
  • the lower limit of the peel adhesion strength provided by the adhesive layer can be determined based on the above relational expression so that the substrate and the moisture absorbent film after moisture absorption do not peel.
  • the peel adhesion strength can be adjusted depending on the type of adhesive used, the bonding conditions, the type of substrate, and the like.
  • adhesives that can be used in this adhesive layer include urethane adhesives, olefin resin adhesives, butyl rubber adhesives, acrylic resin adhesives, polyester resin adhesives, epoxy resin adhesives, silicones Examples thereof include resin adhesives.
  • an acrylic adhesive is particularly preferable because no outgas is generated, hygroscopicity is low, and heat resistance is high.
  • LDPE product name: Petrocene 202R, manufactured by Tosoh Corporation, melt flow rate: 24 g / 10 min, melting point: 106 ° C.
  • calcium oxide CaO, density: 3.35 g / cm 3
  • the kneading was performed using a lab plast mill (manufactured by Toyo Seiki Seisakusho Co., Ltd.).
  • LLDPE product name: Evolue SP2520, manufactured by Prime Polymer Co., Ltd., melt flow rate: 1.9 g / 10 min, melting point: 122 ° C.
  • the above hygroscopic composition and skin layer resin were formed into a film by using a T-die for co-extrusion of the three layers so that the thickness of the hygroscopic layer was 40 ⁇ m and the skin layers of the front and back surfaces were 10 ⁇ m, respectively. .
  • volume expansion coefficient measurement of film Pass through the center of a 10cm square moisture-absorbing film, draw two marked lines that are perpendicular to each other from the end of the film, the center of the four sections separated by the marked line, and the marked line The thickness of a total of five points of the intersection of was measured. The average thickness of the measured value of the thickness of the hygroscopic film was obtained by the number average of these five thicknesses, and the volume of the hygroscopic film before moisture absorption was calculated using the vertical and horizontal dimensions of the film. The moisture-absorbing film whose volume was measured was allowed to stand for 24 hours or more in an environment at a temperature of 60 ° C.
  • Table 1 shows the results of evaluating the various hygroscopic laminates shown in Table 1 prepared by changing the base material and the adhesive within the range where the peel adhesion strength is 10 N / 25 mm or less, by the evaluation method described above. I write.
  • the peel adhesion strength required to prevent peeling after moisture absorption differs.
  • a peel adhesive strength of 6.4 N / 25 mm is required between the hygroscopic film before moisture absorption and the substrate, but the volume expansion is 3
  • 0.033 N / 25 mm is sufficient as the peel adhesion strength.
  • FIG. 2 shows the relationship between the volume expansion coefficient after moisture absorption created from the results of the above test example and the peel adhesion strength between the moisture absorbent film and the substrate before moisture absorption that does not cause peeling after moisture absorption.
  • a quadratic approximate expression is created from the relationship between the lowest peel adhesion strength at which peeling did not occur after moisture absorption and the deposition expansion rate.
  • FIG. 3 shows the relationship between the content of calcium oxide (chemical adsorbent) and the expansion rate of the moisture-absorbing film containing it.

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

L'invention porte sur un stratifié adsorbant l'humidité, lequel stratifié comprend un film adsorbant l'humidité qui est difficilement rompu quand un matériau de base est plié ou qu'un impact est appliqué lors d'une chute, et qui peut être retravaillé et qui contient un agent d'adsorption chimique. Le stratifié adsorbant l'humidité selon la présente invention comprend un matériau de base, un film adsorbant l'humidité et une couche adhésive disposée entre le matériau de base et le film adsorbant l'humidité, le film adsorbant l'humidité ayant à l'intérieur de ce dernier une couche absorbant l'humidité contenant un liant en résine thermoplastique et un agent d'adsorption chimique, et la force d'adhérence vis-à-vis de l'arrachage (Y) (N/25 mm) entre le matériau de base et le film adsorbant l'humidité qui n'a pas encore adsorbé de l'humidité satisfaisant à une relation qui est exprimée à l'aide du taux de dilatation volumique (X) (%) du film adsorbant l'humidité qui a déjà adsorbé de l'humidité, et qui est représentée par l'équation suivante : Y ≥ 0,0011 X2 + 0,058 X -0,26 (dans laquelle 0 < Y ≤ 5,00).
PCT/JP2015/065655 2014-06-20 2015-05-29 Stratifié adsorbant l'humidité comportant un film adsorbant l'humidité WO2015194348A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201580033444.8A CN106660343B (zh) 2014-06-20 2015-05-29 具备吸湿薄膜的吸湿性层叠体
JP2016529212A JP6611711B2 (ja) 2014-06-20 2015-05-29 吸湿フィルムを備えた吸湿性積層体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014127608 2014-06-20
JP2014-127608 2014-06-20

Publications (1)

Publication Number Publication Date
WO2015194348A1 true WO2015194348A1 (fr) 2015-12-23

Family

ID=54935339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2015/065655 WO2015194348A1 (fr) 2014-06-20 2015-05-29 Stratifié adsorbant l'humidité comportant un film adsorbant l'humidité

Country Status (4)

Country Link
JP (1) JP6611711B2 (fr)
CN (1) CN106660343B (fr)
TW (1) TWI663066B (fr)
WO (1) WO2015194348A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106393928A (zh) * 2016-08-27 2017-02-15 无锡中洁能源技术有限公司 一种吸湿型太阳能背板的生产工艺

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112829422B (zh) * 2021-01-04 2023-04-14 浙江海顺新材料有限公司 吸湿膜、制备方法、包装结构
CN115895241A (zh) * 2022-11-30 2023-04-04 惠州市保瑞新材料有限公司 一种包装材料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169057U (fr) * 1984-10-11 1986-05-12
JPS6357230A (ja) * 1986-08-29 1988-03-11 大日本印刷株式会社 Ｅｌパネル用外装材
JPH04189779A (ja) * 1990-11-22 1992-07-08 Marutani Kakoki Kk 軽包装用シート材及びこれを用いた軽包装袋

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1160189C (zh) * 1997-04-17 2004-08-04 吴羽化学工业株式会社 防湿薄膜及其制造方法以及场致发光元件及其制造方法
EP1857164A1 (fr) * 2005-02-21 2007-11-21 Kyodo Printing Co., Ltd. Film d adsorption et dispositif el organique

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6169057U (fr) * 1984-10-11 1986-05-12
JPS6357230A (ja) * 1986-08-29 1988-03-11 大日本印刷株式会社 Ｅｌパネル用外装材
JPH04189779A (ja) * 1990-11-22 1992-07-08 Marutani Kakoki Kk 軽包装用シート材及びこれを用いた軽包装袋

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106393928A (zh) * 2016-08-27 2017-02-15 无锡中洁能源技术有限公司 一种吸湿型太阳能背板的生产工艺

Also Published As

Publication number Publication date
JPWO2015194348A1 (ja) 2017-04-20
TWI663066B (zh) 2019-06-21
JP6611711B2 (ja) 2019-11-27
TW201612000A (en) 2016-04-01
CN106660343A (zh) 2017-05-10
CN106660343B (zh) 2019-02-01

Similar Documents

Publication Publication Date Title
CN106604816B (zh) 覆盖膜及使用其的电子部件包装体
EP2963095B1 (fr) Film adhésif et procédé de fabrication d&#39;un dispositif organique électronique l&#39;utilisant
JP6358403B1 (ja) 樹脂組成物、カバーテープおよび電子部品用包装体
US9643155B2 (en) Absorbent laminate provided with absorbent film, electronic device containing same, and method for producing same
KR101685749B1 (ko) 커버 테이프
JP6611711B2 (ja) 吸湿フィルムを備えた吸湿性積層体
JP5376327B2 (ja) 吸湿性積層体
WO2016056625A1 (fr) Matériau d&#39;étanchéité filmogène, feuille d&#39;étanchéité et dispositif électronique
JP2016087791A (ja) フィルム状封止材、封止シートおよび電子デバイス
JP5376328B2 (ja) 吸湿性積層体
JP6468810B2 (ja) フィルム状封止材、封止シートおよび電子デバイス
JP6365804B1 (ja) 水分吸収用積層保護フィルム
JP2018118766A (ja) カバーテープおよび電子部品用包装体
JP2008273602A (ja) カバーフィルム
KR20210141413A (ko) 봉지 필름
JP2010234525A (ja) 積層体
JP2016078260A (ja) フィルム状封止材、封止シートおよび電子デバイス
JP6201751B2 (ja) 包装用カバーテープ
KR102672308B1 (ko) 봉지재
WO2024157775A1 (fr) Bande de recouvrement pour mise en boîtier de composants électroniques et boîtier de composants électroniques
JP2016078261A (ja) フィルム状封止材、封止シートおよび電子デバイス
JP2004216790A (ja) 積層フィルム
JP2008260141A (ja) 帯電防止フィルム
JP2016078259A (ja) フィルム状封止材、封止シートおよび電子デバイス

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 15809089

Country of ref document: EP

Kind code of ref document: A1

ENP Entry into the national phase

Ref document number: 2016529212

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 15809089

Country of ref document: EP

Kind code of ref document: A1