TW201612000A - Moisture-adsorbing laminate provided with moisture-adsorbing film - Google Patents

Moisture-adsorbing laminate provided with moisture-adsorbing film

Info

Publication number
TW201612000A
TW201612000A TW104119591A TW104119591A TW201612000A TW 201612000 A TW201612000 A TW 201612000A TW 104119591 A TW104119591 A TW 104119591A TW 104119591 A TW104119591 A TW 104119591A TW 201612000 A TW201612000 A TW 201612000A
Authority
TW
Taiwan
Prior art keywords
moisture
adsorbing
film
base material
adsorbing film
Prior art date
Application number
TW104119591A
Other languages
Chinese (zh)
Other versions
TWI663066B (en
Inventor
Yuki Narita
Masa Taniguchi
Tatsuya Ogawa
Akira Terada
Original Assignee
Kyodo Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Printing Co Ltd filed Critical Kyodo Printing Co Ltd
Publication of TW201612000A publication Critical patent/TW201612000A/en
Application granted granted Critical
Publication of TWI663066B publication Critical patent/TWI663066B/en

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00Organic light-emitting devices
    • H10K50/80Constructional details
    • H10K50/84Passivation; Containers; Encapsulations
    • H10K50/844Encapsulations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/18Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/02Details
    • H05B33/04Sealing arrangements, e.g. against humidity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Laminated Bodies (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

Provided is a moisture-adsorbing laminate provided with a moisture-adsorbing film which is hardly broken when a base material is folded or when an impact is applied upon dropping, and which can be re-worked and contains a chemical adsorbent. The moisture-adsorbing laminate according to the present invention comprises a base material, a moisture-adsorbing film and an adhesive layer arranged between the base material and the moisture-adsorbing film, wherein the moisture-adsorbing film has therein a moisture-adsorbing layer containing a thermoplastic resin binder and a chemical adsorbent, and the peel-adhesion strength (Y) (N/25 mm) between the base material and the moisture-adsorbing film that has not adsorb moisture yet meets a relationship which is expressed using the volume expansion ratio (X) (%); of the moisture-adsorbing film that has already adsorbed moisture and which is represented the following equation: Y ≥ 0.0011X2 + 0.058X - 0.26 (wherein 0 < Y ≤ 5.00).
TW104119591A 2014-06-20 2015-06-17 Hygroscopic laminate with hygroscopic film TWI663066B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014127608 2014-06-20
JP2014-127608 2014-06-20

Publications (2)

Publication Number Publication Date
TW201612000A true TW201612000A (en) 2016-04-01
TWI663066B TWI663066B (en) 2019-06-21

Family

ID=54935339

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104119591A TWI663066B (en) 2014-06-20 2015-06-17 Hygroscopic laminate with hygroscopic film

Country Status (4)

Country Link
JP (1) JP6611711B2 (en)
CN (1) CN106660343B (en)
TW (1) TWI663066B (en)
WO (1) WO2015194348A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106393928A (en) * 2016-08-27 2017-02-15 无锡中洁能源技术有限公司 Production technology of moisture absorption type solar backboard
CN112829422B (en) * 2021-01-04 2023-04-14 浙江海顺新材料有限公司 Moisture absorption film, preparation method and packaging structure
CN115895241A (en) * 2022-11-30 2023-04-04 惠州市保瑞新材料有限公司 Packaging material and preparation method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05355Y2 (en) * 1984-10-11 1993-01-07
JPS6357230A (en) * 1986-08-29 1988-03-11 大日本印刷株式会社 Sheathing material for el panel
JP2982079B2 (en) * 1990-11-22 1999-11-22 丸谷化工機株式会社 Light packaging sheet material and light packaging bag using the same
CN1160189C (en) * 1997-04-17 2004-08-04 吴羽化学工业株式会社 Moisture-proofing film and electroluminescent device
EP1857164A1 (en) * 2005-02-21 2007-11-21 Kyodo Printing Co., Ltd. Adsorption film and organic el device

Also Published As

Publication number Publication date
JPWO2015194348A1 (en) 2017-04-20
WO2015194348A1 (en) 2015-12-23
TWI663066B (en) 2019-06-21
JP6611711B2 (en) 2019-11-27
CN106660343A (en) 2017-05-10
CN106660343B (en) 2019-02-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees