TW201612000A - Moisture-adsorbing laminate provided with moisture-adsorbing film - Google Patents
Moisture-adsorbing laminate provided with moisture-adsorbing filmInfo
- Publication number
- TW201612000A TW201612000A TW104119591A TW104119591A TW201612000A TW 201612000 A TW201612000 A TW 201612000A TW 104119591 A TW104119591 A TW 104119591A TW 104119591 A TW104119591 A TW 104119591A TW 201612000 A TW201612000 A TW 201612000A
- Authority
- TW
- Taiwan
- Prior art keywords
- moisture
- adsorbing
- film
- base material
- adsorbing film
- Prior art date
Links
- 239000000463 material Substances 0.000 abstract 4
- 239000003463 adsorbent Substances 0.000 abstract 2
- 239000000126 substance Substances 0.000 abstract 2
- 239000012790 adhesive layer Substances 0.000 abstract 1
- 239000011230 binding agent Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 229920005992 thermoplastic resin Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/12—Light sources with substantially two-dimensional radiating surfaces
- H05B33/14—Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laminated Bodies (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Provided is a moisture-adsorbing laminate provided with a moisture-adsorbing film which is hardly broken when a base material is folded or when an impact is applied upon dropping, and which can be re-worked and contains a chemical adsorbent. The moisture-adsorbing laminate according to the present invention comprises a base material, a moisture-adsorbing film and an adhesive layer arranged between the base material and the moisture-adsorbing film, wherein the moisture-adsorbing film has therein a moisture-adsorbing layer containing a thermoplastic resin binder and a chemical adsorbent, and the peel-adhesion strength (Y) (N/25 mm) between the base material and the moisture-adsorbing film that has not adsorb moisture yet meets a relationship which is expressed using the volume expansion ratio (X) (%); of the moisture-adsorbing film that has already adsorbed moisture and which is represented the following equation: Y ≥ 0.0011X2 + 0.058X - 0.26 (wherein 0 < Y ≤ 5.00).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014127608 | 2014-06-20 | ||
JP2014-127608 | 2014-06-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201612000A true TW201612000A (en) | 2016-04-01 |
TWI663066B TWI663066B (en) | 2019-06-21 |
Family
ID=54935339
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW104119591A TWI663066B (en) | 2014-06-20 | 2015-06-17 | Hygroscopic laminate with hygroscopic film |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6611711B2 (en) |
CN (1) | CN106660343B (en) |
TW (1) | TWI663066B (en) |
WO (1) | WO2015194348A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106393928A (en) * | 2016-08-27 | 2017-02-15 | 无锡中洁能源技术有限公司 | Production technology of moisture absorption type solar backboard |
CN112829422B (en) * | 2021-01-04 | 2023-04-14 | 浙江海顺新材料有限公司 | Moisture absorption film, preparation method and packaging structure |
CN115895241A (en) * | 2022-11-30 | 2023-04-04 | 惠州市保瑞新材料有限公司 | Packaging material and preparation method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05355Y2 (en) * | 1984-10-11 | 1993-01-07 | ||
JPS6357230A (en) * | 1986-08-29 | 1988-03-11 | 大日本印刷株式会社 | Sheathing material for el panel |
JP2982079B2 (en) * | 1990-11-22 | 1999-11-22 | 丸谷化工機株式会社 | Light packaging sheet material and light packaging bag using the same |
CN1160189C (en) * | 1997-04-17 | 2004-08-04 | 吴羽化学工业株式会社 | Moisture-proofing film and electroluminescent device |
EP1857164A1 (en) * | 2005-02-21 | 2007-11-21 | Kyodo Printing Co., Ltd. | Adsorption film and organic el device |
-
2015
- 2015-05-29 CN CN201580033444.8A patent/CN106660343B/en not_active Expired - Fee Related
- 2015-05-29 WO PCT/JP2015/065655 patent/WO2015194348A1/en active Application Filing
- 2015-05-29 JP JP2016529212A patent/JP6611711B2/en active Active
- 2015-06-17 TW TW104119591A patent/TWI663066B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPWO2015194348A1 (en) | 2017-04-20 |
WO2015194348A1 (en) | 2015-12-23 |
TWI663066B (en) | 2019-06-21 |
JP6611711B2 (en) | 2019-11-27 |
CN106660343A (en) | 2017-05-10 |
CN106660343B (en) | 2019-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP3596184A4 (en) | Adhesive bonding composition and electronic components prepared from the same | |
MX2014013347A (en) | Adhesive compositions containing graphenic carbon particles. | |
PH12017500375A1 (en) | Maleimide film | |
EP3207094A4 (en) | Silicone composition and a pressure sensitive adhesive film having a pressure sensitive adhesive layer made from the composition | |
TW201612275A (en) | Acryl foam adhesive tape | |
IN2014CN03520A (en) | ||
EP3718996A4 (en) | Compound containing unsaturated double bond, oxygen absorber comprising same, and resin composition | |
EP3075753A4 (en) | (meth)acrylic copolymer, adhesive composition containing same, and adhesive sheet | |
EP3385349A4 (en) | Adhesive composition, sealing sheet, and sealed body | |
EP3511386A4 (en) | Adhesive composition, sealing sheet, and sealed body | |
WO2012064071A3 (en) | Adhesive composition | |
EP3327098A4 (en) | Adhesive resin layer and adhesive resin film | |
SG10201403298XA (en) | Lightweight two-sided adhesive tape | |
MX2017004616A (en) | Porous titanate compound particles and method for producing same. | |
EP3492508A4 (en) | Curable resin composition and structural material bonding adhesive agent using said composition | |
EP3007187A4 (en) | Soft-magnetic resin composition, soft-magnetic adhesive film, circuit board with soft-magnetic film laminated thereto, and position detection device | |
MX2016005110A (en) | Reactive 2-component adhesive system. | |
MX2017017041A (en) | Laminating adhesive-polyester-polycarbonate-polyol systems. | |
EP3656830A4 (en) | Adhesive composition and adhesive film | |
PH12016500005A1 (en) | Dicing sheet | |
EP3239259A4 (en) | Adhesive resin layer and adhesive resin film | |
EP4048732A4 (en) | Hot-melt pressure sensitive adhesive composition and uses thereof | |
SG11201803752WA (en) | 2-part epoxy adhesive composition | |
EP3561019A4 (en) | Adhesive composition having antifog properties | |
SG11201507898UA (en) | Hydrophilic adhesives and tapes and devices containing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |