WO2015186704A1 - Pâte conductrice, structure connectée et procédé de fabrication de structure connectée - Google Patents

Pâte conductrice, structure connectée et procédé de fabrication de structure connectée Download PDF

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Publication number
WO2015186704A1
WO2015186704A1 PCT/JP2015/065905 JP2015065905W WO2015186704A1 WO 2015186704 A1 WO2015186704 A1 WO 2015186704A1 JP 2015065905 W JP2015065905 W JP 2015065905W WO 2015186704 A1 WO2015186704 A1 WO 2015186704A1
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WO
WIPO (PCT)
Prior art keywords
electrode
conductive paste
solder
connection
target member
Prior art date
Application number
PCT/JP2015/065905
Other languages
English (en)
Japanese (ja)
Inventor
敬士 久保田
石澤　英亮
Original Assignee
積水化学工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 積水化学工業株式会社 filed Critical 積水化学工業株式会社
Priority to CN201580004070.7A priority Critical patent/CN105900180B/zh
Priority to KR1020167015288A priority patent/KR102392995B1/ko
Priority to JP2015528740A priority patent/JP5860191B1/ja
Publication of WO2015186704A1 publication Critical patent/WO2015186704A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H01L2224/115—Manufacturing methods by chemical or physical modification of a pre-existing or pre-deposited material
    • H01L2224/1152—Self-assembly, e.g. self-agglomeration of the bump material in a fluid
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector

Definitions

  • the present invention relates to a conductive paste containing solder particles.
  • the present invention also relates to a connection structure using the conductive paste and a method for manufacturing the connection structure.
  • Anisotropic conductive materials such as anisotropic conductive paste and anisotropic conductive film are widely known.
  • anisotropic conductive material conductive particles are dispersed in a binder resin.
  • the anisotropic conductive material may be connected between a flexible printed circuit board and a glass substrate (FOG (Film on Glass)), or connected between a semiconductor chip and a flexible printed circuit board (COF ( (Chip on Film)), connection between a semiconductor chip and a glass substrate (COG (Chip on Glass)), connection between a flexible printed circuit board and a glass epoxy substrate (FOB (Film on Board)), and the like.
  • FOG Glass
  • COF Chip on Film
  • an anisotropic conductive material containing conductive particles is disposed on the glass epoxy substrate. To do.
  • a flexible printed circuit board is laminated, and heated and pressurized. As a result, the anisotropic conductive material is cured, and the electrodes are electrically connected via the conductive particles to obtain a connection structure.
  • Patent Document 1 includes a resin layer containing a thermosetting resin, solder powder, and a curing agent, and the solder powder and the curing agent include the resin layer.
  • An adhesive tape present therein is disclosed. This adhesive tape is in the form of a film, not a paste.
  • Patent Document 1 discloses a bonding method using the above-mentioned adhesive tape. Specifically, a first substrate, an adhesive tape, a second substrate, an adhesive tape, and a third substrate are laminated in this order from the bottom to obtain a laminate. At this time, the first electrode provided on the surface of the first substrate is opposed to the second electrode provided on the surface of the second substrate. Moreover, the 2nd electrode provided in the surface of the 2nd board
  • the adhesive tape described in Patent Document 1 is a film, not a paste. For this reason, it is difficult to efficiently arrange the solder powder on the electrodes (lines). For example, in the adhesive tape described in Patent Document 1, a part of the solder powder is easily placed in a region (space) where no electrode is formed. Solder powder disposed in a region where no electrode is formed does not contribute to conduction between the electrodes.
  • the solder powder may not be efficiently disposed on the electrodes (lines).
  • An object of the present invention is to provide a conductive paste that can efficiently arrange solder particles on electrodes and can improve conduction reliability between the electrodes. Moreover, this invention is providing the manufacturing method of the connection structure and connection structure using the said electrically conductive paste.
  • the solder includes a thermosetting component, a flux, and a plurality of solder particles, and the viscosity at the melting point of the flux is 0.1 Pa ⁇ s or more and 3 Pa ⁇ s or less.
  • a conductive paste is provided in which the viscosity at the melting point of the particles is 0.1 Pa ⁇ s or more and 5 Pa ⁇ s or less.
  • the melting point of the flux is 80 ° C. or more and 190 ° C. or less, and in another specific aspect, the melting point of the flux is 100 ° C. or more and 190 ° C. or less.
  • the content of the flux is 0.1 wt% or more and 5 wt% or less in 100 wt% of the conductive paste.
  • the conductive paste does not contain a filler or contains a filler in less than 0.25% by weight in 100% by weight of the conductive paste.
  • the solder particles are surface-treated so that carboxyl groups exist on the outer surface.
  • the melting point of the flux is higher than the melting point of the solder particles.
  • a first connection target member having at least one first electrode on the surface
  • a second connection target member having at least one second electrode on the surface
  • the connection part is formed of the above-described conductive paste
  • the first electrode and the second electrode A connection structure is provided in which an electrode is electrically connected by a solder portion in the connection portion.
  • the first connection target member and the second connection target member are disposed so as to face each other, and by heating the conductive paste to a temperature equal to or higher than the melting point of the solder particles and equal to or higher than the curing temperature of the thermosetting component.
  • a step of electrically connecting the first electrode and the second electrode with a solder portion in the connection portion How to manufacture connection structures There is provided.
  • connection portion in the step of arranging the second connection target member and the step of forming the connection portion, no pressure is applied, and the conductive paste includes The weight of the second connection target member is added.
  • the second connection target member is a resin film, a flexible printed board, a rigid flexible board, or a flexible flat cable.
  • the conductive paste according to the present invention includes a thermosetting component, a flux, and a plurality of solder particles, and the viscosity at the melting point of the flux is 0.1 Pa ⁇ s or more and 3 Pa ⁇ s or less. Since the viscosity at the melting point is 0.1 Pa ⁇ s or more and 5 Pa ⁇ s or less, when the electrodes are electrically connected, the solder particles can be efficiently disposed on the electrodes. The conduction reliability can be increased.
  • FIG. 1 is a partially cutaway front sectional view schematically showing a connection structure obtained using a conductive paste according to an embodiment of the present invention.
  • FIGS. 2A to 2C are diagrams for explaining each step of an example of a method of manufacturing a connection structure using the conductive paste according to the embodiment of the present invention.
  • FIG. 3 is a partially cutaway front sectional view showing a modified example of the connection structure.
  • FIGS. 4A, 4B, and 4C are images showing an example of a connection structure using a conductive paste that is not included in the embodiment of the present invention.
  • FIGS. 4A and 4B are images.
  • FIG. 4C is a cross-sectional image
  • FIG. 4C is a planar image.
  • the conductive paste according to the present invention includes a thermosetting component, a flux, and a plurality of solder particles.
  • the viscosity at the melting point of the flux is 0.1 Pa ⁇ s or more and 3 Pa ⁇ s or less.
  • the solder particles have a viscosity at the melting point of 0.1 Pa ⁇ s to 5 Pa ⁇ s.
  • the conductive paste according to the present invention since the above-described configuration is adopted, when the electrodes are electrically connected, a plurality of solder particles are easily collected between the electrodes, and the plurality of solder particles are placed on the electrodes (lines). Can be arranged efficiently. Moreover, it is difficult for some of the plurality of solder particles to be disposed in a region (space) where no electrode is formed, and the amount of solder particles disposed in a region where no electrode is formed can be considerably reduced. Therefore, the conduction reliability between the electrodes can be improved. In addition, it is possible to prevent electrical connection between laterally adjacent electrodes that should not be connected, and to improve insulation reliability.
  • the conductive paste according to the present invention can be suitably used for the following manufacturing method of the connection structure according to the present invention.
  • a conductive paste, a first connection target member, and a second connection target member are used.
  • the conductive material used in the method for manufacturing a connection structure according to the present invention is not a conductive film but a conductive paste.
  • the conductive paste includes a thermosetting component, a flux, and a plurality of solder particles.
  • the first connection target member has at least one first electrode on the surface.
  • the second connection target member has at least one second electrode on the surface.
  • the step of disposing the conductive paste according to the present invention on the surface of the first connection target member, and the first connection target member side of the conductive paste include: On the opposite surface, the step of disposing the second connection object member so that the first electrode and the second electrode face each other, the melting point of the solder particles or higher, and the thermosetting component By heating the conductive paste above the curing temperature, a connection portion connecting the first connection target member and the second connection target member is formed by the conductive paste, and the first And electrically connecting the second electrode and the second electrode with a solder portion in the connection portion.
  • connection structure in the step of arranging the second connection target member and the step of forming the connection portion, no pressure is applied, and the second connection is applied to the conductive paste.
  • the weight of the target member is preferably added.
  • the conductive paste in the step of arranging the second connection target member and the step of forming the connection portion, has a weight force of the second connection target member. It is preferable not to apply a pressure higher than.
  • the plurality of solder particles are easily collected between the first electrode and the second electrode, and the plurality of solder particles are collected on the electrode ( Line). Moreover, it is difficult for some of the plurality of solder particles to be disposed in a region (space) where no electrode is formed, and the amount of solder particles disposed in a region where no electrode is formed can be considerably reduced. Therefore, the conduction reliability between the first electrode and the second electrode can be improved. In addition, it is possible to prevent electrical connection between laterally adjacent electrodes that should not be connected, and to improve insulation reliability.
  • a conductive paste is used instead of a conductive film. The inventors have found that they need to be used.
  • conductive particles having base material particles and a solder layer disposed on the surface of the base material particles are known as particles different from the solder particles. Compared to the case where such conductive particles are used, when solder particles are used, the melting point of the flux and the melting point of the solder particles are in a specific range, so that the solder particles are arranged on the electrodes. The effect of improving accuracy is increased.
  • the connection portion is Solder particles arranged in a region (space) where no electrode is formed before being formed are more easily collected between the first electrode and the second electrode, and a plurality of solder particles are separated into electrodes (lines).
  • the inventors have also found that they can be arranged efficiently above.
  • a configuration in which a conductive paste is used instead of a conductive film and a configuration in which the weight of the second connection target member is added to the conductive paste without applying pressure are used in combination. This has a great meaning in order to obtain the effects of the present invention at a higher level.
  • WO2008 / 023452A1 describes that it is preferable to pressurize with a predetermined pressure at the time of bonding from the viewpoint of efficiently moving the solder powder to the electrode surface, and the pressurizing pressure further ensures the solder area.
  • the pressure is set to 0 MPa or more, preferably 1 MPa or more.
  • a predetermined pressure may be applied to the adhesive tape by its own weight.
  • the pressure applied intentionally to the adhesive tape may be 0 MPa, but there is no difference between the effect when the pressure exceeding 0 MPa is applied and when the pressure is set to 0 MPa. Not listed.
  • the thickness of the connecting portion can be adjusted as appropriate depending on the amount of the conductive paste applied.
  • the conductive film in order to change or adjust the thickness of the connection portion, it is necessary to prepare a conductive film having a different thickness or to prepare a conductive film having a predetermined thickness. There is.
  • FIG. 1 schematically shows a connection structure obtained by using a conductive paste according to an embodiment of the present invention in a partially cutaway front sectional view.
  • connection structure 1 shown in FIG. 1 is a connection that connects a first connection target member 2, a second connection target member 3, and the first connection target member 2 and the second connection target member 3.
  • Part 4 The connection portion 4 is formed of a conductive paste containing a thermosetting component, a flux, and a plurality of solder particles. In this conductive paste, the viscosity at the melting point of the flux and the viscosity at the melting point of the solder particles are within a specific range.
  • the connecting portion 4 includes a solder portion 4A in which a plurality of solder particles are gathered and joined to each other, and a cured product portion 4B in which a thermosetting component is thermally cured.
  • the first connection object member 2 has a plurality of first electrodes 2a on the surface (upper surface).
  • the second connection target member 3 has a plurality of second electrodes 3a on the surface (lower surface).
  • the first electrode 2a and the second electrode 3a are electrically connected by the solder portion 4A. Therefore, the first connection target member 2 and the second connection target member 3 are electrically connected by the solder portion 4A.
  • no solder exists in a region (cured product portion 4B portion) different from the solder portion 4A gathered between the first electrode 2a and the second electrode 3a.
  • connection structure 1 As shown in FIG. 1, in the connection structure 1, after a plurality of solder particles are melted, the molten solder particles are wetted and spread on the surface of the electrode to solidify to form a solder portion 4 ⁇ / b> A. For this reason, the connection area of 4 A of solder parts and the 1st electrode 2a, and 4 A of solder parts, and the 2nd electrode 3a becomes large. That is, by using the solder particles, the solder portion 4A, the first electrode 2a, and the solder portion are compared with the case where the conductive outer surface is made of a metal such as nickel, gold or copper. The contact area between 4A and the second electrode 3a increases. For this reason, the conduction
  • connection structure 1 shown in FIG. 1 all of the solder portions 4A are located in the facing region between the first and second electrodes 2a and 3a.
  • the connection structure 1X of the modification shown in FIG. 3 is different from the connection structure 1 shown in FIG. 1 only in the connection portion 4X.
  • the connection part 4X has the solder part 4XA and the hardened
  • most of the solder portions 4XA are located in regions where the first and second electrodes 2a and 3a are opposed to each other, and a part of the solder portion 4XA is first and second. You may protrude to the side from the area
  • the solder part 4XA protruding laterally from the region where the first and second electrodes 2a and 3a are opposed is a part of the solder part 4XA and is not a solder separated from the solder part 4XA.
  • the amount of solder away from the solder portion can be reduced, but the solder away from the solder portion may exist in the cured product portion.
  • connection structure 1 If the amount of solder particles used is reduced, the connection structure 1 can be easily obtained. If the amount of the solder particles used is increased, it becomes easy to obtain the connection structure 1X.
  • connection structure 1 using the conductive paste according to the embodiment of the present invention will be described.
  • the first connection target member 2 having the first electrode 2a on the surface (upper surface) is prepared.
  • a conductive paste 11 including a thermosetting component 11B, a plurality of solder particles 11A, and a flux is disposed on the surface of the first connection target member 2 ( First step).
  • the conductive paste 11 is disposed on the surface of the first connection target member 2 on which the first electrode 2a is provided.
  • the solder particles 11A are disposed both on the first electrode 2a (line) and on a region (space) where the first electrode 2a is not formed.
  • the arrangement method of the conductive paste 11 is not particularly limited, and examples thereof include application with a dispenser, screen printing, and ejection with an inkjet device.
  • the 2nd connection object member 3 which has the 2nd electrode 3a on the surface (lower surface) is prepared.
  • the 2nd connection object member 3 is arrange
  • the second connection target member 3 is disposed from the second electrode 3a side. At this time, the first electrode 2a and the second electrode 3a are opposed to each other.
  • the conductive paste 11 is heated above the melting point of the solder particles 11A and above the curing temperature of the thermosetting component 11B (third step). That is, the conductive paste 11 is heated to a temperature lower than the melting point of the solder particles 11A and the curing temperature of the thermosetting component 11B. At the time of this heating, the solder particles 11A that existed in the region where no electrode is formed gather between the first electrode 2a and the second electrode 3a (self-aggregation effect). In this embodiment, since the conductive paste is used instead of the conductive film, the solder particles 11A are effectively collected between the first electrode 2a and the second electrode 3a. Also, the solder particles 11A are melted and joined together. Further, the thermosetting component 11B is thermoset.
  • connection portion 4 connecting the first connection target member 2 and the second connection target member 3 is formed with the conductive paste 11.
  • the connection part 4 is formed by the conductive paste 11
  • the solder part 4A is formed by joining a plurality of solder particles 11A
  • the cured part 4B is formed by thermosetting the thermosetting component 11B. Since the solder particles 11A move quickly, the first electrode 2a and the second electrode are moved after the movement of the solder particles 11A not located between the first electrode 2a and the second electrode 3a starts. It is not necessary to keep the temperature constant until the movement of the solder particles 11A is completed.
  • connection structure 1 shown in FIG. 1 is obtained.
  • the second step and the third step may be performed continuously.
  • the laminated body of the obtained 1st connection object member 2, the electrically conductive paste 11, and the 2nd connection object member 3 is moved to a heating part, and said 3rd said You may perform a process.
  • the laminate In order to perform the heating, the laminate may be disposed on a heating member, or the laminate may be disposed in a heated space.
  • the heating temperature in the third step is not particularly limited as long as it is higher than the melting point of the solder particles and higher than the curing temperature of the thermosetting component.
  • the heating temperature is preferably 130 ° C. or higher, more preferably 160 ° C. or higher, preferably 450 ° C. or lower, more preferably 250 ° C. or lower, and still more preferably 200 ° C. or lower.
  • the said 1st connection object member should just have at least 1 1st electrode.
  • the first connection target member preferably has a plurality of first electrodes.
  • the said 2nd connection object member should just have at least 1 2nd electrode.
  • the second connection target member preferably has a plurality of second electrodes.
  • the first and second connection target members are not particularly limited. Specific examples of the first and second connection target members include electronic components such as semiconductor chips, capacitors, and diodes, and resin films, printed boards, flexible printed boards, flexible flat cables, rigid flexible boards, glass epoxies. Examples thereof include electronic components such as circuit boards such as substrates and glass substrates.
  • the first and second connection target members are preferably electronic components.
  • At least one of the first connection target member and the second connection target member is a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board.
  • the second connection target member is preferably a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board. Resin films, flexible printed boards, flexible flat cables, and rigid flexible boards have the property of being highly flexible and relatively lightweight. When a conductive film is used for connection of such a connection object member, there exists a tendency for a solder particle not to gather on an electrode.
  • the conductive paste according to the present invention is used, even if a resin film, a flexible printed board, a flexible flat cable, or a rigid flexible board is used, the solder particles can be efficiently collected on the electrode. And the reliability of conduction between the electrodes can be sufficiently enhanced.
  • the reliability of conduction between electrodes by not applying pressure compared to the case of using other connection target members such as a semiconductor chip. The improvement effect can be obtained more effectively.
  • the electrode provided on the connection target member examples include metal electrodes such as a gold electrode, a nickel electrode, a tin electrode, an aluminum electrode, a copper electrode, a silver electrode, a molybdenum electrode, a SUS electrode, and a tungsten electrode.
  • the electrode is preferably a gold electrode, a nickel electrode, a tin electrode, a silver electrode, or a copper electrode.
  • the electrode is preferably an aluminum electrode, a copper electrode, a molybdenum electrode, a silver electrode, or a tungsten electrode.
  • the electrode formed only with aluminum may be sufficient and the electrode by which the aluminum layer was laminated
  • the material for the metal oxide layer include indium oxide doped with a trivalent metal element and zinc oxide doped with a trivalent metal element.
  • the trivalent metal element include Sn, Al, and Ga.
  • the distance D1 of the connecting portion at the position where the first electrode and the second electrode face each other is preferably 5 ⁇ m or more, more preferably 20 ⁇ m or more, preferably 50 ⁇ m or less, more preferably 75 ⁇ m or less.
  • the distance D1 is equal to or greater than the lower limit, the connection reliability between the connection portion and the connection target member is further increased.
  • the distance D1 is less than or equal to the above upper limit, solder particles are more likely to gather on the electrodes when the connection portion is formed, and the conduction reliability between the electrodes is further enhanced.
  • the viscosity ⁇ 1 at 25 ° C. of the conductive paste is preferably 10 Pa ⁇ s or more, more preferably 50 Pa ⁇ s or more, and further preferably 100 Pa ⁇ s or more, preferably Is 800 Pa ⁇ s or less, more preferably 600 Pa ⁇ s or less, and still more preferably 500 Pa ⁇ s or less.
  • the viscosity can be appropriately adjusted depending on the type and amount of the compounding component. Further, the use of a filler can make the viscosity relatively high. However, since the filler may inhibit the movement of the solder particles, the filler content is preferably small.
  • the viscosity ⁇ 2 at the melting point of the flux of the conductive paste is 0.1 Pa ⁇ s or more and 3 Pa ⁇ s or less. From the viewpoint of more efficiently arranging the solder particles on the electrode, the viscosity ⁇ 2 is preferably 0.15 Pa ⁇ s or more, more preferably 0.2 Pa ⁇ s or more, preferably 2 Pa ⁇ s or less, more preferably 1 Pa ⁇ s or less.
  • the viscosity ⁇ 3 at the melting point of the solder particles of the conductive paste is 0.1 Pa ⁇ s or more and 5 Pa ⁇ s or less. From the viewpoint of more efficiently arranging the solder particles on the electrode, the viscosity ⁇ 3 is preferably 0.15 Pa ⁇ s or more, more preferably 0.2 Pa ⁇ s or more, preferably 3 Pa ⁇ s or less, more preferably 1 Pa ⁇ s or less.
  • the ratio of the viscosity ⁇ 1 to the viscosity ⁇ 2 is preferably 15 or more, more preferably 50 or more, preferably 3000 or less, more preferably Is 2500 or less.
  • the ratio of the viscosity ⁇ 1 to the viscosity ⁇ 3 is preferably 10 or more, more preferably 40 or more, preferably 2500 or less, more preferably Is 2000 or less.
  • the ratio of the viscosity ⁇ 2 to the viscosity ⁇ 3 is preferably 0.1 or more, more preferably 0.3 or more, preferably 10 Below, more preferably 1 or less.
  • the viscosity can be measured under conditions of 25 ° C. and 5 rpm using, for example, an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.).
  • the conductive paste includes a thermosetting component, a flux, and a plurality of solder particles.
  • the thermosetting component preferably includes a curable compound (thermosetting compound) that can be cured by heating, and a thermosetting agent.
  • solder particles have solder on a conductive outer surface.
  • both a center part and an electroconductive outer surface are formed with the solder.
  • the solder particles are preferably surface-treated so that carboxyl groups exist on the outer surface.
  • the solder particles are preferably blended into the conductive paste after being surface-treated so that carboxyl groups exist on the outer surface.
  • the solder is preferably a metal (low melting point metal) having a melting point of 450 ° C. or lower.
  • the solder particles are preferably metal particles (low melting point metal particles) having a melting point of 450 ° C. or lower.
  • the low melting point metal particles are particles containing a low melting point metal.
  • the low melting point metal is a metal having a melting point of 450 ° C. or lower.
  • the melting point of the low melting point metal is preferably 300 ° C. or lower, more preferably 160 ° C. or lower.
  • the solder particles include tin.
  • the content of tin is preferably 30% by weight or more, more preferably 40% by weight or more, still more preferably 70% by weight or more, and particularly preferably 90% by weight or more.
  • the content of tin in the solder particles is equal to or higher than the lower limit, the connection reliability between the solder portion and the electrode is further enhanced.
  • the tin content is determined using a high-frequency inductively coupled plasma emission spectrometer (“ICP-AES” manufactured by Horiba, Ltd.) or a fluorescent X-ray analyzer (“EDX-800HS” manufactured by Shimadzu). It can be measured.
  • ICP-AES high-frequency inductively coupled plasma emission spectrometer
  • EDX-800HS fluorescent X-ray analyzer
  • solder particles By using the above solder particles, the solder is melted and joined to the electrodes, and the solder portion conducts between the electrodes. For example, since the solder portion and the electrode are not in point contact but in surface contact, the connection resistance is lowered. In addition, the use of solder particles increases the bonding strength between the solder portion and the electrode. As a result, peeling between the solder portion and the electrode is further less likely to occur, and the conduction reliability and the connection reliability are effectively increased.
  • the low melting point metal constituting the solder particles is not particularly limited.
  • the low melting point metal is preferably tin or an alloy containing tin.
  • the alloy include a tin-silver alloy, a tin-copper alloy, a tin-silver-copper alloy, a tin-bismuth alloy, a tin-zinc alloy, and a tin-indium alloy.
  • the low melting point metal is preferably tin, a tin-silver alloy, a tin-silver-copper alloy, a tin-bismuth alloy, or a tin-indium alloy because of its excellent wettability with respect to the electrode. More preferred are a tin-bismuth alloy and a tin-indium alloy.
  • the solder particles are preferably a filler material having a liquidus line of 450 ° C. or lower based on JIS Z3001: Welding terms.
  • the composition of the solder particles include metal compositions containing zinc, gold, silver, lead, copper, tin, bismuth, indium and the like. Of these, a tin-indium system (117 ° C. eutectic) or a tin-bismuth system (139 ° C. eutectic) which is low-melting and lead-free is preferable. That is, the solder particles preferably do not contain lead, and preferably contain tin and indium, or contain tin and bismuth.
  • the solder particles include nickel, copper, antimony, aluminum, zinc, iron, gold, titanium, phosphorus, germanium, tellurium, cobalt, bismuth, manganese, chromium. Further, it may contain a metal such as molybdenum and palladium. Moreover, from the viewpoint of further increasing the bonding strength between the solder portion and the electrode, the solder particles preferably contain nickel, copper, antimony, aluminum, or zinc. From the viewpoint of further increasing the bonding strength between the solder part and the electrode, the content of these metals for increasing the bonding strength is preferably 0.0001% by weight or more, preferably 1% by weight in 100% by weight of the solder particles. % Or less.
  • the average particle diameter of the solder particles is preferably 0.5 ⁇ m or more, more preferably 1 ⁇ m or more, still more preferably 3 ⁇ m or more, particularly preferably 5 ⁇ m or more, preferably 100 ⁇ m or less, more preferably 40 ⁇ m or less, and even more preferably 30 ⁇ m.
  • it is more preferably 20 ⁇ m or less, particularly preferably 15 ⁇ m or less, and most preferably 10 ⁇ m or less.
  • the average particle diameter of the solder particles is particularly preferably 3 ⁇ m or more and 30 ⁇ m or less.
  • the average particle diameter” of the solder particles indicates the number average particle diameter.
  • the average particle diameter of the solder particles is obtained, for example, by observing 50 arbitrary solder particles with an electron microscope or an optical microscope and calculating an average value.
  • the content of the solder particles in 100% by weight of the conductive paste is preferably 1% by weight or more, more preferably 2% by weight or more, still more preferably 10% by weight or more, particularly preferably 20% by weight or more, and most preferably 30%. % By weight or more, preferably 80% by weight or less, more preferably 60% by weight or less, and still more preferably 50% by weight or less.
  • the content of the solder particles is not less than the above lower limit and not more than the above upper limit, it is possible to more efficiently arrange the solder particles on the electrodes, and it is easy to arrange many solder particles between the electrodes, The conduction reliability is further increased. From the viewpoint of further improving the conduction reliability, it is preferable that the content of the solder particles is large.
  • thermosetting component examples include oxetane compounds, epoxy compounds, episulfide compounds, (meth) acrylic compounds, phenolic compounds, amino compounds, unsaturated polyester compounds, polyurethane compounds, silicone compounds, and polyimide compounds.
  • an epoxy compound is preferable from the viewpoint of further improving the curability and viscosity of the conductive paste and further improving the connection reliability.
  • thermosetting compound is preferably dispersed in the form of particles.
  • the content of the thermosetting compound is preferably 20% by weight or more, more preferably 40% by weight or more, still more preferably 50% by weight or more, and preferably 99% by weight or less. Is 98% by weight or less, more preferably 90% by weight or less, and particularly preferably 80% by weight or less. From the viewpoint of further improving the impact resistance, it is preferable that the content of the thermosetting component is large.
  • thermosetting agent thermosetting component
  • the thermosetting agent thermosets the thermosetting compound.
  • examples of the thermosetting agent include an imidazole curing agent, an amine curing agent, a phenol curing agent, a polythiol curing agent, an acid anhydride, a thermal cation initiator, and a thermal radical generator.
  • the said thermosetting agent only 1 type may be used and 2 or more types may be used together.
  • an imidazole curing agent, a polythiol curing agent, or an amine curing agent is preferable because the conductive paste can be cured more rapidly at a low temperature.
  • a latent curing agent is preferable.
  • the latent curing agent is preferably a latent imidazole curing agent, a latent polythiol curing agent or a latent amine curing agent.
  • the said thermosetting agent may be coat
  • the imidazole curing agent is not particularly limited, and 2-methylimidazole, 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2, 4-Diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine and 2,4-diamino-6- [2'-methylimidazolyl- (1')]-ethyl-s- Examples include triazine isocyanuric acid adducts.
  • the polythiol curing agent is not particularly limited, but is trimethylolpropane tris-3-mercaptopropionate, pentaerythritol tetrakis (3-mercaptobutyrate), pentaerythritol tetrakis-3-mercaptopropionate and dipentaerythritol hexa. -3-Mercaptopropionate and the like.
  • the solubility parameter of the polythiol curing agent is preferably 9.5 or more, and preferably 12 or less.
  • the solubility parameter is calculated by the Fedors method.
  • the solubility parameter of trimethylolpropane tris-3-mercaptopropionate is 9.6, and the solubility parameter of dipentaerythritol hexa-3-mercaptopropionate is 11.4.
  • the amine curing agent is not particularly limited, and hexamethylenediamine, octamethylenediamine, decamethylenediamine, 3,9-bis (3-aminopropyl) -2,4,8,10-tetraspiro [5.5].
  • examples include undecane, bis (4-aminocyclohexyl) methane, metaphenylenediamine, and diaminodiphenylsulfone.
  • thermal cation curing agent examples include iodonium cation curing agents, oxonium cation curing agents, and sulfonium cation curing agents.
  • examples of the iodonium-based cationic curing agent include bis (4-tert-butylphenyl) iodonium hexafluorophosphate.
  • examples of the oxonium-based cationic curing agent include trimethyloxonium tetrafluoroborate.
  • the sulfonium-based cationic curing agent examples include tri-p-tolylsulfonium hexafluorophosphate.
  • the thermal radical generator is not particularly limited, and examples thereof include azo compounds and organic peroxides.
  • examples of the azo compound include azobisisobutyronitrile (AIBN).
  • examples of the organic peroxide include di-tert-butyl peroxide and methyl ethyl ketone peroxide.
  • the reaction initiation temperature of the thermosetting agent is preferably 50 ° C or higher, more preferably 70 ° C or higher, still more preferably 80 ° C or higher, preferably 250 ° C or lower, more preferably 200 ° C or lower, still more preferably 150 ° C or lower, Especially preferably, it is 140 degrees C or less.
  • the reaction start temperature of the thermosetting agent is not less than the above lower limit and not more than the above upper limit, the solder particles are more efficiently arranged on the electrode.
  • the reaction initiation temperature of the thermosetting agent is particularly preferably 80 ° C. or higher and 140 ° C. or lower.
  • the reaction initiation temperature of the thermosetting agent is preferably lower than the melting point of the solder in the solder particles, more preferably 5 ° C. or more, and more preferably 10 It is more preferable that the temperature is lower by at least ° C.
  • the reaction start temperature of the thermosetting agent means the temperature at which the exothermic peak of DSC starts to rise.
  • the content of the thermosetting agent is not particularly limited.
  • the content of the thermosetting agent is preferably 0.01 parts by weight or more, more preferably 1 part by weight or more, preferably 200 parts by weight or less, more preferably 100 parts by weight with respect to 100 parts by weight of the thermosetting compound. Part or less, more preferably 75 parts by weight or less.
  • the content of the thermosetting agent is at least the above lower limit, it is easy to sufficiently cure the conductive paste.
  • the content of the thermosetting agent is not more than the above upper limit, it is difficult for an excess thermosetting agent that did not participate in curing after curing to remain, and the heat resistance of the cured product is further enhanced.
  • the conductive paste contains a flux.
  • the flux is not particularly limited.
  • a flux generally used for soldering or the like can be used.
  • the flux include zinc chloride, a mixture of zinc chloride and an inorganic halide, a mixture of zinc chloride and an inorganic acid, a molten salt, phosphoric acid, a derivative of phosphoric acid, an organic halide, hydrazine, an organic acid, and pine resin.
  • Etc As for the said flux, only 1 type may be used and 2 or more types may be used together.
  • Examples of the molten salt include ammonium chloride.
  • Examples of the organic acid include lactic acid, citric acid, stearic acid, glutamic acid, and glutaric acid.
  • Examples of the pine resin include activated pine resin and non-activated pine resin.
  • the flux is preferably an organic acid having two or more carboxyl groups, pine resin.
  • the flux may be an organic acid having two or more carboxyl groups, or pine resin.
  • the above rosins are rosins whose main component is abietic acid.
  • the flux is preferably rosins, and more preferably abietic acid. By using this preferable flux, the conduction reliability between the electrodes is further enhanced.
  • the active temperature (melting point) of the flux is preferably 50 ° C. or higher, more preferably 70 ° C. or higher, still more preferably 80 ° C. or higher, particularly preferably 100 ° C. or higher, preferably 200 ° C. or lower, more preferably 190 ° C. or lower. More preferably, it is 160 ° C. or less, more preferably 150 ° C. or less, and still more preferably 140 ° C. or less.
  • the activation temperature of the flux is not less than the above lower limit and not more than the above upper limit, the flux effect is more effectively exhibited, and the solder particles are more efficiently arranged on the electrode. As a result, the connection resistance between the electrodes is reduced, and the connection reliability is also increased.
  • the active temperature (melting point) of the flux is preferably 80 ° C. or higher and 190 ° C. or lower, and more preferably 100 ° C. or higher and 190 ° C. or lower.
  • the activation temperature of the flux is particularly preferably 80 ° C. or higher and 140 ° C. or lower, and more preferably 100 ° C. or higher and 140 ° C. or lower.
  • Examples of the flux having a melting point of 80 ° C. or higher and 190 ° C. or lower include succinic acid (melting point 186 ° C.), glutaric acid (melting point 96 ° C.), adipic acid (melting point 152 ° C.), pimelic acid (melting point 104 ° C.), suberic acid
  • Examples thereof include dicarboxylic acids such as (melting point 142 ° C.), benzoic acid (melting point 122 ° C.), and malic acid (melting point 130 ° C.).
  • the boiling point of the flux is preferably 200 ° C. or lower.
  • the melting point of the flux is preferably higher than the melting point of the solder in the solder particles, preferably 5 ° C or higher, more preferably 10 ° C or higher. Is more preferable.
  • the melting point of the flux is preferably higher than the reaction start temperature of the thermosetting agent, more preferably 5 ° C or higher, more preferably 10 ° C or higher. More preferably.
  • the flux may be dispersed in the conductive paste or may be adhered on the surface of the solder particles.
  • the solder particles can be efficiently aggregated on the electrode portion. This is because, when heat is applied at the time of joining, when the electrode formed on the connection target member is compared with the portion of the connection target member around the electrode, the thermal conductivity of the electrode portion is that of the connection target member portion around the electrode. Due to the fact that it is higher than the heat traditional rate, it is caused by the rapid temperature rise of the electrode part. At the stage where the melting point of the solder particles is exceeded, the inside of the solder particles dissolves, but the oxide film formed on the surface does not reach the melting point (activation temperature) of the flux and is not removed.
  • the flux is preferably a flux that releases cations by heating.
  • a flux that releases cations upon heating the solder particles can be arranged more efficiently on the electrode.
  • thermal cation curing agent can be used as the flux that releases cations by heating.
  • the content of the flux is preferably 0.5% by weight or more, preferably 30% by weight or less, more preferably 25% by weight or less.
  • the conductive paste may not contain a flux.
  • the flux content is not less than the above lower limit and not more than the above upper limit, it becomes more difficult to form an oxide film on the surface of the solder and the electrode, and the oxide film formed on the surface of the solder and the electrode is more effective. Can be removed.
  • a filler may be added to the conductive paste.
  • the filler may be an organic filler or an inorganic filler. However, since the filler may inhibit the movement of the solder particles, the filler content is preferably small.
  • the conductive paste does not contain a filler or contains a filler in less than 5% by weight in 100% by weight of the conductive paste.
  • the content of the filler is preferably 0% by weight (not contained) or more, preferably 5% by weight or less, more preferably 2% by weight or less, still more preferably 1% by weight or less, even more.
  • it is less than 0.25 wt%, particularly preferably 0.1 wt% or less.
  • the conductive paste does not contain a filler or contains less than 0.25% by weight of filler in 100% by weight of the conductive paste, and most preferably the conductive paste does not contain a filler. If the filler content is less than 0.25% by weight, the solder particle migration inhibition by the filler is sufficiently small, and if the filler content is 0.1% by weight or less, the solder particle migration inhibition by the filler is inhibited. Pretty small.
  • the conductive paste is, for example, a filler, an extender, a softener, a plasticizer, a polymerization catalyst, a curing catalyst, a colorant, an antioxidant, a heat stabilizer, a light stabilizer, an ultraviolet absorber, and a lubricant.
  • various additives such as an antistatic agent and a flame retardant may be included.
  • Polymer A Synthesis of reaction product (polymer A) of bisphenol F with 1,6-hexanediol diglycidyl ether and bisphenol F type epoxy resin: 72 parts by weight of bisphenol F (containing 4,4′-methylene bisphenol, 2,4′-methylene bisphenol and 2,2′-methylene bisphenol in a weight ratio of 2: 3: 1), 1,6-hexanediol 70 parts by weight of glycidyl ether and 30 parts by weight of bisphenol F type epoxy resin (“EPICLON EXA-830CRP” manufactured by DIC) were placed in a three-necked flask and dissolved at 150 ° C. under a nitrogen flow.
  • bisphenol F type epoxy resin (“EPICLON EXA-830CRP” manufactured by DIC)
  • the reaction product (Polymer A) contains a hydroxyl group derived from bisphenol F, 1,6-hexanediol diglycidyl ether, and an epoxy group of bisphenol F type epoxy resin. It was confirmed that it has a structural unit bonded to the main chain and has an epoxy group at both ends.
  • the weight average molecular weight of the reaction product (polymer A) obtained by GPC was 10,000, and the number average molecular weight was 3,500.
  • Polymer B both ends epoxy group rigid skeleton phenoxy resin, “YX6900BH45” manufactured by Mitsubishi Chemical Corporation, weight average molecular weight 16000
  • Thermosetting compound 1 Resorcinol type epoxy compound, “EX-201” manufactured by Nagase ChemteX Corporation, washed after crystallization at low temperature
  • Thermosetting compound 2 Bisphenol F type epoxy resin, “EPICLON EXA-830CRP” manufactured by DIC, used after being crystallized at low temperature
  • Thermosetting agent 1 Pentaerythritol tetrakis (3-mercaptobutyrate), “Karenz MT PE1” manufactured by Showa Denko KK
  • Latent epoxy thermosetting agent 1 T & K TOKA's “Fujicure 7000”
  • Flux 1 Adipic acid, manufactured by Wako Pure Chemical Industries, Ltd., melting point (activation temperature) 152 ° C.
  • Flux 2 Succinic acid, manufactured by Wako Pure Chemical Industries, Ltd., melting point (active temperature) 186 ° C.
  • Flux 3 Abietic acid, manufactured by Wako Pure Chemical Industries, Ltd., melting point (activation temperature) 174 ° C.
  • Solder particles 1 (SnBi solder particles, melting point 139 ° C., “DS10” manufactured by Mitsui Kinzoku Co., Ltd.) are subjected to the following surface treatment, average particle diameter 13 ⁇ m)
  • solder particles 200 g of solder particles, 40 g of adipic acid, and 70 g of acetone are weighed in a three-necked flask, and 0.3 g of dibutyltin oxide, which is a dehydration condensation catalyst between the hydroxyl groups of the solder particles and the carboxyl groups of adipic acid, is added. The reaction was carried out at 4 ° C for 4 hours. Thereafter, the solder particles were collected by filtration.
  • dibutyltin oxide which is a dehydration condensation catalyst between the hydroxyl groups of the solder particles and the carboxyl groups of adipic acid
  • the collected solder particles, 50 g of adipic acid, 200 g of toluene, and 0.3 g of para-toluenesulfonic acid are weighed in a three-necked flask and allowed to react at 120 ° C. for 3 hours while evacuating and refluxing. It was. At this time, the reaction was carried out while removing water produced by dehydration condensation using a Dean-Stark extraction device.
  • solder particles were collected by filtration, washed with hexane, and dried. Thereafter, the obtained solder particles were crushed with a ball mill, and then a sieve was selected so as to obtain a predetermined CV value. The obtained solder particles were surface-treated so that carboxyl groups were present on the outer surface.
  • Solder particles 2 (SnBi solder particles, melting point 139 ° C., “DS30” manufactured by Mitsui Kinzoku Co., Ltd.) surface-treated in the same manner as the solder particles 1, average particle diameter 32 ⁇ m
  • Phenoxy resin (“YP-50S” manufactured by Nippon Steel & Sumikin Chemical Co., Ltd.)
  • Examples 1 to 4, 6 to 9 (1) Preparation of anisotropic conductive paste The components shown in Table 1 below were blended in the blending amounts shown in Table 1 to obtain anisotropic conductive paste. In the anisotropic conductive paste obtained, the thermosetting compound was dispersed in the form of particles.
  • FR-4 substrate having a copper electrode pattern (copper electrode thickness 10 ⁇ m) having an L / S of 50 ⁇ m / 50 ⁇ m on the upper surface
  • Second connection object member the flexible printed circuit board (2nd connection object member) which has a copper electrode pattern (copper electrode thickness 10 micrometers) whose L / S is 50 micrometers / 50 micrometers on the lower surface was prepared.
  • the overlapping area of the glass epoxy substrate and the flexible substrate was 1.5 cm ⁇ 4 mm, and the number of connected electrodes was 75 pairs.
  • the anisotropic conductive paste immediately after fabrication was applied to the upper surface of the glass epoxy substrate so as to have a thickness of 50 ⁇ m to form an anisotropic conductive paste layer.
  • the flexible printed circuit board was laminated on the upper surface of the anisotropic conductive paste layer so that the electrodes face each other. At this time, no pressure was applied. The weight of the flexible printed board is added to the anisotropic conductive paste layer. Thereafter, while heating the anisotropic conductive paste layer to 190 ° C., the solder was melted and the anisotropic conductive paste layer was cured at 190 ° C. to obtain a first connection structure.
  • Glass epoxy substrate (FR-4 substrate) having a copper electrode pattern (copper electrode thickness 10 ⁇ m) having L / S of 75 ⁇ m / 75 ⁇ m on the upper surface (First connection object member) was prepared.
  • the flexible printed circuit board (2nd connection object member) which has a copper electrode pattern (copper electrode thickness 10 micrometers) whose L / S is 75 micrometers / 75 micrometers on the lower surface was prepared.
  • 2nd connection structure was obtained like manufacture of the 1st connection structure except having used the above-mentioned glass epoxy board and flexible printed circuit board from which L / S differs.
  • 3rd connection structure was obtained like manufacture of the 1st connection structure except having used the above-mentioned glass epoxy board and flexible printed circuit board from which L / S differs.
  • Electrode size (L) / inter-electrode space (S) is 100 ⁇ m / 100 ⁇ m (for the third connection structure), 75 ⁇ m / 75 ⁇ m (for the second connection structure), 50 ⁇ m / 50 ⁇ m (first connection structure) 5 mm square semiconductor chip (thickness 400 ⁇ m) and a glass epoxy substrate (size 30 ⁇ 30 mm, thickness 0.4 mm) having electrodes facing it.
  • First, second, and third connection structures were obtained in the same manner as in Example 1 except that a semiconductor chip and a glass epoxy substrate were used.
  • the 1st, 2nd, 3rd connection structure was obtained like Example 1 except having used an anisotropic conductive film.
  • Electrode size (L) / inter-electrode space (S) is 100 ⁇ m / 100 ⁇ m (for the third connection structure), 75 ⁇ m / 75 ⁇ m (for the second connection structure), 50 ⁇ m / 50 ⁇ m (first connection structure) 5 mm square semiconductor chip (thickness 400 ⁇ m) and a glass epoxy substrate (size 30 ⁇ 30 mm thickness 0.4 mm) having electrodes facing it.
  • the first, second, and third connection structures were obtained in the same manner as in Comparative Example 1 except that this semiconductor chip and glass epoxy substrate were used.
  • Viscosity The viscosity ⁇ 1 at 25 ° C. of the anisotropic conductive paste was measured under the conditions of 25 ° C. and 5 rpm using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.). Further, the viscosity ⁇ 2 at the melting point of the flux of the anisotropic conductive paste was measured using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.) under the condition of the melting point of the flux and 5 rpm.
  • the viscosity ⁇ 3 at the melting point of the solder particles of the anisotropic conductive paste was measured using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd.) under the condition of the melting point of the solder particles and 5 rpm.
  • the ratio ( ⁇ 1 / ⁇ 2), the ratio ( ⁇ 1 / ⁇ 3), and the ratio ( ⁇ 2 / ⁇ 3) were determined from the obtained measured values.
  • connection distance (inter-electrode spacing)
  • solder placement accuracy on electrodes In the cross section (cross section in the direction shown in FIG. 1) of the obtained first connection structure, it is separated from the solder portion disposed between the electrodes in 100% of the total area of the solder. Thus, the area (%) of the solder remaining in the cured product was evaluated. In addition, the average of the area in five cross sections was computed. The placement accuracy of the solder on the electrode was determined according to the following criteria.
  • ⁇ Average value of connection resistance is 10 7 ⁇ or more ⁇ : Average value of connection resistance is 10 6 ⁇ or more, less than 10 7 ⁇ ⁇ : Average value of connection resistance is 10 5 ⁇ or more, less than 10 6 ⁇ ⁇ : Connection The average resistance is less than 10 5 ⁇
  • the second connection target member is a flexible printed circuit board
  • the second connection target member is It can be seen that the effect of improving the conduction reliability by using the conductive paste of the present invention can be obtained more effectively than in the case of a semiconductor chip.
  • FIGS. 4A, 4B and 4C show an example of a connection structure using a conductive paste not included in the embodiment of the present invention.
  • 4A and 4B are cross-sectional images
  • FIG. 4C is a planar image.
  • 4A, 4B, and 4C a plurality of solders (solder particles) remaining in the cured product away from the solder portions disposed between the electrodes exist on the side of the solder portions.
  • grains which remain

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Abstract

L'invention concerne une pâte conductrice qui permet de disposer efficacement des particules de brasure sur une électrode et d'améliorer la fiabilité de conduction entre des électrodes. Une pâte conductrice selon la présente invention contient un composant thermodurcissable, un fondant et une pluralité de particules de brasure. Cette pâte conductrice présente une viscosité de 0,1 Pa·s à 3 Pa·s (inclus) au du point de fusion du fondant, et une viscosité de 0,1 Pa·s à 5 Pa·s (inclus) au point de fusion des particules de brasure.
PCT/JP2015/065905 2014-06-05 2015-06-02 Pâte conductrice, structure connectée et procédé de fabrication de structure connectée WO2015186704A1 (fr)

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JP2017112312A (ja) * 2015-12-18 2017-06-22 日立化成株式会社 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板
JP2019050347A (ja) * 2017-09-08 2019-03-28 株式会社タムラ製作所 電子基板の製造方法および異方性導電ペースト
JP2020188268A (ja) * 2015-12-18 2020-11-19 昭和電工マテリアルズ株式会社 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板
JP2021114449A (ja) * 2020-01-21 2021-08-05 積水化学工業株式会社 導電ペースト及び接続構造体
JP2022160604A (ja) * 2020-07-14 2022-10-19 昭和電工マテリアルズ株式会社 導電性接着剤組成物、接続構造体及び半導体発光素子搭載フレキシブル配線基板

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KR101820468B1 (ko) * 2016-11-21 2018-01-19 ㈜ 엘프스 자가 융착형 도전접속 페이스트
CN111417488A (zh) * 2017-12-22 2020-07-14 积水化学工业株式会社 焊锡粒子、导电材料、焊锡粒子的保管方法、导电材料的保管方法、导电材料的制造方法、连接结构体及连接结构体的制造方法

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