WO2015166588A1 - Substrat rigide-souple à élément incorporé - Google Patents

Substrat rigide-souple à élément incorporé Download PDF

Info

Publication number
WO2015166588A1
WO2015166588A1 PCT/JP2014/062202 JP2014062202W WO2015166588A1 WO 2015166588 A1 WO2015166588 A1 WO 2015166588A1 JP 2014062202 W JP2014062202 W JP 2014062202W WO 2015166588 A1 WO2015166588 A1 WO 2015166588A1
Authority
WO
WIPO (PCT)
Prior art keywords
rigid
component
prepreg
rigid flex
flexible
Prior art date
Application number
PCT/JP2014/062202
Other languages
English (en)
Japanese (ja)
Inventor
光昭 戸田
学 宮脇
松本　徹
Original Assignee
株式会社メイコー
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社メイコー filed Critical 株式会社メイコー
Priority to PCT/JP2014/062202 priority Critical patent/WO2015166588A1/fr
Publication of WO2015166588A1 publication Critical patent/WO2015166588A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits

Definitions

  • the present invention relates to a component built-in rigid flex substrate in which a rigid unit incorporating components and a flexible unit are integrated.
  • a flexible substrate having flexibility having flexibility
  • a relatively hard rigid substrate having no flexibility and the flexible substrate are joined.
  • Various substrates such as a bonded substrate or a rigid flex substrate in which the flexible substrate and the rigid substrate are integrated without forming a bonded portion are used.
  • a flexible circuit board including a rigid portion having an opening and a flexible portion
  • an electronic component is disposed in the opening of the rigid portion
  • interlayer adhesive layers are respectively provided on both sides of the rigid portion.
  • a manufacturing method for obtaining a component built-in rigid flex substrate has been developed by laminating a first substrate and a second substrate having the same by a heat press (see Patent Document 1).
  • the thickness of the built-in component is restricted to a relatively thin component of about 25 ⁇ m.
  • an adhesive amount sufficient to sufficiently fill the space for providing the incorporated component is required, but the interlayer adhesive layer formed on the first substrate and the second substrate as in Patent Document 1 The amount of adhesive may be insufficient.
  • the interlayer adhesive layer needs to be a material for a flexible circuit board, which has low flowability of the adhesive and insufficient filling into the opening. From this point as well, the manufacturing method of Patent Document 1 can not be incorporated in the substrate unless it is a relatively thin and small electronic component.
  • the present invention has been made in view of such problems, and an object of the present invention is to make it possible to incorporate relatively large electronic components in a rigid portion and to secure the reliability of via bonding. To provide a built-in rigid flex substrate.
  • the component-embedded rigid flex substrate of the present invention is a component-embedded rigid flex substrate having a rigid portion incorporating components and a flexible portion, and a copper foil is laminated on an insulating layer A flexible base having an opening that can receive the part in a range corresponding to the rigid part, and filling the inside of the opening containing the part, at least one side or both sides of the flexible base And a prepreg laminated so as to cover a portion.
  • the component built-in rigid flex substrate according to the present invention, the component is covered by filling the inside of the opening portion containing the component with a prepreg without using an adhesive or the like as in the prior art. This is because, by adjusting the melt viscosity of the prepreg, even if a large built-in component of, for example, 75 ⁇ m or more is accommodated in the opening, the prepreg can be easily filled in the opening without a gap.
  • the prepreg is laminated so as to cover at least a part of one side or both sides of the flexible substrate, thereby laminating a copper foil or the like on the surface of the prepreg to perform hole processing with a drill or a laser, etc.
  • Reliable inter-layer connection can be made by paste.
  • the component built-in rigid flex substrate according to the present invention can incorporate relatively large electronic components in the rigid portion, and can also ensure the reliability of via bonding.
  • FIG. 2 is a partially enlarged cross-sectional view taken along the line II-II in FIG.
  • FIG. 7 is a cross-sectional view (a) to (d) showing the manufacturing process of the component built-in rigid flex substrate according to the first embodiment.
  • FIG. 7 is a partial enlarged cross-sectional view of a component-embedded rigid flex substrate according to a second embodiment of the present invention. It is a partial expanded sectional view of the components built-in rigid flex substrate concerning the modification of the present invention.
  • FIG. 1 is a plan view of the component built-in rigid flex substrate 1 according to the first embodiment.
  • the component built-in rigid flex substrate 1 is a flat substrate having a rectangular planar shape.
  • the component built-in rigid flex substrate 1 is formed with a pair of rigid portions 3 and 3 incorporating electronic components 2 (components) on both sides in the longitudinal direction, and a flexible portion 4 is formed therebetween.
  • FIG. 1 illustrates that one electronic component 2 is built in one rigid unit 3, the other rigid unit 3 may also incorporate an electronic component.
  • the number and position are not limited to this.
  • the electronic component is, for example, a resistor, a capacitor, an inductor, an IC, an LSI, or the like, and in this embodiment, a relatively large electronic component of 75 ⁇ m or more is incorporated.
  • the component built-in rigid flex substrate 1 has a relatively hard characteristic as a whole, but the flexible portion 4 at the central portion of the substrate is flexible. It can be easily bent.
  • the planar shape of the component-embedded rigid flex substrate 1 is not limited to a rectangular shape, and can be appropriately changed according to the opening shape of the electric / electronic device in which the component-embedded rigid flex substrate 1 is to be embedded.
  • FIG. 2 is a partially enlarged cross-sectional view taken along the line II-II of FIG.
  • the component built-in rigid flex substrate 1 is formed of copper on both sides of the insulating layer 11 made of a flexible and insulating insulator such as polyimide and epoxy resin which does not contain glass cloth.
  • the conductive pattern of the foils 12 and 13 is formed, and further, the flexible base 10 covered with the coverlays 14 and 15 for protecting the copper foils 12 and 13 is provided.
  • the copper foils 12 and 13 on both sides of the flexible base 10 are electrically connected by the conductive portion 16 plated with the laser via.
  • the layer thickness of the insulating layer 11 is about 10 ⁇ m to 50 ⁇ m
  • the layer thickness of the copper foils 12 and 13 is about 8 ⁇ m to 30 ⁇ m
  • the layer thickness of the coverlays 14 and 15 is 10 ⁇ m to 30 ⁇ m.
  • the thickness of the material 10 as a whole is preferably 50 ⁇ m to 100 ⁇ m.
  • the flexible substrate 10 is formed with an opening 17 capable of containing the electronic component 2, and the electronic component 2 is disposed in the opening 17. There is.
  • the inside of the opening 17 is filled with a prepreg 20 so as to cover the electronic component 2, and the prepreg 20 is further covered with a cover lay 14 so as to cover both surfaces of the flexible base 10 in the rigid portion 3 of the component built-in rigid flex substrate 1. It is stacked on top of 15.
  • conductor patterns of copper foils 21 and 22 are formed on both sides of the prepreg 20, and the electronic component 2 is attached via an adhesive 23 applied to one of the copper foils 21.
  • the electronic component 2 is electrically conducted by the conductive portions 24 and 25 in which the laser vias communicated from the copper foil 21 to the terminal portion are plated. Furthermore, conductive portions 26 and 27 plated with laser vias corresponding to the conductive portions 16 of the flexible base 10 are also formed on both copper foils 21 and 22 on the prepreg 20, whereby each copper foil 12, 13, 21 and 22 are connected between layers. Then, solder resists 28 and 29 are applied to the rigid portion 3 of the component built-in rigid flex substrate 1.
  • FIG. 3 is a cross-sectional view (a) to (d) showing a manufacturing process of the component built-in rigid flex substrate according to the first embodiment.
  • a flexible base 10 made of an insulating layer 11, copper foils 12, 13 and cover lays 14, 15 is prepared, and an opening 17 is formed in the flexible base 10.
  • the pair of prepregs 20a and 20b and the copper foils 21 and 22 are thermally heated from both sides of the flexible substrate 10 in a range corresponding to the rigid portion 3 of the component built-in rigid flex substrate 1.
  • Adhesive lamination is carried out by heating and pressing with a press.
  • the opening hole 20c which can accommodate the electronic component 2 attached via the adhesive agent 23 on one copper foil 21 is formed in one prepreg 20a.
  • the pair of prepregs 20a and 20b are melted by performing heat pressing so as to cover the opening holes 20c of one of the prepregs 20a that accommodates the electronic component 2 with the other prepreg 20b, thereby opening the opening 17 is filled so as to fill the gap between the electronic component 2 and the electronic component 2.
  • the prepreg 20 is integrally filled in the opening 17 by the hot press, and the prepreg 20 is formed between the both surfaces of the flexible substrate 10 and the copper foils 21 and 22. A layer is formed.
  • laser vias are formed at positions corresponding to the terminal portions of the electronic component and the conductive portions 16 of the flexible base 10, and plating is performed to form the respective conductive portions 24 to 27.
  • the electronic component 2 and the respective copper foils 12, 13, 21, 22 are conducted.
  • solder resists 28 and 29 are applied on both sides of the rigid portion 3.
  • the component built-in rigid flex substrate 1 manufactured in this manner needs to use one having an appropriate melt viscosity as the prepreg 20.
  • the prepreg 20 is laminated in a semi-cured state in which a thermosetting resin such as a polyimide resin or an epoxy resin mixed with an additive such as a curing agent mixed with a fibrous reinforcing material such as glass cloth or carbon fiber.
  • a thermosetting resin such as a polyimide resin or an epoxy resin mixed with an additive such as a curing agent mixed with a fibrous reinforcing material such as glass cloth or carbon fiber.
  • the prepreg used in the production of a general rigid substrate has a minimum viscosity of less than 500 ps at 100 ° C. to 150 ° C. In this case, the resin exudes to the flexible portion to make the flexible portion flexible. It will hurt.
  • the prepreg used for the rigid part of a common rigid flex substrate has a minimum melt viscosity of 5,000 to 35,000 ps at 100 ° C. to 150 ° C.
  • the resin flow at the time of hot pressing is small, and a void is generated in the opening.
  • the prepreg 20 in the present embodiment has a minimum melt viscosity of 1,000 to 4,000 ps (1,000 ps) at 100 to 150 ° C. (100 ° C. or more and 150 ° C. or less) in order to realize the contradictory requirements as described above. Use more than 4,000 Ps)).
  • the prepreg 20 has a minimum melt viscosity of 1,000 to 4,000 ps at 100 to 150 ° C. by adding a filler or the like to the epoxy resin which is a thermosetting resin to increase the melt viscosity. Use one that has been adjusted to
  • the inside of the opening 17 containing the electronic component 2 is filled with the prepreg 20 without using an adhesive or the like as in the related art.
  • the prepreg 20 can be easily and reliably filled in the opening 17 without a gap.
  • the prepreg 20 is laminated so as to cover both surfaces of the flexible substrate 10 in the rigid portion 3, thereby laminating the copper foils 21 and 22 on the surface of the prepreg 20 and plating the laser vias with the conductive portions 24 to 27.
  • reliable interlayer connection can be performed.
  • the component-embedded rigid flex substrate 1 in the first embodiment can incorporate relatively large electronic components 2 in the rigid portion 3 and can also ensure via junction reliability.
  • FIG. 4 is a partially enlarged cross-sectional view of the component built-in rigid flex substrate according to the second embodiment.
  • the same reference numerals are given to the same components as those in the first embodiment, and the detailed description will be omitted.
  • the electronic component 2 is built in the rigid unit 31 and has a flexible unit 32 which is easily bent.
  • conductor patterns of copper foils 42 and 43 are formed on both sides of an insulating layer 41 made of a flexible and insulating insulator such as polyimide and epoxy resin containing no glass cloth.
  • the flexible substrate 40 is provided.
  • the copper foils 42 and 43 on both sides of the flexible base 40 are electrically connected by the conductive portion 44 plated with the laser via.
  • the thicknesses of the insulating layer 41 and the copper foils 42 and 43 are the same as in the first embodiment.
  • the insulating layer 41 may contain a glass cloth.
  • an opening 45 capable of containing the electronic component 2 is formed in the flexible base 40, and the electronic component 2 is disposed in the opening 45.
  • the inside of the opening 45 is filled with a prepreg 50 so as to cover the electronic component 2, and the prepreg 50 is further laminated so as to cover the entire copper foils 42 and 43 on both sides of the flexible base 40.
  • the conductor patterns of the copper foils 51 and 52 are formed on both sides of the prepreg 50, and the electronic component 2 is attached via the adhesive 53 applied to one of the copper foils 51.
  • the electronic component 2 is conducted by the conductive portions 54 and 55 in which laser vias communicated from the copper foil 51 to the terminal portion are plated.
  • conductive portions 56 and 57 formed by plating laser vias corresponding to the conductive portions 44 of the flexible base material 40 are also formed on both copper foils 51 and 52 on the prepreg 50, whereby the respective copper foils 42, 43, 51 and 52 are connected between layers. Then, solder resists 58 and 59 are applied to the rigid portion 31 of the component built-in rigid flex substrate 30.
  • the prepreg 50 covers the rigid portion 31 to the flexible portion 32 in layers without providing the cover lay on the flexible base 40,
  • the numeral 50 protects the copper foils 42 and 43 of the flexible base 40.
  • the method of manufacturing the component built-in rigid flex substrate 30 in the second embodiment is substantially the same as the method of manufacturing the component built-in rigid flex substrate 1 in the first embodiment.
  • a pair of prepregs extending from the rigid portion 31 to the flexible portion 32 are heated and pressed together with the copper foils 51 and 52 by heat pressing on both sides of the flexible base 40 Adhesively laminate.
  • the prepreg 20 adjusts the elastic modulus by using a polyimide resin or an epoxy resin having a polyimide resin as a skeleton for a thermosetting resin.
  • the flexible portion 32 is also covered with the prepreg 50 so that the flexible base 40 can be extended from the rigid portion 31 to the flexible portion 32 without forming a cover lay.
  • the copper foils 42 and 43 can be protected.
  • FIG. 5 is a partially enlarged cross-sectional view of a component built-in rigid flex substrate 1 according to a modification.
  • the same components as those of the first and second embodiments are designated by the same reference numerals and their detailed description will be omitted.
  • the basic configuration of the component built-in rigid flex substrate 30 ′ shown in FIG. 5 is the same as that of the component built-in rigid flex substrate 30 of the second embodiment, and the electronic component 2 is disposed in the opening 45 of the flexible base 40. ing. And while filling the opening part 45, the prepreg 50 is laminated
  • FIG. 5 The basic configuration of the component built-in rigid flex substrate 30 ′ shown in FIG. 5 is the same as that of the component built-in rigid flex substrate 30 of the second embodiment, and the electronic component 2 is disposed in the opening 45 of the flexible base 40. ing. And while filling the opening part 45, the prepreg 50 is laminated
  • a conductor pattern of copper foils 61 and 62 is further formed on both sides of the prepreg 50 in the flexible portion 32.
  • the copper foils 61 and 62 are protected by the cover lays 63 and 64.
  • the copper foils 61 and 62 can be easily applied to the flexible portion 32 by covering the prepreg 50 to a range corresponding to the flexible portion 32 of the flexible base 40.
  • Conductor patterns can be added.
  • the conductive portions may be formed on the copper foils 61 and 62 added to the flexible portion 32 so that the copper foils 42 and 43 of the flexible base 40 can be interlayer connected.
  • the component built-in rigid flex substrate 1, 30, 30 'in each of the above-described embodiments and modifications is a so-called four-layer substrate
  • the number of laminations is not limited to this, applications of the component built-in rigid flex substrate, and requirements It can be suitably changed according to the dimensions etc.
  • a prepreg and a copper foil may be further laminated on the outer layer, or a solder resist or the like may be laminated to form a multilayer substrate of four or more layers.
  • the conductive portions 16, 24 to 27, 44, 54 to 57 in the respective embodiments are plated with laser vias, other highly reliable via junctions can also be applied. For example, drilling with a drill may be used, or a conductive paste may be embedded.
  • the insulating layers 11 and 41 are used as the insulating layers 11 and 41, but the insulating layer is not limited to epoxy resin, and an insulator having flexibility and insulating property If it is Further, the insulating layer 11 does not necessarily have to be made of only a resin, and if the substrate such as glass cloth is not included, other insulating materials which improve the insulating property and other characteristics are dispersed and held in the resin. It may be done.
  • prepregs 20 and 50 are laminated
  • the component built-in rigid flex substrate according to the first embodiment of the present invention is a component built-in rigid flex substrate having a rigid section incorporating components and a flexible section, wherein copper foil is laminated on an insulating layer A flexible base having an opening which is openable to accommodate the component in a range corresponding to the rigid part, and filling the inside of the opening which houses the component, and at least one or both sides of the flexible base And a prepreg laminated to cover the part.
  • the component-embedded rigid flex substrate according to the second embodiment is the component-embedded rigid flex substrate according to the first embodiment, wherein the prepreg has a minimum melt viscosity of 1,000 ps or more at 100 ° C. or more and 150 ° C. or less 4,000 ps or less.
  • the component-embedded rigid flex substrate according to the third embodiment is the component-embedded rigid flex substrate according to the second embodiment, and a filler is added to the thermosetting resin in the prepreg.
  • the component built-in rigid flex substrate according to the fourth embodiment the component built-in rigid flex substrate according to any of the first to third embodiments, wherein the prepreg is formed on the rigid portion of the flexible base It is stacked only in the corresponding range.
  • the component-embedded rigid flex substrate according to the fifth embodiment is the component-embedded rigid flex substrate according to any of the first to third embodiments, wherein the prepreg is formed from the rigid portion of the flexible base material. It laminates over the range corresponding to a flexible part.
  • the component built-in rigid flex substrate according to the sixth embodiment the component built-in rigid flex substrate according to the fifth embodiment is provided, and the prepreg is made of a polyimide resin or an epoxy resin of polyimide skeleton as a thermosetting resin. It is used.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

L'invention concerne un substrat rigide-souple (1) équipé d'un élément incorporé (2). Ledit substrat rigide-souple (1), qui comporte une section rigide (3) dans laquelle l'élément (2) est incorporé et une section souple (4), contient les éléments suivants : un substrat souple (10) qui comprend une couche isolante (11) sur laquelle sont stratifiées des feuilles de cuivre (12, 13) et qui présente, dans sa zone correspondant à la section rigide (3), une ouverture (17) qui peut recevoir l'élément (2) ; et un pré-imprégné (20) qui est disposé de manière à couvrir au moins une partie d'une surface ou des deux surfaces du substrat souple (4) et qui, avec l'élément (2) logé dans l'ouverture (17), remplit l'intérieur de ladite ouverture (17).
PCT/JP2014/062202 2014-05-02 2014-05-02 Substrat rigide-souple à élément incorporé WO2015166588A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/062202 WO2015166588A1 (fr) 2014-05-02 2014-05-02 Substrat rigide-souple à élément incorporé

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2014/062202 WO2015166588A1 (fr) 2014-05-02 2014-05-02 Substrat rigide-souple à élément incorporé

Publications (1)

Publication Number Publication Date
WO2015166588A1 true WO2015166588A1 (fr) 2015-11-05

Family

ID=54358339

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2014/062202 WO2015166588A1 (fr) 2014-05-02 2014-05-02 Substrat rigide-souple à élément incorporé

Country Status (1)

Country Link
WO (1) WO2015166588A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20170196094A1 (en) * 2015-12-30 2017-07-06 AT&S Austria Electronic component packaged in a flexible component carrier
CN107046771A (zh) * 2017-05-30 2017-08-15 邹时月 一种埋入式电路板的制造方法
CN107105570A (zh) * 2016-02-22 2017-08-29 太阳诱电株式会社 电路板及其制造方法
US10058125B2 (en) 2015-10-13 2018-08-28 Rai Strategic Holdings, Inc. Method for assembling an aerosol delivery device
CN109429431A (zh) * 2017-08-22 2019-03-05 太阳诱电株式会社 电路基板
CN109427731A (zh) * 2017-08-22 2019-03-05 太阳诱电株式会社 电路基板
WO2021127845A1 (fr) * 2019-12-23 2021-07-01 瑞声声学科技(深圳)有限公司 Carte de circuit imprimé souple

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231795Y2 (fr) * 1985-02-28 1990-08-28
JPH07231165A (ja) * 1994-02-15 1995-08-29 Hitachi Cable Ltd 多層配線基板及びその製造方法
JPH0837378A (ja) * 1994-07-21 1996-02-06 Hitachi Chem Co Ltd キャビティ付多層配線板の製造法
JPH0946050A (ja) * 1995-07-26 1997-02-14 Matsushita Electric Works Ltd 多層基板
JPH1154927A (ja) * 1997-06-03 1999-02-26 Toshiba Corp 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
JP2002246748A (ja) * 2001-02-16 2002-08-30 Nippon Mektron Ltd フレキシブルプリント基板およびその製造方法
JP2002271037A (ja) * 2001-03-12 2002-09-20 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2007273654A (ja) * 2006-03-31 2007-10-18 Sumitomo Bakelite Co Ltd フレキシブル回路基板、フレキシブル回路基板の製造方法および電子機器
JP2008034588A (ja) * 2006-07-28 2008-02-14 Dainippon Printing Co Ltd 多層プリント配線板及びその製造方法
WO2012140964A1 (fr) * 2011-04-14 2012-10-18 株式会社村田製作所 Substrat multicouche flexible avec composants électroniques incorporés

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0231795Y2 (fr) * 1985-02-28 1990-08-28
JPH07231165A (ja) * 1994-02-15 1995-08-29 Hitachi Cable Ltd 多層配線基板及びその製造方法
JPH0837378A (ja) * 1994-07-21 1996-02-06 Hitachi Chem Co Ltd キャビティ付多層配線板の製造法
JPH0946050A (ja) * 1995-07-26 1997-02-14 Matsushita Electric Works Ltd 多層基板
JPH1154927A (ja) * 1997-06-03 1999-02-26 Toshiba Corp 複合配線基板、フレキシブル基板、半導体装置、および複合配線基板の製造方法
JP2002246748A (ja) * 2001-02-16 2002-08-30 Nippon Mektron Ltd フレキシブルプリント基板およびその製造方法
JP2002271037A (ja) * 2001-03-12 2002-09-20 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2007273654A (ja) * 2006-03-31 2007-10-18 Sumitomo Bakelite Co Ltd フレキシブル回路基板、フレキシブル回路基板の製造方法および電子機器
JP2008034588A (ja) * 2006-07-28 2008-02-14 Dainippon Printing Co Ltd 多層プリント配線板及びその製造方法
WO2012140964A1 (fr) * 2011-04-14 2012-10-18 株式会社村田製作所 Substrat multicouche flexible avec composants électroniques incorporés

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10058125B2 (en) 2015-10-13 2018-08-28 Rai Strategic Holdings, Inc. Method for assembling an aerosol delivery device
US20170196094A1 (en) * 2015-12-30 2017-07-06 AT&S Austria Electronic component packaged in a flexible component carrier
WO2017114917A1 (fr) * 2015-12-30 2017-07-06 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Composant électronique conditionné dans un support de composant souple
JP2018046297A (ja) * 2016-02-22 2018-03-22 太陽誘電株式会社 回路基板
JP2017152692A (ja) * 2016-02-22 2017-08-31 太陽誘電株式会社 回路基板及びその製造方法
JP2017201732A (ja) * 2016-02-22 2017-11-09 太陽誘電株式会社 回路基板及びその製造方法
CN107105570A (zh) * 2016-02-22 2017-08-29 太阳诱电株式会社 电路板及其制造方法
JP2018046298A (ja) * 2016-02-22 2018-03-22 太陽誘電株式会社 回路基板及び回路モジュール
CN107105570B (zh) * 2016-02-22 2019-07-23 太阳诱电株式会社 电路板及其制造方法
CN107046771A (zh) * 2017-05-30 2017-08-15 邹时月 一种埋入式电路板的制造方法
CN109429431A (zh) * 2017-08-22 2019-03-05 太阳诱电株式会社 电路基板
CN109427731A (zh) * 2017-08-22 2019-03-05 太阳诱电株式会社 电路基板
CN109429431B (zh) * 2017-08-22 2021-04-27 太阳诱电株式会社 电路基板
CN109427731B (zh) * 2017-08-22 2021-06-04 太阳诱电株式会社 电路基板
WO2021127845A1 (fr) * 2019-12-23 2021-07-01 瑞声声学科技(深圳)有限公司 Carte de circuit imprimé souple

Similar Documents

Publication Publication Date Title
WO2015166588A1 (fr) Substrat rigide-souple à élément incorporé
JP4709325B2 (ja) 配線板及びその製造方法
JP6303443B2 (ja) Ｉｃ内蔵基板の製造方法
US8178191B2 (en) Multilayer wiring board and method of making the same
US9066439B2 (en) Wiring board and method for manufacturing the same
WO2010007704A1 (fr) Carte de câblage flexorigide et dispositif électronique
KR101241544B1 (ko) 인쇄회로기판 및 그의 제조 방법
JP6795137B2 (ja) 電子素子内蔵型印刷回路基板の製造方法
US8186042B2 (en) Manufacturing method of a printed board assembly
KR101569156B1 (ko) 프린트 배선 기판
KR102194721B1 (ko) 인쇄회로기판 및 그 제조 방법
JP6742682B2 (ja) 多層配線基板
KR101905879B1 (ko) 인쇄회로기판 및 그의 제조 방법
JP2006128360A (ja) プリント配線板およびその製造方法
KR20130102203A (ko) 인쇄회로기판 및 그의 제조 방법
JP5931483B2 (ja) 部品内蔵多層プリント配線板の製造方法、および部品内蔵多層プリント配線板
JP2017028024A (ja) 部品搭載基板、部品内蔵基板、部品搭載基板の製造方法および部品内蔵基板の製造方法
CN106170174B (zh) 印刷基板和电子装置
KR102052761B1 (ko) 칩 내장 기판 및 그 제조 방법
TW201427505A (zh) 具有內埋元件的電路板及其製作方法
CN210157483U (zh) 多层基板
JP2006128226A (ja) 電気部品内蔵多層プリント配線板及びその製造方法
KR20160080871A (ko) 경연성 인쇄회로기판 및 그의 제조 방법
JP2015162626A (ja) プリント配線板およびその製造方法
US20070230146A1 (en) Printed-wiring board with built-in component, manufacturing method of printed-wiring board with built-in component, and electronic device

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 14890831

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 14890831

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP