WO2015146476A1 - 実装用基板及びその製造方法、並びに、部品実装方法 - Google Patents
実装用基板及びその製造方法、並びに、部品実装方法 Download PDFInfo
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- WO2015146476A1 WO2015146476A1 PCT/JP2015/055785 JP2015055785W WO2015146476A1 WO 2015146476 A1 WO2015146476 A1 WO 2015146476A1 JP 2015055785 W JP2015055785 W JP 2015055785W WO 2015146476 A1 WO2015146476 A1 WO 2015146476A1
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- 238000000034 method Methods 0.000 title claims description 131
- 238000004519 manufacturing process Methods 0.000 title claims description 71
- 239000000758 substrate Substances 0.000 claims description 351
- 229910000679 solder Inorganic materials 0.000 claims description 82
- 230000004907 flux Effects 0.000 claims description 78
- 239000011521 glass Substances 0.000 claims description 19
- 238000005530 etching Methods 0.000 claims description 18
- 230000014509 gene expression Effects 0.000 claims description 18
- 238000009792 diffusion process Methods 0.000 claims description 17
- 230000001681 protective effect Effects 0.000 claims description 16
- 230000002265 prevention Effects 0.000 claims description 13
- 238000007639 printing Methods 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 238000005240 physical vapour deposition Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 239000010410 layer Substances 0.000 description 110
- 239000000463 material Substances 0.000 description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 14
- 239000010949 copper Substances 0.000 description 10
- 238000004544 sputter deposition Methods 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 8
- 238000005553 drilling Methods 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 7
- 239000011247 coating layer Substances 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 5
- 239000011651 chromium Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 239000011159 matrix material Substances 0.000 description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- 229910018487 Ni—Cr Inorganic materials 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000001133 acceleration Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000002585 base Substances 0.000 description 4
- 239000000788 chromium alloy Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 239000011810 insulating material Substances 0.000 description 4
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 230000002730 additional effect Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052839 forsterite Inorganic materials 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
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- H—ELECTRICITY
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16238—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bonding area protruding from the surface of the item
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
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- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
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- H01L2924/1904—Component type
- H01L2924/19042—Component type being an inductor
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- H01L2924/1904—Component type
- H01L2924/19043—Component type being a resistor
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
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- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
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- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
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- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
- H05K2203/1394—Covering open PTHs, e.g. by dry film resist or by metal disc
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present disclosure relates to a mounting board, a manufacturing method thereof, and a component mounting method.
- a double-sided copper-clad laminate for printed wiring boards (hereinafter referred to as “glass-epoxy copper-clad laminate”) composed of a glass cloth base epoxy resin
- the wiring formed on both sides is usually formed by through holes. Connecting.
- a through hole is formed by forming a copper layer on the inner wall of the through hole by an electroless plating method and an electrolytic plating method. obtain.
- ⁇ Glass epoxy copper clad laminates have poor dimensional stability in response to demands for high-density mounting of micro components.
- Japanese Patent Application Laid-Open No. 2002-324958 discloses a method of filling a through hole using a conductive paste instead of the electroless plating method and the electrolytic plating method.
- a solder layer is often formed on the component mounting portion on which the component is to be mounted, then flux is applied, the solder layer is melted, and the component is mounted via the solder layer.
- a component mounting method for mounting on a part is adopted.
- the flux is partially applied to a desired position by a printing method or the like.
- the positional accuracy of the pattern formed by such a method has a large tolerance of about several tens of ⁇ m, and when the connection pitch itself is reduced to about several tens of ⁇ m, it is difficult to apply such a method.
- a method of applying a flux to the entire surface as disclosed in JP 2010-123780 is employed.
- a first object of the present disclosure is to provide a mounting board having a configuration and structure in which a component is not easily tilted during component mounting, a manufacturing method thereof, and a component mounting method.
- a second object of the present disclosure is to provide a mounting board having a structure and structure that do not hinder the mounting of components and a manufacturing method thereof.
- the mounting substrate according to the first aspect or the second aspect of the present disclosure for achieving the first object described above A through hole formed in the substrate, A first land portion formed on the first surface of the substrate and surrounding the through hole; and a second land portion formed on the second surface of the substrate facing the first surface and surrounding the through hole; Formed on the first surface of the substrate and connected to the first land portion (or connected to the wiring extending from the first land portion), and formed on the second surface of the substrate; A second component mounting portion connected to the second land portion (or wiring extending from the second land portion), A conductive layer formed on the inner wall of the through-hole and conducting between the first land portion and the second land portion; and A filling member filled in a part of the through hole, It has.
- the mounting substrate according to the first aspect of the present disclosure includes the following (Requirement-1). Further, in the mounting substrate according to the second aspect of the present disclosure, a flux having an average thickness d is applied to the first surface side of the substrate, and the following equation (2) (Requirement-2) ) Is determined such that the shortest distance allowable value L 0 is satisfied.
- (Requirement-1) The volume of the portion of the through hole located above the top surface of the filling member on the first land portion side (the recessed portion on the top surface of the filling member on the first land portion side), mounted on the first component mounting portion Based on the length of the component to be mounted and the inclination of the component to be mounted on the first component mounting portion with respect to the first surface of the substrate (specifically, for example, based on the maximum allowable value of the inclination), the first The shortest distance allowable value from the center of the land portion to the part is determined. In some cases, the shortest distance allowable value from the center of the first land portion to the part may be determined based on the thickness of the flux (specifically, for example, the average thickness).
- the mounting substrate according to the third aspect of the present disclosure for achieving the second object is as follows.
- the mounting substrate manufacturing method for achieving the first object is as follows. After forming the through hole in the substrate, On the first surface of the substrate, a first land portion surrounding the through-hole and a first component attachment portion connected to the first land portion are formed, and the second surface of the substrate facing the first surface A second land portion surrounding the through hole and a second component attachment portion connected to the second land portion are formed on the first land portion and the second land portion on the inner wall of the through hole. A conductive layer is formed, and then, Filling a part of the through hole with a filling member; It is the manufacturing method of the mounting board
- the mounting substrate according to the first aspect of the present disclosure includes (Requirement-1) described above.
- a step of applying a flux having an average thickness d to the first surface side of the substrate after filling a part of the through hole with the filling member is determined so as to satisfy Equation (2) of (Requirement-2).
- the mounting substrate manufacturing method for achieving the second object described above, After forming the through hole in the substrate, On the first surface of the substrate, a first land portion surrounding the through-hole and a first component attachment portion connected to the first land portion are formed, and the second surface of the substrate facing the first surface Forming a second land portion surrounding the through hole and a second component attachment portion connected to the second land portion; Filling the through-hole with a filling member made of a conductive material, and thereby electrically connecting the first land portion and the second land portion; A method of manufacturing a mounting board comprising each step, A slope inclined toward the through hole is formed in a portion of the substrate where the second land portion is to be formed.
- the component mounting method according to the first aspect or the second aspect of the present disclosure for achieving the first object is as follows. After forming the through hole in the substrate, On the first surface of the substrate, a first land portion surrounding the through-hole and a first component attachment portion connected to the first land portion are formed, and the second surface of the substrate facing the first surface A second land portion surrounding the through hole and a second component attachment portion connected to the second land portion are formed on the first land portion and the second land portion on the inner wall of the through hole.
- a conductive layer is formed, and then, After filling a part of the through hole with the filling member, A solder layer or a solder diffusion prevention layer is formed on the part of the first component mounting portion on which the component is to be mounted, and then flux is applied to the first surface side of the substrate, The component is mounted on the part of the first component mounting portion where the component is to be mounted through the solder layer or the solder diffusion prevention layer.
- This is a component mounting method including each process.
- the mounting substrate according to the first aspect of the present disclosure includes (Requirement-1) described above.
- a flux having an average thickness d is applied, and the shortest distance allowable value is satisfied so as to satisfy Expression (2) of (Requirement-2) above. L 0 is determined.
- the mounting substrate, the manufacturing method thereof, and the component mounting method according to the first aspect of the present disclosure include (Requirement-1), and the mounting substrate, the manufacturing method, and the component according to the second aspect of the present disclosure
- the shortest distance allowable value L 0 is determined and determined so as to satisfy the expression (2) of (Requirement-2).
- the filling member since the inclined surface that is inclined toward the through hole is formed in the portion of the substrate located under the second land portion, the filling member It is possible to improve the reliability of the electrical connection between the first land portion and the second land portion, and since it is not necessary to greatly raise the filling member on the land portion, there is no need to polish and remove the filling member, There is no problem that the substrate is damaged. Note that the effects described in the present specification are merely examples and are not limited, and may have additional effects.
- 1A and 1B are a schematic partial cross-sectional view of a mounting board of Example 1 after component mounting, and a mounting board of Example 1 after filling a part of a through hole with a filling member, respectively. It is a typical partial top view of these.
- 2A and 2B are a schematic partial cross-sectional view of the mounting substrate of Example 1 after forming through holes and the like in the substrate, and Example 1 before filling the through holes with a filling member, respectively. It is a typical fragmentary sectional view of the board
- 3A and 3B are schematic partial cross-sectional views of the mounting substrate of Example 1 after filling the through holes with the filling member, respectively.
- FIG. 4A and 4B are a schematic partial end view of the mounting substrate of Example 1 after filling the through hole with the filling member, and a state in which the flux is applied to the first surface side of the substrate, respectively.
- FIG. 3 is a schematic partial end view of the mounting substrate according to the first embodiment.
- 5A and 5B are a schematic partial end view of the mounting substrate of Example 1 in a state where the first component is disposed on the first component mounting portion, and the implementation shown in FIG. 6 is a schematic partial end view of a modification of the mounting board of Example 1.
- FIG. 6A and 6B schematically show a state in which the flux applied to the first surface side of the substrate flows into the portion (space) of the through hole located above the top surface of the filling member on the first land portion side.
- FIG. 7A and 7B are conceptual diagrams showing a state in which the flux applied on the base flows into the through hole portion (space) located above the top surface of the filling member on the first land portion side.
- FIG. 8 is a diagram for explaining a state in which the flux applied to the first surface side of the substrate flows into the through hole portion (space) located above the top surface of the filling member on the first land portion side.
- FIG. 9 shows a state in which the flux applied to the first surface side of the substrate flows into the through hole portion (space) located above the top surface of the filling member on the first land portion side, following FIG. It is a conceptual diagram for demonstrating.
- FIG. 8 is a diagram for explaining a state in which the flux applied to the first surface side of the substrate flows into the through hole portion (space) located above the top surface of the filling member on the first land portion side.
- FIG. 9 shows a state in which the flux applied to the first surface side of the substrate flows into the through hole portion (space) located above the top surface of the
- FIG. 10 is a schematic partial cross-sectional view of the mounting board of Example 2 after component mounting.
- 11A and 11B are a schematic partial cross-sectional view of the mounting substrate of Example 2 after forming through holes and the like in the substrate, and Example 2 before filling the through holes with a filling member, respectively. It is a typical fragmentary sectional view of the board
- 12A and 12B are schematic partial end views of the mounting substrate of Example 2 after the through hole is filled with the filling member.
- 13A and 13B are a schematic partial end view of the mounting substrate of Example 2 after filling the through hole with the filling member, and a state in which the flux is applied to the first surface side of the substrate, respectively.
- FIG. 6 is a schematic partial end view of a mounting substrate of Example 2.
- FIG. 14 is a schematic partial end view of the mounting board according to the second embodiment in a state where the first component is disposed on the first component mounting portion.
- 15A and 15B are schematic partial end views showing a state in which flux is applied to the first surface side of the substrate in the mounting substrate of another modification example of Example 1 after component mounting, and It is a typical partial end view which shows the state after component mounting.
- FIG. 16 is a schematic partial plan view of still another modified example of the mounting board of Example 1 after filling a part of the through hole with the filling member.
- FIG. 17 is a graph showing the results of examining the relationship between the light emitting element luminance and light extraction efficiency and the inclination of the light emitting element when the mounting substrate is viewed at an angle of 45 degrees with respect to the mounting substrate.
- Example 1 Mounting board according to first to second aspects of the present disclosure and manufacturing method thereof, and component mounting method according to first to second aspects of the present disclosure
- Example 2 mounting substrate and manufacturing method thereof according to the third aspect of the present disclosure
- the mounting substrate and the manufacturing method thereof according to the first aspect of the present disclosure and the component mounting method according to the first aspect of the present disclosure are collectively referred to as “first aspect of the present disclosure”.
- the mounting substrate according to the second aspect of the present disclosure, the manufacturing method thereof, and the component mounting method according to the second aspect of the present disclosure are collectively referred to as “the second aspect of the present disclosure”.
- the mounting substrate and the manufacturing method thereof according to the third aspect of the present disclosure may be collectively referred to as “third aspect of the present disclosure”.
- the value of the length L 1 of the component to be mounted on the first component mounting portion can be exemplified by 0.01 mm to 1 mm, and the value of the average thickness d of the flux can be exemplified by 0.001 ⁇ m to 0.1 ⁇ m.
- Examples of the value of the radius r 0 of the through hole are 0.01 mm to 1 mm.
- the value of the volume V h of the portion of the through hole located above the top surface of the filling member on the first land portion side (the recessed portion on the top surface of the filling member on the first land portion side) is the value of the through hole It depends on the value of the radius r 0 , the material constituting the filling member, the method of filling the filling member, and the like.
- the portion of the through hole located above the top surface of the filling member on the first land portion side (of the filling member on the first land portion side) The volume of the concave portion on the top surface is V h , the length of the component to be mounted on the first component mounting portion is L 1 , and the inclination of the component to be mounted on the first component mounting portion with respect to the first surface of the substrate (Specifically, the maximum allowable slope value is ⁇ max ), and the shortest distance allowable value from the center of the first land portion to the part is L 0 , so that the shortest distance satisfies the following expression (1).
- a mode in which the distance allowable value L 0 is determined may be adopted. In this case, the value of ⁇ max can be 30 degrees.
- the first land portion, the second land portion, the first component attaching portion, and the second component attaching portion may be formed of a first member made of a metal or an alloy
- the filling member may be formed of a second member different from the first member.
- the coefficient of thermal expansion of the substrate is CTE 0
- the coefficient of thermal expansion of the first member is CTE 1
- the coefficient of thermal expansion of the second member is CTE 2
- CTE 0 ⁇ CTE 1 ⁇ CTE 2 Can be obtained.
- the first member is made of at least one material selected from the group consisting of aluminum, aluminum alloy, nickel, nickel alloy, chromium and chromium alloy, copper and copper alloy
- the second member is A conductive paste (specifically, low-temperature fired paste or thick film printing paste, more specifically, for example, Ag paste, Cu paste, Ag—Pd paste) can be used.
- a conductive paste specifically, low-temperature fired paste or thick film printing paste, more specifically, for example, Ag paste, Cu paste, Ag—Pd paste
- the electrical resistance value of the filling member is preferably smaller than the electrical resistance value of the conductive layer.
- the radius value of the filling member is preferably larger than the thickness value of the conductive layer.
- the conductive layer can be composed of an extending portion of the first member constituting the first land portion and an extending portion of the first member constituting the second land portion.
- a conductive paste (specifically, a low-temperature fired paste or a thick film printing paste, more specifically, for example, an Ag paste, a Cu paste, (Ag—Pd paste).
- resin which does not have electroconductivity an epoxy resin, a phenol resin, a novolak resin, a polyimide resin, an acrylic resin, and a liquid crystal polymer can be mentioned, for example.
- CTE 0 3 ⁇ 10 ⁇ 6 / K to 1.5 ⁇ 10 ⁇ 5 / K
- CTE 1 3 ⁇ 10 ⁇ 6 / K to 5 ⁇ 10 ⁇ 5 / K
- CTE 2 1 ⁇ 10 ⁇ 5 / K to 2 ⁇ 10 ⁇ 4 / K
- a mounting substrate according to the first to third aspects of the present disclosure including the preferred embodiments described above, or the component mounting method according to the first to second aspects of the present disclosure.
- a printing method for example, a screen printing method
- a dispenser for example, a screen printing method
- the etching technique includes a combination of an etching mask formation technique and a wet etching technique or a dry etching technique.
- an etching mask formation technique for example, formation of an etching resist layer based on a printing technique using a resist ink (for example, a screen printing technique), formation of an etching resist layer based on a photolithography technique using a photosensitive resin, An example is formation of a resist layer for etching using a dry film.
- the component mounting method according to the first aspect to the second aspect of the present disclosure can be configured to fill the through hole with the filling member in a state where the protective film is bonded to the first surface of the substrate.
- a slope inclined toward the through hole can be formed in the portion of the substrate where the second land portion is to be formed.
- the part of the board located under the second land part is directed toward the through hole. It can be set as the form in which the inclined slope is formed. In these cases, the thickness of the flat portion of the land portion is preferably equal to the thickness of the inclined portion of the land portion.
- the thickness of the second land portion and the thickness of the second component attachment portion are preferably equal.
- the thickness of the flat portion of the land portion and the thickness of the inclined portion of the land portion are “equal”.
- the thickness of the flat portion of the land portion is t 1
- the thickness of the inclined portion of the land portion is t 2 .
- the first surface side of the substrate may include the above (Requirement-1), and may further include the above (Requirement-1).
- the shortest distance allowable value L 0 can be determined so as to satisfy the above-described expression (1).
- the second land portion is formed by etching the substrate after forming the through hole. It can be set as the form which forms the slope which inclined toward the through-hole in the part of the board
- hydrofluoric acid may be used for etching the substrate.
- a desired inclined structure can be obtained by controlling the flow of the etching solution and selecting a resist mask pattern.
- the through hole of the filling member is formed in a state where the protective film is bonded to the first surface of the substrate. It can be set as the form which performs filling.
- a component to be mounted (or mounted) on the first component mounting portion for convenience, “first component”
- a light emitting diode (LED) can be mentioned as a light emitting element.
- An image display device can be configured by arranging a plurality of light emitting elements on a substrate in a two-dimensional matrix.
- the image display device may be a so-called tiling type image display device in which a plurality of mounting substrates on which light emitting elements are arranged are juxtaposed.
- a sensor array can be configured by arranging a plurality of sensors on a substrate.
- a component to be mounted (or mounted) on the second component mounting portion for example, an electronic device including a circuit for driving / controlling the first component Can do.
- One second component may drive and control one first component, or may drive and control a plurality of first components.
- the second component can be composed of at least one component selected from the group consisting of a semiconductor device, a transistor, a diode, a resistance element, and a capacitor element (capacitance element). A combination of these can also be used.
- the first component is at least selected from the group consisting of a light emitting element and a sensor, and various components described as the second component (ultra-small semiconductor device, transistor, diode, resistor element, capacitor element (capacitance element)) It may be composed of a single type of component, or may be a combination of any of these and may be referred to as a “third component” for convenience.
- the first component may be composed of a so-called passive element, and the substrate provided with the first component can be used as, for example, a kind of switch (switcher) or branching device.
- the second component may be formed between a plurality of insulating layers formed on the first surface of the substrate.
- the light emitting diode can be a light emitting diode having a known configuration and structure. That is, a light emitting diode having an optimal configuration and structure and made of an appropriate material may be selected depending on the light emitting color of the light emitting diode.
- a light emitting unit composed of a red light emitting diode functions as a red light emitting subpixel
- a light emitting unit composed of a green light emitting diode functions as a green light emitting subpixel.
- the light-emitting portion composed of a blue light-emitting diode functions as a blue light-emitting subpixel, and one pixel is constituted by these three types of subpixels, and a color image can be displayed depending on the light emission state of these three types of subpixels.
- examples of the arrangement of the three types of subpixels include a delta arrangement, a stripe arrangement, a diagonal arrangement, and a rectangle arrangement. And what is necessary is just to drive a light emitting diode by constant current based on the PWM drive method, for example.
- the first panel is composed of a light emitting unit made of a red light emitting diode
- the second panel is composed of a light emitting unit made of a green light emitting diode
- the third panel is made of a blue light emitting diode. It is also possible to apply the light from these three panels to a projector that uses, for example, a dichroic prism.
- the sensor detects visible light, a sensor that detects infrared light, a sensor that detects ultraviolet light, a sensor that detects X-rays, a sensor that detects atmospheric pressure, and a sensor that detects temperature And a sensor for detecting sound, a sensor for detecting vibration, a sensor for detecting acceleration, and a sensor for detecting angular acceleration (so-called gyro sensor).
- the substrate may be formed of a glass substrate.
- the glass substrate specifically, high strain point glass, soda glass (Na 2 O ⁇ CaO ⁇ SiO 2 ), borosilicate glass (Na 2 O ⁇ B 2 O 3 ⁇ SiO 2 ), forsterite ( 2MgO.SiO 2 ), lead glass (Na 2 O.PbO.SiO 2 ), alkali-free glass, and synthetic quartz glass can be exemplified.
- the thickness of the substrate include 0.05 mm to 1.8 mm.
- a slope inclined toward the through hole may be formed in a portion of the substrate located under the first land portion.
- the thickness of the flat portion of the first land portion is preferably equal to the thickness of the inclined portion of the first land portion.
- the shape is a kind of cylindrical shape (column) having a radius r 0 .
- Examples of the external shape of the first land portion and the second land portion include a circular shape, an elliptical shape, a rectangular shape, a rounded rectangular shape, a polygonal shape, and a rounded polygonal shape. be able to.
- a through hole is located at the center of the land portion.
- the members constituting the first land part and the second land part extend to the inner wall of the through hole. However, it is not essential to make the first land portion and the second land portion conductive.
- the first component mounting portion and the second component mounting portion are portions where components are mounted, and the planar shapes of the first component mounting portion and the second component mounting portion are the connection terminal portions and connections of the components to be mounted. What is necessary is just to determine (design) suitably according to the shape of a part (henceforth a "connection terminal part etc.”).
- the number of first component mounting portions is equal to the number of connection terminal portions and the like of the first component to be mounted, and the number of second component mounting portions is the connection terminal of the second component to be mounted. It is equal to the number of parts.
- the first component mounting portion and the second component mounting portion are usually connected to a peripheral circuit and / or a power source.
- the peripheral circuit and the power source may be known peripheral circuits and power sources, and an appropriate peripheral circuit and power source may be selected based on the components to be mounted.
- a solder layer may be formed on the portion of the first component mounting portion where the first component is to be mounted and the portion of the second component mounting portion where the second component is to be mounted.
- the planar shape of the solder layer for example, a shape having a protruding portion extending outward from the center portion of the solder layer can be exemplified.
- the protrusion is disposed so as to be rotationally symmetric at least three times from the center, the tip of the protrusion is disposed on the circumference centered on the center, and the center is circular.
- a certain shape can be illustrated.
- the solder layer is a known solder resist material, an insulating film made of an organic insulating material such as polyimide, or an insulating film made of an inorganic insulating material such as silicon oxide or silicon nitride (hereinafter collectively referred to as these). (It may be called “coating layer”).
- a solder layer may be formed on the component side to be attached, and a solder diffusion preventing layer called an under bump metal layer may be formed on the component attaching portion, thereby joining the solder layer and the solder diffusion preventing layer.
- the under bump metal layer for example, when the base metal is copper, a nickel layer, a gold layer, a tin layer, a palladium layer, or a laminated structure of these layers (for example, a two-layer structure of nickel and gold, nickel-gold) -Palladium three-layer structure) or the like can be used.
- the inclination angle of the inclined surface inclined toward the through hole can be exemplified by 50 to 80 degrees, and the inclined surface length can be exemplified by 0.005 mm to 0.33 mm.
- the present invention is not limited to these.
- the through hole can be formed, for example, based on a drilling method using a drill, or can be formed based on a drilling method using a laser beam.
- the inner wall of the through hole may be smoothed by performing etching, for example.
- the flux may be a known flux
- the flux application method may be a known application method.
- the solder layer may be formed from a known solder material such as a lead-free solder material based on a known method (for example, a solder plating method or a solder paste printing method), and a component mounting method via the solder layer may also be used.
- a well-known mounting method may be used. Specifically, for example, the components may be mounted based on the solder reflow method. What is necessary is just to use an adhesive tape with good peelability after bonding as a protective film.
- a masking tape used to partially protect the base material can be used, and in order to further improve the releasability, for example, to temporarily hold a semiconductor wafer
- the ultraviolet peeling tape used etc. can be used. Bonding of the protective film can be performed based on a known method, for example, a method using a laminator. As described above, a solder layer is formed on the component side to be attached, and a solder diffusion prevention layer called an under bump metal layer is formed on the component attachment portion, and the solder layer and the solder diffusion prevention layer are joined. You can also.
- the substrate can be a double-sided wiring substrate in which various circuits are formed on the first surface and the second surface, or can be a so-called multilayer wiring substrate.
- an interlayer insulating layer may be provided between the wiring layers. What is necessary is just to coat
- the “volume of the portion of the through hole located above the top surface of the filling member on the first land portion side” in the above (Requirement-1) is more specifically, for example, on the first land portion side
- the volume of the space surrounded by the top surface of the filling member, the first land portion, and the inner wall of the through hole (conductive layer), or the volume of the concave portion of the top surface of the filling member on the first land portion side Point to.
- the “length” of the first component is the first length along a straight line connecting one connection terminal portion and the center of the first land portion when there is one connection terminal portion or the like of the first component. 1 part length.
- the first component has two connection terminal portions and the like, it is the length of the first component along a straight line connecting the two connection terminal portions and the like. Furthermore, when the first component has three or more connection terminal portions, the three or more connection terminal portions are appropriately divided into two groups, and the two groups of connection terminals are arranged along the shortest distance. The length of the first part.
- Example 1 relates to a mounting substrate and a manufacturing method thereof according to the first and second aspects of the present disclosure, and a component mounting method according to the first and second aspects of the present disclosure.
- FIG. 1A shows a schematic partial cross-sectional view of the mounting board of Example 1 after mounting the components, and a schematic partial plan view of the mounting board after the filling member fills a part of the through hole. Is shown in FIG. 1B.
- the mounting substrate of Example 1 is A through hole 13 formed in the substrate 10, A first land portion 21 formed on the first surface 11 of the substrate 10 and surrounding the through hole 13, and a second surface 12 of the substrate 10 facing the first surface 11 and surrounding the through hole 13.
- Second land portion 31 A first component mounting portion 22 formed on the first surface 11 of the substrate 10 and connected to the first land portion 21, and a second land portion 31 formed on the second surface 12 of the substrate 10.
- a second component mounting portion 32 connected to A conductive layer 14 formed on the inner wall of the through-hole 13 and conducting the first land portion 21 and the second land portion 31; and A filling member 15 filled in a part of the through-hole 13, It has.
- the mounting substrate of Example 1 includes the following (Requirement-1), and further (Requirement-1).
- the shortest distance allowable value L 0 is determined so as to satisfy the expression (1) in FIG.
- the flux 40 having the average thickness d is applied to the first surface side of the substrate 10 in the mounting substrate of the first embodiment. Therefore, the shortest distance allowable value L 0 is determined so as to satisfy Expression (2) of the following (Requirement-2).
- each of the first component mounting portion and the second component mounting portion is a pair, and the first component mounting portions 22, 23 and the second component. Represented by attachment portions 32 and 33.
- the first component mounting portion 23 and the second component mounting portion 33 are connected to, for example, a peripheral circuit and / or a power source.
- the volume V h of these portions is referred to as “space 13 ′” for the sake of convenience, and a large number of mounting boards are manufactured as prototypes, and the volume V h of the space 13 ′ in the multiple through holes 13 is measured. Can be sought.
- the radius r 0 of the through hole 13, the length L 1 of the first component 51 to be mounted on the first component mounting portions 22 and 23, and the thickness of the flux 40 is a design matter determined by specifications and the like required for the mounting substrate.
- the inclination (for example, the maximum allowable value ⁇ max of the inclination) of the component (first component) 51 to be mounted on the first component mounting portions 22 and 23 with respect to the first surface 11 of the substrate 10 is also the mounting substrate.
- the first component 51 is composed of a light emitting element, specifically, a minute light emitting diode (LED) having an overall size of 0.1 mm or less. If such a minute first component 51 is tilted before mounting, the luminance of the light-emitting element when viewed from the mounting substrate is lowered, and the specification may not be satisfied.
- the inclination before the first component 51 is mounted (specifically, for example, the maximum allowable value of the inclination) is, for example, 30 degrees. Therefore, specifically, as the maximum allowable value ⁇ max , for example, 30 degrees can be given.
- FIG. 17 shows the results of examining the relationship between the luminance and light extraction efficiency of the light-emitting element and the inclination of the light-emitting element when the mounting substrate is viewed at an angle of 45 degrees with respect to the mounting substrate.
- the horizontal axis in FIG. 17 is the tilt angle of the light emitting element
- the vertical axis is the luminance at 45 degrees (see “A” in FIG. 17) and the light extraction efficiency (see “B” in FIG. 17). is there.
- the maximum allowable value ⁇ max is specifically set to 30 degrees, for example.
- an image display device is configured by arranging first components 51 made of a plurality of light emitting elements on a substrate 10 in a two-dimensional matrix.
- the second component to be mounted (or mounted) on the second component mounting portions 32 and 33 drives and controls the first component 51, for example.
- the electronic device includes a circuit, specifically, a semiconductor device.
- the second component is larger than the first component 51, and the second component is temporarily fixed to the second component mounting portions 32 and 33 using, for example, an adhesive before mounting. The problem of tilting is unlikely to occur. In the drawing, the second component is not shown.
- the first land portion 21, the second land portion 31, the first component mounting portions 22, 23, the second component mounting portions 32, 33, and the conductive layer 14 are made of a metal or an alloy. It is comprised from 1 member, and the filling member 15 is comprised from the 2nd member different from the 1st member.
- the first member is made of copper alone or a film in which copper and nickel, titanium, chromium or the like are laminated
- the second member is made of a resin mainly composed of epoxy.
- the substrate 10 is made of a glass substrate, more specifically, a borosilicate non-alkali glass substrate having a thickness of 0.5 mm.
- the coefficient of thermal expansion of the substrate 10 is CTE 0
- the coefficient of thermal expansion of the first member is CTE 1
- the coefficient of thermal expansion of the second member is CTE 2
- CTE 0 ⁇ CTE 1 ⁇ CTE 2 Satisfied.
- CTE 0 3 ⁇ 10 ⁇ 6 / K
- CTE 1 17 ⁇ 10 -6 / K
- CTE 2 50 ⁇ 10 -6 / K
- the electrical resistance value of the filling member 15 is smaller than the electrical resistance value of the conductive layer 14.
- the conductive layer 14 includes an extending portion of the first member that constitutes the first land portion 21 and an extending portion of the first member that constitutes the second land portion 31.
- the first land portion 21, the second land portion 31, the first component mounting portions 22, 23, and the second component mounting portions 32, 33 are the first made of metal or alloy. It is comprised from the member and the filling member 65 is comprised from the 2nd member different from the 1st member, Here, the 1st member and the 2nd member are comprised from said material.
- the substrate 10 is also composed of the glass substrate.
- FIG. 6A shows a state in which the flux 40 is applied to the first surface side of the substrate 10 and the first component 51 is disposed on the flux 40.
- 7A and 8 show a state in which the flux 40, 40 ′ is applied on the base 100, and the first component 51 is disposed on the flux 40, 40 ′.
- the base 100 includes, for example, first component mounting portions 22 and 23, a solder layer 24, a first land portion 21, and a first surface 11 of the substrate 10, or alternatively, a solder layer. 24, the covering layer 18 (see FIG. 15), and the first land portion 21.
- the volume of the space 13 ′ in the through hole 13 located above the top surface of the filling member 15 on the first land portion (not shown in FIGS.
- V h is set. 7A and 8, the flux 40 ′ is illustrated above the space 13 ′, but actually, the portion of the flux 40 ′ illustrated above the space 13 ′ during the flux application formation. Falls into the space 13 '. Furthermore, when the first component 51 is mounted on the first component mounting portions 22 and 23, the flux enters a fluidized state as the temperature of the flux rises, and the amount of flow into the space 13 ′ increases. Note that the assumed maximum value of the volume of flux flowing toward the space 13 ′ is V 0 .
- the part of this flux is shown with reference number 40 '.
- the first component 51 is arranged on the flux 40, 40 ′, it is closer to the first land portion 21 than the shortest distance allowable value L 0.
- the first component 51 in the flux that is in a flow state, about (1/2) of the volume of the flux immediately below the first component 51 flows out toward the space 13 ′.
- the flux flows concentrically around the first land portion 21 and flows toward the space 13 ′. If the flux flows out and disappears, reliable soldering becomes difficult, so about (1/2) of the volume of the flux immediately below the first component 51 flows toward the space 13 ′. It assumes the worst state.
- FIGS. 6B, 7B and 9 The state after the flux 40 'has flowed out toward the space 13' is shown in FIGS. 6B, 7B and 9.
- FIG. 7A the bottom surface of the truncated cone is circular with a radius (L 0 + L 1 ), the top surface is circular with a radius (L 0 ), and the height is the thickness d of the flux. . Therefore, V 0 can be obtained by the following equation.
- the assumed maximum value of the volume at which the flux can flow into the space 13 ′ is V 0. If this assumed maximum value V 0 of the volume is larger than the volume V h of the space 13 ′, the first component mounting portion 22 is used. , 23, the inclination of the first component 51 to be mounted on the first surface 11 of the substrate 10 can be kept within the maximum allowable value ⁇ max .
- Expression (1) is derived from such a request and Expressions (3) and (4).
- the flux 40 It is possible to reliably prevent the occurrence of the problem that 'flows into the recess (space 13') on the top surface of the filling member 15 and the minute first component 51 before mounting is inclined (FIGS. 1A and 9). reference). If the shortest distance allowable value L 0 does not satisfy the expression (1) in (Requirement-1), as shown in FIG.
- the flux directly below the connection terminal portion 52 provided in the first component 51 is There is a case where a problem occurs in the connection between the connection terminal portion 52 and the solder layer 24 due to the loss.
- the portion of the flux occupying a cylinder (volume: ⁇ ⁇ d ⁇ L 0 2 ) having a radius L 0 and a height d shown in FIGS. 7A and 8 may be a space. If it does not flow into 13 ′, it is possible to reliably prevent the problem that the minute first component 51 before mounting is inclined. In such a request, if the volume ( ⁇ ⁇ d ⁇ L 0 2 ) is larger than the volume V h of the space 13 ′, the first component 51 to be mounted on the first component mounting portions 22, 23. There is no problem in the inclination of the substrate 10 with respect to the first surface 11.
- the flux flows into the recess (space 13 ′) on the top surface of the filling member 15 and becomes minute before mounting. It is possible to reliably prevent the occurrence of the problem that the first component 51 is inclined. If the shortest distance allowable value L 0 does not satisfy the expression (2) of (Requirement-2), the flux immediately below the connection terminal portion 52 provided in the first component 51 is lost, and the connection terminal portion etc. There may be problems with the bonding between 52 and the solder layer 24.
- the shortest distance allowable value L 0 satisfying the expression (2) of (Requirement-2) is obtained, and the obtained shortest distance allowable value is obtained.
- L 0 may be multiplied by ⁇ (specifically, for example, 1.2 times) to obtain a new shortest distance allowable value.
- FIGS. 1A, 2A, 2B, 3A, 3B, 4A, 4B, and 5A This will be described with reference to the drawings, partial end views, and schematic partial plan views of the substrate of FIG. 1B and the like.
- the through hole 13 is formed in the substrate 10 based on a known method.
- the through hole 13 can be formed, for example, based on a drilling method using a drill, or can be formed based on a drilling method using a laser beam.
- the inner wall of the through-hole 13 is roughened by drilling, for example, the inner wall of the through-hole 13 may be smoothed by etching.
- Step-110 Next, on the first surface 11 of the substrate 10, a first land portion 21 surrounding the through hole 13, a first component mounting portion 22 connected to the first land portion 21, and a first component mounting A second land portion 31 that surrounds the through-hole 13 and is attached to the second land portion 31 on the second surface 12 of the substrate 10 that forms the portion 23 and faces the first surface 11.
- the portion 32 and the second component attachment portion 33 are formed, and the conductive layer 14 that connects the first land portion 21 and the second land portion 31 is formed on the inner wall of the through hole 13.
- the first member is formed on the second surface 12 of the substrate 10 from the second surface 12 by sputtering, and then the first member 11 is formed on the first surface 11 of the substrate 10.
- the first member is formed based on the sputtering method.
- a first member is formed on the first surface 11 of the substrate 10 from the first surface 11 to the through hole 13 by sputtering.
- the first member is formed on the second surface 12 of the substrate 10 to the through hole 13 and based on the sputtering method.
- the first member may be deposited.
- the conductive layer 14 can be formed on the inner wall of the through hole 13.
- the first component mounting portions 22, 23, the first land portion 21, the second component mounting portions 32, 33, and the second land portion 31 are formed. In this way, the state shown in FIG. 2A can be obtained.
- a part of the through hole 13 is filled with the filling member 15.
- a masking tape made of a polyethylene terephthalate (PET) film having a detachable acrylic adhesive layer formed on the first surface 11 of the substrate 10 is used as a protective film 16, and a laminator is used. Bond together (see FIG. 2B).
- the through-hole 13 is filled with the filling member 15 from the 2nd surface side of the board
- the filling of the through holes 13 with the filling member 15 can be performed based on a printing method (for example, a screen printing method) or a method using a dispenser.
- a printing method for example, a screen printing method
- the second member constituting the filling member 15 is cured (see FIG. 4A).
- the protective film 16 may be peeled off after the second member is cured.
- the filling member 15 contracts in volume.
- the portion of the through hole 13 located above the top surface of the filling member 15 on the first land portion 21 side has a volume V.
- a space 13 ′ of h is generated.
- a space 13 ′′ is generated in the portion of the through hole 13 located above the top surface of the filling member 15 on the second land portion 31 side.
- solder layer 24 is formed on the first component mounting portions 22 and 23 where the first component 51 is to be mounted.
- the solder layer 34 is also formed on the second component mounting portions 32 and 33 where the second component is to be mounted.
- the solder layers 24 and 34 may be formed from a known solder material such as a lead-free solder material based on a known method (for example, a solder plating method or a solder paste printing method).
- FIG. 1B shows a partial plan view of this state viewed from the first surface side of the substrate 10. You may form a coating layer before formation of a solder layer.
- a flux 40 having an average thickness d is applied to the first surface side of the substrate 10 (see FIG. 4B).
- the flux 40 may be a known flux 40, and the application method of the flux 40 may be a known application method.
- the flux is also applied to the second surface side of the substrate 10, the illustration of the flux applied to the second surface side of the substrate 10 is omitted in the drawing.
- the first component 51 is placed on the first component mounting portions 22 and 23 where the first component 51 is to be mounted based on a well-known method (see FIG. 5A).
- the second component (not shown) is temporarily fixed to the second component mounting portions 32 and 33 using, for example, an adhesive.
- the first component 51 is mounted on the first component mounting portions 22 and 23 where the first component 51 is to be mounted via the solder layers 24 and 34, for example, based on the solder reflow method.
- the second component is mounted on the second component mounting portions 32 and 33 where the two components are to be mounted.
- the mounting substrate (mounting substrate on which components are mounted) of Example 1 shown in FIG. 1A can be obtained.
- a part of the flux 40 flows into the space 13 ′, but the flux 40 remains under the first component 51 and the first component 51 does not tilt.
- the shortest distance allowable value L 0 is determined based on (Requirement-1), and further, the shortest distance allowable value so as to satisfy Expression (1) in (Requirement-1). Since the value L 0 is determined or the shortest distance allowable value L 0 is determined so as to satisfy the expression (2) of (Requirement-2), the filling is performed when a part of the through hole is filled with the filling member. Even when a volume shrinkage occurs in the member and a space (dent) is formed on the top surface of the filling member filled with the through-hole, a flux is applied to the entire surface, and a small first component is mounted via a solder layer. Therefore, it is possible to reliably prevent the problem that the flux flows into the space (dent) on the top surface of the filling member and the minute parts before mounting are inclined.
- the second land portion 31 is formed when the through hole 13 is formed as shown in FIG. 5B.
- a slope 17 inclined toward the through hole 13 may be formed in the portion 10 ′ of the substrate 10 to be formed.
- Reference numeral 17 ′ is a flat portion in the portion 10 ′ of the substrate 10 where the second land portion 31 is to be formed. In this case, it is preferable that the thickness of the flat portion of the second land portion 31 is equal to the thickness of the inclined portion of the second land portion 31.
- Example 2 relates to a mounting substrate and a manufacturing method thereof according to the third aspect of the present disclosure.
- FIG. 10 shows a schematic partial cross-sectional view of the mounting substrate of Example 2 after mounting the components.
- the mounting substrate of Example 2 is A through hole 13 formed in the substrate 10, A first land portion 21 formed on the first surface 11 of the substrate 10 and surrounding the through hole 13, and a second surface 12 of the substrate 10 facing the first surface 11 and surrounding the through hole 13.
- Second land portion 31 A first component mounting portion 22 formed on the first surface 11 of the substrate 10 and connected to the first land portion 21, and a second land portion 31 formed on the second surface 12 of the substrate 10.
- a second component mounting portion 32 connected to A filling member 65 made of a conductive material, filled in the through-hole 13, and electrically connecting the first land portion 21 and the second land portion 31; With A slope 17 inclined toward the through hole 13 is formed in the portion 10 ′ of the substrate 10 located below the second land portion 31.
- Example 2 the thickness of the flat portion of the second land portion 31 and the thickness of the inclined portion of the second land portion 31 are equal.
- the inclination angle of the inclined surface 17 inclined toward the through hole 13 can be exemplified by 50 degrees, and the length of the inclined surface 17 can be exemplified by 0.33 mm.
- the configuration on the first surface side described in Example 1 is adopted as the configuration on the first surface side. That is, even in the second embodiment, on the first surface side of the substrate, the shortest distance allowable value L 0 is determined based on the above (Requirement-1), and further, the above equation (Requirement-1) The shortest distance allowable value L 0 is determined so as to satisfy 1).
- FIGS. 10, 11A, 11B, 12A, 12B, 13A, 13B, and the substrate of FIG. This will be described with reference to the drawings and partial end views.
- a slope 17 inclined toward the through hole 13 is formed in a portion 10 ′ of the substrate 10 where the second land portion 31 is to be formed. That is, after the through hole 13 is formed, for example, an etching mask (not shown) is formed, the substrate 10 is etched using hydrofluoric acid, and then the etching mask is removed, whereby the second land portion is formed.
- An inclined surface 17 inclined toward the through hole 13 can be formed in the portion 10 ′ of the substrate 10 where 31 is to be formed.
- a flat portion 17 ′ is also provided on the portion 10 ′ of the substrate 10 where the second land portion 31 is to be formed.
- Step-220 Next, on the first surface 11 of the substrate 10, a first land portion 21 surrounding the through hole 13, a first component mounting portion 22 connected to the first land portion 21, and a first component mounting A second land portion 31 that surrounds the through-hole 13 and is attached to the second land portion 31 on the second surface 12 of the substrate 10 that forms the portion 23 and faces the first surface 11.
- the part 32 and the second component attachment part 33 are formed.
- the first member is formed on the second surface 12 of the substrate 10 based on the sputtering method, and then the first member is formed on the first surface 11 of the substrate 10 based on the sputtering method. .
- the first member may be formed on the first surface 11 of the substrate 10 based on the sputtering method, and then the first member may be formed on the second surface 12 of the substrate 10 based on the sputtering method.
- the first component mounting portions 22, 23, the first land portion 21, the second component mounting portions 32, 33, and the second land portion 31 are formed.
- the state shown in FIG. 11A can be obtained.
- the through-hole 13 is filled with the filling member 65 made of a conductive material, so that the first land portion 21 and the second land portion 31 are electrically connected.
- the protective film 16 is bonded to the first surface 11 of the substrate 10 using a laminator as in the first embodiment (see FIG. 11B).
- the through-hole 13 is filled with the filling member 65 from the 2nd surface side of the board
- the filling of the through hole 13 with the filling member 65 can be performed based on a printing method (for example, a screen printing method) or a method using a dispenser.
- a printing method for example, a screen printing method
- the second member constituting the filling member 65 is cured (see FIG. 13A). After curing the second member, the protective film 16 may be peeled off. Generally, when the second member is cured, the filling member 65 contracts in volume. As a result, the portion of the through hole 13 located above the top surface of the filling member 65 on the first land portion 21 side has a volume V. A space 13 ′ of h is generated. In addition, a space 13 ′′ is generated in the portion of the through hole 13 located above the top surface of the filling member 65 on the second land portion 31 side. The filling member 65 is formed on the second land portion 31. However, the top surface of the filling member 65 does not protrude beyond the level of the top surface of the second component mounting portion 32.
- solder layer 24 is formed on the first component mounting portions 22 and 23 where the first component 51 is to be mounted.
- the solder layer 34 is also formed on the second component mounting portions 32 and 33 where the second component is to be mounted.
- the first component 51 is applied to the first component mounting portions 22 and 23 where the first component 51 is to be mounted based on a known method. Place (see FIG. 14).
- the second component (not shown) is temporarily fixed to the second component mounting portions 32 and 33 using, for example, an adhesive.
- the first component 51 is mounted on the first component mounting portions 22 and 23 where the first component 51 is to be mounted via the solder layers 24 and 34, for example, based on the solder reflow method.
- the second component is mounted on the second component mounting portions 32 and 33 where the two components are to be mounted. In this way, the mounting board (mounting board on which components are mounted) of the second embodiment shown in FIG. 10 can be obtained.
- the filling member is used as the second land. Can extend to the top of the portion, improve the reliability of the electrical connection between the filling member and the second land portion, and further increase the filling member greatly on the land portion. Since there is no need, that is, the filling member extends over the second land portion, but the top surface of the filling member does not protrude beyond the level of the top surface of the second component mounting portion. There is no need to polish and remove the filling member, and there is no problem that the substrate is damaged.
- the second embodiment in some cases, it is possible to adopt a form in which a slope inclined toward the through hole 13 is formed in the portion of the substrate 10 located under the first land portion 21.
- the thickness of the flat portion of the first land portion 21 and the thickness of the inclined portion of the first land portion 21 are preferably equal.
- the first component is composed of a light emitting element.
- the first component is, for example, a sensor that detects visible light, a sensor that detects infrared light, a sensor that detects ultraviolet light, and an X-ray.
- the first component can also be a composite component of a light emitting element or sensor and a third component.
- a multilayer wiring can be provided on the second surface of the substrate.
- FIG. 15A shows a schematic partial end view of a state in which the flux is applied to the first surface side of the substrate in the mounting substrate of another modified example of Example 1 after component mounting.
- the solder layer 24 is made of a known solder resist material, an insulating film made of an organic insulating material such as polyimide, or an inorganic insulating material such as silicon oxide or silicon nitride.
- a form surrounded by a coating layer 18 such as an insulating film may be employed. Specifically, a portion where the solder layer 24 is to be formed and a covering layer 18 having an opening in the land portion 21 are formed on the first surface 11 of the substrate 10, and then the solder layer 24 should be formed.
- a solder layer 24 may be formed in the opening. Thereafter, the flux 40 is applied on the solder layer 24, the coating layer 18, and the first land portion 21 (see FIG. 15A). Then, the first component 51 is mounted on the first component mounting portions 22 and 23 where the first component 51 is to be mounted, for example, based on the solder reflow method, via the solder layers 24 and 34.
- the state shown in FIG. 15B can be obtained by mounting the second component (not shown) on the second component mounting portions 32 and 33 where the two components are to be mounted.
- the planar shape of the solder layer 24 can be a shape having a protruding portion that extends outward from the center portion of the solder layer 24.
- the protrusion is disposed so as to be rotationally symmetric at least three times from the center, the tip of the protrusion is disposed on the circumference centered on the center, and the center is circular. It can be a certain shape. It is also possible to form a solder layer on the component side to be attached, and to form a solder diffusion preventing layer on the component attaching portion, thereby joining the solder layer and the solder diffusion preventing layer.
- FIG. 16 shows the first component mounting portions 22 and 23 that extend straight from the first land portion 21, but the mounting of the first embodiment after the filling member 15 has filled a part of the through hole 13 is shown.
- FIG. 16 a schematic partial plan view of still another modified example of the substrate for use is bent in a direction different from a direction extending straight from the first land portion 21 (90 degrees in the illustrated example). It can also be set as the 1st component attachment parts 22 and 23 extended in a direction.
- first embodiment >> A through hole formed in the substrate, A first land portion formed on the first surface of the substrate and surrounding the through hole; and a second land portion formed on the second surface of the substrate facing the first surface and surrounding the through hole; A first component mounting portion formed on the first surface of the substrate and connected to the first land portion, and a second component formed on the second surface of the substrate and connected to the second land portion.
- Parts mounting part A conductive layer formed on the inner wall of the through-hole and conducting between the first land portion and the second land portion; and A filling member filled in a part of the through hole, With The volume of the portion of the through hole located above the top surface of the filling member on the first land side, the length of the component to be mounted on the first component mounting portion, and the mounting on the first component mounting portion Based on the inclination of the power component to the first surface of the substrate (specifically, for example, based on the maximum allowable value of the inclination), the shortest distance allowable value from the center of the first land portion to the component is determined. substrate.
- the volume of the portion of the through hole located above the top surface of the filling member on the first land side is V h
- the length of the component to be mounted on the first component mounting portion is L 1
- the first When the maximum allowable value of the inclination of the component to be mounted on the component mounting portion with respect to the first surface of the substrate is ⁇ max , and the shortest distance allowable value from the center of the first land portion to the component is L 0 , mounting substrate according to the shortest distance tolerance L 0 is determined so as to satisfy the (1) [A01].
- ⁇ Mounting board second embodiment >> A through hole formed in the substrate, A first land portion formed on the first surface of the substrate and surrounding the through hole; and a second land portion formed on the second surface of the substrate facing the first surface and surrounding the through hole; A first component mounting portion formed on the first surface of the substrate and connected to the first land portion, and a second component formed on the second surface of the substrate and connected to the second land portion.
- Parts mounting part A conductive layer formed on the inner wall of the through-hole and conducting between the first land portion and the second land portion; and A filling member filled in a part of the through hole, With A flux having an average thickness d is applied to the first surface side of the substrate, When the volume of the portion of the through hole located above the top surface of the filling member on the first land portion side is V h and the shortest distance allowable value from the center of the first land portion to the part is L 0 , The mounting board in which the shortest distance allowable value L 0 is determined so as to satisfy the expression (2).
- the first land portion, the second land portion, the first component mounting portion, the second component mounting portion, and the conductive layer are composed of a first member made of a metal or an alloy,
- the mounting board according to [A05] satisfying [A07]
- the first member is made of at least one material selected from the group consisting of aluminum, aluminum alloy, nickel, nickel alloy, chromium and chromium alloy,
- Mounting board third aspect >> A through hole formed in the substrate, A first land portion formed on the first surface of the substrate and surrounding the through hole; and a second land portion formed on the second surface of the substrate facing the first surface and surrounding the through hole; A first component mounting portion formed on the first surface of the substrate and connected to the first land portion, and a second component formed on the second surface of the substrate and connected to the second land portion. Parts mounting part, and A filling member made of a conductive material, filled in the through-hole, and electrically connecting the first land portion and the second land portion; With A mounting substrate in which an inclined surface inclined toward the through hole is formed in a portion of the substrate located below the second land portion.
- [B07] The mounting member according to any one of [B01] to [B06], wherein the filling member extends on the second land portion.
- [B08] The mounting board according to [B07], wherein the top surface of the filling member does not protrude beyond the level of the top surface of the second component mounting portion.
- [C01] The mounting board according to any one of [A01] to [B08], in which the component to be mounted on the first component mounting portion is formed of a light emitting element.
- [C02] The mounting substrate according to [C01], in which a plurality of light emitting elements are arranged in a two-dimensional matrix to form an image display device.
- [C03] The mounting substrate according to any one of [A01] to [B08], in which the component to be mounted on the first component mounting portion is a sensor.
- [C04] The mounting substrate according to any one of [A01] to [C03], wherein the substrate is made of a glass substrate.
- [D01] ⁇ Mounting Board Manufacturing Method: First Aspect >> After forming the through hole in the substrate, On the first surface of the substrate, a first land portion surrounding the through-hole and a first component attachment portion connected to the first land portion are formed, and the second surface of the substrate facing the first surface A second land portion surrounding the through hole and a second component attachment portion connected to the second land portion are formed on the first land portion and the second land portion on the inner wall of the through hole.
- a conductive layer is formed, and then, Filling a part of the through hole with a filling member;
- a method of manufacturing a mounting board comprising each step, The volume of the portion of the through hole located above the top surface of the filling member on the first land side, the length of the component to be mounted on the first component mounting portion, and the mounting on the first component mounting portion
- a mounting board that determines the shortest distance allowable value from the center of the first land portion to the component based on the inclination of the power component to the first surface of the substrate (specifically, for example, based on the maximum allowable inclination value) Production method.
- a conductive layer is formed, and then, Filling a part of the through hole with a filling member;
- a method of manufacturing a mounting board comprising each step, A step of filling a part of the through hole with a filling member and then applying a flux having an average thickness d to the first surface side of the substrate;
- V h the volume of the portion of the through hole located above the top surface of the filling member on the first land portion side
- the shortest distance allowable value from the center of the first land portion to the part is L 0
- a method for manufacturing a mounting board wherein the shortest distance allowable value L 0 is determined so as to satisfy the formula (2).
- the first land portion, the second land portion, the first component mounting portion, the second component mounting portion, and the conductive layer are composed of a first member made of a metal or an alloy,
- the coefficient of thermal expansion of the substrate is CTE 0
- the coefficient of thermal expansion of the first member is CTE 1
- the coefficient of thermal expansion of the second member is CTE 2 , CTE 2 -CTE 0 ⁇ CTE 1 -CTE 0 Or CTE 0 ⁇ CTE 1 ⁇ CTE 2
- the substrate manufacturing method for mounting according to [D05] which satisfies [D07]
- the first member is made of at least one material selected from the group consisting of aluminum, aluminum alloy, nickel, nickel alloy, chromium and chromium alloy
- the mounting member manufacturing method according to [D05] in which the second member is made of a conductive paste.
- [D08] forming a first component mounting portion, a first land portion, a second component mounting portion, a second land portion and a conductive layer based on a combination of physical vapor deposition and etching technology;
- [D09] The mounting substrate manufacturing method according to any one of [D01] to [D08], wherein the through hole is filled with a filling member in a state where the protective film is bonded to the first surface of the substrate.
- [D10] The mounting according to any one of [D01] to [D09], wherein, when the through hole is formed, a slope inclined toward the through hole is formed in a portion of the substrate on which the second land portion is to be formed.
- [D11] The mounting substrate manufacturing method according to [D10], wherein the thickness of the flat portion of the second land portion is equal to the thickness of the inclined portion of the second land portion.
- the substrate is etched to form a slope inclined toward the through hole in the portion of the substrate where the second land portion is to be formed.
- Substrate manufacturing method [E03] The mounting substrate manufacturing method according to [E01] or [E02], in which the through hole is filled with the filling member in a state where the protective film is bonded to the first surface of the substrate. [E04] forming a first component attachment portion, a first land portion, a second component attachment portion, and a second land portion based on a combination of physical vapor deposition and etching technology; The mounting substrate manufacturing method according to any one of [E01] to [E03], wherein the through hole formed by the filling member is filled based on a printing method.
- the volume of the portion of the through hole located above the top surface of the filling member on the first land side is V h
- the length of the component to be mounted on the first component mounting portion is L 1
- the first When the minimum allowable distance from the center of the land portion to the component is L 0 and the maximum allowable inclination of the component to be mounted on the first component mounting portion with respect to the first surface of the substrate is ⁇ max , mounting substrate manufacturing method according to any one of (1) to satisfy the determining shortest distance tolerance L 0 [E01] to [E06].
- a conductive layer is formed, and then, After filling a part of the through hole with the filling member, A solder layer or a solder diffusion prevention layer is formed on the part of the first component mounting portion on which the component is to be mounted, and then flux is applied to the first surface side of the substrate, The component is mounted on the part of the first component mounting portion where the component is to be mounted through the solder layer or the solder diffusion prevention layer.
- a component mounting method including each process, The volume of the portion of the through hole located above the top surface of the filling member on the first land side, the length of the component to be mounted on the first component mounting portion, and the mounting on the first component mounting portion
- Component mounting method for determining the shortest distance allowable value from the center of the first land portion to the component based on the inclination of the power component to the first surface of the substrate (specifically, for example, based on the maximum allowable value of the inclination) .
- a conductive layer is formed, and then, After filling a part of the through hole with the filling member, A solder layer or a solder diffusion prevention layer is formed on the part of the first component mounting portion where the component is to be mounted, and then a flux having an average thickness d is applied to the first surface side of the substrate, The component is mounted on the part of the first component mounting portion where the component is to be mounted through the solder layer or the solder diffusion prevention layer.
- a component mounting method including each process, When the volume of the portion of the through hole located above the top surface of the filling member on the first land portion side is V h and the shortest distance allowable value from the center of the first land portion to the part is L 0 , A component mounting method for determining the shortest distance allowable value L 0 so as to satisfy Equation (2). ⁇ ⁇ d ⁇ L 0 2 > V h (2) [G05]
- the first land portion, the second land portion, the first component mounting portion, the second component mounting portion, and the conductive layer are composed of a first member made of a metal or an alloy,
- the component mounting method according to any one of [G01] to [G04], wherein the filling member includes a second member different from the first member.
- the coefficient of thermal expansion of the substrate is CTE 0
- the coefficient of thermal expansion of the first member is CTE 1
- the coefficient of thermal expansion of the second member is CTE 2 , CTE 2 -CTE 0 ⁇ CTE 1 -CTE 0 Or CTE 0 ⁇ CTE 1 ⁇ CTE 2
- the component mounting method according to [G05] that satisfies the above.
- the first member is made of at least one material selected from the group consisting of aluminum, aluminum alloy, nickel, nickel alloy, chromium and chromium alloy,
- the component mounting method according to [G05] wherein the second member is made of a conductive paste.
- [G08] forming a first component mounting portion, a first land portion, a second component mounting portion, a second land portion and a conductive layer based on a combination of physical vapor deposition and etching technology;
- [G10] The component according to any one of [G01] to [G09], wherein when the through hole is formed, a slope inclined toward the through hole is formed in a portion of the substrate on which the second land portion is to be formed.
- [G11] The component mounting method according to [G10], wherein the thickness of the flat portion of the second land portion is equal to the thickness of the inclined portion of the second land portion.
- [H01] The component mounting method according to any one of [G01] to [G11], wherein the component to be mounted on the first component mounting portion is formed of a light emitting element.
- [H02] The component mounting method according to [H01], in which a plurality of light emitting elements are arranged in a two-dimensional matrix to constitute an image display device.
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Abstract
Description
基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に(あるいは第1のランド部から延在した配線に)接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部(あるいは第2のランド部から延在した配線)に接続された第2の部品取付部、
貫通孔の内壁に形成され、第1のランド部と第2のランド部とを導通させる導通層、並びに、
貫通孔の一部分に充填された充填部材、
を備えている。そして、本開示の第1の態様に係る実装用基板にあっては、以下の(要件-1)を含む。また、本開示の第2の態様に係る実装用基板にあっては、基板の第1面側には平均厚さdのフラックスが塗布されており、以下の(要件-2)の式(2)を満足するように最短距離許容値L0が決定される。
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分(第1のランド部側の充填部材の頂面の凹みの部分)の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき(具体的には、例えば、傾きの最大許容値に基づき)、第1のランド部の中心から部品までの最短距離許容値が決定される。場合によっては、更に、フラックスの厚さ(具体的には、例えば、平均厚さ)に基づき、第1のランド部の中心から部品までの最短距離許容値を決定してもよい。
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、
π・d・L0 2>Vh (2)
基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、並びに、
導電材料から成り、貫通孔に充填され、第1のランド部と第2のランド部とを導通させる充填部材、
を備えており、
第2のランド部の下に位置する基板の部分には、貫通孔に向かって傾斜した斜面が形成されている。
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填する、
各工程を備えた実装用基板の製造方法である。そして、本開示の第1の態様に係る実装用基板にあっては、上記の(要件-1)を含む。また、本開示の第2の態様に係る実装用基板にあっては、貫通孔の一部分を充填部材で充填した後、基板の第1面側に平均厚さdのフラックスを塗布する工程を更に備えており、上記の(要件-2)の式(2)を満足するように最短距離許容値L0を決定する。
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、次いで、
導電材料から成る充填部材で貫通孔を充填し、以て、第1のランド部と第2のランド部とを導通させる、
各工程を備えた実装用基板の製造方法であって、
第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する。
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填した後、
部品を実装すべき第1の部品取付部の部分にハンダ層又はハンダ拡散防止層を形成し、次いで、基板の第1面側にフラックスを塗布し、
ハンダ層又はハンダ拡散防止層を介して、部品を実装すべき第1の部品取付部の部分に部品を実装する、
各工程を備えた部品実装方法である。そして、本開示の第1の態様に係る実装用基板にあっては、上記の(要件-1)を含む。また、本開示の第2の態様に係る実装用基板にあっては、平均厚さdのフラックスを塗布し、上記の(要件-2)の式(2)を満足するように最短距離許容値L0を決定する。
1.本開示の第1の態様~第3の態様に係る実装用基板及びその製造方法、並びに、本開示の第1の態様~第2の態様に係る部品実装方法、全般に関する説明
2.実施例1(本開示の第1の態様~第2の態様に係る実装用基板及びその製造方法、並びに、本開示の第1の態様~第2の態様に係る部品実装方法)
3.実施例2(本開示の第3の態様に係る実装用基板及びその製造方法)、その他
以下の説明において、本開示の第1の態様に係る実装用基板及びその製造方法、本開示の第1の態様に係る部品実装方法を、総称して、『本開示の第1の態様』と呼ぶ場合があるし、本開示の第2の態様に係る実装用基板及びその製造方法、本開示の第2の態様に係る部品実装方法を、総称して、『本開示の第2の態様』と呼ぶ場合がある。また、本開示の第3の態様に係る実装用基板及びその製造方法を、総称して、『本開示の第3の態様』と呼ぶ場合がある。第1の部品取付部に実装すべき部品の長さL1の値として0.01mm乃至1mmを例示することができるし、フラックスの平均厚さdの値として0.001μm乃至0.1μmを例示することができるし、貫通孔の半径r0の値として0.01mm乃至1mmを例示することができる。第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分(第1のランド部側の充填部材の頂面の凹みの部分)の体積Vhの値は、貫通孔の半径r0の値、充填部材を構成する材料、充填部材を充填する方法等に依存する。
CTE2-CTE0<CTE1-CTE0
を満足し、あるいは又、
CTE0<CTE1<CTE2
を満足する形態とすることができる。あるいは又、この場合、第1部材は、アルミニウム、アルミニウム合金、ニッケル、ニッケル合金、クロム及びクロム合金、銅及び銅合金から成る群から選択された少なくとも1種類の材料から成り、第2部材は、導電性ペースト(具体的には、低温焼成ペーストあるいは厚膜印刷ペースト、より具体的には、例えば、Agペースト、Cuペースト、Ag-Pdペースト)から成る形態とすることができる。場合によっては、第2部材を、導電性を有する樹脂、あるいは、導電性を有していない樹脂から構成してもよい。あるいは又、充填部材の電気抵抗の値は、導通層の電気抵抗値よりも小さいことが好ましい。あるいは又、充填部材の半径の値は、導通層の厚さの値よりも大きいことが好ましい。導通層は、第1のランド部を構成する第1部材の延在部と、第2のランド部を構成する第1部材の延在部とから構成することができる。また、本開示の第3の態様における導電材料から成る充填部材として、導電性ペースト(具体的には、低温焼成ペーストあるいは厚膜印刷ペースト、より具体的には、例えば、Agペースト、Cuペースト、Ag-Pdペースト)を挙げることができる。また、導電性を有していない樹脂として、例えば、エポキシ樹脂、フェノール樹脂、ノボラック樹脂、ポリイミド樹脂、アクリル樹脂、液晶ポリマーを挙げることができる。
CTE0:3×10-6/K乃至1.5×10-5/K
CTE1:3×10-6/K乃至5×10-5/K
CTE2:1×10-5/K乃至2×10-4/K
第1の部品取付部、第1のランド部、第2の部品取付部、第2のランド部及び導通層を、真空蒸着法やスパッタリング法を含む物理的気相成長法(PVD法)及びエッチング技術の組合せに基づき形成し(但し、本開示の第3の態様においては、導通層の形成は必須ではない)、
充填部材による貫通孔を、印刷法(例えば、スクリーン印刷法)やディスペンサを用いた方法に基づき充填する形態とすることが好ましい。PVD法を採用することで、ガラス基板に対する第1部材の優れた密着性を達成することができる。エッチング技術には、具体的には、エッチング用マスク形成技術と、ウェットエッチング技術あるいはドライエッチング技術の組合せが含まれる。エッチング用マスク形成技術として、例えば、レジストインクを用いた印刷技術(例えば、スクリーン印刷技術)に基づくエッチング用レジスト層の形成、感光性樹脂を用いたフォトリソグラフィ技術に基づくエッチング用レジスト層の形成、ドライフィルムを用いたエッチング用レジスト層の形成を挙げることができる。
0.8≦t1/t2≦1.2
を満足することを意味する。
基板10に形成された貫通孔13、
基板10の第1面11上に形成され、貫通孔13を取り囲む第1のランド部21、及び、第1面11と対向する基板10の第2面12上に形成され、貫通孔13を取り囲む第2のランド部31、
基板10の第1面11上に形成され、第1のランド部21に接続された第1の部品取付部22、及び、基板10の第2面12上に形成され、第2のランド部31に接続された第2の部品取付部32、
貫通孔13の内壁に形成され、第1のランド部21と第2のランド部31とを導通させる導通層14、並びに、
貫通孔13の一部分に充填された充填部材15、
を備えている。
第1のランド部21側の充填部材15の頂面の上方に位置する貫通孔13の部分(第1のランド部21側の充填部材15の頂面の凹みの部分)の体積Vh、第1の部品取付部22,23に実装すべき部品(第1の部品)51の長さL1、第1の部品取付部22,23に実装すべき部品(第1の部品)51の基板10の第1面11に対する傾きに基づき(具体的には、例えば、傾きの最大許容値θmaxに基づき)、更には、場合によっては、フラックス40の厚さ(具体的には、例えば、フラックス40の平均厚さ)に基づき、第1のランド部21の中心から部品までの最短距離許容値L0が決定される。
第1のランド部21側の充填部材15の頂面の上方に位置する貫通孔13の部分の体積をVh、第1のランド部21の中心から部品までの最短距離許容値をL0としたとき、
π・d・L0 2>Vh (2)
CTE0<CTE1<CTE2
を満足する。具体的には、
CTE0=3×10-6/K
CTE1=17×10-6/K
CTE2=50×10-6/K
である。また、充填部材15の電気抵抗の値は、導通層14の電気抵抗値よりも小さい。導通層14は、第1のランド部21を構成する第1部材の延在部と、第2のランド部31を構成する第1部材の延在部とから構成されている。尚、実施例2においても、第1のランド部21、第2のランド部31、第1の部品取付部22,23及び第2の部品取付部32,33は、金属又は合金から成る第1部材から構成されており、充填部材65は、第1部材とは異なる第2部材から構成されており、ここで、第1部材及び第2部材は、上記の材料から構成されている。また、実施例2において、基板10も上記のガラス基板から構成されている。
=(π・d)(L1 2/3+L1・L0+L0 2) (3)
先ず、周知の方法に基づき、基板10に貫通孔13を形成する。貫通孔13は、例えば、ドリルを用いた孔開け法に基づき形成することができるし、レーザ光を用いた孔開け法に基づき形成することができる。孔開け加工によって貫通孔13の内壁に荒れが生じた場合には、例えば、エッチングを行うことで、貫通孔13の内壁を平滑化してもよい。
次に、基板10の第1面11上に、貫通孔13を取り囲む第1のランド部21、第1のランド部21に接続された第1の部品取付部22、及び、第1の部品取付部23を形成し、第1面11と対向する基板10の第2面12上に、貫通孔13を取り囲む第2のランド部31、第2のランド部31に接続された第2の部品取付部32、及び、第2の部品取付部33を形成し、貫通孔13の内壁に第1のランド部21と第2のランド部31とを導通させる導通層14を形成する。具体的には、例えば、基板10の第2面12上から貫通孔13に亙り、スパッタリング法に基づき第1部材を成膜し、次いで、基板10の第1面11上から貫通孔13に亙り、スパッタリング法に基づき第1部材を成膜する。尚、基板10の第1面11上から貫通孔13に亙り、スパッタリング法に基づき第1部材を成膜し、次いで、基板10の第2面12上から貫通孔13に亙り、スパッタリング法に基づき第1部材を成膜してもよい。これによって、貫通孔13の内壁に導通層14を形成することができる。次いで、周知のパターニング技術に基づき、第1の部品取付部22,23、第1のランド部21、第2の部品取付部32,33、第2のランド部31を形成する。こうして、図2Aに示す状態を得ることができる。
次いで、貫通孔13の一部分を充填部材15で充填する。具体的には、先ず、基板10の第1面11に、再剥離可能なアクリル系粘着層が表面に形成されたポリエチレンテレフタレート(PET)フィルムから成るマスキングテープを保護フィルム16として、ラミネータを用いて貼り合わせる(図2B参照)。そして、基板10の第2面側から、充填部材15によって貫通孔13を充填する(図3A参照)。充填部材15による貫通孔13の充填は、印刷法(例えば、スクリーン印刷法)やディスペンサを用いた方法に基づき行うことができる。次いで、保護フィルム16を引き剥がした後(図3B参照)、充填部材15を構成する第2部材を硬化させる(図4A参照)。尚、第2部材を硬化させた後、保護フィルム16を引き剥がしてもよい。一般に、第2部材を硬化させると、充填部材15には体積収縮が生じる結果、第1のランド部21側の充填部材15の頂面の上方に位置する貫通孔13の部分には、体積Vhの空間13’が生成する。また、第2のランド部31側の充填部材15の頂面の上方に位置する貫通孔13の部分には、空間13”が生成する。
その後、第1の部品51を実装すべき第1の部品取付部22,23の部分にハンダ層24を形成する。第2の部品を実装すべき第2の部品取付部32,33の部分にもハンダ層34を形成する。ハンダ層24,34は、鉛フリーハンダ材料等の周知のハンダ材料から、周知の方法(例えば、ハンダメッキ法やハンダペースト印刷法)に基づき形成すればよい。この状態を基板10の第1面側から眺めた部分的平面図を図1Bに示す。ハンダ層の形成前に被覆層を形成してもよい。
次いで、基板10の第1面側に平均厚さdのフラックス40を塗布する(図4B参照)。フラックス40は周知のフラックス40を用いればよいし、フラックス40の塗布方法も周知の塗布方法とすればよい。基板10の第2面側にもフラックスを塗布するが、図面においては、基板10の第2面側に塗布されたフラックスの図示は省略している。
その後、第1の部品51を実装すべき第1の部品取付部22,23の部分に、周知の方法に基づき、第1の部品51を載置する(図5A参照)。その前に、第2の部品(図示せず)を、例えば、接着剤を用いて第2の部品取付部32,33に仮固定する。次いで、ハンダ層24,34を介して、例えば、ハンダリフロー法に基づき、第1の部品51を実装すべき第1の部品取付部22,23の部分に第1の部品51を実装し、第2の部品を実装すべき第2の部品取付部32,33の部分に第2の部品を実装する。こうして、図1Aに示した実施例1の実装用基板(部品が実装された実装用基板)を得ることができる。図1Aに示すように、フラックス40の一部は空間13’に流入するが、第1の部品51の下にはフラックス40が残っており、第1の部品51が傾くことはない。
基板10に形成された貫通孔13、
基板10の第1面11上に形成され、貫通孔13を取り囲む第1のランド部21、及び、第1面11と対向する基板10の第2面12上に形成され、貫通孔13を取り囲む第2のランド部31、
基板10の第1面11上に形成され、第1のランド部21に接続された第1の部品取付部22、及び、基板10の第2面12上に形成され、第2のランド部31に接続された第2の部品取付部32、並びに、
導電材料から成り、貫通孔13に充填され、第1のランド部21と第2のランド部31とを導通させる充填部材65、
を備えており、
第2のランド部31の下に位置する基板10の部分10’には、貫通孔13に向かって傾斜した斜面17が形成されている。
先ず、実施例1の[工程-100]と同様にして、周知の方法に基づき、基板10に貫通孔13を形成する。
第2のランド部31を形成すべき基板10の部分10’に、貫通孔13に向かって傾斜した斜面17を形成する。即ち、貫通孔13を形成した後、例えば、エッチング用マスク(図示せず)を形成し、フッ酸を用いて基板10をエッチングした後、エッチング用マスクを除去することで、第2のランド部31を形成すべき基板10の部分10’に、貫通孔13に向かって傾斜した斜面17を形成することができる。尚、第2のランド部31を形成すべき基板10の部分10’には平坦部17’も設けられている。
次に、基板10の第1面11上に、貫通孔13を取り囲む第1のランド部21、第1のランド部21に接続された第1の部品取付部22、及び、第1の部品取付部23を形成し、第1面11と対向する基板10の第2面12上に、貫通孔13を取り囲む第2のランド部31、第2のランド部31に接続された第2の部品取付部32、及び、第2の部品取付部33を形成する。具体的には、例えば、基板10の第2面12上にスパッタリング法に基づき第1部材を成膜し、次いで、基板10の第1面11上にスパッタリング法に基づき第1部材を成膜する。尚、基板10の第1面11上にスパッタリング法に基づき第1部材を成膜し、次いで、基板10の第2面12上にスパッタリング法に基づき第1部材を成膜してもよい。実施例2にあっては、貫通孔13の内壁に、図1Aにて説明したような導通層を形成することは必須ではない。次いで、周知のパターニング技術に基づき、第1の部品取付部22,23、第1のランド部21、第2の部品取付部32,33、第2のランド部31を形成する。こうして、図11Aに示す状態を得ることができる。
次いで、導電材料から成る充填部材65で貫通孔13を充填し、以て、第1のランド部21と第2のランド部31とを導通させる。具体的には、先ず、基板10の第1面11に、実施例1と同様に、保護フィルム16をラミネータを用いて貼り合わせる(図11B参照)。そして、基板10の第2面側から、充填部材65によって貫通孔13を充填する(図12A参照)。充填部材65による貫通孔13の充填は、印刷法(例えば、スクリーン印刷法)やディスペンサを用いた方法に基づき行うことができる。次いで、保護フィルム16を引き剥がした後(図12B参照)、充填部材65を構成する第2部材を硬化させる(図13A参照)。第2部材を硬化させた後、保護フィルム16を引き剥がしてもよい。一般に、第2部材を硬化させると、充填部材65には体積収縮が生じる結果、第1のランド部21側の充填部材65の頂面の上方に位置する貫通孔13の部分には、体積Vhの空間13’が生成する。また、第2のランド部31側の充填部材65の頂面の上方に位置する貫通孔13の部分には、空間13”が生成する。充填部材65は、第2のランド部31の上にまで延在している。但し、充填部材65の頂面は、第2の部品取付部32の頂面のレベルよりも突出してはいない。
その後、実施例1の[工程-130]と同様にして、第1の部品51を実装すべき第1の部品取付部22,23の部分にハンダ層24を形成する。第2の部品を実装すべき第2の部品取付部32,33の部分にもハンダ層34を形成する。
次いで、実施例1の[工程-140]と同様にして、基板10の第1面側に平均厚さdのフラックス40を塗布する(図13B参照)。尚、基板10の第2面側にもフラックスを塗布するが、図面においては、基板10の第2面側に塗布されたフラックスの図示は省略している。
その後、実施例1の[工程-150]と同様にして、第1の部品51を実装すべき第1の部品取付部22,23の部分に、周知の方法に基づき、第1の部品51を載置する(図14参照)。その前に、第2の部品(図示せず)を、例えば、接着剤を用いて第2の部品取付部32,33に仮固定する。次いで、ハンダ層24,34を介して、例えば、ハンダリフロー法に基づき、第1の部品51を実装すべき第1の部品取付部22,23の部分に第1の部品51を実装し、第2の部品を実装すべき第2の部品取付部32,33の部分に第2の部品を実装する。こうして、図10に示した実施例2の実装用基板(部品が実装された実装用基板)を得ることができる。
[A01]《実装用基板:第1の態様》
基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、
貫通孔の内壁に形成され、第1のランド部と第2のランド部とを導通させる導通層、並びに、
貫通孔の一部分に充填された充填部材、
を備えており、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき(具体的には、例えば、傾きの最大許容値に基づき)、第1のランド部の中心から部品までの最短距離許容値が決定される実装用基板。
[A02]第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmax、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(1)を満足するように最短距離許容値L0が決定される[A01]に記載の実装用基板。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1)
[A03]θmaxの値は30度である[A02]に記載の実装用基板。
[A04]《実装用基板:第2の態様》
基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、
貫通孔の内壁に形成され、第1のランド部と第2のランド部とを導通させる導通層、並びに、
貫通孔の一部分に充填された充填部材、
を備えており、
基板の第1面側には平均厚さdのフラックスが塗布されており、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(2)を満足するように最短距離許容値L0が決定される実装用基板。
π・d・L0 2>Vh (2)
[A05]第1のランド部、第2のランド部、第1の部品取付部、第2の部品取付部及び導通層は、金属又は合金から成る第1部材から構成されており、
充填部材は、第1部材とは異なる第2部材から構成されている[A01]乃至[A04]のいずれか1項に記載の実装用基板。
[A06]基板の熱膨張率をCTE0、第1部材の熱膨張率をCTE1、第2部材の熱膨張率をCTE2としたとき、
CTE2-CTE0<CTE1-CTE0
を満足し、あるいは又、
CTE0<CTE1<CTE2
を満足する[A05]に記載の実装用基板。
[A07]第1部材は、アルミニウム、アルミニウム合金、ニッケル、ニッケル合金、クロム及びクロム合金から成る群から選択された少なくとも1種類の材料から成り、
第2部材は、導電性ペーストから成る[A05]に記載の実装用基板。
[A08]第2のランド部の下に位置する基板の部分に、貫通孔に向かって傾斜した斜面が形成されている[A01]乃至[A07]のいずれか1項に記載の実装用基板。
[A09]第2ランド部の平坦部の厚さと第2のランド部の傾斜部の厚さとは等しい[A08]に記載の実装用基板。
[B01]《実装用基板:第3の態様》
基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、並びに、
導電材料から成り、貫通孔に充填され、第1のランド部と第2のランド部とを導通させる充填部材、
を備えており、
第2のランド部の下に位置する基板の部分には、貫通孔に向かって傾斜した斜面が形成されている実装用基板。
[B02]第2ランド部の平坦部の厚さと第2のランド部の傾斜部の厚さとは等しい[B01]に記載の実装用基板。
[B03]第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmax、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(1)を満足するように最短距離許容値L0が決定される[B01]又は[B02]に記載の実装用基板。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1)
[B04]貫通孔に向かって傾斜した斜面の傾斜角は、50度乃至80度である[B01]乃至[B03]のいずれか1項に記載の実装用基板。
[B05]第1のランド部の下に位置する基板の部分に、貫通孔に向かって傾斜した斜面が形成されている[B01]又は[B02]に記載の実装用基板。
[B06]第1ランド部の平坦部の厚さと第1のランド部の傾斜部の厚さとは等しい[B05]に記載の実装用基板。
[B07]充填部材は、第2のランド部の上に延在している[B01]乃至[B06]のいずれか1項に記載の実装用基板。
[B08]充填部材の頂面は、第2の部品取付部の頂面のレベルよりも突出していない[B07]に記載の実装用基板。
[C01]第1の部品取付部に実装すべき部品は発光素子から成る[A01]乃至[B08]のいずれか1項に記載の実装用基板。
[C02]複数の発光素子が2次元マトリクス状に配列され、画像表示装置を構成する[C01]に記載の実装用基板。
[C03]第1の部品取付部に実装すべき部品はセンサから成る[A01]乃至[B08]のいずれか1項に記載の実装用基板。
[C04]基板はガラス基板から成る[A01]乃至[C03]のいずれか1項に記載の実装用基板。
[D01]《実装用基板製造方法:第1の態様》
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填する、
各工程を備えた実装用基板の製造方法であって、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき(具体的には、例えば、傾きの最大許容値に基づき)、第1のランド部の中心から部品までの最短距離許容値を決定する実装用基板製造方法。
[D02]第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmax、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(1)を満足するように最短距離許容値L0を決定する[D01]に記載の実装用基板製造方法。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1)
[D03]θmaxの値は30度である[D02]に記載の実装用基板製造方法。
[D04]《実装用基板製造方法:第2の態様》
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填する、
各工程を備えた実装用基板の製造方法であって、
貫通孔の一部分を充填部材で充填した後、基板の第1面側に平均厚さdのフラックスを塗布する工程を更に備えており、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(2)を満足するように最短距離許容値L0を決定する実装用基板製造方法。
π・d・L0 2>Vh (2)
[D05]第1のランド部、第2のランド部、第1の部品取付部、第2の部品取付部及び導通層は、金属又は合金から成る第1部材から構成されており、
充填部材は、第1部材とは異なる第2部材から構成されている[D01]乃至[D04]のいずれか1項に記載の実装用基板製造方法。
[D06]基板の熱膨張率をCTE0、第1部材の熱膨張率をCTE1、第2部材の熱膨張率をCTE2としたとき、
CTE2-CTE0<CTE1-CTE0
を満足し、あるいは又、
CTE0<CTE1<CTE2
を満足する[D05]に記載の実装用基板製造方法。
[D07]第1部材は、アルミニウム、アルミニウム合金、ニッケル、ニッケル合金、クロム及びクロム合金から成る群から選択された少なくとも1種類の材料から成り、
第2部材は、導電性ペーストから成る[D05]に記載の実装用基板製造方法。
[D08]第1の部品取付部、第1のランド部、第2の部品取付部、第2のランド部及び導通層を、物理的気相成長法及びエッチング技術の組合せに基づき形成し、
充填部材による貫通孔を、印刷法に基づき充填する[D01]乃至[D07]のいずれか1項に記載の実装用基板製造方法。
[D09]基板の第1面に保護フィルムを貼り合わせた状態で、充填部材により貫通孔を充填する[D01]乃至[D08]のいずれか1項に記載の実装用基板製造方法。
[D10]貫通孔の形成時、第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する[D01]乃至[D09]のいずれか1項に記載の実装用基板製造方法。
[D11]第2ランド部の平坦部の厚さと第2のランド部の傾斜部の厚さとは等しい[D10]に記載の実装用基板製造方法。
[E01]《実装用基板製造方法:第3の態様》
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、次いで、
導電材料から成る充填部材で貫通孔を充填し、以て、第1のランド部と第2のランド部とを導通させる、
各工程を備えた実装用基板の製造方法であって、
第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する実装用基板製造方法。
[E02]貫通孔を形成した後、基板をエッチングすることで、第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する[E01]に記載の実装用基板製造方法。
[E03]基板の第1面に保護フィルムを貼り合わせた状態で、充填部材による貫通孔の充填を行う[E01]又は[E02]に記載の実装用基板製造方法。
[E04]第1の部品取付部、第1のランド部、第2の部品取付部及び第2のランド部を、物理的気相成長法及びエッチング技術の組合せに基づき形成し、
充填部材による貫通孔を、印刷法に基づき充填する[E01]乃至[E03]のいずれか1項に記載の実装用基板製造方法。
[E05]導電材料から成る充填部材は、導電性ペーストから成る[E01]乃至[E04]のいずれか1項に記載の実装用基板製造方法。
[E06]第2ランド部の平坦部の厚さと第2のランド部の傾斜部の厚さとは等しい[E01]乃至[E05]のいずれか1項に記載の実装用基板製造方法。
[E07]第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1のランド部の中心から部品までの最短距離許容値をL0、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmaxとしたとき、以下の式(1)を満足するように最短距離許容値L0を決定する[E01]乃至[E06]のいずれか1項に記載の実装用基板製造方法。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1)
[E08]貫通孔に向かって傾斜した斜面の傾斜角は、50度乃至80度である[E01]乃至[E07]のいずれか1項に記載の実装用基板製造方法。
[E09]第1のランド部の下に位置する基板の部分に、貫通孔に向かって傾斜した斜面を形成する[E01]乃至[E06]のいずれか1項に記載の実装用基板製造方法。
[E10]第1ランド部の平坦部の厚さと第1のランド部の傾斜部の厚さとは等しい[E09]に記載の実装用基板製造方法。
[E11]充填部材は、第2のランド部の上に延在している[E01]乃至[E10]のいずれか1項に記載の実装用基板製造方法。
[E12]充填部材の頂面は、第2の部品取付部の頂面のレベルよりも突出していない[E11]に記載の実装用基板製造方法。
[F01]第1の部品取付部に実装すべき部品は発光素子から成る[D01]乃至[E12]のいずれか1項に記載の実装用基板製造方法。
[F02]複数の発光素子が2次元マトリクス状に配列され、画像表示装置を構成する[F01]に記載の実装用基板製造方法。
[F03]第1の部品取付部に実装すべき部品はセンサから成る[D01]乃至[E12]のいずれか1項に記載の実装用基板製造方法。
[F04]基板はガラス基板から成る[D01]乃至[F03]のいずれか1項に記載の実装用基板製造方法。
[G01]《部品実装方法:第1の態様》
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填した後、
部品を実装すべき第1の部品取付部の部分にハンダ層又はハンダ拡散防止層を形成し、次いで、基板の第1面側にフラックスを塗布し、
ハンダ層又はハンダ拡散防止層を介して、部品を実装すべき第1の部品取付部の部分に部品を実装する、
各工程を備えた部品実装方法であって、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき(具体的には、例えば、傾きの最大許容値に基づき)、第1のランド部の中心から部品までの最短距離許容値を決定する部品実装方法。
[G02]第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmax、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(1)を満足するように最短距離許容値L0を決定する[G01]に記載の部品実装方法。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1)
[G03]θmaxの値は30度である[G02]に記載の部品実装方法。
[G04]《部品実装方法:第2の態様》
基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填した後、
部品を実装すべき第1の部品取付部の部分にハンダ層又はハンダ拡散防止層を形成し、次いで、基板の第1面側に平均厚さdのフラックスを塗布し、
ハンダ層又はハンダ拡散防止層を介して、部品を実装すべき第1の部品取付部の部分に部品を実装する、
各工程を備えた部品実装方法であって、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(2)を満足するように最短距離許容値L0を決定する部品実装方法。
π・d・L0 2>Vh (2)
[G05]第1のランド部、第2のランド部、第1の部品取付部、第2の部品取付部及び導通層は、金属又は合金から成る第1部材から構成されており、
充填部材は、第1部材とは異なる第2部材から構成されている[G01]乃至[G04]のいずれか1項に記載の部品実装方法。
[G06]基板の熱膨張率をCTE0、第1部材の熱膨張率をCTE1、第2部材の熱膨張率をCTE2としたとき、
CTE2-CTE0<CTE1-CTE0
を満足し、あるいは又、
CTE0<CTE1<CTE2
を満足する[G05]に記載の部品実装方法。
[G07]第1部材は、アルミニウム、アルミニウム合金、ニッケル、ニッケル合金、クロム及びクロム合金から成る群から選択された少なくとも1種類の材料から成り、
第2部材は、導電性ペーストから成る[G05]に記載の部品実装方法。
[G08]第1の部品取付部、第1のランド部、第2の部品取付部、第2のランド部及び導通層を、物理的気相成長法及びエッチング技術の組合せに基づき形成し、
充填部材による貫通孔を、印刷法に基づき充填する[G01]乃至[G07]のいずれか1項に記載の部品実装方法。
[G09]基板の第1面に保護フィルムを貼り合わせた状態で、充填部材により貫通孔を充填する[G01]乃至[G08]のいずれか1項に記載の部品実装方法。
[G10]貫通孔の形成時、第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する[G01]乃至[G09]のいずれか1項に記載の部品実装方法。
[G11]第2ランド部の平坦部の厚さと第2のランド部の傾斜部の厚さとは等しい[G10]に記載の部品実装方法。
[H01]第1の部品取付部に実装すべき部品は発光素子から成る[G01]乃至[G11]のいずれか1項に記載の部品実装方法。
[H02]複数の発光素子が2次元マトリクス状に配列され、画像表示装置を構成する[H01]に記載の部品実装方法。
[H03]第1の部品取付部に実装すべき部品はセンサから成る[G01]乃至[G11]のいずれか1項に記載の部品実装方法。
[H04]基板はガラス基板から成る[G01]乃至[H03]のいずれか1項に記載の部品実装方法。
Claims (20)
- 基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、
貫通孔の内壁に形成され、第1のランド部と第2のランド部とを導通させる導通層、並びに、
貫通孔の一部分に充填された充填部材、
を備えており、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき、第1のランド部の中心から部品までの最短距離許容値が決定される実装用基板。 - 第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmax、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(1)を満足するように最短距離許容値L0が決定される請求項1に記載の実装用基板。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1) - θmaxの値は30度である請求項2に記載の実装用基板。
- 基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、
貫通孔の内壁に形成され、第1のランド部と第2のランド部とを導通させる導通層、並びに、
貫通孔の一部分に充填された充填部材、
を備えており、
基板の第1面側には平均厚さdのフラックスが塗布されており、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(2)を満足するように最短距離許容値L0が決定される実装用基板。
π・d・L0 2>Vh (2) - 第1のランド部、第2のランド部、第1の部品取付部、第2の部品取付部及び導通層は、金属又は合金から成る第1部材から構成されており、
充填部材は、第1部材とは異なる第2部材から構成されている請求項1又は請求項4のいずれか1項に記載の実装用基板。 - 基板に形成された貫通孔、
基板の第1面上に形成され、貫通孔を取り囲む第1のランド部、及び、第1面と対向する基板の第2面上に形成され、貫通孔を取り囲む第2のランド部、
基板の第1面上に形成され、第1のランド部に接続された第1の部品取付部、及び、基板の第2面上に形成され、第2のランド部に接続された第2の部品取付部、並びに、
導電材料から成り、貫通孔に充填され、第1のランド部と第2のランド部とを導通させる充填部材、
を備えており、
第2のランド部の下に位置する基板の部分には、貫通孔に向かって傾斜した斜面が形成されている実装用基板。 - 第2ランド部の平坦部の厚さと第2のランド部の傾斜部の厚さとは等しい請求項6に記載の実装用基板。
- 第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1の部品取付部に実装すべき部品の長さをL1、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きの最大許容値をθmax、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(1)を満足するように最短距離許容値L0が決定される請求項6に記載の実装用基板。
π・L1・sin(θmax)(L1 2/3+L1・L0+L0 2)>Vh (1) - 第1の部品取付部に実装すべき部品は発光素子から成る請求項1、請求項4及び請求項6のいずれか1項に記載の実装用基板。
- 基板はガラス基板から成る請求項1、請求項4及び請求項6のいずれか1項に記載の実装用基板。
- 基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填する、
各工程を備えた実装用基板の製造方法であって、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき、第1のランド部の中心から部品までの最短距離許容値を決定する実装用基板製造方法。 - 基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填する、
各工程を備えた実装用基板の製造方法であって、
貫通孔の一部分を充填部材で充填した後、基板の第1面側に平均厚さdのフラックスを塗布する工程を更に備えており、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(2)を満足するように最短距離許容値L0を決定する実装用基板製造方法。
π・d・L0 2>Vh (2) - 第1の部品取付部、第1のランド部、第2の部品取付部、第2のランド部及び導通層を、物理的気相成長法及びエッチング技術の組合せに基づき形成し、
充填部材による貫通孔を、印刷法に基づき充填する請求項11又は請求項12に記載の実装用基板製造方法。 - 基板の第1面に保護フィルムを貼り合わせた状態で、充填部材により貫通孔を充填する請求項11又は請求項12に記載の実装用基板製造方法。
- 貫通孔の形成時、第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する請求項11又は請求項12に記載の実装用基板製造方法。
- 基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、次いで、
導電材料から成る充填部材で貫通孔を充填し、以て、第1のランド部と第2のランド部とを導通させる、
各工程を備えた実装用基板の製造方法であって、
第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する実装用基板製造方法。 - 貫通孔を形成した後、基板をエッチングすることで、第2のランド部を形成すべき基板の部分に、貫通孔に向かって傾斜した斜面を形成する請求項16に記載の実装用基板製造方法。
- 基板の第1面に保護フィルムを貼り合わせた状態で、充填部材による貫通孔の充填を行う請求項16に記載の実装用基板製造方法。
- 基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填した後、
部品を実装すべき第1の部品取付部の部分にハンダ層又はハンダ拡散防止層を形成し、次いで、基板の第1面側にフラックスを塗布し、
ハンダ層又はハンダ拡散防止層を介して、部品を実装すべき第1の部品取付部の部分に部品を実装する、
各工程を備えた部品実装方法であって、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積、第1の部品取付部に実装すべき部品の長さ、及び、第1の部品取付部に実装すべき部品の基板の第1面に対する傾きに基づき、第1のランド部の中心から部品までの最短距離許容値を決定する部品実装方法。 - 基板に貫通孔を形成した後、
基板の第1面上に、貫通孔を取り囲む第1のランド部、及び、第1のランド部に接続された第1の部品取付部を形成し、第1面と対向する基板の第2面上に、貫通孔を取り囲む第2のランド部、及び、第2のランド部に接続された第2の部品取付部を形成し、貫通孔の内壁に第1のランド部と第2のランド部とを導通させる導通層を形成し、次いで、
貫通孔の一部分を充填部材で充填した後、
部品を実装すべき第1の部品取付部の部分にハンダ層又はハンダ拡散防止層を形成し、次いで、基板の第1面側に平均厚さdのフラックスを塗布し、
ハンダ層又はハンダ拡散防止層を介して、部品を実装すべき第1の部品取付部の部分に部品を実装する、
各工程を備えた部品実装方法であって、
第1のランド部側の充填部材の頂面の上方に位置する貫通孔の部分の体積をVh、第1のランド部の中心から部品までの最短距離許容値をL0としたとき、以下の式(2)を満足するように最短距離許容値L0を決定する部品実装方法。
π・d・L0 2>Vh (2)
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---|---|---|---|
US15/124,499 US9814139B2 (en) | 2014-03-27 | 2015-02-27 | Mounting substrate, manufacturing method for the same, and component mounting method |
CN201580015095.7A CN106105405B (zh) | 2014-03-27 | 2015-02-27 | 安装板、其制造方法、以及安装元件的方法 |
KR1020167025825A KR20160138024A (ko) | 2014-03-27 | 2015-02-27 | 실장용 기판 및 그 제조 방법, 및, 부품 실장 방법 |
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JP2014065302A JP6142831B2 (ja) | 2014-03-27 | 2014-03-27 | 実装用基板及びその製造方法、並びに、部品実装方法 |
JP2014-065302 | 2014-03-27 |
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WO2015146476A1 true WO2015146476A1 (ja) | 2015-10-01 |
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PCT/JP2015/055785 WO2015146476A1 (ja) | 2014-03-27 | 2015-02-27 | 実装用基板及びその製造方法、並びに、部品実装方法 |
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US (1) | US9814139B2 (ja) |
JP (1) | JP6142831B2 (ja) |
KR (1) | KR20160138024A (ja) |
CN (1) | CN106105405B (ja) |
WO (1) | WO2015146476A1 (ja) |
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KR101650938B1 (ko) * | 2014-09-25 | 2016-08-24 | 코닝정밀소재 주식회사 | 집적회로 패키지용 기판 |
JP7143581B2 (ja) | 2017-11-16 | 2022-09-29 | 昭和電工マテリアルズ株式会社 | 配線層の製造方法並びにシード層の形成方法 |
JP6881409B2 (ja) * | 2018-09-27 | 2021-06-02 | 日亜化学工業株式会社 | 照明装置およびその製造方法 |
CN110290633A (zh) * | 2019-06-05 | 2019-09-27 | 众普森科技(株洲)有限公司 | Pcb板、pcb板的制造方法及电器设备 |
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- 2015-02-27 WO PCT/JP2015/055785 patent/WO2015146476A1/ja active Application Filing
- 2015-02-27 KR KR1020167025825A patent/KR20160138024A/ko active Search and Examination
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Also Published As
Publication number | Publication date |
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JP6142831B2 (ja) | 2017-06-07 |
JP2015188037A (ja) | 2015-10-29 |
KR20160138024A (ko) | 2016-12-02 |
US20170019996A1 (en) | 2017-01-19 |
US9814139B2 (en) | 2017-11-07 |
CN106105405B (zh) | 2019-01-18 |
CN106105405A (zh) | 2016-11-09 |
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