WO2015146254A1 - 樹脂膜形成用シート積層体 - Google Patents

樹脂膜形成用シート積層体 Download PDF

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Publication number
WO2015146254A1
WO2015146254A1 PCT/JP2015/051660 JP2015051660W WO2015146254A1 WO 2015146254 A1 WO2015146254 A1 WO 2015146254A1 JP 2015051660 W JP2015051660 W JP 2015051660W WO 2015146254 A1 WO2015146254 A1 WO 2015146254A1
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WO
WIPO (PCT)
Prior art keywords
resin film
sheet
film forming
layer
pressure
Prior art date
Application number
PCT/JP2015/051660
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
泰紀 柄澤
正憲 山岸
Original Assignee
リンテック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by リンテック株式会社 filed Critical リンテック株式会社
Priority to JP2016510079A priority Critical patent/JP6600297B2/ja
Priority to CN201580002966.1A priority patent/CN105793035B/zh
Priority to KR1020167011744A priority patent/KR20160137506A/ko
Priority to KR1020217021516A priority patent/KR102544301B1/ko
Publication of WO2015146254A1 publication Critical patent/WO2015146254A1/ja

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H01L2221/6839—Separation by peeling using peeling wedge or knife or bar

Definitions

  • the present invention relates to a resin film forming sheet laminate in which the resin film forming sheet can be easily attached to a workpiece.
  • chip a semiconductor chip having electrodes such as bumps on a circuit surface
  • the electrodes are bonded to a substrate.
  • the surface (chip back surface) opposite to the circuit surface of the chip may be exposed.
  • the exposed chip back surface may be protected by an organic film.
  • a chip having a protective film made of an organic film is obtained by applying a liquid resin to the back surface of a wafer by spin coating, drying and curing, and cutting the protective film together with the wafer.
  • the thickness accuracy of the protective film formed in this way is not sufficient, the product yield may be lowered.
  • a protective film forming sheet in which a film for forming a semiconductor back surface protective film is laminated on an adhesive layer of an adhesive sheet having an adhesive layer may be used.
  • a semiconductor wafer manufactured in a large diameter state may be cut and separated (diced) into element pieces (semiconductor chips) and then transferred to the next bonding process.
  • the semiconductor wafer is subjected to dicing, cleaning, drying, expanding, and pick-up processes in a state of being adhered to the adhesive sheet in advance, and then transferred to the next bonding process.
  • various dicing / die bonding adhesive sheets having both a wafer fixing function and a die bonding function have been proposed in order to simplify the pick-up process and the bonding process.
  • the adhesive sheet by using the adhesive sheet, it is possible to obtain a semiconductor chip having an adhesive layer attached to the back surface, and direct die bonding such as between an organic substrate and a chip, between a lead frame and a chip, and between a chip and a chip is possible. It becomes.
  • Patent Document 1 Japanese Patent Application Laid-Open No. 2005-350520 describes an adhesive sheet having a structure in which a release substrate, an adhesive layer, an adhesive layer, and a substrate film are sequentially laminated as an adhesive sheet for dicing and die bonding. ing.
  • a resin film forming sheet having a resin film forming layer such as a film for forming a semiconductor back surface protective film or an adhesive layer is attached to a workpiece such as a semiconductor wafer.
  • the resin film forming sheet is used when the end of the resin film forming sheet is not smoothly fed out from the release substrate (release sheet).
  • release sheet Sometimes it was impossible. In other words, the drawn-out resin film forming sheet itself is bent and adhered in the overlapping direction, or the resin film-forming sheet fed out from the release sheet is in close contact (transferred) to the release sheet, or the resin film-forming sheet is In some cases, the sheet could not be fed out from the release sheet.
  • an object of the present invention is to provide a resin film-forming sheet laminate in which the resin film-forming sheet can be easily fed out from the release sheet and can be stably attached to a workpiece.
  • the present inventors have controlled the above-mentioned object by controlling the peeling force of the release sheet and the adhesive force against SUS at the end (outer peripheral part) of the resin film-forming sheet. It was found that the above can be achieved, and the present invention has been completed.
  • the present invention includes the following gist.
  • a release sheet is laminated on a resin film forming layer of a resin film forming sheet including a support sheet and a resin film forming layer, The peeling force of the release sheet at the outer periphery of the resin film forming sheet is 0.05 N / 25 mm or less, A resin film-forming sheet laminate in which the adhesive strength to SUS is 1.0 N / 25 mm or less at the outer peripheral portion of the resin film-forming sheet.
  • a cut portion is formed along the outer periphery of the resin film forming sheet from the surface on the resin film forming layer side,
  • a cut portion is formed along the outer periphery of the resin film forming sheet from the surface on the resin film forming layer side,
  • the resin film-forming sheet laminate of the present invention when the resin film-forming sheet is fed out from the release sheet, the drawn-out resin film-forming sheet itself is bent and adhered in the overlapping direction, or the resin film-forming sheet Can be prevented from being transferred to the release sheet.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32.
  • FIG. 4 is a series of process diagrams for performing an operation of attaching a resin film forming sheet 10 including a support sheet 11 and a resin film forming layer 12 to a semiconductor wafer 32.
  • seat laminated body for resin film formation which concerns on this invention is shown.
  • FIG. 2 shows a schematic cross-sectional view (the resin film forming sheet of the first embodiment) when the resin film forming sheet shown in FIG. 1 is cut along the line AA.
  • seat for resin film formation of a 2nd aspect is shown.
  • seat for resin film formation of a 3rd aspect is shown.
  • seat for resin film formation of a 4th aspect is shown.
  • FIG. 11 is a series of process diagrams for performing a conventional operation of attaching a laminated body including a support sheet and a resin film forming layer to a semiconductor wafer 32.
  • the sheet laminate for resin film formation according to the present invention is an embodiment in which a release sheet is laminated on a resin film formation layer of a resin film formation sheet including a support sheet and a resin film formation layer.
  • the peeling force of the release sheet at the outer periphery of the resin film formation sheet is 0.05 N / 25 mm or less
  • the adhesion to SUS at the outer periphery of the resin film formation sheet The force is 1.0 N / 25 mm or less.
  • the laminated sheet for resin film formation according to the present invention it becomes easy to feed out the sheet 10 for resin film formation from the release sheet 13 even in the workpiece pasting step shown in FIG. Since the sticking to the workpiece 32 can be performed stably, the above problem can be solved.
  • the release sheet 13 has a cut portion along the outer periphery of the resin film forming sheet 10 from the surface on the resin film forming layer side. D1 is formed, and the cut depth d1 of the cut portion D1 is preferably more than 1/2 of the thickness of the release sheet, and more preferably 3/5 to 4/5.
  • the cut portion D1 having a predetermined depth, it becomes easy to create a peeling start point at the interface between the resin film forming sheet 10 and the peeling sheet 13.
  • the feeding property of the resin film forming sheet is improved.
  • the resin film forming sheet can be reliably cut into a predetermined shape in the manufacturing process of the resin film forming sheet laminate. Moreover, by forming the cut portion D1 having a predetermined depth in the release sheet, for example, even when the thickness of the release sheet is 50 ⁇ m or more, the resin film-forming sheet laminate can be easily wound into a roll shape, Excellent storage during storage.
  • stress is applied to the peeling sheet in the longitudinal direction (flow direction). If the cut portion D1 is not formed in the release sheet, the stress may propagate to the resin film forming layer and the resin film forming layer may extend in the flow direction. The deformation (elongation) of the resin film forming layer reduces the thickness accuracy. As a result, the reliability of a semiconductor device obtained using the resin film forming layer may be reduced. By forming a cut portion having a predetermined depth in the release sheet, stress applied to the resin film forming layer can be relaxed, and deformation of the resin film forming layer can be suppressed.
  • the release sheet becomes stronger and tends to be difficult to bend.
  • the stiffness of the resin film-forming sheet tends to be weaker than that of the release sheet. Therefore, in the workpiece pasting step, the peel plate 64 shown in FIG. 1 is applied to the release sheet 13 of the resin film forming sheet laminate 100 and the release sheet 13 is not bent at an acute angle toward the peel plate 64 side. It may be difficult to create a peeling start point at the interface between the sheet 10 and the release sheet 13, and the resin film forming sheet may not be fed out.
  • a peeling sheet having a thickness of 50 ⁇ m or more is difficult to bend to the peel plate side at an acute angle due to its thickness even when a peel plate is used. As shown in FIG. Is difficult.
  • the release sheet can be used even when the thickness of the release sheet is 50 ⁇ m or more.
  • the resin film forming sheet 10 can be easily fed out from the sheet 13, and the resin film forming sheet can be stably attached to the workpiece.
  • the peeling force of the release sheet at the outer peripheral portion of the resin film forming sheet is preferably 0.001 to 0.05 N / 25 mm, more preferably 0.01 to 0.04 N / 25 mm.
  • the adhesive strength against SUS at the outer periphery of the forming sheet is preferably 0.01 to 1.0 N / 25 mm, more preferably 0.1 to 0.8 N / 25 mm.
  • the cut depth d1 of the cut portion D1 is preferably more than 25 ⁇ m. Specifically, when the thickness of the release sheet is 50 ⁇ m, the cut depth d1 of the cut portion D1 is preferably more than 25 ⁇ m, more preferably 30 to 40 ⁇ m, and the thickness of the release sheet is 100 ⁇ m. The cut depth d1 of the cut portion D1 is preferably more than 50 ⁇ m, more preferably 60 to 80 ⁇ m.
  • the cutting depth in this invention measures the depth of the thickness direction of the peeling sheet of the notch
  • Embodiment of Resin Film Forming Sheet Laminate Support sheet 11 and resin film forming layer 12 are cut into a desired planar shape and partially laminated on release sheet 13.
  • the desired planar shape in the support sheet 11 and the resin film forming layer 12 is a state in which the support sheet 11 and the resin film forming layer 12 are partially laminated on the release sheet 13 as shown in FIG. If it becomes the shape used as it, it will not specifically limit.
  • the planar shape of the support sheet 11 is preferably a shape that can be easily attached to a jig such as a ring frame used in the manufacturing process of a semiconductor device to be described later.
  • a circular shape, a substantially circular shape, a rectangular shape, a pentagonal shape, a hexagonal shape examples thereof include a rectangular shape, an octagonal shape, and a wafer shape (a shape in which a part of the outer periphery of the circle is a straight line).
  • a circular shape or a wafer shape is preferable.
  • the planar shape of the resin film forming layer 12 is preferably a shape that matches the planar shape of a workpiece such as a semiconductor wafer.
  • a circular shape, a substantially circular shape, a quadrangular shape, a pentagonal shape, a hexagonal shape, an octagonal shape, a wafer shape It is preferable that the shape be easy to stick to the workpiece, such as (a shape in which a part of the outer periphery of the circle is a straight line).
  • a circular shape or a wafer shape is preferable in order to reduce useless portions other than the portion attached to the workpiece.
  • FIG. 2 is a plan view showing a first embodiment of the resin film-forming sheet laminate 100 according to the present invention
  • FIG. 3 shows the resin film-forming sheet laminate 100 shown in FIG. It is a schematic sectional drawing at the time of cutting along.
  • the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12.
  • the support sheet 11 is a pressure-sensitive adhesive sheet composed of a base material 11a and a pressure-sensitive adhesive layer 11b.
  • a cut portion D ⁇ b> 2 may be formed along the outer periphery of the resin film forming layer 12 in addition to the cut portion D ⁇ b> 1.
  • the depth of cut d2 of the cut portion D2 is not particularly limited, and may be the same as, larger or smaller than the depth of cut d1 of the cut portion D1, but the thickness of the release sheet It is preferably more than 1/2 of the above, more preferably 3/5 to 4/5. Moreover, when the thickness of a peeling sheet is 50 micrometers or more, it is preferable that the cutting depth d2 of the cutting part D2 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 ⁇ m, the cut depth d2 of the cut portion D2 is preferably more than 25 ⁇ m, more preferably 30 to 40 ⁇ m, and the thickness of the release sheet is 100 ⁇ m.
  • the cut depth d2 of the cut portion D2 is preferably more than 50 ⁇ m, more preferably 60 to 80 ⁇ m.
  • the adhesiveness to the release sheet may be increased, and the resin film forming layer may not be fed out in the work pasting process. Even in such a case, by providing the cut portion D2 having a predetermined depth, it is possible to create a peeling start point at the interface between the resin film forming layer 12 and the peeling sheet 13, so that the resin film forming layer 12 Extendability is improved.
  • the cut portion D2 having a predetermined depth, it becomes easy to suppress deformation of the resin film forming layer due to stress applied in the longitudinal direction (flow direction) of the release sheet during the work pasting process.
  • 1st aspect WHEREIN The peeling force of the peeling sheet in the outer peripheral part of the sheet
  • These physical property values in the first aspect can be controlled by adjusting components constituting the pressure-sensitive adhesive layer 11b described later and the thickness of the pressure-sensitive adhesive layer 11b.
  • the said physical-property value in a 1st aspect WHEREIN When an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises the adhesive layer 11b, it is before energy beam irradiation. It is a physical property value.
  • FIG. 4 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the second embodiment.
  • the support sheet 11 and the resin film forming layer 12 in the plan view have the same shape.
  • an adhesive sheet composed of a base material 11a and an adhesive layer 11b may be used as a support sheet, or only the base material 11a may be used as a support sheet.
  • the peeling force of the peeling sheet in the outer peripheral part of the resin film formation sheet or the adhesive force with respect to SUS is a physical-property value measured in the interface of the outer peripheral part of the resin film forming layer 12, and the peeling sheet 13. is there.
  • These physical property values in the second aspect are obtained by using an energy ray curable compound (B) or an energy ray curable polymer (AB) as a component constituting the resin film forming layer, and only on the outer peripheral portion of the resin film forming layer. It can be controlled by means such as irradiation with energy rays.
  • an energy ray shielding layer is provided by printing or the like on the inner peripheral portion of the support sheet, and energy beam irradiation is performed from the support sheet side to the resin film formation layer, or the outer periphery of the resin film formation layer in advance.
  • Examples include a method of irradiating only the part with energy rays and then laminating with a support sheet.
  • FIG. 5 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the third aspect.
  • the support sheet 11 and the resin film forming layer 12 in the plan view have the same shape.
  • a jig adhesive layer 14 is provided between the release sheet 13 and the resin film forming layer 12 in the outer peripheral portion of the resin film forming sheet 10.
  • a cut portion D ⁇ b> 3 may be formed along the inner periphery of the annular jig adhesive layer 14 in addition to the cut portion D ⁇ b> 1.
  • an adhesive sheet composed of a base material 11a and an adhesive layer 11b may be used as a support sheet, or only the base material 11a may be used as a support sheet.
  • the depth of cut d3 of the cut portion D3 is not particularly limited, and may be the same as, larger or smaller than the depth of cut d1 of the cut portion D1, but the thickness of the release sheet It is preferably more than 1/2 of the above, more preferably 3/5 to 4/5. Moreover, when the thickness of a peeling sheet is 50 micrometers or more, it is preferable that the cutting depth d3 of the cutting part D3 is more than 25 micrometers. Specifically, when the thickness of the release sheet is 50 ⁇ m, the cut depth d3 of the cut portion D3 is preferably more than 25 ⁇ m, more preferably 30 to 40 ⁇ m, and the thickness of the release sheet is 100 ⁇ m.
  • the cut depth d3 of the cut portion D3 is preferably more than 50 ⁇ m, more preferably 60 to 80 ⁇ m.
  • the said physical-property value in a 3rd aspect is an energy-beam irradiating compound (AB) and an energy-beam curable polymer (AB) as a component which comprises a jig
  • FIG. 6 is a schematic cross-sectional view of the resin film forming sheet laminate 100 of the fourth aspect.
  • the diameter of the support sheet 11 is larger than the diameter of the resin film forming layer 12 in plan view.
  • a jig adhesive layer 14 is provided between the release sheet 13 and the support sheet 11 on the outer peripheral portion of the resin film forming sheet.
  • a cut portion D ⁇ b> 2 may be formed along the outer periphery of the resin film forming layer 12 in addition to the cut portion D ⁇ b> 1.
  • a cut portion D3 may be formed in the release sheet 13 along the inner periphery of the annular jig adhesive layer 14.
  • the cut depth d2 of the cut portion D2, the cut depth d3 of the cut portion D3, and the effects resulting from these are as described in the first mode and the third mode.
  • the jig adhesive layer 14 is the same as that in the third aspect, and the configuration thereof will be described later.
  • the pressure-sensitive adhesive sheet composed of the base material 11a and the pressure-sensitive adhesive layer 11b may be used as a support sheet, or only the base material 11a may be used as a support sheet as shown in FIG.
  • seat for resin film formation are a physical-property value measured in the interface of the jig
  • FIG. These physical property values in the fourth aspect can be controlled by adjusting components constituting the jig bonding layer described later and the thickness of the jig bonding layer.
  • the said physical-property value in a 4th aspect WHEREIN When an energy-beam curable compound (B) and an energy-beam curable polymer (AB) are included as a component which comprises a jig
  • a resin film forming sheet laminate according to the present invention is obtained by laminating a release sheet on a resin film forming layer of a resin film forming sheet including a support sheet and a resin film forming layer.
  • the resin film forming sheet may include a jig adhesive layer.
  • seat laminated body for resin film formation is demonstrated.
  • Support sheet examples include polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate film, Polyurethane film, ethylene vinyl acetate copolymer film, ionomer resin film, ethylene / (meth) acrylic acid copolymer film, ethylene / (meth) acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluorine A resin film or the like is used. These crosslinked films are also used. Furthermore, these laminated films may be sufficient.
  • an adhesive sheet composed of a base material 11a and an adhesive layer 11b can be used as the support sheet 11.
  • the resin film forming layer is laminated on the pressure-sensitive adhesive layer provided on the base material.
  • the substrate include the films exemplified as the support sheet.
  • the pressure-sensitive adhesive layer can be formed of various conventionally known pressure-sensitive adhesives.
  • the pressure-sensitive adhesive usually contains a polymer (A).
  • A polymer
  • B energy ray-curable compound
  • the energy ray-curable compound (B) contains an energy ray-polymerizable group and has a function of being polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams and reducing the adhesiveness of the pressure-sensitive adhesive.
  • the energy beam polymerizable group in the present invention is a functional group having a polymerizable carbon-carbon double bond, and specific examples thereof include a vinyl group, an allyl group, a (meth) acryloyl group, and the like. (Meth) acryloyl group is mentioned.
  • the energy beam polymerizable group in the present invention does not mean a double bond having no polymerizability because it generates a radical in the presence of a radical and easily causes a polyaddition reaction.
  • each component constituting the energy ray-curable pressure-sensitive adhesive may contain an aromatic ring, but the unsaturated structure of the aromatic ring does not mean the energy ray polymerizable group in the present invention.
  • Such an energy beam curable polymer (AB) has the property of having both a function as a polymer and energy beam curability.
  • the energy ray-curable pressure-sensitive adhesive is not particularly limited, but will be specifically described with an acrylic pressure-sensitive adhesive as an example.
  • the acrylic pressure-sensitive adhesive contains an acrylic polymer (A1) as the polymer (A).
  • the acrylic polymer (A1) a conventionally known acrylic polymer can be used.
  • the weight average molecular weight (Mw) of the acrylic polymer (A1) is preferably 10,000 to 2,000,000, more preferably 100,000 to 1,500,000.
  • the glass transition temperature (Tg) of the acrylic polymer (A1) is preferably in the range of ⁇ 70 to 30 ° C., more preferably in the range of ⁇ 60 to 20 ° C.
  • the monomer constituting the acrylic polymer (A1) includes at least one (meth) acrylic acid ester monomer or a derivative thereof. Specifically, methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, pentyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl ( Alkyl groups such as (meth) acrylate, 2-ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, lauryl (meth) acrylate, tetradecyl (meth) acrylate, octadecyl (meth) acrylate and the like have 1 carbon atom Alkyl (meth) acrylate which is -18; cycloalkyl (meth)
  • (meth) acryl may be used in the meaning including both acryl and methacryl.
  • the acrylic polymer (A1) may be cross-linked.
  • the acrylic polymer (A1) before being crosslinked has a crosslinkable functional group such as a hydroxyl group, and in the composition for forming the pressure-sensitive adhesive layer Add a cross-linking agent.
  • the acrylic polymer (A1) is crosslinked by the reaction between the crosslinkable functional group and the functional group of the crosslinking agent. By crosslinking the acrylic polymer (A1), the cohesive force of the pressure-sensitive adhesive layer can be adjusted.
  • crosslinking agent examples include organic polyvalent isocyanate compounds and organic polyvalent imine compounds.
  • organic polyvalent isocyanate compounds include aromatic polyvalent isocyanate compounds, aliphatic polyvalent isocyanate compounds, alicyclic polyvalent isocyanate compounds, trimers of these organic polyvalent isocyanate compounds, and these organic polyvalent isocyanate compounds.
  • examples thereof include terminal isocyanate urethane prepolymers obtained by reacting with a polyol compound.
  • organic polyvalent isocyanate compound examples include 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylene diisocyanate, diphenylmethane-4,4′-.
  • Examples thereof include polyhydric alcohol adducts (for example, trimethylolpropane adduct tolylene diisocyanate).
  • organic polyvalent imine compounds include N, N′-diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane-tri- ⁇ -aziridinylpropionate, tetramethylol. Mention may be made of methane-tri- ⁇ -aziridinylpropionate and N, N′-toluene-2,4-bis (1-aziridinecarboxamide) triethylenemelamine.
  • the crosslinking agent is usually blended at a ratio of 0.01 to 20 parts by weight, preferably 0.1 to 15 parts by weight, more preferably 0.5 to 12 parts by weight with respect to 100 parts by weight of the acrylic polymer before crosslinking. Is done.
  • the blending amount of the crosslinking agent is increased, the above-described peeling force and adhesive strength are lowered, and when the blending amount of the crosslinking agent is decreased, the peeling force and the tackiness tend to increase.
  • the content of the component constituting the pressure-sensitive adhesive layer is determined based on the content of the acrylic polymer
  • the acrylic polymer is a crosslinked acrylic polymer
  • the standard The content of is the content of the acrylic polymer before being crosslinked.
  • the energy ray-curable compound (B) is a compound that is polymerized and cured when irradiated with energy rays such as ultraviolet rays and electron beams.
  • energy ray curable compounds include low molecular weight compounds (monofunctional and polyfunctional monomers and oligomers) having an energy ray polymerizable group, and specifically include trimethylolpropane triacrylate and tetramethylolmethane.
  • Acrylates such as tetraacrylate, pentaerythritol triacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate, 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, dicyclopentadiene dimethoxydiacrylate, Cyclic aliphatic skeleton-containing acrylates such as isobornyl acrylate, polyethylene glycol diacrylate, oligoester acrylate, urethane acrylate Goma, epoxy-modified acrylates, polyether acrylates, acrylate compounds such as itaconic acid oligomer is used.
  • Such a compound has an energy ray polymerizable group in the molecule and usually has a molecular weight of about 100 to 30,000, preferably about 300 to 10,000.
  • the amount of the low molecular weight compound having an energy ray polymerizable group is preferably 0 to 200 parts by mass relative to 100 parts by mass of the component (A) (including the energy ray curable polymer (AB) described later).
  • the ratio is preferably 1 to 100 parts by mass, more preferably about 1 to 30 parts by mass.
  • the energy beam curable polymer (AB) having the properties of the components (A) and (B) is formed by bonding an energy beam polymerizable group to the main chain, side chain or terminal of the polymer.
  • the energy ray curable polymer bonded to the main chain, side chain or terminal of the energy ray curable polymer is an alkylene group, alkyleneoxy group or polyalkyleneoxy group via the main chain or side chain of the energy ray curable polymer. Or you may couple
  • the weight average molecular weight (Mw) of the energy beam curable polymer (AB) is preferably 10,000 to 2,000,000, and more preferably 100,000 to 1,500,000.
  • the glass transition temperature (Tg) of the energy beam curable polymer (AB) is preferably in the range of ⁇ 70 to 30 ° C., more preferably ⁇ 60 to 20 ° C.
  • Tg is a polymerizable group. It is Tg of the acrylic polymer before making it react with a containing compound.
  • the energy ray curable polymer (AB) includes, for example, an acrylic polymer containing a functional group such as a hydroxy group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group, and a substituent that reacts with the functional group. It is obtained by reacting a polymerizable group-containing compound having 1 to 5 energy beam polymerizable carbon-carbon double bonds per molecule.
  • the acrylic polymer includes a (meth) acrylic acid ester monomer having a functional group such as a hydroxy group, a carboxyl group, an amino group, a substituted amino group, and an epoxy group or a derivative thereof, and a monomer constituting the component (A) described above.
  • a copolymer consisting of Examples of the polymerizable group-containing compound include (meth) acryloyloxyethyl isocyanate, meta-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate, (meth) acryloyl isocyanate, allyl isocyanate, glycidyl (meth) acrylate, and (meth) acrylic acid. Etc.
  • the energy ray curable polymer (AB) When the energy ray curable polymer (AB) is obtained by reacting an acrylic polymer containing a functional group such as a hydroxy group with a polymerizable group-containing compound, the energy ray curable polymer (AB) is Like the above-mentioned acrylic polymer (A1), it may be crosslinked.
  • the acrylic pressure-sensitive adhesive containing the acrylic polymer (A1), the energy ray curable compound (B) and / or the energy ray curable polymer (AB) as described above is cured by irradiation with energy rays. Specifically, ultraviolet rays, electron beams, etc. are used as the energy rays.
  • the polymerization curing time can be shortened and the amount of light irradiation can be decreased.
  • photopolymerization initiators examples include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl, benzoin dimethyl ketal, 2,4-diethyl Thioxanthone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzyl, dibenzyl, diacetyl 1,2-diphenylmethane, 2-hydroxy-2-methyl-1- [4- (1-methylvinyl) phenyl] propanone, 2,4,6-trimethylbenzoy Diphenyl phosphine oxide and ⁇
  • the blending ratio of the photopolymerization initiator is preferably 0.1 to 10 parts by mass with respect to 100 parts by mass in total of the energy beam curable compound (B) and the energy beam curable polymer (AB). More preferably, 5 parts by mass is included. If the blending ratio of the photopolymerization initiator is less than 0.1 parts by mass, satisfactory curability may not be obtained due to insufficient photopolymerization, and if it exceeds 10 parts by mass, a residue that does not contribute to photopolymerization is generated. May cause malfunctions.
  • the thickness of the support sheet is usually 10 to 500 ⁇ m, preferably 15 to 300 ⁇ m, more preferably 20 to 250 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is preferably 2 to 20 ⁇ m in the support sheet, more preferably 3 to 15 ⁇ m, still more preferably 4 to 10 ⁇ m. If the thickness of the pressure-sensitive adhesive layer is too small, sufficient peel strength or pressure-sensitive adhesive strength may not be expressed. If the thickness of the pressure-sensitive adhesive layer is too large, the peel strength or pressure-sensitive adhesive strength increases, and the effect of the present invention. May not be possible.
  • the resin film forming layer in the present invention is appropriately selected from resins having various functions such as a film adhesive, an adhesive layer, and a protective film forming layer, which will be described later, according to the use of the sheet.
  • the resin film forming layer may be a film adhesive.
  • film adhesives are frequently used in the die bonding process of chips in recent years.
  • a film adhesive is preferably an epoxy adhesive or polyimide adhesive formed into a film and semi-cured (B-stage state), and is formed to be peelable on the above support sheet.
  • the film adhesive is affixed to the workpiece.
  • an adhesive-attached chip is obtained, which is picked up from the support sheet, and the chip is fixed to a predetermined position via the adhesive. It is preferable to perform expansion when picking up the chip with adhesive.
  • the sheet for forming a resin film in the present invention may be a dicing / die-bonding sheet having both a wafer fixing function during dicing and a die bonding function during die bonding.
  • the resin film forming layer holds a work or a chip obtained by separating the work in the dicing process, and is cut together with the work during dicing and has the same shape as the chip.
  • a resin film forming layer is formed.
  • the resin film forming layer is peeled off from the support sheet together with the chip.
  • the resin film forming layer functions as an adhesive for fixing the chip during die bonding.
  • a chip with a resin film forming layer is placed on a substrate, heated, etc., and the chip and an adherend such as a substrate or another chip are bonded via the resin film forming layer.
  • an adhesive having a pressure-sensitive adhesive property as a resin film forming layer on the support sheet and having a die bonding function A layer is formed.
  • the resin film forming layer having both the wafer fixing function and the die bonding function includes, for example, the above-described acrylic polymer (A1) and an epoxy adhesive, and, if necessary, an energy ray curable compound. (B), an energy beam curable polymer (AB), a curing aid and the like.
  • A1 acrylic polymer
  • B an energy beam curable polymer
  • AB energy beam curable polymer
  • the resin film forming layer is a protective film for forming the protective film on the back surface of the chip. It may be a forming layer.
  • a work is stuck on the protective film forming layer, the protective film forming layer is cured to form a protective film, and then the work and the protective film are diced to obtain a chip with a protective film.
  • Such a protective film forming sheet has an adhesive resin layer (protective film forming layer) serving as a protective film as a resin film forming layer on the support sheet.
  • the resin film forming layer serving as such a protective film includes, for example, the above-described acrylic polymer (A1), an epoxy adhesive and a curing aid, and, if necessary, an energy ray curable compound (B), An energy beam curable polymer (AB), a filler, or the like may be contained.
  • the thickness of the resin film-forming layer varies depending on the application, but is approximately 1 to 300 ⁇ m, preferably 10 to 200 ⁇ m, particularly preferably 20 to 100 ⁇ m.
  • the jig adhesive layer As a jig
  • the jig adhesive layer is, for example, an annular shape (ring shape), has a hollow portion (internal opening), and has a size that can be fixed to a jig such as a ring frame.
  • the inner diameter of the ring frame is smaller than the outer diameter of the jig adhesive layer. Further, the inner diameter of the ring frame is slightly larger than the inner diameter of the jig adhesive layer.
  • the ring frame is usually a molded body of metal or plastic.
  • the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is not particularly limited, but for example, it is made of an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, or a silicone pressure-sensitive adhesive. Is preferred.
  • the acrylic containing the acrylic polymer (A1) described above is taken into consideration in the outer peripheral portion of the resin film forming sheet in consideration of the peeling force of the release sheet, the adhesive strength against SUS, and the removability from the ring frame.
  • System adhesives are preferred.
  • the said adhesive may be used independently or may be used in mixture of 2 or more types.
  • the thickness of the pressure-sensitive adhesive layer constituting the jig adhesion layer is preferably 2 to 20 ⁇ m, more preferably 3 to 15 ⁇ m, and further preferably 4 to 10 ⁇ m.
  • the thickness of the pressure-sensitive adhesive layer is less than 2 ⁇ m, sufficient peeling force or adhesive force may not be exhibited.
  • the thickness of the pressure-sensitive adhesive layer exceeds 20 ⁇ m, the peeling force and the pressure-sensitive adhesive force are increased, and the effect of the present invention cannot be exhibited, or a residue of the pressure-sensitive adhesive remains on the ring frame when peeling from the ring frame, May contaminate the ring frame.
  • the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer is the same as the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer in the pressure-sensitive adhesive member composed of the above pressure-sensitive adhesive layer alone. The same applies to the thickness of the pressure-sensitive adhesive layer.
  • the base material constituting the jig adhesive layer is not particularly limited.
  • examples thereof include polyolefin films such as acrylate copolymer films and ionomer resin films, polyvinyl chloride films, and polyethylene terephthalate films.
  • a polyethylene film and a polyvinyl chloride film are preferable, and a polyvinyl chloride film is more preferable.
  • the thickness of the base material constituting the jig adhesion layer is preferably 15 to 200 ⁇ m, more preferably 30 to 150 ⁇ m, and still more preferably 40 to 100 ⁇ m.
  • the double-sided pressure-sensitive adhesive member When a double-sided pressure-sensitive adhesive member having a core material is used as a jig adhesive layer, the double-sided pressure-sensitive adhesive member is formed on the core material, a laminating pressure-sensitive adhesive layer formed on one surface thereof, and the other surface. It consists of an adhesive layer for fixing.
  • the pressure-sensitive adhesive layer for laminating is the pressure-sensitive adhesive layer on the side attached to the resin film-forming layer in the third aspect, and is the pressure-sensitive adhesive layer on the side attached to the support sheet in the fourth aspect.
  • the fixing pressure-sensitive adhesive layer is a pressure-sensitive adhesive layer on the side attached to the release sheet.
  • the core material of the double-sided pressure-sensitive adhesive member the same material as the base material of the pressure-sensitive adhesive member can be mentioned.
  • polyolefin film and plasticized polyvinyl chloride film are preferred in view of expandability.
  • the thickness of the core material is usually 15 to 200 ⁇ m, preferably 30 to 150 ⁇ m, more preferably 40 to 100 ⁇ m.
  • the double-sided pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer may be the same pressure-sensitive adhesive layer or different pressure-sensitive adhesive layers.
  • the pressure-sensitive adhesive constituting the fixing pressure-sensitive adhesive layer is formed so that the peeling force of the release sheet and the pressure-sensitive adhesive force against SUS are within a predetermined range at the outer peripheral portion of the resin film-forming sheet, and the pressure-sensitive adhesive layer for fixing and the ring frame Is suitably selected so that the adhesive strength between the resin film forming layer or the support sheet and the adhesive layer for lamination is smaller.
  • pressure-sensitive adhesives include acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, and silicone pressure-sensitive adhesives.
  • an acrylic pressure-sensitive adhesive containing the above-mentioned acrylic polymer (A1) is preferable.
  • the pressure-sensitive adhesive forming the fixing pressure-sensitive adhesive layer may be used alone or in combination of two or more.
  • the pressure-sensitive adhesive constituting the lamination pressure-sensitive adhesive layer is not particularly limited, and examples thereof include an acrylic pressure-sensitive adhesive, a rubber pressure-sensitive adhesive, and a silicone pressure-sensitive adhesive.
  • the acrylic pressure-sensitive adhesive containing the above-mentioned acrylic polymer (A1) is preferable from the viewpoint of easy control of the adhesive force with the resin film forming layer or the support sheet.
  • stacking may be used independently, or 2 or more types may be mixed and used for it.
  • the thickness of the laminating pressure-sensitive adhesive layer and the fixing pressure-sensitive adhesive layer is the same as the thickness of the pressure-sensitive adhesive layer of the pressure-sensitive adhesive member.
  • the jig adhesive layer By providing the jig adhesive layer, it becomes easy to bond the resin film forming sheet to a jig such as a ring frame.
  • the release sheet serves as a carrier film when the resin film-forming sheet is used, and the film exemplified as the support sheet described above can be used.
  • the surface tension of the surface in contact with the resin film forming layer of the release sheet is preferably 40 mN / m or less, more preferably 37 mN / m or less, and particularly preferably 35 mN / m or less.
  • the lower limit is usually about 25 mN / m.
  • Such a release sheet having a relatively low surface tension can be obtained by appropriately selecting the material, and can also be obtained by applying a release agent to the surface of the release sheet and performing a release treatment. .
  • alkyd, silicone, fluorine, unsaturated polyester, polyolefin, wax, and the like are used as the release agent used for the release treatment.
  • alkyd, silicone, and fluorine release agents are heat resistant. This is preferable.
  • the release agent can be used without any solvent, or can be diluted or emulsified in a solvent to obtain a gravure coater, Mayer bar coater, air knife coater.
  • the release sheet coated with a release coater may be applied at room temperature or under heating, or may be cured with an electron beam to form a release agent layer.
  • the surface tension of the release sheet may be adjusted by laminating films by wet lamination, dry lamination, hot melt lamination, melt extrusion lamination, coextrusion processing, or the like. That is, a film in which the surface tension of at least one surface is in a preferable range as the surface in contact with the resin film forming layer of the release sheet described above is set so that the surface is in contact with the resin film forming layer. It is good also as a peeling sheet by manufacturing the laminated body laminated
  • the thickness of the release sheet is not particularly limited, but is preferably 50 ⁇ m or more, more preferably 50 to 200 ⁇ m.
  • the release film is less than 50 ⁇ m, when the resin film-forming sheet is wound into a roll, winding marks may occur in the resin film-forming layer.
  • the thickness accuracy of the resin film forming layer is lowered, and in the air biting when the resin film forming layer is attached to the workpiece or in the method of manufacturing a semiconductor device described later, the chip is attached to the resin film. This may cause a decrease in adhesiveness and void generation when bonded to a chip mounting portion (a substrate or another chip) via the formation layer.
  • the resin film forming layer is used as a protective film for protecting the back surface of the chip, the traces of the resin film forming layer cause an appearance defect in addition to the above.
  • the sheet laminate for forming a resin film having the above-described configuration / configuration is obtained by removing the release sheet, and then attaching the resin film forming layer to the work. Applied. Then, the support film is peeled off while the resin film forming layer remains fixed to the workpiece. That is, it is used in a process including a step of transferring a resin film forming layer from a support sheet to a workpiece.
  • the workpiece applicable in the present invention is not limited to the material, and examples thereof include various articles such as a semiconductor wafer, a glass substrate, a ceramic substrate, an organic material substrate such as an FPC, or a metal material such as precision parts. .
  • the shape of the resin film-forming sheet laminate can be a belt-like shape in which a resin film-forming sheet including a support sheet and a resin film-forming layer is laminated on a long release sheet, which can be rolled up.
  • a form in which a resin film forming sheet including a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals.
  • the shape of the resin film-forming sheet laminate can also be a single wafer.
  • a resin film including a support sheet and a resin film forming layer cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals.
  • the thickness of the sheet laminate for resin film formation becomes nonuniform between the portion where the sheet for application is laminated and the portion where the sheet for resin film formation is not laminated.
  • the thickness becomes non-uniform, the non-uniform winding pressure may occur, and the roll may collapse. Therefore, it is preferable to make the thickness uniform in the sheet laminate for forming a resin film in such a form.
  • the peripheral tape 14 having the same thickness as the resin film forming sheet is bonded.
  • the distance between the resin film forming sheet and the peripheral tape 14 is preferably about 1 to 20 mm, and particularly preferably about 2 to 10 mm. The peripheral tape 14 makes it easier to avoid the above problems by eliminating the uneven thickness.
  • a resin film-forming sheet laminate in which a resin film-forming sheet cut out in accordance with a desired shape is laminated on a long release sheet so as to be peeled at regular intervals.
  • the manufacturing method of the body will be described by taking the first mode shown in FIG. 3 and the third mode shown in FIG. 5 as an example.
  • the resin film forming sheet of the present invention is obtained by such a manufacturing method. It is not limited.
  • the resin film forming layer on the release sheet is half-cut into a desired shape.
  • first long release sheet two long release sheets
  • second long release sheet is the release sheet 13 in FIG. 3.
  • a resin film forming layer formed in advance in a film shape may be sandwiched between two long release sheets, and a resin film forming composition for forming a resin film forming layer is used as one long release sheet.
  • the laminate may be formed by coating, drying, and pasting the other long release sheet on the coating film.
  • the first long release sheet is removed.
  • the resin film forming layer is completely cut into a desired shape, and the resin film forming layer is die-cut (half cut) so as to reach the second long release sheet 13.
  • Die cutting is performed by a general-purpose apparatus (rotary blade or flat blade) and method such as die cutting.
  • the cutting depth at this time is the total depth of the thickness of the resin film forming layer and the cutting depth d2 in order to completely cut the resin film forming layer and form the cutting portion D2 having the cutting depth d2. Cut in. For this reason, the cut part D2 of the cut depth d2 is formed in the surface of a 2nd elongate peeling sheet.
  • an adhesive tape for peeling is applied in the longitudinal direction of the resin film forming layer. Then, by removing the peeling adhesive tape, the resin film forming layer 12 having a desired shape is left on the second long release sheet 13, and the remaining resin film forming layer is removed. The remaining portions other than the resin film forming layer having a desired shape are continuous. For this reason, when the interface between the second long release sheet and the resin film forming layer is a starting point of peeling, the remaining resin film forming layer is removed, and the resin film forming layer 12 having a desired shape is formed into the second long film. It remains on the scale release sheet 13. As a result, a laminated body in which the resin film forming layers 12 having a desired shape are arranged on the second long release sheet 13 is obtained.
  • the support sheet 11 is attached to the surface of the second long release sheet 13 having the resin film forming layer 12 so as to be in contact with the second long release sheet 13 and the resin film forming layer 12.
  • the support sheet 11 is a pressure-sensitive adhesive sheet composed of a base material 11a and a pressure-sensitive adhesive layer 11b.
  • the method for forming the pressure-sensitive adhesive layer 11b on the base material 11a is not particularly limited.
  • a method for forming the pressure-sensitive adhesive layer 11b on the base material 11a by applying and drying the composition (pressure-sensitive adhesive) Examples include a method in which an adhesive is provided on a release sheet different from the release sheet, and the adhesive is transferred to the base material 11a.
  • the support sheet is die-cut into a desired shape that is larger than the inner diameter of the ring frame and smaller than the outer diameter.
  • the resin film forming layer 12 is punched so that the center point of the resin film forming layer 12 coincides with the center point of the support sheet 11 after punching.
  • the cut depth is cut by the total depth of the thickness of the support sheet and the cut depth d1. For this reason, the cut part D1 of the cut depth d1 is formed in the surface of a 2nd elongate peeling sheet.
  • the support sheet 11 having a desired shape is left on the second long release sheet 13 and the remaining support sheet is removed.
  • the resin film forming sheet laminate according to the first aspect in which a resin film forming sheet including a resin film forming layer having a desired shape and the support sheet 11 is laminated on the second long release sheet 13. Is obtained.
  • the support sheet when the support sheet is die cut, the support sheet is cut into a desired shape, and a small interval is provided outside the support sheet 11 of the shape so as to form the second long release sheet. It is preferable to perform die cutting so that the supporting sheet as the peripheral tape 14 remains along both edges 15 in the short direction. Thereafter, the support sheet 11 and the peripheral tape 14 having a desired shape are left on the second long release sheet 13 and the remaining support sheet is removed, thereby including the support sheet 11 and the resin film forming layer 12.
  • the resin film forming sheet laminate 100 in a form in which the resin film forming sheet 10 and the peripheral tape 14 are continuously bonded onto the long release sheet 13 is obtained.
  • the pressure-sensitive adhesive for forming the pressure-sensitive adhesive layer (laminating pressure-sensitive adhesive layer and fixing pressure-sensitive adhesive layer) of the jig adhesive layer is prepared.
  • the pressure-sensitive adhesive constituting the lamination pressure-sensitive adhesive layer is referred to as “laminating pressure-sensitive adhesive”
  • the pressure-sensitive adhesive for forming the fixation pressure-sensitive adhesive layer is referred to as “fixation pressure-sensitive adhesive”.
  • the lamination pressure-sensitive adhesive is applied onto a long release sheet (hereinafter referred to as a third long release sheet) and dried to form a lamination pressure-sensitive adhesive layer.
  • a third long release sheet a long release sheet
  • the pressure-sensitive adhesive layer for lamination is bonded to the core material to obtain a laminate in which the core material, the pressure-sensitive adhesive layer for lamination, and the third long release sheet are laminated in this order.
  • the fixing adhesive is applied onto a long release sheet (hereinafter referred to as a fourth long release sheet.
  • the fourth long release sheet is the release sheet 13 in FIG. 5) and dried.
  • a fixing pressure-sensitive adhesive layer is formed.
  • the pressure-sensitive adhesive layer for lamination is bonded to the core material of the laminate obtained above, and the third long release sheet, the pressure-sensitive adhesive layer for lamination, the core material, the pressure-sensitive adhesive layer for fixation, and the fourth long-length material.
  • a laminate in which release sheets are laminated in this order (a jig adhesive layer sandwiched between long release sheets) is obtained.
  • the laminate in which the jig adhesive layer and the fourth long release sheet are laminated in this order is cut into a desired shape, and the laminate is die-cut (half-cut) so as to reach the fourth long release sheet.
  • Die cutting is performed by a general-purpose apparatus (rotary blade or flat blade) and method such as die cutting.
  • the depth of cut is that the laminate is completely cut to form a cut portion D3 having a depth of cut d3. .
  • the cutting part D3 of the cutting depth d3 is formed in the surface of a 4th elongate peeling sheet.
  • an adhesive tape for peeling is applied in the longitudinal direction of the jig adhesive layer. Then, the jig adhesive layer having a desired shape is removed from the fourth long release sheet 13 by removing the peeling adhesive tape. As a result, a laminated body is obtained in which a jig adhesive layer having an internal opening of a desired shape is laminated on the fourth long release sheet 13.
  • the support sheet 11 in which the adhesive layer 11b is formed on the base material 11a is prepared.
  • the method for obtaining the support sheet is as described in the first aspect.
  • the method for forming the resin film forming layer 12 on the pressure-sensitive adhesive layer 11b is not particularly limited.
  • a method for forming the resin film-forming composition on the pressure-sensitive adhesive layer 11b by applying and drying, or a method for forming a resin film examples include a method of forming the composition on a release sheet different from the release sheet and transferring the composition to the pressure-sensitive adhesive layer 11b. In this way, a laminate composed of the support sheet 11 and the resin film forming layer 12 is obtained.
  • the support sheet 11 and the resin film forming layer 12 are formed so that the surface of the fourth long release sheet 13 having the jig adhesive layer is in contact with the fourth long release sheet 13 and the jig adhesive layer.
  • the resin film forming layer 12 of the laminate is affixed, and the resin film forming sheet 10 is formed on the fourth long release sheet 13.
  • the resin film forming sheet 10 is die-cut into a desired shape that is not less than the inner diameter of the ring frame and not more than the outer diameter.
  • the die is cut so that the center point of the internal opening of the jig adhesive layer coincides with the center point of the resin film forming sheet 10 after die cutting.
  • the depth of cut is the total depth of the thickness of the resin film forming sheet and the depth of cut d1 in order to completely cut the resin film formed sheet and form the cut portion D1 of the depth of cut d1. Cut in. For this reason, the cut part D1 of the cut depth d1 is formed in the surface of a 4th elongate peeling sheet.
  • the resin film forming sheet 10 having a desired shape is left on the fourth long release sheet 13 and the remaining resin film forming sheet is removed.
  • the resin film forming sheet laminate of the third aspect in which the resin film forming sheet 10 having a desired shape is laminated on the fourth long release sheet 13 is obtained.
  • the resin film forming sheet laminate of the first embodiment shown in FIGS. 2 and 3 is applied to the semiconductor device manufacturing method. This will be described as an example.
  • a method of manufacturing a semiconductor device using a resin film-forming sheet laminate The resin film-forming layer of the laminate is attached to a work, and the work is diced into chips. It is preferable that the method includes a step of leaving the resin film forming layer fixedly remaining on the surface and peeling the resin film from the support sheet, and placing the chip on the die pad portion or another chip via the resin film forming layer. .
  • the formation of a circuit on the wafer surface can be performed by various methods including conventionally used methods such as an etching method and a lift-off method.
  • the opposite surface (back surface) of the circuit surface of the wafer is ground.
  • the grinding method is not particularly limited, and grinding may be performed by a known means using a grinder or the like.
  • an adhesive sheet called a surface protection sheet is attached to the circuit surface in order to protect the circuit on the surface.
  • the circuit surface side (that is, the surface protection sheet side) of the wafer is fixed by a chuck table or the like, and the back surface side on which no circuit is formed is ground by a grinder.
  • the thickness of the wafer after grinding is not particularly limited, but is usually about 50 to 500 ⁇ m.
  • the crushed layer generated during back grinding is removed.
  • the crushed layer is removed by chemical etching, plasma etching, or the like.
  • the resin film forming layer of the resin film forming sheet laminate is pasted on the back surface of the wafer.
  • the attaching method is not particularly limited.
  • the resin film forming layer is attached to the semiconductor wafer in the step shown in FIG.
  • FIGS. 1A to 1D are a series of process diagrams in which the operation of attaching the resin film forming sheet 10 to the semiconductor wafer 32 is performed.
  • the release sheet 13 plays the role of a carrier film, while being supported by two rolls 62 and 66 and a peel plate 64,
  • the first roll 42 is wound with one end connected to the cylindrical core 44
  • the second roll 52 is wound with the other end connected to the cylindrical core 54.
  • a core driving motor (not shown) for rotating the core 54 is connected to the core 54 of the second roll 52, and the resin film forming sheet 10 is peeled off.
  • the release sheet 13 is wound at a predetermined speed.
  • the winding core driving motor rotates
  • the winding core 54 of the second roll 52 rotates and the resin film forming sheet 100 is wound around the winding core 44 of the first roll 42.
  • the sheet 10 is pulled out of the first roll 42.
  • the drawn resin film forming sheet 10 is guided onto a disk-shaped semiconductor wafer 32 disposed on a movable stage and a ring frame 34 disposed so as to surround the semiconductor wafer 32.
  • the resin film forming sheet 10 is peeled from the release sheet 13.
  • the peel plate 64 is applied from the peeling sheet 13 side of the sheet
  • the resin film forming sheet can be easily fed out.
  • the peeling sheet 13 is bend
  • air may be blown to the boundary surface between the release sheet 13 and the resin film forming sheet 10 so that the release start point is more efficiently created. As a result, the feeding of the resin film forming sheet 10 is further facilitated.
  • the resin film forming sheet 10 is attached so that the resin film forming sheet 10 is in close contact with the ring frame 34 and the semiconductor wafer 32. At this time, the resin film forming sheet 10 is pressed against the semiconductor wafer 32 by the roll 68. Then, as shown in FIG. 1D, the attachment of the resin film forming sheet 10 onto the semiconductor wafer 32 is completed, and a semiconductor wafer with a resin film forming sheet is obtained.
  • the resin film forming sheet 10 can be attached to the semiconductor wafer 32 continuously in an automated process.
  • An example of an apparatus for performing the operation of attaching the resin film forming sheet 10 to the semiconductor wafer 32 is RAD-2500 (trade name) manufactured by Lintec Corporation.
  • the resin film forming sheet 10 is attached to the semiconductor wafer 32 by such a process, the resin film forming sheet is used by using the resin film forming sheet laminate having desired physical properties according to the present invention.
  • the resin film-forming sheet is released from the release sheet at the outer periphery and is fed out.
  • the resin film forming layer When the resin film forming layer does not have tackiness at room temperature, it may be heated appropriately (although it is not limited, 40 to 80 ° C. is preferable).
  • the resin film forming layer is irradiated with energy rays from the support sheet side, and the resin is formed.
  • the layer-forming layer may be preliminarily cured to increase the cohesive force of the resin film-forming layer and reduce the adhesive force between the resin film-forming layer and the support sheet.
  • the cutting depth at this time is a depth that takes into account the sum of the thickness of the semiconductor wafer and the thickness of the resin film forming layer and the amount of wear of the dicing saw.
  • the energy beam irradiation may be performed at any stage after the semiconductor wafer is pasted and before the semiconductor chip is peeled off (pickup).
  • the irradiation may be performed after dicing or after the following expanding step. Although it is good, it is preferably performed after the semiconductor wafer is attached and before dicing. Further, the energy beam irradiation may be performed in a plurality of times.
  • the resin film forming sheet is expanded, the interval between the semiconductor chips is expanded, and the semiconductor chips can be picked up more easily. At this time, a deviation occurs between the resin film forming layer and the support sheet, the adhesive force between the resin film forming layer and the support sheet is reduced, and the pick-up property of the semiconductor chip is improved. When the semiconductor chip is picked up in this manner, the cut resin film forming layer can be adhered to the back surface of the semiconductor chip and peeled off from the support sheet.
  • the semiconductor chip is placed on the die pad of the lead frame or on the surface of another semiconductor chip (lower chip) through the resin film forming layer (hereinafter, the die pad or lower chip surface on which the chip is mounted is referred to as “chip mounting portion”. ).
  • the pressure when mounting is usually 1 kPa to 200 MPa.
  • the chip mounting portion may be heated before mounting the semiconductor chip or heated immediately after mounting.
  • the heating temperature is usually 80 to 200 ° C., preferably 100 to 180 ° C.
  • the heating time is usually 0.1 seconds to 5 minutes, preferably 0.5 seconds to 3 minutes.
  • the heating conditions at this time are in the above heating temperature range, and the heating time is usually 1 to 180 minutes, preferably 10 to 120 minutes.
  • the resin film forming layer may be cured by using a heat in resin sealing that is normally performed in package manufacturing, without temporarily performing the heat treatment after placement.
  • the resin film formation layer hardens
  • the resin film forming layer of the resin film forming sheet is pasted on the back surface of the semiconductor wafer having a circuit formed on the surface, and then the resin film is applied on the back surface. It is preferable to obtain a semiconductor chip having the same.
  • the resin film is a protective film for a semiconductor chip.
  • the method for manufacturing a semiconductor device according to the present invention preferably further includes the following steps (1) to (3), wherein the steps (1) to (3) are performed in an arbitrary order. Step (1): peeling the resin film forming layer or resin film and the support sheet, Step (2): The resin film forming layer is cured to obtain a resin film. Step (3): dicing the semiconductor wafer and the resin film forming layer or resin film.
  • the resin film forming layer of the resin film forming sheet is attached to the back surface of the semiconductor wafer. This step is the same as the attaching step in the first method for manufacturing a semiconductor device.
  • steps (1) to (3) are performed in an arbitrary order.
  • the steps (1) to (3) are performed in the order of steps (1), (2), (3), the steps (2), (1), (3), the steps (2), (3),
  • the order is (1), steps (3), (2), (1), or steps (3), (1), (2). Details of this process are described in detail in JP-A-2002-280329. As an example, the case where it performs in order of process (1), (2), (3) is demonstrated.
  • a resin film forming layer of a resin film forming sheet is attached to the back surface of a semiconductor wafer having a circuit formed on the front surface.
  • the support sheet is peeled from the resin film forming layer to obtain a laminate of the semiconductor wafer and the resin film forming layer.
  • the resin film forming layer is cured to form a resin film on the entire surface of the wafer.
  • the resin film forming layer contains an epoxy adhesive, the resin film forming layer is cured by thermosetting.
  • the resin film forming layer can be cured by energy ray irradiation, and an epoxy adhesive, energy
  • curing by heating and energy beam irradiation may be performed simultaneously or sequentially.
  • the energy rays to be irradiated include ultraviolet rays (UV) and electron beams (EB), and preferably ultraviolet rays are used.
  • a resin film made of a cured resin is formed on the back surface of the wafer, and the strength is improved as compared with the case of the wafer alone, so that damage during handling of the thinned wafer can be reduced. Further, compared with a coating method in which a coating solution for a resin film is directly applied to the back surface of a wafer or chip, the thickness of the resin film is excellent.
  • the laminated body of the semiconductor wafer and the resin film is diced for each circuit formed on the wafer surface. Dicing is performed so as to cut both the wafer and the resin film.
  • the wafer is diced by a conventional method using a dicing sheet. As a result, a semiconductor chip having a resin film on the back surface is obtained.
  • Laser printing can be performed on the resin film.
  • Laser printing is performed by a laser marking method, and the surface of the protective film is scraped off by laser light irradiation to mark a product number or the like on the protective film.
  • Laser printing can also be performed before the resin film forming layer is cured.
  • a semiconductor chip having a resin film on the back surface can be obtained.
  • the semiconductor device can be manufactured by mounting the semiconductor chip on a predetermined base by the face-down method.
  • a semiconductor device can be manufactured by bonding a semiconductor chip having a resin film on the back surface to another member (on a chip mounting portion) such as a die pad portion or another semiconductor chip. According to the present invention, a highly uniform resin film can be easily formed on the back surface of the chip, and cracks after the dicing process and packaging are less likely to occur.
  • the resin film formation sheet serves as a dicing sheet.
  • the semiconductor wafer is bonded to the inner peripheral portion of the resin film forming sheet via the resin film forming layer, and the outer peripheral portion of the resin film forming sheet is bonded to another jig such as a ring frame, A resin film forming sheet affixed to the semiconductor wafer is fixed to the apparatus, and dicing is performed.
  • a semiconductor chip having a resin film forming layer on the back surface is mounted on a predetermined base by a face-down method, and is usually used in package manufacturing.
  • the resin film forming layer can also be cured by utilizing heating in the resin sealing performed.
  • Adhesion between support sheets or resin film-forming layers and transfer to release sheet Adhesion between support sheets or resin film forming layers (hereinafter referred to as adhesion evaluation) and transfer to a release sheet (hereinafter referred to as transfer evaluation) were performed as follows. When removing the release sheet from the resin film-forming sheet laminate, the support sheets of the resin film-forming sheets or the resin film-forming layers are bent in close contact with each other, or the resin film-forming sheet is attached to the release sheet. It was confirmed visually whether or not the transfer was performed.
  • a MEK solution (solid content concentration 25%) is prepared by adding 8 parts by mass of trimethylolpropane adduct tolylene diisocyanate and 3 parts by mass of 1-hydroxycyclohexyl phenyl ketone to 100 parts by mass of the solid content of the energy ray curable polymer. And the adhesive for forming the adhesive layer of the support sheet A was obtained.
  • an adhesive layer might be set to 10 micrometers on the peeling process surface of PET film (thickness: 50 micrometers) which peel-processed said adhesive. Then, the base material and the adhesive layer were bonded together and the support sheet A was obtained.
  • Methacryloyloxyethyl isocyanate 50 mol per 100 mol of 2-hydroxyethyl acrylate unit
  • Trimethylolpropane adduct tolylene diisocyanate, 2,2-dimethoxy-1,2-diphenylethane-1-one, and 1-hydroxycyclohexyl phenyl ketone are added to 100 parts by mass of the solid content of the energy ray curable polymer.
  • the MEK solution (solid content concentration 25%) to which 1 part by mass of each was added was prepared, and an adhesive for forming the adhesive layer of the support sheet B was obtained.
  • Example 1 Preparation of Jig Adhesive Layer A release-treated PET film (thickness: 50 ⁇ m) was prepared as a long release sheet. The pressure-sensitive adhesive for lamination was applied on the release-treated surface of the release sheet so that the thickness of the pressure-sensitive adhesive layer for lamination was 5 ⁇ m. Next, the pressure-sensitive adhesive layer for lamination and the core material (polypropylene base material, thickness: 40 ⁇ m) were bonded together.
  • the core material polypropylene base material, thickness: 40 ⁇ m
  • a fixing pressure-sensitive adhesive layer having a thickness of 5 ⁇ m is formed on the release-treated surface of another release sheet, and bonded to the core material, and then the release sheet, the pressure-sensitive adhesive layer for lamination, and the core material Then, a laminate (laminate for jig adhesive layer) in which the fixing adhesive layer and the release sheet were laminated in this order was obtained.
  • the release sheet on the laminating pressure-sensitive adhesive layer side was removed from the laminated body for bonding jig adhesive layer, and the mold was punched from the laminating pressure-sensitive adhesive layer side into a circle having a diameter of 330 mm.
  • the die cutting was performed so that the pressure-sensitive adhesive layer for lamination, the core material, and the pressure-sensitive adhesive layer for fixing were completely cut, and 30 ⁇ m was cut into the release sheet on the side of the pressure-sensitive adhesive layer for fixing. That is, a cut portion D3 having a cut depth d3 of 30 ⁇ m was formed.
  • the laminate composed of the pressure-sensitive adhesive layer for lamination cut into a circle, the core material, and the pressure-sensitive adhesive layer for fixing was removed, a circular internal opening was formed, and a jig adhesive layer was produced on the release sheet.
  • the thickness of a resin film formation layer might be set to 20 micrometers on the peeling process surface of PET film (thickness: 50 micrometers) which peel-processed said composition for resin film formation. Thereafter, the resin film-forming layer and the pressure-sensitive adhesive layer of the support sheet A obtained above were bonded together to obtain a laminate composed of the support sheet A and the resin film-forming layer.
  • a resin film forming layer of a laminate composed of the support sheet A and the resin film forming layer was attached to the jig adhesive layer on the release sheet, and a resin film forming sheet was formed on the release sheet.
  • the resin film forming sheet is die-cut into a circular shape with a diameter of 370 mm concentrically with the circular inner opening of the jig adhesive layer, unnecessary portions are removed, and the resin film forming sheet stack of the third aspect is laminated.
  • the die cutting was performed so that the resin film-forming sheet was completely cut and 30 ⁇ m was cut into the release sheet. That is, a cut portion D1 having a cut depth d1 of 30 ⁇ m was formed.
  • Each evaluation was performed using this sheet laminate for resin film formation. The results are shown in Table 1.
  • Example 2 A sheet laminate for forming a resin film was obtained in the same manner as in Example 1 except that the cut depth of the cut portion D1 was set to 35 ⁇ m, and each evaluation was performed. The results are shown in Table 1.
  • Example 3 Production of Resin Film Forming Sheet Laminate
  • a release-treated PET film (thickness: 50 ⁇ m) was prepared as a long release sheet.
  • the above resin film-forming composition is applied onto the release-treated surface of the release sheet so that the thickness of the resin film-forming layer is 20 ⁇ m, and another release sheet (PET film, thickness: 50 ⁇ m) is applied to the resin film. Laminated on the forming layer.
  • one release sheet was removed, and the resin film forming layer was die-cut into a circle having a diameter of 330 mm.
  • the die cutting was performed so that the resin film forming layer was completely cut and 30 ⁇ m was cut into the release sheet. That is, a cut portion D2 having a cut depth d2 of 30 ⁇ m was formed. Thereafter, the remaining resin film forming layer was removed to obtain a circular resin film forming layer on the release sheet.
  • the pressure-sensitive adhesive layer of the support sheet A was pasted on the resin film forming layer on the release sheet to form a resin film forming sheet on the release sheet.
  • the resin film forming layer was cut into a circle having a diameter of 370 mm concentrically with the circular resin film forming layer, and unnecessary portions were removed to obtain the resin film forming sheet laminate of the first aspect. .
  • the die cutting was performed so that the resin film-forming sheet was completely cut and 30 ⁇ m was cut into the release sheet. That is, a cut portion D1 having a cut depth d1 of 30 ⁇ m was formed.
  • Each evaluation was performed using this sheet laminate for resin film formation. The results are shown in Table 1.
  • Example 4 Except having made the cutting depth of the cutting part D1 into 35 micrometers, it carried out similarly to Example 3, and obtained the sheet
  • Example 1 A sheet laminate for forming a resin film was obtained in the same manner as in Example 3 except that the support sheet B was used instead of the support sheet A, and each evaluation was performed. The results are shown in Table 1.
  • Example 2 A sheet laminate for forming a resin film was obtained in the same manner as in Example 4 except that the support sheet B was used instead of the support sheet A, and each evaluation was performed. The results are shown in Table 1.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesives Or Adhesive Processes (AREA)
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WO2019146605A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体
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JPWO2019146607A1 (ja) * 2018-01-24 2021-01-07 リンテック株式会社 長尺積層シートおよびその巻収体
JPWO2019146605A1 (ja) * 2018-01-24 2021-02-04 リンテック株式会社 長尺積層シートおよびその巻収体
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WO2019146604A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートの巻収体
KR102637842B1 (ko) * 2018-01-24 2024-02-16 린텍 가부시키가이샤 장척 적층 시트의 권수체
KR20200112830A (ko) * 2018-01-24 2020-10-05 린텍 가부시키가이샤 장척 적층 시트의 권수체
KR102637843B1 (ko) * 2018-01-24 2024-02-16 린텍 가부시키가이샤 장척 적층 시트 및 그 권수체
WO2019146605A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体
JP7402052B2 (ja) 2018-01-24 2023-12-20 リンテック株式会社 長尺積層シートおよびその巻収体
JPWO2019146604A1 (ja) * 2018-01-24 2021-02-04 リンテック株式会社 長尺積層シートの巻収体
WO2019146607A1 (ja) * 2018-01-24 2019-08-01 リンテック株式会社 長尺積層シートおよびその巻収体
JP7148434B2 (ja) 2019-02-20 2022-10-05 三井化学株式会社 メルトブロー不織布の製造方法
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KR20210088767A (ko) 2021-07-14
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CN105793035B (zh) 2018-05-15

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