JP5759729B2 - 半導体部品の表面保護用粘着テープ - Google Patents
半導体部品の表面保護用粘着テープ Download PDFInfo
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- JP5759729B2 JP5759729B2 JP2011010066A JP2011010066A JP5759729B2 JP 5759729 B2 JP5759729 B2 JP 5759729B2 JP 2011010066 A JP2011010066 A JP 2011010066A JP 2011010066 A JP2011010066 A JP 2011010066A JP 5759729 B2 JP5759729 B2 JP 5759729B2
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- Prior art keywords
- pressure
- sensitive adhesive
- adhesive tape
- adhesive layer
- release
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- JKNCOURZONDCGV-UHFFFAOYSA-N 2-(dimethylamino)ethyl 2-methylprop-2-enoate Chemical compound CN(C)CCOC(=O)C(C)=C JKNCOURZONDCGV-UHFFFAOYSA-N 0.000 description 1
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- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/201—Adhesives in the form of films or foils characterised by their carriers characterised by the release coating composition on the carrier layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/296—Organo-silicon compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
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- C09J7/38—Pressure-sensitive adhesives [PSA]
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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Description
この転写異物の発生原因は主に粘着剤由来であると考えられており、低分子量成分を除去したポリマーを粘着剤層に用いた表面保護粘着テープや、半田付け等の加熱工程での耐熱性を向上させるために各種添加剤を粘着剤層に混合した表面保護粘着テープを使用して、粘着剤層由来の転写異物の低減を図っている。
1.少なくとも基材フィルム、粘着剤層、剥離ライナーから構成される粘着テープにおいて、基材フィルムの片面に粘着剤層を有し、該粘着剤層上に、離型層を設けない未処理プラスチックフィルムによる剥離ライナーが積層されている表面保護用粘着テープ。
2.剥離ライナーはポリエチレンテレフタレート又はポリエチレンナフタレートである1に記載の表面保護用粘着テープ。
3.該粘着剤層が付加反応型シリコーン系粘着剤層である1又は2に記載の表面保護用粘着テープ。
4.該粘着剤層面からの剥離ライナーの剥離力が1N/50mm以下、好ましくは0.5N/50mm以下であることを特徴とする1〜3のいずれかに記載の表面保護用粘着テープ。
5.常温での初期粘着力が0.05N/20mm以下、260℃リフロー後の初期粘着力が0.50N/20mm以下である1〜4のいずれかに記載の表面保護用粘着テープ。
特に粘着剤層が付加反応型シリコーン系粘着剤層である場合、シリコーンゴム成分とシリコーンレジン成分の配合比率を調整して粘着力を制御でき、他の樹脂からなる粘着剤よりも低い粘着力とした場合には、特に剥離ライナーに対しても粘着力が低下するので、剥離ライナー自体に剥離剤層を設けることなく、ひいては粘着剤層面への離型剤の転写を発生させることがない。
さらに該粘着剤層面からの剥離ライナーの剥離力が1N/50mm以下、好ましくは0.50N/50mm以下としたり、常温での初期粘着力を0.05N/20mm以下とすること、つまり、粘着剤層の粘着力を低下させることにより、剥離ライナーには剥離剤層を設ける必要がないことになる。
このような剥離ライナーとしては、例えば、ポリエチレン、ポリプロピレン等のポリオレフィン系樹脂、ポリエチレンテレフタレート、ポリエチレンナフタレート等のポリエステル系樹脂等のフィルムを使用できる。そして、これらのフィルムのなかでも特にポリエチレンテレフタレートやポリエチレンナフタレートが好ましい。
剥離ライナーの厚さは、取扱性等を損なわない範囲で適宜選択できるが、一般に10〜200μm程度、好ましくは20〜100μm程度である。
基材の厚さは、取扱性等を損なわない範囲で適宜選択できるが、一般に10〜500μm程度、好ましくは20〜100μm程度である。
その付加反応型シリコーン粘着剤層としては、例えばオルガノポリシロキサンを主成分とするシリコーンゴムやシリコーンレジンを含有してなり、これに架橋剤を添加してキュアーすることにより粘着剤層を形成することができる。このように、粘着剤は通常架橋剤を添加して、3次元構造化して凝集力を上げている。その他、粘着剤には必要に応じて、タッキファイヤー、酸化防止剤、その他の添加剤等を配合することが出来る。
架橋剤の使用量は特に制限されるものではないが、例えば、前記アクリル系ポリマー100重量部に対して、0.1〜15重量部が好ましく、1〜10重量部がより好ましい。
このような性質は、粘着力が弱いシリコーン系粘着剤層、架橋密度が高いアルキル系粘着剤層によって実現され、しかもこのような粘着力を有する粘着剤によって、離型層を有しない未処理プラスチックフィルムを剥離ライナーとすることが可能となった。
ポリイミドフィルム(東レデュポン社製カプトン200H:厚さ50μm)の片面に、付加反応型シリコーン系粘着剤(シリコーンゴム:シリコーンレジン=95:5)100部に白金系触媒0.5部を加えた18重量%トルエン溶液を塗布し、150℃で3分間加熱して厚さ6μmのシリコーン系粘着層を形成した。該シリコーン系粘着層上に、剥離ライナーとして離型処理していないポリエチレンテレフタレートフィルム(商品名「ルミラーS−10」東レ社製;厚さ:50μm)を貼り合わせ、表面保護用粘着テープを得た。
上記実施例1において、剥離ライナーとしてフルオロシリコーン系離型層を有するポリエステルフィルム(商品名「MRS−50」三菱化学(株)製;厚さ:50μm)にした以外は実施例1と同様にして表面保護用粘着テープを得た。
上記実施例1において、剥離ライナーとしてシリコーン系離型層を有するポリエステルフィルム(商品名「セラピールMD(A)(R)」東洋メタライジング(株)製;厚さ:38μm)にした以外は実施例1と同様にして表面保護用粘着テープを得た。
上記実施例1において、剥離ライナーを貼り合わせていないこと以外は実施例1と同様にして表面保護用粘着テープを得た。
〔実施例2〕
ポリイミドフィルム(東レデュポン社製カプトン200H:厚さ50μm)の片面に、付加反応型シリコーン系粘着剤(シリコーンゴム:シリコーンレジン=80:20)100部に白金系触媒0.5部を加えた20重量%トルエン溶液を塗布し、150℃で3分間加熱して厚さ10μmのシリコーン系粘着層を形成した。該シリコーン系粘着層上に、剥離ライナーとして離型処理していないポリエチレンテレフタレートフィルム(商品名「ルミラーS−10」東レ社製;厚さ:50μm)を貼り合わせ、表面保護用粘着テープを得た。
〔比較例4〕
上記実施例2において、剥離ライナーとしてフルオロシリコーン系離型層を有するポリエステルフィルム(商品名「MRS−50」三菱化学(株)製;厚さ:50μm)にした以外は実施例1と同様にして表面保護用粘着テープを得た。
上記実施例1および比較例1、2、3で得られた各粘着テープについて、以下に示す各試験により、表面汚染性(パーティクル)、初期粘着力、を評価したところ、表1の結果を得た。
半導体ウエハに粘着テープを貼付し、これをNORITAKE社製加熱装置(型番CLF-104C)を用いてTop260℃リフロー加熱後、粘着テープを剥離した。粘着テープ剥離後の該ウエハ上の1.6μm以上のパーティクルの数を表面異物検査装置(商品名「Surfscan6200」、KLA−Tencor社製)を用いて測定した。
常温及びNORITAKE社製加熱装置(型番CLF-104C)を用いて260℃リフロー後のそれぞれの粘着力を引っ張り試験機にて測定した。試験用の被着体はガラス面とし、試験は180゜剥離、剥離速度300mm/分で行った。
基材フィルムの背面側をステンレスに仮圧着し、引っ張り試験機にて、上記サンプルの剥離ライナー剥離力(180°剥離、剥離速度300mm/分)を測定した。
しかしながら、剥離ライナーを貼り合わせていない比較例3の粘着テープと比較して、シリコーン系離型層やフルオロシリコーン系離型層の離型処理をした剥離ライナーを用いた比較例1及び2の粘着テープは、転写異物が多くなっており、この結果によれば比較例1及び2に記載の剥離ライナーの剥離面に形成された離型剤層から、離型剤が再転写していることがわかる。
これに対し、実施例1の結果から明らかなように、剥離ライナーとして離型処理していないポリエチレンテレフタレートフィルムを用いた本発明の表面保護用粘着テープは、剥離ライナーを使用しない比較例3と同程度のパーティクル数を示すので、実施例1によれば離型剤の再転写が発生することなく、転写異物低減が可能であることがわかる。
実施例2及び比較例4による常温と260℃リフロー後の耐ガラス粘着力をみると、いずれの例も同程度の結果となり、剥離ライナーの有無や、離型剤層の有無はこの耐ガラス粘着力には影響を及ぼさないことがわかる。
しかしながら、剥離ライナーとして離型処理していないポリエチレンテレフタレートフィルムを用いた実施例2とフルオロシリコーン系離型層の離型処理をした剥離ライナーを用いた比較例4のパーティクル数を比べると、実施例2は離型剤の再転写が発生することなく、転写異物低減が可能であることがわかる。
Claims (4)
- 少なくとも基材フィルム、シリコーン系粘着剤層、剥離ライナーから構成される粘着テープにおいて、
基材フィルムの片面に粘着剤層を有し、
前記剥離ライナーが、該シリコーン系粘着剤層に貼り合せられる面に離型層を有さず、ポリエチレンテレフタレート又はポリエチレンナフタレートからなる未処理の単層プラスチックフィルムからなり、シリコーン系粘着剤層に貼り合せられる面が平滑である、
加熱工程用表面保護粘着テープ。 - 該シリコーン系粘着剤層が付加型シリコーン系粘着剤層である請求項1に記載の加熱工程用表面保護粘着テープ。
- 該粘着剤層面からの剥離ライナーの剥離力が1N/50mm以下であることを特徴とする請求項1又は2に記載の加熱工程用表面保護粘着テープ。
- 常温での粘着力が0.05N/20mm以下、260℃リフロー後の粘着力が0.50N/20mm以下である請求項1〜3のいずれかに記載の加熱工程用表面保護粘着テープ。
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JP2011010066A JP5759729B2 (ja) | 2011-01-20 | 2011-01-20 | 半導体部品の表面保護用粘着テープ |
CN2012800039570A CN103237858A (zh) | 2011-01-20 | 2012-01-18 | 半导体部件的表面保护用粘合带 |
PCT/JP2012/050949 WO2012099158A1 (ja) | 2011-01-20 | 2012-01-18 | 半導体部品の表面保護用粘着テープ |
KR1020137013044A KR20140018191A (ko) | 2011-01-20 | 2012-01-18 | 반도체 부품의 표면 보호용 점착 테이프 |
US13/991,998 US20130344274A1 (en) | 2011-01-20 | 2012-01-18 | Pressure-sensitive adhesive tape for protecting surface of semiconductor parts |
TW101102733A TW201235222A (en) | 2011-01-20 | 2012-01-20 | Adhesive tape for protecting surface of semiconductor parts |
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JP (1) | JP5759729B2 (ja) |
KR (1) | KR20140018191A (ja) |
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JP6245435B2 (ja) * | 2013-12-20 | 2017-12-13 | フジコピアン株式会社 | 吸着フィルム |
JP6600297B2 (ja) * | 2014-03-26 | 2019-10-30 | リンテック株式会社 | 樹脂膜形成用シート積層体 |
JP6249862B2 (ja) * | 2014-03-31 | 2017-12-20 | リンテック株式会社 | キャリアシート及び積層体 |
JP2016124944A (ja) * | 2014-12-26 | 2016-07-11 | 大王製紙株式会社 | 電気電子機器用粘着シートおよびこれを用いた電気電子機器 |
JP6783106B2 (ja) * | 2016-09-29 | 2020-11-11 | 日東電工株式会社 | 導電性粘着テープ |
JP6582013B2 (ja) * | 2017-03-31 | 2019-09-25 | 古河電気工業株式会社 | 剥離ライナー付マスク一体型表面保護テープ |
US20220348393A1 (en) * | 2019-08-16 | 2022-11-03 | Nitto Denko Corporation | Cover member and member supply assembly including same |
JP7427552B2 (ja) * | 2020-07-10 | 2024-02-05 | 日東電工株式会社 | シリコーン系粘着剤及び粘着テープ |
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JP2000303046A (ja) * | 1999-04-20 | 2000-10-31 | Nitto Denko Corp | ポリエステルフイルム接着用のアクリル系感圧性接着剤組成物とその接着シ―ト類 |
JP2003003132A (ja) * | 2001-06-19 | 2003-01-08 | Lintec Corp | 粘着シートおよび貼着体 |
JP3987720B2 (ja) * | 2001-12-19 | 2007-10-10 | 日東電工株式会社 | クリーニングシートおよびこれを用いた基板処理装置のクリーニング方法 |
JP2005089609A (ja) * | 2003-09-17 | 2005-04-07 | Nitto Denko Corp | 粘着テープの貼付方法及び貼付装置 |
JP2006003676A (ja) * | 2004-06-18 | 2006-01-05 | Lintec Corp | 表示画面用機能フィルム及びその製造法 |
JP5019725B2 (ja) * | 2004-07-12 | 2012-09-05 | リンテック株式会社 | シリコーンゴム粘着シート |
JP2006213810A (ja) * | 2005-02-03 | 2006-08-17 | Shin Etsu Chem Co Ltd | 粘着剤用シリコーン組成物及び該組成物から得られる粘着テープ |
JP2007099858A (ja) * | 2005-10-03 | 2007-04-19 | Furukawa Electric Co Ltd:The | 半導体加工用テープ |
JP5101919B2 (ja) * | 2007-04-09 | 2012-12-19 | 日東電工株式会社 | 配線回路基板用両面粘着テープ又はシートおよび両面粘着テープ付き配線回路基板 |
US20120201772A1 (en) * | 2009-08-20 | 2012-08-09 | Tomonori Toyoda | Hair styling cosmetic |
JP5551568B2 (ja) * | 2009-11-12 | 2014-07-16 | 日東電工株式会社 | 樹脂封止用粘着テープ及びこれを用いた樹脂封止型半導体装置の製造方法 |
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2011
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2012
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- 2012-01-18 CN CN2012800039570A patent/CN103237858A/zh active Pending
- 2012-01-18 WO PCT/JP2012/050949 patent/WO2012099158A1/ja active Application Filing
- 2012-01-18 US US13/991,998 patent/US20130344274A1/en not_active Abandoned
- 2012-01-20 TW TW101102733A patent/TW201235222A/zh unknown
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JP2012149192A (ja) | 2012-08-09 |
US20130344274A1 (en) | 2013-12-26 |
TW201235222A (en) | 2012-09-01 |
WO2012099158A1 (ja) | 2012-07-26 |
CN103237858A (zh) | 2013-08-07 |
KR20140018191A (ko) | 2014-02-12 |
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