WO2015111721A1 - 素子収納用パッケージおよび実装構造体 - Google Patents
素子収納用パッケージおよび実装構造体 Download PDFInfo
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- WO2015111721A1 WO2015111721A1 PCT/JP2015/051904 JP2015051904W WO2015111721A1 WO 2015111721 A1 WO2015111721 A1 WO 2015111721A1 JP 2015051904 W JP2015051904 W JP 2015051904W WO 2015111721 A1 WO2015111721 A1 WO 2015111721A1
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- Prior art keywords
- signal line
- circuit board
- coaxial connector
- core shaft
- frame body
- Prior art date
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/38—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure having concentrically or coaxially arranged contacts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0091—Housing specially adapted for small components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2103/00—Two poles
Definitions
- the present invention relates to an element storage package in which elements can be mounted and stored, and a mounting structure in which elements are mounted in the package.
- the element storage package proposed in Japanese Patent Application Laid-Open No. 2007-123950 proposes a structure including a substrate, a frame provided on the substrate, and a coaxial connector provided on a part of the frame. Has been.
- the frequency characteristics when inputting / outputting a signal through the coaxial connector are improved. It is demanded.
- An object of the present invention is to provide an element storage package and a mounting structure capable of improving frequency characteristics in an element storage package having a coaxial connector.
- An element storage package includes a metal substrate having a mounting area for mounting an element on an upper surface thereof, four sides provided on the metal substrate and surrounding the mounting area in plan view, the four sides A first through hole provided on one side, a frame having a second through hole provided on the one side adjacent to the first through hole, and a first core provided in the first through hole A first coaxial connector having a shaft; a second coaxial connector having a second core shaft provided in the second through hole; and a region surrounded by the frame body, and the frame body in plan view. And a circuit board provided in a state in which a part is in contact with the one side.
- a first signal line connected to the first core shaft of the first coaxial connector and a second signal line connected to the second core shaft of the second coaxial connector.
- a first ground conductor layer provided between the first signal line and the second signal line with a gap therebetween.
- a second ground conductor layer is formed at a location overlapping the first signal line and the second signal line as seen through the plane. Further, a groove is provided between the one side of the frame body and the side surface of the circuit board and between the first signal line and the second signal line.
- a mounting structure includes the element storage package and an element mounted in the mounting region of the element storage package.
- FIG. 6 is a cross-sectional view taken along the line XX in FIG. 5.
- FIG. 9 is a cross-sectional view taken along YY in FIG.
- FIG. 9 is a cross-sectional view taken along the line ZZ in FIG. 8. It is the graph which showed the simulation result of the frequency characteristic of the high frequency signal in the coaxial connector of the element storage package and the mounting structure according to the present embodiment.
- the mounting structure 1 includes an element storage package 2 and an element 3 provided in the mounting region R of the element storage package 2.
- the element storage package 2 includes, for example, an active element such as a semiconductor element, a transistor, a laser diode, a photodiode, or a thyristor, or a passive element such as a resistor, a capacitor, a solar cell, a piezoelectric element, a crystal oscillator, or a ceramic oscillator. It is used for mounting and housing the element 3.
- Element 3 is mounted on pedestal 3a.
- the pedestal 3 a is provided in the mounting region R inside the element storage package 2.
- the pedestal 3a is for mounting the element 3, and the height position of the element 3 can be adjusted.
- the pedestal 3a is made of an insulating material, and electrical wiring that is electrically connected to the element 3 is formed on the upper surface of the pedestal 3a.
- two input / output terminals 4 are provided, and two elements 3 are mounted on the base 3a accordingly.
- the element storage package 2 is suitable for mounting and functioning an element 3 corresponding to high withstand voltage, high current, high power, high speed and high frequency.
- an element 3 a semiconductor element is used. It is to be implemented.
- the element storage package 2 includes a metal substrate 21 having a mounting region R for mounting the element 3 on the upper surface, four sides surrounding the mounting region R provided on the metal substrate 21 in plan view, and one side of the four sides.
- a frame 22 having a first through hole Ha provided and a second through hole Hb adjacent to the first through hole Ha on one side, and a first core shaft 231a provided in the first through hole Ha.
- the metal substrate 21 is a rectangular metal plate, and is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.
- the thermal conductivity of the metal substrate 21 is set to, for example, 15 W / (m ⁇ K) or more and 450 W / (m ⁇ K) or less.
- the thermal expansion coefficient of the metal substrate 21 is set to, for example, 3 ⁇ 10 ⁇ 6 / K or more and 28 ⁇ 10 ⁇ 6 / K or less.
- the metal substrate 21 is manufactured in a predetermined shape by using a metal processing method such as rolling or punching for an ingot obtained by casting and solidifying a molten metal material into a mold.
- a metal processing method such as rolling or punching for an ingot obtained by casting and solidifying a molten metal material into a mold.
- the length of one side of the metal substrate 21 in a plan view is set to, for example, 5 mm or more and 50 mm or less.
- the thickness of the metal substrate 21 in the vertical direction is set to, for example, 0.3 mm or more and 5 mm or less.
- a metal layer such as nickel or gold is formed on the surface of the metal substrate 21 by using an electroplating method or an electroless plating method in order to prevent oxidative corrosion.
- the thickness of the metal layer is set to, for example, 0.5 ⁇ m or more and 9 ⁇ m or less.
- the frame body 22 is provided on the metal substrate 21.
- the frame 22 has four sides that surround the mounting region R in plan view.
- the frame body 22 is provided with a coaxial connector 23 on one side of the four sides.
- the frame body 22 is provided with input / output terminals 4 on both sides adjacent to one side where the coaxial connector 23 is provided.
- the frame body 22 is joined to the metal substrate 21 by a brazing material such as silver-copper brazing.
- the frame 22 is made of, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel, or cobalt, or an alloy containing these metal materials.
- the frame body 22 has a function of efficiently radiating heat generated from the element 3 to the outside and a function of absorbing or dispersing thermal stress.
- the thermal conductivity of the frame 22 is set to, for example, 15 W / (m ⁇ K) or more and 450 W / (m ⁇ K) or less.
- the thermal expansion coefficient of the frame 22 is set to, for example, 3 ⁇ 10 ⁇ 6 / K or more and 28 ⁇ 10 ⁇ 6 / K or less.
- the upper and lower thicknesses of the frame body 22 are set to, for example, 5 mm or more and 20 mm or less. Moreover, the thickness of the frame when the frame 22 is viewed in plan is set to, for example, 0.5 mm or more and 3 mm or less.
- the frame body 22 is provided with a step portion 22a on which the circuit board 24 is placed on one side to which the coaxial connector 23 is connected.
- the step portion 22a is a part of the frame 22 and is integrated.
- the step portion 22a has a length that protrudes from one side of the frame body 22 toward the region surrounded by the frame body 22, for example, 1 mm or more and 10 mm or less, and a vertical length of 0.5 mm or more and 5 mm or less.
- the length in the direction along one side is set to, for example, 5 mm or more and 50 mm or less.
- the input / output terminal 4 is provided at the edge of the metal substrate 21 and can electrically connect the inside of the frame body 22 and the outside of the frame body 22.
- the input / output terminal 4 has a rectangular parallelepiped shape, and is cut out from the upper surface to the side surface located in the frame body 22. As shown in FIG. 4, a part of the lower surface of the input / output terminal 4 protrudes to the side.
- the lead terminal 5 is connected to a part of the lower surface protruding to the side of the input / output terminal 4.
- the input / output terminal 4 is an insulating material, for example, an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic. It consists of ceramic materials such as.
- the thermal expansion coefficient of the input / output terminal 4 is set to, for example, 3 ⁇ 10 ⁇ 6 / K or more and 8 ⁇ 10 ⁇ 6 / K or less.
- the input / output terminal 4 can be formed by laminating a plurality of layers. Here, a method for manufacturing the input / output terminal 4 will be described. If the input / output terminal 4 is made of, for example, an aluminum oxide sintered body, an organic binder, a plasticizer, a solvent, or the like is added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide. A green sheet formed into a sheet is obtained while obtaining a mixture.
- the input / output terminal 4 is provided with a wiring conductor to which the lead terminal 5 is connected.
- a high melting point metal powder such as tungsten or molybdenum, which is a raw material for the wiring conductor, is prepared, and an organic binder, a plasticizer, a solvent, or the like is added to and mixed with the powder to obtain a metal paste. Then, the unfired green sheet is punched into a predetermined shape, and a metal paste is printed at a predetermined location.
- the lead terminal 5 is connected to the wiring conductor on the lower surface of the input / output terminal 4 via a brazing material.
- the input / output terminals 4 are formed with wiring conductors 41 to which lead terminals 5 and bonding wires are connected.
- the lead terminal 5 is a member for electrically connecting an external electronic device or the like to the element 3.
- the lead terminal 5 is connected to a wiring conductor formed on the lower surface of the input / output terminal 4 through a brazing material. Thereby, the wiring conductor and the lead terminal 5 are electrically connected.
- a plurality of wiring conductors are formed on the lower surface of the input / output terminal 4, and the plurality of wiring conductors are provided with a gap therebetween. And adjacent wiring conductors are electrically insulated. And by providing each lead terminal 5 in each wiring conductor, adjacent lead terminals 5 are electrically insulated.
- the lead terminal 5 is made of a conductive material, for example, a metal material such as copper, iron, tungsten, molybdenum, nickel or cobalt, or an alloy containing these metal materials.
- the lead terminal 5 extends along the plane direction, but the one end of the lead terminal 5 and the other end of the lead terminal 5 are bent. As shown in FIG. 5, the lead terminal 5 is bent and adjusted so that the height position of the lower surface of the lead terminal 5 is the same as the height position of the lower surface of the metal substrate 21. Thereby, both the metal substrate 21 and the lead terminal 5 can be mounted flat with respect to the external substrate.
- the element storage package 2 can be connected so as not to be inclined with respect to the external substrate while increasing the area to be fixed to the external substrate. As a result, the element storage package 2 can be stably and firmly connected to an external substrate.
- the wiring conductor 41 is also formed on the upper surface of the input / output terminal 4 and in a region surrounded by the frame body 22.
- the wiring conductor 41 is electrically connected to the electrode of the element 3 by, for example, a bonding wire.
- the wiring conductor 41 extends from the upper surface of the input / output terminal 4 into the input / output terminal 4. Furthermore, the wiring conductor 41 extends to the lower surface of the input / output terminal 4 through a via hole in the input / output terminal 4.
- the element 3 is electrically connected to the lead terminal 5 via the wiring conductor 41.
- a first metal layer is formed on a part of the upper surface of the input / output terminal 4.
- the first metal layer since the main body portion of the input / output terminal 4 is made of a ceramic material, the main body portion of the ceramic material and the frame portion of the metal material of the frame body 22 and the seal ring 6 are interposed via a brazing material.
- the first metal layer can serve as a base for the brazing material.
- the first metal layer is connected to a conductor having a reference potential, for example, a ground conductor.
- the first metal layer functions as a shielding electrode for the wiring conductor 41, can reduce the influence of external electromagnetic waves, and can easily maintain the high-frequency current flowing through the wiring conductor 41 in a desired state. Can do.
- a second metal layer different from the first metal layer is formed on the lower surface of the input / output terminal 4 and connected to the metal substrate 21.
- the second metal layer can connect the main body portion made of the ceramic material of the input / output terminal 4 and the metal substrate 21 made of the metal material via a brazing material.
- the second metal layer is set to a predetermined potential and functions as a reference potential.
- the second metal layer is provided on the lower surface of the input / output terminal 4 with a space from the wiring conductor 41.
- the wiring conductor 41 is electrically insulated.
- the second metal layer functions as a shielding electrode for the wiring conductor 41, and can protect the wiring conductor 41 from external electromagnetic waves. And generation
- production of electromagnetic noise can be suppressed in the wiring conductor 41.
- a third metal layer is formed on a side surface parallel to the short side of the input / output terminal 4 in a plan view, where the first metal layer and the second metal layer are different from each other at a portion connected to the frame body 22 Has been.
- the third metal layer can connect the main body portion made of the ceramic material of the input / output terminal 4 and the frame body 22 made of the metal material via a brazing material.
- the third metal layer is set to a predetermined potential and functions as a reference potential.
- the frame body 22 is provided with a first through hole Ha and a second through hole Hb on one side between the pair of input / output terminals 4.
- the second through hole Hb is provided on one side of the frame body 22 so as to be spaced from the first through hole Ha.
- the first through hole Ha is provided with a first coaxial connector 23a having a first core shaft 231a.
- the second through hole Hb is provided with a second coaxial connector 23b having a second core shaft 231b.
- the coaxial connector 23 is for electrically connecting the internal element 3 and an external coaxial cable.
- a coaxial connector 23 such as a communication connector or a coaxial connector is attached to the first through hole Ha and the second through hole Hb from the outside toward the frame body 22.
- size of the 1st through-hole Ha and the 2nd through-hole Hb is set to the magnitude
- the coaxial connector 23 includes a core shaft 231 that electrically connects the inside and outside of the frame body 22, a metal member 232 that surrounds the periphery of the core shaft 231 with a space from the core shaft 231, and a core shaft 231 and a metal member 232, and a dielectric 233 interposed.
- the coaxial connector 23 is for transmitting an external electrical signal to the circuit board 24 in the package or to transmit the electrical signal of the circuit board 24 in the package to the outside.
- the core shaft 231 has a function of transmitting a predetermined electric signal.
- the core shaft 231 is made of a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, for example.
- the metal member 232 has a function of setting a common potential, for example, a reference potential.
- the metal member 232 is made of a metal material such as copper, silver, gold, iron, aluminum, nickel, cobalt, or chromium, for example.
- the frame body 22 is made of a metal material, and the metal member 232 and the frame body 22 are electrically connected.
- the dielectric 233 is an insulating material, for example, an inorganic material such as aluminum oxide, aluminum nitride, or silicon nitride, an organic material such as an epoxy resin, a polyimide resin, or an ethylene resin, a glass material such as a borosilicate glass, Alternatively, it is made of a ceramic material such as an aluminum oxide sintered body, a mullite sintered body, a silicon carbide sintered body, an aluminum nitride sintered body, a silicon nitride sintered body, or a glass ceramic. Or it consists of a composite material which mixed several materials among these materials.
- the circuit board 24 is provided in a region surrounded by the frame body 22 in a state where a part thereof is in contact with one side of the frame body 22 in plan view.
- the circuit board 24 electrically connects the core shaft 231 of the coaxial connector 23 and the signal line 241 provided on the circuit board 24 via a brazing material.
- a first signal line 241a connected to the first core shaft 231a of the first coaxial connector 23a and a second signal line 241b connected to the second core shaft 231b of the second coaxial connector 23b.
- a first ground conductor layer 242 provided between the first signal line 241a and the second signal line 241b and spaced from both signal lines.
- a second ground conductor 243 is provided on the lower surface of the circuit board 24 at a location overlapping the first signal line 241a and the second signal line 241b in a plan view.
- the second ground conductor 243 serves as a ground electrode for stabilizing the bonding property with the metal substrate 21 and the transmission characteristics of the high-frequency signal transmitted through the first signal line 241a and the second signal line 241b. It may be provided on the entire lower surface.
- the circuit board 24 is provided with a groove P at a position between the first signal line 241a and the second signal line 241b between one side of the frame body 22 and the side surface facing the frame body 22.
- the groove P is provided by forming a recess on the side surface of the circuit board 24. As shown in FIG. 8, a part of the upper surface of the stepped portion 22a is exposed in the groove P in plan view.
- the circuit board 24 has a side length of 2 mm to 20 mm and a vertical thickness of 0.2 mm to 2 mm in plan view.
- the recess of the circuit board 24 has a depth set to, for example, 0.1 mm to 1 mm, and a length along one side of the circuit board 24, for example, set to 1 mm to 10 mm.
- two corners facing one side (inner surface) of the frame body 22 in the four corners of the circuit board 24 are provided with notches.
- the notch is provided at a location where the first signal line 241a is sandwiched between the grooves P.
- the notch is provided at a location where the second signal line 241b is sandwiched between the grooves P.
- the seal ring 6 is provided continuously through the brazing material along the side of the frame body 22.
- the seal ring 6 connects the lid body 7 to the frame body 22 when the lid body 7 is provided so as to cover the inside of the frame body 22.
- the seal ring 6 is made of, for example, a metal such as copper, tungsten, iron, nickel, or cobalt having excellent seam weldability with the lid 7 or an alloy containing a plurality of these metals.
- the thermal expansion coefficient of the seal ring 6 is set to 4 ⁇ 10 ⁇ 6 / K or more and 16 ⁇ 10 ⁇ 6 / K or less, for example.
- the lid 7 is provided on the seal ring 6 so as to cover the element 3 in the frame 22.
- the lid body 7 hermetically seals a region surrounded by the frame body 22.
- the lid 7 is made of, for example, a metal such as copper, tungsten, iron, nickel, or cobalt, or an alloy containing a plurality of these metals, an aluminum oxide sintered body, a mullite sintered body, or a silicon carbide sintered body. It consists of ceramics such as an aluminum nitride sintered body, a silicon nitride sintered body, or glass ceramics.
- the lid body 7 is joined to the seal ring 6 by seam welding, for example, via a joining member such as solder or brazing material.
- the region surrounded by the frame 22 is filled with a vacuum state or nitrogen gas, and the region surrounded by the frame 22 is hermetically sealed by providing the lid 7 on the seal ring 6. can do.
- the lid body 7 is placed on the seal ring 6 in a predetermined atmosphere, and attached to the seal ring 6 by performing seam welding.
- the lid 7 can be attached via a bonding material such as a brazing material, a glass bonding material, or a resin bonding material.
- the mounting structure 1 and the element storage package 2 are connected to the signal of the circuit board 24 from the inner peripheral surface of the frame body 22 in the signal line from the coaxial connector 23 to the signal line 241.
- a groove P is provided on the side surface of the circuit board 24 facing the frame body 22 in the axial direction of the core shaft 231 connected to the wire 241, and a notch is provided at a corner of the circuit board 24 sandwiching the groove P.
- the signal line 241 sandwiched between the first ground conductor layers 242 on the circuit board 24 can function as a coplanar line as shown in FIG.
- the frequency characteristic of the signal line from the coaxial connector 23 to the signal line 241 can be improved. That is, when the groove P and the notch are not provided, a high-frequency signal is generated between the connection portion between the core shaft 231 and the signal line 241 and the circuit board 24 when a high-frequency signal is transmitted from the coaxial connector 23 to the signal line 241.
- the capacitance increases due to the electric field distribution.
- the groove P and the notch so as to sandwich the connecting portion between the core shaft 231 and the signal line 241 as described above and forming a microstrip line, the static connection at the connecting portion between the core shaft 231 and the signal line 241 is achieved.
- the electric capacity can be reduced.
- the groove P and the notch can suppress a decrease in characteristic impedance at the connection portion between the core shaft 231 and the signal line 241 and can improve the frequency characteristics.
- the first ground conductor layer 242 is fixed in a plan view from the bottom of the groove P and the notch provided at the corner of the circuit board 24 sandwiching the groove P to the inside of the package. They may be formed at intervals.
- the capacitance and characteristic impedance between the connection portion with the signal line 241 to which the coaxial connector 23 is connected and the signal line 241 sandwiched between the first ground conductor layers 242 on the circuit board 24 are stepwise. Can be changed. As a result, it is possible to suppress insertion loss and reflection loss that occur between the connection portion with the signal line 241 to which the coaxial connector 23 is connected and the signal line 241 sandwiched between the first ground conductor layers 242 on the circuit board 24. Can do.
- the groove P and the notch have a length in the axial direction of the core shaft 231, that is, the lower end of the groove P and the lower end of the notch are at the same height position.
- the electric field distribution generated at the connecting portion between the core shaft 231 and the signal line 241 can be made symmetrical with respect to a vertical section with respect to the axis of the core shaft 231.
- the resonance of the high frequency signal that occurs when the high frequency signal is transmitted from the coaxial connector 23 to the signal line 241 can be suppressed.
- the groove P and the notch have the same distance from the axis of the core shaft 231 in plan view.
- the electric field distribution generated at the connection portion between the core shaft 231 and the signal line 241 as described above can be made symmetrical with respect to the axis perpendicular to the axis of the core shaft 231, and is generated from the coaxial connector 23 to the signal line 241.
- the resonance of the high frequency signal can be suppressed.
- the circuit board 24 is preferably joined so as to contact the inner peripheral surface of the frame body 22 with the groove P and the notch interposed therebetween.
- the electric field distribution generated at the connection portion between the core shaft 231 and the signal line 241 as described above can be made symmetrical with respect to the axis perpendicular to the axis of the core shaft 231, and is generated from the coaxial connector 23 to the signal line 241.
- the resonance of the high frequency signal can be suppressed.
- the first ground conductor layer 242 is provided with a certain interval in parallel with the bottom surface of the groove P and the notch in a plan view.
- the characteristic impedance from being reduced at the connecting portion between the core shaft 231 and the signal line 241 as described above, to improve the frequency characteristics, and to distribute the electric field generated in the core shaft 231 and the signal line 241.
- the length of the groove P and the notch in the axial direction of the core shaft 231 in the plan view is shorter than the length of the core shaft 231 protruding from the inner peripheral surface of the frame body 22 to the inside of the package.
- the groove P and the notch are provided in parallel with the inner peripheral surface of the frame body 22 at a predetermined interval in plan view.
- the electric field distribution generated in the core shaft 231 and the signal line 241 can be made symmetrical with respect to the cross section perpendicular to the axis of the core shaft 231, and the resonance of the high-frequency signal generated from the coaxial connector 23 to the signal line 241 can be suppressed. Can do.
- the coaxial connector 23 is connected to a lower end portion of the core shaft 231 on the inner side of the package with a plate-like conductive member having a thickness smaller than the diameter of the core shaft 231 and extending to the inner side of the package. It may be connected to the signal line 241 via a conductive connection member such as. Thereby, the electrostatic capacitance in the conductive member that becomes the connection portion between the core shaft 231 and the signal line 241 can be reduced, and the characteristic impedance is prevented from being reduced at the connection portion between the core shaft 231 and the signal line 241. Frequency characteristics can be improved.
- the groove P and the cutout in plan view may have a length in the axial direction of the core shaft 231 shorter than the length of the plate-like conductive member protruding from the inner peripheral surface of the frame body 22 to the inside of the package. preferable. As a result, it is possible to prevent the characteristic impedance from being reduced at the junction between the conductive member and the signal line 241 as described above, and to improve the frequency characteristics.
- FIG. 12 shows the frequency characteristics (S-parameters) of the high-frequency signal in the coaxial connector 23 of the element storage package and the mounting structure according to the present embodiment (reflection loss: Return Loss “S11”, insertion loss: Insertion Loss “S21”) It is the graph which showed the simulation result.
- the reflection loss is indicated by a solid line
- the reflection loss is indicated by a dotted line.
- the insertion loss of the frequency characteristics of the present embodiment is indicated by a long broken line
- the insertion loss of the frequency characteristics of the comparative example is indicated by a broken line.
- the present embodiment has a structure in which the groove P is provided in the circuit board 24, and the comparative example has a structure in which the circuit board 24 does not have the groove P.
- the reflection loss approaches 0 dB as the frequency increases from 0 GHz.
- the insertion loss is 0 dB at a frequency of 0 GHz, but the deviation from 0 dB gradually increases as the frequency increases.
- the frequency at which the insertion loss suddenly begins to deviate significantly from 0 dB is a so-called resonance frequency.
- the comparative example has a numerical value between ⁇ 20 dB and 0 dB at 45 GHz to 60 GHz.
- a numerical value of approximately ⁇ 20 dB or less can be obtained from 45 GHz to 60 GHz.
- the element storage package 2 and the element 3 are prepared.
- the metal substrate 21 and the frame 22 of the element storage package 2 use a conventionally known metal processing method such as rolling or punching for an ingot obtained by casting a molten metal material into a mold and solidifying it. Thus, it is manufactured in a predetermined shape. Further, the input / output terminal 4 is manufactured by the manufacturing method described above.
- the metal substrate 21 is connected to the frame body 22 and the input / output terminal 4 through a brazing material.
- the coaxial connector 23 is fitted and connected to the first through hole Ha and the second through hole Hb of the frame body 22 via gold-tin solder.
- the circuit board 24 is mounted on the upper surface of the step portion 22a provided at the lower end portion inside the side wall of the frame body 22 provided with the first through hole Ha and the second through hole Hb, and the signal line 241 has a core shaft.
- 231 is electrically connected through a conductive bonding material such as gold-tin solder. In this way, the element storage package 2 can be manufactured.
- a pedestal 3a is provided in the mounting region R of the element storage package 2 via a bonding material such as gold-tin solder or an insulating resin bonding material. Furthermore, the element 3 is mounted on the pedestal 3a, and the electrode of the element 3 and the wiring conductor 41 of the input / output terminal 4 and the signal line 241 of the circuit board 24 are electrically connected via bonding wires. Furthermore, the mounting structure 1 can be manufactured by attaching the seal ring 6 and the lid 7 to the element housing package 2.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Semiconductor Lasers (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
実装構造体1は、素子収納用パッケージ2と、素子収納用パッケージ2の実装領域Rに設けられた素子3とを備えている。素子収納用パッケージ2は、例えば、半導体素子、トランジスタ、レーザーダイオード、ホトダイオードまたはサイリスタ等の能動素子、あるいは抵抗器、コンデンサ、太陽電池、圧電素子、水晶振動子またはセラミック発振子等の受動素子からなる素子3を実装して収容するのに用いるものである。
ここで、図1または図2に示す実装構造体1の製造方法を説明する。まず、素子収納用パッケージ2と素子3とを準備する。素子収納用パッケージ2の金属基板21および枠体22は、溶融した金属材料を型枠に鋳込んで固化させたインゴットに対して、従来周知の圧延加工または打ち抜き加工等の金属加工法を用いることで、所定形状に製作される。また、上述した製造方法によって入出力端子4を作製する。
Claims (5)
- 上面に素子を実装する実装領域を有する金属基板と、
前記金属基板上に設けられた、平面視して前記実装領域を取り囲む四辺、前記四辺の一辺に設けられた第1貫通孔、および前記一辺に前記第1貫通孔に隣接して設けられた第2貫通孔を有する枠体と、
前記第1貫通孔に設けられた、第1芯軸を有する第1同軸コネクタと、
前記第2貫通孔に設けられた、第2芯軸を有する第2同軸コネクタと、
前記枠体で囲まれた領域内に、平面視して前記枠体の前記一辺に一部が接した状態で設けられた回路基板とを備え、
前記回路基板の上面には、前記第1同軸コネクタの前記第1芯軸に接続された第1信号線と、前記第2同軸コネクタの前記第2芯軸に接続された第2信号線と、前記第1信号線と前記第2信号線との間に両線と間を空けて設けられた第1接地導体層とが形成されており、
前記回路基板の下面には、平面透視して前記第1信号線と前記第2信号線と重なる箇所に設けられた第2接地導体層が形成されており、
前記枠体の前記一辺と前記回路基板の側面との間であって、前記第1信号線および前記第2信号線とで挟まれる箇所には溝が設けられていることを特徴とする素子収納用パッケージ。 - 請求項1に記載の素子収納用パッケージであって、
前記溝は、前記回路基板の側面に凹部を設けて形成されていることを特徴とする素子収納用パッケージ。 - 請求項1または請求項2に記載の素子収納用パッケージであって、
前記溝は、平面視して前記第1接地導体層から間を空けて設けられていることを特徴とする素子収納用パッケージ。 - 請求項1ないし請求項3のいずれかに記載の素子収納用パッケージであって、
前記回路基板は、矩形状であって、四隅のうちの前記枠体の内面と対向する2つの角に切欠きが設けられていることを特徴とする素子収納用パッケージ。 - 請求項1ないし請求項4のいずれかに記載の素子収納用パッケージと、
前記素子収納用パッケージの前記実装領域に実装された素子とを備えたことを特徴とする実装構造体。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
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JP2015559146A JP6181777B2 (ja) | 2014-01-24 | 2015-01-23 | 素子収納用パッケージおよび実装構造体 |
CN201580004741.XA CN106415821B (zh) | 2014-01-24 | 2015-01-23 | 元件收纳用封装以及安装结构体 |
US15/111,238 US9805995B2 (en) | 2014-01-24 | 2015-01-23 | Element-accommodating package and mounting structure |
EP15740630.7A EP3098842B1 (en) | 2014-01-24 | 2015-01-23 | Package for an electronic element |
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JP2014011295 | 2014-01-24 | ||
JP2014-011295 | 2014-01-24 |
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WO2015111721A1 true WO2015111721A1 (ja) | 2015-07-30 |
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US (1) | US9805995B2 (ja) |
EP (1) | EP3098842B1 (ja) |
JP (1) | JP6181777B2 (ja) |
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JP6781021B2 (ja) * | 2016-11-29 | 2020-11-04 | モレックス エルエルシー | 電子部品 |
US10008362B1 (en) * | 2016-12-27 | 2018-06-26 | Mapper Lithography Ip B.V. | Optical fiber feedthrough device and fiber path arrangement |
US10374338B2 (en) * | 2017-12-22 | 2019-08-06 | Robertshaw Controls Company | Connector bridge |
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EP3098842B1 (en) | 2020-08-26 |
EP3098842A1 (en) | 2016-11-30 |
CN106415821B (zh) | 2019-03-01 |
JP6181777B2 (ja) | 2017-08-16 |
US20160343628A1 (en) | 2016-11-24 |
CN106415821A (zh) | 2017-02-15 |
EP3098842A4 (en) | 2017-11-01 |
JPWO2015111721A1 (ja) | 2017-03-23 |
US9805995B2 (en) | 2017-10-31 |
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