WO2015096765A1 - 一种触控显示装置及其制备方法 - Google Patents

一种触控显示装置及其制备方法 Download PDF

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Publication number
WO2015096765A1
WO2015096765A1 PCT/CN2014/094919 CN2014094919W WO2015096765A1 WO 2015096765 A1 WO2015096765 A1 WO 2015096765A1 CN 2014094919 W CN2014094919 W CN 2014094919W WO 2015096765 A1 WO2015096765 A1 WO 2015096765A1
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Prior art keywords
conductive
layer
electrode
display device
substrate
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PCT/CN2014/094919
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English (en)
French (fr)
Inventor
朱少鹏
邱勇
平山秀雄
黄秀颀
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昆山工研院新型平板显示技术中心有限公司
昆山国显光电有限公司
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Application filed by 昆山工研院新型平板显示技术中心有限公司, 昆山国显光电有限公司 filed Critical 昆山工研院新型平板显示技术中心有限公司
Priority to US15/107,285 priority Critical patent/US10185430B2/en
Priority to EP14874008.7A priority patent/EP3088999A4/en
Priority to KR1020167018881A priority patent/KR101891819B1/ko
Priority to JP2016559490A priority patent/JP6246387B2/ja
Publication of WO2015096765A1 publication Critical patent/WO2015096765A1/zh

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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0412—Digitisers structurally integrated in a display
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/26—Power supply means, e.g. regulation thereof
    • G06F1/32—Means for saving power
    • G06F1/3203—Power management, i.e. event-based initiation of a power-saving mode
    • G06F1/3234—Power saving characterised by the action undertaken
    • G06F1/325—Power saving in peripheral device
    • G06F1/3262—Power saving in digitizer or tablet
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/0416—Control or interface arrangements specially adapted for digitisers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/40—OLEDs integrated with touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04111—Cross over in capacitive digitiser, i.e. details of structures for connecting electrodes of the sensing pattern where the connections cross each other, e.g. bridge structures comprising an insulating layer, or vias through substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals

Definitions

  • the present invention relates to the field of display technologies, and in particular, to an organic light emitting display device having an in-cell touch structure and a method of fabricating the same.
  • Touch screen (English full name called Touch Panel), also known as touch screen, touch panel, is an inductive display device that can receive input signals such as contacts, and is widely used in various electronic products. According to the working principle of the touch screen and the medium for transmitting information, the touch screen can be divided into four types: resistive type, capacitive type, infrared type and surface acoustic wave type.
  • Capacitive touch screen (English full name Capacitive Touch Panel, referred to as CTP) is the use of human body current sensing to control the screen. According to the change of the capacitance of the detected touch area, the position of the finger is calculated, the accuracy is up to 99%, and the response time is less than 3ms.
  • CTP has the advantages of high sensitivity and easy implementation of multi-touch technology, and has gradually become the mainstream touch screen for applications in electronic products such as smart phones and tablet computers.
  • the CTP can be divided into: out cell (the touch device is externally mounted on the display panel), the on cell (the touch device is disposed on the display panel), and the in cell.
  • Technical architecture such as (the touch device is integrated in the display panel).
  • the out cell and on cell technologies are mature, they are widely used in small and medium size display panels, and the OFS in the out cell technology (English called One Film Solution) can be applied to organic electro In the light-emitting display device, a flexible touch display is made possible.
  • the in cell can make the display panel lighter and lighter, has higher transmittance, lower power, and can achieve flexibility. It is called the touch display, especially the ultimate solution for organic electroluminescent display touch, and will gradually become The development of touch technology in organic electroluminescent display devices is mainstream.
  • Chinese patent CNl01635276A discloses an organic light emitting diode touch panel comprising a substrate, an OLED element, and an optical sensing element. At least one pixel area is defined on the substrate, and a display area and a sensing area are defined in the pixel area.
  • the OLED element is disposed on the substrate in the display region, and includes a first thin film transistor, a light emitting lower electrode portion, a patterned organic light emitting layer, and a light emitting upper electrode portion.
  • the light-emitting lower electrode portion is disposed on the light-emitting upper electrode portion and electrically connected to the first thin film transistor.
  • the patterned organic light-emitting layer is disposed on the light-emitting lower electrode portion.
  • the light emitting upper electrode portion is disposed on the patterned organic light emitting layer.
  • the optical sensing element is disposed on the substrate in the sensing region, and includes a second thin film transistor, a photosensitive lower electrode portion, a patterned photosensitive dielectric layer, and a photosensitive upper electrode portion.
  • the photosensitive lower electrode portion is disposed on the second thin film transistor and electrically connected to the second thin film transistor.
  • the patterned photosensitive dielectric layer is disposed on the photosensitive lower electrode portion, and the photosensitive upper electrode portion is disposed on the patterned photosensitive dielectric layer.
  • the patent has high sensitivity, but it is an in-cell type optical touch method. It is not only complicated in structure and preparation process, but also difficult to implement multi-touch, and is not a mainstream touch technology.
  • the present invention solves the problem that the in-cell type touch technology structure and the preparation process are complicated in the prior art, and provides an organic light-emitting display device with a simple structure and a simple structure and an in-cell touch structure. Preparation.
  • a touch display device includes a substrate, a plurality of organic light emitting diodes disposed on the substrate, the organic light emitting diodes including a first electrode, an organic material layer and a second electrode which are sequentially stacked;
  • the first electrodes are independently disposed;
  • the second electrodes are respectively connected in series to form a plurality of first conductive strips arranged in parallel and a plurality of second conductive strips arranged in parallel, wherein the first conductive strips and the second conductive strips form an insulated cross between each other The internet.
  • the first conductive strip is formed in series by the second electrode arranged in a first direction; the second conductive strip is disposed on the organic light by the second electrode arranged along a second side Conductive bridges outside the diode are formed in series.
  • the conductive bridge is disposed on the substrate and insulated from the organic light emitting diode by an insulating layer directly covering the conductive bridge.
  • the conductive bridge is a metal conductive bridge.
  • the conductive bridge has a thickness of 10 nm to 1000 nm.
  • a pixel defining layer that is adjacent to the adjacent organic light emitting diode is further disposed on the substrate.
  • the pixel defining layer is further directly provided with an isolation pillar layer separating the first conductive strip and the second conductive strip.
  • the second electrode has a thickness of 1 nm to 500 nm.
  • the method further includes a plurality of driving thin film transistors disposed on the substrate, each of the first electrodes being in contact connection with a source or a drain of each of the driving thin film transistors.
  • the method for preparing the touch device of the present invention comprises the following steps:
  • the method further includes the step of forming a pixel defining layer surrounding the first electrode on the substrate.
  • the step S3 further includes the step of forming an isolation pillar layer on the pixel defining layer; the adjacent first conductive strip and the second conductive strip formed in the step S4 are separated by the isolation pillar layer.
  • the angle between the axial direction of the through hole and the substrate in step S2 is 10° to 90°.
  • a touch display device comprising: a substrate; an organic light emitting diode disposed on the substrate, wherein the first electrodes are independently disposed; and the second electrodes are respectively connected in series to form a plurality of first conductive strips arranged in parallel And a plurality of second conductive strips arranged in parallel, the first conductive strip and the second conductive strip forming a cross-network insulated from each other. While forming the second electrode, the second electrodes are respectively connected in series in the lateral direction and the longitudinal direction to form an insulated side crossing network, that is, a touch sensing layer is formed, and the touch function is integrated in the second electrode of the organic light emitting diode.
  • the structure is simple; moreover, multi-touch can be realized.
  • a touch display device integrates a touch function into the organic light emitting diode, and does not need to additionally provide a touch component, and has high luminous efficiency and fast corresponding speed.
  • the method for preparing a touch display device according to the present invention wherein the second electrode is prepared to be connected in series in a horizontal direction and a vertical direction, respectively, and the lithography and etching are completed by the process while completing the preparation of the organic light emitting diode.
  • the process can be integrated with a touch function, the preparation method is simple, and the process cost is low.
  • FIG. 1 is a schematic structural diagram of a touch display device according to Embodiment 1 of the present invention.
  • Reference numerals in the figures are denoted as: 100-substrate, 101-insulating layer, 102-first electrode, 103-organic material layer, 104-second electrode in the second conductive strip, 105-first in the first conductive strip Two electrodes, 106-isolated pillar layer, 107-via, 108-conductive bridge, 109-package layer, 110-pixel defining layer.
  • the embodiment provides a touch display device.
  • the substrate 100 includes an organic light emitting diode disposed on the substrate 100 , and the first electrodes 102 are independently disposed.
  • the second electrodes 104 and 105 are respectively connected in series. a plurality of first conductive strips arranged in parallel and a plurality of second conductive strips arranged in parallel, the first conductive strips and the second conductive strips forming a cross-network insulated from each other.
  • the first conductive strip is formed in series by the second electrode 105 arranged in a first direction; the second conductive strip is disposed by the second electrode 104 arranged along the second side Conductive bridges outside the organic light emitting diode are formed in series.
  • the conductive bridge 108 is disposed in the insulating layer 101 between the substrate 100 and the organic light emitting diode, and the conductive bridge 108 is selected from, but not limited to, a single layer or a plurality of layers of conductive polymers or molybdenum, aluminum, titanium, A metal such as tungsten or an alloy film thereof is preferably a multilayer metal conductive bridge, and in this embodiment, a three-layer metal film of molybdenum/aluminum/molybdenum which is sequentially stacked is more preferable.
  • the molybdenum/aluminum/molybdenum in the conductive bridge 108 is 50 nm/250 nm/50 nm, respectively.
  • the thickness of the conductive bridge 108 may also be 10 nm to 1000 nm, and the present invention can be realized. The purpose of the present invention falls within the scope of protection of the present invention.
  • the insulating layer 101 is selected from, but not limited to, one or more stacked layers of silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, etc., and this embodiment is preferably a single layer silicon nitride layer.
  • the material and thickness of the first electrode 102, the organic material layer 103, and the second electrode of the present invention are the same as those in the prior art, wherein the thickness of the second electrode is preferably from 1 nm to 500 nm.
  • the first electrode 102 is a sequentially stacked ITO/Ag/ITO layer having a thickness of 15 nm/110 nm/7 nm; the material layer 103 includes a light-emitting layer and a hole injection layer, a hole transport layer, and an electron.
  • the organic material layer 103 in the present embodiment includes hole transport arranged in a stack
  • the layer, the light-emitting layer and the electron transport layer have a total thickness of 200 nm
  • the second electrode is Ag and has a thickness of 5 nm.
  • the substrate 100 is further provided with a pixel defining layer 110 for isolating adjacent the organic light emitting diodes, and the pixel defining layer 110 is further directly provided with a partitioning adjacent the first conductive strips and the second conductive strips.
  • the column layer 106 is isolated.
  • the isolation pillar 106 separating the second electrode into the first conductive strip and the second conductive strip is preferably a polyimide layer having a height of 0.1 ⁇ m to 5 ⁇ m. It is preferably 1 ⁇ m and has a width of 1 ⁇ m.
  • the isolation pillars 106 may be prepared from other insulating materials, and the isolation pillars 106 may not be disposed between the second electrodes to ensure adjacent first conductive strips and the first The purpose of the present invention can be achieved by insulating the two conductive strips, and is within the scope of protection of the present invention.
  • the touch display device of the present embodiment is an active matrix organic light emitting display device, and further includes a plurality of driving thin film transistors disposed on the substrate 100, and the source of each of the first electrodes 102 and each of the driving thin film transistors Or drain contact connection.
  • the touch display device of the present invention is preferably a top emission organic light emitting display device, that is, the second electrode 102 is a transparent electrode.
  • the second electrodes 104 and 105 are further provided with an encapsulation layer 109, and the encapsulation layer 109 comprises one or more layers of organic thin films and/or inorganic thin films which are alternately disposed, and the inorganic thin film is selected from the group consisting of However, it is not limited to a film such as silicon nitride or silicon oxide, and the organic film is selected from films such as an ultraviolet curing resin and a silica-acrylic resin composite material.
  • the encapsulation layer 109 is preferably four pairs of alternatingly deposited polyacrylate layer and aluminum oxide layer, the polyacrylate layer has a film thickness of 1.5 microns, and the aluminum oxide layer has a film thickness of 50 nm.
  • the second electrode is configured to be connected in series in a horizontal direction and a vertical direction, respectively, to form an insulated side crossing network, and a touch sensing layer is formed while forming the second electrode.
  • the touch function is integrated in the organic light emitting diode, and the structure is simple. Moreover, the touch function is integrated in the organic light emitting diode, and the touch component is not required to be additionally disposed, and the light emitting efficiency is high and the corresponding speed is fast.
  • the method for preparing the touch device includes the following steps:
  • S1 forming a first conductive layer on the substrate 101 by a sputtering process, and patterning a plurality of continuous conductive strips disposed in a longitudinal direction, that is, forming the conductive bridge 108.
  • the first conductive layer may also be patterned to form a conductive bridge 108 in the form of a wire, and the wire or the conductive strip may also be discontinuous.
  • the through hole 107 of the same conductive bridge 108 is passed through.
  • the through hole 107 has an angle of 50° with the substrate 100.
  • the through hole may also be subjected to laser ablation, ion beam etching, electron beam etching, and the like.
  • the angle between the axial direction of the through hole 107 and the substrate 100 may be any angle of 10° to 90°, and the object of the present invention can be achieved, and belongs to the protection scope of the present invention.
  • the second conductive layer can also be prepared by a process such as CVD, electrochemical deposition, or the like, and the object of the present invention can be achieved, and belongs to the protection scope of the present invention.
  • a pixel defining layer 110 covering the first electrode 102 is formed on a substrate by a coating process, and patterned by a photolithography process to expose the first electrode 102 and the via 107.
  • An isolation pillar layer 106 is then formed on the pixel defining layer 110 by a coating and photolithography process.
  • An organic material layer 103 is formed on the first electrode 102 by a fine mask evaporation process.
  • the two electrodes 104, the second electrode 104 and the second electrode 105 are naturally separated by a layer of spacers 106 of negative angle.
  • the second electrode 105 is formed in series to form a first conductive strip, and a material forming the second electrode is filled in the through hole 107 and electrically connected to the conductive bridge 108, so that the second electrode 104 can be along the first
  • the two directions are connected in series to form a second conductive strip.
  • the step S4 further includes the step of preparing an encapsulation layer 109 covering the second electrodes 104 and 105 on the substrate 100, and the specific implementation is the same as the prior art.
  • the second electrode is prepared to be connected in series in the horizontal and vertical directions, and the integrated photolithography process can be integrated through the mature photolithography process. It has touch function, simple preparation method and low process cost.

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Abstract

本发明所述的一种触控显示装置，在形成第二电极的同时，第二电极分别沿横向和纵向串联连接，形成彼此绝缘侧交叉网络，即形成触控感测层，将触控功能集成在所述有机发光二极管中，结构简单，无需另外再设置触控部件，发光效率高、响应速度快。本发明所述的一种触控显示装置的制备方法，将第二电极制备成分别沿横向和纵向串联连接结构，在完成有机发光二极管制备的同时，通过工艺成熟的光刻和刻蚀工艺便可以集成有触控功能，制备方法简单，工艺成本低。

Description

一种触控显示装置及其制备方法 技术领域
本发明涉及显示技术领域，具体涉及一种具有内嵌式触控结构的有机发光显示装置及其制备方法。
背景技术
触控屏(英文全称为Touch Panel)，又称触摸屏、触控面板，是一种可接收触头等输入信号的感应式显示装置，广泛应用在各种电子产品上。按照触摸屏的工作原理和传输信息的介质，触摸屏可分为四种：电阻式、电容式、红外线式和表面声波式。
电容式触摸屏(英文全称为Capacitive Touch Panel，简称为CTP)是利用人体的电流感应对屏幕进行控制的。根据侦测触碰区域的电容变化，进而计算手指所在位置，精确度可达99％，响应时间小于3ms。CTP具有灵敏度高、容易实现多点触控技术等优点，逐渐成为智能手机、平板电脑等电子产品中应用的主流触摸屏。
现有技术中，按照触控层叠结构和显示面板的相对位置，CTP可分为：out cell(触控装置外挂于显示面板外)、on cell(触控装置设置在显示面板上)和in cell(触控装置集成在显示面板中)等技术架构。尽管out cell和on cell技术成熟，在中小尺寸显示面板中得到了广泛的应用，而且out cell技术中的OFS(英文全称为One Film Solution，译为单片薄膜解决方案)可应用在有机电致发光显示装置中，使得柔性触控显示成为可能。但是in cell可以使得显示面板更加轻薄、透光率更高、功率更小，而且可以实现柔性，被称为是触控显示，特别是有机电致发光显示触控的终极解决方案，将逐渐成为有机电致发光显示装置中触控技术的发展主流。
中国专利CNl01635276A公开了一种有机发光二极管触控面板，包括基板、OLED元件，以及光学感测元件。基板上定义有至少一像素区域，且像素区域中定义有显示区域与感测区域。OLED元件设置于显示区域中的基板上，包括第一薄膜晶体管、发光下电极部、图案化有机发光层，以及发光上电极部。发光下电极部设置于发光上电极部上，且电连接至第一薄膜晶体管。图案化有机发光层设置于发光下电极部上。发光上电极部设置于图案化有机发光层上。光学感测元件设置于感测区域中的基板上，包括第二薄膜晶体管、感光下电极部、图案化感光介电层，以及感光上电极部。感光下电极部设置于第二薄膜晶体管上，且电连接至第二薄膜晶体管。图案化感光介电层设置于感光下电极部上，感光上电极部设置于图案化感光介电层上。该专利灵敏度高，但属于in-cell型光学触控方式，不但结构和制备工艺复杂而且难以实现多点触控，不属于主流的触控技术。
发明内容
为此，本发明所要解决的是现有技术中in-cell型触控技术结构和制备工艺复杂的问题，提供一种结构和工艺简单且具有内嵌式触控结构的有机发光显示装置及其制备方法。
为解决上述技术问题，本发明采用的技术方案如下：
本发明所述的一种触控显示装置，包括基板、设置在基板上的多个有机发光二极管，所述有机发光二极管包括依次堆叠设置的第一电极、有机材料层和第二电极；所述第一电极独立设置；所述第二电极分别串联形成若干平行排列的第一导电条和若干平行排列的第二导电条，所述第一导电条与所述第二导电条形成彼此绝缘的交叉网络。
所述第一导电条由沿第一方向排布的所述第二电极同层串联形成；所述第二导电条由沿第二方排布的所述第二电极通过设置在所述有机发光二极管外部的导电桥进行串联形成。
所述导电桥设置在所述基板上，并通过直接覆盖在所述导电桥上的绝缘层与所述有机发光二极管绝缘。
所述导电桥为金属导电桥。
所述导电桥的厚度为10nm～1000nm。
所述基板上还设置有隔离相邻所述有机发光二极管的像素限定层。
所述像素限定层上还直接设置有分隔相邻所述第一导电条与所述第二导电条的隔离柱层。
所述第二电极的厚度为1nm～500nm。
还包括设置在所述基板上的若干驱动薄膜晶体管，各所述第一电极与各所述驱动薄膜晶体管的源极或漏极接触连接。
本发明所述的触控装置的制备方法，包括如下步骤：
S1、在基板上形成第一导电层，并图案化形成多个沿第二方向平行设置的导电桥；
S2、在基板上形成覆盖导电桥的绝缘层，在绝缘层中设置导通导电桥的通孔；
S3、在绝缘层上直接形成彼此独立的第一电极、在各第一电极上形成有机材料层；
S4、在有机材料层上形成第二电极，沿第一方向排布的若干第二电极同层串联，形成多个平行排列的第一导电条，沿第二方向排布的若干第二电极通过通孔与导电桥进行串联，形成多个平行排列的第二导电条，所述第一导电条与所述第二导电条形成彼此绝缘的交叉网络。
步骤S3中形成所述第一电极后，还包括在所述基板上形成环绕所述第一电极的像素限定层的步骤。
步骤S3中还包括在所述像素限定层上形成隔离柱层的步骤；步骤S4中形成的相邻所述第一导电条与所述第二导电条由所述隔离柱层隔开。
步骤S2中所述通孔的轴向与所述基板的夹角为10°～90°。
本发明的上述技术方案相比现有技术具有以下优点：
1、本发明所述的一种触控显示装置，包括基板、设置在基板上的有机发光二极管，所述第一电极独立设置；所述第二电极分别串联形成若干平行排列的第一导电条和若干平行排列的第二导电条，所述第一导电条与所述第二导电条形成彼此绝缘的交叉网络。在形成第二电极的同时，第二电极分别沿横向和纵向串联连接，形成彼此绝缘侧交叉网络，即形成触控感测层，将触控功能集成在所述有机发光二极管的第二电极中，结构简单；而且，可以实现多点触控。
2、本发明所述的一种触控显示装置，将触控功能集成在所述有机发光二极管中，无需另外再设置触控部件，发光效率高、相应速度快。
3、本发明所述的一种触控显示装置的制备方法，将第二电极制备成分别沿横向和纵向串联连接结构，在完成有机发光二极管制备的同时，通过工艺成熟的光刻和刻蚀工艺便可以集成有触控功能，制备方法简单，工艺成本低。
附图说明
为了使本发明的内容更容易被清楚的理解，下面根据本发明的具体实施例并结合附图，对本发明作进一步详细的说明，其中
图1是本发明实施例1中所述触控显示装置的结构示意图；
图中附图标记表示为：100-基板、101-绝缘层、102-第一电极、103-有机材料层、104-第二导电条中的第二电极、105-第一导电条中的第二电极、106-隔离柱层、107-通孔、108-导电桥、109-封装层、110-像素限定层。
具体实施方式
为了使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明的实施方式作进一步地详细描述。
本发明可以以许多不同的形式实施，而不应该被理解为限于在此阐述的实施例。相反，提供这些实施例，使得本公开将是彻底和完整的，并且将把本发明的构思充分传达给本领域技术人员，本发明将仅由权利要求来限定。 在附图中，为了清晰起见，会夸大层和区域的尺寸和相对尺寸。应当理解的是，当元件例如层、区域或基板被称作“形成在”或“设置在”另一元件“上”时，该元件可以直接设置在所述另一元件上，或者也可以存在中间元件。相反，当元件被称作“直接形成在”或“直接设置在”另一元件上时，不存在中间元件。
本实施例提供一种触控显示装置，如图1所示，包括基板100、设置在基板100上的有机发光二极管，其第一电极102独立设置；所述第二电极104和105分别串联形成的若干平行排列的第一导电条和若干平行排列的第二导电条，所述第一导电条与所述第二导电条形成彼此绝缘的交叉网络。
所述第一导电条由沿第一方向排布的所述第二电极105同层串联形成；所述第二导电条由沿第二方排布的所述第二电极104通过设置在所述有机发光二极管外部的导电桥进行串联形成。
所述导电桥108设置在所述基板100与所述有机发光二极管之间的绝缘层101中，所述导电桥108选自但不限于单层或多层导电聚合物或钼、铝、钛、钨等金属或其合金薄膜，优选为多层金属导电桥，本实施例更优选依次堆叠的钼/铝/钼三层金属膜。
本实施例中所述导电桥108中钼/铝/钼分别为50nm/250nm/50nm，作为本发明的其他实施例，所述导电桥108的厚度还可以为10nm～1000nm，均可以实现本发明的目的，属于本发明的保护范围。
所述绝缘层101选自但不限于氮化硅、氧化硅、氮氧化硅、氧化铝等中的一层或多层堆叠结构，本实施例优选为单层的氮化硅层。
本发明所述第一电极102、所述有机材料层103、所述第二电极所用材料和厚度均同现有技术，其中所述第二电极的厚度优选为1nm～500nm。本实施例中所述第一电极102为依次堆叠的ITO/Ag/ITO层，厚度为15nm/110nm/7nm；所述有材料层103包括发光层以及空穴注入层、空穴传输层、电子阻挡层、空穴阻挡层、电子传输层以及电子注入层中的一种或多种的组合，本实施例中所述有机材料层103包括依次堆叠设置的空穴传输 层、发光层和电子传输层，厚度总共为200nm，所述第二电极为Ag，厚度为5nm。
所述基板100上还设置有隔离相邻所述有机发光二极管的像素限定层110，所述像素限定层110上还直接设置有分隔相邻所述第一导电条与所述第二导电条的隔离柱层106。
本实施例中，将所述第二电极分隔为所述第一导电条和所述第二导电条的隔离柱106优选为聚酰亚胺层，其的高度为0.1μm～5μm，本实施例优选为1μm，宽度为1μm。作为本发明的其他实施例，所述隔离柱106还可以为其他绝缘材料制备，所述第二电极之间也可以不设置隔离柱106，能保证相邻所述第一导电条与所述第二导电条绝缘即可实现本发明的目的，属于本发明的保护范围。
本实施例所述的触控显示装置为主动矩阵有机发光显示装置，还包括设置在所述基板100上的若干驱动薄膜晶体管，各所述第一电极102与各所述驱动薄膜晶体管的源极或漏极接触连接。
本发明所述触控显示装置优选为顶发射有机发光显示装置，即所述第二电极102为透明电极。
本实施例中，所述第二电极104和105上还设置有封装层109，所述封装层109包括一层或多层交替设置的有机薄膜和/或无机薄膜的膜层，无机薄膜选自但不限于氮化硅、氧化硅等薄膜，有机薄膜选自紫外光固化树脂、二氧化硅-丙烯酸树脂复合材料等薄膜。本实施例中，所述封装层109优选为四对交替沉积的聚丙烯酸酯层和氧化铝层，聚丙烯酸酯层膜厚均为1.5微米，氧化铝层的膜厚均为50nm。
本实施例所述的一种触控显示装置，所述第二电极设置为分别沿横向和纵向串联连接结构，形成彼此绝缘侧交叉网络，在形成第二电极的同时，形成触控感测层，将触控功能集成在所述有机发光二极管中，结构简单；而且，将触控功能集成在所述有机发光二极管中，无需另外再设置触控部件，发光效率高、相应速度快。
所述的触控装置的制备方法，包括如下步骤：
S1、通过溅射工艺在基板101上形成第一导电层，并图案化形成多个纵向平行设置的连续的导电条，即形成导电桥108。
作为本发明的其他实施例，所述第一导电层还可以图案化形成导线状的导电桥108，所述导线或导电条还可以为不连续的。
S2、通过等离子增强化学气相沉积(PECVD)工艺，形成覆盖所述导电桥108的绝缘层101，通过光刻工艺，在同列相邻所述第二有机发光二极管之间的绝缘层101中设置导通同一条所述导电桥108的通孔107。所述通孔107的轴向与所述基板100的夹角为50°，作为本发明的其他实施例，所述通孔还可以通过激光烧蚀、离子束刻蚀、电子束刻蚀等工艺制备，所述通孔107的轴向与所述基板100的夹角还可以为10°～90°的任意角度，均可以实现本发明的目的，属于本发明的保护范围。
S3、通过溅射工艺在绝缘层101上直接形成第二导电层，并通过光刻和刻蚀工艺图案化形成彼此独立的第一电极102。
作为本发明的其他实施例，所述第二导电层还可以通过CVD、电化学沉积等工艺制备，均可以实现本发明的目的，属于本发明的保护范围。
通过涂覆工艺在基板上形成覆盖所述第一电极102的像素限定层110，并通过光刻工艺图案化，暴露所述第一电极102和通孔107。
然后通过涂覆和光刻工艺，在像素限定层110上形成隔离柱层106。
通过精细掩膜蒸镀工艺，在所述第一电极102上形成有机材料层103。
S4、通过蒸镀工艺，以所述隔离柱层106为掩膜，在所述有机材料层103上形成沿第一方向同层串联连接的第二电极105，以及沿第二方向彼此分离的第二电极104，第二电极104与第二电极105由负角度的隔离柱106层自然隔开。所述第二电极105串联形成第一导电条，形成所述第二电极的材料填充在所述通孔107中并与所述导电桥108电接触连接，使得所述第二电极104得以沿第二方向串联，形成第二导电条。
本实施例中，所述步骤S4之后还包括在所述基板100上制备覆盖所述第二电极104和105的封装层109的步骤，具体实施方式同现有技术。
本实施例所述的一种触控显示装置的制备方法，将第二电极制备成分别沿横向和纵向串联连接结构，在完成有机发光二极管制备的同时，通过工艺成熟的光刻工艺便可以集成有触控功能，制备方法简单，工艺成本低。
显然，上述实施例仅仅是为清楚地说明所作的举例，而并非对实施方式的限定。对于所属领域的普通技术人员来说，在上述说明的基础上还可以做出其它不同形式的变化或变动。这里无需也无法对所有的实施方式予以穷举。而由此所引伸出的显而易见的变化或变动仍处于本发明的保护范围之中。

Claims (13)

  1. 一种触控显示装置，包括基板、设置在基板上的多个有机发光二极管，所述有机发光二极管包括依次堆叠设置的第一电极、有机材料层和第二电极；其特征在于，所述第一电极独立设置；所述第二电极分别串联形成若干平行排列的第一导电条和若干平行排列的第二导电条，所述第一导电条与所述第二导电条形成彼此绝缘的交叉网络。
  2. 根据权利要求1所述的触控显示装置，其特征在于，所述第一导电条由沿第一方向排布的所述第二电极同层串联形成；所述第二导电条由沿第二方排布的所述第二电极通过设置在所述有机发光二极管外部的导电桥进行串联形成。
  3. 根据权利要求2所述的触控显示装置，其特征在于，所述导电桥设置在所述基板上，并通过直接覆盖在所述导电桥上的绝缘层与所述有机发光二极管绝缘。
  4. 根据权利要求3所述的触控显示装置，其特征在于，所述导电桥为金属导电桥。
  5. 根据权利要求3所述的触控显示装置，其特征在于，所述导电桥的厚度为10nm～1000nm。
  6. 根据权利要求1所述的触控显示装置，其特征在于，所述基板上还设置有隔离相邻所述有机发光二极管的像素限定层。
  7. 根据权利要求6所述的触控显示装置，其特征在于，所述像素限定层上还直接设置有分隔相邻所述第一导电条与所述第二导电条的隔离柱层。
  8. 根据权利要求1-7任一所述的触控显示装置，其特征在于，所述第二电极的厚度为1nm～500nm。
  9. 根据权利要求1-7任一所述的触控显示装置，其特征在于，还包括设置在所述基板上的若干驱动薄膜晶体管，各所述第一电极与各所述驱动薄膜晶 体管的源极或漏极接触连接。
  10. 一种权利要求1-9任一所述的触控装置的制备方法，其特征在于，包括如下步骤：
    S1、在基板上形成第一导电层，并图案化形成多个沿第二方向平行设置的导电桥；
    S2、在基板上形成覆盖导电桥的绝缘层，在绝缘层中设置导通导电桥的通孔；
    S3、在绝缘层上直接形成彼此独立的第一电极、在各第一电极上形成有机材料层；
    S4、在有机材料层上形成第二电极，沿第一方向排布的若干第二电极同层串联，形成多个平行排列的第一导电条，沿第二方向排布的若干第二电极通过通孔与导电桥进行串联，形成多个平行排列的第二导电条，所述第一导电条与所述第二导电条形成彼此绝缘的交叉网络。
  11. 根据权利要求10所述的触控装置的制备方法，其特征在于，步骤S3中形成所述第一电极后，还包括在所述基板上形成环绕所述第一电极的像素限定层的步骤。
  12. 根据权利要求11所述的触控装置的制备方法，其特征在于，步骤S3中还包括在所述像素限定层上形成隔离柱层的步骤；步骤S4中形成的相邻所述第一导电条与所述第二导电条由所述隔离柱层隔开。
  13. 根据权利要求10所述的触控装置的制备方法，其特征在于，步骤S2中所述通孔的轴向与所述基板的夹角为10°～90°。
PCT/CN2014/094919 2013-12-27 2014-12-25 一种触控显示装置及其制备方法 WO2015096765A1 (zh)

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KR101891819B1 (ko) 2018-08-24
CN104750284A (zh) 2015-07-01
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US20170003800A1 (en) 2017-01-05
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