WO2015067066A1 - 显示面板及其制备方法、显示装置 - Google Patents
显示面板及其制备方法、显示装置 Download PDFInfo
- Publication number
- WO2015067066A1 WO2015067066A1 PCT/CN2014/082240 CN2014082240W WO2015067066A1 WO 2015067066 A1 WO2015067066 A1 WO 2015067066A1 CN 2014082240 W CN2014082240 W CN 2014082240W WO 2015067066 A1 WO2015067066 A1 WO 2015067066A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- substrate
- display panel
- auxiliary electrode
- conductive spacer
- organic electroluminescent
- Prior art date
Links
- 238000002360 preparation method Methods 0.000 title abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 154
- 125000006850 spacer group Chemical group 0.000 claims abstract description 130
- 239000000463 material Substances 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 36
- 230000008569 process Effects 0.000 claims description 24
- 238000000059 patterning Methods 0.000 claims description 19
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 7
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 7
- 229910052750 molybdenum Inorganic materials 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 6
- 239000011733 molybdenum Substances 0.000 claims description 6
- 229920000767 polyaniline Polymers 0.000 claims description 6
- -1 polyparaphenylene Polymers 0.000 claims description 6
- 229920000265 Polyparaphenylene Polymers 0.000 claims description 5
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 claims description 5
- 229910001195 gallium oxide Inorganic materials 0.000 claims description 5
- 229910003437 indium oxide Inorganic materials 0.000 claims description 5
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920000128 polypyrrole Polymers 0.000 claims description 5
- 229920000123 polythiophene Polymers 0.000 claims description 5
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 239000000178 monomer Substances 0.000 claims description 4
- 229920001197 polyacetylene Polymers 0.000 claims description 4
- 229910052804 chromium Inorganic materials 0.000 claims description 3
- 239000011651 chromium Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 132
- 239000011159 matrix material Substances 0.000 description 11
- 239000004020 conductor Substances 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229910052814 silicon oxide Inorganic materials 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- 230000004888 barrier function Effects 0.000 description 5
- 239000002131 composite material Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 229910001257 Nb alloy Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- 238000002161 passivation Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000010936 titanium Substances 0.000 description 4
- 229910052581 Si3N4 Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- YBMRDBCBODYGJE-UHFFFAOYSA-N germanium oxide Inorganic materials O=[Ge]=O YBMRDBCBODYGJE-UHFFFAOYSA-N 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- PVADDRMAFCOOPC-UHFFFAOYSA-N oxogermanium Chemical compound [Ge]=O PVADDRMAFCOOPC-UHFFFAOYSA-N 0.000 description 3
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 3
- 239000011241 protective layer Substances 0.000 description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QNTVPKHKFIYODU-UHFFFAOYSA-N aluminum niobium Chemical compound [Al].[Nb] QNTVPKHKFIYODU-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005401 electroluminescence Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- DTSBBUTWIOVIBV-UHFFFAOYSA-N molybdenum niobium Chemical compound [Nb].[Mo] DTSBBUTWIOVIBV-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 229920001609 Poly(3,4-ethylenedioxythiophene) Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- NCMAYWHYXSWFGB-UHFFFAOYSA-N [Si].[N+][O-] Chemical compound [Si].[N+][O-] NCMAYWHYXSWFGB-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- YZZNJYQZJKSEER-UHFFFAOYSA-N gallium tin Chemical compound [Ga].[Sn] YZZNJYQZJKSEER-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000002324 mouth wash Substances 0.000 description 1
- 229940051866 mouthwash Drugs 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80522—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
- H10K50/125—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers specially adapted for multicolour light emission, e.g. for emitting white light
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/818—Reflective anodes, e.g. ITO combined with thick metallic layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/828—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/805—Electrodes
- H10K59/8052—Cathodes
- H10K59/80524—Transparent cathodes, e.g. comprising thin metal layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8723—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3026—Top emission
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/38—Devices specially adapted for multicolour light emission comprising colour filters or colour changing media [CCM]
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Electroluminescent Light Sources (AREA)
- Veterinary Medicine (AREA)
- Pharmacology & Pharmacy (AREA)
- Animal Behavior & Ethology (AREA)
- General Health & Medical Sciences (AREA)
- Public Health (AREA)
- Medicinal Chemistry (AREA)
- Epidemiology (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Inorganic Chemistry (AREA)
- Neurosurgery (AREA)
- Neurology (AREA)
- Biomedical Technology (AREA)
- Orthopedic Medicine & Surgery (AREA)
- Psychology (AREA)
- Biochemistry (AREA)
- Molecular Biology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Organic Chemistry (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Proteomics, Peptides & Aminoacids (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/422,271 US10411189B2 (en) | 2013-11-11 | 2014-07-15 | Display panel having cathode connected to auxiliary electrode through conductive spacers and manufacturing method thereof, and display device |
US16/393,153 US10950793B2 (en) | 2013-11-11 | 2019-04-24 | Display panel having cathode connected to auxiliary electrode through conductive spacers and manufacturing method thereof, and display device |
US17/169,099 US11950490B2 (en) | 2013-11-11 | 2021-02-05 | Display device having conductive spacers connecting anode and cathode on opposing substrates |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310557149.5A CN103545345B (zh) | 2013-11-11 | 2013-11-11 | 一种显示面板及其制备方法、显示装置 |
CN201310557149.5 | 2013-11-11 |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/422,271 A-371-Of-International US10411189B2 (en) | 2013-11-11 | 2014-07-15 | Display panel having cathode connected to auxiliary electrode through conductive spacers and manufacturing method thereof, and display device |
US16/363,153 Continuation US20190290769A1 (en) | 2013-11-11 | 2019-03-25 | Hydrogel Compositions |
US16/393,153 Continuation US10950793B2 (en) | 2013-11-11 | 2019-04-24 | Display panel having cathode connected to auxiliary electrode through conductive spacers and manufacturing method thereof, and display device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015067066A1 true WO2015067066A1 (zh) | 2015-05-14 |
Family
ID=49968629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/CN2014/082240 WO2015067066A1 (zh) | 2013-11-11 | 2014-07-15 | 显示面板及其制备方法、显示装置 |
Country Status (3)
Country | Link |
---|---|
US (3) | US10411189B2 (zh) |
CN (1) | CN103545345B (zh) |
WO (1) | WO2015067066A1 (zh) |
Families Citing this family (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103545345B (zh) | 2013-11-11 | 2016-09-21 | 京东方科技集团股份有限公司 | 一种显示面板及其制备方法、显示装置 |
CN103824876A (zh) * | 2014-02-12 | 2014-05-28 | 京东方科技集团股份有限公司 | 一种三维显示面板、其制作方法及三维显示装置 |
TWI549289B (zh) * | 2014-02-26 | 2016-09-11 | 友達光電股份有限公司 | 有機發光顯示面板及其製作方法 |
CN103972270B (zh) | 2014-05-09 | 2016-03-02 | 京东方科技集团股份有限公司 | Oled显示面板及应用其的oled显示装置 |
CN104112767B (zh) * | 2014-07-28 | 2017-09-19 | 京东方科技集团股份有限公司 | 阵列基板、有机发光二极管显示面板和显示装置 |
CN104201190A (zh) * | 2014-08-26 | 2014-12-10 | 上海和辉光电有限公司 | 有机发光装置及其制备方法 |
CN104659063A (zh) | 2014-12-30 | 2015-05-27 | 京东方科技集团股份有限公司 | 显示基板及其制造方法、显示面板和掩膜板 |
CN104576706B (zh) * | 2015-01-27 | 2017-10-27 | 京东方科技集团股份有限公司 | 底发射型有机电致发光显示器件、其制作方法及显示装置 |
KR102364863B1 (ko) | 2015-03-10 | 2022-02-18 | 삼성디스플레이 주식회사 | 표시 장치 및 그 제조 방법 |
CN104766930B (zh) | 2015-04-17 | 2017-07-25 | 京东方科技集团股份有限公司 | Oled基板及其制备方法、显示装置 |
CN106206984A (zh) | 2016-08-18 | 2016-12-07 | 京东方科技集团股份有限公司 | 顶发射型有机电致发光器件及其制备方法、显示装置 |
CN106129102A (zh) * | 2016-09-13 | 2016-11-16 | 京东方科技集团股份有限公司 | 一种oled封装基板及其制备方法、oled显示面板 |
CN106549113B (zh) * | 2017-01-16 | 2019-10-01 | 上海天马有机发光显示技术有限公司 | 一种有机发光显示面板及装置 |
CN106803547B (zh) * | 2017-02-15 | 2018-08-14 | 深圳市华星光电技术有限公司 | 顶发射型oled显示器件的制作方法及结构 |
CN106953026A (zh) * | 2017-03-21 | 2017-07-14 | 京东方科技集团股份有限公司 | 显示面板及其制造方法、显示装置 |
CN106898707A (zh) * | 2017-04-28 | 2017-06-27 | 深圳市华星光电技术有限公司 | 一种顶发射oled器件及制备方法、显示面板 |
CN107293573A (zh) * | 2017-07-06 | 2017-10-24 | 京东方科技集团股份有限公司 | Oled基板和oled显示装置 |
CN107316951B (zh) | 2017-08-16 | 2019-01-29 | 京东方科技集团股份有限公司 | 封装基板及其制备方法、oled显示面板及其制备方法 |
CN107394052B (zh) * | 2017-08-31 | 2024-01-09 | 京东方科技集团股份有限公司 | 一种有机发光二极管器件及其制备方法、显示装置 |
CN109427998B (zh) * | 2017-09-01 | 2020-01-14 | 京东方科技集团股份有限公司 | 用于有机电致发光显示器件的盖板及其制作方法、有机电致发光显示器件以及显示设备 |
CN107634012B (zh) * | 2017-09-13 | 2021-05-07 | 京东方科技集团股份有限公司 | 一种封装基板及其制备方法、显示面板、显示装置 |
CN107644894B (zh) * | 2017-09-18 | 2023-11-24 | 京东方科技集团股份有限公司 | 一种有机电致发光器件、其制备方法及显示装置 |
US20210193953A1 (en) * | 2017-09-26 | 2021-06-24 | Boe Technology Group Co., Ltd. | Organic light emitting diode display substrate, organic light emitting diode display apparatus, and method of fabricating organic light emitting diode display substrate |
CN107785401B (zh) * | 2017-10-27 | 2020-11-27 | 京东方科技集团股份有限公司 | 彩膜基板的制作方法、彩膜基板及显示面板 |
CN107887526B (zh) * | 2017-10-31 | 2019-11-05 | 京东方科技集团股份有限公司 | 显示面板及其制作方法、显示装置 |
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CN103545345B (zh) | 2016-09-21 |
US20160035980A1 (en) | 2016-02-04 |
US10411189B2 (en) | 2019-09-10 |
US20210154303A1 (en) | 2021-05-27 |
US10950793B2 (en) | 2021-03-16 |
US11950490B2 (en) | 2024-04-02 |
CN103545345A (zh) | 2014-01-29 |
US20190252616A1 (en) | 2019-08-15 |
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