WO2015053355A1 - Film adhésif, corps d'enroulement de film, procédé de production pour structure de liaison, procédé de liaison, structure de liaison - Google Patents

Film adhésif, corps d'enroulement de film, procédé de production pour structure de liaison, procédé de liaison, structure de liaison Download PDF

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Publication number
WO2015053355A1
WO2015053355A1 PCT/JP2014/077039 JP2014077039W WO2015053355A1 WO 2015053355 A1 WO2015053355 A1 WO 2015053355A1 JP 2014077039 W JP2014077039 W JP 2014077039W WO 2015053355 A1 WO2015053355 A1 WO 2015053355A1
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Prior art keywords
film
layer
adhesive
modulus
young
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PCT/JP2014/077039
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English (en)
Japanese (ja)
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雄太 荒木
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デクセリアルズ株式会社
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Publication of WO2015053355A1 publication Critical patent/WO2015053355A1/fr

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive film in which an adhesive layer is supported on a base film.
  • the adhesive film is wound around a reel and continuously unwound from the reel during actual use, and only the adhesive layer is cut to a predetermined length.
  • the base film relates to an adhesive film continuously wound up, and a connection method using the adhesive film.
  • a mounting method has been used in which electronic components are mounted on a substrate using an adhesive film.
  • COG Chip on Glass
  • an IC chip as a liquid crystal driving circuit is mounted via a conductive adhesive film, various driving circuits, etc., are formed on the periphery of a glass substrate of a liquid crystal display panel (LCD panel)
  • An FOG (Film-on-Glass) mounting for connecting a flexible substrate can be mentioned.
  • the conductive adhesive film 40 is obtained by forming an adhesive layer 43 in which conductive particles 42 are dispersed in a binder resin 41 on a base film 44 that serves as a support.
  • connection terminal of the flexible substrate and the connection terminal of the rigid substrate will be described as an example.
  • both connection terminals 52 and 55 of the flexible substrate 51 and the glass substrate 54 are formed.
  • the conductive adhesive film 40 is disposed between the regions, and is appropriately heat-pressed from above the flexible substrate 51 by the heating and pressing head 56 through the buffer material 50.
  • the binder resin exhibits fluidity, flows out from between the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54, and in the conductive adhesive film 40.
  • the conductive particles 42 are sandwiched between the connection terminals and crushed.
  • connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54 are electrically connected through the conductive particles 42, and the binder resin is cured in this state.
  • the conductive particles 42 that are not between the connection terminals 52 and 55 are dispersed in the binder resin 41 and maintain an electrically insulated state. Thereby, electrical continuity is achieved only between the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54.
  • Such a conductive adhesive film 40 is used, for example, in the form of a film wound body wound around a core of a reel member 45 having a pair of reel flanges as shown in FIG. Reference 1).
  • the base film is made thin, it may be cut to the base film in the half-cut process, making it impossible to carry. That is, the conductive adhesive film supplied as a film winding body wound around the reel is unwound from the reel and drawn to the take-up reel through a plurality of transport rollers in actual use.
  • the conductive adhesive film when a knife cuts into the adhesive layer, only the adhesive layer is cut to a predetermined length, and the base film supporting the adhesive layer is not cut, so-called half cut is performed. Thereafter, the conductive adhesive film is heat-pressed onto the connection object such as a substrate by a temporary crimping tool from above the base film, so that only the adhesive layer cut to a predetermined length is on the connection object.
  • the base film is continuously conveyed and wound on a take-up reel.
  • the base film may be cut in the half-cut process.
  • the knife is cut shallowly to prevent the base film from being cut, the adhesive layer is not cut and there is a risk of poor transfer, so a sufficient depth of cut into the adhesive layer must be secured.
  • an object of the present invention is to provide an adhesive film that can be elongated while preventing the base film from being cut by half-cutting.
  • an adhesive film according to the present invention includes a base film and an adhesive layer supported by the base film.
  • the base film has a relatively high Young's modulus.
  • a layer and a layer having a relatively low Young's modulus are laminated.
  • the film winding body according to the present invention is a film winding body in which an adhesive film having a base film and an adhesive layer supported by the base film is wound on a reel.
  • a layer having a high Young's modulus and a layer having a relatively low Young's modulus are laminated.
  • the manufacturing method of the connection structure which concerns on this invention is a connection object in the manufacturing method of the connection structure using the adhesive film which has a base film and the adhesive bond layer supported by the said base film. It is transported onto an object, a cutter is cut from the adhesive layer side, only the adhesive layer is cut to a predetermined length, the adhesive layer is transferred to the connection object, and the base film is continuous. It is intended to wind up.
  • connection method is a method for connecting a connection object using an adhesive film having a base film and an adhesive layer supported by the base film, and transporting the adhesive film onto the connection object. Then, a cutter is cut from the adhesive layer side, only the adhesive layer is cut to a predetermined length, the adhesive layer is transferred to the connection object, and the base film is continuously wound up. Is.
  • connection structure according to the present invention is manufactured by the above connection method.
  • the base film is prevented from being cut by the layer having a high Young's modulus and a high breaking strength. Therefore, according to this invention, even after an adhesive bond layer peels, a base film can be conveyed continuously.
  • a base film can be made thin and can lengthen, preventing cutting of the base film by a half cut.
  • FIG. 1 is a cross-sectional view showing an adhesive film to which the present invention is applied and a film fitting.
  • FIG. 2 is a front view showing the film mounting body.
  • FIG. 3 is a diagram illustrating a manufacturing process of a connection structure using an adhesive film to which the present invention is applied.
  • FIG. 4 is a perspective view showing a state in which a knife is cut into the adhesive layer.
  • FIG. 5 is a side view showing a state in which the adhesive layer is transferred to the substrate by the temporary crimping tool.
  • FIG. 6 is a perspective view showing a state in which only the base film is continuously conveyed after the adhesive layer is transferred to the substrate.
  • FIG. 7 is a cross-sectional view showing a conventional adhesive film and film fitting.
  • FIG. 8 is a diagram showing a connection process using an adhesive film, where (A) shows a pre-connection process, and (B) shows a thermal pressurization process.
  • An adhesive film 1 to which the present invention is applied has a base film 2 and an adhesive layer 3 supported by the base film 2 as shown in FIG. Moreover, the base film 2 of the adhesive film 1 is formed by laminating a hard film layer 10 having a relatively high Young's modulus and a soft film layer 20 having a relatively low Young's modulus. The adhesive layer 3 is supported by the soft film layer 20.
  • the hard film layer 10 constituting the base film 2 is made of a film having a relatively high Young's modulus as compared with a soft film layer 20 described later, such as PEN (polyethylenenaphthalate, Young's modulus: 6.1 GPa), PI ( A relatively high rigidity material such as polyimide and Young's modulus: 9.1 GPa can be used.
  • PEN polyethylenenaphthalate, Young's modulus: 6.1 GPa
  • PI A relatively high rigidity material such as polyimide and Young's modulus: 9.1 GPa can be used.
  • the soft film layer 20 constituting the base film 2 is made of a film having a Young's modulus lower than that of the hard film layer 10.
  • PP polypropylene, Young's modulus: 1.5 GPa
  • PET polyethylene terephthalate, Young's modulus: 5. 3GPa
  • PP polypropylene, Young's modulus: 1.5 GPa
  • PET polyethylene terephthalate, Young's modulus: 5. 3GPa
  • the base film 2 is integrally molded by joining the hard film layer 10 and the soft film layer 20 with an adhesive or the like. Further, the flexible film layer 20 is provided with the adhesive layer 3.
  • the knife 5 is cut from the soft film layer 20 side and only the adhesive layer 3 is cut to a predetermined length in the half-cut process.
  • the adhesive film 1 even when the soft film layer 20 is cut by the knife 5, the base film 2 is prevented from being cut by the hard film layer 10 having a high Young's modulus and a high breaking strength. Accordingly, the adhesive film 1 can continuously transport the base film 2 even after the adhesive layer 3 is peeled off.
  • the base film 2 can be made thin, and the lengthening can be achieved while preventing the base film 2 from being cut by a half cut. Can be planned.
  • Such a base film 2 can be formed by separately forming the hard film layer 10 and the soft film layer 20 and then laminating them through an adhesive. Moreover, you may form the adhesive film 1 by laminating
  • the thickness of the soft film layer 20 is equal to or less than the thickness of the hard film layer 10.
  • the base film 2 preferably has a thickness equal to or greater than the thickness of the adhesive layer 3 described later. Thereby, in the half-cut process, it becomes easy to adjust the cutting depth of the knife 5, and the cutting edge of the knife 5 does not cut deeply into the hard film layer 10 of the base film 2, thereby reliably preventing cutting.
  • a hard film layer 10 having a Young's modulus higher than that of the soft film layer 20 is laminated on the soft film layer 20 that supports the adhesive layer 3, and in the half-cut process, a knife is applied from the soft film layer 20 side. 5 cuts. That is, the base film 2 has a layer having a high Young's modulus sequentially from the lowest layer to the uppermost layer cut by the knife 5. Thereby, since the layer with a high Young's modulus is sequentially provided in the base film 2 as the knife 5 cuts, the cutting
  • the base film 2 may have a two-layer structure of the hard film layer 10 and the soft film layer 20, or may have a laminated structure of three or more layers. At this time, the base film 2 can effectively prevent cutting by the knife 5 by laminating film layers having high Young's modulus sequentially from the lowest layer to the uppermost layer cut by the knife 5.
  • the upper film laminated on the soft film layer 20 that supports the adhesive layer 3 has a thickness equal to or larger than the thickness of the soft film layer 20. It is preferable to provide.
  • the Young's modulus of the hard film layer 10 is 6.0 (GPa) or more.
  • the base film 2 can effectively prevent cutting with the knife 5 while achieving a reduction in thickness.
  • the Young's modulus of the soft film layer 20 that supports the adhesive layer 3 is preferably less than 6.0 (GPa).
  • the base film 2 has flexibility, winding failure around the reel, protrusion of the adhesive layer 3 during reel winding, Generation
  • the difference between the Young's modulus of the hard film layer 10 and the Young's modulus of the soft film layer 20 that supports the adhesive layer 3 is 0.5 (GPa) or more.
  • the adhesive layer 3 is an insulating adhesive layer made of a binder resin, or a conductive adhesive layer in which spherical or scale-like conductive particles having an average particle size of the order of several ⁇ m are contained in the binder resin.
  • the binder resin contains, for example, a film forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like.
  • the film-forming resin contained in the binder resin is preferably a resin having an average molecular weight of about 10,000 to 80,000.
  • the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.
  • thermosetting resin is not particularly limited, and examples thereof include commercially available epoxy resins and acrylic resins.
  • the epoxy resin is not particularly limited.
  • naphthalene type epoxy resin biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin.
  • an acrylic compound, liquid acrylate, etc. can be selected suitably.
  • what made acrylate the methacrylate can also be selected from methyl acrylate, ethyl acrylate, isopropy
  • the latent curing agent is not particularly limited, but includes a heat curing type curing agent.
  • the latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction.
  • the activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature
  • There are a method of initiating a curing reaction by dissolving and dissolving with a resin a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules.
  • Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof.
  • the above mixture may be sufficient.
  • the radical polymerization initiator a known one can be used, and among them, an organic peroxide can be preferably used.
  • the silane coupling agent is not particularly limited, and examples thereof include an epoxy type, an amino type, a mercapto sulfide type, and a ureido type. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.
  • Examples of the conductive particles contained in the binder resin of the adhesive layer 3 include any known conductive particles used in anisotropic conductive films (ACF). That is, as the conductive particles, for example, particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film.
  • ACF anisotropic conductive films
  • examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.
  • the adhesive film 1 in which the adhesive layer 3 made of a conductive adhesive layer or an insulating adhesive layer is formed on the soft film layer 20 of the base film 2 has been described. It is not limited.
  • the adhesive film 1 may be an anisotropic conductive film in which the adhesive layer 3 is configured by laminating a conductive adhesive layer and an insulating adhesive layer.
  • the adhesive film 1 to which the present invention is applied is wound around a reel member 6 as shown in FIG.
  • the reel member 6 includes a core 7 around which the tape-like adhesive film 1 is wound, and reel flanges 8 provided on both sides of the core 7.
  • the adhesive film 1 forms a film winding body 9 by being wound around the reel member 6.
  • the adhesive film 1 is supplied as this film winding body 9 when used for connection of electronic components.
  • connection process Subsequently, the connection process of the electronic component using the adhesive film 1 is demonstrated. As shown in FIG. 3, the adhesive film 1 is unwound from the reel member 6 and drawn to the take-up reel 31 through a plurality of conveying rollers 30.
  • the adhesive film 1 is subjected to a so-called half cut in which the knife 5 cuts into the adhesive layer 3 before the adhesive layer 3 is transferred to the substrate 32 that is a connection object.
  • the knife 5 is adjusted to a sufficient cutting depth for cutting the adhesive layer 3. Therefore, the knife 5 cuts into the base film 2 of the adhesive film 1.
  • the adhesive film 1 even when the soft film layer 20 is cut by the knife 5, the hard film layer 10 having a high Young's modulus and a high breaking strength is provided at the tip of the adhesive film 1. Only the layer 3 is cut, and the base film 2 can be prevented from being cut.
  • the adhesive film 1 is formed by applying only the adhesive layer 3 cut to a predetermined length by being hot-pressed on the substrate 32 by the provisional pressure bonding tool 33 from above the base film 2.
  • the base film 2 is continuously conveyed and wound around the take-up reel 31 as shown in FIG. 6.
  • the adhesive film 1 has the base film 2 provided with the hard film layer 10 having a high Young's modulus and a high breaking strength, so that the knife 5 is cut and the adhesive layer 3 is peeled off continuously.
  • the base film 2 can be conveyed and taken up on the take-up reel 31.
  • the base film 2 can be made thin, and the lengthening can be achieved while preventing the base film 2 from being cut by a half cut. Can be planned.
  • an adhesive film using a single-layer base film or a base film having a two-layer or three-layer structure having a layer layer having a relatively high Young's modulus and a layer having a low Young's modulus is prepared.
  • the cutability and the winding length around the reel member were compared and evaluated.
  • a reel member having a core diameter of 66 mm and an outer diameter of 145 mm was prepared.
  • UR1400 polyester urethane resin
  • Example 1 In Example 1, a PI film (Upilex-S: manufactured by Ube Industries, Young's modulus 9.1 GPa) having a thickness of 12 ⁇ m as a hard film layer, and a PP film (Treffan 2578: Toray Industries, Inc.) having a thickness of 15 ⁇ m as a soft film layer.
  • a polyurethane-based material in which a curing agent composed of a mixture of xylene diisocyanate (adduct body) and hexamethylene diisocyanate (Hewlett body) is blended with a main component composed of polyester polyol so as to have a solid content ratio of 3: 1.
  • An adhesive was used. The application amount of the adhesive was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
  • the base film according to Example 1 has a two-layer structure of a PI film and a PP film, and has a thickness of 27 ⁇ m. Moreover, the base film which concerns on Example 1 formed the adhesive bond layer (ADH) in PP film by which the peeling process was carried out.
  • ADH adhesive bond layer
  • Example 2 In Example 2, the conditions were the same as in Example 1 except that a PI film having a thickness of 25 ⁇ m was used as the hard film layer.
  • the base film according to Example 2 has a thickness of 40 ⁇ m.
  • Example 3 In Example 3, a 12 ⁇ m thick PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) as a hard film layer, and a 12 ⁇ m thick PET film (PET-01-BU as a soft film layer) : Mitsui Chemicals Tosero Co., Ltd., Young's modulus 5.3 GPa) and a base film laminated by a dry lamination method was used. The amount of adhesive applied was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
  • the base film according to Example 3 has a two-layer structure of a PEN film and a PET film and has a thickness of 24 ⁇ m. Moreover, the base film which concerns on Example 3 formed the adhesive bond layer (ADH) in PET film by which the peeling process was carried out.
  • ADH adhesive bond layer
  • Example 4 In Example 4, the same conditions as in Example 3 were used except that a 25 ⁇ m thick PET film (25 GS: manufactured by Lintec Corporation, Young's modulus 5.3 GPa) was used as the soft film layer.
  • the base film according to Example 4 has a thickness of 37 ⁇ m.
  • Example 5 In Example 5, the same conditions as in Example 3 were used except that a 25 ⁇ m thick PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) was used as the hard film layer.
  • the base film according to Example 5 has a thickness of 37 ⁇ m.
  • Example 6 a three-layer film (manufactured by Mitsubishi Polyester Film GMBH) formed by coextrusion biaxial stretching of PEN resin and PET resin was used as the base film.
  • the base film according to Example 6 includes a PEN layer (thickness: 1 ⁇ m, Young's modulus 6.1 GPa), a mixed layer of PEN and PET (thickness: 10 ⁇ m, Young's modulus 5.7 GPa), and a PET layer (thickness). 1 ⁇ m and Young's modulus 5.3 GPa) are laminated in this order.
  • the base film according to Example 6 had a thickness of 12 ⁇ m, and an adhesive layer (ADH) was formed on the peeled PET film.
  • Comparative Example 1 In Comparative Example 1, a PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) having a thickness of 12 ⁇ m was used as the base film. In Comparative Example 1, the base film was peeled and an adhesive layer (ADH) was laminated.
  • a PEN film Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa
  • ADH adhesive layer
  • Comparative Example 2 In Comparative Example 2, a PET film having a thickness of 25 ⁇ m (25 GS: manufactured by Lintec Corporation, Young's modulus 5.3 GPa) was used as the base film. In Comparative Example 2, the base film was peeled and an adhesive layer (ADH) was laminated.
  • ADH adhesive layer
  • Comparative Example 3 In Comparative Example 3, the conditions were the same as in Comparative Example 2 except that a PET film having a thickness of 38 ⁇ m was used as the base film.
  • Comparative Example 4 In Comparative Example 4, the conditions were the same as in Comparative Example 2 except that a 75 ⁇ m thick PET film was used as the base film.
  • Comparative Example 5 In Comparative Example 5, the same conditions as in Comparative Example 2 were used except that a PET film having a thickness of 100 ⁇ m was used as the base film.
  • Comparative Example 6 a base film in which two PET films having a thickness of 12 ⁇ m (PET-01-BU: manufactured by Mitsui Chemicals, Inc., Young's modulus 5.3 GPa) were laminated by a dry lamination method was used. The application amount of the adhesive was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
  • PET-01-BU manufactured by Mitsui Chemicals, Inc., Young's modulus 5.3 GPa
  • the base film according to Comparative Example 6 is a two-layer structure of two PET films and has a thickness of 24 ⁇ m. Moreover, the base film which concerns on the comparative example 6 gave the peeling process to one PET film, and formed the adhesive bond layer (ADH).
  • winding length around the reel member was evaluated as ⁇ (good) when it was 200 m or more, and x (defective) when it was less than 200 m.
  • the adhesive films using the base films according to Examples 1 to 6 have a thickness of 12 to 12 because a film having a high Young's modulus is laminated on the film supporting the adhesive layer. Despite being as thin as 40 ⁇ m, the half-cut property showed an ordinary performance, and there was no problem in actual use.
  • the adhesive films using the base films according to Examples 1 to 6 had a thin base film thickness of 12 to 40 ⁇ m, and therefore the winding length around the reel member was 200 m or more.
  • the comparative example 1 uses the base film which consists only of a PEN film with a comparatively high Young's modulus, since thickness is as thin as 12 micrometers, winding length was as favorable as 409m, but half cut Inferior to sex.
  • Comparative Examples 2 and 3 use a base film made of only a PET film having a relatively low Young's modulus, if the thickness is reduced to 25 ⁇ m or 38 ⁇ m, the half-cut property is inferior.
  • Comparative Examples 4 and 5 half-cutting properties can be improved by increasing the thickness to 25 ⁇ m and 38 ⁇ m using a base film made of only a PET film, but the thickness of the base film is increased. The winding length was shortened.
  • Comparative Example 6 a base film laminated with a PET film having a relatively low Young's modulus is used, but since a film having a high Young's modulus is not used, attempting to reduce the thickness results in inferior half-cut properties. It was.
  • the PI film and PEN film (hard film layer) having a high Young's modulus had a low Young's modulus
  • the PP film and PET film (soft film layer). the thickness of the layer having the lowest Young's modulus that supports the adhesive layer is preferably equal to or less than the thickness of the layer having a relatively higher Young's modulus.
  • Example 4 and Example 5 having a two-layer structure with a base film thickness of 37 ⁇ m are compared, the half-cut property in Example 5 is ⁇ (best), whereas Example In 4, it became ⁇ (good). From this, it can be seen that the thickness of the soft film layer is preferably not more than the thickness of the hard film layer, thereby increasing the rigidity of the base film in the half-cut process and reliably preventing cutting.
  • Example 3 and Comparative Example 6 having a two-layer structure with a base film thickness of 24 ⁇ m are compared, in Example 3, the half-cut property is ⁇ (normal), whereas Comparative Example 6 is. Then, it became x (defect). Therefore, the Young's modulus of the hard film layer having a high Young's modulus should be 6.0 (GPa) or more, and the Young's modulus of the hard film layer having a high Young's modulus and the softest having the lowest Young's modulus that supports the adhesive layer. It can be seen that the difference from the Young's modulus of the film layer is preferably 0.5 (GPa) or more.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Conductive Materials (AREA)

Abstract

La présente invention concerne un film adhésif qui peut être allongé tout en empêchant qu'un film de base ne se rompe à cause d'une coupure en deux. Dans un film adhésif (1), celui-ci comprend un film de base (2) et une couche adhésive (3) qui est supportée sur le film de base (2). Le film de base (2) est stratifié à partir d'une couche (10) ayant un module d'Young relativement élevé et d'une couche (20) ayant un module d'Yound relativement faible.
PCT/JP2014/077039 2013-10-11 2014-10-09 Film adhésif, corps d'enroulement de film, procédé de production pour structure de liaison, procédé de liaison, structure de liaison WO2015053355A1 (fr)

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JP2013-213887 2013-10-11
JP2013213887A JP6431256B2 (ja) 2013-10-11 2013-10-11 接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体

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