WO2015053355A1 - Adhesive film, film wound body, production method for connection structure, connection method, connection structure - Google Patents

Adhesive film, film wound body, production method for connection structure, connection method, connection structure Download PDF

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Publication number
WO2015053355A1
WO2015053355A1 PCT/JP2014/077039 JP2014077039W WO2015053355A1 WO 2015053355 A1 WO2015053355 A1 WO 2015053355A1 JP 2014077039 W JP2014077039 W JP 2014077039W WO 2015053355 A1 WO2015053355 A1 WO 2015053355A1
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Prior art keywords
film
layer
adhesive
modulus
young
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PCT/JP2014/077039
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French (fr)
Japanese (ja)
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雄太 荒木
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デクセリアルズ株式会社
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Publication of WO2015053355A1 publication Critical patent/WO2015053355A1/en

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/022—Mechanical properties
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature

Definitions

  • the present invention relates to an adhesive film in which an adhesive layer is supported on a base film.
  • the adhesive film is wound around a reel and continuously unwound from the reel during actual use, and only the adhesive layer is cut to a predetermined length.
  • the base film relates to an adhesive film continuously wound up, and a connection method using the adhesive film.
  • a mounting method has been used in which electronic components are mounted on a substrate using an adhesive film.
  • COG Chip on Glass
  • an IC chip as a liquid crystal driving circuit is mounted via a conductive adhesive film, various driving circuits, etc., are formed on the periphery of a glass substrate of a liquid crystal display panel (LCD panel)
  • An FOG (Film-on-Glass) mounting for connecting a flexible substrate can be mentioned.
  • the conductive adhesive film 40 is obtained by forming an adhesive layer 43 in which conductive particles 42 are dispersed in a binder resin 41 on a base film 44 that serves as a support.
  • connection terminal of the flexible substrate and the connection terminal of the rigid substrate will be described as an example.
  • both connection terminals 52 and 55 of the flexible substrate 51 and the glass substrate 54 are formed.
  • the conductive adhesive film 40 is disposed between the regions, and is appropriately heat-pressed from above the flexible substrate 51 by the heating and pressing head 56 through the buffer material 50.
  • the binder resin exhibits fluidity, flows out from between the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54, and in the conductive adhesive film 40.
  • the conductive particles 42 are sandwiched between the connection terminals and crushed.
  • connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54 are electrically connected through the conductive particles 42, and the binder resin is cured in this state.
  • the conductive particles 42 that are not between the connection terminals 52 and 55 are dispersed in the binder resin 41 and maintain an electrically insulated state. Thereby, electrical continuity is achieved only between the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54.
  • Such a conductive adhesive film 40 is used, for example, in the form of a film wound body wound around a core of a reel member 45 having a pair of reel flanges as shown in FIG. Reference 1).
  • the base film is made thin, it may be cut to the base film in the half-cut process, making it impossible to carry. That is, the conductive adhesive film supplied as a film winding body wound around the reel is unwound from the reel and drawn to the take-up reel through a plurality of transport rollers in actual use.
  • the conductive adhesive film when a knife cuts into the adhesive layer, only the adhesive layer is cut to a predetermined length, and the base film supporting the adhesive layer is not cut, so-called half cut is performed. Thereafter, the conductive adhesive film is heat-pressed onto the connection object such as a substrate by a temporary crimping tool from above the base film, so that only the adhesive layer cut to a predetermined length is on the connection object.
  • the base film is continuously conveyed and wound on a take-up reel.
  • the base film may be cut in the half-cut process.
  • the knife is cut shallowly to prevent the base film from being cut, the adhesive layer is not cut and there is a risk of poor transfer, so a sufficient depth of cut into the adhesive layer must be secured.
  • an object of the present invention is to provide an adhesive film that can be elongated while preventing the base film from being cut by half-cutting.
  • an adhesive film according to the present invention includes a base film and an adhesive layer supported by the base film.
  • the base film has a relatively high Young's modulus.
  • a layer and a layer having a relatively low Young's modulus are laminated.
  • the film winding body according to the present invention is a film winding body in which an adhesive film having a base film and an adhesive layer supported by the base film is wound on a reel.
  • a layer having a high Young's modulus and a layer having a relatively low Young's modulus are laminated.
  • the manufacturing method of the connection structure which concerns on this invention is a connection object in the manufacturing method of the connection structure using the adhesive film which has a base film and the adhesive bond layer supported by the said base film. It is transported onto an object, a cutter is cut from the adhesive layer side, only the adhesive layer is cut to a predetermined length, the adhesive layer is transferred to the connection object, and the base film is continuous. It is intended to wind up.
  • connection method is a method for connecting a connection object using an adhesive film having a base film and an adhesive layer supported by the base film, and transporting the adhesive film onto the connection object. Then, a cutter is cut from the adhesive layer side, only the adhesive layer is cut to a predetermined length, the adhesive layer is transferred to the connection object, and the base film is continuously wound up. Is.
  • connection structure according to the present invention is manufactured by the above connection method.
  • the base film is prevented from being cut by the layer having a high Young's modulus and a high breaking strength. Therefore, according to this invention, even after an adhesive bond layer peels, a base film can be conveyed continuously.
  • a base film can be made thin and can lengthen, preventing cutting of the base film by a half cut.
  • FIG. 1 is a cross-sectional view showing an adhesive film to which the present invention is applied and a film fitting.
  • FIG. 2 is a front view showing the film mounting body.
  • FIG. 3 is a diagram illustrating a manufacturing process of a connection structure using an adhesive film to which the present invention is applied.
  • FIG. 4 is a perspective view showing a state in which a knife is cut into the adhesive layer.
  • FIG. 5 is a side view showing a state in which the adhesive layer is transferred to the substrate by the temporary crimping tool.
  • FIG. 6 is a perspective view showing a state in which only the base film is continuously conveyed after the adhesive layer is transferred to the substrate.
  • FIG. 7 is a cross-sectional view showing a conventional adhesive film and film fitting.
  • FIG. 8 is a diagram showing a connection process using an adhesive film, where (A) shows a pre-connection process, and (B) shows a thermal pressurization process.
  • An adhesive film 1 to which the present invention is applied has a base film 2 and an adhesive layer 3 supported by the base film 2 as shown in FIG. Moreover, the base film 2 of the adhesive film 1 is formed by laminating a hard film layer 10 having a relatively high Young's modulus and a soft film layer 20 having a relatively low Young's modulus. The adhesive layer 3 is supported by the soft film layer 20.
  • the hard film layer 10 constituting the base film 2 is made of a film having a relatively high Young's modulus as compared with a soft film layer 20 described later, such as PEN (polyethylenenaphthalate, Young's modulus: 6.1 GPa), PI ( A relatively high rigidity material such as polyimide and Young's modulus: 9.1 GPa can be used.
  • PEN polyethylenenaphthalate, Young's modulus: 6.1 GPa
  • PI A relatively high rigidity material such as polyimide and Young's modulus: 9.1 GPa can be used.
  • the soft film layer 20 constituting the base film 2 is made of a film having a Young's modulus lower than that of the hard film layer 10.
  • PP polypropylene, Young's modulus: 1.5 GPa
  • PET polyethylene terephthalate, Young's modulus: 5. 3GPa
  • PP polypropylene, Young's modulus: 1.5 GPa
  • PET polyethylene terephthalate, Young's modulus: 5. 3GPa
  • the base film 2 is integrally molded by joining the hard film layer 10 and the soft film layer 20 with an adhesive or the like. Further, the flexible film layer 20 is provided with the adhesive layer 3.
  • the knife 5 is cut from the soft film layer 20 side and only the adhesive layer 3 is cut to a predetermined length in the half-cut process.
  • the adhesive film 1 even when the soft film layer 20 is cut by the knife 5, the base film 2 is prevented from being cut by the hard film layer 10 having a high Young's modulus and a high breaking strength. Accordingly, the adhesive film 1 can continuously transport the base film 2 even after the adhesive layer 3 is peeled off.
  • the base film 2 can be made thin, and the lengthening can be achieved while preventing the base film 2 from being cut by a half cut. Can be planned.
  • Such a base film 2 can be formed by separately forming the hard film layer 10 and the soft film layer 20 and then laminating them through an adhesive. Moreover, you may form the adhesive film 1 by laminating
  • the thickness of the soft film layer 20 is equal to or less than the thickness of the hard film layer 10.
  • the base film 2 preferably has a thickness equal to or greater than the thickness of the adhesive layer 3 described later. Thereby, in the half-cut process, it becomes easy to adjust the cutting depth of the knife 5, and the cutting edge of the knife 5 does not cut deeply into the hard film layer 10 of the base film 2, thereby reliably preventing cutting.
  • a hard film layer 10 having a Young's modulus higher than that of the soft film layer 20 is laminated on the soft film layer 20 that supports the adhesive layer 3, and in the half-cut process, a knife is applied from the soft film layer 20 side. 5 cuts. That is, the base film 2 has a layer having a high Young's modulus sequentially from the lowest layer to the uppermost layer cut by the knife 5. Thereby, since the layer with a high Young's modulus is sequentially provided in the base film 2 as the knife 5 cuts, the cutting
  • the base film 2 may have a two-layer structure of the hard film layer 10 and the soft film layer 20, or may have a laminated structure of three or more layers. At this time, the base film 2 can effectively prevent cutting by the knife 5 by laminating film layers having high Young's modulus sequentially from the lowest layer to the uppermost layer cut by the knife 5.
  • the upper film laminated on the soft film layer 20 that supports the adhesive layer 3 has a thickness equal to or larger than the thickness of the soft film layer 20. It is preferable to provide.
  • the Young's modulus of the hard film layer 10 is 6.0 (GPa) or more.
  • the base film 2 can effectively prevent cutting with the knife 5 while achieving a reduction in thickness.
  • the Young's modulus of the soft film layer 20 that supports the adhesive layer 3 is preferably less than 6.0 (GPa).
  • the base film 2 has flexibility, winding failure around the reel, protrusion of the adhesive layer 3 during reel winding, Generation
  • the difference between the Young's modulus of the hard film layer 10 and the Young's modulus of the soft film layer 20 that supports the adhesive layer 3 is 0.5 (GPa) or more.
  • the adhesive layer 3 is an insulating adhesive layer made of a binder resin, or a conductive adhesive layer in which spherical or scale-like conductive particles having an average particle size of the order of several ⁇ m are contained in the binder resin.
  • the binder resin contains, for example, a film forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like.
  • the film-forming resin contained in the binder resin is preferably a resin having an average molecular weight of about 10,000 to 80,000.
  • the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.
  • thermosetting resin is not particularly limited, and examples thereof include commercially available epoxy resins and acrylic resins.
  • the epoxy resin is not particularly limited.
  • naphthalene type epoxy resin biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin.
  • an acrylic compound, liquid acrylate, etc. can be selected suitably.
  • what made acrylate the methacrylate can also be selected from methyl acrylate, ethyl acrylate, isopropy
  • the latent curing agent is not particularly limited, but includes a heat curing type curing agent.
  • the latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction.
  • the activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature
  • There are a method of initiating a curing reaction by dissolving and dissolving with a resin a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules.
  • Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof.
  • the above mixture may be sufficient.
  • the radical polymerization initiator a known one can be used, and among them, an organic peroxide can be preferably used.
  • the silane coupling agent is not particularly limited, and examples thereof include an epoxy type, an amino type, a mercapto sulfide type, and a ureido type. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.
  • Examples of the conductive particles contained in the binder resin of the adhesive layer 3 include any known conductive particles used in anisotropic conductive films (ACF). That is, as the conductive particles, for example, particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film.
  • ACF anisotropic conductive films
  • examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.
  • the adhesive film 1 in which the adhesive layer 3 made of a conductive adhesive layer or an insulating adhesive layer is formed on the soft film layer 20 of the base film 2 has been described. It is not limited.
  • the adhesive film 1 may be an anisotropic conductive film in which the adhesive layer 3 is configured by laminating a conductive adhesive layer and an insulating adhesive layer.
  • the adhesive film 1 to which the present invention is applied is wound around a reel member 6 as shown in FIG.
  • the reel member 6 includes a core 7 around which the tape-like adhesive film 1 is wound, and reel flanges 8 provided on both sides of the core 7.
  • the adhesive film 1 forms a film winding body 9 by being wound around the reel member 6.
  • the adhesive film 1 is supplied as this film winding body 9 when used for connection of electronic components.
  • connection process Subsequently, the connection process of the electronic component using the adhesive film 1 is demonstrated. As shown in FIG. 3, the adhesive film 1 is unwound from the reel member 6 and drawn to the take-up reel 31 through a plurality of conveying rollers 30.
  • the adhesive film 1 is subjected to a so-called half cut in which the knife 5 cuts into the adhesive layer 3 before the adhesive layer 3 is transferred to the substrate 32 that is a connection object.
  • the knife 5 is adjusted to a sufficient cutting depth for cutting the adhesive layer 3. Therefore, the knife 5 cuts into the base film 2 of the adhesive film 1.
  • the adhesive film 1 even when the soft film layer 20 is cut by the knife 5, the hard film layer 10 having a high Young's modulus and a high breaking strength is provided at the tip of the adhesive film 1. Only the layer 3 is cut, and the base film 2 can be prevented from being cut.
  • the adhesive film 1 is formed by applying only the adhesive layer 3 cut to a predetermined length by being hot-pressed on the substrate 32 by the provisional pressure bonding tool 33 from above the base film 2.
  • the base film 2 is continuously conveyed and wound around the take-up reel 31 as shown in FIG. 6.
  • the adhesive film 1 has the base film 2 provided with the hard film layer 10 having a high Young's modulus and a high breaking strength, so that the knife 5 is cut and the adhesive layer 3 is peeled off continuously.
  • the base film 2 can be conveyed and taken up on the take-up reel 31.
  • the base film 2 can be made thin, and the lengthening can be achieved while preventing the base film 2 from being cut by a half cut. Can be planned.
  • an adhesive film using a single-layer base film or a base film having a two-layer or three-layer structure having a layer layer having a relatively high Young's modulus and a layer having a low Young's modulus is prepared.
  • the cutability and the winding length around the reel member were compared and evaluated.
  • a reel member having a core diameter of 66 mm and an outer diameter of 145 mm was prepared.
  • UR1400 polyester urethane resin
  • Example 1 In Example 1, a PI film (Upilex-S: manufactured by Ube Industries, Young's modulus 9.1 GPa) having a thickness of 12 ⁇ m as a hard film layer, and a PP film (Treffan 2578: Toray Industries, Inc.) having a thickness of 15 ⁇ m as a soft film layer.
  • a polyurethane-based material in which a curing agent composed of a mixture of xylene diisocyanate (adduct body) and hexamethylene diisocyanate (Hewlett body) is blended with a main component composed of polyester polyol so as to have a solid content ratio of 3: 1.
  • An adhesive was used. The application amount of the adhesive was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
  • the base film according to Example 1 has a two-layer structure of a PI film and a PP film, and has a thickness of 27 ⁇ m. Moreover, the base film which concerns on Example 1 formed the adhesive bond layer (ADH) in PP film by which the peeling process was carried out.
  • ADH adhesive bond layer
  • Example 2 In Example 2, the conditions were the same as in Example 1 except that a PI film having a thickness of 25 ⁇ m was used as the hard film layer.
  • the base film according to Example 2 has a thickness of 40 ⁇ m.
  • Example 3 In Example 3, a 12 ⁇ m thick PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) as a hard film layer, and a 12 ⁇ m thick PET film (PET-01-BU as a soft film layer) : Mitsui Chemicals Tosero Co., Ltd., Young's modulus 5.3 GPa) and a base film laminated by a dry lamination method was used. The amount of adhesive applied was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
  • the base film according to Example 3 has a two-layer structure of a PEN film and a PET film and has a thickness of 24 ⁇ m. Moreover, the base film which concerns on Example 3 formed the adhesive bond layer (ADH) in PET film by which the peeling process was carried out.
  • ADH adhesive bond layer
  • Example 4 In Example 4, the same conditions as in Example 3 were used except that a 25 ⁇ m thick PET film (25 GS: manufactured by Lintec Corporation, Young's modulus 5.3 GPa) was used as the soft film layer.
  • the base film according to Example 4 has a thickness of 37 ⁇ m.
  • Example 5 In Example 5, the same conditions as in Example 3 were used except that a 25 ⁇ m thick PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) was used as the hard film layer.
  • the base film according to Example 5 has a thickness of 37 ⁇ m.
  • Example 6 a three-layer film (manufactured by Mitsubishi Polyester Film GMBH) formed by coextrusion biaxial stretching of PEN resin and PET resin was used as the base film.
  • the base film according to Example 6 includes a PEN layer (thickness: 1 ⁇ m, Young's modulus 6.1 GPa), a mixed layer of PEN and PET (thickness: 10 ⁇ m, Young's modulus 5.7 GPa), and a PET layer (thickness). 1 ⁇ m and Young's modulus 5.3 GPa) are laminated in this order.
  • the base film according to Example 6 had a thickness of 12 ⁇ m, and an adhesive layer (ADH) was formed on the peeled PET film.
  • Comparative Example 1 In Comparative Example 1, a PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) having a thickness of 12 ⁇ m was used as the base film. In Comparative Example 1, the base film was peeled and an adhesive layer (ADH) was laminated.
  • a PEN film Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa
  • ADH adhesive layer
  • Comparative Example 2 In Comparative Example 2, a PET film having a thickness of 25 ⁇ m (25 GS: manufactured by Lintec Corporation, Young's modulus 5.3 GPa) was used as the base film. In Comparative Example 2, the base film was peeled and an adhesive layer (ADH) was laminated.
  • ADH adhesive layer
  • Comparative Example 3 In Comparative Example 3, the conditions were the same as in Comparative Example 2 except that a PET film having a thickness of 38 ⁇ m was used as the base film.
  • Comparative Example 4 In Comparative Example 4, the conditions were the same as in Comparative Example 2 except that a 75 ⁇ m thick PET film was used as the base film.
  • Comparative Example 5 In Comparative Example 5, the same conditions as in Comparative Example 2 were used except that a PET film having a thickness of 100 ⁇ m was used as the base film.
  • Comparative Example 6 a base film in which two PET films having a thickness of 12 ⁇ m (PET-01-BU: manufactured by Mitsui Chemicals, Inc., Young's modulus 5.3 GPa) were laminated by a dry lamination method was used. The application amount of the adhesive was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
  • PET-01-BU manufactured by Mitsui Chemicals, Inc., Young's modulus 5.3 GPa
  • the base film according to Comparative Example 6 is a two-layer structure of two PET films and has a thickness of 24 ⁇ m. Moreover, the base film which concerns on the comparative example 6 gave the peeling process to one PET film, and formed the adhesive bond layer (ADH).
  • winding length around the reel member was evaluated as ⁇ (good) when it was 200 m or more, and x (defective) when it was less than 200 m.
  • the adhesive films using the base films according to Examples 1 to 6 have a thickness of 12 to 12 because a film having a high Young's modulus is laminated on the film supporting the adhesive layer. Despite being as thin as 40 ⁇ m, the half-cut property showed an ordinary performance, and there was no problem in actual use.
  • the adhesive films using the base films according to Examples 1 to 6 had a thin base film thickness of 12 to 40 ⁇ m, and therefore the winding length around the reel member was 200 m or more.
  • the comparative example 1 uses the base film which consists only of a PEN film with a comparatively high Young's modulus, since thickness is as thin as 12 micrometers, winding length was as favorable as 409m, but half cut Inferior to sex.
  • Comparative Examples 2 and 3 use a base film made of only a PET film having a relatively low Young's modulus, if the thickness is reduced to 25 ⁇ m or 38 ⁇ m, the half-cut property is inferior.
  • Comparative Examples 4 and 5 half-cutting properties can be improved by increasing the thickness to 25 ⁇ m and 38 ⁇ m using a base film made of only a PET film, but the thickness of the base film is increased. The winding length was shortened.
  • Comparative Example 6 a base film laminated with a PET film having a relatively low Young's modulus is used, but since a film having a high Young's modulus is not used, attempting to reduce the thickness results in inferior half-cut properties. It was.
  • the PI film and PEN film (hard film layer) having a high Young's modulus had a low Young's modulus
  • the PP film and PET film (soft film layer). the thickness of the layer having the lowest Young's modulus that supports the adhesive layer is preferably equal to or less than the thickness of the layer having a relatively higher Young's modulus.
  • Example 4 and Example 5 having a two-layer structure with a base film thickness of 37 ⁇ m are compared, the half-cut property in Example 5 is ⁇ (best), whereas Example In 4, it became ⁇ (good). From this, it can be seen that the thickness of the soft film layer is preferably not more than the thickness of the hard film layer, thereby increasing the rigidity of the base film in the half-cut process and reliably preventing cutting.
  • Example 3 and Comparative Example 6 having a two-layer structure with a base film thickness of 24 ⁇ m are compared, in Example 3, the half-cut property is ⁇ (normal), whereas Comparative Example 6 is. Then, it became x (defect). Therefore, the Young's modulus of the hard film layer having a high Young's modulus should be 6.0 (GPa) or more, and the Young's modulus of the hard film layer having a high Young's modulus and the softest having the lowest Young's modulus that supports the adhesive layer. It can be seen that the difference from the Young's modulus of the film layer is preferably 0.5 (GPa) or more.

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)

Abstract

Provided is an adhesive film that can be increased in length while preventing a base film from severing because of half-cutting. In an adhesive film (1) that has a base film (2) and an adhesive layer (3) that is supported upon the base film (2). The base film (2) is laminated from a layer (10) that has a relatively high Young's modulus and a layer (20) that has a relatively low Young's modulus.

Description

接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体Adhesive film, film winding body, connection structure manufacturing method, connection method, connection structure
　本発明は、ベースフィルムに接着剤層が支持された接着フィルムに関し、特にリールに巻回され、実使用時にはリールより連続して巻き出され、接着剤層のみが所定の長さに切断されるとともにベースフィルムは連続的に巻き取られる接着フィルム、及びこの接着フィルムを用いた接続方法に関する。本出願は、日本国において２０１３年１０月１１日に出願された日本特許出願番号特願２０１３－２１３８８７を基礎として優先権を主張するものであり、この出願は参照されることにより、本出願に援用される。 The present invention relates to an adhesive film in which an adhesive layer is supported on a base film. In particular, the adhesive film is wound around a reel and continuously unwound from the reel during actual use, and only the adhesive layer is cut to a predetermined length. In addition, the base film relates to an adhesive film continuously wound up, and a connection method using the adhesive film. This application claims priority on the basis of Japanese Patent Application No. 2013-21387 filed on Oct. 11, 2013 in Japan. This application is incorporated herein by reference. Incorporated.
　従来から、基板に接着フィルムを用いて電子部品を実装する実装法が用いられている。例えば、液晶表示パネル（ＬＣＤパネル）のガラス基板周縁部に導電性の接着フィルムを介して液晶駆動回路であるＩＣチップを実装するＣＯＧ（Chip on Glass）実装や、各種駆動回路等が形成されたフレキシブル基板を接続するＦＯＧ（Film on Glass）実装が挙げられる。図７に示すように、導電性の接着フィルム４０は、バインダー樹脂４１に導電性粒子４２が分散された接着剤層４３が、支持体となるベースフィルム４４上に形成されたものである。 Conventionally, a mounting method has been used in which electronic components are mounted on a substrate using an adhesive film. For example, COG (Chip on Glass) mounting, in which an IC chip as a liquid crystal driving circuit is mounted via a conductive adhesive film, various driving circuits, etc., are formed on the periphery of a glass substrate of a liquid crystal display panel (LCD panel) An FOG (Film-on-Glass) mounting for connecting a flexible substrate can be mentioned. As shown in FIG. 7, the conductive adhesive film 40 is obtained by forming an adhesive layer 43 in which conductive particles 42 are dispersed in a binder resin 41 on a base film 44 that serves as a support.
　フレキシブル基板の接続端子とリジッド基板の接続端子とを接続する場合を例に説明すると、図８（Ａ）に示すように、フレキシブル基板５１とガラス基板５４の両接続端子５２，５５が形成された領域の間に導電性接着フィルム４０を配置し、適宜、緩衝材５０を介して加熱押圧ヘッド５６によってフレキシブル基板５１の上から熱加圧する。すると、図８（Ｂ）に示すように、バインダー樹脂は流動性を示し、フレキシブル基板５１の接続端子５２とガラス基板５４の接続端子５５との間から流出するとともに、導電性接着フィルム４０中の導電性粒子４２は、両接続端子間に挟持されて押し潰される。 The case of connecting the connection terminal of the flexible substrate and the connection terminal of the rigid substrate will be described as an example. As shown in FIG. 8A, both connection terminals 52 and 55 of the flexible substrate 51 and the glass substrate 54 are formed. The conductive adhesive film 40 is disposed between the regions, and is appropriately heat-pressed from above the flexible substrate 51 by the heating and pressing head 56 through the buffer material 50. Then, as shown in FIG. 8B, the binder resin exhibits fluidity, flows out from between the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54, and in the conductive adhesive film 40. The conductive particles 42 are sandwiched between the connection terminals and crushed.
　その結果、フレキシブル基板５１の接続端子５２とガラス基板５４の接続端子５５とは、導電性粒子４２を介して電気的に接続され、この状態でバインダー樹脂が硬化する。両接続端子５２，５５の間にない導電性粒子４２は、バインダー樹脂４１に分散されており、電気的に絶縁した状態を維持している。これにより、フレキシブル基板５１の接続端子５２とガラス基板５４の接続端子５５との間のみで電気的導通が図られることになる。 As a result, the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54 are electrically connected through the conductive particles 42, and the binder resin is cured in this state. The conductive particles 42 that are not between the connection terminals 52 and 55 are dispersed in the binder resin 41 and maintain an electrically insulated state. Thereby, electrical continuity is achieved only between the connection terminal 52 of the flexible substrate 51 and the connection terminal 55 of the glass substrate 54.
　このような導電性接着フィルム４０は、例えば、図７に示すように、一対のリールフランジを有するリール部材４５の巻芯に巻回されたフィルム巻装体の形状で使用される（例えば、特許文献１を参照）。 Such a conductive adhesive film 40 is used, for example, in the form of a film wound body wound around a core of a reel member 45 having a pair of reel flanges as shown in FIG. Reference 1).
　ところで、導電性接着フィルム４０のリール交換を行うためには、いったんラインを停止し、導電性接着フィルム４０を搬送ローラに引き回す等繁雑な作業を要し、ＦＯＧ実装等の工程において大きなタイムロスとなっている。このため、導電性接着フィルム４０のリール交換作業の簡素化や交換回数の低減のための方策が種々試みられている。なかでも、導電性接着フィルム４０の長尺化がリール交換の回数低減に効果的である。 By the way, in order to replace the reel of the conductive adhesive film 40, a complicated operation such as stopping the line and drawing the conductive adhesive film 40 to the transport roller is required, which causes a large time loss in processes such as FOG mounting. ing. For this reason, various measures for simplifying the reel replacement work of the conductive adhesive film 40 and reducing the number of replacements have been attempted. Especially, the lengthening of the conductive adhesive film 40 is effective for reducing the number of reel replacements.
特開２００６－１１６７１８号公報JP 2006-116718 A
　しかし、導電性接着フィルムを長尺化すると、リールに巻回された際のフィルム巻装体の径が大きくなり、装置へのセットが煩雑となるなど、取扱いが困難となる。そこで、ベースフィルムの薄型化による長尺化も検討されている。 However, if the length of the conductive adhesive film is increased, the diameter of the film winding body when wound on a reel increases, and the handling of the apparatus becomes difficult, for example, the setting on the apparatus becomes complicated. Then, lengthening by making a base film thin is also examined.
　しかし、ベースフィルムを薄くすると、ハーフカット工程において、ベースフィルムまで切断され、搬送不能となる恐れがある。すなわち、リールに巻回されたフィルム巻装体として供給される導電性接着フィルムは、実使用時においては、リールより巻き出され複数の搬送ローラを介して巻取リールまで引き回される。 However, if the base film is made thin, it may be cut to the base film in the half-cut process, making it impossible to carry. That is, the conductive adhesive film supplied as a film winding body wound around the reel is unwound from the reel and drawn to the take-up reel through a plurality of transport rollers in actual use.
　導電性接着フィルムは、接着剤層にナイフが切り込むことにより、接着剤層のみが所定の長さにカットされ、接着剤層を支持するベースフィルムは切断されない、いわゆるハーフカットが行われる。その後、導電性接着フィルムは、ベースフィルムの上から仮圧着ツールによって基板等の接続対象物上に熱加圧されることにより、所定の長さにカットされた接着剤層のみが接続対象物上に転着され、ベースフィルムは、引き続き搬送されて巻取リールに巻き取られていく。 In the conductive adhesive film, when a knife cuts into the adhesive layer, only the adhesive layer is cut to a predetermined length, and the base film supporting the adhesive layer is not cut, so-called half cut is performed. Thereafter, the conductive adhesive film is heat-pressed onto the connection object such as a substrate by a temporary crimping tool from above the base film, so that only the adhesive layer cut to a predetermined length is on the connection object. The base film is continuously conveyed and wound on a take-up reel.
　しかし、上述したように導電性接着フィルムの長尺化を図るためにベースフィルムを薄くすると、ハーフカット工程においてベースフィルムまで切断されてしまう恐れがある。また、ベースフィルムの切断を防ぐためにナイフの切り込みを浅くすると、接着剤層が切断されず、転着不良を起こす危険もあるため、接着剤層への切り込み深さは十分確保する必要がある。 However, as described above, if the base film is thinned in order to increase the length of the conductive adhesive film, the base film may be cut in the half-cut process. In addition, if the knife is cut shallowly to prevent the base film from being cut, the adhesive layer is not cut and there is a risk of poor transfer, so a sufficient depth of cut into the adhesive layer must be secured.
　そこで、本発明は、ハーフカットによるベースフィルムの切断を防止しつつ、長尺化を図ることができる接着フィルムを提供することを目的とする。 Therefore, an object of the present invention is to provide an adhesive film that can be elongated while preventing the base film from being cut by half-cutting.
　上述した課題を解決するために、本発明に係る接着フィルムは、ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムにおいて、上記ベースフィルムは、相対的にヤング率が高い層と、相対的にヤング率が低い層が積層されているものである。 In order to solve the above-described problems, an adhesive film according to the present invention includes a base film and an adhesive layer supported by the base film. The base film has a relatively high Young's modulus. A layer and a layer having a relatively low Young's modulus are laminated.
　また、本発明に係るフィルム巻装体は、ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムがリールに巻回されたフィルム巻装体において、上記ベースフィルムは、相対的にヤング率が高い層と、相対的にヤング率が低い層が積層されているものである。 Moreover, the film winding body according to the present invention is a film winding body in which an adhesive film having a base film and an adhesive layer supported by the base film is wound on a reel. In particular, a layer having a high Young's modulus and a layer having a relatively low Young's modulus are laminated.
　また、本発明に係る接続構造体の製造方法は、ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムを用いた接続構造体の製造方法において、上記接着フィルムを接続対象物上に搬送し、上記接着剤層側からカッターを切り込み、上記接着剤層のみを所定の長さに切断し、上記接着剤層を上記接続対象物に転着するとともに、上記ベースフィルムを連続的に巻き取るものである。 Moreover, the manufacturing method of the connection structure which concerns on this invention is a connection object in the manufacturing method of the connection structure using the adhesive film which has a base film and the adhesive bond layer supported by the said base film. It is transported onto an object, a cutter is cut from the adhesive layer side, only the adhesive layer is cut to a predetermined length, the adhesive layer is transferred to the connection object, and the base film is continuous. It is intended to wind up.
　また、本発明に係る接続方法は、ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムを用いて接続対象物の接続方法において、上記接着フィルムを接続対象物上に搬送し、上記接着剤層側からカッターを切り込み、上記接着剤層のみを所定の長さに切断し、上記接着剤層を上記接続対象物に転着するとともに、上記ベースフィルムを連続的に巻き取るものである。 Further, the connection method according to the present invention is a method for connecting a connection object using an adhesive film having a base film and an adhesive layer supported by the base film, and transporting the adhesive film onto the connection object. Then, a cutter is cut from the adhesive layer side, only the adhesive layer is cut to a predetermined length, the adhesive layer is transferred to the connection object, and the base film is continuously wound up. Is.
　また、本発明に係る接続構造体は、上記接続方法により製造されたものである。 The connection structure according to the present invention is manufactured by the above connection method.
　本発明によれば、相対的にヤング率の低い層がナイフによって切り込まれた場合にも、ヤング率が高く破断強度の大きい層によって、ベースフィルムの切断が防止される。したがって、本発明によれば、接着剤層が剥離した後も、連続してベースフィルムを搬送することができる。 According to the present invention, even when a layer having a relatively low Young's modulus is cut by a knife, the base film is prevented from being cut by the layer having a high Young's modulus and a high breaking strength. Therefore, according to this invention, even after an adhesive bond layer peels, a base film can be conveyed continuously.
　そして、本発明によれば、ヤング率の高い層を備えることにより、ベースフィルムを薄型にすることができ、ハーフカットによるベースフィルムの切断を防止しつつ、長尺化を図ることができる。 And according to this invention, by providing a layer with a high Young's modulus, a base film can be made thin and can lengthen, preventing cutting of the base film by a half cut.
図１は、本発明が適用された接着フィルム、及びフィルム卷装体を示す断面図である。FIG. 1 is a cross-sectional view showing an adhesive film to which the present invention is applied and a film fitting. 図２は、フィルム卷装体を示す正面図である。FIG. 2 is a front view showing the film mounting body. 図３は、本発明が適用された接着フィルムを用いた接続構造体の製造工程を示す図である。FIG. 3 is a diagram illustrating a manufacturing process of a connection structure using an adhesive film to which the present invention is applied. 図４は、接着剤層にナイフを切り込む状態を示す斜視図である。FIG. 4 is a perspective view showing a state in which a knife is cut into the adhesive layer. 図５は、仮圧着ツールによって接着剤層を基板に転着する状態を示す側面図である。FIG. 5 is a side view showing a state in which the adhesive layer is transferred to the substrate by the temporary crimping tool. 図６は、接着剤層を基板に転着した後、ベースフィルムのみを連続的に搬送する状態を示す斜視図である。FIG. 6 is a perspective view showing a state in which only the base film is continuously conveyed after the adhesive layer is transferred to the substrate. 図７は、従来の接着フィルム及びフィルム卷装体を示す断面図である。FIG. 7 is a cross-sectional view showing a conventional adhesive film and film fitting. 図８は、接着フィルムを用いた接続工程を示す図であり、（Ａ）は接続前、（Ｂ）は熱加圧工程を示す。FIG. 8 is a diagram showing a connection process using an adhesive film, where (A) shows a pre-connection process, and (B) shows a thermal pressurization process.
　以下、本発明が適用された接着フィルム、フィルム巻装体、接続構造体の製造方法、接続方法、接続構造体について、図面を参照しながら詳細に説明する。なお、本発明は、以下の実施形態のみに限定されるものではなく、本発明の要旨を逸脱しない範囲内において種々の変更が可能であることは勿論である。また、図面は模式的なものであり、各寸法の比率等は現実のものとは異なることがある。具体的な寸法等は以下の説明を参酌して判断すべきものである。また、図面相互間においても互いの寸法の関係や比率が異なる部分が含まれていることは勿論である。 Hereinafter, an adhesive film, a film winding body, a connection structure manufacturing method, a connection method, and a connection structure to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.
　［接着フィルム］
　本発明が適用された接着フィルム１は、図１に示すように、ベースフィルム２と、ベースフィルム２に支持された接着剤層３とを有する。また、接着フィルム１のベースフィルム２は、相対的にヤング率が高い硬質フィルム層１０と、相対的にヤング率が低い軟質フィルム層２０が積層されている。接着剤層３は、軟質フィルム層２０に支持されている。 [Adhesive film]
An adhesive film 1 to which the present invention is applied has a base film 2 and an adhesive layer 3 supported by the base film 2 as shown in FIG. Moreover, the base film 2 of the adhesive film 1 is formed by laminating a hard film layer 10 having a relatively high Young's modulus and a soft film layer 20 having a relatively low Young's modulus. The adhesive layer 3 is supported by the soft film layer 20.
　ベースフィルム２を構成する硬質フィルム層１０は、後述する軟質フィルム層２０に比してヤング率が相対的に高いフィルムからなり、例えばＰＥＮ（polyethylene naphthalate、ヤング率：６．１ＧＰａ）や、ＰＩ（polyimide、ヤング率：９．１ＧＰａ）等の比較的高剛性の材料を用いることができる。 The hard film layer 10 constituting the base film 2 is made of a film having a relatively high Young's modulus as compared with a soft film layer 20 described later, such as PEN (polyethylenenaphthalate, Young's modulus: 6.1 GPa), PI ( A relatively high rigidity material such as polyimide and Young's modulus: 9.1 GPa can be used.
　ベースフィルム２を構成する軟質フィルム層２０は、硬質フィルム層１０よりもヤング率の低いフィルムからなり、例えばＰＰ（polypropylene、ヤング率：１．５ＧＰａ）や、ＰＥＴ（polyethylene terephthalate、ヤング率：５．３ＧＰａ）等の比較的低剛性の材料を用いることができる。 The soft film layer 20 constituting the base film 2 is made of a film having a Young's modulus lower than that of the hard film layer 10. For example, PP (polypropylene, Young's modulus: 1.5 GPa) or PET (polyethylene terephthalate, Young's modulus: 5. 3GPa) or the like can be used.
　ベースフィルム２は、これら硬質フィルム層１０と軟質フィルム層２０とが接着剤により接合される等により一体に成型されている。また、軟質フィルム層２０は、接着剤層３が設けられる。 The base film 2 is integrally molded by joining the hard film layer 10 and the soft film layer 20 with an adhesive or the like. Further, the flexible film layer 20 is provided with the adhesive layer 3.
　接着フィルム１は、実使用時においては、ハーフカット工程において、軟質フィルム層２０側からナイフ５が切り込み、接着剤層３のみが所定の長さに切断される。このとき、接着フィルム１によれば、軟質フィルム層２０がナイフ５によって切り込まれた場合にも、ヤング率が高く破断強度の大きい硬質フィルム層１０によって、ベースフィルム２の切断が防止される。したがって、接着フィルム１は、接着剤層３が剥離した後も、連続してベースフィルム２を搬送することができる。 When the adhesive film 1 is actually used, the knife 5 is cut from the soft film layer 20 side and only the adhesive layer 3 is cut to a predetermined length in the half-cut process. At this time, according to the adhesive film 1, even when the soft film layer 20 is cut by the knife 5, the base film 2 is prevented from being cut by the hard film layer 10 having a high Young's modulus and a high breaking strength. Accordingly, the adhesive film 1 can continuously transport the base film 2 even after the adhesive layer 3 is peeled off.
　そして、接着フィルム１によれば、ヤング率の高い硬質フィルム層１０を備えることにより、ベースフィルム２を薄型にすることができ、ハーフカットによるベースフィルム２の切断を防止しつつ、長尺化を図ることができる。 And according to the adhesive film 1, by providing the hard film layer 10 with a high Young's modulus, the base film 2 can be made thin, and the lengthening can be achieved while preventing the base film 2 from being cut by a half cut. Can be planned.
　このようなベースフィルム２は、硬質フィルム層１０と軟質フィルム層２０を、別個に形成した後、接着剤を介してラミネートすることにより形成することができる。また、接着フィルム１は、硬質フィルム層１０と軟質フィルム層２０の各原料となる樹脂を、Ｔダイによる共押出しにより積層することにより形成してもよい。 Such a base film 2 can be formed by separately forming the hard film layer 10 and the soft film layer 20 and then laminating them through an adhesive. Moreover, you may form the adhesive film 1 by laminating | stacking resin used as each raw material of the hard film layer 10 and the soft film layer 20 by co-extrusion by T-die.
　ここで、ベースフィルム２は、軟質フィルム層２０の厚さが、硬質フィルム層１０の厚さ以下とすることが好ましい。硬質フィルム層１０の厚さを軟質フィルム層２０の厚さ以上とすることで、ハーフカット工程におけるベースフィルム２の剛性を高め、確実に切断を防止することができる。 Here, in the base film 2, it is preferable that the thickness of the soft film layer 20 is equal to or less than the thickness of the hard film layer 10. By setting the thickness of the hard film layer 10 to be equal to or greater than the thickness of the soft film layer 20, it is possible to increase the rigidity of the base film 2 in the half-cut process and reliably prevent cutting.
　また、ベースフィルム２は、後述する接着剤層３の厚さ以上の厚さを備えることが好ましい。これにより、ハーフカット工程において、ナイフ５の切り込み深さの調整が容易となり、ナイフ５の刃先がベースフィルム２の硬質フィルム層１０まで深く切り込むことがなく、確実に切断を防止することができる。 The base film 2 preferably has a thickness equal to or greater than the thickness of the adhesive layer 3 described later. Thereby, in the half-cut process, it becomes easy to adjust the cutting depth of the knife 5, and the cutting edge of the knife 5 does not cut deeply into the hard film layer 10 of the base film 2, thereby reliably preventing cutting.
　ベースフィルム２は、接着剤層３を支持する軟質フィルム層２０の上に、軟質フィルム層２０よりもヤング率の高い硬質フィルム層１０が積層され、ハーフカット工程において、軟質フィルム層２０側からナイフ５が切り込む。すなわち、ベースフィルム２は、ナイフ５が切り込む最下層から最上層にかけて、順次ヤング率の高い層が積層されている。これにより、ベースフィルム２は、ナイフ５が切り込むにつれて、順次ヤング率が高い層が設けられるため、ナイフ５による切断を防止することができる。 In the base film 2, a hard film layer 10 having a Young's modulus higher than that of the soft film layer 20 is laminated on the soft film layer 20 that supports the adhesive layer 3, and in the half-cut process, a knife is applied from the soft film layer 20 side. 5 cuts. That is, the base film 2 has a layer having a high Young's modulus sequentially from the lowest layer to the uppermost layer cut by the knife 5. Thereby, since the layer with a high Young's modulus is sequentially provided in the base film 2 as the knife 5 cuts, the cutting | disconnection by the knife 5 can be prevented.
　また、ベースフィルム２は、硬質フィルム層１０と軟質フィルム層２０の２層構造とする他、３層以上の積層構造としてもよい。このとき、ベースフィルム２は、ナイフ５が切り込む最下層から最上層にかけて、順次ヤング率の高いフィルム層を積層することにより、ナイフ５による切断を効果的に防止することができる。 In addition, the base film 2 may have a two-layer structure of the hard film layer 10 and the soft film layer 20, or may have a laminated structure of three or more layers. At this time, the base film 2 can effectively prevent cutting by the knife 5 by laminating film layers having high Young's modulus sequentially from the lowest layer to the uppermost layer cut by the knife 5.
　なお、ベースフィルム２は、３層以上の積層構造とする場合においても、接着剤層３を支持する軟質フィルム層２０に積層される上層フィルムは、軟質フィルム層２０の厚さ以上の厚さを備えることが好ましい。 Even when the base film 2 has a laminated structure of three or more layers, the upper film laminated on the soft film layer 20 that supports the adhesive layer 3 has a thickness equal to or larger than the thickness of the soft film layer 20. It is preferable to provide.
　［ヤング率］
　また、ベースフィルム２は、硬質フィルム層１０のヤング率が、６．０（ＧＰａ）以上であることが好ましい。ヤング率６．０（ＧＰａ）以上の硬質フィルム層１０を備えることにより、ベースフィルム２は、薄型化を図りつつ、ナイフ５による切断を効果的に防止することができる。 [Young's modulus]
Moreover, as for the base film 2, it is preferable that the Young's modulus of the hard film layer 10 is 6.0 (GPa) or more. By providing the hard film layer 10 having a Young's modulus of 6.0 (GPa) or more, the base film 2 can effectively prevent cutting with the knife 5 while achieving a reduction in thickness.
　また、ベースフィルム２は、接着剤層３を支持する軟質フィルム層２０のヤング率が、６．０（ＧＰａ）未満であることが好ましい。ヤング率６．０（ＧＰａ）未満の軟質フィルム層２０を備えることにより、ベースフィルム２は、柔軟性を備え、リールへの巻回不良や、リール巻回時における接着剤層３のはみ出しや、はみ出した接着剤層３がリールフランジに付着し巻出しを阻害するブロッキングの発生を防止することができる。 Further, in the base film 2, the Young's modulus of the soft film layer 20 that supports the adhesive layer 3 is preferably less than 6.0 (GPa). By providing the soft film layer 20 having a Young's modulus of less than 6.0 (GPa), the base film 2 has flexibility, winding failure around the reel, protrusion of the adhesive layer 3 during reel winding, Generation | occurrence | production of the blocking which the adhesive layer 3 which protruded adheres to a reel flange, and inhibits unwinding can be prevented.
　さらに、ベースフィルム２は、硬質フィルム層１０のヤング率と、接着剤層３を支持する軟質フィルム層２０のヤング率との差が０．５（ＧＰａ）以上であることが好ましい。これにより、ナイフ５が軟質フィルム層２０に切り込んでいった場合にも、その先に、よりヤング率の高い硬質フィルム層１０が控えていることにより、硬質フィルム層１０においてこれ以上の切り込みを防止し、ベースフィルム２の切断を防止することができる。 Furthermore, in the base film 2, it is preferable that the difference between the Young's modulus of the hard film layer 10 and the Young's modulus of the soft film layer 20 that supports the adhesive layer 3 is 0.5 (GPa) or more. Thereby, even when the knife 5 cuts into the soft film layer 20, the hard film layer 10 with a higher Young's modulus is kept ahead, thereby preventing further cuts in the hard film layer 10. In addition, the base film 2 can be prevented from being cut.
　［接着剤層］
　ここで、軟質フィルム層２０に支持される接着剤層３について説明する。接着剤層３は、バインダー樹脂からなる絶縁性接着剤層、あるいはバインダー樹脂に平均粒径が数μｍオーダーの球状又は鱗片状の導電性粒子が含有された導電性接着剤層である。 [Adhesive layer]
Here, the adhesive layer 3 supported by the soft film layer 20 will be described. The adhesive layer 3 is an insulating adhesive layer made of a binder resin, or a conductive adhesive layer in which spherical or scale-like conductive particles having an average particle size of the order of several μm are contained in the binder resin.
　［バインダー樹脂］
　バインダー樹脂は、例えば、膜形成樹脂、熱硬化性樹脂、潜在性硬化剤、シランカップリング剤等を含有する。バインダー樹脂に含有される膜形成樹脂としては、平均分子量が１００００～８００００程度の樹脂が好ましい。膜形成樹脂としては、エポキシ樹脂、変形エポキシ樹脂、ウレタン樹脂、フェノキシ樹脂等の各種の樹脂が挙げられる。中でも、膜形成状態、接続信頼性等の観点からフェノキシ樹脂が特に好ましい。 [Binder resin]
The binder resin contains, for example, a film forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like. The film-forming resin contained in the binder resin is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.
　熱硬化性樹脂としては、特に限定されず、例えば、市販のエポキシ樹脂、アクリル樹脂等が挙げられる。 The thermosetting resin is not particularly limited, and examples thereof include commercially available epoxy resins and acrylic resins.
　エポキシ樹脂としては、特に限定されないが、例えば、ナフタレン型エポキシ樹脂、ビフェニル型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、ビスフェノール型エポキシ樹脂、スチルベン型エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、フェノールアラルキル型エポキシ樹脂、ナフトール型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、トリフェニルメタン型エポキシ樹脂等が挙げられる。これらは単独でも、２種以上の組み合わせであってもよい。 The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.
　アクリル樹脂としては、特に制限はなく、目的に応じてアクリル化合物、液状アクリレート等を適宜選択することができる。例えば、メチルアクリレート、エチルアクリレート、イソプロピルアクリレート、イソブチルアクリレート、エポキシアクリレート、エチレングリコールジアクリレート、ジエチレングリコールジアクリレート、トリメチロールプロパントリアクリレート、ジメチロールトリシクロデカンジアクリレート、テトラメチレングリコールテトラアクリレート、２－ヒドロキシ－１，３－ジアクリロキシプロパン、２，２－ビス[４－（アクリロキシメトキシ）フェニル]プロパン、２，２－ビス[４－（アクリロキシエトキシ）フェニル]プロパン、ジシクロペンテニルアクリレート、トリシクロデカニルアクリレート、トリス（アクリロキシエチル）イソシアヌレート、ウレタンアクリレート、エポキシアクリレート等を挙げることができる。なお、アクリレートをメタクリレートにしたものを用いることもできる。これらは、１種単独で使用してもよいし、２種以上を併用してもよい。 There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.
　潜在性硬化剤としては、特に限定されないが、加熱硬化型の硬化剤が挙げられる。潜在性硬化剤は、通常では反応せず、熱、光、加圧等の用途に応じて選択される各種のトリガにより活性化し、反応を開始する。熱活性型潜在性硬化剤の活性化方法には、加熱による解離反応などで活性種（カチオンやアニオン、ラジカル）を生成する方法、室温付近ではエポキシ樹脂中に安定に分散しており高温でエポキシ樹脂と相溶・溶解し、硬化反応を開始する方法、モレキュラーシーブ封入タイプの硬化剤を高温で溶出して硬化反応を開始する方法、マイクロカプセルによる溶出・硬化方法等が存在する。熱活性型潜在性硬化剤としては、イミダゾール系、ヒドラジド系、三フッ化ホウ素－アミン錯体、スルホニウム塩、アミンイミド、ポリアミン塩、ジシアンジアミド等や、これらの変性物があり、これらは単独でも、２種以上の混合体であってもよい。ラジカル重合開始剤としては、公知のものを使用することができ、中でも有機過酸化物を好ましく使用することができる。 The latent curing agent is not particularly limited, but includes a heat curing type curing agent. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature There are a method of initiating a curing reaction by dissolving and dissolving with a resin, a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. As the radical polymerization initiator, a known one can be used, and among them, an organic peroxide can be preferably used.
　シランカップリング剤としては、特に限定されないが、例えば、エポキシ系、アミノ系、メルカプト・スルフィド系、ウレイド系等を挙げることができる。シランカップリング剤を添加することにより、有機材料と無機材料との界面における接着性が向上される。 The silane coupling agent is not particularly limited, and examples thereof include an epoxy type, an amino type, a mercapto sulfide type, and a ureido type. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.
　［導電性粒子］
　接着剤層３のバインダー樹脂に含有される導電性粒子としては、異方性導電フィルム（ＡＣＦ：Anisotropic Conductive Film）において使用されている公知の何れの導電性粒子を挙げることができる。すなわち、導電性粒子としては、例えば、ニッケル、鉄、銅、アルミニウム、錫、鉛、クロム、コバルト、銀、金等の各種金属や金属合金の粒子、金属酸化物、カーボン、グラファイト、ガラス、セラミック、プラスチック等の粒子の表面に金属をコートしたもの、或いは、これらの粒子の表面に更に絶縁薄膜をコートしたもの等が挙げられる。樹脂粒子の表面に金属をコートしたものである場合、樹脂粒子としては、例えば、エポキシ樹脂、フェノール樹脂、アクリル樹脂、アクリロニトリル・スチレン（ＡＳ）樹脂、ベンゾグアナミン樹脂、ジビニルベンゼン系樹脂、スチレン系樹脂等の粒子を挙げることができる。 [Conductive particles]
Examples of the conductive particles contained in the binder resin of the adhesive layer 3 include any known conductive particles used in anisotropic conductive films (ACF). That is, as the conductive particles, for example, particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.
　なお、上述した説明では、ベースフィルム２の軟質フィルム層２０上に導電性接着剤層又は絶縁性接着剤層からなる接着剤層３が形成されてなる接着フィルム１について説明したが、この例に限定されるものではない。例えば、接着フィルム１は、接着剤層３が導電性接着剤層と絶縁性接着剤層とが積層されて構成された異方性導電フィルムとしてもよい。 In the above description, the adhesive film 1 in which the adhesive layer 3 made of a conductive adhesive layer or an insulating adhesive layer is formed on the soft film layer 20 of the base film 2 has been described. It is not limited. For example, the adhesive film 1 may be an anisotropic conductive film in which the adhesive layer 3 is configured by laminating a conductive adhesive layer and an insulating adhesive layer.
　［フィルム巻装体］
　本発明が適用された接着フィルム１は、図２に示すように、リール部材６に巻回される。リール部材６は、テープ状の接着フィルム１が巻回される巻芯７と、巻芯７の両側に設けられたリールフランジ８とを備える。接着フィルム１は、リール部材６に巻回されることにより、フィルム巻装体９を形成する。接着フィルム１は、電子部品の接続に用いられる場合、このフィルム巻装体９として供給される。 [Film roll]
The adhesive film 1 to which the present invention is applied is wound around a reel member 6 as shown in FIG. The reel member 6 includes a core 7 around which the tape-like adhesive film 1 is wound, and reel flanges 8 provided on both sides of the core 7. The adhesive film 1 forms a film winding body 9 by being wound around the reel member 6. The adhesive film 1 is supplied as this film winding body 9 when used for connection of electronic components.
　［接続工程］
　次いで、接着フィルム１を用いた電子部品の接続工程について説明する。接着フィルム１は、図３に示すように、リール部材６より巻き出され複数の搬送ローラ３０を介して巻取リール３１まで引き回される。 [Connection process]
Subsequently, the connection process of the electronic component using the adhesive film 1 is demonstrated. As shown in FIG. 3, the adhesive film 1 is unwound from the reel member 6 and drawn to the take-up reel 31 through a plurality of conveying rollers 30.
　図４に示すように、接着フィルム１は、接着剤層３が接続対象物である基板３２に転着されるに先立って、ナイフ５が接着剤層３に切り込む、いわゆるハーフカットが行われる。ハーフカット工程においては、ナイフ５は、接着剤層３を切断するために十分な切り込み深さに調整される。そのため、接着フィルム１は、ベースフィルム２にもナイフ５が切り込む。 As shown in FIG. 4, the adhesive film 1 is subjected to a so-called half cut in which the knife 5 cuts into the adhesive layer 3 before the adhesive layer 3 is transferred to the substrate 32 that is a connection object. In the half-cut process, the knife 5 is adjusted to a sufficient cutting depth for cutting the adhesive layer 3. Therefore, the knife 5 cuts into the base film 2 of the adhesive film 1.
　このとき、接着フィルム１によれば、軟質フィルム層２０がナイフ５によって切り込まれた場合にも、その先にヤング率が高く破断強度の大きい硬質フィルム層１０が設けられているため、接着剤層３のみが切断され、ベースフィルム２が切断されることを防止することができる。 At this time, according to the adhesive film 1, even when the soft film layer 20 is cut by the knife 5, the hard film layer 10 having a high Young's modulus and a high breaking strength is provided at the tip of the adhesive film 1. Only the layer 3 is cut, and the base film 2 can be prevented from being cut.
　その後、図５に示すように、接着フィルム１は、ベースフィルム２の上から仮圧着ツール３３によって基板３２上に熱加圧されることにより、所定の長さにカットされた接着剤層３のみが基板３２に転着され、図６に示すように、ベースフィルム２は、引き続き搬送されて巻取リール３１に巻回されていく。 Thereafter, as shown in FIG. 5, the adhesive film 1 is formed by applying only the adhesive layer 3 cut to a predetermined length by being hot-pressed on the substrate 32 by the provisional pressure bonding tool 33 from above the base film 2. As shown in FIG. 6, the base film 2 is continuously conveyed and wound around the take-up reel 31 as shown in FIG. 6.
　このように、接着フィルム１は、ヤング率が高く破断強度の大きい硬質フィルム層１０を備えたベースフィルム２を有することにより、ナイフ５が切り込み、接着剤層３が剥離した後も、連続してベースフィルム２を搬送し巻取リール３１に巻き取ることができる。 Thus, the adhesive film 1 has the base film 2 provided with the hard film layer 10 having a high Young's modulus and a high breaking strength, so that the knife 5 is cut and the adhesive layer 3 is peeled off continuously. The base film 2 can be conveyed and taken up on the take-up reel 31.
　そして、接着フィルム１によれば、ヤング率の高い硬質フィルム層１０を備えることにより、ベースフィルム２を薄型にすることができ、ハーフカットによるベースフィルム２の切断を防止しつつ、長尺化を図ることができる。 And according to the adhesive film 1, by providing the hard film layer 10 with a high Young's modulus, the base film 2 can be made thin, and the lengthening can be achieved while preventing the base film 2 from being cut by a half cut. Can be planned.
　次いで、本発明の実施例について説明する。本実施例では、単層のベースフィルム、あるいは相対的にヤング率の高い層層とヤング率の低い層とを有する２層ないし３層構造のベースフィルムを用いた接着フィルムを用意し、それぞれハーフカット性とリール部材への巻回長さを比較、評価した。リール部材は、巻芯径６６ｍｍ、外径１４５ｍｍのものを用意した。 Next, examples of the present invention will be described. In this embodiment, an adhesive film using a single-layer base film or a base film having a two-layer or three-layer structure having a layer layer having a relatively high Young's modulus and a layer having a low Young's modulus is prepared. The cutability and the winding length around the reel member were compared and evaluated. A reel member having a core diameter of 66 mm and an outer diameter of 145 mm was prepared.
　ベースフィルムに設けられる接着剤層は、ポリエステルウレタン樹脂（商品名：ＵＲ１４００、東洋紡績株式会社製、メチルエチルケトン／トルエン＝５０：５０の混合溶媒にて３０質量％に溶解したもの）を固形分換算で６０質量部、ラジカル重合性樹脂（商品名：ＥＢ－６００、ダイセル・サイテック株式会社製）３０質量部及びエトキシ化ｏ－フェニルフェノールアクリレート（商品名：Ａ－ＬＥＮ－１０、新中村化学工業株式会社製）３質量部、リン酸アクリレート（商品名：Ｐ－１Ｍ、共栄化学株式会社製）１質量部、ラジカル重合開始剤（商品名：パーヘキサＣ、日本油脂株式会社製）３質量部、導電性粒子（商品名：ＡＵＬ７０４、積水化学工業株式会社製）３質量部からなる。この接着剤を各ベースフィルムに厚さ２０μｍとなるように塗布した。 The adhesive layer provided on the base film is a polyester urethane resin (trade name: UR1400, manufactured by Toyobo Co., Ltd., dissolved in 30% by mass in a mixed solvent of methyl ethyl ketone / toluene = 50: 50) in terms of solid content. 60 parts by mass, 30 parts by mass of radically polymerizable resin (trade name: EB-600, manufactured by Daicel Cytec Co., Ltd.) and ethoxylated o-phenylphenol acrylate (trade name: A-LEN-10, Shin-Nakamura Chemical Co., Ltd.) 3 parts by weight, phosphoric acid acrylate (trade name: P-1M, manufactured by Kyoei Chemical Co., Ltd.) 1 part by weight, radical polymerization initiator (trade name: Perhexa C, manufactured by NOF Corporation), conductive part It consists of 3 parts by mass of particles (trade name: AUL704, manufactured by Sekisui Chemical Co., Ltd.). This adhesive was applied to each base film so as to have a thickness of 20 μm.
　［実施例１］
　実施例１では、硬質フィルム層として厚さ１２μｍのＰＩフィルム（ユーピレックス‐Ｓ：宇部興産株式会社製、ヤング率９．１ＧＰａ）と、軟質フィルム層として厚さ１５μｍのＰＰフィルム（トレファン２５７８：東レ株式会社社製、ヤング率１．５ＧＰａ）とをドライラミネート法により積層したベースフィルムを用いた。接着剤としては、ポリエステルポリオールからなる主剤に、キシレンジイソシアネート（アダクト体）とヘキサメチレンジイソシアネート（ヒューレット体）の混合物からなる硬化剤を、固形分比で３：１になるように配合したポリウレタン系の接着剤を用いた。接着剤の塗布量はドライ換算で４ｇ／ｍｍ２になるように調整した。エージング温度は５０℃‐５日とした。 [Example 1]
In Example 1, a PI film (Upilex-S: manufactured by Ube Industries, Young's modulus 9.1 GPa) having a thickness of 12 μm as a hard film layer, and a PP film (Treffan 2578: Toray Industries, Inc.) having a thickness of 15 μm as a soft film layer. The base film which laminated | stacked by the company company make, Young's modulus 1.5GPa) by the dry lamination method was used. As an adhesive, a polyurethane-based material in which a curing agent composed of a mixture of xylene diisocyanate (adduct body) and hexamethylene diisocyanate (Hewlett body) is blended with a main component composed of polyester polyol so as to have a solid content ratio of 3: 1. An adhesive was used. The application amount of the adhesive was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
　実施例１に係るベースフィルムは、ＰＩフィルムとＰＰフィルムとの２層構造であり、厚さ２７μｍである。また、実施例１に係るベースフィルムは、剥離処理されたＰＰフィルムに接着剤層（ＡＤＨ）を形成した。 The base film according to Example 1 has a two-layer structure of a PI film and a PP film, and has a thickness of 27 μm. Moreover, the base film which concerns on Example 1 formed the adhesive bond layer (ADH) in PP film by which the peeling process was carried out.
　［実施例２］
　実施例２では、硬質フィルム層として厚さ２５μｍのＰＩフィルムを用いた他は、実施例１と同じ条件とした。実施例２に係るベースフィルムは、厚さ４０μｍである。 [Example 2]
In Example 2, the conditions were the same as in Example 1 except that a PI film having a thickness of 25 μm was used as the hard film layer. The base film according to Example 2 has a thickness of 40 μm.
　［実施例３］
　実施例３では、硬質フィルム層として厚さ１２μｍのＰＥＮフィルム（テオネックスＱ５１：帝人デュポンフィルム株式会社製、ヤング率６．１ＧＰａ）と、軟質フィルム層として厚さ１２μｍのＰＥＴフィルム（ＰＥＴ－０１－ＢＵ：三井化学東セロ株式会社製、ヤング率５．３ＧＰａ）とをドライラミネート法により積層したベースフィルムを用いた。接着剤の塗布量はドライ換算で４ｇ／ｍｍ2になるように調整した。エージング温度は５０℃‐５日とした。 [Example 3]
In Example 3, a 12 μm thick PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) as a hard film layer, and a 12 μm thick PET film (PET-01-BU as a soft film layer) : Mitsui Chemicals Tosero Co., Ltd., Young's modulus 5.3 GPa) and a base film laminated by a dry lamination method was used. The amount of adhesive applied was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
　実施例３に係るベースフィルムは、ＰＥＮフィルムとＰＥＴフィルムとの２層構造であり、厚さ２４μｍである。また、実施例３に係るベースフィルムは、剥離処理されたＰＥＴフィルムに接着剤層（ＡＤＨ）を形成した。 The base film according to Example 3 has a two-layer structure of a PEN film and a PET film and has a thickness of 24 μm. Moreover, the base film which concerns on Example 3 formed the adhesive bond layer (ADH) in PET film by which the peeling process was carried out.
　［実施例４］
　実施例４では、軟質フィルム層として厚さ２５μｍのＰＥＴフィルム（２５ＧＳ：リンテック株式会社製、ヤング率５．３ＧＰａ）を用いた他は、実施例３と同じ条件とした。実施例４に係るベースフィルムは、厚さ３７μｍである。 [Example 4]
In Example 4, the same conditions as in Example 3 were used except that a 25 μm thick PET film (25 GS: manufactured by Lintec Corporation, Young's modulus 5.3 GPa) was used as the soft film layer. The base film according to Example 4 has a thickness of 37 μm.
　［実施例５］
　実施例５では、硬質フィルム層として厚さ２５μｍのＰＥＮフィルム（テオネックスＱ５１：帝人デュポンフィルム株式会社製、ヤング率６．１ＧＰａ）を用いた他は、実施例３と同じ条件とした。実施例５に係るベースフィルムは、厚さ３７μｍである。 [Example 5]
In Example 5, the same conditions as in Example 3 were used except that a 25 μm thick PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) was used as the hard film layer. The base film according to Example 5 has a thickness of 37 μm.
　［実施例６］
　実施例６では、ベースフィルムとして、ＰＥＮ樹脂とＰＥＴ樹脂とを共押出二軸延伸により形成した３層フィルム（三菱ポリエステルフィルムＧＭＢＨ社製）を用いた。実施例６に係るベースフィルムは、ＰＥＮ層（厚さ：１μｍ、ヤング率６．１ＧＰａ）と、ＰＥＮ及びＰＥＴの混合層（厚さ：１０μｍ、ヤング率５．７ＧＰａ）と、ＰＥＴ層（厚さ：１μｍ、ヤング率５．３ＧＰａ）とが、この順で積層されている。 [Example 6]
In Example 6, a three-layer film (manufactured by Mitsubishi Polyester Film GMBH) formed by coextrusion biaxial stretching of PEN resin and PET resin was used as the base film. The base film according to Example 6 includes a PEN layer (thickness: 1 μm, Young's modulus 6.1 GPa), a mixed layer of PEN and PET (thickness: 10 μm, Young's modulus 5.7 GPa), and a PET layer (thickness). 1 μm and Young's modulus 5.3 GPa) are laminated in this order.
　また、実施例６に係るベースフィルムは、厚さ１２μｍであり、剥離処理されたＰＥＴフィルムに接着剤層（ＡＤＨ）を形成した。 Further, the base film according to Example 6 had a thickness of 12 μm, and an adhesive layer (ADH) was formed on the peeled PET film.
　［比較例１］
　比較例１では、ベースフィルムとして厚さ１２μｍのＰＥＮフィルム（テオネックスＱ５１：帝人デュポンフィルム株式会社製、ヤング率６．１ＧＰａ）を用いた。比較例１では、このベースフィルムに剥離処理を施し、接着剤層（ＡＤＨ）を積層させた。 [Comparative Example 1]
In Comparative Example 1, a PEN film (Teonex Q51: Teijin DuPont Films, Young's modulus 6.1 GPa) having a thickness of 12 μm was used as the base film. In Comparative Example 1, the base film was peeled and an adhesive layer (ADH) was laminated.
　［比較例２］
　比較例２では、ベースフィルムとして厚さ２５μｍのＰＥＴフィルム（２５ＧＳ：リンテック株式会社製、ヤング率５．３ＧＰａ）を用いた。比較例２では、このベースフィルムに剥離処理を施し、接着剤層（ＡＤＨ）を積層させた。 [Comparative Example 2]
In Comparative Example 2, a PET film having a thickness of 25 μm (25 GS: manufactured by Lintec Corporation, Young's modulus 5.3 GPa) was used as the base film. In Comparative Example 2, the base film was peeled and an adhesive layer (ADH) was laminated.
　［比較例３］
　比較例３では、ベースフィルムとして厚さ３８μｍのＰＥＴフィルムを用いた他は、比較例２と同じ条件とした。 [Comparative Example 3]
In Comparative Example 3, the conditions were the same as in Comparative Example 2 except that a PET film having a thickness of 38 μm was used as the base film.
　［比較例４］
　比較例４では、ベースフィルムとして厚さ７５μｍのＰＥＴフィルムを用いた他は、比較例２と同じ条件とした。 [Comparative Example 4]
In Comparative Example 4, the conditions were the same as in Comparative Example 2 except that a 75 μm thick PET film was used as the base film.
　［比較例５］
　比較例５では、ベースフィルムとして厚さ１００μｍのＰＥＴフィルムを用いた他は、比較例２と同じ条件とした。 [Comparative Example 5]
In Comparative Example 5, the same conditions as in Comparative Example 2 were used except that a PET film having a thickness of 100 μm was used as the base film.
　［比較例６］
　比較例６では、２枚の厚さ１２μｍのＰＥＴフィルム（ＰＥＴ－０１－ＢＵ：三井化学東セロ株式会社製、ヤング率５．３ＧＰａ）をドライラミネート法により積層したベースフィルムを用いた。接着剤の塗布量はドライ換算で４ｇ／ｍｍ２になるように調整した。エージング温度は５０℃‐５日とした。 [Comparative Example 6]
In Comparative Example 6, a base film in which two PET films having a thickness of 12 μm (PET-01-BU: manufactured by Mitsui Chemicals, Inc., Young's modulus 5.3 GPa) were laminated by a dry lamination method was used. The application amount of the adhesive was adjusted to 4 g / mm 2 in terms of dry. The aging temperature was 50 ° C.-5 days.
　比較例６に係るベースフィルムは、２つのＰＥＴフィルムの２層構造であり、厚さ２４μｍである。また、比較例６に係るベースフィルムは、一方のＰＥＴフィルムに剥離処理を施し接着剤層（ＡＤＨ）を形成した。 The base film according to Comparative Example 6 is a two-layer structure of two PET films and has a thickness of 24 μm. Moreover, the base film which concerns on the comparative example 6 gave the peeling process to one PET film, and formed the adhesive bond layer (ADH).
　これら実施例１～６、比較例１～６に係る接着フィルムについて、それぞれハーフカット性と、リール部材への巻回長さを比較、評価した。ハーフカット性とは、一定のテンションで張った接着フィルムに対して、ナイフの刃を接着剤層側から一定の圧力で押し当てたときに、ベースフィルムの状態を評価したもので、１０００回中１度も切断しない場合を◎（最良）、１０００回中１～２回切断した場合を〇（良好）、１０００回中３～４回切断した場合を△（普通）、１０００回中５回以上切断した場合を×（不良）とした。 These adhesive films according to Examples 1 to 6 and Comparative Examples 1 to 6 were respectively compared and evaluated for the half-cut property and the winding length around the reel member. Half-cut property is an evaluation of the state of the base film when the knife blade is pressed with a constant pressure against the adhesive film stretched with a constant tension. ◎ (best) when not cut once, ○ (good) when cut 1 to 2 times in 1000 times, △ (normal) when cut 3 to 4 times in 1000 times, 5 times or more in 1000 times The case of cutting was defined as x (defect).
　また、リール部材への巻回長さは、２００ｍ以上の場合を〇（良好）、２００ｍ未満の場合を×（不良）とした。 Further, the winding length around the reel member was evaluated as ◯ (good) when it was 200 m or more, and x (defective) when it was less than 200 m.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
　表１に示すように、実施例１～６に係るベースフィルムを用いた接着フィルムは、接着剤層を支持するフィルム上に、ヤング率の高いフィルムが積層されているため、厚さが１２～４０μｍと薄型であるにもかかわらず、ハーフカット性は普通以上の性能を示し、実使用上、問題はなかった。また、実施例１～６に係るベースフィルムを用いた接着フィルムは、ベースフィルムの厚さがいずれも１２～４０μｍと薄型であるため、リール部材への巻回長さは２００ｍ以上であった。 As shown in Table 1, the adhesive films using the base films according to Examples 1 to 6 have a thickness of 12 to 12 because a film having a high Young's modulus is laminated on the film supporting the adhesive layer. Despite being as thin as 40 μm, the half-cut property showed an ordinary performance, and there was no problem in actual use. In addition, the adhesive films using the base films according to Examples 1 to 6 had a thin base film thickness of 12 to 40 μm, and therefore the winding length around the reel member was 200 m or more.
　一方、比較例１は、比較的ヤング率の高いＰＥＮフィルムのみからなるベースフィルムを用いているが、厚さが１２μｍと薄いことから、巻回長さは４０９ｍと良好であったが、ハーフカット性に劣る。 On the other hand, although the comparative example 1 uses the base film which consists only of a PEN film with a comparatively high Young's modulus, since thickness is as thin as 12 micrometers, winding length was as favorable as 409m, but half cut Inferior to sex.
　また、比較例２，３は、比較的ヤング率の低いＰＥＴフィルムのみからなるベースフィルムを用いているため、２５μｍ、３８μｍと薄型にすると、ハーフカット性に劣る。また、比較例４，５は、ＰＥＴフィルムのみからなるベースフィルムを用いて、厚さを２５μｍ、３８μｍと厚くすることでハーフカット性を改善することはできるが、ベースフィルムの厚みを増した分、巻回長さが短くなった。 Moreover, since Comparative Examples 2 and 3 use a base film made of only a PET film having a relatively low Young's modulus, if the thickness is reduced to 25 μm or 38 μm, the half-cut property is inferior. In Comparative Examples 4 and 5, half-cutting properties can be improved by increasing the thickness to 25 μm and 38 μm using a base film made of only a PET film, but the thickness of the base film is increased. The winding length was shortened.
　比較例６では、比較的ヤング率の低いＰＥＴフィルムをラミネートしたベースフィルムを用いているが、ヤング率の高いフィルムを用いていないため、薄型化を図ろうとすると、ハーフカット性に劣る結果となった。 In Comparative Example 6, a base film laminated with a PET film having a relatively low Young's modulus is used, but since a film having a high Young's modulus is not used, attempting to reduce the thickness results in inferior half-cut properties. It was.
　また、ハーフカット性が最良となった実施例２，５は、いずれもヤング率の高いＰＩフィルムやＰＥＮフィルム（硬質フィルム層）の厚さがヤング率の低いＰＰフィルムやＰＥＴフィルム（軟質フィルム層）の厚さよりも厚く形成されている。すなわち、接着剤層を支持する最もヤング率の低い層の厚みは、ヤング率が相対的に高い層の厚み以下とすることが好ましいことが分かる。 In Examples 2 and 5, which had the best half-cutting properties, the PI film and PEN film (hard film layer) having a high Young's modulus had a low Young's modulus, and the PP film and PET film (soft film layer). ). That is, it can be seen that the thickness of the layer having the lowest Young's modulus that supports the adhesive layer is preferably equal to or less than the thickness of the layer having a relatively higher Young's modulus.
　同様に、ともにベースフィルムの厚さが３７μｍの２層構造である実施例４と実施例５とを対比すると、実施例５ではハーフカット性が◎（最良）であるのに対して、実施例４では〇（良好）となった。これからも、軟質フィルム層の厚さが、硬質フィルム層の厚さ以下とすることが好ましく、これによりハーフカット工程におけるベースフィルムの剛性を高め、確実に切断を防止することができることが分かる。 Similarly, when Example 4 and Example 5 having a two-layer structure with a base film thickness of 37 μm are compared, the half-cut property in Example 5 is ◎ (best), whereas Example In 4, it became ◯ (good). From this, it can be seen that the thickness of the soft film layer is preferably not more than the thickness of the hard film layer, thereby increasing the rigidity of the base film in the half-cut process and reliably preventing cutting.
　また、ともにベースフィルムの厚さが２４μｍの２層構造である実施例３と比較例６とを対比すると、実施例３ではハーフカット性が△（普通）であるのに対して、比較例６では×（不良）となった。これより、ヤング率の高い硬質フィルム層のヤング率は６．０（ＧＰａ）以上とすること、また、ヤング率の高い硬質フィルム層のヤング率と接着剤層を支持する最もヤング率の低い軟質フィルム層のヤング率との差は０．５（ＧＰａ）以上とすることが好ましいことが分かる。 Further, when Example 3 and Comparative Example 6 having a two-layer structure with a base film thickness of 24 μm are compared, in Example 3, the half-cut property is Δ (normal), whereas Comparative Example 6 is. Then, it became x (defect). Therefore, the Young's modulus of the hard film layer having a high Young's modulus should be 6.0 (GPa) or more, and the Young's modulus of the hard film layer having a high Young's modulus and the softest having the lowest Young's modulus that supports the adhesive layer. It can be seen that the difference from the Young's modulus of the film layer is preferably 0.5 (GPa) or more.
１　接着フィルム、２　ベースフィルム、３　接着剤層、５　ナイフ、１０　硬質フィルム層、２０　軟質フィルム層、３０　搬送ローラ、３１　巻取リール、３２　基板、３３　仮圧着ツール 1 adhesive film, 2 base film, 3 adhesive layer, 5 knife, 10 hard film layer, 20 soft film layer, 30 transport roller, 31 take-up reel, 32 substrate, 33 temporary crimping tool

Claims (13)

  1. 　ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムにおいて、
    　上記ベースフィルムは、相対的にヤング率が高い層と、相対的にヤング率が低い層が積層されている接着フィルム。     In an adhesive film having a base film and an adhesive layer supported by the base film,
    The base film is an adhesive film in which a layer having a relatively high Young's modulus and a layer having a relatively low Young's modulus are laminated.
  2. 　上記接着剤層は、相対的にヤング率の低い層に支持されている請求項１記載の接着フィルム。 The adhesive film according to claim 1, wherein the adhesive layer is supported by a layer having a relatively low Young's modulus.
  3. 　上記ベースフィルムは、上記接着剤層を支持する層から最上層にかけて、順次ヤング率の高い層が積層されている請求項２記載の接着フィルム。 3. The adhesive film according to claim 2, wherein the base film is formed by sequentially laminating layers having a high Young's modulus from a layer supporting the adhesive layer to an uppermost layer.
  4. 　上記接着剤層を支持する最もヤング率の低い層の厚みは、ヤング率が相対的に高い層の厚み以下である請求項２又は３に記載の接着フィルム。 4. The adhesive film according to claim 2, wherein the thickness of the layer having the lowest Young's modulus that supports the adhesive layer is equal to or less than the thickness of the layer having a relatively high Young's modulus.
  5. 　上記接着剤層の厚みは、上記ベースフィルムの厚みよりも小さい請求項１～３のいずれか１項に記載の接着フィルム。 The adhesive film according to any one of claims 1 to 3, wherein a thickness of the adhesive layer is smaller than a thickness of the base film.
  6. 　ヤング率が高い層のヤング率は、６．０（ＧＰａ）以上である請求項１～３のいずれか１項に記載の接着フィルム。 The adhesive film according to any one of claims 1 to 3, wherein the layer having a high Young's modulus has a Young's modulus of 6.0 (GPa) or more.
  7. 　上記接着剤層を支持する最もヤング率の低い層のヤング率は６．０（ＧＰａ）未満である請求項６記載の接着フィルム。 The adhesive film according to claim 6, wherein the Young's modulus of the layer having the lowest Young's modulus that supports the adhesive layer is less than 6.0 (GPa).
  8. 　ヤング率の高い層のヤング率と上記接着剤層を支持する最もヤング率の低い層のヤング率との差は０．５（ＧＰａ）以上である請求項６記載の接着フィルム。 The adhesive film according to claim 6, wherein the difference between the Young's modulus of the layer having a high Young's modulus and the Young's modulus of the layer having the lowest Young's modulus that supports the adhesive layer is 0.5 (GPa) or more.
  9. 　ヤング率の高い層のヤング率と上記接着剤層を支持する最もヤング率の低い層のヤング率との差は０．５（ＧＰａ）以上である請求項７記載の接着フィルム。 The adhesive film according to claim 7, wherein the difference between the Young's modulus of the layer having a high Young's modulus and the Young's modulus of the layer having the lowest Young's modulus that supports the adhesive layer is 0.5 (GPa) or more.
  10. 　ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムがリールに巻回されたフィルム巻装体において、
    　上記ベースフィルムは、相対的にヤング率が高い層と、相対的にヤング率が低い層が積層されているフィルム巻装体。     In a film winding body in which an adhesive film having a base film and an adhesive layer supported by the base film is wound on a reel,
    The base film is a film winding body in which a layer having a relatively high Young's modulus and a layer having a relatively low Young's modulus are laminated.
  11. 　ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムを用いた接続構造体の製造方法において、
    　上記接着フィルムを接続対象物上に搬送し、
    　上記接着剤層側からカッターを切り込み、上記接着剤層のみを所定の長さに切断し、
    　上記接着剤層を上記接続対象物に転着するとともに、上記ベースフィルムを連続的に巻き取る接続構造体の製造方法。     In a method for manufacturing a connection structure using an adhesive film having a base film and an adhesive layer supported by the base film,
    Transport the adhesive film onto the connection object,
    Cut the cutter from the adhesive layer side, cut only the adhesive layer to a predetermined length,
    The manufacturing method of the connection structure which winds up the said base film continuously while transferring the said adhesive bond layer to the said connection target object.
  12. 　ベースフィルムと、上記ベースフィルムに支持された接着剤層とを有する接着フィルムを用いて接続対象物の接続方法において、
    　上記接着フィルムを接続対象物上に搬送し、
    　上記接着剤層側からカッターを切り込み、上記接着剤層のみを所定の長さに切断し、
    　上記接着剤層を上記接続対象物に転着するとともに、上記ベースフィルムを連続的に巻き取る接続方法。     In the connection method of the connection object using an adhesive film having a base film and an adhesive layer supported by the base film,
    Transport the adhesive film onto the connection object,
    Cut the cutter from the adhesive layer side, cut only the adhesive layer to a predetermined length,
    A connection method in which the adhesive layer is transferred to the connection object and the base film is continuously wound.
  13. 　請求項１２に記載の方法により製造された接続構造体。 A connection structure manufactured by the method according to claim 12.
PCT/JP2014/077039 2013-10-11 2014-10-09 Adhesive film, film wound body, production method for connection structure, connection method, connection structure WO2015053355A1 (en)

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