JP2015189836A - Adhesive film wound body, method for producing connection body and method for connecting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the squeeze-out of a binder resin component caused by the stress of tight-winding even in the case the tight-winding is produced by tension upon the pulling-up of an adhesive film, i.e., to prevent the generation of blocking.SOLUTION: Provided is an adhesive film having: an adhesive film 20; a base material film 30; and a resin layer 31 supported to the base film 30 and plastically deformed, including a stress relaxation film 5 connected with the adhesive film 20 and relaxing stress by the tight-winding of the adhesive film 20 and a reel member 3, and the adhesive film 20 is wound around the reel member 3 via the relaxation film 5.

Description

  The present invention relates to an adhesive formed in a film shape, in particular, an adhesive film winding body that is manufactured as a film winding body wound around a reel and is unwound at the time of use, a method for manufacturing a connection body using the same, And an electronic component connecting method.

  Conventionally, an anisotropic conductive film (ACF: Anisortropic Conductive Film) has been used as means for connecting an electronic component to a circuit board or the like. This anisotropic conductive film can be used for various purposes including connecting a terminal of a flexible printed circuit board (FPC) or an IC chip and an ITO (Indium Tin Oxide) electrode formed on a glass substrate of an LCD panel. These terminals are used for bonding and electrically connecting the terminals.

  As this anisotropic conductive film, generally, an epoxy resin-based insulating binder resin (adhesive) in which conductive particles are dispersed is used, for example, an IC chip terminal and ITO on a glass substrate. When the conductive particles are sandwiched between the electrodes and crushed, the electrical connection between the terminals of the IC chip and the ITO electrodes is realized, and the binder resin is cured in this state, whereby the IC A mechanical connection between the chip and the glass substrate is realized.

  The anisotropic conductive film 50 is a long film having a width of several millimeters. As shown in FIG. 4, the binder resin layer 51 containing the conductive particles 56 is a release film such as PET (Poly Ethylene Terephthalate) at the time of manufacture. 1 and is wound around a core 53a of a reel 53 in a state of being supported by the release film 52 as shown in FIG. The anisotropic conductive film 50 is stored in a state of a film wound body 54 wound around a reel 53, and is pulled out from the reel 53 at the time of use, cut to a required length, and then connected to an electronic component. Provided.

JP 2008-94622 A

  By the way, in electronic devices and the like for mobile use, the device main body has been reduced in size, and accordingly, electronic components mounted therein and their mounting areas have also been reduced in size and size. Along with this, an anisotropic conductive film having a width of 1 mm or less is also required. Further, in order to reduce the frequency of reel replacement and increase production efficiency, the film winding body 54 is required to wind an anisotropic conductive film as long as possible, for example, as long as 300 m. Yes.

  However, in the film winding body, as the length of the wound anisotropic conductive film becomes longer, winding tightening due to tension occurs when the film is pulled out from the reel 53, and the stress due to the winding tightening becomes larger as it becomes the core part. .

  When the anisotropic conductive film 50 is pulled out from the film winding body 54, particularly when a stress is generated in the central portion of the reel, the binder resin layer 51 is deformed to induce the binder resin component to protrude. Furthermore, the protruding binder resin adheres to the flange 55 of the reel 53, and so-called blocking, in which the anisotropic conductive film 50 cannot be normally drawn out, occurs. This phenomenon tends to occur remarkably in an anisotropic conductive film having a particularly low viscosity.

  Further, if the anisotropic conductive film 50 is shortened in order to reduce the stress due to the tightening of the wound body 54, the replacement frequency of the reel 53 increases, and the line needs to be stopped each time. Resulting in.

  The present invention solves the above-mentioned problems in the prior art, and suppresses the protrusion of the binder resin component due to the tightening stress even when the tightening occurs due to the tension when the adhesive film is pulled out, so-called blocking. It is an object of the present invention to provide an adhesive film winding body, a method for manufacturing a connection body, and a method for connecting an electronic component, which can prevent the occurrence of the above.

  In order to solve the above-described problems, an adhesive film wound body according to the present invention includes an adhesive film, a base film, and a plastically deformed resin layer supported by the base film, and the adhesive film And a reel member, and the adhesive film is wound around the reel member via the stress relaxation film.

  Moreover, the manufacturing method of the connection body which concerns on this invention temporarily sticks the adhesive film pulled out from the adhesive film winding body to the 1st electronic component, and arrange | positions a 2nd electronic component through the said adhesive film. And a step of crimping the first electronic component and the second electronic component and curing the adhesive film, wherein the adhesive film winding body includes an adhesive film, a base film, and the base film. And a resin layer that is plastically deformed and supported by the adhesive film, and is provided with a stress relaxation film that is continuous with the adhesive film and relieves stress caused by tightening of the adhesive film, and a reel member, and the adhesive film includes the stress relaxation film It is wound around the reel member via a film.

  In the electronic component connecting method according to the present invention, the adhesive film drawn from the adhesive film winding body is temporarily attached to the first electronic component, and the second electronic component is disposed via the adhesive film. And a step of crimping the first electronic component and the second electronic component and curing the adhesive film, wherein the adhesive film winding body includes an adhesive film, a base film, and the base film. And a resin layer that is plastically deformed and supported by the adhesive film, and is provided with a stress relaxation film that is continuous with the adhesive film and relieves stress caused by tightening of the adhesive film, and a reel member, and the adhesive film includes the stress relaxation film It is wound around the reel member via a film.

  According to the present invention, since the resin layer of the stress relaxation film is plastically deformed, the stress applied to the adhesive film at the time of unwinding is effectively relaxed, and protrusion and blocking can be prevented. Therefore, even an adhesive film having an adhesive layer with low viscosity can be elongated.

FIG. 1 is a perspective view showing a film winding body to which the present invention is applied. FIG. 2 is a cross-sectional view showing a state in which the stress relaxation film and the anisotropic conductive film are continuous. FIG. 3 is a cross-sectional view of the film winding body, in which A indicates the winding region of the anisotropic conductive film, and B indicates the winding region of the stress relaxation film. FIG. 4 is a cross-sectional view showing a conventional anisotropic conductive film.

  Hereinafter, an adhesive film winding body, a connection body manufacturing method, and an electronic component connection method to which the present invention is applied will be described in detail with reference to the drawings. It should be noted that the present invention is not limited to the following embodiments, and various modifications can be made without departing from the scope of the present invention. Further, the drawings are schematic, and the ratio of each dimension may be different from the actual one. Specific dimensions should be determined in consideration of the following description. Moreover, it is a matter of course that portions having different dimensional relationships and ratios are included between the drawings.

  A film winding body 1 to which the present invention is applied is formed by winding an adhesive film 2 around a reel 3 via a stress relaxation film 5 as shown in FIG.

[reel]
The reel 3 includes a cylindrical core 10 around which the adhesive film 2 is wound, and plate-like flanges 11 provided at both ends of the core 10. The winding core 10 has a shaft hole 10a into which a rotating shaft for rotating the reel 3 is inserted. One end of the adhesive film 2 in the longitudinal direction is connected to the core 10, and the stress relaxation film 5 and the adhesive film 2 are wound around the core 10.

  The core 10 and the flange 11 can be formed using, for example, various plastic materials. The flange 11 may be subjected to electrostatic treatment on the surface in contact with the adhesive film 2. Examples of the method for applying the electrostatic treatment include a method of applying a compound such as polythiophene to the flange 11.

[Adhesive film]
The adhesive film 2 wound around the reel 3 and constituting the film winding body 1 is an anisotropic conductive film (such as COG mounting for mounting electronic components on a circuit board or the like, FOG mounting for connecting substrates to each other) Examples thereof include ACF (Anisortropic Conductive Film) or a conductive adhesive film that connects a solar cell electrode and a tab wire.

  Hereinafter, the anisotropic conductive film 20 will be described as an example of the adhesive film 2. FIG. 2 is a cross-sectional view showing a state in which the stress relaxation film 5 and the anisotropic conductive film 20 are continuous. The anisotropic conductive film 20 includes a release film 21 and a binder resin layer 22 formed on the release film 21. The anisotropic conductive film 20 is formed in a tape shape, and the core 10 and the flange 11 are wound around the core 10 sandwiched by the flange 11 so that the release film 21 is on the outer peripheral side. The film winding body 1 is comprised in the area | region formed by these.

[Peeling film]
The release film 21 is formed in a tape shape, for example, by applying a release agent such as silicone to a base material. The release film 21 prevents the anisotropic conductive film 20 from drying and maintains the shape of the anisotropic conductive film 20. Examples of the substrate used for the release film 21 include PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methylpentene-1), PTFE (Polytetrafluoroethylene), and the like.

[Binder resin layer]
As shown in FIG. 2, the binder resin layer 22 is made of a normal binder resin containing a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, and the like, and conductive particles 25 are dispersed therein. .

  The film-forming resin contained in the binder resin is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  It does not specifically limit as curable resin, For example, a commercially available epoxy resin, an acrylic resin, etc. are mentioned.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

  The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermal activation type latent curing agent includes a method of generating active species (cation, anion, radical) by a dissociation reaction by heating, etc., and it is stably dispersed in the epoxy resin near room temperature, and epoxy at high temperature There are a method of initiating a curing reaction by dissolving and dissolving with a resin, a method of initiating a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, and an elution / curing method using microcapsules. Thermally active latent curing agents include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

  The adhesive composition constituting the binder resin is not limited to the case where it contains a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, etc. You may make it consist of any material used as an agent composition.

[Conductive particles]
Examples of the conductive particles 25 include any known conductive particles used in the anisotropic conductive film 1. Examples of the conductive particles 25 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

[2-layer ACF]
The anisotropic conductive film 20 according to the present invention includes a binder resin layer 22 containing conductive particles 25 and an insulating adhesive layer made of an insulating adhesive composition that does not contain conductive particles. It is good also as an anisotropic conductive film of the 2 layer structure laminated | stacked.

  The insulating adhesive composition constituting the insulating adhesive consists of a normal binder component containing a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, etc., and the binder resin layer 22 described above. It can be comprised with the material similar to adhesive composition of.

  The anisotropic conductive film 20 having a two-layer structure is formed by applying an adhesive composition constituting an insulating adhesive to a release film and drying it, and then bonding the binder resin 22 laminated and supported on the release film 21 described above. It can be formed by combining them.

  The adhesive film according to the present invention may be a conductive adhesive film containing conductive particles 25 or an insulating adhesive film (NCF: Non Conductive Film) containing no conductive particles.

[Stress relief film]
The stress relaxation film 5 is interposed between the anisotropic conductive film 20 and the winding core 10 and wound, so that when the anisotropic conductive film 20 is pulled out from the film winding body 1, stress due to tightening In the case where the stress is applied, the stress is relaxed to prevent the binder resin layer 22 of the anisotropic conductive film 20 from protruding or blocking.

  The stress relaxation film 5 includes a base film 30 and a stress relaxation resin layer 31 that is supported by the base film 30 and relieves stress by plastic deformation.

  The base film 30 is formed in a film shape and supports the stress relaxation resin layer 31. For example, PET (Poly Ethylene Terephthalate), PEN (Poly Ethylene naphthalate), PE (Poly Ethylene), PP (Polypropylene) ), Films such as aluminum foil.

  The stress relaxation resin layer 31 supported by the base film 30 is plastically deformed by applying a stress, thereby relieving the stress, and can be formed using various plastically deformable resins. it can. For example, the stress relaxation resin layer 31 includes various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin having an average molecular weight of about 10,000 to 80,000 used as the film forming resin of the binder resin layer 22 described above. It can be formed using a laminate.

  The stress relaxation film 5 is continuous with the anisotropic conductive film 20 and is wound around the core 10 before the anisotropic conductive film 20 is wound around the core 10. When the anisotropic conductive film 20 is pulled out from the film winding body 1 when the stress relaxation film 5 is cumulatively applied in the direction of the core 10, the stress relaxation resin layer 31 is plastically deformed and the stress relaxation film 5. Can be relaxed.

  When the anisotropic conductive film 20 is pulled out from the reel 3, a cumulative stress is applied in the direction of the core 10, thereby causing a gap between the release film 21 and the binder resin layer 22, resulting in a gap (winding nest). When it is generated and further stress is applied, the binder resin layer 22 protrudes from the wound body of the anisotropic conductive film 20 and cannot be pulled out normally by adhering to the flange 11 (blocking).

  However, since the anisotropic conductive film 20 is wound around the core 10 via the stress relaxation film 5 in the film winding body 1, stress is applied to the core 10 when the anisotropic conductive film 20 is pulled out. Even when it is cumulatively applied in the direction, the stress relaxation resin layer 31 can be plastically deformed to relieve the stress, and in particular, the protrusion or blocking of the binder resin layer 22 of the anisotropic conductive film 20 in the vicinity of the core 10 is prevented. Can be prevented.

[Viscosity of resin layer]
Here, the viscosity of the stress relaxation resin layer 31 of the stress relaxation film 5 is preferably + 30% or less of the viscosity of the binder resin layer 22 of the anisotropic conductive film 20. When the viscosity of the stress relaxation resin layer 31 is higher than + 30% of the viscosity of the binder resin layer 22, the stress relaxation property becomes insufficient, and the protrusion and blocking of the binder resin layer 22 cannot be prevented.

  The viscosity of the stress relaxation resin layer 31 may be higher than the viscosity of the binder resin layer 22. This is because the stress relaxation film 5 is wound on the core 10 side of the anisotropic conductive film 20, and the stress applied to the film winding body 1 is cumulatively increased toward the core 10 side. Become. That is, since stress greater than the anisotropic conductive film 20 is applied to the stress relaxation film 5, the stress related to the binder resin layer 22 can be relaxed even if the viscosity of the stress relaxation film 5 is higher than the viscosity of the binder resin layer 22. .

  The viscosity of the stress relaxation resin layer 31 of the stress relaxation film 5 is preferably −30% of the viscosity of the binder resin layer 22 of the anisotropic conductive film 20. By making the viscosity of the stress relaxation resin layer 31 lower than the viscosity of the binder resin layer 22, the stress related to the binder resin layer 22 can be more effectively relaxed. Relaxation can be expressed most effectively.

  In addition, it is preferable that the viscosity of the stress relaxation resin layer 31 is 5000 Pa · s or more and 1000000 Pa · s or less. At a viscosity lower than 5000 Pa · s, when stress is applied, the stress relaxation resin layer 31 is immediately plastically deformed, and the stress applied cumulatively when the anisotropic conductive film 20 is drawn cannot be alleviated, and the binder resin layer 22 is not relaxed. Cannot be prevented from protruding or blocking. Moreover, when the viscosity is higher than 1,000,000 Pa · s, the viscosity becomes too high for the binder resin layer of many adhesive films 2, and the stress relaxation property at the time of drawing becomes insufficient, thereby preventing protrusion and blocking. Can not.

[Cross sectional area of resin layer]
Moreover, when the stress relaxation film 5 is wound around the core 10, the total cross-sectional area of the film winding body 1 is preferably about 0.3% or more of the total cross-sectional area of the film winding body 1. . That is, it is preferable to wind so that the cross-sectional area B of the winding area of the stress relaxation film 5 is 0.3% or more of the cross-sectional area A of the film winding body 1 in the cross-sectional view shown in FIG.

  When the total cross-sectional area of the stress relaxation film 5 in the film winding body 1 is less than 0.3% of the total cross-sectional area of the film winding body 1, the stress relaxation effect is not sufficient, and the binder resin layer 22 protrudes or blocks. Can not be prevented. The upper limit of the total cross-sectional area of the stress relaxation film 5 is not particularly set, but when the total cross-sectional area increases, the winding length of the stress relaxation film 5 becomes longer, and the anisotropic conductive film 20 can be wound accordingly. Since it disappears, adjust it so that it becomes an appropriate total cross-sectional area.

  Here, the total cross-sectional area of the stress relaxation film 5 can be easily adjusted by the application thickness of the stress relaxation resin layer 31 applied to the base film 30 and the winding length around the core 10. In addition, although the application | thickness thickness to the base film 30 can be set arbitrarily, it is preferable when setting it as less than 300% of the thickness of the base film 30 on application | coating unevenness. In addition, when the application thickness of the stress relaxation resin layer 31 is thin, it is necessary to increase the length of the stress relaxation film 5 and wind it in multiple layers in order to obtain a predetermined total cross-sectional area.

  In addition, the stress relaxation film 5 does not need to apply | coat the stress relaxation resin layer 31 over the full length of the base film 30, and is a connection area | region with black PET which shows the termination | terminus of the anisotropic conductive film 20 or the anisotropic conductive film 20 The stress relaxation resin layer 31 does not have to be applied to the one end portion to be or the other end portion wound around the core 10.

  The anisotropic conductive film 20 may be produced by any method, but can be produced, for example, by the following method. An adhesive composition containing a film-forming resin, a curable resin, a latent curing agent, a silane coupling agent, conductive particles 25 and the like constituting the binder resin layer 22 is prepared. An anisotropic conductive film in which the binder resin layer 22 is laminated and supported on the release film 21 by applying the adjusted adhesive composition onto the release film 21 using a bar coater, a coating apparatus, and the like, and drying it with an oven or the like. Get 20.

  The anisotropic conductive film 20 is slit to a predetermined width as appropriate, and then connected to black PET 34 colored black as an end mark and an adhesive tape 35 as shown in FIG. The anisotropic conductive film 20 is continuous with the stress relaxation film 5 by connecting the black PET 34 and the stress relaxation film 5 with the adhesive tape 35 or the like. The anisotropic conductive film 20 is wound around the reel 3 by a predetermined length following the black PET 34 after the stress relaxation film 5 is wound around the core 10. Thereby, the film winding body 1 is manufactured.

  In addition, as for the anisotropic conductive film 20 wound by the film winding body 1, that whose winding length is 300 m or less is preferable when preventing the protrusion and blocking by stress relaxation. Of course, the anisotropic conductive film 20 longer than 300 m also exhibits the effect of preventing protrusion according to the present invention.

  When the anisotropic conductive film 20 is pulled out from the film winding body 1, stress due to winding is applied to the anisotropic conductive film 20 and the stress relaxation film 5, and cumulatively increases in the direction of the core 10. . At this time, according to the film winding body 1, since the anisotropic conductive film 20 is wound around the reel 3 through the stress relaxation film 5, the stress relaxation resin layer 31 is anisotropically deformed by plastic deformation. The stress relating to the conductive film 20 is relaxed, and the protrusion and blocking of the binder resin layer 22 can be prevented.

  Moreover, since the film winding body 1 can be manufactured only by interposing the stress relaxation film 5 between the anisotropic conductive film 20 and the core 10 of the reel 3, the conventional winding of the anisotropic conductive film 20 is possible. Can be easily applied to the body. Furthermore, the stress relaxation film 5 can easily adjust the stress relaxation properties by the viscosity, thickness, and winding length of the stress relaxation resin layer 31 that undergoes plastic deformation under the stress of the tightening, and the anisotropic conductivity. Necessary stress relaxation properties can be easily obtained according to the viscosity, winding length, etc. of the binder resin layer 22 of the film 20.

  The anisotropic conductive film 20 drawn out from the film winding body 1 has a binder resin layer 22 temporarily attached to a circuit board. After the temporary attachment, the anisotropic conductive film 20 is subjected to a main pressure bonding step by heat-pressing or ultraviolet irradiation after the release film 21 is peeled off and various electronic components such as an IC chip are mounted. Thereby, the connection body by which the electronic component was connected to the circuit board via the anisotropic conductive film 20 is manufactured.

  Next, examples of the present invention will be described. In this example, the presence or absence of the stress relaxation film, the composition of the resin layer of the stress relaxation film, the sample of the film winding body with the changed cross-sectional area ratio and viscosity are formed, and the extraction properties such as the presence or absence of blocking or blocking at the time of extraction Was measured and evaluated.

[Anisotropic conductive film]
Anisotropic conductive films according to Examples and Comparative Examples are 35 parts by mass of bifunctional acrylate (DCP, Shin-Nakamura Chemical Co., Ltd.), 35 parts by mass of phenoxy resin (YP50, manufactured by Toto Kasei Co., Ltd.), urethane acrylate (U-2PPA). , Shin-Nakamura Chemical Co., Ltd.) 20 parts by mass, conductive particles (AUL705, Sekisui Chemical Co., Ltd.) 5 parts by mass, silane coupling agent (KBE-503, Shin-Etsu Chemical Co., Ltd.) 1 part by mass, aliphatic diacyl After preparing a binder resin composition in which 4 parts by mass of peroxide (Perroyl L, manufactured by NOF Corporation) was added to a solvent, and coating this binder resin composition on a peeled PET film (width 1 mm, thickness 50 μm), By volatilizing the solvent, an anisotropic conductive film having a binder resin layer with a thickness of 35 μm was formed.

This anisotropic conductive film was wound over a length of 300 m to prepare a film wound body. The cross-sectional area of the film winding body was 6.0E + 09 (μm ² ).

  The viscosity of the binder resin layer was 60000 (Pa · s / 30 ° C.). Viscosity (Pa · s / 30 ° C) was measured using a rotary rheometer (TA Instruments), heating rate: 10 ° C / min, measuring pressure: 0 to 5 g, measuring plate diameter used: 8 mm, frequency: 1 Hz The dynamic viscoelasticity measurement of the anisotropic conductive film was performed under the conditions, and the viscosity at 30 ° C. was measured.

[Stress relief film]
The stress relaxation film connected to the anisotropic conductive film is prepared by adjusting a resin composition in which a solid epoxy resin (trade name: EP828, manufactured by Japan Epoxy Resin Co., Ltd.) and a phenoxy resin (YP50, manufactured by Toto Kasei Co., Ltd.) are added to a solvent. It was formed by applying and drying on a base film (PET, thickness 50 μm).

[Film roll]
In Examples 1 to 5 and Comparative Example 2, after the stress relaxation film was wound around the reel, 2 m of black PET was wound around the tip of the stress relaxation film, and the anisotropic conductive film was further wound around the black PET. The film winding body was created by connecting and winding over 300 m. In Comparative Example 1, after winding black PET around a reel, an anisotropic conductive film was connected to the tip of black PET and wound for 300 m to prepare a film wound body. The cross-sectional area of the film winding body according to each example and each comparative example is 6.0E + 09 (μm ² ).

[Example 1]
In Example 1, 70 parts by mass of a solid epoxy resin and 30 parts by mass of a phenoxy resin were mixed, and a stress relaxation resin layer was formed on a base film over a thickness of 20 μm and a length of 6 m. The viscosity of the stress relaxation resin layer according to Example 1 is 5000 (Pa · s / 30 ° C.). Moreover, the film winding body which concerns on Example 1 has a total cross-sectional area of a stress relaxation film of 1.20E + 08 (μm ² ), which is 0.57% of the cross-sectional area of the film winding body.

[Example 2]
In Example 2, 50 parts by mass of a solid epoxy resin and 50 parts by mass of a phenoxy resin were mixed, and a stress relaxation resin layer was formed on a base film over a thickness of 8 μm and a length of 6 m. The viscosity of the stress relaxation resin layer according to Example 2 is 50000 (Pa · s / 30 ° C.). Moreover, the film winding body which concerns on Example 2 has the total cross-sectional area of a stress relaxation film of 6.00E + 07 (micrometer < ² >), and this is 0.29% of the cross-sectional area of a film winding body.

[Example 3]
In Example 3, 50 parts by mass of a solid epoxy resin and 50 parts by mass of a phenoxy resin were mixed, and a stress relaxation resin layer was formed on a base film over a thickness of 20 μm and a length of 6 m. The viscosity of the stress relaxation resin layer according to Example 3 is 50000 (Pa · s / 30 ° C.). Further, in the film winding body according to Example 3, the total cross-sectional area of the stress relaxation film is 1.20E + 08 (μm ² ), which is 0.57% of the cross-sectional area of the film winding body.

[Example 4]
In Example 4, 45 parts by mass of a solid epoxy resin and 55 parts by mass of a phenoxy resin were mixed, and a stress relaxation resin layer was formed on a base film over a thickness of 20 μm and a length of 6 m. The viscosity of the stress relaxation resin layer according to Example 4 is 78000 (Pa · s / 30 ° C.). Further, in the film winding body according to Example 4, the total cross-sectional area of the stress relaxation film is 1.20E + 08 (μm ² ), which is 0.57% of the cross-sectional area of the film winding body.

[Example 5]
In Example 5, 55 parts by mass of a solid epoxy resin and 45 parts by mass of a phenoxy resin were mixed, and a stress relaxation resin layer was formed on a base film over a thickness of 20 μm and a length of 6 m. The viscosity of the stress relaxation resin layer according to Example 5 is 42000 (Pa · s / 30 ° C.). In the film winding body according to Example 5, the total cross-sectional area of the stress relaxation film is 1.20E + 08 (μm ² ), which is 0.57% of the cross-sectional area of the film winding body.

[Comparative Example 1]
In Comparative Example 1, the film winding was performed by winding the black PET around the reel for 8.4 m without interposing the stress relaxation film, connecting the anisotropic conductive film to the tip of the black PET, and winding it. Formed body. Note that the winding length of the black PET was calculated by replacing the cross-sectional integral of the stress relaxation film in Example 3 with the PET length, and the film winding body according to Comparative Example 1 was different from Example 3. The winding length of the isotropic conductive film and the cross-sectional area of the film winding body are the same.

[Comparative Example 2]
In Comparative Example 2, 43 parts by mass of a solid epoxy resin and 57 parts by mass of a phenoxy resin were mixed, and a stress relaxation resin layer was formed on a base film over a thickness of 20 μm and a length of 6 m. The viscosity of the stress relaxation resin layer according to Comparative Example 2 is 84000 (Pa · s / 30 ° C.). Moreover, the film winding body which concerns on the comparative example 2 has a total cross-sectional area of a stress relaxation film of 1.20E + 08 (μm ² ), which is 0.57% of the cross-sectional area of the film winding body.

  About the film winding body which concerns on these Examples 1-5 and Comparative Examples 1 and 2, the extraction characteristics, such as the protrusion of the binder resin layer at the time of extraction of an anisotropic conductive film, and the presence or absence of blocking, were evaluated. Specifically, a weight of 50 g was hung from the tip of the anisotropic conductive film of the film winding body, and the film winding body was left in a 30 ° C. environment for 6 hours. Then, if 300m of the anisotropic conductive film is pulled out and the binder resin adheres to the reel flange, the presence of blocking that prevents the anisotropic conductive film from being drawn out normally due to the binder resin adhering to the reel flange. Evaluated.

  As a result, ◎ (best) when blocking did not occur and no protrusion was observed visually, ◯ (good) when protrusion was seen but blocking did not occur, and blocking occurred Although it was recognized, the case where the anisotropic conductive film could be pulled out was evaluated as Δ (normal), and the case where the anisotropic conductive film could not be pulled out normally as a result of blocking was evaluated as x (defect).

  As shown in Table 1, in Examples 1 to 5, the anisotropic conductive film could be pulled out. This is because in the film winding body according to each example, the stress at the time of unwinding was effectively relieved by plastic deformation of the stress relaxation resin layer. On the other hand, in Comparative Example 1 in which the stress relaxation film is not interposed, since the stress relaxation film is not interposed, the stress related to the anisotropic conductive film is not relaxed, blocking occurs, and the anisotropic conductive film is drawn normally. I couldn't. Moreover, in Comparative Example 2, the viscosity of the stress relaxation resin layer was 40% higher than the viscosity of the binder resin layer of the anisotropic conductive film, and the stress relaxation property was insufficient.

  When Example 4 is compared with Example 5, in Example 4 where the viscosity of the stress relaxation resin layer is 30% higher than the viscosity of the binder resin layer of the anisotropic conductive film, the anisotropic conductive film can be pulled out. The occurrence of blocking was observed. On the other hand, in Example 5 where the viscosity of the stress relaxation resin layer was 30% lower than the viscosity of the binder resin layer of the anisotropic conductive film, no protrusion or blocking was observed. From this, it can be seen that the viscosity of the stress relaxation resin layer is preferably + 30% or less, more preferably −30% of the viscosity of the binder resin layer of the anisotropic conductive film.

  In contrast to Example 2 and Example 3, in Example 2 where the total cross-sectional area of the stress relaxation film is 0.29% of the cross-sectional area of the film winding body, although the anisotropic conductive film can be drawn, Generation of blocking was observed. On the other hand, in Example 3 in which the total cross-sectional area of the stress relaxation film was 0.57% of the cross-sectional area of the film winding body, the protrusion was observed, but the blocking was not reached. This shows that the total cross-sectional area of the stress relaxation resin layer is preferably 0.3% or more of the cross-sectional area of the film winding body.

  When Example 1 is compared with Example 5, in Example 1 in which the viscosity of the stress relaxation resin layer is 5000 (Pa · s / 30 ° C.), the anisotropic conductive film can be pulled out, but blocking is observed. It was. On the other hand, in Example 5 where the viscosity of the stress relaxation resin layer was 42000 (Pa · s / 30 ° C.), no protrusion or blocking was observed. It can be seen from this that the viscosity of the stress relaxation resin layer is preferably 5000 (Pa · s / 30 ° C.) or more.

DESCRIPTION OF SYMBOLS 1 Film winding body, 2 Adhesive film, 3 Reel, 10 roll core, 10a Shaft hole, 11 Flange, 20 Anisotropic conductive film, 21 Release film, 22 Binder resin layer, 25 Conductive particle, 30 Base film, 31 Stress relaxation resin layer, 35 Adhesive tape

Claims (8)

Adhesive film,
A stress relieving film that has a base film and a resin layer that is plastically deformed supported by the base film, is continuous with the adhesive film, and relieves stress due to winding of the adhesive film;
A reel member,
An adhesive film winding body in which the adhesive film is wound around the reel member via the stress relaxation film.   The adhesive film winding body according to claim 1, wherein the resin layer of the stress relaxation film has a viscosity of + 30% or less of the viscosity of the adhesive layer of the adhesive film.   The adhesive film winding body according to claim 2, wherein the viscosity of the resin layer of the stress relaxation film is -30% of the viscosity of the adhesive layer of the adhesive film.   The adhesive film winding body according to any one of claims 1 to 3, wherein the resin layer of the stress relaxation film has a viscosity of 5000 to 1000000 Pa · s.   The adhesive film winding body according to any one of claims 1 to 4, wherein a total cross-sectional area of the stress relaxation film is 0.3% or more of a total cross-sectional area of the adhesive film winding body.   The wound length of the said adhesive film is 300 m or less, The adhesive film winding body of any one of Claims 1-5. The adhesive film drawn out from the adhesive film winding body is temporarily attached to the first electronic component, the second electronic component is disposed through the adhesive film, and the first electronic component and the second electronic component are disposed. A step of crimping the component and curing the adhesive film;
The adhesive film winding body is
Adhesive film,
A stress relieving film that has a base film and a resin layer that is plastically deformed supported by the base film, is continuous with the adhesive film, and relieves stress due to winding of the adhesive film;
A reel member,
The manufacturing method of the connection body by which the said adhesive film is wound around the said reel member via the said stress relaxation film. The adhesive film drawn out from the adhesive film winding body is temporarily attached to the first electronic component, the second electronic component is disposed through the adhesive film, and the first electronic component and the second electronic component are disposed. A step of crimping the component and curing the adhesive film;
The adhesive film winding body is
Adhesive film,
A stress relieving film that has a base film and a resin layer that is plastically deformed supported by the base film, is continuous with the adhesive film, and relieves stress due to winding of the adhesive film;
A reel member,
An electronic component connecting method in which the adhesive film is wound around the reel member via the stress relaxation film.

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