KR102161430B1 - Anisotropic conductive film, connecting method, and joined structure - Google Patents

Abstract

An anisotropic conductive film for anisotropic conductive connection between a terminal of a first electronic component and a terminal of a second electronic component, comprising a film-forming resin, a curable resin, a curing agent, and conductive particles, wherein the film-forming resin is a crystalline resin It is an anisotropic conductive film containing and an amorphous resin.

Description

An anisotropic conductive film, a connection method, and a bonded body TECHNICAL FIELD [ANISOTROPIC CONDUCTIVE FILM, CONNECTING METHOD, AND JOINED STRUCTURE]

The present invention relates to an anisotropic conductive film, a connection method, and a bonded body.

Conventionally, as a means for connecting an electronic component to a substrate, a tape-like connection material (for example, an anisotropic conductive film (ACF)) in which a thermosetting resin in which conductive particles are dispersed is applied to a release film has been used.

This anisotropic conductive film, for example, when connecting a terminal of a flexible printed circuit board (FPC) or an IC chip to an electrode formed on a glass substrate of an LCD panel, and bonding various terminals to each other and electrically It is used when connecting.

However, in recent years, connection at a low temperature is required for connection between electronic components. Connection at low temperatures reduces thermal damage to electronic components, and variations in heating temperature during connection (depending on whether or not a component is connected to the end of the wiring connected to the electrode, the heating temperature in the electrode portion changes. When the mounting density becomes high, the deviation becomes particularly remarkable) and is required in terms of reducing the load on the mounting equipment.

However, in connection at a low temperature, the conventional anisotropic conductive film is not sufficiently melted and has low fluidity. Therefore, there is a problem that sufficient connection cannot be made, and conduction resistance and crushing of the conductive particles become insufficient.

On the other hand, in order to improve the fluidity in connection at low temperature, and increase the low molecular weight material that melts at low temperature in the anisotropic conductive film, when the anisotropic conductive film is wound on a reel, the above There is a problem that the anisotropic conductive film protrudes.

By the way, as a liquid anisotropic conductive adhesive used for anisotropic conductive connection, in order to control fluidity before use and during connection, an anisotropic conductive adhesive using a crystalline polyester resin has been proposed (for example, Patent Document 1 Reference).

However, even if the technique of this proposal is applied to an anisotropic conductive film, the problem of insufficient conduction resistance and crushing of conductive particles in connection at low temperature, and the anisotropic conduction from the end when the anisotropic conductive film is wound on a reel. It can't solve the whole problem of film escaping.

Therefore, sufficient conduction resistance and crushing of the conductive particles can be obtained in connection at low temperature, and an anisotropic conductive film capable of preventing the anisotropic conductive film from protruding from the end when the anisotropic conductive film is wound on a reel And the present situation is that the provision of a connection method using the anisotropic conductive film and a bonded body using the anisotropic conductive film is required.

Japanese Patent Application Publication No. 2006-152233

The present invention makes it a subject to solve the aforementioned various problems in the prior art and achieve the following objects. That is, in the present invention, sufficient conduction resistance and crushing of the conductive particles can be obtained in connection at low temperatures, and when the anisotropic conductive film is wound on a reel, the anisotropic conductive film can be prevented from protruding from the end. It aims at providing a present anisotropic conductive film, a connection method using the anisotropic conductive film, and a bonded body using the anisotropic conductive film.

As a means for solving the said subject, it is as follows. In other words,

<1> As an anisotropic conductive film for anisotropically conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,

It contains a film-forming resin, a curable resin, a curing agent, and conductive particles,

The film-forming resin is an anisotropic conductive film comprising a crystalline resin and an amorphous resin.

It is the anisotropic conductive film as described in said <1> whose mass ratio (crystalline resin: amorphous resin) of <2> crystalline resin and amorphous resin is 90:10-10:90.

<3> Crystalline resin is a crystalline polyester resin,

An amorphous resin is an anisotropic conductive film in any one of said <1> to <2> which is at least any one of amorphous polyester urethane resin, amorphous phenoxy resin, and amorphous polyurethane resin.

A <4> amorphous resin is the anisotropic conductive film in any one of said <1>-<3> which is an amorphous polyester urethane resin.

<5> As a connection method for anisotropically conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,

A first arrangement step of disposing the anisotropic conductive film according to any one of <1> to <4> on the terminal of the second electronic component, and

A second arrangement step of disposing the first electronic component on the anisotropic conductive film so that a terminal of the first electronic component is in contact with the anisotropic conductive film,

A connection method comprising a heating and pressing step of heating and pressing the first electronic component by a heating and pressing member.

<6> A first electronic component having a terminal, a second electronic component having a terminal, and the terminal of the first electronic component and the second electronic component interposed between the first electronic component and the second electronic component. Having a cured product of an anisotropic conductive film electrically connecting terminals,

It is a bonded body characterized in that the said anisotropic conductive film is the anisotropic conductive film in any one of said <1>-<4>.

Advantageous Effects of Invention According to the present invention, it is possible to solve the above-described problems in the prior art, achieve the above object, obtain sufficient conduction resistance and crushing of conductive particles in connection at low temperature, and transfer an anisotropic conductive film to a reel. When wound up, an anisotropic conductive film capable of preventing the anisotropic conductive film from protruding from an end portion, a connection method using the anisotropic conductive film, and a bonded body using the anisotropic conductive film can be provided.

(Anisotropic conductive film)

The anisotropic conductive film of the present invention contains at least a film-forming resin, a curable resin, a curing agent, and an electroconductive particle, and further contains other components as necessary.

The said anisotropic conductive film is an anisotropic conductive film which anisotropically connects a terminal of a 1st electronic component to a terminal of a 2nd electronic component.

<Film-forming resin>

The film-forming resin contains a crystalline resin and an amorphous resin.

-Crystalline resin-

The crystalline resin is not particularly limited, and may be appropriately selected according to the purpose, and for example, crystalline polyester resin, crystalline polyurethane resin, crystalline polyolefin resin, crystalline polyamide resin, crystalline polystyrene Resin, etc. are mentioned. Among these, a crystalline polyester resin is preferable from the viewpoint of adhesiveness and electrical insulation.

These may be used individually by 1 type, and may use 2 or more types together.

Here, the crystalline resin refers to a resin having a crystalline region, and whether the crystalline resin is, for example, in differential scanning calorimetry, can be confirmed by observing an endothermic peak during the heating process.

The number average molecular weight of the crystalline resin is not particularly limited and can be appropriately selected according to the purpose, but is preferably 8,000 to 50,000, more preferably 10,000 to 40,000, and particularly preferably 15,000 to 30,000.

The said number average molecular weight can be calculated|required, for example by gel permeation chromatography measurement (GPC, polystyrene conversion).

The melting point of the crystalline resin is not particularly limited, and can be appropriately selected according to the purpose, but is preferably 80°C to 110°C, and more preferably 90°C to 105°C.

The melting point can be measured, for example, by differential scanning calorimetry (DSC).

The content of the crystalline resin in the anisotropic conductive film is not particularly limited, and can be appropriately selected according to the purpose, but is preferably 3% by mass to 50% by mass, and more preferably 7% by mass to 50% by mass. And, 15 mass%-35 mass% are especially preferable.

-Amorphous resin-

The amorphous resin is not particularly limited, and may be appropriately selected according to the purpose, and the anisotropic conductive film protrudes from the end when the crushed surface of the conductive particles and the anisotropic conductive film are wound on a reel. From the viewpoint of preventing, at least any of an amorphous polyester urethane resin, an amorphous phenoxy resin, and an amorphous polyurethane resin is preferable, and an amorphous polyester urethane resin is more preferable.

Examples of the amorphous polyester urethane resin include urethane-modified amorphous polyester resins.

The number average molecular weight of the amorphous resin is not particularly limited, and can be appropriately selected according to the purpose, but is preferably 1,000 to 70,000, more preferably 20,000 to 60,000, and particularly preferably 30,000 to 50,000.

The said number average molecular weight can be calculated|required, for example by gel permeation chromatography measurement (GPC, polystyrene conversion).

The glass transition temperature of the amorphous resin is not particularly limited, and can be appropriately selected according to the purpose, but is preferably from 60°C to 110°C, and more preferably from 70°C to 100°C.

The glass transition temperature can be measured, for example, by differential scanning calorimetry (DSC).

The content of the amorphous resin in the anisotropic conductive film is not particularly limited, and can be appropriately selected depending on the purpose, but is preferably 3% by mass to 50% by mass, and more preferably 7% by mass to 50% by mass. And, 15 mass%-35 mass% are especially preferable.

The mass ratio of the crystalline resin and the amorphous resin (crystalline resin: amorphous resin) is not particularly limited, and may be appropriately selected according to the purpose, but 90:10 to 10:90 is preferable, and 90:10 -20:80 is more preferable, and 60:40-40:60 is particularly preferable.

The film-forming resin is a thermoplastic resin and is different from the curable resin.

<curable resin>

The curable resin is not particularly limited, and may be appropriately selected according to the purpose, and examples thereof include an epoxy resin and an acrylate.

-Epoxy resin-

The epoxy resin is not particularly limited, and may be appropriately selected according to the purpose, for example, bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin, modified epoxy resins thereof, alicyclic epoxy resins And the like. These may be used individually by 1 type, and may use 2 or more types together.

-Acrylate-

Methacrylate is also contained in the said acrylate.

The acrylate is not particularly limited, and may be appropriately selected according to the purpose, and, for example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, phosphate acrylate, epoxy acrylate, ethylene glycol Diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy-1,3-diacryloxypropane, 2, 2-bis[4-(acryloxymethoxy)phenyl]propane, 2,2-bis[4-(acryloxyethoxy)phenyl]propane, dicyclopentenylacrylate, tricyclodecanylacrylate, tris( Acryloxyethyl) isocyanurate, urethane acrylate, etc. are mentioned. Moreover, what made these acrylates a methacrylate is mentioned. These may be used individually by 1 type, and may use 2 or more types together.

The content of the curable resin in the anisotropic conductive film is not particularly limited and can be appropriately selected according to the purpose, but is preferably 30 to 80% by mass, more preferably 40 to 55% by mass. .

<hardener>

The curing agent is not particularly limited and may be appropriately selected according to the purpose, and examples thereof include imidazoles, organic peroxides, anionic curing agents, and cationic curing agents.

As said imidazoles, 2-ethyl 4-methylimidazole, etc. are mentioned, for example.

Examples of the organic peroxide include lauroyl peroxide, butyl peroxide, benzyl peroxide, dilauroyl peroxide, dibutyl peroxide, peroxydicarbonate, and benzoyl peroxide.

As said anionic hardening agent, organic amines etc. are mentioned, for example.

Examples of the cationic curing agent include a sulfonium salt, an onium salt, an aluminum chelating agent, and the like.

The combination of the curable resin and the curing agent is not particularly limited, and may be appropriately selected according to the purpose, and a combination of the epoxy resin and the imidazoles, and a combination of the acrylate and the organic peroxide are preferable.

The content of the curing agent in the anisotropic conductive film is not particularly limited, and can be appropriately selected depending on the purpose, but is preferably 1 to 10% by mass, and more preferably 3 to 7% by mass.

<Conductive particles>

It does not specifically limit as said electroconductive particle, It can select suitably according to the objective, For example, metal particle, metal-coated resin particle, etc. are mentioned.

The metal particles are not particularly limited and may be appropriately selected according to the purpose, and examples thereof include nickel, cobalt, silver, copper, gold, palladium, solder, and the like. These may be used individually by 1 type, and may use 2 or more types together.

Among these, nickel, silver, and copper are preferable. These metal particles may be coated with gold or palladium on their surface for the purpose of preventing surface oxidation. Further, you may use a metal protrusion or an organic material coated with an insulating film on the surface.

The metal-coated resin particle is not particularly limited as long as it is a particle coated with a metal on the surface of the resin particle, and may be appropriately selected according to the purpose. For example, the surface of the resin particle is nickel, silver, solder, copper, And particles coated with at least any metal of gold and palladium. Further, you may use a metal protrusion or an organic material coated with an insulating film on the surface. In the case of connection considering low resistance, particles in which the surface of the resin particles are coated with silver are preferred.

The method of coating the metal to the resin particles is not particularly limited, and can be appropriately selected according to the purpose, and examples thereof include an electroless plating method, a sputtering method, and the like.

The material of the resin particles is not particularly limited, and may be appropriately selected according to the purpose, for example, styrene-divinylbenzene copolymer, benzoguanamine resin, crosslinked polystyrene resin, acrylic resin, styrene-silica composite resin And the like.

The said electroconductive particle should just have electroconductivity at the time of anisotropic electroconductive connection. For example, even if it is a particle|grain coated with an insulating film on the surface of a metal particle, if the said particle|grain is deformed at the time of anisotropic conductive connection, and the said metal particle is exposed, it is the said electroconductive particle.

The average particle diameter of the conductive particles is not particularly limited, and can be appropriately selected depending on the purpose, but is preferably 1 µm to 50 µm, more preferably 2 µm to 25 µm, and particularly preferably 2 µm to 10 µm. .

The said average particle diameter is an average value of the particle diameters arbitrarily measured about 10 electroconductive particle.

The particle diameter can be measured, for example, by observation with a scanning electron microscope.

<Other ingredients>

The other components are not particularly limited and may be appropriately selected according to the purpose, and for example, a silane coupling agent, a filler, a softener, an accelerator, an anti-aging agent, a colorant (pigment, dye), an organic solvent, an ion catcher And the like. The amount of the other components to be added is not particularly limited and can be appropriately selected depending on the purpose.

<The first electronic component and the second electronic component>

The first electronic component and the second electronic component are not particularly limited as long as it is an electronic component having a terminal to be subjected to anisotropic conductive connection using the anisotropic conductive film, and can be appropriately selected according to the purpose. For example, a glass substrate, a flexible substrate, a rigid substrate, an IC (Integrated Circuit) chip, a TAB (Tape Automated Bonding), a liquid crystal panel, etc. are mentioned. Examples of the glass substrate include an Al wiring formed glass substrate, an ITO (indium tin oxide) wiring formed glass substrate, and the like. As said IC chip, an IC chip for liquid crystal screen control in a flat panel display (FPD), etc. is mentioned, for example.

The average thickness of the anisotropic conductive film is not particularly limited and can be appropriately selected according to the purpose, but is preferably 5 µm to 100 µm, more preferably 10 µm to 60 µm, and particularly preferably 20 µm to 50 µm. Do.

The method for producing the anisotropic conductive film is not particularly limited, and may be appropriately selected according to the purpose, for example, by mixing the crystalline resin, the amorphous resin, the curable resin, the curing agent, and the conductive particles A method of applying the obtained anisotropic conductive composition onto a peel-treated polyethylene terephthalate (PET) film, etc. are mentioned.

(Connection method)

The connection method of the present invention includes at least a first batching step, a second batching step, and a heating and pressing step, and further includes other steps as necessary.

The connection method is a method of anisotropically conductively connecting the terminal of the first electronic component and the terminal of the second electronic component.

The first electronic component and the second electronic component are not particularly limited, and can be appropriately selected according to the purpose, for example, the first electronic component exemplified in the description of the anisotropic conductive film of the present invention, And the second electronic component, respectively.

<1st batch process>

The first arrangement step is not particularly limited as long as it is a step of disposing the anisotropic conductive film of the present invention on the terminal of the second electronic component, and may be appropriately selected according to the purpose.

<2nd batch process>

The second arrangement step is not particularly limited as long as it is a step of arranging the first electronic component on the anisotropic conductive film so that the terminal of the first electronic component is in contact with the anisotropic conductive film. You can choose.

<Heating and pressing process>

The heating and pressing step is not particularly limited as long as it is a step of heating and pressing the first electronic component with a heating and pressing member, and may be appropriately selected according to the purpose.

Examples of the heating pressing member include a pressing member having a heating mechanism. Examples of the pressing member having the heating mechanism include a heat tool.

The heating temperature is not particularly limited, and can be appropriately selected according to the purpose, but is preferably from 100°C to 140°C.

The pressure for pressurization is not particularly limited, and can be appropriately selected depending on the purpose, but is preferably 0.5 MPa to 10 MPa.

The heating and pressurizing time is not particularly limited, and can be appropriately selected according to the purpose, and 0.5 seconds to 10 seconds are preferable.

(Conjugate)

The bonded body of the present invention has at least a cured product of a first electronic component, a second electronic component, and an anisotropic conductive film, and further has other members as necessary.

The first electronic component and the second electronic component are not particularly limited, and can be appropriately selected according to the purpose, for example, the first electronic component exemplified in the description of the anisotropic conductive film of the present invention, And the second electronic component, respectively.

The said anisotropic conductive film is the said anisotropic conductive film of this invention.

The cured product of the anisotropic conductive film is interposed between the first electronic component and the second electronic component to electrically connect the terminal of the first electronic component and the terminal of the second electronic component.

The said conjugate can be manufactured by the said connection method of this invention, for example.

Example

Hereinafter, examples of the present invention will be described, but the present invention is not limited to these examples at all.

(Example 1)

<Production of anisotropic conductive film>

Crystalline polyester resin (brand name: SP-185, manufactured by Nippon Synthetic Chemical Industries, Ltd., film-forming resin) 45 parts by mass, amorphous polyester urethane resin (brand name: UR-1400, manufactured by Toyobo Corporation, film-forming resin) 5 Parts by mass, urethane acrylate (trade name: M-1600, manufactured by Toa Synthetic Corporation, curable resin) 28 parts by mass, multifunctional acrylate (trade name: M-315, manufactured by Toa Synthesis Corporation, curable resin) 20 parts by mass, acrylic phosphate Rate (trade name: PM-2, manufactured by Nippon Explosives Co., Ltd., curable resin) 2 parts by mass, dilauroyl peroxide (trade name: Peroyl L, manufactured by Nichiyu Corporation, hardener) 5 parts by mass, Ni metal particles (Parrainco) Production, average particle diameter: 4 µm, electroconductive particle) 2 parts by mass and toluene were mixed to obtain an anisotropic conductive composition having a solid content of 50% by mass.

The obtained anisotropic conductive composition was applied onto a 50 µm-thick PET (polyethylene terephthalate) film so that the average thickness after drying was 20 µm, and dried at 80° C. for 10 minutes to prepare an anisotropic conductive film.

<Presence or absence of protrusion>

The PET film on which the anisotropic conductive film was formed was slit to a width of 2.0 mm x a length of 100 m, wound up on a reel having a core diameter of 2.54 mm with a tension of 0.2 N/mm 2, and allowed to stand at room temperature for 1 day. It evaluated by the following evaluation criteria by external appearance observation. Table 1 shows the results.

[Evaluation standard]

(Double-circle): Protrusion of an anisotropic conductive film is not confirmed.

○: There is protrusion of the anisotropic conductive film, but less than 0.5 layer on average

△: Protrusion of the anisotropic conductive film is 0.5 layer or more and less than 1.0 layer on average

X: Protrusion of the anisotropic conductive film is an average of 1.0 or more layers

In addition, the average number of protruding layers represents the average number of protruding layers, and the number of protruding protrusions on the reel was calculated by dividing the number of protruding layers by the number of layers when wound. The smaller the average number of protruding layers is, the less protruding is, indicating superiority. For example, if the number of floors is 10 and there are 10 protruding points, the average number of protruding layers is 1.0, and if the number of layers is 10 and protruding is 5 points, The average number of layers is 0.5 layers.

<Preparation of conjugate and evaluation of conjugate>

A conjugated body was produced by the following method, and evaluation shown below was performed. Table 1 shows the results.

As the second electronic component, a printed wiring board [0.4 mm pitch (line/space = 0.2 mm/0.2 mm), copper pattern thickness 35 µm, nickel/gold plating treatment, substrate thickness 1.0 mm] was used.

As the first electronic component, a flexible printed circuit board [0.4 mm pitch (line/space = 0.2 mm/0.2 mm), polyimide thickness 25 µm, copper pattern thickness 12 µm, nickel/gold plating treatment] was used.

On the terminal of the second electronic component, the anisotropic conductive film (film width 2.0 mm) obtained above was disposed. Subsequently, the first electronic component was disposed on the anisotropic conductive film. Subsequently, through a buffer material (silicon rubber, thickness 0.2 mm), the first electronic component is heated and pressurized by a heating tool (width 2.0 mm) at 130°C for 4 MPa for 5 seconds, thereby forming Got it.

<<conduction resistance>>

The initial resistance value of the obtained bonded body was measured by the following method and evaluated.

Using a digital multimeter (article number: digital multimeter 34401A, manufactured by Agilent Corporation), the resistance value when a current of 1 mA was passed through the 4-terminal method was measured. The resistance value was measured for 30 channels, and the maximum resistance value was evaluated by the following evaluation criteria. Table 1 shows the results.

[Evaluation standard]

○: Resistance value is less than 2 Ω

△: Resistance value is 2 Ω or more and less than 10 Ω

×: resistance value is 10 Ω or more

<<Appearance (conductive particle crushed state)>>

With respect to the conductive particles contained in the anisotropic conductive film, the diameter of the conductive particles before anisotropic conductive connection is measured using a metal microscope (Olympus Corporation make, brand name: MX51), and then the width of the conductive particles after anisotropic conductive connection The length of the direction was measured, and the crushed state of the electroconductive particle was calculated|required from the following formula (1).

The crushed state of the electroconductive particle (%) = (length in the width direction of the electroconductive particle after anisotropic electroconductive connection/diameter of electroconductive particle before anisotropic electroconductive connection) x 100. Equation (1)

In addition, the length in the width direction of the electroconductive particle after anisotropically conductive connection was made into the length of the said electroconductive particle in the direction (connection direction) orthogonal to the 1st electronic component and the 2nd electronic component at the time of anisotropically conductive connection.

And, with respect to 100 connection points to which the terminals of the first electronic component and the terminals of the second electronic component are connected, the crushing state of all the conductive particles is measured, and the crushing state exceeds 50% (the above formula ( 1) The electroconductive particle obtained by "the crushed state (%) of the electroconductive particle becomes less than 50%" was used as the crushed electroconductive particle, the ratio was calculated|required, and it evaluated by the following evaluation criteria.

[Evaluation standard]

◎: 90% or more of the number of crushed conductive particles

(Circle): The number of crushed electroconductive particles is 80% or more and less than 90%

△: The number of crushed electroconductive particles is 50% or more and less than 80%

×: the number of crushed electroconductive particles is less than 50%

(Examples 2 to 12, Comparative Examples 1 to 3)

In Example 1, in the same manner as in Example 1, except that the composition and compounding amount (same as the content) of the film-forming resin, curable resin, and curing agent were changed to the composition and compounding amount shown in Tables 1 to 3 , An anisotropic conductive film was produced, and it was provided for evaluation. The results are shown in Tables 1 to 3.

The unit of the blending amount (content) in Tables 1 to 3 is parts by mass.

The blending amount (content) is the blending amount (content) excluding the solvent component when the product contains a solvent.

The details of the various product names described in Tables 1 to 3 are as follows.

SP-185: Crystalline polyester resin, manufactured by Nippon Synthetic Chemical Industry Co., Ltd., number average molecular weight 20,000, melting point 95°C

Aaron Melt PES-111: Crystalline polyester resin, manufactured by Toa Synthesis, Inc., melting point 110°C, glass transition temperature 0°C

UR-1400: Amorphous polyester urethane resin, manufactured by Toyobo Corporation, number average molecular weight 40,000, glass transition temperature 83 ℃

YP-50: Amorphous phenoxy resin, manufactured by Shinnittetsu Chemical Co., Ltd., number average molecular weight 10,000, glass transition temperature 100 ℃

Nippolan 5196: amorphous polyurethane resin, manufactured by Nippon Polyurethane Industrial Co., Ltd., number average molecular weight 20,000, glass transition temperature -27 ℃

M-1600: Urethane acrylate, manufactured by Toa Synthesis Co., Ltd.

M-315: Multifunctional acrylate, manufactured by Toa Synthesis Co., Ltd.

PM-2: Phosphoric acid acrylate, manufactured by Nippon Explosives Co., Ltd.

Alicyclic epoxy resin: CEL2021P, manufactured by Daicel Co., Ltd.

Peroyl L: Dilauroyl peroxide, manufactured by Nichiyu Corporation

Cationic hardener: SI-60L, manufactured by Sanshin Chemical Industry Co., Ltd.

Ni metal particle: electroconductive particle, manufactured by Bahrainco, average particle diameter 4 µm

In Examples 1 to 12, conduction resistance and appearance (particle crushing) were good even in the case of compression bonding at a low temperature of 130°C. Moreover, even when winding up a reel, there was little protrusion and it was favorable.

When the mass ratio of the crystalline resin and the amorphous resin (crystalline resin: amorphous resin) is 90:10 to 20:80, conduction resistance and appearance (particle crushing) become better, and 60:40 to 40:60 Also, the protrusion was further reduced (see, for example, Examples 1 to 7).

As the amorphous resin, the amorphous polyester urethane resin was superior to the amorphous phenoxy resin and the amorphous polyurethane resin in terms of appearance (particle crushing) and protrusion (e.g., Examples 3, 8, and 9).

The melting point of the crystalline resin was superior in terms of appearance (particle crushing) than in the case where the one in the range of 90°C to 105°C exceeded 105°C (see, for example, Examples 3 and 10).

As the curable resin, the acrylate was superior to the epoxy resin in terms of appearance (particle crushing) and protrusion (see, for example, Examples 3 and 11).

The content of the curable resin was superior in appearance (particle crushing) and protrusion compared to the case in which the content in the range of 40 parts by mass to 55 parts by mass exceeded 55 parts by mass with respect to 100 parts by mass of the anisotropic conductive film ( See, for example, Examples 3, and 12).

In Comparative Example 1 not containing a crystalline resin, the decrease in melt viscosity during compression was slow, and the conduction resistance and appearance (particle crushing) were insufficient.

In the case of not containing an amorphous resin, the bulging test resulted in a bad result (refer to Comparative Example 3).

The anisotropic conductive film of the present invention can obtain sufficient conduction resistance and crushing of conductive particles in connection at low temperature, and prevents the anisotropic conductive film from protruding from the end when the anisotropic conductive film is wound on a reel. Since it can, it can be used suitably for connection at low temperature.

Claims (10)

An anisotropic conductive film for anisotropically conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
It contains a film-forming resin, a curable resin, a curing agent, and conductive particles,
The anisotropic conductive film, wherein the film-forming resin contains a crystalline resin and an amorphous resin having a melting point of 90°C to 110°C. The method of claim 1,
The anisotropic conductive film in which the mass ratio of the crystalline resin and the amorphous resin (the crystalline resin: the amorphous resin) is 90:10 to 10:90. The method of claim 1,
The crystalline resin is a crystalline polyester resin,
The anisotropic conductive film, wherein the amorphous resin is at least any of an amorphous polyester urethane resin, an amorphous phenoxy resin, and an amorphous polyurethane resin. The method of claim 1,
The anisotropic conductive film in which the amorphous resin is an amorphous polyester urethane resin. The method of claim 1,
The anisotropic conductive film having a mass ratio of the crystalline resin and the amorphous resin (crystalline resin: amorphous resin) is 90:10 to 40:60. The method of claim 1,
The anisotropic conductive film in which the amorphous resin is at least any of an amorphous polyester urethane resin and an amorphous polyurethane resin. The method of claim 1,
An anisotropic conductive film having less than one layer of protrusion by winding 100 m or more on a reel. As a connection method for anisotropically conductive connection between a terminal of a first electronic component and a terminal of a second electronic component,
A first arrangement step of disposing the anisotropic conductive film according to any one of claims 1 to 7 on the terminal of the second electronic component, and
A second arrangement step of disposing the first electronic component on the anisotropic conductive film so that a terminal of the first electronic component is in contact with the anisotropic conductive film,
And a heating and pressing step of heating and pressing the first electronic component by a heating and pressing member. A first electronic component having a terminal, a second electronic component having a terminal, and the terminal of the first electronic component and the terminal of the second electronic component are electrically connected between the first electronic component and the second electronic component. Having a cured product of an anisotropic conductive film to be connected by
The bonded body characterized in that the said anisotropic conductive film is an anisotropic conductive film in any one of Claims 1-7. The reel body which wound up the anisotropic conductive film in any one of Claims 1-7.