WO2015014072A1 - 一种电致发光显示屏及其制备方法、显示装置 - Google Patents

一种电致发光显示屏及其制备方法、显示装置 Download PDF

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Publication number
WO2015014072A1
WO2015014072A1 PCT/CN2013/089348 CN2013089348W WO2015014072A1 WO 2015014072 A1 WO2015014072 A1 WO 2015014072A1 CN 2013089348 W CN2013089348 W CN 2013089348W WO 2015014072 A1 WO2015014072 A1 WO 2015014072A1
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Prior art keywords
region
package substrate
glass
light
laser
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PCT/CN2013/089348
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English (en)
French (fr)
Inventor
陈俊生
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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BOE Technology Group Co Ltd
Ordos Yuansheng Optoelectronics Co Ltd
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Priority to US14/363,258 priority Critical patent/US9439248B2/en
Publication of WO2015014072A1 publication Critical patent/WO2015014072A1/zh
Anticipated expiration legal-status Critical
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/12—Light sources with substantially two-dimensional [2D] radiating surfaces
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants

Definitions

  • Electroluminescent display screen preparation method thereof, and display device
  • the present invention relates to the field of display technologies, and in particular, to an electroluminescent display screen, a method for fabricating the same, and a display device.
  • An OLED (Organic Light Emitting Diode) display is a self-luminous display. Compared with an LCD (liquid crystal display), an OLED display does not require a backlight, so the OLED display is lighter and thinner. With high brightness, low power consumption, wide viewing angle, high response speed, wide operating temperature range, etc., it is increasingly used in various high performance display fields.
  • the best packaging method for OLED is glass glue welding method, which has very good sealing performance, adhesive strength, and is suitable for mass production process conditions.
  • the structure of the finished mobile phone includes: back plate 11, glass glue 12, light emitting layer 13, package substrate 14, mobile phone black side 15 and cover glass 16 from bottom to top.
  • the existing glass glue welding method needs to use a mask 17 to shield the laser 18 to be melted by laser irradiation at the position where the glass glue is formed, to reach the back sheet and the package.
  • the purpose of the substrate package is to prevent damage to the area other than the glass paste by the laser.
  • This type of packaging requires control of the accuracy of the mask 17 and the alignment accuracy of the mask and the package substrate, which increases the requirements for the process, resulting in increased cost and reduced throughput.
  • the embodiment of the invention provides an electroluminescent display screen and a preparation method thereof, and an electroluminescence display device, which is used for realizing the illumination of the laser by the electroluminescence display screen without using a mask plate, which simplifies the electricity.
  • the production process of the illuminating display improves production efficiency and reduces production costs.
  • An electroluminescent display screen includes a backplane, a package substrate, and a light emitting layer and a glass paste disposed between the backplane and the package substrate, and is further included in the package a light shielding layer formed on a side of the substrate facing the back sheet for shielding the glass glue from the outer surface of the glass paste.
  • the invention forms a light-shielding layer for shielding the outer region of the glass glue when the glass substrate is irradiated with laser light on the side of the package substrate facing the back plate, so that the electroluminescent display screen can shield the laser light by itself, and the mask is omitted.
  • the use of the board reduces the process requirements, reduces costs and increases productivity.
  • the color of the light shielding layer is black, and the black material has the function of blocking the laser light, so that the light shielding layer can block the area outside the glass glue when the laser irradiates the glass glue, so that the light is electrically
  • the illuminating display can block the laser irradiation by itself, eliminating the use of the reticle, reducing the process requirements, reducing the cost and increasing the production capacity.
  • the material of the light shielding layer is a metal material, carbon black or titanium black, so that the light shielding layer can block the area outside the glass glue when the laser irradiates the glass glue, so that the electroluminescence display
  • the screen can block the laser irradiation by itself, eliminating the use of the mask, reducing the process requirements, reducing the cost and increasing the production capacity.
  • the metal material is an oxide of aluminum, manganese, chromium, chromium or a nitride of chromium, so that the light shielding layer can block the area outside the glass glue when the laser irradiates the glass glue, so that The electroluminescent display can block the laser irradiation by itself, eliminating the use of the mask, reducing the process requirements, reducing costs and increasing productivity.
  • the light shielding layer comprises a first annular region and a second annular region, wherein the glass glue surrounds the first annular region, and the second annular region surrounds the glass glue.
  • the distance between the outermost side of the first annular region and the innermost side of the second annular region ranges from 0,6 mm to 1.2 mm, such that the first annular region and the second The distance between the annular regions is greater than the coating width of the glass glue, which facilitates the packaging of the backplane and the package substrate.
  • the distance between the innermost side of the first annular region and the outermost side of the second annular region is the sum of the beam width of the laser and the alignment accuracy of the laser.
  • An electroluminescent display device includes the electroluminescent display screen described above.
  • a method for fabricating an electroluminescent display screen according to an embodiment of the present invention comprising: forming a light-emitting layer on a backplane;
  • the glass paste is irradiated with a laser from a side of the package substrate away from the back sheet, and the package substrate and the back sheet are packaged.
  • the electroluminescent display screen can block the laser light by forming a light shielding layer for shielding the area outside the glass glue when the glass substrate is irradiated with laser light on the side of the package substrate facing the back plate. Irradiation eliminates the need for masks, reduces process requirements, reduces costs, and increases productivity.
  • a light shielding layer for shielding a region other than the glass glue when the glass is irradiated by the laser is formed on a side of the package substrate facing the back plate, including: a side of the package substrate facing the back plate
  • a light-shielding layer for shielding a region other than the glass paste when the glass is irradiated by the laser is formed.
  • the electroluminescent display can block the illumination of the laser by itself, eliminating the use of the mask, reducing the requirements of the process, reducing the cost and increasing the productivity.
  • the masking process forms a light-shielding layer for shielding the area outside the glass glue when the glass paste is laser-coated on the side of the package substrate facing the backplane, and specifically includes:
  • Coating a photoresist on the shading layer material exposing and developing the photoresist to form a first photoresist removal region at a position corresponding to the glass paste on the package substrate, and forming a first photolithography on the inner side of the glass paste region a glue retention region, forming a second photoresist retention region outside the glass paste region, and a second photoresist removal region inside the first photoresist retention region;
  • FIG. 1 is a schematic diagram of a package structure of a finished mobile phone in the prior art
  • FIG. 2 is a schematic view showing a process of packaging a finished mobile phone in the prior art
  • FIG. 3 is a schematic cross-sectional view of an electroluminescent display panel according to an embodiment of the present invention
  • FIG. 4 is a schematic plan view showing an electroluminescent display according to an embodiment of the present invention
  • a schematic diagram of a process for preparing a display screen
  • FIG. 6 is a schematic flow chart of a process for preparing a shading layer according to an embodiment of the present invention.
  • Embodiments of the present invention provide an electroluminescent display screen, a method for fabricating the same, and an electroluminescent display device, which are used to realize that the electroluminescence display screen can block the illumination of the laser by itself, thereby eliminating the use of the mask. Reduced process requirements, reduced costs, and increased productivity.
  • the embodiment of the invention provides an electroluminescent display screen, which may be an organic electroluminescence display screen or an inorganic electroluminescence display screen, which is not specifically limited in the present invention.
  • an embodiment of the present invention provides an electroluminescent display, which can be seen from the bottom to the top: The back plate 31, the glass paste 32, the light-emitting layer 33, the first annular region 34 of the light-shielding layer, the second annular region 35 of the light-shielding layer, and the package substrate 36.
  • the backplane 31 and the package substrate 36 may be the same kind of substrate, or may be substrates of different materials, such as a glass substrate, a quartz substrate, or the like.
  • a thin film transistor and a driving circuit are further disposed between the back plate 31 and the package substrate 36, and the ffi is used to control the display of the electroluminescent display.
  • the light-emitting layer 33 and the glass paste 32 are disposed between the back plate 31 and the package substrate 36, and the light-emitting layer 33 is disposed on a side of the back plate 31 facing the package substrate 36, and may not be etched with the package substrate 36.
  • the glass glue 32 is in contact with both the back plate 31 and the package substrate 36 for packaging the two;
  • the light shielding layer is divided into a first annular region 34 and a second annular region 35, and is disposed on a side of the package substrate 36 facing the back plate 31, and the glass adhesive 32 surrounds the first annular region 34 of the light shielding layer.
  • the second annular region 35 of the layer surrounds the glass glue 32, that is, the first annular region 34 is located inside the glass paste 32, and the second annular region 35 is located outside the glass paste. See FIG. 4 for details.
  • the first annular region 34 can also serve as a black frame on the display cover plate for defining the display region, and forming a light shielding layer on the package substrate 36, in addition to being a barrier layer for laser irradiation. Eliminating the need to set a black frame on the cover of a product such as a mobile phone can simplify the process and save costs in the same day.
  • the ring-shaped area is an annular area formed along the periphery of the package substrate, and may be closed or unclosed, which is not limited by the present invention.
  • each sub-pixel further includes a thin film transistor switching element, an electrode structure, a gate line and a data line, and other film structures connected to the respective sub-pixels.
  • the light-emitting layer 33 may be a red-green-blue light-emitting layer, or may be a white light-emitting layer, or a combination of blue and yellow complementary light-emitting layers.
  • the light shielding layer is used to shield the outer region of the glass paste 32 when the laser is irradiated with the glass paste 32.
  • the outer region of the glass paste 32 refers to the side of the back plate 31 facing the package substrate 36.
  • the region other than the glue 32 may be a partial region or a total region. Since the laser beam irradiation range is limited, it is only necessary to block the periphery of the region of the glass paste 32. Thus, when the glass paste 32 is irradiated by the laser, the light shielding layer blocks the outer region of the glass paste 32, and the back sheet 31 and the package substrate 36 are packaged.
  • the color of the light shielding layer is black
  • the material thereof may be a metal material such as aluminum, manganese or chromium, and the material thereof may also be titanium black or carbon black.
  • the metal material includes not only a metal such as aluminum, manganese, chromium or the like, but also a metal compound such as a metal oxide or a metal nitride such as an oxide of chromium or a nitride of chromium.
  • the first annular region 34 of the light shielding layer and the second annular region of the light shielding layer The distance range M between the domains 35, that is, the distance between the outermost side of the first annular region 34 and the innermost side of the second annular region 35 is 0.6 mm to 1.2 mm, that is, the outermost portion of the first annular region 34
  • the distance between the side edge and the innermost side of the second annular region 35 is not less than the width of the region of the glass glue.
  • the distance N between the innermost side of the first annular region 34 and the outermost side of the second annular region 35 is the sum of the beam width of the laser and the alignment accuracy of the laser, that is, the laser beam can only be allowed in its accuracy.
  • the region of the glass paste 32 or the first annular region 34 and the second annular region 35 are irradiated, that is, the distance range of N as shown in FIG.
  • An electroluminescent display device using the above electroluminescent display panel which may be an organic electroluminescence display device or an inorganic electroluminescence display device, and may be any device for display such as a television, a mobile phone, a computer, a digital camera, or the like. . Since the electroluminescent display device uses the above electroluminescent display panel, the package has high package stability, high reliability, low cost, and high productivity, thereby improving display quality and service life of the electroluminescence display device, and reducing The cost also increases production capacity.
  • the embodiment of the invention further provides a method for preparing an electroluminescent display screen.
  • the method includes:
  • S1 forms a light-emitting layer on the back plate
  • the glass paste is irradiated with a laser from a side of the package substrate away from the back plate, and the package substrate and the back plate are packaged.
  • the above steps are only some steps included in the preparation method of the electroluminescent display screen, and the order is not limited thereto, such as the formation of the glass paste and before the formation of the light shielding layer, in addition to the above.
  • Other steps such as the steps of forming a thin film transistor and a driver circuit, may be included in addition to the steps.
  • the glass paste may be formed in advance on the side of the back sheet facing the package substrate or on the side of the package substrate facing the back sheet.
  • the laser irradiation is performed from the side of the package substrate away from the back plate, and the shielding of the light-shielding layer formed on the package substrate can function as a mask, so that the laser acts only on the pre-set glass paste, so that the package substrate Sealed with the backing plate.
  • the light emitting layer may be a red green blue light emitting layer, or may be a white light emitting layer, or
  • the combination of the blue-blue color and the yellow-yellow color of the complementary light-comprising color light-emitting layer layer combination is not limited by these inventions. .
  • the material quality of the packaged substrate plate may be the same as or different from that of the back plate, and the material quality thereof may be glass. Glass, stone quartz and so on. .
  • a thin film film crystal tube and a driving electric circuit can be disposed between the back plate and the package substrate plate.
  • display display for displaying the display screen for controlling and controlling the electroluminescence. .
  • the side surface is formed to be used for laser beam irradiation to irradiate the glass glass glue.
  • the layer of the opaque layer of the occlusion block including:
  • the surface of the package substrate is formed to be used for laser irradiation to irradiate the glass glue.
  • the area of the outer area outside the glass glue enters the layer of the shading layer that blocks the block. .
  • composition and drawing process art can be regarded as including the structure of the process including the exposure light, the development of the image, the etching process, and the like. It is also possible to assume that it is used for other forms for forming a pattern having a certain shape pattern. .
  • the masking layer of the masking layer is used for shielding the outer region of the glass frit glue when the laser glass is irradiated by the laser light.
  • the specific outer region of the glass frit glue refers to the side of the back plate is removed toward the side of the package substrate substrate. All or part of the area outside the glass-glass glue, due to the limited range of the laser beam irradiation range, therefore only need to be in The perimeter of the area of the glass-glass glue can be blocked by the perimeter of the area. . In this way, in the layer of the light-shielding light layer described in the laser beam irradiated by the laser light, the outer region of the glass-glass glue is covered.
  • the shielding block is arranged to carry out the sealing and packaging of the backing board and the package base substrate. .
  • the far-away structure drawing process is formed on the side of the package substrate surface facing the back plate to form a laser for laser irradiation.
  • the light-shielding glass-glass glue is used to shield the outer layer of the glass-glass glue from the outer layer, and the specific body package includes:
  • the coating cloth is provided with a mask material material material 3377, and the material material thereof may be a metal metal material material, for example, such as aluminum aluminum, manganese manganese, chromium chromium, chromium chromium
  • the oxynitride or chrome-chromium nitride material may also be titanium titanium black or carbon black.
  • a lithographic lithographic adhesive 3388 on the masking material material 3377 of the opaque pattern, and subjecting the photolithographic squeegee 3388 to exposure light exposure and development imaging in order to form a first photolithographic glue in the position of the corresponding glass substrate glue 3322 on the package substrate substrate 3366 to remove the de-intersection area 338811, in the glass
  • the inner side of the area of the glass glue is formed into a first first photolithographic glue-bonding retention area 338822, and a second second photolithography is formed on the outer side of the glass-glass adhesive area.
  • the engraved rubber retaining area 338833, and the first second photolithographic adhesive is used to protect the inner side of the retention area to remove the de-divided area 338844;
  • the photo-etching photoresist is used to remove the masking layer material material material 3377 of the removing region, and then etching and etching is performed, and then peeling off the photolithographic photoresist, and then obtaining
  • the second ring-shaped region 3344 and the second and second sides located on the outer side of the glass-glass rubber region are located on the inner side of the glass-glass adhesive region. Ring shape
  • the first first photolithographic lithographic glue removes the area of the 338811 corresponding to the area formed into the glass glazing glue, and the opaque layer layer here.
  • the laser it is convenient for the laser to irradiate the glass glue to seal the package substrate and the back plate;
  • the second photoresist removal area 384 corresponds to the display area, and a light-emitting layer is formed in the display area for display on the electroluminescent display screen,
  • the laser beam has a limited illumination range and is not exposed to laser light, so it is not necessary to form a light-shielding layer.
  • the distance M between the first annular region 34 of the light shielding layer and the second annular region 35 of the light shielding layer is the outermost side of the first annular region 34 and the most outermost region of the second annular region 35
  • the distance between the inner side edges is 0.6 mm to 1.2 mm, that is, the distance between the first annular region 34 of the light shielding layer and the second annular region 35 of the light shielding layer is not less than the formation area of the glass glue.
  • the distance N between the innermost side of the first annular region 34 and the outermost side of the second annular region 35 is the sum of the beam width of the laser and the alignment accuracy of the laser, that is, the laser beam can only be allowed in its accuracy.
  • the area of the glass glue or the first annular area 34 and the second annular area 35 are irradiated, that is, the distance range of N shown in FIG.
  • the inner side of the glass glue area refers to the side close to the display area
  • the outer side of the glass glue area refers to the side close to the edge area of the substrate.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

一种电致发光显示屏及其制备方法、显示装置，该电致发光显示屏包括：背板（31），封装基板（36），以及设置在背板（31）与封装基板（36）之间的发光层（33）、玻璃胶（32），在封装基板（36）上朝向背板（31）一侧还包括用于激光照射玻璃胶（32）时对玻璃胶（32）之外区域进行遮挡的遮光图层（34，35）。该电致发光显示屏能够自行遮挡激光的照射，省去掩膜板的使用，减少了制程的要求，降低了生产成本，提高了产能。

Description

种电致发光显示屏及其制备方法、 显示装置
本发明涉及显示技术领域，尤其涉及一种电致发光显示屏及其制备方法、 显不装置。
OLED ( Organic Light Emitting Diode, 有机发光二极管） 显示器是一种 自发光显示器， 与 LCD (liquid crystal display, 液晶显示器） 相比， OLED显 示器不需要背光源， 因此 OLED显示器更为轻薄， 此外 OLED显示器还具有 高亮度、 低功耗、 宽视角、 高响应速度、 宽使用温度范围等优点， 因而越来 越多地被应用于各种高性能显示领域当中。
目前用于 OLED最佳的封装方式为玻璃胶熔接方式， 其具有非常好的密 封性能， 黏着强度， 适合大量生产的工艺条件。
以成品手机为例说明一下现有的玻璃胶封装技术。 参见图 1 , 成品手机 的结构从下至上包括： 背板 11 , 玻璃胶 12， 发光层 13， 封装基板 14, 手机 黑边 15以及盖板玻璃 16。参见图 2， 现有的玻璃胶熔接方式需要使用掩膜板 (Mask) 17对镭射激光（Laser) 18进行遮挡， 以在形成玻璃胶的位置通过 激光照射使其瑢融， 达到背板和封装基板封装的目的， 同时防止激光对玻璃 胶之外的区域造成损坏。此种封装方式需要控制掩膜板 17的精度以及掩膜板 与封装基板的对位精度， 对于制程的要求增加， 导致成本提高， 产能降低。
本发明实施例提供了一种电致发光显示屏及其制备方法， 以及一种电致 发光显示装置， 用以实现电致发光显示屏能够自行遮挡激光的照射， 无需掩 膜板， 简化了电致发光显示屏的制作流程， 提高了生产效率， 降低了生产成 本。
本发明实施例提供的一种电致发光显示屏， 包括背板、 封装基板、 以及 设置在所述背板与所述封装基板之间的发光层、 玻璃胶， 还包括在所述封装 基板面向所述背板的一侧形成的用于激光照射所述玻璃胶时对所述玻璃胶之 外区域进行遮挡的遮光图层。
本发明通过在封装基板面向背板的一侧形成有用于激光照射玻璃胶时对 玻璃胶之外区域进行遮挡的遮光图层， 使电致发光显示屏能够自行遮挡激光 的照射， 省去掩膜板的使用， 减少了制程的要求， 降低了成本， 提高了产能。
较佳地， 所述遮光图层的颜色为黑色， 黑色材料具有遮挡激光的功能， 这样，所述遮光图层便可以在激光照射玻璃胶时对玻璃胶之外区域迸行遮挡， 使电致发光显示屏能够自行遮挡激光的照射， 省去掩膜板的使用， 减少了制 程的要求， 降低了成本， 提高了产能。
较佳地， 所述遮光图层的材料为金属材料、 炭黑或钛黑， 这样， 所述遮 光图层便可以在激光照射玻璃胶时对玻璃胶之外区域进行遮挡， 使电致发光 显示屏能够自行遮挡激光的照射， 省去掩膜板的使用， 减少了制程的要求， 降低了成本， 提高了产能。
较佳地， 所述金属材料为铝、 锰、 铬、 铬的氧化物或铬的氮化物， 这样， 所述遮光图层便可以在激光照射玻璃胶时对玻璃胶之外区域进行遮挡， 使电 致发光显示屏能够自行遮挡激光的照射， 省去掩膜板的使用， 减少了制程的 要求， 降低了成本， 提高了产能。
较佳地， 所述的遮光图层包括第一环形区域和第二环形区域， 其中， 所 述玻璃胶包围所述第一环形区域， 所述第二环形区域包围所述玻璃胶。
较佳地， 所述第一环形区域的最外侧边和所述第二环形区域的最内侧边 之间的距离范围为 0,6毫米至 1.2毫米， 这样， 第一环形区域与第二环形区域 之间的距离大于玻璃胶涂布宽度， 便于进行背板与封装基板的封装。
较佳地， 所述第一环形区域的最内侧边和所述第二环形区域的最外侧的 边之间的距离为激光的光束宽度与激光的对位精度之和。
本发明实施例提供的一种电致发光显示装置， 包括上述的电致发光显示 屏。
本发明实施例提供的一种电致发光显示屏的制备方法， 该方法包括： 在背板上形成发光层；
在封装基板面向背板的一侧形成用于激光照射玻璃胶时对玻璃胶之外区 域迸行遮挡的遮光图层；
在背板面向封装基板的一侧或者在封装基板面向背板的一侧上形成玻璃 胶；
从封装基板远离背板的一侧通过激光对所述玻璃胶进行照射， 将封装基 板与背板进行封装。
从上述制备方法可以看出， 通过在封装基板面向背板的一侧形成有用于 激光照射玻璃胶时对玻璃胶之外区域进行遮挡的遮光图层， 使电致发光显示 屏能够自行遮挡激光的照射， 省去掩膜板的使用， 减少了制程的要求， 降低 了成本， 提高了产能。
较佳地， 在封装基板面向背板的一侧形成用于激光照射玻璃胶时对玻璃 胶之外区域迸行遮挡的遮光图层， 包括： 遥过构图工艺在封装基板面向背板 的一侧形成用于激光照射玻璃胶时对玻璃胶之外区域进行遮挡的遮光图层。
这样使得电致发光显示屏能够自行遮挡激光的照射，省去掩膜板的使用， 减少了制程的要求， 降低了成本， 提高了产能。
较佳地， 所述通过构图工艺在封装基板面向背板的一侧形成用于激光照 射玻璃胶时对玻璃胶之外区域进行遮挡的遮光图层， 具体包括：
在封装基板面向背板的一侧涂布遮光图层材料；
在遮光图层材料上涂布光刻胶， 并对光刻胶进行曝光、 显影， 以在封装 基板对应玻璃胶的位置形成第一光刻胶去除区， 在玻璃胶区域内侧形成第一 光刻胶保留区， 在玻璃胶区域外侧形成第二光刻胶保留区， 以及第一光刻胶 保留区内侧的第二光刻胶去除区；
对光刻胶去除区的遮光图层材料进行刻蚀以及剥离光刻胶， 得到由位于 玻璃胶区域内侧的第一环形区域和位于玻璃胶区域外侧的第二环形区域构成 的所述遮光图层。
这样， 便形成了用于激光照射玻璃胶 ^对玻璃胶之外区域进行遮挡的遮 光图层， 使电致发光显示屏能够自行遮挡激光的照射， 省去掩膜板的使用， 减少了制程的要求， 降低了成本， 提高了产能。 图 1为现有技术中成品手机封装结构示意图；
图 2为现有技术中成品手机封装工艺示意图；
图 3为本发明实施例提供的电致发光显示屏的剖面结构示意图； 图 4为本发明实施例提供的电致发光显示屏的平面结构示意图； 图 5为本发明实施例提供的电致发光显示屏的制备方法流程示意图; 图 6为本发明实施例提供的遮光图层制备工艺流程示意图。
本发明实施例提供了一种电致发光显示屏及其制备方法、 以及一种电致 发光显示装置， 用以实现电致发光显示屏能够自行遮挡激光的照射， 省去掩 膜板的使用， 减少了制程的要求， 降低了成本， 提高了产能。
下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行 清楚、 完整地描述， 显然， 所描述的实施例仅仅是本发明一部分实施例， 而 不是全部的实施例。 基于本发明中的实施例， 本领域普通技术人员在没有做 出创造性劳动前提下所获得的所有其他实施例， 都属于本发明保护的范围。
本发明实施例提供了一种电致发光显示屏， 所述的电致发光显示屏可以 是有机电致发光显示屏， 还可以是无机电致发光显示屏， 本发明不作具体限 定。
下面以有机电致发光显示屏为例说明具体实施例， 如图 3所示， 本发明 实施例提供了一种电致发光显示屏， 可以看出所述电致发光显示屏从下至上 包括： 背板 31， 玻璃胶 32 , 发光层 33 , 遮光图层的第一环形区域 34 , 遮光 图层的第二环形区域 35， 封装基板 36。
其中， 所述背板 31和所述封装基板 36可以为同种基板， 也可以为不同 材质的基板， 如可以为玻璃基板、 石英基板等。
较佳地，在背板 31与封装基板 36之间还可以有薄膜晶体管和驱动电路, ffi于控制电致发光显示屏的显示。
具体的， 发光层 33与玻璃胶 32设置在背板 31与封装基板 36之间， 发 光层 33设置在背板 31朝向封装基板 36的一侧之上， 并且可以不与封装基 板 36接蝕， 玻璃胶 32与背板 31和封装基板 36都接触， 用于将两者封装； 所述的遮光图层分为第一环形区域 34和第二环形区域 35 , 并设置在封装基 板 36面向背板 31的一侧， 玻璃胶 32包围遮光图层的第一环形区域 34， 遮 光图层的第二环形区域 35包围玻璃胶 32， 即所述第一环形区域 34位于玻璃 胶 32的内侧, 所述第二环形区域 35位于玻璃胶外侧， 具体可参见图 4。 其 中， 所述第一环形区域 34在作为激光照射的阻挡层之外， 还可以同时作为显 示屏盖板上的黑框，用于界定显示区域，通过在封装基板 36上形成遮光图层， 可以省去在产品如手机的盖板上设置黑框的步骤， 可以简化工艺， 同日寸节省 成本。 其中， 所述环形区域是指沿封装基板周边形成的环形区域， 可以为闭 合的， 也可以为不闭合的， 对此本发明不做限定。
需要说明的是， 本发明实施例附图为了示意方便， 仅在电致发光显示屏 的显示区域示意了三个子像素的发光层， 如可以为红绿蓝≡个子像素的发光 层。 可以理解的是， 在实际的电致发光显示屏中包括多个子像素， 还可以为 除红绿蓝颜色之外的其他颜色的子像素， 以及形成不同的排布结构， 这些子 像素构成像素单元， 同时每个子像素还包括与各个子像素连接的薄膜晶体管 开关元件、 电极结构、 栅线和数据线以及其他膜层结构， 这些结构是与现有 技术相同的， 此处不再赘述。
其中， 所述的发光层 33可以为红绿蓝发光层， 还可以为白光发光层， 或 者蓝色和黄色这种互补色的发光层组合。
所述的遮光图层用于在激光照射玻璃胶 32时对玻璃胶 32之外区域进行 遮挡， 具体的， 所述玻璃胶 32之外区域是指背板 31朝向封装基板 36的一侧 除玻璃胶 32之外的区域， 可以为部分区域， 也可以为全部区域， 由于激光束 照射范围有限， 因此仅需要在玻璃胶 32的区域的周边进行遮挡即可。 这样， 遥过激光照射玻璃胶 32时所述的遮光图层对玻璃胶 32之外区域进行遮挡， 使背板 31与封装基板 36迸行封装。
其中， 所述遮光图层的颜色为黑色， 其材料可以为金属材料， 例如铝、 锰、 铬， 其材料也可以为钛黑或炭黑。 需要说明的是， 所述金属材料不仅包 括金属如铝、 锰、 铬等， 还可以包括金属氧化物、 金属氮化物等金属化合物, 如铬的氧化物或铬的氮化物。
具体的，所述遮光图层的第一环形区域 34和所述遮光图层的第二环形区 域 35之间的距离范围 M即第一环形区域 34的最外侧边与第二环形区域 35 的最内侧边之间的距离为 0.6毫米至 1.2毫米， 即第一环形区域 34的最外侧 边与第二环形区域 35的最内侧边之间的距离不小于玻璃胶的区域宽度。所述 第一环形区 34最内侧边和第二环形区域 35最外侧边之间的距离 N为激光的 光束宽度与激光的对位精度之和，即激光束仅能在其精度允许的误差范围内， 照射到玻璃胶 32的区域或者第一环形区域 34和第二环形区域 35上，即如图 3所示 N的距离范围。
一种使用了上述电致发光显示屏的电致发光显示装置， 可以为有机电致 发光显示装置或者无机电致发光显示装置， 可以为电视、 手机、 电脑、 数码 相机等任何用于显示的装置。 由于该电致发光显示装置使用了上述电致发光 显示屏， 其封装稳定性强、 可靠性高、 成本低、 产能高， 因此能提高电致发 光显示装置的显示质量和使用寿命， 并且能降低成本同时提高产能。
本发明实施例还提供了一种电致发光显示屏的制备方法， 参见图 5 , 该 方法包括：
S1 在背板上形成发光层；
512、在封装基板面向背板的一侧形成用于激光照射玻璃胶时对玻璃胶之 外区域进行遮挡的遮光图层；
513、在背板面向封装基板的一侧或者在封装基板面向背板的一侧上形成
514、从封装基板远离背板的一侧通过激光对所述玻璃胶进行照射， 将封 装基板与背板进行封装。
需要说明的是， 上述各步骤仅是说明一种电致发光显示屏的制备方法中 包括的一些步骤， 其顺序不限于此， 如玻璃胶的形成和可以在遮光图层的形 成之前， 除上述步骤以外还可以包括其他步骤， 如形成薄膜晶体管和驱动电 路的步骤。 玻璃胶可以预先形成在背板面向封装基板的一侧或者在封装基板 面向背板的一侧。 从封装基板远离背板的一侧进行激光照射， 通过封装基板 上预先形成的遮光图层的遮挡， 可以起到掩膜板的作用， 使得激光仅作用于 预先设置的玻璃胶上， 使得封装基板和背板进行封接。
其中， 所述的发光层可以为红绿蓝发光层， 还可以为白光发光层， 或者 蓝蓝色色和和黄黄色色这这种种互互补补色色的的发发光光层层组组合合，， 这这些些本本发发明明不不做做限限定定。。
其其中中，， 所所述述封封装装基基板板的的材材质质可可以以与与背背板板相相同同或或不不同同，， 其其材材质质可可以以为为玻玻璃璃、、 石石英英等等。。
较较佳佳地地，， 在在背背板板与与封封装装基基板板之之间间还还可可以以设设置置薄薄膜膜晶晶体体管管和和驱驱动动电电路路，， 用用 于于控控制制电电致致发发光光显显示示屏屏的的显显示示。。
其其中中，， 在在封封装装基基板板面面向向背背板板的的一一侧侧形形成成用用于于激激光光照照射射玻玻璃璃胶胶时时对对玻玻璃璃胶胶 之之外外区区域域进进行行遮遮挡挡的的遮遮光光图图层层，， 包包括括：：
通通过过构构图图工工艺艺在在封封装装基基板板面面向向背背板板的的一一侧侧形形成成用用于于激激光光照照射射玻玻璃璃胶胶时时对对 玻玻璃璃胶胶之之外外区区域域进进行行遮遮挡挡的的遮遮光光图图层层。。
其其中中，， 所所述述构构图图工工艺艺可可以以为为包包括括曝曝光光、、 显显影影、、 刻刻蚀蚀等等工工序序的的构构图图工工艺艺，， 也也可可以以为为其其他他用用于于形形成成具具有有一一定定形形状状图图案案的的工工艺艺。。 所所述述的的遮遮光光图图层层用用于于在在激激 光光照照射射玻玻璃璃胶胶时时对对玻玻璃璃胶胶之之外外区区域域进进行行遮遮挡挡，， 具具体体的的，， 所所述述玻玻璃璃胶胶之之外外区区域域 是是指指背背板板朝朝向向封封装装基基板板的的一一侧侧除除玻玻璃璃胶胶之之外外的的全全部部或或部部分分区区域域，， 由由于于激激光光束束 照照射射范范围围有有限限，， 因因此此仅仅需需要要在在玻玻璃璃胶胶的的区区域域周周边边进进行行遮遮挡挡即即可可。。 这这样样，， 在在激激 光光照照射射玻玻璃璃胶胶 ^^所所述述的的遮遮光光图图层层对对玻玻璃璃胶胶之之外外区区域域进进行行遮遮挡挡，， 使使背背板板与与封封装装 基基板板进进行行封封装装。。
参参见见图图 66，， 所所述述遥遥过过构构图图工工艺艺在在封封装装基基板板面面向向背背板板的的一一侧侧形形成成用用于于激激光光 照照射射玻玻璃璃胶胶时时对对玻玻璃璃胶胶之之外外区区域域进进行行遮遮挡挡的的遮遮光光图图层层，， 具具体体包包括括：：
在在封封装装基基板板 3366面面向向背背板板 3311的的一一侧侧 （（图图 66所所示示的的封封装装基基板板 3366的的上上表表面面）） 涂涂布布遮遮光光图图层层材材料料 3377，， 其其材材料料可可以以为为金金属属材材料料，， 例例如如铝铝、、 锰锰、、 铬铬、、 铬铬的的氧氧化化 物物或或铬铬的的氮氮化化物物，， 其其材材料料也也可可以以为为钛钛黑黑或或炭炭黑黑。。
在在遮遮光光图图层层材材料料 3377上上涂涂布布光光刻刻胶胶 3388，， 并并对对光光刻刻胶胶 3388进进行行曝曝光光、、 显显影影，， 以以在在封封装装基基板板 3366对对应应玻玻璃璃胶胶 3322的的位位置置形形成成第第一一光光刻刻胶胶去去除除区区 338811，， 在在玻玻璃璃 胶胶区区域域内内侧侧形形成成第第一一光光刻刻胶胶保保留留区区 338822 ,, 在在玻玻璃璃胶胶区区域域外外侧侧形形成成第第二二光光刻刻胶胶 保保留留区区 338833，， 以以及及第第一一光光刻刻胶胶保保留留区区内内侧侧的的第第二二光光刻刻胶胶去去除除区区 338844;;
对对光光刻刻胶胶去去除除区区的的遮遮光光图图层层材材料料 3377进进行行刻刻蚀蚀，， 之之后后剥剥离离光光刻刻胶胶，， 得得到到由由 位位于于玻玻璃璃胶胶区区域域内内侧侧的的第第一一环环形形区区域域 3344 和和位位于于玻玻璃璃胶胶区区域域外外侧侧的的第第二二环环形形
Figure imgf000008_0001
其其中中，， 第第一一光光刻刻胶胶去去除除区区 338811对对应应形形成成玻玻璃璃胶胶的的区区域域，， 此此处处的的遮遮光光图图层层 通过刻蚀去除， 便于激光照射玻璃胶进行封装基板和背板的封接； 第二光刻 胶去除区 384对应显示区域， 在显示区域形成发光层， 用于电致发光显示屏 进行显示， 由于激光束照射范围有限， 此处不会受到激光照射， 因此也不需 要形成遮光图层。
其中，所述遮光图层的第一环形区域 34和所述遮光图层的第二环形区域 35之间的距离范围 M即第一环形区域 34的最外侧边与第二环形区域 35的最 内侧边之间的距离为 0.6毫米至 1.2毫米， 即所述遮光图层的第一环形区域 34和所述遮光图层的第二环形区域 35之间的距离不小于玻璃胶的形成区域。 所述第一环形区 34最内侧边和第二环形区域 35最外侧边之间的距离 N为激 光的光束宽度与激光的对位精度之和， 即激光束仅能在其精度允许的误差范 围内， 照射到玻璃胶的区域或者第一环形区域 34和第二环形区域 35上， 即 图 6示出的 N的距离范围。
所述的玻璃胶区域内侧是指靠近显示区域的一侧， 所述的玻璃胶区域外 侧是指靠近基板边缘区域的一侧。
显然， 本领域的技术人员可以对本发明进行各种改动和变型而不脱离本 发明的精神和范围。 这样， 倘若本发明的这些修改和变型属于本发明权利要 求及其等同技术的范围之内， 则本发明也意图包含这些改动和变型在内。

Claims

1. 一种电致发光显示屏， 包括背板、 封装基板、 以及设置在所述背板与 所述封装基板之间的发光层、 玻璃胶， 其特征在于， 还包括在所述封装基板 面向所述背板的一侧形成的用于激光照射所述玻璃胶时对所述玻璃胶之外区 域进行遮挡的遮光图层。
2. 如权利要求 1所述的电致发光显示屏， 其特征在于， 所述遮光图层的 颜色为黑色。
3. 如权利要求 2所述的电致发光显示屏， 其特征在于， 所述遮光图层的 材料为金属材料、 炭黑或钛黑。
4. 如权利要求 3所述的电致发光显示屏， 其特征在于， 所述金属材料为 铝、 锰、 铬、 铬的氧化物或铬的氮化物。
5. 如权利要求 1至 4中任一项所述的电致发光显示屏， 其特征在于， 所 述的遮光图层包括第一环形区域和第二环形区域， 其中， 所述玻璃胶包围所 述第一环形区域， 所述第二环形区域包围所述玻璃胶。
6. 如权利要求 5所述的电致发光显示屏， 其特征在于， 所述第一环形区 域的最外侧边和所述第二环形区域的最内侧边之间的距离范围为 0.6毫米至 1.2毫米。
7. 如权利要求 5或 6所述的电致发光显示屏， 其特征在于， 所述第一环 形区域的最内侧边和所述第二环形区域的最外侧边之间的距离为激光的光束 宽度与激光的对位精度之和。
8. 一种电致发光显示装置， 其特征在于， 包括权利要求 1 7中任一项所 述的电致发光显示屏。
9. 一种电致发光显示屏的制备方法， 其特征在于， 该方法包括： 在背板上形成发光层；
在封装基板面向背板的一侧形成用于激光照射玻璃胶时对玻璃胶之外区 域进行遮挡的遮光图层；
在背板面向封装基板的一侧或者在封装基板面向背板的一侧上形成玻璃 胶； 从封装基板远离背板的一侧通过激光对所述玻璃胶进行照射， 将封装基 板与背板迸行封装。
10. 如权利要求 9所述的方法， 其特征在于， 在封装基板面向背板的一 侧形成用于激光照射玻璃胶时对玻璃胶之外区域进行遮挡的遮光图层，包括： 通过构图工艺在封装基板面向背板的一侧形成用于激光照射玻璃胶时对 玻璃胶之外区域进行遮挡的遮光图层。
11. 如权利要求 10所述的方法， 其特征在于， 所述通过构图工艺在封装 基板面向背板的一侧形成用于激光照射玻璃胶时对玻璃胶之外区域迸行遮挡 的遮光图层， 具体包括：
在封装基板面向背板的一侧涂布遮光图层材料；
在遮光图层材料上涂布光刻胶， 并对光刻胶进行曝光、 显影， 以在封装 基板对应玻璃胶的区域形成第一光刻胶去除区， 在玻璃胶区域内侧形成第一 光刻胶保留区， 在玻璃胶区域外侧形成第二光刻胶保留区， 以及第一光刻胶 保留区内侧的第二光刻胶去除区；
对光刻胶去除区的遮光图层材料进行刻蚀以及剥离光刻胶， 得到由位于 玻璃胶区域内侧的第一环形区域和位于玻璃胶区域外侧的第二环形区域构成 的所述遮光图层。
PCT/CN2013/089348 2013-08-02 2013-12-13 一种电致发光显示屏及其制备方法、显示装置 Ceased WO2015014072A1 (zh)

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