WO2015006907A1 - Procédé de traitement de prétraitement de soudage par résistance et procédé de préparation de carte de circuit imprimé haute fréquence - Google Patents

Procédé de traitement de prétraitement de soudage par résistance et procédé de préparation de carte de circuit imprimé haute fréquence Download PDF

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Publication number
WO2015006907A1
WO2015006907A1 PCT/CN2013/079406 CN2013079406W WO2015006907A1 WO 2015006907 A1 WO2015006907 A1 WO 2015006907A1 CN 2013079406 W CN2013079406 W CN 2013079406W WO 2015006907 A1 WO2015006907 A1 WO 2015006907A1
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WO
WIPO (PCT)
Prior art keywords
treatment
frequency pcb
pcb
solder mask
process according
Prior art date
Application number
PCT/CN2013/079406
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English (en)
Chinese (zh)
Inventor
朱拓
彭卫红
刘�东
宋建远
何淼
Original Assignee
深圳崇达多层线路板有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 深圳崇达多层线路板有限公司 filed Critical 深圳崇达多层线路板有限公司
Priority to PCT/CN2013/079406 priority Critical patent/WO2015006907A1/fr
Priority to CN201380000619.6A priority patent/CN104737629B/zh
Publication of WO2015006907A1 publication Critical patent/WO2015006907A1/fr

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits

Definitions

  • the invention belongs to the technical field of printed circuit board (PCB) preparation, in particular to a high frequency PCB solder mask pre-treatment process and a high frequency PCB preparation process.
  • PCB printed circuit board
  • PCB Printed circuit board Board
  • PCB also known as printed circuit board
  • the printed circuit board provides the following functions in the electronic device: providing mechanical support for fixing and assembling various electronic components such as an integrated circuit; realizing wiring and electrical connection or electrical insulation between various electronic components such as integrated circuits; Required electrical characteristics, such as characteristic impedance; provide solder mask graphics for automatic soldering, and provide identification characters and graphics for component insertion, inspection, and maintenance.
  • the high-frequency material PCB can meet the needs of high-speed communication equipment with high-throughput fast signal transmission. It is mainly used in the power amplifier module of wireless communication equipment, and is one of the development directions of PCB to high-end.
  • the purpose of the embodiments of the present invention is to provide a high-frequency PCB solder mask pre-treatment process and a high-frequency PCB production process, aiming at solving the problem that the high-frequency material PCB is difficult to perform solder resist processing in the prior art.
  • a high-frequency PCB solder mask pre-treatment process includes: a baking sheet, a sand blasting, a plasma activation, and an ultra-roughening treatment step, wherein the baking sheet is treated at a temperature of 140-160 ° C.
  • Another object of the embodiments of the present invention is to provide a high frequency PCB production process, including the pre-soldering treatment process of the present invention, and a solder resist process, wherein the pre-weld process and the solder resist process have an interval of less than 4 hours.
  • Another object of embodiments of the present invention is to provide a PCB board prepared by the high frequency PCB fabrication process of the present invention.
  • the high-frequency PCB solder mask pre-treatment process provided by the embodiment of the invention has the effect of good bonding with the ink for the high-frequency plate and the copper surface, and improves the bonding force between the ink and the high-frequency plate and the copper surface during the solder resist operation.
  • the utility model can effectively prevent the occurrence of the problem that the solder resist ink falls from the high frequency plate, and at the same time reduce the scrapping and improve the product quality.
  • FIG. 2 is a comparison diagram of the copper surface effect of the pre-soldering treatment process and the comparative embodiment process in the first embodiment of the present invention.
  • the whole process of the conventional manufacturing process of the printed circuit board can be divided into two parts: the inner layer manufacturing process and the outer layer manufacturing process.
  • the present invention improves the partial processing process of the outer layer manufacturing process, and provides a high frequency PCB solder mask pre-treatment process.
  • the process comprises a baking sheet treatment, a sand blasting treatment, a plasma activation treatment, and an ultra-roughening treatment step, wherein the baking sheet is treated at a temperature of 140-160 ° C.
  • the baking sheet treatment temperature is 150 °C.
  • the baking sheet processing time is 2.5-3.5 h, and the baking sheet processing time is preferably 3 h.
  • the baking sheet treatment process can effectively remove the hidden moisture in the substrate, and prevent the moisture from affecting the bonding effect between the ink and the board surface.
  • the high frequency PCB material in the embodiment of the present invention may be, but not limited to, polytetrafluoroetylene (PTFE) or polyimide resin (PI).
  • PTFE polytetrafluoroetylene
  • PI polyimide resin
  • polytetrafluoroethylene resin also known as Teflon and Teflon
  • PI polyimides
  • PCB substrate materials made of polyimide resin have high Tg properties, so their application fields are also extensive.
  • sand blasting is performed, and in the blasting process, a mixture of corundum and water is sprayed onto the surface of the substrate, wherein 280-320# of corundum can be selected, and the volume percentage of the corundum in the water is selected. It is 15-20% (V/V), preferably 17% by volume.
  • the function of the blasting process is to spray diamond on the PCB substrate to remove oxides and other impurities on the substrate and the copper surface.
  • the blasting process also includes a step of washing and drying to make it clean and dry.
  • the high-speed substrate transfer speed during the blasting process is 1.8-3.5 m/min, which ensures that the blasting process can be efficiently performed.
  • the embodiment of the invention also performs plasma activation treatment on the high frequency PCB material, and the plasma activation treatment comprises two stages: the first stage is processed by using a mixed gas of plasma nitrogen, oxygen and carbon tetrafluoride, and the stage is high frequency.
  • the substrate material is hydrophilized, and the surface of the high-frequency plate can be activated by the treatment to increase the hydrophilic capacity, thereby ensuring good bonding with the ink during the solder resist process and avoiding falling off; the second stage utilizes argon.
  • the gas is separately treated, and the process allows the high-frequency substrate material treated as described above to maintain a stable plasma activation state for a period of time to better perform the subsequent solder resist process.
  • the NH2 group is introduced into the polymer surface of the high-frequency PCB substrate, which increases the hydrophilicity of the high-frequency PCB substrate.
  • the final step of the high-frequency PCB solder mask pre-treatment process in the embodiment of the present invention is an ultra-roughening process, which may include oil removal, micro-etching, pickling, water washing, drying, etc., throughout the process.
  • the PCB substrate is treated with an acid compound, and the super-roughening effect is controlled by controlling the concentration of copper ions (Cu 2+ ), wherein the copper ion concentration is set to 10-35 g/L, and the ultra-roughening treatment can ensure the copper surface roughness. And uniformity is maximized, while also ensuring that the effect of the previous plasma treatment is not affected.
  • the high-frequency PCB solder mask pre-treatment process of the embodiment of the present invention obtains a surface effect which can be well combined with the ink for the high-frequency material and the copper surface, and effectively prevents the subsequent solder mask from falling off.
  • the embodiment of the invention further provides a high-frequency PCB production process, including the pre-soldering treatment process of the present invention, and the solder resist process, wherein the pre-weld treatment process and the solder resist process have an interval of less than 4 hours. Since the activated layer of the treated high-frequency material and the ultra-roughened layer of the copper surface remain active within 4 hours, their activity will decrease if it exceeds 4 hours, thereby affecting the subsequent solder resist effect.
  • the solder resist process can be applied to the PCB substrate by using a silk screen or a spray process, and then subsequent operations including pre-baking, exposure, development, characters, and the like can be performed.
  • Embodiments of the present invention also provide a PCB board prepared by the high frequency PCB preparation process of the present invention.
  • the substrate made of polytetrafluoroethylene resin is processed by the inner layer process, and the following treatment is performed:
  • Baking sheet treatment The substrate is treated at 150 ° C for 3H.
  • Sand blasting Automatically completed by pre-treatment blasting machine.
  • the process uses 280-320# mixture of corundum and water.
  • the volume percentage of corundum in water is set to 17% (V/V) during the blasting process.
  • the mixture of corundum and water was continuously stirred to keep them uniformly mixed, and the high-frequency substrate was conveyed in the machine during the blasting, and the conveying speed was set to 2 m/min.
  • the blasting process also includes a surface washing and drying process, and the drying temperature is 75-85 °C. After sandblasting, visual inspection is carried out, and the next step is processed in accordance with the standard.
  • Plasma activation treatment The treatment is carried out in two stages, the first stage is carried out using nitrogen, oxygen and carbon tetrafluoride, wherein each gas flow rate is set to nitrogen (160 sccm), oxygen (1200 sccm) and tetrafluoroethylene, respectively. Carbon (240sccm), processing time is 15min. Specifically, the substrate treated in step 2 is placed in a closed container, the container is evacuated, and then a plasma mixed gas mixture is introduced into the container for 15 minutes. The second stage was carried out using argon gas, the gas flow rate was set to 3000 sccm, the treatment time was 30 min, and the power was 8000 W.
  • the plasma activation process can be accomplished using a plasma machine.
  • the molecular structure of the high-frequency PCB material before and after the plasma activation treatment is shown in Fig. 1. As shown in the figure, after the plasma treatment, one F atom in the repeating unit is replaced by the NH 2 group.
  • the process includes steps of brushing, degreasing treatment, micro-etching treatment, pickling treatment, water washing treatment, drying treatment, and the like.
  • the degreasing treatment is carried out by using a degreaser, and the degreaser is commercially available.
  • BTH-2181 purchased from Shenzhen Banming Technology Co., Ltd.
  • the pressure control during the degreasing process was 1.5 ⁇ 0.5 kg/cm 2 .
  • the micro-etching treatment which is carried out by using the ultra-roughening micro-etching liquid.
  • the ultra-roughening micro-etching liquid used in this embodiment is BTH-2085 (purchased from Shenzhen Banming Technology Co., Ltd.).
  • the treatment effect is controlled by controlling the content of copper ions (Cu 2+ ), wherein the copper ion concentration is controlled to be 10-35 g/L, and the micro-etching cylinder pressure for micro-etching treatment is set to 1.5 ⁇ 0.5 kg/cm. 2 .
  • the super-roughening process is completed by using an ultra-roughening machine before soldering.
  • the copper surface structure observed under an electron microscope after super-roughening treatment is shown in Fig. 1.
  • solder mask treatment After the super-roughening treatment, the solder resist treatment is performed, and the solder resist ink is bonded to the surface of the PCB substrate by silk screen printing.
  • a substrate made of the same polytetrafluoroethylene resin as in Example 1 was obtained, and after the same baking sheet treatment as in Step 1 of Example 1, mechanical polishing and pozzolan treatment were performed, and the obtained product was observed under an electron microscope. 1 is shown.
  • the structure of the copper substrate of the PCB substrate after the ultra-roughening treatment of the organic acid in the embodiment of the present invention is observed under the electron microscope (5000 times magnification) of the PCB substrate after the conventional mechanical brushing + volcanic ash treatment, as shown in FIG.
  • the copper surface after acid super-roughening treatment is more uniform than the conventional mechanical brush + volcanic ash treatment, which makes it easier to firmly bond with the solder resist ink, reducing the possibility of subsequent solder mask falling off.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

La présente invention concerne un procédé de prétraitement par résistance et un procédé de préparation de carte de circuit imprimé haute fréquence, le procédé de traitement de prétraitement de soudage par résistance comprenant les étapes suivantes : la cuisson d'une carte, le sablage, l'activation par plasma et la rugosification de surface, la température du traitement de cuisson de la carte étant comprise entre 140 et 160°C. L'utilisation dudit procédé de prétraitement de soudage par résistance de la carte de circuit imprimé haute fréquence permet la réalisation d'une excellente liaison avec de l'encre entre une carte de circuit imprimé haute fréquence et la surface de cuivre, améliore la force de liaison de l'encre entre la carte de circuit imprimé haute fréquence et la surface de cuivre lors des opérations de soudage par résistance, et évite le problème de chute d'encre de soudage par résistance depuis la carte haute fréquence.
PCT/CN2013/079406 2013-07-15 2013-07-15 Procédé de traitement de prétraitement de soudage par résistance et procédé de préparation de carte de circuit imprimé haute fréquence WO2015006907A1 (fr)

Priority Applications (2)

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PCT/CN2013/079406 WO2015006907A1 (fr) 2013-07-15 2013-07-15 Procédé de traitement de prétraitement de soudage par résistance et procédé de préparation de carte de circuit imprimé haute fréquence
CN201380000619.6A CN104737629B (zh) 2013-07-15 2013-07-15 高频pcb阻焊前处理工艺及其制备工艺

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PCT/CN2013/079406 WO2015006907A1 (fr) 2013-07-15 2013-07-15 Procédé de traitement de prétraitement de soudage par résistance et procédé de préparation de carte de circuit imprimé haute fréquence

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Cited By (4)

* Cited by examiner, † Cited by third party
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CN106535490A (zh) * 2016-07-22 2017-03-22 无锡深南电路有限公司 一种超厚铜印制板及其阻焊加工方法
CN109041445A (zh) * 2018-08-10 2018-12-18 四川海英电子科技有限公司 一种hid电路板的高效高质量烘板方法
CN111065206A (zh) * 2019-12-18 2020-04-24 惠州市金百泽电路科技有限公司 一种在pcb基材表面印字符的加工方法
CN113939102A (zh) * 2021-08-27 2022-01-14 江苏博敏电子有限公司 一种pcb阻焊图形的制作方法

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CN107347229A (zh) * 2016-05-06 2017-11-14 鹤山市中富兴业电路有限公司 线路板选择性树脂塞孔的工艺方法
CN106535480A (zh) * 2016-11-18 2017-03-22 江门崇达电路技术有限公司 多层pcb正凹蚀的工艺
CN108282966B (zh) * 2018-02-05 2020-12-11 江西景旺精密电路有限公司 一种pcb阻焊前处理工艺
CN108566737A (zh) * 2018-06-08 2018-09-21 深圳市五株科技股份有限公司 一种pcb的加工方法及pcb
CN108811344A (zh) * 2018-08-03 2018-11-13 景旺电子科技(龙川)有限公司 一种fpc盲孔检测方法
CN109640513B (zh) * 2019-01-22 2024-04-02 广州安费诺诚信软性电路有限公司 一种自弹性轴向伸缩软性电路板及其制备方法
CN110300497A (zh) * 2019-06-12 2019-10-01 惠州市特创电子科技有限公司 一种5g高频线路板阻焊前处理方法
CN112911820A (zh) * 2019-12-03 2021-06-04 深南电路股份有限公司 一种电路板阻焊层的制作方法及电路板
CN113141724B (zh) * 2021-03-25 2023-09-29 广州美维电子有限公司 一种pcb印制电路板制作工艺
CN113365441A (zh) * 2021-07-09 2021-09-07 深圳市迅捷兴科技股份有限公司 通过改变铜面微观结构增加干膜与阻焊结合力的方法
CN114158189A (zh) * 2021-10-27 2022-03-08 深圳崇达多层线路板有限公司 一种改善沉锡板pad边掉油的制作方法
CN114710882B (zh) * 2022-03-29 2023-07-21 金禄电子科技股份有限公司 线路板及其制备方法

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CN106535490A (zh) * 2016-07-22 2017-03-22 无锡深南电路有限公司 一种超厚铜印制板及其阻焊加工方法
CN109041445A (zh) * 2018-08-10 2018-12-18 四川海英电子科技有限公司 一种hid电路板的高效高质量烘板方法
CN111065206A (zh) * 2019-12-18 2020-04-24 惠州市金百泽电路科技有限公司 一种在pcb基材表面印字符的加工方法
CN113939102A (zh) * 2021-08-27 2022-01-14 江苏博敏电子有限公司 一种pcb阻焊图形的制作方法

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