WO2014208150A1 - フリップチップ実装用チップ保持ツール及びフリップチップ実装方法 - Google Patents
フリップチップ実装用チップ保持ツール及びフリップチップ実装方法 Download PDFInfo
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- WO2014208150A1 WO2014208150A1 PCT/JP2014/057664 JP2014057664W WO2014208150A1 WO 2014208150 A1 WO2014208150 A1 WO 2014208150A1 JP 2014057664 W JP2014057664 W JP 2014057664W WO 2014208150 A1 WO2014208150 A1 WO 2014208150A1
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- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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Definitions
- the present invention relates to a structure of a chip holding tool for flip chip mounting and a flip chip mounting method using the chip holding tool.
- a plurality of bumps are formed on the circuit surface of the semiconductor chip with a material such as solder, and the bumps are heated to a plurality of electrodes formed on the circuit substrate.
- Flip chip mounting in which a semiconductor chip is directly bonded to a circuit board by bonding by melting is widely used.
- thermosetting non-conductive paste NCP
- a thermosetting non-conductive paste NCP
- the heated semiconductor chip is pressed against the electrodes of the board to heat and melt the bumps.
- a method of heat-curing a non-conductive paste (NCP) with a semiconductor chip and resin sealing between the semiconductor chip and the circuit board is used (for example, refer to Patent Document 1).
- a mounting tool used for flip-chip mounting is a thin rectangular parallelepiped that adsorbs a square flat base and a semiconductor chip arranged at the center of the base. And a chip holder.
- the size of the chip holder is approximately the same as the size of the semiconductor chip to be mounted.
- the mounting tool is thinly configured as a whole so that the heat of the heater can be efficiently transferred to the semiconductor chip held on the chip holder, and the protruding height from the base of the chip holder is adjacent when mounting. The height is such that it does not contact the semiconductor chip (see, for example, Patent Document 2).
- the chip holding tool 100 can be replaced with a chip holding table 105 having a smaller size in accordance with the size of the semiconductor chip 45 to be mounted, but the heater 20 may be of the same size. Therefore, the size of the base 101 fixed to the heater 20 of the chip holding tool 100 is substantially constant regardless of the size of the semiconductor chip 45. Therefore, as shown in FIG. 4, when the semiconductor chip 45 is mounted at the mounting pitch XP smaller than the length C0 of the heater 20 or the base 101, the length of the heater 20 or the chip holding tool 100.
- the length C1 of half of C0 becomes longer than 1/2 of the mounting pitch XP of the semiconductor chip 45, and the non-mounted non-conductive paste (the surface 102 is applied to the adjacent mounting position at the time of mounting) NCP) 42 is extended to the upper surface and covered thereover. Since the heater 20 heats the semiconductor chip 45 to a temperature of 300 ° C. to 350 ° C., the surface 102 of the chip holding base 105 also becomes considerably high, and as shown by the downward arrow in FIG. The surface of the paste (NCP) 42 is heated. The non-conductive paste (NCP) 42 often starts to change in quality when heated to about 70 ° C., and is heated to a high temperature by the surface 102 that protrudes around the chip holder 105 as shown in FIG.
- the mounting pitch XP of the semiconductor chip 45 is narrower than the length C0 of the heater 20 or the chip holding tool 100, and the heat of the heater 20 is not mounted from the surface 102 of the chip holding tool 100 and is not mounted on the non-conductive paste (NCP).
- NCP non-conductive paste
- a non-conductive paste (NCP) 42 is once applied to every other mounting position, a semiconductor chip 45 is mounted at that position, and then the semiconductor chip 45 is mounted again. It is possible to use a method in which a non-conductive paste (NCP) 42 is applied to a position where no mounting is performed and a semiconductor chip 45 is mounted at that position, and the mounting pitch is twice that of XP and mounting is performed twice. In many cases, mounting takes time and the mounting process becomes complicated.
- An object of the present invention is to flip-chip mount semiconductor chips at a narrow mounting pitch by a simple method.
- a chip holding tool of the present invention is a chip holding tool for flip chip mounting, which has a base part, and a chip holding base that protrudes from the surface of the base part and holds a semiconductor chip on its front end surface. Is offset with respect to the base portion.
- the offset amount of the chip holding base is longer than the length obtained by subtracting 1/2 of the mounting pitch of the semiconductor chip from 1/2 of the base portion length. It is also preferable that the offset amount of the holding table is shorter than 1 ⁇ 2 of the width of the chip holding table.
- the flip chip mounting method of the present invention flips a chip holding tool having a base portion and a chip holding base that is offset from the base portion and protrudes from the surface of the base portion so as to hold the semiconductor chip on the tip surface.
- the process of setting the chip mounting apparatus and the mounting of the semiconductor chip toward the offset side of the chip holding base and the relative position of the chip holding tool with respect to the substrate are alternately moved repeatedly by the mounting pitch of the semiconductor chip.
- a flip chip mounting method for mounting a plurality of semiconductor chips on a substrate are alternately moved repeatedly by the mounting pitch of the semiconductor chip.
- the present invention has an effect that a semiconductor chip can be flip-chip mounted with a narrow mounting pitch by a simple method.
- the chip holding tool 10 of the present embodiment protrudes from a flat base 11 that is a base portion fixed to the heater 20 and a surface 12 of the base 11, and on the tip surface 16 thereof.
- a chip holder 15 for holding the semiconductor chip is provided.
- a suction hole 17 for sucking and fixing the semiconductor chip is provided in the center of the front end surface 16.
- FIG. 1A and 1B show a state in which the chip holding tool 10 is attracted and fixed to the lower surface 22 of the heater 20 fixed to the tip of the mounting head 30, and the substrate feed direction of the flip chip mounting apparatus is the X direction and the horizontal plane
- the direction perpendicular to the X direction is the Y direction
- the vertical direction is the Z direction.
- the directions of XYZ are the same.
- the base 11 is a rectangular flat plate having a thickness (Z direction) H1, a width (X direction) D0, and a depth (Y direction) E0. is there.
- the heater connection surface 13 on the heater 20 side is fixed to the lower surface 22 (surface on the negative side in the Z direction) of the heater 20 by vacuum suction.
- the chip holding table 15 is disposed on the side opposite to the heater connection surface 13 of the base 11 and adsorbs the semiconductor chip.
- a tip surface 16 (tip surface on the minus side in the Z direction) is a height H2 from the surface 12 of the base 11.
- Each side in the XY direction of the square chip holding base 15 is a base of a rectangular parallelepiped with a thickness (Z direction) H2, a width (X direction) D2, and a depth (Y direction) E2 protruding only in the Z direction minus side. It arrange
- the thickness H2 of the chip holder 15 is set so as not to contact the non-conductive paste (NCP) 42 applied to the adjacent semiconductor chip or substrate when the semiconductor chip is mounted. Further, the entire thickness of the chip holding tool 10 is H0.
- the Z-direction center line 53 passing through the center point 55 is common to the heater 20, the mounting head 30, and the base 11.
- the center line 61 in the X direction and the center line 62 in the Y direction of the chip holding table 15 are respectively the distances ⁇ X and ⁇ Y from the center line 51 in the X direction and the center line 52 in the Y direction on the negative side in the X direction.
- the position is shifted to the Y direction plus side. Further, the position of the center point 65 in the XY plane of the chip holding table 15 which is the intersection of the center line 61 in the X direction of the chip holding table 15 and the center line 62 in the Y direction, and the Z-direction central axis passing through the center point 65 63 also represents a distance ⁇ X, ⁇ Y from the center point 55 in the XY plane of the base 11 and the center line 53, which are the intersections of the center line 51 in the X direction of the base 11 and the center line 52 in the Y direction.
- the position is shifted to the plus side. That is, the chip holding table 15 is arranged with an offset of ⁇ X and ⁇ Y with respect to the base 11 in the XY directions.
- the offset direction length E1 of the chip holding base 15 in the Y direction (X direction center line 61 or Y direction plus side length from the Z direction center line 63) is also 1 of the Y direction length E0 of the base 11.
- each of the offset amounts ⁇ X and ⁇ Y in the X and Y directions of the chip holding table 15 is a semiconductor chip from 1/2 of the lengths D0 and E0 of the base 11 in the X and Y directions. 45 is longer than the length obtained by subtracting 1/2 of the mounting pitches XP and YP in the X and Y directions ( ⁇ X> D0 / 2 ⁇ XP / 2) and ( ⁇ Y> E0 / 2 ⁇ YP / 2).
- the offset side lengths D1 and E1 in the X and Y directions of the chip holder 15 are shorter than 1 ⁇ 2 of the mounting pitches XP and YP in the X and Y directions of the semiconductor chip 45 (D1 ⁇ XP / 2, E1 ⁇ YP / 2).
- the surface 12 on each offset side in the X and Y directions of the chip holding tool 10 is over the adjacent unmounted non-conductive paste (NCP) 42. It does not stretch, and it is possible to suppress heating of the adjacent non-mounted non-conductive paste (NCP) 42 during mounting.
- the center line 53 is a center line of a vertical load applied in the Z direction from the mounting head 30 via the heater 20, and the chip holding base 15 has the chip direction holding the chip direction center line 53 passing through the center point of the base 11. It is arranged at a position penetrating the tip surface 16 of the table 15.
- the chip holding table 15 is arranged so that a load in the Z direction is applied in the plane of the tip surface 16, and the semiconductor chip is placed on the tip surface 16 of the chip holding table 15 by the eccentric load applied to the chip holding table 15 during mounting. It is configured not to rotate around the corner. Accordingly, the offset amounts ⁇ X and ⁇ Y in the XY directions are smaller than 1 ⁇ 2 of the X-direction length D2 and the Y-direction length E2 of the chip holding base 15, respectively.
- the chip holding tool 10 according to the present embodiment described with reference to FIGS. 1A and 1B is sucked and fixed to the lower surface 22 of the heater 20 fixed to the mounting head 30.
- each side of the four sides of the chip holding tool 10 is aligned with the direction of each side of the four sides of the heater 20, and each offset side of the tip holding table 15 in the XY direction is respectively the X direction minus side and the Y direction plus side. In such a manner, it is fixed to the lower surface 22 of the heater 20 by suction.
- a non-conductive paste (NCP) 42 is applied on each position of the surface 41 of the substrate 40 on which the semiconductor chip 45 is mounted by a dispenser (not shown). As shown in FIG. 3, the non-conductive paste (NCP) 42 intersects at the center of the position where the semiconductor chip 45 is mounted, and the X-type paste has a length that is the diagonal length of the semiconductor chip 45 to be mounted. It may be applied. The applied non-conductive paste (NCP) 42 rises from the surface 41 of the substrate 40 as shown in FIG.
- the substrate 40 After applying a non-conductive paste (NCP) 42 to the substrate 40, the substrate 40 is heated to about 70 ° C. by a preheating stage (not shown), and then fixed by suction to a mounting stage (not shown). The mounting stage holds the temperature of the substrate 40 at about 70 ° C.
- the suction hole 17 on the tip surface 16 of the chip holding table 15 is evacuated, the semiconductor chip 45 is sucked and fixed to the tip surface 16, the heater 20 is turned on, and the semiconductor chip 45 is heated to 300 to 350 ° C.
- the mounting head 30 is lowered to place the semiconductor chip 45 adsorbed on the tip surface 16 of the chip holding table 15 on the non-conductive paste (NCP) 42. Press.
- the non-conductive paste (NCP) 42 covers the entire surface of the semiconductor chip 45 on the substrate 40 side, and a part thereof slightly protrudes around the circumference of the semiconductor chip 45. To be spread out. Then, it hardens
- the mounting of the semiconductor chip 45 is sequentially performed toward each XY offset side of the chip holding base 15 as indicated by white arrows 91 and 92 shown in FIG.
- the mounting process will be described with reference to FIG.
- the semiconductor chip 451 is mounted at the upper right corner position (X direction plus side, Y direction plus side corner) of the substrate 40.
- the non-conductive paste (NCP) 42 is cured between the semiconductor chip 451 and the substrate 40 and around the semiconductor chip 451 to become a cured resin 431.
- the substrate 40 is moved to the Y direction plus side by the Y direction mounting pitch YP by a mounting stage (not shown).
- the position of the mounting head 30 moves relative to the substrate 40 by the Y-direction mounting pitch YP toward the Y-direction minus side as indicated by the white arrow 92 in FIG. Then, the mounting head 30 is lowered to mount the semiconductor chip 452 at the next mounting position. Thereafter, the mounting of the semiconductor chips and the movement of the mounting stage (not shown) are alternately repeated, and the semiconductor chips 453 and 454 are sequentially mounted.
- the mounting stage (not shown) is moved to the X direction plus side by the X direction mounting pitch XP, and the mounting stage is moved to the Y direction minus side by 4 mounting pitches (4 ⁇ YP).
- the mounting head 30 is moved by XP toward the minus side in the X direction as indicated by the white arrow 91 in FIG. 3, and is moved by four mounting pitches (4 ⁇ YP) toward the plus side in the Y direction. Then, the mounting head 30 is lowered to mount the semiconductor chip 455 shown in FIG. In this way, as indicated by the hollow arrows 91 and 92 shown in FIG. 3, the semiconductor chip 45 is moved while moving the mounting head 30 to the offset side (X direction minus side, Y direction plus side) with respect to the substrate 40. It will be implemented sequentially.
- the offset side lengths D1 and E1 in the X and Y directions of the chip holding base 15 are more than 1/2 of the mounting pitches XP and YP in the X and Y directions of the semiconductor chip 45. It is getting shorter. For this reason, the surface 12 on the offset side in the X and Y directions of the chip holding tool 10 does not extend onto the adjacent non-mounted non-conductive paste (NCP) 42 when mounting, and when mounting, Heating the adjacent non-mounted non-conductive paste (NCP) 42 can be suppressed.
- NCP adjacent non-mounted non-conductive paste
- the mounting pitches XP and YP in the X and Y directions for mounting the semiconductor chip 45 are the size of the heater 20 or the size D0 of the base 11 of the chip holding tool 10.
- the temperature rise of the non-conductive paste (NCP) 42 applied to the unmounted position can be suppressed, and the semiconductor chips 45 can be sequentially mounted at adjacent positions.
- Many semiconductor chips 45 can be mounted on the substrate 40 in a short time.
- the anti-offset side lengths D ⁇ b> 3 and E ⁇ b> 3 in the X and Y directions of the chip holding base 15 are 1 / X of the mounting pitches XP and YP in the X and Y directions for mounting the semiconductor chip 45. 2
- the surface 12 of the base 11 is covered on the adjacent mounted semiconductor chips 451 to 455, but the non-conductive paste 42 in this part has already been thermoset to form cured resins 431 to 435. Therefore, there is no problem even if heated by the surface 12 of the base 11.
- the embodiment described above has an effect that the semiconductor chips 45 can be sequentially flip-chip mounted at a narrow mounting pitch by a simple method of offsetting the chip holding base 15 with respect to the base 11.
- the chip holding tool 10 is square and the chip holding base 15 is also quadrangular.
- the shape is not limited to square, and may be round or other shapes such as oval. Good.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (5)
- 基体部と、
前記基体部の表面から突出し、その先端面に半導体チップを保持するチップ保持台と、を有するフリップチップ実装用のチップ保持ツールであって、
前記チップ保持台は前記基体部に対してオフセットされているチップ保持ツール。 - 請求項1に記載のチップ保持ツールであって、
前記チップ保持台のオフセット量は、前記基体部長さの1/2から半導体チップの実装ピッチの1/2を差し引いた長さよりも長いチップ保持ツール。 - 請求項1に記載のチップ保持ツールであって、
前記チップ保持台のオフセット量は、前記チップ保持台の幅の1/2よりも短いチップ保持ツール。 - 請求項2に記載のチップ保持ツールであって、
前記チップ保持台のオフセット量は、前記チップ保持台の幅の1/2よりも短い特徴とするチップ保持ツール。 - フリップチップ実装方法であって、
基体部と、基体部に対してオフセットされ、先端面に半導体チップを保持するように前記基体部の表面から突出したチップ保持台と、を有するチップ保持ツールをフリップチップ実装装置にセットする工程と、
前記チップ保持台のオフセット側に向かって半導体チップの実装と前記基板に対する前記チップ保持ツールの相対位置を前記半導体チップの実装ピッチ分だけ移動させることを交互に繰り返し、前記基板に複数の半導体チップを実装する実装工程と、
を有し、基板に複数の半導体チップを実装するフリップチップ実装方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG11201510605QA SG11201510605QA (en) | 2013-06-26 | 2014-03-20 | Chip holding tool for flip-chip mounting, and flip-chip mounting method |
CN201480002661.6A CN104704622B (zh) | 2013-06-26 | 2014-03-20 | 覆晶粘晶用芯片保持工具以及覆晶粘晶方法 |
JP2015523888A JP6209799B2 (ja) | 2013-06-26 | 2014-03-20 | フリップチップ実装用チップ保持ツール及びフリップチップ実装方法 |
KR1020157009324A KR101693209B1 (ko) | 2013-06-26 | 2014-03-20 | 플립 칩 실장용 칩 유지 툴 및 플립 칩 실장 방법 |
Applications Claiming Priority (2)
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JP2013133321 | 2013-06-26 | ||
JP2013-133321 | 2013-06-26 |
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WO2014208150A1 true WO2014208150A1 (ja) | 2014-12-31 |
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PCT/JP2014/057664 WO2014208150A1 (ja) | 2013-06-26 | 2014-03-20 | フリップチップ実装用チップ保持ツール及びフリップチップ実装方法 |
Country Status (6)
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JP (1) | JP6209799B2 (ja) |
KR (1) | KR101693209B1 (ja) |
CN (1) | CN104704622B (ja) |
SG (1) | SG11201510605QA (ja) |
TW (1) | TWI531013B (ja) |
WO (1) | WO2014208150A1 (ja) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137241A (ja) * | 1988-10-31 | 1990-05-25 | Internatl Business Mach Corp <Ibm> | 方向づけ調節装置 |
JP2002217242A (ja) * | 2001-01-23 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 超音波接合方法とその装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
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US3256465A (en) * | 1962-06-08 | 1966-06-14 | Signetics Corp | Semiconductor device assembly with true metallurgical bonds |
JP2002016091A (ja) | 2000-06-29 | 2002-01-18 | Kyocera Corp | 接触加熱装置 |
JP2005150446A (ja) | 2003-11-17 | 2005-06-09 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法 |
JP4539454B2 (ja) * | 2005-06-20 | 2010-09-08 | パナソニック株式会社 | 電子部品の熱圧着ツールおよび電子部品の実装装置ならびに実装方法 |
KR100899942B1 (ko) * | 2007-05-31 | 2009-05-28 | 미래산업 주식회사 | 테스트 핸들러, 그를 이용한 반도체 소자 제조방법, 및테스트트레이 이송방법 |
-
2013
- 2013-12-20 TW TW102147340A patent/TWI531013B/zh active
-
2014
- 2014-03-20 SG SG11201510605QA patent/SG11201510605QA/en unknown
- 2014-03-20 CN CN201480002661.6A patent/CN104704622B/zh active Active
- 2014-03-20 JP JP2015523888A patent/JP6209799B2/ja active Active
- 2014-03-20 WO PCT/JP2014/057664 patent/WO2014208150A1/ja active Application Filing
- 2014-03-20 KR KR1020157009324A patent/KR101693209B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02137241A (ja) * | 1988-10-31 | 1990-05-25 | Internatl Business Mach Corp <Ibm> | 方向づけ調節装置 |
JP2002217242A (ja) * | 2001-01-23 | 2002-08-02 | Matsushita Electric Ind Co Ltd | 超音波接合方法とその装置 |
Also Published As
Publication number | Publication date |
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TW201501221A (zh) | 2015-01-01 |
KR101693209B1 (ko) | 2017-01-17 |
JPWO2014208150A1 (ja) | 2017-02-23 |
SG11201510605QA (en) | 2016-01-28 |
CN104704622A (zh) | 2015-06-10 |
KR20150053992A (ko) | 2015-05-19 |
TWI531013B (zh) | 2016-04-21 |
CN104704622B (zh) | 2017-10-27 |
JP6209799B2 (ja) | 2017-10-18 |
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