WO2014204245A3 - 하이브리드 단열 시트 및 이를 구비한 전자기기 - Google Patents
하이브리드 단열 시트 및 이를 구비한 전자기기 Download PDFInfo
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- WO2014204245A3 WO2014204245A3 PCT/KR2014/005438 KR2014005438W WO2014204245A3 WO 2014204245 A3 WO2014204245 A3 WO 2014204245A3 KR 2014005438 W KR2014005438 W KR 2014005438W WO 2014204245 A3 WO2014204245 A3 WO 2014204245A3
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- WIPO (PCT)
- Prior art keywords
- electronic equipment
- insulation sheet
- same
- hybrid insulation
- heat
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/027—Thermal properties
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- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H04M—TELEPHONIC COMMUNICATION
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- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Textile Engineering (AREA)
- Dispersion Chemistry (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Telephone Set Structure (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Secondary Cells (AREA)
Abstract
본 발명은 단열 시트 및 이를 구비한 전자기기에 관한 것으로, 단열 시트는 전자기기의 발열 부품에서 발생된 열을 확산(Spreading)시켜 방열하는 방열층; 및 상기 방열층에서 포화된 열의 외부 전달을 억제하는 단열층;을 포함한다.
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14748091.7A EP2874479B1 (en) | 2013-06-19 | 2014-06-19 | Hybrid insulation sheet and electronic equipment comprising same |
CN201480000758.3A CN104737634B (zh) | 2013-06-19 | 2014-06-19 | 混合型隔热片及具有该混合型隔热片的电子设备 |
JP2015523046A JP6023885B2 (ja) | 2013-06-19 | 2014-06-19 | ハイブリッド断熱シートおよびこれを備えた電子機器 |
US14/459,544 US9374932B2 (en) | 2013-06-19 | 2014-08-14 | Hybrid insulation sheet and electronic apparatus using the same |
Applications Claiming Priority (12)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20130070481 | 2013-06-19 | ||
KR10-2013-0070481 | 2013-06-19 | ||
KR10-2013-0131034 | 2013-10-31 | ||
KR1020130131034A KR101746066B1 (ko) | 2013-10-31 | 2013-10-31 | 방열시트, 그 제조방법 및 그를 구비한 휴대용 단말기 |
KR10-2013-0168277 | 2013-12-31 | ||
KR20130168277 | 2013-12-31 | ||
KR10-2014-0017744 | 2014-02-17 | ||
KR20140017745 | 2014-02-17 | ||
KR10-2014-0017745 | 2014-02-17 | ||
KR20140017744 | 2014-02-17 | ||
KR1020140074798A KR101576157B1 (ko) | 2013-06-19 | 2014-06-19 | 단열시트 및 그의 제조방법과, 이를 구비한 휴대 단말기 |
KR10-2014-0074798 | 2014-06-19 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/459,544 Continuation US9374932B2 (en) | 2013-06-19 | 2014-08-14 | Hybrid insulation sheet and electronic apparatus using the same |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2014204245A2 WO2014204245A2 (ko) | 2014-12-24 |
WO2014204245A3 true WO2014204245A3 (ko) | 2015-04-23 |
Family
ID=52813813
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2014/005438 WO2014204245A2 (ko) | 2013-06-19 | 2014-06-19 | 하이브리드 단열 시트 및 이를 구비한 전자기기 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9374932B2 (ko) |
EP (1) | EP2874479B1 (ko) |
JP (1) | JP6023885B2 (ko) |
CN (1) | CN104737634B (ko) |
WO (1) | WO2014204245A2 (ko) |
Families Citing this family (49)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9743564B2 (en) | 2014-08-28 | 2017-08-22 | Apple Inc. | Electromagnetic shielding structures |
WO2016114528A1 (ko) * | 2015-01-12 | 2016-07-21 | 주식회사 아모그린텍 | 방열유닛 및 이를 구비한 무선전력 송수신장치 |
KR20160090144A (ko) * | 2015-01-21 | 2016-07-29 | 주식회사 아모그린텍 | 방열 시트 일체형 안테나 모듈 |
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US20140376191A1 (en) | 2014-12-25 |
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WO2014204245A2 (ko) | 2014-12-24 |
US9374932B2 (en) | 2016-06-21 |
EP2874479A4 (en) | 2015-12-16 |
EP2874479A2 (en) | 2015-05-20 |
CN104737634B (zh) | 2017-08-18 |
CN104737634A (zh) | 2015-06-24 |
JP6023885B2 (ja) | 2016-11-09 |
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