WO2014204245A3 - 하이브리드 단열 시트 및 이를 구비한 전자기기 - Google Patents

하이브리드 단열 시트 및 이를 구비한 전자기기 Download PDF

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Publication number
WO2014204245A3
WO2014204245A3 PCT/KR2014/005438 KR2014005438W WO2014204245A3 WO 2014204245 A3 WO2014204245 A3 WO 2014204245A3 KR 2014005438 W KR2014005438 W KR 2014005438W WO 2014204245 A3 WO2014204245 A3 WO 2014204245A3
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WO
WIPO (PCT)
Prior art keywords
electronic equipment
insulation sheet
same
hybrid insulation
heat
Prior art date
Application number
PCT/KR2014/005438
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English (en)
French (fr)
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WO2014204245A2 (ko
Inventor
황승재
Original Assignee
주식회사 아모그린텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020130131034A external-priority patent/KR101746066B1/ko
Application filed by 주식회사 아모그린텍 filed Critical 주식회사 아모그린텍
Priority to EP14748091.7A priority Critical patent/EP2874479B1/en
Priority to CN201480000758.3A priority patent/CN104737634B/zh
Priority to JP2015523046A priority patent/JP6023885B2/ja
Priority claimed from KR1020140074798A external-priority patent/KR101576157B1/ko
Priority to US14/459,544 priority patent/US9374932B2/en
Publication of WO2014204245A2 publication Critical patent/WO2014204245A2/ko
Publication of WO2014204245A3 publication Critical patent/WO2014204245A3/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/027—Thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
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    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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    • B32B27/00—Layered products comprising a layer of synthetic resin
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    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
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    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/003—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by using permeable mass, perforated or porous materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/02—Constructions of heat-exchange apparatus characterised by the selection of particular materials of carbon, e.g. graphite
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
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    • H—ELECTRICITY
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Ceramic Engineering (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Textile Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Secondary Cells (AREA)

Abstract

본 발명은 단열 시트 및 이를 구비한 전자기기에 관한 것으로, 단열 시트는 전자기기의 발열 부품에서 발생된 열을 확산(Spreading)시켜 방열하는 방열층; 및 상기 방열층에서 포화된 열의 외부 전달을 억제하는 단열층;을 포함한다.
PCT/KR2014/005438 2013-06-19 2014-06-19 하이브리드 단열 시트 및 이를 구비한 전자기기 WO2014204245A2 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP14748091.7A EP2874479B1 (en) 2013-06-19 2014-06-19 Hybrid insulation sheet and electronic equipment comprising same
CN201480000758.3A CN104737634B (zh) 2013-06-19 2014-06-19 混合型隔热片及具有该混合型隔热片的电子设备
JP2015523046A JP6023885B2 (ja) 2013-06-19 2014-06-19 ハイブリッド断熱シートおよびこれを備えた電子機器
US14/459,544 US9374932B2 (en) 2013-06-19 2014-08-14 Hybrid insulation sheet and electronic apparatus using the same

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
KR20130070481 2013-06-19
KR10-2013-0070481 2013-06-19
KR10-2013-0131034 2013-10-31
KR1020130131034A KR101746066B1 (ko) 2013-10-31 2013-10-31 방열시트, 그 제조방법 및 그를 구비한 휴대용 단말기
KR10-2013-0168277 2013-12-31
KR20130168277 2013-12-31
KR10-2014-0017744 2014-02-17
KR20140017745 2014-02-17
KR10-2014-0017745 2014-02-17
KR20140017744 2014-02-17
KR1020140074798A KR101576157B1 (ko) 2013-06-19 2014-06-19 단열시트 및 그의 제조방법과, 이를 구비한 휴대 단말기
KR10-2014-0074798 2014-06-19

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US14/459,544 Continuation US9374932B2 (en) 2013-06-19 2014-08-14 Hybrid insulation sheet and electronic apparatus using the same

Publications (2)

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WO2014204245A2 WO2014204245A2 (ko) 2014-12-24
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Families Citing this family (49)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9743564B2 (en) 2014-08-28 2017-08-22 Apple Inc. Electromagnetic shielding structures
WO2016114528A1 (ko) * 2015-01-12 2016-07-21 주식회사 아모그린텍 방열유닛 및 이를 구비한 무선전력 송수신장치
KR20160090144A (ko) * 2015-01-21 2016-07-29 주식회사 아모그린텍 방열 시트 일체형 안테나 모듈
EP3270030A4 (en) * 2015-03-10 2018-10-10 Kabushiki Kaisha Toshiba Vacuum insulated panel, core material, refrigerator, method for producing vacuum insulated panel, and method for recycling refrigerator
CN106457749B (zh) * 2015-03-30 2018-09-14 松下知识产权经营株式会社 一种绝热片、使用其的电子设备及绝热片的制造方法
CN107535076B (zh) * 2015-06-26 2020-04-07 松下知识产权经营株式会社 导热片以及使用其的电子设备
CN105280587B (zh) * 2015-07-03 2018-08-07 苏州赛伍应用技术股份有限公司 功率模块用散热片及用其制成的功率模块
CN105072868B (zh) * 2015-07-14 2018-04-27 广东欧珀移动通信有限公司 移动终端以及对该移动终端散热的方法
CN104994712A (zh) * 2015-07-14 2015-10-21 广东欧珀移动通信有限公司 移动终端以及对该移动终端散热的方法
TWI617231B (zh) * 2015-08-11 2018-03-01 奇鋐科技股份有限公司 具絕熱之中框結構及電子設備
TWI575359B (zh) * 2015-08-11 2017-03-21 奇鋐科技股份有限公司 具斷熱之中框結構及電子設備
CN106455404B (zh) * 2015-08-11 2022-07-01 奇鋐科技股份有限公司 具断热之中框结构及电子设备
CN106455410B (zh) * 2015-08-11 2019-03-12 奇鋐科技股份有限公司 具绝热之中框结构及电子设备
US9578791B1 (en) 2015-08-17 2017-02-21 Asia Vital Components Co., Ltd. Internal frame structure with heat isolation effect and electronic apparatus with the internal frame structure
WO2017052254A1 (ko) * 2015-09-23 2017-03-30 주식회사 아모그린텍 웨어러블 디바이스 및 그의 제조 방법
US10448541B2 (en) * 2015-11-19 2019-10-15 Boyd Corporation Densified foam for thermal insulation in electronic devices
CN105392343A (zh) * 2015-12-11 2016-03-09 赛尔康技术（深圳）有限公司 一种散热处理结构
CN105472947A (zh) * 2015-12-15 2016-04-06 联想(北京)有限公司 一种电子设备
JPWO2017175742A1 (ja) * 2016-04-08 2018-11-01 株式会社サンクレスト 取付フィルムおよび取付構造
CN107343375B (zh) * 2016-04-29 2021-03-12 Oppo广东移动通信有限公司 一种后壳和移动终端
KR20170136063A (ko) * 2016-05-30 2017-12-11 주식회사 아모그린텍 초박형 전자파 차폐시트 및 그를 구비한 전자기기
KR20170136064A (ko) * 2016-05-30 2017-12-11 주식회사 아모그린텍 플렉시블 전자파 차폐시트 및 그를 구비한 전자기기
CN105889708B (zh) * 2016-06-15 2019-10-15 嘉兴中易碳素科技有限公司 智能设备隔热膜及包含该隔热膜的智能设备
CN106009686B (zh) * 2016-07-06 2019-09-17 浙江农业商贸职业学院 一种发动机高性能隔热材料
EP3272516B1 (en) * 2016-07-22 2021-03-03 Panasonic Intellectual Property Management Co., Ltd. Heat-insulation material and production method thereof
KR102563691B1 (ko) * 2016-08-26 2023-08-07 주식회사 아모그린텍 감압성 점착테이프, 그의 제조방법 및 그를 구비한 전자기기
KR102591754B1 (ko) * 2016-09-09 2023-10-20 삼성디스플레이 주식회사 커버 패널 및 이를 포함하는 표시 장치
US10820455B2 (en) 2016-11-22 2020-10-27 Samsung Display Co., Ltd. Display device
CN106659079A (zh) * 2016-12-23 2017-05-10 努比亚技术有限公司 一种复合散热膜和移动终端
TWM541700U (zh) * 2017-02-10 2017-05-11 Amazing Cool Tech Corp 印刷電路之輻射散熱結構
US10606327B2 (en) 2017-06-16 2020-03-31 Qualcomm Incorporated Heat reduction using selective insulation and thermal spreading
US11602922B2 (en) 2017-07-06 2023-03-14 Lg Chem, Ltd. Composite material
KR102085647B1 (ko) * 2017-07-17 2020-03-06 주식회사 아모그린텍 차량용 무선 전력 송신장치
CN109425812B (zh) * 2017-08-28 2021-03-12 创意电子股份有限公司 半导体封装元件的检测系统及其热阻障层元件
CN207099513U (zh) * 2017-09-05 2018-03-13 陈庆洪 一种散热功能良好的防护等级达65级及以上的电气机箱
KR102114288B1 (ko) * 2018-05-15 2020-05-22 나용일 냉장고용 도어외판의 내부면에 부착되는 부직포 적층시트 및 그 제조 방법
CN108766981B (zh) 2018-05-28 2021-01-22 京东方科技集团股份有限公司 一种绝热膜的制作方法、绝热结构、显示装置
CN110753462A (zh) * 2018-07-23 2020-02-04 宏碁股份有限公司 机壳结构以及机壳结构的制作方法
CN109768019B (zh) * 2018-12-29 2020-12-25 苏州赛伍应用技术股份有限公司 一种功率模块用散热片及用其制成的功率模块
TWI686309B (zh) * 2019-01-09 2020-03-01 可成科技股份有限公司 散熱結構及其製造方法
TWI691696B (zh) * 2019-05-31 2020-04-21 訊凱國際股份有限公司 散熱裝置
CN110621141A (zh) * 2019-09-23 2019-12-27 Oppo广东移动通信有限公司 复合膜及电子设备
CN110684142A (zh) * 2019-10-29 2020-01-14 追信数字科技有限公司 一种用于cpu散热的蜂窝状固液复合散热材料的制造方法
US11147169B2 (en) * 2019-11-04 2021-10-12 Sharp Kabushiki Kaisha Impact absorbing element for display device
KR20220108766A (ko) * 2019-11-29 2022-08-03 도레이 카부시키가이샤 열전도체 및 그 제조 방법
WO2021256093A1 (ja) * 2020-06-18 2021-12-23 阿波製紙株式会社 断熱シート及びこれを備える電源装置
KR102513358B1 (ko) * 2020-12-17 2023-03-24 주식회사 포스코 이종코팅 강판 및 디스플레이 장치
KR102604978B1 (ko) * 2021-07-23 2023-11-23 아주스틸 주식회사 Oled tv의 디스플레이 패널에 부착되는 eia 시트의 제조방법 및 이에 의해 제조된 eia 시트
KR20230124814A (ko) 2022-02-18 2023-08-28 현대자동차주식회사 복사 냉각용 적층체 및 이의 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025519A (ja) * 2000-07-04 2002-01-25 Sony Corp 電池収納容器およびこれを有する電子機器、並びに、電池の使用方法
WO2007029311A1 (ja) * 2005-09-06 2007-03-15 Fujitsu Limited 電子機器
KR20100072508A (ko) * 2008-12-22 2010-07-01 오리온피디피주식회사 플라즈마 디스플레이 패널의 방열 시트 구조
KR101161735B1 (ko) * 2012-01-31 2012-07-03 (주)메인일렉콤 잠열을 이용한 지연 방열시트
KR101179364B1 (ko) * 2008-09-22 2012-09-03 파나소닉 주식회사 휴대전자기기

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5879786A (en) * 1996-11-08 1999-03-09 W. L. Gore & Associates, Inc. Constraining ring for use in electronic packaging
JP2000106495A (ja) * 1998-09-29 2000-04-11 Kitagawa Ind Co Ltd 電気電子器具の内部構造
WO2001031082A1 (en) * 1999-10-28 2001-05-03 P1 Diamond, Inc. Improved diamond thermal management components
DE10036301A1 (de) * 2000-07-26 2002-02-07 Philips Corp Intellectual Pty Hochspannungserzeuger mit Hybridisolierung
US6747347B2 (en) * 2001-08-30 2004-06-08 Micron Technology, Inc. Multi-chip electronic package and cooling system
CN1212756C (zh) * 2003-08-04 2005-07-27 台达电子工业股份有限公司 均温装置
US7768785B2 (en) * 2004-09-29 2010-08-03 Super Talent Electronics, Inc. Memory module assembly including heat-sink plates with heat-exchange fins attached to integrated circuits by adhesive
US7219713B2 (en) * 2005-01-18 2007-05-22 International Business Machines Corporation Heterogeneous thermal interface for cooling
KR101134880B1 (ko) 2005-06-29 2012-04-13 엘지전자 주식회사 단열필름을 구비한 휴대용 단말기
US7360581B2 (en) * 2005-11-07 2008-04-22 3M Innovative Properties Company Structured thermal transfer article
US20070165376A1 (en) * 2006-01-17 2007-07-19 Norbert Bones Three phase inverter power stage and assembly
US7376218B2 (en) * 2006-08-16 2008-05-20 Endicott Interconnect Technologies, Inc. X-ray source assembly
JP4751810B2 (ja) * 2006-11-02 2011-08-17 日立オートモティブシステムズ株式会社 電力変換装置
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
WO2008086627A1 (en) * 2007-01-18 2008-07-24 D-Wave Systems, Inc. Input/output system and devices for use with superconducting devices
JP2008198917A (ja) * 2007-02-15 2008-08-28 Polymatech Co Ltd 熱拡散シート及びその製造方法
US7598119B2 (en) * 2007-03-12 2009-10-06 Texas Instruments Incorporated System and method for inhibiting and containing resin bleed-out from adhesive materials used in assembly of semiconductor devices
JP5227532B2 (ja) * 2007-04-02 2013-07-03 日立オートモティブシステムズ株式会社 インバータ回路用の半導体モジュール
JP4452953B2 (ja) * 2007-08-09 2010-04-21 日立オートモティブシステムズ株式会社 電力変換装置
JP2009111003A (ja) * 2007-10-26 2009-05-21 Kaneka Corp 複合断熱体とそれを含む電子機器
US8120171B2 (en) * 2007-12-26 2012-02-21 Keihin Corporation Power drive unit including a heat sink and a fastener
JP4580997B2 (ja) * 2008-03-11 2010-11-17 日立オートモティブシステムズ株式会社 電力変換装置
JP2009230332A (ja) * 2008-03-21 2009-10-08 Selamission Hanbai Kk 放熱シート及び放熱シートを積層した半導体装置
JP4657329B2 (ja) * 2008-07-29 2011-03-23 日立オートモティブシステムズ株式会社 電力変換装置および電動車両
JP2010251386A (ja) * 2009-04-10 2010-11-04 Nec Corp 熱拡散部材を備える電子機器、熱拡散部材を備える電子機器の製法及び熱拡散部材
US8081468B2 (en) * 2009-06-17 2011-12-20 Laird Technologies, Inc. Memory modules including compliant multilayered thermally-conductive interface assemblies
US8106510B2 (en) * 2009-08-04 2012-01-31 Raytheon Company Nano-tube thermal interface structure
JPWO2011111716A1 (ja) * 2010-03-10 2013-06-27 日東電工株式会社 断熱放熱シート及び装置内構造
NL2007834A (en) * 2010-12-23 2012-06-27 Asml Netherlands Bv Lithographic apparatus and removable member.
TWI472423B (zh) * 2010-12-23 2015-02-11 Compal Electronics Inc 殼體結構及電子裝置殼體結構製造方法
JP5641230B2 (ja) * 2011-01-28 2014-12-17 株式会社豊田自動織機 電子機器
JP2012160503A (ja) * 2011-01-31 2012-08-23 Kaneka Corp 複合フィルム、デバイス、および複合フィルムの製造方法
US8879276B2 (en) * 2011-06-15 2014-11-04 Power Gold LLC Flexible circuit assembly and method thereof
CN103025122A (zh) * 2011-09-23 2013-04-03 联想(北京)有限公司 一种电子设备
US8753924B2 (en) * 2012-03-08 2014-06-17 Texas Instruments Incorporated Grown carbon nanotube die attach structures, articles, devices, and processes for making them
CN103107147A (zh) * 2012-04-06 2013-05-15 北京中石伟业科技股份有限公司 一种表面覆有石墨烯薄膜的散热器
CN103242755B (zh) * 2013-05-06 2014-07-09 深圳市美信电子有限公司 一种导热扩散片及其制备方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002025519A (ja) * 2000-07-04 2002-01-25 Sony Corp 電池収納容器およびこれを有する電子機器、並びに、電池の使用方法
WO2007029311A1 (ja) * 2005-09-06 2007-03-15 Fujitsu Limited 電子機器
KR101179364B1 (ko) * 2008-09-22 2012-09-03 파나소닉 주식회사 휴대전자기기
KR20100072508A (ko) * 2008-12-22 2010-07-01 오리온피디피주식회사 플라즈마 디스플레이 패널의 방열 시트 구조
KR101161735B1 (ko) * 2012-01-31 2012-07-03 (주)메인일렉콤 잠열을 이용한 지연 방열시트

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US20140376191A1 (en) 2014-12-25
JP2015532778A (ja) 2015-11-12
WO2014204245A2 (ko) 2014-12-24
US9374932B2 (en) 2016-06-21
EP2874479A4 (en) 2015-12-16
EP2874479A2 (en) 2015-05-20
CN104737634B (zh) 2017-08-18
CN104737634A (zh) 2015-06-24
JP6023885B2 (ja) 2016-11-09

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