WO2014172983A1 - 一种光阻涂布装置及其涂布方法 - Google Patents

一种光阻涂布装置及其涂布方法 Download PDF

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Publication number
WO2014172983A1
WO2014172983A1 PCT/CN2013/077769 CN2013077769W WO2014172983A1 WO 2014172983 A1 WO2014172983 A1 WO 2014172983A1 CN 2013077769 W CN2013077769 W CN 2013077769W WO 2014172983 A1 WO2014172983 A1 WO 2014172983A1
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WIPO (PCT)
Prior art keywords
photoresist
injection tube
nozzle body
nozzle
photoresist injection
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Ceased
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PCT/CN2013/077769
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English (en)
French (fr)
Inventor
徐彬
柯智胜
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TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to US13/981,343 priority Critical patent/US20140322449A1/en
Publication of WO2014172983A1 publication Critical patent/WO2014172983A1/zh
Anticipated expiration legal-status Critical
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

Definitions

  • the present invention relates to the field of liquid crystal display manufacturing, and in particular to a photoresist coating apparatus and a coating method thereof.
  • a conventional photoresist coating apparatus includes a nozzle 1' including a first nozzle split 11' disposed oppositely, a second nozzle split 12', and a first nozzle
  • the split body 11' and the second nozzle split body 12' are mounted with a fixed top plate 13', a slit 10' is formed between the first nozzle split body 11' and the second nozzle split body 12', and the bottom of the slit 10' is light.
  • the discharge outlet 100' (the shaded portion shown in FIG.
  • a photoresist injection tube 112' is disposed in a middle portion of the operation surface 111' of the first nozzle body 11', and a bubble discharge tube 113' is further disposed above the photoresist injection tube 112', and two of the operation surfaces 11
  • the side is also provided with a bubble discharging tube 113' for discharging bubbles which may be generated when the photoresist is injected.
  • the photoresist injection tube 112' and the bubble discharge tube 113' both penetrate the first nozzle body 11' and communicate with the slit 10'.
  • a cavity 110' is provided, and the bubble discharge pipe 113' provided in the middle of the first nozzle body 1 is also in communication with the cavity 110'.
  • FIG. 3 it is a schematic diagram showing the flow state of the photoresist in the slit 10' region during photoresist coating.
  • the direction of the photoresist flow is shown by the arrow in the figure.
  • the photoresist from the photoresist injection pump Pulp
  • the photoresist injection pump is in an accelerated state, and the photoresist flow velocity is accelerated by the pumping force.
  • the pressure is large near the photoresist injection pipe 112', the photoresist flows to both sides, the photoresist fills the entire photoresist injection region, and the photoresist injection region is tapered.
  • the photoresist penetration region is located at the bottom of the slit 10', and the photoresist is discharged through the photoresist discharge port 100' and applied to the substrate.
  • a disadvantage of the above-described photoresist coating apparatus and method is that since the photoresist is injected in the middle portion, the pressure is large near the photoresist injection tube 112', and is discharged through the photoresist penetration region (for example, from the vicinity of C shown in Figs. 1, 3).
  • the amount of light resisted by the spout is relatively large, and the pressure is small on both sides due to the pressure difference, and the amount of light emitted through the photoresist penetration zone (for example, spouting from around A and B shown in Figs. 1, 3) is relatively Smaller, the result is that the uniformity of the photoresist applied to the substrate is poor, and the coating quality is lowered.
  • the technical problem to be solved by the present invention is to provide a photoresist coating apparatus and a coating method thereof for improving the uniformity and quality of photoresist coating.
  • the present invention provides a photoresist coating apparatus, comprising: a nozzle including a first nozzle split body disposed oppositely, a second nozzle split body, and a first nozzle split body and a second nozzle Separately mounting the fixed top plate, forming a slit between the first nozzle split body and the second nozzle split body, and providing a first photoresist injection tube in the middle of the operation surface of the first nozzle split body, the first photoresist injection tube The first nozzle is separated from the slit, and is connected to the slit.
  • Two second photoresist injection tubes are disposed on the operation surface of the first nozzle, respectively, which are respectively located on two sides of the first photoresist injection tube, and the second photoresist
  • the injection tube runs through the first nozzle body and communicates with the slit.
  • the second photoresist injection tube has a smaller aperture than the first photoresist injection tube.
  • the second photoresist injection tube is provided with a control valve for controlling the flow rate of the photoresist in the second photoresist injection tube.
  • the first photoresist injection tube and the second photoresist injection tube are both connected to the photoresist injection pump.
  • the first photoresist injection tube and the second photoresist injection tube are respectively provided with a discharge tube for discharging the air bubbles.
  • a first cavity is disposed at a position where the first photoresist injection tube communicates with the slit, and the bubble discharging tube disposed above the first photoresist injection tube penetrates the first nozzle body and communicates with the first cavity.
  • a second cavity is disposed at a position where the second photoresist injection tube communicates with the slit, and the bubble discharging tube disposed above the second photoresist injection tube penetrates the first nozzle body and communicates with the second cavity.
  • the present invention also provides a coating method of a photoresist coating apparatus, the photoresist coating apparatus comprising a nozzle, the nozzle includes a first nozzle split body disposed oppositely, a second nozzle split body, and the first nozzle split body and the second nozzle
  • the nozzle is separately mounted and fixed to the top plate, a slit is formed between the first nozzle body and the second nozzle body, and a first photoresist injection pipe is disposed in a middle portion of the operation surface of the first nozzle body, and the first photoresist injection is performed.
  • the Tube penetrates the first nozzle body and communicates with the slit; the first photoresist injection tube and the second photoresist injection tube are both connected to the photoresist injection pump; the second photoresist injection tube is provided with a control valve for controlling The second photoresist is injected into the flow of the photoresist in the tube; the coating method comprises: in the acceleration phase of the photoresist injection pump, simultaneously injecting the photoresist into the slit through the first photoresist injection tube and the second photoresist injection tube; During the steady phase of the injection pump, the control valve on the second photoresist injection tube is gradually closed until the control valve is completely closed; during the deceleration phase of the photoresist injection pump, the control valve is closed.
  • the flow rate of the photoresist in the second photoresist injection tube is controlled such that the amount of photoresist injected through the second photoresist injection tube is smaller than the light resistance injected through the first photoresist injection tube.
  • the present invention also provides a photoresist coating apparatus, comprising: a nozzle, the nozzle includes a first nozzle split oppositely disposed, a second nozzle split body, and the first nozzle split body and the second nozzle split body fixedly mounted a top plate, a slit formed between the first nozzle split body and the second nozzle split body, and a first photoresist injection tube is disposed in a middle portion of the operation surface of the first nozzle split body, and the first photoresist injection tube penetrates the first nozzle
  • the body is connected to the slit, and two second photoresist injection tubes are disposed on the operation surface of the first nozzle, respectively, which are respectively located on two sides of the first photoresist injection tube, and the second photoresist injection tube penetrates the first
  • the nozzle is separated from the slit, and the second photoresist injection tube has a smaller diameter than the first photoresist injection tube.
  • the photoresist coating device and the coating method thereof provided by the invention increase the photoresist injection amount on both sides of the slit by adding a second photoresist injection tube to compensate for the corresponding pressure difference between the central portion and the two sides.
  • a large difference in the amount of injected photoresist so that the amount of light emitted from the photoresist penetration zone through the photoresist discharge port can be kept substantially the same whether in the middle position or both sides, thereby ensuring that the photoresist is applied to the substrate. Uniformity on the top, improving coating quality.
  • FIG. 1 is a schematic perspective view of a conventional photoresist coating apparatus.
  • 2 is a side cross-sectional view showing a conventional photoresist coating apparatus in a middle position.
  • Fig. 3 is a view showing the state of photoresist flow in the slit 10' region of the conventional photoresist coating apparatus at the time of photoresist coating.
  • FIG. 4 is a perspective view showing the structure of a photoresist coating apparatus according to an embodiment of the present invention.
  • Fig. 5 is a side cross-sectional view showing the photoresist coating apparatus in a central portion according to an embodiment of the present invention.
  • Figure 6 is a side cross-sectional view showing the photoresist coating apparatus of the embodiment of the present invention at both side positions.
  • Fig. 7 is a view showing the state of photoresist flow in the region of the slit 10 in the photoresist coating apparatus according to the embodiment of the present invention.
  • Fig. 8 is a schematic view showing the comparison of the light-dissipation amount distribution of the photoresist coating apparatus and the conventional photoresist coating apparatus in the coating acceleration stage according to the embodiment of the present invention.
  • Fig. 9 is a timing chart showing the opening degree of the control valve of the photoresist coating apparatus according to the embodiment of the present invention.
  • FIG. 10 is a schematic flow chart of a coating method of a photoresist coating apparatus according to a second embodiment of the present invention.
  • a first embodiment of the present invention provides a photoresist coating apparatus including a nozzle 1 including a first nozzle split body 11 disposed opposite to each other, a second nozzle split body 12, and a first nozzle.
  • the split body 11 and the second nozzle split body 12 are mounted with a fixed top plate 13, a slit 10 is formed between the first nozzle split body 11 and the second nozzle split body 12, and the bottom of the slit 10 is a light-resistance discharge port 100, first The bottoms of the nozzle split body 11 and the second nozzle split body 12 respectively form a pusher.
  • a first photoresist injection pipe 112 is disposed in a middle portion of the operation surface 111 of the first nozzle body 11, and two second photoresist injection pipes 114 are further disposed on the operation surface 111 of the first nozzle body 11 respectively.
  • a discharge tube 113 is provided above the first photoresist injection tube 112 and the second photoresist injection tube 114 for discharging bubbles which may be generated when the photoresist is injected.
  • the first photoresist injection tube 112 and the second photoresist injection tube 114 are both connected to a photoresist injection pump (not shown).
  • the first photoresist injection tube 112 and the discharge tube 113 disposed above thereof penetrate the first nozzle body 11 and communicate with the slit 10.
  • a first cavity 110 is disposed at a position where the first photoresist injection pipe 112 communicates with the slit 10.
  • a discharge tube 113 disposed above the first photoresist injection pipe 112 is also in communication with the first cavity 110.
  • the second photoresist injection pipe 114 and the bubble discharge pipe 113 disposed thereabove penetrate the first nozzle body 11 and communicate with the slit 10.
  • a second cavity 115 is disposed at the intersection of the slit 10, and the bubble discharging tube 113 disposed above the second photoresist injection pipe 114 is also in communication with the second cavity 115.
  • the first cavity 110 and the second cavity 115 function to provide a storage space for the photoresists injected from the first photoresist injection pipe 112 and the second photoresist injection pipe 114, respectively.
  • the shaded portions in Figures 5 and 6 are the photoresist.
  • FIG. 7 it is a schematic diagram of the flow state of the photoresist in the slit 10 region when the photoresist is coated.
  • the flow direction of the photoresist is shown by the arrow in the figure.
  • the photoresist from the photoresist injection pump is injected through the first photoresist injection tube 112.
  • the photoresist injection pump is in an accelerated state, and the photoresist flow rate is also affected by the pumping force.
  • the pressure is large near the photoresist injection pipe 112, and the photoresist flows from the middle to the both sides of the slit 10 until it fills the entire photoresist injection region.
  • the photoresist is injected only in the middle portion, the amount of light-resistance discharge on both sides of the slit is small due to the pressure difference between the middle portion and the two sides, which affects the uniformity of coating.
  • One of the improvements is to add a second photoresist injection tube 114 on both sides. At the beginning of the coating, the photoresist is also injected through the second photoresist injection tube 114 to reach both sides of the slit 10.
  • the advantage of adding the second photoresist injection tube 114 is that the amount of photoresist injection on both sides of the slit 10 is increased to compensate for the large difference in the amount of corresponding injection photoresist caused by the pressure difference between the central portion and the two sides, so that the light is received.
  • the amount of photoresist that is blocked by the permeation zone through the photoresist discharge port 100 can be kept substantially the same whether it is at the intermediate position (C at Fig. 7) or both sides (at A and B in Fig. 7), thereby ensuring light. Uniformity of coating on the substrate, increasing the coating port ⁇
  • the light curve C1 is the distribution of the photoresist amount emitted from the photoresist penetration zone in the acceleration phase of the photoresist injection device of the prior art, and it can be seen that The amount of photoresist on both sides is much lower than the amount of photoresist in the middle position.
  • the dark curve C2 is the distribution of the amount of photoresist discharged from the photoresist penetration zone during the acceleration phase of the photoresist injection pump of the embodiment, and it can be seen that the second photoresist injection tube 114 is added. The amount of photoresist injected on both sides has been greatly reduced from the difference in the amount of photoresist at the intermediate position.
  • the second photoresist injection tube 114 is added.
  • the amount of photoresist to be implanted must be smaller than the amount of photoresist injected from the first photoresist injection tube 112. Therefore, in the embodiment, the aperture of the second photoresist injection tube 114 is smaller than the aperture of the first photoresist injection tube 112.
  • the photoresist injection pump in the acceleration stage when coating.
  • the status of the segment In fact, after the acceleration phase, the photoresist injection pump will enter a stable phase, that is, maintain a constant speed, the photoresist will also move at a constant speed, the middle position (at C in Figure 7) and the two sides (A in Figure 7,
  • the photoresist injection pump continues to enter the deceleration phase, the photoresist flow decelerates and is subjected to a force opposite to the flow direction.
  • the force is applied near the first photoresist injection pipe 112 at the intermediate position, and the pressure difference is caused on both sides due to the pressure difference.
  • the force is small, and the amount of light-resistance on both sides will be greater than the amount of discharge in the middle position. In this case, it is further unnecessary to supplement the amount of photoresist injection on both sides by the second photoresist injection tube 114. That is to say, it is divided by the working state of the photoresist injection pump.
  • the second photoresist injection tube 114 is needed to supplement the photoresist injection amount on both sides; when it is in the stabilization phase and the deceleration phase, it is no longer necessary to pass the first
  • the two photoresist injection tubes 114 are used to supplement the amount of photoresist injection on both sides, and the second photoresist injection tube 114 should be closed.
  • a control valve 116 is provided on the second photoresist injection pipe 114 for controlling the flow rate of the photoresist in the second photoresist injection pipe 114.
  • the opening and closing speed of the control valve 116 can be adjusted according to actual needs. Referring to FIG.
  • a timing chart of the opening degree of the control valve 116 of the present embodiment is shown.
  • the control valve 116 is opened, and the photoresist injection amount on both sides is supplemented by the second photoresist injection tube 114; when the photoresist injection pump is stabilized, the control valve 116 is gradually closed until completely closed, no longer The amount of photoresist injection on both sides is supplemented by the second photoresist injection tube 114.
  • the second embodiment of the present invention provides a coating method for a photoresist coating device.
  • the photoresist coating device is the same as the first embodiment of the present invention, and details are not described herein again.
  • the coating method includes:
  • Step S1 in the acceleration phase of the photoresist injection pump, simultaneously injecting a photoresist into the slit 10 through the first photoresist injection tube 112 and the second photoresist injection tube 114;
  • Step S2 in the stable phase of the photoresist injection pump, gradually close the control valve 116 on the second photoresist injection pipe 112 until the control valve 116 is completely closed;
  • Step S3 the control valve 116 is closed during the deceleration phase of the photoresist injection pump.
  • the step S101 further includes: controlling the flow rate of the photoresist in the second photoresist injection pipe 114 to pass the The amount of photoresist injected by the two photoresist injection tubes 114 is smaller than the amount of photoresist injected through the first photoresist injection tube 112.
  • the photoresist coating device and the coating method thereof provided by the invention increase the photoresist injection amount on both sides of the slit by adding a second photoresist injection tube to compensate for the corresponding pressure difference between the central portion and the two sides.
  • a large difference in the amount of injected photoresist so that the amount of light emitted from the photoresist penetration zone through the photoresist discharge port can be kept substantially the same whether in the middle position or both sides, thereby ensuring that the photoresist is applied to the substrate. Uniformity on the top, improving coating quality.

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  • General Physics & Mathematics (AREA)
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Abstract

一种光阻涂布装置及其涂布方法，其中光阻涂布装置包括：喷嘴（1），所述喷嘴（1）包括相对设置的第一喷嘴分体（11）、第二喷嘴分体（12）以及将所述第一喷嘴分体（11）和第二喷嘴分体（12）安装固定的顶板（13），所述第一喷嘴分体（11）和第二喷嘴分体（12）之间形成狭缝（10），在所述第一喷嘴分体（11）的操作面的中部设有第一光阻注入管（112），所述第一光阻注入管（112）贯穿所述第一喷嘴分体（11），与所述狭缝（10）连通，在所述第一喷嘴分体（11）的操作面上还设有两个第二光阻注入管（114），分别位于所述第一光阻注入管（112）的两侧，所述第二光阻注入管（114）贯穿所述第一喷嘴分体（11），与所述狭缝（10）连通。通过增设第二光阻注入管（114），增加了狭缝（10）两侧的光阻注入量，使得吐出的光阻量保持大体一致，从而确保光阻涂布到基板上的均匀度，提高涂布品质。

Description

一种光阻涂布装置及其涂布方法
本申请要求于 2013 年 4 月 25 日提交中国专利局、 申请号为 201310147362.9、 发明名称为 "一种光阻涂布装置及其涂布方法" 的中国专 利申请的优先权， 上述专利的全部内容通过引用结合在本申请中。 技术领域
本发明涉及液晶显示器制造领域，尤其涉及一种光阻涂布装置及其涂布 方法。
背景技术
在液晶显示器 LCD的制造过程中， 需要使用光阻涂布装置在玻璃基板 上涂上一定厚度的光阻（photo resist )。 请参照图 1和图 2所示， 现有的光阻 涂布装置包括喷嘴 1',该喷嘴 Γ包括相对设置的第一喷嘴分体 11'、第二喷嘴 分体 12'以及将第一喷嘴分体 11'和第二喷嘴分体 12'安装固定的顶板 13', 第 一喷嘴分体 11'和第二喷嘴分体 12'之间形成狭缝 10', 狭缝 10'的底部为光阻 吐出口 100' (如图 2所示的阴影部分即为光阻）， 第一喷嘴分体 11'和第二喷 嘴分体 12'的底部分别形成推体。 在第一喷嘴分体 11'的操作面 111'的中部设 有光阻注入管 112', 在光阻注入管 112'的上方还设有排泡管 113', 此外， 在 操作面 11Γ的两侧也分别设有排泡管 113', 排泡管 113'用于将光阻注入时可 能产生的气泡排出。 光阻注入管 112'和排泡管 113'均贯穿第一喷嘴分体 11', 与狭缝 10'连通。 在光阻注入管 112'与狭缝 10'相接处， 设有空腔 110', 设在 第一喷嘴分体 1 Γ中部的排泡管 113'也与该空腔 110'连通。
再请参照图 3所示， 为光阻涂布时狭缝 10'区域光阻流动状况示意图。 光阻流动方向如图中箭头所示。 当进行涂布时， 来自光阻注入泵 （Pump ) 的光阻通过光阻注入管 112'注入， 在涂布开始阶段， 光阻注入泵处于加速状 态，光阻流速受泵力作用也处于加速状态，在光阻注入管 112'附近压力较大， 光阻向两侧流动， 光阻充满整个光阻注入区， 光阻注入区呈锥形分布。 光阻 渗透区位于狭缝 10'底部， 光阻通过光阻吐出口 100'吐出， 涂布到基板上。 上述光阻涂布装置及方式的缺陷在于， 由于在中部注入光阻， 在光阻注 入管 112'附近压力较大， 经过光阻渗透区吐出 （例如从图 1、 图 3所示 C处 周围吐出）的光阻量相对较大， 而两侧由于压差关系， 压力较小， 经过光阻 渗透区吐出 （例如从图 1、 图 3所示 A、 B处周围吐出）的光阻量相对较小， 造成的后果就是， 使涂布到基板上的光阻均匀度较差， 降低了涂布品质。 发明内容
本发明所要解决的技术问题在于，提供一种提高光阻涂布均匀度和品质 的光阻涂布装置及其涂布方法。
为了解决上述技术问题， 本发明提供一种光阻涂布装置， 其中， 包括： 喷嘴， 喷嘴包括相对设置的第一喷嘴分体、 第二喷嘴分体以及将第一喷嘴分 体和第二喷嘴分体安装固定的顶板， 第一喷嘴分体和第二喷嘴分体之间形成 狭缝， 在第一喷嘴分体的操作面的中部设有第一光阻注入管， 第一光阻注入 管贯穿第一喷嘴分体， 与狭缝连通， 在第一喷嘴分体的操作面上还设有两个 第二光阻注入管， 分别位于第一光阻注入管的两侧， 第二光阻注入管贯穿第 一喷嘴分体， 与狭缝连通。
其中， 第二光阻注入管的口径小于第一光阻注入管。
其中， 第二光阻注入管上设有控制阀， 用于控制第二光阻注入管内光阻 的流量。
其中， 第一光阻注入管和第二光阻注入管均连接到光阻注入泵上。
其中， 第一光阻注入管和第二光阻注入管的上方均分别设有用于排出气 泡的排泡管。
其中， 在第一光阻注入管与狭缝连通处， 设有第一空腔， 设在第一光阻 注入管上方的排泡管贯穿第一喷嘴分体， 与第一空腔连通。
其中， 在第二光阻注入管与狭缝连通处， 设有第二空腔， 设在第二光阻 注入管上方的排泡管贯穿第一喷嘴分体， 与第二空腔连通。
本发明还提供一种光阻涂布装置的涂布方法， 光阻涂布装置包括喷嘴， 喷嘴包括相对设置的第一喷嘴分体、第二喷嘴分体以及将第一喷嘴分体和第 二喷嘴分体安装固定的顶板， 第一喷嘴分体和第二喷嘴分体之间形成狭缝， 在第一喷嘴分体的操作面的中部设有第一光阻注入管， 第一光阻注入管贯穿 第一喷嘴分体， 与狭缝连通； 在第一喷嘴分体的操作面上还设有两个第二光 阻注入管， 分别位于第一光阻注入管的两侧， 第二光阻注入管贯穿第一喷嘴 分体， 与狭缝连通； 第一光阻注入管和第二光阻注入管均连接到光阻注入泵 上；第二光阻注入管上设有控制阀，用于控制第二光阻注入管内光阻的流量； 涂布方法包括： 在光阻注入泵的加速阶段， 同时通过第一光阻注入管和第二 光阻注入管向狭缝注入光阻； 在光阻注入泵的稳定阶段， 逐渐闭合第二光阻 注入管上的控制阀直至控制阀完全关闭； 在光阻注入泵的减速阶段， 关闭控 制阀。
其中， 在光阻注入泵的加速阶段， 控制第二光阻注入管内光阻的流量， 使通过第二光阻注入管注入的光阻量小于通过第一光阻注入管注入的光阻 量。
本发明还提供一种光阻涂布装置， 其中， 包括： 喷嘴， 喷嘴包括相对设 置的第一喷嘴分体、第二喷嘴分体以及将第一喷嘴分体和第二喷嘴分体安装 固定的顶板， 第一喷嘴分体和第二喷嘴分体之间形成狭缝， 在第一喷嘴分体 的操作面的中部设有第一光阻注入管， 第一光阻注入管贯穿第一喷嘴分体， 与狭缝连通， 在第一喷嘴分体的操作面上还设有两个第二光阻注入管， 分别 位于第一光阻注入管的两侧， 第二光阻注入管贯穿第一喷嘴分体， 与狭缝连 通， 第二光阻注入管的口径小于第一光阻注入管。
本发明所提供的光阻涂布装置及其涂布方法， 通过增设第二光阻注入 管， 增加了狭缝两侧的光阻注入量， 弥补因中部与两侧的压力差带来的相应 注入光阻量的较大差距， 使得从光阻渗透区经由光阻吐出口吐出的光阻量， 不管是在中间位置， 还是两侧位置均能保持大体一致， 从而确保光阻涂布到 基板上的均匀度， 提高涂布品质。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案， 下面将对实 施例或现有技术描述中所需要使用的附图作简单地介绍， 显而易见地， 下面 描述中的附图仅仅是本发明的一些实施例， 对于本领域普通技术人员来讲， 在不付出创造性劳动的前提下， 还可以根据这些附图获得其他的附图。
图 1是现有光阻涂布装置的立体结构示意图。 图 2是现有光阻涂布装置在中部位置的侧面剖视示意图。
图 3是现有光阻涂布装置在光阻涂布时狭缝 10'区域的光阻流动状况示 意图。
图 4是本发明实施例一光阻涂布装置的立体结构示意图。
图 5是本发明实施例一光阻涂布装置在中部位置的侧面剖视示意图。 图 6是本发明实施例一光阻涂布装置在两侧位置的侧面剖视示意图。 图 7是本发明实施例一光阻涂布装置在光阻涂布时狭缝 10区域的光阻 流动状况示意图。
图 8是本发明实施例一光阻涂布装置与现有光阻涂布装置在涂布加速阶 段吐出光阻量分布的对比示意图。
图 9是本发明实施例一光阻涂布装置的控制阀开度时序示意图。
图 10是本发明实施例二光阻涂布装置的涂布方法的流程示意图。
具体实施方式
下面参考附图对本发明的优选实施例进行描述。
请参照图 4所示，本发明实施例一提供一种光阻涂布装置， 包括喷嘴 1 , 该喷嘴 1包括相对设置的第一喷嘴分体 11、 第二喷嘴分体 12以及将第一喷 嘴分体 11和第二喷嘴分体 12安装固定的顶板 13 , 第一喷嘴分体 11和第二 喷嘴分体 12之间形成狭缝 10, 狭缝 10的底部为光阻吐出口 100, 第一喷嘴 分体 11和第二喷嘴分体 12的底部分别形成推体。 在第一喷嘴分体 11的操 作面 111的中部设有第一光阻注入管 112, 在第一喷嘴分体 11的操作面 111 上，还设有两个第二光阻注入管 114, 分别位于第一光阻注入管 112的两侧。 在第一光阻注入管 112和第二光阻注入管 114的上方分别设有排泡管 113 , 用于将光阻注入时可能产生的气泡排出。 第一光阻注入管 112和第二光阻注 入管 114均连接到光阻注入泵（未图示）上。
请再参照图 5及图 6所示， 第一光阻注入管 112和设置在其上方排泡管 113均贯穿第一喷嘴分体 11 , 与狭缝 10连通。 在第一光阻注入管 112与狭 缝 10连通处， 设有第一空腔 110, 设在第一光阻注入管 112上方的排泡管 113也与该第一空腔 110连通。 第二光阻注入管 114和设置在其上方的排泡 管 113均贯穿第一喷嘴分体 11 , 与狭缝 10连通。 在第二光阻注入管 114与 狭缝 10连通处，设有第二空腔 115 ,设在第二光阻注入管 114上方的排泡管 113也与该第二空腔 115连通。 第一空腔 110和第二空腔 115的作用在于， 为分别从第一光阻注入管 112和第二光阻注入管 114注入的光阻提供存储空 间。 图 5及图 6中阴影部分即为光阻。
如图 7所示， 为光阻涂布时狭缝 10区域光阻流动状况示意图。 光阻流 动方向如图中箭头所示。 当进行涂布时， 来自光阻注入泵（Pump ) 的光阻 通过第一光阻注入管 112注入，在涂布开始阶段，光阻注入泵处于加速状态， 光阻流速受泵力作用也处于加速状态， 在光阻注入管 112附近压力较大， 光 阻从狭缝 10 中部向两侧流动， 直至充满整个光阻注入区。 如前面有关现有 技术的介绍， 如果仅仅在中部注入光阻， 由于中部与两侧的压力差， 导致狭 缝两侧的光阻吐出量较少， 影响涂布的均匀度， 因此本实施例的改进之一是 增设了两侧的第二光阻注入管 114, 在涂布开始阶段， 光阻也同时通过第二 光阻注入管 114注入， 到达狭缝 10的两侧。 增设第二光阻注入管 114的好 处在于， 增加了狭缝 10两侧的光阻注入量， 弥补因中部与两侧的压力差带 来的相应注入光阻量的较大差距，使得从光阻渗透区经由光阻吐出口 100吐 出的光阻量， 不管是在中间位置（图 7中 C处）， 还是两侧位置（图 7中 A、 B处）均能保持大体一致， 从而确保光阻涂布到基板上的均匀度， 提高涂布 口口 臾
从实际效果来看， 如图 8所示， 其中， 浅色曲线 C1为现有光阻涂布装 置在光阻注入泵加速阶段，从光阻渗透区吐出的光阻量分布状况，可以看出， 两侧的光阻量大大低于中间位置的光阻量。 深色曲线 C2为本实施例的光阻 涂布装置在光阻注入泵加速阶段， 从光阻渗透区吐出的光阻量分布状况， 可 以看出， 由于增设第二光阻注入管 114, 补充了两侧的光阻注入量， 其与中 间位置的光阻量差距已大大缩小。
当然， 由于注入两侧位置的光阻还有部分系由中间位置流动而来， 如欲 实现从中间位置到两侧位置的光阻吐出量相同， 则由增设的第二光阻注入管 114所注入的光阻量须小于从第一光阻注入管 112所注入的光阻量。 因此本 实施例中， 第二光阻注入管 114的口径小于第一光阻注入管 112的口径。
应当说明的是， 上述的说明均是针对在涂布时， 光阻注入泵处于加速阶 段的状况。 实际上， 经过加速阶段， 光阻注入泵将进入稳定阶段， 即保持匀 速， 光阻亦为匀速运动， 中间位置（图 7中 C处）和两侧位置 （图 7中 A、
B处）没有压力差， 光阻吐出量无差异。 这样， 在中部注入的光阻量， 与从 中部流动到两侧的光阻量也能维持大体相同。 所以， 继续通过第二光阻注入 管 114来补充两侧的光阻注入量， 就没有太大必要。 反而可能导致两侧光阻 注入量增加过多，与中部位置的差距再次扩大，影响稳定阶段涂布的均匀度。 当光阻注入泵继续进入到减速阶段时， 光阻流动减速， 受到与流动方向相反 力的作用， 中间位置的第一光阻注入管 112附近受力作用较大， 两侧由于压 差关系， 受力较小， 两侧的光阻吐出量将大于中间位置吐出量。 在这种情况 下， 更无需通过第二光阻注入管 114来补充两侧的光阻注入量。 也就是说， 以光阻注入泵的工作状态来划分， 在加速阶段， 需通过第二光阻注入管 114 来补充两侧的光阻注入量； 到了稳定阶段和减速阶段， 不再需要通过第二光 阻注入管 114来补充两侧的光阻注入量，应关闭第二光阻注入管 114。 由此， 本实施例的又一改进在于， 在第二光阻注入管 114上设置控制阀 116, 用于 控制第二光阻注入管 114内光阻流量。 控制阀 116的开闭速度可以根据实际 需要调整。 请参照图 9所示， 为本实施例的控制阀 116开度时序示意图。 在 光阻注入泵加速阶段， 控制阀 116开启， 通过第二光阻注入管 114来补充两 侧的光阻注入量； 进入光阻注入泵稳定阶段， 控制阀 116逐渐闭合直至完全 关闭， 不再通过第二光阻注入管 114来补充两侧的光阻注入量。 通过前述方 式， 在光阻注入泵的全部工作阶段都可以保证光阻吐出量的均衡和一致性。
请再参照图 10所示， 本发明实施例二提供一种光阻涂布装置的涂布方 法， 该光阻涂布装置与本发明实施例一相同， 此处不再贅述。 该涂布方法包 括：
步骤 S1 ,在光阻注入泵的加速阶段， 同时通过第一光阻注入管 112和第 二光阻注入管 114向狭缝 10注入光阻；
步骤 S2,在光阻注入泵的稳定阶段，逐渐闭合第二光阻注入管 112上的 控制阀 116直至控制阀 116完全关闭；
步骤 S3 , 在光阻注入泵的减速阶段， 关闭控制阀 116。
如前所述， 由于在光阻注入泵的加速阶段， 注入两侧位置的光阻还有部 分系由中间位置流动而来，如欲实现从中间位置到两侧位置的光阻吐出量相 同， 则须步骤 S101进一步包括： 控制第二光阻注入管 114内光阻的流量， 使通过第二光阻注入管 114注入的光阻量小于通过第一光阻注入管 112注入 的光阻量。
本发明所提供的光阻涂布装置及其涂布方法， 通过增设第二光阻注入 管， 增加了狭缝两侧的光阻注入量， 弥补因中部与两侧的压力差带来的相应 注入光阻量的较大差距， 使得从光阻渗透区经由光阻吐出口吐出的光阻量， 不管是在中间位置， 还是两侧位置均能保持大体一致， 从而确保光阻涂布到 基板上的均匀度， 提高涂布品质。
以上所揭露的仅为本发明较佳实施例而已， 当然不能以此来限定本发明 之权利范围， 因此依本发明权利要求所作的等同变化， 仍属本发明所涵盖的 范围。

Claims

权 利 要 求
1、 一种光阻涂布装置， 其中， 包括： 喷嘴， 所述喷嘴包括相对设置的 第一喷嘴分体、第二喷嘴分体以及将所述第一喷嘴分体和第二喷嘴分体安装 固定的顶板， 所述第一喷嘴分体和第二喷嘴分体之间形成狭缝， 在所述第一 喷嘴分体的操作面的中部设有第一光阻注入管， 所述第一光阻注入管贯穿所 述第一喷嘴分体， 与所述狭缝连通， 在所述第一喷嘴分体的操作面上还设有 两个第二光阻注入管， 分别位于所述第一光阻注入管的两侧， 所述第二光阻 注入管贯穿所述第一喷嘴分体， 与所述狭缝连通。
2、 根据权利要求 1 所述的光阻涂布装置， 其中， 所述第二光阻注入管 的口径小于所述第一光阻注入管。
3、 根据权利要求 1 所述的光阻涂布装置， 其中， 所述第二光阻注入管 上设有控制阀， 用于控制所述第二光阻注入管内光阻的流量。
4、 根据权利要求 2所述的光阻涂布装置， 其中， 所述第一光阻注入管 和第二光阻注入管均连接到光阻注入泵上。
5、 根据权利要求 2所述的光阻涂布装置， 其中， 所述第一光阻注入管 和第二光阻注入管的上方均分别设有用于排出气泡的排泡管。
6、 根据权利要求 5所述的光阻涂布装置， 其中， 在所述第一光阻注入 管与所述狭缝连通处， 设有第一空腔， 设在所述第一光阻注入管上方的排泡 管贯穿所述第一喷嘴分体， 与所述第一空腔连通。
7、 根据权利要求 5所述的光阻涂布装置， 其中， 在所述第二光阻注入 管与所述狭缝连通处， 设有第二空腔， 设在所述第二光阻注入管上方的排泡 管贯穿所述第一喷嘴分体， 与所述第二空腔连通。
8、 一种光阻涂布装置的涂布方法， 所述光阻涂布装置包括喷嘴， 所述 喷嘴包括相对设置的第一喷嘴分体、第二喷嘴分体以及将所述第一喷嘴分体 和第二喷嘴分体安装固定的顶板， 所述第一喷嘴分体和第二喷嘴分体之间形 成狭缝， 在所述第一喷嘴分体的操作面的中部设有第一光阻注入管， 所述第 一光阻注入管贯穿所述第一喷嘴分体， 与所述狭缝连通； 在所述第一喷嘴分 体的操作面上还设有两个第二光阻注入管， 分别位于所述第一光阻注入管的 两侧， 所述第二光阻注入管贯穿所述第一喷嘴分体， 与所述狭缝连通； 所述 第一光阻注入管和第二光阻注入管均连接到光阻注入泵上； 所述第二光阻注 入管上设有控制阀， 用于控制所述第二光阻注入管内光阻的流量； 所述涂布 方法包括：
在光阻注入泵的加速阶段， 同时通过所述第一光阻注入管和第二光阻注 入管向所述狭缝注入光阻；
在光阻注入泵的稳定阶段，逐渐闭合所述第二光阻注入管上的控制阀直 至所述控制阀完全关闭；
在光阻注入泵的减速阶段， 关闭所述控制阀。
9、 根据权利要求 8所述的涂布方法， 其中， 在光阻注入泵的加速阶段， 控制所述第二光阻注入管内光阻的流量，使通过所述第二光阻注入管注入的 光阻量小于通过所述第一光阻注入管注入的光阻量。
10、 一种光阻涂布装置， 其中， 包括： 喷嘴， 所述喷嘴包括相对设置的 第一喷嘴分体、第二喷嘴分体以及将所述第一喷嘴分体和第二喷嘴分体安装 固定的顶板， 所述第一喷嘴分体和第二喷嘴分体之间形成狭缝， 在所述第一 喷嘴分体的操作面的中部设有第一光阻注入管， 所述第一光阻注入管贯穿所 述第一喷嘴分体， 与所述狭缝连通， 在所述第一喷嘴分体的操作面上还设有 两个第二光阻注入管， 分别位于所述第一光阻注入管的两侧， 所述第二光阻 注入管贯穿所述第一喷嘴分体， 与所述狭缝连通， 所述第二光阻注入管的口 径小于所述第一光阻注入管。
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CN106938222B (zh) * 2017-02-09 2019-03-22 武汉华星光电技术有限公司 一种光阻涂布装置及喷嘴
CN106938239B (zh) * 2017-04-24 2019-07-16 武汉华星光电技术有限公司 一种涂布头及涂布机
CN107398396A (zh) * 2017-08-24 2017-11-28 武汉华星光电技术有限公司 光阻材料的涂布装置及涂布方法
CN109807025A (zh) * 2019-02-14 2019-05-28 京东方科技集团股份有限公司 胶涂覆装置
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