WO2014170003A1 - Funkenverdampfen von metallischen, intermetallischen und keramischen targetmaterialien um al-cr-n beschichtungen herzustellen - Google Patents
Funkenverdampfen von metallischen, intermetallischen und keramischen targetmaterialien um al-cr-n beschichtungen herzustellen Download PDFInfo
- Publication number
- WO2014170003A1 WO2014170003A1 PCT/EP2014/000989 EP2014000989W WO2014170003A1 WO 2014170003 A1 WO2014170003 A1 WO 2014170003A1 EP 2014000989 W EP2014000989 W EP 2014000989W WO 2014170003 A1 WO2014170003 A1 WO 2014170003A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- target
- intermetallic
- powder
- compound
- coatings
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32614—Consumable cathodes for arc discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
Definitions
- the present invention relates to a coating method based on cathodic spark evaporation.
- Cathodic sputtering is a well known process for depositing nitrides such as Al x Cr 1-x N layers at high deposition rates. With this method, dense and well adhering to the surface layers can be achieved. However, macroparticles (droplets) form during the coating, which are incorporated into the layers and impair the coating quality. Droplet formation occurs in particular when a target contains at least two metals which have very different melting points, as is the case with aluminum and chromium. The size and number of these droplets can be reduced by increasing the nitrogen flow.
- the object of the present invention is to further reduce the number and size of the droplets.
- the spark evaporation is operated by means of targets prepared by powder metallurgy in which the components are present as intermetallic compounds, ie for the target preparation, a powder was used which contains an intermetallic compound.
- An example of such an intermetallic compound is Al 8 Cr 5 .
- an Al-Cr-N layer can be obtained which essentially contains a composition of metallic proportions of 60 at% Al and 40 at% Cr. If, for example, a layer with a concentration ratio of 70 at% Al and 30 at% Cr is to be prepared, it is possible to resort to a target with the intermetallic compound Al 9 Cr 4 .
- a powder metallurgically produced target can be used in the case of the powder of a intermetallic compound was mixed with the powder of another intermetallic compound.
- the atomic concentration of the metallic constituents then depends on the mixing ratio of the two powders.
- targets which contain the ceramic compounds AIN and CrN can also be used on targets which contain the ceramic compounds AIN and CrN.
- a method for coating a substrate by means of cathodic spark evaporation wherein a powder metallurgy produced target is used as source of material for the spark evaporation, and wherein the powder used for the target preparation contains a first intermetallic compound and a second intermetallic compound.
- a method for coating a substrate by means of cathodic spark evaporation wherein a powder metallurgically produced target is used as material source for the spark evaporation, and wherein the powder used for the target preparation contains a first ceramic compound, preferably AIN, and a second ceramic compound, preferably CrN, contains.
- the powder used for the preparation of the target contains both an intermetallic compound and a ceramic compound.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
- Ceramic Products (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP14718326.3A EP2986753B8 (de) | 2013-04-18 | 2014-04-14 | Funkenverdampfen von metallischen, intermetallischen und keramischen targetmaterialien um al-cr-n beschichtungen herzustellen |
| CN201480021672.9A CN105164306A (zh) | 2013-04-18 | 2014-04-14 | 电弧蒸发金属靶材、金属间化合物靶材和陶瓷靶材以制造Al-Cr-N涂层 |
| JP2016508033A JP2016519218A (ja) | 2013-04-18 | 2014-04-14 | Al−Cr−Nコーティングを生成するための金属、金属間化合物及びセラミックターゲット材料のアーク蒸着 |
| KR1020157032710A KR20150143783A (ko) | 2013-04-18 | 2014-04-14 | AlCrN 코팅을 제조하기 위한 금속, 금속간 및 세라믹 표적 재료들의 아크 증착 |
| US14/785,357 US20160053364A1 (en) | 2013-04-18 | 2014-04-14 | ARC VAPORIZATION OF METALLIC, INTERMETALLIC, AND CERAMIC TARGET MATERIALS IN ORDER TO PRODUCE Al-Cr-N COATINGS |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102013006633.6 | 2013-04-18 | ||
| DE102013006633.6A DE102013006633A1 (de) | 2013-04-18 | 2013-04-18 | Funkenverdampfen von metallischen, intermetallischen und keramischen Targetmaterialien um Al-Cr-N Beschichtungen herzustellen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2014170003A1 true WO2014170003A1 (de) | 2014-10-23 |
Family
ID=50513881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2014/000989 Ceased WO2014170003A1 (de) | 2013-04-18 | 2014-04-14 | Funkenverdampfen von metallischen, intermetallischen und keramischen targetmaterialien um al-cr-n beschichtungen herzustellen |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20160053364A1 (enExample) |
| EP (1) | EP2986753B8 (enExample) |
| JP (1) | JP2016519218A (enExample) |
| KR (1) | KR20150143783A (enExample) |
| CN (1) | CN105164306A (enExample) |
| AR (1) | AR095879A1 (enExample) |
| DE (1) | DE102013006633A1 (enExample) |
| WO (1) | WO2014170003A1 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102877458B1 (ko) * | 2023-03-09 | 2025-10-29 | 주식회사 이엠엘 | 다중 타겟을 이용한 코팅 방법 및 그에 따른 코팅재 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001226764A (ja) * | 2000-02-10 | 2001-08-21 | Shin Etsu Chem Co Ltd | スパッタリングのターゲット材用焼結体、その製造方法、及びスパッタリング用ターゲット |
| CH693035A5 (de) * | 1994-06-24 | 2003-01-31 | Unaxis Balzers Ag | Verfahren zur Herstellung eines Targets, nach dem Verfahren hergestelltes Target und Verwendung desselben. |
| JP2010236060A (ja) * | 2009-03-31 | 2010-10-21 | Hitachi Tool Engineering Ltd | 窒化物分散Ti−Al系ターゲット及びその製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2275585A (en) * | 1937-10-08 | 1942-03-10 | Clad Metals Ind Inc | Method of making composite metal |
| US3836451A (en) * | 1968-12-26 | 1974-09-17 | A Snaper | Arc deposition apparatus |
| US3625848A (en) * | 1968-12-26 | 1971-12-07 | Alvin A Snaper | Arc deposition process and apparatus |
| LU78204A1 (de) * | 1977-09-29 | 1979-05-25 | Bleichert Foerderanlagen Gmbh | Einschienenfoerderanlage |
| US5342571A (en) * | 1992-02-19 | 1994-08-30 | Tosoh Smd, Inc. | Method for producing sputtering target for deposition of titanium, aluminum and nitrogen coatings, sputtering target made thereby, and method of sputtering with said targets |
| JPH09249966A (ja) * | 1996-03-13 | 1997-09-22 | Mitsubishi Materials Corp | 金属間化合物分散型焼結Al合金製スパッタリングターゲット |
| US20070189916A1 (en) * | 2002-07-23 | 2007-08-16 | Heraeus Incorporated | Sputtering targets and methods for fabricating sputtering targets having multiple materials |
| US6759005B2 (en) * | 2002-07-23 | 2004-07-06 | Heraeus, Inc. | Fabrication of B/C/N/O/Si doped sputtering targets |
| EP1627094B1 (de) * | 2003-04-28 | 2018-10-24 | Oerlikon Surface Solutions AG, Pfäffikon | Werkstück mit alcr-haltiger hartstoffschicht |
| US7575039B2 (en) * | 2003-10-15 | 2009-08-18 | United Technologies Corporation | Refractory metal core coatings |
| JP5192642B2 (ja) * | 2005-11-11 | 2013-05-08 | 三菱重工業株式会社 | 表面被覆部材及びその製造方法ならびに工具及び工作装置 |
| JP2008179853A (ja) * | 2007-01-24 | 2008-08-07 | Hitachi Tool Engineering Ltd | ホウ化物含有ターゲット材 |
| SE531749C2 (sv) * | 2007-09-17 | 2009-07-28 | Seco Tools Ab | Metod att utfälla slitstarka skikt på hårdmetall med bågförångning och katod med Ti3SiC2 som huvudbeståndsdel |
| CN102124138A (zh) * | 2008-08-17 | 2011-07-13 | 欧瑞康贸易股份公司(特吕巴赫) | 适用于火花蒸发的靶的应用以及适于此应用的靶的制备方法 |
| PL2166128T3 (pl) * | 2008-09-19 | 2012-05-31 | Oerlikon Trading Ag | Sposób wytwarzania powłok z tlenków metali przez naparowywanie łukowe |
| EP2363509A1 (en) * | 2010-02-28 | 2011-09-07 | Oerlikon Trading AG, Trübbach | Synthesis of metal oxides by reactive cathodic arc evaporation |
| DE102010042828A1 (de) * | 2010-10-22 | 2012-04-26 | Walter Ag | Target für Lichtbogenverfahren |
-
2013
- 2013-04-18 DE DE102013006633.6A patent/DE102013006633A1/de not_active Withdrawn
-
2014
- 2014-04-14 WO PCT/EP2014/000989 patent/WO2014170003A1/de not_active Ceased
- 2014-04-14 US US14/785,357 patent/US20160053364A1/en not_active Abandoned
- 2014-04-14 CN CN201480021672.9A patent/CN105164306A/zh active Pending
- 2014-04-14 JP JP2016508033A patent/JP2016519218A/ja active Pending
- 2014-04-14 EP EP14718326.3A patent/EP2986753B8/de active Active
- 2014-04-14 KR KR1020157032710A patent/KR20150143783A/ko not_active Withdrawn
- 2014-04-16 AR ARP140101617A patent/AR095879A1/es unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH693035A5 (de) * | 1994-06-24 | 2003-01-31 | Unaxis Balzers Ag | Verfahren zur Herstellung eines Targets, nach dem Verfahren hergestelltes Target und Verwendung desselben. |
| JP2001226764A (ja) * | 2000-02-10 | 2001-08-21 | Shin Etsu Chem Co Ltd | スパッタリングのターゲット材用焼結体、その製造方法、及びスパッタリング用ターゲット |
| JP2010236060A (ja) * | 2009-03-31 | 2010-10-21 | Hitachi Tool Engineering Ltd | 窒化物分散Ti−Al系ターゲット及びその製造方法 |
Non-Patent Citations (1)
| Title |
|---|
| BRIAN GABBITAS ET AL: "Microstructural evolution during mechanical milling of Ti/Al powder mixture and production of intermetallic TiAl cathode target", JOURNAL OF MATERIALS SCIENCE, KLUWER ACADEMIC PUBLISHERS, BO, vol. 47, no. 3, 7 September 2011 (2011-09-07), pages 1234 - 1243, XP019993186, ISSN: 1573-4803, DOI: 10.1007/S10853-011-5886-9 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2986753B1 (de) | 2019-03-20 |
| US20160053364A1 (en) | 2016-02-25 |
| EP2986753A1 (de) | 2016-02-24 |
| CN105164306A (zh) | 2015-12-16 |
| KR20150143783A (ko) | 2015-12-23 |
| JP2016519218A (ja) | 2016-06-30 |
| DE102013006633A1 (de) | 2014-10-23 |
| EP2986753B8 (de) | 2019-06-19 |
| AR095879A1 (es) | 2015-11-18 |
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