WO2014157585A1 - ヒューズエレメント、及びヒューズ素子 - Google Patents
ヒューズエレメント、及びヒューズ素子 Download PDFInfo
- Publication number
- WO2014157585A1 WO2014157585A1 PCT/JP2014/059037 JP2014059037W WO2014157585A1 WO 2014157585 A1 WO2014157585 A1 WO 2014157585A1 JP 2014059037 W JP2014059037 W JP 2014059037W WO 2014157585 A1 WO2014157585 A1 WO 2014157585A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fuse element
- fuse
- metal layer
- melting point
- point metal
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/08—Fusible members characterised by the shape or form of the fusible member
- H01H85/11—Fusible members characterised by the shape or form of the fusible member with applied local area of a metal which, on melting, forms a eutectic with the main material of the fusible member, i.e. M-effect devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/02—Details
- H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
- H01H85/05—Component parts thereof
- H01H85/055—Fusible members
- H01H85/06—Fusible members characterised by the fusible material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H2207/00—Connections
- H01H2207/02—Solder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/48—Protective devices wherein the fuse is carried or held directly by the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
- H01H85/48—Protective devices wherein the fuse is carried or held directly by the base
- H01H85/50—Protective devices wherein the fuse is carried or held directly by the base the fuse having contacts at opposite ends for co-operation with the base
Definitions
- the present invention relates to a fuse element and a fuse element that are mounted on a current path and blown by self-heating when a current exceeding the rating flows, and cuts off the current path.
- the present invention relates to a fuse element excellent in insulation.
- a fuse element that melts by self-heating when a current exceeding the rating flows and interrupts the current path has been used.
- the fuse element for example, a holder-fixed fuse in which solder is enclosed in a glass tube, a chip fuse in which an Ag electrode is printed on the surface of a ceramic substrate, or a screw fixing in which a part of a copper electrode is thinned and incorporated in a plastic case or Plug-in fuses are often used.
- a high melting point solder containing Pb having a melting point of 300 ° C. or higher is preferable for the fuse element in terms of fusing characteristics so as not to melt by the heat of reflow.
- Pb-containing solder is only limitedly recognized, and it is considered that the demand for Pb-free solder will increase in the future.
- the fuse element can be surface-mounted by reflow and has excellent mountability to the fuse element, it can handle a large current by raising its rating, and the current path is quickly interrupted when overcurrent exceeds the rating. It is required to have fast fusing properties.
- an object of the present invention is to provide a fuse element that can be surface-mounted and can achieve both improvement in rating and fast fusing property, and a fuse element using the same.
- a fuse element according to the present invention constitutes a current-carrying path of a fuse element, and in a fuse element that melts by self-heating when a current exceeding a rating is applied, a low-melting-point metal layer, A high melting point metal layer laminated on the low melting point metal layer, and the low melting point metal layer erodes and melts the high melting point metal layer when the current is applied.
- the fuse element according to the present invention includes an insulating substrate, and a fuse element that is mounted on the insulating substrate and that melts the energization path by self-heating when a current exceeding the rating is energized. And a low melting point metal layer and a high melting point metal layer laminated on the low melting point metal layer, and the low melting point metal layer erodes and melts the high melting point metal layer during the energization.
- the fuse element is formed by laminating the high melting point metal layer as the outer layer on the low melting point metal layer as the inner layer, so that the reflow temperature exceeds the melting temperature of the low melting point metal layer, It does not blow out as a fuse element. Therefore, the fuse element can be efficiently mounted by reflow.
- the fuse element according to the present invention melts by self-heating and interrupts the energization path. At this time, in the fuse element, the melted low melting point metal layer erodes the high melting point metal layer, so that the high melting point metal layer is melted at a temperature lower than the melting temperature. Therefore, the fuse element can be blown out in a short time using the erosion action of the high melting point metal layer by the low melting point metal layer.
- the fuse element is formed by laminating a low-melting metal layer with a low-melting-point metal layer, the conductor resistance can be greatly reduced, compared to a conventional chip fuse of the same size.
- the current rating can be greatly improved.
- it can be made thinner than conventional chip fuses having the same current rating, and is excellent in quick fusing.
- FIG. 1 is a cross-sectional view showing a fuse element to which the present invention is applied and the fuse element.
- FIG. 2 is a cross-sectional view showing another fuse element to which the present invention is applied.
- FIG. 3 is a cross-sectional view showing another fuse element to which the present invention is applied.
- 4A and 4B are perspective views showing another fuse element to which the present invention is applied, in which FIG. 4A shows a high melting point metal layer provided on the upper and lower surfaces of a low melting point metal layer, and FIG. 4B shows a high melting point metal layer. Is provided on the surface of a long low melting point metal and cut to an appropriate length, (C) shows a high melting point metal layer provided on the surface of a wire-like low melting point metal and cut to an appropriate length.
- FIG. 5 is a perspective view showing a fuse element in which a protective member is formed.
- 6A and 6B are diagrams showing a fuse element protected by a protective case, in which FIG. 6A is an exploded perspective view, FIG. 6B is a perspective view showing a state in which the fuse element is housed in a housing, and FIG. It is a perspective view which shows the state obstruct
- FIG. 7 is a cross-sectional view showing a fuse element in which a fuse element is sandwiched between clamp terminals.
- FIG. 8 is a cross-sectional view showing an embodiment in which the fuse element itself fitted and connected to the clamp terminal is used as a fuse element.
- FIG. 9 is a perspective view showing another fuse element to which the present invention is applied.
- 10A and 10B are diagrams showing a manufacturing process of a fuse element using the fuse element shown in FIG. 9, wherein FIG. 10A is a perspective view of the insulating substrate, FIG. 10B is a state in which the fuse element is mounted on the insulating substrate, and FIG. ) Is a state in which a flux is provided on the fuse element, (D) is a state in which a cover member is mounted, and (E) is a state of mounting on a circuit board.
- 11A and 11B are diagrams showing a fusing state of a fuse element using a single plate-like element, in which FIG.
- FIG. 11A shows a state in which a current exceeding the rated value has started to be applied
- FIG. (C) shows a state in which the element is blown out explosively with arc discharge
- 12A and 12B are diagrams showing a fusing state of a fuse element using a fuse element having a plurality of element portions, where FIG. 12A shows a state in which a current exceeding the rating starts to be applied, and FIG. The blown state, (C) shows a state where the inner element portion is blown with arc discharge.
- FIGS. 13A and 13B are plan views showing the fuse element.
- FIG. 13A is a view in which both sides of the element portion are integrally supported
- FIG. 13B is a view in which one side of the element portion is integrally supported.
- FIG. 13A is a view in which both sides of the element portion are integrally supported
- FIG. 13B is a view in which one side of the element portion is integrally supported.
- FIG. 14 is a perspective view showing a fuse element in which three elements are arranged in parallel.
- FIGS. 15A and 15B are diagrams showing a fuse element in which a protruding portion is provided on the first and second electrodes, where FIG. 15A is a plan view of an insulating substrate and FIG. 15B is a perspective view.
- FIG. 16 is a diagram showing a manufacturing process of another fuse element using the fuse element shown in FIG. 9, (A) is a perspective view of the insulating substrate, (B) is a state in which the fuse element is mounted on the insulating substrate, (C) shows a state where flux is provided on the fuse element, and (D) shows a state where a cover member is mounted and a state where the cover member is mounted on the circuit board.
- FIG. 17 is a perspective view showing another fuse element using another fuse element.
- 18A and 18B are plan views showing an insulating substrate on which first and second divided electrodes are formed.
- the fuse element 1 As shown in FIG. 1, the fuse element 1 according to the present invention includes an insulating substrate 2, first and second electrodes 3, 4 provided on the insulating substrate 2, and first and second electrodes 3, 4.
- the fuse element 5 is mounted between the first electrode 3 and the second electrode 4.
- the fuse element 5 is blown by self-heating when a current exceeding the rating is applied and the current path between the first electrode 3 and the second electrode 4 is interrupted.
- the insulating substrate 2 is formed in a square shape by an insulating member such as alumina, glass ceramics, mullite, zirconia.
- the insulating substrate 2 may be made of a material used for a printed wiring board such as a glass epoxy board or a phenol board.
- First and second electrodes 3 and 4 are formed at opposite ends of the insulating substrate.
- the first and second electrodes 3 and 4 are each formed by a conductive pattern such as a Cu wiring, and a protective layer 6 such as Sn plating is appropriately provided on the surface as an anti-oxidation measure.
- the first and second electrodes 3 and 4 extend from the front surface 2a of the insulating substrate 2 to the back surface 2b through the side surfaces.
- the fuse element 1 is mounted on the current path of the circuit board via the first and second electrodes 3 and 4 formed on the back surface 2b.
- fuse element 5 mounted between the first and second electrodes 3 and 4 is melted by self-heating (Joule heat) when a current exceeding the rating is applied, and the first electrode 3 and the second electrode The current path to 4 is cut off.
- the fuse element 5 is a laminated structure composed of an inner layer and an outer layer.
- the fuse element 5 has a low melting point metal layer 5a as an inner layer and a refractory metal layer 5b as an outer layer laminated on the low melting point metal layer 5a. Is formed.
- the fuse element 5 is mounted between the first and second electrodes 3 and 4 via an adhesive material 8 such as solder and then connected to the insulating substrate 2 by reflow soldering or the like.
- the low melting point metal layer 5a is preferably a metal mainly composed of Sn, and is a material generally called “Pb-free solder” (for example, M705, manufactured by Senju Metal Industry).
- the melting point of the low melting point metal layer 5a is not necessarily higher than the temperature of the reflow furnace, and may be melted at about 200 ° C.
- the high melting point metal layer 5b is a metal layer laminated on the surface of the low melting point metal layer 5a, and is, for example, Ag or Cu, or a metal mainly composed of either of them, and the fuse element 5 is removed from the reflow furnace. Therefore, it has a high melting point that does not melt even when mounting on the insulating substrate 2.
- the fuse element 5 5 does not lead to fusing. Therefore, the fuse element 5 can be efficiently mounted by reflow.
- the fuse element 5 is not melted by self-heating while a predetermined rated current flows.
- a current having a value higher than the rating flows, the current is melted by self-heating, and the current path between the first and second electrodes 3 and 4 is interrupted.
- the fuse element 5 the melted low melting point metal layer 5a erodes the refractory metal layer 5b, so that the refractory metal layer 5b is melted at a temperature lower than the melting temperature. Therefore, the fuse element 5 can be blown out in a short time using the erosion action of the high melting point metal layer 5b by the low melting point metal layer 5a.
- the molten metal of the fuse element 5 is divided into left and right by the physical pulling action of the first and second electrodes 3, 4, the first and second electrodes can be quickly and reliably.
- the current path between 3 and 4 can be interrupted.
- the fuse element 5 is configured by laminating the high melting point metal layer 5b on the low melting point metal layer 5a serving as the inner layer, the fusing temperature is greatly reduced as compared with a conventional chip fuse made of a high melting point metal. be able to. Therefore, the fuse element 5 can have a larger cross-sectional area and can greatly improve the current rating as compared with a chip fuse of the same size. In addition, it can be made smaller and thinner than conventional chip fuses having the same current rating, and is excellent in quick fusing.
- the fuse element 5 can improve resistance to a surge (pulse resistance) in which an abnormally high voltage is instantaneously applied to the electrical system in which the fuse element 1 is incorporated. That is, the fuse element 5 must not be blown until, for example, a current of 100 A flows for several milliseconds.
- the fuse element 5 since a large current flowing in a very short time flows in the surface layer of the conductor (skin effect), the fuse element 5 is provided with a refractory metal layer 5b such as Ag plating having a low resistance value as an outer layer. It is easy to flow the current applied by the surge, and it is possible to prevent fusing due to self-heating. Therefore, the fuse element 5 can greatly improve the resistance to a surge as compared with a fuse made of a conventional solder alloy.
- a fuse element a fuse element (Example) in which both sides of a low melting point metal foil (Sn96.5 / Ag / Cu) were plated with a thickness of 4 ⁇ m and a low melting point metal foil (Pb90 / Sn). / Ag) was prepared as a fuse element (comparative example).
- the fuse element according to the example has a cross-sectional area of 0.1 mm 2 , a length L of 1.5 mm, and a fuse element resistance of 2.4 m ⁇ .
- the fuse element according to the comparative example has a sectional area of 0.15 mm 2 , a length L of 1.5 mm, and a fuse element resistance of 2.4 m ⁇ .
- the fuse element according to the example was able to withstand 3890 pulses until fusing, but the fuse element according to the comparative example has a larger cross-sectional area than the fuse element according to the example. Regardless, it could only endure 412 times. From this, it is understood that the pulse resistance of the fuse element in which the high melting point metal layer is laminated on the low melting point metal layer is greatly improved.
- the fuse element 5 preferably has a volume of the low melting point metal layer 5a larger than that of the high melting point metal layer 5b. By increasing the volume of the low melting point metal layer 5a, the fuse element 5 can be effectively melted in a short time by erosion of the high melting point metal layer 5b.
- the fuse element 5 has a covering structure in which an inner layer is a low melting point metal layer 5a and an outer layer is a high melting point metal layer 5b, and the layer thickness ratio between the low melting point metal layer 5a and the high melting point metal layer 5b is low melting point metal.
- Layer: refractory metal layer 2.1: 1 to 100: 1.
- the volume of the low melting point metal layer 5a can be made larger than the volume of the high melting point metal layer 5b as the thickness of the low melting point metal layer 5a increases to 1 or more.
- the low melting point metal layer 5a melted by heat during reflow mounting may be eroded.
- the range of the film thickness is that a sample of a plurality of fuse elements with different film thicknesses is prepared and mounted on the first and second electrodes 3 and 4 via solder paste, and then a temperature of 260 ° C. corresponding to reflow. It was determined by observing the state where the fuse element did not melt.
- the high melting point metal layer 100: 1 is also possible.
- the thickness of the low melting point metal layer 5a is preferably 30 ⁇ m or more in general, although it depends on the size of the fuse element in consideration of diffusion of erosion to the high melting point metal layer 5b and quick fusing.
- the fuse element 5 can be manufactured by depositing the high melting point metal 5b on the surface of the low melting point metal layer 5a using a plating technique.
- the fuse element 5 can be efficiently manufactured by, for example, applying Ag plating to the surface of a long solder foil, and can be easily used by cutting according to the size at the time of use.
- the fuse element 5 may be manufactured by bonding a low melting point metal foil and a high melting point metal foil.
- the fuse element 5 can be manufactured by, for example, pressing a rolled solder foil between two rolled Cu foils or an Ag foil.
- the low melting point metal foil it is preferable to select a softer material than the high melting point metal foil.
- variation in thickness can be absorbed and a low melting metal foil and a high melting metal foil can be stuck without gap.
- the film thickness of the low melting point metal foil is reduced by pressing, it is preferable to make it thick beforehand.
- the low-melting-point metal foil protrudes from the end face of the fuse element by pressing, it is preferable to trim off and adjust the shape.
- the fuse element 5 can also form the fuse element 5 in which the refractory metal layer 5b is laminated on the low melting point metal layer 5a by using a thin film forming technique such as vapor deposition or other known lamination technique. .
- the fuse element 5 may be formed by alternately forming a plurality of low melting point metal layers 5a and high melting point metal layers 5b.
- the outermost layer may be either the low melting point metal layer 5a or the high melting point metal layer 5b.
- the fuse element 5 may further form an antioxidant film 7 on the surface of the outermost refractory metal layer 5b.
- the fuse element 5 has an outermost refractory metal layer 5b covered with an anti-oxidation film 7 to prevent Cu oxidation even when, for example, Cu plating or Cu foil is formed as the refractory metal layer 5b. can do. Therefore, the fuse element 5 can prevent a situation where the fusing time is prolonged due to oxidation of Cu, and can be blown in a short time.
- the fuse element 5 can be formed without using an inexpensive material such as Ag, which is inexpensive but easily oxidized, such as Cu, as the high melting point metal layer 5b.
- the high melting point metal antioxidant film 7 can be made of the same material as the inner low melting point metal layer 5a, for example, Pb-free solder containing Sn as a main component.
- the antioxidant film 7 can be formed by performing tin plating on the surface of the refractory metal layer 5b.
- the antioxidant film 7 can be formed by Au plating or preflux.
- the fuse element 5 may be formed by laminating a high melting point metal layer 5b on the upper surface and the back surface of the low melting point metal layer 5a, or as shown in FIG.
- the outer peripheral portion of the low melting point metal layer 5a excluding the two opposing end faces may be covered with the high melting point metal layer 5b.
- the fuse element 5 may be a rectangular soluble conductor, or may be a round wire soluble conductor as shown in FIG. Furthermore, the entire surface of the fuse element 5 including the end surface may be covered with the refractory metal layer 5b.
- the fuse element 5 may be provided with a protective member 10 on at least a part of the outer periphery.
- the protective member 10 prevents the inflow of connecting solder and the outflow of the low melting point metal layer 5a of the inner layer when the reflow mounting of the fuse element 5 is performed, and maintains the shape, and also melted solder when a current exceeding the rating flows. Inflow is prevented, and the rapid fusing property is prevented from lowering due to an increase in rating.
- the protective member 10 on the outer periphery, the low melting point metal layer 5a melted at the reflow temperature can be prevented from flowing out, and the shape of the element can be maintained.
- the protective member 10 is provided on the outer peripheral portion. The low melting point metal is prevented from flowing out from the side surface, and the shape can be maintained.
- the fuse element 5 can prevent the molten solder from flowing in when a current exceeding the rating flows by providing the protective member 10 on the outer periphery.
- the fuse element 5 When the fuse element 5 is connected to the first and second electrodes 3 and 4 by soldering, the fuse element 5 generates heat when a current exceeding the rating flows, so that solder for connecting to the first and second electrodes is reduced. There is a possibility that the metal constituting the melting point metal layer 5a melts and flows into the center of the fuse element 5 to be blown.
- the fuse element 5 When a molten metal such as solder flows in, the fuse element 5 has a resistance value that is reduced and heat generation is hindered, and does not blow at a predetermined current value, or the fusing time is increased, or after fusing, the first and second electrodes 3 and 3 There is a risk of impairing the insulation reliability between the four. Therefore, the fuse element 5 is provided with the protective member 10 on the outer periphery to prevent the inflow of molten metal, to fix the resistance value, to blow out quickly at a predetermined current value, and to the first and second electrodes. The insulation reliability between 3 and 4 can be ensured.
- the protective member 10 is preferably made of a material having insulation properties and heat resistance at a reflow temperature and resist properties against molten solder.
- the protection member 10 can be formed by using a polyimide film and attaching it to the center of the tape-shaped fuse element 5 with an adhesive 11 as shown in FIG.
- the protective member 10 can be formed by applying an ink having insulating properties, heat resistance, and resist properties to the outer periphery of the fuse element 5.
- the protective member 10 can be formed by applying a solder resist to the outer periphery of the fuse element 5.
- the protective member 10 made of the above-described film, ink, solder resist or the like can be formed on the outer periphery of the long fuse element 5 by sticking or coating, and the fuse element provided with the protective member 10 when used. What is necessary is just to cut
- the protective member 10 may be a protective case 10a that houses the fuse element 5.
- the protective case 10a includes, for example, a housing 12 whose upper surface is opened and a lid body 13 that covers the upper surface of the housing 12.
- the protective case 10a has an opening 14 that leads both ends of the fuse element 5 connected to the first and second electrodes 3 and 4 outward.
- the protective case 10a is closed except for the opening 14 through which the fuse element 5 is led out, and prevents intrusion of molten solder or the like into the housing 12.
- the protective case 10a can be formed using an engineering plastic having insulating properties, heat resistance, and resist properties.
- the protective case 10a accommodates the fuse element 5 from the opened upper surface side of the housing 12, and is closed by the lid 13 as shown in FIG. 6 (C). It is formed. Both ends of the fuse element 5 connected to the first and second electrodes 3 and 4 are bent downward and led out from the side surface of the housing 12.
- an opening 14 through which the fuse element 5 is led out is formed by the convex portion 13 a formed on the inner surface of the lid body 13 and the side surface of the housing 12.
- the fuse element 5 provided with the protective member 10 and the protective case 10a is used by being incorporated in the fuse element 1 (see FIG. 1). May be directly surface mounted.
- the fuse element 1 is mounted with a fuse element 5 spaced apart from the surface 2 a of the insulating substrate 2.
- the fuse element 1 is reliably connected between the first and second electrodes 3 and 4 without the molten metal of the fuse element 5 adhering to the surface 2 a of the insulating substrate 2.
- the current path can be interrupted.
- the molten metal of the fuse element adheres on the insulating substrate between the first and second electrodes. Leaks.
- a fuse element in which a fuse element is formed by printing an Ag paste on a ceramic substrate the ceramic and silver are sintered and bite in and remain between the first and second electrodes. Therefore, a leak current flows between the first and second electrodes due to the residue, and the current path cannot be completely blocked.
- the fuse element 5 is formed separately from the insulating substrate 2 and mounted separately from the surface 2 a of the insulating substrate 2. Therefore, when the fuse element 5 is melted, the fuse element 1 is drawn onto the first and second electrodes without causing the molten metal to penetrate into the insulating substrate 2 and reliably insulates the first and second electrodes from each other. be able to.
- the fuse element 5 has a fuse element as shown in FIG. 1 for preventing oxidation of the outer high-melting-point metal layer 5b or the low-melting-point metal layer 5a, removing oxide at the time of fusing, and improving solder fluidity.
- the flux 17 may be applied to almost the entire surface of the outer layer 5. By applying the flux 17, the wettability of the low melting point metal (for example, solder) is enhanced, and the oxide while the low melting point metal is dissolved is removed, thereby eroding the high melting point metal (for example, silver). It can be used to improve the fast fusing property.
- the anti-oxidation film 7 such as Pb-free solder containing Sn as a main component is formed on the surface of the outermost refractory metal layer 5b by applying the flux 17, the anti-oxidation film 7 is also formed.
- the oxide can be removed, the refractory metal layer 5b can be effectively prevented from being oxidized, and the fast fusing property can be maintained and improved.
- the fuse element 5 can be connected to the first and second electrodes 3 and 4 by reflow soldering as described above. In addition, the fuse element 5 can be connected to the first and second electrodes by ultrasonic welding. It may be connected on the two electrodes 3 and 4.
- the fuse element 5 may be mounted by a clamp terminal 21 connected to the first and second electrodes 3 and 4 as shown in FIG.
- the clamp terminal 21 can be easily connected by clamping the end of the fuse element 5 by pressure bonding.
- the fuse element 5 physically fitted and connected by the clamp terminal 21 is directly used as a fuse element as it is in the fuse box or the breaker device as shown in FIG. It may be incorporated.
- the fuse element 5 is sandwiched between the first and second electric wire terminals 23 and 24 arranged on the insulating terminal block 22 and the clamp terminal 21, and the clamp terminal 21, the electric wire terminals 23 and 24, and the insulating terminal
- the bolts 25 penetrating the base 22 and the fasteners such as nuts 26 arranged on the back surface of the insulated terminal base 22 are fixed.
- a cover member 20 may be placed on the insulating substrate 2 in order to protect the surface 2 a of the insulating substrate 2 configured as described above.
- the fuse element 5 is applied to the fuse element 1 that is blown by self-heating due to a current exceeding the above-described rating, and is a lithium ion secondary battery that is blown by heating of a heating element provided on an insulating substrate to cut off a current path. It can also be applied to a protective element for equal use.
- FIG. 9 is a perspective view of the fuse element 30, and FIG. 10 is a perspective view showing a manufacturing process of the fuse element 40 using the fuse element 30.
- the fuse element 40 includes an insulating substrate 2 provided with first and second electrodes 3 and 4, and a fuse element 30 mounted between the first and second electrodes 3 and 4.
- the flux 17 provided on the fuse element 30 and the cover member 20 covering the surface 2a of the insulating substrate 2 provided with the fuse element 30 are provided.
- the fuse element 30 is incorporated in series with a circuit formed on the circuit board.
- the fuse element 40 realizes a small and highly rated fuse element.
- the dimensions of the insulating substrate 2 are about 3 to 4 mm ⁇ 5 to 6 mm, and the resistance value is 0.5 to 1 m ⁇ . 50-60A rating and higher rating are being achieved.
- the present invention can be applied to fuse elements having all sizes, resistance values, and current ratings.
- the fuse element 30 has a plurality of energization paths by arranging a plurality of element portions 31A to 31C in parallel. As shown in FIG. 10 (B), the plurality of element portions 31A to 31C are connected across the first and second electrodes 3 and 4 formed on the surface 2a of the insulating substrate 2, respectively. It melts by self-heating (Joule heat) when a current exceeding the rating is applied. The fuse element 30 cuts off the current path between the first and second electrodes 3 and 4 by melting all the element portions 31A to 31C.
- the fuse element 30 is a laminated structure composed of an inner layer and an outer layer, similarly to the fuse element 5 described above, and has a low melting point metal layer 5a as an inner layer and a refractory metal layer 5b as an outer layer laminated on the low melting point metal layer 5a.
- the fuse element 30 is mounted between the first and second electrodes 3 and 4 via an adhesive material 8 such as solder and then connected to the insulating substrate 2 by reflow soldering or the like.
- the fuse element 30 is the same as the above-described fuse element 5 except for the outer shape of the low melting point metal layer 5a and the high melting point metal layer 5b, the structure of the low melting point metal layer 5a and the manufacturing method, operation, and effect thereof. Omitted.
- the low melting point metal layer 5a is mainly composed of Sn and erodes high melting point metal.
- a high melting point metal such as Ag is used.
- the fuse element 30 can be melted and melted quickly.
- FIG. 11A in the fuse element 43 mounted over a wide range between the electrode terminals 41 and 42 on the insulating substrate 40, when a voltage exceeding the rating is applied and a large current flows, Fever. Then, as shown in FIG. 11 (B), the fuse element 43 is melted and becomes agglomerated, and then melts while large-scale arc discharge is generated as shown in FIG. 11 (C). . For this reason, the melt of the fuse element 43 explodes. For this reason, a new current path is formed by the scattered metal and the insulation is impaired, or the electrode terminals 41 and 42 formed on the insulating substrate 40 are melted and scattered together to adhere to surrounding electronic components and the like. There is a fear. Furthermore, since the fuse element 43 is melted and cut off after agglomeration as a whole, the heat energy required for fusing increases and the fast fusing property is poor.
- the fuse element 30 has a plurality of element portions 31A to 31C mounted between the first and second electrodes 3 and 4 in parallel.
- a large amount of current flows through the lower element portion 31 and is melted sequentially by self-heating, and arc discharge occurs only when the last remaining element portion 31 is melted. Therefore, according to the fuse element 30, even when an arc discharge occurs when the last remaining element portion 31 is melted, the fuse element 30 becomes small according to the volume of the element portion 31, and the molten metal is explosively scattered.
- the insulation after fusing can be greatly improved. Further, since the fuse element 30 is blown for each of the plurality of element portions 31A to 31C, less heat energy is required for fusing each element portion 31, and can be cut off in a short time.
- the fuse element 30 may have a relatively high resistance by making the cross-sectional area of a part or all of one element part 31 smaller than the cross-sectional area of other element parts among the plurality of element parts 31. .
- a relatively high resistance by making the cross-sectional area of a part or all of one element part 31 smaller than the cross-sectional area of other element parts among the plurality of element parts 31.
- the fuse element 30 is provided with three or more element portions and the inner element portion is blown last.
- the fuse element 30 is provided with three element portions 31A, 31B, and 31C, and the middle element portion 31B is blown last.
- the current concentrates on the middle element portion 31B and melts with arc discharge.
- the fuse element 30 melts the molten metal of the element part 31B first by blowing the middle element part 31B last, even if arc discharge occurs, so that the outer element parts 31A and 31C are fused first. Can be captured by. Therefore, scattering of the molten metal in the element portion 31B can be suppressed, and a short circuit due to the molten metal can be prevented.
- the fuse element 30 has a cross-sectional area of the other element portions 31A and 31C located on the outer side of a part or all of the middle element portion 31B located on the inner side.
- the resistance may be relatively increased, and the middle element portion 31B may be blown out last.
- the cross-sectional area is finally blown out by relatively reducing the arc, the arc discharge becomes small according to the volume of the element portion 31B, and the explosive scattering of the molten metal is further suppressed. be able to.
- the fuse element 30 in which a plurality of element portions 31 are formed has two central portions of a laminated body 32 of a plate-like low melting point metal 5a and a high melting point metal 5b. Can be manufactured by punching into a rectangular shape.
- the fuse element 30 is integrally supported on both sides of the three element portions 31A to 31C arranged in parallel.
- the fuse element 30 may be one in which one side of the three element portions 31A to 31C arranged in parallel is integrally supported.
- the fuse element 30 may form a terminal portion 33 serving as an external connection terminal of the first and second electrodes 3 and 4 formed on the insulating substrate 2.
- the terminal portion 33 connects the circuit formed on the circuit board and the fuse element 30 as shown in FIG. , Formed on both sides of the element portion 31 in the longitudinal direction.
- the terminal portion 33 is connected to an electrode terminal formed on the circuit board via solder or the like by mounting the fuse element 40 face down on the circuit board.
- the fuse element 40 is conductively connected to the circuit board via the terminal portion 33 formed in the fuse element 30, thereby reducing the resistance value of the entire element, and reducing the size and increasing the rating. That is, the fuse element 40 is provided with an electrode for connection to the circuit board on the back surface of the insulating substrate 2 and connected to the first and second electrodes 3 and 4 through through holes filled with conductive paste. Due to the limitation of the hole diameter and the number of holes of through holes and castellations and the limitation of the resistivity and film thickness of the conductive paste, it is difficult to realize a resistance value lower than that of the fuse element, and it is difficult to increase the rating.
- the fuse element 40 forms the terminal portion 33 in the fuse element 30 and protrudes to the outside of the element through the cover member 20. Then, as shown in FIG. 10E, the fuse element 40 is face-down mounted on the circuit board, thereby connecting the terminal portion 33 directly to the electrode terminal of the circuit board. As a result, the fuse element 40 can be prevented from being increased in resistance due to the presence of the conductive through hole, and the rating of the element is determined by the fuse element 30, so that downsizing and higher rating can be realized.
- the fuse element 40 is formed with the terminal portion 33 in the fuse element 30, so that it is not necessary to form a connection electrode with the circuit board on the back surface of the insulating substrate 2, and the first and second electrodes only on the front surface 2 a. It is sufficient to form the electrodes 3 and 4, and the number of manufacturing steps can be reduced.
- the fuse element 30 provided with the terminal portion 33 can be manufactured, for example, by punching a laminated body of the plate-like low melting point metal 5a and the high melting point metal 5b and bending both side edges. Or you may manufacture by connecting the metal plate which comprises the terminal part 33 on the 1st and 2nd electrodes 3 and 4. FIG.
- the terminal part 33 and the plurality of element parts are formed.
- the first and second electrodes 3 and 4 may not be provided on the insulating substrate 2 because the first and second electrodes 31 and 31 are integrally formed in advance.
- the insulating substrate 2 is used to dissipate heat from the fuse element 30, and a ceramic substrate having good thermal conductivity is preferably used.
- the adhesive for connecting the fuse element 30 to the insulating substrate 2 may be non-conductive and preferably has excellent thermal conductivity.
- a plurality of elements 34 corresponding to the element portion 31 may be connected in parallel across the first and second electrodes 3 and 4.
- Each of the elements 34A to 34C is formed in a rectangular plate shape, and terminal portions 33 are bent at both ends.
- the element 34 has a relatively high resistance by making the cross-sectional area of the middle element 34B provided on the inner side smaller than the cross-sectional area of the other elements 34A and 34B provided on the outer side. You may make it melt.
- the fuse element 40 in which the fuse element 30 is used is manufactured by the following process. As shown in FIG. 10A, the insulating substrate 2 on which the fuse element 30 is mounted has first and second electrodes 3 and 4 formed on the surface 2a. The fuse element 30 is connected to the first and second electrodes 3 and 4 (FIG. 10B). Thus, the fuse element 30 is incorporated in series on the circuit formed on the circuit board by mounting the fuse element 40 on the circuit board.
- the fuse element 30 is mounted between the first and second electrodes 3 and 4 via a connecting material such as solder, and is soldered when the fuse element 40 is reflow-mounted on the circuit board. Further, as shown in FIG. 10C, a flux 17 is provided on the fuse element 30. By providing the flux 17, the fuse element 30 can be prevented from being oxidized and wettability can be improved, and can be quickly blown. Moreover, by providing the flux 17, adhesion of the molten metal to the insulating substrate 2 due to arc discharge can be suppressed, and insulation after fusing can be improved.
- the fuse element 40 is protected by mounting the cover member 20 that protects the surface 2 a of the insulating substrate 2 and reduces the melting scattered matter of the fuse element 30 due to arc discharge.
- the cover member 20 is formed with a pair of leg portions extending in the width direction at both ends in the longitudinal direction. The leg portions are installed on the surface 2a, and the terminal portion 33 of the fuse element 30 faces upward from the opened side surface. It is protruding.
- the fuse element 40 is connected by face-down mounting with the surface 2a side on which the cover member 20 is provided facing the circuit board.
- the fuse element 40 has overhang portions 3a and 4a projecting from a portion to which one element portion 31 of the first and second electrodes 3 and 4 is connected.
- the inter-electrode distance between the overhang portions 3a and 4a may be shorter than the inter-electrode distance of the portion to which the other element portion 31 is connected.
- the contact area between the element portion 31 and the first and second electrodes 3 and 4 and the overhang portions 3a and 4a is increased. For this reason, even when the current flows and the element portion 31 self-heats, the element portion 31 radiates heat through the first and second electrodes 3 and 4 and the overhang portions 3a and 4a. It becomes easier to cool than the other element portions 31 mounted on the portion where the 4a is not provided, and blows out later than the other element portions 31. Thereby, the fuse element 40 can melt the element part 31 of the fuse element 30 sequentially.
- the distance between the electrodes is shorter than that of other element portions. Since the element part 31 is easily melted as the distance between the electrodes becomes longer, the element part 31 mounted on the overhanging parts 3a and 4a is less likely to be melted than the other element parts 31, and Fusing late. Also by this, the fuse element 40 can melt the element part 31 of the fuse element 30 sequentially.
- the fuse element 40 uses the fuse element 30 provided with three or more element portions, and the overhanging portion 3a is formed at a portion of the first and second electrodes 3 and 4 where the inner element portion 31 is mounted. 4a, and the inner element portion 31 is preferably melted last.
- the fuse element 30 provided with three element portions 31A, 31B, 31C is used, and the overhang portions 3a, 4a are provided at the portion where the middle element portion 31B is mounted. It is preferable that the part 31B is melted at the end by facilitating cooling and shortening the distance between the electrodes.
- the fuse element 30 is accompanied by an arc discharge when the last element portion 31 is melted, the element portion 31B is melted by the last element portion 31B, so that even if an arc discharge occurs, the element portion
- the molten metal of 31B can be captured by the outer element portions 31A and 31C that have been melted first. Therefore, scattering of the molten metal in the element portion 31B can be suppressed, and a short circuit due to the molten metal can be prevented.
- the fuse element 30 has a part or all of the cross-sectional area of the middle element portion 31B located inside the other element portions 31A and 31C located outside.
- the resistance may be relatively increased, and the middle element portion 31B may be blown out last.
- the cross-sectional area is finally blown by making the cross-sectional area relatively small, the arc discharge can be made small according to the volume of the element portion 31B.
- the terminal portion 33 is integrally formed with the fuse element 30, and the terminal portion 33 is fitted to the side surface of the insulating substrate 2, You may make it protrude in the back surface side of the insulated substrate 2.
- a flux 17 is provided on the fuse element 30, and then, as shown in FIG. 16D, the cover member 20 is placed on the surface 2a of the insulating substrate 2. Manufactured by mounting. The terminal portion 33 protrudes from the open side surface of the cover member 20 to the back surface side of the insulating substrate 2. In the fuse element 50, the cover member 20 is not necessarily mounted.
- the fuse element 50 is mounted with a connecting material such as solder with the back surface of the insulating substrate 2 facing the circuit board. As a result, the fuse element 50 has the terminal portion 33 connected to the electrode terminal formed on the circuit board, and the fuse element 30 is connected in series to the circuit of the circuit board.
- the fuse element 50 has a mounting area on the circuit board by forming a fitting recess 35 into which the terminal portion 33 of the fuse element 30 is fitted on the side surface of the insulating substrate 2.
- the fitting position of the fuse element 30 can be fixed without spreading.
- the first and second electrodes 3 and 4 may not be formed on the surface 2 a of the insulating substrate 2. Thereby, the fuse element 50 does not need to form an electrode on the surface 2a of the insulating substrate 2, and can reduce the number of manufacturing steps.
- the insulating substrate 2 is used to dissipate heat from the fuse element 30, and a ceramic substrate having good thermal conductivity is preferably used.
- the adhesive for connecting the fuse element 30 to the insulating substrate 2 may be non-conductive and preferably has excellent thermal conductivity.
- the fuse element 50 may be formed with a heat radiation electrode on the back surface of the insulating substrate 2.
- the fuse element 50 may be manufactured by connecting a plurality of elements 51 corresponding to the element portion 31 in parallel across the first and second electrodes 3 and 4.
- the terminal portion 52 is bent and formed, and the terminal portion 52 is fitted to the side surface of the insulating substrate 2 and protrudes to the back surface side of the insulating substrate 2.
- the first and second electrodes 3 and 4 provided on the surface 2a of the insulating substrate 2 may not be formed.
- the fuse element 50 three elements 51 are arranged in parallel, and the cross-sectional area of the middle element 51B provided on the inner side is made smaller than the cross-sectional areas of the other elements 51A and 51B provided on the outer side.
- the resistance may be relatively increased and finally blown.
- the first and second electrodes 3 and 4 correspond to the mounting positions of the plurality of element portions 31A to 31C of the fuse element 30 and the plurality of elements 34, respectively.
- the first divided electrodes 3A to 3C and the second divided electrodes 4A to 4C may be divided.
- the fuse element 50 as shown in FIG. 18B, the first and second electrodes 3 and 4 correspond to the mounting positions of the element portions 31A to 31C of the fuse element 30 and the plurality of elements 51.
- the first divided electrodes 3A to 3C and the second divided electrodes 4A to 4C may be divided.
Landscapes
- Fuses (AREA)
Abstract
Description
[ヒューズ素子]
本発明に係るヒューズ素子1は、図1に示すように、絶縁基板2と、絶縁基板2に設けられた第1及び第2の電極3,4と、第1及び第2の電極3,4間にわたって実装され、定格を超える電流が通電することによって自己発熱により溶断し、第1の電極3と第2の電極4との間の電流経路を遮断するヒューズエレメント5とを備える。
第1及び第2の電極3,4間にわたって実装されているヒューズエレメント5は、定格を超える電流が通電することによって自己発熱(ジュール熱)により溶断し、第1の電極3と第2の電極4との間の電流経路を遮断するものである。
ここで、ヒューズ素子1の耐パルス試験について説明する。本試験では、ヒューズ素子として、低融点金属箔(Sn96.5/Ag/Cu)の両面にそれぞれ厚さ4μmのAgメッキを施したヒューズエレメント(実施例)と、低融点金属箔(Pb90/Sn/Ag)のみからなるヒューズエレメント(比較例)を用意した。実施例にかかるヒューズエレメントは、断面積が0.1mm2、長さLが1.5mmで、ヒューズ素子抵抗は2.4mΩである。比較例にかかるヒューズエレメントは、断面積が0.15mm2、長さLが1.5mmで、ヒューズ素子抵抗は2.4mΩである。
ヒューズエレメント5は、低融点金属層5aの表面に高融点金属5bをメッキ技術を用いて成膜することにより製造できる。ヒューズエレメント5は、例えば、長尺状のハンダ箔の表面にAgメッキを施すことにより効率よく製造でき、使用時には、サイズに応じて切断することで、容易に用いることができる。
次いで、ヒューズエレメント5の実装状態について説明する。ヒューズ素子1は、図1に示すように、ヒューズエレメント5が、絶縁基板2の表面2aから離間して実装されている。これにより、ヒューズ素子1は、定格を超える電流が流れた時に、第1、第2の電極3,4間においてヒューズエレメント5の溶融金属が絶縁基板2の表面2aに付着することなく、確実に電流経路を遮断することができる。
また、ヒューズエレメント5は、外層の高融点金属層5b又は低融点金属層5aの酸化防止と、溶断時の酸化物除去及びハンダの流動性向上のために、図1に示すように、ヒューズエレメント5上の外層のほぼ全面にフラックス17を塗布してもよい。フラックス17を塗布することにより、低融点金属(例えばハンダ)の濡れ性を高めるとともに、低融点金属が溶解している間の酸化物を除去し、高融点金属(例えば銀)への浸食作用を用いて速溶断性を向上させることができる。
なお、ヒューズ素子1は、図1に示すように、このようにして構成された絶縁基板2の表面2a上を保護するためにカバー部材20を絶縁基板2上に載置してもよい。
次いで、本発明が適用された他のヒューズエレメント及びヒューズ素子について説明する。なお、以下の説明において、上述したヒューズ素子1と同じ部材については、同一の符号を付してその詳細を省略する。図9は、ヒューズエレメント30の斜視図であり、図10は、ヒューズエレメント30を用いたヒューズ素子40の製造工程を示す斜視図である。
このような複数のエレメント部31が形成されたヒューズエレメント30は、例えば図13(A)に示すように、板状の低融点金属5aと高融点金属5bの積層体32の中央部2か所を矩形状に打ち抜くことにより製造することができる。ヒューズエレメント30は、並列する3つのエレメント部31A~31Cの両側が一体に支持されている。なお、図13(B)に示すように、ヒューズエレメント30は、並列する3つのエレメント部31A~31Cの片側が一体に支持されたものでもよい。
また、ヒューズエレメント30は、絶縁基板2に形成された第1、第2の電極3,4の外部接続端子となる端子部33を形成してもよい。端子部33は、ヒューズエレメント30が搭載されたヒューズ素子40が回路基板に実装されると、当該回路基板に形成された回路とヒューズエレメント30とを接続するものであり、図9に示すように、エレメント部31の長手方向の両側に形成されている。そして、端子部33は、ヒューズ素子40がフェースダウンで回路基板に実装されることにより、回路基板上に形成された電極端子とハンダ等を介して接続される。
ヒューズエレメント30が用いられるヒューズ素子40は、以下の工程により製造される。ヒューズエレメント30が搭載される絶縁基板2は、図10(A)に示すように、表面2aに第1、第2の電極3,4が形成されている。第1、第2の電極3,4は、ヒューズエレメント30が接続される(図10(B))。これにより、ヒューズエレメント30は、ヒューズ素子40が回路基板に実装されることにより、回路基板に形成された回路上に直列に組み込まれる。
また、ヒューズ素子40は、図15(A)(B)に示すように、第1、第2の電極3,4の1つのエレメント部31が接続される部位が張り出す張出し部3a,4aを形成し、張出し部3a,4a間における電極間距離が、他のエレメント部31が接続される部位の電極間距離よりも短くしてもよい。
また、ヒューズ素子40は、図18(A)に示すように、第1、第2の電極3,4がヒューズエレメント30の複数のエレメント部31A~31Cや複数枚のエレメント34の搭載位置に応じて、第1の分割電極3A~3C及び第2分割電極4A~4Cに分割してもよい。同様に、ヒューズ素子50も、図18(B)に示すように、第1、第2の電極3,4がヒューズエレメント30のエレメント部31A~31Cや複数枚のエレメント51の搭載位置に応じて、第1の分割電極3A~3C及び第2分割電極4A~4Cに分割してもよい。
Claims (45)
- ヒューズ素子の通電経路を構成し、定格を超える電流が通電することによって自己発熱により溶断するヒューズエレメントにおいて、
低融点金属層と、
上記低融点金属層に積層された高融点金属層とを有し、
上記低融点金属層が、上記通電時に上記高融点金属層を浸食し溶断する作用を用いたヒューズエレメント。 - 上記低融点金属層は、ハンダであり、
上記高融点金属層は、Ag、Cu、Ag又はCuを主成分とする合金である請求項1記載のヒューズエレメント。 - 上記低融点金属層は、上記高融点金属層よりも体積が多い請求項1又は2に記載のヒューズエレメント。
- 上記低融点金属層と上記高融点金属層との膜厚比が
低融点金属層:高融点金属層=2:1~100:1
である請求項1又は2に記載のヒューズエレメント。 - 上記低融点金属層の膜厚は、30μm以上であり、
上記高融点金属層の膜厚は、3μm以上である請求項4記載のヒューズエレメント。 - 上記高融点金属層は、上記低融点金属層の表面にメッキすることにより形成される請求項1又は2に記載のヒューズエレメント。
- 上記高融点金属層は、上記低融点金属層の表面に金属箔を貼着させることにより形成される請求項1又は2に記載のヒューズエレメント。
- 上記高融点金属層は、上記低融点金属層の表面に薄膜形成工程により形成される請求項1又は2に記載のヒューズエレメント。
- 上記高融点金属層の表面に、さらに酸化防止膜が形成されている請求項1又は2に記載のヒューズエレメント。
- 上記低融点金属層と上記高融点金属層とが、交互に複数層積層されている請求項1又は2に記載のヒューズエレメント。
- 上記低融点金属層の対向する2端面を除く外周部が上記高融点金属層によって被覆されている請求項1又は2に記載のヒューズエレメント。
- 外周の少なくとも一部が保護部材によって保護されている請求項1又は2に記載のヒューズエレメント。
- 並列する複数のエレメント部を有し、
上記複数のエレメント部が、定格を超える電流の通電による自己発熱により溶断する請求項1に記載のヒューズエレメント。 - 上記複数のエレメント部が順次溶断する請求項13に記載のヒューズエレメント。
- 1つの上記エレメント部は、一部又は全部の断面積が他のエレメント部の断面積よりも小さい請求項14に記載のヒューズエレメント。
- 3つの上記エレメント部が並列され、
真ん中の上記エレメント部が最後に溶断する請求項13又は14に記載のヒューズエレメント。 - 真ん中の上記エレメント部は、一部又は全部の断面積が両側のエレメント部の断面積よりも小さい請求項16に記載のヒューズエレメント。
- 上記ヒューズ素子の外部接続端子となる端子部が形成されている請求項1,2,13~15のいずれか1項に記載のヒューズエレメント。
- 上記高融点金属層の膜厚は、0.5μm以上である請求項5記載のヒューズエレメント。
- 絶縁基板と、
上記絶縁基板上に搭載され、定格を超える電流が通電することによって自己発熱により、通電経路を溶断するヒューズエレメントとを備え、
上記ヒューズエレメントは、
低融点金属層と、
上記低融点金属層に積層された高融点金属層とを有し、
上記低融点金属層が、上記通電時に上記高融点金属層を浸食し溶断する作用を用いたヒューズ素子。 - 上記絶縁基板に設けられた第1及び第2の電極を有し、
上記ヒューズエレメントは、上記第1及び第2の電極間にわたって実装されている請求項20記載のヒューズ素子。 - 上記ヒューズエレメントは、上記第1及び第2の電極と、ハンダ接続されている請求項21に記載のヒューズ素子。
- 上記ヒューズエレメントは、上記第1及び第2の電極と、超音波溶接により接続されている請求項21に記載のヒューズ素子。
- 上記ヒューズエレメントは、上記絶縁基板から離間して実装されている請求項20~23のいずれか1項に記載のヒューズ素子。
- 上記ヒューズエレメントの表面がフラックスでコーティングされている請求項20~23のいずれか1項に記載のヒューズ素子。
- カバー部材によって上記絶縁基板上が覆われている請求項20~23のいずれか1項に記載のヒューズ素子。
- 並列する複数の上記ヒューズエレメント又は並列する複数のエレメント部を有する上記ヒューズエレメントを有し、
上記ヒューズエレメントが、定格を超える電流の通電による自己発熱により溶断する請求項20~23のいずれか1項に記載のヒューズ素子。 - 複数の上記ヒューズエレメント又は複数の上記エレメント部が、順次溶断する請求項27記載のヒューズ素子。
- 1つの上記ヒューズエレメント又は1つの上記エレメント部は、一部又は全部の断面積が他のヒューズエレメント又は他のエレメント部の断面積よりも小さい請求項28に記載のヒューズ素子。
- 3つの上記ヒューズエレメント又は3つの上記エレメント部が並列され、
真ん中の上記ヒューズエレメント又は真ん中の上記エレメント部は、最後に溶断する請求項27に記載のヒューズ素子。 - 真ん中の上記ヒューズエレメント又は真ん中の上記エレメント部は、一部又は全部の断面積が両側のヒューズエレメント又は両側のエレメント部の断面積よりも小さい請求項30に記載のヒューズ素子。
- 上記絶縁基板に設けられた第1及び第2の電極間にわたって複数の上記ヒューズエレメント又は複数の上記エレメント部が並列され、
上記第1及び第2の電極は、1つの上記ヒューズエレメント又は1つの上記エレメント部が接続される部位が張り出し、電極間距離が、他の上記ヒューズエレメント又は他の上記エレメント部が接続される部位の電極間距離よりも短い請求項28に記載のヒューズ素子。 - 上記絶縁基板に設けられた第1及び第2の電極間にわたって複数の上記ヒューズエレメント又は複数の上記エレメント部が並列され、
上記第1及び第2の電極は、1つの上記ヒューズエレメント又は1つの上記エレメント部が接続される部位が張り出し、電極間距離が、他の上記ヒューズエレメント又は他の上記エレメント部が接続される部位の電極間距離よりも短い請求項29に記載のヒューズ素子。 - 上記絶縁基板に設けられた第1及び第2の電極間にわたって3つの上記ヒューズエレメント又は3つの上記エレメント部が並列され、
上記第1及び第2の電極は、真ん中の上記ヒューズエレメント又は真ん中の上記エレメント部が接続される部位が張り出し、電極間距離が、他の上記ヒューズエレメント又は他の上記エレメント部が接続される部位の電極間距離よりも短い請求項30に記載のヒューズ素子。 - 上記絶縁基板に設けられた第1及び第2の電極間にわたって3つの上記ヒューズエレメント又は3つの上記エレメント部が並列され、
上記第1及び第2の電極は、真ん中の上記ヒューズエレメント又は真ん中の上記エレメント部が接続される部位が張り出し、電極間距離が、他の上記ヒューズエレメント又は他の上記エレメント部が接続される部位の電極間距離よりも短い請求項31に記載のヒューズ素子。 - 上記ヒューズエレメントに、外部接続端子となる端子部が形成されている請求項27に記載のヒューズ素子。
- 上記ヒューズエレメントは、上記端子部が上記絶縁基板の表面上に突出するように接続され、
上記端子部は、カバー部材とともに上記ヒューズエレメントの溶断部位を覆う請求項36に記載のヒューズ素子。 - 上記ヒューズエレメントは、上記端子部が上記絶縁基板の側面に嵌合する請求項36に記載のヒューズ素子。
- 上記絶縁基板は、上記ヒューズエレメントが搭載される面と反対側の面に、放熱用電極が形成されている請求項38に記載のヒューズ素子。
- 上記ヒューズエレメントは、上記絶縁基板と接着剤により接続されている請求項27に記載のヒューズ素子。
- 上記第1及び第2の電極は、複数の上記ヒューズエレメント又は複数の上記エレメント部の搭載位置に応じて分割している請求項27に記載のヒューズ素子。
- 上記ヒューズエレメントに、外部接続端子となる端子部が形成されており、
上記ヒューズエレメントが、定格を超える電流の通電による自己発熱により溶断する請求項20~23のいずれか1項に記載のヒューズ素子。 - 上記ヒューズエレメントは、上記端子部が上記絶縁基板の表面上に突出するように接続され、
上記端子部は、カバー部材とともに溶断部位を覆う請求項42に記載のヒューズ素子。 - 上記ヒューズエレメントは、上記端子部が上記絶縁基板の側面に嵌合する請求項42に記載のヒューズ素子。
- 上記絶縁基板は、上記ヒューズエレメントが搭載される面と反対側の面に、放熱用電極が形成されている請求項44に記載のヒューズ素子。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020157028498A KR102213303B1 (ko) | 2013-03-28 | 2014-03-27 | 퓨즈 엘리먼트, 및 퓨즈 소자 |
US14/770,312 US10600602B2 (en) | 2013-03-28 | 2014-03-27 | Fuse element and fuse device |
CN201480018203.1A CN105051855B (zh) | 2013-03-28 | 2014-03-27 | 熔丝元件以及熔丝器件 |
HK16105349.9A HK1217379A1 (zh) | 2013-03-28 | 2016-05-11 | 熔絲元件以及熔絲器件 |
US16/783,785 US20200176210A1 (en) | 2013-03-28 | 2020-02-06 | Fuse element and fuse device |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013-070306 | 2013-03-28 | ||
JP2013070306 | 2013-03-28 | ||
JP2014-059135 | 2014-03-20 | ||
JP2014059135A JP6420053B2 (ja) | 2013-03-28 | 2014-03-20 | ヒューズエレメント、及びヒューズ素子 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/770,312 A-371-Of-International US10600602B2 (en) | 2013-03-28 | 2014-03-27 | Fuse element and fuse device |
US16/783,785 Division US20200176210A1 (en) | 2013-03-28 | 2020-02-06 | Fuse element and fuse device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2014157585A1 true WO2014157585A1 (ja) | 2014-10-02 |
Family
ID=51624541
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/059037 WO2014157585A1 (ja) | 2013-03-28 | 2014-03-27 | ヒューズエレメント、及びヒューズ素子 |
Country Status (7)
Country | Link |
---|---|
US (2) | US10600602B2 (ja) |
JP (1) | JP6420053B2 (ja) |
KR (1) | KR102213303B1 (ja) |
CN (1) | CN105051855B (ja) |
HK (1) | HK1217379A1 (ja) |
TW (1) | TWI610328B (ja) |
WO (1) | WO2014157585A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016076173A1 (ja) * | 2014-11-11 | 2016-05-19 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子、短絡素子、切替素子 |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5979654B2 (ja) * | 2012-09-28 | 2016-08-24 | 釜屋電機株式会社 | チップヒューズ及びその製造方法 |
JP6382028B2 (ja) * | 2014-08-26 | 2018-08-29 | デクセリアルズ株式会社 | 回路基板及び電子部品の実装方法 |
JP6483987B2 (ja) * | 2014-09-26 | 2019-03-13 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、及び発熱体内蔵ヒューズ素子 |
WO2017061458A1 (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
JP2017073373A (ja) * | 2015-10-09 | 2017-04-13 | デクセリアルズ株式会社 | ヒューズ素子 |
DE102015222939A1 (de) * | 2015-11-20 | 2017-05-24 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Elektrische Überbrückungseinrichtung zum Überbrücken elektrischer Bauelemente, insbesondere einer Energiequelle oder eines Energieverbrauchers |
JP6756490B2 (ja) * | 2016-02-19 | 2020-09-16 | デクセリアルズ株式会社 | 電流ヒューズ |
US20170336467A1 (en) * | 2016-05-17 | 2017-11-23 | Globalfoundries Inc. | Gate protection for hv-stress application |
CN107644797A (zh) * | 2016-07-21 | 2018-01-30 | 东莞华恒电子有限公司 | 保护元件 |
CN107644796A (zh) * | 2016-07-21 | 2018-01-30 | 东莞华恒电子有限公司 | 薄型化保护元件 |
JP6707428B2 (ja) * | 2016-09-16 | 2020-06-10 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子 |
JP7002955B2 (ja) | 2017-02-28 | 2022-01-20 | デクセリアルズ株式会社 | ヒューズ素子 |
CN109727832A (zh) * | 2017-10-30 | 2019-05-07 | 聚鼎科技股份有限公司 | 保护元件及其电路保护装置 |
JP7010706B2 (ja) | 2018-01-10 | 2022-01-26 | デクセリアルズ株式会社 | ヒューズ素子 |
JP6577118B2 (ja) * | 2018-10-23 | 2019-09-18 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子、短絡素子、切替素子 |
JP7231527B2 (ja) | 2018-12-28 | 2023-03-01 | ショット日本株式会社 | 保護素子用ヒューズ素子およびそれを利用した保護素子 |
TWI684311B (zh) * | 2019-04-01 | 2020-02-01 | 聚鼎科技股份有限公司 | 保護元件 |
JP7433796B2 (ja) * | 2019-07-24 | 2024-02-20 | デクセリアルズ株式会社 | 保護素子 |
JP7433811B2 (ja) * | 2019-08-23 | 2024-02-20 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子および保護素子 |
US11811272B2 (en) * | 2019-09-27 | 2023-11-07 | Black & Decker, Inc. | Electronic module having a fuse in a power tool |
JP7349954B2 (ja) * | 2020-04-13 | 2023-09-25 | ショット日本株式会社 | 保護素子 |
JP2022034733A (ja) | 2020-08-19 | 2022-03-04 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子及び保護素子 |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5149454A (ja) * | 1974-10-25 | 1976-04-28 | Matsushita Electric Ind Co Ltd | Ondohyuuzu |
JPS58122350U (ja) * | 1982-02-15 | 1983-08-20 | 株式会社フジクラ | ヒユ−ジブルリンク |
JPS6344357U (ja) * | 1986-09-10 | 1988-03-25 | ||
JPH01170933U (ja) * | 1988-05-23 | 1989-12-04 | ||
JPH0569847U (ja) * | 1992-02-27 | 1993-09-21 | 瓊章 顔 | エンドキャップの無いチップタイプの回路遮断用素子 |
JP2004185960A (ja) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | 回路保護素子とその製造方法 |
JP2005026036A (ja) * | 2003-07-01 | 2005-01-27 | Matsushita Electric Ind Co Ltd | ヒューズおよびヒューズ製造方法 |
JP2013229293A (ja) * | 2012-03-29 | 2013-11-07 | Dexerials Corp | 保護素子 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2911504A (en) * | 1958-05-15 | 1959-11-03 | Sigmund Cohn Corp | Fuse member and method of making the same |
US4320374A (en) * | 1979-03-21 | 1982-03-16 | Kearney-National (Canada) Limited | Electric fuses employing composite aluminum and cadmium fuse elements |
JP3562685B2 (ja) * | 1996-12-12 | 2004-09-08 | 矢崎総業株式会社 | ヒューズ及びその製造方法 |
EP1300867A1 (fr) * | 2001-10-03 | 2003-04-09 | Metalor Technologies International S.A. | Element de fusible et son procédé de fabrication |
GB2385723B (en) * | 2002-02-21 | 2004-07-07 | Yazaki Corp | Fuse and fuse production method |
JP2004265618A (ja) * | 2003-02-05 | 2004-09-24 | Sony Chem Corp | 保護素子 |
DE102007014334A1 (de) * | 2007-03-26 | 2008-10-02 | Robert Bosch Gmbh | Schmelzlegierungselement, Thermosicherung mit einem Schmelzlegierungselement sowie Verfahren zum Herstellen einer Thermosicherung |
JP5072796B2 (ja) * | 2008-05-23 | 2012-11-14 | ソニーケミカル&インフォメーションデバイス株式会社 | 保護素子及び二次電池装置 |
JP5301298B2 (ja) * | 2009-01-21 | 2013-09-25 | デクセリアルズ株式会社 | 保護素子 |
US8937524B2 (en) * | 2009-03-25 | 2015-01-20 | Littelfuse, Inc. | Solderless surface mount fuse |
JP5306139B2 (ja) | 2009-10-08 | 2013-10-02 | 北陸電気工業株式会社 | チップヒューズ |
JP5656466B2 (ja) * | 2010-06-15 | 2015-01-21 | デクセリアルズ株式会社 | 保護素子、及び、保護素子の製造方法 |
-
2014
- 2014-03-20 JP JP2014059135A patent/JP6420053B2/ja active Active
- 2014-03-27 US US14/770,312 patent/US10600602B2/en active Active
- 2014-03-27 CN CN201480018203.1A patent/CN105051855B/zh active Active
- 2014-03-27 TW TW103111427A patent/TWI610328B/zh active
- 2014-03-27 KR KR1020157028498A patent/KR102213303B1/ko active IP Right Grant
- 2014-03-27 WO PCT/JP2014/059037 patent/WO2014157585A1/ja active Application Filing
-
2016
- 2016-05-11 HK HK16105349.9A patent/HK1217379A1/zh unknown
-
2020
- 2020-02-06 US US16/783,785 patent/US20200176210A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5149454A (ja) * | 1974-10-25 | 1976-04-28 | Matsushita Electric Ind Co Ltd | Ondohyuuzu |
JPS58122350U (ja) * | 1982-02-15 | 1983-08-20 | 株式会社フジクラ | ヒユ−ジブルリンク |
JPS6344357U (ja) * | 1986-09-10 | 1988-03-25 | ||
JPH01170933U (ja) * | 1988-05-23 | 1989-12-04 | ||
JPH0569847U (ja) * | 1992-02-27 | 1993-09-21 | 瓊章 顔 | エンドキャップの無いチップタイプの回路遮断用素子 |
JP2004185960A (ja) * | 2002-12-03 | 2004-07-02 | Kamaya Denki Kk | 回路保護素子とその製造方法 |
JP2005026036A (ja) * | 2003-07-01 | 2005-01-27 | Matsushita Electric Ind Co Ltd | ヒューズおよびヒューズ製造方法 |
JP2013229293A (ja) * | 2012-03-29 | 2013-11-07 | Dexerials Corp | 保護素子 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016076173A1 (ja) * | 2014-11-11 | 2016-05-19 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子、短絡素子、切替素子 |
JP2016095899A (ja) * | 2014-11-11 | 2016-05-26 | デクセリアルズ株式会社 | ヒューズエレメント、ヒューズ素子、保護素子、短絡素子、切替素子 |
CN107735849A (zh) * | 2014-11-11 | 2018-02-23 | 迪睿合株式会社 | 熔丝单元、熔丝元件、保护元件、短路元件、切换元件 |
TWI697022B (zh) * | 2014-11-11 | 2020-06-21 | 日商迪睿合股份有限公司 | 熔絲單元、熔絲元件、保護元件、短路元件、切換元件 |
Also Published As
Publication number | Publication date |
---|---|
TW201503203A (zh) | 2015-01-16 |
TWI610328B (zh) | 2018-01-01 |
HK1217379A1 (zh) | 2017-01-06 |
KR20150135349A (ko) | 2015-12-02 |
US20160013001A1 (en) | 2016-01-14 |
CN105051855A (zh) | 2015-11-11 |
US20200176210A1 (en) | 2020-06-04 |
CN105051855B (zh) | 2019-04-19 |
US10600602B2 (en) | 2020-03-24 |
JP2014209467A (ja) | 2014-11-06 |
JP6420053B2 (ja) | 2018-11-07 |
KR102213303B1 (ko) | 2021-02-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6420053B2 (ja) | ヒューズエレメント、及びヒューズ素子 | |
JP6483987B2 (ja) | ヒューズエレメント、ヒューズ素子、及び発熱体内蔵ヒューズ素子 | |
JP6437262B2 (ja) | 実装体の製造方法、温度ヒューズ素子の実装方法及び温度ヒューズ素子 | |
JP6214318B2 (ja) | 電流ヒューズ | |
KR102255773B1 (ko) | 퓨즈 엘리먼트, 퓨즈 소자 | |
KR102523229B1 (ko) | 보호 소자 및 실장체 | |
TWI699811B (zh) | 熔絲元件 | |
CN111527580B (zh) | 熔丝器件 | |
JP7319237B2 (ja) | ヒューズ素子 | |
WO2016009988A1 (ja) | ヒューズ素子、及びヒューズエレメント | |
KR20190004804A (ko) | 퓨즈 엘리먼트, 퓨즈 소자, 보호 소자 | |
CN108701566B (zh) | 保护元件 | |
WO2016143353A1 (ja) | ヒューズエレメント及びヒューズ素子 | |
WO2023248787A1 (ja) | 保護素子、及び保護素子の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201480018203.1 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14774518 Country of ref document: EP Kind code of ref document: A1 |
|
DPE1 | Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101) | ||
WWE | Wipo information: entry into national phase |
Ref document number: 14770312 Country of ref document: US |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20157028498 Country of ref document: KR Kind code of ref document: A |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14774518 Country of ref document: EP Kind code of ref document: A1 |