WO2014136606A1 - Feuille adhésive et procédé pour la fabrication de feuille adhésive - Google Patents

Feuille adhésive et procédé pour la fabrication de feuille adhésive Download PDF

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Publication number
WO2014136606A1
WO2014136606A1 PCT/JP2014/054425 JP2014054425W WO2014136606A1 WO 2014136606 A1 WO2014136606 A1 WO 2014136606A1 JP 2014054425 W JP2014054425 W JP 2014054425W WO 2014136606 A1 WO2014136606 A1 WO 2014136606A1
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WO
WIPO (PCT)
Prior art keywords
conductive
adhesive layer
adhesive
adhesive sheet
wiring board
Prior art date
Application number
PCT/JP2014/054425
Other languages
English (en)
Japanese (ja)
Inventor
山本　正道
淑文 内田
道廣 木村
聡志 木谷
佳世 橋爪
澄人 上原
Original Assignee
住友電気工業株式会社
住友電工プリントサーキット株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2013043568A external-priority patent/JP2014175323A/ja
Priority claimed from JP2013043569A external-priority patent/JP6088292B2/ja
Priority claimed from JP2013140215A external-priority patent/JP6320694B2/ja
Priority claimed from JP2013273256A external-priority patent/JP6377905B2/ja
Application filed by 住友電気工業株式会社, 住友電工プリントサーキット株式会社 filed Critical 住友電気工業株式会社
Priority to CN201480011587.4A priority Critical patent/CN105008475B/zh
Publication of WO2014136606A1 publication Critical patent/WO2014136606A1/fr

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/0806—Silver
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C08K2003/085—Copper
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/21—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being formed by alternating adhesive areas of different nature
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/314—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive layer and/or the carrier being conductive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit

Definitions

  • the present invention relates to an adhesive sheet and a manufacturing method thereof.
  • a reinforcing plate may be partially attached to a surface of the flexible printed wiring board opposite to the component mounting surface to compensate for the strength reduction of the wiring board due to the reduction in thickness.
  • the reinforcing plate As the reinforcing plate, a metal plate such as stainless steel is generally used. Therefore, a flexible printed wiring board has been developed in which the grounding circuit of the printed wiring board is electrically connected to the metal reinforcing board to provide the reinforcing board with a shielding function against electromagnetic noise.
  • a method of electrically connecting the reinforcing plate and the ground circuit of the printed wiring board a method of bonding the reinforcing board to the printed wiring board using an electrically conductive adhesive (conductive adhesive) containing electrically conductive particles.
  • conductive adhesive electrically conductive adhesive
  • the conductive adhesive is obtained by dispersing conductive particles (fillers) in an insulating adhesive resin, has anisotropic conductivity, and is provided with a reinforcing plate and a substrate opposed to each other by heating and pressing. Are bonded while being electrically connected to each other.
  • a heat sink having fins on the surface opposite to the component mounting surface or the like for the purpose of suppressing the temperature rise.
  • a metal plate for heat dissipation is attached.
  • the electrically conductive adhesive and the thermally conductive adhesive have a small difference in electrical energy or thermal energy between the printed wiring board and a metal plate (reinforcing plate or heat radiating metal plate) bonded to the printed wiring board. As such, it contains particles that conduct these energies. Therefore, the proposal for the electrically conductive adhesive and the thermally conductive adhesive is to optimize the particles according to the type of energy to be conducted, and is not different from the technical field.
  • the present invention has been made in view of the above-described disadvantages, and in the adhesion of the members to be bonded disposed facing each other (for example, in the adhesion between the flexible printed wiring board and the metal plate), the mechanical adhesion strength is provided.
  • An object of the present invention is to provide an adhesive sheet capable of satisfying both improvement of electrical conductivity (electrical connectivity) or improvement of thermal conductivity and a method for producing the same.
  • the invention made to solve the above problems is an adhesive sheet that includes a conductive adhesive layer and exhibits electrical conductivity or thermal conductivity at least in the thickness direction, and the conductive adhesive layer has a thickness direction. It is an adhesive sheet having a conductive part continuous to the conductive part and an adhesive layer filled around the conductive part.
  • Another invention made in order to solve the said subject is equipped with the release adhesive film and the conductive adhesive layer laminated
  • This conductive adhesive layer is Bonding the printed wiring board and the metal plate facing each other, and bonding between the conductive region exposed on the facing surface and the metal plate in the conductive pattern of the printed wiring board to develop electrical conductivity or thermal conductivity at least in the thickness direction
  • a method for producing a sheet the step of laminating a conductive slurry having electrical conductivity or thermal conductivity only in a region to be bonded to a conductive region of the printed wiring board on the surface of the release film by printing, and Curing the laminated conductive slurry to form one or a plurality of conductive parts, and filling the adhesive with the adhesive around the one or more conductive parts and the release film. It is a manufacturing method of the adhesive sheet and a step of forming an adhesive layer on a partial region of the surface.
  • the adhesive sheet can achieve both improved mechanical adhesive strength and improved electrical conductivity (electrical connectivity) or thermal conductivity.
  • FIG. 1 is a schematic end view showing an adhesive sheet according to an embodiment of the present invention (a plane whose cut surface is perpendicular to the conductive adhesive layer (a plane parallel to the thickness direction of the conductive adhesive layer)).
  • FIG. 2 is a schematic plan view showing an adhesive sheet according to an embodiment of the present invention.
  • FIG. 3 is a schematic end view for explaining the manufacturing method of the adhesive sheet of FIG. 1 (a plane in which the cut surface is perpendicular to the conductive adhesive layer).
  • FIG. 4 is a schematic end view showing an adhesive sheet according to an embodiment different from the adhesive sheet of FIG. 1 (a plane in which the cut surface is perpendicular to the conductive adhesive layer).
  • FIG. 5 is a schematic plan view showing an adhesive sheet of an embodiment different from the adhesive sheet of FIG. FIG.
  • FIG. 6 is a schematic plan view showing an adhesive sheet according to an embodiment of the present invention.
  • FIG. 7 is a schematic cross-sectional view taken along line XX of the adhesive sheet of FIG. 6 (a plane in which the cut surface is perpendicular to the conductive adhesive layer).
  • FIG. 8A is a schematic cross-sectional view (a surface in which a cut surface is perpendicular to a conductive adhesive layer) showing a manufacturing process of the adhesive sheet in FIG. 6.
  • FIG. 8B is a schematic cross-sectional view (a plane in which the cut surface is perpendicular to the conductive adhesive layer) showing the next manufacturing step of FIG. 8A.
  • FIG. 9 is a schematic plan view showing an adhesive sheet of an embodiment different from the adhesive sheet of FIG. FIG.
  • FIG. 10 is a schematic plan view showing an adhesive sheet of an embodiment different from the adhesive sheets of FIGS. 6 and 9.
  • FIG. 11 is a schematic cross-sectional view taken along line YY of the adhesive sheet of FIG. 10 (a plane in which the cut surface is perpendicular to the conductive adhesive layer).
  • An adhesive sheet that includes a conductive adhesive layer and exhibits electrical conductivity (conductivity) or thermal conductivity in at least the thickness direction, and the conductive adhesive layer is continuous in the thickness direction. And an adhesive layer filled around the conductive portion.
  • the adhesive sheet has a conductive adhesive layer made of a conductive part and an adhesive layer made of an adhesive filled around the conductive part. Therefore, the adherend member can be mechanically bonded by the adhesive layer, and the conductive portions of the adherend member are electrically connected by the conductive portion, or the heat of the adherend members is heated by the conductive portion. Can promote conduction. As a result, it is possible to achieve both improvement in the mechanical adhesive strength between the adherends and improvement in electrical conductivity (electrical connectivity) or thermal conductivity.
  • the conductive portion may be a bump (bump) or a protrusion. Further, the conductive portion may be formed by laminating a plurality of bumps (bumps) in the thickness direction of the adhesive sheet. Further, the conductive portion may be made of a conductive paste or a heat conductive paste.
  • the conductive adhesive layer can be an electrically conductive adhesive layer (conductive adhesive layer) or a thermally conductive adhesive layer.
  • the adhesive sheet may be an adhesive sheet that develops both electrical conductivity and thermal conductivity in at least the thickness direction.
  • the conductive portion may be one or a plurality of conductive portions having electrical conductivity (conductivity) or thermal conductivity. Further, the conductive portion may be one or a plurality of conductive portions having both electrical conductivity and thermal conductivity.
  • the conductive portions may be formed in a linear shape in a plan view and arranged in a stripe shape, a lattice shape, or a concentric shape.
  • the conductive portion may be formed in a dot shape in a plan view and arranged in a dotted shape. Even if the conductive portion is arranged in a planar manner in this way, electrical connection or thermal connection can be ensured by a plurality of conductive portions between the adherend members, so that the mechanical connection strength is maintained easily and more easily.
  • the members to be bonded can be reliably connected electrically or thermally.
  • the central longitudinal cross-sectional shape of the conductive portion may be a trapezoid.
  • the adhesive covers the inclined side of the trapezoid, and therefore, the drop of the conductive portion from the conductive adhesive layer can be prevented.
  • the adhesive sheet is pressure-bonded to the adherend member, the pressure on the side where the width of the conductive portion is small (the trapezoidal top side) becomes high, so the side where the width of the conductive portion is small on the adherend having low adhesion By sticking the surface, the reliability of electric or heat transfer can be improved.
  • the conductive portion may be close to or exposed to at least one of the front surface and the back surface of the conductive adhesive layer.
  • the adhesive layer preferably contains electrically conductive particles (conductive particles), and the content of the electrically conductive particles is preferably 20% by volume or less.
  • electrical connectivity can further be improved, without reducing the mechanical adhesive strength of the said adhesive sheet because an adhesive bond layer contains the electroconductive particle of content below the said upper limit.
  • the adhesive sheet having a release film that is releasably laminated on at least one of the front side and the back side of the conductive adhesive layer is peeled off from the release film and bonded to an adherend (for example, flexible By adhering to the printed wiring board and the reinforcing board easily and reliably (for example, the flexible printed wiring board and the reinforcing board) mechanically bonded and electrically or thermally connected Can do.
  • an adherend for example, flexible
  • the adhesive layer contains heat conductive particles, and the content of the heat conductive particles is preferably 20% by volume or less.
  • heat conductivity can further be improved, without reducing the adhesive force of the said adhesive sheet because an adhesive bond layer contains the heat conductive particle of content below the said upper limit.
  • the conductive adhesive layer may have electrical insulation. Leakage current can be cut off because the conductive adhesive layer has electrical insulation.
  • a conductive part is formed on one side of the release film by printing using a conductive slurry having electrical conductivity or thermal conductivity, and an adhesive layer is formed around the conductive part by filling with an adhesive.
  • These adhesive sheets can be manufactured by a manufacturing method having a step of:
  • This manufacturing method includes a step of forming a conductive portion and a step of filling an adhesive around the conductive portion, so that the adhesive sheet is excellent in mechanical adhesive strength and electrical connection or thermal conductivity. Can be obtained.
  • the conductive adhesive layer includes a conductive portion and an adhesive layer made of an adhesive filled around the conductive portion, the conductive portion allows the ground circuit and the reinforcing plate of the flexible printed wiring board to be connected. It can be electrically connected, or heat conduction between the ground circuit of the flexible printed wiring board and the reinforcing plate can be promoted, and these can be mechanically bonded by the adhesive layer. As a result, it is possible to achieve both improvement in the mechanical adhesive strength between the flexible printed wiring board and the reinforcing plate and improvement in electrical conductivity (electrical connectivity) or thermal conductivity.
  • the conductive portion may be arranged so that the trapezoidal top side is located on the reinforcing plate side.
  • the contact area of the conductive portion with the reinforcing plate is relative to the contact area of the flexible printed wiring board. Therefore, the adhesion pressure to the reinforcing plate can be increased, and as a result, the adhesion to the reinforcing plate can be enhanced.
  • the contact area with the flexible printed wiring board is increased, the conduction area with the flexible printed wiring board is increased, and the electrical connectivity or thermal conductivity can be further improved.
  • the conductive portion may be disposed so that the trapezoidal top side is located on the flexible printed wiring board side. Since the trapezoidal top side is in contact with the flexible printed wiring board in this way, the contact area of the conductive portion with the flexible printed wiring board is relatively smaller than the contact area with the reinforcing plate. The adhesion pressure to the flexible printed wiring board can be increased, and as a result, the adhesion to the flexible printed wiring board can be enhanced.
  • the average thickness of the adhesive layer is preferably smaller than the average height of the conductive portion.
  • the conductive portion is exposed from the front surface or the back surface of the conductive adhesive layer, and the flexible printed wiring board and the reinforcing plate are more reliably Can be connected electrically or thermally.
  • At least one of the front surface side and the back surface side of the conductive portion is filled with an adhesive layer. In this way, by filling at least one of the front surface side and the back surface side of the conductive portion with the adhesive layer, it is possible to prevent the conductive portion from falling off the conductive adhesive layer.
  • the flexible printed wiring board and the reinforcing board are bonded, the ground circuit and the reinforcing board of the flexible printed wiring board are made electrically conductive, and separated by printing using a conductive slurry having electrical conductivity or thermal conductivity.
  • the adhesive sheet can be manufactured by a manufacturing method including a step of forming a conductive portion on one surface side of the mold film and a step of forming an adhesive layer around the conductive portion by filling the adhesive.
  • the manufacturing method of the adhesive sheet has excellent mechanical adhesive strength and electrical connectivity or thermal conductivity by having a step of forming a conductive portion and a step of filling an adhesive around the conductive portion. An adhesive sheet can be obtained.
  • the conductive adhesive layer is laminated on the release film and at least a part of the surface of the release film, and the conductive adhesive layer bonds the printed wiring board and the metal plate facing each other.
  • an adhesive sheet that develops electrical conductivity or thermal conductivity at least in the thickness direction between the conductive region where the conductive pattern is exposed on the opposing surface and the metal plate, wherein the one or more conductive portions are It may be present only in a region to be bonded to the conductive region of the printed wiring board.
  • the adhesive sheet by arranging one or a plurality of conductive parts that conduct electricity or heat only in the region to be bonded to the conductive region of the printed wiring board, electrical conductivity or thermal conductivity in the region to be bonded is provided.
  • the adhesive strength of the adhesive layer can be increased in a region other than the region to be bonded, so that a relatively large mechanical bond strength can be obtained. Therefore, it is possible to achieve both improvement in mechanical adhesive strength and improvement in electrical conductivity (electrical connectivity) or thermal conductivity.
  • the printed wiring board to which the adhesive sheet adheres has an insulating layer such as a coverlay laminated in a region other than the conductive region. Therefore, according to the adhesive sheet having the conductive portion other than the region to be bonded to the conductive region, it is necessary to compress the conductive portion other than the conductive region on the surface of the coverlay or the like to ensure the conductivity of the conductive portion of the conductive region. There is. On the other hand, if the adhesive sheet does not have a conductive portion other than the region to be bonded to the conductive region, there is no need to compress the conductive portion, and the conductive portion in the region to be bonded to the conductive region can be easily and reliably connected. it can.
  • One conductive portion may be provided for each conductive region. In this way, by configuring one conductive portion to be connected to each conductive region, the adhesive force of the adhesive layer is concentrated on one conductive portion in each conductive region, so that the pressure contact force acts. An electrical or thermal connection by contact of the conductive portion can be ensured more reliably.
  • the total area ratio of the conductive portions in the conductive adhesive layer is preferably 0.01% or more and 2% or less. As described above, by setting the total area ratio of the conductive portions within the above range, good adhesive strength and good electrical conductivity or thermal conductivity can be obtained.
  • the conductive pattern exposed in the conductive region is a ground wiring
  • the conductive portion preferably contains electrically conductive particles and a binder thereof.
  • the content of the electrically conductive particles is 20 volume% or more and 75 volumes. % Or less is preferable.
  • the metal plate can block electromagnetic noise.
  • the conductive portion contains the above-described content of the electrically conductive particles and the binder, better electrical conductivity and mechanical strength of the conductive portion can be obtained.
  • the conductive part may contain thermally conductive particles and a binder thereof, and the content of the thermally conductive particles is preferably 30% by volume or more and 90% by volume or less. As described above, when the conductive portion contains the thermally conductive particles and the binder having the above-described contents, better thermal conductivity and mechanical strength of the conductive portion can be obtained.
  • the present invention also includes a release film and a conductive adhesive layer laminated on at least a part of the surface of the release film, the conductive adhesive layer being opposed to the printed wiring board and metal.
  • a step of laminating a conductive slurry having electrical conductivity or thermal conductivity only in a region to be bonded to a conductive region of the printed wiring board on the surface of the release film by printing, and the laminated conductive slurry And a part of the surface of the release film around the one or the plurality of conductive portions by the step of forming one or a plurality of conductive portions and filling with an adhesive It includes processes for the preparation of the adhesive sheet and a step of forming an adhesive layer.
  • the “metal plate” means a plate-like metal body laminated on the flexible printed wiring board, and is used to reinforce the flexible printed wiring board or to enhance the heat dissipation of the flexible printed wiring board. It is a concept that includes a heat sink.
  • the “total area ratio of the conductive portion” refers to the ratio of the sum of the exposed areas of the conductive portion on the surface obtained by cutting the conductive adhesive layer at the center (or substantially the center) in the thickness direction.
  • the term “trapezoidal shape” means a shape having a base and a top side opposite to the base, the width of which decreases from the base side toward the top side, and includes concepts in which the top side or the side is a curve. is there.
  • the central longitudinal cross-sectional shape of the conductive portion means a cross-sectional shape in a plane that passes through the center of gravity of the conductive portion and is perpendicular to the conductive adhesive layer.
  • the “marking” is used for positioning, and includes the one based on the shape of the release film itself, the one printed on the surface of the release film, the other member, and the like.
  • the “slurry” refers to a material in which a solid content is mixed with a fluid and has a fluidity that can be printed, and includes adhesives, pastes, inks, paints, and the like.
  • the adhesive sheet 1 in FIG. 1 includes a conductive adhesive layer 3 and a release film 2 that is detachably laminated on one surface (referred to as the back surface) of the conductive adhesive layer 3.
  • the conductive adhesive layer 3 adheres to-be-adhered members (for example, a substrate of a flexible printed wiring board and a reinforcing plate) that face each other on the front side and the back side.
  • the conductive adhesive layer 3 includes a plurality of conductive portions 5 that are continuous in the thickness direction and are exposed on the front and back surfaces, and an adhesive that is filled around the plurality of conductive portions 5 in the conductive adhesive layer 3 in plan view.
  • an adhesive layer 6 made of The conductive adhesive layer 3 has anisotropic conductivity that allows electrical conduction in at least a direction perpendicular to the surface by the conductive portion 5, and has adhesiveness by the adhesive layer 6.
  • the conductive part 5 contains electrically conductive particles (conductive particles) and a binder thereof.
  • electrically conductive particles such as metal particles are dispersed in a binder can be used.
  • the shape of the conductive portion 5 in plan view is not particularly limited, and can be, for example, a linear shape or a dot shape.
  • the dot shape when the conductive portion 5 is in a dot shape is not particularly limited, and may be a polygonal shape, a cross shape, a star shape, or the like in addition to a circular shape.
  • the arrangement pattern of the conductive portion 5 in plan view can be appropriately designed according to the area and shape of the bonding surface of the member to be bonded. For example, a plurality of linear conductive portions shown in FIG. FIG. 2B shows a striped arrangement, a lattice shape in which a plurality of linear conducting portions shown in FIG.
  • FIG. 2B intersect, a concentric circle made up of a plurality of annular conducting portions shown in FIG. It is possible to use a scattered dot shape composed of a plurality of dot-shaped conductive portions shown in d), a staggered shape composed of a plurality of dot-shaped conductive portions (not shown), or a combination thereof.
  • Each of the above shapes has a region where the conductive portion 5 is not formed in plan view.
  • the area ratio of the conductive part 5 in the conductive adhesive layer 3 is not particularly limited, but the lower limit of the total area ratio of the conductive part 5 with respect to the area of the conductive adhesive layer 3 is preferably 0.01%. 0.05% is more preferable, 2.0% is more preferable, and 3.5% is more preferable. If the total area ratio of the conductive portion 5 is equal to or greater than the above lower limit, sufficient electrical connectivity of the adhesive sheet 1 is easily obtained.
  • the upper limit of the total area ratio of the conductive portion 5 with respect to the area of the conductive adhesive layer 3 is preferably 40%, more preferably 35%, and even more preferably 30%. If the total area ratio of the conductive part 5 is less than or equal to the above upper limit, the ratio of the adhesive layer 6 is reduced, and the mechanical adhesive strength of the adhesive sheet 1 can be suppressed from decreasing.
  • the lower limit of the total area ratio of the conductive part 5 to the area of the conductive adhesive layer 3 is 0.01%, more preferably 0.05%, and the upper limit of the total area ratio of the conductive part 5 to the area of the conductive adhesive layer 3 is It can also be 2%, more preferably 1.5%.
  • the conductive portion 5 when most or all of the conductive portion 5 is arranged in a region to be bonded to a conductive region of a member to be bonded (for example, a printed wiring board), it is preferable to set such an upper limit and a lower limit. . If the total area ratio of the conductive portion 5 is equal to or greater than this lower limit, sufficient electrical connectivity between the adherends can be easily obtained.
  • the total area ratio of the conductive portion 5 is less than or equal to this upper limit, the total amount of the conductive portion 5 is reduced, so that the manufacturing cost can be reduced, and the adhesive layer 6 is relatively large because the ratio of the adhesive layer 6 is large. Expresses adhesive strength.
  • the total area ratio of the conductive portion 5 to the area of the conductive adhesive layer 3 is the sum of the exposed area of the conductive portion 5 on the surface obtained by cutting the conductive adhesive layer 3 at the center (or substantially the center) in the thickness direction. Is divided by the area in plan view of the conductive adhesive layer 3 (including the conductive portion 5).
  • the plurality of conductive portions 5 are arranged in a state surrounded by the adhesive layer 6 in plan view. That is, as shown in FIG. 2, the conductive adhesive layer 3 is disposed so that the conductive layer 5 does not exist and the adhesive layer 6 exists at the edge of the conductive adhesive layer 3.
  • the shape of the central longitudinal section perpendicular to the conductive adhesive layer 3 of the conductive portion 5 is a trapezoid.
  • the central longitudinal cross-sectional shape of the conductive portion 5 has a bottom that comes into contact with the release film 2 and a top that appears on the surface of the conductive adhesive layer 3, from the bottom toward the top.
  • the width is smaller.
  • the top side is shorter than the bottom side, and the side connecting the top and the bottom is inclined.
  • An adhesive layer 6 is laminated on the inclined side.
  • the average length w1 of the bottom side of the conductive portion 5 can be appropriately designed according to the bonding area of the adherend, and can be set to 50 ⁇ m or more and 2000 ⁇ m or less, for example. Can be 50 ⁇ m or more and 500 ⁇ m or less.
  • the average length w2 of the top side of the conductive portion 5 can be, for example, 10 ⁇ m or more and 1900 ⁇ m or less, and preferably 20 ⁇ m or more and 450 ⁇ m or less.
  • the average length of the bottom side of the conduction part 5 means the average value of the base length in the central longitudinal cross-sectional shape in which the bottom side length of each conduction part 5 is the minimum.
  • the average length of the top sides of the conductive portions 5 means the average value of the top side lengths in the central longitudinal sectional shape in which the length of the top sides of the respective conductive portions 5 is minimized.
  • the average distance between the conductive parts 5 means the average value of the minimum distances between the adjacent conductive parts 5.
  • the upper limit of the ratio (w2 / w1) of the average length w2 of the top to the average length w1 of the bottom of the conductive portion 5 is preferably 0.95, and more preferably 0.8. 0.6 is more preferable.
  • the ratio of the average length w2 of the top to the average length w1 of the base exceeds the above upper limit, the effect of preventing the conduction part 5 from falling off may not be sufficiently obtained.
  • the lower limit of the ratio (w2 / w1) of the average length w2 of the top to the average length w1 of the bottom of the conductive portion 5 is preferably 0.2 and more preferably 0.4.
  • the ratio of the average length w2 of the top side to the average length w1 of the bottom side is less than the lower limit, the average length w1 of the bottom side becomes too large and the filling amount of the adhesive filled around the conductive portion 5 decreases. As a result, the mechanical adhesive strength may be reduced, or the average length w2 of the top side may be too small, and the electrical conductivity between the members to be bonded may be reduced.
  • the upper limit of the average height h of the conductive portion 5 is preferably 50 ⁇ m, and more preferably 45 ⁇ m. When the average height h of the conductive part 5 exceeds the upper limit, the thickness of the adhesive sheet 1 may be increased more than necessary.
  • the lower limit of the average height h of the conductive portion 5 is preferably 10 ⁇ m, and more preferably 15 ⁇ m. When the average height h of the conductive part 5 is less than the lower limit, it may be difficult to form the conductive part 5.
  • the average height h of the conductive portion 5 becomes smaller than the thickness of the cover lay laminated on the surface of the conductive pattern, so There is a possibility that the pattern and the reinforcing plate cannot be electrically connected.
  • Electrode conductive particles examples of the material for the electrically conductive particles contained in the conductive portion 5 include metals.
  • metals For example, silver, platinum, gold, copper, aluminum, iron, cobalt, magnesium, molybdenum, nickel, tungsten, zinc, palladium, solder, and the like can be used alone or in combination of two or more.
  • the electrically conductive particles a small amount of ceramic material such as AlN, Al 2 O 3 , SiC, Al—SiC, Si 3 N 4 , SiO 2 , ZrO 2 is mixed with the above metal simple substance or alloy into a particle shape. It may be.
  • silver powder, silver-coated copper powder, solder powder, or the like This is because these have excellent electrical conductivity (conductivity).
  • the conductive part 5 containing these metal particles as electrically conductive particles also has thermal conductivity
  • the adhesive sheet 1 also has thermal conductivity.
  • the content rate of the electroconductive particle of the conduction part 5 As a minimum of the content rate of the electroconductive particle of the conduction part 5, 20 volume% is preferable, 30 volume% is more preferable, 40 volume% is more preferable, 45 volume% is more preferable, 50 volume% is further more preferable.
  • the content rate of electroconductive particle is less than the said minimum, there exists a possibility that the electrical connectivity between to-be-adhered members may fall.
  • 75 volume% is preferable, 70 volume% is more preferable, and 60 volume% is further more preferable.
  • the content rate of electroconductive particle exceeds the said upper limit, the fluidity
  • binder examples include an epoxy resin, a phenol resin, a polyester resin, a polyurethane resin, an acrylic resin, a melamine resin, a polyimide resin, and a polyamideimide resin, and one or more of these can be used. It can. Among these, a thermosetting resin capable of improving the heat resistance of the conductive portion 5 is preferable, and an epoxy resin is particularly preferable.
  • Examples of the epoxy resin used for the binder include bisphenol A type, bisphenol F type, bisphenol S type, bisphenol AD type, copolymerized type of bisphenol A type and bisphenol F type, naphthalene type, novolac type, biphenyl type, dicyclopentadiene.
  • Examples thereof include an epoxy resin such as a mold and a phenoxy resin which is a polymer epoxy resin.
  • the binder can be used by dissolving in a solvent.
  • the solvent include ester-based, ether-based, ketone-based, ether-ester-based, alcohol-based, hydrocarbon-based, and amine-based organic solvents, and one or more of these are used. be able to.
  • a high boiling point solvent excellent in printability specifically, carbitol acetate or butyl carbyl. It is preferable to use tall acetate or the like.
  • the adhesive that fills the periphery of the conductive portion 5 in plan view and forms the adhesive layer 6 is not particularly limited as long as it has adhesiveness.
  • epoxy resin, polyimide resin, polyester resin, phenol resin, polyurethane examples thereof include a resin, an acrylic resin, a melamine resin, and a polyamideimide resin.
  • a thermosetting resin is preferable from the viewpoint of heat resistance, an epoxy resin or an acrylic resin is particularly preferable from the viewpoint of adhesion to a flexible printed wiring board, and the same kind of adhesive as the conductive slurry forming the conductive portion 5 is used. Is more preferable.
  • the above-mentioned solvent, curing agent, auxiliary agent and the like can be appropriately added to the adhesive layer 6.
  • electrically conductive particles can be added to the adhesive layer 6.
  • the upper limit of the amount of electrically conductive particles added to the adhesive layer 6 is preferably 20% by volume, more preferably 10% by volume, and even more preferably 5% by volume.
  • the adhesiveness of the adhesive layer 6 may be reduced due to an increase in impurities in the adhesive layer 6.
  • 0.1 time is preferable and 0.05 time is more preferable.
  • the upper limit of the average thickness of the conductive adhesive layer 3 is preferably 40 ⁇ m, more preferably 35 ⁇ m, and further preferably 30 ⁇ m (the average thickness of the conductive adhesive layer 3 is filled around the conductive portion 5 in plan view). Means the average thickness of the adhesive layer 6). When the average thickness of the conductive adhesive layer 3 exceeds the upper limit, the thickness of the adhesive sheet 1 may be increased more than necessary. Moreover, the thickness of the electronic component comprised by adhere
  • attaching a to-be-adhered member for example, a flexible printed wiring board and a metal plate
  • the lower limit of the average thickness of the conductive adhesive layer 3 is preferably 10 ⁇ m, and more preferably 15 ⁇ m.
  • the adhesive sheet 1 may not exhibit sufficient mechanical adhesive strength and electrical connectivity.
  • the average height h of the conductive portion 5 may be larger than the average thickness of the conductive adhesive layer 3.
  • the protruding length of the conductive portion 5 is preferably 20 ⁇ m, and more preferably 10 ⁇ m.
  • a synthetic resin film such as polyethylene resin, polypropylene resin, ethylene-vinyl acetate copolymer, ethylene-vinyl alcohol copolymer, polyethylene terephthalate resin, rubber sheet, paper, cloth, nonwoven fabric, net, An appropriate film-like body made of a foam sheet, a metal foil, a laminate of these, or the like can be used.
  • the surface of the release film 2 is subjected to release treatment such as silicone treatment, long-chain alkyl treatment, and fluorine treatment as necessary.
  • the peelability of the release film 2 can be controlled by adjusting the type of drug used for the peeling treatment or the coating amount thereof.
  • the adhesive sheet 1 can be used in the following procedure. First, the surface (the surface on which the release film 2 is not laminated) is attached to one member to be bonded. Next, the release film 2 is peeled off, and the back surface (the surface on which the release film 2 is laminated) is attached to the other member to be bonded, so that the members to be bonded are bonded while being electrically connected. be able to.
  • the manufacturing method of the said adhesive sheet has the following processes. (1) Step of forming conductive portion 5 on the surface of release film 2 by printing using conductive slurry having electrical conductivity (2) Forming an adhesive layer around conductive portion 5 by filling with adhesive Process
  • Conduction part formation process In a conduction part formation process, as shown in Drawing 3 (a), conductive slurry is printed on the surface of release film 2, and a plurality of conduction parts 5 are formed.
  • the conductive slurry printing method is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like can be used.
  • the conductive slurry forming the conductive part 5 is a composition having electrical conductivity by including the conductive particles constituting the conductive part 5 and a binder, and the binder is not cured, and is determined by a printing technique. What is necessary is just to have the moderate fluidity which can form a pattern, and to be hardened in the hardening process mentioned later. Therefore, as the conductive slurry having electrical conductivity, for example, those commercially available under the names of conductive paste, conductive ink, conductive paint, conductive adhesive and the like may be used.
  • a curing agent can be added to the conductive slurry.
  • the curing agent include amine curing agents, polyaminoamide curing agents, acid and acid anhydride curing agents, basic active hydrogen compounds, tertiary aminos, and imidazoles.
  • auxiliary agents such as thickeners and leveling agents can be added to the conductive slurry.
  • a conductive slurry can be obtained by mixing each said component, for example with a three roll, a rotary stirring deaerator, etc.
  • Adhesive filling process In the adhesive filling process, as shown in FIG. 3 (b), the surface of the release film 2 on which the plurality of conductive portions 5 are formed (around the conductive portions 5) is filled with an adhesive.
  • An adhesive layer 6 is formed.
  • a printing method or a coating method can be used.
  • the printing method is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like can be used.
  • a coating method For example, a knife coat, a die coat, a roll coat etc. can be used.
  • the adhesive sheet 1 has a conductive adhesive layer 3 having a plurality of conductive portions 5 and an adhesive layer 6 made of an adhesive filled around the conductive portions 5, the flexible print is disposed facing each other.
  • the conductive portion 5 electrically connects the conductive pattern and the reinforcing plate at the same time, and at the same time mechanically bonds the substrate and the reinforcing plate by the adhesive layer 6. be able to. As a result, it is possible to improve both the mechanical adhesive strength between the substrate and the reinforcing plate and the electrical conductivity (electrical connectivity).
  • the adhesive sheet 1 ensures electrical continuity by contact of a plurality of electrically conductive particles because the conductive portion 5 is in contact with the conductive pattern of the substrate and the reinforcing plate at the same time to reliably connect the conductors. As compared with a conventional conductive adhesive, variation in resistance value can be suppressed. Further, in the conventional conductive adhesive, a plurality of electrical paths that do not contribute to conduction (electrically connect the substrate and the reinforcing plate) are constituted by the electrically conductive particles, but this is prevented in the adhesive sheet 1, Connection reliability can be improved.
  • the adhesive sheet 1 has a range in which electrical connection between the substrate and the reinforcing plate is possible. Can be bigger. Moreover, the said adhesive sheet 1 can be used suitably also for the connection of the to-be-adhered member of a special planar shape. Further, since the plurality of conductive portions 5 are arranged in a state in which the periphery of the planar view is surrounded by the adhesive layer 6 (the conductive portion 5 does not exist at the edge of the conductive adhesive layer 3), the mechanical portion is highly mechanical. Has adhesive strength.
  • the adhesive sheet 1 can cover the inclined side of the trapezoid with the adhesive layer 6 and prevent the conductive part 5 from falling off.
  • the adhesive sheet 11 in FIG. 4A includes a conductive adhesive layer 13 and a release film 2 that is peelably laminated on one surface (referred to as the back surface) of the conductive adhesive layer 13.
  • the release film 2 is the same as the adhesive sheet 1 of the first embodiment of FIG.
  • the conductive adhesive layer 13 is continuous in the thickness direction, close to the front surface and exposed to the back surface and a plurality of conductive portions 5, and an adhesive layer 16 made of an adhesive filled around the plurality of conductive portions 5. And have.
  • the adhesive layer 16 is filled on the side surface side and the surface side of the conductive portion 5, and the average thickness of the conductive adhesive layer 13 is larger than the average height of the conductive portion 5.
  • the conductive part 5 is the same as the adhesive sheet 1 of the first embodiment of FIG. 1, the same reference numerals are given and description thereof is omitted.
  • the adhesive agent which forms the adhesive bond layer 16 is the same as the adhesive agent which forms the adhesive bond layer 6 of 1st embodiment.
  • the upper limit of the average distance h1 between the surface of the conductive adhesive layer 13 and the surface of the conductive portion 5 is preferably 15 ⁇ m, and more preferably 10 ⁇ m.
  • the conductive portion 5 is connected to the conductor portion of the adherend member when the adhesive sheet 11 is adhered to the adherend member. There is a risk that it will not be.
  • the lower limit of the average distance h1 between the surface of the conductive adhesive layer 13 and the surface of the conductive portion 5 is preferably 1 ⁇ m. When the average distance h1 between the surface of the conductive adhesive layer 13 and the surface of the conductive portion 5 is less than the lower limit, the effect of preventing the drop of the conductive portion 5 may not be sufficiently obtained.
  • the adhesive constituting the adhesive layer 16 on the surface side of the conductive portion 5 flows by pressure during adhesion to the adherend member, and the conductive portion 5 is a conductor of the adherend member on the front surface side and the back surface side. Connected to the part. Therefore, the said adhesive sheet 11 has an effect similar to the adhesive sheet 1 of 1st embodiment. Moreover, since the said adhesive sheet 11 has the adhesive bond layer 16 laminated
  • the adhesive sheet 21 in FIG. 4B includes a conductive adhesive layer 23 and a release film 2 that is peelably laminated on one surface (referred to as the back surface) of the conductive adhesive layer 23.
  • the release film 2 is the same as the adhesive sheet 1 of the first embodiment of FIG.
  • the conductive adhesive layer 23 has a plurality of conductive portions 5 that are continuous in the thickness direction and close to the front and back surfaces, and an adhesive layer 26 made of an adhesive filled around the plurality of conductive portions 5. . That is, the adhesive layer 26 is filled on the side surface side, the front surface side, and the back surface side of the conductive portion 5, and the average thickness of the conductive adhesive layer 23 is larger than the average height of the conductive portion 5. As a result, it is possible to improve the prevention of the conductive portion 5 from falling off the conductive adhesive layer 23 and to easily and reliably fill the periphery of the conductive portion 5 with the adhesive layer 26. Since the conductive part 5 is the same as the adhesive sheet 1 of the first embodiment of FIG. 1, the same reference numerals are given and description thereof is omitted. Moreover, the adhesive agent which forms the adhesive bond layer 26 is the same as the adhesive agent which forms the adhesive bond layer 6 of 1st embodiment.
  • the upper limit of the average distance h2 between the back surface of the conductive adhesive layer 23 (the surface of the release film 2) and the back surface of the conductive portion 5 is preferably 15 ⁇ m and more preferably 10 ⁇ m.
  • the conductive portion 5 is connected to the conductor portion of the bonded member when the adhesive sheet 21 is bonded to the bonded member. There is a risk that it will not be.
  • the lower limit of the average distance h2 between the back surface of the conductive adhesive layer 23 and the back surface of the conductive portion 5 is preferably 1 ⁇ m. When the average distance h2 between the back surface of the conductive adhesive layer 23 and the back surface of the conductive portion 5 is less than the lower limit, the drop-off preventing effect of the conductive portion 5 may not be sufficiently obtained.
  • the said adhesive sheet 21 can be manufactured with the manufacturing method which has the following processes, for example. (1) Step of laminating adhesive on the surface of release film 2 (2) Conductive portion 5 on the surface of adhesive laminated in the adhesive laminating step by printing using conductive slurry having electrical conductivity (3) Forming the adhesive layer 26 around the conductive portion 5 by filling the adhesive
  • the adhesive constituting the adhesive layer 26 on the front surface side and the back surface side of the conductive portion 5 flows by pressure at the time of bonding to the adherend member, and the conductive portion 5 adheres on the front surface side and the back surface side. Connected to the conductor portion of the member. Therefore, the said adhesive sheet 21 has an effect similar to the adhesive sheet 1 of 1st embodiment. Moreover, since the said adhesive sheet 21 has the adhesive bond layer 26 laminated
  • the adhesive sheet of the present embodiment is substantially the same as the adhesive sheet of the first embodiment, but is characterized in that the conductive portion contains electrically insulating thermally conductive particles.
  • FIG. 1 to FIG. 3 are referred to as in the case of the adhesive sheet of the first embodiment.
  • the conductive adhesive layer 3 adheres to-be-adhered members (for example, a conductive pattern of a printed wiring board and a heat radiating member) disposed to face the front side and the back side, respectively.
  • the conductive adhesive layer 3 includes a plurality of conductive portions 5 that are continuous in the thickness direction and are exposed on the front and back surfaces, and an adhesive that is filled around the plurality of conductive portions 5 in the conductive adhesive layer 3 in plan view.
  • an adhesive layer 6 made of The conductive adhesive layer 3 has a high thermal conductivity at least in a direction perpendicular to the surface by the conductive part 5 (a thermal conductivity higher in the direction perpendicular to the surface direction of the conductive adhesive layer 3). At the same time, the adhesive layer 6 has adhesiveness.
  • the conductive adhesive layer 3 preferably has electrical insulation.
  • the conductive part 5 contains thermally conductive particles and a binder thereof.
  • a material in which thermally conductive particles are dispersed in a binder can be used.
  • these thermally conductive particles and binder have electrical insulation so as to prevent leakage current and the like.
  • the conductive part 5 of the present embodiment is the same as the conductive part 5 in the first embodiment except that it contains electrically insulating thermally conductive particles.
  • the shape and arrangement pattern of the conductive portion 5 of the present embodiment are the same as those of the first embodiment. Further, similarly to the first embodiment, the plurality of conductive portions 5 are arranged in a state of being surrounded by the adhesive layer 6 in the plan view.
  • the area ratio of the conductive portion 5 in the conductive adhesive layer 3 of the present embodiment is the same as that of the first embodiment. If the total area ratio of the conductive portions 5 in the conductive adhesive layer 3 is equal to or greater than the lower limit shown in the first embodiment, sufficient thermal conductivity of the adhesive sheet 1 is easily obtained.
  • the shape of the central longitudinal section perpendicular to the conductive adhesive layer 3 of the conductive portion 5 is a trapezoidal shape as in the first embodiment, but the ratio of the average length w2 of the top to the average length w1 of the bottom is In the case of less than the lower limit shown in the first embodiment, there is a possibility that the thermal conductivity between the adherends is lowered. Further, when the average height h of the conductive portion 5 is less than the lower limit shown in the first embodiment, for example, when the heat dissipation member is bonded to the printed wiring board using the adhesive sheet 1, the conductive portion 5 is laminated on the surface of the conductive pattern. The average height h of the conductive portion 5 becomes smaller than the thickness of the cover lay, and there is a possibility that good thermal conductivity cannot be exhibited due to the separation of the conductive pattern and the heat radiating member from the conductive portion 5.
  • thermally conductive particles examples include ceramics.
  • These thermally conductive particles are electrically insulating.
  • aluminum nitride and silicon nitride are preferable from the viewpoint of thermal conductivity, and aluminum nitride is more preferable.
  • the average particle diameter of the heat conductive particles depends on the thickness of the adhesive sheet 1, the lower limit is preferably 2 ⁇ m, more preferably 3 ⁇ m, and even more preferably 5 ⁇ m. If the average particle size of the heat conductive particles is less than the lower limit, it may be difficult to mold the heat conductive particles. Moreover, as an upper limit, 30 micrometers is preferable, 20 micrometers is more preferable, and 15 micrometers is more preferable. If the average particle size of the thermally conductive particles exceeds the above upper limit, the surface of the conductive portion 5 may become rough and the adhesion to the adherend may be impaired.
  • the “average particle size” means a particle size value at which the integrated amount is 50% by mass based on the integrated distribution obtained from the total particle mass under the sieve of each particle size obtained by the sieving method for the particle group. To do.
  • the content rate of the heat conductive particle of the conduction part 5 As a minimum of the content rate of the heat conductive particle of the conduction part 5, 30 volume% is preferable, 40 volume% is more preferable, 45 volume% is more preferable, 50 volume% is further more preferable. When the content rate of a heat conductive particle is less than the said minimum, there exists a possibility that the heat conductivity between to-be-adhered members may fall. On the other hand, as an upper limit of the content rate of the heat conductive particle of the conduction part 5, 90 volume% is preferable, 75 volume% is more preferable, and 70 volume% is more preferable.
  • the fluidity of the conductive part 5 may be lowered during production, and it may be difficult to form the conductive part 5, or the conductive part 25 may be broken during use to cause thermal conductivity. May be damaged.
  • binder The material of the binder of the conductive part 5 of this embodiment is the same as that of the first embodiment.
  • the adhesive layer 6 of this embodiment is the same as that of 1st embodiment, it is preferable to have electrical insulation.
  • thermally conductive particles having electrical insulation can be added to the adhesive layer 6.
  • the upper limit of the amount of thermally conductive particles added to the adhesive layer 6 is preferably 20% by volume, more preferably 10% by volume, and even more preferably 5% by volume.
  • the adhesiveness of the adhesive layer 6 may be lowered due to an increase in impurities in the adhesive layer 6.
  • 0.1 time is preferable and 0.05 time is more preferable.
  • the release film 2 of this embodiment is the same as that of the first embodiment.
  • the usage method of the adhesive sheet of this embodiment is the same as that of 1st embodiment.
  • the manufacturing method of the said adhesive sheet has the following processes. (1) A conductive part forming step of forming the conductive part 5 on the surface of the release film 2 by printing using a conductive slurry having thermal conductivity, (2) Adhesive filling step of forming the adhesive layer 6 around the conductive portion 5 by filling the adhesive
  • the manufacturing method of the adhesive sheet is the same as the manufacturing method of the adhesive sheet of the first embodiment except that the conductive slurry is different.
  • the conductive slurry forming the conductive part 5 is a composition having thermal conductivity by including the thermally conductive particles constituting the conductive part 5 and a binder, and the binder is not cured and depends on the printing technology. What is necessary is just to have the moderate fluidity which can form a pattern, and to be hardened in a hardening process.
  • the adhesive sheet 1 includes a conductive adhesive layer 3 having a plurality of conductive portions 5 and an adhesive layer 6 made of an adhesive filled around the plurality of conductive portions 5 in the conductive adhesive layer 3 in plan view. For this reason, when the members to be bonded that are arranged to face each other are bonded together, the conductive portion 5 increases the thermal conductivity between the members to be bonded and mechanically bonds the members to be bonded by the adhesive layer 6. be able to. As a result, it is possible to improve both the mechanical adhesive strength between the members to be bonded and the thermal conductivity.
  • the adhesive sheet 1 can be reliably connected by simultaneously abutting against a pair of members to be bonded (for example, a conductive pattern of a printed wiring board and a heat radiating member) disposed with the conductive portion 5 facing each other.
  • the variation in thermal conductivity can be suppressed as compared with a conventional thermal conductive adhesive that ensures thermal conductivity by contact of a plurality of thermally conductive particles.
  • the adhesive sheet 1 has a region having high thermal conductivity between the bonded members. Can be bigger. Moreover, the said adhesive sheet 1 can be used suitably also for the connection of the to-be-adhered member of a special planar shape. Moreover, since the some conduction
  • the adhesive sheet 1 can cover the inclined side of the trapezoid with the adhesive layer 6 and prevent the conductive part 5 from falling off.
  • the conductive adhesive layer 3 of the adhesive sheet 1 has an electrical insulation property, it is possible to cut off a leakage current. As a result, the power consumption of the circuit is reduced, malfunctions are prevented, and dielectric breakdown is prevented. Etc. can be achieved.
  • FIG. 1 to FIG. 3 are referred to as in the case of the adhesive sheet of the first embodiment.
  • vertical to the conductive contact bonding layer 3 of the conduction part 5 is trapezoid similarly to 1st embodiment.
  • the conductive portion 5 may be arranged such that the trapezoidal top side is located on the flexible printed wiring board side, or may be arranged such that the trapezoidal top side is located on the reinforcing plate side. Since the contact area on the top side of the trapezoidal shape of the conductive portion 5 is relatively smaller than the contact area on the bottom side, the conductive portion 5 is arranged so that the top side is located on the member side where the adhesive pressure is to be increased. By doing so, adhesiveness with this member can be improved.
  • the adhesive sheet 1 can be used in the following procedure. First, the surface (the surface on which the release film 2 is not laminated) is attached to one of the flexible printed wiring board and the reinforcing board. Next, the release film 2 is peeled off, and the back surface (the surface on which the release film 2 is laminated) is attached to the other of the flexible printed wiring board and the reinforcing board, thereby electrically connecting the flexible printed wiring board and the reinforcing board. It can be glued while connected to.
  • the surface of the adhesive sheet 1 is affixed to the reinforcing plate, that is, the affixation of the conductive portion 5 is performed by adhering the trapezoidal top of the central longitudinal section of the conductive portion 5 to the reinforcing plate.
  • the contact area with the board can be made relatively small with respect to the contact area with the flexible printed wiring board to increase the adhesion pressure to the reinforcing board.
  • the adhesion of the adhesive sheet 1 to the reinforcing plate can be enhanced.
  • the contact area to the flexible printed wiring board is increased, the conduction area between the adhesive sheet 1 and the flexible printed wiring board is increased, and the electrical connectivity can be further improved.
  • the contact area with the flexible printed wiring board 5 can be made relatively small with respect to the contact area with the reinforcing plate to increase the adhesion pressure to the flexible printed wiring board.
  • the adhesion of the adhesive sheet 1 to the flexible printed wiring board can be enhanced.
  • the conductive adhesive layer 2 has a plurality of conductive portions 5 and an adhesive layer 6 made of an adhesive filled around the conductive portions 5, the adhesive sheet 1 is a flexible print disposed so as to face each other.
  • the conductive portion 5 electrically connects the conductive pattern and the reinforcing plate at the same time, and at the same time mechanically bonds the substrate and the reinforcing plate by the adhesive layer 6. be able to. As a result, it is possible to improve both the mechanical adhesive strength between the substrate and the reinforcing plate and the electrical conductivity (electrical connectivity).
  • the adhesive sheet 1 is electrically connected by contact of a plurality of conductive particles in order that the conductive portion 5 is in contact with the ground circuit and the reinforcing plate of the flexible printed wiring board at the same time, thereby reliably connecting them.
  • the variation in resistance value can be suppressed.
  • a plurality of electrical paths that do not contribute to conduction does not electrically connect the substrate and the reinforcing plate
  • this is prevented and connected. Reliability can be increased.
  • the adhesive sheet 1 has an electrical connection between the ground circuit of the flexible printed wiring board and the reinforcing plate. Range that can be connected dynamically. Moreover, the said adhesive sheet 1 can be used suitably also for the connection of a flexible printed wiring board and reinforcement board of a special planar shape.
  • the plurality of conductive portions 5 are disposed in a state in which the periphery of the planar view is surrounded by the adhesive layer 6 (the conductive portions 5 do not exist at the edge of the conductive adhesive layer 2), Has adhesive strength.
  • the adhesive sheet 1 can cover the inclined side of the trapezoid with the adhesive layer 6 to prevent the conductive part 5 from falling off. it can.
  • the adhesive sheet 1 shown in FIGS. 6 and 7 includes a release film 2 and a conductive adhesive layer 3 laminated in a central region on the surface of the release film 2.
  • the adhesive sheet 1 adheres the printed wiring board and the metal plate facing each other by the conductive adhesive layer 3, and at least the thickness between the conductive region and the metal plate where the conductive pattern is exposed on the facing surface of the printed wiring board. It develops electrical conductivity in the direction.
  • the release film 2 has positioning holes 4 as markings for positioning in both end regions where the conductive adhesive layer 3 is not laminated.
  • the material which comprises the release film 2 is the same as that of 1st embodiment.
  • the conductive adhesive layer 3 bonds the flexible printed wiring board and the metal plate facing the front surface side and the back surface side to each other, and between the conductive region and the metal plate where the conductive pattern is exposed on the facing surface of the flexible printed wiring board. It is a layer formed for the purpose of developing electrical conductivity at least in the thickness direction.
  • the conductive adhesive layer 3 has a plurality of conductive portions 5 having electrical conductivity at least in the thickness direction, and an adhesive layer 6 filled around the conductive portions 5. .
  • the conductive adhesive layer 3 can conduct electric energy at least in a direction (thickness direction) perpendicular to the surface by the conductive portion 5 and has adhesiveness by the adhesive layer 6.
  • the conductive part 5 contains electrically conductive particles and a binder thereof.
  • the conductive portion 5 is arranged in the conductive adhesive layer 3 so as to be present only in the region 7 to be bonded to the conductive region of the flexible printed wiring board indicated by a one-dot chain line in FIG.
  • the plan view shape of the conductive portion 5 is the same as that of the first embodiment. Further, the arrangement pattern of the conductive portion 5 in plan view is the same as that in the first embodiment, but can be appropriately designed according to the area, shape, and the like of the adhesion planned region 7. Moreover, there exists an area
  • the total area ratio of the conductive portion 5 in the conductive adhesive layer 3 is not particularly limited, but the lower limit of the total area ratio of the conductive portion 5 with respect to the area of the conductive adhesive layer 3 is preferably 0.01%, 0.05% is more preferable. On the other hand, the upper limit of the total area ratio of the conductive portion 5 with respect to the area of the conductive adhesive layer 3 is preferably 2%, and more preferably 1.5%.
  • the total area ratio of the conductive portion 5 in the adhesion planned region 7 is not particularly limited, but the lower limit of the total area ratio of the conductive portion 5 with respect to the area of the adhesion planned region 7 is preferably 0.1%, 1% is more preferable.
  • the upper limit of the total area ratio of the conductive portion 5 with respect to the area of the adhesion planned region 7 is preferably 80%, and more preferably 60%. When the total area ratio of the conductive portion 5 with respect to the area of the adhesion planned region 7 is less than the lower limit, the electrical conductivity of the conductive adhesive layer 3 may be insufficient.
  • the total area ratio of the conductive portion 5 with respect to the area of the conductive adhesive layer 3 is the sum of the exposed areas of the conductive portion 5 on the surface obtained by cutting the conductive adhesive layer 3 at the center (or substantially the center) in the thickness direction. Is divided by the area in plan view of the conductive adhesive layer 3 (including the conductive portion 5).
  • the plurality of conductive portions 5 are arranged in a state surrounded by the adhesive layer 6 in plan view. That is, as shown in FIG. 6, the conductive layer 5 is not present at the periphery of the adhesion planned region 7 so that the adhesive layer 6 is present.
  • the shape of the central vertical cross section perpendicular to the conductive adhesive layer 3 of the conductive portion 5 is a trapezoidal shape, which is the same as in the first embodiment, and thus redundant description is omitted.
  • the conductive portion 5 may be arranged such that the trapezoidal top side is located on the flexible printed wiring board side, or may be arranged such that the trapezoidal top side is located on the metal plate side. Since the contact area on the top side of the trapezoidal shape of the conductive portion 5 is relatively smaller than the contact area on the bottom side, the conductive portion 5 is arranged so that the top side is located on the member side where the adhesive pressure is to be increased. By doing so, adhesiveness with this member can be improved.
  • the electrically conductive particles are the same as in the first embodiment.
  • binder The material of the binder is the same as in the first embodiment.
  • Adhesive layer The adhesive layer is the same as in the first embodiment.
  • the adhesive sheet 1 can be used in the following procedure. First, the surface (surface opposite to the release film 2) is attached to a flexible printed wiring board having a conductive region where the conductive pattern is exposed. At this time, for example, a positioning hole having the same shape is formed in advance in the position corresponding to the positioning hole 4 of the adhesive sheet 1 in the flexible printed wiring board, and the positioning hole of the flexible printed wiring board and the corresponding positioning of the adhesive sheet 1 are performed. By detecting the state in which the holes 4 are arranged in the thickness direction of the adhesive sheet 1 by optical means such as laser light, the conductive area of the flexible printed wiring board and the adhesion expected area of the adhesive sheet 1 are accurately overlapped. be able to.
  • the bonding expected area of the adhesive sheet 1 is aligned with the conductive area of the flexible printed wiring board. Also good.
  • the release film 2 is peeled off, and the back surface of the conductive adhesive layer 3 (the surface on which the release film 2 is laminated) is attached to a metal plate.
  • the conductive adhesive layer 3 and the metal plate are aligned by, for example, forming a positioning hole in the metal plate or its jig that can be positioned using optical means such as laser light or mechanical means such as a pin. be able to.
  • the conductive pattern corresponding to the adhesion planned region 7 of the adhesive sheet 1 and exposed in the conductive region of the flexible printed wiring board is a ground wiring.
  • the contact area of the conductive portion 5 with the conductive pattern can be made relatively small with respect to the contact area with the metal plate, so that the adhesion pressure of the conductive portion 5 to the conductive pattern can be increased. As a result, the adhesion of the adhesive sheet 1 to the conductive pattern can be improved. Further, since the contact area of the conductive portion 5 with the metal plate is increased, the energy transmission area between the conductive adhesive layer 3 and the metal plate is increased, and the electrical conductivity can be further improved.
  • the surface of the adhesive sheet 1 may be attached to a metal plate so that the trapezoidal top side in the central vertical cross-sectional shape of the conductive portion 5 contacts the metal plate.
  • the contact area of the conductive portion 5 with the metal plate is made relatively small with respect to the contact area with the conductive pattern of the flexible printed wiring board, and the conductivity
  • the adhesion pressure of the adhesive layer 3 to the metal plate can be increased.
  • the manufacturing method of the said adhesive sheet has the following processes. (1) A step of laminating a conductive slurry having electrical conductivity only in the region 7 to be bonded to the conductive region of the printed wiring board on the surface of the release film 2 by printing. (2) Laminating the conductive slurry Step of curing to form a plurality of conductive portions 5 (3) Forming an adhesive layer 6 around the plurality of conductive portions 5 and in a part of the surface of the release film 2 by filling with an adhesive. Process
  • a conductive slurry containing electrically conductive particles and a binder thereof is laminated on the surface of the release film 2 so as to have a desired three-dimensional shape by printing.
  • the method for printing the conductive slurry is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like can be used.
  • the conductive slurry is the same as in the first embodiment.
  • the conductive part forming step the conductive slurry is cured by heating by an appropriate method according to the type of binder of the conductive slurry laminated on the surface of the release film 2, for example, when the binder is a thermosetting resin.
  • the conductive portion 5 is formed.
  • the solvent is evaporated in this conductive portion forming step.
  • the adhesive layer 6 is formed by filling the surface of the release film 2 on which the plurality of conductive portions 5 are formed (around the conductive portions 5) with the adhesive.
  • a printing method or a coating method can be used as a method for filling the adhesive.
  • the printing method is not particularly limited, and for example, screen printing, gravure printing, offset printing, flexographic printing, inkjet printing, dispenser printing, and the like can be used.
  • a coating method For example, a knife coat, a die coat, a roll coat etc. can be used.
  • the adhesive sheet 1 includes a plurality of conductive parts 5 having conductive properties, in which a conductive adhesive layer 3 is formed in a planned adhesion area 7 with respect to a conductive area where a conductive pattern of a flexible printed wiring board is exposed, and these conductive parts. 5, when the flexible printed wiring board and the metal plate are bonded by the conductive adhesive layer 3, the conductive adhesive layer 3 conducts the flexible printed wiring board. Electrical conductivity is developed in the thickness direction between the conductive pattern exposed on the opposing surface in the region and the metal plate. Further, the adhesive layer 6 is not required to have electrical conductivity, and the conductive portion 5 does not exist in the region other than the adhesion planned region 7, so that a relatively large adhesive force is expressed. That is, the said adhesive sheet 1 can make compatible the improvement of the mechanical adhesive strength between a flexible printed wiring board and a metal plate, and the improvement of electrical conductivity (electrical connection property).
  • the adhesive sheet 1 is electrically connected by contact of a plurality of conductive particles, since the conductive portion 5 is in contact with the conductive pattern of the flexible printed wiring board and the metal plate at the same time, thereby securely connecting them. As compared with the conventional electrically conductive adhesive to be secured, variation in resistance value can be suppressed.
  • the conductive sheet 5 does not exist in a region other than the planned adhesion region 7 in the adhesive sheet 1, the conductive adhesive layer 3 can exhibit a relatively large adhesive force in a region other than the planned adhesion region 7. Thereby, the adhesive strength of a flexible printed wiring board and a metal plate can be improved more.
  • the adhesive sheet 1 covers the inclined side of the trapezoid with the adhesive layer 6 to prevent the conductive part 5 from falling off. Can do.
  • the adhesive sheet 1 has a plurality of conductive portions 5 in the bonding scheduled region 7, even if one conductive portion 5 is separated from the conductive pattern or metal plate of the printed wiring board, another conductive portion 5 is provided. Thus, the electrical conductivity between the conductive pattern of the printed wiring board and the metal plate can be maintained.
  • [Seventh embodiment] 9 includes a release film 12 and a plurality of conductive adhesive layers 13 formed on the release film 12 in a predetermined pattern.
  • the adhesive sheet 11 has a back surface of the conductive adhesive layer 13 in which two conductive adhesive layers 13 are laminated on a plurality of flexible printed wiring boards having a shape P indicated by a two-dot chain line, and the release film 12 is peeled off.
  • it is used for laminating metal plates each having a planar shape substantially equal to each conductive adhesive layer 13.
  • the release film 12 has two positioning holes 14 for each region corresponding to each flexible printed wiring board in order to perform positioning with each flexible printed wiring board on which the two conductive adhesive layers 13 are laminated.
  • the material of the release film 12 the same material as the release film 2 in the adhesive sheet 1 of FIG. 6 can be used.
  • Each conductive adhesive layer 13 has one conductive portion 15 and an adhesive layer 16 filled around the conductive portion 15.
  • Each of the conductive adhesive layers 13 has one planned adhesion region 17, and each conductive planned region 17 has a conductive portion 15.
  • the individual conductive portions 15 are the same as the conductive portions 5 in the adhesive sheet 1 of FIG.
  • the adhesive layer 16 is the same as the adhesive layer 6 in the adhesive sheet 1 of FIG. 6 except for the planar shape corresponding to the arrangement of the conductive portion 15, the description thereof is omitted.
  • the adhesive sheet 11 has one conductive portion 15 in each bonding planned region 17 and pressure due to the adhesive force of the adhesive layer 16 is concentrated on the conductive portion 15, the conductive portion 15 and the flexible printed wiring board An electrical connection that allows electrical conduction to and from the conductive pattern is ensured.
  • the conductive portion 15 determines the distance between the flexible printed wiring board and the metal plate at the contact position.
  • the flexible printed circuit is formed around the conductive portion 15. The distance between the flexible printed wiring board and the metal plate is reduced by the flexibility of the wiring board. As a result, the adhesive layer 16 is more reliably brought into contact with the flexible printed wiring board and the metal plate, so that a larger adhesive force can be obtained.
  • the adhesive sheet 11 can simultaneously laminate two conductive adhesive layers 13 on a plurality of flexible printed wiring boards. For this reason, the electronic component comprised by adhere
  • the adhesive sheet 21 shown in FIGS. 10 and 11 includes a release film 2 and a conductive adhesive layer 23 laminated in a central region on the surface of the release film 2.
  • the adhesive sheet 1 adheres the printed wiring board and the metal plate facing each other by the conductive adhesive layer 3, and at least the thickness between the conductive region and the metal plate where the conductive pattern is exposed on the facing surface of the printed wiring board. It develops thermal conductivity in the direction.
  • the release film 2 is the same as the release film 2 of the adhesive sheet 1 of FIGS.
  • the conductive adhesive layer 23 adheres the flexible printed wiring board and the metal plate facing the front side and the back side to each other, and at least the thickness between the conductive region and the metal plate of the flexible printed wiring board where the conductive pattern is exposed. It is a layer formed for the purpose of developing thermal conductivity in the direction.
  • the conductive adhesive layer 23 has a plurality of conductive portions 25 having thermal conductivity at least in the thickness direction, and an adhesive layer 6 filled around the conductive portions 25. .
  • the conductive adhesive layer 23 can conduct heat energy at least in the direction perpendicular to the surface (thickness direction) by the conductive portion 25 and has adhesiveness by the adhesive layer 6.
  • the adhesive layer 6 is the same as the adhesive layer 6 in the conductive adhesive layer 23 of the adhesive sheet 1 of FIGS.
  • Conductive portion 25 contains thermally conductive particles and a binder thereof. Since the conductive portion 25 is the same except for the conductive portion 5 and the thermally conductive particles in the conductive adhesive layer 23 of the adhesive sheet 1 in FIGS. 6 and 7, the shape, arrangement, binder material, etc. A duplicate description is omitted.
  • the thermally conductive particles are the same as in the fourth embodiment.
  • the adhesive sheet 21 can be used in the following procedure. First, the surface (surface opposite to the release film 2) is attached to a flexible printed wiring board having a conductive region where the conductive pattern is exposed. Next, the release film 2 is peeled off, and the back surface of the conductive adhesive layer 23 (the surface on which the release film 2 is laminated) is attached to a metal plate.
  • the metal plate that is bonded to the flexible printed wiring board by the adhesive sheet 21 is preferably a heat sink having fins that protrude perpendicularly to the flexible printed wiring board.
  • the manufacturing method of the said adhesive sheet 21 of FIG.10 and FIG.11 has the following processes. (1) The process of laminating the conductive slurry having thermal conductivity only in the area 7 to be bonded to the conductive area of the printed wiring board in the surface of the release film 2 by printing. (2) The laminated conductive slurry Step of curing and forming a plurality of conductive portions 25 (3) Forming the adhesive layer 6 around the plurality of conductive portions 25 and in a part of the surface of the release film 2 by filling the adhesive. Process
  • the manufacturing method of the adhesive sheet 21 is the same as the adhesive sheet 1 shown in FIGS. 6 and 7 except that the conductive slurry is different, the overlapping description is omitted.
  • the adhesive sheet 21 includes a plurality of conductive portions 25 having a thermal conductivity in which a conductive adhesive layer 23 is formed in a planned adhesion region 7 with respect to a conductive region where a conductive pattern of a flexible printed wiring board is exposed, and these conductive portions.
  • the adhesive layer 6 made of an adhesive filled around the conductive adhesive layer 23 is adhered to the flexible printed wiring board and the metal plate by the conductive adhesive layer 23.
  • Thermal conductivity is developed in the thickness direction between the conductive pattern exposed in the region and the metal plate.
  • the adhesive layer 6 is not required to have thermal conductivity, and the conductive portion 25 is not present outside the region 7 to be bonded, and thus exhibits a relatively large adhesive force. That is, the adhesive sheet 21 can achieve both improvement in mechanical adhesion strength between the flexible printed wiring board and the metal plate and improvement in thermal conductivity.
  • the adhesive sheet 11 in FIG. 9 can be an adhesive sheet that includes a conductive portion having thermal conductivity, and has other features similar to those of the adhesive sheet 11 in FIG. 9.
  • planar shape of the adhesive sheet and the conductive adhesive layer is not limited to that of the above embodiment.
  • it can be made into arbitrary shapes according to the shape of the printed wiring board and metal plate to adhere
  • the adhesive sheet includes a sheet that adheres a metal plate to an inflexible printed wiring board.
  • the conductive part when the conductive slurry forming the conductive part includes the electrically conductive particles and the thermally conductive particles, the conductive part may have both electrical conductivity and thermal conductivity.
  • the lower limit and the upper limit of the content ratio of the electrically conductive particles and the thermally conductive particles in the conductive part are determined according to the volume ratio of the electrically conductive particles and the thermally conductive particles.
  • the lower limit and the upper limit of the above-described thermally conductive particles may be set to values that are proportionally distributed.
  • a conductive portion having electrical conductivity by including electrically conductive particles and a conductive portion having thermal conductivity by including thermally conductive particles may be formed separately.
  • the conductive part having electrical conductivity and the conductive part having thermal conductivity may be disposed in the same adhesion planned region, and the conductive part having electrical conductivity and You may arrange
  • the said adhesive sheet was equipped with the release film only in the one surface (back surface) side of the conductive adhesive layer, the release film was provided in the other surface (front surface) side of the conductive adhesive layer. You may prepare.
  • the said adhesive sheet may be provided with the base material instead of a release film, and may be provided with both the release film and the base material. Further, the adhesive sheet may have a form without a release film or a substrate, and even the conductive adhesive layer alone functions as an adhesive sheet.
  • the adhesive sheet may be first laminated on a metal plate, and then the flexible printed wiring board may be adhered to the back surface of the conductive adhesive layer from which the release film has been peeled off.
  • the conductive portion may have a shape in which the width on the back side where the release sheet is laminated is small and the width on the front side is large. Furthermore, the conductive portion may be a laminate of a plurality of conductive portions in the thickness direction of the adhesive sheet.
  • the shape of the central longitudinal section perpendicular to the conductive adhesive layer of the conductive portion is not limited to a strict trapezoid, for example, a trapezoid in which the top of the trapezoid is an arc, or the base and the top are non-parallel. It may be trapezoidal. It is also possible to adopt semi-circular shapes other than trapezoids, triangles, rectangles, constricted shapes that decrease in width toward the central portion in the height direction, barrel shapes that increase in width toward the central portion in the height direction, etc. It is.
  • the conduction part may be singular.
  • an adhesive sheet having a single conductive portion such as the adhesive sheet 41 shown in FIG. 5A or FIG. 5B, may be used.
  • the conductive portion 5 is exposed only on the front surface side, and the adhesive layer 36 is filled between the conductive portion 5 and the release film 2 (the back surface side of the conductive portion 5).
  • the adhesive sheet 31 provided with the conductive adhesive layer 33 may be used.
  • the conductive portion only needs to be able to be connected to both conductors of the adherend member when the adhesive sheet is bonded to the adherend member, and does not necessarily need to be close to or exposed to the front or back surface of the conductive adhesive layer. That is, in the conductive adhesive layer of the adhesive sheet, the conductive portion may be formed so as not to appear on one or both of the front surface side and the back surface side. In this way, even if there is an adhesive layer on the front or back surface of the conductive portion, the surface of the conductive portion is caused by the pressure contact force when the conductive adhesive layer is bonded to a member to be bonded (flexible printed wiring board, metal plate, etc.). Or the adhesive on the back surface is pushed out, and the conductive portion can be brought into contact with a member to be bonded (such as a conductive pattern of a flexible printed wiring board or a metal plate).
  • the marking for positioning may be a notch or protrusion, a mark printed on a release film, or the like in addition to the through hole.
  • the adhesive sheet can be used for adhesion between members that require electrical conductivity (conductivity) or between members that require thermal conductivity. It can be suitably used for adhesion and the like.
  • the adhesive sheet of the present invention can be suitably used for bonding, for example, a flexible printed wiring board and a metal plate.

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)

Abstract

L'invention porte sur une feuille adhésive dotée d'une couche adhésive conductrice, pour la réalisation d'une conductivité électrique ou d'une conductivité thermique dans au moins une direction d'épaisseur, la couche adhésive conductrice ayant une partie de conduction continue dans la direction de l'épaisseur et une couche d'agent adhésif garnissant une périphérie de la partie de conduction.
PCT/JP2014/054425 2013-03-05 2014-02-25 Feuille adhésive et procédé pour la fabrication de feuille adhésive WO2014136606A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201480011587.4A CN105008475B (zh) 2013-03-05 2014-02-25 粘接片及粘接片的制造方法

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2013043568A JP2014175323A (ja) 2013-03-05 2013-03-05 接着シート及びその製造方法
JP2013043569A JP6088292B2 (ja) 2013-03-05 2013-03-05 接着シート及びその製造方法
JP2013-043569 2013-03-05
JP2013-043568 2013-03-05
JP2013140215A JP6320694B2 (ja) 2013-07-03 2013-07-03 電気部品及びその製造方法
JP2013-140215 2013-07-03
JP2013273256A JP6377905B2 (ja) 2013-12-27 2013-12-27 接着シート及び接着シートの製造方法
JP2013-273256 2013-12-27

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019055354A1 (fr) 2017-09-15 2019-03-21 Technetics Group Llc Matériaux de liaison présentant des caractéristiques améliorées de résistance au plasma et procédés associés
WO2021259599A1 (fr) * 2020-06-23 2021-12-30 Tesa Se Bande adhésive conductrice double-face sensible à la pression

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101743022B1 (ko) * 2016-10-31 2017-06-02 신화인터텍 주식회사 방열 시트 및 그 제조 방법
JP6901896B2 (ja) * 2017-03-31 2021-07-14 日立造船株式会社 フィラー・樹脂複合体、フィラー・樹脂複合体の製造方法、フィラー・樹脂複合層、および、フィラー・樹脂複合体の使用方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144970A (en) * 1978-05-01 1979-11-12 Nitto Electric Ind Co Adhesive tape for electric circuit components
JPS6452247U (fr) * 1987-09-26 1989-03-31
JPH1121522A (ja) * 1997-07-03 1999-01-26 Nitto Denko Corp 熱伝導性接着テ−プ及びその製造方法
JP2004002840A (ja) * 2002-04-24 2004-01-08 Kamite:Kk 粘着シートおよびその製造方法、並びに該粘着シートを利用する接着方法と該接着方法に使用する冶具
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板
JP2009218443A (ja) * 2008-03-11 2009-09-24 Sumitomo Electric Ind Ltd 金属補強板を備えたフレキシブルプリント配線板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100774440B1 (ko) * 2007-01-17 2007-11-08 조인셋 주식회사 전도성 점착테이프

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54144970A (en) * 1978-05-01 1979-11-12 Nitto Electric Ind Co Adhesive tape for electric circuit components
JPS6452247U (fr) * 1987-09-26 1989-03-31
JPH1121522A (ja) * 1997-07-03 1999-01-26 Nitto Denko Corp 熱伝導性接着テ−プ及びその製造方法
JP2004002840A (ja) * 2002-04-24 2004-01-08 Kamite:Kk 粘着シートおよびその製造方法、並びに該粘着シートを利用する接着方法と該接着方法に使用する冶具
JP2006298954A (ja) * 2005-04-15 2006-11-02 Tatsuta System Electronics Kk 導電性接着シート及び回路基板
JP2009218443A (ja) * 2008-03-11 2009-09-24 Sumitomo Electric Ind Ltd 金属補強板を備えたフレキシブルプリント配線板

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019055354A1 (fr) 2017-09-15 2019-03-21 Technetics Group Llc Matériaux de liaison présentant des caractéristiques améliorées de résistance au plasma et procédés associés
EP3682469A1 (fr) * 2017-09-15 2020-07-22 Technetics Group LLC Matériaux de liaison présentant des caractéristiques améliorées de résistance au plasma et procédés associés
EP3682469A4 (fr) * 2017-09-15 2021-05-19 Technetics Group LLC Matériaux de liaison présentant des caractéristiques améliorées de résistance au plasma et procédés associés
WO2021259599A1 (fr) * 2020-06-23 2021-12-30 Tesa Se Bande adhésive conductrice double-face sensible à la pression

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