WO2014104204A1 - 冷却装置 - Google Patents
冷却装置 Download PDFInfo
- Publication number
- WO2014104204A1 WO2014104204A1 PCT/JP2013/084918 JP2013084918W WO2014104204A1 WO 2014104204 A1 WO2014104204 A1 WO 2014104204A1 JP 2013084918 W JP2013084918 W JP 2013084918W WO 2014104204 A1 WO2014104204 A1 WO 2014104204A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- heat
- heat pipe
- shaped
- receiving block
- cooling device
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D2015/0216—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes having particular orientation, e.g. slanted, or being orientation-independent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the present invention relates to a cooling device that cools a heating element, and more particularly, to a cooling device that cools an electronic component such as a power conversion device mounted on a moving body such as a railway vehicle, an aircraft, or a ship by air cooling.
- a moving body such as a railway vehicle includes a power control device including a power device such as an IGBT and other electronic components in a power control housing in order to control a drive motor and the like. Since these electronic components generate heat due to heat loss, a cooling device is provided on the heating element so as to efficiently cool the attached electrical components using forced air cooling or wind generated by vehicle movement.
- a power control device including a power device such as an IGBT and other electronic components in a power control housing in order to control a drive motor and the like. Since these electronic components generate heat due to heat loss, a cooling device is provided on the heating element so as to efficiently cool the attached electrical components using forced air cooling or wind generated by vehicle movement.
- FIG. 12 An example of a conventional cooling device is shown in FIG.
- the cooling device shown in FIG. 12 includes a heat receiving block 2, heat pipes 3, and fins 4, and is configured by horizontally arranging U-shaped heat pipes in the traveling direction (wind flow direction) when cooling using traveling wind. It is a thing. Further, as a configuration different from that of FIG. 13, a cooling device in which L-shaped heat pipes are arranged vertically in the traveling direction has been proposed (see FIG. 8 of Patent Document 1).
- the present invention has been proposed in order to solve the above-described problems of the prior art, and its purpose is to keep the ventilation resistance small and to secure a sufficient contact area between the fin and the heat pipe to cool the air.
- the object is to provide a cooling device with improved performance and vibration resistance.
- the present invention includes a heat receiving block that is thermally connected to a heating element, and a heat pipe group that is erected on the surface of the heat receiving block and receives heat from the heat receiving block and transports heat.
- a plurality of fins provided in the heat pipe group, and the heat pipe constituting the heat pipe group is a U-shaped heat pipe having a bent bottom portion and a straight straight portion, and the U The U-shaped surface of the letter-shaped heat pipe is erected on the heat receiving block in a direction perpendicular to the incident wind direction, and the adjacent heat pipes are arranged so as to overlap with the wind direction, When the mounting surface of the heat pipe group in the heat receiving block is made vertical, all the straight portions are inclined upward and are provided.
- the U-shaped surface of the heat pipe formed in a U-shape is arranged perpendicular to the wind flow direction with respect to the heat receiving block, and further, the adjacent heat pipe is in the wind direction direction.
- the ventilation resistance it is possible to reduce the ventilation resistance. That is, in the past, the U-shaped surface of the U-shaped heat pipe was arranged parallel to the wind flow direction, but when the number of heat pipes was increased, the heat pipes were concentrated on the heat receiving block, and the ventilation resistance was increased. It was. In this respect, in this aspect, the distance between the two straight portions formed in the U-shaped heat pipe is ensured, so even if the number of heat pipes is increased, the passage of the wind is secured and the ventilation resistance is suppressed. Is possible.
- the contact area between the fin and the heat pipe can be sufficiently secured, so that the fin efficiency can be increased, and the number of joints between the fin and the heat pipe is increased. Will also improve.
- the heat pipe group further includes an L-shaped heat pipe having a bottom portion having a bent portion and a straight straight portion, and the U-shaped heat pipe.
- the U-shaped heat pipe and the L-shaped heat pipe are erected on the heat receiving block alternately with the U-shaped surface of the L-shaped heat pipe and the L-shaped surface of the L-shaped heat pipe being perpendicular to the incident wind direction.
- the straight portions of the U-shaped heat pipe and the L-shaped heat pipe are both inclined upward. It is characterized by being provided.
- the air path resistance can be adjusted by combining the L-shaped heat pipe while using the arrangement of the U-shaped heat pipe as a base.
- the cooling efficiency can be further improved.
- by combining the L-shaped heat pipe on the downstream side where the cooling efficiency is relatively low due to the decrease in the wind speed it is possible to contribute to equalization of the cooling efficiency in the upstream and downstream.
- a plurality of the heat pipes are thermally disposed along the wind direction on the bottom portion of the heat pipe group erected on the heat receiving block. It is characterized in that a heat equalizing member connected to is provided.
- the heat equalizing member by further stacking the heat equalizing member on the bottom of the heat pipe group, it is possible to further equalize the heat in the wind direction.
- the soaking member is a soaking heat pipe, the effect of soaking in the wind direction is further enhanced.
- the cooling device 1 As shown in FIG. 1, the cooling device 1 according to the first embodiment of the present invention is erected on the surface of the heat receiving block 2 and the heat receiving block 2 that is thermally connected to the electronic components that constitute the heating element.
- the heat pipe 3 that receives heat from the heat receiving block 2 and transports heat and the plurality of fins 4 provided on the heat pipe 3 are provided.
- a plurality of heat pipes 3 are erected on the heat receiving block 2 to form a heat pipe group.
- the heat receiving block 2 is formed of a rectangular aluminum block, and as shown by a broken line in the drawing, a plurality of electronic components (here, six) serving as heating elements are provided on the back side. )
- a mounting location H for mounting is provided.
- eight circles provided along a broken-line frame indicate attachment holes for electronic components.
- the heat pipe 3 is placed on the surface side of the heat receiving block 2 in the wind direction F indicated by the arrows in FIGS. 2 and 8.
- Each two-row heat pipe group is provided in a parallel direction, and in principle, fins 4 are provided in each of the two rows of heat pipe groups.
- the wind direction F may be a wind direction opposite to the arrow. The same applies to the following description.
- the heat pipe 3 is a U-shape having a bent bottom portion 31 and a straight straight portion 32 as shown in the left and right side views of FIGS. 6 and 7. Further, as shown in FIG. 8, the heat pipe 3 is erected on the heat receiving block 2 with a U-shaped U-shaped surface arranged in a direction perpendicular to the wind direction F indicated by an arrow in the drawing. Furthermore, the heat pipes 3 are arranged so as to overlap with each other between the adjacent pipes in the direction of the wind direction.
- the upward inclination angle is about 7 to 10 degrees with respect to the horizontal plane.
- This is an angle designed to be larger than a cant (tilt angle) provided on a track such as a railway vehicle to which the cooling device 1 of the present embodiment is installed.
- tilt angle tilt angle
- the heat receiving side of the heat pipe 3 becomes higher than the heat radiating side, so that the top heat state is prevented.
- the angle is set as described above.
- the fins 4 are provided in each of the two rows of the heat pipe group, and in each row, as shown in FIGS. 4 and 5, a predetermined pitch is provided. Are arranged in layers.
- Each fin 4 is provided with a plurality of burrings for press-fitting the heat pipe 3 at positions corresponding to the heat pipe 3.
- the fin 4 is pressure-fixed to the heat pipe 3 by press-fitting the heat pipe 3 in this burring.
- the fins 4 arranged in two rows have the same pitch and the number of press-fitted and fixed with respect to the two heat pipes 3.
- the straight portion 32 of the heat pipe 3 is formed with a predetermined inclination with respect to the horizontal direction, the three fins 4 are formed in a stepped manner from the end portion.
- the U-shaped surface of the heat pipe 3 formed in a U-shape is arranged perpendicular to the wind direction F with respect to the heat receiving block 2, and further, adjacent heat pipes Since 3 is arranged so as to overlap with the wind direction F, the ventilation resistance can be reduced. That is, as shown in FIG. 12, the U-shaped surface of the U-shaped heat pipe is conventionally arranged in parallel to the wind direction F, but when the number of heat pipes is increased, the heat pipes are concentrated on the heat receiving block, Ventilation resistance was increasing. In this respect, in the present embodiment, since the interval between the two straight portions 32 of the heat pipe 3 is ensured, even if the number of the heat pipes 3 is increased, the passage of the wind is ensured and the ventilation resistance can be suppressed. It is.
- the contact area between the fin 4 and the heat pipe 3 can be sufficiently secured by using the U-shaped heat pipe 3, it is possible to increase the fin efficiency, and at the same time, the number of joints between the fin 4 and the heat pipe 3 increases. Therefore, vibration resistance is also improved.
- the U-shaped heat pipe when the U-shaped heat pipe is installed with the U-shaped surface vertical, the working fluid accumulates in the bent portion located below, and there is a concern that the pipe swells particularly during freezing. 3 can be suppressed by using a wick having a high capillary force.
- a cooling device 20 according to a second embodiment of the present invention will be described with reference to FIG.
- the cooling device 20 of the present embodiment is an aspect in which an L-shaped heat pipe 5 is used as a part of the U-shaped heat pipe 3 in the heat pipe group formed in the cooling device 10 shown in the first embodiment. is there.
- the arrangement configuration on the plane of the heat pipe 3 and the heat pipe 5 forming the heat pipe group is the same.
- the heat receiving block 2 is erected with the U-shaped surface or the L-shaped surface of the heat pipe in a vertical direction. Further, the adjacent heat pipes 3 or 5 are arranged so as to overlap with the wind direction and form a heat pipe group.
- L-shaped heat pipes 5 are arranged in a row in the wind direction from the upper side in the figure, and U-shaped heat pipes 3 are arranged in a row in the same direction in the wind direction. Group combinations are repeated in the further lower row.
- the U-shaped heat pipe 3 and the L-shaped heat pipe 5 are combined to form the heat pipe group.
- the upstream side of the wind Combinations such as providing a U-shaped heat pipe 3 and providing an L-shaped heat pipe 5 on the downstream side are also possible. That is, as long as the U-shaped surface or L-shaped surface of the heat pipe is perpendicular to the incident wind direction F, and the adjacent heat pipe 3 or 5 is provided so as to overlap the wind direction F, the first The arrangement of the U-shaped heat pipe 3 shown in the embodiment can be used as a base, and the U-shaped heat pipe 3 in this configuration can be appropriately replaced with the L-shaped heat pipe 5 and used. .
- the L-shaped heat pipe 5 is combined and heated while using the arrangement of the U-shaped heat pipe 3 as a base.
- the pipe group By forming the pipe group, it is possible to adjust the air path resistance. As a result, the cooling efficiency can be further improved.
- the L-shaped heat pipe 5 by combining the L-shaped heat pipe 5 on the downstream side where the cooling efficiency is relatively low due to the decrease in the wind speed, it is possible to contribute to equalization of the cooling efficiency in the upstream and downstream.
- a cooling device 30 according to a third embodiment of the present invention will be described with reference to FIG.
- the cooling device 30 of the present embodiment is a mode aimed at further improving the cooling efficiency by adding a configuration to the U-shaped heat pipe 3 of the cooling device 10 shown in the first embodiment.
- the heat equalizing member 6 that thermally connects a plurality of heat pipes along the wind direction F to the bottom 31 where the heat pipe 3 is attached to the heat receiving block 2.
- a soaking heat pipe is provided.
- the soaking heat pipe a pipe that transports heat from the leeward side to the upwind side, a pipe that diffuses the heat of each heat pipe 3 in the longitudinal direction of the soaking heat pipe, or the like can be used.
- a soaking heat pipe is shown as the soaking member 6, but the soaking member 6 is not limited to this example.
- FIG. 10 shows a soaking heat pipe that transports heat from the leeward side to the upwind side, a pipe that diffuses the heat of each heat pipe 3 in the longitudinal direction of the soaking heat pipe, or the like.
- a soaking heat pipe is shown as the soaking member 6, but the soaking member 6 is not limited to this example.
- FIG. 10 as shown in FIG.
- the soaking member 6 may be a rod-shaped body 6 ⁇ / b> A made of a material having good thermal conductivity (for example, copper) or a plate-shaped body.
- the heat equalizing member 6 By making the heat equalizing member 6 a rod-shaped body 6A or a plate-shaped body having a good thermal conductivity, the heat of each heat pipe 3 can be diffused in the longitudinal direction of the heat equalizing member 6.
- two soaking members 6 are provided in each row in the entire range from upstream to downstream in the wind direction at the bottom of the heat pipes 3 forming the heat pipe group.
- the soaking member 6 is fixed to the heat pipe 3 by soldering or brazing.
- the arrangement range and the number of arrangement of the heat equalizing member 6 in the upstream and downstream direction of the wind can be appropriately changed in relation to the cooling efficiency.
- the heat equalizing member 6 is, of course, also in an embodiment using a combination of a U-shaped and an L-shaped heat pipe as the cooling device 20 shown in the second embodiment. It can be adopted.
- the heat equalizing member 6 by arranging the heat equalizing member 6 on the bottom of the heat pipe 3, further heat equalization in the wind direction becomes possible. This effect becomes significant when the material of the soaking member 6 is superior in thermal conductivity to the material of the heat receiving block 2. Furthermore, when the soaking member 6 is a soaking heat pipe, the effect of soaking in the wind direction is enhanced.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
本発明の第1の実施形態に係る冷却装置1は、図1に示すように、発熱体を構成する電子部品に熱的に接続される受熱ブロック2と、受熱ブロック2の表面に立設され、受熱ブロック2から受熱して熱輸送を行うヒートパイプ3と、ヒートパイプ3に設けられた複数のフィン4とを備える。ヒートパイプ3は、受熱ブロック2上に複数立設されることでヒートパイプ群を形成する。
本発明の第2の実施形態に係る冷却装置20について、図9を参照して説明する。本実施形態の冷却装置20は、第1の実施形態において示した冷却装置10に形成されたヒートパイプ群におけるU字型ヒートパイプ3の一部に、L字型ヒートパイプ5を用いた態様である。
本発明の第3の実施形態に係る冷却装置30について、図10を参照して説明する。本実施形態の冷却装置30は、第1の実施形態において示した冷却装置10のU字型ヒートパイプ3に構成を付加することにより、さらなる冷却効率の向上を狙った態様である。
2 受熱ブロック
21 長穴溝
3,5 ヒートパイプ
31 底部
32 ストレート部
4 フィン
6 均熱部材
H 電子部品
Claims (4)
- 発熱体に熱的に接続される受熱ブロックと、
前記受熱ブロックの表面に立設され、前記受熱ブロックから受熱して熱輸送を行うヒートパイプ群と、
前記ヒートパイプ群に設けられた複数のフィンと、を備え、
前記ヒートパイプ群を構成するヒートパイプは、屈曲する底部と直線状のストレート部とを有するU字型ヒートパイプであり、前記U字型ヒートパイプのU字面が、入射する風向き方向に対して垂直方向にして前記受熱ブロックに立設され、かつ、隣接する前記ヒートパイプが風向き方向に対して重畳して配置され、
さらに、前記受熱ブロックにおける前記ヒートパイプ群の取付面を重力方向に対して垂直にした場合に、前記ストレート部がいずれも上方に傾けて設けられていることを特徴とする冷却装置。 - 前記ヒートパイプ群は、屈曲する部分を備えた底部と直線状のストレート部とを有するL字型ヒートパイプをさらに備え、
前記U字型ヒートパイプのU字面と前記L字型ヒートパイプのL字面とが、入射する風向き方向に対して垂直方向にして、前記U字型ヒートパイプと前記L字型ヒートパイプとが交互に前記受熱ブロックに立設され、
かつ、前記受熱ブロックにおける前記ヒートパイプ群の取付面を重力方向に対して垂直にした場合に、前記U字型ヒートパイプ及び前記L字型ヒートパイプの前記ストレート部がいずれも上方に傾けて設けられていることを特徴とする請求項1記載の冷却装置。 - 前記受熱ブロック上に複数立設された前記ヒートパイプ群の前記底部に、前記風向き方向に沿って、複数のヒートパイプを熱的に接続する均熱部材を設けたことを特徴とする請求項1又は2記載の冷却装置。
- 前記均熱部材は均熱ヒートパイプであることを特徴とする、請求項3記載の冷却装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201390000853.4U CN204806945U (zh) | 2012-12-27 | 2013-12-26 | 冷却装置 |
BR112015014943A BR112015014943A2 (pt) | 2012-12-27 | 2013-12-26 | aparelho de resfriamento |
JP2014514257A JP5697063B2 (ja) | 2012-12-27 | 2013-12-26 | 冷却装置 |
EP13868439.4A EP2940415A4 (en) | 2012-12-27 | 2013-12-26 | COOLER |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012-285231 | 2012-12-27 | ||
JP2012285231 | 2012-12-27 |
Publications (1)
Publication Number | Publication Date |
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WO2014104204A1 true WO2014104204A1 (ja) | 2014-07-03 |
Family
ID=51021278
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2013/084918 WO2014104204A1 (ja) | 2012-12-27 | 2013-12-26 | 冷却装置 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2940415A4 (ja) |
JP (1) | JP5697063B2 (ja) |
CN (1) | CN204806945U (ja) |
BR (1) | BR112015014943A2 (ja) |
WO (1) | WO2014104204A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2965903B3 (fr) * | 2010-10-08 | 2012-10-26 | Astrium Sas | Systeme de transfert de chaleur |
KR20160139094A (ko) * | 2015-05-26 | 2016-12-07 | 엘에스산전 주식회사 | 히트파이프를 구비한 전력전자 기기용 밀폐형 외함 |
US9750160B2 (en) * | 2016-01-20 | 2017-08-29 | Raytheon Company | Multi-level oscillating heat pipe implementation in an electronic circuit card module |
EP4020757A1 (en) | 2020-12-22 | 2022-06-29 | Koninklijke Philips N.V. | Wireless power transfer |
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JPH09119785A (ja) * | 1995-10-26 | 1997-05-06 | Furukawa Electric Co Ltd:The | 移動体における筐体内の電気部品冷却装置 |
JPH10223814A (ja) | 1997-02-07 | 1998-08-21 | Hitachi Cable Ltd | 半導体素子冷却用ヒートパイプ式ヒートシンク |
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JP2012160669A (ja) * | 2011-02-02 | 2012-08-23 | Furukawa Electric Co Ltd:The | 電子部品冷却装置 |
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JP3367411B2 (ja) * | 1998-03-06 | 2003-01-14 | 株式会社日立製作所 | 電力変換装置 |
JP4929325B2 (ja) * | 2009-08-27 | 2012-05-09 | 株式会社日立製作所 | 電力変換装置 |
JP5466073B2 (ja) * | 2010-04-23 | 2014-04-09 | 株式会社日立製作所 | 電力変換装置および鉄道車両 |
JP5581119B2 (ja) * | 2010-06-07 | 2014-08-27 | 株式会社日立製作所 | 冷却装置,電力変換装置,鉄道車両 |
-
2013
- 2013-12-26 EP EP13868439.4A patent/EP2940415A4/en not_active Withdrawn
- 2013-12-26 WO PCT/JP2013/084918 patent/WO2014104204A1/ja active Application Filing
- 2013-12-26 JP JP2014514257A patent/JP5697063B2/ja active Active
- 2013-12-26 BR BR112015014943A patent/BR112015014943A2/pt not_active IP Right Cessation
- 2013-12-26 CN CN201390000853.4U patent/CN204806945U/zh not_active Expired - Lifetime
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09119785A (ja) * | 1995-10-26 | 1997-05-06 | Furukawa Electric Co Ltd:The | 移動体における筐体内の電気部品冷却装置 |
JPH10223814A (ja) | 1997-02-07 | 1998-08-21 | Hitachi Cable Ltd | 半導体素子冷却用ヒートパイプ式ヒートシンク |
JP2000161880A (ja) * | 1998-11-26 | 2000-06-16 | Toshiba Corp | ヒートパイプ式冷却器 |
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EP2940415A4 (en) | 2016-11-02 |
BR112015014943A2 (pt) | 2017-07-11 |
CN204806945U (zh) | 2015-11-25 |
JPWO2014104204A1 (ja) | 2017-01-19 |
EP2940415A1 (en) | 2015-11-04 |
JP5697063B2 (ja) | 2015-04-08 |
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