WO2014097879A1 - 成膜装置 - Google Patents

成膜装置 Download PDF

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Publication number
WO2014097879A1
WO2014097879A1 PCT/JP2013/082428 JP2013082428W WO2014097879A1 WO 2014097879 A1 WO2014097879 A1 WO 2014097879A1 JP 2013082428 W JP2013082428 W JP 2013082428W WO 2014097879 A1 WO2014097879 A1 WO 2014097879A1
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WO
WIPO (PCT)
Prior art keywords
substrate
film forming
vacuum chamber
guide
forming apparatus
Prior art date
Application number
PCT/JP2013/082428
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
博之 田村
正直 藤塚
悌二 ▲高▼橋
孝史 澁谷
信朗 塩入
高橋　賢
内田　敬自
Original Assignee
キヤノントッキ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by キヤノントッキ株式会社 filed Critical キヤノントッキ株式会社
Priority to KR1020157017934A priority Critical patent/KR101968801B1/ko
Publication of WO2014097879A1 publication Critical patent/WO2014097879A1/ja

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates

Definitions

  • the present invention relates to a film forming apparatus.
  • organic EL display devices using organic electroluminescence elements have attracted attention as display devices that replace CRTs and LCDs.
  • This organic EL display device has a structure in which an electrode layer and a plurality of organic light emitting layers are laminated on a substrate, and a sealing layer is further formed on the substrate. It is self-luminous, has excellent high-speed response compared to LCD, and has a high field of view. Corners and high contrast can be realized.
  • Such an organic EL device is generally manufactured by a vacuum vapor deposition method, in which a substrate and a vapor deposition mask are aligned and closely adhered in a vacuum chamber, and a vapor deposition film having a desired film formation pattern is formed by the vapor deposition mask. It is formed on the substrate.
  • film formation on a flexible substrate using a sheet-like plastic film is performed by continuously feeding the flexible substrate by a roll-to-roll method. There is also a way to do it.
  • Patent Document 1 proposes a film forming apparatus for forming a film of vapor deposition material ejected from a vapor deposition source disposed below while conveying a film formation substrate.
  • the deposition source is supported on the bottom surface of the vacuum container and the substrate transport roller is supported on the side surface of the vacuum container, the load between the substrate transport mechanism is driven and the substrate and the deposition source are set in the atmosphere. Since the film thickness distribution is deteriorated due to the positional relationship being shifted, the deflection of the vacuum vessel after evacuation must be suppressed by the above-described method, and the weight of the vacuum vessel becomes significant.
  • Patent Document 2 proposes a vacuum vapor deposition apparatus that can perform a stable scan operation of the evaporation source without depending on the pressure state inside the vacuum chamber, but the support position of the substrate and the mask is not specified. It is unclear if the positional relationship between the substrate, mask and evaporation source after vacuum chamber exhaustion is maintained, and the positional accuracy of the evaporation source including the substrate and mask is strictly required. Scanning with the substrate and mask separated In the method of forming a film, it is difficult to form a desired film formation pattern at a desired position.
  • An object of the present invention is to provide a film forming apparatus that can maintain a good positional relationship between the two without affecting the positional relationship, and that can form a film with low cost, light weight, and high accuracy.
  • a transport mechanism for transporting the substrate 2 or the film forming source 1 is provided.
  • the transport mechanism includes a moving unit 4 and a guide unit 5 that guides the movement of the moving unit 4.
  • the guide unit 5 is provided outside the vacuum chamber 3 and provided on the wall surface of the vacuum chamber 3.
  • the film forming source 1 is supported by a base column 10 provided outside the vacuum chamber 3 and penetrating through a through hole 9 provided in the wall surface of the vacuum chamber 3.
  • the holding part for holding the substrate 2 is configured to be held by a base part 11 that is provided outside the vacuum chamber 3 and supported by a base column 10 that penetrates a through hole 9 provided in a wall surface of the vacuum chamber 3.
  • the base strut 10 or an installation portion of the base strut 10 and a wall surface around the through hole 9 are connected in an airtight state via an elastic member 12, and the transport mechanism and the film forming source 1 or the substrate 2 are connected to each other.
  • the present invention relates to a film forming apparatus characterized in that the positional relationship between the film forming source 1 and the substrate 2 is maintained without being affected by the deformation of the wall surface due to the decompression of the vacuum chamber 3.
  • the substrate 2 or a transport mechanism for transporting the film forming source 1 includes a moving unit 4 and a guide unit 5 that guides the movement of the moving unit 4.
  • the guide column 7 is provided outside and is supported by a guide column 7 that penetrates the through hole 6 provided on the wall surface of the vacuum chamber 3.
  • the guide column 7 or the installation portion of the guide column 7 and the wall surface around the through hole 6 When the substrate 2 is transported by the transport mechanism, the film forming source 1 is provided outside the vacuum chamber 3 and provided on the wall surface of the vacuum chamber 3.
  • a holding unit for holding the substrate 2 is supported by a base column 10 provided outside the vacuum chamber 3 and penetrating through a through hole 9 provided in the wall surface of the vacuum chamber 3.
  • the base column 11 or the base column 10 installation portion and the wall surface around the through-hole 9 are connected in an airtight state via the expansion / contraction member 12, and the transport mechanism and The film forming source 1 or the substrate 2 is configured so that the positional relationship between the film forming source 1 and the substrate 2 is maintained without being affected by the deformation of the wall surface due to the decompression of the vacuum chamber 3.
  • This relates to a film forming apparatus.
  • the guide unit 5 that guides the movement of the moving unit 4 on which the substrate 2 of the transport mechanism is held is supported by the guide column 7, and the base unit 11 that holds the film forming source 1.
  • the guide unit 5 that guides the movement of the moving unit 4 on which the substrate 2 of the transport mechanism is held is supported by the guide column 7, and the base unit 11 that holds the film forming source 1.
  • the substrate 2 and the vapor deposition mask 20 are arranged in a separated state, and the substrate 2 is configured to be relatively movable with respect to the vapor deposition mask 20, so that the relative movement makes it wider than the vapor deposition mask 20.
  • the guide column 7 or the base column 10 is erected on a mount 13 installed outside the bottom of the vacuum chamber 3, and the through-hole 6 or the base column 10 through which the guide column 7 penetrates penetrates.
  • the film forming apparatus according to claim 1, wherein a linear motor that moves the moving unit 4 is provided in the transport mechanism.
  • the moving unit 4 communicates the storage unit 14 filled with the atmosphere in the vacuum chamber 3 with the storage unit 14 and the atmospheric pressure space outside the vacuum chamber 3 to provide power supply wiring and cooling.
  • substrate 2 are provided.
  • the present invention relates to the film forming apparatus described in item 1.
  • the substrate alignment mechanism includes a substrate moving means 29 that is disposed in the housing portion 14 and moves the suction portion 16; A reference mark display unit 17 arranged in parallel to the guide unit 5 and provided with a reference mark, an image pickup means for picking up an image of the reference mark and the substrate mark provided on the substrate 2, and based on the image pickup result 9.
  • the film forming apparatus further comprising: an operating unit that operates the substrate moving unit 29; and an imaging unit accommodating unit that accommodates the imaging unit.
  • the imaging means and the reference mark display unit 17 are disposed on either the guide unit 5 or the guide column 7 and are mechanically independent of the vacuum chamber 3.
  • the film forming apparatus is characterized in that:
  • the film forming apparatus according to claim 1, further comprising a film forming source alignment mechanism 19 that aligns the film forming source 1 with respect to the substrate 2. It is.
  • the film forming apparatus according to claim 1, wherein the film forming material is an organic material.
  • the present invention is configured as described above, even when the size of the vacuum chamber is increased with an increase in the size of the substrate, the deformation of the wall surface due to the pressure variation in the vacuum chamber affects the positional relationship between the substrate and the film forming source. Therefore, the positional relationship between the two can be satisfactorily maintained, and a film forming apparatus capable of highly accurate film formation at low cost and light weight can be obtained.
  • the organic layer can be deposited with high accuracy, and a film forming apparatus for manufacturing an organic EL device capable of realizing highly accurate deposition.
  • the film forming apparatus can be continuously operated without increasing the temperature of the substrate.
  • the substrate can be aligned in parallel with the guide, it is possible to prevent the deposition pattern width from becoming larger than the desired film formation pattern width when the substrate is transported.
  • the vacuum chamber is deformed by evacuation, There is no effect on the alignment of the substrate.
  • the film forming source can be sequentially aligned with the substrate with high accuracy, and a desired film forming pattern can be formed at a desired position over the entire surface of the substrate.
  • the film forming material emitted from the film forming source 1 is deposited on the substrate 2 through the mask opening of the vapor deposition mask 20, for example, and a thin film having a film formation pattern defined by the vapor deposition mask 20 is formed on the substrate 2. Is done. At this time, for example, the substrate 2 and the vapor deposition mask 20 are disposed in a separated state, and the substrate 2 is configured to be relatively movable while maintaining the separated state from the vapor deposition mask 20. By doing so, a thin film having a film formation pattern defined by the vapor deposition mask 20 can be formed on the substrate 2 in a wider range than the vapor deposition mask itself.
  • both the transport mechanism for transporting the substrate 2 and the film forming source 1 (or the transport mechanism for transporting the film forming source 1 and the substrate 2) are provided by the columns 7 and 10 provided outside the vacuum chamber 3.
  • the positional relationship between the substrate 2, the vapor deposition mask 20 and the film forming source 1 is adjusted in the atmospheric pressure space, and the wall of the vacuum chamber 3 is caused by pressure fluctuations caused by the vacuum state in the vacuum chamber 3 being a film forming environment.
  • the transport mechanism and the film forming source 1 are not supported by the wall surface of the vacuum chamber 3 but are supported by columns provided outside the vacuum chamber 3, for example, columns 7 and 10 erected on a highly rigid base 13. Therefore, the transport mechanism and the film formation source 1 are not affected by the deformation of the wall surface of the vacuum chamber 3, and therefore, the substrate 2 and the film formation source 1 are arranged in a direction orthogonal to the film formation surface of the substrate 2. The interval does not change due to the deformation, and the positional relationship between the substrate 2 and the film forming source 1 can be maintained.
  • the present invention in order to prevent the deformation of the wall surface of the vacuum chamber 3, it is not necessary to thicken the wall surface or provide a large number of ribs, that is, without increasing the size and weight of the vacuum chamber 3. It becomes possible to prevent the positional relationship between the substrate 2 and the film forming source 1 from being changed due to the deformation of the wall surface of the vacuum chamber 3 due to the reduced pressure.
  • the moving unit 4 communicates the storage unit 14 filled with the atmosphere in the vacuum chamber 3 with the storage unit 14 and the atmospheric pressure space outside the vacuum chamber 3,
  • a joint portion 15 formed with a hollow introduction portion for introducing a cooling pipe into the housing portion 14 and an adsorption portion 16 that adsorbs the substrate 2, substrate alignment, a power supply mechanism, cooling It is possible to provide a highly functional moving unit 4 including a mechanism and a substrate attaching / detaching mechanism.
  • the substrate 2 adsorbed on the adsorption unit 16 must be aligned in parallel with the guide unit 5, for example, a reference mark display unit positioned in parallel with the guide unit 5.
  • the imaging means is accommodated in the imaging means accommodating portion 18 which is an atmospheric pressure space, and is photographed through a window provided on the wall portion of the imaging means accommodating portion 18.
  • the imaging means accommodating portion 18 and the reference mark display portion 17 are disposed in either one of the guide portion 5 or the guide support column 7, for example, so that they are not affected by the deformation of the vacuum chamber 3 and are in the atmosphere.
  • the positions of the imaging means and the reference mark display unit 17 adjusted in (1) are not changed even in a vacuum.
  • a deposition material for example, an organic material for manufacturing an organic EL device
  • vaporized from the deposition source 1 is deposited on the substrate 2 through the mask opening of the deposition mask 20, and this deposition mask is used.
  • the thin film having the film formation pattern defined by 20 is formed on the substrate 2, the substrate 2 and the vapor deposition mask 20 are disposed in a separated state, and the substrate 2 is separated from the vapor deposition mask 20.
  • a film forming apparatus configured to be relatively movable while being held, and to form a thin film having a film formation pattern defined by the vapor deposition mask 20 on the substrate 2 in a range wider than the vapor deposition mask 20 by this relative movement. It solves the problem.
  • the substrate 2 of the transport mechanism is held as shown in FIG.
  • the guide unit 5 that guides the movement of the moving unit 4 and the base unit 11 that holds the film forming source 1 are supported by the guide column 7 and the base column 10 provided outside the vacuum chamber 3, respectively.
  • the wall surface of the vacuum chamber 3 is caused by pressure fluctuations caused by the vacuum state in the vacuum chamber 3 being a film formation environment.
  • the substrate can be transported with high accuracy without changing the positional relationship between the substrate 2 and the film forming source 1 even if the substrate is deformed.
  • the guide portion 5 includes a guide block 22 provided on the lower surface side of the moving portion 4, a linear guide including a guide rail 23 on which the guide block 22 is fitted, and the guide rail 23. It is comprised with a pair of guide base 24 by which this is arrange
  • a gantry 13 composed of a high-rigidity member such as a steel material in which the guide column 7 that supports the guide base 24 is installed on the floor surface outside the bottom of the vacuum chamber 3. Is provided so as to penetrate the through hole 6 provided in the bottom surface of the vacuum chamber 3.
  • the guide column 7 and the wall surface around the through-hole 6 are connected in an airtight state by an elastic member 8 (bellows 8) provided so as to cover the guide column 7.
  • an elastic member 8 (bellows 8) provided so as to cover the guide column 7.
  • the lower surface of the large-diameter portion 7 a of the guide column 7 and the wall surface around the through-hole 6 facing this are connected by a bellows 8 in an airtight state.
  • the deformation of the bellows 8 absorbs the deformation, so that the positions of the guide column 7 and the guide base 24 do not change, and the height It becomes possible to transport the substrate 2 with high accuracy.
  • the film forming source 1 includes a host material generation source 1 a and a dopant material generation source 1 b, and a base portion 11 (base plate 11) on which a mask frame 21 provided with a vapor deposition mask 20 is disposed. It is supported.
  • the base column 10 that supports the base plate 11 is erected on the film forming source alignment mechanism 19 on the frame 13 installed on the floor surface outside the bottom of the vacuum chamber 3, and penetrates through the bottom surface of the vacuum chamber 3. It is provided so as to penetrate the hole 9.
  • the base column 10 and the wall surface around the through hole 9 are connected in an airtight state by using an elastic member 12 (bellows 12) provided so as to cover the base column 10.
  • an elastic member 12 (bellows 12) provided so as to cover the base column 10.
  • the upper surface of the large-diameter portion 10a of the base column 10 and the wall surface around the through-hole 9 facing this are connected by a bellows 12 in an airtight state.
  • the deformation of the bellows 12 absorbs the deformation, so that the positions of the base column 10 and the base plate 11 do not change, and the transport is performed. It is possible to sequentially align the film forming source 1 and the mask frame 21 provided with the vapor deposition mask 20 with respect to the substrate 2 with high accuracy.
  • the frame 13 that supports the transport mechanism and the film forming source 1 also supports the vacuum chamber 3 at the same time.
  • the vacuum chamber 3 and the mount 13 are connected by a spherical bearing 25 capable of receiving a radial load and an axial load in both directions. It is made not to come out to the said mount 13.
  • a linear motor is used as the drive source for the transport mechanism. Accordingly, the transport mechanism has high positioning accuracy, constant speed stability, cleanliness, and maintainability, and the stroke required for transporting the large substrate 2 can be lengthened without restriction. Furthermore, when the rotational power of the drive motor provided outside the vacuum chamber 3 is transmitted to the ball screw in the vacuum chamber 3 via the magnetic fluid seal and rotated, the inside of the vacuum chamber 3 is connected to the outside, Although the outer wall of the vacuum chamber 3 is affected by the deformation, the linear motor can be structured such that the drive source is disposed inside the vacuum chamber 3 and is not affected by the deformation of the outer wall of the vacuum chamber 3.
  • the moving unit 4 that holds the substrate 2 and moves together with the substrate 2 moves along the linear guide disposed on the guide base 24 as shown in FIGS. Thrust is generated between the plurality of magnets 27 disposed on the plate 26 attached to the inner surface side and the coil unit 28 attached to the moving unit 4 side.
  • the moving unit 4 communicates the storage unit 14 that is an atmospheric pressure space in the vacuum chamber 3 with the storage unit 14 and the atmospheric pressure space outside the vacuum chamber 3.
  • a joint portion 15 formed with a hollow introduction portion for introducing a supply wiring and a cooling pipe into the housing portion 14 and an adsorption portion 16 for adsorbing and holding the substrate 2 are provided.
  • the attracting unit 16 is configured such that a plurality of electrostatic chucks 31 are arranged on a flatly formed stage base 30, and the substrate 2 is attracted to the surface of the electrostatic chuck 31. Further, a support column 32 that supports the stage base 30 through the through hole 34 on the bottom surface of the accommodating portion 14 is provided. Further, the stage base 30 and the wall surface around the through hole 34 of the accommodating portion 14 are connected in an airtight state by an elastic member 33 (bellows 33) provided so as to cover the support column 32, and the atmosphere and vacuum are in an airtight state. I try to keep it. Note that the support 32 and the wall surface around the through hole 34 may be connected by a bellows 33.
  • the substrate alignment mechanism since the substrate alignment mechanism has a servo motor and cannot be disposed in a vacuum environment, it is usually disposed under atmospheric pressure outside the vacuum chamber 3 (in the case of deposition down, the upper surface of the vacuum chamber 3). The rigidity is increased so that the deformation effect of the vacuum chamber 3 does not affect the alignment accuracy.
  • the substrate moving means 29 for moving the column base 32 of the substrate alignment mechanism to move the stage base 30 in the accommodating portion 14 the deformation effect of the vacuum chamber 3 affects the substrate alignment accuracy. Therefore, it is not necessary to make the vacuum chamber 3 highly rigid, and the weight can be reduced.
  • the accommodating portion 14 needs to have a highly rigid structure so that the deformation due to the pressure difference between the atmosphere and the vacuum does not affect the substrate alignment mechanism, but the volume is smaller than that of the vacuum chamber 3, for example, aluminum or the like. Since it can be manufactured with a lightweight member, the entire apparatus is lightweight and low in cost, and can have a highly rigid structure without causing an increase in size and weight.
  • the power supply to the motor for the substrate alignment mechanism in the accommodating portion 14, the coil unit of the linear motor and the electrostatic chuck 31 is performed by wiring from the power source in the atmospheric space outside the vacuum chamber 3 to the hollow introduction portion of the joint portion 15. Is going through.
  • the joint portion 15 uses a link mechanism having a hollow structure that follows the movement of the accommodating portion 14, and this hollow portion is used as a hollow introduction portion.
  • air or water cooling piping from the atmospheric space outside the vacuum chamber 3 is arranged through the hollow introduction portion of the joint portion 15 in the motor, coil unit, and stage base 30 that need cooling.
  • the joint portion 15 connects the outer wall of the vacuum chamber 3 and the housing portion 14, and if the vacuum chamber 3 is bent by evacuation, the driving operation and airtightness of the joint portion 15 are affected. 14 is also loaded, and the high-accuracy conveyance of the substrate 2 is also affected. Therefore, an expansion / contraction member 35 (bellows 35) is disposed between the vacuum chamber 3 and the joint portion 15 to influence the deformation of the vacuum chamber 3. Has eased. Specifically, the wall surface around the through hole 36 of the vacuum chamber 3 and one end of the joint portion 15 are connected in an airtight state by the bellows 35. A bellows 35 may be disposed between the other end of the joint portion 15 and the accommodating portion 14.
  • the linear pattern formed while the substrate 2 and the vapor deposition mask 20 are moved relative to each other is at a desired position on the substrate 2. Therefore, the substrate 2 after suction must be aligned with the linear guide.
  • a substrate alignment mechanism for aligning the substrate 2 with the guide portion 5 is provided.
  • a reference mark is provided on a substrate moving means 29 that is arranged in the accommodating portion 14 and moves the suction portion 16 and a transparent portion 39 that is arranged in parallel to the guide portion 5.
  • the reference mark display unit 17 positioned in parallel with the linear guide are arranged in the transport direction of the substrate 2, for example, a CCD camera 37 or the like.
  • the reference mark and the substrate mark formed on the substrate 2 are photographed by the imaging means.
  • the image pickup means since the image pickup means cannot be directly arranged in a vacuum, the image pickup means is accommodated in the image pickup means accommodating portion 18 which is an atmospheric pressure space, and an image is taken through the window 38 of the image pickup means accommodating portion 18.
  • the linear guide By moving the suction portion 16 by the substrate moving means 29 and performing alignment so that the substrate mark of the sucked substrate 2 is in a predetermined positional relationship with the reference mark, the linear guide is not tilted. It is conveyed in parallel to.
  • the imaging means accommodating portion 18 and the reference mark display portion 17 are disposed on at least one of the guide base 24 or the guide column 7 so that they are mechanically independent from the vacuum chamber 3 and can be deformed.
  • the guide base 24 is arranged.
  • the case where the substrate 2 is transferred by the transfer mechanism has been described. However, the same applies to the case where the film formation source 1 is transferred by the transfer mechanism. In this embodiment, the case where the vapor deposition mask 20 is used has been described, but the same applies to the case where the vapor deposition mask is not used.
  • the columns 7 and 10 are erected on the gantry 13, but if the rigidity can be secured, the columns 13 are not provided and the columns directly on the floor surface where the film forming apparatus is installed. 7 and 10 may be provided.
  • the substrate 2 is not limited to the glass substrate 2, and it is possible to form a film with high accuracy in the same manner when the flexible substrate 2 (for example, a sheet-like plastic film) is fed. .
  • the present embodiment is not limited to vacuum vapor deposition, but can be widely applied to a CVD or sputtering apparatus having a vacuum chamber 3.

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)
PCT/JP2013/082428 2012-12-18 2013-12-03 成膜装置 WO2014097879A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020157017934A KR101968801B1 (ko) 2012-12-18 2013-12-03 성막 장치

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012275613A JP6008731B2 (ja) 2012-12-18 2012-12-18 成膜装置
JP2012-275613 2012-12-18

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WO2014097879A1 true WO2014097879A1 (ja) 2014-06-26

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JP (1) JP6008731B2 (zh)
KR (1) KR101968801B1 (zh)
TW (1) TWI593817B (zh)
WO (1) WO2014097879A1 (zh)

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JP2020147830A (ja) * 2019-03-15 2020-09-17 キヤノントッキ株式会社 成膜装置、成膜システム
CN114752888A (zh) * 2021-01-08 2022-07-15 佳能特机株式会社 成膜装置、输送方法、成膜方法及电子器件制造方法

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KR101665380B1 (ko) * 2015-05-26 2016-10-13 주식회사 선익시스템 기판 증착 챔버 및 그를 구비한 기판 증착 시스템
KR101840976B1 (ko) * 2017-07-26 2018-03-21 캐논 톡키 가부시키가이샤 이동체 지지장치와, 이를 포함한 진공 증착 장치 및 증착 방법
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KR101968801B1 (ko) 2019-04-12
TWI593817B (zh) 2017-08-01

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