Classifications

• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
• • C—CHEMISTRY; METALLURGY
  • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
  • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
  • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
  • C09K5/08—Materials not undergoing a change of physical state when used
  • C09K5/14—Solid materials, e.g. powdery or granular
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
• • C—CHEMISTRY; METALLURGY
  • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
  • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
  • C08K3/00—Use of inorganic substances as compounding ingredients
  • C08K3/34—Silicon-containing compounds
  • C08K3/36—Silica

Definitions

• the present invention is a thermally conductive plastic.
• Plastics are widely used materials for a variety of applications. Plastics are characterized by good deformability, insulation behavior and acceptable strength.
• Plastics typically have a low thermal conductivity. Typical thermal conductivities of plastics are in the range of about 0.2 to 0.3 W / mK.
• the object of the present invention was to provide fillers in order to achieve desirable properties in the plastics composition.
• thermally conductive composition comprising a plastic and 20 to 80 wt .-% of an additive selected from island silicates, metallic silicon and mixtures thereof.
• a plastic is mixed with an additive which is selected from island silicates or metallic silicon or mixtures thereof and is present in an amount of from 20 to 80% by weight of the composition. Amounts of 30 to 80 wt .-% are preferred. Additionally, the composition contains a plastic that makes up the majority of the remaining composition. The amount of plastic is preferably in the range of 15 to 70%. In addition to the plastic, other auxiliaries, in particular dyes, impact modifiers, etc. may be present.
• the island silicates are aluminosilicates, in particular aluminosilicates. A particularly preferred island silicate is the dysthene.
• silicates are called silicates whose silicate anions consist of isolated Si0 4 tetrahedra, ie the Si0 4 tetrahedra are not connected to each other via Si-O-Si bonds.
• silicates includes the important rock-forming minerals of the garnet and olive group, zirconium and the economically or petrologically important aluminosilicates andalusite, sillimanite, disthen, staurolite and topaz.
• Suitable plastics are elastomers, thermoplastic or thermosetting polymers, in particular plastics selected from polyamide, polyethylene, polypropylene, polystyrene, polycarbonate, polyester, polyurethane, epoxy resins and mixtures and copolymers thereof.
• Copolymers include variants in which prepolymers or monomers of different chemical skeletons are polymerized together. It also includes mixtures of more than two substances, also referred to as terpolymers.
• additives are used in combination, for example different island silicates or a mixture of an island silicate and metallic silicon, or else it is also possible to use as several different island silicates are mixed together or multiple island silicates with metallic silicon.
• Suitable particle sizes of the additives are in the range of about 1 to 50 ⁇ (d50).
• d50 means that 50% by weight has a smaller and 50% by weight a larger particle size.
• Such grain size characteristics can be determined by laser diffraction.
• d50 particle sizes of at least 2 ⁇ m or at least 5 ⁇ m are preferred.
• the d50 particle size is preferably below 40 or below 30 ⁇ m.
• the grain size is 2 to 20 ⁇ , in others at 10 to 30 or 10 to 50 ⁇ .
• the grains have a relatively narrow particle size distribution such that d90 / d50 is ⁇ 3 or ⁇ 2.
• the invention also provides a process for producing a thermally conductive composition according to the invention comprising the step of mixing a plastic with 20 to 80 wt .-%, preferably 30 to 80 wt .-% of at least one additive selected from island silicates, metallic silicon and mixtures thereof.
• the proportion of the fillers used according to the invention is 40% by weight or more, 50% by weight or more or 60% by weight or more.
• Another object of the invention is the use of an additive selected from island silicates and metallic silicon and mixtures thereof to improve the thermal conductivity of plastic.
• SILBOND 4000 AST (quartz works): cristobalite, d50 about 5 pm
• the filler was compounded via an extruder (Leistritz, ZSE 27 MAXX) in polycaprolactam (PA6). From the compounds molded parts were produced by means of injection molding (Demag, Ergotech 100 / 420-310):
• the specimens required for the measurement of the thermal conductivity were machined from the plates.
• Z-direction transversely to the extrusion direction
• X-direction 6 bars each with a length of 12.7 mm and a width of 2 mm had to be milled out, which were then clamped together by 90 ° for measurement in a special sample holder.
• the fillers were incorporated by means of a vacuum mixer (PC Laboratories, Labotop) in epoxy resins (Huntsman, Araldite CY 184, Aradur HY 1235, accelerator DY 062).
• the molding compounds were poured into plates of dimension 250mmx250mmx2mm and thermally hardened. From these parts were sawn about 20mmx20mmx2mm large specimens. 3.
• PA6 0 107 2.5 Despite the high filler contents, the materials according to the invention show good mechanical properties. The finer filler (smaller d50), the better the mechanical properties.
• the inventively filled plastics show excellent heat resistance.
• thermosetting mixture of 63% by weight of bisphenol and 37% by weight of epoxy resin had the following properties:
• thermoset (100% of the epoxy resin) has a thermal conductivity of only 0.2 W / mK.

Landscapes

• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Organic Chemistry (AREA)
• Medicinal Chemistry (AREA)
• Health & Medical Sciences (AREA)
• Polymers & Plastics (AREA)
• Engineering & Computer Science (AREA)
• Combustion & Propulsion (AREA)
• Thermal Sciences (AREA)
• Materials Engineering (AREA)
• Physics & Mathematics (AREA)
• Compositions Of Macromolecular Compounds (AREA)
• Manufacture Of Macromolecular Shaped Articles (AREA)

Priority Applications (12)

Applications Claiming Priority (4)

Publications (1)

Family

ID=49779920

Family Applications (1)

Country Status (14)

Cited By (3)

Families Citing this family (5)

Citations (1)

Family Cites Families (25)

• 2013
  • 2013-12-16 TW TW102146404A patent/TWI541278B/zh active
  • 2013-12-18 SI SI201330355A patent/SI2935432T1/sl unknown
  • 2013-12-18 RU RU2015129581A patent/RU2662533C2/ru active
  • 2013-12-18 WO PCT/EP2013/077066 patent/WO2014095984A1/de not_active Ceased
  • 2013-12-18 CN CN201380066294.1A patent/CN104937020A/zh active Pending
  • 2013-12-18 UA UAA201507125A patent/UA115158C2/uk unknown
  • 2013-12-18 US US14/653,660 patent/US20150307764A1/en not_active Abandoned
  • 2013-12-18 MX MX2015007283A patent/MX367151B/es active IP Right Grant
  • 2013-12-18 EP EP13808027.0A patent/EP2935432B1/de active Active
  • 2013-12-18 BR BR112015014269A patent/BR112015014269A2/pt not_active Application Discontinuation
  • 2013-12-18 KR KR1020157015987A patent/KR102267585B1/ko active Active
  • 2013-12-18 JP JP2015547081A patent/JP2016500385A/ja active Pending
  • 2013-12-18 CA CA2893795A patent/CA2893795A1/en not_active Abandoned
  • 2013-12-18 PL PL13808027T patent/PL2935432T3/pl unknown
• 2018
  • 2018-08-14 JP JP2018152695A patent/JP7125005B2/ja active Active
• 2020
  • 2020-08-20 JP JP2020139650A patent/JP7107621B2/ja active Active

Patent Citations (1)

Also Published As

Similar Documents

Legal Events