WO2014091633A1 - Matériau d'électrode pour fusible thermique et procédé pour sa production - Google Patents

Matériau d'électrode pour fusible thermique et procédé pour sa production Download PDF

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Publication number
WO2014091633A1
WO2014091633A1 PCT/JP2012/082580 JP2012082580W WO2014091633A1 WO 2014091633 A1 WO2014091633 A1 WO 2014091633A1 JP 2012082580 W JP2012082580 W JP 2012082580W WO 2014091633 A1 WO2014091633 A1 WO 2014091633A1
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Prior art keywords
layer
alloy
electrode material
internal oxidation
thermal fuse
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PCT/JP2012/082580
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English (en)
Japanese (ja)
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英生 汲田
慎也 眞々田
真弘 山口
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株式会社徳力本店
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Priority to PCT/JP2012/082580 priority Critical patent/WO2014091633A1/fr
Priority to JP2014551829A priority patent/JP6021284B2/ja
Publication of WO2014091633A1 publication Critical patent/WO2014091633A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/05—Component parts thereof
    • H01H85/055—Fusible members
    • H01H85/06—Fusible members characterised by the fusible material
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C1/00—Making non-ferrous alloys
    • C22C1/04—Making non-ferrous alloys by powder metallurgy
    • C22C1/0466—Alloys based on noble metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C22C5/08—Alloys based on silver with copper as the next major constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H37/00—Thermally-actuated switches
    • H01H37/74—Switches in which only the opening movement or only the closing movement of a contact is effected by heating or cooling
    • H01H37/76—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material
    • H01H2037/768—Contact member actuated by melting of fusible material, actuated due to burning of combustible material or due to explosion of explosive material characterised by the composition of the fusible material

Definitions

  • the present invention relates to an electrode material for a thermal fuse to be mounted to prevent an abnormally high temperature of an electronic device or an electric appliance for home appliances, and a method for manufacturing the same.
  • Thermal fuses that are installed to prevent electronic and electrical equipment from becoming extremely hot are because the temperature-sensitive pellet melts at the operating temperature, unloads the force of the strong compression spring, and the strong compression spring extends. The electrode material pressed by the strong compression spring is separated from the lead wire to cut off the current.
  • Patent Document 1 As an electrode material used for this thermal fuse, an Ag-oxide alloy is becoming mainstream (for example, Patent Document 1 and Patent Document 2).
  • the electrode material is a thin plate of 0.1 mm or less due to the thermal fuse mechanism, and the contact surface with the lead wire is kept energized for a long time, so it is welded to the lead wire or metal case. Phenomenon easily occurs, and welding resistance is required as a material property. In recent years, there has been a demand for a reduction in the material price of Ag-oxide alloys.
  • the demand for welding resistance and material cost reduction can be met by increasing the oxide content in the Ag-oxide alloy and decreasing the Ag content.
  • the Ag-oxide alloy has a marked decrease in rolling processability with the increase in oxide, making it difficult to process into a thin plate in the rolling process after internal oxidation.
  • the rolling processability is poor, and it was necessary to reduce the oxide content in order to improve the rolling processability.
  • This invention makes it a subject to solve such a problem.
  • the present invention forms a substrate layer and an Ag—Cu alloy layer by clad an Ag—Cu alloy plate on both front and back surfaces in the longitudinal direction of the substrate made of Cu or Cu alloy, and performs internal oxidation treatment on this.
  • an electrode material for a thermal fuse having a multilayer structure in which an internal oxide layer is formed on the surface layer of the Ag—Cu alloy layer is obtained.
  • a bonding layer capable of improving the bonding strength may be provided as necessary at the interface between the substrate layer and the Ag—Cu alloy layer.
  • the thermal fuse electrode material having a multilayer structure as described above allows the material cost to be further reduced as compared with the conventional manufacturing method because the inexpensive substrate layer that occupies most of the material does not contain Ag. Further, since the substrate layer is rich in workability, it has succeeded in improving workability when rolling the material after internal oxidation while maintaining the oxide content in the internal oxide layer.
  • composition of each layer pure Cu containing inevitable impurities is preferable in the substrate layer, but for the purpose of improving heat resistance, conductivity or mechanical properties, Ti, Cr, Be, Si, Fe, Co, Zr Cu alloy containing at least one of Zn, Sn, Ni, P, and Pb may be used.
  • the Ag—Cu alloy plate contains 1 to 50% by mass of Cu and the balance contains Ag and inevitable impurities, or contains 1 to 50% by mass of Cu, and further includes Sn, In, Ti, Fe, Ni and Co.
  • An alloy containing 0.01 to 5% by mass of at least one selected from the group consisting of Ag and inevitable impurities is preferred.
  • the reason for the addition amount of Cu in the Ag—Cu alloy sheet being 1 to 50 mass% is that, after the internal oxidation treatment, if the Cu content is less than 1 mass%, the oxide is insufficient, and the temperature fuse This is because sufficient welding resistance to be used as an electrode material for a battery cannot be obtained.
  • the internal oxide layer refers to a layer having an oxide content of 1% by mass or more.
  • the Cu content exceeds 50% by mass, the workability of the internal oxide layer is remarkably reduced due to the increase in the oxide content, and the internal oxide layer is easily cracked.
  • oxygen even if oxygen is allowed to penetrate into the Ag-Cu alloy plate by internal oxidation treatment, oxygen mainly binds to Cu to form an oxide film near the surface, and the oxide particles are dispersed in the Ag matrix. Making it difficult to generate.
  • the bonding layer pure Ag containing inevitable impurities or an alloy having a composition containing 0.01 to 28% by weight of Cu and the balance containing Ag and inevitable impurities is most preferable.
  • Any metal material may be used as long as it has appropriate bonding properties, such as a Cu alloy plate, a noble metal such as Au, Mg, Cr, Sn, In, Ti, Fe, Ni, or Co.
  • This bonding layer improves the bondability between the substrate layer and the Ag—Cu alloy layer, and prevents peeling due to differences in elongation during processing, vibration or impact.
  • a part of the constituent components may be diffused or alloyed to other adjacent layers by heat treatment.
  • this bonding layer is subjected to an internal oxidation process on the surface layer of the bonding layer during the internal oxidation process, and oxygen enters the substrate layer and Cu is oxidized until immediately before the adjacent substrate layer is subjected to the internal oxidation process. It also has a function of preventing peeling of the internal oxide layer that may be caused by this.
  • the reason why the added amount of Cu contained in the alloy of the bonding layer is 0.01 to 28% by mass is that when the Cu content exceeds 28% by mass, the bonding property to the adjacent plate material is preferable. This is because there is not.
  • the bonding layer in which the Cu content exceeds 28% by mass is more oxygenated during the internal oxidation treatment than the bonding layer in which the Cu content is 28% by mass or less. It has a high function of preventing peeling of the internal oxide layer that may be caused by Cu entering and oxidizing Cu.
  • the clad method is the most preferable method for producing the thermal fuse electrode material according to the present invention.
  • the plate materials to be various layers are subjected to current heating, the plate material to be the substrate layer is covered with a plate material constituting an Ag—Cu alloy layer or a bonding layer, and is joined by hot rolling,
  • This is a method of forming a multilayer structure material composed of the various layers.
  • an internal oxide layer is formed on the surface layer of the Ag—Cu alloy layer on both the front and back surfaces of the multilayer structure material.
  • the plating method is a method of performing electrolysis or electroless plating on a substrate layer using a plating solution containing a metal salt constituting an Ag—Cu alloy layer or a bonding layer.
  • a thin film is formed on a substrate layer using a target material constituting an Ag—Cu alloy layer or a bonding layer and, if necessary, an oxygen atmosphere.
  • the manufacturing method of the multilayer structure material include plasma spraying, gas spraying, high-speed flame spraying, laminating by spraying such as a cold spray method, intermittent discharge in the air or liquid, pulse, etc.
  • a stacking by a discharge and a stacking by a vapor deposition method such as PVD (Physical Vapor Deposition) and CVD (Chemical Vapor Deposition).
  • the manufacturing method of the thermal fuse electrode material according to the present invention may be a method combining the above manufacturing methods.
  • the substrate layer is the material central portion, one surface is a cladding method, and the opposite surface is a plating method. But you can.
  • the above-mentioned various layers and / or internal oxide layers that are asymmetrical on the front and back sides may be arranged with the substrate layer as the center of the material.
  • the surface layer on one side may be an internal oxide layer
  • the surface layer on the opposite side may be a bonding layer or an Ag—Cu alloy layer.
  • the internal oxidation treatment takes a process in which, in the Ag—Cu alloy layer, Cu previously contained in Ag is precipitated as an oxide in the Ag matrix by being combined with oxygen stored in Ag from the material surface layer. . At this time, Cu, which is a solute element, diffuses from the material inside the Ag—Cu alloy layer toward the surface layer.
  • the definition of the surface layer in the present invention refers to a range not more than the total thickness of the Ag—Cu alloy layer and the bonding layer from the material surface.
  • the phenomenon that the solute element diffuses from the inside of the material toward the surface layer is caused by the internal oxide layer formed by the oxide precipitated from the material surface of the Ag—Cu alloy layer toward the inside, and the precipitation over time.
  • This is a phenomenon in which a difference in Cu concentration occurs between the unoxidized layer and the non-oxidized layer, and Cu diffuses from the unoxidized layer toward the surface layer in order to fill the concentration gradient. For this reason, oxygen is always supplied in excess of the amount of oxygen necessary for the oxidation of other elements in the Ag matrix.
  • the diffusion process by adding at least one selected from the group consisting of Sn, In, Ti, Fe, Ni, and Co into the Ag—Cu alloy layer, the diffusion phenomenon due to the concentration gradient is suppressed, As a result, by suppressing the aggregation due to the movement of the deposited oxide, the oxide structure is made finer and a uniform dispersion can be obtained. Furthermore, it becomes a complex oxide with Cu, for example, (Cu—Sn) Ox, and has the effect of improving the welding resistance.
  • the Ag—Cu alloy layer at least one of Sn, In, Ti, Fe, Ni or Co is made 0.01 to 5% by mass. This is because the movement of the solute element at the time cannot be sufficiently suppressed, and a homogeneous dispersion of the oxide cannot be obtained. When the amount exceeds 5 mass%, a coarse oxide is formed at the grain boundary and the contact resistance is increased. This is to invite.
  • the present invention is characterized in that, in this internal oxidation treatment, only the surface layers on both the front and back surfaces of the material have an internal oxide structure, and the internal oxidation conditions for this are set at 500 ° C. in an internal oxidation furnace at a desired plate thickness. It is adjusted under the conditions of ⁇ 750 ° C., 0.25 hours or more, and oxygen partial pressure of 0.1 to 2 MPa. As a result, an internal oxide layer can be formed on the front and back surfaces of the material, and a substrate layer can be formed at the center of the material.
  • the average particle size of the oxide particles dispersed in the internal oxide layer is 0.5 to 5 ⁇ m, preferably 1 to 4 ⁇ m, more preferably 2 to 3 ⁇ m.
  • the average particle size of the oxide particles is less than 0.5 ⁇ m, the oxide particles are fine at the contact portion between the lead wire and the movable electrode, so that the oxide particles are easily welded.
  • the average particle size of the oxide particles is 5 ⁇ m. If it is larger, the contact resistance becomes higher, so that welding becomes easier.
  • the oxygen partial pressure during the internal oxidation treatment is important for adjusting the average particle size of the oxide particles to 0.5 to 5 ⁇ m.
  • the oxygen partial pressure during the internal oxidation treatment under internal oxidation conditions is preferably 0.1 to 2 MPa. That is, when the oxygen partial pressure is less than 0.1 MPa, it is difficult to form the internal oxide layer uniformly, the average particle size of the oxide particles is greater than 5 ⁇ m, and when the oxygen partial pressure is greater than 2 MPa, The average particle size becomes less than 0.5 ⁇ m, and it becomes easy to weld as described above.
  • the temperature during the internal oxidation treatment is preferably 500 ° C. to 750 ° C. as described above.
  • the temperature is lower than 500 ° C., the oxidation reaction does not proceed sufficiently.
  • the temperature is higher than 750 ° C., it becomes difficult to control the thickness of the internal oxide layer and the size of the oxide particles.
  • the time of the internal oxidation treatment is the layer thickness of the target internal oxide layer, the layer thickness of the unoxidized layer, the composition of the Ag—Cu alloy plate, the layer thickness of the bonding layer and the Ag—Cu alloy layer, It is necessary to adjust appropriately according to temperature and oxygen partial pressure.
  • the thickness of the target internal oxide layer it is preferably 0.25 hours or longer. That is, when the internal oxidation time is less than 0.25 hours, it is difficult to form the internal oxide layer uniformly. If the internal oxidation time is less than 0.25 hours, it is difficult to form the internal oxide layer uniformly and sufficiently, and there is a risk of causing a welding phenomenon with the lead wire or the metal case when used as an electrode material for a thermal fuse. is there. There is no particular upper limit to the internal oxidation time, and the thickness of the internal oxide layer increases in proportion to the increase in internal oxidation time.
  • the substrate layer is internally oxidized, it may cause peeling of each layer, so that the ratio of the thickness of the Ag—Cu alloy layer or the bonding layer to the substrate layer should be increased so that the substrate layer is not subjected to internal oxidation treatment.
  • a layer for preventing oxidation may be provided at the interface with the substrate layer.
  • the temperature, pressure, and time of internal oxidation are correlated with each other. For example, in order to shorten the internal oxidation time in a short time, the temperature and pressure are increased and adjusted. It is necessary to select a proper condition.
  • the electrode material for the thermal fuse has various component compositions and various final plate thicknesses depending on the usage of the thermal fuse, but a thin plate material of 0.1 mm or less is used due to the mechanism of the thermal fuse.
  • a thin plate material of 0.1 mm or less is used due to the mechanism of the thermal fuse.
  • shearing or heat treatment may be performed as necessary.
  • the electrode material of the present invention even if the content of Ag is decreased by increasing the Cu content in the Ag-Cu alloy layer to 50 mass% and increasing the oxide content after the internal oxidation treatment, In the processing after the internal oxidation, it is possible to perform a rolling process with a cross-section reduction rate of 80% or more.
  • the internal oxide layer having a sufficient thickness on both the front and back surfaces of the electrode material and a substrate layer mainly composed of Cu at the center of the material are provided.
  • Workability can be greatly improved without reducing the oxide content of the oxide layer.
  • an electrode material for thermal fuse that adjusts heat resistance, conductivity, mechanical properties, etc. to desired characteristics while maintaining welding resistance It becomes possible to provide.
  • thermal fuse electrode material that can greatly reduce the amount of Ag and the like while maintaining various characteristics such as welding resistance and low contact resistance required for the thermal fuse electrode material. Is possible.
  • Examples of the present invention are shown in Tables 1 to 4, and a method for manufacturing these thermal fuse electrode materials will be described.
  • an Example and a comparative example are electrode material kind No ..
  • Table 2 is shown in a format corresponding to Table 1
  • Table 4 is shown in a format corresponding to Table 3.
  • the composition of components contained in the Ag—Cu alloy plate and the joining plate of the production methods 1 and 2 of the present invention is shown in Table 1, and the Ag—Cu alloy plate and the joining plate of the production methods 3 to 4 of the present invention are shown in Table 1.
  • the component composition contained is listed in Table 3.
  • Tables 1 and 3 also show the composition of components contained in the Ag—Cu alloy plate of the comparative example.
  • internal oxidation temperature, internal oxidation time, oxygen partial pressure, average particle size of oxide, workability of rolling after internal oxidation treatment and after clad processing, electrode material for thermal fuse Table 2 or Table 4 shows the final plate thickness and the final processing rate.
  • the component composition contained in the Ag—Cu alloy plate and the joining plate is quantitatively analyzed using a wavelength dispersive electron microscope and an ICP emission analyzer.
  • the remaining Ag and inevitable impurities are described as remaining.
  • the inevitable impurities described in the examples of the present invention indicate impurities having a content of less than 0.01% by mass.
  • Bondability is determined by subjecting each clad plate obtained by manufacturing methods 1 to 4 to a fully-annealed clad plate after 180 ° bending according to the pressing method defined in JIS Z 2248, and performing a close-contact bending test. Bondability was evaluated by the presence or absence of peeling. The case where cracks and peeling were observed in the curved portion was evaluated as x, and the case where cracks and separation were not observed in the curved portion and excellent in bondability was evaluated as ⁇ . Even if the bondability evaluation is x, if the following processability evaluation is A to C and the evaluation of other evaluation items is ⁇ , it can be suitably used as a movable electrode for a thermal fuse.
  • Bending workability is determined by fixing a test piece of various electrode materials processed to the final plate thickness by each manufacturing method and then performing a 90 ° repeated bending test until the test piece is cracked. The number of bends was measured, and the bondability was evaluated based on the number of bends. The number of bending was 10 times or more was evaluated as A, the number of 4 times or more and less than 10 times was evaluated as B, and the case of 2 times or more and less than 4 times was evaluated as C. In addition, when processing into a movable electrode having a predetermined shape, bending is performed once by pressing, but if the evaluation is A to C, the movable electrode can be processed with sufficient reliability. In any of the production methods of the present invention, the obtained movable electrode material did not cause interfacial delamination between layers, and was broken at the substrate layer to obtain a movable electrode material having extremely good bonding properties. .
  • the workability was evaluated as “ ⁇ ” when the final processing rate in the final plate thickness before the hardness adjustment by heat treatment was cold-rolled to 80% or more in terms of the cross-sectional reduction rate, and “ ⁇ ” when it was not possible.
  • Reasons for evaluation x include cracks and breaks during rolling, cracks in the internal oxide layer, and the like.
  • good workability was obtained as compared with the comparative example.
  • oxygen-free Cu was used for the substrate layer
  • manufacturing methods 3 and 4 a Cu alloy was used for the substrate layer, but no difference in workability was observed.
  • the average particle size of the oxide particles was measured at 1000 times the cross section of the movable electrode material for the thermal fuse with a metal microscope. A sample having an average particle size in the range of 0.5 to 5 ⁇ m was evaluated as ⁇ , and a sample having an average particle size outside the range of 0.5 to 5 ⁇ m was evaluated as ⁇ . In addition, in any internal oxidation conditions of the present invention, a good average oxide particle size was obtained.
  • Comparative Example As a comparative example, an internal oxidation treatment was performed on an Ag—Cu alloy plate having a thickness of 0.5 mm in an internal oxidation furnace under conditions of 500 ° C. to 750 ° C. for 48 hours and an oxygen partial pressure of 0.1 to 2 MPa.
  • An Ag-oxide alloy plate (FIG. 6) in which an inner oxide layer 4 containing an oxide on both surface layers and an oxide thin layer 7 in the middle layer portion were formed, and after final annealing, the final thickness (0. 1 mm or less), the electrode material type No. which has been cold-rolled so that the final processing rate in the cross-section reduction rate is 80% or more. Details of 41 to 47 are also shown in Tables 1 to 4. The reason why the internal oxidation time of the comparative example is unified to 48 hours is that the oxide thin layer 7 can be surely formed in the thickness of the Ag—Cu alloy plate of the comparative example.
  • the definition of the diluted oxide layer 7 in the comparative example is located at the center of the longitudinal cross section of the Ag-Cu alloy plate subjected to the internal oxidation treatment, the oxide content is lower than 1% by mass, and the cross-sectional ratio Means a layer in the range of 10% or less.
  • Manufacturing method 1 Examples according to this production method are shown in Tables 1 and 2.
  • An Ag—Cu alloy having each desired composition corresponding to the electrode material types No. 1 to 40 and oxygen-free Cu containing inevitable impurities were prepared by a melting method.
  • the Ag—Cu alloy was rolled to obtain an Ag—Cu alloy plate (plate thickness 0.5 mm) to be the Ag—Cu alloy layer 1.
  • Oxygen-free Cu was subjected to extrusion processing and rolling processing to form a Cu plate (plate thickness 2 mm) to be the substrate layer 2.
  • the Ag—Cu alloy plate and the Cu plate are subjected to surface treatment, and these are subjected to clad processing and cold rolling to have a plate thickness of 0.5 mm on both the front and back surfaces of the substrate layer 2 in the longitudinal direction.
  • a three-layer clad plate (FIG. 1) having a multilayer structure having an Ag—Cu alloy layer 1 was obtained.
  • the conditions for the clad processing two energizing rolls are provided on each of the Ag—Cu alloy plate and the Cu plate, and current is heated between the energizing rolls in a reducing atmosphere, while Ag is formed on both front and back surfaces of the Cu plate in the longitudinal direction.
  • -Continuous feeding between the pressure-bonding rolls so that the Cu alloy plates overlap, and hot rolling with a reduction rate of 50% was performed.
  • the reducing atmosphere was adjusted so that the mixing ratio of nitrogen and hydrogen was 5: 2.
  • the current heating conditions were such that the current value was adjusted so that the temperature of the Cu plate and the Ag—Cu alloy plate was 400 ° C. when the material passed between the pressure-bonding rolls.
  • the reason for fixing the temperature at 400 ° C. is to align the test conditions, and the temperature condition is preferably in the range of 200 to 750 ° C.
  • the above three-layer clad plate was internally oxidized in an internal oxidation furnace under the conditions of 550 to 750 ° C., 0.25 to 36 hours, and oxygen partial pressure of 0.1 to 2 MPa. At this time, conditions are selected within the above ranges depending on the composition and thickness of each layer, and an internal oxide layer 4 containing oxide 3 is formed on the front and back surfaces of the three-layer clad plate, and unoxidized in the middle layer portion.
  • a multilayer structure (FIG. 2) having a layer 5 and a substrate layer 2 at the center of the material was provided.
  • the above-mentioned three-layer clad plate after internal oxidation is completely annealed and then cold-rolled with the multilayer structure shown in FIG.
  • the electrode material for thermal fuses was produced.
  • the bonding plate and the Cu plate are subjected to surface treatment, and these are subjected to cladding processing and cold rolling processing, whereby the plate thickness is 2.0 mm, and the bonding layer 6 is formed on both the front and back surfaces of the substrate layer 2 in the longitudinal direction.
  • a three-layer clad plate having a multilayer structure (FIG. 3) was obtained.
  • the conditions for the clad processing were the same as those in Manufacturing Method 1 except that the Ag—Cu alloy plate was replaced with a bonded plate.
  • the Ag—Cu alloy plate and the three-layer clad plate produced under the same conditions as in the production method 1 were subjected to surface treatment, and the plate thickness was 0.5 mm by clad processing and cold rolling.
  • a multi-layered five-layer clad plate (FIG. 4) having a bonding layer 6 and an Ag—Cu alloy layer 1 on both front and back surfaces in the longitudinal direction of the substrate layer 2 was obtained.
  • the conditions for the clad processing were the same as those in Production Method 1 except that the Cu plate was replaced with a three-layer clad plate.
  • the above five-layer clad plate was subjected to internal oxidation treatment under the same conditions as in Production Method 1. At this time, conditions within the above ranges are selected according to the composition and layer thickness of each layer, and an internal oxide layer 4 containing oxide 3 is formed on the front and back surfaces of the five-layer clad plate, and unoxidized in the middle layer portion.
  • the layer 5 and the bonding layer 6 have a multilayer structure (FIG. 5) having the substrate layer 2 at the center of the material.
  • the above-mentioned internally oxidized five-layer clad plate is completely annealed and then cold-rolled with the multilayer structure shown in FIG.
  • the electrode material for thermal fuses was produced.
  • a thermal fuse electrode having the multilayer structure shown in FIG. 2 and having a final thickness of 0.1 mm or less is the same as in manufacturing method 1 except that the Cu plate is replaced with the Cu alloy plate. The material was made.
  • Manufacturing method 4 Examples according to this production method are shown in Tables 3 and 4.
  • a Cu alloy containing 0.2% by mass of Sn was prepared by a melting method.
  • the Cu alloy was subjected to extrusion processing and rolling processing to obtain a Cu alloy plate (plate thickness 3.0 mm) to be the substrate layer 2.
  • a thermal fuse electrode having the multilayer structure shown in FIG. 5 and having a final thickness of 0.1 mm or less is the same as in manufacturing method 2 except that the Cu plate is replaced with the Cu alloy plate. The material was made.
  • the thermal fuse electrode materials of the examples and comparative examples are adjusted to a desired hardness by heat treatment as necessary, and then processed into a movable electrode having a predetermined shape by pressing or the like, so that the temperature sensitive material is at the operating temperature. It melts and unloads the compression spring, and when the compression spring expands, the movable electrode pressed by the compression spring is separated from the lead wire to cut off the current, and it becomes a typical temperature-sensitive pellet type temperature fuse on the market It can be suitably used.
  • Tables 2 and 4 show the results of conducting an energization test and a current interruption test with a fuse mounted, DC30V, 20A, and a heating rate of 1 ° C per minute.
  • the temperature fuse was energized for 10 minutes, and the temperature difference on the surface of the temperature fuse metal case before and after the test was less than 10 ° C., and the temperature difference of 10 ° C. or more was evaluated as x.

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Abstract

La présente invention concerne un matériau d'électrode pour fusible thermique qui utilise un matériau de revêtement formé en liant au moins deux couches métalliques présentant des propriétés différentes, ainsi qu'un procédé de production du matériau d'électrode. Le matériau d'électrode pour fusible thermique est configuré de façon à présenter une structure multicouche réalisée en effectuant un traitement d'oxydation interne sur un alliage contenant 1 à 50% en masse de Cu, le reste étant constitué d'Ag et d'impuretés inévitables, ou sur un alliage contenant 1 à 50% en masse de Cu, 0,01 à 5% en masse d'au moins un élément choisi dans le groupe constitué de Sn, In, Ti, Fe, Ni et Co, le reste étant constitué d'Ag et d'impuretés inévitables, afin de former une couche intérieurement oxydée sur la ou les surfaces avant et arrière du matériau. La structure multicouche résultante comprend une couche de substrat dans sa section centrale de matériau et, le cas échéant, une couche de liaison sur les deux surfaces de la couche de substrat.
PCT/JP2012/082580 2012-12-14 2012-12-14 Matériau d'électrode pour fusible thermique et procédé pour sa production WO2014091633A1 (fr)

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PCT/JP2012/082580 WO2014091633A1 (fr) 2012-12-14 2012-12-14 Matériau d'électrode pour fusible thermique et procédé pour sa production
JP2014551829A JP6021284B2 (ja) 2012-12-14 2012-12-14 温度ヒューズ用電極材料およびその製造方法

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104217878A (zh) * 2014-09-15 2014-12-17 南通万德科技有限公司 一种镀贵金属开关触点元件及其制备方法

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JPS62241211A (ja) * 1986-04-11 1987-10-21 中外電気工業株式会社 点溶接可能なテ−プ状電気接点材料
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