WO2014073356A1 - 保護素子用フラックス、保護素子用ヒューズ素子、および回路保護素子 - Google Patents

保護素子用フラックス、保護素子用ヒューズ素子、および回路保護素子 Download PDF

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Publication number
WO2014073356A1
WO2014073356A1 PCT/JP2013/078359 JP2013078359W WO2014073356A1 WO 2014073356 A1 WO2014073356 A1 WO 2014073356A1 JP 2013078359 W JP2013078359 W JP 2013078359W WO 2014073356 A1 WO2014073356 A1 WO 2014073356A1
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Prior art keywords
flux
fuse
layer
protection element
element according
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Application number
PCT/JP2013/078359
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English (en)
French (fr)
Japanese (ja)
Inventor
栄吾 岸
Original Assignee
エヌイーシー ショット コンポーネンツ株式会社
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Application filed by エヌイーシー ショット コンポーネンツ株式会社 filed Critical エヌイーシー ショット コンポーネンツ株式会社
Priority to KR1020157011242A priority Critical patent/KR101925669B1/ko
Priority to CN201380058080.XA priority patent/CN104781901B/zh
Publication of WO2014073356A1 publication Critical patent/WO2014073356A1/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/04—Fuses, i.e. expendable parts of the protective device, e.g. cartridges
    • H01H85/041—Fuses, i.e. expendable parts of the protective device, e.g. cartridges characterised by the type
    • H01H85/048—Fuse resistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/02—Details
    • H01H85/46—Circuit arrangements not adapted to a particular application of the protective device
    • H01H2085/466—Circuit arrangements not adapted to a particular application of the protective device with remote controlled forced fusing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H85/00—Protective devices in which the current flows through a part of fusible material and this current is interrupted by displacement of the fusible material when this current becomes excessive
    • H01H85/0039—Means for influencing the rupture process of the fusible element
    • H01H85/0047—Heating means
    • H01H85/0065—Heat reflective or insulating layer on the fusible element

Definitions

  • the present invention relates to a protective element flux, a protective element fuse element having a flux layer formed of the protective element flux, and a circuit protective element of an electric / electronic device including the protective element fuse element.
  • a protection element of a surface mount component is suitably used for a protection circuit of a secondary battery pack.
  • These protection elements include non-restoring protection elements that detect excessive heat generation caused by the overcurrent of the protected equipment, or respond to abnormal overheat of the ambient temperature to activate the fuse and interrupt the electric circuit under predetermined conditions. is there.
  • the protection circuit detects an abnormality generated in the device, the protection element causes the resistance element to generate heat by the signal current, and the heat generation melts a fuse layer made of a fusible alloy material to generate a circuit. Can be cut off or the circuit can be cut off by melting the fuse layer by over current.
  • a protective element flux is applied to the surface of the fuse layer.
  • the conventional protective element flux is rich in thermal fluidity, when the protective element is mounted on a circuit board and exposed to a thermal environment such as a reflow furnace, the flux applied to the surface of the fuse layer flows out. An extremely thin film layer may be left from the surface of the fuse layer.
  • flux is lost from the surface of the fuse layer, spherical melting of the alloy for the fuse is prevented, causing poor melting such as stringing due to unmelted or oxide remaining on the surface of the alloy for the fuse.
  • JP 2010-003665 A As a technique for stably holding the flux in a predetermined position, for example, in JP 2010-003665 A (patent document 1), a step of holding the flux in a predetermined position in an insulating cover member covering a fuse layer of a protection element A technology for providing a projected ridge portion where a portion is formed, applying flux to contact an annularly formed stepped portion and a central portion of a fuse layer, and holding the flux using an interfacial tension between the flux and an insulating cover member Is disclosed.
  • the conventional flux loses thixotropy and flows when heated up to a reflow temperature (maximum temperature of 250 to 260 ° C.) even if a thixo agent is contained, so that the shape can not be maintained. Therefore, in order to regulate the flow-out range of the fluidized flux under the thermal environment, for example, as described in Patent Document 1, a specific package structure, such as providing a step on the insulating cover member facing the center of the fuse layer Had to be used.
  • the melted portion of the insulating cover member narrows the internal space when the fuse layer is melted and the melted fuse The alloy is pushed out from the electrode portion to bridge between the electrodes or to inhibit the wet flow of the melted fuse alloy to the electrode portion, which causes melting failure.
  • the molten fuse alloy gathers in a dome shape on the heated electrode while wetting the electrode portion heated by surface tension and melts, but the height of the molten alloy formed in the dome shape is Since the step portion and the protruding portion provided on the cover member are limited, there is a disadvantage that the excess molten alloy is pushed out around the periphery to bridge between the electrodes and to cause non-melting cut.
  • the structure of the package becomes complicated and the cost of parts increases.
  • the present invention has been proposed to solve the above-mentioned problems, and in the flux for a protective element applied to a surface mounting type circuit protective element, regardless of the shape of the housing or lid of the protective element package.
  • the flux for a protective element is used so that the flux applied to the surface of the fuse layer does not flow out and be lost from the surface of the fuse layer even if the protective element is exposed to a thermal environment where the flux melts.
  • An object of the present invention is to provide a fuse for a protection element and a circuit protection element.
  • the present invention provides a flux for a protective element, which comprises a flux base containing a heat-fusible resin and an activator, and a retention agent composed of inorganic particles.
  • the flux substrate preferably further contains a thixotropic agent.
  • the heat fusible resin preferably includes at least one selected from the group consisting of natural rosin, polymerized rosin, acid-modified rosin and hydrogenated rosin.
  • the above-mentioned activator preferably contains at least one selected from the group consisting of organic acids, organic acid amine salts and hydrohalic acid amine salts.
  • the inorganic particles preferably include at least one selected from the group consisting of glass powder, ceramic powder, calcium carbonate, talc, silica, alumina, kaolin, titanium oxide, mica and montmorillonite.
  • the inorganic particles preferably have a volume average particle size (D 50 ) in the range of 0.01 to 10 ⁇ m.
  • the holding material is preferably contained in the range of 0.5 to 70% by mass with respect to the flux base material.
  • the present invention also provides a fuse element for a protection element, comprising a fuse layer and a flux layer provided on the surface of the fuse layer, wherein the flux layer is made of the above-mentioned flux for a protection element.
  • the present invention also includes an insulating substrate, a pattern electrode provided on the surface of the insulating substrate, and a fuse element electrically connected to the pattern electrode, wherein the fuse element is provided on the surface of the fuse layer and the fuse layer. And a flux layer, wherein the flux layer comprises the flux for the protective element.
  • the circuit protection element may further include a resistive heating element provided on the surface of the insulating substrate.
  • the flux when the flux is applied to the fuse layer to form the fuse element by adding the retention agent made of inorganic particles to the flux for protective element, the flux melts and becomes liquid under the thermal environment Even if it does, flux can be prevented from flowing out of the fuse layer. Therefore, it is possible to prevent the flux from flowing out without devising the configuration of the circuit protection element, and the flux acts sufficiently at the time of melting of the fuse element, so that the fuse element can be melted rapidly and stably.
  • FIG.2 (a) is a schematic diagram of an upper surface
  • FIG.2 (b) is a longitudinal cross-sectional view
  • FIG.2 (c) is a lower surface.
  • FIG. 3 (a) is a schematic diagram of an upper surface
  • FIG.3 (b) is a longitudinal cross-sectional view
  • FIG.3 (c) is a lower surface.
  • the flux for a protective element of the present invention comprises a flux base containing a heat-fusible resin and an activator, and a holding agent composed of inorganic particles.
  • the inorganic particles constituting the holding agent are preferably insulating and insoluble and infusible with respect to the flux substrate.
  • the protective element flux is applied to the surface of the fuse layer in the fuse element to form a flux layer.
  • the flux layer has an antioxidizing action on the surface of the fuse layer, and also has an activating action to rapidly and stably melt the fused fuse layer when the fuse layer is fused due to an increase in ambient temperature.
  • the flux base material exerts a more excellent activation action by melting or softening preferably at a temperature at which the fuse layer melts. Therefore, the melting point or softening point of the flux base is preferably lower than the melting point of the fuse layer.
  • the flux base is solid or paste at room temperature.
  • the flux according to the present invention includes the retention agent composed of inorganic particles together with the flux base material, so that the flux base material flows out from the surface of the fuse layer even if the flux base material melts and becomes liquid in a thermal environment. Can be prevented from being lost. This is considered to be due to the fact that the interfacial tension of the flux base material in the liquid state causes the flux base material to be held in the gap between the holding agents. By preventing the flux base material from flowing out from the surface of the fuse layer, the flux acts when the fuse element is fused, and the fuse element can be fused rapidly and stably.
  • the heat fusible resin includes, for example, at least one selected from the group consisting of natural rosin, polymerized rosin, acid-modified rosin and hydrogenated rosin.
  • the activator includes, for example, at least one selected from the group consisting of organic acids, organic acid amine salts and hydrohalic acid amine salts.
  • the inorganic particles are preferably insulating and insoluble and infusible in the flux base.
  • the inorganic particles include, for example, at least one selected from the group consisting of glass powder, ceramic powder, calcium carbonate, talc, silica, alumina, kaolin, titanium oxide, mica and montmorillonite.
  • the surface of the inorganic particle may be surface-modified with a fatty acid, a resin acid, a wax, a phosphoric acid compound, a silane coupling agent or the like so that it can be easily added and mixed in the flux base.
  • the volume average particle size (D 50 ) of the inorganic particles is, for example, 0.01 to 10 ⁇ m, and preferably 0.01 to 1.5 ⁇ m. When the volume average particle size (D 50 ) of the inorganic particles is 0.01 to 1.5 ⁇ m, it is preferable because there is no particle separation and the stability of the dispersed state is good.
  • the flux for a protective element according to the present invention may be appropriately added with a thixo agent for adjusting the fluidity, a surfactant for improving the fluidity at the time of melting, an antioxidant, etc. It may be diluted.
  • a thixotropic agent for example, higher fatty acid amides, hydrogenated higher fatty acid esters, hydrogenated higher fatty acids, fumed silicas and the like can be used, and the temperature is 70 to 140 ° C., which is a relatively low temperature range.
  • Thixotropic agents capable of adjusting the flowability are preferably used.
  • Specific examples of the thixotropic agent include stearic acid amide, isopropyl myristate, behenic acid and the like.
  • the solvent high boiling point solvents such as petroleum hydrocarbons, glycol esters and organic acid esters are preferably used.
  • the flux for a protective element according to the present invention comprises a flux base and a holding agent, and the blending ratio in the flux base is, for example, 10 to 90% by mass, preferably 30 to 70% by mass of thermoplastic resin, activator Is 0.1 to 60% by mass, preferably 5 to 30% by mass.
  • the holding agent can be blended, for example, in an amount of 0.5 to 70% by mass, preferably 0.5 to 30% by mass, with respect to 100% by mass of the flux base.
  • the thixotropic agent is preferably blended in the flux base in the range of 5 to 40% by mass.
  • the fuse element of the present invention comprises a fuse layer and a flux layer provided on the surface of the fuse layer.
  • the shape of the fuse element is not limited and is, for example, a plate-like body, a rod-like body or the like.
  • the flux layer is provided on the surface of the fuse layer which is not in contact with the electrode pattern of the circuit protection element when the fuse element is disposed on the circuit protection element.
  • the flux layer is formed using the above-mentioned flux for a protective element, and can be formed, for example, by applying the above-mentioned flux for a protective element to the surface of the fuse layer by an arbitrary method.
  • the flux may be applied to the entire surface of the fuse layer and used, or may be provided in the center of the surface of the fuse layer like a filling and only partially transferred. Even in the case of partial transfer, the crest of the embankment formed by the holding agent contained in the flux functions to support the convex apex of the liquid flux surface to cause the flux substrate to flow out of the surface of the fuse layer. It can be prevented. In addition, the partial transfer enables the spreading operation to be efficient because the exuded liquid flux base material self-expands and covers the surface of the fuse layer. By preventing the flux base material from flowing out from the surface of the fuse layer, the flux acts when the fuse element is fused, and the fuse element can be fused rapidly and stably.
  • the fuse layer may be a single layer or a multilayer, but preferably comprises a single layer.
  • the fuse element of the present invention is used by being provided in a circuit protection element incorporated in an external circuit.
  • the temperature at which the fuse element is melted can be adjusted by appropriately selecting the material of the fuse layer, and can be set, for example, at 247 ° C. or more and 296 ° C. or less.
  • FIG. 1 is a perspective view schematically showing a fuse element for a protection element of the first embodiment.
  • the fuse element 10 is a plate-like body, and includes a plate-like fuse layer 11 and a flux layer 12 covering one surface of the fuse layer 11.
  • the thickness of the fuse element 10 is preferably 64 ⁇ m to 300 ⁇ m, and more preferably 80 ⁇ m to 110 ⁇ m from the viewpoint of reducing the size and thickness of the circuit protection element to be mounted.
  • the flux has the function of preventing oxidation of the surface of the fuse layer 11 and is applied in an amount such that the activation action to melt the fuse layer 11 melted rapidly and stably when the fuse layer 11 is melted due to the rise of ambient temperature is exhibited
  • the amount is not particularly limited as long as the flux layer 12 is formed.
  • the flux layer 12 can be applied, for example, with a thickness of 5 to 60 ⁇ m.
  • FIG. 2 is a diagram showing the configuration of the circuit protection element of the second embodiment.
  • Fig.2 (a) is a schematic diagram of an upper surface
  • FIG.2 (b) is a longitudinal cross-sectional view
  • FIG.2 (c) is a schematic diagram of a lower surface.
  • 2 (a) corresponds to the dd cross section of FIG. 2 (b)
  • FIG. 2 (b) corresponds to the DD cross section of FIG. 2 (a) or (c).
  • FIG. 2 includes insulating substrate 33, pattern electrode 34 provided on the surface of insulating substrate 33, and fuse element 10 joined to pattern electrode 34 and electrically connected to pattern electrode 34, and a fuse And a cap-like lid 36 covering the element 10.
  • a conductive pattern 39 and a heating resistor 38 are provided on the back surface of the insulating substrate 33 so as to be electrically connected to the conductive pattern 39.
  • fuse element 10 the case where fuse element 10 of a 1st embodiment shown in Drawing 1 is used is shown.
  • the insulating substrate 33 is made of a heat-resistant insulating substrate, such as a glass epoxy substrate, a BT (Bismalemide Triazine) substrate, a Teflon (registered trademark) substrate, a ceramic substrate, a glass substrate, or the like.
  • the thickness of the insulating substrate 33 is, for example, 0.20 mm or more and 0.40 mm or less.
  • the pattern electrode 34 is formed on the surface of the insulating substrate 33 in an arbitrary pattern, and is connected to an external circuit through terminals 37 a and 37 b provided in half through holes formed on the side surfaces of the insulating substrate 33.
  • the pattern electrode 34 is for supplying a current to the fuse element 10, and is formed so as to be electrically open when the fuse element 10 is fused.
  • the pattern electrode 34 is made of, for example, a metal material such as tungsten, molybdenum, nickel, copper, silver, gold or aluminum, or an alloy thereof, or a composite material in which a plurality of these materials are mixed, or a material thereof.
  • the heating resistor 38 is connected to an abnormality detector incorporated in an external circuit through terminals 39a and 39b provided in the half through holes.
  • the abnormality detector detects an abnormality in the external circuit
  • the heating resistor 38 is energized through the terminals 39a and 39b and the conductive pattern 39 to raise the temperature of the heating resistor 38.
  • the fuse element 10 can be fused due to the temperature rise of the heating resistor 38.
  • the conductive pattern 39 is provided on the surface of the insulating substrate 33 so as to be in contact with the fuse element 10, and can conduct the temperature of the heating resistor 38 to the fuse element 10 with high efficiency.
  • a configuration is adopted in which the pattern electrodes 34 or the conductive patterns 39 formed on the front and back surfaces are electrically connected via the terminals 37a, 37b, 39a, 39b provided in the half through holes.
  • a conductor through hole penetrating the insulating substrate 33 or a surface wiring with a flat electrode pattern may be employed.
  • the heating resistor 38 is, for example, a metal material such as tungsten, silver, palladium, ruthenium, lead, boron, or aluminum, or an alloy or oxide thereof, a composite material in which a plurality of materials are mixed, or a composite of these materials It consists of layers.
  • the surface of the heating resistor 38 may be provided with an insulating coating.
  • the cap-like lid 36 is only required to cover the insulating substrate 33 and the fuse element 10 from above to maintain a desired space, and the shape and material are not limited. For example, dome-like resin film material, plastic material, ceramic material, etc. Become.
  • the circuit protection element of the present invention is incorporated in an external circuit and used.
  • the fuse element 10 is melted and the operation of the external circuit is urgently stopped due to the abnormal temperature.
  • One example of a method of manufacturing the circuit protection element 30 is to prepare the insulating substrate 33 provided with the pattern electrode 34 on the surface, and the fuse element 10 having the fuse layer 11 and the flux layer 12 covering one surface of the fuse layer 11.
  • the preparation step (St10) in a state where the fuse element 10 is in contact with the pattern electrode 34 via the solder material, the fuse element 10 is heated to the melting temperature of the solder material, and the fuse element 10 is joined to the pattern electrode 34 and electrically connected It has a process (St20) and a package process (St30) which covers and fuses the fuse element 10 with the cap-like lid body 36.
  • the heating means applied in the bonding step (St20) is not particularly limited, and any method and apparatus can be used as long as it can heat the solder material for bonding the pattern electrode 34 and the fuse element 10 to a melting temperature. It does not matter. For example, heating using a high temperature batch furnace, heating using a hot plate, heating using a reflow furnace, and the like can be suitably used.
  • the bonding step (St20) the flux base material of the flux layer 12 provided in the fuse element 10 can be melted since the temperature is raised to a temperature higher than the melting point of the solder material joining the fuse element 10 and the pattern electrode 34 Although the flux layer 12 contains a retention agent, the outflow of the flux substrate is prevented.
  • the method of manufacturing the circuit protection element 30 using the one in which the flux layer 12 is provided in advance as the fuse element 10 is described, but a fuse which does not include the flux layer 12 in the bonding step (St20) Only the layer 11 may be bonded to the pattern electrode 34, and then a flux application step (St21) may be provided to apply a flux to the surface of the fuse layer 11 to form the flux layer 12 before the package step (St30).
  • a flux application step St21
  • the flux layer 12 may be exposed to a high temperature environment where it melts. Therefore, the flux layer 12 is formed by the flux of the present invention. Since the flux base material melted by the holding agent contained in is held on the surface of the fuse layer 11, the flux layer 12 can be prevented from disappearing before the fuse element 10 is melted and broken.
  • FIG. 3 is a diagram showing the configuration of the circuit protection element of the third embodiment.
  • Fig.3 (a) is a schematic diagram of an upper surface
  • FIG.3 (b) is a longitudinal cross-sectional view
  • FIG.3 (c) is a schematic diagram of a lower surface.
  • 3 (a) corresponds to the dd cross section of FIG. 3 (b)
  • FIG. 3 (b) corresponds to the DD cross section of FIG. 3 (a) or (c).
  • Circuit protection element 40 shown in FIG. 3 includes insulating substrate 43, pattern electrode 44 provided on the surface of insulating substrate 43, and fuse element 10 joined to pattern electrode 44 and electrically connected to pattern electrode 44, and a fuse And a cap-like lid 46 covering the element 10.
  • FIG. 3 shows the case where the fuse element 10 of the first embodiment shown in FIG. 1 is used as the fuse element 10.
  • the pattern electrode 44 is formed on the surface of the insulating substrate 43 in an arbitrary pattern, and is connected to an external circuit through terminals 47 a and 47 b provided in half through holes formed on the side surfaces of the insulating substrate 43.
  • the pattern electrode 44 is for passing a current to the fuse element 10, and is formed to be electrically open when the fuse element 10 is melted.
  • the heating resistor 48 is connected to an abnormality detector incorporated in an external circuit through terminals 49a and 49b provided in the half through holes. When the abnormality detector detects an abnormality in the external circuit, the heating resistor 48 is energized via the terminals 49a and 49b and the conductive pattern 49, and the temperature of the heating resistor 48 is raised. As a result, the fuse element 10 can be fused due to the temperature rise of the heating resistor 48.
  • the circuit protection element 40 of the third embodiment differs from the circuit protection element 30 of the second embodiment only in that the heating resistor 48 is provided on the surface of the insulating substrate.
  • the circuit protection element provided with the heat generating resistor was shown as 2nd Embodiment and 3rd Embodiment, the circuit protection element of this invention may be the structure which does not have a heat generating resistor. .
  • evaluation test 1 As evaluation test 1, a test flux 1-1 consisting only of flux base material A, and 10 mass% of a retention agent for 100 mass% flux base material A (amorphous granular CaCO 3 , volume average shown in Table 1 Prepare the sample flux 1-2 to 1-8 containing the particle diameter (D 50 ) and the sample flux 1-9 consisting only of the flux base B, dispersion stability, appearance after two reflows, Evaluation of the melting operation was performed.
  • Flux base material A Flux base material A mixed and prepared each ingredient by the following loadings.
  • Acid-modified hydrogenated polymerization rosin thermoplastic resin 53% by mass Stearic acid amide (thixo agent) 20 mass% Sebacic acid and sebacic acid dicyclohexylamine salt (activator) 17% by mass Diethylene glycol monoester high boiling point solvent 10 mass% (Flux base material B) Flux base material B mixed and prepared each ingredient by the following loadings.
  • the particle diameter of the holding material according to the flux of the present invention is preferable because inorganic particles with a volume average particle diameter of 0.01 to 10 ⁇ m do not separate, and in particular, 0.01 to 1.5 ⁇ m. Since they have no particle separation and have good stability in the dispersed state, they were most preferable for blending into paste-like flux.
  • evaluation test 2 As the evaluation test 2, retention of the content and type described in Table 2 with respect to the test flux 2-1 consisting only of the flux base material A prepared in the same manner as the evaluation test 1 and 100 mass% of the flux base material A The test flux 2-2 to 2-13 containing the agent was prepared, and the workability, the appearance after two reflows, and the melting operation were evaluated.
  • Circuit protection elements were prepared using each sample flux in the same manner as in Evaluation Test 1 and the appearance after two reflows was evaluated. Table 2 shows the results. (Fusion operation) In the same manner as in the evaluation test 1, a circuit protection element was prepared using each of the test fluxes, and the melting operation was evaluated. Table 2 shows the results.
  • the flux holding material according to the present invention be mixed with the flux base in the range of 0.5 to 70% by mass, and in particular, the addition range of 5 to 30% by mass Is suitable because dispenser application can be performed at a low temperature of less than 80.degree.
  • Example 1 The flux for a protective element of Example 1 comprises 53% by mass of a thermofusible resin consisting of an acid-modified hydrogenated polymerization rosin, 20% by mass of a thixotropic agent consisting of a stearic acid amide, and sebacic acid and a sebacic acid dicyclohexylamine salt
  • a thermofusible resin consisting of an acid-modified hydrogenated polymerization rosin
  • a thixotropic agent consisting of a stearic acid amide
  • Amorphous granular material having a volume average particle diameter (D 50 ) of 1 to 1.5 ⁇ m on a flux base uniformly kneaded with 17% by mass of an activator comprising 10% by mass of a diethylene glycol monoester-based high boiling point solvent.
  • a holding material made of calcium carbonate was added to 100 mass% of the flux base material so as to have a
  • the flux for a protective element of Example 2 comprises 53% by mass of a thermofusible resin consisting of an acid-modified hydrogenated polymerization rosin, 20% by mass of a thixotropic agent consisting of a stearic acid amide, and sebacic acid and a sebacic acid dicyclohexylamine salt Of a spherical silica having a volume average particle diameter (D 50 ) of 0.3 ⁇ m on a flux base uniformly kneaded with 17% by mass of an activator comprising 10% by mass of a diethylene glycol monoester-based high boiling point solvent The material was prepared by adding 20 mass% of the material to 100 mass% of the flux base.
  • Example 3 The flux for a protective element of Example 3 is composed of 53% by mass of a thermofusible resin consisting of an acid-modified hydrogenated polymerization rosin, 20% by mass of a thixotropic agent consisting of a stearic acid amide, and sebacic acid and a sebacic acid diphenylamine salt Amorphous particulate alumina having a volume average particle diameter (D 50 ) of 1 to 1.5 ⁇ m on a flux base uniformly kneaded with 17% by mass of the active agent and 10% by mass of a diethylene glycol monoester high-boiling point solvent. The holding material which consists of these was added so that it might be 30 mass% with respect to 100 mass% of flux base materials.
  • a thermofusible resin consisting of an acid-modified hydrogenated polymerization rosin
  • a thixotropic agent consisting of a stearic acid amide
  • a circuit protection element was prepared using the flux of each example by the same method as evaluation test 1 and the appearance after two reflows was evaluated. Table 3 shows the results.
  • the circuit protection elements to which the fluxes of Examples 1 to 3 and Examples 3-1 to 3-19 are applied have no outflow of flux to the insulating substrate after two reflows, and It turned out that melting operation was working normally in several tens of seconds.
  • the circuit protection device of the fourth embodiment is a circuit protection device using the flux for a protection device according to any one of the first to third embodiments, and has the configuration of the second embodiment shown in FIG.
  • an insulating substrate 33 made of alumina ceramic provided with a plurality of pattern electrodes 34 made of Ag alloy on the upper and lower surfaces, and a resistance heating element electrically connected to the pattern electrode 34 and provided on the lower surface of the insulating substrate 33 38, the fuse layer 11 electrically connected to the pattern electrode 34 on the upper surface of the insulating substrate 33, the flux layer 12 provided by applying the flux to the surface of the fuse layer 11, and the top of the fuse element 10 including the flux layer 12
  • a cap-like lid 36 made of a liquid crystal polymer fixed to the insulating substrate 33.
  • the surface of the resistance heating element 38 is overglazed of a glass material.
  • the circuit protection device of the fifth embodiment is a circuit protection device using the flux for the protection device according to any one of the first to third embodiments, and has the configuration of the third embodiment shown in FIG.
  • an alumina ceramic base substrate 43 provided with a plurality of Ag alloy pattern electrodes 49 on the upper and lower surfaces, and a resistance heating element 48 electrically connected to the pattern electrodes 49 and provided on the upper surface of the insulating substrate 43
  • a fuse layer 11 in contact with the resistance heating element 48 and electrically connected to the pattern electrode 49 on the upper surface of the insulating substrate 43
  • a flux layer 12 provided by applying a flux to the surface of the fuse layer 11
  • a cap-like lid made of a liquid crystal polymer fixed to the insulating substrate 43 so as to cover the top of the fuse element 10 including the layer 12.
  • the surface of the resistance heating element 23 is overglazed of a glass material.
  • the flux for protection element of the present invention and the circuit protection element using the same can be mounted on a protected circuit board together with other surface-mounted components, and collectively solder-mounted by a reflow method etc. to protect secondary batteries such as battery packs Available to the device.

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  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Chemical & Material Sciences (AREA)
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  • Combustion & Propulsion (AREA)
PCT/JP2013/078359 2012-11-07 2013-10-18 保護素子用フラックス、保護素子用ヒューズ素子、および回路保護素子 WO2014073356A1 (ja)

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KR1020157011242A KR101925669B1 (ko) 2012-11-07 2013-10-18 보호 소자용 플럭스, 보호 소자용 퓨즈 소자, 및 회로 보호 소자
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JP2014091162A (ja) 2014-05-19
JP5807969B2 (ja) 2015-11-10
KR20150082254A (ko) 2015-07-15
CN104781901B (zh) 2018-02-23
CN104781901A (zh) 2015-07-15

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