WO2014027516A1 - Dispositif de nettoyage du type à immersion - Google Patents

Dispositif de nettoyage du type à immersion Download PDF

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Publication number
WO2014027516A1
WO2014027516A1 PCT/JP2013/068045 JP2013068045W WO2014027516A1 WO 2014027516 A1 WO2014027516 A1 WO 2014027516A1 JP 2013068045 W JP2013068045 W JP 2013068045W WO 2014027516 A1 WO2014027516 A1 WO 2014027516A1
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WO
WIPO (PCT)
Prior art keywords
cleaning
wafer
cleaned
chamber
chuck
Prior art date
Application number
PCT/JP2013/068045
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English (en)
Japanese (ja)
Inventor
洋右 内藤
裕 天野
史朗 原
Original Assignee
株式会社プレテック
独立行政法人 産業技術総合研究所
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Application filed by 株式会社プレテック, 独立行政法人 産業技術総合研究所 filed Critical 株式会社プレテック
Publication of WO2014027516A1 publication Critical patent/WO2014027516A1/fr

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Definitions

  • the present invention relates to a cleaning apparatus for cleaning an object to be cleaned with a cleaning liquid.
  • semiconductor device production lines that use this type of cleaning equipment have multiple units called bays that contain processing equipment of the same type in a large clean room, and the bays are connected by a transport robot or belt conveyor.
  • the layout that adopts the job shop method is becoming mainstream. Further, a wafer having a large diameter of 12 inches or the like is used for a workpiece processed in such a production line, and a production system in which several thousand semiconductor chips are manufactured from one wafer is used.
  • Patent Document 1 discloses a conventional technique for cleaning an object to be cleaned (semiconductor wafer) by immersing it in a cleaning liquid.
  • a cleaning bath and a chemical bath are provided, and a chemical bath filled with a rinsing liquid after immersing an object to be cleaned in a cleaning bath supplied with pure water as a cleaning liquid. It is set as the structure wash
  • Patent Document 2 discloses a conventional technique for transporting a wafer by a transport arm mechanism.
  • This Patent Document 2 includes a superfluid cleaning unit having a cleaning chamber in which a cleaning liquid (liquid nitrogen) is stored. Then, the object to be cleaned (wafer) is taken out from the hoop placed on the hoop mounting table to the loader module by the transfer arm mechanism, and is carried into and out of the cleaning chamber of the superfluid cleaning unit. Yes.
  • a cleaning liquid liquid nitrogen
  • Patent Document 1 there is no description of a specific configuration for bringing an object to be cleaned into and out of the cleaning tank and the chemical tank.
  • Patent Document 2 it is the structure which carries in / out a to-be-conveyed object in a washing
  • the present invention has been made from the above-described actual state of the prior art, and an object of the present invention is to provide a cleaning apparatus capable of cleaning an object to be cleaned more efficiently.
  • the present invention is a cleaning apparatus for cleaning an object to be cleaned with a cleaning liquid, and includes a chamber having a plurality of cleaning tanks into which the cleaning object is supplied and into which the object to be cleaned can be inserted.
  • a cleaning device comprising: a gripping unit that is movably attached to grip the object to be cleaned, and that immerses the object to be cleaned in any of the cleaning tanks in a state where the object to be cleaned is gripped. The device.
  • the object to be cleaned can be immersed in any of the cleaning tanks while the object to be cleaned is gripped by the gripping portion. Therefore, the object to be cleaned immersed in any one of the cleaning tanks using this gripping part can be taken out from any one of the cleaning tanks and immersed in another cleaning tank different from any one of them. Therefore, the object to be cleaned can be more efficiently cleaned using a plurality of cleaning tanks provided in the chamber.
  • the plurality of cleaning tanks are provided at positions equal to the center of the chamber and along the circumferential direction of the chamber, and the gripping portion of the chamber.
  • the cleaning apparatus is characterized in that it can be rotated and raised and lowered with the center as the center of rotation.
  • the object to be cleaned can be immersed in the cleaning tank by raising and lowering the gripping part while the object to be cleaned is gripped by the gripping part, and the gripping part is rotated. By carrying out, it can be made to move from any one washing tank to any other washing tank, and can be immersed. Accordingly, the object to be cleaned can be cleaned in the plurality of cleaning tanks provided in the chamber by moving the gripping part up and down, and thus the object to be cleaned can be cleaned more efficiently.
  • the gripping portion includes a pair of chuck portions each having a pair of chuck pins attached in parallel in the vertical direction along the axial direction.
  • the cleaning apparatus is characterized in that the gap between the parts is changed and the edges of the object to be cleaned are sandwiched and held.
  • the chuck pins of the chuck portions are sandwiched between the edges of the object to be cleaned. Can be released. Therefore, since the object to be cleaned can be securely held with a simple configuration without covering the surface of the object to be cleaned, the object to be cleaned can be more reliably and efficiently cleaned.
  • the present invention includes a stage provided in the chamber on which the object to be cleaned is installed, and the gripping unit grips the object to be cleaned installed on the stage.
  • the cleaning apparatus was immersed in the cleaning tank.
  • an object to be cleaned placed on a stage can be held by a gripping part, and the object to be cleaned can be immersed in a cleaning tank while being gripped by the gripping part. That is, by installing the object to be cleaned on the stage, the object to be cleaned can be immersed in the cleaning tank and cleaned, so that the object to be cleaned can be cleaned more efficiently.
  • the stage is equal to a distance from the center of the chamber to the cleaning tank, and is provided at a position along the circumferential direction of the chamber together with the cleaning tank. It was set as the washing
  • the present invention configured as described above moves the object to be cleaned onto one of the cleaning tanks by rotating the gripping part while the object to be cleaned placed on the stage is gripped by the gripping part. Can be made.
  • the object to be cleaned that is gripped by the gripping part can be immersed in one of the cleaning tanks by lowering the gripping part. Therefore, the object to be cleaned placed on the stage can be immersed in the cleaning tank and cleaned only by rotating and raising / lowering the gripping part, so that the object to be cleaned can be more efficiently cleaned.
  • the object to be cleaned is a disk-shaped wafer having a predetermined size, and the cleaning tank is formed in a circular shape in plan view slightly larger than the wafer.
  • a cleaning device characterized by
  • a disc-shaped wafer having a predetermined size is held in a holding tank and is immersed in a cleaning tank having a circular shape in plan view slightly larger than the wafer. For this reason, for example, in the case of a relatively small wafer, the cleaning tank can be made small, and the amount of cleaning liquid supplied to the cleaning tank can be reduced, so that the cleaning of this wafer can be made more productive.
  • the object to be cleaned can be immersed in any of the cleaning tanks while the object to be cleaned is gripped by the gripping portion. Therefore, using this gripping part, an object to be cleaned immersed in any one cleaning tank can be taken out from any one cleaning tank and immersed in another cleaning tank different from any one of these. . Therefore, using a plurality of cleaning tanks provided in the chamber, it is possible to more efficiently clean the object to be cleaned in the plurality of cleaning tanks.
  • FIG. 5 is a plan sectional view showing a gripping portion of the cleaning device, where (a) is a diagram before gripping an object to be cleaned, (b) is a diagram when the object is gripped, and (c) is a gripping object. It is a figure of the state which moved the washing
  • FIG. 1 is an external view showing a cleaning apparatus according to an embodiment of the present invention, in which (a) is a front view and (b) is a right side view.
  • FIG. 2 is a schematic explanatory view showing a part of the cleaning apparatus.
  • 3A and 3B are diagrams showing a part of the cleaning apparatus, in which FIG. 3A is a side cross-sectional view, and FIG. 3B is a cross-sectional view along AA in FIG.
  • FIG. 4 is a front cross-sectional view illustrating a transporting process of the cleaning unit of the cleaning apparatus.
  • FIG. 5 is a partially enlarged view showing a cleaning tank of the cleaning device, in which (a) is a side sectional view and (b) is a plan view.
  • a wafer cleaner 1 as a cleaning apparatus includes a minimal fab based on a minimal fabrication concept housed in a case 2 having a standardized size. It is a cleaning device.
  • this minimal fab concept is optimal for the semiconductor manufacturing market with a small amount of various products, and can cope with various fabs that save resources, save energy, save investment, and have high performance.
  • JP 2012-54414 A This realizes a minimal production system that minimizes the production described in 1.
  • the housing 2 of the wafer cleaning machine 1 is a cleaning module formed in a substantially rectangular parallelepiped shape having a longitudinal direction in the vertical direction, and has a structure that blocks fine particles and gas molecules from the inside.
  • a cleaning unit 3 is accommodated on the back surface of the upper part 2a of the upper side of the housing 2 in order to clean the wafer W as an object to be cleaned.
  • the cleaning by the cleaning unit 3 includes those for the purpose of removing the resist on the wafer W, etching, removing residues attached to the surface, and the like.
  • a cleaning liquid used for cleaning in the cleaning unit 3 such as an SPM liquid (sulfuric acid: H 2 SO 4 + hydrogen peroxide water: H 2 O 2 + is disposed on the back surface of the apparatus upper portion 2a below the cleaning unit 3. It becomes an inlet connected to a chemical solution tank (not shown) in which each chemical solution constituting pure water (H 2 O) is stored, a pure water tank (not shown) in which pure water for rinsing is stored, and the like.
  • a supply unit 3a is provided.
  • these chemical solution tank and pure water tank are housed in a housing (not shown) having the same size and structure as the housing 2 of the wafer cleaning machine 1, and this housing is used as an exhaust waste liquid treatment module. It is good also as a structure installed adjacent to the housing
  • an apparatus lower part 2b for incorporating a control device for controlling the cleaning unit 3 in the apparatus upper part 2a.
  • the back surface of the apparatus lower part 2b is connected to a waste liquid tank (not shown) for storing waste liquid such as sulfuric acid, hydrogen peroxide water, pure water, etc. after being used for cleaning in the cleaning unit 3.
  • a discharge portion 3b serving as an outlet is provided.
  • these waste liquid tanks may be accommodated in a housing in which the chemical liquid tank and the pure water tank are accommodated.
  • a concave portion 2c is formed in the middle portion in the vertical direction of the device upper portion 2a of the housing 2 so that the front side of the housing 2 is recessed in a side view, and a lower portion of the concave portion 2c is formed.
  • the portion is a front chamber 2 d for carrying the wafer W into the housing 2.
  • a substantially circular docking port 2e as a shuttle accommodating portion for installing a minimal shuttle (not shown) as a transport container is provided at a substantially central portion of the upper surface of the front chamber 2d.
  • the front chamber 2 d is configured to block each of the fine particles and gas molecules into the housing 2. That is, the front chamber 2d is a PLAD (Particle Lock Air-tight Docking) system that allows the wafer W accommodated in the transfer container to be taken into and out of the housing 2 without being exposed to the outside air. ing.
  • PLAD Particle Lock Air-tight Docking
  • the wafer W carried in from the docking port 2e is transported to a predetermined position of the cleaning unit 3, and the wafer W cleaned in the cleaning unit 3 is unloaded to the docking port 2e.
  • a conveying device 4 is accommodated.
  • the transfer device 4 for example, a work transfer device described in Japanese Patent Application Laid-Open No. 2011-96942 is used.
  • the transport device 4 sequentially extends and retracts a plurality of elongated rod-shaped machine bodies 4a, and a U-shaped holding part 4b provided at the tip of these machine bodies 4a.
  • a slide-type telescopic actuator (not shown) that transports the held wafer W is used.
  • the cleaning unit 3 is accommodated in the wafer processing chamber 2 f on the upper rear side of the front chamber 2 d in the housing 2.
  • the wafer W to be cleaned by the cleaning unit 3 is formed in a disk shape having a circular surface having a predetermined size, for example, a diameter of 12.5 mm (half inch size).
  • a predetermined pattern is formed on the wafer W in advance and is in a state before cleaning.
  • the wafer W can be a bare silicon wafer from which the photoresist film has been removed.
  • the cleaning unit 3 includes a bottomed cylindrical chamber 5, and a wafer gripping and transporting unit 6 as a gripping unit that can be moved up and down and rotated on the chamber 5. It has.
  • the chamber 5 is provided with a trapezoidal installation base portion 5b at the center position of a rectangular bottom surface portion 5a, and a wall surface portion 5c is formed so as to cover the outer periphery of the bottom surface portion 5a.
  • the wall surface portion 5c has an inner surface formed in a circular shape in plan view, and an outer surface formed in a square shape in plan view.
  • a substantially cylindrical fitting concave portion 5d for supporting the wafer gripping and conveying portion 6 so as to be movable up and down and rotatable is provided above the wall surface portion 5c.
  • a shaft hole 5e penetrating in the vertical direction is provided at the center position of the installation base portion 5b of the chamber 5, and a flat circular installation surface 5f located above the installation base portion 5b
  • a wafer exchanging section 5g for exchanging the wafer W is provided.
  • the wafer transfer portion 5g is provided at a position spaced a predetermined distance in the radial direction from the center position of the installation surface 5f.
  • the wafer transfer section 5g includes a circular housing recess 5h that is slightly larger than the wafer W, as shown in FIG.
  • the housing recess 5h is formed in a shape in which one side edge of the installation base portion 5b is cut horizontally horizontally.
  • a wafer transfer stage 7 for transferring the wafer W held and transferred by the holding unit 4b of the transfer device 4 is attached to the receiving recess 5h.
  • the wafer transfer stage 7 is inserted into the housing recess 5h and is mounted so as to be lifted and lowered.
  • an elevating cylinder 7a is attached to the lower end portion of the wafer transfer stage 7 to move the wafer transfer stage 7 up and down to move it up and down.
  • the wafer transfer stage 7 has a plurality of cylindrical pin-shaped portions 7b, and the wafer is formed at the inner edge of the convex locking convex portion 7c provided at the tip of each pin-shaped portion 7b. The periphery of W is locked, and the wafer W is locked by these pin-like portions 7b.
  • the above-described SPM liquid is supplied to one of the cleaning tanks 8a.
  • the other cleaning tank 8b is supplied with pure water and is a rinse tank for rinsing.
  • These cleaning tanks 8a and 8b are provided at a position spaced radially from the center position of the installation surface 5f by a predetermined distance equal to the wafer transfer section 5g.
  • these cleaning tanks 8a and 8b are provided at positions facing each other through an angle of 180 ° across the center of the installation surface 5f, and the cleaning tanks 8a and 8b along the circumferential direction of the installation surface 5f.
  • a wafer transfer section 5g is provided between them. That is, the cleaning tanks 8a and 8b and the wafer transfer section 5g are provided at regular intervals along the circumferential direction of the installation surface 5f, for example, at intervals of 90 °.
  • the cleaning tanks 8a and 8b are formed in a circular shape in plan view that is slightly larger than the outer diameter of the wafer W, and an inner tank portion 8c into which the wafer W can be inserted. And an outer tank portion 8d covering the outer periphery of the inner tank portion 8c. And the upper end edge of this inner tank part 8c is provided with the some overflow overflow recessed part 8e spaced apart at equal intervals along the opening edge of this inner tank part 8c.
  • An ultrasonic transducer (PZT) 9 is attached below the bottom surface of the inner tank portion 8c to ultrasonically vibrate the cleaning liquid supplied and stored in the inner tank portion 8c. Further, as shown in FIG.
  • a supply pipe portion 8f for supplying a cleaning liquid to the inner tank portion 8c is provided on the side portion of the bottom surface portion of the inner tank portion 8c. Further, at the lower part of the bottom surface of the outer tank part 8d, a discharge pipe part for discharging the cleaning liquid overflowing from the inner tank part 8c to the outer tank part 8d via the overflow recess 8e. 8g is provided.
  • a lid member 8h having a circular plate shape in plan view covering the cleaning tanks 8 is concentrically attached.
  • An insertion hole 8i having a substantially rectangular shape in plan view is provided at the center position of the lid member 8h to expose the inner tank portion 8c of each of the cleaning tanks 8a and 8b covered with the lid member 8h.
  • These insertion holes 8i can be immersed in the cleaning tanks 8a and 8b by inserting the wafer W together with the chuck portion 6e in a state where the wafer W is held by the pair of chuck portions 6e of the chuck hand 6d of the wafer holding and conveying portion 6. It is formed in size.
  • O-ring packings 8j are attached to the outer opening edges of the respective insertion holes 8i.
  • the O-ring packing 8j is a main body portion to which the hand chuck 6d is attached when the wafer W chucked by the chuck hand 6d of the wafer gripping and transporting unit 6 is immersed in the cleaning tanks 8a and 8b together with the hand chuck 6d.
  • the outer periphery of the insertion hole 8i of each lid member 8h that covers the cleaning tanks 8a and 8b and is in close contact with the lower surface of 6a is sealed in the circumferential direction.
  • the wafer gripping and transporting unit 6 includes a main body 6a that is a columnar rotating body, a columnar rotating shaft 6b that protrudes concentrically downward from the center position of the lower surface of the main body 6a, and an upper side of the main body 6a And a substantially cylindrical fitting cylinder portion 6c provided concentrically.
  • the main body portion 6a is inserted into the shaft hole 5e of the chamber 5 so that the rotary shaft portion 6b can be moved up and down and rotated, and the fitting tube portion 6c can be moved up and down and turned into the fitting recess 5d of the chamber 5.
  • a rotary joint is made by fitting.
  • the main body 6a can be moved up and down along the center of the wall surface 5c of the chamber 5 and can be rotated in the circumferential direction.
  • the rotating shaft portion 6 b is attached with the lower end portion of the rotating shaft portion 6 b protruding downward from the shaft hole 5 e of the chamber 5.
  • a servo motor 11 is attached to the lower end portion of the rotating shaft portion 6b as driving means for rotating the rotating shaft portion 6b in the circumferential direction.
  • the servo motor 11 may be a driving unit such as an AC motor or a stepping motor that can rotate the rotating shaft 6b.
  • a vertically moving cylinder 12 that moves the rotating shaft portion 6b up and down to move the main body portion 6a up and down is provided.
  • the main body 6a of the wafer gripping and transporting unit 6 is provided with a chuck hand 6d that is a robot hand for gripping and moving the wafer W that is transported and set on the wafer transfer stage 7 of the chamber 5.
  • the chuck hand 6f is provided at a position spaced apart from the center position of the lower surface of the main body 6a by a predetermined distance in the radial direction.
  • the chuck hand 6f is configured to be rotatable in the circumferential direction around the center of the main body 6a, that is, the center position of the installation surface 5f of the chamber 5, and capable of moving up and down in the vertical direction.
  • the chuck handle 6d is attached to a position shifted in the radial direction from the center position of the main body 6a by a distance equal to the distance from the center position of the installation surface 5f of the chamber 5 to the center position of each of the cleaning tanks 8a and 8b. It has been.
  • the chuck hand 6d includes a pair of chuck portions 6e.
  • a chuck cylinder 6f that changes the distance between the pair of chuck portions 6e is attached to the pair of chuck portions 6e.
  • the chuck cylinder 6f is attached to the lower surface side of the main body portion 6a, and is configured to protrude downward from the lower surface of the main body portion 6a. Further, the chuck cylinder 6f changes the distance between the pair of chuck portions 6e to grip the wafer W by bringing the pair of chuck portions 6e closer to each other, and moves the wafer W by moving the pair of chuck portions 6e away from each other. It is set as the structure which cancels
  • each of the pair of chuck portions 6e has a pair of chuck pins 6g attached in parallel in the vertical direction along the axial direction. These chuck pins 6g are attached so as to be smaller than the diameter dimension of the wafer W and spaced apart by an interval dimension smaller than the interval dimension of the pin-like portion 7b of the wafer transfer stage 7. Furthermore, a convex locking piece 6h is provided concentrically at the tip of each chuck pin 6g.
  • the pair of chuck portions 6e is configured such that the distance between the pair of chuck portions 6e is changed by the chuck cylinder 6f.
  • the gaps between the chuck pins 6g of the chuck portions 6e are changed in the chuck portions 6e, and the peripheral edge of the wafer W is formed at the inner edge of the locking piece portion 6h of the chuck pins 6g.
  • the wafer W is held and held (chucked) with a total of four chuck pins 6g.
  • the wafer gripping and transporting unit 6 drives the chuck cylinder 6f and grips the wafer W by the pair of chuck units 6e of the chuck hand 6d, and moves the wafer W up and down by the vertical movement cylinder 12 to servo.
  • the wafer W is rotationally moved by the motor 11 to move the wafer W onto the cleaning tanks 8 a and 8 b of the chamber 5. Further, the wafer W is moved downward by the vertical movement cylinder 12 and the wafer W is dipped in the cleaning liquid in one of the cleaning tanks 8a and 8b.
  • FIG. 6 is a partially enlarged view showing the stage of the cleaning apparatus
  • (a) is a diagram of the state of conveyance of the object to be cleaned
  • (b) is a diagram of the state of installing the object of conveyance on the stage
  • FIG. 4 is a diagram showing a state where an object to be cleaned is installed on the stage.
  • FIGS. 7A and 7B are plan sectional views showing a gripping portion of the cleaning device, in which FIG. 7A shows a state before gripping the object to be cleaned, FIG. 7B shows a state where the object to be transported is gripped, and FIG. It is a figure of the state which moved the to-be-cleaned to-be-washed object on a washing tank.
  • FIG. 8 is a front sectional view showing a dipping process of the cleaning unit of the cleaning apparatus.
  • a minimal shuttle accommodating a wafer W that needs to be cleaned is fitted into the docking port 2e of the front chamber 2d of the wafer cleaning machine 1 and installed.
  • a start switch (not shown) provided at a predetermined position of the wafer cleaner 1 is pushed.
  • the minimal shuttle installed in the docking port 2e is opened, and the wafer W accommodated in the minimal shuttle is held by the holding unit 4b of the transfer device 4.
  • the wafer transfer stage 7 is moved up by the elevating cylinder 7a, and the wafer gripping / conveying section 6 is rotated by the servo motor 11, as shown in FIG. 7A.
  • the chuck hand 6d of the wafer gripping and conveying unit 6 is moved onto the wafer transfer stage 7 in an unchucked state.
  • the body 4a of the transfer device 4 extends, and the wafer W held by the holding portion 4b of the transfer device 4 is transferred to the wafer transfer stage 7 of the chamber 5 as shown in FIG. It is transported up.
  • the body 4a of the transfer device 4 moves downward, and the wafer W held by the holding portion 4b of the transfer device 4 is transferred to the wafer transfer stage 7.
  • the pin-shaped portion 7b is locked and installed at the inner edge of the locking convex portion 7c.
  • the wafer transfer stage 7 is lowered by the elevating cylinder 7a, and the wafer transfer stage 7 is received in the receiving recess 5h of the chamber 5. Further, from this state, the wafer gripping / conveying unit 6 is rotationally moved by the servo motor 11 and is gripped by the chuck hand 6d of the wafer gripping / conveying unit 6 as shown in FIGS. 4 and 7C. The wafer W is moved onto the inner tank portion 8c of the cleaning tank 8a to which the PCM liquid is supplied.
  • the wafer gripping and transporting unit 6 is lowered by the vertical movement cylinder 12, and the wafer W gripped by the chuck hand 6d of the wafer gripping and transporting unit 6 is moved to each chuck hand 6d.
  • the chuck pin 6g is inserted into the inner tank portion 8c of the cleaning tank 8a. As a result, the wafer W is immersed in the PCM liquid stored in the inner tank portion 8c, and the surface of the wafer W is cleaned with the PCM liquid.
  • the PCM liquid stored in the inner tank portion 8c of the cleaning tank 8a is heated to, for example, 140 ° C. and supersonic by the ultrasonic vibrator 9 attached below the inner tank portion 8c.
  • the resist and residue adhered to the surface of the wafer W are removed and cleaned by the ultrasonic vibration, the ultrasonic vibration, and the heated PCM liquid.
  • the wafer gripping / conveying unit 6 is lifted by the vertical movement cylinder 12, and the wafer W gripped by the chuck hand 6d of the wafer gripping / conveying unit 6 is the inner tank of the cleaning tank 8a in which the PCM liquid is stored. It is taken out from the inside of the part 8c. Thereafter, the wafer gripping / conveying section 6 is rotated by the servo motor 11, and the wafer W gripped by the chuck hand 6d of the wafer gripping / conveying section 6 is contained in the cleaning tank 8b to which pure water is supplied. It moves on the tank part 8c.
  • the wafer gripping and transporting unit 6 is lowered by the vertical movement cylinder 12, and the wafer W gripped by the chuck hand 6d of the wafer gripping and transporting unit 6 is cleaned together with each chuck pin 6g of the chuck hand 6d. It is inserted into the inner tank portion 8c of the tank 8b. As a result, the wafer W is immersed in pure water stored in the inner tank portion 8c, and the PCM liquid or the like adhering to the surface of the wafer W is cleaned and rinsed with the pure water.
  • the pure water stored in the inner tank portion 8c of the cleaning tank 8b is ultrasonically vibrated by the ultrasonic vibrator 9 attached below the inner tank portion 8c, and is ultrasonically vibrated.
  • the surface of the wafer W is rinsed with pure water.
  • the wafer gripping and transporting unit 6 is rotated at a high speed, for example, at a speed of about 1500 rpm by the servo motor 11, and the wafer W gripped by the chuck hand 6d of the wafer gripping and transporting unit 6 is rotated at a high speed. Pure water or the like adhering to the wafer W is blown off, and the wafer W is spin-dried and dried.
  • the wafer transfer stage 7 is moved up by the elevating cylinder 7a, and the wafer gripping / conveying unit 6 is rotated by the servo motor 11, as shown in FIG. 7 (b). As shown, the chuck hand 6 d of the wafer gripping and conveying unit 6 is moved onto the wafer transfer stage 7.
  • the pair of chuck portions 6e of the chuck hand 6d is moved away by the chuck cylinder 6f, and the gripping of the wafer W by the engaging piece portions 6h of the chuck pins 6g of the pair of chuck portions 6e is released.
  • the chuck state is set.
  • the wafer W is locked at the inner edge of the locking convex portion 7 c of each pin-like portion 7 b of the wafer transfer stage 7 and placed on the wafer transfer stage 7.
  • the minimal shuttle is closed and the wafer W is accommodated. Further, the wafer W is unloaded from the wafer cleaning machine 1 by removing the minimal shuttle accommodating the wafer W from the docking port 2d of the front chamber 2c.
  • the wafer W placed on the wafer transfer stage 7 of the chamber 5 is gripped and chucked by the chuck hand 6d of the wafer gripping and transporting unit 6.
  • the wafer gripping / conveying unit 6 is appropriately moved up and down and rotated to move the wafer W from the wafer transfer stage 7 onto the cleaning tanks 8a and 8b. It can be cleaned by immersing it in the cleaning solution in 8b.
  • the wafer W is immersed in the cleaning tank 8a supplied with the SPM liquid and cleaned. can do. Further, after cleaning the wafer W in the cleaning tank 8a, the wafer W can be taken out from the cleaning tank 8a and rinsed by immersing the wafer W in the cleaning tank 8 supplied with pure water. Therefore, the cleaning and rinsing of the wafer W can be performed only by the rotation operation and the elevation operation of the wafer gripping and conveying unit 6. For this reason, the wafer W can be efficiently cleaned using the cleaning tanks 8a and 8b provided at intervals on the installation surface 5f of the installation surface portion 5b of the chamber 5.
  • the wafer gripping and transporting unit 6 is rotated at a high speed, whereby the wafer chucked by the chuck hand 6d of the wafer gripping and transporting unit 6 Spin dry by rotating W at high speed. Therefore, the wafer W can be spin-dried and dried using the wafer gripping and transporting unit 6 that transports the wafer W transported onto the wafer transfer stage 7 of the chamber 5 to the cleaning tanks 8a and 8b. A series of steps from cleaning to drying of the wafer W can be performed in one chamber. Therefore, since the wafer W can be cleaned appropriately and efficiently without being affected by cross contamination and the like, the cleaning quality of the wafer W can be improved.
  • the cleaning liquid supplied to the cleaning tanks 8a and 8b of the chamber 5 is caused to flow from the supply pipe part 8f below the inner tank part 8c of the cleaning tanks 8a and 8b, and the cleaning liquid in the inner tank part 8c is
  • the overflow from the overflow recess 8a at the opening edge of the inner tank portion 8c is allowed to flow into the outer tank portion 8d, and is discharged from the discharge pipe portion 8g below the outer tank portion 8d.
  • the cleaning liquid supplied to the cleaning tanks 8a and 8b is always refreshed.
  • the cleaning liquid in the inner tank portion 8c is discharged from the liquid surface side of the cleaning liquid to the outer tank portion 8d, the resist and residues having a higher specific gravity than the cleaning liquid are efficiently removed from the inner tank portion 8c. It can be discharged to the tank portion 8d.
  • the chuck can be chucked by sandwiching the periphery of the wafer W with the chuck pins 6g. Further, by increasing the distance between the pair of chuck portions 6e, the chucking of the wafer W by the chuck pins 6g of the chuck portions 6e can be released.
  • the wafer W can be gripped in a clean atmosphere in the chamber 5, and the wafer W can be securely gripped with a relatively simple configuration. Further, since the wafer W can be chucked and immersed in the cleaning tanks 8a and 8b and dipped in the cleaning liquid without covering or contacting the front and back surfaces of the wafer W. More reliable and efficient cleaning can be performed.
  • the wafer W is gripped by the pair of chuck portions 6e of the chuck hand 6d of the wafer gripping and transporting portion 6.
  • the openings of the lid members 8h are opened as shown in FIG.
  • the O-ring packing 8j attached to the edge is in close contact with the lower surface of the main body 6a that covers the outer periphery of the chuck hand 6d.
  • the outer periphery of the insertion hole 8i of the lid member 8h is hermetically sealed by the O-ring packing 8j across the circumferential direction on the lower surface of the main body 6a, so that the wafer W is contained in the inner tank 8c of the cleaning tanks 8a and 8b. It is possible to prevent the cleaning liquid from overflowing from the insertion hole 8i of the lid member 8h when immersed in the cleaning liquid.
  • the O-ring packing 8j attached to the opening edge of the lid member 8h covering the cleaning tanks 8b and 8a is also provided in the cleaning tanks 8b and 8a on the side where the wafer W is not immersed.
  • the outer periphery of the insertion hole 8i of the lid member 8h is hermetically sealed over the circumferential direction. Therefore, it is possible to simultaneously prevent overflow and leakage of the cleaning liquid from the insertion hole 8i of the lid member 8h in the cleaning tanks 8b and 8a on the side where the wafer W is not immersed.
  • the wafer cleaning machine 1 is based on the minimal fab concept in which the size of the wafer W is a half inch size (diameter 12.5 mm), the wafer transfer stage 7 and cleaning tanks 8a and 8b on which the wafer W is transferred. Can be reduced in size. Therefore, even the chamber 5 in which the wafer transfer stage 7 and the two cleaning tanks 8a and 8b are provided on the installation surface 5f of the installation surface 5b can be accommodated in the wafer processing chamber 2f of the housing 2. Further, by cleaning the inside of the chamber 5 of the wafer cleaning machine 1, the wafer W can be cleaned and dried in a clean atmosphere in the chamber 5. Can be done appropriately.
  • each of the cleaning tanks 8a and 8b of the wafer cleaning machine 1 can be reduced by making the wafer W to be cleaned by the wafer cleaning machine 1 into a half inch size. For this reason, the amount of SPM liquid or pure water supplied to each of the cleaning tanks 8a and 8b can be greatly reduced and reduced. Therefore, the cleaning of the wafer W can be performed with higher yield and productivity.
  • the wafer W is immersed in the cleaning tank 8a supplied with the SPM solution for cleaning, and then the wafer W is immersed in the cleaning tank 8b supplied with pure water for rinsing. It was set as the structure provided with the washing tanks 8a and 8b.
  • the present invention is not limited to this, and two or more cleaning tanks may be provided on the installation surface 5f of the chamber 5, and various cleaning liquids other than SPM liquid and pure water are used for these cleaning tanks. You can also.
  • the wafer W is immersed in a first cleaning tank supplied with a dilute hydrofluoric acid aqueous solution (HF) and the Si oxide film on the wafer W is removed, and then the SPM liquid is supplied.
  • the wafer W is immersed in the second cleaning tank, and organic substances and particles adhering to the surface of the wafer W are removed.
  • the wafer W is immersed in a third cleaning tank to which hydrochloric acid (HCl) and hydrogen peroxide (H 2 O 2 ) are supplied to remove metals attached to the surface of the wafer W.
  • a so-called RCA cleaning in which the wafer W is immersed and rinsed in a fourth cleaning tank supplied with pure water may be employed.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Cleaning Or Drying Semiconductors (AREA)

Abstract

L'invention porte sur un dispositif de nettoyage de plaquettes du type à trempage, lequel dispositif est apte à nettoyer une plaquette avec une plus grande efficacité. La présente invention comporte : une chambre (5) ayant une pluralité de réservoirs de nettoyage (8a, 8b) qui sont alimentés avec un fluide de nettoyage, et dans lesquels une plaquette (W) peut être insérée ; et une unité de support/transport de plaquette (6) qui est montée mobile au sommet de la chambre (5), et qui, tandis qu'elle tient la plaquette (W), immerge la plaquette (W) dans l'un ou l'autre des réservoirs de nettoyage (8a, 8b). Après avoir été immergée dans l'un des réservoirs de nettoyage (8a), la plaquette (W) est extraite à partir du réservoir de nettoyage (8a), et est ensuite immergée dans l'autre réservoir de nettoyage (8b).
PCT/JP2013/068045 2012-08-17 2013-07-01 Dispositif de nettoyage du type à immersion WO2014027516A1 (fr)

Applications Claiming Priority (2)

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JP2012-181008 2012-08-17
JP2012181008A JP6100486B2 (ja) 2012-08-17 2012-08-17 浸漬式の洗浄装置

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WO2014027516A1 true WO2014027516A1 (fr) 2014-02-20

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CN117637548A (zh) * 2023-12-06 2024-03-01 张家口众安鑫辰机电技术有限公司 一种半导体基底清洁装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110665894B (zh) * 2019-11-11 2020-09-01 南京溧水高新创业投资管理有限公司 一种半导体生产清洗装置

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JP2002359226A (ja) * 2001-05-30 2002-12-13 Shimada Phys & Chem Ind Co Ltd バッチ式ウェット処理装置
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JPH07106292A (ja) * 1993-09-29 1995-04-21 Kawasaki Steel Corp 半導体ウエハの洗浄装置
JPH09167750A (ja) * 1995-12-14 1997-06-24 Tokyo Ohka Kogyo Co Ltd 基板端縁部の洗浄装置及び洗浄方法
JPH1140534A (ja) * 1997-07-18 1999-02-12 Sugai:Kk 基板洗浄装置の排気装置
JP2000208587A (ja) * 1999-01-18 2000-07-28 Tokyo Ohka Kogyo Co Ltd 基板搬送装置及び基板搬送方法
JP2002359226A (ja) * 2001-05-30 2002-12-13 Shimada Phys & Chem Ind Co Ltd バッチ式ウェット処理装置
JP2003031542A (ja) * 2001-07-13 2003-01-31 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2007194367A (ja) * 2006-01-18 2007-08-02 Tokyo Seimitsu Co Ltd 洗浄装置及び該洗浄装置を備えるダイシング装置
WO2010035771A1 (fr) * 2008-09-29 2010-04-01 タツモ株式会社 Dispositif, système et procédé de traitement rotatif

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117637548A (zh) * 2023-12-06 2024-03-01 张家口众安鑫辰机电技术有限公司 一种半导体基底清洁装置

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