WO2010035771A1 - Dispositif, système et procédé de traitement rotatif - Google Patents

Dispositif, système et procédé de traitement rotatif Download PDF

Info

Publication number
WO2010035771A1
WO2010035771A1 PCT/JP2009/066599 JP2009066599W WO2010035771A1 WO 2010035771 A1 WO2010035771 A1 WO 2010035771A1 JP 2009066599 W JP2009066599 W JP 2009066599W WO 2010035771 A1 WO2010035771 A1 WO 2010035771A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
processed
processing
holding mechanism
transfer
Prior art date
Application number
PCT/JP2009/066599
Other languages
English (en)
Japanese (ja)
Inventor
山辺浩
Original Assignee
タツモ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by タツモ株式会社 filed Critical タツモ株式会社
Publication of WO2010035771A1 publication Critical patent/WO2010035771A1/fr

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices

Definitions

  • the present invention relates to a rotary processing apparatus for processing a substrate to be processed, which is a precision substrate such as a semiconductor substrate, a liquid crystal glass substrate, and a magnetic disk, one by one, a processing system including the rotary processing apparatus, and a processing system.
  • the present invention relates to a rotary processing method to be executed.
  • Coating process to coat the film on the precision substrate surface Development process to form a pattern on the organic film, A process of removing the film of the substrate to be treated, which is covered with a film of metal, oxide or organic substance, by chemically reacting with the treatment liquid, In order to improve the cleanliness of the substrate to be processed, the process of removing contaminants from the substrate to be processed, etc. Many processes are performed by discharging a processing liquid onto a precision substrate as a material.
  • a rotary processing apparatus that processes substrates to be processed one by one is employed.
  • a rotary processing apparatus that processes substrates to be processed one by one has been adopted.
  • a rotary processing apparatus includes a rotation holding mechanism that horizontally holds and rotates a substrate to be processed, and a processing liquid discharger structure that discharges a processing liquid toward a processing surface of the substrate to be processed held by the rotation holding mechanism.
  • a rotation holding mechanism that horizontally holds and rotates a substrate to be processed
  • a processing liquid discharger structure that discharges a processing liquid toward a processing surface of the substrate to be processed held by the rotation holding mechanism.
  • An opening is formed in the container. The substrate to be processed is carried into and out of the rotation holding mechanism via the opening.
  • a plurality of types of processing liquids are sequentially discharged from the processing liquid discharge mechanism.
  • the waste liquids of a plurality of types of processing liquids discharged from the processing liquid discharge mechanism need to be individually collected when trying to reuse them in consideration of environmental properties.
  • a plurality of guide walls that guide waste liquids of a plurality of types of processing liquids to individual drain paths are arranged concentrically on the outer peripheral side of the rotation holding mechanism (for example, Patent Documents). 1 or 2).
  • a plurality of types of processing liquids By moving each of the plurality of guide walls relative to the substrate to be processed held by the rotation holding mechanism and selectively opening any one of the plurality of guide walls, a plurality of types of processing liquids The waste liquids are individually collected via the respective drainage paths.
  • a shutter for opening and closing the opening is provided outside the apparatus in order to prevent deterioration of the external environment due to leakage of the processing liquid and its atmosphere from the opening to the outside of the container.
  • the exclusive area of was increased.
  • An object of the present invention is to provide a rotary processing apparatus, a processing system, and a rotation that can realize a reduction in the occupied area and a reduction in processing time by opening and closing the opening of the container with the outermost peripheral guide wall located on the outermost side. It is to provide an expression processing method.
  • the rotary processing apparatus of the present invention includes a container, a rotation holding mechanism, a processing liquid discharge mechanism, a plurality of guide walls, and an elevating mechanism.
  • the container includes an opening through which a substrate to be processed is carried in and out, and stores a rotation holding mechanism, a processing liquid discharge mechanism, and a plurality of guide walls.
  • the rotation holding mechanism horizontally holds and rotates the substrate to be processed that is carried in from the opening.
  • the processing liquid discharge mechanism sequentially discharges a plurality of processing liquids toward the target surface of the target substrate held by the rotation holding mechanism.
  • the plurality of guide walls are arranged concentrically on the outer peripheral side of the rotation holding mechanism, and separate and discharge the waste liquids of the plurality of processing liquids discharged from the processing liquid discharge mechanism.
  • the elevating mechanism elevates and lowers each of the plurality of guide walls between a collection position located above the substrate to be processed whose upper end is held by the rotation holding mechanism and a retreat position located below.
  • the outermost peripheral guide wall located on the outermost side among the plurality of guide walls closes the opening at the recovery position and opens the opening at the retracted position.
  • the opening is closed when the outermost peripheral guide wall located at the outermost position among the plurality of guide walls for separating and draining the waste liquid of the processing liquid is positioned at the recovery position, and opening when positioned at the retracted position. Part is released. Therefore, it is not necessary to provide a shutter whose outermost peripheral guide wall functions as an opening / closing member for the opening and functions only as an opening / closing member for the opening.
  • the outermost peripheral guide wall is provided with an uneven portion that overlaps the upper edge portion of the opening portion in the horizontal direction at the recovery position over the entire periphery.
  • the uneven portion at the upper end of the outermost peripheral guide wall overlaps the upper edge of the opening in the horizontal direction, and the splashes and atmosphere of the processing liquid leak outside from the opening. Can be prevented.
  • the processing system includes at least one of the above rotary processing apparatuses and a transfer apparatus that loads and unloads the substrate to be processed to and from the rotation holding mechanism via the opening.
  • a substrate to be processed that is processed by the rotary processing apparatus can be carried into and out of the rotation holding mechanism via the opening by the transfer device.
  • the distance between the transfer device for carrying in and out the substrate to be processed and the rotation holding mechanism for holding the substrate to be processed in the rotary processing device is shortened, and not only can the area occupied by the processing system be reduced, but also the transfer of the substrate to be processed. You can save time. Thereby, the throughput can be further improved.
  • a general-purpose processing system can be constructed in a mass-production factory using a precision substrate stored in a wafer transfer case (FOUP, SMIF, open cassette, etc.) used in a conductor manufacturing factory as a substrate to be processed.
  • a wafer transfer case FOUP, SMIF, open cassette, etc.
  • the rotary processing method of the present invention for processing a substrate to be processed in the above processing system, when the transfer of the substrate to be processed to the rotation holding mechanism by the transfer device is completed, after raising the outermost peripheral guide wall to the collection position, The substrate is rotated by the rotation holding mechanism and the processing liquid is discharged from the processing liquid discharge mechanism to start processing. Further, when the processing of the substrate to be processed in the rotary processing apparatus is completed, the rotation of the substrate to be processed by the rotation holding mechanism is stopped and the plurality of guide walls are lowered to the retracted position, and the plurality of guide walls are lowered to the retracted position. At this timing, unloading of the substrate to be processed from the rotation holding mechanism by the transfer device is started.
  • processing including raising and lowering of the outermost peripheral guide wall can be started immediately after the substrate to be processed is carried into the rotation holding mechanism by the transfer device. Moreover, the carrying-out of the substrate to be processed from the rotation holding mechanism by the transfer device can be started immediately after the processing is completed.
  • the outermost peripheral guide wall functions as an opening / closing member for the opening
  • a shutter that functions only as the opening / closing member for the opening can be eliminated, and the occupied area can be reduced and the processing can be shortened. Time can be realized.
  • FIG. 1 is a schematic plan view of a processing system according to a first embodiment of the present invention.
  • FIG. 2 is a side sectional view taken along line XX in FIG.
  • FIG. 2 is a side cross-sectional view of the main part of the rotary processing apparatus of the present invention taken along line XX in FIG.
  • FIG. 6 is a side sectional view taken along line XX in FIG. 5.
  • It is a schematic plan view of the processing system which concerns on 3rd Embodiment of this invention.
  • It is a schematic plan view of the processing system which concerns on 4th Embodiment of this invention.
  • FIG. 1 is a schematic plan view of a processing system according to the first embodiment of the present invention.
  • FIG. 2 is a side sectional view taken along line XX in FIG.
  • the processing system 100 includes one rotary processing device 1, a container 5 and a transport device 2, and two dedicated transport cases 4.
  • the container 5 will be described later.
  • the transfer device 2 includes a rectangular coordinate type transfer robot 41.
  • the transfer robot 41 includes a substrate holding unit 6 composed of three arms, and is capable of rotating 360 ° around a vertical axis.
  • the transfer robot 41 transfers the substrate 3 to be processed in a curved manner between the processing apparatus 1 and the transfer case 4 in plan view.
  • a cylindrical coordinate type transfer robot may be used as the transfer robot 41.
  • the transfer apparatus 2 in order to carry the substrate to be processed 3 into and out of each of the two dedicated transfer cases 4, it is necessary to provide the transfer apparatus 2 with rails parallel to the arrangement direction of the two dedicated transfer cases 4.
  • the substrate holding unit 6 may include a reversing mechanism that reverses the front and back of the substrate 3 to be processed. Further, in order not to recontaminate the processed substrate 3 after processing by contact with the substrate holding unit 6, the transfer robot 41 individually holds the processed substrate 3 before processing and the processed substrate 3 after processing. It is preferable that two or more substrate holders 6 are provided.
  • the two dedicated transport cases 4 are detachably mounted on the two placement portions 48 provided on the side surfaces of the transport device 2, respectively.
  • Each conveyance case 4 accommodates a plurality of substrates to be processed 3 in the vertical direction.
  • the processing system 100 is equipped with two transport cases 4. Although the number of transfer cases 4 varies depending on the manufacturing process and production status, at least two of the transfer cases 4 for storing the substrate to be processed 3 before processing and the transfer cases 4 for storing the substrate to be processed after processing. It is preferable to provide one.
  • the rotary processing apparatus 1 includes processing liquid discharge arms 30 and 35 having nozzles 30A and 35A, respectively, in a container 1A.
  • the treatment liquid discharge arms 30 and 35 discharge two kinds of treatment liquids, a treatment liquid and a rinse liquid, from the nozzles 30A and 35A, respectively.
  • the rotary processing apparatus 1 performs two-stage processing using two types of processing liquids.
  • Treatment liquids include organic treatment liquids, alkaline treatment liquids, acid treatment liquids, treatment liquids added with surfactants, treatment liquids called functional water in which a small amount of gas is dissolved in ultrapure water, ozone water, etc. Can also be used.
  • an organic rinse liquid such as ultrapure water or isopropyl alcohol is generally used.
  • FIG. 3 and 4 are side cross-sectional views of the main part of the rotary processing apparatus of the present invention taken along line XX in FIG.
  • FIG. 3 shows a state when the substrate to be processed is carried in / out in the rotary processing apparatus 1.
  • FIG. 4 shows a state during processing of the substrate to be processed in the rotary processing apparatus 1.
  • the rotary processing apparatus 1 includes a rotation holding mechanism 7, drainage ports 13 and 14, guide walls 16 and 17, and exhaust ports 25 and 26 in a container 1A.
  • the rotation holding mechanism 7 includes a post, a sleeve, a bearing, and a rotation support member (not shown) together with the table 10 and the motor 11.
  • the column is fixed with the axial direction vertical at the center of the container 1A.
  • the sleeve is rotatably fitted to the support via a bearing.
  • the rotation support member is fixed to the upper end of the sleeve.
  • the table 10 is fixed to the upper end of the rotation support member, and holds the substrate 3 to be processed by a plurality of holders 39 provided on the upper surface.
  • the motor 11 supplies rotation to the sleeve.
  • the motor 11 When the motor 11 is driven, the sleeve, the rotation support member, and the table 10 rotate integrally around the support column.
  • the rotation of the motor 11 can be transmitted to the table 10 via a transmission mechanism such as a pulley and a belt or a gear train.
  • the guide walls 16 and 17 are cylindrical bodies that have a circular ring shape in a plan view, and are arranged concentrically outside the table 10.
  • the guide walls 16 and 17 are increased in diameter in this order, and a gap is formed inside each of them.
  • a collar portion is formed over the entire circumference toward the inside.
  • the upper ends of the drive shafts 19 and 20 are fixed to the guide walls 16 and 17.
  • the lower ends of the drive shafts 19 and 20 are attached to the air cylinders 22 and 23.
  • the drive shafts 19 and 20 and the air cylinders 22 and 23 correspond to the lifting mechanism of the present invention.
  • the drive mechanism can also be constituted by a motor cylinder, a cam mechanism, a ball screw nut rotating mechanism, or the like.
  • the drainage ports 13 and 14 are continuous to the lower portions of the gaps of the guide walls 16 and 17, respectively, and constitute a drainage channel and an exhaust channel.
  • the treatment liquid and the rinsing liquid are respectively guided to the liquid discharge ports 13 and 14 from the guide walls 16 and 17 and are individually discharged.
  • the guide walls 16 and 17 are moved up and down between the upper collection position and the lower retreat position via the drive shafts 19 and 20.
  • the drainage flow path and the exhaust flow path leading to any one of the drainage openings 13 and 14 are selectively opened, and each of the plurality of processing waste liquids is set to a predetermined drainage opening. Drain through 13 and 14.
  • the number of guide walls to be arranged can be appropriately changed according to the type of treatment liquid used in consideration of the manufacturing process and productivity.
  • FIG. 4 shows that the drainage flow path formed by the gap between the outermost peripheral guide wall 17 and the guide wall 16 located on the outermost side among the guide walls 16 and 17 is opened, and the other drainage flow.
  • the road shows a blocked state.
  • each drive shaft 19 and 20 for example, a fixed flange and a movable flange connected by a bellows are arranged, and each drive shaft 19 and 20 is cut off from waste liquid of processing liquid and exhaust atmosphere. Thereby, the liquid leakage and corrosion to a drive part can be prevented, and the reliability and durability of the rotary processing apparatus 1 can be improved.
  • the exhaust ports 25 and 26 are arranged at positions higher than the drainage ports 13 and 14 below the gaps of the guide walls 16 and 17, respectively.
  • the exhaust ports 25 and 26 exhaust only the atmosphere of each processing solution to the outside of the container 1A.
  • a means for opening and closing the exhaust ports 25 and 26 so as to selectively open only the exhaust ports 25 and 26 corresponding to those opened by any one of the guide walls 16 and 17.
  • an auto damper whose opening degree can be automatically adjusted so that the pressure in the container 1A is constant.
  • the pressure in the container 1A is controlled to a negative pressure with respect to the outside.
  • the exhaust passage is provided with exhaust ports 25 and 26 and an umbrella-shaped lid for preventing drainage mixture into the exhaust channel, and the atmosphere in the container 1A is made up of the exhaust ports 25 and 26 and the umbrella-shaped lid. It exhausts from the gap with the lid.
  • a drain trap in the drain path, and it is preferable to reduce the staying portion so that exhaust and drain can be efficiently performed even when outside air is mixed.
  • the respective drainage channels can be integrated into one. As a result, the number of parts can be reduced and the cost can be reduced.
  • the outermost peripheral guide wall 17 is provided with a convex portion 28 at the upper end. With the outermost peripheral guide wall 17 positioned at the recovery position, the convex portion 28 engages with the concave portion 37 ⁇ / b> A formed at the upper edge of the opening portion 37 so as to overlap in the horizontal direction. As a result, the opening 37 is closed by the outermost peripheral guide wall 17 located at the collection position.
  • the outermost peripheral guide wall 17 In the state where the outermost peripheral guide wall 17 is located at the retracted position, the opening 37 is open. Therefore, the outermost peripheral guide wall 17 constitutes a drainage path for processing waste liquid and has a function of opening and closing the opening 37.
  • the concave and convex portions can be reversed to each other, and the convex portion and the concave portion can be respectively formed into a concave and convex shape. it can.
  • the guide walls 16 and 17 are made of a resin (particularly fluororesin) material from the viewpoint of resistance to the treatment liquid.
  • the resin material has a large water repellency, and the treatment liquid is guided by the guide walls 16 and 17. When it is scattered, it becomes a droplet.
  • the processing liquid When the processing liquid further scatters toward the liquid droplets, the liquid droplets scatter onto the substrate 3 due to the collision between the droplets, and the traces of the reattached contaminants and water droplets called watermarks are processed. 3 Remains as a residue on the surface, greatly affecting the yield.
  • hydrophilic treatment it is effective to perform hydrophilic treatment on the surfaces of the guide walls 16 and 17.
  • the hydrophilic treatment method any method such as control of the resin surface roughness, chemical change of the resin surface by ultraviolet rays or an alkaline chemical solution may be used.
  • first and second processing liquid supply pipes are arranged.
  • the first and second processing liquid supply pipes are connected to the processing liquid discharge arms 30 and 35, respectively.
  • a drive motor 31 is disposed below the rotation support portion 29.
  • the processing liquid discharge arm 30 performs an arc motion on the upper portion of the substrate 3 to be processed around the rotation support portion 29.
  • the rotation support unit 29 has an upper and lower position so that the nozzle 30A can move up and down between an upper position where the nozzle 30A does not interfere with the guide walls 16 and 17 and a lower position where the nozzle 30A is as close as possible to the surface of the substrate 3 to be processed.
  • a drive mechanism 32 is provided.
  • the processing liquid supplied from the first processing liquid supply pipe is discharged from the nozzle 30A at the tip of the processing liquid discharge arm 30 onto the processing surface of the substrate 3 to be processed.
  • the treatment liquid discharge arm 35 is configured in the same manner as the treatment liquid discharge arm 30.
  • the table 10 is provided with a lower nozzle 34.
  • the processing liquid supplied from the processing liquid supply pipe is discharged from the lower nozzle 34 to the back surface of the substrate 3 to be processed. It is preferable that the treatment liquid discharge arm 30 is inclined to prevent liquid accumulation.
  • the treatment liquid supply pipe, the rotation support portion 29, the treatment liquid discharge arms 30 and 35, the drive motor 31, and the vertical drive mechanism 32 correspond to the treatment liquid discharge mechanism of the present invention.
  • the processing liquid discharge mechanism may include at least one processing liquid discharge arm and sequentially discharge a plurality of processing liquids, and does not necessarily include a plurality of processing liquid discharge arms.
  • the processing liquid discharge mechanism may include at least one processing liquid discharge arm and sequentially discharge a plurality of processing liquids, and does not necessarily include a plurality of processing liquid discharge arms.
  • the number of treatment liquid discharge arms to be used is similar to the number of guide walls described above.
  • the number of treatment liquid types can also be set to the number of treatment liquid types corresponding to the manufacturing process and productivity. The same applies to the lower nozzle 34.
  • a processing apparatus capable of processing the front surface / back surface of the substrate to be processed at the same time.
  • the lower nozzle 34 for back surface processing is removed and only the surface is processed. It may be a device.
  • the to-be-processed substrate 3 is hold
  • the members constituting the outer surface such as the upper plate, the side plate, and the lower plate of the rotary processing apparatus 1 are fixed using an O-ring, resin packing, or metal. It is preferable to carry out through various sealing tools such as a C-ring.
  • the treatment liquid supply pipe has a small retention portion, and the treatment liquid supply system for weighing and supplying the treatment liquid, and the parts for performing degassing and gas addition are closest to the inside or outside of the rotary processing apparatus 1. It is preferable to arrange in.
  • a fan filter unit 38 composed of a fan and a filter for supplying clean air into the processing apparatus is disposed on the rotary processing apparatus 1 of the present embodiment.
  • the fan filter unit 38 adjusts the rotational speed (for example, an inverter) or output voltage of a fan (not shown), for example, about 2 to 10 m 3 per minute according to the configuration of the rotary processing apparatus 1 or the like.
  • the gas supply amount is controlled within a range.
  • the displacement of the production plant fluctuates, so it is preferable to control the rotational speed of the fan within a predetermined range.
  • the transfer robot 41 of the transfer device 2 unloads the substrate to be processed 3 before processing from the transfer dedicated case 4. Thereafter, the transfer robot 41 turns toward the opening 37 of the rotary processing apparatus 1, moves the substrate holding unit 6 toward the rotary processing apparatus 1, and moves the substrate 3 to be processed into the rotary processing apparatus 1. Carry in.
  • the rotary processing apparatus 1 drives the holding unit driving mechanism 40 to operate the holding unit 39 after the processing target substrate 3 before processing is carried in, so that the processing target substrate 3 before processing is in a horizontal state by the holding unit 39. Hold on.
  • the guide walls 16 and 17 are raised by the vertical drive mechanisms 22 and 23 to block the internal atmosphere of the rotary processing apparatus 1 from the internal atmosphere of the transfer device.
  • the processing liquid discharge arm 30 is swung around the first rotation support portion 29 until the nozzle 30 ⁇ / b> A reaches above the center of the substrate 3 to be processed. . Further, the processing liquid discharge arm 30 is lowered by the vertical drive mechanism 32, and when the nozzle 30A reaches the vicinity of the surface of the substrate 3 to be processed, the processing liquid is discharged from the nozzle 30A.
  • the processing liquid discharge arm 30 is stopped, the guide wall 16 is lowered, and the processing liquid discharge arm 30 is returned to the origin. Further, after the processing liquid discharge arm 35 is swung until the nozzle 35A reaches above the center of the substrate 3 to be processed, the processing liquid discharge arm 35 is lowered, and when the nozzle 35A reaches the vicinity of the surface of the substrate 3 to be processed. A treatment liquid (for example, ultrapure water) is discharged from the nozzle 35A. Thereby, the final processing of the substrate 3 to be processed is performed.
  • a treatment liquid for example, ultrapure water
  • the discharge of the processing liquid by the processing liquid discharge arm 35 is stopped, the processing liquid discharge arm 35 is returned to the origin, and the substrate 3 to be processed is rotated at high speed and remains on the surface. Shake off the liquid.
  • the outermost peripheral guide wall 17 is lowered and the processing is finished. In a state where the outermost peripheral guide wall 17 is lowered, the processed substrate 3 after processing is in a state of being ready for unloading.
  • the transfer robot 41 moves the substrate holding unit 6 in the direction of the rotary processing apparatus 1 and carries out the substrate 3 to be processed before processing to the transfer apparatus 2. Thereafter, the transfer robot 41 turns around the central axis 5 in the direction of the transfer case 4 for storing the processed substrate 3 after processing.
  • the transfer robot 41 moves the substrate holding unit 6 in the direction of the transfer case 4, loads the processed substrate 3 into the transfer case 4, and ends the process.
  • spin drying a drying method using a drying method called spin-drying (spin drying) has been shown, but various dryings other than spin drying are considered in consideration of the state of the substrate 3 to be processed, the manufacturing process, productivity, and the like.
  • the method can be used.
  • the rotary processing apparatus 1 does not require a shutter outside the container 1A, the distance between the transfer apparatus 2 and the substrate 3 to be processed in the rotary processing apparatus 1 can be shortened, and only the area occupied by the processing system is reduced. In addition, the processing throughput can be improved.
  • temperature control management of the substrate to be processed is required before and after the processing of the substrate to be processed.
  • a container 5 capable of precise temperature control is provided as shown in FIG. 1 for temperature control management of the substrate 3 to be processed before and after processing.
  • the substrate to be processed 3 is carried into and out of the container 5 before and after processing by the transfer robot 41 as necessary, and temperature control is performed.
  • the temperature control management of the substrate 3 to be processed is not necessary.
  • the container 5 to be controlled can be omitted, or the rotary processing apparatus 1 can be provided instead. By omitting the container 5, the present processing system can be reduced in size. Moreover, productivity can be improved by providing the rotary processing apparatus 1 instead of the container 5.
  • FIG. 5 is a schematic plan view of a processing system according to the second embodiment of the present invention.
  • 6 is a side sectional view taken along line XX in FIG.
  • the processing system 200 according to the second embodiment includes two transfer devices 2, 42, three rotary processing devices 1, one temperature control container 5, two transfer cases 4, and one substrate delivery unit 43. ing.
  • the transfer apparatus 2 includes a rectangular coordinate type transfer robot 41 as an example.
  • the transfer robot 41 can turn 360 ° about the central axis 5, includes a substrate holding unit 6, and is processed between each of the three rotary processing apparatuses 1 and one container 8 and the substrate delivery unit 43.
  • the substrate 3 is transferred.
  • the container 8 will be described later.
  • the transfer device 42 includes a cylindrical coordinate type transfer robot 46 as an example.
  • the transfer robot 46 can turn 360 ° with respect to the central axis 44, includes a substrate holding unit 45, and is movable along the arrow B direction by a rail (not shown).
  • the transfer robot 46 transfers the substrate 3 to be processed between the transfer case 4 and the substrate delivery unit 43. It is preferable that the board
  • the substrate transfer unit 43 includes a stage 47 on which the substrate to be processed 3 is placed, and transfers the substrate 3 to be processed between the transfer device 2 and the transfer device 42.
  • the substrate delivery unit 43 preferably includes two stages 47 for the substrate to be processed 3 before processing and for the substrate to be processed 3 that has been processed.
  • the substrate holding units 6 and 45 may be provided with a holding unit mechanism for holding a plurality of substrates to be processed 3 in order to shorten the transport time of the substrate 3 to be processed. In this case, it is necessary to be able to place a plurality of substrates to be processed 3 on the substrate delivery unit 43.
  • the two transfer cases 4 are mounted on the mounting portions 48 arranged on the side portions of the transfer device 42, respectively.
  • the number of transfer cases 4 is not limited to two, and the number of arrangements can be changed according to the manufacturing process and production status. It is preferable to arrange at least two transfer cases 4 for individually storing the substrate to be processed 3 before processing and the substrate to be processed 3 after processing.
  • the transfer device 46 moves the transfer robot 46 to the position facing the transfer case 4 along the arrow B direction, and moves the substrate holding unit 45 in the direction of the transfer case 4 to process the substrate to be processed. 3 is unloaded from the transfer case 4.
  • the transfer device 46 moves the transfer robot 46 in the direction of the arrow B to a position facing the substrate delivery unit 43 and then turns it, and moves the substrate holding unit 45 in the direction of the stage 47 to perform the pre-processing.
  • the substrate 3 to be processed is placed on the stage 47.
  • the transfer apparatus 2 holds the substrate 3 to be processed placed on the stage 47 on the substrate holding unit 6 of the transfer robot 41, and the substrate holding unit 6 should perform processing among the three rotary processing apparatuses 1.
  • the transfer robot 41 is turned so as to face the rotary processing apparatus 1.
  • the rotary processing apparatus 1 to be processed is in a loading preparation state in which the outermost peripheral guide wall 17 is lowered and the loading / unloading port 37 is opened.
  • the transfer apparatus 2 moves the substrate holding unit 6 toward the rotary processing apparatus 1 and carries the substrate 3 to be processed before processing into the rotary processing apparatus 1.
  • the rotary processing apparatus 1 processes the substrate 3 to be processed in the same manner as in the first embodiment.
  • the rotary processing apparatus 1 lowers the outermost peripheral guide wall 17 and opens the loading / unloading port 37 so that the processed substrate 3 to be processed is ready for unloading.
  • the transfer apparatus 2 reciprocates the substrate holding unit 6 with respect to the inside of the rotary processing apparatus 1 and carries out the processed substrate 3 to be processed.
  • the transfer apparatus 2 turns the transfer robot 41 so that the substrate holding unit 6 faces the stage 47 of the substrate transfer unit 43, and the processed substrate 3 to be processed is placed on the stage 47 via the substrate holding unit 6. Place.
  • the transfer device 42 holds the substrate 3 to be processed placed on the stage 47 on the substrate holding unit 45, and then moves and turns the transfer robot 46 along the arrow B direction. Further, the substrate holding unit 45 is moved toward the transfer case 4, the processed substrate 3 is loaded into the transfer case 4, and the process is terminated.
  • the transfer devices 2 and 42 may drive a plurality of axes of the transfer robots 41 and 46 at the same time.
  • Each of the transfer robots 41 and 46 preferably includes two substrate holders 6 and 45 that individually hold the substrate to be processed 3 before and after processing.
  • the processing system 200 When used in the resist coating process and the development process, the processing system 200 includes a mechanism for controlling the temperature of the container 8 and is controlled by the transfer robot 41 according to the necessity of temperature control management of the substrate to be processed 3 before and after the processing.
  • the processing substrate 3 is carried into and out of the container 8 to perform temperature control.
  • the processing system 200 when used in a process for removing a film on a substrate to be processed and a process for removing contaminants on the substrate to be processed, when the temperature control management of the substrate to be processed 3 is not necessary, the container 8 Can be omitted, or alternatively, the rotary processing apparatus 1 can be provided. By omitting the container 8, the processing system 200 can be downsized. Moreover, productivity can be improved by providing the rotation processing apparatus 1 instead of the container 8.
  • a plurality of (for example, 25) substrates to be processed 3 can be stored in a dedicated cassette 4 (for example, FOUP or SMIF) used in a production factory. Therefore, productivity is improved by sequentially carrying the substrate to be processed 3 into each of the three rotary processing apparatuses 1 and sequentially carrying out the processed substrate 3 from the three rotary processing apparatuses 1. Can do.
  • a dedicated cassette 4 for example, FOUP or SMIF
  • each of the three rotary processing apparatuses 1 does not require an external shutter, the distance between the transfer apparatus 2 and the substrate 3 to be processed in the rotary processing apparatus 1 can be shortened, and the area occupied by the processing system 200 can be reduced. In addition to implementation, it is possible to improve processing throughput.
  • the number of the rotary processing devices 1 provided in the processing system 200 can be appropriately changed depending on productivity and manufacturing process.
  • the plurality of rotary processing apparatuses 1 are not limited to being arranged in the horizontal direction, and may be arranged in the vertical direction. In the case where a plurality of rotary processing apparatuses 1 are arranged in the vertical direction, it is preferable to arrange the transfer robot 46 in each stage.
  • productivity and yield can be improved by performing processing one by one in each of the plurality of rotary processing apparatuses 1.
  • productivity and yield can be improved by performing processing one by one in each of the plurality of rotary processing apparatuses 1.
  • the conveyance device 2 and the three rotary processing devices 1 are isolated by the guide wall 17 arranged in each rotary processing device 1, it is possible to cope with a manufacturing process in which continuous processing is performed.
  • the back surface and the back surface may be processed through the lower nozzle 34 arranged in the rotary processing apparatus 1 as in the first embodiment.
  • the substrate to be processed 3 when carried into and out of the rotary processing apparatus 1 by the transfer devices 2 and 42, the substrate to be processed 3 may be reversed by the reversing mechanism disposed in each of the substrate holding units 6 and 45. good.
  • FIG. 7 is a schematic plan view of a processing system according to the third embodiment of the present invention.
  • the processing system 300 according to the third embodiment includes a transport device 2, a transport device 42, a rotary processing device 1, and two transport cases 4 as well as two CMP devices 49, a scrub as another substrate processing device.
  • a device 50 is provided.
  • the CMP apparatus 49 polishes the surface of the substrate 3 to be processed using an abrasive to improve the flatness of the surface of the substrate 3 to be processed.
  • the scrubbing device 50 is a pre-process for removing abrasive particles adhering to the surface of the substrate 3 to be processed by polishing in the CMP device 40 from the surface of the substrate 3 to be processed by the roll brush 52 while rotating the substrate 3 to be processed by the roller 51. I do.
  • the transfer apparatus 2 includes a rectangular coordinate type transfer robot 41 as an example.
  • the transfer robot 41 can rotate 360 °, and includes a substrate holding unit 6, and carries the substrate 3 to be processed into and out of the rotary processing apparatus 1, the substrate transfer unit 43, the two CMP 49 apparatuses, and the scrub apparatus 50.
  • the transfer device 42 includes a cylindrical coordinate type transfer robot 46 as an example.
  • the transfer robot 46 includes a substrate holding unit 45, can be rotated 360 °, and can be moved along the arrow B direction.
  • the transfer robot 46 transfers the substrate 3 to be processed between the transfer case 4 and the substrate delivery unit 43.
  • Each of the transfer device 2 and the transfer device 42 includes upper and lower two substrate holding units 6 and 45 that individually hold the substrate to be processed and the processed substrate 3 that have been processed, and the upper substrate holding units 6 and 45. Is preferably provided with a reversing mechanism capable of reversing the substrate 3 to be processed.
  • the two transfer cases 4 are mounted on the mounting portions 48 arranged on the side portions of the transfer device 42, respectively.
  • the number of transfer cases 4 is not limited to two, and the number of arrangements can be changed according to the manufacturing process and production status. It is preferable to arrange at least two transfer cases 4 for individually storing the substrate to be processed 3 before processing and the substrate to be processed 3 after processing.
  • the transfer device 42 moves the transfer robot 46 to the position facing the transfer case 4 along the arrow B direction, and moves the substrate holding part 45 in the direction of the transfer case 4 to process the substrate to be processed. 3 is unloaded from the transfer case 4.
  • the transfer device 46 moves the transfer robot 46 in the direction of the arrow B to a position facing the substrate delivery unit 43 and then turns it, and moves the substrate holding unit 45 in the direction of the stage 47 to perform the pre-processing.
  • the substrate 3 to be processed is placed on the stage 47.
  • the transfer apparatus 2 holds the substrate 3 to be processed placed on the stage 47 on the substrate holding unit 6 of the transfer robot 41, and the substrate holding unit 6 is the CMP apparatus to be polished among the two CMP apparatuses 49.
  • the transfer robot 41 is turned so as to face 49.
  • the transfer device 2 reciprocates the substrate holding unit 6 with respect to the inside of the CMP apparatus 49 and carries the substrate 3 to be processed into the CMP apparatus 49.
  • the CMP apparatus 49 polishes the surface of the loaded substrate 3 to be processed.
  • the transfer apparatus 2 carries out the substrate 3 to be processed from the CMP apparatus 49 via the substrate holding unit 6 of the transfer robot 41. Further, the transfer device 2 turns the transfer robot 41 so that the substrate 3 to be processed held by the substrate holding unit 6 approaches the scrubbing device 50, and the scrubbing device 3 holds the substrate 3 to be processed held by the substrate holding unit 6. Carry in 50. The scrubbing device 50 performs preprocessing on the substrate 3 to be processed.
  • the transfer apparatus 2 carries out the pretreated substrate 3 from the scrubbing apparatus 50 via the substrate holding unit 6, and the substrate 3 to be processed held by the substrate holding unit 6. Rotates the transfer robot 41 so as to be close to the rotary processing apparatus 1.
  • the rotary processing apparatus 1 is in a loading preparation state in which the outermost peripheral guide wall 17 is lowered and the loading / unloading port 37 is opened.
  • the transfer apparatus 2 moves the substrate holding unit 6 toward the rotary processing apparatus 1 and carries the substrate 3 to be processed before processing into the rotary processing apparatus 1.
  • the rotary processing apparatus 1 processes the substrate 3 to be processed in the same manner as in the first embodiment.
  • the treatment liquid used for the treatment can be arbitrarily selected.
  • the rotary processing apparatus 1 lowers the outermost peripheral guide wall 17 and opens the loading / unloading port 37 so that the processed substrate 3 to be processed is ready for unloading.
  • the transfer apparatus 2 reciprocates the substrate holding unit 6 with respect to the inside of the processing apparatus 1 and carries out the processed substrate 3 to be processed.
  • the transfer apparatus 2 turns the transfer robot 41 so that the substrate holding unit 6 faces the stage 47 of the substrate transfer unit 43, and the processed substrate 3 to be processed is placed on the stage 47 via the substrate holding unit 6. Place.
  • the transfer device 42 holds the substrate 3 to be processed placed on the stage 47 on the substrate holding unit 45, and then moves and turns the transfer robot 46 along the arrow B direction. Further, the substrate holding unit 45 is moved toward the transfer case 4, the processed substrate 3 is loaded into the transfer case 4, and the process is terminated.
  • the processing system 300 includes two CMP apparatuses 49 and one scrub apparatus 50. A time difference shorter than the time required for polishing one processed substrate 3 is given to each of the two CMP apparatuses 49, and the processed substrate 3 is loaded, and the polished processed substrates 2 are sequentially loaded into the scrubbing apparatus 50. By doing so, the time required for the entire processing can be shortened.
  • the rotary processing apparatus 1 is processing the first substrate to be processed 3 for which the pretreatment by the scrubbing apparatus 50 has been completed, the second substrate to be processed 3 for which the pretreatment has been completed is rotated. Productivity can be further improved by conveying to the vicinity of the processing apparatus 1.
  • the back surface can be processed simultaneously with the front surface.
  • the substrate to be processed 3 can also be reversed by the reversing mechanism disposed in the substrate holders 6 and 45 when the substrate to be processed 3 is carried into and out of the rotary processing apparatus 1 by the transfer devices 2 and 42.
  • the processing system 300 can continuously polish and process the substrate 3 to be processed, not only can the occupied area be reduced, but also the productivity and the yield can be improved.
  • the CMP apparatus 49 and the scrubbing apparatus 50 are arranged as other substrate processing apparatuses.
  • the processing in the rotary processing apparatus 1 is performed on the substrate to be processed 3 in consideration of improvement in productivity and yield. It is also possible to arrange another substrate processing apparatus that performs processing different from the above.
  • the sealing property (airtightness) between the atmosphere in the rotary processing apparatus 1 by the outermost peripheral guide wall 17 and the atmosphere in which the transfer apparatuses 2 and 42 are arranged is not perfect.
  • the other substrate processing apparatus is a wet type substrate processing apparatus using a chemical solution or ultrapure water. Since the rotary processing apparatus 1 can be separated from the transfer apparatus 2 by the guide wall 17 disposed in the opening 37, it can cope with a manufacturing process in which such wet substrate processing is continuously performed.
  • the polished substrate 3 is once stored in the transport case and dried, it becomes difficult to remove the dried abrasive particles from the surface of the substrate 3 to be processed.
  • the processed substrate 3 after polishing is transported to the scrub apparatus 50 without being stored in the transport case.
  • the to-be-processed substrate 3 after the polishing is pretreated in a wet state, and the abrasive particles can be easily removed from the surface of the to-be-processed substrate 3.
  • FIG. 8 is a schematic plan view of a processing system according to the fourth embodiment of the present invention.
  • the processing system 400 according to the fourth embodiment includes a storage device 53 in addition to the transfer device 2, the transfer device 42, the three rotary processing devices 1, and the two transfer cases 4. Between the transfer device 2 and the transfer device 42, a substrate transfer unit 43 is disposed.
  • the transfer apparatus 2 includes a rectangular coordinate type transfer robot 41 as an example.
  • the transfer robot 41 can rotate 360 °, and includes a substrate holding unit 6, and carries the substrate 3 to be processed into and out of the rotary processing apparatus 1, the substrate transfer unit 43, the two CMP 49 apparatuses, and the scrub apparatus 50.
  • the transfer device 42 includes a cylindrical coordinate type transfer robot 46 as an example.
  • the transfer robot 46 includes a substrate holding unit 45, can be rotated 360 °, and can be moved along the arrow B direction.
  • the transfer robot 46 transfers the substrate 3 to be processed between the transfer case 4 and the substrate delivery unit 43.
  • Each of the transfer device 2 and the transfer device 42 includes upper and lower two substrate holding units 6 and 45 that individually hold the substrate to be processed and the processed substrate 3 that have been processed, and the upper substrate holding units 6 and 45. Is preferably provided with a reversing mechanism capable of reversing the substrate 3 to be processed.
  • the two transfer cases 4 are mounted on the mounting portions 48 arranged on the side portions of the transfer device 42, respectively.
  • the number of transfer cases 4 is not limited to two, and the number of arrangements can be changed according to the manufacturing process and production status. It is preferable to arrange at least two transfer cases 4 for individually storing the substrate to be processed 3 before processing and the substrate to be processed 3 after processing.
  • FIG. 8 shows the case where two transfer cases are provided, the number of mounted parts varies depending on the manufacturing process and production status, but the transfer case 4 for storing the substrate to be processed 3 before processing and the post-processing case are shown. It is preferable to provide at least two mounting portions 48 with the transfer case 4 for storing the substrate 3 to be processed.
  • the storage device 53 includes a gas supply means 71 and a gas exhaust means 72, and can control the gas pressure and gas concentration of the internal atmosphere.
  • the gas supply means 71 includes a gas flow rate control system including a pressure reducing valve 55, a filter 56, a mass flow controller 57, and a valve 58, and supplies an inert gas into the storage device 53.
  • Nitrogen or argon is preferable as the inert gas, but the gas type can be arbitrarily selected according to the type of substrate 3 to be processed and the purpose of processing. Moreover, it is good also as a mixed gas instead of a single gas.
  • members for constructing the gas flow rate control system are not limited to the above combination, but it is preferable that the supply pipe is configured so that no gas retention portion is generated. Further, the gas supply means 71 may be configured to perform flow rate control by pressure control. Furthermore, the arrangement position of the gas supply port is not limited to the side surface of the storage device 53.
  • the gas exhaust means 72 includes a valve 59 and a vacuum pump 60, and performs vacuum exhaust.
  • the gas exhaust means 72 is connected to the exhaust equipment of the factory via the valve 61.
  • the exhaust system can be switched by the valve 59 and the valve 61.
  • the gas exhaust means 72 and the exhaust pipe should be configured so as not to generate a gas retention portion in order to perform efficient gas replacement.
  • the exhaust ports are preferably arranged concentrically in order to create a uniform flow of fluid, and the vacuum exhaust and general exhaust ports may be arranged separately.
  • the storage device 53 includes a shielding plate 54 and is isolated from the atmosphere in the rotary processing apparatus 1 and the atmosphere of the transfer device 2. For this reason, the atmosphere of the storage container 53 can be instantaneously replaced by the gas supply means 71 and the gas exhaust means 72.
  • the wiring pattern size is nano-order.
  • organic substances at the molecular level and natural oxide films at the molecular level from the atmosphere greatly contribute to the reliability and yield of electronic devices. Influence.
  • oxygen which is an oxidizing species
  • moisture contained in the atmosphere interact to form a natural oxide film on the substrate 3 to be processed, and the substrate 3 to be processed is exposed to the atmosphere after processing.
  • formation of a natural oxide film can be suppressed.
  • the substrate 3 to be processed immediately after processing can be stored in the storage container 53 in which the atmosphere is controlled, which greatly affects the reliability and yield of electronic devices. Formation of a natural oxide film and contamination by organic substances can be suppressed.
  • the transfer device 46 moves the transfer robot 46 to the position facing the transfer case 4 along the arrow B direction, and moves the substrate holding unit 45 in the direction of the transfer case 4 to process the substrate to be processed. 3 is unloaded from the transfer case 4.
  • the transfer device 46 moves the transfer robot 46 in the direction of the arrow B to a position facing the substrate delivery unit 43 and then turns it, and moves the substrate holding unit 45 in the direction of the stage 47 to perform the pre-processing.
  • the substrate 3 to be processed is placed on the stage 47.
  • the transfer device 2 holds the substrate 3 to be processed placed on the stage 47 on the substrate holding unit 6 of the transfer robot 41, and the substrate holding unit 6 should perform processing among the four rotary processing devices 1.
  • the transfer robot 41 is turned so as to face the rotary processing apparatus 1.
  • the rotary processing apparatus 1 to be processed is in a loading preparation state in which the outermost peripheral guide wall 17 is lowered and the loading / unloading port 37 is opened.
  • the transfer apparatus 2 moves the substrate holding unit 6 toward the rotary processing apparatus 1 and carries the substrate 3 to be processed before processing into the rotary processing apparatus 1.
  • the rotary processing apparatus 1 processes the substrate 3 to be processed in the same manner as in the first embodiment.
  • the rotary processing apparatus 1 lowers the outermost peripheral guide wall 17 and opens the loading / unloading port 37 so that the processed substrate 3 to be processed is ready for unloading.
  • the transfer apparatus 2 reciprocates the substrate holding unit 6 with respect to the inside of the processing apparatus 1 and carries out the processed substrate 3 to be processed. Further, the transfer device 2 turns the transfer robot 6 so that the substrate 3 to be processed held by the substrate holding unit 6 approaches the storage device 53.
  • the storage device 53 opens the shielding plate 54 that shuts off the internal atmosphere and the atmosphere in the transfer device 2 to prepare for loading.
  • the transport device 2 moves the substrate holding unit 6 toward the inside of the storage device 53 and carries the substrate 3 to be processed into the storage device 53.
  • the storage device 53 closes the shielding plate 54 to seal the storage device 53 and isolate it from the atmosphere in the transfer device 2.
  • the storage device 53 opens the shielding plate 54 when carrying out the substrate 3 to be processed, and sequentially brings the substrate into a fine state.
  • the transfer device 2 turns the transfer robot 41 so that the substrate holding unit 6 is leveled with the storage device 53, moves the substrate holding unit 6 toward the storage device 53, and carries out the substrate 3 to be processed from the storage device 53. To do.
  • the storage device 53 closes the shielding plate 54 after the substrate 3 to be processed is unloaded.
  • the transfer device 2 turns the transfer robot 41 so that the substrate 3 to be processed held by the substrate holding unit 6 comes close to the substrate transfer unit 43, and then directs the substrate holding unit 6 toward the substrate transfer unit 43.
  • the processed substrate 3 that has been processed by being moved is placed on the substrate delivery unit 43.
  • the transfer device 42 receives the processed substrate 3 to be processed by the substrate holding unit 45 of the transfer robot 46 and moves the transfer robot 46 along the arrow B direction so as to be close to the transfer case 4. Next, the transfer device 42 turns the transfer robot 46 so that the substrate 3 to be processed held by the substrate holding unit 35 approaches the transfer case 4.
  • the transfer device 42 moves the substrate holding part 45 in the direction of the transfer case 4 and loads the processed substrate 3 into the transfer case 4 to complete the processing.
  • FIG. 8 does not show an apparatus for performing the next process on the substrate 3 to be processed stored in the storage apparatus 53.
  • a shielding plate 62 is disposed on the side surface of the storage device 53 facing the shielding plate 54 so as to be freely opened and closed, and a conveying device is disposed at a position where the shielding plate 62 is sandwiched between the storage device 53 and the storage device 53.
  • a transport device and a dry system device are arranged.
  • the characteristics of the electronic device are improved by performing the treatment before the substrate 3 is formed to suppress oxidation and organic contamination. Further, the characteristics of the electronic device are improved by processing the substrate 3 to be processed before the chemical substance remaining as a residue after etching is exposed to the air atmosphere and removing the etching residue. Therefore, the processing system 400 can improve the characteristics of the electronic device and can improve productivity and yield.
  • the dry system apparatus is not limited to a diffusion apparatus, a CVD apparatus, and an etching apparatus, but can include various apparatuses according to the manufacturing process. Moreover, it does not ask
  • group apparatus is before a process or after a process.
  • continuous processing of wet processing and dry processing can be performed in a state in which contamination at a molecular level is suppressed, which not only contributes to improvement in characteristics of electronic devices, improvement in productivity, and improvement in yield, It is possible to reduce the occupied area of the processing system combined with the system devices.

Abstract

L'invention concerne un dispositif (1) de traitement rotatif comportant un récipient (1A), un mécanisme rotatif (7) de maintien, un bras (30) de refoulement de fluide de traitement, des parois-guides (16, 17) et des vérins pneumatiques (22, 23) destinés à réduire la surface occupée par le dispositif et le temps de traitement. Le mécanisme rotatif (7) de maintien immobilise horizontalement et fait tourner un substrat (3) à traiter chargé par la section (37) d’ouverture du récipient (1A). Les parois-guides (16, 17), disposées de façon coaxiale sur la périphérie extérieure du mécanisme rotatif (7) de maintien, séparent et évacuent l’effluent liquide issu du fluide de traitement refoulé à partir du bras (30) de refoulement de fluide de traitement. Les vérins pneumatiques (22, 23) soulèvent et abaissent les parois-guides (16, 17) respectives entre une position de collecte où leurs extrémités supérieures sont positionnées au-dessus du substrat (3) à traiter et une position de récupération où les extrémités supérieures se trouvent au-dessous du substrat à traiter. La paroi-guide périphérique extérieure (17) ferme la section (37) d’ouverture dans la position de collecte et ouvre la section (37) d’ouverture dans la position de récupération.
PCT/JP2009/066599 2008-09-29 2009-09-25 Dispositif, système et procédé de traitement rotatif WO2010035771A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008249988A JP2010080840A (ja) 2008-09-29 2008-09-29 回転式処理装置、処理システム及び回転式処理方法
JP2008-249988 2008-09-29

Publications (1)

Publication Number Publication Date
WO2010035771A1 true WO2010035771A1 (fr) 2010-04-01

Family

ID=42059769

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2009/066599 WO2010035771A1 (fr) 2008-09-29 2009-09-25 Dispositif, système et procédé de traitement rotatif

Country Status (3)

Country Link
JP (1) JP2010080840A (fr)
TW (1) TWI434337B (fr)
WO (1) WO2010035771A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014027516A1 (fr) * 2012-08-17 2014-02-20 株式会社プレテック Dispositif de nettoyage du type à immersion

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101855217B1 (ko) 2010-12-30 2018-05-08 비코 인스트루먼츠 인코포레이티드 캐리어 연장부를 이용한 웨이퍼 처리
TWI484585B (zh) * 2011-12-20 2015-05-11 Chroma Ate Inc Substrate transfer equipment
US9388493B2 (en) 2013-01-08 2016-07-12 Veeco Instruments Inc. Self-cleaning shutter for CVD reactor
KR102343636B1 (ko) * 2014-12-15 2021-12-28 세메스 주식회사 기판 처리 장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079219A (ja) * 2003-08-29 2005-03-24 Tokyo Electron Ltd 基板処理装置
JP2007019369A (ja) * 2005-07-11 2007-01-25 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006286835A (ja) * 2005-03-31 2006-10-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4963383B2 (ja) * 2006-08-11 2012-06-27 株式会社フジクラ ウェハのエッチング装置、及びウェハのウェット処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005079219A (ja) * 2003-08-29 2005-03-24 Tokyo Electron Ltd 基板処理装置
JP2007019369A (ja) * 2005-07-11 2007-01-25 Tokyo Electron Ltd 基板処理装置及び基板処理方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014027516A1 (fr) * 2012-08-17 2014-02-20 株式会社プレテック Dispositif de nettoyage du type à immersion
JP2014038958A (ja) * 2012-08-17 2014-02-27 Pre-Tech Co Ltd 浸漬式の洗浄装置

Also Published As

Publication number Publication date
TW201023258A (en) 2010-06-16
JP2010080840A (ja) 2010-04-08
TWI434337B (zh) 2014-04-11

Similar Documents

Publication Publication Date Title
KR100855129B1 (ko) 매엽식 기판세정방법
CN107818928B (zh) 基板清洗装置、基板处理装置、基板清洗方法及基板处理方法
CN108789132B (zh) 基板清洗方法
US8545119B2 (en) Substrate cleaning apparatus, coating and developing apparatus having the same and substrate cleaning method
KR100800204B1 (ko) 매엽식 기판세정방법 및 매엽식 기판세정장치
JP2009071235A (ja) 基板処理装置
KR20150011764A (ko) 기판 세정 장치, 기판 세정 방법 및 기억 매체
JP2014167996A (ja) 研磨装置および研磨方法
US20090038641A1 (en) Substrate Cleaning Apparatus, Substrate Cleaning Method, Substrate Processing System, and Storage Medium
TW200841378A (en) Substrate cleaning apparatus, substrate cleaning method and storage medium
TW201941289A (zh) 基板處理方法及基板處理裝置
KR102359530B1 (ko) 기판 처리 방법, 기판 처리 장치, 그리고 용기 세정 방법
TWI753789B (zh) 基板處理方法及基板處理裝置
WO2010035771A1 (fr) Dispositif, système et procédé de traitement rotatif
TWI681449B (zh) 研磨方法及研磨裝置
KR20190141587A (ko) 기판 처리 방법
WO2019047140A1 (fr) Procédé et appareil de nettoyage d'une tranche de semi-conducteur
TW201802870A (zh) 基板處理裝置及基板處理方法
KR102315667B1 (ko) 기판 처리 방법 및 장치
CN107799442B (zh) 基板清洗装置及具备该基板清洗装置的基板处理装置
JP6159282B2 (ja) 基板処理装置、および基板処理装置の配管洗浄方法
JP7372176B2 (ja) 基板処理装置および基板処理方法
JP2003047925A (ja) 処理装置
CN209766371U (zh) 基板清洗装置
WO2023195340A1 (fr) Dispositif de traitement de substrat et procédé de traitement de substrat

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 09816186

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 09816186

Country of ref document: EP

Kind code of ref document: A1